TWI752087B - 半導體裝置檢查用插座 - Google Patents
半導體裝置檢查用插座 Download PDFInfo
- Publication number
- TWI752087B TWI752087B TW106132608A TW106132608A TWI752087B TW I752087 B TWI752087 B TW I752087B TW 106132608 A TW106132608 A TW 106132608A TW 106132608 A TW106132608 A TW 106132608A TW I752087 B TWI752087 B TW I752087B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact pin
- socket
- semiconductor package
- contact
- base
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 110
- 238000007689 inspection Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 239000011295 pitch Substances 0.000 description 38
- 125000006850 spacer group Chemical group 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000009467 reduction Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170055038A KR102293762B1 (ko) | 2017-04-28 | 2017-04-28 | 반도체 장치 검사용 소켓 |
| KR10-2017-0055038 | 2017-04-28 | ||
| ??10-2017-0055038 | 2017-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201839416A TW201839416A (zh) | 2018-11-01 |
| TWI752087B true TWI752087B (zh) | 2022-01-11 |
Family
ID=63918413
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110125105A TWI766753B (zh) | 2017-04-28 | 2017-09-22 | 半導體裝置檢查用插座 |
| TW106132608A TWI752087B (zh) | 2017-04-28 | 2017-09-22 | 半導體裝置檢查用插座 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110125105A TWI766753B (zh) | 2017-04-28 | 2017-09-22 | 半導體裝置檢查用插座 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102293762B1 (fr) |
| TW (2) | TWI766753B (fr) |
| WO (1) | WO2018199403A1 (fr) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102088204B1 (ko) * | 2019-08-22 | 2020-03-16 | 주식회사 프로이천 | 핀 보드 |
| CN112992599B (zh) * | 2019-12-13 | 2023-02-17 | 天津平高智能电气有限公司 | 真空灭弧室真空度测量装置 |
| KR102673342B1 (ko) | 2021-10-26 | 2024-06-10 | (주)마이크로컨텍솔루션 | 반도체 칩 테스트 소켓 |
| KR102766604B1 (ko) * | 2021-12-21 | 2025-02-13 | (주)마이크로컨텍솔루션 | 테스트 소켓 |
| KR102823858B1 (ko) * | 2022-04-05 | 2025-06-23 | 주식회사 오킨스전자 | 테스트 소켓용 콘택 핀 및 이를 포함하는 테스트 소켓 |
| CN115508687B (zh) * | 2022-09-27 | 2025-04-04 | 东莞福哥电子有限公司 | 一种可快速连续测试的光电编码器治具 |
| KR102764392B1 (ko) * | 2022-11-04 | 2025-02-07 | (주)마이크로컨텍솔루션 | 소켓용 세퍼레이터 유닛 제조 방법 및 소켓용 세퍼레이터 유닛 |
| KR102641973B1 (ko) * | 2023-03-31 | 2024-02-29 | 보이드코리아유한회사 | 컨텍트핀안전정렬삽입부가 적용된 반도체 패키지 검사용 소켓 장치 |
| KR102864393B1 (ko) * | 2023-04-27 | 2025-09-25 | 주식회사 오킨스전자 | 테스트 소켓 및 이의 조립 장치 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004139939A (ja) * | 2002-10-21 | 2004-05-13 | Texas Instr Japan Ltd | 半導体装置用ソケットおよび半導体装置のソケットへの着脱方法 |
| TW200503363A (en) * | 2003-07-15 | 2005-01-16 | Enplas Corp | Socket for electronic component |
| KR20130005874A (ko) * | 2011-07-07 | 2013-01-16 | 주식회사 오킨스전자 | 반도체 패키지 테스트용 소켓 |
| TW201633636A (zh) * | 2014-12-23 | 2016-09-16 | 英特爾公司 | 用於測試晶粒接觸器之成形導線探針互連 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3836005B2 (ja) * | 2001-09-11 | 2006-10-18 | 株式会社エンプラス | 電気部品用ソケット |
| JP2003163064A (ja) * | 2001-11-27 | 2003-06-06 | Yamaichi Electronics Co Ltd | Ｉｃソケット |
| JP3746710B2 (ja) * | 2001-12-12 | 2006-02-15 | 株式会社エンプラス | 電気部品用ソケット |
-
2017
- 2017-04-28 KR KR1020170055038A patent/KR102293762B1/ko active Active
- 2017-09-11 WO PCT/KR2017/009944 patent/WO2018199403A1/fr not_active Ceased
- 2017-09-22 TW TW110125105A patent/TWI766753B/zh active
- 2017-09-22 TW TW106132608A patent/TWI752087B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004139939A (ja) * | 2002-10-21 | 2004-05-13 | Texas Instr Japan Ltd | 半導体装置用ソケットおよび半導体装置のソケットへの着脱方法 |
| TW200503363A (en) * | 2003-07-15 | 2005-01-16 | Enplas Corp | Socket for electronic component |
| KR20130005874A (ko) * | 2011-07-07 | 2013-01-16 | 주식회사 오킨스전자 | 반도체 패키지 테스트용 소켓 |
| TW201633636A (zh) * | 2014-12-23 | 2016-09-16 | 英特爾公司 | 用於測試晶粒接觸器之成形導線探針互連 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180121717A (ko) | 2018-11-08 |
| TWI766753B (zh) | 2022-06-01 |
| TW201839416A (zh) | 2018-11-01 |
| KR102293762B1 (ko) | 2021-08-25 |
| TW202138828A (zh) | 2021-10-16 |
| WO2018199403A1 (fr) | 2018-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI752087B (zh) | 半導體裝置檢查用插座 | |
| US8143909B2 (en) | Universal test socket and semiconductor package testing apparatus using the same | |
| US8562367B2 (en) | Socket for electrical part | |
| US8602805B2 (en) | Socket | |
| US20030054676A1 (en) | Burn-in test socket | |
| JP2014179379A (ja) | ウエハ検査装置及び該装置の整備方法 | |
| CN103178384A (zh) | 电气元件用插座 | |
| KR100510501B1 (ko) | 반도체 패키지 검사 장치 및 이를 이용한 검사 방법 | |
| KR20120015013A (ko) | 테스트핸들러용 인서트 | |
| US6012929A (en) | IC socket structure | |
| TW201524025A (zh) | 半導體裝置檢查用插座裝置 | |
| CN106862093B (zh) | 测试分选机用插件 | |
| KR100910889B1 (ko) | 전자부품용 소켓 | |
| KR101403049B1 (ko) | 워페이지 현상을 방지하는 반도체 패키지 테스트용 소켓 | |
| US10320106B2 (en) | Electrical component socket | |
| KR100640634B1 (ko) | 반도체 패키지 검사장치 및 이를 이용한 검사방법 | |
| KR101302112B1 (ko) | 다접점 콘택트핀 및 이를 포함하는 반도체 패키지 테스트용 소켓 | |
| JP5067244B2 (ja) | Ｉｃソケット及びｉｃの検査方法 | |
| KR101053462B1 (ko) | 반도체 소자 테스트 소켓 | |
| KR20160044737A (ko) | 전자 부품을 수납하기 위한 인서트 조립체 | |
| KR101067004B1 (ko) | 반도체 패키지 캐리어 | |
| KR20130124824A (ko) | 컨택트핀 및 이를 포함하는 반도체 패키지 장착용 소켓 | |
| KR101183612B1 (ko) | 프로브 카드의 탐침 구조물 | |
| KR102198301B1 (ko) | 소켓 보드 조립체 | |
| KR20070062082A (ko) | 반도체 패키지 인서트와 테스트 소켓의 결합 구조 |