TWI745645B - Single-sided and double-sided sidewall inspection system and paired mirror assembly device - Google Patents
Single-sided and double-sided sidewall inspection system and paired mirror assembly device Download PDFInfo
- Publication number
- TWI745645B TWI745645B TW107146567A TW107146567A TWI745645B TW I745645 B TWI745645 B TW I745645B TW 107146567 A TW107146567 A TW 107146567A TW 107146567 A TW107146567 A TW 107146567A TW I745645 B TWI745645 B TW I745645B
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- image capturing
- side wall
- mirror
- hole
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 22
- 238000012360 testing method Methods 0.000 claims description 108
- 238000001514 detection method Methods 0.000 claims description 88
- 238000003384 imaging method Methods 0.000 claims description 34
- 238000012546 transfer Methods 0.000 claims description 24
- 229910003460 diamond Inorganic materials 0.000 claims description 9
- 239000010432 diamond Substances 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000007547 defect Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 30
- 230000003287 optical effect Effects 0.000 description 22
- 238000012545 processing Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
本發明係有關於一種光學檢測系統,尤指一種用以檢測待測物孔洞側壁的光學檢測系統。The present invention relates to an optical detection system, in particular to an optical detection system for detecting the side wall of a hole of an object to be tested.
自動光學檢查(Automated Optical Inspection, AOI),係運用機器視覺做為檢測標準技術,透過機器視覺取代傳統人眼辨識以達到高精密度及高效率的檢測。作為改良傳統上以人力使用光學儀器進行檢測的缺點,應用層面包括從高科技產業之研發、製造品管、國防、民生、醫療、環保、電力等領域。Automated Optical Inspection (AOI) uses machine vision as the inspection standard technology to replace traditional human eye recognition through machine vision to achieve high-precision and high-efficiency inspections. As an improvement on the shortcomings of the traditional use of optical instruments for inspection by humans, the application level includes areas such as research and development, manufacturing quality control, national defense, people's livelihood, medical care, environmental protection, and electricity in high-tech industries.
在光學檢測領域中,複雜表面的檢測相對平滑表面較為困難,一般可視性的複雜表面取決於攝影機的景深範圍,若是攝影機的景深足夠一般都可以克服。相對而言,針對平面不可視的缺陷,則是難以由傳統的光學方式(例如平面拍攝)進行檢測,以致於在進行這類的檢測時非常的耗時耗功,難以達到相應的效率。In the field of optical inspection, it is more difficult to detect complex surfaces than smooth surfaces. Generally, the visibility of complex surfaces depends on the depth of field of the camera. If the depth of field of the camera is sufficient, it can generally be overcome. Relatively speaking, it is difficult to detect defects with invisible planes by traditional optical methods (such as plane shooting), so that such inspections are very time-consuming and labor-intensive, and it is difficult to achieve corresponding efficiency.
本發明的目的,在於提供一種單側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括一待測物載台、以及一影像擷取裝置。該待測物載台用以承載該待測物。該影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像,其中該影像擷取裝置與該孔洞側壁之間具有一取像傾角,以擷取該孔洞側壁的影像。The object of the present invention is to provide a single-sided detection system for detecting at least one side wall of a hole on an object to be tested. The single-sided detection system includes a platform for the object to be tested and an image capturing device. The test object carrier is used to carry the test object. The image capturing device is arranged on the side of the test object carrier to capture the image of the test object, wherein there is an image capturing angle between the image capturing device and the side wall of the hole to capture the side wall of the hole image.
本發明的另一目的,在於提供一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括一待測物載台、一第一影像擷取裝置、以及一第二影像擷取裝置。該待測物載台用以承載該待測物。該第一影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像,其中該第一影像擷取裝置與該孔洞側壁之間具有一第一取像傾角,以擷取該孔洞側壁的第一側影像。該第二影像擷取裝置設置於該待測物載台一側,用以擷取該待測物影像,其中該第二影像擷取裝置與該孔洞側壁之間具有一第二取像傾角,使該影像擷取裝置擷取該孔洞側壁的一第二側影像。Another object of the present invention is to provide a double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The single-sided detection system includes a platform for the object to be tested and a first image capturing device , And a second image capturing device. The test object carrier is used to carry the test object. The first image capturing device is arranged on the side of the test object carrier to capture the image of the test object, wherein there is a first image capturing inclination between the first image capturing device and the side wall of the hole to Capture the first side image of the side wall of the hole. The second image capturing device is arranged on the side of the test object carrier to capture the image of the test object, wherein there is a second image capturing inclination between the second image capturing device and the side wall of the hole, The image capturing device captures a second side image of the side wall of the hole.
本發明的另一目的,在於提供一種單側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括一待測物載台、一影像擷取裝置、以及一反射鏡裝置。該待測物載台用以承載該待測物。該影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像。該反射鏡裝置設置於該影像擷取裝置及該待測物載台之間,該反射鏡裝置與該孔洞側壁之間具有一取像傾角,使該影像擷取裝置透過該反射鏡裝置擷取該孔洞側壁的影像。Another object of the present invention is to provide a single-sided detection system for detecting at least one side wall of a hole on an object to be tested, the single-sided detection system including a platform for the object to be tested, an image capturing device, and A mirror device. The test object carrier is used to carry the test object. The image capturing device is arranged on the side of the test object carrier to capture the image of the test object. The reflecting mirror device is arranged between the image capturing device and the object-to-be-tested stage, and there is an image capturing angle between the reflecting mirror device and the side wall of the hole, so that the image capturing device can capture through the reflecting mirror device The image of the side wall of the hole.
本發明的另一目的,在於提供一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該單側式檢測系統包括一待測物載台、一第一影像擷取裝置與一第二影像擷取裝置、一第一反射鏡裝置、以及一第二反射鏡裝置。該待測物載台用以承載該待測物。該第一影像擷取裝置與該第二影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像。該第一反射鏡裝置設置於該第一影像擷取裝置及該待測物載台之間,其中該第一反射鏡裝置與該孔洞側壁之間具有一第一取像傾角,使該第一影像擷取裝置透過該第一反射鏡裝置擷取該孔洞側壁的第一側影像。該第二反射鏡裝置設置於該第二影像擷取裝置及該待測物載台之間,該第二反射鏡與該孔洞側壁之間具有一第二取像傾角,使該第二影像擷取裝置透過該第二反射鏡裝置擷取該孔洞側壁的第二側影像。Another object of the present invention is to provide a double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The single-sided detection system includes a platform for the object to be tested and a first image capturing device And a second image capturing device, a first mirror device, and a second mirror device. The test object carrier is used to carry the test object. The first image capturing device and the second image capturing device are arranged on one side of the test object carrier to capture images of the test object. The first mirror device is disposed between the first image capturing device and the object-to-be-tested stage, wherein there is a first image acquisition inclination between the first mirror device and the side wall of the hole, so that the first The image capturing device captures the first side image of the side wall of the hole through the first mirror device. The second mirror device is disposed between the second image capturing device and the object-to-be-tested stage, and there is a second image capturing angle between the second mirror and the side wall of the hole, so that the second image is captured The capturing device captures the second side image of the side wall of the hole through the second mirror device.
本發明的另一目的,在於提供一種成對反射鏡組裝置,包括一第一反射鏡、以及一第二反射鏡。該第一反射鏡設置於該影像擷取裝置及該待測物載台之間,該第一反射鏡與該待測物的孔洞側壁之間具有一第一取像傾角。該第二反射鏡設置於該影像擷取裝置及該待測物載台之間並設置於該第一反射鏡的對向側,該第二反射鏡與該待測物的孔洞側壁之間具有一第二取像傾角。Another object of the present invention is to provide a paired mirror assembly device, including a first mirror and a second mirror. The first reflecting mirror is arranged between the image capturing device and the object under test platform, and there is a first image acquisition inclination between the first reflecting mirror and the side wall of the hole of the object under test. The second reflecting mirror is arranged between the image capturing device and the object-to-be-measured stage and arranged on the opposite side of the first reflecting mirror. There is a gap between the second reflecting mirror and the side wall of the hole A second acquisition inclination angle.
本發明的另一目的,在於提供一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該雙側式檢測系統包括一待測物載台、一影像擷取裝置、一如上所述的成對反射鏡組裝置。該待測物載台用以承載該待測物。該影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像。該影像擷取裝置透過該反射鏡擷取該孔洞側壁的第一側影像以及第二側影像。Another object of the present invention is to provide a double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The double-sided detection system includes a platform for the object to be tested, an image capture device, and a The paired mirror group device as described above. The test object carrier is used to carry the test object. The image capturing device is arranged on the side of the test object carrier to capture the image of the test object. The image capturing device captures the first side image and the second side image of the side wall of the hole through the reflecting mirror.
本發明的另一目的,在於提供一種雙側式檢測系統,用於檢測待測物上的至少一個孔洞側壁,該雙側式檢測系統包括一待測物載台、一影像擷取裝置、複數個如上所述的成對反射鏡組裝置。該待測物載台用以承載該待測物。該影像擷取裝置設置於該待測物載台一側,用以擷取待測物影像。複數個如上所述的成對反射鏡組裝置,分別對應該待測物的孔洞側壁設置,該影像擷取裝置透過該反射鏡擷取該孔洞側壁的第一側影像以及第二側影像。Another object of the present invention is to provide a double-sided detection system for detecting at least one side wall of a hole on an object to be tested. The double-sided detection system includes a platform for the object to be tested, an image capturing device, and A pair of mirror group devices as described above. The test object carrier is used to carry the test object. The image capturing device is arranged on the side of the test object carrier to capture the image of the test object. A plurality of the above-mentioned paired mirror group devices are respectively arranged corresponding to the side wall of the hole of the object to be measured, and the image capturing device captures the first side image and the second side image of the side wall of the hole through the mirror.
本發明可以有效的提升光學檢測系統檢測盲孔、穿孔或是其他複雜表面的瑕疵的效率,相較於習知技術可以大幅地降低檢測所需的時間成本。The invention can effectively improve the efficiency of the optical detection system to detect blind holes, perforations or other complex surface defects, and can greatly reduce the time cost required for detection compared with the conventional technology.
再者,本發明機構設置簡單,相較於習知技術可以降低檢測的複雜度,同時降低設備的維修成本。Furthermore, the mechanism of the present invention is simple to set up, and compared with the conventional technology, the complexity of detection can be reduced, and the maintenance cost of the equipment can be reduced at the same time.
有關本發明之詳細說明及技術內容,現就配合圖式說明如下。再者,本發明中之圖式,為說明方便,其比例未必照實際比例繪製,該等圖式及其比例並非用以限制本發明之範圍,在此先行敘明。The detailed description and technical content of the present invention will now be described in conjunction with the drawings as follows. Furthermore, for the convenience of description, the figures in the present invention are not necessarily drawn according to actual proportions. These figures and their proportions are not intended to limit the scope of the present invention, and are described here first.
於本發明中並未於圖式中明確揭示有控制器,惟,可理解本發明係應用於光學檢測設備,必然包括有用於執行影像處理用的影像處理器;為協調各部裝置的運作,其必然包括中央控制器(例如PLC)調整各部裝置的參數,以確保裝置的運作順暢並消弭誤差;裝置可個別包括獨立的控制器及對應的韌體,以切換各裝置的工作模式、或是由感測器反饋對應的參數等,在此必須先予以敘明。In the present invention, the controller is not explicitly disclosed in the drawings. However, it can be understood that the present invention is applied to optical inspection equipment and must include an image processor for performing image processing; in order to coordinate the operation of various devices, It must include a central controller (such as PLC) to adjust the parameters of each device to ensure the smooth operation of the device and eliminate errors; the device can individually include an independent controller and corresponding firmware to switch the working mode of each device, or by The parameters corresponding to the sensor feedback must be described here first.
該等控制器例如可以為中央處理器(Central Processing Unit;CPU),或是其他可程式化之一般用途或特殊用途的微處理器(Microprocessor)、數位訊號處理器(Digital Signal Processor;DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuits;ASIC)、可程式化邏輯裝置(Programmable Logic Device;PLD)或其他類似裝置或這些裝置的組合。The controllers can be, for example, a central processing unit (Central Processing Unit; CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessors), digital signal processors (Digital Signal Processors; DSPs), Programmable controller, Application Specific Integrated Circuits (ASIC), Programmable Logic Device (PLD) or other similar devices or a combination of these devices.
本發明光學檢測系統主要是用於對複雜表面的待測物進行光學檢測,該等複雜表面包括凹凸表面、金柱、盲孔、穿孔等,用以特別針對平面拍攝時待測物表面不容易顯示的側壁進行檢測。本發明用於盲孔、穿孔的檢測上特別具有功效,可以經由一次性拍攝即完成複數個盲孔、穿孔內部孔壁的檢測。The optical detection system of the present invention is mainly used for optical detection of objects to be tested on complex surfaces, such complex surfaces including concave and convex surfaces, gold pillars, blind holes, perforations, etc., which are particularly difficult for the surface of the object to be tested when shooting in a plane. The sidewalls shown are inspected. The present invention is particularly effective for detecting blind holes and perforations, and can complete the detection of multiple blind holes and the inner wall of the perforation through one-time shooting.
以下係針對本發明複數個不同實施例分別進行說明,請先一併參閱「圖1」,係本發明第一實施例的外觀示意圖。The following is a description of a plurality of different embodiments of the present invention. Please refer to "FIG. 1" first, which is a schematic diagram of the appearance of the first embodiment of the present invention.
本實施例係提供一種單側式待測物側壁檢測系統100,包括一待測物載台10A、一影像擷取裝置20A、一反射鏡裝置30A、以及一第一移載裝置40A。This embodiment provides a single-sided object-to-be-tested
待測物載台10A係用以承載該待測物AN。於其中一較佳實施例中,該待測物載台10A係可以為用以擺設待測物AN的平台,透過治具固定待測物AN位置。於用以檢測穿孔的實施例中,該待測物載台10A係可以做為一第二光源,用以對待測物AN提供背光源,該第二光源設置於該孔洞側壁H下方,以提供該孔洞側壁H照明光源,以對該穿孔內側提供均光照明。於較佳實施例中,該第二光源包括一面光源,其中該面光源的面積與該待測物AN成正比,於本發明中對於該待測物載台10A的實施例不予以限制。The
影像擷取裝置20A設置於該待測物載台10A一側,用以擷取待測物影像。該影像擷取裝置20A係透過感光元件及對應的鏡頭拍攝待測物AN的影像,並將所獲取的影像傳送至後端的影像處理裝置IP進行影像分析,以確認待測物AN的瑕疵狀態並完成檢測。於本實施例中,為了進行高精度的檢測,該影像擷取裝置20A包括一成像單元21A、一設置於該成像單元21A上的物鏡22A、以及一結合於該物鏡22A的第一光源。其中該成像單元21A係包括複數個感光元件。該物鏡22A內側對應於其光路設置有複數個光學元件(例如透鏡、鏡片)。該影像擷取裝置包括但不限於線掃描攝影機或面掃描攝影機。於一較佳實施例中,該影像擷取裝置係可以為線掃描攝影機,有利於增加檢測的效率。所述的第一光源設置於該孔洞側壁H上方,以提供該孔洞側壁H照明光源。於較佳實施例中,該第一光源的類型包括同軸光源23A、側向光源70A或環形光源。The image capturing
反射鏡裝置30A設置於該影像擷取裝置20A及該待測物載台10A之間。該反射鏡裝置30A於一較佳實施例中,係可以為金屬鍍膜反射鏡、矽光反射鏡、介電質光反射鏡等,於本發明中不予以限制。該反射鏡裝置30A與該待測物AN目標側壁之間具有一取像傾角A,以令該孔洞側壁H落在該反射鏡裝置30A相對該影像擷取裝置20A的取像範圍內。其中該反射鏡裝置30A具有一調整機構,藉以調整該反射鏡裝置30A的該取像傾角A的範圍。於較佳實施例中,該反射鏡裝置30A包括一平面鏡或一菱鏡,藉以由該影像擷取裝置20A透過該反射鏡裝置30A擷取該孔洞側壁H的影像。The
該影像擷取裝置20A及該反射鏡裝置30A設置於第一移載裝置40A上反射鏡(該反射鏡裝置30A亦可以結合於該物鏡22A上,並配合該物鏡22A從動),並將該影像擷取裝置20A及該反射鏡裝置30A,由該待測物載台10A的第一側位置移動至第二側位置,獲取該待測物AN整面所有該目標側壁的影像。於另一較佳實施例中,該待測物載台10A亦可以設置於一第二移載裝置上,用以移載該待測物載台10A相對該影像擷取裝置20A移動,該第二移載裝置係可以為可動式載台(或XYZ載台、XYθ載台等),可移載或移動待測物AN至適當的取像位置。The
請一併參閱「圖2」及「圖3」,係本發明第一實施例的光學路徑示意圖、以及成像示意圖。Please refer to "FIG. 2" and "FIG. 3" together, which are the schematic diagrams of the optical path and the imaging diagram of the first embodiment of the present invention.
如「圖2」,於進行檢測時,第一移載裝置40A係將該影像擷取裝置20A及該反射鏡裝置30A,由該待測物載台10A的第一側位置L1移動至第二側位置L2(如箭頭A1),完成該待測物AN於一整條路徑上盲孔及穿孔的檢測。為了將該待測物載台10A上待測物AN的目標影像反射至該影像擷取裝置20A,以拍攝待測物AN的孔洞側壁H,在該影像擷取裝置20A與待測物AN平面為90度設置的情況下,所述的取像傾角A至少必須要低於45度角。於較佳實施例中,為了減少取像距離,該取像傾角A係介於10度至20度之間,可以得到較佳的成像品質。所取得的影像如「圖3」所示,於進行單向的移動時,該待測物AN孔洞側壁H的第一側影像W1如斜線位置,係可以被影像擷取裝置20A拍攝並取得。相對該目標側壁W1的另一側孔洞側壁H的第二側影像(圖未示)則可以由鏡向的方式取得(例如整個影像擷取裝置及反射鏡裝置水平旋轉180度、反射鏡裝置180度鏡向旋轉、或是直接設置輔助影像擷取裝置及輔助反射鏡如後面第二實施例所示)。As shown in "FIG. 2", during inspection, the
有關於檢測時該影像擷取裝置20A的移動路徑,請一併參閱「圖4」及「圖5」,係本發明第一實施例的工作示意圖(一)及工作示意圖(二)。For the moving path of the
如「圖4」,於本實施例中,第一移載裝置40A係可以帶動該影像擷取裝置20A以S路徑方式移動,藉此取得待測物AN上複數排孔洞側壁H的影像。有關於S路徑轉折的次數取決於待測物AN的面積大小、或是該影像擷取裝置20A的取像範圍,於本發明中不予以限制。As shown in "FIG. 4", in this embodiment, the
於拍攝完該目標側壁的影像後,如「圖5」,到達路徑末端時,該影像擷取裝置20A及該反射鏡裝置30A係可以水平旋轉180度後,在延S路徑原路復歸至起始位置,完成孔洞側壁H第二側影像的檢測。藉此孔洞側壁H兩側的影像都可以被有效的取得。After shooting the image of the target side wall, as shown in "Figure 5", when reaching the end of the path, the
於另一較佳實施例中,該第一移載裝置40A係可以省略,而直接由該待測物載台10A(XY載台)相對該影像擷取裝置20A移動,以獲取所有側壁影像,此部分非屬本發明所欲限制的範圍。In another preferred embodiment, the
關於光源配置的部分,請一併參閱「圖6」及「圖7」,係本發明第一實施例用於盲孔檢測及用於穿孔檢測的光學配置方式。Regarding the configuration of the light source, please refer to "FIG. 6" and "FIG. 7" together, which is the optical configuration method for blind hole detection and perforation detection according to the first embodiment of the present invention.
本發明用於盲孔檢測的實施例,請參閱圖6,盲孔檢測主要是透過同軸光源23A對待測物AN的孔洞側壁H進行補光,透過相對高指向性的同軸光照亮該孔洞側壁H,以凸顯該孔洞側壁H上的瑕疵。除了用同軸光進行補光外,亦可以透過一側或兩側的側向光源70A對待測物AN進行補光,該側向光源70A係可以為平行光源或是漫射光源,於較佳實施例中則是可以在多種光源中進行切換,以便後端影像處理設備對不同種類的瑕疵進行分類。For an embodiment of the present invention for blind hole detection, please refer to FIG. 6. Blind hole detection mainly uses coaxial
本發明用於穿孔檢測的實施例,請參閱圖7,穿孔檢測主要是透過設置於待測物載台10A上的背光源80A進行補光。該背光源80A較佳係為漫射光源,透過均光板提供一致性的補光。為了進一步加強穿孔內壁的影像,於檢測穿孔的光學配置仍可以提供側向光源進一步補光。For an embodiment of the present invention used for perforation detection, please refer to FIG. The backlight source 80A is preferably a diffuse light source, which provides consistent fill light through a light homogenizing plate. In order to further enhance the image of the inner wall of the perforation, the optical configuration for detecting the perforation can still provide a side light source to further supplement the light.
於另一較佳實施例,請一併參閱「圖8」,係本發明第二實施例的外觀示意圖。以下針對本發明的第二實施例進行說明,由於本實施例與第一實施例的差異性僅在於本發明影像擷取裝置及反射鏡裝置的數量,相同部分即不再予以贅述。For another preferred embodiment, please also refer to "FIG. 8", which is a schematic diagram of the appearance of the second embodiment of the present invention. The second embodiment of the present invention will be described below. Since the difference between this embodiment and the first embodiment is only in the number of image capture devices and mirror devices of the present invention, the same parts will not be repeated.
本實施例除了原先包括的待測物載台10A、影像擷取裝置20A(第一影像擷取裝置)、反射鏡裝置30A(第一反射鏡裝置)、以及第一移載裝置40A之外,更進一步包括一第二影像擷取裝置50A、以及一第二反射鏡裝置60A。該第二影像擷取裝置50A設置於該待測物載台10A一側,用以拍攝待測物AN孔洞側壁H的影像。該第二反射鏡裝置60A設置於該第二影像擷取裝置50A及該待測物載台10A之間。In addition to the
請一併參閱「圖9」,係本發明第二實施例中第二影像擷取裝置50A的成像示意圖。由於該第二反射鏡裝置60A與該待測物AN相對該孔洞側壁H具有第二取像傾角B,該第二影像擷取裝置50A經由該第二反射鏡裝置60A拍攝該孔洞側壁H時將獲得該孔洞側壁H的第二側影像W2,藉以拍攝並獲得該孔洞側壁H的所有區域。Please also refer to "FIG. 9", which is a schematic diagram of imaging of the second
於較佳實施例中,該第二影像擷取裝置50A及該第二反射鏡裝置60A係相對該第一影像擷取裝置20A、第一反射鏡裝置30A以鏡向方式設置,並共同設置於該第一移載裝置40A上,藉由此方式該第一移載裝置40A移動時可同時透過第一影像擷取裝置20A及第一反射鏡裝置30A的組合取得目標側壁(第一方向)的影像、第二影像擷取裝置50A及第二反射鏡裝置60A的組合取得另一目標側壁(第二方向)的影像,藉此於一次路徑方向上完成兩側目標側壁的檢測。In a preferred embodiment, the second
以下係針對本發明的第三實施例進行說明,請一併參閱「圖10」,係本發明第三實施例的外觀示意圖。以下有關於相同專業名詞的定義不再予以贅述,僅針對結構上與第一實施例及第二實施例的主要差異性部分進行說明。The following is a description of the third embodiment of the present invention. Please also refer to "FIG. 10", which is a schematic diagram of the appearance of the third embodiment of the present invention. The following definitions of the same technical terms will not be repeated, and only the main differences between the first embodiment and the second embodiment in terms of structure will be described.
本實施例係提供一種雙側式待測物側壁檢測系統200,包括一待測物載台10B、一影像擷取裝置20B、一成對反射鏡組裝置30B、以及一線性滑軌載台40B。於較佳實施例中,所述的待測物載台10B、一影像擷取裝置20B、以及一成對反射鏡組裝置30B係可以共構為一體。所述的影像擷取裝置20B設置於該待測物載台10B一側,用以拍攝待測物影像。所述的成對反射鏡組裝置30B設置於該影像擷取裝置20B及該待測物載台10B之間,包括一第一反射鏡31B以及一設置於該第一反射鏡31B對向側的第二反射鏡32B。該第一反射鏡31B與該待測物AN的孔洞側壁H之間具有一第一取像傾角C,該第二反射鏡32B與該待測物AN的孔洞側壁H之間具有一第二取像傾角D,以令該孔洞側壁H的第一側影像與該孔洞側壁H的第二側影像分別落在該第一反射鏡31B及該第二反射鏡32B相對該影像擷取裝置20B的取像範圍內。其中該第一反射鏡31B具有一第一調整機構,藉以調整該第一反射鏡31B的該第一取像傾角的範圍,該第二反射鏡32B具有一第二調整機構,藉以調整該第二反射鏡32B的該第二取像傾角的範圍。This embodiment provides a double-sided object-to-be-tested
為了將該待測物載台10B上待測物AN的孔洞側壁H影像反射至該影像擷取裝置20B,以進行檢測,在該影像擷取裝置20B與待測物AN平面為90度設置的情況下,包含但不限於第一取像傾角C至少必須要低於45度角(0度至45度),於鏡向設置的實施例中,包含但不限於第二取像傾角D則至少必須要高於45度角(-45度至0度)。於較佳實施例中,為了減少取像距離,該第一取像傾角C係介於10度至20度之間、該第二取像傾角D係介於-10度至-20度之間,可以得到較佳的成像品質。In order to reflect the image of the side wall H of the hole of the test object AN on the
須注意的是,於線掃描攝影機的實施例中,為了同時取得第一反射鏡31B以及第二反射鏡32B的影像,該線掃描攝影機的掃描方向係正交於該第一反射鏡31B以及該第二反射鏡32B,以同時獲取孔洞側壁H的第一側影像及第二側影像。It should be noted that in the embodiment of the line scan camera, in order to obtain the images of the
請一併參閱「圖11」及「圖12」,係本發明第三實施例的光學路徑示意圖、以及成像示意圖。如「圖11」,以線掃描攝影機為實施例進行檢測時,所述的線性滑軌載台40B係將該影像擷取裝置20B相對該成對反射鏡組裝置30B由該待測物載台10B的第一側位置L3移動至第二側位置L4(如箭頭A2),以沿路徑掃過複數個孔洞側壁H,完成該待測物AN於一整條路徑上孔洞側壁H的檢測。如「圖12」,對向兩側(第一反射鏡31B、第二反射鏡32B)的影像同時由該影像擷取裝置20B所拍攝取得,因此於一次行程中,影像擷取裝置20B即可完成孔洞側壁H的第一側影像P1及第二側影像P2的檢測。Please refer to "FIG. 11" and "FIG. 12" together, which are the schematic diagrams of the optical path and the imaging diagram of the third embodiment of the present invention. As shown in "FIG. 11", when a line scan camera is used as an embodiment for detection, the linear
以下係針對本發明的第四實施例進行說明,請一併參閱「圖13」,係本發明第四實施例的外觀示意圖。The following is a description of the fourth embodiment of the present invention. Please also refer to "FIG. 13", which is a schematic diagram of the appearance of the fourth embodiment of the present invention.
以下針對本發明的第四實施例進行說明,由於本實施例與第三實施例的差異性僅在於成對反射鏡組裝置的設置數量,相同部分即不再予以贅述。The following describes the fourth embodiment of the present invention. Since the difference between this embodiment and the third embodiment is only the number of paired mirror assembly devices, the same parts will not be repeated.
本實施例係包括複數個成對反射鏡組裝置30B用以分別對準至待測物AN上的複數個區域的盲孔及穿孔進行檢測。於本實施例中,影像擷取裝置20B係配合設置於一線性滑軌載台40B上,以經由該線性滑軌載台40B移動至複數個區域上以分別拍攝盲孔及穿孔的第一目標側壁及第二目標側壁。由於多個成對反射鏡組裝置30B所組成的成對反射鏡列Ⅰ,設置於待測物AN上側,可一次擷取多個孔洞的第一目標側壁影像及第二目標側壁影像。This embodiment includes a plurality of paired
有關於檢測時該影像擷取裝置20B的移動路徑,請一併參閱「圖14」,係本發明第四實施例的工作示意圖。For the moving path of the
如「圖14」,於本實施例中,由於多個成對反射鏡組裝置30B以排列設置於待測物AN的盲孔或穿孔周側,線性滑軌載台40B係可以直接將影像擷取裝置20B沿一直線路徑方式移動,分別拍攝對應位置上的盲孔及穿孔。於拍攝完該盲孔及穿孔的影像到達路徑末端時,即完成一次檢測。藉由本實施例的方式,可以大幅地縮減檢測所需的時間,有效提升檢測的效率。As shown in "FIG. 14", in this embodiment, since a plurality of pairs of
請一併參閱「圖15」,係本發明第五實施例的工作示意圖於另一較佳實施態樣中,成對反射鏡組亦可以直接以直條的菱鏡取代,由於本實施例與第四實施例的差異性僅在於反射鏡種類,相同部分即不再予以贅述。Please also refer to "Figure 15", which is a schematic diagram of the operation of the fifth embodiment of the present invention. The difference of the fourth embodiment lies only in the types of mirrors, and the same parts will not be repeated.
本實施例係包括複數個並排設置的菱鏡M用以分別對準至待測物AN上的複數個區域的盲孔及穿孔進行檢測,如「圖15」,該菱鏡M係呈倒三角形,於該菱鏡M的二側斜面上係設置有一層反射膜。於本實施例中,影像擷取裝置20B係配合設置於一線性滑軌載台40B上,以經由該線性滑軌載台40B移動至複數個區域上以分別拍攝盲孔及穿孔的第一目標側壁及第二目標側壁。由於多個菱鏡M設置於待測物AN上側,可一次擷取多個孔洞的第一目標側壁影像及第二目標側壁影像。有關於檢測時該影像擷取裝置20B的移動路徑請一併參閱「圖14」。This embodiment includes a plurality of diamond mirrors M arranged side by side to respectively align to the blind holes and perforations of the plurality of areas on the test object AN for detection. As shown in "Figure 15", the diamond mirror M is in the shape of an inverted triangle. , A reflective film is provided on the two slopes of the diamond mirror M. In this embodiment, the
如「圖14」,於本實施例中,由於多個菱鏡M以並排方式設置於待測物AN的盲孔或穿孔周側,線性滑軌載台40B係可以直接將影像擷取裝置20B沿一直線路徑方式移動,分別拍攝對應位置上的盲孔及穿孔。於拍攝完該盲孔及穿孔的影像到達路徑末端時,即完成一次檢測。藉由本實施例的方式,可以大幅地縮減檢測所需的時間,有效提升檢測的效率。As shown in "FIG. 14", in this embodiment, since a plurality of diamond mirrors M are arranged side by side on the blind hole or perforation side of the test object AN, the linear
請一併參閱「圖16」,係本發明第六實施例的外觀示意圖。Please also refer to "FIG. 16", which is a schematic diagram of the appearance of the sixth embodiment of the present invention.
於本實施例中揭示一種單側式檢測系統300,用於檢測待測物AN上的至少一個孔洞側壁H。該單側式檢測系統300包括一待測物載台10C、以及一影像擷取裝置20C。In this embodiment, a single-
所述的待測物載台10C用以承載該待測物AN,於其中一較佳實施例中,該待測物載台10C係可以為用以擺設待測物AN的平台,透過治具固定待測物AN位置。於另一較佳實施例中,該待測物載台10C係可以為可動式載台(或XYZ載台、XYθ載台等),可移載或移動待測物AN至適當的取像位置。於用以檢測穿孔的實施例中,在該待測物載台10C下方,係設置有一面光源,用以對待測物AN提供背光源,其中該面光源的面積與該待測物AN成正比以對該穿孔內側提供均光照明,於本發明中對於該待測物載台10C的實施例不予以限制。The
該影像擷取裝置20C設置於該待測物載台10C一側,用以擷取待測物AN影像,該影像擷取裝置20C係透過感光元件及對應的鏡頭拍攝待測物AN的影像,並將所獲取的影像傳送至後端的影像處理裝置24C進行影像分析,以確認待測物AN的瑕疵狀態並完成檢測。於本實施例中,為了進行高精度的檢測,該影像擷取裝置20C包括一成像單元21C、一設置於該成像單元21C上的物鏡22C、以及一結合於該物鏡22C的第一光源23C。其中該成像單元21C係包括複數個感光元件。該物鏡22C內側對應於其光路設置有複數個光學元件(例如透鏡、鏡片)。該影像擷取裝置20C包括但不限於,可為線掃描攝影機或面掃描攝影機。於一較佳實施例中,該影像擷取裝置20C係可以為線掃描攝影機,有利於增加檢測的效率。The
為了拍攝該孔洞側壁H的影像,該影像擷取裝置20C與該孔洞側壁H之間具有一取像傾角E,使該影像擷取裝置20C擷取該孔洞側壁H的影像。該取像傾角E於較佳實施例中,係可以為15度至75度之間。In order to capture the image of the side wall H of the hole, there is an inclination angle E between the
於一較佳實施例中,為了取得該孔洞側壁H內的影像,該影像擷取裝置20C可以配合線性軌道、環形軌道、多軸機臂、或其他類此的裝置設置。於線性軌道的實施例中,可以透過該線性軌道移動該影像擷取裝置20C分別拍攝孔洞側壁H的第一側影像後,再由另一側方向復歸時旋轉180度,拍攝孔洞側壁H的第二側影像,以完成孔洞側壁H的檢測;於環形軌道的實施例中,該影像擷取裝置20A係可以該孔洞側壁H的中心為軸心,於平面上旋轉180度以獲取該孔洞側壁H的所有影像;該等實施例非屬本發明所欲限制的範圍。In a preferred embodiment, in order to obtain the image in the side wall H of the hole, the
於一可行的較佳實施例中,該單側式檢測系統300可進一步包括一反射鏡裝置設置於該影像擷取裝置20C及該待測物載台10C之間,該影像擷取裝置20C具有一調整機構,藉以調整該反射鏡裝置的該取像傾角E的範圍。In a feasible preferred embodiment, the single-
請一併參閱「圖17」,係本發明第七實施例的外觀示意圖。Please also refer to "FIG. 17", which is a schematic diagram of the appearance of the seventh embodiment of the present invention.
以下針對本發明的第六實施例進行說明,由於本實施例與第一實施例的差異性僅在於本發明影像擷取裝置的數量,相同部分即不再予以贅述。The sixth embodiment of the present invention will be described below. Since the difference between this embodiment and the first embodiment lies in the number of image capturing devices of the present invention, the same parts will not be repeated.
於本實施例中,係更進一步設置一第二影像擷取裝置50C,該第二影像擷取裝置50C係設置於該第一影像擷取裝置20C相對於孔洞側壁H的另一側,因此可以同時拍攝到待測物AN孔洞側壁H的第一側影像及第二側影像。於本實施例中,該第一影像擷取裝置20C與該孔洞側壁H之間具有一第一取像傾角E,該第二影像擷取裝置50C與該孔洞側壁H之間具有一第二取像傾角F,使該第一影像擷取裝置20C及該第二影像擷取裝置50C分別擷取該孔洞側壁H的第一側影像以及第二側影像。In this embodiment, a second
為了拍攝該孔洞側壁H的影像,該第一影像擷取裝置20C與該孔洞側壁H之間具有一取像傾角E,使該影像擷取裝置20C擷取該孔洞側壁H的影像。該取像傾角E於較佳實施例中,係可以為15度至45度之間,該取像傾角E於較佳實施例中,係可以為-15度至-45度之間。In order to capture the image of the side wall H of the hole, there is an inclination E between the first
綜上所述,本發明可以有效的提升光學檢測系統檢測盲孔、穿孔或是其他複雜表面的瑕疵的效率,相較於習知技術可以大幅地降低檢測所需的時間成本。此外,本發明機構設置簡單,相較於習知技術可以降低檢測的複雜度,同時降低設備的維修成本。In summary, the present invention can effectively improve the efficiency of the optical inspection system to detect blind holes, perforations or other complex surface defects, and can greatly reduce the time and cost required for inspection compared with the prior art. In addition, the mechanism of the present invention is simple to set up, and compared with the conventional technology, the complexity of detection can be reduced, and the maintenance cost of the equipment can be reduced at the same time.
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能以此限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾,皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, everything made in accordance with the scope of the patent application of the present invention is equal Changes and modifications should still fall within the scope of the patent of the present invention.
100:單側式檢測系統
10A:待測物載台
20A:影像擷取裝置
21A:成像單元
22A:物鏡
23A:同軸光源
30A:反射鏡裝置
40A:第一移載裝置
50A:第二影像擷取裝置
60A:第二反射鏡裝置
70A:側向光源
A:取像傾角
B:第二取像傾角
W1:第一側影像
W2:第二側影像
200:雙側式檢測系統
10B:待測物載台
20B:影像擷取裝置
30B:成對反射鏡組裝置
31B:第一反射鏡
32B:第二反射鏡
40B:線性滑軌載台
C:第一取像傾角
D:第二取像傾角
P1:第一目標側壁
P2:第二目標側壁
H:孔洞側壁
L1:第一側位置
L2:第二側位置
A1:箭頭
L3:第一側位置
L4:第二側位置
A2:箭頭
300:單側式檢測系統
10C:待測物載台
20C:影像擷取裝置
40C:線性滑軌載台
50C:第二影像擷取裝置
A3:箭頭
E:第一取像傾角
F:第二取像傾角
Ⅰ:成對反射鏡列
IP:影像處理裝置
100: Single-
圖1,本發明第一實施例的外觀示意圖。Fig. 1 is a schematic diagram of the appearance of the first embodiment of the present invention.
圖2,本發明第一實施例的光學路徑示意圖。Fig. 2 is a schematic diagram of the optical path of the first embodiment of the present invention.
圖3,本發明第一實施例的成像示意圖。Fig. 3 is a schematic diagram of imaging of the first embodiment of the present invention.
圖4,本發明第一實施例的工作示意圖(一)。Fig. 4 is a working schematic diagram (1) of the first embodiment of the present invention.
圖5,本發明第一實施例的工作示意圖(二)。Fig. 5 is a working schematic diagram (2) of the first embodiment of the present invention.
圖6,本發明第一實施例用於盲孔檢測的光學配置方式。Fig. 6 shows the optical configuration for blind hole detection according to the first embodiment of the present invention.
圖7,本發明第一實施例用於穿孔檢測的光學配置方式。Fig. 7 shows the optical configuration for perforation detection in the first embodiment of the present invention.
圖8,本發明第二實施例的外觀示意圖。Fig. 8 is a schematic diagram of the appearance of the second embodiment of the present invention.
圖9,本發明第二實施例中第二影像擷取裝置的成像示意圖。FIG. 9 is a schematic diagram of imaging of the second image capturing device in the second embodiment of the present invention.
圖10,本發明第二實施例的外觀示意圖。Fig. 10 is a schematic diagram of the appearance of the second embodiment of the present invention.
圖11,本發明第三實施例的外觀示意圖。Fig. 11 is a schematic diagram of the appearance of the third embodiment of the present invention.
圖12,本發明第三實施例的工作示意圖。Fig. 12 is a schematic diagram of the operation of the third embodiment of the present invention.
圖13,本發明第三實施例的成像示意圖。Fig. 13 is a schematic diagram of imaging of the third embodiment of the present invention.
圖14,本發明第四實施例的外觀示意圖。Fig. 14 is a schematic diagram of the appearance of the fourth embodiment of the present invention.
圖15,本發明第四實施例的工作示意圖。Fig. 15 is a schematic diagram of the operation of the fourth embodiment of the present invention.
圖16,本發明第五實施例的外觀示意圖。Fig. 16 is a schematic diagram of the appearance of the fifth embodiment of the present invention.
圖17,本發明第六實施例的工作示意圖。Fig. 17 is a schematic diagram of the operation of the sixth embodiment of the present invention.
100:單側式檢測系統 100: Single-sided detection system
10A:待測物載台 10A: Object stage to be tested
20A:影像擷取裝置 20A: Image capture device
21A:成像單元 21A: imaging unit
22A:物鏡 22A: Objective lens
23A:同軸光源 23A: Coaxial light source
30A:反射鏡裝置 30A: Mirror device
40A:第一移載裝置 40A: The first transfer device
A:取像傾角 A: Acquisition inclination
IP:影像處理裝置 IP: image processing device
AN:待測物 AN: DUT
H:孔洞側壁 H: Sidewall of the hole
Claims (32)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107146567A TWI745645B (en) | 2018-12-21 | 2018-12-21 | Single-sided and double-sided sidewall inspection system and paired mirror assembly device |
| CN201911229714.9A CN111351797A (en) | 2018-12-21 | 2019-12-04 | Single-side and double-side detection system and paired reflector set device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107146567A TWI745645B (en) | 2018-12-21 | 2018-12-21 | Single-sided and double-sided sidewall inspection system and paired mirror assembly device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202024602A TW202024602A (en) | 2020-07-01 |
| TWI745645B true TWI745645B (en) | 2021-11-11 |
Family
ID=71194245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107146567A TWI745645B (en) | 2018-12-21 | 2018-12-21 | Single-sided and double-sided sidewall inspection system and paired mirror assembly device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111351797A (en) |
| TW (1) | TWI745645B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI892551B (en) * | 2024-02-06 | 2025-08-01 | 翔緯光電股份有限公司 | Via detection device and method for tgv (through glass via) substrate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112146577A (en) * | 2020-09-29 | 2020-12-29 | 广州市景泰科技有限公司 | Glue dispensing state detection device of full-automatic three-in-one glue spreader |
| TWI870685B (en) * | 2022-07-27 | 2025-01-21 | 泓偊科技股份有限公司 | Automatic optical inspection equipment for automatic calibration of light sources |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4865448A (en) * | 1986-01-14 | 1989-09-12 | Sanko Giken Kogyo Co., Ltd. | Method and aparatus for observing the internal surface of a small hole |
| TW517847U (en) * | 2001-06-28 | 2003-01-11 | Key Ware Electronics Co Ltd | Non-destructive detecting device for wall of micro hole of circuit board |
| WO2005038446A1 (en) * | 2003-10-16 | 2005-04-28 | Hitachi, Ltd. | Defect inspection device, defect inspection method, and method of machining internal surface of cylindrial object |
| US9019352B2 (en) * | 2011-11-21 | 2015-04-28 | Amchael Visual Technology Corp. | Two-parallel-channel reflector with focal length and disparity control |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4560273A (en) * | 1982-11-30 | 1985-12-24 | Fujitsu Limited | Method and apparatus for inspecting plated through holes in printed circuit boards |
| JPH06241737A (en) * | 1992-12-25 | 1994-09-02 | Toyota Central Res & Dev Lab Inc | Cross-sectional area and volume measuring device |
| JP3536166B2 (en) * | 1996-05-13 | 2004-06-07 | 株式会社椿本チエイン | Surface inspection method and surface inspection device |
| JP3614597B2 (en) * | 1996-10-24 | 2005-01-26 | 三菱原子燃料株式会社 | Internal imaging device |
| JP2004524538A (en) * | 2001-04-06 | 2004-08-12 | ケーエルエー−テンカー コーポレイション | Improvement of defect detection system |
| CN102042988A (en) * | 2010-11-25 | 2011-05-04 | 赵晓宇 | Detection system for defects of inclined teeth in screws and detection method thereof |
| KR20120087538A (en) * | 2011-01-28 | 2012-08-07 | 삼성전기주식회사 | Inspection device of printed board |
-
2018
- 2018-12-21 TW TW107146567A patent/TWI745645B/en active
-
2019
- 2019-12-04 CN CN201911229714.9A patent/CN111351797A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4865448A (en) * | 1986-01-14 | 1989-09-12 | Sanko Giken Kogyo Co., Ltd. | Method and aparatus for observing the internal surface of a small hole |
| TW517847U (en) * | 2001-06-28 | 2003-01-11 | Key Ware Electronics Co Ltd | Non-destructive detecting device for wall of micro hole of circuit board |
| WO2005038446A1 (en) * | 2003-10-16 | 2005-04-28 | Hitachi, Ltd. | Defect inspection device, defect inspection method, and method of machining internal surface of cylindrial object |
| US9019352B2 (en) * | 2011-11-21 | 2015-04-28 | Amchael Visual Technology Corp. | Two-parallel-channel reflector with focal length and disparity control |
Non-Patent Citations (5)
| Title |
|---|
| Leader 萊得科技有限公司,"產品介紹:ZK-200U懸背式顯微鏡",2017/07/31,"http://www.leader-s.com.tw/Product_Detail.aspx?CategoryID=84e210c5-afb1-4dbe-abc6-f6a4909cb973&ID=664c265b-c018-4289-b13e-f27ea6e3bb33" |
| Leader 萊得科技有限公司,"產品介紹:ZK-200U懸背式顯微鏡",2017/07/31,"http://www.leader-s.com.tw/Product_Detail.aspx?CategoryID=84e210c5-afb1-4dbe-abc6-f6a4909cb973&ID=664c265b-c018-4289-b13e-f27ea6e3bb33"; * |
| 力丞儀器科技有限公司,"3D顯微鏡",2018/08/21,"http://apisc.com/microscope_3D.htm" |
| 力丞儀器科技有限公司,"3D顯微鏡",2018/08/21,"http://apisc.com/microscope_3D.htm"; * |
| 宜特科技股份有限公司,"超高解析度數位顯微鏡 (3D OM)",2018/07/25,"https://www.istgroup.com/tw/service/3d-om/" * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI892551B (en) * | 2024-02-06 | 2025-08-01 | 翔緯光電股份有限公司 | Via detection device and method for tgv (through glass via) substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202024602A (en) | 2020-07-01 |
| CN111351797A (en) | 2020-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6954268B2 (en) | Defect inspection apparatus | |
| KR101207198B1 (en) | Board inspection apparatus | |
| TWI773032B (en) | An arched illumination device, an imaging system with the same and a method for imaging | |
| TWI745645B (en) | Single-sided and double-sided sidewall inspection system and paired mirror assembly device | |
| TW200427980A (en) | Inspection device for transparent substrate end surface and inspection method therefor | |
| TWI881180B (en) | Appearance inspection device and method | |
| CN106596555B (en) | Optical inspection equipment using a multi-axis arm | |
| JPWO2002023123A1 (en) | Optical sensor | |
| CN112033971A (en) | Visual flaw detection system and method | |
| JP6122310B2 (en) | Inspection device | |
| CN111044524A (en) | Optical detection device and method for realizing equal optical path imaging of semiconductor crystal grains relative to two surfaces | |
| KR101124567B1 (en) | Wafer inspecting apparatus having hybrid illumination | |
| CN110849886B (en) | Device and method for realizing simultaneous detection of top and bottom surfaces of semiconductor crystal grains based on image transfer lens | |
| KR20090107314A (en) | Surface inspection device and surface inspection method | |
| KR20090092116A (en) | Apparatus and method for measuring three dimension shape of a object | |
| TW202109027A (en) | Wafer appearance inspection device and method | |
| CN111198190A (en) | Optical detection system | |
| KR20090116552A (en) | AOI device | |
| CN108303431A (en) | Automatic optical detection system for surface foreign matter detection | |
| KR20130035827A (en) | Apparatus for automated optical inspection | |
| JP2012169370A (en) | Display panel inspection equipment and display panel inspection method | |
| TWI845721B (en) | Wafer appearance inspection device and method | |
| CN211426306U (en) | Device for realizing simultaneous detection of semiconductor crystal grain top surface and bottom surface based on image transfer lens | |
| CN115015275A (en) | Defect detection device | |
| KR101164208B1 (en) | Board inspection apparatus |