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TWI744372B - 接合用組成物及其製造方法、接合體以及被覆銀奈米粒子 - Google Patents

接合用組成物及其製造方法、接合體以及被覆銀奈米粒子 Download PDF

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Publication number
TWI744372B
TWI744372B TW106126492A TW106126492A TWI744372B TW I744372 B TWI744372 B TW I744372B TW 106126492 A TW106126492 A TW 106126492A TW 106126492 A TW106126492 A TW 106126492A TW I744372 B TWI744372 B TW I744372B
Authority
TW
Taiwan
Prior art keywords
bonding
acid
silver
carboxylic acid
composition
Prior art date
Application number
TW106126492A
Other languages
English (en)
Chinese (zh)
Other versions
TW201805391A (zh
Inventor
久保田茂樹
中島尚耶
Original Assignee
日商阪東化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商阪東化學股份有限公司 filed Critical 日商阪東化學股份有限公司
Publication of TW201805391A publication Critical patent/TW201805391A/zh
Application granted granted Critical
Publication of TWI744372B publication Critical patent/TWI744372B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
TW106126492A 2016-08-10 2017-08-07 接合用組成物及其製造方法、接合體以及被覆銀奈米粒子 TWI744372B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-158258 2016-08-10
JP2016158258 2016-08-10

Publications (2)

Publication Number Publication Date
TW201805391A TW201805391A (zh) 2018-02-16
TWI744372B true TWI744372B (zh) 2021-11-01

Family

ID=61162452

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126492A TWI744372B (zh) 2016-08-10 2017-08-07 接合用組成物及其製造方法、接合體以及被覆銀奈米粒子

Country Status (2)

Country Link
TW (1) TWI744372B (fr)
WO (1) WO2018030173A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7257738B2 (ja) * 2017-10-10 2023-04-14 Dic株式会社 オフセット印刷用金属微粒子インク
JP6958434B2 (ja) * 2018-03-06 2021-11-02 三菱マテリアル株式会社 金属粒子凝集体及びその製造方法並びにペースト状金属粒子凝集体組成物及びこれを用いた接合体の製造方法
EP3852507A4 (fr) * 2018-09-14 2021-11-10 Showa Denko Materials Co., Ltd. Composant électronique et procédé de fabrication de composant électronique
CN113643841B (zh) * 2021-08-05 2023-03-14 江苏正能电子科技有限公司 耐醋酸背银及其制备方法、和包括其的perc电池
WO2024111095A1 (fr) 2022-11-24 2024-05-30 花王株式会社 Composition de liaison et procédé de production de corps lié

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011038128A (ja) * 2009-08-06 2011-02-24 Dowa Electronics Materials Co Ltd 金属ナノ粒子分散液およびその製造方法、ならびに金属ナノ粒子凝集体およびその製造方法
TW201249940A (en) * 2011-04-28 2012-12-16 Fujifilm Corp Electroconductive member, method for manufacturing the same, touch panel, solar cell and composition containing metal nanowire
TW201324538A (zh) * 2011-09-28 2013-06-16 Fujifilm Corp 導電性組成物、導電性構件及其製造方法、觸控式面板及太陽電池
WO2014084275A1 (fr) * 2012-11-30 2014-06-05 ナミックス株式会社 Pâte conductrice et son procédé de production
TW201615785A (zh) * 2014-10-31 2016-05-01 阪東化學股份有限公司 接合用組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6118192B2 (ja) * 2013-06-21 2017-04-19 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
US10427251B2 (en) * 2014-06-11 2019-10-01 Bando Chemical Industries, Ltd. Fine silver particle dispersion, fine silver particles, and method for producing same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011038128A (ja) * 2009-08-06 2011-02-24 Dowa Electronics Materials Co Ltd 金属ナノ粒子分散液およびその製造方法、ならびに金属ナノ粒子凝集体およびその製造方法
TW201249940A (en) * 2011-04-28 2012-12-16 Fujifilm Corp Electroconductive member, method for manufacturing the same, touch panel, solar cell and composition containing metal nanowire
TW201324538A (zh) * 2011-09-28 2013-06-16 Fujifilm Corp 導電性組成物、導電性構件及其製造方法、觸控式面板及太陽電池
WO2014084275A1 (fr) * 2012-11-30 2014-06-05 ナミックス株式会社 Pâte conductrice et son procédé de production
TW201615785A (zh) * 2014-10-31 2016-05-01 阪東化學股份有限公司 接合用組成物

Also Published As

Publication number Publication date
TW201805391A (zh) 2018-02-16
WO2018030173A1 (fr) 2018-02-15

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