TWI742861B - Storage equipment and a storage system - Google Patents
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本發明涉及一種倉儲設備及倉儲系統,特別是一種能用來同時儲存冷凍及冷藏的倉儲設備。The invention relates to a storage device and a storage system, in particular to a storage device that can be used to store freezing and cold storage at the same time.
在部分的半導體製程中,所需要使用的物料,必須存在冷凍環境中。在相關製程作業需要使用該物料時,相關人員必須在相關製程開始作業前,先將物料由冷凍庫中取出,並將其設置於常溫環境中進行解凍,直到該物料的溫度大致等於常溫後,再將其投入相關製程作業中。In some semiconductor manufacturing processes, the materials that need to be used must be stored in a refrigerated environment. When the relevant process operations need to use the material, the relevant personnel must first remove the material from the freezer before the relevant process starts operation, and set it in a room temperature environment for thawing until the temperature of the material is approximately equal to room temperature. Put it into related process operations.
如上所述,在實際應用中,相關人員將物料由冷凍庫中取出後,會將其設置於位於常溫環境中的桌子上,並等待該物料的溫度大致等於常溫時,再將其投入相關製程中。此種作業流程及方式,不但耗費人力,還容易發生錯誤。As mentioned above, in practical applications, after the relevant personnel take the material out of the freezer, set it on a table in a room temperature environment, and wait for the temperature of the material to be approximately equal to room temperature before putting it into the relevant manufacturing process. . This kind of operation process and method is not only labor intensive, but also prone to errors.
本發明公開一種倉儲設備,主要用以改善習知利用人工的方式,將設置於冷凍庫中的物件取出,以置放於常溫環境中,並等待物件的溫度大致為常溫時,再將其投入相關生產作業中的作業方式,所帶來的種種不便及問題。The present invention discloses a storage equipment, which is mainly used to improve the conventional manual method to take out objects set in a freezer and place them in a normal temperature environment, and wait for the temperature of the objects to be approximately normal temperature, and then put them into the relevant Various inconveniences and problems caused by the operation method in the production operation.
本發明的其中一實施例公開一種倉儲設備,其用以提供多個承載架存放,各個承載架用以承載一物件,倉儲設備包含:一本體、一處理裝置、一移載裝置、至少一第一腔室、至少一第二腔室、一溫度阻隔板及至少一環境調節裝置。本體包含一進出口。移載裝置包含一伸縮機構、一旋轉機構及一固持組件,伸縮機構與旋轉機構相連接,固持組件與伸縮機構相連接,固持組件用以固持承載架;移載裝置電性連接處理裝置,處理裝置能控制伸縮機構,而使固持組件相對於旋轉機構向前或向後移動;處理裝置能控制旋轉機構,而使伸縮機構及固持組件旋轉。第一腔室環繞移載裝置設置,第一腔室用以容置多個承載架。第二腔室環繞移載裝置設置,且第二腔室位於第一腔室的上方,第二腔室用以容置多個承載架。溫度阻隔板設置於第一腔室及第二腔室之間,溫度阻隔板用以阻隔第一腔室的內部的熱能與第二腔室的內部的熱能相互傳遞。環境調節裝置電性連接處理裝置,處理裝置用以控制環境調節裝置,以使第一腔室的溫度不高於一第一溫度,並使第二腔室的溫度不高於一第二溫度;其中,第二溫度低於30度,第一溫度高於負10度,且第一溫度不高於第二溫度。其中,處理裝置能控制移載裝置,而使固持組件將位於進出口的承載架,移入第一腔室或第二腔室置放,且處理裝置能控制移載裝置,而使固持組件將位於第一腔室中或第二腔室中的承載架移載至進出口。One of the embodiments of the present invention discloses a storage device, which is used to provide a plurality of carrier racks for storage, each carrier rack is used to carry an object, the storage device includes: a body, a processing device, a transfer device, at least one second A chamber, at least one second chamber, a temperature resistance partition, and at least one environmental regulation device. The body contains an entrance and exit. The transfer device includes a telescopic mechanism, a rotating mechanism, and a holding component. The telescopic mechanism is connected to the rotating mechanism, the holding component is connected to the telescopic mechanism, and the holding component is used to hold the carrier; the transfer device is electrically connected to the processing device for processing The device can control the telescopic mechanism to move the holding assembly forward or backward relative to the rotating mechanism; the processing device can control the rotating mechanism to rotate the telescopic mechanism and the holding assembly. The first chamber is arranged around the transfer device, and the first chamber is used for accommodating a plurality of supporting racks. The second chamber is arranged around the transfer device, and the second chamber is located above the first chamber, and the second chamber is used for accommodating a plurality of carrier racks. The temperature resistance baffle is arranged between the first chamber and the second chamber, and the temperature resistance baffle is used to block the heat energy inside the first chamber and the heat energy inside the second chamber from being transferred to each other. The environmental adjustment device is electrically connected to the processing device, and the processing device is used to control the environmental adjustment device so that the temperature of the first chamber is not higher than a first temperature, and the temperature of the second chamber is not higher than a second temperature; Wherein, the second temperature is lower than 30 degrees, the first temperature is higher than minus 10 degrees, and the first temperature is not higher than the second temperature. Among them, the processing device can control the transfer device, so that the holding component will be moved into the first chamber or the second chamber to be placed on the carrier at the entrance and exit, and the processing device can control the transfer device, and the holding component will be located in the first chamber or the second chamber. The carrier in the first chamber or the second chamber is transferred to the inlet and outlet.
本發明的其中一實施例公開一種倉儲系統,其包含:一倉儲設備、一移載設備及一處理設備。倉儲設備用以提供多個承載架存放,各個承載架用以承載一物件,倉儲設備包含:一本體、一處理裝置、一移載裝置、至少一第一腔室、至少一第二腔室、一溫度阻隔板及至少一環境調節裝置。本體包含一載台及一進出口,載台用以提供承載架置放。移載裝置包含一伸縮機構、一旋轉機構及一固持組件,伸縮機構與旋轉機構相連接,固持組件與伸縮機構相連接,固持組件用以固持承載架;移載裝置電性連接處理裝置,處理裝置能控制伸縮機構,而使固持組件相對於旋轉機構向前或向後移動;處理裝置能控制旋轉機構,而使伸縮機構及固持組件旋轉。第一腔室環繞移載裝置設置,第一腔室用以容置多個承載架。第二腔室環繞移載裝置設置,且第二腔室位於第一腔室的上方,第二腔室用以容置多個承載架。溫度阻隔板設置於第一腔室及第二腔室之間,溫度阻隔板用以阻隔第一腔室的內部的熱能與第二腔室的內部的熱能相互傳遞。環境調節裝置電性連接處理裝置,處理裝置用以控制環境調節裝置,以使第一腔室的溫度不高於一第一溫度,並使第二腔室的溫度不高於一第二溫度;其中,第二溫度低於30度,第一溫度高於負10度,且第一溫度不高於第二溫度。其中,處理裝置能控制移載裝置,而使固持組件將設置於在載台的承載架,穿過進出口,而移入第一腔室或第二腔室置放,且處理裝置能控制移載裝置,而使固持組件將位於第一腔室中或第二腔室中的承載架,穿過進出口而置放於載台。移載設備用以將承載架及其承載的物件由一冷凍庫移載至倉儲設備的載台。處理設備能接收一需求資訊,處理設備能依據需求資訊,控制移載設備將至少一個承載架及其承載的物件,由冷凍庫中取出並移載至載台;處理裝置能依據需求資訊,控制移載裝置將設置於載台的承載架及其承載的物件,移入第一腔室,且處理裝置能依據需求資訊,在承載架及其承載的物件設置於第一腔室一預定時間後,將承載架及其承載的物件移載至第二腔室。One of the embodiments of the present invention discloses a storage system, which includes: a storage device, a transfer device, and a processing device. The storage equipment is used to provide multiple carrier racks for storage, and each carrier rack is used to carry an object. The storage equipment includes: a body, a processing device, a transfer device, at least one first chamber, at least one second chamber, A temperature resistance baffle and at least one environmental regulation device. The main body includes a carrier and an entrance and exit, and the carrier is used to provide a carrier for placement. The transfer device includes a telescopic mechanism, a rotating mechanism, and a holding component. The telescopic mechanism is connected to the rotating mechanism, the holding component is connected to the telescopic mechanism, and the holding component is used to hold the carrier; the transfer device is electrically connected to the processing device for processing The device can control the telescopic mechanism to move the holding assembly forward or backward relative to the rotating mechanism; the processing device can control the rotating mechanism to rotate the telescopic mechanism and the holding assembly. The first chamber is arranged around the transfer device, and the first chamber is used for accommodating a plurality of supporting racks. The second chamber is arranged around the transfer device, and the second chamber is located above the first chamber, and the second chamber is used for accommodating a plurality of carrier racks. The temperature resistance baffle is arranged between the first chamber and the second chamber, and the temperature resistance baffle is used to block the heat energy inside the first chamber and the heat energy inside the second chamber from being transferred to each other. The environmental adjustment device is electrically connected to the processing device, and the processing device is used to control the environmental adjustment device so that the temperature of the first chamber is not higher than a first temperature, and the temperature of the second chamber is not higher than a second temperature; Wherein, the second temperature is lower than 30 degrees, the first temperature is higher than minus 10 degrees, and the first temperature is not higher than the second temperature. Among them, the processing device can control the transfer device, so that the holding component will be arranged on the carrier of the carrier, pass through the entrance and exit, and move into the first chamber or the second chamber for placement, and the processing device can control the transfer Device, so that the holding component will pass through the inlet and outlet of the carrier in the first chamber or the second chamber and be placed on the carrier. The transfer equipment is used to transfer the carrier and the objects it carries from a freezer to the carrier of the storage equipment. The processing equipment can receive a piece of demand information, and the processing equipment can control the transfer equipment to remove at least one carrier and its carried objects from the freezer and transfer it to the carrier according to the demand information; the processing device can control the transfer according to the demand information. The carrier device moves the carrier and the objects it carries into the first chamber, and the processing device can move the carrier and the objects it carries into the first chamber according to demand information after the carrier and its objects are set in the first chamber for a predetermined period of time. The carrying frame and its carried objects are transferred to the second chamber.
綜上所述,本發明的倉儲設備及倉儲系統,通過處理裝置及移載裝置等設計,可以讓相關人員更方便地將剛由冷凍庫中取出的承載架及物件進行存放。In summary, the storage equipment and storage system of the present invention, through the design of the processing device and the transfer device, can allow relevant personnel to more conveniently store the carrying racks and objects that have just been taken out of the freezer.
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.
於以下說明中,如有指出請參閱特定圖式或是如特定圖式所示,其僅是用以強調於後續說明中,所述及的相關內容大部份出現於該特定圖式中,但不限制該後續說明中僅可參考所述特定圖式。In the following description, if it is pointed out, please refer to a specific drawing or as shown in a specific drawing, it is only used to emphasize that in the subsequent description, most of the related content appears in the specific drawing. However, it is not limited that only the specific drawings can be referred to in this subsequent description.
請參閱圖1至圖3,圖1為本發明的倉儲設備的示意圖,圖2為本發明的倉儲設備的方塊示意圖,圖3為本發明的倉儲設備的局部剖面示意圖。倉儲設備100用以提供多個承載架200(如圖5所示)存放,各個承載架200用以承載一物件2(如圖5所示)。倉儲設備100包含:一本體A、一處理裝置B、一移載裝置C、一第一腔室D、三個第二腔室E、一溫度阻隔板F及至少一環境調節裝置G。Please refer to FIGS. 1 to 3. FIG. 1 is a schematic diagram of the storage device of the present invention, FIG. 2 is a block diagram of the storage device of the present invention, and FIG. 3 is a schematic partial cross-sectional view of the storage device of the present invention. The
本體A可以是包含一框體A1及多個蓋板A2,框體A1作為倉儲設備100整體的支撐結構,蓋板A2則是固定設置於框體A1上,而框體A1及多個蓋板A2則是共同構成所述第一腔室D及三個第二腔室E。在實際應用中,用來形成第一腔室D的多個蓋板A2可以是選用具有良好的阻熱效果的構件,而該些蓋板A2能避免第一腔室D內的溫度受外部環境影響。The main body A may include a frame body A1 and a plurality of cover plates A2. The frame body A1 serves as the overall supporting structure of the
處理裝置B電性連接移載裝置C及環境調節裝置G,處理裝置B能控制移載裝置C作動,且處理裝置B也能控制環境調節裝置G作動。在實際應用中,處理裝置B例如可以是各式電腦、伺服器、各式處理器等,於此不加以限制。處理裝置B可以設置於倉儲設備100的本體A中,或者,處理裝置B可以是獨立於本體A設置。處理裝置B還可以是連接有至少一個輸入裝置(例如是各式鍵盤、滑鼠、觸控螢幕、觸控板等)及至少一顯示裝置,而相關人員則可以是通過輸入裝置控制處理裝置B執行相關程序,且相關人員可以通過觀看顯示裝置,以得知倉儲設備100當前的倉儲狀態。The processing device B is electrically connected to the transfer device C and the environmental adjustment device G, the processing device B can control the operation of the transfer device C, and the processing device B can also control the operation of the environmental adjustment device G. In practical applications, the processing device B can be, for example, various computers, servers, various processors, etc., which is not limited herein. The processing device B may be installed in the main body A of the
移載裝置C包含一伸縮機構C1、一旋轉機構C2、一固持組件C3及一升降機構C4,伸縮機構C1與旋轉機構C2相連接,伸縮機構C1的一端設置有固持組件C3,固持組件C3用以固持承載架200(如圖5所示)。伸縮機構C1、旋轉機構C2、固持組件C3都與升降機構C4相連接,而升降機構C4能使伸縮機構C1及固持組件C3縱向地向上或向下移動。伸縮機構C1與處理裝置B電性連接,處理裝置B能控制伸縮機構C1作動,而使固持組件C3相對於旋轉機構C2向前(即靠近第一腔室D的方向)或向後(即遠離第一腔室D的方向)移動。The transfer device C includes a telescopic mechanism C1, a rotating mechanism C2, a holding component C3, and a lifting mechanism C4. The telescopic mechanism C1 is connected to the rotating mechanism C2. One end of the telescopic mechanism C1 is provided with a holding component C3 for the holding component C3. To hold the carrier 200 (as shown in FIG. 5). The telescopic mechanism C1, the rotating mechanism C2, and the holding assembly C3 are all connected to the lifting mechanism C4, and the lifting mechanism C4 can make the telescopic mechanism C1 and the holding assembly C3 move vertically upward or downward. The telescopic mechanism C1 is electrically connected to the processing device B, and the processing device B can control the action of the telescopic mechanism C1, so that the holding assembly C3 is forward (ie close to the direction of the first chamber D) or backward (ie away from the first chamber D) relative to the rotating mechanism C2. The direction of a chamber D) moves.
旋轉機構C2電性連接處理裝置B,處理裝置B能控制旋轉機構C2作動,而使伸縮機構C1及其所連接的固持組件C3相對於第一腔室D旋轉預定角度(可以是依據需求為任意角度)。固持組件C3用以固持承載架200。固持組件C3可以是依據承載架200具體的外型而變化,任何可以用來夾持承載架200的組件,都屬於在此所指的固持組件C3可具體實施的範圍中。The rotating mechanism C2 is electrically connected to the processing device B, and the processing device B can control the operation of the rotating mechanism C2, so that the telescopic mechanism C1 and its connected holding assembly C3 rotate a predetermined angle with respect to the first chamber D (it can be arbitrary according to requirements) angle). The holding component C3 is used to hold the
伸縮機構C1、旋轉機構C2、固持組件C3及升降機構C4能相互配合,而使固持組件C3所固持的承載架200,沿橫向方向(即圖3所示座標的X軸或Y軸方向)移動,以進入或離開第一腔室D或是第二腔室E。The telescopic mechanism C1, the rotating mechanism C2, the holding assembly C3, and the lifting mechanism C4 can cooperate with each other, so that the
伸縮機構C1、旋轉機構C2、固持組件C3及升降機構C4能相互配合,而使固持組件C3所固持的承載架200沿縱向方向(即圖3所示座標的Z軸方向)移動,而由鄰近第一腔室D的位置移動至鄰近於第二腔室E的位置,或是由鄰近於第二腔室E的位置移動至鄰近於第一腔室D的位置。The telescopic mechanism C1, the rotating mechanism C2, the holding assembly C3, and the lifting mechanism C4 can cooperate with each other, so that the
伸縮機構C1、旋轉機構C2、固持組件C3及升降機構C4能相互配合,而使固持組件C3所固持的承載架200,相對於第一腔室D旋轉及相對於第二腔室E旋轉。The telescopic mechanism C1, the rotating mechanism C2, the holding assembly C3, and the lifting mechanism C4 can cooperate with each other, so that the
伸縮機構C1、旋轉機構C2、固持組件C3及升降機構C4所包含的機構、構件、電子零組件等,皆可依據實際承載架200及承載架200所欲承載的物件2、本體A的外型及尺寸等設計,於此不加以限制;也就是說,任何可以用來固持承載架200及其所承載的物件2,並使其沿Z軸方向移動、沿X軸方向移動、沿Y軸方向移動、以Z軸為中心旋轉的機構,都屬於在此所指的移載裝置C可應用的範圍。The mechanisms, components, electronic components, etc. included in the telescopic mechanism C1, the rotating mechanism C2, the holding assembly C3, and the lifting mechanism C4 can be based on the
請一併參閱圖4至圖8,圖4為本發明的倉儲設備的第一腔室及第二腔室的示意圖,圖5為本發明的倉儲設備設置有多個承載架的示意圖,圖6為本發明的倉儲設備的第一腔室及環狀活動壁的示意圖,圖7為本發明的倉儲設備的固持組件固持位於第一腔室的承載架的示意圖,圖8為本發明的倉儲設備的第一底座的局部剖面示意圖。第一腔室D環繞移載裝置C設置,第一腔室D能容置多個承載架200,而多個承載架200能環狀排列地設置於第一腔室D中。具體來說,倉儲設備100具有一第一底座H,第一底座H呈環狀,且第一底座H環繞移載裝置C設置,而第一底座H、本體A的多個蓋板A2及溫度阻隔板F則共同形成所述第一腔室D。Please refer to FIGS. 4 to 8 together. FIG. 4 is a schematic diagram of the first chamber and the second chamber of the storage device of the present invention, and FIG. 5 is a schematic diagram of the storage device of the present invention provided with multiple carrier racks, and FIG. 6 It is a schematic diagram of the first chamber and annular movable wall of the storage equipment of the present invention. FIG. 7 is a schematic diagram of the holding component of the storage equipment of the present invention holding the carrier in the first chamber. FIG. 8 is the storage equipment of the present invention. A schematic partial cross-sectional view of the first base. The first chamber D is arranged around the transfer device C, the first chamber D can accommodate a plurality of carrier racks 200, and the plurality of
第一底座H用來提供多個承載架200設置。多個承載架200設置於第一底座H上時,多個承載架200將是對應環繞移載裝置C設置,而處理裝置B則可以是控制移載裝置C作動,以使固持組件C3將設置於第一底座H上的其中一個承載架200取出。處理裝置B也能控制移載裝置C,而使固持組件C3將一個承載架200設置於第一底座H。關於第一底座H的外型、尺寸皆可依據需求變化,不以圖中所示為限。第一底座H可以容置的承載架200數量,也可以是依據需求變化。The first base H is used to provide a plurality of supporting
在具體的應用中,第一底座H還可以包含多個定位結構H1(如圖8所示),多個定位結構H1用以限制設置於第一腔室D中的多個承載架200相對於第一底座H的移動範圍;在較佳的實施例中,四個定位結構H1可以共同限制設置於第一底座H上的一個承載架200,而四個定位結構H1可以是對應抵靠於承載架200的四個底角。當然,第一底座H是通過幾個定位結構H1來限制一個承載架200,不以四個為限,且用來限制一個承載架200的多定位結構H1於第一底座H的設置位置,也不以圖中所示為限。In a specific application, the first base H may also include a plurality of positioning structures H1 (as shown in FIG. 8), and the plurality of positioning structures H1 are used to restrict the plurality of carrier frames 200 disposed in the first chamber D relative to The range of movement of the first base H; in a preferred embodiment, the four positioning structures H1 can jointly limit a
值得一提的是,本體A還可以包含多個感測器A3(如圖2所示),各個感測器A3電性連接處理裝置B,各個感測器A3用以感測位於第一腔室D中的各個承載架200是否正確地設置於第一底座H。如此,處理裝置B可以是通過設置於第一底座H的各個感測器A3,來判斷第一底座H的各個位置是否設置有承載架200,且處理裝置B也可以是通過各個感測器A3來判斷設置於第一底座H的承載架200是否正確地設置。It is worth mentioning that the body A may also include a plurality of sensors A3 (as shown in FIG. 2), each sensor A3 is electrically connected to the processing device B, and each sensor A3 is used to sense the Whether each
在不同的實施例中,第一底座H可以是包含多個軌道,各個軌道用以提供各個承載架200滑動地設置於第一底座H。各個軌道的周邊可以是對應設置有相關的感測器及止擋機構,感測器用以承載架200是否已與軌道相互連接,若感測器感測滑軌已與承載架200相連接,則相關處理器將控制止擋機構作動,據以限制承載架200於軌道的活動範圍。In different embodiments, the first base H may include a plurality of rails, and each rail is used to provide each supporting
多個第二腔室E位於第一腔室D的上方,且多個第二腔室E可以是彼此相互連通地上下排列設置。在不同的實施例中,多個第二腔室E彼此間也可以是不相互連通。各個第二腔室E環繞移載裝置C設置,且各個第二腔室E能容置多個承載架200,而多個承載架200能環狀排列地設置於第二腔室E中。具體來說,倉儲設備100包含三個第二底座L,三個第二底座L通過多個支撐結構M,而縱向地上下間隔排列,最鄰近於溫度阻隔板F的第二底座L則是通過多個支撐結構M與溫度阻隔板F相連接。各個第二底座L呈環狀,各個第二底座L環繞移載裝置C設置,部分的第二底座L與多個蓋板A2共同形成第二腔室E,其中一個第二底座L則是與溫度阻隔板F、多個蓋板A2共同形成一個第二腔室E。The plurality of second chambers E are located above the first chamber D, and the plurality of second chambers E may be arranged up and down in communication with each other. In different embodiments, the plurality of second chambers E may not communicate with each other. Each second cavity E is arranged around the transfer device C, and each second cavity E can accommodate a plurality of carrier racks 200, and the plurality of
在本實施例圖中是以倉儲設備100包含一個第一腔室D及三個第二腔室E為例,但倉儲設備100所包含的第一腔室D及第二腔室E的數量不以此為限;在不同的實施例中,第一腔室D的數量可以是兩個或兩個以上,第二腔室E的數量也可以是一個、二個或是四個以上。較佳地,第二腔室E的數量是大於第一腔室D的數量。In the figure of this embodiment, the
溫度阻隔板F設置於第一腔室D與最鄰近於第一腔室D的第二腔室E之間。溫度阻隔板F用以阻隔第一腔室D及第二腔室E,而使第一腔室D不與第二腔室E相互連通,並據以阻隔第一腔室D的內部的熱能與第二腔室E的內部的熱能相互傳遞。關於溫度阻隔板F的外型、尺寸等,皆可依據需求設計,於此不加以限制。The temperature resistance barrier F is arranged between the first chamber D and the second chamber E closest to the first chamber D. The temperature barrier F is used to block the first chamber D and the second chamber E, so that the first chamber D and the second chamber E are not communicated with each other, and accordingly block the internal thermal energy of the first chamber D and The heat energy inside the second chamber E is transferred to each other. The appearance and size of the temperature resistance spacer F can be designed according to requirements, and there is no limitation here.
環境調節裝置G電性連接處理裝置B,處理裝置B用以控制環境調節裝置G,以使第一腔室D的溫度不高於一第一溫度,並使第二腔室E的溫度不高於一第二溫度;第一溫度高於負10度,第二溫度低於30度,且第一溫度不高於第二溫度;較佳地,第一溫度與第二溫度的差值大於5度。在較佳的實施例中,第二溫度可以是介於20~25度,第一溫度則可以是介於負5度至15度;也就是說,處理裝置B是通過控制環境調節裝置G,來使第二腔室E的溫度接近於常溫的溫度,並使第一腔室D的溫度接近於冷藏的溫度。The environmental adjustment device G is electrically connected to the processing device B, and the processing device B is used to control the environmental adjustment device G so that the temperature of the first chamber D is not higher than a first temperature, and the temperature of the second chamber E is not high At a second temperature; the first temperature is higher than minus 10 degrees, the second temperature is lower than 30 degrees, and the first temperature is not higher than the second temperature; preferably, the difference between the first temperature and the second temperature is greater than 5 Spend. In a preferred embodiment, the second temperature can be between 20-25 degrees, and the first temperature can be between minus 5 degrees and 15 degrees; that is, the processing device B is controlled by the environmental adjustment device G, To make the temperature of the second chamber E close to the temperature of normal temperature, and make the temperature of the first chamber D close to the temperature of refrigeration.
為了更好地控制第一腔室D的環境狀態及第二腔室E的環境狀態,倉儲設備100可以是包含兩個環境調節裝置G,其分別定義為一第一環境調節裝置及一第二環境調節裝置,第一環境調節裝置單獨用來控制第一腔室D的溫度及濕度,第二環境調節裝置則是單獨用來控制多個第二腔室E的溫度及濕度。In order to better control the environmental state of the first chamber D and the environmental state of the second chamber E, the
請一併參閱圖2、圖6及圖7,在實際應用中,倉儲設備100還可以包含一環狀活動壁N、一活動壁旋轉機構P及一活動門Q。環狀活動壁N與活動壁旋轉機構P相連接,活動壁旋轉機構P能帶動環狀活動壁N相對於第一腔室D旋轉。環狀活動壁N具有一開口N1,活動門Q可活動地設置於環狀活動壁N的一側。活動門Q能被操作而遮蔽開口N1或不遮蔽開口N1。當開口N1不被活動門Q遮蔽時,固持組件C3所固持的承載架200能通過開口N1進出第一腔室D。於本實施例圖中,是以環狀活動壁N環繞移載裝置C而整體大致呈現為圓圈狀為例,但環狀活動壁N的外型不以此為限,在不同的實施例中,環狀活動壁N的外型也可以是環繞移載裝置C而整體大致呈現為矩形狀。Please refer to FIGS. 2, 6 and 7 together. In practical applications, the
依上所述,處理裝置B控制固持組件C3將承載架200及其承載的物件2置入第一腔室D的流程例如可以是:處理裝置B先控制移載裝置C作動,而使固持組件C3及其固持的承載架200移動至第一腔室D外,接著,處理裝置B將控制活動壁旋轉機構P旋轉,而使活動門Q及開口N1旋轉至對應於固持組件C3當下的位置,最後,處理裝置B將控制活動門Q開啟,並控制移載裝置C作動,而使固持組件C3將其所固持的承載架200通過開口N1,移入第一腔室D中。當然,在不同的實施例中,處理裝置B也可以是同時控制移載裝置C及活動壁旋轉機構P作動,而在移載裝置C帶動其所固持的承載架200移動至第一腔室D外的過程中,活動壁旋轉機構P同時驅動環狀活動壁N旋轉,而使開口N1對應移動至預定的位置。As described above, the process in which the processing device B controls the holding assembly C3 to place the
活動門Q可以是通過電子控制式滑軌組與環狀活動壁N相連接,而處理裝置B則能通過控制所述電子控制式滑軌組,以控制活動門Q相對於環狀活動壁N活動,從而開啟或關閉開口N1,或者,活動門Q可以是僅通過機械方式與環狀活動壁N相連接,而處理裝置B無法以電子控制的方式,控制活動門Q相對於環狀活動壁N移動。也就是說,活動門Q可以是電動門或是非電動門。The movable door Q can be connected to the annular movable wall N through an electronically controlled slide rail group, and the processing device B can control the movable door Q relative to the annular movable wall N by controlling the electronically controlled slide rail group. Movable to open or close the opening N1, or the movable door Q can be connected to the annular movable wall N only by mechanical means, and the processing device B cannot electronically control the movable door Q relative to the annular movable wall N moves. In other words, the movable door Q can be an electric door or a non-electric door.
在環狀活動壁N是圓弧狀的實施例中,活動門Q可以是對應為弧狀板體,且活動門Q可以是非電動門,而倉儲設備100則可以是還包含一開門組件R,開門組件R與前述旋轉機構C2相連接,開門組件R能一同隨前述旋轉機構C2相對於第一腔室D旋轉,開門組件R用以帶動活動門Q相對於環狀活動壁N活動,以使開口N1露出或不露出。在實際應用中,活動門Q例如可以是具有一門把,且開門組件R可以是具有能固持門把的構件,而處理裝置B則能控制開門組件R作動,以固持活動門Q的門把,並帶動活動門Q相對於環狀活動壁N移動。In the embodiment where the annular movable wall N is arc-shaped, the movable door Q may correspond to an arc-shaped plate, and the movable door Q may be a non-electric door, and the
請一併參閱圖2及圖8,在處理裝置B通過環境調節裝置G,控制第一腔室D的溫度維持在負5度至15度的實施例中,第一底座H還可以是具有多個排液溝槽H2。多個排液溝槽H2的一端與一排液通道H3相連通,各個排液溝槽H2中的液體將被導引至排液通道H3中,而位於排液通道H3中的液體將被導引並向外排出。關於排液溝槽H2的數量、外型及排列方式,都不以圖中所示為限,任何可以用來導引液體至排液通道H3的結構,都屬於排液溝槽H2可應用的範圍。排液通道H3的數量及其與多個排液溝槽H2的連接方式,都不以圖中所示為限。Please refer to FIGS. 2 and 8 together. In an embodiment in which the processing device B controls the temperature of the first chamber D at minus 5 degrees to 15 degrees through the environmental adjustment device G, the first base H may also have more A drainage groove H2. One end of the plurality of drain grooves H2 is connected to a drain channel H3, the liquid in each drain channel H2 will be guided to the drain channel H3, and the liquid located in the drain channel H3 will be guided Lead and discharge outward. Regarding the number, shape and arrangement of the drainage grooves H2, they are not limited to those shown in the figure. Any structure that can be used to guide liquid to the drainage channel H3 is applicable to the drainage groove H2. Scope. The number of the drainage channels H3 and the connection with the multiple drainage grooves H2 are not limited to those shown in the figure.
舉例來說,第一腔室D可以是用來存放剛由冷凍庫取出的承載架200及其承載的物件2。當剛由冷凍庫(溫度低於負5度)取出的承載架及其承載的物件2被置放於第一底座H時,由於第一腔室D的溫度高於冷凍庫的溫度,因此,承載架200及其承載的物件2的表面將可能會形成冷凝水,該些冷凝水則可以是通過該些排液溝槽H2及排液通道H3向外排出。在較佳的實施例中,第一底座H的表面H4可以是向排液通道H3傾斜,如此,落在第一底座H的表面H4的冷凝水,也可以是被導引而流入排液通道H3或排液溝槽H2。For example, the first chamber D may be used to store the
在不同的實施例中,倉儲設備100還可以包含一吹氣裝置W,吹氣裝置W電性連接處理裝置B,吹氣裝置W能被處理裝置B控制而對第一腔室D內吹送一氣體,據以使剛由冷凍庫取出而置放於第一腔室D中的承載架200,能夠相對快速地升溫至與第一腔室D大致相同的溫度。吹氣裝置W例如可以是連接潔淨氣體提供設備,而吹氣裝置W是持續地對第一腔室D中吹送潔淨氣體。In different embodiments, the
在倉儲設備100設置於20~25度的環境的實施例中,倉儲設備100還可以是包含一抽氣裝置X,抽氣裝置X連接吹氣裝置W,抽氣裝置X用以抽取倉儲設備100外的空氣,吹氣裝置W則用以將抽氣裝置X所抽取的空氣向第一腔室D內吹送。通過吹氣裝置W的設置,將可以使環境調節裝置G能更好地控制第一腔室D的環境狀態(例如溫度及濕度)。在倉儲設備100設置的環境的溫度,與各第二腔室E的溫度大致相同的情況下,抽氣裝置X及吹氣裝置W可以是相互配合,而將倉儲設備100外的空氣,同時吹入各第二腔室E及第一腔室D中。當然,吹氣裝置W的出氣口可以是依據需求設置有相關的過濾構件,以過濾抽氣裝置X所吸入的空氣。In an embodiment where the
請復參圖1及圖2,倉儲設備100的本體A還包含一進出口A4及一載台A5。進出口A4能與第二腔室E相連通。本體A還可以是具有一進出門A6,進出門A6能受處理裝置B控制,而遮蔽或不遮蔽進出口A4。進出門A6未遮蔽進出口A4時,第二腔室E將通過進出口A4與外連通。載台A5鄰近於進出口A4設置,載台A5用以提供承載架200(如圖5所示)及其承載的物件2置放。當進出口A4未被遮蔽時,固持組件C3能通過進出口A4,固持設置於載台A5上的承載架200,相對地,固持組件C3也可以將原本設置於第一腔室D或是第二腔室E中的承載架200及其承載的物件2放置載台A5上。關於載台A5及進出口A4的數量及設置位置,不以圖中所示為限,在特殊的應用中,倉儲設備100也可以是具有兩個或是兩個以上的進出口A4及載台A5。Please refer to FIGS. 1 and 2 again. The body A of the
在不同的實施例中,倉儲設備100的本體A還可以是包含有至少一載台感測器A7,載台感測器A7用以感測載台A5是否設置有承載架200,並據以產生一感測資訊A71,處理裝置B能依據感測資訊A71控制移載裝置C及進出門A6作動。舉例來說,當相關人員或是相關設備將承載架200設置於載台A5時,處理裝置B將接收載台感測器A7所傳遞的感測資訊A71,並據以控制進出門A6開啟,且控制移載裝置C作動,而使固持組件C3通過進出口A4,將位於載台A5的承載架200,移入第二腔室E或是第一腔室D。In different embodiments, the body A of the
在實際應用中,處理裝置B可以是通過有線或是無線的方式接收外部電子設備(例如各式電腦、伺服器、智慧型手機、平板電腦等)傳遞的一需求資訊3,而處理裝置B能依據需求資訊3,控制移載裝置C作動,以由第二腔室E或第一腔室D中取出一個承載架200,接著,控制進出門A6開啟,並使剛取出的承載架200通過進出口A4置放於載台A5,最後,處理裝置B在接收到載台感測器A7所傳遞的感測資訊A71後,處理裝置B將會傳遞相關資訊至外部電子設備,而使外部電子設備通知相關設備或是人員,至載台A5取走承載架200。In practical applications, the processing device B can receive a
請復參圖1及圖2,本發明的倉儲設備100應用於自動化廠房中時,倉儲設備100還可以包含一讀取裝置Y,其用以讀取一識別單元以產生一識別資訊。識別單元用以設置於物件2或承載架200上。識別單元例如是各式條碼、各式無線射頻(RFID)標籤等。識別資訊例如可以是包含有物件的相關基本資料(例如物件的出廠日、使用年限等)。在識別單元為可讀寫的構件(例如無線射頻標籤)的實施例中,所述讀取裝置Y則不但可以是能讀取識別單元所儲存的資料外,讀取裝置Y也可以是能將資料寫入於識別單元中。Please refer to FIGS. 1 and 2 again. When the
處理裝置B電性連接讀取裝置Y。處理裝置B能依據識別資訊,控制移載裝置C將位於進出口A4的承載架200移入第一腔室D或第二腔室E;相對地,處理裝置B也能依據識別資訊,控制移載裝置C將位於第一腔室D的其中一個承載架200,或位於第二腔室E的其中一個承載架200移載至進出口A4。The processing device B is electrically connected to the reading device Y. The processing device B can control the transfer device C to move the
本發明的倉儲設備100例如可以是應用於半導體設備廠房中,物件2例如可以是半導體生產過程中所使用的特定種類的膠捲,所述特定種類的膠捲是指在不使用時必須存放於冷凍庫中的種類。本發明的倉儲設備100應用於半導體設備廠房中時,倉儲設備100可以是用來存放所述膠捲。The
在現有的應用中,相關人員欲使用設置於冷凍庫中的膠捲的流程大致是:相關人員先依據作業流程判斷何時會需要用到膠捲,接著,在需要用到膠捲前的6個小時甚至一天前,將膠捲由冷凍庫取出,並將膠捲設置於常溫環境中的桌子上,以使膠捲的溫度逐漸升至常溫,最後,相關人員在需要使用到膠捲時,則直接拿取設置於常溫環境中的桌子上,且溫度已經大致等同於常溫的膠捲。上述現有應用中的膠捲使用流程,若是相關人員沒有在正確的時間由冷凍庫中取出膠捲,則當相關作業流程需要使用到膠捲時,將可能發生膠捲的溫度過低,而相關作業流程無法使用膠捲的問題,甚至,若相關人員未提前將膠捲由冷凍庫中取出,則將發生相關作業流程必須被迫停止的問題。另外,由冷凍庫拿出的膠捲直接放置於常溫環境中的桌子上,凝結於膠捲表面的水珠,將會流至桌面,而導致桌面或是地面會有一攤水。再者,相關人員將膠捲由冷凍庫取出,而置放於常溫環境的桌子上時,若是相關人員沒有正確地於膠捲上設置標籤或是相關標示,則可能發生另一個人員取錯膠捲的問題。In the existing applications, the process for the relevant personnel to use the film set in the freezer is roughly as follows: the relevant personnel first judge when the film will be used according to the operation process, and then, 6 hours or even a day before the film is needed. , Take the film out of the freezer, and set the film on the table in the room temperature environment, so that the temperature of the film gradually rises to room temperature. Finally, when the relevant personnel need to use the film, they directly take the film set in the room temperature environment. On the table, and the temperature has been roughly equivalent to the film at room temperature. For the film use process in the above-mentioned existing applications, if the relevant personnel do not take out the film from the freezer at the correct time, when the film needs to be used in the relevant operation process, the temperature of the film may be too low, and the relevant operation process cannot use the film. Even if the relevant personnel do not take out the film from the freezer in advance, the related operation process must be forced to stop. In addition, the film taken out of the freezer is placed directly on the table in a room temperature environment, and the water droplets condensed on the surface of the film will flow to the tabletop, causing a puddle of water on the tabletop or the ground. Furthermore, when the relevant person takes the film out of the freezer and places it on a table in a room temperature environment, if the relevant person does not correctly set a label or relevant mark on the film, another person may take the wrong film.
承上,在本發明的倉儲設備100應用於半導體自動化廠房的實施例中,將由冷凍庫中取出的承載架200及其承載的物件2存放於第一腔室D中的流程可以是:首先,相關設備或人員將由冷凍庫取出的承載架200及其承載的物件2設置於載台A5;接著,處理裝置B將會接收到載台感測器A7感測到載台A5上設置有承載架200後所發出的感測資訊A71,而處理裝置B可以是先控制讀取裝置Y作動,據以讀取承載架200或物件2上的識別單元所儲存的識別資訊。而後,處理裝置B則可以依據識別資訊及當前的第一腔室D的存放狀態,控制移載裝置C及進出門A6作動,而使固持組件C3將設置於載台A5的承載架200及其承載的物件2,一同移載至第一腔室D外;最後,處理裝置B將使旋轉機構C2、活動壁旋轉機構P及活動門Q作動,而使固持組件C3將其所固持的承載架200通過環狀活動壁N的開口N1,移入第一腔室D中。In conclusion, in an embodiment in which the
承上,當處理裝置B控制固持組件C3將承載架200及其承載的物件2置放於第一腔室D中後,處理裝置B將進行相關的記錄(例如包含進入承載架200上的識別單元所儲存的識別資訊、承載架200設置於第一腔室D中的時間等),而後,處理裝置B將會依據識別資訊或是相關需求資訊,在承載架200及其承載的物件2存放於第一腔室D後的一預定時間(例如6~10小時),控制移載裝置C、活動壁旋轉機構P及活動門Q等構件作動,而使固持組件C3將承載架200移載至第二腔室E存放。當處理裝置B將承載架200移載至第二腔室E存放時,處理裝置B可以是發出相關的通知資訊至相關的外部電子設備,以通知相關設備或是人員,該承載架200所承載的物件2的溫度已經大致等於常溫。當相關設備或是人員收到處理裝置B所發出的通知資訊,相關設備或人員則可以是向處理裝置B發送相關取物資訊,而處理裝置B接收取物資訊後,將控制移載裝置C及進出門A6,以將設置於第二腔室E的承載架200設置於載台A5。In addition, when the processing device B controls the holding component C3 to place the
如上所述,換句話說,本發明的倉儲設備100應用於儲存半導體廠房使用的需要冷凍存放的膠捲時,處理裝置B可以是能執行一解凍程序,處理裝置B執行解凍程序時,處理裝置B將控制移載裝置C,把設置於載台A5上的承載架200及其所承載的物件2,先移載至第一腔室D,並且處理裝置B將於承載架200及其所承載的物件2置放於第一腔室D中一預定時間後,控制移載裝置C將承載架200及其所承載的物件2,由第一腔室D移載至第二腔室E中存放,直到相關人員或是設備向處理裝置B發出相關取出資訊,處理裝置B才會進一步將設置於第二腔室E中的所述承載架200及其承載的物件2移至載台A5。As mentioned above, in other words, when the
請一併參閱圖9至圖12,圖9及圖10為本發明的倉儲設備的承載架的不同視角的示意圖,圖11為本發明的倉儲設備的伸縮機構及固持組件的示意圖,圖12為本發明的倉儲設備的固持組件固持承載架的示意圖。倉儲設備100還可以是包含多個承載架200。在實際應用中,本發明的倉儲設備100在販售時,可以是包含有多個承載架200一同販售,或者,倉儲設備100販售時,也可以是不包含多個承載架200。Please refer to FIGS. 9 to 12 together. FIGS. 9 and 10 are schematic diagrams of different perspectives of the carrier frame of the storage equipment of the present invention. FIG. 11 is a schematic diagram of the telescopic mechanism and holding components of the storage equipment of the present invention. FIG. 12 is A schematic diagram of the holding frame of the holding component of the storage equipment of the present invention. The
各個承載架200可以是具有一頂板201、一底板202及三個側板,頂板201、底板202及三個側板相互連接,並共同形成一容置室204,容置室204用以容置物件2。三個側板分別定義為兩個旁側板2031及一後側板2032,兩個旁側板2031彼此相面對地設置,且各個旁側板2031具有多個穿孔20311。通過多個穿孔20311的設計,當承載架200設置於第一腔室D中時,將可以使得吹氣裝置W(如圖2所示)送入第一腔室D中空氣,可以於物件2的周圍流動,從而可以使物件2的溫度,相對快速地達到與第一腔室D大致相同的溫度。關於各旁側板2031所具有的穿孔20311的外型、尺寸、數量及設置位置,皆不以圖中所示為限。後側板2032與兩個旁側板2031相連接,且後側板2032也可以是具有多個穿孔20321,各個穿孔20321貫穿後側板2032設置,且後側板2032的一側還可以是設置有兩個輔助結構205及兩個乘靠結構206,兩個輔助結構205彼此間隔地設置,各個乘靠結構206設置於各個輔助結構205的一端。Each
如圖11所示,對應於承載架200的輔助結構205及乘靠結構206的設計,固持組件C3可以是包含一固持本體C31及四個活動夾持構件C32,其中兩個活動夾持構件C32彼此相面對地設置,另外兩個活動夾持構件C32彼此相面對地設置,相面對設置的兩個活動夾持構件C32能受控制而夾持承載架200的其中一個輔助結構205。各個活動夾持構件C32還可以是具有一卡合部C321,卡合部C321用以與承載架200的乘靠結構206相互卡合,而承載架200能通過乘靠結構206與卡合部C321掛設於固持組件C3。As shown in FIG. 11, corresponding to the design of the
如圖9至圖12所示,具體來說,各個乘靠結構206可以是與後側板2032共同形成一容槽207,而各個卡合部C321則是能對應卡合設置於所述容槽207中,如此,固持組件C3固持承載架200時,固持組件C3不但會通過四個活動夾持構件C32來夾持兩個輔助結構205,還會通過各個卡合部C321與各個容槽207相互卡合來與承載架200相互連接,藉此,將可有效地確保固持組件C3能夠穩定地固持承載架200。As shown in FIGS. 9 to 12, specifically, each riding
請一併參閱圖1至圖3及圖13,圖13顯示為本發明的倉儲系統的方塊示意圖。本發明的倉儲系統1包含前述倉儲設備100、一移載設備400及一處理設備300。倉儲設備100的詳細說明,於此不再贅述。移載設備400用以將承載架200及設置於承載架200上的物件2由一冷凍庫移載至倉儲設備100的載台A5。處理設備300能接收一需求資訊3。處理設備300能依據需求資訊3,控制移載設備400將至少一個承載架200及其承載的物件2,由冷凍庫中取出並移載至載台A5。Please refer to FIG. 1 to FIG. 3 and FIG. 13 together. FIG. 13 shows a block diagram of the storage system of the present invention. The storage system 1 of the present invention includes the
倉儲設備100的處理裝置B也可以是能接收所述需求資訊3,而處理裝置B能依據需求資訊3,控制移載裝置C將設置於載台A5的承載架200及其承載的物件2移入第一腔室D,且處理裝置B能依據需求資訊3,在承載架200及其承載的物件2設置於第一腔室D一預定時間後,移載至第二腔室E,並且處理裝置B能依據所述需求資訊3,在承載架200及其承載的物件2設置於第二腔室E另一預定時間後,控制移載裝置C將承載架200及其承載的物件2由第二腔室E移載至載台A5。The processing device B of the
另外,處理設備300還能接收一取物資訊4,而處理設備300能依據取物資訊4,控制倉儲設備100,據以使處理裝置B控制移載裝置C作動,而將設置於第二腔室E中的其中一個承載架200及其承載的物件2移至載台A5,且處理設備300還能依據取物資訊4,控制移載設備400將設置於載台A5的承載架200及其承載的物件2移動至特定的工作站或是工作設備。In addition, the
綜合上述,本發明的倉儲設備通過移載裝置、第一腔室及第二腔室等設計,讓相關人員可以方便地利用倉儲設備,存放剛由冷凍庫中取出的承載架及其承載的物件。本發明的倉儲系統通過倉儲設備、移載設備及處理設備等設計,讓相關人員可以向處理設備發出需求資訊,而使倉儲系統依據需求資訊,自動地於冷凍庫中取出承載架及其承載的物件,並將其先後設置於第一腔室及第二腔室中進行解凍。In summary, the storage equipment of the present invention is designed with a transfer device, a first chamber, and a second chamber, so that relevant personnel can conveniently use the storage equipment to store the carrying rack and its carried objects that have just been taken out of the freezer. The storage system of the present invention is designed through storage equipment, transfer equipment and processing equipment, so that relevant personnel can send demand information to the processing equipment, and the storage system can automatically take out the carrying rack and its carried objects from the freezer according to the demand information. , And set it in the first chamber and the second chamber successively for thawing.
以上所述僅為本發明的較佳可行實施例,非因此侷限本發明的專利範圍,故舉凡運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的保護範圍內。The above descriptions are only the preferred and feasible embodiments of the present invention, which do not limit the scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .
1:倉儲系統1: Warehousing system
100:倉儲設備100: storage equipment
A:本體A: Ontology
A1:框體A1: Frame
A2:蓋板A2: Cover
A3:感測器A3: Sensor
A4:進出口A4: Import and export
A5:載台A5: Carrier
A6:進出門A6: in and out
A7:載台感測器A7: Stage sensor
A71:感測資訊A71: Sensing information
B:處理裝置B: Processing device
C:移載裝置C: Transfer device
C1:伸縮機構C1: Telescopic mechanism
C2:旋轉機構C2: Rotating mechanism
C3:固持組件C3: Holding components
C31:固持本體C31: Hold the body
C32:活動夾持構件C32: movable clamping member
C321:卡合部C321: Card joint part
C4:升降機構C4: Lifting mechanism
D:第一腔室D: The first chamber
E:第二腔室E: second chamber
F:溫度阻隔板F: Temperature resistance baffle
G:環境調節裝置G: Environmental regulation device
H:第一底座H: First base
H1:定位結構H1: Positioning structure
H2:排液溝槽H2: Drainage groove
H3:排液通道H3: Drainage channel
H4:表面H4: Surface
L:第二底座L: second base
M:支撐結構M: Supporting structure
N:環狀活動壁N: Annular movable wall
N1:開口N1: opening
P:活動壁旋轉機構P: movable wall rotating mechanism
Q:活動門Q: movable door
R:開門組件R: Door opening assembly
W:吹氣裝置W: blowing device
X:抽氣裝置X: Exhaust device
Y:讀取裝置Y: Reading device
200:承載架200: Carrier
201:頂板201: top plate
20:底板20: bottom plate
2031:旁側板2031: side panel
20311:穿孔20311: perforation
2032:後側板2032: rear side panel
20321:穿孔20321: Piercing
204:容置室204: storage room
205:輔助結構205: auxiliary structure
206:乘靠結構206: Riding Structure
207:容槽207: Tolerance
300:處理設備300: processing equipment
400:移載設備400: Transfer equipment
2:物件2: Object
3:需求資訊3: Demand information
4:取物資訊4: Fetching information
圖1為本發明的倉儲設備的示意圖。Figure 1 is a schematic diagram of the storage equipment of the present invention.
圖2為本發明的倉儲設備的方塊示意圖。Figure 2 is a block diagram of the storage equipment of the present invention.
圖3為本發明的倉儲設備的局部剖面示意圖。Fig. 3 is a schematic partial cross-sectional view of the storage equipment of the present invention.
圖4為本發明的倉儲設備的第一腔室及第二腔室的示意圖。Fig. 4 is a schematic diagram of the first chamber and the second chamber of the storage device of the present invention.
圖5為本發明的倉儲設備設置有多個承載架的示意圖。Fig. 5 is a schematic diagram of the storage equipment of the present invention provided with multiple supporting racks.
圖6為本發明的倉儲設備的第一腔室及環狀活動壁的示意圖。Fig. 6 is a schematic diagram of the first chamber and the annular movable wall of the storage device of the present invention.
圖7為本發明的倉儲設備的固持組件固持位於第一腔室的承載架的示意圖。Fig. 7 is a schematic diagram of the holding component of the storage equipment of the present invention holding the carrier in the first chamber.
圖8為本發明的倉儲設備的第一底座的局部剖面示意圖。Fig. 8 is a schematic partial cross-sectional view of the first base of the storage equipment of the present invention.
圖9及圖10為本發明的倉儲設備的承載架的不同視角的示意圖。9 and 10 are schematic diagrams of different perspectives of the carrying rack of the storage equipment of the present invention.
圖11為本發明的倉儲設備的伸縮機構及固持組件的示意圖。Fig. 11 is a schematic diagram of the telescopic mechanism and the holding assembly of the storage equipment of the present invention.
圖12為本發明的倉儲設備的固持組件固持承載架的示意圖。Fig. 12 is a schematic diagram of the holding frame of the holding component of the storage equipment of the present invention.
圖13為本發明的倉儲系統的方塊示意圖。Fig. 13 is a block diagram of the storage system of the present invention.
100:倉儲設備 100: storage equipment
C:移載裝置 C: Transfer device
C1:伸縮機構 C1: Telescopic mechanism
C3:固持組件 C3: Holding components
C4:升降機構 C4: Lifting mechanism
D:第一腔室 D: The first chamber
E:第二腔室 E: second chamber
F:溫度阻隔板 F: Temperature resistance baffle
H:第一底座 H: First base
L:第二底座 L: second base
M:支撐結構 M: Supporting structure
N:環狀活動壁 N: Annular movable wall
Q:活動門 Q: movable door
R:開門組件 R: Door opening assembly
Claims (12)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011038555.7A CN113734673B (en) | 2020-05-29 | 2020-09-28 | Storage equipment and storage system |
| CN202022165875.0U CN213863864U (en) | 2020-05-29 | 2020-09-28 | Storage equipment and storage system |
| KR1020210001449A KR20210148844A (en) | 2020-05-29 | 2021-01-06 | Storage equipment and a storage system |
| JP2021013063A JP7234271B2 (en) | 2020-05-29 | 2021-01-29 | Storage facilities and storage systems |
| SG10202102893UA SG10202102893UA (en) | 2020-05-29 | 2021-03-22 | Storage apparatus and storage system |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063031806P | 2020-05-29 | 2020-05-29 | |
| US63/031,806 | 2020-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI742861B true TWI742861B (en) | 2021-10-11 |
| TW202144252A TW202144252A (en) | 2021-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109132368A TWI742861B (en) | 2020-05-29 | 2020-09-18 | Storage equipment and a storage system |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI742861B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI826085B (en) * | 2022-10-31 | 2023-12-11 | 博訊生物科技股份有限公司 | Cryopreservation cassette for automatic cell cryopreservation and thawing equipment |
| CN115892812B (en) * | 2022-11-02 | 2024-06-25 | 深圳市海柔创新科技有限公司 | Cargo transmission system, cargo transmission method and processing terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200710010A (en) * | 2005-09-15 | 2007-03-16 | Min-Lee Chen | Elastic multi-temperature transportation structure resolution |
| TWI580624B (en) * | 2016-05-24 | 2017-05-01 | 黃裕權 | Modular storage |
| CN108016800A (en) * | 2017-05-31 | 2018-05-11 | 真玫智能科技(深圳)有限公司 | Storage module, control method, server and computer-readable medium |
| TWM590580U (en) * | 2019-08-30 | 2020-02-11 | 張榮琳 | Unmanned automated warehouse system |
-
2020
- 2020-09-18 TW TW109132368A patent/TWI742861B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200710010A (en) * | 2005-09-15 | 2007-03-16 | Min-Lee Chen | Elastic multi-temperature transportation structure resolution |
| TWI580624B (en) * | 2016-05-24 | 2017-05-01 | 黃裕權 | Modular storage |
| CN108016800A (en) * | 2017-05-31 | 2018-05-11 | 真玫智能科技(深圳)有限公司 | Storage module, control method, server and computer-readable medium |
| TWM590580U (en) * | 2019-08-30 | 2020-02-11 | 張榮琳 | Unmanned automated warehouse system |
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| TW202144252A (en) | 2021-12-01 |
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