TWI639691B - Nano carbon material heat dissipation material manufacturing method - Google Patents
Nano carbon material heat dissipation material manufacturing method Download PDFInfo
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- TWI639691B TWI639691B TW106144173A TW106144173A TWI639691B TW I639691 B TWI639691 B TW I639691B TW 106144173 A TW106144173 A TW 106144173A TW 106144173 A TW106144173 A TW 106144173A TW I639691 B TWI639691 B TW I639691B
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- 239000000463 material Substances 0.000 title claims abstract description 79
- 229910021392 nanocarbon Inorganic materials 0.000 title claims abstract description 75
- 239000003575 carbonaceous material Substances 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 title abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011231 conductive filler Substances 0.000 claims abstract description 35
- 239000004094 surface-active agent Substances 0.000 claims abstract description 29
- 239000002270 dispersing agent Substances 0.000 claims abstract description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 12
- 239000000080 wetting agent Substances 0.000 claims abstract description 9
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 8
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 25
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 11
- 239000003906 humectant Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000001856 Ethyl cellulose Substances 0.000 claims description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 3
- 239000003945 anionic surfactant Substances 0.000 claims description 3
- 238000000498 ball milling Methods 0.000 claims description 3
- 239000003093 cationic surfactant Substances 0.000 claims description 3
- 229920001249 ethyl cellulose Polymers 0.000 claims description 3
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- SOSQXPIKTBUEKF-UHFFFAOYSA-N 1,4-dihexoxy-1,4-dioxobutane-2-sulfonic acid Chemical compound CCCCCCOC(=O)CC(S(O)(=O)=O)C(=O)OCCCCCC SOSQXPIKTBUEKF-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 159000000000 sodium salts Chemical class 0.000 claims description 2
- 238000013019 agitation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 23
- 239000007864 aqueous solution Substances 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- WVFDILODTFJAPA-UHFFFAOYSA-M sodium;1,4-dihexoxy-1,4-dioxobutane-2-sulfonate Chemical compound [Na+].CCCCCCOC(=O)CC(S([O-])(=O)=O)C(=O)OCCCCCC WVFDILODTFJAPA-UHFFFAOYSA-M 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 4
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004846 water-soluble epoxy resin Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002048 multi walled nanotube Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
一種含奈米碳材散熱材料的製作方法,步驟包括:(A)準備一水溶性樹脂、一導熱填料、一奈米碳材及一界面活性劑,其中,該奈米碳材包含石墨烯及奈米碳管之至少一者,該界面活性劑包含濕潤劑及分散劑之至少一者;(B)在該水溶性樹脂中添加該界面活性劑;(C)在含有該界面活性劑的該水溶性樹脂中添加該導熱填料及該奈米碳材,將該水溶性樹脂、該導熱填料及該奈米碳材充分混合;(D)固化該水溶性樹脂而完成該散熱材料的製作。藉此,於水溶性樹脂中分散導熱填料及奈米碳材,以提升水溶性樹脂之散熱效果。 The invention comprises the following steps: (A) preparing a water-soluble resin, a heat-conductive filler, a nano-carbon material and a surfactant, wherein the nano-carbon material comprises graphene and At least one of the carbon nanotubes, the surfactant comprising at least one of a wetting agent and a dispersing agent; (B) adding the surfactant to the water-soluble resin; (C) the surfactant containing the surfactant The heat conductive filler and the nano carbon material are added to the water-soluble resin, and the water-soluble resin, the heat-conductive filler, and the nano-carbon material are sufficiently mixed; and (D) the water-soluble resin is cured to complete the production of the heat-dissipating material. Thereby, the heat conductive filler and the nano carbon material are dispersed in the water-soluble resin to enhance the heat dissipation effect of the water-soluble resin.
Description
本發明係關於一種散熱材料的製作方法,特別是關於一種含奈米碳材散熱材料的製作方法。 The invention relates to a method for manufacturing a heat dissipating material, in particular to a method for manufacturing a heat dissipating material containing nano carbon materials.
隨著科技的進步,對於各式裝置的性能要求亦愈發嚴格。在高性能的產品導向下,一般產品都需要在高功率的狀態下執行。然而,在高功率運作狀態下的裝置通常伴隨散熱不良的問題。常見用來解決產品散熱問題的技術包含液冷、氣冷、加裝散熱結構、採用高導熱係數材料進行產品製作、在裝置的散熱界面塗布散熱物質等。其中,塗布散熱物質於裝置表面是簡單有效又相對低成本的散熱方式,目前已廣泛運用。然而,此種散熱方式在散熱方面的效果,還有一定的改善空間。 With the advancement of technology, the performance requirements for various devices are becoming more stringent. Under the guidance of high performance products, general products need to be executed under high power. However, devices in high power operation are often accompanied by poor heat dissipation. Commonly used techniques to solve the problem of product heat dissipation include liquid cooling, air cooling, installation of heat dissipation structure, production of materials with high thermal conductivity materials, and application of heat dissipation materials at the heat dissipation interface of the device. Among them, the application of the heat dissipating material on the surface of the device is a simple and effective and relatively low-cost heat dissipation method, and has been widely used at present. However, this heat dissipation method has a certain improvement space in terms of heat dissipation.
石墨烯及奈米碳管為新穎奈米材料,其在應用上遭遇最大的問題在於如何與高分子基材進行混拌分散,藉此體現石墨烯或奈米碳管優異的物理特性,然而奈米材料由於其表面能與高比表面積的作用下,經常於混拌過程中發生團聚分散不均之問題,因次若能改善石墨烯或奈米碳管材料於高分子基材中的混拌分散效果,將有助於奈米碳材優異物理特性(導電、導熱、機械強化等)之展現。 Graphene and carbon nanotubes are novel nanomaterials, and the biggest problem in their application is how to mix and disperse with polymer substrates, thereby reflecting the excellent physical properties of graphene or carbon nanotubes. Due to its surface energy and high specific surface area, rice materials often have problems of uneven agglomeration and dispersion during mixing, and if they can improve the mixing of graphene or carbon nanotube materials in polymer substrates. The dispersion effect will contribute to the display of excellent physical properties (conductivity, heat conduction, mechanical strengthening, etc.) of nano carbon materials.
因此,目前業界需要一種含奈米碳材散熱材料的製作方法,於材料中分散導熱填料及奈米碳材,透過簡單的製備流程,以製備出符合業界需求的散熱材料。 Therefore, at present, the industry needs a method for manufacturing a heat-dissipating material containing nano carbon materials, dispersing a heat-conducting filler and a nano-carbon material in a material, and preparing a heat-dissipating material that meets the needs of the industry through a simple preparation process.
鑒於上述習知技術之缺點,本發明之主要目的在於提供一種含奈米碳材散熱材料的製作方法,於水溶性樹脂中的導熱填料可以作為熱傳導的主要媒介,且填充奈米碳材可以作為導熱填料之間的熱搭橋媒介,由於導熱填料及奈米碳材皆具有高熱傳係數,因此能提供良好的熱散溢效果。 In view of the above disadvantages of the prior art, the main object of the present invention is to provide a method for fabricating a heat-dissipating material containing nano carbon materials. The heat-conductive filler in the water-soluble resin can be used as a main medium for heat conduction, and the filled nano carbon material can be used as The thermal bridging medium between the thermally conductive fillers provides a good heat dissipation effect due to the high heat transfer coefficient of the thermally conductive filler and the nano carbon material.
為了達到上述目的,根據本發明所提出之一方案,提供一種含奈米碳材散熱材料的製作方法,步驟包括:(A)準備一水溶性樹脂、一導熱填料、一奈米碳材及一界面活性劑,其中,該奈米碳材包含石墨烯及奈米碳管之至少一者,該界面活性劑包含濕潤劑及分散劑之至少一者;(B)在該水溶性樹脂中添加該界面活性劑;(C)在含有該界面活性劑的該水溶性樹脂中添加該導熱填料及該奈米碳材,將該水溶性樹脂、該導熱填料及該奈米碳材充分混合;(D)固化該水溶性樹脂而完成該散熱材料的製作。 In order to achieve the above object, according to one aspect of the present invention, a method for fabricating a heat-dissipating material containing a nano-carbon material is provided, the steps comprising: (A) preparing a water-soluble resin, a heat-conductive filler, a nano-carbon material, and a a surfactant, wherein the nano carbon material comprises at least one of graphene and a carbon nanotube, the surfactant comprising at least one of a wetting agent and a dispersing agent; (B) adding the water-soluble resin a surfactant; (C) adding the heat conductive filler and the nano carbon material to the water-soluble resin containing the surfactant, and thoroughly mixing the water-soluble resin, the heat conductive filler, and the nano carbon material; The curing of the heat dissipating material is completed by curing the water-soluble resin.
上述中,該濕潤劑為陰離子界面活性劑,且該濕潤劑之成分包含磺基琥珀酸1,4-二己酯鈉鹽(C16H29O7NaS);該濕潤劑的重量百分比不大於10%。 In the above, the humectant is an anionic surfactant, and the component of the humectant comprises sodium 1,4-dihexyl sulfosuccinate (C 16 H 29 O 7 NaS); the weight percentage of the humectant is not more than 10%.
上述中,該分散劑為陽離子界面活性劑,且該分 散劑之成分包含四丁基氯化銨(C4H12ClN);該分散劑的重量百分比不大於10%。 In the above, the dispersing agent is a cationic surfactant, and the component of the dispersing agent comprises tetrabutylammonium chloride (C 4 H 12 ClN); the dispersing agent is not more than 10% by weight.
上述中,該導熱填料可包含多個粒徑不大於10微米之陶瓷顆粒;該導熱填料的材質可為氮化鋁、氧化鋁、導熱碳黑及乙基纖維素之至少一者。 In the above, the thermally conductive filler may comprise a plurality of ceramic particles having a particle diameter of not more than 10 micrometers; the thermally conductive filler may be made of at least one of aluminum nitride, aluminum oxide, thermal conductive carbon black, and ethyl cellulose.
上述中,該導熱填料的重量百分比為10%~50%;該奈米碳材的重量百分比不大於10%。 In the above, the weight percentage of the heat conductive filler is 10% to 50%; and the weight percentage of the nano carbon material is not more than 10%.
上述中,該水溶性樹脂為環氧樹脂。 In the above, the water-soluble resin is an epoxy resin.
上述中,步驟(C)可使用真空脫泡技術、膠體球磨技術或均質攪拌技術進行充分混合。 In the above, the step (C) can be sufficiently mixed using a vacuum defoaming technique, a colloidal ball milling technique or a homogeneous stirring technique.
本發明是一種含奈米碳材散熱材料的製作方法,該水溶性樹脂中的該導熱填料可以作為熱傳導的主要媒介,且填充該奈米碳材可以作為該導熱填料之間的熱搭橋媒介(thermal-bridging material),由於該導熱填料及該奈米碳材皆具有高熱傳係數,因此能提供良好的熱散溢效果。此外,藉由在該水溶性樹脂中添加磺基琥珀酸1,4-二己酯鈉鹽及四丁基氯化銨,能夠增進該奈米碳材於該水溶性樹脂中的濕潤性與分散性,避免該奈米碳材因團聚效應而無法均勻地分散於該水溶性樹脂中,以確保該奈米碳材作為熱搭橋媒介的功效,本發明之散熱材料有利於增進散熱效果,對產業利用具有相當經濟之改良。 The invention relates to a method for preparing a heat-dissipating material containing nano carbon materials, wherein the heat-conductive filler in the water-soluble resin can serve as a main medium for heat conduction, and filling the nano-carbon material can serve as a heat bridge medium between the heat-conductive fillers ( The thermal-bridging material) provides a good heat dissipation effect because both the thermally conductive filler and the nanocarbon material have a high heat transfer coefficient. Further, by adding sodium 1,4-dihexyl sulfosuccinate and tetrabutylammonium chloride to the water-soluble resin, the wettability and dispersion of the nanocarbon material in the water-soluble resin can be enhanced. To prevent the nano carbon material from being uniformly dispersed in the water-soluble resin due to the agglomeration effect, to ensure the effect of the nano carbon material as a heat bridge medium, the heat dissipating material of the present invention is advantageous for enhancing the heat dissipation effect on the industry. The use of considerable economic improvements.
以上之概述與接下來的詳細說明及附圖,皆是為 了能進一步說明本發明達到預定目的所採取的方式、手段及功效。而有關本發明的其他目的及優點,將在後續的說明及圖式中加以闡述。 The above summary and the following detailed description and drawings are The manner, means and efficacy of the present invention for achieving the intended purpose can be further explained. Other objects and advantages of the present invention will be described in the following description and drawings.
S101-S104‧‧‧步驟 S101-S104‧‧‧Steps
100‧‧‧散熱材料 100‧‧‧heating materials
200‧‧‧待散熱物品 200‧‧‧heating items
1‧‧‧水溶性樹脂 1‧‧‧Water-soluble resin
2‧‧‧導熱填料 2‧‧‧ Thermally conductive filler
3‧‧‧奈米碳材 3‧‧‧Nano carbon material
第一圖係為本發明一種含奈米碳材散熱材料的製作方法流程圖;第二圖係為本發明一種含奈米碳材散熱材料之一應用態樣示意圖;第三圖係為本發明實施例在不同時間下,奈米碳材於各式溶液中的分布狀態。 The first figure is a flow chart of a method for manufacturing a heat-dissipating material containing a nano carbon material according to the present invention; the second figure is a schematic view of an application form of a heat-dissipating material containing a nano-carbon material according to the present invention; EXAMPLES The distribution of nanocarbon materials in various solutions at different times.
以下係藉由特定的具體實例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地了解本發明之優點及功效。 The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the advantages and effects of the present invention from the disclosure herein.
請參閱第一圖,其係為本發明之一種含奈米碳材散熱材料的製作方法流程圖。如圖所示,本發明之一種含奈米碳材散熱材料的製作方法,步驟包括:(A)準備一水溶性樹脂、一導熱填料、一奈米碳材及一界面活性劑,其中,該奈米碳材包含石墨烯及奈米碳管之至少一者,該界面活性劑包含濕潤劑及分散劑之至少一者S101;(B)在該水溶性樹脂中添加該界面活性劑S102;(C)在含有該界面活性劑的該水溶性樹脂中添加該導熱填料及該奈米碳材,將該水溶性樹脂、該導熱填料及 該奈米碳材充分混合S103;(D)固化該水溶性樹脂而完成該散熱材料的製作S104。 Please refer to the first figure, which is a flow chart of a method for manufacturing a nano-carbon material heat-dissipating material according to the present invention. As shown in the figure, a method for manufacturing a nanocarbon-containing heat dissipating material according to the present invention comprises the steps of: (A) preparing a water-soluble resin, a heat-conductive filler, a nano-carbon material, and a surfactant, wherein The nano carbon material comprises at least one of graphene and a carbon nanotube, the surfactant comprising at least one of a wetting agent and a dispersing agent S101; (B) adding the surfactant S102 to the water-soluble resin; C) adding the heat conductive filler and the nano carbon material to the water-soluble resin containing the surfactant, and the water-soluble resin, the heat conductive filler, and The nano carbon material is sufficiently mixed with S103; (D) the water-soluble resin is cured to complete the production of the heat dissipating material S104.
請參閱第二圖,其為本發明一種含奈米碳材散熱材料之一應用態樣示意圖。如圖所示,散熱材料100的製作方法的一實施例,該散熱材料100適用於塗佈於一待散熱物品200上,藉以提供熱散逸效果,該散熱材料100的成分包含一水溶性樹脂1、一填充於該水溶性樹脂1中的導熱填料2、一填充於該水溶性樹脂1中的奈米碳材3以及圖中未繪製出的界面活性劑成分。其中,第二圖是以白色圓形圖案代表該導熱填料2,並以黑色圓型圖案代表該奈米碳材3。以下,配合第一圖之流程圖,說明本發明的具體實施方式。 Please refer to the second figure, which is a schematic diagram of an application aspect of a heat-dissipating material containing nano carbon materials. As shown in the figure, in an embodiment of the method for manufacturing the heat dissipating material 100, the heat dissipating material 100 is applied to a heat dissipating material 200 to provide a heat dissipating effect, and the component of the heat dissipating material 100 comprises a water soluble resin. A thermally conductive filler 2 filled in the water-soluble resin 1, a nanocarbon material 3 filled in the water-soluble resin 1, and a surfactant component not shown in the drawing. The second figure represents the thermally conductive filler 2 in a white circular pattern and represents the nanocarbon material 3 in a black circular pattern. Hereinafter, specific embodiments of the present invention will be described with reference to the flowchart of the first drawing.
首先,於該步驟S101,需預先準備該水溶性樹脂1、該導熱填料2、該奈米碳材3及該界面活性劑的原料。本實施例中,該水溶性樹脂1是採用水溶性環氧樹脂(expoxy),該水溶性環氧樹脂在此準備步驟時包含尚未混合的基底劑及固化劑等兩種主要成分。該散熱材料100可以採用微米級或奈米級的高導熱係數材料,例如可以是氮化鋁、氧化鋁、導熱碳黑、乙基纖維素的一者或多者的混合,以提供主要的熱傳導途徑。在一些實施態樣中,該導熱填料2具體可以包含多個粒徑不大於10微米的氮化鋁顆粒、氧化鋁顆粒等陶瓷顆粒,但不以此實施方式為限。該奈米碳材3包含寡層石墨烯、單 壁奈米碳管、多壁奈米碳管的一者或多者的混合,能夠作為該導熱填料2之間的熱搭橋媒介(thermal-bridging material)。在一些實施態樣中,該寡層石墨烯的厚度小於5奈米且橫向尺寸介於0.1~5微米之間,但不以此種石墨烯材料為限。該界面活性劑包含濕潤劑及分散劑,該濕潤劑可以增進該奈米碳材3於水溶液中的親水性,例如可以使用成分包含磺基琥珀酸1,4-二己酯鈉鹽(C16H29O7NaS)的陰離子界面活性劑;該分散劑可以增進該奈米碳材3於水溶液中的分散性,藉以避免該奈米碳材3在水溶液中發生明顯的團聚現象,本實施例中該分散劑例如可以使用成分包含四丁基氯化銨(C4H12ClN)的陽離子界面活性劑。 First, in this step S101, the water-soluble resin 1, the thermally conductive filler 2, the nanocarbon material 3, and the raw material of the surfactant are prepared in advance. In the present embodiment, the water-soluble resin 1 is a water-soluble epoxy resin which contains two main components such as a base agent and a curing agent which have not been mixed in the preparation step. The heat dissipating material 100 may be a micro- or nano-scale high thermal conductivity material, such as a mixture of one or more of aluminum nitride, aluminum oxide, thermally conductive carbon black, and ethyl cellulose to provide primary heat transfer. way. In some embodiments, the thermally conductive filler 2 may specifically comprise a plurality of ceramic particles of aluminum nitride particles, alumina particles, or the like having a particle diameter of not more than 10 micrometers, but is not limited by this embodiment. The nanocarbon material 3 comprises a mixture of one or more of an oligo-graphene, a single-walled carbon nanotube, and a multi-walled carbon nanotube, and can serve as a thermal bridging medium between the thermally conductive fillers 2 (thermal-bridging) Material). In some embodiments, the oligo-graphene has a thickness of less than 5 nm and a lateral dimension of between 0.1 and 5 microns, but is not limited to such graphene material. The surfactant comprises a wetting agent and a dispersing agent, and the wetting agent can improve the hydrophilicity of the nano carbon material 3 in an aqueous solution, for example, the component comprising 1,4-dihexyl sulfosuccinate sodium salt (C 16 An anionic surfactant of H 29 O 7 NaS); the dispersant can improve the dispersibility of the nano carbon material 3 in an aqueous solution, thereby avoiding a significant agglomeration of the nano carbon material 3 in an aqueous solution, this embodiment As the dispersant, for example, a cationic surfactant containing tetrabutylammonium chloride (C 4 H 12 ClN) may be used.
接著,於步驟S102中可在該水溶性樹脂1中添加界面活性劑。詳細來說,本步驟是需要先使用該水溶性樹脂1的該基底劑,該基底劑在本步驟是呈現膠狀或膏狀的未凝固狀態。本步驟可將該界面活性劑的該濕潤劑及該分散劑之至少一者添加於該水溶性樹脂1的該基底劑中,且該濕潤劑及/或該分散劑的較佳重量百分比不大於10%,但在不同實施態樣中該濕潤劑及/或該分散劑的添加比例均可調整,不以此處揭露內容為限。 Next, a surfactant may be added to the water-soluble resin 1 in step S102. In detail, this step is to use the base agent of the water-soluble resin 1, which is in an unsolidified state which is in the form of a gel or a paste in this step. In this step, at least one of the humectant and the dispersing agent of the surfactant may be added to the base agent of the water-soluble resin 1, and the preferred weight percentage of the humectant and/or the dispersing agent is not more than 10%, but the ratio of the humectant and/or the dispersant can be adjusted in different embodiments, and is not limited to the contents disclosed herein.
再來,於步驟S103中可在含有該界面活性劑的該水溶性樹脂1中添加該導熱填料2及該奈米碳材3,並令該水溶性樹脂1、該導熱填料2及該奈米碳材3充分混合,該導 熱填料2的重量百分比例如為10~50%,該奈米碳材3的重量百分比例如為不大於10%,但不以此等比例為限。其中,步驟S104可使用真空脫泡技術、膠體球磨技術或均質攪拌技術,使該水溶性樹脂1、該導熱填料2、該奈米碳材3及該界面活性劑充分混合,但不以此等技術為限。 Further, in the step S103, the heat conductive filler 2 and the nano carbon material 3 may be added to the water-soluble resin 1 containing the surfactant, and the water-soluble resin 1, the heat conductive filler 2 and the nanometer may be added. Carbon material 3 is thoroughly mixed, the guide The weight percentage of the hot filler 2 is, for example, 10 to 50%, and the weight percentage of the nanocarbon material 3 is, for example, not more than 10%, but is not limited thereto. Wherein, in step S104, the water-soluble resin 1, the heat-conductive filler 2, the nano-carbon material 3 and the surfactant may be sufficiently mixed using a vacuum defoaming technique, a colloidal ball milling technique or a homogeneous stirring technique, but not Technology is limited.
請參閱第三圖,為本發明實施例在不同時間下,奈米碳材於各式溶液中的分布狀態。其中標示(1)者為添加0.05%磺基琥珀酸1,4-二己酯鈉鹽(濕潤劑)及1%四丁基氯化銨(分散劑)的含該奈米碳材3的水溶液,標示(2)者為添加1%十二烷基苯磺酸鈉(Sodium dodecylbenzenesulfonate,SDBS)分散劑的含該奈米碳材3的水溶液,標示(3)者為添加2% SDBS分散劑的含該奈米碳材3的水溶液,標示(4)為不含任何界面活性劑的含該奈米碳材3的水溶液,其中SDBS是一般較常見的分散劑。第三圖(a)呈現四種水溶液剛調配完成的狀態,第三圖(b)呈現四種水溶液靜置4小時後的狀態。從第三圖(a)與第三圖(b)的比較可知,四種水溶液剛調配完成時該奈米碳材3均呈現均勻分布於水溶液中的狀態,但經過一段時間靜置後,含SDBS的水溶液(2)、(3)以及未含任何界面活性劑的水溶液(4)中,該奈米碳材3均產生團聚及沉澱現象,但添加磺基琥珀酸1,4-二己酯鈉鹽及四丁基氯化銨的水溶液(1)中該奈米碳材3仍呈現均勻分布的狀態,如此可知本實施例添加磺基琥珀酸1,4-二己酯鈉鹽及四丁基氯化銨確實能較一般界面活性 劑增進該奈米碳材3的分散性,如此能避免該奈米碳材3在該水溶性樹脂1未均勻分散而影響導熱效能。 Please refer to the third figure, which is a distribution state of nano carbon materials in various solutions at different times according to an embodiment of the present invention. Wherein (1) is an aqueous solution containing 0.05% sodium sulfouccinate 1,4-dihexyl ester (wetting agent) and 1% tetrabutylammonium chloride (dispersant) containing the nano carbon material 3. The indicator (2) is an aqueous solution containing the sodium dodecylbenzenesulfonate (SDBS) dispersant containing the nano carbon material 3, and the label (3) is added with 2% SDBS dispersant. An aqueous solution containing the nanocarbon material 3, and (4) is an aqueous solution containing the nanocarbon material 3, which is a generally more common dispersant, without any surfactant. The third graph (a) shows the state in which the four aqueous solutions have just been blended, and the third graph (b) shows the state in which the four aqueous solutions are allowed to stand for 4 hours. From the comparison between the third figure (a) and the third figure (b), the nano carbon materials 3 are uniformly distributed in the aqueous solution when the four aqueous solutions are just finished, but after a period of standing, the In the aqueous solution (2), (3) of SDBS and the aqueous solution (4) not containing any surfactant, the nanocarbon material 3 is agglomerated and precipitated, but 1,4-dihexyl sulfosuccinate is added. In the aqueous solution (1) of the sodium salt and tetrabutylammonium chloride, the nano carbon material 3 is still in a state of uniform distribution. Thus, it is known that the sodium 1,4-dihexyl sulfosuccinate and the tetrabutylate are added in this embodiment. Ammonium chloride can indeed be more than normal interfacial activity The agent enhances the dispersibility of the nanocarbon material 3, so that the nanocarbon material 3 is prevented from being uniformly dispersed in the water-soluble resin 1 to affect the heat conduction performance.
完成前述步驟後,於步驟S104可固化該水溶性樹脂1,而完成該散熱材料100的製作。本步驟中,例如可以藉由1比1的比例在該水溶性樹脂1的該基底劑中添加固化劑,即能完成非凝固狀的該散熱材料100的製作。此外,如第二圖之應用態樣所示,該製備完成的散熱材料100可供塗佈於該待散熱物品200的表面,藉由自然蔭乾或加熱固化的方式,使該散熱材料100轉為固態狀,且厚度例如為10微米至60微米但不以此為限,藉以在該待散熱物品200的散熱表面提供較佳的熱散逸效果。 After the foregoing steps are completed, the water-soluble resin 1 can be cured in step S104 to complete the fabrication of the heat-dissipating material 100. In this step, for example, a curing agent can be added to the base agent of the water-soluble resin 1 at a ratio of 1 to 1, that is, the heat-dissipating material 100 can be produced in a non-solidified state. In addition, as shown in the application form of the second figure, the prepared heat dissipating material 100 can be coated on the surface of the object to be heat-dissipated 200, and the heat dissipating material 100 is rotated by natural shading or heat curing. It is solid and has a thickness of, for example, 10 micrometers to 60 micrometers, but not limited thereto, thereby providing a better heat dissipation effect on the heat dissipation surface of the article to be heat-dissipated 200.
以下,配合前述說明流程茲舉一實施例,藉以具體說明本發明散熱材料100的製作方法。首先,將水溶性環氧樹脂的基底劑以3:1的比例加入含濕潤劑及分散劑的水溶液稀釋(基底劑對水溶液的比例為3比1),形成一總重30克的膠狀基質,其中,濕潤劑為0.05%的磺基琥珀酸1,4-二己酯鈉鹽,分散劑為1%的四丁基氯化。然後,在上述膠狀基質中加入粒徑0.5微米的氧化鋁顆粒(30%)作為導熱填料2,並加入2%石墨烯及2%多壁奈米碳管作為奈米碳材3,以行星式真空脫泡機將上述原料充分混合。最後,再將前述原料以1:1的比例加入水溶性環氧樹脂的固化劑並充分混合,便完成散熱材料100的製作。欲使用時,可以塗布棒將散熱材料100塗布 在待散熱物品上,以80℃加熱30分鐘或自然蔭乾,即可將該散熱材料100轉為固態狀以提供散熱功效。 Hereinafter, an embodiment will be described in conjunction with the above description, and a method of manufacturing the heat dissipating material 100 of the present invention will be specifically described. First, the base agent of the water-soluble epoxy resin is diluted in a ratio of 3:1 to an aqueous solution containing a wetting agent and a dispersing agent (the ratio of the base agent to the aqueous solution is 3 to 1) to form a gelatinous matrix having a total weight of 30 g. Wherein the wetting agent is 0.05% sodium 1,4-dihexyl sulfosuccinate and the dispersing agent is 1% tetrabutyl chloride. Then, alumina particles (30%) having a particle diameter of 0.5 μm are added as a heat conductive filler 2 to the above-mentioned colloidal matrix, and 2% graphene and 2% multi-walled carbon nanotubes are added as nano carbon material 3 to the planet. The above-mentioned raw materials are thoroughly mixed by a vacuum deaerator. Finally, the above-mentioned raw materials are added to the curing agent of the water-soluble epoxy resin in a ratio of 1:1 and thoroughly mixed to complete the production of the heat dissipating material 100. When you want to use it, you can apply a rod to coat the heat sink material 100. The heat dissipating material 100 can be turned into a solid state to provide heat dissipation effect by heating at 80 ° C for 30 minutes or natural shading on the item to be heat-dissipated.
請參閱表一,為不同成分比例之散熱材料100的降溫效果比較,該降溫效果是依循ASTM D5470標準測試方法,以固定功率加熱一銅塊作為加熱器,並將未塗布、有塗布該散熱材料100的待測試試片放置於該銅塊上加熱一段時間,待熱平衡後量測表面溫度,藉以比較散熱之效果。本次測試中,是以5W之功率進行加熱,加熱時間為4小時,塗布該散熱材料100的厚度為40微米。在不同的條件下,未塗布該散熱材料100的待測試試片達到熱平衡的溫度不盡相同,但大致範圍在60~80℃之間,而上述表格中的降溫效果,則是比較在相同的加熱條件下,有塗布該散熱材料100的待測試試片於熱平衡後,其溫度與未塗布該散熱材料100的待測試試片的差異。由該試驗結果可知,在未添加界面活性劑的狀態下,該散熱材料100提供4℃的散熱效果,而在添加0.05%磺基琥珀酸1,4-二己酯鈉鹽及1%四丁基氯化銨後降溫效果能提升至6.45℃,此外若進一步增加該奈米碳材3的比例則能將降溫效果提升至9.28℃。由此可知,本實施例的散熱材料100確實能提供有效的散熱效果,且界面活性劑的添加也確實能提升該散熱材料100的散熱功效。 Please refer to Table 1 for the comparison of the cooling effect of the heat dissipating material 100 with different proportions. The cooling effect is in accordance with the ASTM D5470 standard test method. A copper block is heated as a heater at a fixed power, and the heat dissipating material is uncoated and coated. The test piece to be tested of 100 is placed on the copper block for heating for a period of time, and the surface temperature is measured after the heat balance, thereby comparing the effect of heat dissipation. In this test, heating was performed at a power of 5 W for 4 hours, and the thickness of the heat dissipating material 100 was 40 μm. Under different conditions, the temperature at which the test piece not coated with the heat dissipating material 100 reaches the heat balance is not the same, but the range is generally between 60 and 80 ° C, and the cooling effect in the above table is the same. Under heating conditions, there is a difference between the temperature of the test piece to be tested coated with the heat dissipating material 100 and the test piece to be tested that is not coated with the heat dissipating material 100 after heat balance. It can be seen from the test results that the heat dissipating material 100 provides a heat dissipation effect of 4 ° C in the state where no surfactant is added, and is added with 0.05% sodium 1,4-dihexyl sulfosuccinate and 1% tetrabutylate. The cooling effect after the ammonium chloride can be increased to 6.45 ° C, and if the proportion of the nano carbon material 3 is further increased, the cooling effect can be raised to 9.28 ° C. It can be seen that the heat dissipating material 100 of the embodiment can provide an effective heat dissipating effect, and the addition of the surfactant can also improve the heat dissipating effect of the heat dissipating material 100.
本發明提供一種含奈米碳材散熱材料的製作方法,以水溶性樹脂作為基底材料,在水溶性樹脂中添加例如粒徑小於10微米的陶瓷填料,並添入濕潤劑(如:磺基琥珀酸1,4-二己酯鈉鹽)、分散劑(如:四丁基氯化銨),以提升石墨烯、奈米碳管等奈米碳材的濕潤性及在水溶性樹脂中的分散性,如此能讓陶瓷填料作為水溶性樹脂中的主要熱散逸媒介,並由奈米碳材作為陶瓷填料之間的架橋材料,而實現一高效能的散熱材料,本發明之散熱材料能有效提升散熱效果,可直接使用於散熱元件,使其在未來的應用領域更加寬廣。 The invention provides a method for preparing a heat-dissipating material containing nano carbon materials, wherein a water-soluble resin is used as a base material, and a ceramic filler having a particle diameter of less than 10 μm is added to the water-soluble resin, and a humectant (for example, sulfo amber) is added. Acid 1,4-dihexyl ester sodium salt), dispersant (such as tetrabutylammonium chloride) to improve the wettability of nano-carbon materials such as graphene and carbon nanotubes and dispersion in water-soluble resin Therefore, the ceramic filler can be used as the main heat dissipation medium in the water-soluble resin, and the nano-carbon material is used as a bridging material between the ceramic fillers to realize a high-efficiency heat-dissipating material, and the heat-dissipating material of the invention can effectively improve the heat dissipation. The effect can be directly applied to the heat dissipating component, making it more widely used in future applications.
上述之實施例僅為例示性說明本發明之特點及功效,非用以限制本發明之實質技術內容的範圍。任何熟悉此 技藝之人士均可在不違背發明之精神及範疇下,對上述實施例進行修飾與變化。因此,本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above-described embodiments are merely illustrative of the features and effects of the present invention and are not intended to limit the scope of the technical scope of the present invention. Any familiar with this Modifications and variations of the above-described embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.
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| US20110046027A1 (en) * | 2009-08-19 | 2011-02-24 | Aruna Zhamu | Nano graphene-modified lubricant |
| TW201600460A (en) * | 2014-06-24 | 2016-01-01 | 安炬科技股份有限公司 | Graphene polymer composite material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20110046027A1 (en) * | 2009-08-19 | 2011-02-24 | Aruna Zhamu | Nano graphene-modified lubricant |
| TW201600460A (en) * | 2014-06-24 | 2016-01-01 | 安炬科技股份有限公司 | Graphene polymer composite material |
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