TWI620911B - Heat conduction structure with liquid-gas separation mechanism - Google Patents
Heat conduction structure with liquid-gas separation mechanism Download PDFInfo
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- TWI620911B TWI620911B TW106111453A TW106111453A TWI620911B TW I620911 B TWI620911 B TW I620911B TW 106111453 A TW106111453 A TW 106111453A TW 106111453 A TW106111453 A TW 106111453A TW I620911 B TWI620911 B TW I620911B
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- 238000000926 separation method Methods 0.000 title claims abstract description 16
- 239000012530 fluid Substances 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 238000005192 partition Methods 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 230000003134 recirculating effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 238000007872 degassing Methods 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本發明係關於一種具有液氣分離機制的導熱結構,包括均溫板、熱管、隔板及工作流體,均溫板包括殼體及容腔,殼體具有底板及立板,在底板的內表面設有第一毛細組織,在立板開設有穿孔;熱管包括管體及第二毛細組織,管體具有開口端,管體以開口端對應穿孔穿接封合;隔板鋪設在開口端並且覆蓋在第一毛細組織和第二毛細組織,從而在隔板的二側分別形成有氣體流道和液體流道;工作流體填注在容腔內。藉此,回流的液態工作流體可不受到氣態工作流體流動的影響,進而提昇液態工作流體的回流速度。 The invention relates to a heat conducting structure with a liquid-gas separation mechanism, comprising a temperature equalizing plate, a heat pipe, a partition plate and a working fluid. The temperature equalizing plate comprises a casing and a cavity, the casing has a bottom plate and a vertical plate, and the inner surface of the bottom plate The first capillary structure is provided, and the vertical plate is provided with a perforation; the heat pipe comprises a pipe body and a second capillary structure, the pipe body has an open end, and the pipe body is sealed by the open end corresponding to the perforation; the partition plate is laid at the open end and covered In the first capillary structure and the second capillary structure, gas flow paths and liquid flow paths are respectively formed on both sides of the separator; the working fluid is filled in the cavity. Thereby, the recirculating liquid working fluid can be unaffected by the flow of the gaseous working fluid, thereby increasing the recirculation speed of the liquid working fluid.
Description
本發明係有關一種導熱技術,尤指一種具有液氣分離機制的導熱結構。 The invention relates to a heat conduction technology, in particular to a heat conduction structure having a liquid gas separation mechanism.
隨著電子元件的運算速度不斷提昇,其所產生的熱量亦越來越高,為了有效地解決此高發熱量的問題,業界已將具有良好導熱特性的熱管(Heat Pipe)和均溫板(Vapor Chamber)進行廣泛性的使用,其中熱管雖然具有讓內部的氣態工作流體的流向性一致,但因為體積的拘限導致其所能傳導的熱量相當有限,另均溫板雖具有寬敞的受熱面積來提供給發熱源直接貼附傳導,但其氣態工作流體的流向相當的紊亂,如此皆將限制其導散熱效能。 As the computing speed of electronic components continues to increase, the heat generated by them is getting higher and higher. In order to effectively solve this problem of high heat generation, the heat pipe and the temperature equalizing plate (Vapor) with good thermal conductivity are already available in the industry. Chamber) is widely used, in which the heat pipe has the same flow direction of the internal working fluid, but the heat that can be transmitted is limited due to the limitation of the volume, and the temperature plate has a spacious heating area. The heat source is directly attached to the conduction, but the flow of the gaseous working fluid is quite disordered, which will limit the heat dissipation performance.
業界為了解決前述所存在的問題點,已將熱管和均溫板加以組接而形成一導熱結構,其中熱管是穿接在均溫板的一側邊,並且讓熱管的內部空間和均溫板的內部空間相互連通。 In order to solve the above problems, the heat pipe and the temperature equalizing plate have been assembled to form a heat conducting structure, wherein the heat pipe is connected to one side of the temperature equalizing plate, and the inner space and the temperature equalizing plate of the heat pipe are allowed. The internal spaces are interconnected.
然而,習知均溫板和熱管組合結構,雖然具有導散熱效能,但卻存在有以下的問題點,由於氣態工作流體在流經熱管時,因為截面積變小從而使得流速增加,此等被增加的流速將對回流的液態工作流體產生牽制作用,而 將回流的液態工作流體帶回熱管遠離均溫板的一端,進而讓均溫板產生空燒等不良情況。另熱管內部的毛細組織未能與均溫板內部的毛細組織相互貼接,因而導致液態工作流體來回流的過程中產生中斷或不連續的情況,皆將大幅度地降低其導散熱效能。 However, the conventional uniform temperature plate and heat pipe combination structure, although having the heat dissipation performance, has the following problems. Since the gaseous working fluid flows through the heat pipe, the flow rate increases because the cross-sectional area becomes smaller, and this is The increased flow rate will create a flow for the returning liquid working fluid, and The returned liquid working fluid is brought back to the heat pipe away from one end of the temperature equalizing plate, so that the temperature equalizing plate is caused by air burning and the like. In addition, the capillary structure inside the heat pipe fails to adhere to the capillary structure inside the temperature equalizing plate, thereby causing interruption or discontinuity in the process of returning the liquid working fluid, which will greatly reduce the heat dissipation performance.
本發明之一目的,在於提供一種具有液氣分離機制的導熱結構,其以隔板來分隔出氣體流道和液體流道,利於回流的液態工作流體可不受到氣態工作流體流動的影響,進而提昇液態工作流體的回流速度。 An object of the present invention is to provide a heat-conducting structure having a liquid-gas separation mechanism, which separates a gas flow path and a liquid flow path by a separator, and the liquid working fluid which is favorable for reflux can be not affected by the flow of the gaseous working fluid, thereby improving The reflux rate of the liquid working fluid.
為了達成上述之目的,本發明係提供一種具有液氣分離機制的導熱結構,包括一均溫板、一熱管、一隔板及一工作流體,該均溫板包括一殼體及形成在該殼體內部的一容腔,該殼體具有一底板及自該底板延伸出的一立板,在該底板的內表面佈設有一第一毛細組織,在該立板開設有連通該容腔的一穿孔;該熱管包括一管體及佈設在該管體內的一第二毛細組織,該管體具有一開口端,該管體以該開口端對應該穿孔穿接封合;該隔板鋪設在該開口端並且覆蓋在該第一毛細組織和該第二毛細組織,從而在該隔板的二側分別形成有一氣體流道和一液體流道;該工作流體填注在該容腔內。 In order to achieve the above object, the present invention provides a heat conducting structure having a liquid-gas separation mechanism, comprising a temperature equalizing plate, a heat pipe, a partition plate and a working fluid, the temperature equalizing plate comprising a casing and being formed on the casing a housing inside the body, the housing has a bottom plate and a vertical plate extending from the bottom plate, a first capillary structure is disposed on the inner surface of the bottom plate, and a through hole communicating with the cavity is opened in the vertical plate The heat pipe includes a tube body and a second capillary structure disposed in the tube body, the tube body having an open end, the tube body is pierced and sealed by the open end; the partition plate is laid at the opening And covering the first capillary structure and the second capillary structure, so that a gas flow channel and a liquid flow channel are respectively formed on two sides of the separator; the working fluid is filled in the cavity.
本發明還具有以下功效,利用第一毛細組織和第二毛細組織貼附接觸進而提昇液態工作流體的回流速度。藉由長條狀遮蔽片和各弧形片體連接,可使從各熱管回流的液態工作流體能夠做相互交換或補給之需求。 The present invention also has the effect of using the first capillary structure and the second capillary tissue to attach the contact to thereby increase the reflux velocity of the liquid working fluid. By connecting the strip-shaped shielding sheets and the arc-shaped sheets, the liquid working fluid flowing back from the heat pipes can be exchanged or replenished.
10‧‧‧均溫板 10‧‧‧Wall plate
11‧‧‧下殼體 11‧‧‧ Lower case
111‧‧‧底板 111‧‧‧floor
112‧‧‧立板 112‧‧‧Legs
113‧‧‧穿孔 113‧‧‧Perforation
12‧‧‧上殼體 12‧‧‧Upper casing
13‧‧‧第一毛細組織 13‧‧‧First capillary tissue
A‧‧‧容腔 A‧‧‧ cavity
20‧‧‧熱管 20‧‧‧heat pipe
21‧‧‧管體 21‧‧‧ tube body
22‧‧‧第二毛細組織 22‧‧‧Second capillary tissue
30‧‧‧隔板 30‧‧‧Baffle
31‧‧‧遮蔽片 31‧‧‧ Masking
31a‧‧‧長條狀遮蔽片 31a‧‧‧Long strips
32‧‧‧弧形片體 32‧‧‧Shaped sheet
C1‧‧‧氣體流道 C1‧‧‧ gas flow path
C2‧‧‧液體流道 C2‧‧‧ liquid flow channel
40‧‧‧工作流體 40‧‧‧Working fluid
8‧‧‧發熱源 8‧‧‧heat source
圖1係本發明的立體分解圖。 Figure 1 is a perspective exploded view of the present invention.
圖2係本發明的組合剖視圖。 Figure 2 is a cross-sectional view of the combination of the present invention.
圖3係本發明之另一方向的組合剖視圖。 Figure 3 is a cross-sectional view of the combination in another direction of the present invention.
圖4係本發明應用於發熱源的組合剖視圖。 Figure 4 is a combined cross-sectional view of the present invention applied to a heat source.
圖5係本發明之另一實施例組合剖視圖。 Figure 5 is a cross-sectional view showing another embodiment of the present invention.
有關本發明之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 The detailed description and technical content of the present invention are set forth in the accompanying drawings.
請參閱圖1及圖3所示,本發明提供一種具有液氣分離機制的導熱結構,其主要包括一均溫板10、一熱管20、一隔板30及一工作流體40。 Referring to FIG. 1 and FIG. 3, the present invention provides a heat conducting structure having a liquid-gas separation mechanism, which mainly includes a temperature equalizing plate 10, a heat pipe 20, a partition plate 30, and a working fluid 40.
本實施例的均溫板10主要包括一下殼體11及一上殼體12,上殼體12和下殼體11皆以銅、鋁或其合金等導熱性良好的材料所製成,下殼體11具有一矩形底板111及自矩形底板111向上彎折延伸出的一立板112,上殼體12是對應於下殼體11做密接封合,從而在上殼體12和下殼體11之間形成有一容腔A,在立板112上開設有連通前述容腔A的一穿孔113。在底板111的內表面佈設有一第一毛細組織13,其可為金屬編織網、纖維束或金屬粉末燒結物等材料所製成。同理亦可在立板112的內表面和上殼體12的內表面佈設前述第一毛細組織13。 The temperature equalizing plate 10 of the present embodiment mainly includes a lower casing 11 and an upper casing 12, and the upper casing 12 and the lower casing 11 are made of a material having good thermal conductivity such as copper, aluminum or alloy thereof, and the lower casing. The body 11 has a rectangular bottom plate 111 and a vertical plate 112 which is bent upwardly from the rectangular bottom plate 111. The upper casing 12 is tightly sealed corresponding to the lower casing 11, so that the upper casing 12 and the lower casing 11 are in the upper casing 12 and the lower casing 11 A cavity A is formed between the opening plate 112 and a through hole 113 connecting the cavity A. A first capillary structure 13 is disposed on the inner surface of the bottom plate 111, which may be made of a material such as a metal woven mesh, a fiber bundle or a metal powder sinter. Similarly, the first capillary structure 13 may be disposed on the inner surface of the vertical plate 112 and the inner surface of the upper casing 12.
熱管20包括一管體21及一第二毛細組織22,管體21可為銅、鋁或其合金等導熱性良好的材料所製成,其具有一封閉端和一開口端,第二毛細組織22可為金屬編織網、纖維束或金屬粉末燒結物等材料所製成,其是設置在管體21內壁並且延伸至管體21的開口端端面位置,熱管20是以其開口端對應於前述穿孔113做穿接封合,並且令第二毛細組織22的端面與第一毛細組織13做相互貼附接觸。 The heat pipe 20 includes a tube body 21 and a second capillary structure 22. The tube body 21 can be made of a material having good thermal conductivity such as copper, aluminum or alloy thereof, and has a closed end and an open end, and the second capillary structure 22 may be made of a material such as a metal woven mesh, a fiber bundle or a metal powder sinter, which is disposed on the inner wall of the tubular body 21 and extends to the end surface of the open end of the tubular body 21, and the heat pipe 20 corresponds to the open end thereof. The aforementioned through hole 113 is pierced and sealed, and the end faces of the second capillary structure 22 are brought into contact with each other with the first capillary structure 13.
隔板30為一不透氣片體,其可為銅箔、鋁箔或其合金等材料所製成,本實施例的隔板30具有一遮蔽片31及連接遮蔽片31的一弧形片體32,遮蔽片31大致呈一矩形狀,其是覆蓋在第一毛細組織13的內表面,弧形片體32的曲率半徑大致與第二毛細組織32內表面的曲率半徑相等,藉以使弧形片體32能夠密貼且覆蓋在第二毛細組織22上方,從而在隔板30的上側形成有一氣體流道C1以及在隔板30的下側形成有一液體流道C2。 The separator 30 is a gas-impermeable sheet, which can be made of a material such as a copper foil, an aluminum foil or an alloy thereof. The separator 30 of the present embodiment has a shielding sheet 31 and an arc-shaped sheet 32 connecting the shielding sheets 31. The shielding piece 31 has a substantially rectangular shape covering the inner surface of the first capillary structure 13, and the radius of curvature of the curved piece 32 is substantially equal to the radius of curvature of the inner surface of the second capillary structure 32, thereby making the curved piece The body 32 can be adhered and covered over the second capillary structure 22 such that a gas flow path C1 is formed on the upper side of the partition 30 and a liquid flow path C2 is formed on the lower side of the partition 30.
工作流體40可為水,可透過一入液除氣管(圖未示出)與前述容腔A相互連通,將工作流體40填入上殼體12和下殼體11所形成的容腔A中,並藉助入液除氣管進行除氣加工和對入液除氣管施以封口作業,進而完成本發明之具有液氣分離機制的導熱結構。 The working fluid 40 can be water, and can communicate with the cavity A through a liquid inlet degassing tube (not shown), and fill the working fluid 40 into the cavity A formed by the upper casing 12 and the lower casing 11. And performing the degassing process by means of the liquid-intake degassing pipe and applying a sealing operation to the liquid-incorporating degassing pipe, thereby completing the heat-conducting structure with the liquid-gas separation mechanism of the present invention.
請參閱圖4所示,使用時是將均溫板10的底板111對應於一發熱源8做密合貼接,在發熱源8運作產生高熱量後,此等高熱量將令蓄存在第一毛細組織13內的液態工作流體40產生蒸發並形成為氣態工作流體40,此氣態工作流體40帶著大量的熱從容腔A經由氣體流道C1朝向熱管20的管體21內部流動,在到達熱管20遠離均溫板10的一端,透過熱管20外部所裝設的散熱鰭片等散熱單元(圖未示出)的作用下,將令前述的氣態工作流體40產生冷凝作用並形成為液態工作流體40,此等液態工作流體40藉助第二毛細組織22的毛細吸附力,並且透過第二毛細組織22和第一毛細組織13的貼接,將從液體流道C2流回第一毛細組織13,如此連續不斷的循環運作以進行熱量的導離散逸。 Referring to FIG. 4, in use, the bottom plate 111 of the temperature equalizing plate 10 is closely adhered to a heat source 8. After the heat source 8 operates to generate high heat, the high heat will cause the first capillary to be stored. The liquid working fluid 40 in the tissue 13 is vaporized and formed into a gaseous working fluid 40, which flows with a large amount of heat from the cavity A through the gas flow path C1 toward the inside of the pipe body 21 of the heat pipe 20, and reaches the heat pipe 20 Moving away from the end of the temperature equalizing plate 10, through the heat dissipating unit (not shown) such as the heat dissipating fins disposed outside the heat pipe 20, the gaseous working fluid 40 is condensed and formed into a liquid working fluid 40. The liquid working fluid 40 flows back to the first capillary structure 13 from the liquid flow path C2 by the capillary adsorption force of the second capillary structure 22 and through the attachment of the second capillary structure 22 and the first capillary structure 13, so continuous Constant cycle operation for the conduction of heat.
本案藉由隔板30對氣態工作流體40和液態工作流體40進行分道處理,藉以令氣態工作流體40在流經開口端時,因為截面積變小從而使得流速 增加,此等被增加的流速將不致於對回流的液態工作流體40產生牽制作用,進而可提昇液態工作流體的回流速度。 In this case, the gaseous working fluid 40 and the liquid working fluid 40 are separated by the partition 30, so that when the gaseous working fluid 40 flows through the open end, the flow rate is reduced because the cross-sectional area is small. Increasingly, such increased flow rates will not cause drawback of the reflowed liquid working fluid 40, thereby increasing the reflux rate of the liquid working fluid.
請參閱圖5所示,本實施例與上述實施例的差異在於:隔板30包括一長條狀遮蔽片31a及連接長條狀遮蔽片31a的複數弧形片體32,各弧形片體32對應於各熱管20做穿接並覆蓋在各第二毛細組織22上,長條狀遮蔽片31a則是橫跨各熱管20的開口端覆蓋在第一毛細組織13上,如此可使從各熱管20回流的液態工作流體40能夠做相互交換或補給之需求。 Referring to FIG. 5, the difference between this embodiment and the above embodiment is that the partition plate 30 includes a long strip-shaped shielding piece 31a and a plurality of curved piece bodies 32 connecting the long strip-shaped shielding pieces 31a, and each curved piece body 32 corresponds to each heat pipe 20 for piercing and covering each of the second capillary structures 22, and the long strip-shaped shielding sheets 31a cover the first capillary structure 13 across the open ends of the heat pipes 20, so that each can be The liquid working fluid 40, which is recirculated by the heat pipe 20, can be exchanged or replenished.
綜上所述,本發明之具有液氣分離機制的導熱結構,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。 In summary, the heat-conducting structure with the liquid-gas separation mechanism of the present invention can achieve the intended use purpose, and solves the lack of the prior art, and is extremely novel and progressive, fully conforms to the requirements of the invention patent application, and converts If the patent law is filed, please check and grant the patent in this case to protect the rights of the inventor.
Claims (8)
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| CN116997131A (en) * | 2022-04-25 | 2023-11-03 | 惠州惠立勤电子科技有限公司 | Heat radiation module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM363774U (en) * | 2009-05-05 | 2009-08-21 | Celsia Technologies Taiwan Inc | Heat spreader with dividing plates |
| TWM453123U (en) * | 2013-01-04 | 2013-05-11 | Auras Technology Co Ltd | Gas/liquid separation type heat pipe |
| CN203934263U (en) * | 2014-07-04 | 2014-11-05 | 讯凯国际股份有限公司 | Heat sink with capillary members |
| JP2015169420A (en) * | 2014-03-11 | 2015-09-28 | オーム電機株式会社 | heat sink |
| TWM517315U (en) * | 2015-11-24 | 2016-02-11 | Asia Vital Components Co Ltd | Heat dissipating unit |
| US20160102921A1 (en) * | 2012-11-20 | 2016-04-14 | Lockheed Martin Corporation | Heat pipe with axial wick |
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2017
- 2017-04-05 TW TW106111453A patent/TWI620911B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM363774U (en) * | 2009-05-05 | 2009-08-21 | Celsia Technologies Taiwan Inc | Heat spreader with dividing plates |
| US20160102921A1 (en) * | 2012-11-20 | 2016-04-14 | Lockheed Martin Corporation | Heat pipe with axial wick |
| TWM453123U (en) * | 2013-01-04 | 2013-05-11 | Auras Technology Co Ltd | Gas/liquid separation type heat pipe |
| JP2015169420A (en) * | 2014-03-11 | 2015-09-28 | オーム電機株式会社 | heat sink |
| CN203934263U (en) * | 2014-07-04 | 2014-11-05 | 讯凯国际股份有限公司 | Heat sink with capillary members |
| TWM517315U (en) * | 2015-11-24 | 2016-02-11 | Asia Vital Components Co Ltd | Heat dissipating unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116997131A (en) * | 2022-04-25 | 2023-11-03 | 惠州惠立勤电子科技有限公司 | Heat radiation module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201837415A (en) | 2018-10-16 |
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