TWI620281B - Sensor module package structure and method for manufacturing the same - Google Patents

Abstract

A sensing module package structure and a manufacturing method thereof are provided with a protective layer outside the sensing circuit of the touch panel to avoid the influence of high temperature in the process, and particularly a protective structure formed by a high melting point material. An embodiment of the manufacturing method includes placing a sensing circuit module into a first mold, injecting a first molten material into the first mold, and forming a first covering body after the first cooling, thereby engaging the sensing circuit One part of the module; the semi-finished product is placed in the second mold, and the second molten material is injected, and the second covering body is shaped by the second cooling process to cover another part of the circuit module. The two-stage process forms a sensing module package structure in which the first cladding body and the second cladding body are coupled to the sensing circuit module.

Description

Sensing module packaging structure and manufacturing method thereof

The invention relates to an electronic sensing circuit structure and a manufacturing method thereof, in particular to a method for manufacturing a surface structure for avoiding high temperature damage when packaging a sensing circuit.

When the touch panel is manufactured, a sensing circuit for touch is provided on the back of the panel. When packaging, a polymer such as plastic is usually used as the backing material. In the general production process, the sensing circuit is placed in a mold machine having a specific appearance, and a molten polymer material is injected, and the manufacturing process is performed under a specific high temperature, and after cooling, it can be formed together with the sensing circuit. One part of an electronic device. The sensing circuit 101, as schematically illustrated in FIG. 1, is formed in the mold together with the polymer material to form a cladding material 103 on the outside of the sensing circuit 101.

However, in the above process, high temperature may damage the electronic components on the general sensing circuit, or the materials used in the specific components of the circuit may be melted. Therefore, a specially designed sensing circuit is often required, thereby increasing the cost. .

A conventional sensing circuit can refer to the cross-sectional structure described in FIG. 2.

The figure shows a touch sensing module covered by a first polymer layer 201 and a second polymer layer 211. The main structure has a conductive line 205 that tracks the sensing track by using a touch event and another conductive layer 209. Between the two, the insulating layer 207, 207' can be separated according to the requirement, and a capacitive sensing effect is generated between the conductive line 205 and the conductive layer 209, and the touch event may cause a change in capacitance, so that the sensing track can be obtained. Structurally, touch sensing module The main structure is bonded to the outer first polymer layer 201 through the optical adhesive 203.

The second polymer layer 211 is a substrate structure of the entire sensing module, and the material of the first polymer layer 201 may be a polyethylene (Ethylene Terephthalate), or other high. Molecular polymer materials, in the above processes, may damage the components of the sensing circuit due to the high temperature of the melt.

The present invention provides an electronic sensing circuit structure and a manufacturing method thereof, which can pass through a stage process, in view of the problem that the conventional technology is used in the manufacture of an electronic device in which various components of the sensing circuit and the external package structure are formed, which may cause damage due to high temperature. To avoid problems caused by high temperature in the manufacturing process.

According to one of the embodiments of the present invention, when the package sensing circuit is fabricated, a structure for avoiding high temperature damage is disposed on the surface layer of the circuit structure, and the high temperature effect is prevented by the formed protective layer.

The manufacturing method of the sensing module package structure comprises: firstly installing a sensing circuit module having a touch panel sensing circuit, and then placing the sensing circuit module into the first mold, and injecting the first molten material into the first Within the mold, the first molten material is shaped by a first cooling process to form a first cladding that encases a portion of the circuit module.

Thereafter, the composition of the first covering body and the sensing circuit module is placed in the second mold, and the second molten material is injected into the second mold, and the second molten material is shaped by the second cooling process to Forming a second covering body covering another part of the circuit module, the sensing module packaging structure is a structure in which the sensing circuit module is joined by the first covering body and the second covering body.

The sensing circuit module is mainly composed of two conductive layers and one insulating layer, and the first molten material or the second molten material is a high molecular polymer material, and is formed on the two conductive layers and the insulating layer. The surface structure may be a protective structure that blocks high temperatures, such as a layer of material having a high melting point.

The main structure of the sensing module package structure embodiment is the sensing circuit module and the cladding structure thereof. The sensing circuit module mainly has a substrate layer, a first conductive layer, an insulating layer, a second conductive layer and a surface layer. . Forming a first cladding body and a second cladding body by using a two-stage manufacturing method outside the circuit module, wherein the first cladding body and the second cladding system are respectively injected into the first mold and the second mold Molecular polymer material is formed.

In particular, in an embodiment, the surface layer of the sensing circuit module may be a high melting material layer or another protective layer may be formed outside the surface layer.

In order to fabricate a sensing module package structure that is free from high temperature effects in the process, the present disclosure proposes a sensing module package structure and a manufacturing method thereof, and a process for manufacturing a protective structure, particularly a high melting point, on the outer layer of the sensing circuit module. The material is such that the internal circuit is not damaged in the high temperature process or affects the performance of the component, and the material adhesion of the high melting point material itself can be considered as the property of the adjacent material.

An embodiment of the sensing module structure disclosed in the disclosure may refer to FIG. 3.

The sensing module structure shown in the schematic diagram is particularly used for a sensing circuit of a touch panel. The main structure includes an insulating layer 303 having two conductive layers (the first conductive layer 301 and the second conductive layer 305) spaced therefrom. The combination of the first conductive layer 301 and the second conductive layer 305 can sense the trajectory of the touch. The structure further includes a substrate layer 307 and a surface layer 300.

According to the embodiment of the invention described in the present disclosure, when the package structure of the sensing module is fabricated, especially the surface layer 300 of the structure is formed as a high melting point structure for avoiding high temperature damage, and may be, for example, polyamidamine ( Kaptone's insulating materials, or other insulating coatings, replace traditional surface layers such as polyethylene terephthalate (PET).

FIG. 4 is a schematic diagram of an embodiment of a package structure of a sensing module.

According to an embodiment of the invention, the sensing module package structure mainly comprises a sensing circuit module of the circuit portion and an covering body of the packaging material portion.

The substrate layer 411 is mainly formed, and a conductive layer 409 is formed on the substrate layer 411 (corresponding to the second conductive layer 305 of the main structure embodiment of the sensing module shown in FIG. 3), and the insulating layer 407, 407' is formed on the conductive layer 409. The conductive layer 409 is separated from the other conductive line 405 (corresponding to the first conductive layer 301 of the main structure embodiment of the sensing module shown in FIG. 3) by the insulating layer 407, 407', and the conductive layer 409 (second conductive layer) The conductive line 405 (first conductive layer) is correspondingly disposed corresponding to the insulating structure, and the design of the insulating layer 407, 407' can be adjusted according to actual needs, thereby the electrical characteristics between the two conductive layers can sense the touch behavior, such as the change of the capacitance. And draw a touch track accordingly.

In this example, a high melting point material layer 401 is used to replace the structure originally formed on the surface, such a high melting point material can prevent the internal circuit module from being affected by the high temperature in the process, and the high melting point material layer 401 can utilize the double-sided adhesive 403 (eg, A transparent optical adhesive is combined with the above-described conductive line 405, insulating layers 407, 407', and a structure in which the conductive layer 409 and the substrate layer 411 are formed.

Moreover, in an embodiment, the surface of the high melting point material layer 401 may be coated with a surface modifying agent to increase the adhesion to the outer covering body, such as the first coating as shown in FIG. 5(b). Body (503) or second cladding (505). In still another embodiment, the surface of the high melting point material layer 401 may also be coated with a coating Optical properties increase optical properties. In particular, in an embodiment, the material of the high melting point material layer 401 and the first covering body (503) or the second covering body (505) may be a highly adhesive material, or the adhesion is higher. Good material.

In another embodiment, the foregoing high melting point material layer 401 is adjacent to the first covering body (503) and the second covering body (505), so the material adhesion of the high melting point material layer 401 will be considered in the first package. The material properties of the cover (503) and/or the second cover (505) are particularly considered in terms of better adhesion.

It is worth mentioning that, because the general optical glue may be deformed or peeled off due to high temperature under high temperature conditions, a high-temperature double-sided adhesive such as a double-sided adhesive of a silicon series may be used. It can withstand high temperature of 250 degrees Celsius or replace it with high temperature resistant products such as light-solid (UV) or thermosetting liquid glue. Double-sided adhesive can also choose optical adhesive with good optical properties. In addition, in order to increase the optical properties or adhesion, the high melting point material may be specially selected or surface coated with a special material.

In particular, in forming the package structure of the sensing module, the embodiment proposed by the disclosure utilizes a two-stage fabrication method to form an outer covering body of the cladding sensing circuit module, that is, The cladding structure formed of the high temperature molten material may be an external protection device of the electronic device using the induction circuit.

FIG. 5(a) is a schematic structural view of the first stage of the two-stage process, in which the surface layer (FIG. 3, 300), the conductive layer (301), and the insulating layer (303) are included. The sensing circuit module 501 of the conductive layer (305) and the substrate layer (307) is externally formed with a first covering body 503 for covering a portion of the sensing circuit module 501, in this case, the lower portion. .

Then, as shown in FIG. 5(b), the structure is implemented in the second stage. The example includes the semi-finished product formed by the sensing circuit module 501 and the first covering body 503, and then the second covering body 505 is formed. The remaining portion of the sensing circuit module 501, wherein the first covering body 503 and the second covering body 505 are respectively formed of a polymer material injected into the two modules.

FIG. 6 then depicts a process embodiment of the package structure of the sensing module in the present disclosure.

At the beginning of the step, the sensing circuit module having the basic sensing circuit structure is prepared, and particularly includes a sensing circuit applied to the touch panel. Then, in step S601, the relevant component of the module is placed in the first mold, and the first mold is determined according to the design of the electronic device using the sensing circuit module, thereby forming a part of the external protection structure. Such as the first covering body.

In step S603, a first molten material is injected into the first mold. The material is particularly a high molecular polymer, which requires high temperature to make it a flowable molten fluid, and is completely joined to the sensing circuit through the first mold. One part of the module. Next, in step S605, the first molten material is shaped by the first cooling process to form a first covering body (step S607), and the first covering body can thus engage a portion of the set sensing circuit module.

Then, the composition (semi-finished product) of the first covering body and the sensing circuit module is placed in another second mold (step S609), and the second mold is also determined according to the design of the related electronic device, and the first mold is matched. An external protection structure of the electronic device can be formed.

In step S611, a second molten material is injected into the second mold. The second molten material is fluid at a high temperature and can be tightly coupled to the sensing circuit module. Forming the second molten material through the second cooling process (step S613), forming a second covering body of the other portion of the first covering body that is not covered (step S615).

Through the above process, the sensing module package structure of the sensing circuit module is formed by the first covering body and the second covering body, and according to the design, the first covering body and the second covering body or both thereof One may be a polymer, depending on the design requirements, that is, such a polymer needs to be in a high temperature environment during the manufacturing process, and the present disclosure proposes a sensing circuit module having a protective structure, thereby blocking The effect of high temperatures on circuit components.

In summary, the sensing module package structure and the manufacturing method thereof disclosed in the present disclosure, in particular, utilize two-stage processes to form two kinds of cladding bodies on the sensing circuit module respectively, wherein when dealing with high temperature problems, The use of materials such as high-melting materials that are resistant to high temperatures and high temperatures can protect their internal circuit components during the process.

However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent structural changes that are made by using the specification and the contents of the present invention are equally included in the present invention. Within the scope, it is combined with Chen Ming.

101‧‧‧Sensor circuit

103‧‧‧Covering materials

201‧‧‧First polymer layer

203‧‧‧Optical adhesive

205‧‧‧Electrical circuit

207, 207' ‧ ‧ insulation

209‧‧‧ Conductive layer

211‧‧‧Second polymer layer

300‧‧‧ surface layer

301‧‧‧First conductive layer

303‧‧‧Insulation

305‧‧‧Second conductive layer

307‧‧‧ substrate layer

401‧‧‧High melting point material layer

403‧‧‧double-sided tape

405‧‧‧Electrical circuit

407,407'‧‧‧Insulation

409‧‧‧ Conductive layer

411‧‧‧ substrate layer

501‧‧‧Sensor circuit module

503‧‧‧First cladding

505‧‧‧second covering

Step S601~S615‧‧‧Sense Module Packaging Process

1 is a schematic diagram of a sensing circuit package of a prior art; 2 is a schematic cross-sectional view showing a structure of a sensing circuit of the prior art; FIG. 3 is a schematic diagram showing the main structure of the sensing module of the present invention; FIG. 4 is a schematic view showing an embodiment of a sensing module structure according to the present invention; Figure 5 (a) (b) is a schematic view showing a two-stage process embodiment of the present invention; FIG. 6 is a flow chart showing an embodiment of a sensing module packaging process of the present invention.

Claims (10)

A method for manufacturing a sensing module package structure, comprising: preparing a sensing circuit module, comprising: a sensing circuit applied to a touch panel; placing the sensing circuit module into a first mold; injecting a first a molten material is formed in the first mold; the first molten material is shaped by a first cooling process to form a first covering body, the first covering body engaging a portion of the sensing circuit module; Forming the composition of the first covering body and the sensing circuit module into a second mold; injecting a second molten material into the second mold; shaping the second molten material through a second cooling process Forming a second covering body, the second covering body is joined to the first covering body and not covering another portion of the sensing circuit module; and forming the first covering body and the The second covering body engages the sensing module package structure of the sensing circuit module. The method for fabricating a sensing module package structure according to claim 1, wherein the first molten material or the second molten material is a high molecular polymer material. A sensing module package structure produced by the manufacturing method of claim 1, comprising the sensing circuit module and the first covering body covering a part of the sensing circuit module And the second covering body covering the other part of the sensing circuit module; wherein the first covering body and the second covering system are respectively injected into a first mold and a second mold Formed by a polymer material, The sensing circuit module includes: a substrate layer; a second conductive layer formed on the substrate layer; an insulating layer formed on the second conductive layer; and a first conductive layer formed on the insulating layer, The first conductive layer is spaced apart from the second conductive layer by the insulating layer; and a surface layer formed on the first conductive layer. The sensing module package structure of claim 3, wherein the surface layer is a layer of high melting point material. The sensing module package structure according to claim 4, wherein the material of the high melting point material layer on the surface layer and the first covering body or the second covering body are a highly adhesive material. The sensing module package structure of claim 4, further comprising a double-sided tape for attaching to a surface layer of the sensing module package structure. The sensing module package structure according to claim 6, wherein the first conductive layer is further provided with the double-sided tape, and the double-sided tape is a enamel material, a light-solid type or a thermosetting high-temperature series. product. The sensing module package structure of claim 6, wherein the first conductive layer is further provided with the double-sided tape, and the double-sided tape is an optical glue having optical characteristics. The sensing module package structure according to claim 4, wherein the surface of the high melting point material layer is coated with a surface modifying agent to increase the space between the first covering body or the second covering body. Adhesion. The sensing module package structure according to claim 4, wherein the surface of the high melting point material layer is coated with an optical characteristic material to increase optical speciality. Sex.