TWI613541B - Liquid cooling system - Google Patents
Liquid cooling system Download PDFInfo
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- TWI613541B TWI613541B TW105125642A TW105125642A TWI613541B TW I613541 B TWI613541 B TW I613541B TW 105125642 A TW105125642 A TW 105125642A TW 105125642 A TW105125642 A TW 105125642A TW I613541 B TWI613541 B TW I613541B
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- 239000007788 liquid Substances 0.000 title claims abstract description 81
- 238000001816 cooling Methods 0.000 title abstract description 72
- 230000017525 heat dissipation Effects 0.000 claims abstract description 43
- 238000001179 sorption measurement Methods 0.000 claims abstract description 37
- 239000002826 coolant Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 6
- 230000002209 hydrophobic effect Effects 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 230000003075 superhydrophobic effect Effects 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 abstract description 5
- 238000004891 communication Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000013461 design Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一種液冷式散熱系統，包含一液冷排、一液冷頭、複數個流管及一空氣吸附裝置。液冷頭，熱接觸於至少一熱源。流管連通於液冷頭與液冷排之間，以與液冷頭、液冷排形成供冷卻液連通循環的一迴路。空氣吸附裝置連通於迴路以吸附冷卻液中的空氣。A liquid cooling heat dissipation system comprises a liquid cooling circuit, a liquid cooling head, a plurality of flow tubes and an air adsorption device. The liquid cooling head is in thermal contact with at least one heat source. The flow tube is connected between the liquid cooling head and the liquid cooling row to form a circuit for circulating the cooling liquid with the liquid cooling head and the liquid cooling row. The air adsorption device is in communication with the circuit to adsorb air in the coolant.
Description
本發明係關於一種液冷式散熱系統，特別是一種適用於電子裝置散熱的液冷式散熱系統。The invention relates to a liquid cooling heat dissipation system, in particular to a liquid cooling heat dissipation system suitable for heat dissipation of an electronic device.
現有的電子裝置中設置許多高功率的電子元件，例如中央處理器或圖像處理器。這些電子元件具有優異的資料處理效能，但在運轉時會產生驚人的熱能，若沒有經過適當的散熱機制來排除熱能，熱能會讓這些電子元件超過其安全操作溫度而降低運作效能，甚至使得整個電子裝置因過熱而當機。Many high power electronic components, such as a central processing unit or an image processor, are provided in existing electronic devices. These electronic components have excellent data processing performance, but they generate amazing heat energy during operation. Without proper heat dissipation mechanism to eliminate thermal energy, thermal energy will cause these electronic components to exceed their safe operating temperature and reduce operational efficiency, even making the whole The electronic device crashed due to overheating.
隨著散熱技術的進步，液冷式散熱系統逐漸成為電子裝置散熱的主流之一。所謂液冷式散熱，是以液體作為散熱媒介。傳統上，液冷式散熱系統主要是由多條流管將一液冷頭與一液冷排串連所組成的循環。在該循環中填充有冷卻液，冷卻液可受液冷頭內裝設的泵(pump)驅動而在該循環中不斷流動以進行解熱。With the advancement of heat dissipation technology, liquid-cooled heat dissipation systems have gradually become one of the mainstream of heat dissipation for electronic devices. The so-called liquid-cooled heat dissipation uses liquid as a heat dissipation medium. Traditionally, the liquid-cooled heat-dissipating system is mainly composed of a plurality of flow tubes which are connected by a liquid cooling head and a liquid cooling row. The circulation is filled with a coolant which can be driven by a pump installed in the liquid cooling head to continuously flow in the cycle for deheating.
然而，該循環內的冷卻液會在流經流管時向外蒸散。統計顯示，在約為攝氏60度的使用環境下，每年經由流管向外蒸散的冷卻液的量約為8~10克不等。嚴重的是，在冷卻液向外蒸散的過程中，空氣中小分子的氣體，如氦氣，將經由流管的管材置換進入該循環內而溶解於冷卻液中，當溶解飽和後，空氣將以氣泡的方式存在於該循環中。這些氣泡除了干擾液冷循環而影響散熱效能外，在配置有泵的液冷系統中，當這些氣泡經循環被吸進泵時，會干擾槳葉的轉動，不僅影響泵的效能，還會讓泵在旋轉時產生噪音。甚至，氣泡將使槳葉在旋轉時產生晃動，造成槳葉的軸承損壞，進而影響整個液冷系統的壽命。也就是說，隨著逐年的使用，進入液冷式散熱系統的空氣越來越多，除了讓散熱系統的散熱效能越來越低，還會有泵損壞的潛在問題。However, the coolant within the cycle will emanate outward as it flows through the flow tube. Statistics show that the amount of coolant escaping outward through the flow tube is about 8-10 grams per year in a use environment of about 60 degrees Celsius. Seriously, in the process of escaping the coolant outward, small molecules of gas in the air, such as helium, will be displaced into the circulation through the pipe of the flow tube and dissolved in the coolant. When the solution is saturated, the air will be The way bubbles are present in this cycle. In addition to interfering with the liquid cooling cycle and affecting the heat dissipation performance, these bubbles in the liquid cooling system equipped with the pump, when these bubbles are sucked into the pump through the cycle, will interfere with the rotation of the blade, which not only affects the performance of the pump, but also allows The pump produces noise when it rotates. Even the air bubbles will cause the blades to sway as they rotate, causing damage to the bearings of the blades, which in turn affects the life of the entire liquid cooling system. That is to say, with the use of the liquid cooling system, more and more air enters the liquid-cooled cooling system. In addition to making the heat dissipation performance of the heat dissipation system lower and lower, there is a potential problem of pump damage.
本發明在於提供一種液冷式散熱系統，藉以解決傳統的液冷式散熱系統因循環中有空氣所造成降低散熱效能、甚至損壞泵等問題。The invention provides a liquid cooling heat dissipation system, which solves the problems that the conventional liquid cooling heat dissipation system reduces heat dissipation performance and even damages the pump due to air in the circulation.
本發明所揭露的液冷式散熱系統，包含一液冷排、一液冷頭、複數個流管及一空氣吸附裝置。液冷頭，熱接觸於至少一熱源。流管連通於液冷頭與液冷排之間，以與液冷頭、液冷排形成供冷卻液連通循環的一迴路。空氣吸附裝置連通於迴路以吸收冷卻液中的空氣。The liquid cooling heat dissipation system disclosed in the present invention comprises a liquid cooling row, a liquid cooling head, a plurality of flow tubes and an air adsorption device. The liquid cooling head is in thermal contact with at least one heat source. The flow tube is connected between the liquid cooling head and the liquid cooling row to form a circuit for circulating the cooling liquid with the liquid cooling head and the liquid cooling row. The air adsorption device is in communication with the circuit to absorb air from the coolant.
本發明所揭露的液冷式散熱系統，藉由空氣吸附裝置連通液冷迴路的設計，可吸收進入迴路中的空氣，不僅可防止空氣在迴路中對散熱效能的影響，還可維持泵順暢的運轉，避免泵吸入空氣而產生運轉噪音，更能延長泵的使用壽命。The liquid-cooled heat dissipating system disclosed by the invention can absorb the air entering the circuit by the air adsorption device communicating with the design of the liquid cooling circuit, not only preventing the air from affecting the heat dissipation performance in the circuit, but also maintaining the smoothness of the pump. It can prevent the pump from inhaling air and generate running noise, which can prolong the service life of the pump.
以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理，並且提供本發明之專利申請範圍更進一步之解釋。The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.
本發明實施方式提供了一種液冷式散熱系統，包含一液冷排、一液冷頭、複數個流管及一空氣吸附裝置。液冷頭熱接觸於至少一熱源。流管連通於液冷頭與液冷排之間，以與液冷頭、液冷排形成供冷卻液連通循環的一迴路。空氣吸附裝置連通於迴路以吸附冷卻液中的空氣。由於空氣吸附裝置連通液冷迴路的設計，可吸收進入迴路中的空氣，不僅可防止空氣在迴路中對散熱效能的影響，還可維持泵順暢的運轉，避免泵吸入空氣而產生運轉噪音，更能延長泵的使用壽命。Embodiments of the present invention provide a liquid cooling heat dissipation system including a liquid cooling row, a liquid cooling head, a plurality of flow tubes, and an air adsorption device. The liquid cooling head is in thermal contact with at least one heat source. The flow tube is connected between the liquid cooling head and the liquid cooling row to form a circuit for circulating the cooling liquid with the liquid cooling head and the liquid cooling row. The air adsorption device is in communication with the circuit to adsorb air in the coolant. Because the air adsorption device communicates with the design of the liquid cooling circuit, it can absorb the air entering the circuit, which not only prevents the air from affecting the heat dissipation performance in the circuit, but also maintains the smooth operation of the pump and avoids the pumping air to generate running noise. Can extend the life of the pump.
一種改進中，液冷式散熱系統還額外配有一可變容積腔體在迴路上，由於可變容積腔體為一不具形變恢復力的材質所構成，例如為一個可收縮且不具彈性的水球。藉此，可平衡空氣吸附裝置吸附氣泡後所帶來的壓力改變。In a refinement, the liquid-cooled heat dissipating system is additionally provided with a variable-volume cavity on the circuit, since the variable-capacity cavity is made of a material having no deformation restoring force, for example, a retractable and non-elastic water polo. Thereby, the pressure change caused by the adsorption of the air bubbles by the air adsorption device can be balanced.
以下透過具體實施例詳細敘述本發明之詳細特徵以及優點，其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點，但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are described in detail below with reference to the detailed description of the embodiments of the present invention. The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.
需注意的是，本發明所附圖式均為簡化之示意圖，僅以示意方式說明本發明之基本結構。因此，在所附圖式中僅標示與本發明有關之元件，且所顯示之元件並非以實際實施時之數目、形狀、尺寸比例等加以繪製，其實際實施時之規格尺寸實為一種選擇性之設計，且其元件佈局形態可能更為複雜，先予敘明。It is to be noted that the present invention is a simplified schematic and is merely illustrative of the basic structure of the invention. Therefore, only the components related to the present invention are labeled in the drawings, and the components are not drawn in the actual number, shape, size ratio, etc., and the actual size is actually an option. The design, and its component layout form may be more complicated, first described.
首先，請參照圖1~2，圖1係為根據本發明之第一實施例所繪示之液冷式散熱系統的示意圖，而圖2係為圖1的局部放大剖式圖。First, please refer to FIG. 1 to FIG. 2, which are schematic diagrams of a liquid-cooled heat dissipation system according to a first embodiment of the present invention, and FIG. 2 is a partially enlarged cross-sectional view of FIG.
於本實施例中，提出了一種液冷式散熱系統1a，適用於對電子裝置散熱。電子裝置可以是例如桌上型電腦，但本發明並非以此為限。In the embodiment, a liquid cooling heat dissipation system 1a is proposed, which is suitable for dissipating heat from an electronic device. The electronic device may be, for example, a desktop computer, but the invention is not limited thereto.
具體來說，於本實施例中，液冷式散熱系統1a包含一液冷頭10、一液冷排20、一第一流管31、一第二流管32、一第三流管33及一空氣吸附裝置40。Specifically, in the embodiment, the liquid cooling heat dissipation system 1a includes a liquid cooling head 10, a liquid cooling row 20, a first flow tube 31, a second flow tube 32, a third flow tube 33, and a Air adsorption device 40.
液冷頭10可用以熱接觸於至少一熱源9。熱源9可以是例如前述電子裝置中的中央處理器(Central Processing Unit，CPU)、圖形處理器(Graphics Processing Unit，GPU)等運轉時會產生大量熱能的電子元件，但本發明並非以此為限。液冷頭10具有一中空容腔10s，及連通於該中空容腔10s的一第一接口10a及一第二接口10b。The liquid cooling head 10 can be used to thermally contact at least one heat source 9. The heat source 9 may be, for example, a central processing unit (CPU) or a graphics processing unit (GPU) in the electronic device, which generates a large amount of thermal energy during operation, but the invention is not limited thereto. . The liquid cooling head 10 has a hollow cavity 10s, and a first interface 10a and a second interface 10b connected to the hollow cavity 10s.
液冷排20可是例如由複數個散熱鰭片(未繪示)及穿過這些散熱鰭片中的輸送管(未繪示)所構成。液冷排20具有一第三接口20a與一第四接口20b，分別為該輸送管兩端的開口。The liquid cooling row 20 can be formed, for example, by a plurality of heat dissipating fins (not shown) and a conveying pipe (not shown) passing through the heat dissipating fins. The liquid cooling row 20 has a third interface 20a and a fourth interface 20b, which are openings at both ends of the conveying pipe.
空氣吸附裝置40包含一主腔體410與容置於主腔體410內的複數個吸附單元420。而主腔體410的兩側上分別具有一第一開口410a與一第二開口410b。The air adsorption device 40 includes a main cavity 410 and a plurality of adsorption units 420 housed in the main cavity 410. The main cavity 410 has a first opening 410a and a second opening 410b on both sides.
第一流管31的兩端分別直接連接於液冷頭10的第一接口10a與空氣吸附裝置40的第一開口410a，第二流管32的兩端分別直接連接於空氣吸附裝置40的第二開口410b與液冷排20的第三接口20a，而第三流管33的兩端分別直接連接於液冷頭10的第二接口10b與液冷排20的第四接口20b。藉此，液冷頭10、第一流管31、空氣吸附裝置40、第二流管32、液冷排20與第三流管33形成供冷卻液流通循環的一迴路A。The two ends of the first flow tube 31 are directly connected to the first opening 10a of the liquid cooling head 10 and the first opening 410a of the air adsorption device 40, and the two ends of the second flow tube 32 are directly connected to the second of the air adsorption device 40, respectively. The opening 410b is connected to the third port 20a of the liquid-cooling row 20, and both ends of the third flow pipe 33 are directly connected to the second port 10b of the liquid-cooling head 10 and the fourth port 20b of the liquid-cooling row 20, respectively. Thereby, the liquid cooling head 10, the first flow tube 31, the air adsorbing device 40, the second flow tube 32, the liquid cooling line 20, and the third flow tube 33 form a primary circuit A through which the cooling liquid flows.
在運轉上，液冷式散熱系統1a所形成的該迴路A內填充有冷卻液。此外，於本實施例中，液冷頭10的中空容腔10s內裝設有一泵8，可用以驅動冷卻液的流動。當電子裝置在運作時，熱源9產生的熱能會直接傳導至液冷頭10中而讓液冷頭10內的冷卻液升溫，而泵8可將液冷頭10內高溫的冷卻液經由第一流管31、空氣吸附裝置40、第二流管32輸送至液冷排20作散熱降溫後，再經由第三流管33帶回液冷頭10以完成液冷循環。In operation, the circuit A formed by the liquid cooling heat dissipation system 1a is filled with a coolant. Further, in the present embodiment, a pump 8 is provided in the hollow chamber 10s of the liquid cooling head 10 to drive the flow of the coolant. When the electronic device is in operation, the heat generated by the heat source 9 is directly transmitted to the liquid cooling head 10 to heat the coolant in the liquid cooling head 10, and the pump 8 can pass the high temperature coolant in the liquid cooling head 10 through the first flow. The tube 31, the air adsorbing device 40, and the second flow tube 32 are sent to the liquid cooling row 20 for heat dissipation and cooling, and then returned to the liquid cooling head 10 via the third flow tube 33 to complete the liquid cooling cycle.
其中，由於流管的材質通常是使用鐵氟龍(Teflon)所構成，其聚合物之間的鏈結長度會讓少量的冷卻液通過而經由管材蒸散至外界環境。且在蒸散的過程中，流管內的壓強將下降而讓外界空氣中較小的空氣分子(如氦氣)一併經由管材吸引進入流管中而溶解於冷卻液。若溶解的空氣飽和，則會以氣泡的方式存在。這些氣泡存在於冷卻液中，不僅會提高流阻而影響散熱效能，更嚴重的是，若這些氣泡經液冷循環進入泵8，會受到泵8的槳葉的撞擊而產生噪音，且會干擾泵槳葉的轉動而影響泵8的效能，甚至，氣泡會讓槳葉在旋轉時過度晃動而造成槳葉的軸承損壞，進而讓泵8停止運作而縮短了整個液冷系統的使用壽命。Among them, since the material of the flow tube is usually made of Teflon, the length of the chain between the polymers allows a small amount of coolant to pass through and evaporates to the outside environment via the tube. And during the evapotranspiration process, the pressure in the flow tube will drop and the smaller air molecules (such as helium) in the outside air will be absorbed into the flow tube through the tube and dissolved in the coolant. If the dissolved air is saturated, it will exist as bubbles. These bubbles are present in the cooling liquid, which not only increases the flow resistance but also affects the heat dissipation performance. More seriously, if these bubbles enter the pump 8 through the liquid cooling cycle, they will be affected by the impact of the blades of the pump 8 and will cause noise and interfere. The rotation of the pump blade affects the performance of the pump 8. Even the air bubbles cause the blade to excessively sway during rotation, causing damage to the bearing of the blade, thereby stopping the operation of the pump 8 and shortening the service life of the entire liquid cooling system.
為了避免發生前述的問題，本實施例的液冷式散熱系統1a配置有空氣吸附裝置40。空氣吸附裝置40內有多個吸附單元420，每一吸附單元420為一具有超親水-超疏水特性的多孔結構，例如，為具超疏水表面的超疏水-超親水轉換結構，其具有不與冷卻液發生浸潤現象的特色。超疏水表面是指水滴在表面上呈現大接觸角（例如大於150度）的表面。因此，當流過空氣吸附裝置40的冷卻液存有空氣氣泡F(如圖2)，或溶有空氣時，空氣可輕易取代孔洞中的液體，即空氣會被吸收進入這些微小的孔洞內。也就是說，吸附單元420可吸收並容納這些空氣，以確保流出空氣吸附裝置40的冷卻液內不會摻雜空氣氣泡。藉此，除了可防止冷卻液中存有空氣氣泡而影響散熱效能之外，還可防止空氣進入泵而產生噪音，或造成泵損壞的問題發生。在一實施例中，前述具有超親水-超疏水特性的吸附單元可以在其內部充滿冷卻液如水，當水路中有空氣接觸在上面，則發生吸附。其中，使吸附單元內部充滿水的方式可以是：在一實現中，使用超疏水-超親水材料，通過改變外部條件（如光照或磁場），可以在親水-疏水兩種狀態下相互轉換，需要注水時，將材料調整為親水狀態；注水完成後，再將其轉換為疏水狀態；或者在另一實現中，使用疏水材料，且提供一種與之配套的溶質，疏水材料可與溶有一定濃度的此溶質的水親和；當注水完成後，在保證迴路沒有氣泡的情況下，通過例如化學反應或者稀釋降低此溶質濃度。In order to avoid the occurrence of the aforementioned problems, the liquid-cooling heat dissipation system 1a of the present embodiment is provided with an air suction device 40. The air adsorption device 40 has a plurality of adsorption units 420, each adsorption unit 420 is a porous structure having super-hydrophilic-superhydrophobic properties, for example, a superhydrophobic-super-hydrophilic conversion structure having a superhydrophobic surface, which has The characteristic of the infiltration of the coolant. A superhydrophobic surface refers to a surface on which water droplets exhibit a large contact angle (eg, greater than 150 degrees). Therefore, when the coolant flowing through the air adsorbing device 40 contains the air bubbles F (Fig. 2), or when the air is dissolved, the air can easily replace the liquid in the holes, that is, the air is absorbed into the minute holes. That is, the adsorption unit 420 can absorb and accommodate the air to ensure that air bubbles are not doped into the coolant flowing out of the air adsorption device 40. In addition to preventing air bubbles in the coolant from affecting the heat dissipation performance, it is also possible to prevent air from entering the pump to generate noise or cause damage to the pump. In one embodiment, the aforementioned adsorption unit having super-hydrophilic-superhydrophobic characteristics may be filled with a coolant such as water inside, and adsorption occurs when air is contacted in the water path. Wherein, the manner of filling the interior of the adsorption unit with water may be: in an implementation, using a superhydrophobic-super-hydrophilic material, by changing external conditions (such as light or magnetic field), it is possible to convert each other in a hydrophilic-hydrophobic state, requiring When water is injected, the material is adjusted to a hydrophilic state; after the water injection is completed, it is converted into a hydrophobic state; or in another implementation, a hydrophobic material is used, and a matching solute is provided, and the hydrophobic material can be dissolved with a certain concentration. The water affinity of the solute; when the water injection is completed, the solute concentration is lowered by, for example, chemical reaction or dilution, while ensuring that the loop is free of air bubbles.
此外，需聲明的是，本發明並非以空氣吸附裝置40與迴路A之間的連接方式與連接的位置為限。例如於其他實施例中，空氣吸附裝置40也可以位於迴路A外，僅以一開口連通於迴路A。Further, it is to be noted that the present invention is not limited to the connection between the air adsorbing device 40 and the circuit A and the position of the connection. For example, in other embodiments, the air adsorption device 40 may also be located outside of the loop A, with only one opening communicating with the loop A.
接著，請參閱圖3，圖3係為根據本發明之第二實施例所繪示之液冷式散熱系統的示意圖。本實施例提出了一種液冷式散熱系統1b，但由於本實施例的液冷式散熱系統1b與前述實施例的液冷式散熱系統1a相似，故以下僅針對差異處進行說明。Next, please refer to FIG. 3. FIG. 3 is a schematic diagram of a liquid-cooled heat dissipation system according to a second embodiment of the present invention. The present embodiment proposes a liquid-cooled heat dissipation system 1b. However, since the liquid-cooled heat dissipation system 1b of the present embodiment is similar to the liquid-cooled heat dissipation system 1a of the foregoing embodiment, only differences will be described below.
與前述實施例的差異在於，液冷式散熱系統1b還包含有一可變容積腔體50。而第二流管32替換成一第四流管34與一第五流管35。如圖所示，可變容積腔體50兩側分別具有一第三開口50a與一第四開口50b。第四流管34的兩端分別直接連接於空氣吸附裝置40的第二開口410b與可變容積腔體50的第三開口50a，而第五流管35的兩端分別直接連接於可變容積腔體50的第四開口50b與液冷排20的第三接口20a。可知，在此實施例中，可變容積腔體50位於迴路A上。The difference from the foregoing embodiment is that the liquid-cooled heat dissipation system 1b further includes a variable volume chamber 50. The second flow tube 32 is replaced by a fourth flow tube 34 and a fifth flow tube 35. As shown, the variable volume chamber 50 has a third opening 50a and a fourth opening 50b on each side. The two ends of the fourth flow tube 34 are directly connected to the second opening 410b of the air adsorption device 40 and the third opening 50a of the variable volume chamber 50, respectively, and the two ends of the fifth flow tube 35 are directly connected to the variable volume The fourth opening 50b of the cavity 50 and the third interface 20a of the liquid cooling row 20. It can be seen that in this embodiment, the variable volume chamber 50 is located on the loop A.
一種具體實現中，可變容積腔體50外形可以是如一水球般，且是由不具有形變恢復力的材質所構成。可變容積腔體50在冷卻液蒸散而減少的過程中，液冷系統中的冷卻液的量會減少，可變容積腔體50會隨著冷卻液的減少而凹陷扁塌，有助於平衡空氣吸附裝置40吸收氣泡時對迴路A產生的壓力改變。In one implementation, the variable volume cavity 50 may be shaped like a water polo and constructed of a material that does not have a deformation restoring force. During the process in which the variable volume chamber 50 is reduced by the evaporation of the coolant, the amount of the coolant in the liquid cooling system is reduced, and the variable volume chamber 50 is collapsed and collapsed as the coolant is reduced, contributing to the balance. The pressure generated by the air adsorbing device 40 when absorbing air bubbles changes to the circuit A.
另一種具體實現中，可變容積腔體50也可以是採用活塞方式實現，即將圖3所示球狀可變容積腔體50替換為如圖4所示，迴路中增加支路53，其中支路53的一端（即分液路51）連通迴路，另一端設有一開口54直接連通外界大氣，分液路51和開口54之間設有一可滑動活塞52，當迴路內的壓強與外界大氣壓有差異時，活塞52會因受到壓力而活動，直至迴路內外壓力平衡。In another specific implementation, the variable volume cavity 50 can also be implemented by using a piston method, that is, replacing the spherical variable volume cavity 50 shown in FIG. 3 with the addition of a branch 53 in the circuit, as shown in FIG. One end of the road 53 (ie, the liquid separation path 51) communicates with the circuit, and the other end is provided with an opening 54 directly communicating with the outside atmosphere. A slidable piston 52 is disposed between the liquid separation path 51 and the opening 54. When the pressure in the circuit and the external atmospheric pressure are When there is a difference, the piston 52 is activated by the pressure until the pressure is balanced inside and outside the circuit.
由上述可知，在本發明所揭露的液冷式散熱系統中，藉由空氣吸附裝置連通液冷迴路的設計，可吸收進入迴路中的空氣，不僅可防止空氣在迴路中對散熱效能的影響，還可維持泵順暢的運轉，避免泵吸入空氣而產生運轉噪音，更能延長泵的使用壽命。It can be seen from the above that in the liquid-cooled heat dissipating system disclosed in the present invention, the design of the liquid cooling circuit through the air adsorption device can absorb the air entering the circuit, thereby preventing the air from affecting the heat dissipation performance in the circuit. It can also keep the pump running smoothly, avoiding the pump to take in air and generating running noise, which can extend the service life of the pump.
雖然本發明以前述之實施例揭露如上，然其並非用以限定本發明。在不脫離本發明之精神和範圍內，所為之更動與潤飾，均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.
1a、1b‧‧‧液冷散熱系統1a, 1b‧‧‧ liquid cooling system
8‧‧‧泵8‧‧‧ pump
9‧‧‧熱源9‧‧‧heat source
10‧‧‧液冷頭10‧‧‧ liquid cold head
10a‧‧‧第一接口10a‧‧‧ first interface
10b‧‧‧第二接口10b‧‧‧second interface
10s‧‧‧中空容腔10s‧‧‧ hollow cavity
20‧‧‧液冷排20‧‧‧Liquid cooling row
20a‧‧‧第三接口20a‧‧‧ third interface
20b‧‧‧第四接口20b‧‧‧fourth interface
31‧‧‧第一流管31‧‧‧First flow tube
32‧‧‧第二流管32‧‧‧Second flow tube
33‧‧‧第三流管33‧‧‧ Third flow tube
34‧‧‧第四流管34‧‧‧fourth flow tube
35‧‧‧第五流管35‧‧‧ fifth flow tube
40‧‧‧空氣吸附裝置40‧‧‧Air adsorption device
50‧‧‧可變容積腔體50‧‧‧Variable volume chamber
50a‧‧‧第三開口50a‧‧‧ third opening
50b‧‧‧第四開口50b‧‧‧fourth opening
410‧‧‧主腔體410‧‧‧ main cavity
410a‧‧‧第一開口410a‧‧ first opening
410b‧‧‧第二開口410b‧‧‧ second opening
420‧‧‧吸附單元420‧‧‧Adsorption unit
51‧‧‧分液路51‧‧‧Separation road
52‧‧‧可滑動活塞52‧‧‧slidable piston
53‧‧‧支路53‧‧‧ branch road
54‧‧‧開口54‧‧‧ openings
A‧‧‧迴路A‧‧‧ loop
F‧‧‧氣泡F‧‧‧ bubble
圖1係為根據本發明之第一實施例所繪示之液冷式散熱系統的示意圖。 圖2係為圖1的局部放大剖式示意圖。 圖3係為根據本發明之第二實施例所繪示之液冷式散熱系統的示意圖。 圖4係為根據本發明之第二實施例所繪示之液冷式散熱系統中的空氣吸附裝置的示意圖。1 is a schematic view of a liquid-cooled heat dissipation system according to a first embodiment of the present invention. Figure 2 is a partially enlarged cross-sectional view of Figure 1. 3 is a schematic diagram of a liquid-cooled heat dissipation system according to a second embodiment of the present invention. 4 is a schematic view of an air adsorption device in a liquid-cooled heat dissipation system according to a second embodiment of the present invention.
1a‧‧‧液冷散熱系統 1a‧‧‧Liquid cooling system
8‧‧‧泵 8‧‧‧ pump
9‧‧‧熱源 9‧‧‧heat source
10‧‧‧液冷頭 10‧‧‧ liquid cold head
10a‧‧‧第一接口 10a‧‧‧ first interface
10b‧‧‧第二接口 10b‧‧‧second interface
10s‧‧‧中空容腔 10s‧‧‧ hollow cavity
20‧‧‧液冷排 20‧‧‧Liquid cooling row
20a‧‧‧第三接口 20a‧‧‧ third interface
20b‧‧‧第四接口 20b‧‧‧fourth interface
31‧‧‧第一流管 31‧‧‧First flow tube
32‧‧‧第二流管 32‧‧‧Second flow tube
33‧‧‧第三流管 33‧‧‧ Third flow tube
40‧‧‧空氣吸附裝置 40‧‧‧Air adsorption device
410‧‧‧主腔體 410‧‧‧ main cavity
410a‧‧‧第一開口 410a‧‧ first opening
410b‧‧‧第二開口 410b‧‧‧ second opening
420‧‧‧吸附單元 420‧‧‧Adsorption unit
A‧‧‧迴路 A‧‧‧ loop
Claims (7)
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| TW105125642A TWI613541B (en) | 2016-08-11 | 2016-08-11 | Liquid cooling system |
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| Application Number | Priority Date | Filing Date | Title |
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| TW105125642A TWI613541B (en) | 2016-08-11 | 2016-08-11 | Liquid cooling system |
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| Publication Number | Publication Date |
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| TWI613541B true TWI613541B (en) | 2018-02-01 |
| TW201805766A TW201805766A (en) | 2018-02-16 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI654921B (en) | 2018-02-02 | 2019-03-21 | 台達電子工業股份有限公司 | Liquid-cooling device having liquid-gas isolation mechanism |
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| TWI725422B (en) * | 2018-05-31 | 2021-04-21 | 技嘉科技股份有限公司 | Liquid cooling device, coolant circulation system , and liquid leaking detection method |
| CN109933176A (en) * | 2019-03-28 | 2019-06-25 | 东莞市建鑫电子科技有限公司 | A piston decompression structure for a water-cooled radiator and a water-cooled radiator |
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| CN1601731A (en) * | 2003-09-25 | 2005-03-30 | 株式会社日立制作所 | Cooling module |
| CN101439235A (en) * | 2007-11-22 | 2009-05-27 | 东京毅力科创株式会社 | Gas-liquid separating device |
| TWM500843U (en) * | 2014-10-30 | 2015-05-11 | Cooler Master Co Ltd | Water replenishing structure of liquid cooling device, pump and liquid cooling device with the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1601731A (en) * | 2003-09-25 | 2005-03-30 | 株式会社日立制作所 | Cooling module |
| CN101439235A (en) * | 2007-11-22 | 2009-05-27 | 东京毅力科创株式会社 | Gas-liquid separating device |
| TWM500843U (en) * | 2014-10-30 | 2015-05-11 | Cooler Master Co Ltd | Water replenishing structure of liquid cooling device, pump and liquid cooling device with the same |
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| TWI654921B (en) | 2018-02-02 | 2019-03-21 | 台達電子工業股份有限公司 | Liquid-cooling device having liquid-gas isolation mechanism |
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