TWI612331B - Device for modulating light intensity - Google Patents
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Abstract
一種光強度調變裝置包含一光源模組以及一全像繞射模組。全像繞射模組用以產生一干涉全像圖案,以繞射光源模組所提供重建光,並形成具有一第一光強度分佈之一第一聚焦影像以及具有一第二光強度分佈之一第二聚焦影像。第一以及第二聚焦影像部分重疊,以形成具有一第三光強度分佈之一第三聚焦影像,其中第三光強度分佈大於第一光強度分佈以及第二光強度分佈。上述之光強度調變裝置可藉由控制第三聚焦影像之位置以及尺寸精確定義加工位置,以利光束加工應用。A light intensity modulation device includes a light source module and a holographic diffraction module. The holographic diffraction module is configured to generate an interference holographic pattern to diffract the reconstructed light provided by the light source module, and form a first focused image having a first light intensity distribution and having a second light intensity distribution A second focused image. The first and second focused images partially overlap to form a third focused image having a third light intensity distribution, wherein the third light intensity distribution is greater than the first light intensity distribution and the second light intensity distribution. The above-mentioned light intensity modulation device can accurately define the processing position by controlling the position and size of the third focused image to facilitate beam processing applications.
Description
本發明是有關一種調變裝置,特別是一種光強度調變裝置。 The invention relates to a modulation device, in particular to a light intensity modulation device.
多光子吸收(multi photon absorption)原理是將適當之材料在受到足夠之光強度照射後固化成所設計之圖案。習知之光束加工裝置是利用鏡片式之光學透鏡來聚焦光源,使聚焦之光斑之光強度大於一閥值以固化材料。然而,為了形成特定之圖案,必須以適當之掃描機構使聚焦之光斑掃描加工區之材料,如此導致生產量(throughput)無法有效提升。 The principle of multi photon absorption is to cure a suitable material into a designed pattern after being exposed to sufficient light intensity. Conventional beam processing devices utilize a lens-type optical lens to focus the light source such that the intensity of the focused spot is greater than a threshold to cure the material. However, in order to form a particular pattern, the focused spot must be scanned with the material of the processing zone with a suitable scanning mechanism, thus resulting in an inefficient increase in throughput.
另一種光束加工裝置是以全像技術產生具有空間體積之立體實像,以使立體實像區域內之材料固化以形成特定之圖案。然而,受限於成像解析度以及相位階數、深度以及像素大小之調變自由度的限制,導致繞射效率無法精確控制,進而造成產品解析度不佳或甚至錯誤加工的問題。 Another beam processing apparatus produces a stereoscopic image having a spatial volume using a holographic technique to cure a material in a solid image area to form a particular pattern. However, limited by the resolution of the imaging and the degree of freedom of the phase order, the depth, and the modulation of the pixel size, the diffraction efficiency cannot be accurately controlled, resulting in poor product resolution or even erroneous processing.
有鑑於此,如何提升光束加工裝置之生產量以及精確定義加工位置便是目前極需努力的目標。 In view of this, how to increase the throughput of the beam processing device and precisely define the processing position is the current goal.
本發明提供一種光強度調變裝置,其是利用至少一干涉全像圖案形成部分重疊之多個聚焦影像,以獲得光強度分佈較高之重疊影像區域,藉由控 制重疊影像區域之位置以及尺寸,即可精確定義加工位置而有利於光束加工之應用。 The present invention provides a light intensity modulation device that forms a plurality of focused images that are partially overlapped by using at least one interference holographic pattern to obtain an overlapping image region with a high light intensity distribution, by controlling By adjusting the position and size of the image area, it is possible to precisely define the processing position and facilitate the application of beam processing.
本發明一實施例之光強度調變裝置包含一光源模組以及一全像繞射模組。光源模組用以提供一重建光。全像繞射模組用以產生一干涉全像圖案,以繞射重建光,並形成具有一第一光強度分佈之一第一聚焦影像以及具有一第二光強度分佈之一第二聚焦影像,其中,第二聚焦影像與第一聚焦影像部分重疊,以形成具有一第三光強度分佈之一第三聚焦影像,且第三光強度分佈大於第一光強度分佈以及第二光強度分佈。 The light intensity modulation device according to an embodiment of the invention comprises a light source module and a holographic diffraction module. The light source module is used to provide a reconstructed light. The holographic diffraction module is configured to generate an interference holographic pattern to diffract the reconstructed light and form a first focused image having a first light intensity distribution and a second focused image having a second light intensity distribution The second focused image partially overlaps the first focused image to form a third focused image having a third light intensity distribution, and the third light intensity distribution is greater than the first light intensity distribution and the second light intensity distribution.
以下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。 The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the appended claims.
11‧‧‧發光單元 11‧‧‧Lighting unit
11a、11b‧‧‧光源模組 11a, 11b‧‧‧ light source module
12a、12b‧‧‧第一全像繞射模組 12a, 12b‧‧‧ first hologram diffraction module
121a~121c‧‧‧全像片 121a~121c‧‧‧All-in-one film
122‧‧‧滾輪 122‧‧‧Roller
123‧‧‧轉盤 123‧‧‧ Turntable
13‧‧‧控制元件 13‧‧‧Control elements
14‧‧‧分光器 14‧‧‧ Spectroscope
15a、15b‧‧‧擴束器 15a, 15b‧‧ ‧ beam expander
16a、16b‧‧‧光學掃描模組 16a, 16b‧‧‧ optical scanning module
IM1、IM1’‧‧‧第一聚焦影像 IM1, IM1'‧‧‧ first focused image
IM2‧‧‧第二聚焦影像 IM2‧‧‧Second focus image
IM3‧‧‧第三聚焦影像 IM3‧‧‧ third focused image
RLa、RLb‧‧‧重建光 RLa, RLb‧‧‧ reconstructed light
RLa’、RLb’‧‧‧重建光 RLa’, RLb’‧‧‧Reconstruction of light
S81~S83‧‧‧步驟 S81~S83‧‧‧Steps
圖1為一示意圖,顯示本發明第一實施例之光強度調變裝置。 Fig. 1 is a schematic view showing a light intensity modulation device according to a first embodiment of the present invention.
圖2為一示意圖,顯示本發明一實施例之光強度調變裝置之光強度分佈。 Fig. 2 is a schematic view showing the light intensity distribution of the light intensity modulation device according to an embodiment of the present invention.
圖3為一示意圖,顯示本發明一實施例之光強度調變裝置之全像繞射模組。 3 is a schematic view showing a holographic diffraction module of a light intensity modulation device according to an embodiment of the present invention.
圖4為一示意圖,顯示本發明另一實施例之光強度調變裝置之全像繞射模組。 4 is a schematic view showing a holographic diffraction module of a light intensity modulation device according to another embodiment of the present invention.
圖5為一示意圖,顯示本發明第二實施例之光強度調變裝置。 Fig. 5 is a schematic view showing a light intensity modulation device according to a second embodiment of the present invention.
圖6為一示意圖,顯示本發明第三實施例之光強度調變裝置。 Figure 6 is a schematic view showing a light intensity modulation device according to a third embodiment of the present invention.
圖7為一示意圖,顯示本發明另一實施例之光強度調變裝置之聚焦影像。 Fig. 7 is a schematic view showing a focused image of a light intensity modulation device according to another embodiment of the present invention.
以下將詳述本發明之各實施例,並配合圖式作為例示。除了這些詳細說明之外,本發明亦可廣泛地施行於其它的實施例中,任何所述實施例的輕易替代、修改、等效變化都包含在本發明之範圍內,並以申請專利範圍為準。在說明書的描述中,為了使讀者對本發明有較完整的瞭解,提供了許多特定細節;然而,本發明可能在省略部分或全部特定細節的前提下,仍可實施。此外,眾所周知的步驟或元件並未描述於細節中,以避免對本發明形成不必要之限制。圖式中相同或類似之元件將以相同或類似符號來表示。特別注意的是,圖式僅為示意之用,並非代表元件實際之尺寸或數量,有些細節可能未完全繪出,以求圖式之簡潔。 The embodiments of the present invention will be described in detail below with reference to the drawings. In addition to the detailed description, the present invention may be widely practiced in other embodiments, and any alternatives, modifications, and equivalent variations of the described embodiments are included in the scope of the present invention. quasi. In the description of the specification, numerous specific details are set forth in the description of the invention. In addition, well-known steps or elements are not described in detail to avoid unnecessarily limiting the invention. The same or similar elements in the drawings will be denoted by the same or similar symbols. It is to be noted that the drawings are for illustrative purposes only and do not represent the actual dimensions or quantities of the components. Some of the details may not be fully drawn in order to facilitate the simplicity of the drawings.
請參照圖1,本發明之一實施例之光強度調變裝置包含一光源模組、一第一全像繞射模組12a以及一第二全像繞射模組12b。於圖1所示之實施例中,光源模組包含多個發光單元11a、11b。發光單元11a、11b可提供重建光RLa、RLb,以分別照射第一全像繞射模組12a以及第二全像繞射模組12b。於一實施例中,重建光RLa、RLb具有同調性或部分同調性,較佳者,重建光RLa、RLb可為一飛秒雷射(femtosecond laser)。於一實施例中,光源模組包含一雷射二極體或一發光二極體。 Referring to FIG. 1, a light intensity modulation device according to an embodiment of the present invention includes a light source module, a first hologram diffraction module 12a, and a second hologram diffraction module 12b. In the embodiment shown in FIG. 1, the light source module includes a plurality of light emitting units 11a, 11b. The light emitting units 11a, 11b can provide the reconstructed light RLa, RLb to illuminate the first hologram diffraction module 12a and the second hologram diffraction module 12b, respectively. In one embodiment, the reconstructed light RLa, RLb has coherence or partial homology. Preferably, the reconstructed light RLa, RLb may be a femtosecond laser. In one embodiment, the light source module includes a laser diode or a light emitting diode.
第一全像繞射模組12a用以產生一第一干涉全像圖案,以繞射重建光RLa,並形成具有一第一光強度分佈之一第一聚焦影像IM1。同樣的,第二全像繞射模組12b用以產生一第二干涉全像圖案,以繞射重建光RLb,並形成具有一第二光強度分佈之一第二聚焦影像IM2。如圖1所示,第一聚焦影像IM1以及第二聚焦影像IM2部分重疊,即可形成具有一第三光強度分佈之一第三聚焦影像IM3,如圖1所示之陰影區域,其中,第三聚焦影像IM3之第三光強度分佈大於第一聚焦影像IM1之第一光強度分佈以及第二聚焦影像IM2之第二光強度分佈。可以理解的是,發光單元11a、11b提供不同波長範圍之重建光RLa、RLb亦可實現 本發明。舉例而言,發光單元11a、11b提供不同波長範圍之重建光RLa、RLb分別照射第一全像繞射模組12a以及第二全像繞射模組12b,即可形成不同波長範圍之第一聚焦影像IM1以及第二聚焦影像IM2。 The first hologram diffraction module 12a is configured to generate a first interference holographic pattern to diffract the reconstructed light RLa and form a first focused image IM1 having a first light intensity distribution. Similarly, the second hologram diffraction module 12b is configured to generate a second interference hologram pattern to diffract the reconstructed light RLb and form a second focused image IM2 having a second light intensity distribution. As shown in FIG. 1 , the first focused image IM1 and the second focused image IM2 are partially overlapped to form a third focused image IM3 having a third light intensity distribution, as shown in FIG. 1 . The third light intensity distribution of the three-focus image IM3 is greater than the first light intensity distribution of the first focused image IM1 and the second light intensity distribution of the second focused image IM2. It can be understood that the light-emitting units 11a, 11b can provide the reconstructed light RLa, RLb of different wavelength ranges. this invention. For example, the light-emitting units 11a, 11b provide different wavelength ranges of the reconstructed light RLa, RLb respectively illuminating the first hologram diffraction module 12a and the second hologram diffraction module 12b, thereby forming the first of different wavelength ranges. The image IM1 and the second focused image IM2 are focused.
需注意的是,圖1所示之實施例是以第一全像繞射模組12a以及第二全像繞射模組12b分別產生第一聚焦影像IM1以及第二聚焦影像IM2。但不限於此,於一實施例中,第一聚焦影像IM1以及第二聚焦影像IM2亦能夠以單一之全像繞射模組形成。舉例而言,單一之全像繞射模組產生包含第一干涉全像圖案以及第二干涉全像圖案之干涉全像圖案,如此即可形成聚焦位置相異且部分重疊之第一聚焦影像IM1以及第二聚焦影像IM2。可以理解的是,以三組或三組以上之光源模組以及全像繞射模組亦可實現本發明,且未脫離本發明之專利範圍。 It should be noted that, in the embodiment shown in FIG. 1, the first focused image IM1 and the second focused image IM2 are respectively generated by the first hologram diffraction module 12a and the second hologram diffraction module 12b. However, the first focused image IM1 and the second focused image IM2 can also be formed by a single holographic diffraction module. For example, a single holographic diffraction module generates an interference hologram pattern including a first interference hologram pattern and a second interference hologram pattern, so that a first focus image IM1 with different focus positions and partial overlaps can be formed. And a second focused image IM2. It will be understood that the present invention can be implemented in three or more sets of light source modules and holographic diffraction modules without departing from the scope of the invention.
請參照圖2,其顯示圖1所示之第一聚焦影像IM1、第二聚焦影像IM2以及第三聚焦影像IM3沿線段OO’之光強度分佈。由於第一聚焦影像IM1以及第二聚焦影像IM2是利用全像技術所形成,因此,第一聚焦影像IM1以及第二聚焦影像IM2至少其中之一於聚焦位置可為較為均勻之光強度分佈。於一實施例中,第一聚焦影像IM1或第二聚焦影像IM2之均勻光強度分佈有別於透鏡式光學元件所形成具有高斯分佈之光強度分佈。舉例而言,第一聚焦影像IM1從點A1至點A2大部分為均勻之光強度分佈,第二聚焦影像IM2從點B1至點B2大部分亦為均勻之光強度分佈,因此,第一聚焦影像IM1以及第二聚焦影像IM2重疊後所形成之第三聚焦影像IM3,其從點A1至點B2之光強度分佈大於第一聚焦影像IM1之第一光強度分佈以及第二聚焦影像IM2之第二光強度分佈。於一實施例中,第一聚焦影像IM1之第一光強度分佈以及第二聚焦影像IM2之第二光強度分佈小於一閥值,而第三聚焦影像IM3之光強度分佈大於閥值,如此即可藉由控制第三聚焦影像IM3之位置以及尺寸精確定義加工位置,以進行較精準的光束加工應用, 而光強度分佈小於閥值之第一聚焦影像IM1以及第二聚焦影像IM2則不會固化材料且不會影響到第三聚焦影像IM3的加工操作。 Referring to FIG. 2, the light intensity distribution along the line segment OO' of the first focused image IM1, the second focused image IM2, and the third focused image IM3 shown in FIG. 1 is displayed. Since the first focused image IM1 and the second focused image IM2 are formed by using the holographic technique, at least one of the first focused image IM1 and the second focused image IM2 may have a relatively uniform light intensity distribution at the focus position. In one embodiment, the uniform light intensity distribution of the first focused image IM1 or the second focused image IM2 is different from the light intensity distribution formed by the lenticular optical element having a Gaussian distribution. For example, the first focused image IM1 is mostly a uniform light intensity distribution from point A1 to point A2, and the second focused image IM2 is also a uniform light intensity distribution from point B1 to point B2. Therefore, the first focus is The third focused image IM3 formed by the overlapping of the image IM1 and the second focused image IM2 has a light intensity distribution from the point A1 to the point B2 that is greater than the first light intensity distribution of the first focused image IM1 and the second focused image IM2. Two light intensity distribution. In one embodiment, the first light intensity distribution of the first focused image IM1 and the second light intensity distribution of the second focused image IM2 are less than a threshold, and the light intensity distribution of the third focused image IM3 is greater than a threshold, thus By precisely controlling the position and size of the third focused image IM3, the machining position can be accurately defined for more precise beam processing applications. The first focused image IM1 and the second focused image IM2 whose light intensity distribution is smaller than the threshold will not solidify the material and will not affect the processing operation of the third focused image IM3.
請再參照圖1,於一實施例中,第一全像繞射模組12a以及第二全像繞射模組12b至少其中之一包含一空間光調制器以及一控制元件13,其中控制元件13與空間光調制器電性連接。舉例而言,空間光調制器可為一相位式矽基液晶面板。於圖1所示之實施例中,第一全像繞射模組12a以及第二全像繞射模組12b之空間光調制器為透射式全像繞射模組。控制元件13可控制第一全像繞射模組12a所產生的第一干涉全像圖案或第二全像繞射模組12b所產生的第二干涉全像圖案,以依時間序列產生多個子聚焦影像,而第一聚焦影像IM1或第二聚焦影像IM2則是由多個子聚焦影像依時間序列重疊所形成,如此可獲得較為均勻的光強度分佈。 Referring to FIG. 1 again, in an embodiment, at least one of the first hologram diffraction module 12a and the second hologram diffraction module 12b includes a spatial light modulator and a control component 13, wherein the control component 13 is electrically connected to the spatial light modulator. For example, the spatial light modulator can be a phase-based germanium-based liquid crystal panel. In the embodiment shown in FIG. 1, the spatial light modulators of the first hologram diffraction module 12a and the second hologram diffraction module 12b are transmissive holographic diffraction modules. The control element 13 can control the first interference hologram pattern generated by the first hologram diffraction module 12a or the second interference hologram pattern generated by the second hologram diffraction module 12b to generate a plurality of sub-sequences in time series. The image is focused, and the first focused image IM1 or the second focused image IM2 is formed by overlapping a plurality of sub-focused images in time series, so that a relatively uniform light intensity distribution can be obtained.
於一實施例中,控制元件13亦可控制第一全像繞射模組12a所產生的第一干涉全像圖案或第二全像繞射模組12b所產生的第二干涉全像圖案,以使第一聚焦影像IM1或第二聚焦影像IM2的聚焦位置移動。換言之,控制元件13可藉由控制第一全像繞射模組12a所產生的第一干涉全像圖案或第二全像繞射模組12b所產生的第二干涉全像圖案來移動第一聚焦影像IM1或第二聚焦影像IM2,進而達到掃描加工材料的目的。 In an embodiment, the control component 13 can also control the first interference hologram pattern generated by the first hologram diffraction module 12a or the second interference hologram pattern generated by the second hologram diffraction module 12b. The focus position of the first focused image IM1 or the second focused image IM2 is moved. In other words, the control element 13 can move the first by controlling the first interference hologram pattern generated by the first hologram diffraction module 12a or the second interference hologram pattern generated by the second hologram diffraction module 12b. The image IM1 or the second focused image IM2 is focused to achieve the purpose of scanning the processed material.
請參照圖3,於一實施例中,以第一全像繞射模組12a為例,第一全像繞射模組12a可包含多個靜態之全像片121a、121b、121c以及一驅動模組(例如滾輪122)。藉由滾輪122驅動多個全像片121a、121b、121c依序通過重建光RLa的照射範圍亦可產生多個子聚焦影像。同樣的,多個子聚焦影像依序重疊即可形成光強度分佈較為均勻的第一聚焦影像IM1。於另一實施例中,請參照圖4,驅動模組可為一轉盤123,而藉由轉盤123可驅動多個全像片121a、121b、121c依序通過重建光RLa的照射範圍而產生多個子聚焦影像,並依序重疊成光強度分佈較 為均勻的第一聚焦影像IM1。可以理解的是,藉由不同的全像片121a、121b、121c設計以及驅動模組驅動全像片121a、121b、121c,可使第一聚焦影像IM1的聚焦位置移動,而達到掃描加工材料的目的。 Referring to FIG. 3 , in an embodiment, taking the first hologram diffraction module 12 a as an example, the first hologram diffraction module 12 a may include a plurality of static full images 121 a , 121 b , 121 c and a drive. Module (eg, wheel 122). A plurality of sub-focus images may also be generated by the roller 122 driving the plurality of holograms 121a, 121b, 121c sequentially through the illumination range of the reconstructed light RLa. Similarly, the plurality of sub-focus images are sequentially superposed to form a first focused image IM1 having a relatively uniform light intensity distribution. In another embodiment, referring to FIG. 4, the driving module can be a turntable 123, and the plurality of full-image pieces 121a, 121b, and 121c can be driven by the turntable 123 to sequentially generate the illumination range of the reconstructed light RLa. The images are focused and overlapped in order to form a light intensity distribution. It is a uniform first focused image IM1. It can be understood that by designing the holograms 121a, 121b, and 121c and driving the holograms 121a, 121b, and 121c, the focus position of the first focus image IM1 can be moved to scan the processed material. purpose.
請參照圖5,於一實施例中,光源模組可包含一發光單元11以及一分光器14。發光單元可為一雷射二極體或一發光二極體,其用以提供重建光。分光器14設置於發光單元11之一出光側,用以將重建光分成多束重建光RLa、RLb,並使重建光RLa、RLb分別照射第一全像繞射模組12a以及第二全像繞射模組12b。於圖5所示之實施例中,第一全像繞射模組12a以及第二全像繞射模組12b為一反射式全像繞射模組。舉例而言,分光器14可為一偏振分光器(polarization beam splitter,PBS)。於一實施例中,本發明之光強度調變裝置更包含至少一擴束器(beam expander)15a、15b,其設置於第一全像繞射模組12a以及第二全像繞射模組12b至少其中之一之入光光路。擴束器(beam expander)15a、15b可增加重建光RLa’、RLb’的照射範圍,亦即從擴束器15a、15b出射之重建光RLa’、RLb’之光束截面積大於入射至擴束器15a、15b之重建光RLa、RLb之光束截面積。 Referring to FIG. 5 , in an embodiment, the light source module can include a light emitting unit 11 and a beam splitter 14 . The light emitting unit can be a laser diode or a light emitting diode for providing reconstructed light. The beam splitter 14 is disposed on one light emitting side of the light emitting unit 11 for dividing the reconstructed light into the plurality of reconstructed lights RLa, RLb, and causing the reconstructed lights RLa, RLb to respectively illuminate the first hologram diffraction module 12a and the second hologram The diffraction module 12b. In the embodiment shown in FIG. 5, the first hologram diffraction module 12a and the second hologram diffraction module 12b are a reflective hologram diffraction module. For example, the beam splitter 14 can be a polarization beam splitter (PBS). In one embodiment, the light intensity modulation device of the present invention further includes at least one beam expander 15a, 15b disposed on the first hologram diffraction module 12a and the second hologram diffraction module. At least one of 12b enters the light path. The beam expanders 15a, 15b can increase the illumination range of the reconstructed light RLa', RLb', that is, the reconstructed light RLa', RLb' emitted from the beam expanders 15a, 15b has a larger beam cross-sectional area than the incident to the expanded beam The beam cross-sectional areas of the reconstructed lights RLa, RLb of the devices 15a, 15b.
前述之實施例中,第一聚焦影像或第二聚焦影像之聚焦位置是藉由不同的干涉全像圖案所實現,但不限於此。請參照圖6,於一實施例中,本發明之光強度調變裝置更包含至少一光學掃描模組16a、16b,其設置於第一全像繞射模組12a以及第二全像繞射模組12b至少其中之一之一出光側。光學掃描模組16a、16b可為反射式或折射式之機械掃描光學元件,以移動第一聚焦影像IM1以及第二聚焦影像IM2至少其中之一之聚焦位置,而達到掃描加工材料的目的。舉例而言,光學掃描模組16a可將第一聚焦影像IM1之聚焦位置移動至第一聚焦影像IM1’之聚焦位置。 In the foregoing embodiments, the focus position of the first focused image or the second focused image is achieved by different interference holographic patterns, but is not limited thereto. Referring to FIG. 6, in an embodiment, the light intensity modulation device of the present invention further includes at least one optical scanning module 16a, 16b disposed on the first hologram diffraction module 12a and the second hologram diffraction. At least one of the modules 12b exits the light side. The optical scanning module 16a, 16b can be a reflective or refractive mechanical scanning optical element to move the focus position of at least one of the first focused image IM1 and the second focused image IM2 to achieve the purpose of scanning the processed material. For example, the optical scanning module 16a can move the focus position of the first focused image IM1 to the focus position of the first focused image IM1'.
由前述說明可知,本發明能夠藉由調整第一聚焦影像IM1之第一光強度分佈以及第二聚焦影像IM2之第二光強度分佈,以獲得光強度分佈較強之 第三聚焦影像IM3。因此,依據上述結構,本發明能夠以具有空間體積之立體實像固化材料。可以理解的是,依據不同的加工需求,第一聚焦影像IM1、第二聚焦影像IM2以及第三聚焦影像IM3任一者可為一點影像、一維影像、二維影像或具有空間體積之立體影像。舉例而言,如圖7所示,第一聚焦影像IM1為實線繪製之較大環型影像,而第二聚焦影像IM2為虛線繪製之較小環型影像,第一聚焦影像IM1之內側與第二聚焦影像IM2之外側彼此部分重疊即可形成較小之環型第三聚焦影像IM3。因此,若第三聚焦影像IM3為點影像,則可逐點掃描以獲得立體之加工物件;若第三聚焦影像IM3為平面影像,則可逐層掃描以獲得立體之加工物件。 It can be seen from the foregoing description that the present invention can obtain a strong light intensity distribution by adjusting the first light intensity distribution of the first focused image IM1 and the second light intensity distribution of the second focused image IM2. The third focused image IM3. Therefore, according to the above structure, the present invention can be a solid-state solidified material having a space volume. It can be understood that any one of the first focused image IM1, the second focused image IM2, and the third focused image IM3 can be a point image, a one-dimensional image, a two-dimensional image, or a stereoscopic image with a spatial volume according to different processing requirements. . For example, as shown in FIG. 7 , the first focused image IM1 is a larger ring image drawn by a solid line, and the second focused image IM2 is a smaller ring image drawn by a broken line, and the inner side of the first focused image IM1 is The outer sides of the second focused image IM2 partially overlap each other to form a smaller ring-shaped third focused image IM3. Therefore, if the third focused image IM3 is a point image, the image can be scanned point by point to obtain a three-dimensional processed object; if the third focused image IM3 is a planar image, the layered image can be scanned layer by layer to obtain a three-dimensional processed object.
綜合上述,本發明之光強度調變裝置利用至少一干涉全像圖案形成部分重疊之多個聚焦影像,以獲得光強度分佈較高之重疊影像區域。因此,本發明不僅可簡單控制重疊影像區域之光強度分佈,且可藉由控制重疊影像區域之位置以及尺寸精確定義加工位置而有利於光束加工之應用。 In summary, the light intensity modulation device of the present invention forms a plurality of focused images partially overlapping by using at least one interference hologram pattern to obtain overlapping image regions having a high light intensity distribution. Therefore, the present invention not only can easily control the light intensity distribution of the overlapping image area, but also can favor the application of the beam processing by precisely controlling the position and size of the overlapping image area to accurately define the processing position.
以上所述之實施例僅是為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即大凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。 The embodiments described above are only intended to illustrate the technical idea and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.
11a、11b‧‧‧光源模組 11a, 11b‧‧‧ light source module
12a、12b‧‧‧第一全像繞射模組 12a, 12b‧‧‧ first hologram diffraction module
13‧‧‧控制元件 13‧‧‧Control elements
RLa、RLb‧‧‧重建光 RLa, RLb‧‧‧ reconstructed light
IM1‧‧‧第一聚焦影像 IM1‧‧‧ first focused image
IM2‧‧‧第二聚焦影像 IM2‧‧‧Second focus image
IM3‧‧‧第二聚焦影像 IM3‧‧‧Second focus image
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| WO2001096962A2 (en) * | 2000-06-15 | 2001-12-20 | 3M Innovative Properties Company | Multiphoton absorption method using patterned light |
| US6624915B1 (en) * | 2000-03-16 | 2003-09-23 | Science Applications International Corporation | Holographic recording and micro/nanofabrication via ultrafast holographic two-photon induced photopolymerization (H-TPIP) |
| US20040012872A1 (en) * | 2001-06-14 | 2004-01-22 | Fleming Patrick R | Multiphoton absorption method using patterned light |
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| US6624915B1 (en) * | 2000-03-16 | 2003-09-23 | Science Applications International Corporation | Holographic recording and micro/nanofabrication via ultrafast holographic two-photon induced photopolymerization (H-TPIP) |
| WO2001096962A2 (en) * | 2000-06-15 | 2001-12-20 | 3M Innovative Properties Company | Multiphoton absorption method using patterned light |
| US20040012872A1 (en) * | 2001-06-14 | 2004-01-22 | Fleming Patrick R | Multiphoton absorption method using patterned light |
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