TWI608215B - Method of menufacturing heat transfer module - Google Patents

Description

Thermal module manufacturing method

The invention relates to a heat conduction technology, in particular to a heat conduction module structure and a manufacturing method thereof.

As the computing speed of electronic components continues to increase, the heat generated by them is becoming higher and higher. In order to effectively solve the problem of high heat generation, the industry has widely used uniform temperature plates and heat pipes with good thermal conductivity characteristics. However, such a temperature equalizing plate and a heat pipe have room for improvement, such as heat conductivity, production cost, and ease of manufacture.

The conventional uniform temperature plate and heat pipe assembly structure mainly sets the heat pipe on the temperature equalization plate, and the internal spaces of the two are not connected to each other, and only the heat conduction method can be used for heat conduction and dissipation, and the foregoing structure is The uniform temperature plate and the heat pipe uniform temperature effect cannot be achieved, and the heat conduction effect is greatly reduced. In order to solve the above problems, the industry has a perforation for the connection of the heating pipe on the temperature equalizing plate. However, in the manufacturing process, there are problems such as cumbersome and complicated processes, and the circulation effect of the internal working fluid is also poor, which needs to be improved.

An object of the present invention is to provide a heat conduction module structure and a manufacturing method thereof, which can not only simplify the process but also effectively improve the heat conduction and heat dissipation performance.

In order to achieve the above object, the present invention provides a method for manufacturing a heat conduction module, the steps comprising: a) preparing a metal plate, forming a perforation and a ring wall for the metal plate; b) preparing a heat pipe, Forming a first segment and a second segment to the heat pipe, the first segment having an opening; c) erecting the heat pipe corresponding to the ring wall to communicate the opening with the through hole; d) placing a core a rod is inserted from the perforation and blocked by the second section; e) a metal powder is filled from the perforation to form an outer periphery of the mandrel; f) a semi-finished product of step e) is subjected to a sintering process, thereby Forming a porous sintered structure between the perforations and the first section, and forming an upper casing; g) preparing a casing, sealing the lower casing to the upper casing; and h) The semi-finished product of step g) is subjected to a liquid filling and a degassing sealing process.

In order to achieve the above object, the present invention provides a heat conducting module structure comprising a temperature equalizing plate, a heat pipe, a porous sintered structure and a working fluid, the temperature equalizing plate comprising a lower casing and a corresponding lower casing An upper casing of the sealing connection, a cavity is formed between the upper casing and the lower casing, the upper casing is provided with a perforation and a ring wall extending from the periphery of the perforation; the heat pipe has a first a segment and a second segment extending from the first segment, the first segment having an inner diameter greater than the inner diameter of the second segment, the first segment having an opening, the heat pipe corresponding to the opening Standing and communicating with the perforation; the porous sintered structure is formed between the perforation and the first section; the working fluid is filled in the cavity.

The present invention also has the effect of connecting the first capillary structure and the second capillary structure by the porous sintered structure, thereby achieving a good circulation effect of the internal working fluid.

10‧‧‧Wall plate

11a‧‧‧Metal sheet

11‧‧‧Upper casing

111‧‧‧Perforation

112‧‧‧Circle wall

12‧‧‧ Lower case

13‧‧‧First capillary tissue

14‧‧‧ Third capillary tissue

A‧‧‧ cavity

20‧‧‧heat pipe

21‧‧‧ first paragraph

211‧‧‧ openings

22‧‧‧ second paragraph

23‧‧‧Second capillary tissue

24‧‧‧closed end

30‧‧‧Porous sintered structure

40‧‧‧Working fluid

8‧‧‧ mandrel

9‧‧‧Metal powder

a~h‧‧‧step

Figure 1 is a flow chart of the method of the present invention.

Figure 2 is a cross-sectional view of a metal plate of the present invention.

Figure 3 is a cross-sectional view showing the metal sheet of the present invention after being formed.

Figure 4 is a cross-sectional view showing the heat pipe of the present invention after forming.

Figure 5 is a cross-sectional view showing a combination of a metal plate, a heat pipe and a mandrel of the present invention.

Figure 6 is a cross-sectional view showing the inner wall of the metal powder of the present invention filled with perforations and metal sheets.

Figure 7 is a cross-sectional view showing the upper housing and the lower upper housing of the present invention.

Figure 8 is a cross-sectional view showing another embodiment of the present invention.

The detailed description and technical content of the present invention are set forth in the accompanying drawings.

Referring to FIG. 1 to FIG. 7 , the present invention provides a method for manufacturing a heat conduction module, the steps of which include:

a) preparing a metal plate 11a, forming a through hole 111 and a ring wall 112 for the metal plate 11a; as shown in FIG. 2 and FIG. 3, the metal plate 11a in this step may be made of aluminum, copper or an alloy thereof. Forming a punching and extending process for the metal plate 11a by a molding die (not shown) to form a plurality of through holes 111 and a ring wall 112 extending from the periphery of each of the through holes 111, respectively, on the metal plate 11a. The number of perforations 111 can be selected according to actual needs, and the micro heat sink can also be set by a single through hole 111.

b) preparing a heat pipe 20, the heat pipe 20 is processed to form a first section 21 and a second section 22, the first section 21 has an opening 211; see Figure 4, step b) can be before step a) Or after the execution, the heat pipe 20 in this step may be made of aluminum, copper or an alloy thereof, wherein the processing method may be a process of expanding or shrinking, and the expansion process is the first section of the inner diameter of the heat pipe 20 The enlargement processing is performed such that the inner diameter of the first section 21 is larger than the inner diameter of the second section 22. The shrinkage process is to reduce the inner diameter of the second section 22 of the heat pipe 20 such that the inner diameter of the first section 21 is greater than the inner diameter of the second section 22. The length of the first segment 21 is generally between 0.5 and 10 mm. The first end of the first segment 21 has an opening 211. The inside of the heat pipe 20 is provided with a second capillary structure 23, and the second capillary structure 23 can be A metal woven mesh, a porous powder sinter or groove; and a closed end 24 is formed at the end of the second section 22.

c) the heat pipe 20 is erected corresponding to the ring wall 112, so that the opening 211 is in communication with the through hole 11; as shown in FIG. 5, this step is to apply an adhesive (such as tin) to the outer peripheral wall of the first section 21 of the heat pipe 20. After the paste is not shown, the first section 21 of the heat pipe 20 is connected to the annular wall 112 so that the opening 211 and the through hole 111 communicate with each other. The first section 21 of this embodiment is accommodated in the ring wall. 112 internal.

d) inserting a mandrel 8 from the perforation 111 and being blocked by the second section 22; as shown in FIG. 5, this step is to insert a mandrel 8 from the perforation 111 and the first section 21 of the heat pipe 20 into the opening 211. And positioned by the aforementioned second segment 22 to locate.

e) a metal powder 9 is filled from the perforations 111 to be formed around the outer periphery of the mandrel 8; as shown in Fig. 6, this step is to fill a metal powder 9 from the perforations 111 to form around the outer periphery of the mandrel 8 and The metal powder 9 may be sprinkled between the inner walls of the first section 21 of the heat pipe 20 at the same time as the inner wall of the metal plate 10, thereby forming a first capillary structure 13, which is a porous structure. Powder sinter.

f) performing a sintering process on the semi-finished product of step e) to form a porous sintered structure 30 between the perforations 111 to the first section 21 and forming an upper casing 11; see FIG. The semi-finished product which has been filled with the metal powder 9 and sprinkled with the metal powder 9 is sent to a heating device (not shown) for sintering, and the mandrel 8 must be removed after the sintering process, thereby perforating A porous sintered structure 30 (shown in FIG. 7) is formed around the periphery of the first section 21, and an upper casing 11 is formed. The porous sintered structure 30 after the completion of the process is connected to the first capillary structure. 13 and second capillary tissue 23.

g) preparing the housing 12, and sealing the lower housing 12 corresponding to the upper housing 11; as shown in FIG. 7, in this step, the lower housing 12 has been pre-machined to form a cavity and disposed inside the cavity. a third capillary structure 14, which may be a metal woven mesh, a porous powder sinter or The lower casing 12 is welded and sealed corresponding to the upper casing 11 so that a cavity A is formed between the upper casing 11 and the lower casing 12.

h) applying a liquid filling and a degassing sealing process to the semi-finished product of step g). Referring to FIG. 7, in this step, a liquid such as water is filled into the chamber A through an infusion degassing tube (not shown), and a processing step such as degassing and sealing is performed. Finish the production.

Referring to FIG. 7 again, the present invention provides a thermal module structure including a Vapor Chamber 10, a Heat Pipe 20, a porous sintered structure 30, and a working fluid 40. The upper plate 11 includes a lower casing 11 and an upper casing 11 correspondingly connected to the lower casing 12. A cavity A is formed between the upper casing 11 and the lower casing 12, and a cavity is arranged inside the cavity A. a capillary structure 13, the upper casing 11 is provided with a through hole 111 and a ring wall 112 extending from the periphery of the through hole 111; the heat pipe 20 has a first section 21 and a second section 22, and the inner diameter of the first section 21 is larger than the second section The inner diameter of the segment 22 has an opening 211 and a second capillary structure 23 disposed therein. The heat pipe 20 is erected corresponding to the annular wall 112 by the opening 211 and communicates with the through hole 111; the porous sintered structure 30 is formed in the through hole 111. Between the first segments 21 and connecting the first capillary structure 13 and the second capillary structure 23; the working fluid 40 is filled in the cavity A.

When in use, the liquid working fluid 40, upon heating, will evaporate to form a gaseous working fluid 40 that will carry a significant amount of heat toward the opening 211 of each heat pipe 20 and to the closed end 22 of the heat pipe 20. The gaseous working fluid 40 will be condensed into a liquid working fluid 40 and sequentially passed through the second capillary structure 23, porous sintered structure after being dissipated through the heat pipe 20 in contact with a plurality of fins (not shown). 30 and the first capillary structure 13 are returned to the cavity A, since the first capillary structure 13 and the second capillary structure 23 are connected through the porous sintered structure 30, thereby forming a continuous return path and thereby increasing the liquid reflux speed. .

As shown in FIG. 8 , in addition to the foregoing embodiment, the heat conducting module structure of the present invention may be applied to the outer peripheral wall of the ring wall 112 to apply an adhesive to the first segment 21 of the heat pipe 20 corresponding to the ring wall 112. The socket 211 is connected to the through hole 111 so that the ring wall 112 of this embodiment is housed inside the first segment 21.

In summary, the structure of the heat-conducting module of the present invention and the manufacturing method thereof can achieve the intended use purpose, and solve the lack of the prior art, and because of the novelty and the progressiveness, fully comply with the requirements of the invention patent application, and convert If the patent law is filed, please check and grant the patent in this case to protect the right to invent.

10‧‧‧Wall plate

11a‧‧‧Metal sheet

11‧‧‧Upper casing

111‧‧‧Perforation

112‧‧‧Circle wall

12‧‧‧ Lower case

13‧‧‧First capillary tissue

14‧‧‧ Third capillary tissue

A‧‧‧ cavity

20‧‧‧heat pipe

21‧‧‧ first paragraph

211‧‧‧ openings

22‧‧‧ second paragraph

23‧‧‧Second capillary tissue

24‧‧‧closed end

30‧‧‧Porous sintered structure

40‧‧‧Working fluid

Claims (7)

A method for manufacturing a heat-conducting module, comprising the steps of: a) preparing a metal plate, forming a perforation and a ring wall for processing the metal plate; b) preparing a heat pipe with a second capillary structure disposed inside the heat pipe, forming the heat pipe Having a first segment and a second segment, the first segment having an opening; c) erecting the heat pipe corresponding to the ring wall to communicate the opening with the perforation; d) inserting a mandrel from the perforation And being blocked by the second segment; e) placing a metal powder only on the inner side of the metal plate and filling from the perforation to form an outer periphery of the mandrel; f) performing a semi-finished product through the step e) Sintering processing to form a first capillary structure on the metal plate and a porous sintered structure connecting the first capillary structure and the second capillary structure between the perforations and the first segment, and forming a The upper casing; g) preparing the casing, sealing the lower casing to the upper casing; and h) applying a liquid filling and a degassing sealing process to the semi-finished product of the step g). The method for fabricating the thermal module according to claim 1, wherein the step b) is performed before the step a). The method of manufacturing the heat conduction module according to claim 1, wherein the processing in the step b) is to apply a expansion process to the first segment. The method of manufacturing the heat conduction module according to claim 1, wherein the processing in the step b) is to perform a shrinking process on the second segment. The method of manufacturing the heat-conducting module of claim 1, wherein the step c) is to thread the first wall into the ring wall, so that the first segment is received inside the ring wall. The method of manufacturing the heat conductive module according to claim 1, wherein the first capillary structure is integrally formed with the porous sintered structure. The method of manufacturing the heat-conducting module of claim 1, wherein the step c) is to sleeve the ring wall with the first segment, so that the ring wall is accommodated inside the first segment.