TWI607499B - Polishing device, polishing pad attachment method, and polishing pad replacement method - Google Patents

Description

Grinding device, polishing pad attaching method, and polishing pad changing method

The present invention relates to a polishing apparatus, a polishing pad attaching method, and a polishing pad changing method.

In recent years, a polishing apparatus has been used to polish the surface of a substrate such as a semiconductor wafer. The polishing apparatus rotates the polishing table to which the polishing pad for polishing the substrate is attached, and polishes the surface of the substrate by pressing the substrate held by the upper annular turntable against the polishing pad.

The polishing pad of such a polishing apparatus is treated as a consumable, and the polishing pad is periodically replaced. The polishing pad is usually replaced manually by an operator.

The attaching process of attaching the polishing pad to the polishing table is performed by the operator manually attaching the polishing pad whose back surface is the adhesive surface to the polishing table. Since the polishing pad is attached to the polishing table with a strong adhesive force without unevenness when the substrate is polished, the peeling step of peeling off the polishing pad from the polishing table is difficult when the polishing pad is peeled off, and the peeling operation takes time.

Further, in the attaching process, if air enters between the polishing pad and the polishing table, air retention may affect the polishing performance profile of the substrate. Thus, when the polishing pad is strongly adhered to the polishing table, it is difficult to reuse it once the polishing pad is peeled off. Therefore, when air stagnation occurs between the polishing pad and the polishing table, it is sometimes necessary to peel off the polishing pad and reattach the new polishing pad, which is not economical.

In this regard, it is known that the past technology is interposed between the polishing table and the adhesive surface of the polishing pad. Fluorine resin layer. Thereby, the polishing pad attached to the polishing table can be easily peeled off from the polishing table.

Further, since the polishing pad is usually cut into the same shape as the attachment surface of the polishing table and attached to the polishing table, there is no such thing as a step of peeling off the polishing pad in the peeling step of peeling the polishing pad from the polishing table. Therefore, there is a problem that it takes time to peel off the polishing pad.

In this regard, it has been known in the prior art to cut the polishing pad in such a manner that one of the polishing pads protrudes from the outer side of the polishing table, and the protruding portion serves as a clue to perform the peeling of the polishing pad. Further, it is also known that the polishing pad is peeled off by using a retracting tool to reduce the peeling of the polishing pad.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-238375

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-20339

[Patent Document 1] Japanese Patent Laid-Open No. Hei 10-217148

However, the prior art does not consider the case where the polishing pad may be thermally damaged due to heat treatment when the polishing pad is attached to the polishing table.

In other words, in the past, a fluorine-based resin layer was interposed between the polishing table and the adhesive surface of the polishing pad. In order to apply the fluorine-based resin to the polishing table, it is necessary to carry out a relatively high temperature of, for example, 300 ° C to 400 ° C. Heat treatment.

In addition, the polishing table can be formed of various materials. For example, when a polishing table is formed of a material having a relatively low heat-resistant temperature such as a resin, heat treatment for applying a fluorine-based resin may cause thermal damage such as deformation on the polishing table.

Therefore, an object of the present invention is to provide a polishing apparatus and a polishing pad attaching method which can easily perform a cloth changing operation and can suppress thermal damage on a polishing table.

In addition, the prior art does not take into account the replacement of the polishing pad with excellent precision in suppressing the influence on the polishing performance of the substrate.

That is, the prior art in which the protrusion from the polishing table is formed in advance on the polishing pad, the portion of the head becomes a singular point, which may affect the polishing performance.

In addition, even if the past technique is used and the polishing pad is peeled off using a retracting tool, the result is still required to start peeling off the polishing pad, which may damage the surface of the polishing table or cause damage during winding.

Further, in the polishing, in order to prevent the polishing pad from peeling off from the polishing table, the polishing pad is attached to the polishing table with a certain degree of adhesion, so that a considerable force is required to peel off the polishing pad.

In addition, generally, the polishing pad is attached to the polishing table, and the polishing pad having the adhesive surface on the back surface is manually attached to the polishing table. Here, in the attaching step, air stagnation may occur between the surface of the polishing table and the back surface of the polishing pad. In this case, even if the film is pressed flat from the surface side of the polishing pad, it is difficult to remove the trapped air, and it is necessary to peel off the polishing pad and discard it, and attach a new polishing pad again. In addition, the confirmation of whether or not air retention occurs depends on manual touch or visual inspection, so it is difficult to accurately determine whether the attachment state is good or not.

Therefore, an object of the present invention is to achieve an excellent polishing pad replacement that suppresses the influence on the polishing performance of a substrate.

Further, an object of the present invention is to suppress the influence on the polishing performance of the substrate and to save the peeling operation of the polishing pad.

In view of the above problems, the polishing apparatus of the present invention is characterized in that it includes a polishing table having a bonding surface to which a polishing pad for polishing a substrate is attached, and a resin layer which is attached to the polishing table. The cover surface is between the aforementioned polishing table and the aforementioned polishing pad.

Further, the enamel resin layer may include a coating layer of an enamel-containing adhesive provided on the attachment surface, or an enamel-containing adhesive sheet attached to the attachment surface.

Further, the base resin layer may include a resin-based paint which is applied to the above-mentioned attachment surface and which is mixed with a ceramic in a resin.

Further, the polishing table may be formed by including at least one of tantalum carbide, stainless steel, resin, and alumina.

Further, an adhesive for the polishing pad may be further provided between the resin layer and the polishing pad.

Further, the control unit may further include a control unit that pressurizes or depressurizes the back surface of the polishing pad that is bonded to the polishing pad of the polishing table, and the control unit peels off the polishing pad from the polishing table. Pressing the back surface of the polishing pad or pressing or depressurizing the back surface of the polishing pad in the attaching step of attaching the polishing pad to the polishing table.

Further, the pressing member may further include a pressing member that is pressed against the polishing pad from the polishing table, and presses a back surface opposite to a polishing surface of the polishing pad, wherein the pressing member includes a piston that is attached to the piston a hole formed in the attachment surface of the polishing pad to which the polishing pad is attached, and a driving member that drives the piston in a direction in which the back surface of the polishing pad is pressed in the peeling step.

Further, the method of attaching a polishing pad according to the present invention is characterized in that a resin layer is provided on the attachment surface of a polishing table having a bonding surface to which a polishing pad for polishing a substrate is attached, The tantalum resin layer provided on the attaching surface is subjected to heat treatment, and the polishing pad is attached to the tantalum resin layer after the heat treatment.

Further, the polishing pad of the present invention is characterized in that the method of attaching the polishing pad or the method of peeling the polishing pad from the polishing table is performed in a peeling process of peeling the polishing pad from the polishing table. Pressurizing the back surface of the polishing pad attached to the polishing pad opposite to the polishing surface, or pressurizing or reducing the back surface of the polishing pad in the attaching process of attaching the polishing pad to the polishing table. Pressure.

Further, in the peeling step of the polishing pad, the piston provided in the hole of the polishing table to which the polishing pad is attached may be driven in a direction in which the back surface of the polishing pad is pressed.

Further, the coating layer of the enamel-containing adhesive is formed by heat-treating a coating layer of an enamel-containing adhesive applied to the attachment surface of the polishing table.

According to the invention of the present invention, the polishing pad can be easily replaced, and thermal damage of the polishing table can be suppressed.

Further, in the case of the present invention, it is possible to realize the replacement of the polishing pad with excellent precision which suppresses the influence on the polishing performance of the substrate.

According to the invention of the present invention, the influence on the polishing performance of the substrate can be suppressed, and the peeling operation of the polishing pad can be saved.

100, 1100, 2100‧‧‧ grinding device

102, 1102, 2102‧‧‧ substrates

108, 1108, 2108‧‧‧ polishing pads

108a, 1108a‧‧‧ polished surface

108b, 1108b, 2108b, 2110b‧‧‧ back

109‧‧‧Adhesive

110, 1110, 2110‧‧‧ grinding table

110a, 1110a, 2110a‧‧‧ attached surface

111‧‧‧ resin layer

112, 1112, 2112‧‧‧ first electric motor

116, 1116, 2116‧‧‧ upper ring carousel

118, 1118, 2118‧‧‧ second electric motor

120, 1120, 2120‧‧‧ mud pipeline

122, 1122, 2122‧‧‧

124, 1124, 2124‧‧‧Finishing unit

1107‧‧‧Air detention

1109‧‧‧

1110b‧‧‧ face

1111, 2111‧‧ holes

1111a‧‧‧ first hole

1111b‧‧‧second hole

1130, 2130‧‧‧ operation panel

1140, 2140‧‧‧Control Department

1152, 2152, 2152-1, 2152-2‧‧ Compressed air line

1154‧‧‧vacuum pipeline

1156-1, 1156-2, 2156‧‧‧ pressure regulator

1158-1‧‧‧Pressure valve

1158-2‧‧‧Sucking valve

1159‧‧‧Connected flow path

1160, 2160, 2170‧‧‧ rotary joints

1170‧‧‧Rotary connector

1182‧‧‧ Pressure Sensor

1184‧‧‧ solenoid valve

2158-1, 2158-2‧‧‧ Valve

2182, 2184‧‧‧ speed control valve

2190‧‧‧Rotary connector

2192‧‧‧Control signal pipeline

2200‧‧‧Extrusion parts

2210‧‧‧Piston

2210a‧‧‧Squeeze surface

2220‧‧‧Drive parts

2240‧‧‧stop parts

2240-a‧‧‧Cylinder

2240-b‧‧‧Flange

2242‧‧‧ screws

2250‧‧‧shield parts

2260‧‧ ‧ cylinder

2260a, 2260b‧‧‧ first and second communication ports

2262‧‧‧First space

2264‧‧‧Second space

2270‧‧‧ separated parts

2280‧‧‧Connected parts

2300‧‧‧Tools for polishing pad peeling

2302‧‧‧Compressed air connection埠

2304-1, 2304-2‧‧‧Compressed air lines

2306, 2308‧‧‧ Valves

2312, 2314, 2316‧‧‧ speed control valves

2322, 2324‧‧‧Tools connection埠

The first drawing mode shows the overall configuration of the polishing apparatus of the first embodiment.

The second figure shows a state diagram of the polishing pad and the polishing table.

The third figure shows a process flow chart of the attachment process and the polishing process of the polishing pad.

The fourth drawing mode shows the overall configuration of the polishing apparatus of the second embodiment.

The fifth figure shows the detailed configuration of the periphery of the polishing table.

The sixth drawing shows an example of an arrangement pattern of a plurality of holes formed in the polishing table.

The seventh drawing shows a process flow chart of the peeling process of the polishing pad.

The eighth figure shows a state diagram of the peeling process of the polishing pad.

The ninth drawing shows a process flow chart showing the attaching process of the polishing pad.

Fig. 10 is a view showing a state in which the polishing pad is attached.

The eleventh figure shows the overall configuration of the polishing apparatus.

Fig. 12 is a view showing a polishing apparatus of a third embodiment.

The thirteenth figure shows a detailed view of the extruded part.

Fig. 14 is a view showing another example of the pressing member.

The fifteenth pattern shows a state diagram of the peeling process of the polishing pad.

Fig. 16 is a view showing a state of the polishing apparatus of the fourth embodiment.

Fig. 17 is a view showing a polishing apparatus of a fifth embodiment.

<First embodiment>

Hereinafter, a polishing apparatus and a polishing pad replacement method according to a first embodiment of the present invention will be described with reference to the drawings. An example of the following embodiment is a CMP (Chemical Mechanical Polishing) polishing apparatus, but is not limited thereto.

The first pattern shows the overall composition of the polishing apparatus of the first embodiment. Figure. As shown in the first figure, the polishing apparatus 100 includes a polishing table 110 on which a polishing pad 108 for polishing a substrate 102 such as a semiconductor wafer or the like, a first electric motor 112 that rotationally drives the polishing table 110, and a substrate that can hold the substrate An annular turntable 116 above 102, and a second electric motor 118 that rotationally drives the upper annular turntable 116.

Further, the polishing apparatus 100 includes a slurry line 120 that supplies a polishing liquid containing an abrasive material on the polishing pad 108, and a conditioning unit 124 that includes a conditioning disk 122 that performs conditioning of the polishing pad 108.

When the substrate 102 is polished, the polishing liquid containing the abrasive is supplied from the slurry line 120 to the upper surface of the polishing pad 108, and the polishing table 110 is rotationally driven by the first electric motor 112. Then, the substrate 102 held by the upper ring-shaped turntable 116 is pressed against the polishing pad 108 in a state where the upper ring-shaped turntable 116 is rotated around the rotating shaft which is eccentric with the rotating shaft of the polishing table 110. Thereby, the substrate 102 is polished by the polishing pad 108 to be planarized.

Next, the state of the polishing pad 108 and the polishing table 110 will be described. The second figure shows the subsequent pattern of the polishing pad and the polishing table. As shown in the second figure, in the present embodiment, the adhesive surface 109 containing the adhesive on the polishing pad is formed on the back surface 108b on the opposite side of the polishing surface 108a of the polishing pad 108. Further, a resin layer 111 is provided on the attachment surface 110a of the polishing table 110 to which the polishing pad 108 is attached. In other words, the base resin layer 111 is interposed between the polishing table 110 and the polishing pad 108, and the adhesive surface 109 is interposed between the silicone resin layer 111 and the polishing pad 108.

The base resin layer 111 may include an enamel-containing adhesive applied to the attachment surface 110a of the polishing table 110. At this time, the adhesive containing the enamel resin can be applied to the attaching surface 110a of the polishing table 110 by various methods such as brushing, roll coating, spray coating, and spray coating.

In addition, the resin layer 111 may also include a bonding surface 110a attached to the polishing table 110. Adhesive sheet containing enamel resin.

Further, the base resin layer 111 may include a resin-based paint which is mixed with a ceramic (for example, ceramic powder) in a resin coated on the attachment surface 110a of the polishing table 110. At this time, the resin-based coating material in which the ceramic is mixed with the resin can be applied to the attachment surface 110a of the polishing table 110 by various methods such as brushing, roll coating, spray coating, and spray coating. By mixing the ceramic in the tantalum resin, the hardness of the base resin layer 111 is increased, and the durability of the base resin layer 111 can be improved.

Further, the polishing table 110 may be formed of at least one of materials such as tantalum carbide (SiC), stainless steel (SUS), resin, and alumina (Alumina).

Next, the attaching process and the polishing process of the polishing pad of this embodiment will be described. The third figure shows a process flow chart of the attachment process and the polishing process of the polishing pad. In the third figure, one aspect of the resin layer 111 is exemplified by the case of using a ruthenium resin adhesive.

As shown in the third figure, the attaching step first coats the surface of the polishing table 110 (the attaching surface 110a) with a resin adhesive (step S101). Continuing, the attaching process heat-treats the resin adhesive applied to the polishing table 110 (step S102). This heat treatment is, for example, a process in which the polishing table 110 and the resin adhesive are combined, for example, heat of about 150 ° C to about 200 ° C is applied. By this heat treatment, the enamel resin adhesive is favorably applied to the attachment surface 110a of the polishing table 110.

Continuing, the attaching step attaches the polishing pad 108 to the resin adhesive after the heat treatment (step S103). Further, an adhesive surface 109 is applied to the back surface 108b of the polishing pad 108 in advance, and in step S103, the adhesive surface 109 of the polishing pad 108 is attached to the silicone resin. Thereby, the attaching process of the polishing pad 108 is completed.

Continuing, the polishing process rotates the polishing table 110 by rotating the first electric motor 112 (step S104). Continuing, the polishing process rotates the second electric motor 118 (step S105) The upper ring turntable 116 is rotated.

Continuing, in the polishing step, the substrate 102 held by the upper ring-shaped turntable 116 is pressed against the polishing surface 108a of the polishing pad 108 to polish the surface of the substrate 102 (step S106). Continuing, the polishing process determines whether or not the polishing of the substrate 102 is completed (step S107). The determination as to whether or not the polishing of the substrate 102 is completed is performed, for example, based on a change in the torque current of the first electric motor 112 or the second electric motor 118.

When it is determined that the polishing of the substrate 102 has not been completed in the polishing step (NO in step S107), the polishing process is repeatedly performed until it is determined that the polishing is completed. In addition, when it is determined that the polishing of the substrate 102 is completed in the polishing step (YES in step S107), the processing is terminated.

As described above, according to the present embodiment, the polishing work of the polishing pad 108 can be easily performed, and thermal damage of the polishing table 110 can be suppressed.

That is, in the present embodiment, the resin layer 111 is interposed between the attachment surface 110a of the polishing table 110 and the polishing pad 108 (or the adhesive surface 109). Thereby, the adhesion of the polishing pad 108 (adhesive surface 109) to the polishing table 110 is weakened in the direction orthogonal to the attachment surface 110a.

Therefore, for example, in the peeling process of the polishing pad 108, when the polishing pad 108 is peeled off in the direction orthogonal to the bonding surface 110a, the polishing pad 108 can be easily peeled off. In addition, the polishing table 110 and the polishing pad 108 are attached by interposing the resin layer 111, and the adhesion force in the shearing direction of the polishing pad 108 (in the direction along the bonding surface 110a) is strongly maintained. As a result, peeling or positional deviation of the polishing pad 108 during polishing of the substrate 102 can be suppressed.

Further, in the attaching process of the polishing pad 108, even if air stagnation occurs between the polishing table 110 and the polishing pad 108, since the polishing pad 108 can be easily peeled off, the polishing pad 108 can be easily peeled off and then reattached. .

Further, in the present embodiment, since the ruthenium resin layer 111 is used, it is possible to suppress thermal damage such as deformation on the polishing table 110 by heat treatment of the ruthenium resin layer 111.

In other words, when a fluorine-based resin layer is interposed between the polishing table and the polishing pad as a comparative example, in order to apply the fluorine-based resin to the polishing table, for example, a relatively high temperature of 300 ° C to 400 ° C is required. To heat treat the fluorine resin. When the heat treatment is performed at such a relatively high temperature, for example, when a polishing table is formed of a material having a relatively low heat resistance temperature such as a resin, thermal damage such as deformation of the polishing table may occur.

On the other hand, in the present embodiment, since the resin layer 111 is interposed between the polishing table 110 and the polishing pad 108, it can be applied to the polishing table 110 at a relatively low temperature of, for example, about 150 ° C to about 200 ° C. Heat treatment of the cloth resin layer 111. Therefore, even when the polishing table 110 is formed of a material having a relatively low heat resistance temperature such as a resin, it is possible to suppress thermal damage such as deformation on the polishing table 110 by heat treatment. Further, in the case of the present embodiment, even when the resin layer 111 is heat-treated at a relatively low temperature of from about 150 ° C to about 200 ° C, it is possible to obtain a heat treatment of the fluorine-based resin at a temperature higher than, for example, 300 ° C to 400 ° C. The peel strength (ease of peeling) of the same polishing pad 108.

Further, since the resin layer 111 is excellent in chemical resistance and heat resistance, it is possible to increase the temperature of the polishing liquid supplied from the slurry line 120 during polishing and the temperature of the polishing table 110 during polishing.

Further, although the flatness of the polishing table 110 affects the polishing process performance of the substrate 102, in this regard, since the base resin layer 111 can be coated to a thickness of, for example, about 10 ± 5 μm, the flatness of the polishing table 110 can be maintained.

In addition, a resin-based coating is mixed with a ceramic resin to form a resin. In the case of the layer 111, the hardness of the enamel resin layer 111 can be increased by mixing ceramics in the enamel resin, and as a result, the durability of the enamel resin layer 111 can be improved.

<Second embodiment>

Hereinafter, a polishing apparatus and a polishing pad replacement method according to a second embodiment of the present invention will be described with reference to the drawings. An example of the following embodiment is a CMP (Chemical Mechanical Polishing) polishing apparatus, but is not limited thereto. Further, the polishing apparatus and the polishing pad changing method of the second embodiment can be implemented in combination with the polishing apparatus and the polishing pad cloth changing method of the first embodiment.

The fourth drawing mode shows the overall configuration of the polishing apparatus of the second embodiment. As shown in the fourth figure, the polishing apparatus 1100 includes a polishing table 1110 on which a polishing pad 1108 for polishing a substrate 1102 such as a semiconductor wafer or the like, a first electric motor 1112 that rotationally drives the polishing table 1110, and a substrate that can hold the substrate. An annular turntable 1116 above 1102 and a second electric motor 1118 that rotationally drives the upper annular turntable 1116.

Further, the polishing apparatus 1100 includes a slurry line 1120 that supplies a polishing liquid containing an abrasive on the upper surface of the polishing pad 1108, and a conditioning unit 1124 that includes a conditioning disk 1122 that performs conditioning of the polishing pad 1108.

Further, the polishing apparatus 1100 is provided with an operation panel 1130 for inputting various operation commands regarding the replacement of the polishing pad 1108, or outputting various information regarding the replacement of the polishing pad 1108, and a control unit 1140 for controlling each component of the polishing apparatus 1100. . The control unit 1140 is a controller for pressurizing or depressurizing the back surface of the polishing pad 1108 attached to the polishing table 1110 on the opposite side to the polishing surface. The control unit 1140 pressurizes the back surface of the polishing pad 1108 in the peeling step of peeling the polishing pad 1108 from the polishing table 1110. Further, the control unit 1140 attaches the polishing pad 1108 to the polishing table 1110. In the attaching step, the back surface of the polishing pad 1108 is pressurized or depressurized. The specific control aspect of the control unit 1140 will be described later.

Further, the polishing apparatus 1100 includes a rotary joint 1160 for introducing a fluid between the compressed air line 1152 and the vacuum line 1154 and the polishing table 1110 in the polishing apparatus 1100, and an input and output between the control unit 1140 and the polishing table 1110. A rotary connector 1170 for the signal. Pressure regulators 1156-1, 1156-2, and a pressure valve 1158-1 and a suction valve 1158-2 for switching the respective lines are provided in the compressed air line 1152 and the vacuum line 1154, respectively. The pressure regulator 1156-1 is an electric air conditioner that controls the air pressure injected from the compressed air line 1152 to, for example, a high pressure, a low pressure, etc., and the pressure regulator 1156-2 controls the air pressure sucked into the vacuum line 1154 to, for example, a high pressure. Manual regulators such as low pressure. Further, the pressure regulator 1156-1 is not limited to the electro-pneumatic regulator. Further, the pressure regulator 1156-2 is not limited to the manual adjuster.

When the substrate 1102 is polished, the polishing liquid containing the polishing material is supplied from the slurry line 1120 to the upper surface of the polishing pad 1108, and the polishing table 1110 is rotationally driven by the first electric motor 1112. Then, the substrate 1102 held by the upper ring-shaped turntable 1116 is pressed against the polishing pad 1108 in a state where the upper ring-shaped turntable 1116 is rotated around the rotating shaft which is eccentric with the rotating shaft of the polishing table 1110. Thereby, the substrate 1102 is polished by the polishing pad 1108 to be planarized.

The fifth figure shows the detailed configuration of the periphery of the polishing table. As shown in FIG. 5, a plurality of holes 1111 penetrating through the surface 1110a to which the bonding surface 1110a of the polishing pad 1108 and the opposite surface 1110a of the bonding surface 1110a are attached are formed in the polishing table 1110. The hole 1111 is an example of a communication path connecting the back surface 1108b on the opposite side of the polishing surface 1108a of the polishing pad 1108 and the outside of the polishing table 1110. The communication path is not limited to the hole, and it is only necessary to connect the back surface 1108b of the polishing pad 1108 to the outside of the polishing table 1110.

Further, as shown in the fifth figure, the air supplied from the compressed air line 1152 (flow) When the pressurizing valve 1158-1 is opened and the suction valve 1158-2 is closed, a plurality of holes 1111 formed in the polishing table 1110 can be injected via the communication flow path 1159. Further, when the pressurizing valve 1158-1 is closed and the suction valve 1158-2 is opened, the vacuum line 1154 can be sucked from the plurality of holes 1111 via the communication flow path 1159.

In the peeling step, the control unit 1140 pressurizes the back surface 1108b of the polishing pad 1108 by injecting a fluid (air) into the back surface 1108b of the polishing pad 1108 through the hole 1111. Further, in the attaching step, the control unit 1140 pressurizes the back surface 1108b of the polishing pad 1108 by injecting a fluid (air) into the back surface 1108b of the polishing pad 1108 through the hole 1111, or by polishing the pad from the polishing pad 1111. The back side 1108b of 1108 draws fluid and depressurizes the back side 1108b (back side 1108b side) of the polishing pad 1108. Further, the decompression of the back surface 1108b of the polishing pad 1108 means that the pressure applied to the back surface 1108b is reduced.

In each of the communication passages 1159 connecting the plurality of holes 1111 and the compressed air line 1152 and the vacuum line 1154, a pressure sensor 1182 and a solenoid valve 1184 for each of the communication passages 1159 are provided. The pressure detected by each pressure sensor 1182 is input to the control unit 1140 via the rotary connector 1170. Further, each solenoid valve 1184 is opened and closed in accordance with a control signal input from the control unit 1140 via the rotary connector 1170.

Next, an arrangement pattern of a plurality of holes 1111 formed in the polishing table 1110 will be described. The sixth drawing shows an example of an arrangement pattern of a plurality of holes formed in the polishing table. As shown in the sixth (a) diagram, in the polishing table 1110, a plurality of holes 1111 can be vortexed from the center of the polishing table to the outer peripheral portion of the polishing table. Further, as shown in the sixth (b) diagram, a plurality of holes 1111 may be arranged in a concentric shape in the polishing table 1110. Further, as shown in the sixth (c) diagram, a plurality of holes 1111 may be arranged in a lattice shape in the polishing table 1110.

Further, an adhesive is applied to the back surface of the polishing pad 1108, whereby the polishing pad 1108 is attached to the polishing table 1110. Here, as shown in FIG. 6(b), by applying a non-adhesive coating (non-adhesive) to the periphery of the hole 1111 of the polishing table 1110, the adhesion of the adhesive to the polishing pad 1108 is not hindered. The polishing pad 1108 can be easily peeled off.

Next, the peeling process of the polishing pad 1108 will be described. The seventh drawing shows a process flow chart of the peeling process of the polishing pad. The eighth figure shows a state diagram of the peeling process of the polishing pad.

As shown in the seventh figure, the peeling process of the polishing pad 1108 first indicates "pressurization" for peeling off the polishing pad 1108 from the operation panel 1130. At this time, the control unit 1140 outputs a valve switching signal to the pressurizing valve 1158-1 and the suction valve 1158-2. Thereby, the pressurizing valve 1158-1 and the suction valve 1158-2 are switched to the "pressurized" mode. Specifically, the pressurizing valve 1158-1 becomes "open", and the suction valve 1158-2 becomes "closed".

The control unit 1140 performs pressure setting on the pressure regulator 1156-1. Specifically, the pressure regulator 1156-1 is set to "high pressure". Here, the high pressure is a pressure at which the polishing pad 1108 is peeled off or peeled off easily.

Continuing, the control unit 1140 performs switching control of the electromagnetic valve. For example, the control unit 1140 causes the plurality of solenoid valves 1184 corresponding to the plurality of holes 1111 to be "open" in the order of stylization.

Specifically, as shown in the eighth (a) diagram, the control unit 1140 first makes a plurality of solenoid valves 1184 corresponding to the holes 1111 of the peripheral portion of the polishing table 1110 (for example, the first hole 1111a in the sixth (b) diagram. The solenoid valve 1184 is "open". Thereby, the control unit 1140 pressurizes the back surface 1108b of the polishing pad 1108 via the opened electromagnetic valve 1184. As a result, since the peripheral portion of the polishing pad 1108 is peeled off or easily peeled off, the head for peeling off the polishing pad 1108 can be easily made. 1109.

In a state where air is injected into the hole 1111 in the peripheral portion of the polishing table 1110, the pressure sensor 1182 provided in the air-injecting communication path 1159 measures the communication flow path 1159, in other words, the hole 1111 into which the air has been injected is measured. pressure. The control unit 1140 determines the attachment state of the polishing pad 1108 based on the pressure measured by the pressure sensor 1182.

Specifically, when the control unit 1140 detects that the pressure measured by the pressure sensor 1182 is lower than the preset threshold pressure, it is determined that the portion of the polishing pad 1108 has peeled off. That is, when air is injected in the state where the polishing pad 1108 is not peeled off, the pressure of the hole 1111 rises, and if the polishing pad 1108 has peeled off, the pressure is lowered due to the air being discharged therefrom. When the control unit 1140 determines that the polishing pad 1108 has peeled off, the solenoid valve 1184 corresponding to the hole 1111 after the pressure drop is turned "OFF".

As described above, the back surface of the polishing pad 1108 is pressurized by injecting air into the hole 1111 in the peripheral edge portion of the polishing table 1110. As shown in the eighth (b), the worker can take the clad 1109 and peel the polishing pad 1108.

After the thread 1109 is made, the polishing pad 1108 can also be manually peeled off. However, this example illustrates the further assisting of the peeling of the polishing pad 1108. In the case where the program is being executed, the control unit 1140 opens another hole 1111 corresponding to the hole 1111 to which the air is initially injected (for example, the first hole 1111a in the sixth (b) diagram) (for example, in the sixth (b) diagram. The solenoid valve 1184 of the second hole 1111b) is injected with air.

At this time, as shown in the eighth (c), the back surface 1108b of the polishing pad 1108 is pressurized by the injection of air, and since the polishing pad 1108 is peeled off or peeled off easily, the worker can easily peel off the polishing pad 1108.

The other hole 1111 into which the air is injected also measures the pressure of the hole 1111 in the same manner as described above. When the pressure is detected to decrease, the solenoid valve 1184 corresponding to the hole 1111 is closed, and the other holes 1111 which are further adjacent are subjected to the same treatment. . As shown in the eighth (d) (e) diagram, the polishing pad 1108 can be easily peeled off by repeatedly performing the peeling operation of the polishing pad 1108 and the pressing from the adjacent hole 1111. Further, the control unit 1140 can sequentially inject air from the hole 1111 at the peripheral edge portion of the polishing table 1110 to the adjacent hole 1111. Alternatively, another method may be employed in which air is injected into all the holes at the same pressure, and the solenoid valves corresponding to the holes are sequentially closed from the holes in which the pressure is lowered.

After the entire polishing pad 1108 has been peeled off, the peeling "end" of the polishing pad is instructed via the operation panel 1130. At this time, the control unit 1140 determines that the program has been completed, and outputs a valve switching signal to the pressurizing valve 1158-1. Thereby, the pressurizing valve 1158-1 is turned "OFF", and the peeling process of the polishing pad 1108 is completed.

Next, the attaching process of the polishing pad 1108 will be described. The ninth drawing shows a process flow chart showing the attaching process of the polishing pad. Fig. 10 is a view showing a state in which the polishing pad is attached.

First, the attachment work of the polishing pad 1108 is performed by an operator. This is an operation of sequentially attaching the back surface of the polishing pad 1108 to the polishing table 1110 by manual operation as shown in the tenth (a).

After the attaching operation of the polishing pad 1108 is completed, the "suction" of the polishing pad 1108 is instructed from the operation panel 1130. At this time, the control unit 1140 outputs a valve switching signal to the pressurizing valve 1158-1 and the suction valve 1158-2. Thereby, the pressurizing valve 1158-1 and the suction valve 1158-2 are switched to the "attractive" mode. Specifically, the pressurizing valve 1158-1 becomes "closed", and the suction valve 1158-2 becomes "open".

Continuing, the control unit 1140 performs switching control of the electromagnetic valve. Specifically, the control unit 1140 causes all of the solenoid valves 1184 corresponding to the plurality of holes 1111 to be "open". By taking shape All of the holes 1111 formed in the polishing table 1110 attract air.

As a result, as shown in the tenth (b), when the polishing pad 1108 is attached, even if air is trapped 1107 between the back surface 1108b of the polishing pad 1108 and the attachment surface 1110a of the polishing table 1110, as shown in the tenth (c) As shown, air can still be drawn from the air hold 1107 to remove air retention 1107. Here, an example in which air is sucked from all the holes 1111 is shown here, but is not limited thereto. For example, air may also be drawn from at least one hole 1111 corresponding to a portion where air retention 1107 occurs.

After the suction of the air retention 1107 is completed, the control unit 1140 temporarily turns all the solenoid valves 1184 corresponding to the plurality of holes 1111 to "OFF". Continuing, the control unit 1140 outputs a valve switching signal to the suction valve 1158-2. Thereby, the suction valve 1158-2 is switched to the "pressurization" mode. Specifically, the suction valve 1158-2 becomes "closed".

Continuing, the control unit 1140 performs pressure setting on the pressure regulator 1156-1. Specifically, the pressure regulator 1156-1 is set to "low pressure". The term "low pressure" as used herein refers to a pressure that does not reach the extent that the polishing pad 1108 is peeled off or is easily peeled off. The pressure regulator 1156-1 is set to "low pressure" because the polishing pad 1108 which is normally attached under high pressure may peel off or peel off easily.

Continuing, the control unit 1140 outputs a valve switching signal to the pressurizing valve 1158-1. Thereby, the pressurizing valve 1158-1 is switched to the "pressurized" mode. Specifically, the pressurizing valve 1158-1 becomes "open".

Continuing, the control unit 1140 causes all of the solenoid valves 1184 corresponding to the plurality of holes 1111 to be "open". Thereby, as shown in the tenth (d), air is injected from the entire holes 1111 formed in the polishing table 1110 to the back surface 1108b of the polishing pad 1108.

In a state where air is injected into all the holes 1111 of the polishing table 1110, the pressure sensor 1182 provided in the communication flow path 1159 measures the communication flow path 1159, in other words, the pressure of the hole 1111 into which the air has been injected. The control unit 1140 determines the pressure measured by the pressure sensor 1182. The attached state of the polishing pad 1108.

Specifically, the control unit 1140 detects that the pressure measured by the pressure sensor 1182 is lower than the preset threshold pressure, or detects that the measured time of the pressure rises longer than the preset threshold time, and then determines When the polishing pad 1108 is not peeled off or air is trapped, the adhesion state of the polishing pad is abnormal.

That is, if the polishing pad 1108 has peeled off, even if the injection air pressure does not rise, and the air retention 1107 is formed, the time required for the pressure rise is longer than the state in which the air retention 1107 is not formed. When the control unit 1140 determines that the attachment state of the polishing pad 1108 is abnormal, the control panel 1140 displays the attachment "abnormal" of the polishing pad 1108 on the operation panel 1130.

Moreover, the control unit 1140 determines that the attachment state of the polishing pad 1108 is normal, and the attachment of the polishing pad 1108 is "normal" on the operation panel 1130. Then, the control unit 1140 causes all of the solenoid valves 1184 corresponding to the plurality of holes 1111 to be "closed".

Thereby, if an abnormality is attached to the polishing pad 1108, the problem can be noticed at an early stage after the attaching operation.

Further, in the present embodiment, since the pressure sensor 1182 is provided individually for all of the plurality of holes 1111, when the attachment state of the polishing pad 1108 is abnormal, it is possible to specify which portion is abnormal. However, the pressure sensor 1182 is not separately provided for each hole 1111. For example, one pressure sensor 1182 is provided for two holes 1111, or one pressure sensor 1182 is provided for four holes 1111, and the like. Quantity. Further, one pressure sensor 1182 may be provided for all the holes 1111. Further, in the present embodiment, an example is described in which air is injected into all of the plurality of holes 1111, and the state in which the polishing pad 1108 is attached is determined. However, the present invention is not limited thereto, and air may be injected into at least one hole 1111 to determine the polishing of the portion. The attached state of the pad 1108. In addition, this embodiment shows a plurality of holes 1111. Each of the holes 1111 is connected to the polishing table 1110, and each of the holes 1111 is connected to the communication channel 1159. However, the hole 1111 is not limited thereto. For example, a plurality of holes 1111 may be combined in the polishing table 1110 to form a back surface of the polishing table 1110. The side opening is connected to one of the communication passages 1159.

Thereafter, when the attachment of the polishing pad "end" is instructed via the operation panel 1130, the control unit 1140 outputs a valve switching signal to the pressurizing valve 1158-1. Thereby, the pressurizing valve 1158-1 is turned "closed", and the attaching process of the polishing pad 1108 is completed.

As described above, in the present embodiment, since the back surface 1108b of the polishing pad 1108 is pressurized in the peeling step of the polishing pad 1108, the polishing pad 1108 can be easily peeled off without affecting the polishing performance of the substrate. Further, in the present embodiment, in the attaching step of the polishing pad 1108, since the back surface 1108b of the polishing pad 1108 is decompressed, even if air retention 1107 occurs on the polishing pad 1108, the air can be sucked and removed. Stayed 1107. Further, in the present embodiment, in the attaching step of the polishing pad 1108, the back surface 1108b of the polishing pad 1108 is pressurized, and by monitoring the rise time and distribution of the pressure, it is possible to determine that the polishing pad 1108 is floating or peeling off. Attached to the state. As a result, according to the present embodiment, it is possible to realize the replacement of the polishing pad 1108 with excellent precision which suppresses the influence on the polishing performance of the substrate.

<Third to Fifth Embodiment>

Hereinafter, the polishing apparatus and the polishing pad peeling method according to the third to fifth embodiments of the present invention will be described with reference to the drawings. An example of the following embodiment is a CMP (Chemical Mechanical Polishing) polishing apparatus, but is not limited thereto. Further, the polishing apparatus and the polishing pad peeling method of the third to fifth embodiments can be implemented in combination with the polishing apparatus and the polishing pad replacement method of the first embodiment.

<Third embodiment>

The eleventh figure shows the overall configuration of the polishing apparatus. As shown in Fig. 11, the polishing apparatus 2100 includes a polishing table 2110 on which a polishing pad 2108 for polishing a substrate 2102 such as a semiconductor wafer or the like, and a first electric motor 2112 that can rotationally drive the polishing table 2110. An annular turntable 2116 above the substrate 2102 and a second electric motor 2118 that rotationally drives the upper annular turntable 2116.

Further, the polishing apparatus 2100 includes a mud line 2120 for supplying a polishing liquid containing an abrasive material on the polishing pad 2108, and a dressing unit 2124 having a conditioning disk 2122 for performing conditioning of the polishing pad 2108.

Further, the polishing apparatus 2100 includes an operation panel 2130 for inputting various operation commands regarding peeling of the polishing pad 2108, or outputting various information regarding peeling of the polishing pad 2108, and a control portion 2140 for controlling each component of the polishing apparatus 2100.

The control unit 2140 is a controller for pressing the back surface 2108b attached to the opposite side of the polishing surface of the polishing pad 2108 of the polishing table 2110 in the peeling step of peeling the polishing pad 2108 from the polishing table 2110.

Further, the polishing apparatus 2100 is provided with rotary joints 2160, 2170 for introducing and discharging a fluid between the compressed air line 2152 in the polishing apparatus 2100 and a pressing member 2200 to be described later. The compressed air line 2152 branches into two systems of compressed air lines 2152-1, 2152-2. Compressed air lines 2152-1, 2152-2 are coupled to rotary joints 2160, 2170, respectively. A pressure regulator 2156 is provided in the compressed air line 2152. Valves 2158-1, 2158-2 of the switching line are respectively disposed in the compressed air lines 2152-1, 2152-2. The pressure regulator 2156 is an electro-pneumatic regulator that controls the air pressure injected from the compressed air line 2152 to, for example, a high pressure, a low pressure, or the like. Further, the pressure regulator 2156 is not limited to the electro-pneumatic regulator.

When the substrate 2102 is polished, the polishing liquid containing the polishing material is supplied from the slurry line 2120 to the upper surface of the polishing pad 2108, and the polishing table 2110 is rotationally driven by the first electric motor 2112. Then, the substrate 2102 held by the upper ring-shaped turntable 2116 is pressed against the polishing pad 2108 in a state where the upper ring-shaped turntable 2116 is rotated around the rotating shaft which is eccentric with the rotating shaft of the polishing table 2110. Thereby, the substrate 2102 is polished by the polishing pad 2108 to be planarized.

Fig. 12 is a view showing a polishing apparatus of a third embodiment. The thirteenth figure shows a detailed view of the extruded part. As shown in the twelfth and thirteenth drawings, in the polishing table 2110, a hole 2111 is formed in the attaching surface 2110a to which the polishing pad 2108 is attached. Specifically, the polishing table 2110 is formed with a hole (communication path) 2111 that communicates with the bonding surface 2110a to which the polishing pad 2108 is attached and the surface other than the bonding surface 2110a (the back surface 2110b of the polishing table 2110 in the present embodiment).

Further, on the back side of the polishing table 2110, a pressing member 2200 for pressing the back surface 2108b on the opposite side to the polishing surface of the polishing pad 2108 in the peeling step of peeling the polishing pad 2108 from the polishing table 2110 is provided.

The pressing member 2200 includes a piston 2210 provided in the hole 2111, and a driving member 2220 that can drive the piston 2210 in the direction of pressing the back surface 2108b of the polishing pad 2108 in the peeling process. The driving member 2220 is housed in a casing 2230 attached to the back side of the polishing table 2110. The piston 2210 has a pressing surface 2210a that presses the back surface 2108b of the polishing pad 2108 during the peeling process.

Further, the pressing member 2200 is provided with a stopper member 2240 that regulates the movement of the piston 2210 when the piston 2210 moves in the direction of the back surface 2110b of the polishing table 2110 (the direction in which the piston 2210 is separated from the back surface 2108b of the polishing pad 2108). Specifically, the stopper member 2240 has a cylindrical portion 2240-a and a flange portion 2240-b that protrudes outward from one end portion of the cylindrical portion 2240-a.

Further, the pressing member 2200 is provided to control the piston 2210 by the stopping member 2240 In the moving state, the spacer member 2250 at the position of the stopper member 2240 is adjusted such that the pressing surface 2210a of the piston 2210 and the bonding surface 2110a of the polishing table 2110 are flush with each other.

Specifically, the spacer member 2250 is formed in a disk shape, and a hole is formed in the center of the disk. The other end of the cylindrical portion 2240-a of the stopper member 2240 is inserted into the hole 2111 via the hole of the spacer member 2250, and the flange portion 2240-b is fixed to the polishing table by the screw 2242 via the spacer member 2250. The back surface 2110b of the 2110 is mounted on the polishing table 2110.

When the piston 2210 is moved in the direction toward the back surface 2110b of the polishing table 2110, the piston 2210 is in contact with the other end portion of the cylindrical portion 2240-a to regulate movement. By pressing the thickness of the spacer member 2250, the pressing member 2200 can make the pressing surface 2210a of the piston 2210 and the bonding surface 2110a of the polishing table 2110 be in the same state in a state where the piston 2210 is controlled to move by the stopping member 2240. .

The driving member 2220 includes a cylinder 2260 in which first and second communication ports 2260a and 2260b through which a fluid (air or the like) can flow, and a partition member 2270. The partition member 2270 is a member that partitions the first space 2262 that communicates with the first communication port 2260a in the cylinder 2260 and the second space 2264 that communicates with the second communication port 2260b in the cylinder 2260. Further, the driving member 2220 includes a coupling member 2280 that connects the partition member 2270 and the piston 2210.

The driving member 2220 includes a fluid cylinder that drives the piston 2210 to contact and exit the back surface 2108b of the polishing pad 2108 by fluid inflow and outflow of the first and second communication ports 2260a, 2260b. However, the driving member 2220 is not limited to the fluid cylinder, and it is only necessary to drive the piston in the direction of pressing the back surface 2108b of the polishing pad 2108 in the peeling process. Further, in the present embodiment, an example is described in which one pressing member 2200 is provided to the polishing apparatus 2100. However, the present invention is not limited thereto, and a plurality of pressing members 2200 may be provided.

Further, in the twelfth and thirteenth drawings, an example in which the cylinder 2260 is provided outside the polishing table 2110 is shown, but is not limited thereto. Fig. 14 is a view showing another example of the pressing member. As shown in FIG. 14, the cylinder 2260 can also be formed by a portion of the hole 2111 formed in the polishing table 2110. Thereby, since it is not necessary to attach the frame body 2230 to the back side of the polishing table 2110, the compact pressing member 2200 can be formed.

Further, as shown in Fig. 12, the compressed air lines 2152-1, 2152-2 are connected to the first and second communication ports 2260a, 2260b via rotary joints 2160, 2170, respectively. A speed control valve 2182 for adjusting the speed at which the piston 2210 ascends is provided on the compressed air line 2152-1. Further, a speed control valve 2184 for adjusting the speed at which the piston 2210 is lowered, and a speed control valve 2186 for preventing the piston 2210 from suddenly ejecting from the polishing table are provided on the compressed air line 2152-2.

Next, the operation of pressing the member 2200 in the peeling process of the polishing pad 2108 will be described. The fifteenth pattern shows a state diagram of the peeling process of the polishing pad. The top view of the fifteenth figure shows a state diagram of the pressing member 2200 in the normal use, which is not a peeling process, and the figure below shows the state of the pressing member 2200 in the peeling process.

In general use, as shown in the upper diagram of Fig. 15, the piston 2210 is pressurized downward by causing air to flow from the first communication port 2260a through the compressed air line 2152-1. Specifically, the control unit 2140 controls the valve 2158-1 to "open (air supply)" and control the valve 2158-2 to "close (exhaust)". Thereby, since the partition member 2270 is pressed down, the action of the piston 2210 and the partition member 2270 is also pressed down. The piston 2210 that has been depressed downward is in a state of abutting against the stopper member 2240.

In addition, as shown in the lower figure of the fifteenth figure, in the stripping process, by making air The second communication port 2260b flows in through the compressed air line 2152-2, and presses the piston 2210 upward. Specifically, the control unit 2140 controls the valve 2158-1 to "close (exhaust)", and the valve 2158 -2 is controlled to "open (supply)". Thereby, since the partition member 2270 is pushed up, the movement of the piston 2210 and the partition member 2270 is also pushed up. The piston 2210 pushed up to the top presses the back side 2108b of the polishing pad 2108 to peel off the polishing pad 2108.

According to this embodiment, the influence on the polishing performance of the substrate 2102 can be suppressed, and the peeling operation of the polishing pad 2108 can be saved. That is, in the present embodiment, as shown in the lower drawing of Fig. 15, since the peeling operation of the polishing pad 2108 is assisted by the pressing force of the piston 2210, the polishing pad 2108 can be easily peeled off. Further, in the present embodiment, it is not necessary to form the head protruding from the polishing table in advance on the polishing pad, and it is not necessary to peel off the polishing pad using the retracting tool. As a result, the influence on the polishing performance of the substrate 2102 can be suppressed, and the peeling operation of the polishing pad 2108 can be made labor-saving.

<Fourth embodiment>

Next, a polishing apparatus according to a fourth embodiment will be described. Fig. 16 is a view showing a state of the polishing apparatus of the fourth embodiment. The fourth embodiment differs from the third embodiment in that a control signal for controlling the switches of the valves 2158-1, 2158-2 is input to the valves 2158-1, 2158-2 via the rotary connector. The description of the same portions as those of the third embodiment will be omitted.

As shown in Fig. 16, the compressed air line 2152 is input to the rotary joint 2160 and, after passing through the rotary joint 2160, is branched into two-system compressed air lines 2152-1, 2152-2. Valves 2158-1, 2158-2 of the switching line are respectively disposed on the compressed air lines 2152-1, 2152-2.

In addition, a control signal line 2192 that conveys a control signal for controlling the switches of the valves 2158-1, 2158-2 is input to the rotary connector 2190 and is connected to the rotary connector 2190 via the rotary connector 2190. Valve 2158-1, 2158-2.

When the polishing apparatus 2100 is normally used, the control unit 2140 controls the valve 2158-1 to "open (air supply)" and control the valve 2158-2 to "close (exhaust)". Thereby, since the partition member 2270 is pressed down, the action of the piston 2210 and the partition member 2270 is also pressed down. The piston 2210 that has been depressed to the lower side is in a state of abutting against the stopper member 2240.

Further, in the peeling step, the control unit 2140 controls the valve 2158-1 to "close (exhaust)" and control the valve 2158-2 to "open (air supply)". Thereby, since the partition member 2270 is pushed up, the movement of the piston 2210 and the partition member 2270 is also pushed up. The piston 2210 pushed up to the top presses the back surface 2108b of the polishing pad 2108 to peel off the polishing pad 2108.

According to the present embodiment, as in the third embodiment, the influence on the polishing performance of the substrate 2102 can be suppressed, and the peeling operation of the polishing pad 2108 can be reduced. That is, in the fourth embodiment, in the peeling step, since the peeling operation of the polishing pad 2108 is assisted by the pressing force of the piston 2210, the polishing pad 2108 can be easily peeled off. Further, in the present embodiment, it is not necessary to form the head protruding from the polishing table in advance on the polishing pad, and it is not necessary to peel off the polishing pad using the retracting tool. As a result, the influence on the polishing performance of the substrate 2102 can be suppressed, and the peeling operation of the polishing pad 2108 can be made labor-saving.

<Fifth Embodiment>

Next, a polishing apparatus according to a fifth embodiment will be described. Fig. 17 is a view showing a polishing apparatus of a fifth embodiment. The fifth embodiment differs from the third and fourth embodiments in that a polishing pad peeling tool is attached to the polishing apparatus 2100 (pressing member 2200) when the peeling step is performed. About the same parts as the third and fourth embodiments The description is omitted.

As shown in Fig. 17, the polishing pad peeling tool 2300 includes a compressed air port 2302 connected to a compressed air supply source provided outside the polishing device 2100, and compressed air that carries compressed air supplied from the compressed air port 2302. Lines 2304-1, 2304-2.

The compressed air line 2304-1 is provided with a valve 2306 for switching the compressed air line 2304-1, and a speed control valve 2312 for adjusting the speed at which the piston 2210 is raised. Further, a valve 2308 for switching the compressed air line 2304-2, a speed control valve 2314 for adjusting the speed at which the piston 2210 is lowered, and a nozzle for preventing the piston 2210 from popping up from the grinding table are provided in the compressed air line 2304-2. Speed control valve 2316.

Further, a tool connection port 2322 communicating with the first space 2262 and a tool connection port 2324 communicating with the second space 2264 are connected to the cylinder 2260. When the peeling process of the polishing pad 2108 is performed, the operator connects the compressed air line 2304-1 of the polishing pad peeling tool 2300 to the tool port 2322, and connects the compressed air line 2304-2 to the tool port 2324.

When the polishing apparatus 2100 is normally used, the control unit 2140 controls the valve 2306 to "open" and the valve 2308 to "close". Thereby, since the partition member 2270 is pressed down, the action of the piston 2210 and the partition member 2270 is also pressed down. The piston 2210 that has been depressed to the lower side is in a state of abutting against the stopper member 2240.

Further, in the peeling step, the control unit 2140 controls the valve 2306 to "close" and controls the valve 2308 to "open". Thereby, since the partition member 2270 is pushed up, the movement of the piston 2210 and the partition member 2270 is also pushed up. The piston 2210 pushed up to the top presses the back surface 2108b of the polishing pad 2108 to peel off the polishing pad 2108.

According to the third embodiment, the base can be suppressed as in the third embodiment. The influence of the polishing performance of the plate 2102 can save labor for the peeling operation of the polishing pad 2108. That is, in the fifth embodiment, in the peeling step, since the peeling operation of the polishing pad 2108 is assisted by the pressing force of the piston 2210, the polishing pad 2108 can be easily peeled off. Further, in the present embodiment, it is not necessary to form the head protruding from the polishing table in advance on the polishing pad, and it is not necessary to peel off the polishing pad using the retracting tool. As a result, the influence on the polishing performance of the substrate 2102 can be suppressed, and the peeling operation of the polishing pad 2108 can be made labor-saving.

108‧‧‧ polishing pad

108a‧‧‧Grinding surface

108b‧‧‧Back

109‧‧‧Adhesive

110‧‧‧ polishing table

110a‧‧‧ Attachment

111‧‧‧ resin layer

Claims (11)

A polishing apparatus characterized by comprising: a polishing table having an attachment surface to which a polishing pad for polishing a substrate is attached; and a resin layer attached to the attachment surface of the polishing table, and Between the polishing table and the polishing pad, the resin layer includes a coating layer of an adhesive containing an enamel resin provided on the bonding surface, and an adhesive adhered to the polishing pad by the polishing pad is attached to the polishing layer. The coating layer of the adhesive of the enamel resin and the coating layer of the adhesive containing the oxime resin are peeled off. The polishing apparatus according to claim 1, wherein the resin layer comprises a resin-based coating material which is applied to the surface of the bonding surface and which is mixed with a ceramic. The polishing apparatus according to claim 1 or 2, wherein the polishing table comprises at least one of tantalum carbide, stainless steel, a resin, and alumina. A polishing apparatus according to claim 1 or 2, further comprising an adhesive for a polishing pad interposed between the base resin layer and the polishing pad. A polishing apparatus according to claim 1 or 2, further comprising: a control unit that pressurizes or decompresses a back surface of the polishing pad that is bonded to the polishing pad of the polishing table, wherein the control unit is Pressing the back surface of the polishing pad in the peeling step of peeling the polishing pad from the polishing table; or pressing the back surface of the polishing pad in the attaching step of attaching the polishing pad to the polishing table stress reliever. For example, in the grinding device of claim 1 or 2, further comprising a pressing portion And a back surface of the polishing pad that is opposite to the polishing surface of the polishing pad, wherein the pressing member includes a piston that is attached to the polishing table a hole in the attachment surface of the polishing pad; and a driving member that drives the piston in a direction in which the back surface of the polishing pad is pressed in the peeling step. The polishing apparatus according to claim 1, wherein the coating layer of the oxime resin-containing adhesive is formed by heat-treating a coating layer of an enamel-containing adhesive applied to the bonding surface of the polishing table. A method for attaching a polishing pad, characterized in that a resin layer is provided on the attachment surface of a polishing table having a bonding surface to which a polishing pad for polishing a substrate is attached, and a resin layer provided on the bonding surface is provided The layer is subjected to heat treatment, and the polishing pad is attached to the tantalum resin layer after the heat treatment described above through an adhesive of the polishing pad. A polishing pad cloth changing method characterized in that, in the method of attaching a polishing pad of claim 8 or the method of peeling the polishing pad from the polishing table, peeling off the polishing pad from the polishing table In the step, the back surface of the polishing pad attached to the polishing table is pressed against the back surface of the polishing pad, or the back surface of the polishing pad is pressurized by attaching the polishing pad to the polishing table. Or decompression. The polishing pad cloth changing method according to claim 9, wherein in the peeling step of the polishing pad, a piston provided in a hole formed in the bonding surface of the polishing pad to which the polishing pad is attached is driven by The direction of the back surface of the aforementioned polishing pad is extruded. A polishing apparatus characterized by comprising: a polishing table having an attachment surface to which a polishing pad for polishing a substrate is attached; and a resin layer attached to the attachment surface of the polishing table, and Between the polishing table and the polishing pad; the enamel resin layer includes an enamel-containing adhesive sheet attached to the bonding surface, and the polishing pad is attached to the enamel-containing adhesive sheet and contains bismuth The adhesive sheet of the resin is peeled off, and the polishing apparatus further includes an adhesive for the polishing pad interposed between the resin layer and the polishing pad.