TWI699837B - Multi-grain selection method - Google Patents

Abstract

A method for selecting multiple crystal grains is to first define a selection range containing multiple crystal grains for a film to be selected with multiple crystal grains attached, and then pick out the crystal grains around the selection range so that the selection range is affected by a crystal grain The partition formed after the removal is surrounded, and then a push seat is used to push one of the to-be-selected films corresponding to the selected area, and the die in the selected area is pressed against and attached to an attachment surface In this way, the present invention can simultaneously select multiple dies by simple structure and steps to produce good efficiency and avoid affecting unselected dies.

Description

Multi-grain selection method

The present invention is related to the crystal grain selection process, and particularly relates to a multi-crystal grain selection method capable of simultaneously selecting multiple crystal grains.

For semiconductor dies or LED dies, in the bad die selection or classification selection process, the wafer is first pasted on a soft film commonly known as blue tape, and then cut Into a large number of dies. Then, for the selection of bad crystals, an image capture device (such as a CCD camera) can be used to detect the appearance of the crystals to determine whether the crystals are good or not and to confirm their positions, and then pick out the defective products from the soft film; For classification selection, an image capture device can be used to confirm the position of the classified dies, and a pick-and-place device (such as a pick-and-place swing arm) can be used to remove and classify these dies according to their specifications or grades. place.

Whether the wafer has been cut into die but the die has not yet been sorted, or the die has been sorted but has not been picked to the sorting place or other predetermined location, it may require a large number of die transfer procedures. That is, the pick-and-place device is used to move the crystal grains from the original soft film to a predetermined place (for example, another soft film), so that the crystal grains can be sorted and placed by the crystal grain transfer procedure, or the subsequent processes can be performed after the transfer.

Please refer to China's patent number I581022. The conventional method for selecting crystal grains is to use an ejector seat to push the crystal grains upward under the soft film, and then use a swing arm with a vacuum nozzle to suck the crystal grains above the soft film. The crystal grains are moved to another flexible film by swinging. In order to make the vacuum suction nozzle can effectively suck the die, the ejector seat is provided with a vacuum suction hole and a thimble. When the vacuum nozzle sucks the die, the vacuum suction hole of the ejector seat sucks the original soft film, and the thimble extends The push seat deforms the original soft film and reduces the bonding area between it and the crystal grain, thereby separating the crystal grain from the original soft film.

However, when the conventional method for selecting crystal grains uses a pick-and-place device such as the one described above, the crystal grains on the soft film can only be picked up one by one, and multiple grains cannot be picked up at the same time. At present, the highest efficiency of single-chip sorting equipment on the market is 1 to 2 million per day. For example, a 6-inch wafer can be cut into about 2 million dies. If the conventional die selection method is used to select the dies one by one , It takes more than a day. In other words, when a large number of crystal grains need to be transferred, it is quite time-consuming to use the conventional crystal grain selection method to perform the crystal grain transfer process, which is not conducive to reducing costs. However, if more pick-and-place devices are to be added to select multiple dies at the same time, it will inevitably cause problems such as complex structure and bulky equipment.

In view of the above-mentioned shortcomings, the main purpose of the present invention is to provide a method for selecting multiple crystal grains, which can produce good efficiency by selecting multiple crystal grains at the same time through simple structure and steps.

To achieve the above objective, the method for selecting multiple crystal grains provided by the present invention includes the following steps:

Define a selection range for a to-be-selected adhesive film with a plurality of crystal grains attached, and the selection range includes a part of the plurality of crystal grains and the part includes the plurality of crystal grains;

Picking out the surrounding crystal grains of the selected range, so that the selected range is surrounded by a dividing road formed after the picking of a crystal grain; and

A pushing seat is used to push one of the to-be-selected adhesive films corresponding to the selected area, and the crystal grains in the selected area are pressed against and attached to an attachment surface.

In the embodiment of the present invention, the aforementioned method for selecting multiple crystal grains can be further subdivided into the following steps:

a) Adhere a plurality of dies to one of the adhesive surfaces of an adhesive film to be selected;

b) Define a selection range for the crystal grains, the selection range includes a part of the plurality of crystal grains and the part includes the plurality of crystal grains;

c) Picking out the surrounding crystal grains of the selected range, so that the selected range is surrounded by a partition without any crystal grains, and the width of the partition is greater than the width of the crystal grain;

d) The adhesive film to be selected is set on a base of a first crystal placement device, so that one of the adhesive films to be selected and the mounting surface facing the opposite direction of the adhesive surface face the base, and the first placement A pushing surface of a pushing seat of the crystal device faces the mounting surface of the film to be selected, and the shape and area of the pushing surface of the pushing seat are substantially in line with the shape and area of the selected range;

e) Make the relative position of the first crystal placement device and a second crystal placement device in a reposting position, so that the adhesive surface of the to-be-selected adhesive film is separated from one of the second crystal placement device by a predetermined distance Face to face; and

f) Move the pushing seat relative to the base to push one of the to-be-selected films on a block corresponding to the selected range with its pushing surface, and then press the die in the selected range against the first The adhesion surface of the two crystal device, at this time, the adhesion force of the adhesion surface is greater than the adhesion force of the adhesion surface of the adhesive film to be selected, so that the die in the selected range is attached to the adhesion surface.

Wherein, steps a, b, c, and d can be performed sequentially, so that the step c of picking out the dies around the selected range is not performed on the first die placement device, that is, the subsequent step f of transferring the die in the selected range It is done on different machines. Alternatively, the to-be-selected adhesive film with the dies attached to it can be placed on the base of the first crystal placement device, or the dies can be attached to the to-be-selected film that has been placed on the base of the first die placement device. Then, the steps of defining the selection range and removing the dies around the selection range are performed, so that the step c of removing the dies around the selection range is performed on the first chip placement device, that is, with subsequent transfer of the dies in the selection range The step f is performed on the same machine.

By pushing the plastic film to be selected by the pushing seat and pressing the die in the selected range against the attachment surface of the second die placement device, a batch of die on the plastic film to be selected can be selected to On the attachment surface of the second crystal placement device, by displacing the pushing seat to a position corresponding to different selection ranges and performing this pushing step on each selection range (that is, repeating step f), The dies on the adhesive film to be selected are selected in batches to different areas of the attachment surface of the same second die placement device, or selected to the attachment surfaces of multiple second die placement devices, so that the die When transferring from the first wafer placement device to the second wafer placement device, the die is attached to a predetermined placement (for example, classified placement).

The multi-die selection method of the present invention pushes a plurality of die in the selected range by the ejector seat to transfer the selected die, so multiple pick-and-place devices are not needed to select multiple Die and produce good efficiency. Moreover, by picking out the dies around the selected range before transferring the dies, it can avoid destroying the dies around the selected range when pushing the film to be selected, or by mistakenly transferring the dies around the selected range to this The adhesion surface can improve the accuracy of die transfer.

The aforementioned multi-die selection method achieves good efficiency by pushing the plastic film to be selected by the ejector seat to transfer the die, but it can also be achieved by pushing a die of the aforementioned second die placement device. The adhesive film achieves the same effect. Therefore, the present invention further provides another method for selecting multiple crystal grains, which includes the following steps:

Define a selection range for a to-be-selected attachment (for example, but not limited to, a film to be selected) to which a plurality of crystal grains are attached, the selection range includes a part of the plurality of crystal grains and the part includes a plurality of the crystal grains;

Picking out the surrounding crystal grains of the selected range, so that the selected range is surrounded by a dividing road formed after the picking of a crystal grain; and

Use a top stacker to push one of the die attach films facing the attachment to be selected corresponding to the selected range or the area of the selected range and at least part of the partition, and the crystals in the selected range The particles are pressed against and attached to an attachment surface of the crystal placement adhesive film.

The detailed structure, characteristics, assembly or use of the method for selecting multiple crystal grains provided by the present invention will be described in the detailed description of the following implementations. However, those with ordinary knowledge in the field of the present invention should be able to understand that these detailed descriptions and specific examples for implementing the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the patent application of the present invention.

The applicant first explains here that in the following embodiments and drawings, the same reference numbers represent the same or similar elements or structural features. Secondly, when it is mentioned that an element is arranged on another element, it means that the aforementioned element is directly arranged on the other element, or the aforementioned element is indirectly arranged on the other element, that is, there is still another element between the two elements. One or more other elements are provided. When it is mentioned that an element is "directly" arranged on another element, it means that no other element is arranged between the two elements. It should be noted that the various elements and structures in the drawings are illustrative for convenience and are not drawn based on actual proportions and quantities, and if it is possible in implementation, the features of different embodiments can be applied interactively.

Please refer to FIG. 1, a method 10 for selecting a multi-die provided by a first preferred embodiment of the present invention includes the following steps:

As shown in step S1 in FIG. 1 and as shown in FIGS. 2 to 4, a selection range 60 is defined for a to-be-selected adhesive film 20 with a plurality of dies 11 attached, and the selection range 60 includes the plurality of dies 11 A part of and the part includes a plurality of the crystal grains 11. In detail, this step S1 of this embodiment can be subdivided into the following steps a and b.

a) As shown in FIG. 2, a plurality of dies 11 are adhered to an adhesive surface 21 of an adhesive film 20 to be selected.

It should be noted here that FIG. 2 shows the main structure of the machine used in the multi-die selection method 10 of this embodiment, but not necessarily the initial steps of the multi-die selection method 10 The required structural state. In this embodiment, the machine for performing the multi-die selection method 10 includes a first crystal setting device 30, a second crystal setting device 40 arranged opposite to the first crystal setting device 30, and a The image between the first and second crystal setting devices 30 and 40 and which can be horizontally displaced relative to the first and second crystal setting devices 30 and 40 (that is, along the XY plane) to leave the image between the first and second crystal setting devices 30 and 40 The capture device 50 (such as a CCD camera), the first and second crystal placement devices 30, 40 respectively include a base 31, 41 and a push seat 32, 42, each of the bases 31, 41 is in a hollow ring shape, Therefore, the center has an accommodating space 311, 411, and the pushing seats 32, 42 can be disposed horizontally (that is along the XY plane) and vertically (that is, along the Z axis) relative to the bases 31 and 41, respectively. For the accommodating spaces 311 and 411, for example, in this embodiment, the push seats 32 and 42 are vertically displaced, and the bases 31 and 41 are horizontally displaced. The shape of the pushing seat 32, 42 is not limited. It can have sections that taper toward the pushing surface 321, 421 as shown in FIG. 2, and the overall width or outer diameter can be the same, as long as the top of the pushing seat 32 The shape and area of the pushing surface 321 substantially conform to the shape and area of the selection range 60, and the area of the pushing surface 421 of the pushing seat 42 is greater than or equal to the area of the selection range 60. This part will be described in detail below.

The adhesive film to be selected 20 includes a base layer 22, and an adhesive layer 23 covering a surface of the base layer 22. The other surface of the base layer 22 is a mounting surface 24, and the adhesive layer 23 is exposed on the outer surface This is the adhesive surface 21. The to-be-selected adhesive film 20 can be (but not limited to) a plastic film that can reduce the adhesive force of the adhesive surface 21 through a dissociation step (such as heating, illumination, temperature control, etc.). For example, the to-be-selected adhesive The film 20 can be a thermal release tape. The base layer 22 of the thermal release tape is made of polyester, and the material of the adhesive layer 23 is foaming adhesive. After the adhesive layer 23 is heated to 90°C, the adhesive force of the adhesive surface 21 will be greatly reduced; alternatively, the to-be-selected adhesive film 20 can be a UV release tape, and the base layer 22 is made of polyolefin (Polyolefin), and the material of the adhesive layer 23 is acrylic adhesive. After the adhesive layer 23 is irradiated by ultraviolet light, the adhesive force of the adhesive surface 21 will be greatly reduced; or, the adhesive film to be selected 20 can be a temperature-controllable dissociation adhesive film. When the temperature of the adhesive layer 23 reaches a certain temperature, the adhesive force of the adhesive surface 21 will be greatly reduced.

This step a is mainly to adhere the die 11 to be selected to the adhesive surface 21 of the adhesive film 20 to be selected. More specifically, the adhesive surface 21 is usually attached by a wafer 12 (as shown in FIG. 3). ) Die 11 that have been cut and classified or graded by point measurement. The dice 11 are cut on a plastic film (such as blue film) (not shown in the figure) and then reposted to the to-be-selected The adhesive surface 21 of the adhesive film 20 is therefore in a state where the front surface 112 is adhered to the adhesive surface 21 and the back surface 114 is exposed (as shown in FIG. 2). Then, the die 11 will be transferred to a predetermined place, for example, the same type Or dies of the same grade are attached to the same adhesive film, or different types of dies are arranged on the same adhesive film in a specific way according to the requirements of subsequent processes. In other words, this step a is usually attached to the adhesive surface 21 A considerable number (for example, millions) of dies 11 to be selected. In order to simplify the diagram and facilitate the description, only a few dies 11 are drawn in FIGS. 2 and 6 to 11, which do not correspond to actual conditions or the number of dies in other diagrams.

b) As shown in FIGS. 3 and 4, a selection range 60 is defined for the crystal grains 11, the selection range 60 includes a part of the plurality of crystal grains 11 and the part includes the plurality of crystal grains 11.

The wafer 12 shown in FIG. 3 schematically shows a state in which the die 11 is cut into the die 11 on the aforementioned adhesive film and the die 11 is spaced by the die 11 with a circle, which is usually equivalent to the waiting state. The distribution range of the dies 11 on the adhesive film 20 is selected. In order to simplify the diagram, the dies 11 are not drawn in FIG. 3. Fig. 4 is a schematic diagram of a part of the dies 11. In this embodiment, the selection range 60 defined in step b is rectangular, which includes ninety-six dies 11. However, the shape of the selection range 60 and its The number of included dies 11 is not limited to this. As shown in FIG. 3, the selected range 60 can be round, rectangular, square or any other shape. The die 11 in the selection range 60 will be simultaneously pushed by one of the pushing surfaces 321 of the pushing seat 32 in the subsequent steps. Therefore, the shape and area of the selection range 60 should be substantially in line with the pushing surface 321 of the pushing seat 32. The shape and area of the pushing surface 321 are sufficient. In other words, the pushing surface 321 of the pushing seat 32 can also be round, rectangular, square or any other shape. In fact, the shape and area of the selection range 60 can be defined according to the shape and area of the pushing surface 321 of the pushing seat 32, or the first crystal placement device 30 can be in a form that can replace the pushing seat, or According to the shape and area of the required selection range 60, a suitable pushing seat 32 is selected. Before the selection range 60 is defined, the image capturing device 50 can be used to capture the images of the dies 11 toward the adhesive surface 21 to obtain the position information of the dies 11. Then, in this step b, the software The selection range 60 is divided, and the pusher 32 corresponding to the selection range 60 is automatically selected by the software.

c) Step S2 shown in Fig. 1 and as shown in Fig. 5, pick out the crystal grains 11 around the selected range 60, so that the selected range 60 is surrounded by a partition 62 formed by picking out a crystal grain . That is, no crystal grains are provided in the separation channel 62 to separate the crystal grains 11 in the selected range 60 from other crystal grains 11.

This step c can be performed by any conventional pick-and-place device for selecting a single die, that is, one die 11 is removed at a time. Step c of this embodiment only picks out a circle of die 11 around the selection range 60, so that the width of the partition 62 is only slightly larger than the width of a die 11, more specifically, due to the selection of this embodiment The range 60 is close to the edge of the outermost die 11, and the width of the partition 62 is the width of the selected die plus the distance between the two opposite sides of the die, and since the die of this embodiment The grain 11 is rectangular and has two widths D21 and D22 (D22>D21), so that the horizontal section width D11 and the vertical section width D12 of the divider 62 are not equal (D12>D11), that is, the divider 62 of this embodiment Unequal width, regardless of whether the divider is of equal width or not, the width of each section should be greater than the width of the die parallel to the width. For example, the horizontal section width D11 of the divider 62 in this embodiment is greater than that of the die 11 The width D21 (the width D21 is parallel to the width D11), and the vertical section width D12 of the dividing lane 62 is greater than the width D22 of the die 11 (the width D22 is parallel to the width D12). However, this step c can also pick out two or more dies 11 around the selection range 60, so that the widths D11 and D12 of the partition 62 are respectively greater than the widths D21 and D21 of the two or more dies 11 D22. In addition, the divider 62 can have the same width or unequal width as a whole, and the die 11 can also be square with only a single width (that is, the maximum width), as long as the widths D11 and D12 of each section of the divider 62 are respectively It suffices to be greater than one width D11, D22 of the die 11.

As shown in step S3 in FIG. 1 and as shown in FIGS. 6 to 8, an ejection seat 32 is used to push one of the plastic films 20 to be selected corresponding to the block 25 of the selection range 60, and the selection range 60 The inner die 11 is pressed against and attached to an attachment surface 43. In detail, this step S3 in this embodiment can be subdivided into the following steps d, e and f.

d) As shown in Figures 2 and 6, the adhesive film 20 to be selected is placed on the base 31 of the first crystal placement device 30 so that the mounting surface 24 of the adhesive film 20 to be selected faces the base 31, and The pushing surface 321 of the pushing seat 32 of the first wafer placement device 30 faces the mounting surface 24 of the adhesive film 20 to be selected, and the shape and area of the pushing surface 321 of the pushing seat 32 substantially conform to the selected range The shape and area of 60.

More specifically, the to-be-selected adhesive film 20 is laid on a surface of the base 31 with its mounting surface 24 facing the surface, and shields the opening of the accommodating space 311 on the surface, so that the push seat 32 is located below the mounting surface 24 of the adhesive film 20 to be selected.

It is worth mentioning that this step d can be performed after the aforementioned steps a, b, and c are completed, that is, when the selected adhesive film 20 is set on the base 31, the die 11 has been adhered and the die 11 has been selected. The steps of selecting the range 60 and removing the die 11 around the selected range are shown in FIG. 6. Alternatively, the sequence of this step d may also be before the aforementioned step a, that is, when the die 11 is adhered to the adhesive film 20 to be selected, the adhesive film 20 to be selected is already set on the base 31. Alternatively, the sequence of this step d can also be after the aforementioned step a but before the steps b and c, that is, the die 11 is first adhered to the adhesive film 20 to be selected, and then the adhesive film 20 to be selected is placed on the first position. The crystal device 30 then performs the steps of defining the selection range 60 and picking out the die 11 around the selection range.

e) As shown in Figure 7, the relative position of the first crystal setting device 30 and the second crystal setting device 40 is at a transfer position P, so that the adhesive surface 21 of the to-be-selected adhesive film 20 is An attachment surface 43 of the crystal device 40 faces each other at a predetermined distance D3.

In detail, in addition to the aforementioned base 41 and the push seat 42, the second crystal placement device 40 of this embodiment further includes an attachment member, which can be a die placement film 44 (such as a blue film). As shown in FIG. 2, the die attach film 44 includes a base layer 441, and an adhesive layer 442 covering one surface of the base layer 441. The other surface of the base layer 441 is a mounting surface 443. The adhesive The surface of the layer 442 exposed to the outside is the attachment surface 43. The die attach film 44 is laid on the surface with the mounting surface 443 facing one surface of the base 41, and shields the accommodating space 411 on the surface. The opening allows the push seat 42 to be located above the mounting surface 443 of the crystal glue film 44. The pushing seat 42 will push a part of the crystal glue film 44 with its pushing surface 421 facing the mounting surface 443 of the crystal glue film 44 in a subsequent step.

The first and second crystal placement devices 30, 40 are arranged in such a way that the adhesive surface 21 of the to-be-selected adhesive film 20 and the attachment surface 43 of the second crystal placement device 40 face each other in parallel, and the first, The two crystal devices 30 and 40 are capable of relative displacement substantially perpendicular to the adhesion surface 21 and the adhesion surface 43 (that is, along the Z axis). Therefore, the image capturing device 50 is moved away from the adhesive film 20 to be selected. After the position of the surface 21, the first and second crystal placement devices 30, 40 can be relatively displaced to the transfer position P. At this time, the predetermined distance D3 between them is such that the subsequent step f only needs to move the pushing seats 32, 42. Can proceed.

f) As shown in Figure 8, by simultaneously/single horizontal movement of the pushing seat 32 and/or the base 31 and vertical movement of the pushing seat 32, that is, moving the pushing seat 32 relative to the base 31, The pushing surface 321 pushes one of the plastic films 20 to be selected corresponding to the block 25 of the selection range 60, and then presses the die 11 of the selection range 60 against the attachment of the second crystal placement device 40 At this time, the adhesive force of the adhesive surface 43 is greater than the adhesive force of the adhesive surface 21 of the adhesive film 20 to be selected, so that the die 11 within the selected range 60 is attached to the adhesive surface 43.

More specifically, when the original position of the pushing seat 32 does not correspond to the selected range 60, the pushing seat 32 and/or the base 31 are moved horizontally at the same time/singly, so that the pushing seat 32 can be positioned. At the position corresponding to the selection range 60, the pushing seat 32 then moves vertically in the direction of the film 20 to be selected to push the block 25 of the film 20 to be selected. At this time, the block 25 will be flexible Since there are no crystal grains around the selected range 60, the elastic deformation of the block 25 will not affect other crystal grains 11.

In this step f of the present embodiment, the ejector seat 42 of the second wafer placement device 40 is also made to push one of the wafer placement films 44 with its ejection surface 421 corresponding to the block 444 of the selected range 60 at the same time. In this way, the displacement of the pushing seat 32 and the deformation of the block 25 of the adhesive film 20 to be selected can be reduced, thereby improving efficiency and avoiding damage to the adhesive film 20 to be selected. The pushing surface 421 of the pushing seat 42 of the second crystal placement device 40 is preferably designed with a shape and area substantially equal to the selected range 60, but it can also be larger than the selected range 60.

As shown in FIG. 8, since the adhesive film 20 to be selected has a slight thickness, the block 25 is pushed to the highest plane (that is, the plane where the chip 11 is pushed) is slightly larger than the pushing surface 321, The distribution range of the pushed die 11 is slightly smaller than the plane and slightly smaller than the pushing surface 321, and the distribution range, the range of the plane, and the range in between may all be the selected range 60. However, the difference between the plane, the distribution range and the pushing surface 321 is actually quite small. It is shown enlarged in FIG. 8 for illustration. Therefore, the "shape of the pushing surface" in the present invention And area is substantially equivalent to the shape and area of the selected range", "substantially" means that the aforementioned small difference is regarded as no difference. In other words, the present invention does not limit the shape and area of the pushing surface to be completely equivalent to the selected The shape and area of the range, as long as the difference between the pushing surface and the selected range is less than or equal to the difference between the pushing surface and the aforementioned plane or distribution range, it belongs to the present invention "The shape and area of the pushing surface is substantially equivalent to the selected range "The shape and area of"

In the case that the adhesive film 20 to be selected can reduce the adhesive force through the dissociation step, the pushing seat 32 of the first crystal placement device 30 may (but not limited to) be provided with a dissociation member 33 for placing it on the top When the pushing seat 32 pushes the block 25 of the adhesive film 20 to be selected, the dissociation step is performed on the block 25. For example, in this embodiment, the case where the adhesive film 20 to be selected is a thermally dissociated adhesive film is taken as an example, and the dissociation action member 33 is a heater for the die 11 on the adhesive film to be selected 20 to be During the transfer, the local heating of the adhesive film 20 to be selected reduces the adhesive force of the adhesive surface 21. In the case where the adhesive film to be selected 20 is a photodissociation adhesive film, the dissociation effect member 33 is a light emitter (such as a UV lamp) to correct when the die 11 on the adhesive film to be selected 20 is about to be transferred The part of the adhesive film 20 to be selected irradiates light to reduce the adhesive force of the adhesive surface 21. In the case where the to-be-selected film 20 is a temperature-controllable dissociation film, the dissociation member 33 is a temperature controller, so that when the die 11 on the to-be-selected film 20 is about to be transferred The local temperature control of the adhesive film 20 is selected to reduce the adhesive force of the adhesive surface 21. Alternatively, the dissociation member 33 may not be provided in the pushing seat 32, but an external heater, illuminator or temperature controller may heat, illuminate or control the temperature of the plastic film 20 to be selected. 20 can also be heated, illuminated or temperature controlled before being set on the base 31. Thereby, before the die 11 in the selection range 60 is pressed against the attachment surface 43 of the second crystal placement device 40, the to-be-selected adhesive film 20 can undergo the dissociation step to reduce the adhesive force of the adhesive surface 21 The adhesion force is reduced to less than the adhesion surface 43, so that the die 11 pressed against the adhesion surface 43 can be easily transferred to the adhesion surface 43. For example, in this embodiment, the dissociation step can be performed on the pushing seat 32 is about to push the block 25 or during the process of pushing the block 25 by the pushing seat 32. Alternatively, the adhesive film 20 to be selected can also be an adhesive film with a fixed adhesive force, as long as the adhesive force is less than the adhesive force of the adhesion surface 43.

After the die 11 in the selection range 60 is attached to the attachment surface 43, the push seats 32 and 42 are retracted into the accommodating spaces 311 and 411, respectively, and the area 25 of the adhesive film 20 and the area of the die-position adhesive film 44 are to be selected The block 444 also returns to its original shape, as shown in FIG. 9, at this time, each of the die 11 attached to the attachment surface 43 is attached to the attachment surface 43 with its back surface 114 to expose the front surface 112. The pushing seat 42 of the second crystal placement device 40 may (but not limited to) be provided with a plurality of vacuum suction holes 422 penetrating the pushing surface 421, and the vacuum suction holes 422 are connected with a vacuum source 52. After the pushing seat 42 pushes the crystal gel film 44 (for example, when the pushing seat 42 is retracted into the accommodating space 411), the vacuum source 52 pushes on the pushing seat 42 through the vacuum suction holes 422 The surface 421 generates a vacuum suction force to adsorb the block 444 of the crystal gel film 44, so that the block 444 of the crystal gel film 44 can be quickly pulled back to its original shape and laid flat on the base 41.

By the aforementioned multi-die selection method of the present invention, a batch of die 11 on the adhesive film 20 to be selected (that is, die 11 in the selection range 60) can be selected to be attached to the second die placement device 40 On the surface 43, if a plurality of selection ranges 60 are defined for the die 11 on the adhesive film 20 to be selected, then the push seats 32, 42 and the bases 31, 41 are horizontally displaced separately or simultaneously (for example, as shown in the figure) The position of 9 is shifted to the position of Fig. 10), so that the pushing seats 32 and 42 can be positioned in the corresponding selection ranges 60, and then the pushing steps are performed on the selection ranges 60 respectively (that is, step f is repeated), namely The die 11 on the adhesive film 20 to be selected can be selected on the attachment surface 43 of the second die placement device 40 in batches.

It is worth mentioning that when the method for selecting multiple crystal grains of the present invention is applied to classify or place the crystal grains in grades, usually different types or grades of crystal grains are glued to different adhesive films. It is the aforementioned die placement glue film 44, therefore, there may be a plurality of second die placement devices 40 for the die 11 of different selection ranges 60 to be selected on the attachment surfaces 43 of different second die placement devices 40.

Thereby, the multi-die selection method of the present invention does not need to use multiple pick-and-place devices, and multiple die 11 can be selected at the same time in a single selection operation to produce good efficiency. Moreover, by first removing the dies 11 around the selection range 60 before transferring the dies 11, it is possible to avoid destroying the dies 11 around the selection range 60 when pushing the film 20 to be selected, or mistakenly placing the dies 11 around the selection range 60 The die 11 is also transferred to the attachment surface 43 of the second die placement device 40, so the accuracy of die transfer can be improved.

It is worth mentioning that the second crystal placement device 40 can also be in a form without the pushing seat 42, and the base 41 is a platform without the accommodating space 411. In this case, due to the The die attach film 44 does not need to be pushed, so the die attach film 44 can also be replaced with other non-adhesive film attachments (not shown in the figure). For example, the attaching member can be a conductive plate Body (such as a metal plate) and electrically connected to an electrostatic generator (not shown in the figure) to generate adhesion on the adhesion surface of the attachment by the static electricity provided by the electrostatic generator (that is, electrostatic attraction ); Or, the attachment can be a plate provided with a plurality of vacuum suction holes (not shown in the figure), and the vacuum suction holes are connected with a vacuum source (not shown in the figure) to use the The vacuum source passes through the vacuum suction holes to cause the adhesion surface of the attachment to produce adhesion (that is, vacuum suction). In particular, the second crystal setting device 40 may also be a turning device, and the second crystal setting device 40 is more likely to be in a form without a push seat and adopt the aforementioned attachment. In the case where the second crystal placement device 40 is a flipping device, step a is to make each of the die 11 adhere to the adhesive surface 21 of the adhesive film 20 to be selected with its back surface 114 to expose the front surface 112, and the die 11 When transferred to the second wafer placement device 40, the front surface 112 is attached to the attachment surface 43 and the back surface 114 is exposed. Then, the second wafer placement device 40 transfers the die 11 to another wafer placement film. (Not shown in the figure) so that each of the die 11 is exposed to the front surface 112.

In addition, the first crystal setting device 30 may not be provided with the pushing seat 32, and only the second crystal setting device 40 is provided with the pushing seat 42, which defines the selection range 60 and picks out the die around the selection range 60 After 11, the top stack 42 is used to push the crystal glue film 44 to press the die 11 in the selected range 60 and adhere to the attachment surface 43. As mentioned above, the pushing surface 421 of the pushing seat 42 is preferably designed with a shape and area substantially equivalent to the selected range 60, but it can also be larger than the selected range 60, and the first crystal placement device 30 does not In the case where the pushing seat 32 is provided so that the selected die 11 is not raised, the pushing surface 421 of the pushing seat 42 of the second crystal placement device 40 can still be slightly larger than the selection range 60 but not beyond the selection The partition 62 around the range 60 avoids sticking the unselected die 11 at the periphery of the partition 62. In other words, the block 444 pushed by the pushing seat 42 corresponds to the selected range 60 or corresponds to the selected range 60 And at least part of the partition 62.

In the case that the first crystal placement device 30 is not provided with the pushing seat 32, the base 31 is a platform without the accommodating space 311. In this case, the adhesive film 20 to be selected does not need to be subjected to Therefore, the adhesive film 20 to be selected can be replaced with other non-adhesive film attachments (not shown in the figure). In other words, the die 11 to be selected is attached to the attachment surface of an attachment to be selected. The attachment to be selected may be the adhesive film 20 to be selected as described above (the attachment surface is the adhesive surface 21), but is not limited to this. For example, the attachment member to be selected is the same as the attachment member of the second crystal placement device 40 mentioned above. It can be a plate body that can generate electrostatic adsorption force on the attachment surface by an electrostatic generator, or one with multiple The vacuum suction hole can generate vacuum suction force on the attachment surface by a vacuum source.

As mentioned above, there are many possibilities for the sequence of steps a, b, c, and d. The step c of picking out the die 11 around the selection range 60 may not be performed on the first die placement device 30, that is, with subsequent transfer of the selection range Step f of die 11 in 60 is performed on a different machine; alternatively, step c of picking out die 11 around selected range 60 can also be performed on base 31 of first die placement device 30, that is, with The step f of transferring the die 11 in the selected range 60 is performed on the same machine. In the case that step c is performed on the base 31 of the first crystal placement device 30, in addition to using other pick-and-place devices to pick out the die 11 around the selected range, the first chip that can replace the ejector seat can also be used. The chip placement device 30, and the first chip placement device 30 uses another pushing seat 34 to push the portion of the to-be-selected adhesive film 20 where the chip 11 to be removed is provided so that the chip 11 to be pushed is attached to An attachment 54. As shown in FIG. 11, the attachment 54 may be another adhesive film (such as a blue film), and may be set on another wafer placement device 56 similar to the first wafer placement device 30, so that the The wafer placement device 56 pushes the attachment member 54 with a push seat 562 similar to the push seat 34 to adhere the die 11 to be removed, or the second wafer placement device 40 can be directly used as the wafer placement device. 56, and when step c is performed, the crystal placement glue film 44 is first replaced with the attachment member 54.

As shown in FIG. 12, the difference between the multi-die selection method 10' provided by a second preferred embodiment of the present invention and the aforementioned multi-die selection method 10 is mainly the step of defining the selection range 60 for the dice 11 , That is, step b.

As shown in step S11 in FIG. 12 and as shown in FIG. 13, step b of this embodiment is to first define a total selection range 60', which includes the plurality of dies 11 to be selected; Steps S12 and S13, if the shape and area of the total selection range 60' are substantially equal to the shape and area of the pushing surface 321 of the pushing seat 32, or the pushing seat can be replaced by the first crystal placement device 30 Selecting the pushing seat 32 whose shape and area of the pushing surface is substantially equal to the shape and area of the total selection range 60', then the total selection range 60' is the selection range 60 of the aforementioned method 10 of polycrystalline selection. It is sufficient to execute the aforementioned method 10 for selecting multiple crystal grains, that is, steps S21 and S31 as shown in FIG. 12.

If there is no pusher seat corresponding to the shape of the total selection range 60', or the area of the total selection range 60' is much larger than the pushing surface area of the available pusher seat, then a plurality of numbers are divided into the total selection range 60' The selection range 60 is shown in step S14 in FIG. 12; for example, the total selection range 60' shown in FIG. 13 is divided into six selection ranges 60. Then, in step S22 as shown in FIG. 12, first pick out the crystal grains 11 around the selection range 60, as shown in FIG. 14, that is, except for forming a ring shape around the total selection range 60' The main dividing road 62' further forms a plurality of criss-crossing secondary dividing roads 64 between the selected ranges 60. As a result, each selection range 60 is surrounded by a partial main dividing road 62' and a partial secondary To divide the ring 64 composed of dividers. Then, as shown in step S32 in FIG. 12, when the first crystal setting device 30 and the second crystal setting device 40 are in the reposting position P, the push seats 32, 42 are used for the selected ranges 60 respectively. The step of pushing the adhesive films 20 and 44 to transfer the dies 11 is to transfer the dies 11 in batches by horizontal displacement of the aforementioned pushing seats 32 and 42 and repeating step f. Therefore, the multi-die selection method 10' of the present embodiment can also select multiple die 11 at the same time to achieve good efficiency, and can prevent the unselected die 11 from being affected by the push seat 32.

Finally, it must be explained again that the constituent elements disclosed in the previously disclosed embodiments of the present invention are only examples and are not used to limit the scope of the case. Alternatives or changes to other equivalent elements should also be the scope of the patent application for this case. Covered.

10、10'‧‧‧Multi-die selection method 11‧‧‧Die 112‧‧‧Front 114‧‧‧Back 12‧‧‧Wafer 20‧‧‧Adhesive film to be selected 21‧‧‧Adhesive surface 22‧ ‧‧Base layer 23‧‧‧Adhesive layer 24‧‧‧Mounting surface 25‧‧‧Block 30‧‧‧First crystal placement device 31‧‧‧Base 311‧‧‧Accommodating space 32‧‧‧Top Push seat 321‧‧‧ Push surface 33‧‧‧Dissociation member 34‧‧‧ Push seat 40‧‧‧Second crystal placement device 41‧‧‧Base 411‧‧‧Accommodation space 42‧‧‧Top Push seat 421‧‧‧Pushing surface 422‧‧‧Vacuum suction hole 43‧‧‧Attaching surface 44‧‧‧Possing crystal glue film (attachment) 441‧‧‧Base layer 442‧‧‧Adhesive layer 443‧‧ ‧Mounting surface 444‧‧‧Block 50‧‧‧Image capture device 52‧‧‧Vacuum source 54‧‧‧Attachment 56‧‧‧Crystal device 562‧‧‧Pushing seat 60‧‧‧Selection range 60 '‧‧‧Total selection range 62‧‧‧Separation road 62'‧‧‧Main separation road 64‧‧‧Secondary separation road D11, D12, D21, D22‧‧‧Width D3‧‧‧Predetermined distance P‧‧‧ Repost position S1~S3, S11~S14, S21, S22, S31, S32‧‧‧Step

FIG. 1 is a flow chart of a method for selecting multiple crystal grains according to a first preferred embodiment of the present invention. Fig. 2 is a schematic cross-sectional view of a machine used in the method for selecting multiple crystal grains. 3 and 4 are schematic diagrams of step b of the method for selecting multiple crystal grains. FIG. 5 is a schematic diagram of step c of the method for selecting multiple crystal grains. Figure 6 is similar to Figure 2, but shows the state after step c has been performed. Figures 7 and 8 are similar to Figure 6, but respectively show steps e and f of the method for selecting multiple crystal grains. Fig. 9 is similar to Fig. 7 except that it shows the state after step f has been performed, and Fig. 9 further shows a vacuum source. FIG. 10 is similar to FIG. 9 except that it shows the state where step f will be performed again, and the vacuum source and an image capture device are not shown in FIG. 10. Figure 11 is a schematic cross-sectional view of the machine used to perform step c. FIG. 12 is a flowchart of a method for selecting multiple crystal grains according to a second preferred embodiment of the present invention. 13 and 14 are schematic diagrams of steps b and c of the method for selecting multiple crystal grains, respectively.

10‧‧‧Multi-grain selection method

S1~S3‧‧‧Step

Claims (22)

A method for selecting multiple crystal grains includes the following steps: defining a selection range for a to-be-selected adhesive film with a plurality of crystal grains attached thereto, the selection range including a part of the plurality of crystal grains and the portion including a plurality of the crystal grains; Picking out the surrounding crystal grains of the selected range so that the selected range is surrounded by a partition formed by the removal of a crystal grain; and using an ejector seat to push one of the to-be-selected film films corresponding to the selected range Block, and the selected crystal grains are pressed against and attached to an attachment surface. For the multi-die selection method described in item 1 of the scope of patent application, the adhesive film to be selected has an adhesive surface, the adhesive surface is adhered to the plurality of die, and the adhesive film to be selected is a thermally dissociated adhesive film, a One of a photodissociation film and a temperature-controllable dissociation film; before the crystal grains in the selected range are pressed against the attachment surface, the method for selecting multiple crystal grains further includes a dissociation step, the dissociation The steps include heating the thermally dissociated adhesive film, irradiating light to the photo-dissociated adhesive film, and controlling the temperature of the temperature-controllable dissociating adhesive film to reduce the adhesive force of the adhesive surface of the adhesive film to be selected. The method for selecting multiple crystal grains as described in item 2 of the scope of patent application, wherein a dissociation member is provided in the pushing seat, and the dissociation member is one of a heater, a light emitting device, and a temperature controller , The dissociation step is performed by the dissociation action member on the area corresponding to the selected range of the film to be selected. The method for selecting multiple crystal grains as described in item 1 of the scope of patent application, wherein the pushing seat presses the crystal grains in the selected range and attaches it to an attachment member, the attachment member has the attachment surface, and the attachment member It is one of an adhesive film, a plate that can generate electrostatic adsorption, and a plate that can generate vacuum adsorption. For example, in the multi-die selection method described in item 1 of the patent application, in the step of defining the selection range for the adhesive film to be selected with the plural crystal grains attached, a total selection range is first defined, and then the total selection A plurality of the selection ranges are divided within the range. After the selection ranges are divided, the surrounding crystal grains of the selection ranges are first selected, and then the pushing seats are pushed against the selection ranges respectively. The steps of the film. For example, the multi-die selection method described in item 1 of the scope of patent application, wherein the push seat pushes the to-be-selected film with one push surface, and the shape and area of the push surface substantially conform to the selection The shape and area of the range. The method for selecting multiple crystal grains as described in the first item of the patent application, wherein the width of each section of the partition is greater than the width of at least one crystal grain parallel to the width. For the multi-die selection method described in item 1 of the scope of patent application, in the step of using the ejector seat to push the film to be selected, the film to be selected is set on a base of a first crystal placement device On the seat, the pushing seat is movably arranged in the base, one of the mounting surfaces of the to-be-selected adhesive film faces the base and one pushing surface of the pushing seat, and the plurality of dies adhere to the Select one of the adhesive surfaces facing the opposite direction to the mounting surface, and the pushing seat moves relative to the base in the direction of the to-be-selected plastic film to push the opposite side of the to-be-selected plastic film with its pushing surface The block of the range should be selected. For the multi-die selection method described in item 8 of the scope of the patent application, before the step of pushing the film to be selected by the ejector seat, the first die placement device and the second die placement device The relative position is in a reposting position, and the second crystal setting device includes an attachment member having the attachment surface. When the relative position of the first crystal setting device and the second crystal setting device is in the reposting position, the The adhesion surface of the adhesive film to be selected and the adhesion surface of the second crystal placement device face each other at a predetermined distance. According to the method for selecting multiple crystal grains according to item 9 of the scope of patent application, wherein the second crystal placement device includes a base and an ejector seat movably arranged in the base of the second crystal placement device, The attachment is a die-attach film and is disposed on the base of the second die-attach device, and the die-attach film has an installation facing the opposite direction to the attaching surface and facing the base of the second die-attach device The ejector seat of the second wafer placement device has an ejector surface facing the mounting surface of the wafer placement adhesive film, and the area of the ejector surface of the ejector seat of the second wafer placement device is greater than or equal to the selection The area of the range; when the ejector seat of the first crystal placement device pushes the area of the selected film corresponding to the selected area with its ejection surface, the ejector seat of the second wafer placement device is also used One of the wafer placement adhesive films is pushed by its pushing surface to a block corresponding to the selected range. The pushing seat of the second wafer placement device has a plurality of vacuum suction holes penetrating the pushing surface. After the ejector seat of the device pushes the wafer placement film with its ejector surface, a vacuum source is passed through the vacuum suction holes to generate vacuum suction on the ejector surface of the second wafer placement device to attract The set crystal glue film. The method for selecting multiple crystal grains as described in item 8 of the scope of patent application, wherein the step of picking out the crystal grains around the selected range is performed when the film to be selected is set on the base of the first crystal placement device . For the multi-die selection method described in item 11 of the scope of patent application, the first die placement device can replace its pushing seat, and in the step of picking out the surrounding die of the selected range, the first die A crystal placement device uses another pushing seat to push the part of the plastic film to be selected where the chip to be removed is provided so that the chip to be pushed is attached to an attachment member. For the multi-die selection method described in item 8 of the scope of patent application, the first die placement device can replace the ejector seat, and before defining the selection range, an image capturing device is used to obtain the positions of the die Information, and then the software divides the selection range and automatically selects the pusher that corresponds to the selection range. For example, in the multi-die selection method described in item 1 of the patent application, when the die is attached to the to-be-selected film, each of the die is attached to the to-be-selected film with its front side to expose each of the On the back of one of the dice, the push seat presses the dice in the selected range and attaches it to an attachment member, the attachment member is a crystal glue film and has the attachment surface, and the die is attached to the When attaching the surface, each die is attached to the attaching surface with its back surface to expose the front surface; or, when the die is attached to the adhesive film to be selected, each die is attached to the attaching surface with its back The glue film exposes one of the front faces of each of the crystal grains, and the push seat presses the selected crystal grains against and attaches them to an attachment member of a turning device. The attachment member has the attachment surface, and the die When the grains are attached to the attachment surface of the flipping device, each die is attached to the attachment surface with its front surface to expose the back surface, and then the flipping device transfers the die to a wafer placement film. In the method for selecting multiple crystal grains as described in the first item of the patent application, the step of removing the surrounding crystal grains of the selected range is to remove the crystal grains one at a time. A method for selecting multiple crystal grains includes the following steps: defining a selection range for a to-be-selected attachment member attached with a plurality of crystal grains, the selection range includes a part of the plurality of crystal grains and the part includes a plurality of the crystal grains; Picking out the surrounding crystal grains of the selected range, so that the selected range is surrounded by a separation channel formed after the picking of the crystal grains; and using a top stack seat to push a die attach film facing the attachment to be selected One is corresponding to the selected range or a block corresponding to the selected range and at least part of the partition, and the die in the selected range is pressed against and attached to an attachment surface of the die attach film. The method for selecting multiple crystal grains as described in item 16 of the scope of patent application, wherein the attachment to be selected is a plastic film to be selected, a plate body capable of generating electrostatic adsorption force, and a plate body capable of generating vacuum adsorption force One of them; when the attachment to be selected is the adhesive film to be selected, the adhesive film to be selected has an adhesive surface, the adhesive surface is adhered to the plural crystal grains, the adhesive film to be selected is a thermally dissociated adhesive film, One of a photodissociation film and a temperature-controllable dissociation film. Before the crystal grains in the selected range are pressed against the attachment surface, the method for selecting multiple crystal grains further includes a dissociation step. The dissociation step is to heat the thermally dissociated adhesive film, irradiate the photodissociated adhesive film with light, and control the temperature of the temperature-controllable dissociated adhesive film to reduce the adhesive force of the adhesive surface of the adhesive film to be selected. For example, in the method for selecting multiple crystal grains as described in item 16 of the patent application, in the step of defining the selection range for the attachments to be selected with the plurality of crystal grains attached, a total selection range is first defined, and then the total selection A plurality of the selection ranges are divided within the range. After the selection ranges are divided, the surrounding crystal grains of the selection ranges are first selected, and then the ejection seat pushes the placed crystals respectively for the selection ranges. The steps of the film. For example, the multi-die selection method described in item 16 of the scope of the patent application, wherein the ejector seat pushes the die-placement film with its ejector surface, and the shape and area of the ejector surface substantially conform to the selection The shape and area of the range, or the pushing surface is larger than the selected range and does not exceed the partition. The method for selecting multiple crystal grains as described in claim 16, wherein the width of each section of the partition is greater than the width of at least one crystal grain parallel to the width. For the multi-die selection method described in item 16 of the scope of patent application, before the step of using the ejector seat to push the die-placement adhesive film, the first die placement device and the second die placement device The relative position is in a reposting position, the attachment to be selected is arranged on the first crystal placement device and has an attachment surface to which the plurality of die is attached, the second crystal placement device includes a base, and the push seat is It is movably disposed in the base, and the die attach film is disposed on the base, the die attach film has a mounting surface facing the opposite direction to the attachment surface and facing the base, the push seat There is an ejection surface facing the mounting surface of the die attach film, the area of the ejection surface is greater than or equal to the area of the selected range; when the relative position of the first die placement device and the second die placement device is In the reposting position, the attachment surface of the attachment to be selected and the attachment surface of the second crystal placement device face each other at a predetermined distance; then, the pushing seat faces the crystal placement glue relative to the base The direction of the film moves to push the wafer placement film with its pushing surface, wherein the pushing seat has a plurality of vacuum suction holes penetrating the pushing surface, and the pushing seat pushes the wafer with its pushing surface After the glue film is applied, a vacuum source is made to pass through the vacuum suction holes to generate a vacuum suction force on the pushing surface of the pushing seat to adsorb the crystal glue film. The method for selecting multiple crystal grains as described in item 16 of the patent application, wherein the step of removing the surrounding crystal grains of the selected range is to remove the crystal grains one at a time.

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