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TWI698285B - Aerosol generating device and aerosol generator - Google Patents

Aerosol generating device and aerosol generator Download PDF

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Publication number
TWI698285B
TWI698285B TW107114037A TW107114037A TWI698285B TW I698285 B TWI698285 B TW I698285B TW 107114037 A TW107114037 A TW 107114037A TW 107114037 A TW107114037 A TW 107114037A TW I698285 B TWI698285 B TW I698285B
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ring
circuit board
atomization
chamber
electrode regions
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TW107114037A
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Chinese (zh)
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TW201945079A (en
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林建華
黃紹奕
許由忠
羅凱耀
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微邦科技股份有限公司
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Abstract

The present disclosure discloses an aerosol generating device and an aerosol generator. The aerosol generating device includes an aerosol generator and a plug. The aerosol generator includes a container and an atomizing module arranged in the container. The container has a liquid chamber, an aerosol chamber, and an inserting slot defining an inserting direction. The liquid chamber and the aerosol chamber are respectively arranged at two opposite sides of the atomizing module, and are in spatial communication with each other through the atomizing module. The atomizing module includes two electrode segments having the same polarity and electrically connected to each other. The plug is detachably inserted into the inserting slot of the container along the inserting direction, and a conductive terminal of the plug contacts the two electrode segments. Therefore, the atomizing module of the present disclosure is configured to allow that the single conductive terminal can contact the two electrode segments to establish a multi-point connection, thereby enabling an electrical connection between the atomizing module and the conductive terminal to be more stable.

Description

微霧生成裝置及微霧產生器 Micro mist generating device and micro mist generator

本發明涉及一種微霧產生器,尤其涉及一種適用於多點接觸導通的微霧生成裝置及微霧產生器。 The present invention relates to a micro mist generator, in particular to a micro mist generator and a micro mist generator suitable for multi-point contact conduction.

現有微霧產生器中的霧化模組包含有一震動板及固設於霧化模組內的多個端子,並且上述每個端子是以直接頂抵於霧化模組中的震動板而達成彼此電性連接,並且現有霧化模組的震動板與端子之間為單點接觸。因此,當現有微霧產生器在運作時,所述震動板會產生震動,進而令上述震動板與每個端子之間的電性連接較容易處於不穩定狀態。 The atomization module in the existing micro-mist generator includes a vibration plate and a plurality of terminals fixed in the atomization module, and each of the above-mentioned terminals is directly pressed against the vibration plate in the atomization module. They are electrically connected to each other, and there is a single-point contact between the vibration plate and the terminal of the existing atomization module. Therefore, when the conventional micro-mist generator is in operation, the vibration plate will vibrate, which makes the electrical connection between the vibration plate and each terminal more likely to be in an unstable state.

於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Therefore, the inventor believes that the above-mentioned shortcomings can be improved, and with great concentration of research and the application of scientific principles, we finally propose an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

本發明實施例在於提供一種微霧生成裝置及微霧產生器,其能有效地現有微霧產生器所可能產生的缺陷。 The embodiment of the present invention is to provide a micro mist generating device and a micro mist generator, which can effectively eliminate the defects that may be generated by the existing micro mist generator.

本發明實施例公開一種微霧生成裝置,包括:一微霧產生器,包含有:一容器,其形成有一集液腔室、一霧化腔室、及一插槽,而所述插槽定義有一插拔方向;及一霧化模組,其安裝於所述容器內,所述集液腔室與所述霧化腔室位於所述霧化模組的相反兩側、且經由所述霧化模組而彼此連通;其中,所述霧化模組包含有至少一導電部,而至少一所述導電部設有相同極性且彼此電性 連接的兩個電極區;以及一插頭,其能沿所述插拔方向而可分離地插設於所述容器的所述插槽內,並且所述插頭的至少一導電端子抵接於兩個所述電極區。 The embodiment of the present invention discloses a micro-mist generating device, including: a micro-mist generator, including: a container formed with a liquid collection chamber, an atomization chamber, and a slot, and the slot defines There is a plug-in direction; and an atomization module installed in the container, the liquid collection chamber and the atomization chamber are located on opposite sides of the atomization module, and pass through the mist The atomization modules are in communication with each other; wherein the atomization module includes at least one conductive portion, and at least one of the conductive portions has the same polarity and is electrically connected to each other Two electrode areas connected; and a plug that can be detachably inserted into the slot of the container along the plugging direction, and at least one conductive terminal of the plug abuts against two The electrode area.

優選地,兩個所述電極區皆位於一平面上,並且所述霧化腔室的中心軸線大致垂直於所述平面。 Preferably, both of the electrode regions are located on a plane, and the central axis of the atomization chamber is substantially perpendicular to the plane.

優選地,兩個所述電極區的其中一個所述電極區位於大致垂直所述霧化腔室中心軸線的一平面,而另一個所述電極區位於另一平面,並且兩個所述電極區形成有一夾角。 Preferably, one of the electrode regions of the two electrode regions is located on a plane substantially perpendicular to the central axis of the atomization chamber, and the other electrode region is located on the other plane, and the two electrode regions An angle is formed.

優選地,所述夾角介於70度至110度之間。 Preferably, the included angle is between 70 degrees and 110 degrees.

優選地,所述霧化模組包含有一電子元件,兩個所述電極區分別位於大致垂直所述霧化腔室中心軸線的一平面與所述電子元件的外表面上,以使兩個所述電極區形成有介於70度至110度之間的一夾角。 Preferably, the atomization module includes an electronic component, and the two electrode regions are respectively located on a plane substantially perpendicular to the central axis of the atomization chamber and the outer surface of the electronic component, so that the two The electrode area is formed with an included angle between 70 degrees and 110 degrees.

優選地,兩個所述電極區中的至少一個所述電極區所在的一平面是與所述插槽的所述插拔方向相夾有一銳角。 Preferably, a plane on which at least one of the two electrode areas is located is at an acute angle with the insertion and removal direction of the socket.

優選地,所述銳角介於30度至60度之間。 Preferably, the acute angle is between 30 degrees and 60 degrees.

優選地,所述集液腔室的中心軸線重疊於所述霧化腔室的中心軸線。 Preferably, the central axis of the liquid collection chamber overlaps the central axis of the atomization chamber.

優選地,所述容器形成有位於所述集液腔室與所述霧化腔室之間的一收容腔室,所述霧化模組設置於所述收容腔室內,所述插槽具有連通至所述收容腔室的一穿孔,並且所述穿孔沿所述插拔方向投影至所述霧化模組所形成的一投影區域,其覆蓋兩個所述電極區;而所述插頭的至少一所述導電端子可分離地穿過於所述穿孔、並且彈性地頂抵於兩個所述電極區。 Preferably, the container is formed with a receiving chamber located between the liquid collection chamber and the atomizing chamber, the atomizing module is arranged in the receiving chamber, and the slot has a communication A perforation to the receiving chamber, and the perforation is projected along the plugging direction to a projection area formed by the atomization module, which covers two electrode areas; and at least the plug One of the conductive terminals can detachably pass through the through hole and elastically abuts against the two electrode regions.

優選地,所述霧化模組所包含的至少一所述導電部的數量為兩個,並且兩個所述導電部的極性彼此相異,所述插頭的至少一所述導電端子數量為兩個,並且兩個所述導電端子分別抵接於兩個所述導電部。 Preferably, the number of at least one conductive part included in the atomization module is two, and the polarities of the two conductive parts are different from each other, and the number of at least one conductive terminal of the plug is two. And the two conductive terminals respectively abut against the two conductive parts.

優選地,每個所述電極區所承受的至少一所述導電端子的一壓迫力,其能分解為一水平向量與一垂直向量。 Preferably, a pressing force of at least one of the conductive terminals borne by each of the electrode regions can be decomposed into a horizontal vector and a vertical vector.

優選地,所述霧化模組包含有:一震動環,其形成有一第一孔洞,並且所述震動環自所述第一孔洞向外依序定義有寬度大致相等的一內環區、一中環區、及一外環區;其中,抵接於至少一所述導電端子的兩個所述電極區部位大致位於所述中環區與所述外環區的至少其中之一的上方;一微孔件,其設置於所述震動環並覆蓋所述第一孔洞,並且所述集液腔室與所述霧化腔室經由所述微孔件而彼此連通;一電路板,其位於所述震動環的一側,至少一個所述電極區位於遠離所述震動環的所述電路板表面上;及一緩衝件,其一端連接所述電路板,而所述緩衝件的另一端連接所述外環區與所述中環區的至少其中之一。 Preferably, the atomization module includes: a vibrating ring formed with a first hole, and the vibrating ring sequentially defines an inner ring area and an inner ring area with substantially equal width outward from the first hole A middle ring area and an outer ring area; wherein the two electrode areas abutting on at least one of the conductive terminals are substantially above at least one of the middle ring area and the outer ring area; A hole, which is arranged on the vibration ring and covers the first hole, and the liquid collection chamber and the atomization chamber are communicated with each other through the micro hole; a circuit board is located on the On one side of the vibrating ring, at least one of the electrode regions is located on the surface of the circuit board away from the vibrating ring; and a buffer member, one end of which is connected to the circuit board, and the other end of the buffer member is connected to the At least one of the outer loop region and the middle loop region.

優選地,面向所述震動環的所述中環區表面與所述外環區表面,其面積總和的3%至30%被所述緩衝件所覆蓋。 Preferably, 3% to 30% of the total area of the surface of the middle ring area and the surface of the outer ring area facing the vibrating ring is covered by the buffer member.

優選地,所述震動環的所述內環區與所述電路板之間形成有環形的一間隙,所述緩衝件位於所述間隙的外側,並且所述緩衝件的至少部分位於兩個所述電極區的下方。 Preferably, an annular gap is formed between the inner ring area of the vibrating ring and the circuit board, the buffer is located outside the gap, and at least part of the buffer is located in two Below the electrode area.

優選地,所述霧化模組包含有:一震動環,其形成有一第一孔洞;一微孔件,其設置於所述震動環並覆蓋所述第一孔洞,並且所述集液腔室與所述霧化腔室經由所述微孔件而彼此連通;一電路板,其位於所述震動環的一側;及一電子元件,設置於遠離所述震動環的所述電路板表面,並且兩個所述電極區分別位於所述電子元件的外表面上以及遠離所述震動環的所述電路板表面。 Preferably, the atomization module includes: a vibrating ring formed with a first hole; a microporous member disposed on the vibrating ring and covering the first hole, and the liquid collection chamber And the atomization chamber communicate with each other via the microporous member; a circuit board located on one side of the vibrating ring; and an electronic component disposed on the surface of the circuit board away from the vibrating ring, And the two electrode regions are respectively located on the outer surface of the electronic component and on the surface of the circuit board away from the vibration ring.

優選地,所述霧化模組包含有一底墊圈,並且所述底墊圈包含有一環形片體以及自所述環形片體表面延伸的多個環形肋條,抵接於至少一所述導電端子的兩個所述電極區部位大致位於多個所述環形肋條的上方,以使多個所述環形肋條能用來吸收兩個所述電極區所承受的壓迫力。 Preferably, the atomization module includes a bottom gasket, and the bottom gasket includes a ring-shaped sheet body and a plurality of ring-shaped ribs extending from the surface of the ring-shaped sheet body, abutting on two of the at least one conductive terminal Each of the electrode regions is substantially located above the plurality of annular ribs, so that the plurality of annular ribs can be used to absorb the compression force of the two electrode regions.

本發明實施例也公開一種微霧產生器,包括:一容器,形成有一集液腔室、一霧化腔室、及一插槽,而所述插槽定義有一插拔方向;以及一霧化模組,安裝於所述容器內,所述集液腔室與所述霧化腔室位於所述霧化模組的相反兩側、且經由所述霧化模組而彼此連通;其中,所述霧化模組包含有相同極性且彼此電性連接的兩個電極區,並且兩個所述電極區中的至少一個所述電極區所在的一平面是與所述插槽的所述插拔方向相夾有一銳角。 The embodiment of the present invention also discloses a micro mist generator, including: a container formed with a liquid collection chamber, an atomization chamber, and a slot, and the slot defines a plug-in direction; and an atomizer The module is installed in the container, the liquid collection chamber and the atomization chamber are located on opposite sides of the atomization module and communicate with each other through the atomization module; wherein The atomization module includes two electrode areas with the same polarity and electrically connected to each other, and at least one of the two electrode areas is located on a plane where the electrode area is connected to the insertion and removal of the slot There is an acute angle between the directions.

優選地,所述霧化腔室的中心軸線大致垂直於所述平面,並且兩個所述電極區皆位於所述平面上。 Preferably, the central axis of the atomization chamber is substantially perpendicular to the plane, and both of the electrode regions are located on the plane.

優選地,所述霧化腔室的中心軸線大致垂直於所述平面,所述霧化模組包含有一電子元件,兩個所述電極區分別位於所述平面與所述電子元件的外表面上,以使兩個所述電極區形成有介於70度至110度之間的一夾角。 Preferably, the central axis of the atomization chamber is substantially perpendicular to the plane, the atomization module includes an electronic component, and the two electrode regions are respectively located on the plane and the outer surface of the electronic component , So that the two electrode regions form an included angle between 70 degrees and 110 degrees.

優選地,所述銳角介於30度至60度之間。 Preferably, the acute angle is between 30 degrees and 60 degrees.

優選地,所述集液腔室的中心軸線重疊於所述霧化腔室的中心軸線,並且所述集液腔室的所述中心軸線大致垂直於所述平面。 Preferably, the central axis of the liquid collection chamber overlaps the central axis of the atomization chamber, and the central axis of the liquid collection chamber is substantially perpendicular to the plane.

優選地,所述容器形成有位於所述集液腔室與所述霧化腔室之間的一收容腔室,所述霧化模組設置於所述收容腔室內,所述插槽具有連通至所述收容腔室的一穿孔,並且所述穿孔沿所述插拔方向投影至所述霧化模組所形成的一投影區域,其覆蓋兩個所述電極區。 Preferably, the container is formed with a receiving chamber located between the liquid collection chamber and the atomizing chamber, the atomizing module is arranged in the receiving chamber, and the slot has a communication A perforation to the receiving chamber, and the perforation is projected along the plugging direction to a projection area formed by the atomization module, which covers the two electrode areas.

優選地,所述霧化模組包含有:一震動環,其形成有一第一孔洞,並且所述震動環自所述第一孔洞向外依序定義有寬度大致相等的一內環區、一中環區、及一外環區;其中,兩個所述電極區的至少部分大致位於所述中環區與所述外環區的至少其中之一的上方;一微孔件,其設置於所述震動環並覆蓋所述第一孔洞,並且所述集液腔室與所述霧化腔室經由所述微孔件而彼此連通;一電路板,其位於所述震動環的一側,所述電路板包含位在所述 平面的至少一個所述電極區,並且遠離所述震動環的所述電路板表面位於所述平面上;及一緩衝件,其一端連接所述電路板,而所述緩衝件的另一端連接所述外環區與所述中環區的至少其中之一。 Preferably, the atomization module includes: a vibrating ring formed with a first hole, and the vibrating ring sequentially defines an inner ring area and an inner ring area with substantially equal width outward from the first hole A middle ring area and an outer ring area; wherein at least part of the two electrode areas is approximately located above at least one of the middle ring area and the outer ring area; a microporous member is disposed on the The vibration ring covers the first hole, and the liquid collection chamber and the atomization chamber communicate with each other via the microporous member; a circuit board is located on one side of the vibration ring, the The circuit board includes at least one of the electrode regions located on the plane, and the surface of the circuit board far from the vibration ring is located on the plane; and a buffer member, one end of which is connected to the circuit board, and the The other end of the buffer member connects at least one of the outer ring area and the middle ring area.

優選地,面向所述電路板的所述中環區表面與所述外環區表面,其面積總和的3%至30%被所述緩衝件所覆蓋。 Preferably, 3% to 30% of the total area of the surface of the middle ring area and the surface of the outer ring area facing the circuit board is covered by the buffer member.

優選地,所述震動環的所述內環區與所述電路板之間形成有環形的一間隙,所述緩衝件位於所述間隙的外側,並且所述緩衝件的至少部分位於兩個所述電極區的下方。 Preferably, an annular gap is formed between the inner ring area of the vibrating ring and the circuit board, the buffer is located outside the gap, and at least part of the buffer is located in two Below the electrode area.

優選地,所述霧化模組包含有:一震動環,其形成有一第一孔洞;一微孔件,其設置於所述震動環並覆蓋所述第一孔洞,並且所述集液腔室與所述霧化腔室經由所述微孔件而彼此連通;一電路板,其位於所述震動環的一側,並且遠離所述震動環的所述電路板表面位於所述平面上;及一電子元件,設置於遠離所述震動環的所述電路板表面,並且兩個所述電極區分別位於所述電子元件的外表面上以及遠離所述震動環的所述電路板表面。 Preferably, the atomization module includes: a vibrating ring formed with a first hole; a microporous member disposed on the vibrating ring and covering the first hole, and the liquid collection chamber The atomization chamber communicates with each other via the microporous member; a circuit board, which is located on one side of the vibration ring, and the surface of the circuit board away from the vibration ring is located on the plane; and An electronic component is arranged on the surface of the circuit board far away from the vibration ring, and the two electrode regions are respectively located on the outer surface of the electronic component and the surface of the circuit board far away from the vibration ring.

優選地,所述霧化模組包含有一底墊圈,並且所述底墊圈包含有一環形片體以及自所述環形片體表面延伸的多個環形肋條,抵接於至少一導電端子的兩個所述電極區部位大致位於多個所述環形肋條的上方,以使多個所述環形肋條能用來吸收兩個所述電極區所承受的壓迫力。 Preferably, the atomization module includes a bottom gasket, and the bottom gasket includes a ring-shaped sheet body and a plurality of ring-shaped ribs extending from the surface of the ring-shaped sheet body, and abutting against two of the at least one conductive terminal. The electrode area is approximately located above the plurality of annular ribs, so that the plurality of annular ribs can be used to absorb the compression force of the two electrode areas.

綜上所述,本發明實施例所公開的微霧生成裝置及微霧產生器,其通過在霧化模組上設有相同極性且彼此電性連接的兩個電極區,用以供單個導電端子能同時抵接於上述兩個電極區而形成多點接觸,藉以提供穩定的電性連接。 In summary, the micro-mist generating device and the micro-mist generator disclosed in the embodiments of the present invention are provided with two electrode areas of the same polarity and electrically connected to each other to provide a single conduction The terminals can abut on the two electrode regions at the same time to form multi-point contacts, thereby providing stable electrical connections.

為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed descriptions and drawings about the present invention, but these descriptions and drawings are only used to illustrate the present invention, and do not make any claims about the protection scope of the present invention. limit.

1000‧‧‧微霧產生器 1000‧‧‧Micro mist generator

100‧‧‧霧化模組 100‧‧‧Atomization Module

1‧‧‧震動環 1‧‧‧Vibration ring

11‧‧‧第一孔洞 11‧‧‧The first hole

12‧‧‧內環區 12‧‧‧Inner Ring District

13‧‧‧中環區 13‧‧‧Central District

14‧‧‧外環區 14‧‧‧Outer Ring District

15a、15b‧‧‧電性接點 15a, 15b‧‧‧electrical contact

2‧‧‧微孔件 2‧‧‧Microporous parts

21‧‧‧霧化孔 21‧‧‧Atomization hole

3‧‧‧電路板 3‧‧‧Circuit board

31‧‧‧導電部 31‧‧‧Conductive part

311a、311b、311c‧‧‧電極區 311a, 311b, 311c‧‧‧electrode area

32‧‧‧導電線路 32‧‧‧Conductive circuit

33‧‧‧外接臂 33‧‧‧External arm

34‧‧‧定位部 34‧‧‧Positioning Department

4‧‧‧焊接體 4‧‧‧Welding body

5‧‧‧緩衝件 5‧‧‧Buffer

6‧‧‧承載片 6‧‧‧Carrier sheet

61‧‧‧第二孔洞 61‧‧‧Second hole

7‧‧‧電子元件 7‧‧‧Electronic components

8‧‧‧底墊圈 8‧‧‧Bottom washer

81‧‧‧環形片體 81‧‧‧Annular plate

82‧‧‧環形肋條 82‧‧‧Annular rib

83‧‧‧環形凸肋 83‧‧‧Annular rib

9‧‧‧內墊圈 9‧‧‧Inner gasket

91‧‧‧主環體 91‧‧‧Main ring body

92‧‧‧頂抵環體 92‧‧‧Abutting ring body

200‧‧‧容器 200‧‧‧Container

200a‧‧‧杯體 200a‧‧‧Cup body

200b‧‧‧蓋體 200b‧‧‧Cover body

201‧‧‧集液腔室 201‧‧‧Liquid chamber

202‧‧‧霧化腔室 202‧‧‧Atomization chamber

203‧‧‧收容腔室 203‧‧‧Containment Chamber

204‧‧‧插槽 204‧‧‧Slot

2041‧‧‧穿孔 2041‧‧‧Perforation

2000‧‧‧插頭 2000‧‧‧Plug

2001‧‧‧絕緣體 2001‧‧‧Insulator

2002‧‧‧導電端子 2002‧‧‧Conductive terminal

C1‧‧‧中心軸線 C1‧‧‧Central axis

C2‧‧‧中心軸線 C2‧‧‧Central axis

S‧‧‧插拔方向 S‧‧‧plugging direction

G‧‧‧間隙 G‧‧‧Gap

α‧‧‧夾角 α ‧‧‧Included angle

σ‧‧‧銳角 σ ‧‧‧ acute angle

W1、W2、W3‧‧‧寬度 W1, W2, W3‧‧‧Width

F‧‧‧壓迫力 F‧‧‧Pressure

Fx‧‧‧水平分量 Fx‧‧‧Horizontal component

Fy‧‧‧垂直分量 Fy‧‧‧Vertical component

圖1為本發明微霧生成裝置的立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the micro mist generating device of the present invention.

圖2為圖1沿剖線Ⅱ-Ⅱ的剖視示意圖。 Fig. 2 is a schematic sectional view of Fig. 1 along the section line II-II.

圖3為圖1的分解示意圖。 Fig. 3 is an exploded schematic diagram of Fig. 1.

圖4為圖3沿剖線IV-IV的剖視示意圖。 4 is a schematic cross-sectional view of FIG. 3 along the line IV-IV.

圖5為本發明微霧產生器的分解示意圖。 Fig. 5 is an exploded schematic diagram of the micro mist generator of the present invention.

圖6為本發明霧化模組的立體示意圖。 Fig. 6 is a three-dimensional schematic diagram of the atomization module of the present invention.

圖7為圖6的俯視示意圖。 Fig. 7 is a schematic top view of Fig. 6.

圖8為圖6的分解示意圖。 Fig. 8 is an exploded schematic diagram of Fig. 6.

圖9為本發明霧化模組中的震動環局部放大示意圖。 9 is a partial enlarged schematic diagram of the vibration ring in the atomization module of the present invention.

圖10為圖4中的X部位的局部放大示意圖。 Fig. 10 is a partial enlarged schematic diagram of the X part in Fig. 4.

圖11為圖4中的XI部位的局部放大示意圖。 Fig. 11 is a partial enlarged schematic diagram of the XI part in Fig. 4.

圖12為本發明微霧產生器另一態樣的立體剖視示意圖。 FIG. 12 is a schematic perspective view of another aspect of the micro mist generator of the present invention.

圖13為圖2中的XⅢ部位的局部放大示意圖。 Fig. 13 is a partial enlarged schematic diagram of part XIII in Fig. 2.

圖14為圖2中的XIV部位的局部放大示意圖。 Fig. 14 is a partial enlarged schematic diagram of the XIV part in Fig. 2.

圖15為圖14中的導電端子所施予的壓迫力示意圖。 15 is a schematic diagram of the pressing force exerted by the conductive terminal in FIG. 14.

請參閱圖1至圖15,其為本發明的實施例,需先說明的是,本實施例對應附圖所提及的相關數量與外型,僅用來具體地說明本發明的實施方式,以便於了解本發明的內容,而非用來侷限本發明的保護範圍。 Please refer to FIGS. 1 to 15, which are embodiments of the present invention. It should be noted that the relevant quantities and appearances mentioned in the accompanying drawings in this embodiment are only used to specifically illustrate the implementation of the present invention. In order to understand the content of the present invention, but not to limit the protection scope of the present invention.

如圖1至圖3所示,本實施例公開一種微霧生成裝置,尤指適用於醫療用的微霧生成裝置,但本發明不以此為限。其中,所述微霧生成裝置包含有一微霧產生器1000及可分離地插設於上述微霧產生器1000的一插頭2000,並且所述插頭2000能電性耦接於一外部電源(圖中未示出),以提供所述微霧產生器1000運作 所需的電力。需說明的是,本實施例是以微霧產生器1000搭配插頭2000來說明,但於本發明未繪示的其他實施例中,所述微霧產生器1000也可以是單獨地被運用或是搭配其他構件。 As shown in FIGS. 1 to 3, this embodiment discloses a micro mist generating device, especially a micro mist generating device suitable for medical use, but the present invention is not limited to this. Wherein, the micro mist generating device includes a micro mist generator 1000 and a plug 2000 detachably plugged into the micro mist generator 1000, and the plug 2000 can be electrically coupled to an external power source (in the figure Not shown) to provide the power required for the operation of the micro mist generator 1000. It should be noted that the present embodiment is described by using the micro mist generator 1000 with the plug 2000, but in other embodiments not shown in the present invention, the micro mist generator 1000 can also be used alone or With other components.

如圖4及圖5所示,所述微霧產生器1000包含有一容器200及安裝於上述容器200內的一霧化模組100。需先說明的是,本實施例是以上述霧化模組100搭配容器200來說明,但於本發明未繪示的其他實施例中,所述霧化模組100也可以是單獨地被運用或是搭配其他構件。 As shown in FIGS. 4 and 5, the micro mist generator 1000 includes a container 200 and an atomization module 100 installed in the container 200. It should be noted that in this embodiment, the above-mentioned atomization module 100 is used in combination with the container 200. However, in other embodiments not shown in the present invention, the atomization module 100 may also be used separately Or with other components.

再者,所述容器200形成有一集液腔室201、一霧化腔室202、位於上述集液腔室201與霧化腔室202之間的一收容腔室203、及連通於上述收容腔室203的一插槽204。換個角度來說,本實施例的容器200是以一杯體200a及安裝於上述杯體200a內的一蓋體200b所構成,並且所述霧化模組100夾持定位於上述蓋體200b與杯體200a之間,但本發明不以此為限。而於本實施例中,所述杯體200a構成上述集液腔室201與插槽204,而所述杯體200a與蓋體200b共同形成上述霧化腔室202與收容腔室203。 Furthermore, the container 200 is formed with a liquid collection chamber 201, an atomization chamber 202, a storage chamber 203 located between the liquid collection chamber 201 and the atomization chamber 202, and is connected to the storage chamber A slot 204 of the chamber 203. From another perspective, the container 200 of this embodiment is composed of a cup 200a and a lid 200b installed in the cup 200a, and the atomization module 100 is clamped and positioned between the lid 200b and the cup. Between the body 200a, but the present invention is not limited to this. In this embodiment, the cup body 200a forms the liquid collection chamber 201 and the slot 204, and the cup body 200a and the cover body 200b jointly form the atomization chamber 202 and the receiving chamber 203.

其中,所述霧化模組100設置於上述容器200的收容腔室203內,也就是說,所述集液腔室201與霧化腔室202是位於霧化模組100的相反兩側(如:圖4中的霧化模組100上側與下側),並且上述集液腔室201與霧化腔室202能經由所述霧化模組100而彼此連通。所述插槽204用以供上述插頭2000插設,藉以能通過上述插頭2000的供電來驅動霧化模組100。 Wherein, the atomization module 100 is arranged in the receiving chamber 203 of the container 200, that is, the liquid collection chamber 201 and the atomization chamber 202 are located on opposite sides of the atomization module 100 ( For example, the upper and lower sides of the atomization module 100 in FIG. 4), and the above-mentioned liquid collection chamber 201 and the atomization chamber 202 can communicate with each other through the atomization module 100. The slot 204 is used for inserting the plug 2000, so that the atomization module 100 can be driven by the power supply of the plug 2000.

進一步地說,所述集液腔室201是用來容置液狀的藥物(圖中未示出),以使上述液狀藥物通過霧化模組100而於上述霧化腔室202內被霧化成霧狀藥物(如:上述霧狀藥物是指其粒徑介於3.5微米至6.5微米之間),藉以利於使用者將所述霧狀藥物吸入體內。其中,所述容器200的具體構造能夠依據設計需求而加以變 化,本發明在此不加以限制。 Furthermore, the liquid collection chamber 201 is used to contain liquid medicine (not shown in the figure), so that the liquid medicine passes through the atomization module 100 and is deposited in the atomization chamber 202. Atomized into a mist-like medicine (for example, the above-mentioned mist-like medicine means that the particle size is between 3.5 μm and 6.5 μm), so that the user can inhale the mist-like medicine into the body. The specific structure of the container 200 can be changed according to design requirements, and the present invention is not limited here.

而於本實施例中,所述集液腔室201的中心軸線C1是重疊於所述霧化腔室202的中心軸線C2,並且上述集液腔室201的外形是朝向霧化腔室202的方向呈漸縮狀(如:彈頭形)。據此,所述集液腔室201的構造能夠利於上述液狀藥物順暢地流動,進而有效地避免液狀藥物內產生氣泡。 In this embodiment, the central axis C1 of the liquid collection chamber 201 overlaps the central axis C2 of the atomization chamber 202, and the shape of the liquid collection chamber 201 faces the atomization chamber 202. The direction is tapered (for example, bullet-shaped). Accordingly, the structure of the liquid collection chamber 201 can facilitate the smooth flow of the liquid medicine, thereby effectively avoiding bubbles in the liquid medicine.

再者,本實施例的插槽204定義有一插拔方向S(也就是說,所述插頭2000插入插槽204的方向),並且上述插拔方向S是與集液腔室201的中心軸線C1相夾形成有一銳角。其中,所述插槽204具有連通於收容腔室203的一穿孔2041,並且本實施例插槽204(的穿孔2041)較佳是未固設有任何導電端子。據此,當本實施例的容器200在使用完畢而被拋棄時,上述被拋棄的容器200內並未包含有任何導電端子,藉以能有效地避免資源浪費,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述插槽204內也可以固設有至少一導電端子。 Furthermore, the slot 204 of this embodiment defines a plug-in direction S (that is, the direction in which the plug 2000 is inserted into the slot 204), and the plug-in direction S is aligned with the central axis C1 of the liquid collection chamber 201 The sandwich forms an acute angle. Wherein, the slot 204 has a through hole 2041 connected to the receiving chamber 203, and (the through hole 2041 of the slot 204) of this embodiment is preferably not fixedly provided with any conductive terminals. Accordingly, when the container 200 of the present embodiment is discarded after being used, the discarded container 200 does not contain any conductive terminals, which can effectively avoid resource waste, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, at least one conductive terminal may also be fixed in the slot 204.

如圖6至圖8所示,所述霧化模組100於本實施例中包含有一震動環1、設置於所述震動環1上的一微孔件2、電性耦接於上述震動環1的一電路板3、電性連接所述震動環1與電路板3的一焊接體4、夾持於所述震動環1與電路板3之間的一緩衝件5、承載上述震動環1的一承載片6、安裝於上述電路板3的一電子元件7、夾持於所述承載片6與容器200(如:圖4的蓋體200b)的一底墊圈8、及夾持於所述震動環1與容器200(如:圖4的杯體200a)之間的一內墊圈9。 As shown in FIGS. 6 to 8, the atomization module 100 in this embodiment includes a vibrating ring 1, a microporous member 2 disposed on the vibrating ring 1, and electrically coupled to the vibrating ring 1 a circuit board 3, a welding body 4 electrically connecting the vibrating ring 1 and the circuit board 3, a buffer member 5 clamped between the vibrating ring 1 and the circuit board 3, and carrying the vibrating ring 1 A carrier sheet 6, an electronic component 7 mounted on the circuit board 3, a bottom gasket 8 clamped between the carrier sheet 6 and the container 200 (such as the cover 200b of FIG. 4), and The inner gasket 9 between the vibrating ring 1 and the container 200 (such as the cup body 200a of FIG. 4) is described.

需先說明的是,本實施例的霧化模組100是以包含有上述多個元件來說明,但於本發明未繪示的其他實施例中,所述霧化模組100也可以依據設計需求,而調整上述多個元件的數量、結構、或連接關係;又或者,以霧化模組100進一步搭配本實施例未記 載的其他元件。 It should be noted that the atomization module 100 of this embodiment is described by including the above-mentioned multiple components, but in other embodiments not shown in the present invention, the atomization module 100 may also be designed according to As required, the number, structure, or connection relationship of the above-mentioned multiple components are adjusted; or, the atomization module 100 is further used with other components not described in this embodiment.

如圖7和圖8所示,所述震動環1於本實施例中為一圓環狀的壓電片(PZT片)、並於內緣形成有呈圓形的一第一孔洞11。其中,所述震動環1自其第一孔洞11向外依序定義有寬度大致相等的一內環區12、一中環區13、及一外環區14。所述內環區12、中環區13、及外環區14在對應所述震動環1的徑向的寬度比例(也就是,W1:W2:W3)為1:3:3,但本發明不受限於此。 As shown in FIGS. 7 and 8, the vibrating ring 1 is a circular piezoelectric sheet (PZT sheet) in this embodiment, and a circular first hole 11 is formed on the inner edge. Wherein, the vibrating ring 1 sequentially defines an inner ring area 12, a middle ring area 13, and an outer ring area 14 with approximately equal widths outward from the first hole 11 thereof. The width ratio of the inner ring area 12, the middle ring area 13, and the outer ring area 14 in the radial direction corresponding to the vibration ring 1 (that is, W1:W2:W3) is 1:3:3, but the present invention does not Limited by this.

再者,所述震動環1包含有位於其相同表面(如:圖8中的震動環1頂面)上的兩個電性接點15a、15b。其中,由於上述電性接點15a、15b是屬於震動環1不會產生震動的部位,所以任一個電性接點15a、15b較佳是位於震動環1的中環區13與外環區14的至少其中之一,藉以避免影響震動環1的震動效能。再者,所述震動環1於本實施例中雖是以兩個電性接點15a、15b來說明,但在本發明未繪示的其他實施例中,所述震動環1也可以是包含有一個電性接點。 Furthermore, the vibrating ring 1 includes two electrical contacts 15a, 15b on the same surface (for example, the top surface of the vibrating ring 1 in FIG. 8). Among them, since the above-mentioned electrical contacts 15a and 15b belong to the parts where the vibration ring 1 does not vibrate, any one of the electrical contacts 15a, 15b is preferably located in the middle ring zone 13 and the outer ring zone 14 of the vibration ring 1. At least one of them is to avoid affecting the vibration performance of the vibration ring 1. Furthermore, although the vibrating ring 1 is described in this embodiment with two electrical contacts 15a, 15b, in other embodiments not shown in the present invention, the vibrating ring 1 may also include There is an electrical contact.

此外,上述兩個電性接點15a、15b的成形方式可依據設計需求而加以調整,本發明在此不加以限制。但於本實施例中(如圖9所示),所述震動環1在外側部位的頂面與底面處各具有一電連接部位,位於震動環1頂面的電連接部位則定義為上述電性接點15b,位於震動環1底面的電連接部位(如:圖9中震動環1底面的虛線部位)則是進一步延伸有一導體層,使上述導體層沿著相對應的震動環1側緣延伸至頂面,而位於震動環1頂面的導體層部位則定義為所述另一電性接點15a。 In addition, the forming methods of the two electrical contacts 15a, 15b can be adjusted according to design requirements, and the present invention is not limited here. However, in this embodiment (as shown in Figure 9), the vibrating ring 1 has an electrical connection part on the top and bottom surfaces of the outer part, and the electrical connection part located on the top surface of the vibrating ring 1 is defined as the aforementioned electrical connection. The sexual contact 15b is located at the electrical connection part of the bottom surface of the vibrating ring 1 (for example, the dotted line on the bottom of the vibrating ring 1 in Figure 9) is further extended with a conductor layer, so that the conductor layer is along the corresponding side edge of the vibrating ring 1 The portion of the conductor layer that extends to the top surface and is located on the top surface of the vibrating ring 1 is defined as the other electrical contact 15a.

如圖8和圖10所示,所述微孔件2於本實施例中是以金屬材料或是高分子聚合材料所製成的圓形薄片,並且上述微孔件2的大致中央處形成有貫穿狀的多個霧化孔21,而上述多個霧化孔21 的數量與構造則可以依據設計者所需的霧狀藥物粒徑而加以變化,本發明在此不加以限制。 As shown in FIGS. 8 and 10, in this embodiment, the microporous member 2 is a circular sheet made of a metal material or a polymer material, and the microporous member 2 is formed approximately in the center. There are a plurality of atomization holes 21 in a penetrating shape, and the number and structure of the plurality of atomization holes 21 can be changed according to the particle size of the atomized medicine required by the designer, and the present invention is not limited herein.

再者,所述微孔件2設置於上述震動環1並覆蓋其第一孔洞11,並且本實施例微孔件2是夾設於上述震動環1與承載片6之間。據此,所述容器200的集液腔室201與霧化腔室202能經由上述微孔件2而彼此連通。 Furthermore, the microporous member 2 is disposed on the vibrating ring 1 and covers the first hole 11 thereof, and the microporous member 2 of this embodiment is sandwiched between the vibrating ring 1 and the carrier sheet 6. Accordingly, the liquid collection chamber 201 and the atomization chamber 202 of the container 200 can communicate with each other via the aforementioned microporous member 2.

進一步地說,所述承載片6於本實施例中呈圓環狀且其內緣形成有孔徑小於上述第一孔洞11的一第二孔洞61,所述微孔件2覆蓋承載片6的第二孔洞61(也就是說,所述第一孔洞11與第二孔洞61以使微孔件2隔開),以使上述集液腔室201與霧化腔室202經由覆蓋所述第二孔洞61的微孔件2部位而彼此連通。其中,所述微孔件2的多個霧化孔21較佳是位於上述覆蓋第二孔洞61的微孔件2部位。 Furthermore, in this embodiment, the carrier sheet 6 is annular in shape and its inner edge is formed with a second hole 61 with a diameter smaller than the first hole 11, and the microporous member 2 covers the second hole 61 of the carrier sheet 6. Two holes 61 (that is, the first hole 11 and the second hole 61 to separate the microporous member 2), so that the liquid collection chamber 201 and the atomization chamber 202 are covered by the second hole The microporous parts of 61 are connected to each other. Wherein, the multiple atomization holes 21 of the microporous member 2 are preferably located at the location of the microporous member 2 covering the second hole 61.

如圖7、圖8、和圖11所示,所述電路板3位於上述震動環1的至少部分的一側,並且電路板3是與震動環1的上述至少部分之間形成有一間隙G。其中,所述電路板3朝向上述震動環1電性接點15a、15b所在的一平面(如:圖11中的震動環1頂面)正投影形成的一投影區域,其部分落在上述震動環1的所述至少部分。也就是說,所述電路板3是大致間隔地位在震動環1遠離承載片6(或霧化腔室202)的一側(如:圖11中的震動環1上側)。 As shown in FIG. 7, FIG. 8, and FIG. 11, the circuit board 3 is located on one side of at least part of the vibrating ring 1, and a gap G is formed between the circuit board 3 and the at least part of the vibrating ring 1. Wherein, the circuit board 3 faces a projection area formed by orthographic projection on a plane where the electrical contacts 15a and 15b of the vibrating ring 1 are located (such as the top surface of the vibrating ring 1 in FIG. 11), part of which falls on the vibration Said at least part of ring 1. In other words, the circuit board 3 is roughly spaced apart on the side of the vibrating ring 1 away from the carrier sheet 6 (or the atomization chamber 202) (for example, the upper side of the vibrating ring 1 in FIG. 11).

進一步地說,本實施例的電路板3與震動環1之間的間隔設置可以通過所述焊接體4及緩衝件5的至少其中之一來實現(具體方式於後述說明)。再者,所述電路板3設有一定位部34,而上述定位部34裝配於容器200,藉以使所述電路板3通過上述容器200與定位部34的配合、而間隔地設置於震動環1的所述至少部分的一側,但本發明不以上述為限。 Furthermore, the spacing setting between the circuit board 3 and the vibrating ring 1 of this embodiment can be realized by at least one of the welding body 4 and the buffer member 5 (the specific method will be described later). Furthermore, the circuit board 3 is provided with a positioning portion 34, and the positioning portion 34 is assembled to the container 200, so that the circuit board 3 is arranged on the vibration ring 1 at intervals through the cooperation of the container 200 and the positioning portion 34 However, the present invention is not limited to the above.

舉例來說,在本發明未繪示的其他實施例中,所述電路板3與震動環1之間可以無需有機構上的連接與支撐,也就是說,所述電路板3僅通過上述容器200與定位部34的配合、即能懸掛於震動環1的所述至少部分的一側。 For example, in other embodiments not shown in the present invention, the circuit board 3 and the vibrating ring 1 may not need to be mechanically connected and supported, that is, the circuit board 3 only passes through the container The cooperation between 200 and the positioning portion 34 can be hung on one side of the at least part of the vibration ring 1.

此外,所述電路板3的外形於本實施例中是以大致圓環狀來說明,但所述電路板3的外形與尺寸也可以依據設計需求而加以調整。舉例來說,所述電路板3的外形與尺寸也可以是如圖12所示。 In addition, the shape of the circuit board 3 is described as a substantially circular ring in this embodiment, but the shape and size of the circuit board 3 can also be adjusted according to design requirements. For example, the shape and size of the circuit board 3 may also be as shown in FIG. 12.

如圖7、圖8、和圖11所示,所述電路板3電性耦接於上述震動環1的電性接點15a、15b,而上述電路板3與電性接點15a、15b的電性耦接方式於本實施例中是以焊接體4(如:兩個錫球)固定並電性耦接上述電性接點15a、15b以及電路板3來實現,但在本發明未繪示的其他實施例中,所述電路板3也可以通過導線(cable)而電性耦接於震動環1的電性接點15a、15b。 As shown in Figures 7, 8, and 11, the circuit board 3 is electrically coupled to the electrical contacts 15a, 15b of the vibrating ring 1, and the circuit board 3 is electrically connected to the electrical contacts 15a, 15b. In this embodiment, the electrical coupling is implemented by fixing the soldering body 4 (such as two solder balls) and electrically coupling the electrical contacts 15a, 15b and the circuit board 3, but it is not shown in the present invention. In other embodiments shown, the circuit board 3 may also be electrically coupled to the electrical contacts 15a and 15b of the vibrating ring 1 through cables.

其中,所述電路板3包含有分離且相鄰設置的兩個導電部31以及分別連接於上述兩個導電部31的兩條導電線路32。上述兩個導電部31的極性彼此相異,並且每個導電部31包含有相同極性且彼此電性連接的兩個電極區311a、311b,而任一個導電部31的兩個電極區311a、311b分別鄰設於另一個導電部31的兩個電極區311a、311b。所述每個導電部31(或電極區311a、311b)能經由相對應的導電線路32與焊接體4而電性耦接於相對應的電性接點15a、15b,並且本實施例的兩條導電線路32較佳是具有不同的長度。 Wherein, the circuit board 3 includes two conductive parts 31 that are separated and arranged adjacently and two conductive lines 32 respectively connected to the two conductive parts 31. The polarities of the two conductive portions 31 are different from each other, and each conductive portion 31 includes two electrode regions 311a, 311b of the same polarity and electrically connected to each other, and two electrode regions 311a, 311b of any conductive portion 31 The two electrode regions 311a and 311b are respectively adjacent to the other conductive portion 31. Each of the conductive portions 31 (or electrode regions 311a, 311b) can be electrically coupled to the corresponding electrical contacts 15a, 15b via the corresponding conductive lines 32 and the welding body 4, and the two parts of this embodiment The conductive lines 32 preferably have different lengths.

然而,本實施例電路板3的導電部31(或電極區311a、311b)數量與導電線路32數量可依據設計需求而加以調整變化,不以上述為限。舉例來說,於本發明未繪示的其他實施例中,所述電路板3可以包含有一個導電部31及連接於上述導電部31的一個導 電線路32;或者,所述電路板3也可以包含一個電極區311a、311b及連接於上述電極區311a、311b的一個導電線路32;又或者,所述電路板3包含有一個電極區311a、311b,並且上述電極區311a、311b例如以導線(cable)或直接電性耦接於相對應電性接點15a、15b。 However, the number of conductive portions 31 (or electrode regions 311a, 311b) and the number of conductive lines 32 of the circuit board 3 of this embodiment can be adjusted and changed according to design requirements, and is not limited to the above. For example, in other embodiments not shown in the present invention, the circuit board 3 may include a conductive portion 31 and a conductive circuit 32 connected to the conductive portion 31; or, the circuit board 3 may also It includes one electrode area 311a, 311b and a conductive circuit 32 connected to the above-mentioned electrode area 311a, 311b; or, the circuit board 3 includes one electrode area 311a, 311b, and the above-mentioned electrode area 311a, 311b is, for example, a wire ( cable) or directly electrically coupled to the corresponding electrical contacts 15a, 15b.

更詳細地說,如圖7、圖8、及圖11所示,上述每個電極區311a、311b是位於遠離震動環1的所述電路板3表面(如:圖8中的電路板3頂面)上;並且在所述電路板3朝向震動環1電性接點15a、15b所在的平面(如:圖7中的震動環1頂面)正投影形成的該投影區域之中,由所述每個電極區311a、311b所形成的投影區域部位較佳是位在上述電性接點15a、15b之外。換個角度來說,上述每個電極區311a、311b的至少部分大致位於(未形成有電性接點15a、15b的)所述震動環1的中環區13與外環區14的至少其中之一的上方(如圖11)。 In more detail, as shown in FIG. 7, FIG. 8, and FIG. 11, each of the above-mentioned electrode regions 311a, 311b is located on the surface of the circuit board 3 away from the vibrating ring 1 (for example, the top of the circuit board 3 in FIG. On the surface); and in the projection area formed by the orthographic projection of the circuit board 3 toward the plane where the electrical contacts 15a, 15b of the vibrating ring 1 (such as the top surface of the vibrating ring 1 in Figure 7) are formed, by The projection area formed by each electrode area 311a, 311b is preferably outside the electrical contact 15a, 15b. To put it another way, at least part of each of the above-mentioned electrode regions 311a, 311b is approximately located (without the electrical contacts 15a, 15b) of at least one of the middle ring region 13 and the outer ring region 14 of the vibrating ring 1. Above (Figure 11).

所述電路板3包含有兩個外接臂33,上述兩個外接臂33呈懸空狀且位於震動環1的外環區14與中環區13的至少其中之一的上方,而本實施例的兩個外接臂33的自由端是大致分別位於震動環1的兩個電性接點15a、15b的上方。也就是說,上述每個外接臂33的自由端具備有微幅彈性擺動的功能。此外,在本發明未繪示的其他實施例中,上述電路板3可以僅包含一個外接臂33、或是未包含有任何外接臂33。 The circuit board 3 includes two external arms 33. The two external arms 33 are suspended and located above at least one of the outer ring area 14 and the middle ring area 13 of the vibrating ring 1, and the two external arms 33 of this embodiment The free ends of the two external arms 33 are roughly located above the two electrical contacts 15a and 15b of the vibrating ring 1 respectively. In other words, the free end of each external arm 33 has the function of slightly elastic swing. In addition, in other embodiments not shown in the present invention, the circuit board 3 may include only one external arm 33 or not include any external arm 33.

再者,上述兩條導電線路32的一端分別連接於電路板3的兩個導電部31,而所述兩條導電線路32的另一端則分別延伸至上述兩個外接臂33(的自由端)。連接於兩個電性接點15a、15b的所述兩個焊接體4則是分別焊接於兩個外接臂33,藉以與外接臂33上的導電線路32形成電性連接。藉此,所述電路板3能通過外接臂33的彈性擺動功能,以吸收焊接體4於焊接過程中所可能產生 的誤差,進而有效地避免產生空焊的問題。 Furthermore, one ends of the two conductive lines 32 are respectively connected to the two conductive portions 31 of the circuit board 3, and the other ends of the two conductive lines 32 respectively extend to the two external arms 33 (the free ends) . The two welding bodies 4 connected to the two electrical contacts 15a and 15b are respectively welded to the two external arms 33 to form electrical connections with the conductive lines 32 on the external arms 33. Thereby, the circuit board 3 can absorb the error that may be generated by the welding body 4 during the welding process through the elastic swing function of the external arm 33, thereby effectively avoiding the problem of empty welding.

如圖8和圖11所示,上述每個導電部31的兩個電極區311a、311b皆位於相同的平面(如:圖11中的電路板3頂面)上,並且所述霧化腔室202的中心軸線C2大致垂直於上述平面(如:圖2和圖11)。再者,所述每個導電部31可進一步包含有另一電極區311c,並且在每個導電部31的兩個電極區311a、311c之中,其中一個電極區311a位於大致垂直霧化腔室202中心軸線C2的平面(如:圖11中的電路板3頂面),而另一個電極區311c位於另一平面。其中,所述兩個電極區311a、311c形成有介於70度至110度之間的一夾角α。 As shown in FIGS. 8 and 11, the two electrode regions 311a, 311b of each conductive portion 31 are located on the same plane (for example: the top surface of the circuit board 3 in FIG. 11), and the atomization chamber The central axis C2 of 202 is substantially perpendicular to the above-mentioned plane (for example, FIG. 2 and FIG. 11). Furthermore, each conductive portion 31 may further include another electrode area 311c, and among the two electrode areas 311a, 311c of each conductive portion 31, one of the electrode areas 311a is located in a substantially vertical atomization chamber 202 is a plane of the central axis C2 (for example, the top surface of the circuit board 3 in FIG. 11), and the other electrode area 311c is located on another plane. Wherein, the two electrode regions 311a, 311c are formed with an included angle α between 70 degrees and 110 degrees.

需說明的是,所述電極區311c的具體設置方式可依據設計需求而加以調整,而於本實施例中,所述每個導電部31的電極區311c是設置於電子元件7的外表面上。具體來說,所述電子元件7設置於遠離震動環1的所述電路板3表面(如:圖8中的電路板3頂面),並且上述電子元件7是橫跨地設置於兩個導電部31的兩個電極區311b上,並使位於電子元件7上的兩個電極區311c能夠分別連接於位在電路板3頂面上的兩個電極區311b,藉以達成電性連接。據此,每個導電部31未被覆蓋的兩個電極區311a、311c分別位於電路板3頂面(位於垂直所述霧化腔室202中心軸線C2的平面)與所述電子元件7的外表面上,以使該兩個電極區311a、311c形成有介於70度至110度之間的一夾角α,而上述夾角α於本實施例中是以90度呈現,本發明不受限於此。 It should be noted that the specific arrangement of the electrode area 311c can be adjusted according to design requirements, and in this embodiment, the electrode area 311c of each conductive portion 31 is arranged on the outer surface of the electronic component 7. . Specifically, the electronic component 7 is arranged on the surface of the circuit board 3 away from the vibrating ring 1 (such as the top surface of the circuit board 3 in FIG. 8), and the electronic component 7 is arranged across two conductive The two electrode regions 311b of the portion 31 and the two electrode regions 311c on the electronic component 7 can be respectively connected to the two electrode regions 311b on the top surface of the circuit board 3 to achieve electrical connection. Accordingly, the two electrode regions 311a and 311c that are not covered by each conductive portion 31 are respectively located on the top surface of the circuit board 3 (located on a plane perpendicular to the central axis C2 of the atomization chamber 202) and outside the electronic component 7. On the surface, so that the two electrode regions 311a, 311c are formed with an included angle α between 70 degrees and 110 degrees, and the above included angle α is represented by 90 degrees in this embodiment, and the present invention is not limited to this.

此外,本實施例的電極區311a、311b、311c雖是以位於電路板3及電子元件7來說明,但電極區311a、311b、311c的位置與數量可依據設計需求而加以調整。舉例來說,在本發明未繪示的其他實施例中,所述霧化模組100可以未包含上述電子元件7,據以使所述每個導電部31的兩個電極區311a、311b皆位於相同平 面;或者,所述霧化模組100的每個導電部31也可以僅包含有位於不同平面的兩個電極區311a、311c;又或者,所述霧化模組100可以未包含上述電路板3,而所述震動環1的電性接點15a、15b則皆可用來作為電極區使用。 In addition, although the electrode regions 311a, 311b, and 311c of this embodiment are described as being located on the circuit board 3 and the electronic component 7, the positions and numbers of the electrode regions 311a, 311b, and 311c can be adjusted according to design requirements. For example, in other embodiments not shown in the present invention, the atomization module 100 may not include the above-mentioned electronic component 7, so that the two electrode regions 311a, 311b of each conductive portion 31 are both Are located on the same plane; or, each conductive portion 31 of the atomization module 100 may also only include two electrode regions 311a, 311c located on different planes; or, the atomization module 100 may not include the above The circuit board 3 and the electrical contacts 15a, 15b of the vibrating ring 1 can be used as electrode areas.

另,如圖11所示,所述電路板3的頂面(也就是每個導電部31中的其中至少一個電極區311a、311b所在的平面)是與上述容器200插槽204的插拔方向S相夾有介於30度至60度之間的一銳角σ。其中,所述插槽204的穿孔2041沿插拔方向S投影至所述霧化模組100所形成的一投影區域,其覆蓋上述每個導電部31的兩個電極區311a、311c(如:每個導電部31未被覆蓋的兩個電極區311a、311c)。 In addition, as shown in FIG. 11, the top surface of the circuit board 3 (that is, the plane where at least one of the electrode regions 311a, 311b in each conductive portion 31 is located) is in the direction of insertion and removal from the slot 204 of the container 200. The S phase has an acute angle σ between 30 degrees and 60 degrees. Wherein, the through hole 2041 of the slot 204 is projected to a projection area formed by the atomization module 100 along the insertion and removal direction S, which covers the two electrode regions 311a, 311c of each conductive portion 31 (such as: Two electrode regions 311a, 311c not covered by each conductive portion 31).

然而,本實施例插槽204的插拔方向S是相對於電路板3頂面形成有30度至60度之間的銳角σ來說明,但在本發明未繪示的其他實施例中,所述插槽204的插拔方向S也可以與電路板3頂面形成其他的角度(如:90度)。 However, the insertion and removal direction S of the slot 204 in this embodiment is described by forming an acute angle σ between 30 degrees and 60 degrees with respect to the top surface of the circuit board 3. However, in other embodiments not shown in the present invention, The insertion and removal direction S of the slot 204 can also form other angles (such as 90 degrees) with the top surface of the circuit board 3.

如圖7、圖8、及圖11所示,所述緩衝件5於本實施例中是以固化後的膠體來說明,但本發明的緩衝件5種類也可以依據設計需求而調整或變化。舉例來說,在本發明未繪示的其他實施例中,所述緩衝件5也可以是海綿、彈簧、或其他具有緩衝效果的構件。 As shown in FIG. 7, FIG. 8, and FIG. 11, the cushioning member 5 is illustrated as a cured gel in this embodiment, but the type of the cushioning member 5 of the present invention can also be adjusted or changed according to design requirements. For example, in other embodiments not shown in the present invention, the buffer member 5 may also be a sponge, a spring, or other members with a buffer effect.

所述緩衝件5夾持在所述電路板3與部分震動環1之間,以使所述間隙G進一步限定形成在所述震動環1另一部分與電路板3之間,並且所述間隙G連通於一外部空間。其中,本實施例的緩衝件5一端連接電路板3,而緩衝件5的另一端連接上述震動環1的外環區14與中環區13的至少其中之一。也就是說,所述震動環1的內環區12與電路板3之間形成有環形的間隙G,所述緩衝 件5位於上述間隙G的外側。 The buffer member 5 is clamped between the circuit board 3 and a part of the vibrating ring 1, so that the gap G is further defined and formed between another part of the vibrating ring 1 and the circuit board 3, and the gap G Connected to an external space. Wherein, one end of the buffer member 5 of this embodiment is connected to the circuit board 3, and the other end of the buffer member 5 is connected to at least one of the outer ring area 14 and the middle ring area 13 of the vibrating ring 1 described above. In other words, an annular gap G is formed between the inner ring region 12 of the vibrating ring 1 and the circuit board 3, and the buffer member 5 is located outside the gap G.

進一步地說,所述緩衝件5的至少部分位於(每個導電部31未被覆蓋的)兩個電極區311a、311c的下方(如:所述緩衝件5的至少部分位於上述電極區311a、311c與震動環1之間),藉以通過緩衝件5提供一緩衝功能給上述震動環1與設有電極區311a、311c的電路板3部位,進而使電路板3的電極區311a、311c能夠承受較大的壓迫力。其中,面向震動環1的所述中環區13表面與外環區14表面較佳是其面積總和的3%至30%被所述緩衝件5所覆蓋。 Further, at least part of the buffer member 5 is located below the two electrode regions 311a, 311c (not covered by each conductive portion 31) (for example, at least part of the buffer member 5 is located in the electrode regions 311a, 311c). 311c and the vibrating ring 1), so as to provide a buffer function to the vibrating ring 1 and the circuit board 3 where the electrode regions 311a, 311c are provided through the buffer member 5, so that the electrode regions 311a, 311c of the circuit board 3 can bear Greater pressure. Wherein, the surface of the middle ring region 13 and the surface of the outer ring region 14 facing the vibrating ring 1 are preferably covered by the buffer member 5 by 3% to 30% of the total area.

然而,在本發明未繪示的其他實施例中,所述電路板3與震動環1之間也可以依據設計需求,而未包含有緩衝件5、包含多個緩衝件5、或是佈滿緩衝件5。 However, in other embodiments not shown in the present invention, the circuit board 3 and the vibrating ring 1 may also be designed according to design requirements without including the buffer member 5, including a plurality of buffer members 5, or being filled with Buffer 5.

如圖8及圖13所示,所述底墊圈8於本實施例中是以具有彈性的材質(如:橡膠)所製成的圓環狀構造,並且上述底墊圈8內緣所形成的孔洞,其孔徑大於震動環1的第一孔洞11的孔徑。其中,上述底墊圈8包含有一環形片體81、自所述環形片體81表面延伸的多個環形肋條82、自所述環形片體81外緣延伸的一環形凸肋83。 As shown in Figures 8 and 13, the bottom gasket 8 in this embodiment is an annular structure made of an elastic material (such as rubber), and the hole formed by the inner edge of the bottom gasket 8 , The aperture is larger than the aperture of the first hole 11 of the vibrating ring 1. Wherein, the bottom gasket 8 includes an annular sheet 81, a plurality of annular ribs 82 extending from the surface of the annular sheet 81, and an annular rib 83 extending from the outer edge of the annular sheet 81.

當由所述底墊圈8的俯視圖來看時,上述多個環形肋條82及環形凸肋83大致呈同心圓構造,並且任兩個相鄰的環形肋條82之間的距離皆相等,而每個環形肋條82的高度小於上述環形凸肋83的高度,但本發明不受限於此。 When viewed from the top view of the bottom gasket 8, the plurality of annular ribs 82 and the annular convex ribs 83 are roughly concentrically constructed, and the distance between any two adjacent annular ribs 82 is equal, and each The height of the annular rib 82 is smaller than the height of the aforementioned annular rib 83, but the present invention is not limited to this.

再者,所述底墊圈8設置於容器200的蓋體200b上,上述多個環形肋條82夾持於承載片6與容器200的蓋體200b之間(或者,所述承載片6設置於多個環形肋條82上),所述環形凸肋83夾持於容器200的杯體200a與蓋體200b之間、且大致形成無間隙地相接,而所述底墊圈8的中心大致坐落於霧化腔室202的中 心軸線C2上(如:圖2)。 Furthermore, the bottom gasket 8 is arranged on the lid 200b of the container 200, and the plurality of annular ribs 82 are clamped between the carrying sheet 6 and the lid 200b of the container 200 (or, the carrying sheet 6 is arranged on a plurality of The annular ribs 83 are clamped between the cup body 200a and the lid body 200b of the container 200, and form a substantially seamless connection, and the center of the bottom gasket 8 is substantially located on the mist On the central axis C2 of the chemical chamber 202 (e.g., FIG. 2).

進一步地說,如圖11所示,所述多個環形肋條82朝震動環1正投影所形成的一投影區域,其大致落於中環區13與外環區14的至少其中之一。據此,所述底墊圈8能通過其多個環形肋條82提供一緩衝功能給上述震動環1與設有電極區311a、311b、311c的電路板3部位,進而使電路板3的電極區311a、311b、311c能夠承受較大的壓迫力。 Furthermore, as shown in FIG. 11, a projection area formed by the orthographic projection of the plurality of annular ribs 82 toward the vibrating ring 1 roughly falls on at least one of the middle ring area 13 and the outer ring area 14. Accordingly, the bottom gasket 8 can provide a cushioning function to the vibrating ring 1 and the circuit board 3 where the electrode regions 311a, 311b, 311c are provided through its plurality of annular ribs 82, thereby making the electrode region 311a of the circuit board 3 , 311b, 311c can withstand greater pressure.

如圖8及圖10所示,所述內墊圈9於本實施例中是以具有彈性的材質(如:橡膠)所製成的圓環狀構造,並且上述內墊圈9的內緣所形成的孔洞,其孔徑小於震動環1的第一孔洞11的孔徑。其中,所述內墊圈9包含有一主環體91以及自上述主環體91傾斜地延伸的一頂抵環體92。 As shown in Figures 8 and 10, the inner gasket 9 in this embodiment is an annular structure made of elastic material (such as rubber), and the inner edge of the inner gasket 9 is formed The aperture of the hole is smaller than the aperture of the first hole 11 of the vibration ring 1. The inner gasket 9 includes a main ring body 91 and an abutting ring body 92 extending obliquely from the main ring body 91.

再者,所述主環體91設置於震動環1的局部內環區12(如:圖10突伸出電路板3的內環區12部位)上,並且所述主環體91的局部是位於所述電路板3內側的孔洞內。本實施例的主環體91是夾持於容器200的杯體200a與震動環1之間,以使所述主環體91與容器200的杯體200a之間大致形成無間隙地相接。上述頂抵環體92位於震動環1的第一孔洞11內,並且所述頂抵環體92的末端抵接於所述微孔件2。 Furthermore, the main ring body 91 is arranged on a part of the inner ring area 12 of the vibrating ring 1 (for example, the part of the inner ring area 12 protruding from the circuit board 3 in FIG. 10), and the part of the main ring body 91 is Located in the hole inside the circuit board 3. The main ring body 91 of this embodiment is clamped between the cup body 200a of the container 200 and the vibrating ring 1, so that the main ring body 91 and the cup body 200a of the container 200 are substantially connected to each other without a gap. The abutting ring 92 is located in the first hole 11 of the vibrating ring 1, and the end of the abutting ring 92 abuts against the microporous member 2.

如圖3及圖14所示,所述插頭2000能沿上述插拔方向S而可分離地插設於容器200的插槽204內,藉以使上述插頭2000能夠電性耦接於電路板3。其中,本實施例的插頭2000包含有一絕緣體2001以及埋置於上述絕緣體2001的兩個導電端子2002,並且上述兩個導電端子2002分別抵接於所述電路板3的兩個導電部31。 As shown in FIGS. 3 and 14, the plug 2000 can be detachably inserted into the slot 204 of the container 200 along the plugging direction S, so that the plug 2000 can be electrically coupled to the circuit board 3. The plug 2000 of this embodiment includes an insulator 2001 and two conductive terminals 2002 embedded in the insulator 2001, and the two conductive terminals 2002 abut against the two conductive portions 31 of the circuit board 3 respectively.

進一步地說,上述每個導電端子2002可分離地穿過於插槽 204的穿孔2041、並且彈性地頂抵於相對應導電部31未被覆蓋的兩個電極區311a、311c。據此,本實施例的插頭2000通過每個導電端子2002同時抵接於相對應的兩個電極區311a、311c,以提升導電端子2002與電路板3之間的電性連接穩定度;並且上述插頭2000通過電路板3而電性耦接於震動環1,藉以避免所述插頭2000與震動環1之間的電連接穩定度、受到上述震動環1所產生的震動影響。 Furthermore, each of the aforementioned conductive terminals 2002 can detachably pass through the through hole 2041 of the slot 204 and elastically abut the two electrode regions 311a, 311c of the corresponding conductive portion 31 that are not covered. Accordingly, the plug 2000 of this embodiment simultaneously abuts the two corresponding electrode regions 311a, 311c through each conductive terminal 2002, so as to improve the stability of the electrical connection between the conductive terminal 2002 and the circuit board 3; and The plug 2000 is electrically coupled to the vibrating ring 1 through the circuit board 3 to prevent the stability of the electrical connection between the plug 2000 and the vibrating ring 1 from being affected by the vibration generated by the vibrating ring 1.

其中,如圖15所示,上述電極區311a、311c所承受的相對應導電端子2002的一壓迫力F,其能分解為一水平向量Fx與一垂直向量Fy。抵接於導電端子2002的任一個電極區311a、311c部位大致位於所述震動環1的中環區13與外環區14的至少其中之一的上方、並大致位於所述底墊圈8的多個環形肋條82的上方,藉以使所述緩衝件5及多個環形肋條82能用來吸收上述電極區311a所承受的壓迫力(如:垂直向量Fy)。 Wherein, as shown in FIG. 15, a pressing force F of the corresponding conductive terminal 2002 borne by the electrode regions 311a and 311c can be decomposed into a horizontal vector Fx and a vertical vector Fy. The part of any electrode area 311a, 311c contacting the conductive terminal 2002 is approximately located above at least one of the central ring area 13 and the outer ring area 14 of the vibrating ring 1, and approximately located on the plurality of bottom gaskets 8. Above the annular rib 82, the buffer member 5 and the plurality of annular ribs 82 can be used to absorb the pressing force (such as the vertical vector Fy) that the electrode region 311a bears.

所述插頭2000的導電端子2002數量於本實施例中是以兩個來說明,但於本發明未繪示的其他實施例中,所述插頭2000的導電端子2002數量也可以是一個,用以可分離地穿過於插槽204的穿孔2041、並且彈性地頂抵於上述相對應的兩個電極區311a、311c。 The number of conductive terminals 2002 of the plug 2000 is described as two in this embodiment, but in other embodiments not shown in the present invention, the number of conductive terminals 2002 of the plug 2000 can also be one for It detachably passes through the through hole 2041 of the slot 204 and elastically abuts the two corresponding electrode regions 311a and 311c.

需額外說明的是,本實施例所記載的微霧生成裝置以及本發明未繪示的其他實施例中所記載的內容能夠依據設計需求而任意搭配使用。也就是說,本發明所涵蓋的實施例範圍是包含本實施例所記載的微霧生成裝置以及本發明未繪示的其他實施例中所記載的內容之間的任意搭配。 It should be additionally noted that the micro mist generating device described in this embodiment and the content described in other embodiments not shown in the present invention can be used in any combination according to design requirements. In other words, the scope of the embodiments covered by the present invention includes any combination between the micro mist generating device described in this embodiment and the content described in other embodiments not shown in the present invention.

[本發明實施例所產生的技術效果] [Technical effects produced by the embodiments of the present invention]

綜上所述,本發明實施例所公開的微霧產生器及霧化模組, 其通過在震動環的一側間隔地設置有電性耦接的電路板,用以使導電端子需抵接於電路板,進而電性耦接於震動環。據此,所述震動環與導電端子之間的電性連接較不易受到震動環的振動影響,進而處於較為穩定的狀態。 In summary, the micro mist generator and atomization module disclosed in the embodiments of the present invention are provided with electrically coupled circuit boards spaced apart on one side of the vibrating ring to make the conductive terminals contact On the circuit board, and then electrically coupled to the vibration ring. Accordingly, the electrical connection between the vibrating ring and the conductive terminal is less susceptible to the vibration of the vibrating ring, and thus is in a relatively stable state.

再者,本發明實施例所公開的微霧生成裝置及微霧產生器,其通過在霧化模組上設有相同極性且彼此電性連接的兩個電極區,用以供單個導電端子能同時抵接於上述兩個電極區而形成多點接觸,藉以使得所述震動環(或電路板)與導電端子之間的電性連接處於較為穩定的狀態。 Furthermore, the micro-mist generating device and the micro-mist generator disclosed in the embodiments of the present invention are provided with two electrode regions of the same polarity and electrically connected to each other on the atomization module to provide a single conductive terminal energy At the same time, it abuts on the two electrode regions to form multiple points of contact, so that the electrical connection between the vibrating ring (or circuit board) and the conductive terminal is in a relatively stable state.

以上所述僅為本發明的優選可行實施例,並非用來侷限本發明的保護範圍,凡依本發明專利範圍所做的均等變化與修飾,皆應屬本發明的權利要求書的保護範圍。 The above descriptions are only preferred and feasible embodiments of the present invention, and are not used to limit the scope of protection of the present invention. All equivalent changes and modifications made in accordance with the patent scope of the present invention should fall within the protection scope of the claims of the present invention.

100‧‧‧霧化模組 100‧‧‧Atomization Module

1‧‧‧震動環 1‧‧‧Vibration ring

12‧‧‧內環區 12‧‧‧Inner Ring District

13‧‧‧中環區 13‧‧‧Central District

14‧‧‧外環區 14‧‧‧Outer Ring District

3‧‧‧電路板 3‧‧‧Circuit board

31‧‧‧導電部 31‧‧‧Conductive part

311a、311b、311c‧‧‧電極區 311a, 311b, 311c‧‧‧electrode area

5‧‧‧緩衝件 5‧‧‧Buffer

6‧‧‧承載片 6‧‧‧Carrier sheet

7‧‧‧電子元件 7‧‧‧Electronic components

8‧‧‧底墊圈 8‧‧‧Bottom washer

81‧‧‧環形片體 81‧‧‧Annular plate

82‧‧‧環形肋條 82‧‧‧Annular rib

83‧‧‧環形凸肋 83‧‧‧Annular rib

9‧‧‧內墊圈 9‧‧‧Inner gasket

200‧‧‧容器 200‧‧‧Container

200a‧‧‧杯體 200a‧‧‧Cup body

200b‧‧‧蓋體 200b‧‧‧Cover body

202‧‧‧霧化腔室 202‧‧‧Atomization chamber

203‧‧‧收容腔室 203‧‧‧Containment Chamber

204‧‧‧插槽 204‧‧‧Slot

2041‧‧‧穿孔 2041‧‧‧Perforation

S‧‧‧插拔方向 S‧‧‧plugging direction

G‧‧‧間隙 G‧‧‧Gap

α‧‧‧夾角 α ‧‧‧Included angle

σ‧‧‧銳角 σ ‧‧‧ acute angle

Claims (23)

一種微霧生成裝置,包括:一微霧產生器,包含有:一容器,其形成有一集液腔室、一霧化腔室、及一插槽,而所述插槽定義有一插拔方向;及一霧化模組,其安裝於所述容器內,所述集液腔室與所述霧化腔室位於所述霧化模組的相反兩側、且經由所述霧化模組而彼此連通;其中,所述霧化模組包含有至少一導電部,而至少一所述導電部設有相同極性且彼此電性連接的兩個電極區;以及一插頭,其能沿所述插拔方向而可分離地插設於所述容器的所述插槽內,並且所述插頭的至少一導電端子抵接於兩個所述電極區。 A micro-mist generating device, comprising: a micro-mist generator, including: a container formed with a liquid collection chamber, an atomization chamber, and a slot, and the slot defines a plug-in direction; And an atomization module installed in the container, the liquid collection chamber and the atomization chamber are located on opposite sides of the atomization module, and are mutually connected via the atomization module Wherein, the atomization module includes at least one conductive portion, and at least one of the conductive portions is provided with two electrode regions of the same polarity and electrically connected to each other; and a plug that can be inserted and removed along the It is detachably inserted into the slot of the container, and at least one conductive terminal of the plug abuts against the two electrode regions. 根據請求項1所述的微霧生成裝置,其中,兩個所述電極區皆位於一平面上,並且所述霧化腔室的中心軸線大致垂直於所述平面。 The micro mist generating device according to claim 1, wherein the two electrode regions are both located on a plane, and the central axis of the atomization chamber is substantially perpendicular to the plane. 根據請求項1所述的微霧生成裝置,其中,兩個所述電極區的其中一個所述電極區位於大致垂直所述霧化腔室中心軸線的一平面,而另一個所述電極區位於另一平面,並且兩個所述電極區形成有一夾角。 The micro mist generating device according to claim 1, wherein one of the two electrode areas is located on a plane substantially perpendicular to the central axis of the atomization chamber, and the other electrode area is located Another plane, and the two electrode regions form an included angle. 根據請求項3所述的微霧生成裝置,其中,所述夾角介於70度至110度之間。 The micro mist generating device according to claim 3, wherein the included angle is between 70 degrees and 110 degrees. 根據請求項1所述的微霧生成裝置,其中,所述霧化模組包含有一電子元件,兩個所述電極區分別位於大致垂直所述霧化腔室中心軸線的一平面與所述電子元件的外表面上,以使兩個所述電極區形成有介於70度至110度之間的一夾角。 The micro mist generating device according to claim 1, wherein the atomization module includes an electronic component, and the two electrode regions are respectively located on a plane substantially perpendicular to the central axis of the atomization chamber and the electron On the outer surface of the element, an included angle between 70 degrees and 110 degrees is formed between the two electrode regions. 根據請求項1所述的微霧生成裝置,其中,兩個所述電極區中的至少一個所述電極區所在的一平面是與所述插槽的所述插拔 方向相夾有一銳角。 The micro mist generating device according to claim 1, wherein a plane on which at least one of the two electrode regions is located is connected to the insertion and removal of the slot There is an acute angle between the directions. 根據請求項6所述的微霧生成裝置,其中,所述銳角介於30度至60度之間。 The micro mist generating device according to claim 6, wherein the acute angle is between 30 degrees and 60 degrees. 根據請求項1所述的微霧生成裝置,其中,所述集液腔室的中心軸線重疊於所述霧化腔室的中心軸線。 The micro mist generating device according to claim 1, wherein the central axis of the liquid collection chamber overlaps the central axis of the atomization chamber. 根據請求項1所述的微霧生成裝置,其中,所述容器形成有位於所述集液腔室與所述霧化腔室之間的一收容腔室,所述霧化模組設置於所述收容腔室內,所述插槽具有連通至所述收容腔室的一穿孔,並且所述穿孔沿所述插拔方向投影至所述霧化模組所形成的一投影區域,其覆蓋兩個所述電極區;而所述插頭的至少一所述導電端子可分離地穿過於所述穿孔、並且彈性地頂抵於兩個所述電極區。 The micro mist generating device according to claim 1, wherein the container is formed with a containing chamber located between the liquid collection chamber and the atomization chamber, and the atomization module is disposed in the In the containing chamber, the slot has a through hole communicating with the containing chamber, and the through hole is projected along the plugging and unplugging direction to a projection area formed by the atomization module, which covers two The electrode area; and at least one of the conductive terminals of the plug can detachably pass through the through hole, and elastically abut the two electrode areas. 根據請求項1所述的微霧生成裝置,其中,所述霧化模組所包含的至少一所述導電部的數量為兩個,並且兩個所述導電部的極性彼此相異,所述插頭的至少一所述導電端子數量為兩個,並且兩個所述導電端子分別抵接於兩個所述導電部。 The micro mist generating device according to claim 1, wherein the number of at least one conductive portion included in the atomization module is two, and the polarities of the two conductive portions are different from each other, the The number of at least one conductive terminal of the plug is two, and the two conductive terminals abut against the two conductive parts respectively. 根據請求項1所述的微霧生成裝置,其中,每個所述電極區所承受的至少一所述導電端子的一壓迫力,其能分解為一水平向量與一垂直向量。 The micro mist generating device according to claim 1, wherein a pressing force of at least one of the conductive terminals borne by each of the electrode regions can be decomposed into a horizontal vector and a vertical vector. 根據請求項1所述的微霧生成裝置,其中,所述霧化模組包含有:一震動環,其形成有一第一孔洞,並且所述震動環自所述第一孔洞向外依序定義有寬度大致相等的一內環區、一中環區、及一外環區;其中,抵接於至少一所述導電端子的兩個所述電極區部位大致位於所述中環區與所述外環區的至少其中之一的上方;一微孔件,其設置於所述震動環並覆蓋所述第一孔洞,並且所述集液腔室與所述霧化腔室經由所述微孔件而彼此連通;一電路板,其位於所述震動環的一側,至少一個所述電極區位於遠離所述震動環的所述電路板表面上;及一緩衝件,其一端連接所述電路板,而所述緩衝件的另一端連接所述外環區與所述中環區的至少其中之一。 The micro-mist generating device according to claim 1, wherein the atomization module includes: a vibration ring formed with a first hole, and the vibration ring is sequentially defined outward from the first hole There are an inner ring area, a middle ring area, and an outer ring area with approximately the same width; wherein, the two electrode areas abutting at least one of the conductive terminals are approximately located between the middle ring area and the outer ring Above at least one of the regions; a microporous member, which is arranged on the vibration ring and covers the first hole, and the liquid collection chamber and the atomization chamber are formed through the microporous member Communicate with each other; a circuit board located on one side of the vibrating ring, at least one of the electrode regions is located on the surface of the circuit board away from the vibrating ring; and a buffer member, one end of which is connected to the circuit board, The other end of the buffer member is connected to at least one of the outer ring area and the middle ring area. 根據請求項12所述的微霧生成裝置,其中,面向所述震動環的所述中環區表面與所述外環區表面,其面積總和的3%至30%被所述緩衝件所覆蓋。 The micro mist generating device according to claim 12, wherein 3% to 30% of the total area of the surface of the middle ring area and the surface of the outer ring area facing the vibrating ring is covered by the buffer member. 根據請求項12所述的微霧生成裝置,其中,所述震動環的所述內環區與所述電路板之間形成有環形的一間隙,所述緩衝件位於所述間隙的外側,並且所述緩衝件的至少部分位於兩個所述電極區的下方。 The micro mist generating device according to claim 12, wherein a ring-shaped gap is formed between the inner ring area of the vibrating ring and the circuit board, the buffer member is located outside the gap, and At least part of the buffer member is located below the two electrode regions. 根據請求項1所述的微霧生成裝置,其中,所述霧化模組包含有:一震動環,其形成有一第一孔洞;一微孔件,其設置於所述震動環並覆蓋所述第一孔洞,並且所述集液腔室與所述霧化腔室經由所述微孔件而彼此連通;一電路板,其位於所述震動環的一側;及一電子元件,設置於遠離所述震動環的所述電路板表面,並且兩個所述電極區分別位於所述電子元件的外表面上以及遠離所述震動環的所述電路板表面。 The micro-mist generating device according to claim 1, wherein the atomization module includes: a vibrating ring formed with a first hole; a microporous member disposed on the vibrating ring and covering the The first hole, and the liquid collection chamber and the atomization chamber are in communication with each other through the microporous member; a circuit board located on one side of the vibration ring; and an electronic component located far away The surface of the circuit board of the vibrating ring and the two electrode regions are respectively located on the outer surface of the electronic component and on the surface of the circuit board away from the vibrating ring. 根據請求項1所述的微霧生成裝置,其中,所述霧化模組包含有一底墊圈,並且所述底墊圈包含有一環形片體以及自所述環形片體表面延伸的多個環形肋條,抵接於至少一所述導電端子的兩個所述電極區部位大致位於多個所述環形肋條的上方,以使多個所述環形肋條能用來吸收兩個所述電極區所承受的壓迫力。 The micro mist generating device according to claim 1, wherein the atomization module includes a bottom gasket, and the bottom gasket includes an annular plate and a plurality of annular ribs extending from the surface of the annular plate, The two electrode regions abutting on at least one of the conductive terminals are substantially located above the plurality of annular ribs, so that the plurality of annular ribs can be used to absorb the compression of the two electrode regions force. 一種微霧產生器,包括: 一容器,形成有一集液腔室、一霧化腔室、及一插槽,而所述插槽定義有一插拔方向;以及一霧化模組,安裝於所述容器內,所述集液腔室與所述霧化腔室位於所述霧化模組的相反兩側、且經由所述霧化模組而彼此連通;其中,所述霧化模組包含有相同極性且彼此電性連接的兩個電極區,並且兩個所述電極區中的至少一個所述電極區所在的一平面是與所述插槽的所述插拔方向相夾有一銳角。 A micro-mist generator includes: a container formed with a liquid collection chamber, an atomization chamber, and a slot, and the slot defines a plug-in direction; and an atomization module installed in the In the container, the liquid collection chamber and the atomization chamber are located on opposite sides of the atomization module and communicate with each other through the atomization module; wherein, the atomization module includes There are two electrode areas with the same polarity and electrically connected to each other, and at least one of the electrode areas of the two electrode areas is located on a plane that intersects the insertion and removal direction of the socket at an acute angle. 根據請求項17所述的微霧產生器,其中,所述霧化腔室的中心軸線大致垂直於所述平面,並且兩個所述電極區皆位於所述平面上。 The micro mist generator according to claim 17, wherein the central axis of the atomization chamber is substantially perpendicular to the plane, and the two electrode regions are both located on the plane. 根據請求項17所述的微霧產生器,其中,所述集液腔室的中心軸線重疊於所述霧化腔室的中心軸線,並且所述集液腔室的所述中心軸線大致垂直於所述平面。 The micro mist generator according to claim 17, wherein the central axis of the liquid collection chamber overlaps the central axis of the atomization chamber, and the central axis of the liquid collection chamber is substantially perpendicular to The plane. 根據請求項17所述的微霧產生器,其中,所述霧化模組包含有:一震動環,其形成有一第一孔洞,並且所述震動環自所述第一孔洞向外依序定義有寬度大致相等的一內環區、一中環區、及一外環區;其中,兩個所述電極區的至少部分大致位於所述中環區與所述外環區的至少其中之一的上方;一微孔件,其設置於所述震動環並覆蓋所述第一孔洞,並且所述集液腔室與所述霧化腔室經由所述微孔件而彼此連通;一電路板,其位於所述震動環的一側,所述電路板包含位在所述平面的至少一個所述電極區,並且遠離所述震動環的所述電路板表面位於所述平面上;及一緩衝件,其一端連接所述電路板,而所述緩衝件的另一端連接所述外環區與所述中環區的至少其中之一。 The micro mist generator according to claim 17, wherein the atomization module includes: a vibration ring formed with a first hole, and the vibration ring is sequentially defined outward from the first hole There are an inner ring area, a middle ring area, and an outer ring area with approximately equal widths; wherein at least part of the two electrode areas is approximately located above at least one of the middle ring area and the outer ring area A microporous part, which is arranged in the vibration ring and covers the first hole, and the liquid collection chamber and the atomization chamber communicate with each other through the microporous part; a circuit board, which Located on one side of the vibrating ring, the circuit board includes at least one of the electrode regions located on the plane, and the surface of the circuit board far from the vibrating ring is located on the plane; and a buffer member, One end of the buffer member is connected to the circuit board, and the other end of the buffer member is connected to at least one of the outer ring area and the middle ring area. 根據請求項20所述的微霧產生器,其中,所述震動環的所述 內環區與所述電路板之間形成有環形的一間隙,所述緩衝件位於所述間隙的外側,並且所述緩衝件的至少部分位於兩個所述電極區的下方。 The micro mist generator according to claim 20, wherein a ring-shaped gap is formed between the inner ring area of the vibrating ring and the circuit board, and the buffer is located outside the gap, and At least part of the buffer member is located below the two electrode regions. 根據請求項17所述的微霧產生器,其中,所述霧化模組包含有:一震動環,其形成有一第一孔洞;一微孔件,其設置於所述震動環並覆蓋所述第一孔洞,並且所述集液腔室與所述霧化腔室經由所述微孔件而彼此連通;一電路板,其位於所述震動環的一側,並且遠離所述震動環的所述電路板表面位於所述平面上;及一電子元件,設置於遠離所述震動環的所述電路板表面,並且兩個所述電極區分別位於所述電子元件的外表面上以及遠離所述震動環的所述電路板表面。 The micro mist generator according to claim 17, wherein the atomization module includes: a vibrating ring formed with a first hole; a microporous member disposed on the vibrating ring and covering the The first hole, and the liquid collection chamber and the atomization chamber are in communication with each other via the microporous member; a circuit board is located on one side of the vibration ring and far away from all of the vibration ring The surface of the circuit board is located on the plane; and an electronic component is disposed on the surface of the circuit board away from the vibration ring, and the two electrode regions are respectively located on the outer surface of the electronic component and away from the The surface of the circuit board of the vibration ring. 根據請求項17所述的微霧產生器,其中,所述霧化模組包含有一底墊圈,並且所述底墊圈包含有一環形片體以及自所述環形片體表面延伸的多個環形肋條,抵接於至少一導電端子的兩個所述電極區部位大致位於多個所述環形肋條的上方,以使多個所述環形肋條能用來吸收兩個所述電極區所承受的壓迫力。 The micro mist generator according to claim 17, wherein the atomization module includes a bottom gasket, and the bottom gasket includes an annular plate body and a plurality of annular ribs extending from the surface of the annular plate body, The two electrode regions abutting at least one conductive terminal are substantially located above the plurality of annular ribs, so that the plurality of annular ribs can be used to absorb the compression force of the two electrode regions.
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* Cited by examiner, † Cited by third party
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TWM338106U (en) * 2008-01-04 2008-08-11 Full Most Co Ltd Sprayer
TWI595930B (en) * 2014-06-25 2017-08-21 達爾生技股份有限公司 Spraying device and spraying module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM338106U (en) * 2008-01-04 2008-08-11 Full Most Co Ltd Sprayer
TWI595930B (en) * 2014-06-25 2017-08-21 達爾生技股份有限公司 Spraying device and spraying module

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