TWI689780B - Curable composition, dry film, cured product, printed wiring board and method of manufacturing printed wiring board - Google Patents
Curable composition, dry film, cured product, printed wiring board and method of manufacturing printed wiring board Download PDFInfo
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Abstract
本發明之課題為提供一種解析度及硬化物之黑色度優異的硬化性組成物。 An object of the present invention is to provide a curable composition excellent in resolution and blackness of a cured product.
本發明解決手段為,一種硬化性組成物,使用其之乾膜、其硬化物及具備其硬化物之印刷配線板,該硬化性組成物係含有下述成分之組成物:(A)含羧基樹脂、(B)光聚合起始劑、(C)稀釋劑、(D)1分子中具有至少2個環氧基之多官能環氧化合物、(E)黑色著色劑、及(F)黑色以外之著色劑,其特徵為其乾燥塗膜之膜厚每25μm的波長365nm之吸光度為1.5以下,385nm之吸光度為1.0以下,且波長405nm之吸光度為1.0以下者。 The solution of the present invention is a curable composition using its dry film, its cured product, and a printed wiring board provided with the cured product. The curable composition is a composition containing the following components: (A) containing a carboxyl group Resin, (B) photopolymerization initiator, (C) diluent, (D) polyfunctional epoxy compound having at least 2 epoxy groups in 1 molecule, (E) black colorant, and (F) other than black The coloring agent is characterized in that the dry coating film thickness has an absorbance of 1.5 or less per wavelength of 365 nm of 25 μm, an absorbance of 385 nm or less of 1.0, and an absorbance of 405 nm or less of 1.0.
Description
本發明係關於硬化性組成物、乾膜、硬化物、印刷配線板、乾膜的製造方法、硬化物的製造方法及印刷配線板的製造方法。 The present invention relates to a method for manufacturing a curable composition, a dry film, a cured product, a printed wiring board, a dry film, a method for manufacturing a cured product, and a method for manufacturing a printed wiring board.
一般而言,於使用於電子機器等之印刷配線板中,在安裝電子零件時,係於形成有電路圖型的基板上之排除連接孔的區域形成防焊阻劑,該防焊阻劑係將樹脂組成物進行塗布或者將乾膜上之乾燥塗膜進行疊層之後硬化而成。此防焊阻劑係防止焊錫附著於不需要的部分,並且保護電路之導體者。 Generally speaking, in printed circuit boards used in electronic equipment, etc., when mounting electronic components, a solder resist is formed on the area on the substrate where the circuit pattern is formed excluding the connection hole. The resin composition is applied or cured by laminating a dry coating film on a dry film. This solder resist prevents solder from attaching to unnecessary parts and protects the conductors of the circuit.
又,防焊阻劑亦有將電路圖型之因熱或濕氣等所致之變色,或電性變色、損傷、髒污等進行遮蔽,而防止印刷配線板之外觀性的惡化之功用。因此,為了提昇遮蔽性,通常會在使用來形成防焊阻劑的樹脂組成物或乾膜中添加著色劑(例如,參照專利文獻1)。 In addition, the solder resist also has the function of shielding the circuit pattern from discoloration due to heat or moisture, or electrical discoloration, damage, dirt, etc., thereby preventing the deterioration of the appearance of the printed wiring board. Therefore, in order to improve the shielding property, a coloring agent is usually added to the resin composition or dry film used to form the solder resist (for example, refer to Patent Document 1).
近年來,根據電子機器之小型化或高功能化 的要求,針對印刷配線板亦發展電路圖型之微細化,伴隨此,針對防焊阻劑亦更進一步發展薄膜化。其結果,防焊阻劑的遮蔽性降低,導致作為底層之電路的變色等會透過防焊阻劑而看見,導致外觀不良的問題產生。因此,為了提昇遮蔽性,而要求有深黑色的防焊阻劑。又,就設計性的觀點而言,要求有黑色的防焊阻劑。另外,以往係使用碳黑作為黑色著色劑。 In recent years, according to the miniaturization or high functionality of electronic equipment Requirements, printed circuit boards have also been developed to miniaturize circuit patterns, along with this, for solder resists have also been further developed into thin films. As a result, the shielding property of the solder resist decreases, and discoloration of the circuit as the underlying layer is seen through the solder resist, resulting in a problem of poor appearance. Therefore, in order to improve the shielding property, a dark black solder resist is required. In addition, from a design point of view, a black solder resist is required. In addition, carbon black has been used as a black colorant in the past.
作為防焊阻劑的圖型形成方法之一,以往雖使用有光微影法,但在為了呈現黑色而於防焊阻劑油墨中摻合碳黑的情況,由於碳黑會吸收從紫外線區域至可見光區域之廣範圍的光,因此光透過性會變差,而產生解析度之降低等的問題。 As one of the pattern formation methods of the solder resist, although the photolithography method has been used in the past, when carbon black is blended in the solder resist ink in order to appear black, the carbon black will absorb from the ultraviolet region For a wide range of light up to the visible light region, the light transmittance will deteriorate, which will cause problems such as a reduction in resolution.
作為解決這樣的問題之手段,於專利文獻2中係記載有一種組成物,其特徵為含有黑色著色劑與黑色著色劑以外之著色劑。又,於專利文獻3中係記載有一種組成物,其特徵為組合黑色著色劑以外之著色劑並加以黑色化。然而,針對解析度係仍存有改善的空間。 As a means for solving such a problem, Patent Document 2 describes a composition characterized by containing a black coloring agent and a coloring agent other than the black coloring agent. In addition, Patent Document 3 describes a composition characterized by combining a coloring agent other than a black coloring agent and blackening it. However, there is still room for improvement for the resolution system.
[專利文獻1]日本特開2009-258613號公報 [Patent Document 1] Japanese Unexamined Patent Publication No. 2009-258613
[專利文獻2]日本特開2008-257045號公報 [Patent Document 2] Japanese Unexamined Patent Publication No. 2008-257045
[專利文獻3]日本特開2010-091876號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2010-091876
因此,本發明之目的為提供解析度及硬化物之黑色度優異的硬化性組成物、將該組成物塗布乾燥而成的乾膜、該組成物或該乾膜的硬化物、具有該硬化物的印刷配線板、使用該組成物之乾膜的製造方法、使用該組成物或該乾膜之硬化物的製造方法、及使用該組成物或該乾膜之印刷配線板的製造方法。 Therefore, an object of the present invention is to provide a curable composition excellent in resolution and blackness of a cured product, a dry film obtained by coating and drying the composition, a cured product of the composition or the dry film, and having the cured product Printed wiring board, method for manufacturing a dry film using the composition, method for manufacturing a cured product using the composition or the dry film, and method for manufacturing a printed wiring board using the composition or the dry film.
本發明者們經過努力探討的結果,發現藉由摻合黑色著色劑、及黑色以外之著色劑,進而使其乾燥塗膜之膜厚每25μm的特定波長之吸光度成為特定的範圍,而可解決上述課題,因而完成本發明。 The inventors have made great efforts and found that it can be solved by blending a black colorant and a coloring agent other than black, and then making the dry coating film thickness absorbance at a specific wavelength of 25 μm into a specific range. The above-mentioned subject thus completes the present invention.
亦即,本發明之硬化性組成物,係含有下述成分之組成物:(A)含羧基樹脂、(B)光聚合起始劑、(C)稀釋劑、(D)1分子中具有至少2個環氧基之多官能環氧化合物、(E)黑色著色劑、及(F)黑色以外之著色劑,其特徵為其乾燥塗膜之膜厚每25μm的波長365nm之吸光度為1.5以下,385nm之吸光度為1.0以下,且波長405nm之吸光度為1.0以下。 That is, the curable composition of the present invention is a composition containing the following components: (A) carboxyl group-containing resin, (B) photopolymerization initiator, (C) diluent, (D) 1 molecule has at least Two epoxy-based polyfunctional epoxy compounds, (E) black colorants, and (F) coloring agents other than black, characterized in that the film thickness of the dry coating film has an absorbance of 1.5 or less per wavelength of 365 nm at 25 μm. The absorbance at 385 nm is 1.0 or less, and the absorbance at 405 nm is 1.0 or less.
本發明之硬化性組成物,較佳為前述(F)黑色以外之著色劑含有紫色著色劑。 In the curable composition of the present invention, it is preferable that the coloring agent other than the aforementioned (F) black contains a purple coloring agent.
本發明之硬化性組成物,較佳為前述(F)黑色 以外之著色劑含有橙色著色劑。 The curable composition of the present invention is preferably the aforementioned (F) black Other colorants contain orange colorants.
本發明之硬化性組成物,較佳為前述(F)黑色以外之著色劑含有紅色著色劑、藍色著色劑及黃色著色劑之至少1種。 In the curable composition of the present invention, it is preferable that the coloring agent other than (F) black contains at least one of a red coloring agent, a blue coloring agent, and a yellow coloring agent.
本發明之硬化性組成物,較佳為前述(B)光聚合起始劑含有肟酯系光聚合起始劑。 In the curable composition of the present invention, it is preferable that the aforementioned (B) photopolymerization initiator contains an oxime ester-based photopolymerization initiator.
本發明之硬化性組成物,較佳為前述肟酯系光聚合起始劑為二聚體之肟酯系光聚合起始劑。 In the curable composition of the present invention, the oxime ester-based photopolymerization initiator is preferably a dimer oxime ester-based photopolymerization initiator.
本發明之乾膜,其特徵為具有將前述硬化性組成物塗布、乾燥於薄膜上而得之樹脂層。 The dry film of the present invention is characterized by having a resin layer obtained by coating and drying the curable composition on the film.
本發明之硬化物,其特徵為使前述硬化性組成物及前述乾膜的樹脂層之至少任一者硬化而得。 The cured product of the present invention is characterized in that at least one of the curable composition and the resin layer of the dry film is cured.
本發明之印刷配線板,其特徵為具備前述硬化物。 The printed wiring board of the present invention is characterized by having the above-mentioned cured product.
本發明之乾膜的製造方法,其特徵為使用前述硬化性組成物。 The method for producing a dry film of the present invention is characterized by using the aforementioned curable composition.
本發明之硬化物的製造方法,其特徵為使用前述硬化性組成物。 The method for producing a cured product of the present invention is characterized by using the aforementioned curable composition.
本發明之印刷配線板的製造方法,其特徵為使用前述硬化性組成物及前述乾膜之至少任一者。 The method for manufacturing a printed wiring board of the present invention is characterized by using at least any one of the curable composition and the dry film.
依據本發明,可提供解析度及硬化物之黑色度優異的硬化性組成物、具有塗布乾燥該組成物而得之樹 脂層的乾膜、該組成物或該乾膜之樹脂層的硬化物、具有該硬化物的印刷配線板、及使用該組成物之印刷配線板的製造方法。 According to the present invention, it is possible to provide a curable composition excellent in resolution and blackness of a cured product, and a tree obtained by coating and drying the composition A dry film of a fat layer, a cured product of the composition or the resin layer of the dry film, a printed wiring board having the cured product, and a method of manufacturing a printed wiring board using the composition.
[第1圖]係顯示於實施例2之硬化性組成物進行曝光顯像所形成的50μm線部之斷面的照片圖。 [Figure 1] This is a photograph showing a cross section of a 50 μm line portion formed by exposure development of the curable composition of Example 2.
[第2圖]係顯示於比較例2之硬化性組成物進行曝光顯像所形成的50μm線部之斷面的照片圖。 [Figure 2] This is a photographic view showing a cross section of a 50 μm line portion formed by exposure development of the curable composition of Comparative Example 2.
本發明之硬化性組成物,係含有下述成分之組成物:(A)含羧基樹脂、(B)光聚合起始劑、(C)稀釋劑、(D)1分子中具有至少2個環氧基之多官能環氧化合物、(E)黑色著色劑、及(F)黑色以外之著色劑,其特徵為其乾燥塗膜之膜厚每25μm的波長365nm之吸光度為1.5以下,385nm之吸光度為1.0以下,且波長405nm之吸光度為1.0以下者。 The curable composition of the present invention is a composition containing the following components: (A) carboxyl group-containing resin, (B) photopolymerization initiator, (C) diluent, (D) 1 molecule has at least 2 rings Oxygen-based multifunctional epoxy compound, (E) black colorant, and (F) coloring agent other than black, characterized in that the thickness of the dry coating film has an absorbance of 1.5 or less per wavelength of 365 nm at 25 μm, and an absorbance of 385 nm It is 1.0 or less and the absorbance at a wavelength of 405 nm is 1.0 or less.
於本發明之硬化性組成物中,滿足上述3個吸光度係為重點。藉由滿足上述吸光度,在曝光,尤其是LDI(雷射直接成像)曝光的情況,可進行硬化直至深部,而形成微細的圖型。詳細的機制雖尚不明確,但可推測其原因在於,若對所照射的波長進行探討,則在LDI曝光的 情況係所照射的波長為350~420nm左右,成為峰值的波長係I線(365nm)、h線(405nm)、或者依據光源而為370~400nm之範圍,因此,以峰值波長為中心而350~420nm之範圍的光透過性係成為重要。乾燥塗膜之膜厚每25μm的波長365nm之吸光度較佳為1.0~1.5。在1.0以上的情況,不易產生峰頂過寬。又,乾燥塗膜之膜厚每25μm的波長385nm之吸光度較佳為0.5~1.0。在0.5以上的情況,不易產生峰頂過寬。乾燥塗膜之膜厚每25μm的波長405nm之吸光度較佳為0~1.0。 In the curable composition of the present invention, it is important to satisfy the above three absorbance systems. By satisfying the above-mentioned absorbance, in the case of exposure, especially LDI (Laser Direct Imaging) exposure, it can be hardened to the deep part to form a fine pattern. Although the detailed mechanism is not clear, it is speculated that the reason is that if the wavelength of the irradiation is discussed, the The case is that the irradiated wavelength is about 350~420nm, and the peak wavelength is the range of I line (365nm), h line (405nm), or 370~400nm according to the light source. Therefore, the peak wavelength is 350~ The light transmittance in the range of 420nm becomes important. The absorbance of the film thickness of the dry coating film per 25 μm wavelength of 365 nm is preferably 1.0 to 1.5. In the case of 1.0 or more, the peak width is not easily generated. In addition, the absorbance of the film thickness of the dry coating film per 25 μm at a wavelength of 385 nm is preferably 0.5 to 1.0. In the case of 0.5 or more, it is not easy for the peak top to be too wide. The absorbance of the film thickness of the dry coating film per 25 μm wavelength of 405 nm is preferably 0 to 1.0.
調節成上述吸光度的方法雖無特別限定,但較佳為藉由(E)黑色著色劑及(F)黑色以外之著色劑的種類或摻合比例來進行調節。亦可藉由(B)光聚合起始劑的種類或摻合比例來進行調節。吸光度係可使用紫外可見分光光度計進行測定。 Although the method of adjusting to the above-mentioned absorbance is not particularly limited, it is preferably adjusted by the types or blending ratios of (E) black colorants and (F) coloring agents other than black. It can also be adjusted by (B) the type or blending ratio of the photopolymerization initiator. The absorbance system can be measured using an ultraviolet-visible spectrophotometer.
(F)黑色以外之著色劑,就解析度的觀點而言,作為(F)黑色以外之著色劑較佳為含有紫色著色劑、橙色著色劑及紅色著色劑之至少1種,更佳為含有紫色著色劑及橙色著色劑之至少1種,再更佳為含有紫色著色劑及橙色著色劑。又,就黑色度的觀點而言,作為(F)黑色以外之著色劑較佳為含有紫色著色劑及藍色著色劑之至少1種,更佳為含有紫色著色劑。又,在含有藍色著色劑的情況,更佳為進一步含有黃色著色劑。就解析度及黑色度的觀點而言,作為(F)黑色以外之著色劑特佳為含有紫色著色劑、橙色著色劑、藍色著色劑及黃色著色劑。 (F) A coloring agent other than black, from the viewpoint of resolution, as the coloring agent other than black (F), it is preferable to contain at least one kind of purple coloring agent, orange coloring agent, and red coloring agent, more preferably At least one of the purple colorant and the orange colorant is more preferably a purple colorant and an orange colorant. From the viewpoint of blackness, it is preferable that the coloring agent other than black (F) contains at least one of a purple coloring agent and a blue coloring agent, and more preferably contains a purple coloring agent. Moreover, when a blue coloring agent is contained, it is more preferable to further contain a yellow coloring agent. From the viewpoint of resolution and blackness, it is particularly preferable that the coloring agent other than (F) black contains a purple colorant, an orange colorant, a blue colorant, and a yellow colorant.
以下,針對各成分詳細地進行說明。 Hereinafter, each component will be described in detail.
作為(A)含羧基樹脂,特別是分子中具有乙烯性不飽和雙鍵之含羧基感光性樹脂,係作為進行鹼顯像之感光性的組成物,就光硬化性或耐顯像性的觀點而言為更佳。而,其不飽和雙鍵,較佳為丙烯酸或甲基丙烯酸,或者來自該等之衍生物者。 (A) A carboxyl group-containing resin, especially a carboxyl group-containing photosensitive resin having an ethylenically unsaturated double bond in the molecule, as a photosensitive composition for alkali development, from the viewpoint of photocurability or development resistance It is better. However, the unsaturated double bond is preferably acrylic acid or methacrylic acid, or derivatives derived from these.
作為(A)含羧基樹脂之具體例,較佳為如以下所列舉之化合物(亦可為寡聚物及聚合物之任一者)。 As a specific example of (A) a carboxyl group-containing resin, the compounds listed below (preferably any of oligomers and polymers) are preferable.
(1)藉由(甲基)丙烯酸等之不飽和羧酸,與苯乙烯、α-甲基苯乙烯、低級烷基(甲基)丙烯酸酯、異丁烯等之含不飽和基化合物的共聚物所得之含羧基樹脂。 (1) Obtained from copolymers of unsaturated carboxylic acids such as (meth)acrylic acid and unsaturated group-containing compounds such as styrene, α-methylstyrene, lower alkyl (meth)acrylates, and isobutylene The carboxyl-containing resin.
(2)藉由脂肪族二異氰酸酯、分支脂肪族二異氰酸酯、脂環式二異氰酸酯、芳香族二異氰酸酯等之二異氰酸酯,與二羥甲基丙酸、二羥甲基丁酸等之含羧基二醇化合物及聚碳酸酯系多元醇、聚醚系多元醇、聚酯系多元醇、聚烯烴系多元醇、丙烯酸系多元醇、雙酚A系伸烷基氧化物加成物二醇、具有酚性羥基及醇性羥基之化合物等之二醇化合物及因應需要而具有1個醇性羥基之化合物的加成聚合反應所得之含羧基胺基甲酸酯樹脂。 (2) With diisocyanate such as aliphatic diisocyanate, branched aliphatic diisocyanate, alicyclic diisocyanate, aromatic diisocyanate, and carboxyl group containing dimethylol propionic acid, dimethylol butyric acid, etc. Alcohol compounds and polycarbonate-based polyols, polyether-based polyols, polyester-based polyols, polyolefin-based polyols, acrylic-based polyols, bisphenol A-based alkylene oxide adduct diol, with phenol A carboxyl group-containing urethane resin obtained by the addition polymerization reaction of a diol compound such as an alcoholic hydroxyl group and an alcoholic hydroxyl group compound and a compound having one alcoholic hydroxyl group as needed.
(3)藉由二異氰酸酯,與雙酚A型環氧樹脂、氫化雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、聯二甲苯酚型環氧樹脂、聯苯酚型環氧樹脂等 之2官能環氧樹脂的(甲基)丙烯酸酯或者其部分酸酐變性物、含羧基二醇化合物及二醇化合物的聚加成反應所得之含羧基感光性胺基甲酸酯樹脂。 (3) With diisocyanate, and bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bixylenol type epoxy resin , Biphenol epoxy resin, etc. The carboxyl group-containing photosensitive urethane resin obtained by the polyaddition reaction of the (meth)acrylate of the bifunctional epoxy resin or its partial anhydride modifier, carboxyl group-containing diol compound, and diol compound.
(4)於前述(2)或(3)之樹脂的合成中,添加羥烷基(甲基)丙烯酸酯等之分子中具有1個羥基與1個以上(甲基)丙烯醯基的化合物,進行末端(甲基)丙烯酸化之含羧基感光性胺基甲酸酯樹脂。 (4) In the synthesis of the resin of (2) or (3) above, a compound having one hydroxyl group and one or more (meth)acryloyl group in the molecule of hydroxyalkyl (meth)acrylate, etc. is added, Carboxyl group-containing photosensitive urethane resin subjected to terminal (meth)acrylation.
(5)於前述(2)或(3)之樹脂的合成中,添加異佛酮二異氰酸酯與季戊四醇三丙烯酸酯之等莫耳反應物等分子中具有1個異氰酸酯基與1個以上(甲基)丙烯醯基的化合物,進行末端(甲基)丙烯酸化之含羧基感光性胺基甲酸酯樹脂。 (5) In the synthesis of the resin of (2) or (3) above, the mole reaction products such as isophorone diisocyanate and pentaerythritol triacrylate have one isocyanate group and one or more (methyl ) Acrylate compound, a carboxyl group-containing photosensitive urethane resin subjected to terminal (meth)acrylation.
(6)使2官能或2官能以上之多官能(固體)環氧樹脂與(甲基)丙烯酸進行反應,於存在側鏈的羥基加成二元酸酐之含羧基感光性樹脂。以下,將其稱為羧酸變性環氧丙烯酸酯。另外,作為多官能環氧樹脂之具體例,係可列舉例如日本特開2011-213828號公報之段落0039所例示者。 (6) A carboxyl group-containing photosensitive resin in which a bifunctional or more polyfunctional (solid) epoxy resin and (meth)acrylic acid are reacted to add a dibasic anhydride to a hydroxyl group present in a side chain. Hereinafter, this is called carboxylic acid-modified epoxy acrylate. In addition, as specific examples of the multifunctional epoxy resin, for example, those described in paragraph 0039 of Japanese Patent Application Laid-Open No. 2011-213828 can be cited.
(7)使進一步以表氯醇將2官能(固體)環氧樹脂之羥基進行環氧化的多官能環氧樹脂與(甲基)丙烯酸進行反應,於所產生的羥基加成二元酸酐之含羧基感光性樹脂。 (7) A polyfunctional epoxy resin which further epoxidizes the hydroxyl group of a bifunctional (solid) epoxy resin with (chloro)acrylic acid and (meth)acrylic acid with epichlorohydrin is added to the resulting hydroxyl group to add the content of the dibasic anhydride Carboxyl photosensitive resin.
(8)使2官能氧雜環丁烷樹脂與己二酸、鄰苯二甲酸、六氫鄰苯二甲酸等之二羧酸進行反應,於所產生 之1級羥基加成鄰苯二甲酸酐、四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐等之二元酸酐之含羧基聚酯樹脂。 (8) The difunctional oxetane resin is reacted with dicarboxylic acids such as adipic acid, phthalic acid, hexahydrophthalic acid, etc. The carboxyl group-containing polyester resin of binary acid anhydrides such as the first-grade hydroxyl addition phthalic anhydride, tetrahydrophthalic anhydride, and hexahydrophthalic anhydride.
(9)使雙酚A、雙酚F、雙酚S、酚醛清漆型酚樹脂、聚-p-羥基苯乙烯、萘酚與醛類之縮合物、二羥基萘與醛類之縮合物等之1分子中具有複數個酚性羥基的化合物,與乙烯氧化物、丙烯氧化物等之伸烷基氧化物進行反應,使所得之反應生成物與含不飽和基單羧酸進行反應,使所得之反應生成物與多元酸酐進行反應所得之含羧基感光性樹脂。 (9) Use bisphenol A, bisphenol F, bisphenol S, novolac phenol resin, poly-p-hydroxystyrene, condensates of naphthol and aldehydes, condensates of dihydroxynaphthalene and aldehydes, etc. A compound having a plurality of phenolic hydroxyl groups in one molecule reacts with an alkylene oxide such as ethylene oxide, propylene oxide, etc. to react the resulting reaction product with an unsaturated group-containing monocarboxylic acid to make the resulting A carboxyl group-containing photosensitive resin obtained by reacting a reaction product with a polybasic acid anhydride.
(10)使1分子中具有複數個酚性羥基的化合物與碳酸乙烯酯、碳酸丙烯酯等之環狀碳酸酯化合物進行反應,使所得之反應生成物與含不飽和基單羧酸進行反應,使所得之反應生成物與多元酸酐進行反應所得之含羧基感光性樹脂。 (10) A compound having a plurality of phenolic hydroxyl groups in one molecule is reacted with a cyclic carbonate compound such as ethylene carbonate and propylene carbonate, and the resulting reaction product is reacted with an unsaturated group-containing monocarboxylic acid, A carboxyl group-containing photosensitive resin obtained by reacting the obtained reaction product with a polybasic acid anhydride.
(11)於1分子中具有複數個環氧基之環氧化合物,使p-羥基苯乙醇等之1分子中具有至少1個醇性羥基及1個酚性羥基的化合物與(甲基)丙烯酸等之含不飽和基單羧酸進行反應,使所得之反應生成物之醇性羥基與馬來酸酐、四氫鄰苯二甲酸酐、偏苯三甲酸酐、苯均四酸酐、己二酸等之多元酸酐進行反應所得之含羧基感光性樹脂。 (11) An epoxy compound having a plurality of epoxy groups in one molecule, a compound having at least one alcoholic hydroxyl group and one phenolic hydroxyl group and (meth)acrylic acid in one molecule such as p-hydroxyphenylethanol The monocarboxylic acid containing unsaturated group is reacted to make the alcoholic hydroxyl group of the reaction product obtained with maleic anhydride, tetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, adipic acid, etc. A carboxyl group-containing photosensitive resin obtained by reacting polybasic acid anhydride.
(12)於前述(1)~(11)之樹脂,進一步加成環氧丙基(甲基)丙烯酸酯、α-甲基環氧丙基(甲基)丙烯酸酯等之1分子中具有1個環氧基與1個以上之(甲基)丙烯醯基的化合物而成之含羧基感光性樹脂。 (12) The resins of (1) to (11) above are further added with 1 in one molecule of epoxypropyl (meth)acrylate, α-methylepoxypropyl (meth)acrylate, etc. A carboxyl group-containing photosensitive resin composed of a compound of one epoxy group and one or more (meth)acryloyl groups.
另外,於本說明書中,(甲基)丙烯酸酯係指將丙烯酸酯、甲基丙烯酸酯及該等之混合物總稱的用語,針對其他類似的表現亦為相同。 In addition, in this specification, (meth)acrylate refers to a term which collectively refers to acrylate, methacrylate, and mixtures of these, and the same applies to other similar expressions.
於本發明之硬化性組成物中,(A)含羧基樹脂,較佳為將上述(6)與(12)組合而成的樹脂,具體而言,較佳為使羧酸變性環氧丙烯酸酯,與具有環氧基及自由基聚合性不飽和基之化合物進行反應所得之(A1)含羧基感光性樹脂。 In the curable composition of the present invention, (A) a carboxyl group-containing resin, preferably a resin obtained by combining the above (6) and (12), specifically, preferably a carboxylic acid-modified epoxy acrylate , (A1) carboxyl group-containing photosensitive resin obtained by reacting with a compound having an epoxy group and a radical polymerizable unsaturated group.
如上述之含羧基樹脂,係由於於主鏈/聚合物之側鏈具有多數個羧基,因此使以稀鹼水溶液所致之顯像成為可能。 As described above, the carboxyl group-containing resin has a large number of carboxyl groups in the main chain/polymer side chain, so that development by dilute alkaline aqueous solution is possible.
又,上述含羧基樹脂之酸價較佳為20~200mgKOH/g之範圍,更佳為40~150mgKOH/g之範圍。在含羧基樹脂之酸價為20mgKOH/g以上的情況,塗膜之密著性成為良好,且鹼顯像會成良好。另一方面,在酸價為200mgKOH/g以下的情況,由於可抑制以顯像液所致之曝光部的溶解,因此可抑制線過細,或依據情況而將曝光部與未曝光部無區別地以顯像液進行溶解剝離,而可良好地描繪阻劑圖型。 In addition, the acid value of the carboxyl group-containing resin is preferably in the range of 20 to 200 mgKOH/g, and more preferably in the range of 40 to 150 mgKOH/g. When the acid value of the carboxyl group-containing resin is 20 mgKOH/g or more, the adhesion of the coating film becomes good, and the alkali development becomes good. On the other hand, in the case where the acid value is 200 mgKOH/g or less, since the dissolution of the exposed portion due to the developer can be suppressed, the line can be suppressed from being too thin, or the exposed portion can be distinguished from the unexposed portion depending on the situation By dissolving and peeling with the developer, the resist pattern can be drawn well.
又,本發明所使用之含羧基樹脂的重量平均分子量雖依據樹脂骨架而異,但較佳為2,000~150,000,進而為5,000~100,000之範圍。在重量平均分子量為2,000以上的情況,無黏性性能為良好,曝光後之塗膜的耐濕性為良好,且將顯像時之膜減進行抑制,而可抑制解 析度的降低。另一方面,在重量平均分子量為150,000以下的情況,顯像性為良好,且儲存安定性亦為優異。 In addition, although the weight average molecular weight of the carboxyl group-containing resin used in the present invention varies depending on the resin skeleton, it is preferably in the range of 2,000 to 150,000, and further in the range of 5,000 to 100,000. When the weight average molecular weight is 2,000 or more, the non-stick performance is good, the moisture resistance of the coating film after exposure is good, and the film reduction during development is suppressed to suppress the solution Decrease in resolution. On the other hand, when the weight average molecular weight is 150,000 or less, the developability is good, and the storage stability is also excellent.
本發明之硬化性組成物係可單獨含有1種(A)含羧基樹脂,亦可含有2種以上。在本發明之硬化性組成物為含有2種以上之(A)含羧基樹脂的情況,例如,較佳為含有上述之(A1)含羧基感光性樹脂。 The curable composition of the present invention may contain one (A) carboxyl group-containing resin alone or two or more kinds. In the case where the curable composition of the present invention contains two or more kinds of (A) carboxyl group-containing resin, for example, it is preferable to contain the above-mentioned (A1) carboxyl group-containing photosensitive resin.
又,本發明之硬化性組成物,可於其他樣態中,作為(A)含羧基樹脂而含有上述之(A1)含羧基感光性樹脂與不具有脂環式骨架的含羧基丙烯酸共聚物。作為不具有脂環式骨架的含羧基丙烯酸共聚物,係可列舉作為上述(A)含羧基樹脂之具體例所列舉的(1)苯乙烯共聚合型之含羧基樹脂。作為在摻合不具有脂環式骨架之含羧基丙烯酸共聚物的情況之摻合率,當將(A)含羧基樹脂全體設為100質量份時,例如為10~95質量份,較佳為10~80質量份。 In addition, the curable composition of the present invention may contain (A) a carboxyl group-containing resin as described above (A1) a carboxyl group-containing photosensitive resin and a carboxyl group-containing acrylic copolymer that does not have an alicyclic skeleton. Examples of the carboxyl group-containing acrylic copolymer having no alicyclic skeleton include (1) styrene copolymerized carboxyl group-containing resins listed as specific examples of the above (A) carboxyl group-containing resins. As the blending ratio in the case of blending a carboxyl group-containing acrylic copolymer having no alicyclic skeleton, when (A) the entire carboxyl group-containing resin is 100 parts by mass, for example, 10 to 95 parts by mass, preferably 10~80 parts by mass.
本發明之硬化性組成物係含有(B)光聚合起始劑。作為(B)光聚合起始劑係可列舉:二苯基酮系、苯乙酮系、胺苯乙酮系、安息香醚系、苄基縮酮系、醯基膦氧化物系、肟醚系、肟酯系、二茂鈦系等之周知慣用的化合物。 The curable composition of the present invention contains (B) a photopolymerization initiator. Examples of the (B) photopolymerization initiator system include a diphenyl ketone system, an acetophenone system, an acetophenone system, a benzoin ether system, a benzyl ketal system, an acylphosphine oxide system, and an oxime ether system. , Oxime esters, titanocene, and other well-known and commonly used compounds.
作為(B)光聚合起始劑,較佳為包含以下所示之以一般式(I)所示之構造部分的肟酯系光聚合起始劑。前述肟酯系光聚合起始劑,更佳為二聚體之肟酯系光聚合起 始劑。又,前述肟酯系光聚合起始劑,較佳為具有咔唑構造,更佳為具有咔唑構造的二聚體之肟酯系光聚合起始劑。又,作為胺苯乙酮系光聚合起始劑係可列舉包含以下述一般式(II)所表示之構造部分的α-胺苯乙酮系光聚合起始劑。作為醯基膦氧化物系光聚合起始劑係可列舉包含以下述一般式(III)所表示之構造部分的醯基膦氧化物系光聚合起始劑。作為二茂鈦系光聚合起始劑係可列舉以下述一般式(IV)所表示的二茂鈦系光聚合起始劑。 As the (B) photopolymerization initiator, an oxime ester-based photopolymerization initiator including the structural part represented by the general formula (I) shown below is preferable. The aforementioned oxime ester-based photopolymerization initiator is more preferably a dimer of oxime ester-based photopolymerization. Initial agent. In addition, the oxime ester-based photopolymerization initiator is preferably a carbazole structure, and more preferably a dimer oxime ester-based photopolymerization initiator having a carbazole structure. In addition, examples of the Acetophenone-based photopolymerization initiator system include an α-Acetophenone-based photopolymerization initiator including a structural part represented by the following general formula (II). Examples of the acylphosphine oxide-based photopolymerization initiator system include an acylphosphine oxide-based photopolymerization initiator including a structural part represented by the following general formula (III). Examples of the titanocene-based photopolymerization initiator system include a titanocene-based photopolymerization initiator represented by the following general formula (IV).
一般式(I)中,R1係表示氫原子、苯基、烷基、環烷基、烷醯基(alkanoyl group)或苯甲醯基。R2係表示苯基、烷基、環烷基、烷醯基或苯甲醯基。 In the general formula (I), R 1 represents a hydrogen atom, a phenyl group, an alkyl group, a cycloalkyl group, an alkanoyl group or a benzoyl group. R 2 represents phenyl, alkyl, cycloalkyl, alkyl acetyl or benzoyl.
藉由R1及R2所表示之苯基係可具有取代基,作為該取代基係可列舉例如:碳數1~6之烷基、苯基、鹵素原子等。 The phenyl group represented by R 1 and R 2 may have a substituent, and examples of the substituent group include an alkyl group having 1 to 6 carbon atoms, a phenyl group, and a halogen atom.
作為藉由R1及R2所表示之烷基,較佳為碳數1~20之烷基,亦可於烷基鏈中包含1個以上之氧原子。又,亦 可以1個以上之羥基取代。 The alkyl group represented by R 1 and R 2 is preferably an alkyl group having 1 to 20 carbon atoms, and may contain one or more oxygen atoms in the alkyl chain. Furthermore, it may be substituted with one or more hydroxyl groups.
藉由R1及R2所表示之環烷基,較佳為碳數5~8之環烷基。 The cycloalkyl group represented by R 1 and R 2 is preferably a cycloalkyl group having 5 to 8 carbon atoms.
藉由R1及R2所表示之烷醯基,較佳為碳數2~20之烷醯基。 The alkyl group represented by R 1 and R 2 is preferably an alkyl group having 2 to 20 carbon atoms.
藉由R1及R2所表示之苯甲醯基係可具有取代基,作為該取代基係可列舉例如:碳數1~6之烷基、苯基等。 The benzoyl group represented by R 1 and R 2 may have a substituent, and examples of the substituent system include an alkyl group having 1 to 6 carbon atoms and a phenyl group.
一般式(II)中,R3及R4係各自獨立表示碳數1~12之烷基或芳烷基,R5及R6係各自獨立表示氫原子或碳數1~6之烷基,或者亦可將2個鍵結而形成環狀烷基醚基。 In general formula (II), R 3 and R 4 each independently represent an alkyl or aralkyl group having 1 to 12 carbon atoms, and R 5 and R 6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Alternatively, two bonds may be bonded to form a cyclic alkyl ether group.
一般式(III)中,R7及R8係各自獨立表示碳數1~10之烷基、環己基、環戊基、芳基或鹵素原子、經烷基或烷氧基取代的芳基,或者碳數1~20之羰基(但,排除雙方為碳數1~20之羰基的情況)。 In general formula (III), R 7 and R 8 each independently represent an alkyl group having 1 to 10 carbon atoms, a cyclohexyl group, a cyclopentyl group, an aryl group or a halogen atom, and an aryl group substituted with an alkyl group or an alkoxy group, Or a carbonyl group having 1 to 20 carbon atoms (however, it is excluded that both sides are carbonyl groups having 1 to 20 carbon atoms).
一般式(IV)中,R9及R10係各自獨立表示鹵素原子、芳基、鹵化芳基、含雜環鹵化芳基。 In general formula (IV), R 9 and R 10 independently represent a halogen atom, an aryl group, a halogenated aryl group, and a heterocyclic-containing halogenated aryl group.
作為包含以一般式(I)所表示之構造部分的肟酯系光聚合起始劑係可列舉:1,2-辛二酮-1-[4-(苯硫基)-2-(O-苯甲醯肟)]、以下述式(I-1)所表示之化合物、2-(乙醯肟基甲基(acetyl oximino methyl))硫-9-酮、以及乙酮、1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-,1-(O-乙醯肟)及以下述一般式(I-2)所表示之化合物等之具有咔唑骨架的肟酯系化合物等。 Examples of the oxime ester-based photopolymerization initiator system containing a structural part represented by general formula (I) include: 1,2-octanedione-1-[4-(phenylthio)-2-(O- (Benzoyl oxime)], a compound represented by the following formula (I-1), 2-(acetyl oximino methyl) sulfur -9-ketone, and acetone, 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazol-3-yl]-,1-(O-acetamide) And oxime ester compounds having a carbazole skeleton and the like represented by the following general formula (I-2).
一般式(I-2)中,R11係與一般式(I)中之R1同義,R12及R14係各自獨立與一般式(I)中之R2同義。R13係表示氫原子、鹵素原子、碳數1~12之烷基、環戊基、環己基、苯基、苄基、苯甲醯基、碳數2~12之烷醯基、碳數2~12之烷氧羰基(在構成烷氧基之烷基的碳數為2以上的情況,烷基係可以1個以上之羥基取代,亦可於烷基鏈的中間具有1個以上之氧原子)或者苯氧基羧基。 In general formula (I-2), R 11 is synonymous with R 1 in general formula (I), and R 12 and R 14 are each independently synonymous with R 2 in general formula (I). R 13 represents a hydrogen atom, a halogen atom, a C 1-12 alkyl group, a cyclopentyl group, a cyclohexyl group, a phenyl group, a benzyl group, a benzoyl group, a C 2-12 alkyl group, a carbon number 2 Alkoxycarbonyl group of ~12 (when the carbon number of the alkyl group constituting the alkoxy group is 2 or more, the alkyl group may be substituted with one or more hydroxyl groups, or may have one or more oxygen atoms in the middle of the alkyl chain ) Or phenoxy carboxyl.
如此之肟酯系光聚合起始劑,例如,對於直接成像用之曝光,可提高本發明之硬化性組成物的感度,解析度優異,故為佳。又,肟酯系光聚合起始劑特佳為二聚體。 Such an oxime ester-based photopolymerization initiator can improve the sensitivity of the curable composition of the present invention for exposure to direct imaging, and is excellent in resolution, which is preferable. In addition, the oxime ester-based photopolymerization initiator is particularly preferably a dimer.
作為二聚體之肟酯系光聚合起始劑,更佳為以一般式(I-3)所表示的化合物。 The dimer oxime ester-based photopolymerization initiator is more preferably a compound represented by general formula (I-3).
一般式(I-3)中,R23係表示氫原子、烷基、烷氧基、苯基、萘基。R21、R22係各自獨立表示氫原子、烷基、烷氧基、鹵素基、苯基、萘基、蒽基、吡啶基、苯并呋喃基、苯并噻吩基。 In general formula (I-3), R 23 represents a hydrogen atom, an alkyl group, an alkoxy group, a phenyl group, and a naphthyl group. R 21 and R 22 each independently represent a hydrogen atom, an alkyl group, an alkoxy group, a halogen group, a phenyl group, a naphthyl group, an anthracenyl group, a pyridyl group, a benzofuranyl group, and a benzothienyl group.
Ar係表示單鍵或碳數1~10之伸烷基、伸乙烯基、伸苯基、聯伸苯基、亞吡啶基(pyridylene)、伸萘基、伸蒽基、亞噻吩基(thienylene)、亞呋喃基(furylene)、2,5-吡咯-二基、4,4'-茋-二基、4,2'-苯乙烯-二基。 Ar represents a single bond or a C1-C10 alkylene, vinylidene, phenylene, biphenylene, pyridylene, naphthylene, anthracene, thienylene , Furylene (furylene), 2,5-pyrrole-diyl, 4,4'-stilbene-diyl, 4,2'-styrene-diyl.
n為0~1之整數。 n is an integer from 0 to 1.
藉由R23所表示之烷基,較佳為碳數1~17之烷基。 The alkyl group represented by R 23 is preferably an alkyl group having 1 to 17 carbon atoms.
藉由R23所表示之烷氧基,較佳為碳數1~8之烷氧基。 The alkoxy group represented by R 23 is preferably an alkoxy group having 1 to 8 carbon atoms.
藉由R23所表示之苯基亦可具有取代基,作為取代基係可列舉例如:烷基(較佳為碳數1~17)、烷氧基(較佳為碳數1~8)、胺基、烷基胺基(較佳為烷基之碳數1~8)或者二烷基胺基(較佳為烷基之碳數1~8)等。 The phenyl group represented by R 23 may have a substituent, and examples of the substituent group include alkyl groups (preferably carbon numbers 1 to 17), alkoxy groups (preferably carbon numbers 1 to 8), An amine group, an alkylamine group (preferably an alkyl group having 1 to 8 carbon atoms) or a dialkylamine group (preferably an alkyl group having 1 to 8 carbon atoms), etc.
藉由R23所表示之萘基係可具有取代基,作為該取代基係可列舉與藉由R23所表示之苯基可能具有之上述取代 基相同的基。 The naphthyl group represented by R 23 may have a substituent, and examples of the substituent group include the same substituents as the above-mentioned substituents that the phenyl group represented by R 23 may have.
作為藉由R21及R22所表示之烷基,較佳為碳數1~17之烷基。 The alkyl group represented by R 21 and R 22 is preferably an alkyl group having 1 to 17 carbon atoms.
作為藉由R21及R22所表示之烷氧基,較佳為碳數1~8之烷氧基。 The alkoxy group represented by R 21 and R 22 is preferably an alkoxy group having 1 to 8 carbon atoms.
藉由R21及R22所表示之苯基係可具有取代基,作為取代基係可列舉例如:烷基(較佳為碳數1~17)、烷氧基(較佳為碳數1~8)、胺基、烷基胺基(較佳為烷基之碳數1~8)或者二烷基胺基(較佳為烷基之碳數1~8)等。 The phenyl group represented by R 21 and R 22 may have a substituent, and examples of the substituent group include an alkyl group (preferably carbon number 1 to 17) and an alkoxy group (preferably carbon number 1 to 8), an amine group, an alkylamine group (preferably an alkyl group having 1 to 8 carbon atoms) or a dialkylamine group (preferably an alkyl group having 1 to 8 carbon atoms), etc.
藉由R21及R22所表示之萘基係可具有取代基,作為該取代基係可列舉與藉由R21及R22所表示之苯基可能具有之上述取代基相同的基。 The naphthyl group represented by R 21 and R 22 may have a substituent, and the substituent group may be the same as the above-mentioned substituents that the phenyl group represented by R 21 and R 22 may have.
進而,一般式(I-3)中,較佳為R21、R23係各自獨立為甲基或乙基,R22係甲基或苯基,Ar係單鍵或伸苯基、伸萘基或亞噻吩基,n為0。 Furthermore, in general formula (I-3), it is preferred that R 21 and R 23 are each independently methyl or ethyl, R 22 is methyl or phenyl, Ar is a single bond or phenylene, naphthyl Or thienylene, n is 0.
作為以一般式(I-3)所表示之化合物,更佳為下述化合物No.1。 As the compound represented by the general formula (I-3), the following compound No. 1 is more preferable.
在使用如此之肟酯系光聚合起始劑的情況,為了提昇對於曝光之感度,較佳為與包含以一般式(II)所 表示之構造部分的α-胺苯乙酮系光聚合起始劑等併用。 In the case of using such an oxime ester-based photopolymerization initiator, in order to improve the sensitivity to exposure, it is preferably included in the general formula (II) The α-aminoacetophenone-based photopolymerization initiator and the like in the structural part shown are used together.
作為包含以一般式(II)所表示之構造部分的α-胺苯乙酮系光聚合起始劑係可列舉:2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉丙酮-1、2-苄基-2-二甲基胺基-1-(4-嗎啉苯基)-丁烷-1-酮、2-(二甲基胺基)-2-[(4-甲基苯基)甲基]-1-[4-(4-嗎啉基)苯基]-1-庚酮、N,N-二甲基胺基苯乙酮等。 Examples of the α-aminoacetophenone-based photopolymerization initiator system including the structural part represented by general formula (II) include: 2-methyl-1-[4-(methylthio)phenyl]-2 -Morpholine acetone-1, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butane-1-one, 2-(dimethylamino)-2- [(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-heptanone, N,N-dimethylaminoacetophenone, etc.
作為包含以一般式(III)所表示之構造部分的醯基膦氧化物系光聚合起始劑係可列舉:2,4,6-三甲基苯甲醯基二苯基膦氧化物、雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基-戊基膦氧化物等。 Examples of the acylphosphine oxide-based photopolymerization initiator system including the structural part represented by the general formula (III) include: 2,4,6-trimethylbenzyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzyl)-phenylphosphine oxide, bis(2,6-dimethoxybenzyl)-2,4,4-trimethyl-pentyl Phosphine oxide, etc.
作為以一般式(IV)所表示的二茂鈦系光聚合起始劑係可列舉:雙(η 5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦。 Examples of the titanocene-based photopolymerization initiator system represented by the general formula (IV) include: bis(η 5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro -3-(1H-pyrrol-1-yl)-phenyl) titanium.
相對於(A)含羧基樹脂100質量份,(B)光聚合起始劑之摻合量,較佳為0.01~100質量份,更佳為0.5~80質量份之比例。在相對於(A)含羧基樹脂100質量份,(B)光聚合起始劑之摻合量為0.01質量份以上的情況,在銅上之光硬化性會成為良好,塗膜不易剝離,耐藥品性等之塗膜特性成為良好。另一方面,在相對於(A)含羧基樹脂100質量份,光聚合起始劑(B)之摻合量為100質量份以下的情況,(B)光聚合起始劑之光吸收成為良好,深部硬化性提昇。 The blending amount of the (B) photopolymerization initiator relative to (A) 100 parts by mass of the carboxyl group-containing resin is preferably 0.01 to 100 parts by mass, and more preferably 0.5 to 80 parts by mass. When the blending amount of (B) photopolymerization initiator is 0.01 parts by mass or more relative to (A) 100 parts by mass of the carboxyl group-containing resin, the photocurability on copper becomes good, the coating film is not easily peeled off, and the The properties of the coating film such as chemical properties become good. On the other hand, when the blending amount of the photopolymerization initiator (B) is 100 parts by mass or less with respect to 100 parts by mass of the (A) carboxyl group-containing resin, the light absorption of the (B) photopolymerization initiator becomes good , Deep hardening improved.
作為(C)稀釋劑係可使用有機溶劑及光聚合性單體之至少任一者。 As the diluent (C), at least one of an organic solvent and a photopolymerizable monomer can be used.
作為(C)稀釋劑所使用的有機溶劑係可使用例如:甲基乙基酮、環己酮等之酮類;甲苯、二甲苯、四甲基苯等之芳香族羥類;賽路蘇、甲基賽路蘇、丁基賽路蘇、卡必醇、甲基卡必醇、丁基卡必醇、丙二醇單甲基醚、二丙二醇單甲基醚(DPM)、二丙二醇二乙基醚、三丙二醇單甲基醚等之醇醚類;乙酸乙酯、乙酸丁酯、乳酸丁酯、賽路蘇乙酸酯、丁基賽路蘇乙酸酯、卡必醇乙酸酯、丁基卡必醇乙酸酯、丙二醇單甲基醚乙酸酯、二丙二醇單甲基醚乙酸酯、碳酸丙烯酯等之酯類;辛烷、癸烷等之脂肪族烴類;石油醚、石腦油、溶劑石腦油等之石油系溶劑等。此等之有機溶劑,係可單獨或將2種以上組合使用。 As the organic solvent used as the diluent (C), for example, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydroxy groups such as toluene, xylene and tetramethyl benzene; Methylcellulose, butylcellulose, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether (DPM), dipropylene glycol diethyl ether , Tripropylene glycol monomethyl ether and other alcohol ethers; ethyl acetate, butyl acetate, butyl lactate, celozul acetate, butyl celozul acetate, carbitol acetate, butyl Carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, propylene carbonate, etc.; aliphatic hydrocarbons such as octane, decane, etc.; petroleum ether, stone Petroleum solvents such as naphtha and solvent naphtha. These organic solvents can be used alone or in combination of two or more.
有機溶劑之使用目的係使前述(A)含羧基樹脂溶解、稀釋,藉此成為液狀來進行塗布,接著進行暫時性乾燥,藉此造膜,而可接觸曝光。有機溶劑之使用量並無限定於特定的比例,可因應於選擇之塗布方法等而適當設定。 The purpose of using the organic solvent is to dissolve and dilute the aforementioned (A) carboxyl group-containing resin, thereby applying it in a liquid state, followed by temporary drying, thereby forming a film, and allowing contact exposure. The amount of organic solvent used is not limited to a specific ratio, and can be appropriately set according to the coating method selected.
另一方面,作為可使用為(C)稀釋劑的光聚合性單體之代表性者係可列舉:2-羥乙基(甲基)丙烯酸酯、2-羥丙基(甲基)丙烯酸酯、N-乙烯吡咯啶酮、丙烯醯嗎啉、甲氧基四乙二醇(甲基)丙烯酸酯、甲氧基聚乙二醇(甲 基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、N,N-二甲基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N,N-二甲基胺基丙基(甲基)丙烯醯胺、N,N-二甲基胺基乙基(甲基)丙烯酸酯、N,N-二甲基胺基丙基(甲基)丙烯酸酯、三聚氰胺(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、苯氧乙基(甲基)丙烯酸酯、四氫糠基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯、丙三醇二環氧丙基醚二(甲基)丙烯酸酯、丙三醇三環氧丙基醚三(甲基)丙烯酸酯、異莰基(甲基)丙烯酸酯、環戊二烯 單-或者二-(甲基)丙烯酸酯;己二醇、三羥甲基丙烷、季戊四醇、二三羥甲基丙烷、二季戊四醇、參-羥乙基異氰脲酸酯等之多元醇之多元(甲基)丙烯酸酯類或者此等多元醇之環氧乙烷或環氧丙烷加成物之多元(甲基)丙烯酸酯類;多元酸與羥烷基(甲基)丙烯酸酯之單-、二-、三-或者三以上之聚酯等。此等之光聚合性單體係可單獨或者複數組合而使用。 On the other hand, representative examples of the photopolymerizable monomer that can be used as the (C) diluent include 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate , N-vinylpyrrolidone, acrylomorpholine, methoxytetraethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth Group) acrylate, polyethylene glycol di(meth)acrylate, N,N-dimethyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N,N-di Methylaminopropyl (meth)acrylamide, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, Melamine (meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate , Tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, phenoxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, cyclohexyl (meth)acrylic acid Ester, glycerol diglycidyl ether di(meth)acrylate, glycerin triglycidyl ether tri(meth)acrylate, isobranched (meth)acrylate, cyclopentadiene Mono- or di-(meth)acrylate; polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, ditrimethylolpropane, dipentaerythritol, ginsyl-hydroxyethyl isocyanurate, etc. (Meth)acrylic esters or polyhydric (meth)acrylates of ethylene oxide or propylene oxide adducts of these polyols; mono-, polyacrylic acid and hydroxyalkyl (meth)acrylate Two-, three- or more than three polyesters, etc. These photopolymerizable single systems can be used alone or in combination.
上述光聚合性單體的使用目的係使前述(A)含羧基樹脂稀釋,而成為容易塗布的狀態,並且賦予光聚合性者。 The purpose of using the above-mentioned photopolymerizable monomer is to dilute the (A) carboxyl group-containing resin so as to be in a state where it is easy to apply and to impart photopolymerizability.
使用光聚合性單體作為(C)稀釋劑的情況,光聚合性單體之摻合量係前述(A)含羧基樹脂之合計量每100質量份為5~40質量份之範圍較適當。在光聚合性單體之 摻合量為5質量份以上的情況,賦予光硬化性的效果會更良好。另一方面,在40質量份以下的情況,塗膜之指觸乾燥性會成為良好。 When a photopolymerizable monomer is used as the diluent (C), the blending amount of the photopolymerizable monomer is preferably in the range of 5 to 40 parts by mass per 100 parts by mass of the total amount of the (A) carboxyl group-containing resin. Among the photopolymerizable monomers When the blending amount is 5 parts by mass or more, the effect of imparting photocurability is better. On the other hand, in the case of 40 parts by mass or less, the dryness of the touch of the coating film becomes good.
(D)1分子中具有至少2個環氧基之多官能環氧化合物,不僅賦予組成物耐熱性,亦可確認與底層之密著性提昇。 (D) A polyfunctional epoxy compound having at least two epoxy groups in one molecule not only imparts heat resistance to the composition, but also improves adhesion to the base layer.
作為(D)1分子中具有至少2個環氧基之多官能環氧化合物雖可列舉例如:三菱化學公司製之Epikote 828、Epikote 834、Epikote 1001、Epikote 1004、DIC公司製之EPICLON 840、EPICLON 850、EPICLON 1050、EPICLON 2055、東都化成公司製之EPO TOHTO YD-011、YD-013、YD-127、YD-128、Dow Chemical公司製之D.E.R.317、D.E.R.331、D.E.R.661、D.E.R.664、住友化學工業公司製之SUMI-EPOXY ESA-011、ESA-014、ELA-115、ELA-128、旭化成工業公司製之A.E.R.330、A.E.R.331、A.E.R.661、A.E.R.664等(皆為商品名)之雙酚A型環氧樹脂;三菱化學公司製之Epikote YL903、DIC公司製之EPICLON 152、EPICLON 165、東都化成公司製之EPO TOHTO YDB-400、YDB-500、Dow Chemical公司製之D.E.R.542、住友化學工業公司製之SUMI-EPOXY ESB-400、ESB-700、旭化成工 業公司製之A.E.R.711、A.E.R.714等(皆為商品名)之溴化環氧樹脂;三菱化學公司製之Epikote 152、Epikote 154、Dow Chemical公司製之D.E.N.431、D.E.N.438、DIC公司製之EPICLON N-730、EPICLON N-770、EPICLON N-865、東都化成公司製之EPO TOHTO YDCN-701、YDCN-704、日本化藥公司製之EPPN-201、EOCN-1025、EOCN-1020、EOCN-104S、RE-306、住友化學工業公司製之SUMI-EPOXY ESCN-195X、ESCN-220、旭化成工業公司製之A.E.R.ECN-235、ECN-299等(皆為商品名)之酚醛清漆型環氧樹脂;DIC公司製之EPICLON 830、三菱化學公司製之Epikote 807、東都化成公司製之EPO TOHTO YDF-170、YDF-175、YDF-2004等(皆為商品名)之雙酚F型環氧樹脂;東都化成公司製之EPO TOHTO ST-2004、ST-2007、ST-3000(商品名)等之氫化雙酚A型環氧樹脂;三菱化學公司製之Epikote 604、東都化成公司製之EPO TOHTO YH-434、住友化學工業公司製之SUMI-EPOXY ELM-120等(皆為商品名)之縮水甘油胺型環氧樹脂;乙內醯脲型環氧樹脂;Daicel化學工業公司製之CELLOXIDE 2021等(皆為商品名)之脂環式環氧樹脂;三菱化學公司製之YL-933、Dow Chemical公司製之T.E.N.、EPPN-501、EPPN-502等(皆為商品名)之三羥苯基甲烷型環氧樹脂;三菱化學公司製之YL-6056、YX-4000、YL-6121(皆為商品名)等之聯二甲苯酚型或者聯苯酚型環氧樹脂或該等之混合物;日本化藥公司製EBPS-200、 ADEKA公司製EPX-30、DIC公司製之EXA-1514(商品名)等之雙酚S型環氧樹脂;三菱化學公司製之Epikote 157S(商品名)等之雙酚A酚醛清漆型環氧樹脂;三菱化學公司製之Epikote YL-931等(皆為商品名)之四苯酚基乙烷型環氧樹脂;日產化學工業公司製之TEPIC等(皆為商品名)之雜環式環氧樹脂;日油公司製之BLEMMER DGT等之二縮水甘油鄰苯二甲酸酯樹脂;東都化成公司製之ZX-1063等之四縮水甘油基二甲苯酚乙烷樹脂;新日鐵化學公司製之ESN-190、ESN-360、DIC公司製之HP-4032、EXA-4750、EXA-4700等之含萘基環氧樹脂;DIC公司製之HP-7200、HP-7200H等之具有二環戊二烯骨架之環氧樹脂;日油公司製之CP-50S、CP-50M等之甲基丙烯酸縮水甘油酯共聚合系環氧樹脂;進而,環己基馬來醯亞胺與甲基丙烯酸縮水甘油酯之共聚合環氧樹脂;環氧變性之聚丁二烯橡膠衍生物(例如,Daicel化學工業公司製PB-3600等)、CTBN變性環氧樹脂(例如,東都化成公司製之YR-102、YR-450等)等,但並不限於此等。此等之環氧樹脂係可單獨或者將2種以上組合使用。此等當中,尤其以酚醛清漆型環氧樹脂、雜環式環氧樹脂、雙酚A型環氧樹脂或者該等之混合物為佳。 Examples of polyfunctional epoxy compounds having at least two epoxy groups in molecule (D) include, for example, Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, EPICLON 840, and EPICLON manufactured by Mitsubishi Chemical Corporation. 850, EPICLON 1050, EPICLON 2055, EPO TOHTO YD-011, YD-013, YD-127, YD-128 manufactured by Toto Chemical Co., Ltd., DER317, DER331, DER661, DER664 manufactured by Dow Chemical, Sumitomo Chemical Bisphenol A of SUMI-EPOXY ESA-011, ESA-014, ELA-115, ELA-128, AER330, AER331, AER661, AER664, etc. (all trade names) manufactured by Industrial Corporation Type epoxy resin; Epikote YL903 manufactured by Mitsubishi Chemical Corporation, EPICLON 152, EPICLON 165 manufactured by DIC Corporation, EPO TOHTO YDB-400, YDB-500 manufactured by Toto Chemical Co., Ltd., DER542 manufactured by Dow Chemical Corporation, Sumitomo Chemical Industry Corporation Made of SUMI-EPOXY ESB-400, ESB-700, Asahi Kasei Brominated epoxy resins such as AER711, AER714, etc. (all trade names) manufactured by the industrial company; Epikote 152, Epikote 154 manufactured by Mitsubishi Chemical Corporation, DEN431, DEN438 manufactured by Dow Chemical Corporation, and EPICLON manufactured by DIC Corporation N-730, EPICLON N-770, EPICLON N-865, EPO TOHTO YDCN-701, YDCN-704, EPPN-201, EOCN-1025, EOCN-1020, EOCN-104S made by Toto Chemical Co., Ltd. , RE-306, SUMI-EPOXY ESCN-195X, ESCN-220 made by Sumitomo Chemical Industry Co., Ltd., AEROC-235, ECN-299 made by Asahi Kasei Industry Co., Ltd. (all are trade names) novolac epoxy resins; Bisphenol F-type epoxy resins such as EPICLON 830 manufactured by DIC Corporation, Epikote 807 manufactured by Mitsubishi Chemical Corporation, EPO TOHTO YDF-170, YDF-175, YDF-2004 manufactured by Toto Chemical Co., Ltd. (all are trade names); Hydrogenated bisphenol A type epoxy resins such as EPO TOHTO ST-2004, ST-2007, ST-3000 (trade name) manufactured by Chemical Industry Co., Ltd.; Epikote 604 manufactured by Mitsubishi Chemical Corporation, EPO TOHTO YH-434 manufactured by Toto Chemical Industry Co., Ltd. , SUMI-EPOXY ELM-120 manufactured by Sumitomo Chemical Industry Co., Ltd. (all are trade names) glycidylamine epoxy resin; hydantoin epoxy resin; CELLOXIDE 2021 manufactured by Daicel Chemical Industry Co., Ltd. (all are Alicyclic epoxy resin; YL-933 manufactured by Mitsubishi Chemical Corporation, TEN, EPPN-501, EPPN-502 manufactured by Dow Chemical Corporation (all are trade names), trihydroxyphenylmethane epoxy resin Resin; bixylenol type or biphenol type epoxy resins such as YL-6056, YX-4000, YL-6121 (all trade names) manufactured by Mitsubishi Chemical Corporation or mixtures of these; EBPS manufactured by Nippon Kayaku -200, Bisphenol S type epoxy resins such as EPX-30 manufactured by ADEKA Corporation and EXA-1514 (trade name) manufactured by DIC Corporation; bisphenol A novolac epoxy resins manufactured by Mitsubishi Chemical Corporation such as Epikote 157S (trade name) ; Epoxyte YL-931 manufactured by Mitsubishi Chemical Corporation (all are trade names) tetraphenol ethane type epoxy resin; Nissan Chemical Industry Corporation manufactured TEPIC etc. (all trade names) heterocyclic epoxy resins; Diglycidyl phthalate resins such as BLEMMER DGT manufactured by Nippon Oil Corporation; tetraglycidyl xylenol ethane resins manufactured by Toto Chemical Co., Ltd. such as ZX-1063; ESN- manufactured by Nippon Steel Chemical Co., Ltd. 190, ESN-360, naphthalene-containing epoxy resins such as HP-4032, EXA-4750, EXA-4700 manufactured by DIC; HP-7200, HP-7200H manufactured by DIC, etc. have dicyclopentadiene skeleton Epoxy resin; glycidyl methacrylate copolymer epoxy resin of CP-50S, CP-50M, etc. manufactured by NOF Corporation; furthermore, the copolymerization of cyclohexyl maleimide and glycidyl methacrylate Polymerized epoxy resin; epoxy-modified polybutadiene rubber derivative (for example, PB-3600 manufactured by Daicel Chemical Industry Co., Ltd.), CTBN modified epoxy resin (for example, YR-102, YR-450 manufactured by Toto Chemical Co., Ltd.) Etc.), but not limited to this. These epoxy resins can be used alone or in combination of two or more. Among these, novolac-type epoxy resins, heterocyclic epoxy resins, bisphenol A-type epoxy resins, or mixtures thereof are particularly preferred.
相對於(A)含羧基樹脂100質量份,(D)1分子中具有至少2個環氧基之多官能環氧化合物的摻合量,以環氧當量計較佳係設為0.6~2.8當量,更佳為0.8~2.5當量之範圍。藉由將(D)1分子中具有至少2個環氧基之多 官能環氧化合物的摻合量設為上述範圍,而可賦予組成物良好的耐熱性。 With respect to 100 parts by mass of (A) carboxyl group-containing resin, (D) the blending amount of a multifunctional epoxy compound having at least 2 epoxy groups in 1 molecule is preferably set to 0.6 to 2.8 equivalents in terms of epoxy equivalent, It is more preferably in the range of 0.8 to 2.5 equivalents. By combining at least 2 epoxy groups in (D)1 molecule The blending amount of the functional epoxy compound is set in the above range, and the composition can be given good heat resistance.
(E)黑色著色劑係可為有機系著色劑或無機系著色劑。例如,C.I.Pigment black 6、7、9、18等之碳黑系的顏料、C.I.Pigment black 8、10等之石墨系的顏料、C.I.Pigment black 11、12、27、Pigment Brown 35等之氧化鐵系的顏料;例如,戶田工業公司製KN-370之氧化鐵、Mitsubishi Materials公司製13M-T之鈦黑、C.I.Pigment black 20等之蒽醌系的顏料、C.I.Pigment black 13、25、29等之氧化鈷系的顏料、C.I.Pigment black 15、28等之氧化銅系的顏料、C.I.Pigment black 14、26等之錳系的顏料、C.I.Pigment black 23等之氧化二銻系的顏料、C.I.Pigment black 30等之氧化鎳系的顏料、C.I.Pigment black 31、32、BASF Japan公司製Lumogen Black FK4280之苝系的顏料、Pigment Black 1之苯胺系的顏料及硫化鉬或硫化鉍亦可例示作為適合的顏料。特佳者為碳黑系及苝系的顏料。在碳黑系及苝系之顏料的情況,由於ab值的絕對值較接近0,因此容易黑色化而為佳。此等之著色劑係可單獨或適當組合使用。 (E) The black colorant may be an organic colorant or an inorganic colorant. For example, carbon black pigments such as CIPigment black 6, 7, 9, 18, etc., graphite pigments such as CIPigment black 8, 10, etc., iron oxide series such as CIPigment black 11, 12, 27, Pigment Brown 35, etc. Pigments; for example, KN-370 iron oxide manufactured by Toda Industries, 13M-T titanium black manufactured by Mitsubishi Materials, anthraquinone pigments such as CIPigment black 20, CIPigment black 13, 25, 29, etc. Cobalt oxide pigments, copper oxide pigments such as CIPigment black 15, 28, manganese pigments such as Cigigment black 14, 26, antimony oxide pigments such as CIPigment black 23, CIPigment black 30 Nickel oxide pigments such as CIPigment black 31, 32, perylene pigments of Lumogen Black FK4280 manufactured by BASF Japan, aniline pigments of Pigment Black 1, molybdenum sulfide or bismuth sulfide can also be exemplified as suitable pigments. Particularly preferred are carbon black and perylene pigments. In the case of carbon black-based and perylene-based pigments, the absolute value of ab value is closer to 0, so it is preferable to be blackened. These coloring agents can be used alone or in appropriate combination.
就解析度的觀點而言,相對於(A)含羧基樹脂100質量份,(E)黑色著色劑之摻合量,較佳為0.01~5質量份,更佳為0.05~1質量份。在為0.01質量份以上的情 況,容易黑色化。在為5質量份以下的情況,光透過性不易惡化。 From the viewpoint of resolution, the blending amount of (E) the black colorant is preferably 0.01 to 5 parts by mass, and more preferably 0.05 to 1 part by mass relative to (A) 100 parts by mass of the carboxyl group-containing resin. In the case of 0.01 parts by mass or more In addition, it is easy to blacken. When it is 5 parts by mass or less, the light transmittance is not likely to deteriorate.
本發明之硬化性組成物係含有(F)黑色以外之著色劑。作為使用之著色劑係可使用紅、藍、綠、黃、白等之慣用周知的著色劑,亦可為顏料、染料、色素之任一者。作為具體例係可列舉如下述般之標示有色指數(C.I.;染色家協會(The Society of Dyers and Colourists)發行)編號者。但,就環境負荷減低以及對人體之影響的觀點而言,較佳為不含有鹵素。 The curable composition of the present invention contains (F) a coloring agent other than black. As the coloring agent to be used, conventionally known coloring agents such as red, blue, green, yellow, and white can be used, and any one of pigments, dyes, and pigments can also be used. As a specific example, a number marked with a color index (C.I.; issued by The Society of Dyers and Colourists) can be cited as follows. However, from the standpoint of reducing the environmental load and the impact on the human body, it is preferable not to contain halogen.
(紅色著色劑) (Red colorant)
作為紅色著色劑係有單偶氮系、雙偶氮系、偶氮色澱(azolake)系、苯并咪唑酮系、苝系、二酮基吡咯并吡咯系、縮合偶氮系、蒽醌系、喹吖酮系等,具體而言係可列舉標示有如下述般之色指數編號者。 As the red colorant system, there are monoazo system, disazo system, azo lake system (azolake) system, benzimidazolone system, perylene system, diketopyrrolopyrrole system, condensed azo system, anthraquinone system , Quinacridone, etc., specifically, those marked with a color index number as described below.
單偶氮系:Pigment Red 1,2,3,4,5,6,8,9,12,14,15,16,17,21,22,23,31,32,112,114,146,147,151,170,184,187,188,193,210,245,253,258,266,267,268,269;雙偶氮系:Pigment Red 37,38,41;單偶氮色澱系:Pigment Red 48:1,48:2,48:3,48:4,49:1,49:2,50:1,52:1,52:2,53:1,53:2,57:1,58:4,63:1, 63:2,64:1,68;苯并咪唑酮系:Pigment Red 171,175,176,185,208;苝系:Solvent Red 135,179,Pigment Red 123,149,166,178,179,190,194,224;二酮基吡咯并吡咯系:Pigment Red 254,255,264,270,272;縮合偶氮系:Pigment Red 144,166,214,220,221,242;蒽醌系:Pigment Red 168,177,216,Solvent Red 149,150,52,207;喹吖酮系:Pigment Red 122,202,206,207,209 Monoazo system: Pigment Red 1,2,3,4,5,6,8,9,12,14,15,16,17,21,22,23,31,32,112,114,146,147,151,170,184,187,188,193,210,245,253,258,266,267,268,269; diazo system: Pigment Red 37,38,41; Monoazo lake system: Pigment Red 48:1,48:2,48:3,48:4,49:1,49:2,50:1,52:1,52:2 ,53:1,53:2,57:1,58:4,63:1, 63:2,64:1,68; benzimidazolone system: Pigment Red 171,175,176,185,208; perylene system: Solvent Red 135,179, Pigment Red 123,149,166,178,179,190,194,224; diketopyrrolopyrrole system: Pigment Red 254,255,264,270,272; condensed azo system: P 144,166,214,220,221,242; anthraquinone series: Pigment Red 168,177,216, Solvent Red 149,150,52,207; quinacridone series: Pigment Red 122,202,206,207,209
相對於(A)含羧基樹脂100質量份,紅色著色劑之摻合量,較佳為0~1質量份,更佳為0.1~1質量份,再更佳為0.1~0.8質量份。在為1質量份以下的情況,光透過性不易惡化。又,在為0.1質量份以上的情況,容易黑色化。 The blending amount of the red colorant is preferably 0 to 1 part by mass, more preferably 0.1 to 1 part by mass, and even more preferably 0.1 to 0.8 part by mass relative to (A) 100 parts by mass of the carboxyl group-containing resin. When it is 1 part by mass or less, the light transmittance is not likely to deteriorate. Moreover, when it is 0.1 mass parts or more, it becomes easy to blacken.
(藍色著色劑) (Blue colorant)
作為藍色著色劑係有酞花青系、蒽醌系、雙噁嗪系、鈷系等之分類成顏料系為顏色(Pigment),染料系為溶劑(Solvent)的化合物等,具體而言係可列舉標示有如下述般之色指數編號者。又,此等以外,亦可使用金屬取代或無取代之酞花青化合物。 As the blue colorant system, there are phthalocyanine-based, anthraquinone-based, dioxazine-based, cobalt-based, etc. The pigment system is classified as Pigment, and the dye-based compound is Solvent, etc. Examples include those marked with color index numbers as follows. In addition to these, metal-substituted or unsubstituted phthalocyanine compounds can also be used.
顏料系:Pigment Blue 15,15:1,15:2,15:3,15:4,15:6,16,60;染料系:Solvent Blue 35,45,63,67,68,70,83,87,94,97,104,122,136 Pigment system: Pigment Blue 15,15:1,15:2,15:3,15:4,15:6,16,60; dye system: Solvent Blue 35,45,63,67,68,70,83, 87,94,97,104,122,136
相對於(A)含羧基樹脂100質量份,藍色著色劑之摻合量,較佳為0.1~2.5質量份,更佳為0.2~1.5質量份。 The blending amount of the blue colorant is preferably 0.1 to 2.5 parts by mass, and more preferably 0.2 to 1.5 parts by mass relative to (A) 100 parts by mass of the carboxyl group-containing resin.
在為0.1質量份以上的情況,容易黑色化。在為2.5質量份以下的情況,光透過性不易惡化。 When it is 0.1 parts by mass or more, blackening is easy. When it is 2.5 parts by mass or less, the light transmittance is not likely to deteriorate.
(黃色著色劑) (Yellow colorant)
作為黃色著色劑係有單偶氮系、雙偶氮系、縮合偶氮系、苯并咪唑酮系、異吲哚啉酮系、蒽醌系等,具體而言係可列舉以下之著色劑。 Examples of the yellow colorant system include monoazo system, disazo system, condensed azo system, benzimidazolone system, isoindolinone system, and anthraquinone system. Specifically, the following coloring agents can be mentioned.
單偶氮系:Pigment Yellow 1,2,3,4,5,6,9,10,12,61,62,62:1,65,73,74,75,97,100,101,104,105,111,116,167,168,169,182,183;雙偶氮系:Pigment Yellow 12,13,14,16,17,55,63,81,83,87,126,127,152,170,172,174,176,188,198;縮合偶氮系:Pigment Yellow 93,94,95,128,155,166,180;苯并咪唑酮系:Pigment Yellow 120,151,154,156,175,181:異吲哚啉酮系:Pigment Yellow 109,110,139,179, 185;蒽醌系:Solvent Yellow 163,Pigment Yellow 24,108,193,147,199,202;相對於(A)含羧基樹脂100質量份,黃色著色劑之摻合量,較佳為0.1~1.5質量份。在為0.1質量份以上的情況,容易黑色化。在為1.5質量份以下的情況,光透過性不易惡化。又,相對於(A)含羧基樹脂100質量份,黃色著色劑之摻合量與紅色著色劑的合計之摻合量,較佳為0.1~2.5質量份。在為0.1質量份以上的情況,容易黑色化。在為2.5質量份以下的情況,光透過性不易惡化。 Monoazo system: Pigment Yellow 1,2,3,4,5,6,9,10,12,61,62,62: 1,65,73,74,75,97,100,101,104,105,111,116,167,168,169,182,183; disazo system: Pigment Yellow 12,13,14,16,17,55,63,81,83,87,126,127,152,170,172,174,176,188,198; condensed azo system: Pigment Yellow 93,94,95,128,155,166,180; benzimidazolone system: Pigment Yellow 120,151,154,156,175,181: isoindolinone system: Pigment Yellow 109,110,139,179, 185; Anthraquinone series: Solvent Yellow 163, Pigment Yellow 24,108,193,147,199,202; the blending amount of the yellow colorant is preferably 0.1 to 1.5 parts by mass relative to (A) 100 parts by mass of the carboxyl group-containing resin. When it is 0.1 parts by mass or more, blackening is easy. When it is 1.5 parts by mass or less, the light transmittance is not likely to deteriorate. Furthermore, the blending amount of the yellow colorant and the total blending amount of the red colorant is preferably 0.1 to 2.5 parts by mass relative to 100 parts by mass of the (A) carboxyl group-containing resin. When it is 0.1 parts by mass or more, blackening is easy. When it is 2.5 parts by mass or less, the light transmittance is not likely to deteriorate.
(綠色著色劑) (Green colorant)
作為綠色著色劑係有酞花青系、蒽醌系,具體而言係可使用Pigment Green 7,36,Solvent Green 3,5,20,28等。除上述以外,亦可使用金屬取代或無取代之酞花青化合物。相對於(A)含羧基樹脂100質量份,綠色著色劑之摻合量,較佳為0.2~2.0質量份。在為0.2質量份以上的情況,容易黑色化。在為2.0質量份以下的情況,光透過性不易惡化。 As the green colorant system, there are a phthalocyanine system and an anthraquinone system. Specifically, Pigment Green 7, 36, Solvent Green 3, 5, 20, 28 and the like can be used. In addition to the above, metal-substituted or unsubstituted phthalocyanine compounds can also be used. The blending amount of the green colorant is preferably 0.2 to 2.0 parts by mass relative to (A) 100 parts by mass of the carboxyl group-containing resin. When it is 0.2 parts by mass or more, blackening is easy. When it is 2.0 parts by mass or less, the light transmittance is not likely to deteriorate.
(紫色著色劑) (Purple colorant)
作為紫色著色劑具體而言係可列舉:Pigment Violet 19,29,32,36,38,42;Solvent Violet 13,36等。 Specific examples of the purple colorant include Pigment Violet 19, 29, 32, 36, 38, 42; Solvent Violet 13, 36 and the like.
相對於(A)含羧基樹脂100質量份,紫色著色劑之摻合量,較佳為0.1~2.5質量份,更佳為0.2~2.5質量份。 The blending amount of the purple colorant is preferably 0.1 to 2.5 parts by mass, and more preferably 0.2 to 2.5 parts by mass relative to (A) 100 parts by mass of the carboxyl group-containing resin.
在為0.1質量份以上的情況,容易黑色化。在為2.5質量份以下的情況,光透過性不易惡化。 When it is 0.1 parts by mass or more, blackening is easy. When it is 2.5 parts by mass or less, the light transmittance is not likely to deteriorate.
(橙色著色劑) (Orange colorant)
作為橙色著色劑具體而言係可列舉:Pigment Orange 1,5,13,14,16,17,24,34,36,38,40,43,46,49,51,61,63,64,71,73等。 Specific examples of orange colorants include Pigment Orange 1,5,13,14,16,17,24,34,36,38,40,43,46,49,51,61,63,64,71 , 73 etc.
相對於(A)含羧基樹脂100質量份,橙色著色劑之摻合量,較佳為0.05~1質量份,更佳為0.1~0.8質量份。在為0.05質量份以上的情況,容易黑色化。在為1質量份以下的情況,光透過性不易惡化。 The blending amount of the orange colorant is preferably 0.05 to 1 part by mass, and more preferably 0.1 to 0.8 part by mass relative to (A) 100 parts by mass of the carboxyl group-containing resin. When it is 0.05 mass parts or more, it becomes easy to blacken. When it is 1 part by mass or less, the light transmittance is not likely to deteriorate.
(茶色著色劑) (Brown colorant)
作為茶色著色劑具體而言係可列舉:Pigment brown23,25等。 Specific examples of the brown colorant include Pigment brown 23 and 25.
(白色著色劑) (White colorant)
作為白色著色劑係可列舉:Pigment white 4所示之氧化鋅、Pigment white 6所示之氧化鈦、Pigment white 7所示之硫化鋅,就著色力與無毒性的觀點而言,尤其以氧化鈦為佳,可列舉例如:Fuji Titanium工業公司製TR- 600、TR-700、TR-750、TR-840、石原產業公司製R-550、R-580、R-630、R-820、CR-50、CR-60、CR-90、Titan工業公司製KR-270、KR-310、KR-380等之金紅石型氧化鈦、Fuji Titanium工業公司製TA-100、TA-200、TA-300、TA-500、石原產業公司製A100、A220、Titan工業公司製KA-15、KA-20、KA-35、KA-90等之銳鈦礦型氧化鈦。有時白色著色劑係只要少量,例如,以於本發明之硬化性組成物中成為0.1~3質量%的方式添加,便可期待提高黑色度的效果。 Examples of the white colorant include zinc oxide shown in Pigment white 4, titanium oxide shown in Pigment white 6, and zinc sulfide shown in Pigment white 7. From the viewpoint of coloring power and non-toxicity, titanium oxide is particularly used Preferably, for example: TR-made by Fuji Titanium Industrial Corporation 600, TR-700, TR-750, TR-840, manufactured by Ishihara Industries R-550, R-580, R-630, R-820, CR-50, CR-60, CR-90, manufactured by Titan Industries KR-270, KR-310, KR-380 and other rutile titanium oxides, manufactured by Fuji Titanium Industries Corporation TA-100, TA-200, TA-300, TA-500, manufactured by Ishihara Industries Corporation A100, A220, Titan Industries The anatase titanium oxide produced by the company, such as KA-15, KA-20, KA-35, KA-90, etc. A small amount of white colorant may be added in a small amount, for example, to 0.1 to 3% by mass in the curable composition of the present invention, and an effect of improving blackness can be expected.
(F)黑色以外之著色劑亦可組合2種以上。相對於(A)含羧基樹脂100質量份,(F)黑色以外之著色劑之摻合量,較佳為0.35~9.5質量份。在為0.35質量份以上的情況,容易黑色化。在為9.5質量份以下的情況,光透過性不易惡化。 (F) Two or more coloring agents other than black can be combined. It is preferably 0.35 to 9.5 parts by mass relative to (A) 100 parts by mass of the carboxyl group-containing resin and (F) the blending amount of the coloring agent other than black. When it is 0.35 parts by mass or more, blackening is easy. When it is 9.5 parts by mass or less, the light transmittance is not easily deteriorated.
(熱硬化觸媒) (Thermosetting catalyst)
較佳為於本發明之硬化性組成物中進一步含有熱硬化觸媒。作為熱硬化觸媒係可列舉例如:咪唑、2-甲基咪唑、2-乙基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、4-苯基咪唑、1-氰乙基-2-苯基咪唑、1-(2-氰乙基)-2-乙基-4-甲基咪唑等之咪唑衍生物;二氰二胺、苄基二甲基胺、4-(二甲基胺基)-N,N-二甲基苄基胺、4-甲氧基-N,N-二甲基苄基胺、4-甲基-N,N-二甲基苄基胺等之胺化合物、己二酸二醯肼、癸二酸二醯肼等之肼化合物;三苯基膦等之磷 化合物等。又,作為市售品者係可列舉例如:四國化成工業公司製之2MZ-A、2MZ-OK、2PHZ、2P4BHZ、2P4MHZ(皆為咪唑系化合物之商品名)、SAN-APRO公司製之U-CAT3503N、U-CAT3502T(皆為二甲基胺之封端異氰酸酯化合物之商品名)、DBU、DBN、U-CATSA102、U-CAT5002(皆為二環式脒化合物及其鹽)等。進而,並不限定於此等,只要為環氧樹脂或氧雜環丁烷化合物之熱硬化觸媒,或者促進環氧基及/或氧雜環丁烷基與羧基之反應者則可使用,此等係可單獨或混合2種以上而使用。又,亦可使用三聚氰二胺、乙醯三聚氰二胺、苯并三聚氰二胺、三聚氰胺、2,4-二胺基-6-甲基丙烯醯氧乙基-S-三嗪、2-乙烯基-2,4-二胺基-S-三嗪、2-乙烯基-4,6-二胺基-S-三嗪.異三聚氰酸加成物、2,4-二胺基-6-甲基丙烯醯氧乙基-S-三嗪.異三聚氰酸加成物等之S-三嗪衍生物,較佳為將此等亦作為增黏劑而發揮功能之化合物與熱硬化觸媒併用。 It is preferable that the curable composition of the present invention further contain a thermosetting catalyst. Examples of the thermosetting catalyst system include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyano Imidazole derivatives such as ethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole; dicyandiamine, benzyldimethylamine, 4-( (Dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine Amine compounds such as amine compounds, adipic acid dihydrazide, sebacic acid dihydrazide, etc.; phosphorus such as triphenylphosphine Compounds etc. Examples of the commercially available products include: 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, 2P4MHZ (both are trade names of imidazole compounds) manufactured by Shikoku Chemical Industry Co., Ltd., and U manufactured by SAN-APRO. -CAT3503N, U-CAT3502T (both are trade names of dimethylamine blocked isocyanate compounds), DBU, DBN, U-CATSA102, U-CAT5002 (both are bicyclic amidine compounds and their salts), etc. Furthermore, it is not limited to these, as long as it is a thermosetting catalyst of epoxy resin or oxetane compound, or can promote the reaction of epoxy group and/or oxetane group and carboxyl group, These systems can be used alone or in combination of two or more. In addition, melamine diamine, ethylene melamine diamine, benzo melamine diamine, melamine, 2,4-diamino-6-methacryl oxyethyl-S-tri Azine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine. Isocyanuric acid adducts, 2,4-diamino-6-methacryloyloxyethyl-S-triazine. S-triazine derivatives such as isocyanuric acid adducts are preferably used in combination with compounds that also function as tackifiers and thermosetting catalysts.
熱硬化觸媒之摻合量係以通常使用之比例為充分,例如,相對於(A)含羧基樹脂,或者,(D)1分子中具有至少2個環氧基之多官能環氧化合物100質量份,較佳為0.1~20質量份,更佳為0.5~15.0質量份。 The blending amount of the thermosetting catalyst is sufficient at a ratio generally used, for example, with respect to (A) a carboxyl group-containing resin, or (D) a multifunctional epoxy compound 100 having at least 2 epoxy groups in 1 molecule The part by mass is preferably 0.1 to 20 parts by mass, and more preferably 0.5 to 15.0 parts by mass.
(填料) (filler)
又,於本發明之硬化性組成物中,亦可在提昇硬化物之密著性、機械性強度、線膨脹係數等之特性的目的下, 進一步摻合無機填料或有機填料。作為如此之填料係可使用例如:硫酸鋇、鈦酸鋇、氧化矽粉、微粉狀氧化矽、無定形二氧化矽、滑石、黏土、碳酸鎂、碳酸鈣、氧化鋁、氫氧化鋁、雲母粉等之周知慣用的填料。 Furthermore, in the curable composition of the present invention, for the purpose of improving the characteristics of the adhesiveness, mechanical strength, linear expansion coefficient, etc. of the cured product, Further blended with inorganic fillers or organic fillers. As such a filler, for example, barium sulfate, barium titanate, silica powder, fine powdered silica, amorphous silica, talc, clay, magnesium carbonate, calcium carbonate, alumina, aluminum hydroxide, mica Commonly used fillers such as powder.
(其他任意成分) (Any other ingredients)
於本發明之硬化性組成物中係可因應需要而進一步摻合對苯二酚、對苯二酚單甲基醚、t-丁基鄰苯二酚、五倍子酚、吩噻嗪等之周知慣用的聚合抑制劑、微粉二氧化矽、有機膨土、蒙脫石等之周知慣用的增黏劑、矽酮系、氟系、高分子系等的消泡劑及整平劑之至少任何1種、咪唑系、噻唑系、三唑系等之矽烷偶合劑、抗氧化劑、光聚合增感劑、光安定劑、分散劑、硬化促進劑、難燃劑、難燃助劑、(D)多官能環氧化合物以外之熱硬化成分等之周知慣用的添加劑類。 The hardenable composition of the present invention can be further blended with hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, gallnut, phenothiazine, etc. as needed. At least any one of well-known and commonly used thickeners, silicone-based, fluorine-based, polymer-based defoamers and leveling agents such as polymerization inhibitors, fine powdered silica, organic bentonite, montmorillonite, etc. , Imidazole-based, thiazole-based, triazole-based silane coupling agents, antioxidants, photopolymerization sensitizers, light stabilizers, dispersants, hardening accelerators, flame retardants, flame retardant additives, (D) multifunctional Well-known and commonly used additives such as thermosetting components other than epoxy compounds.
本發明之硬化性組成物較佳為黑色。又,較佳為以作為顯示黑色度之基準的測色計所得之其硬化物的L*值係以SCI方式為35以下。又,就黑色度的觀點而言,較佳係a*值為-1.0~2.0,b*值為-3.0~1.1。更佳係a*值為-0.5~0.5,b*值為-2.0~0.5。 The curable composition of the present invention is preferably black. In addition, it is preferable that the L* value of the cured product obtained by a colorimeter serving as a reference for displaying blackness is 35 or less in the SCI method. From the viewpoint of blackness, it is preferable that the a* value is -1.0 to 2.0 and the b* value is -3.0 to 1.1. More preferably, the a* value is -0.5~0.5, and the b* value is -2.0~0.5.
又,就黑色度的觀點而言,本發明之硬化性組成物,較佳為含有紫色著色劑作為(F)黑色以外之著色劑。尤其,相對於(A)含羧基樹脂100質量份,本發明之硬化性組成物,更佳係含有黑色著色劑0.05~1.0質量 份,且紫色著色劑0.2~2.0質量份。該含有紫色著色劑作為(F)黑色以外之著色劑的硬化性組成物,特佳係a*值為0.07~1.55,b*值為-1.0~1.1。 Furthermore, from the viewpoint of blackness, the curable composition of the present invention preferably contains a purple colorant as a coloring agent other than (F) black. In particular, the curable composition of the present invention preferably contains 0.05 to 1.0 mass of black colorant relative to 100 mass parts of (A) carboxyl group-containing resin. Parts, and 0.2 to 2.0 parts by mass of purple colorant. The curable composition containing a purple coloring agent as a coloring agent other than (F) black has an a* value of 0.07 to 1.55 and a b* value of -1.0 to 1.1.
本發明之硬化性組成物係適於印刷配線板或可撓性印刷配線板之防焊阻劑或層間絕緣層等的硬化皮膜之形成,尤其,於高密度化及高細線化之印刷配線板中,適於高密度化且黑色度高的阻劑圖型之形成。本發明之硬化性組成物,其他亦可使用於印刷油墨、噴墨油墨、光罩製作材料、印刷用打樣製作材料、蝕刻阻劑、防焊阻劑、電漿顯示面板(PDP)之隔壁、介電體圖型、電極(導體電路)圖型、電子零件之配線圖型、導電糊料、導電薄膜、黑色矩陣等之遮蔽影像等之製作。 The curable composition of the present invention is suitable for the formation of a hardened film such as a solder resist or an interlayer insulating layer of a printed wiring board or a flexible printed wiring board, especially for printed wiring boards with high density and high fineness Medium, suitable for the formation of resist patterns with high density and high blackness. The curable composition of the present invention can also be used for printing inks, inkjet inks, photomask production materials, printing proofing production materials, etching resists, solder resists, partition walls of plasma display panels (PDP), Production of mask patterns for dielectric patterns, electrode (conductor circuit) patterns, wiring patterns for electronic parts, conductive pastes, conductive films, black matrix, etc.
本發明之硬化性組成物係可製成塗布、乾燥於載體薄膜(支撐體)上所得之乾膜的形態。於乾膜化時係可將本發明之硬化性組成物藉由上述有機溶劑稀釋而調整成適當的黏度,並以點塗布機、刮刀式塗布機、唇口塗布機(lip coater)、棒式塗布機(rod coater)、擠壓式塗布機(squeeze coater)、逆轉式塗布機、轉送輥塗布機、凹版印刷塗布機、噴塗機等於載體薄膜上塗布成均勻的厚度,通常,以50~130℃的溫度進行乾燥1~30分鐘,而製成乾燥塗膜。針對塗布膜厚雖無特別限制,但一般而言,在乾燥後的膜厚為0.1~100μm,較佳為0.5~50μm之範圍內適當選擇。 The curable composition of the present invention can be prepared as a dry film coated and dried on a carrier film (support). When the film is dried, the curable composition of the present invention can be adjusted to an appropriate viscosity by dilution with the above-mentioned organic solvent, and a point coater, blade coater, lip coater, stick type Coater (rod coater), squeeze coater (squeeze coater), reverse coater, transfer roll coater, gravure coater, sprayer are equal to the carrier film coated to a uniform thickness, usually 50 to 130 Drying is carried out at a temperature of ℃ for 1 to 30 minutes to form a dry coating film. Although the coating film thickness is not particularly limited, in general, the film thickness after drying is appropriately selected within the range of 0.1 to 100 μm, preferably 0.5 to 50 μm.
作為載體薄膜係可使用塑膠薄膜,較佳為使 用聚對苯二甲酸乙二酯等之聚酯薄膜、聚醯亞胺薄膜、聚醯胺醯亞胺薄膜、聚丙烯薄膜、聚苯乙烯薄膜等之塑膠薄膜。針對載體薄膜的厚度雖無特別限制,但一般而言,在0.1~150μm之範圍內適當選擇。 As the carrier film, a plastic film can be used, preferably Plastic films such as polyester films such as polyethylene terephthalate, polyimide films, polyimide films, polypropylene films, polystyrene films, etc. are used. Although the thickness of the carrier film is not particularly limited, in general, it is appropriately selected within the range of 0.1 to 150 μm.
此時,較佳為在將塗膜於載體薄膜上成膜之後,在塗膜的表面進一步層合能夠剝離的覆膜,以防止塗膜的表面附著塵埃等。作為能夠剝離的覆膜係可使用例如:聚乙烯薄膜、聚四氟乙烯薄膜、聚丙烯薄膜、經表面處理的紙等,只要在剝離覆膜時,塗膜與覆膜的接著力比塗膜與載體薄膜的接著力更小者即可。 In this case, it is preferable that after the coating film is formed on the carrier film, a peelable coating film is further laminated on the surface of the coating film to prevent dust and the like from adhering to the surface of the coating film. As the peelable coating system, for example, polyethylene film, polytetrafluoroethylene film, polypropylene film, surface-treated paper, etc., as long as the coating film is peeled off, the adhesion force between the coating film and the coating film is better than that of the coating film The adhesive force with the carrier film is smaller.
又,在將本發明之硬化性組成物使用上述有機溶劑來調整成適於塗布方法的黏度之後,藉由浸塗法、淋塗法、輥式塗布法、刮棒塗布法、網版印刷法、簾塗布法、模具塗布法等之方法塗布於基材上,以約50~90℃的溫度使組成物中所含有的有機溶劑揮發乾燥(預硬化),藉此可形成無黏性之乾燥塗膜。又,在將本發明之硬化性組成物塗布、乾燥於載體薄膜上作為薄膜並捲取之乾膜的情況,將其藉由層壓機等以使組成物之塗膜與基材接觸的方式貼合於基材上,之後,將載體薄膜剝離,藉此可於基材上形成塗膜之層。 In addition, after adjusting the curable composition of the present invention to a viscosity suitable for a coating method using the above-mentioned organic solvent, by dip coating method, shower coating method, roll coating method, bar coating method, screen printing method , Curtain coating method, die coating method, etc. are applied on the substrate, and the organic solvent contained in the composition is volatilized and dried (pre-hardened) at a temperature of about 50-90°C, thereby forming a non-sticky drying Coated film. In addition, in the case of applying and drying the curable composition of the present invention on a carrier film as a film and winding it as a dry film, the lamination machine or the like is used to bring the coating film of the composition into contact with the substrate After being attached to the substrate, the carrier film is peeled off, whereby a coating layer can be formed on the substrate.
可藉由使此等之塗膜,例如,藉由活性能量線照射而光硬化,或者加熱至100~250℃的溫度而熱硬化,而得到硬化物。 These coating films can be cured by light, for example, by irradiation with active energy rays, or thermally cured by heating to a temperature of 100 to 250°C to obtain a cured product.
作為上述基材係可列舉預先形成有電路的印 刷配線板或可撓性印刷配線板,除此之外,採用使用了酚醛紙(paper phenol)、環氧紙、環氧玻璃布、聚醯亞胺玻璃、環氧玻璃布/不織布、環氧玻璃布/紙、環氧合成纖維、氟/聚乙烯/聚苯醚、聚苯醚(polyphenylene oxide)/氰酸酯等之高頻電路用貼銅層合板等的材質者且所有等級(FR-4)的貼銅層合板、其他有聚醯亞胺薄膜、PET薄膜、玻璃基板、陶瓷基板、晶圓板等。 Examples of the above-mentioned substrate system include a printed circuit in which a circuit is formed in advance In addition to brush wiring boards or flexible printed wiring boards, paper phenol, epoxy paper, epoxy glass cloth, polyimide glass, epoxy glass cloth/nonwoven fabric, epoxy All grades (FR-, such as glass cloth/paper, epoxy synthetic fiber, fluorine/polyethylene/polyphenylene oxide, polyphenylene oxide/cyanate, etc. for high-frequency circuit copper-clad laminates, etc.) 4) Copper-clad laminates, other polyimide films, PET films, glass substrates, ceramic substrates, wafer boards, etc.
在塗布了本發明之硬化性組成物之後進行的揮發乾燥係可使用熱風循環式乾燥爐、IR爐、加熱板、對流烘箱等,使用具備有以蒸氣所致之空氣加熱方式的熱源者,使乾燥機內的熱風逆流接觸的方法,及從噴嘴吹附於支撐體的方法來進行。 After applying the curable composition of the present invention, the volatile drying system can use a hot air circulation type drying furnace, an IR furnace, a heating plate, a convection oven, etc., and a heat source equipped with an air heating method by steam can be used. The method of countercurrent contact of hot air in the dryer and the method of blowing on the support from the nozzle.
作為活性能量線照射所使用的曝光機係只要是搭載高壓水銀燈、超高壓水銀燈、金屬鹵素燈、水銀短弧燈等,以350~450nm之範圍照射紫外線的裝置即可,進而,亦可使用直接描繪裝置(例如,藉由來自電腦之CAD數據,照射直接活性能量線而描繪影像的雷射直接成像裝置)。作為直描機的光源係只要使用最大波長為350~410nm之範圍的光即可。用以影像形成的曝光量雖依據膜厚等而異,但一般而言係可設為20~800mJ/cm2,較佳為20~600mJ/cm2之範圍內。 The exposure machine used as the active energy ray irradiation may be a device that is equipped with a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halogen lamp, a mercury short-arc lamp, etc., and irradiates ultraviolet rays in the range of 350 to 450 nm. Furthermore, direct exposure A drawing device (for example, a laser direct imaging device that draws an image by irradiating direct active energy rays with CAD data from a computer). As the light source of the direct-scanner, it is only necessary to use light having a maximum wavelength in the range of 350 to 410 nm. The amount of exposure used for image formation varies depending on the film thickness and the like, but generally it can be set to 20 to 800 mJ/cm 2 , preferably 20 to 600 mJ/cm 2 .
又,作為顯像方法係可藉由浸漬法、淋浴法、噴霧法、毛刷法等進行,作為顯像液係可使用氫氧化鉀、氫氧化鈉、碳酸鈉、碳酸鉀、磷酸鈉、矽酸鈉、氨、 胺類等之鹼水溶液。 In addition, as the developing method, it can be performed by dipping method, shower method, spray method, brush method, etc., and as the developing liquid system, potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, silicon Sodium, ammonia, Alkaline aqueous solutions such as amines.
以下,雖使用實施例更詳細地說明本發明,但本發明並不限定於下述實施例。另外,於以下內容中,「份」及「%」只要無特別說明則皆為質量基準。 Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to the following examples. In addition, in the following, "parts" and "%" are quality standards unless otherwise specified.
於二乙二醇單乙基醚乙酸酯600g中裝入鄰甲酚酚醛清漆型環氧樹脂[大日本油墨化學工業股份有限公司製,EPICLON N-695,軟化點95℃,環氧當量214,平均官能基數7.6]1070g(環氧丙基數(芳香環總數):5.0莫耳)、丙烯酸360g(5.0莫耳)、及對苯二酚1.5g,加熱攪拌至100℃,進行均勻溶解。 600g of diethylene glycol monoethyl ether acetate was filled with o-cresol novolac type epoxy resin [made by Dainippon Ink Chemical Industry Co., Ltd., EPICLON N-695, softening point 95°C, epoxy equivalent 214 , The average number of functional groups 7.6] 1070g (epoxypropyl number (total number of aromatic rings): 5.0 moles), acrylic acid 360g (5.0 moles), and hydroquinone 1.5g, heated and stirred to 100 ℃, uniformly dissolved.
接著,裝入三苯基膦4.3g,加熱至110℃進行反應2小時之後,昇溫至120℃進一步進行反應12小時。於所得到的反應液中,裝入芳香族烴(Solvesso 150)415g、四氫鄰苯二甲酸酐456.0g(3.0莫耳),以110℃進行反應4小時,進行冷卻,而得到感光性之含羧基樹脂溶液(固體成分酸價89mgKOH/g,固體成分65%)。將其作為樹脂溶液A-1。 Next, 4.3 g of triphenylphosphine was charged, and the reaction was heated to 110°C for 2 hours, and then the temperature was raised to 120°C, and the reaction was further carried out for 12 hours. To the obtained reaction liquid, 415 g of aromatic hydrocarbon (Solvesso 150) and 456.0 g (3.0 mole) of tetrahydrophthalic anhydride were charged, and the reaction was carried out at 110° C. for 4 hours, followed by cooling to obtain photosensitive Carboxyl-containing resin solution (solid content acid value 89mgKOH/g, solid content 65%). Let this be the resin solution A-1.
於具備有溫度計、氮導入裝置兼伸烷基氧化物導入裝 置及攪拌裝置的高壓釜中,裝入酚醛清漆型甲酚樹脂(昭和電工公司製,商品名「Shonol CRG 951」,OH當量:119.4)119.4g、氫氧化鉀1.19g及甲苯119.4g,一邊進行攪拌一邊將系統內置換為氮,並進行加熱昇溫。 With a thermometer, nitrogen introduction device and alkylene oxide introduction device The autoclave equipped with a stirring device was filled with novolac-type cresol resin (manufactured by Showa Denko Corporation, trade name "Shonol CRG 951", OH equivalent: 119.4), 119.4g, potassium hydroxide 1.19g, and toluene 119.4g. The system was replaced with nitrogen while stirring, and the temperature was increased by heating.
接著,緩緩滴下環氧丙烷63.8g,以125~132℃,並以0~4.8kg/cm2進行反應16小時。其後,冷卻至室溫,於此反應溶液中添加混合89%磷酸1.56g來中和氫氧化鉀,而得到非揮發性成分62.1%、羥基價182.2g/eq.之酚醛清漆型甲酚樹脂之環氧丙烷反應溶液。其係酚性羥基每1當量加成有伸烷基氧化物平均1.08莫耳者。 Next, 63.8 g of propylene oxide was slowly dropped, and the reaction was carried out at 125 to 132° C. and at 0 to 4.8 kg/cm 2 for 16 hours. After that, it was cooled to room temperature, and 1.56 g of 89% phosphoric acid was added to this reaction solution to neutralize potassium hydroxide to obtain a novolak-type cresol resin with 62.1% of nonvolatile components and a hydroxyl value of 182.2 g/eq. The reaction solution of propylene oxide. The phenolic hydroxyl group added 1.08 moles of alkylene oxide per 1 equivalent.
將所得到的酚醛清漆型甲酚樹脂之伸烷基氧化物反應溶液293.0g、丙烯酸43.2g、甲磺酸11.53g、甲基氫醌0.18g及甲苯252.9g裝入具備有攪拌機、溫度計及空氣吹入管的反應器中,以10ml/分的速度吹入空氣,一邊進行攪拌一邊以110℃進行反應12小時。藉由反應所生成的水係作為與甲苯之共沸混合物而餾出12.6g的水。 The obtained novolac-type cresol resin alkylene oxide reaction solution 293.0g, acrylic acid 43.2g, methanesulfonic acid 11.53g, methylhydroquinone 0.18g and toluene 252.9g were charged with a stirrer, thermometer and air Into the reactor blown into the tube, air was blown at a rate of 10 ml/min, and the reaction was carried out at 110° C. for 12 hours while stirring. The water produced by the reaction was distilled as an azeotropic mixture with toluene, and 12.6 g of water was distilled off.
然後,冷卻至室溫,將所得到的反應溶液以15%氫氧化鈉水溶液35.35g進行中和,接著進行水洗。其後,以蒸發器將甲苯一邊以二乙二醇單乙基醚乙酸酯118.1g進行取代一邊餾除,而得到酚醛清漆型丙烯酸酯樹脂溶液。 Then, it was cooled to room temperature, and the obtained reaction solution was neutralized with 35.35 g of 15% sodium hydroxide aqueous solution, followed by water washing. Thereafter, toluene was distilled off while being substituted with 118.1 g of diethylene glycol monoethyl ether acetate in an evaporator to obtain a novolak acrylate resin solution.
接著,將所得到的酚醛清漆型丙烯酸酯樹脂溶液332.5g及三苯基膦1.22g裝入具備有攪拌器、溫度計及空氣吹入管的反應器中,以10ml/分的速度吹入空氣,一邊 進行攪拌一邊緩緩添加四氫鄰苯二甲酸酐60.8g,以95~101℃進行反應6小時,而得到感光性之含羧基樹脂溶液(固體成分酸價88mgKOH/g,固體成分71%)。將其作為樹脂溶液A-2。 Next, 332.5 g of the obtained novolak acrylate resin solution and 1.22 g of triphenylphosphine were charged into a reactor equipped with a stirrer, a thermometer, and an air blowing tube, and air was blown in at a rate of 10 ml/min. While stirring, 60.8 g of tetrahydrophthalic anhydride was slowly added, and the reaction was carried out at 95 to 101° C. for 6 hours to obtain a photosensitive carboxyl group-containing resin solution (solid content acid value 88 mgKOH/g, solid content 71%). Let this be the resin solution A-2.
使用Daicel公司製CYCLOMER ACA Z320(固體成分酸價135gKOH/g,固體成分39%)。將其作為樹脂溶液A-3。 CYCLOMER ACA Z320 (solid component acid value 135 gKOH/g, solid component 39%) manufactured by Daicel Corporation was used. Let this be the resin solution A-3.
按照下述表1中所示之摻合,摻合各成分並進行攪拌,以3輥機進行分散,而調製出各硬化性組成物。另外,表1中之摻合量係顯示質量份。 According to the blending shown in Table 1 below, each component was blended and stirred, and dispersed with a 3-roller to prepare each curable composition. In addition, the blending amount in Table 1 shows parts by mass.
含羧基樹脂溶液A-1:清漆A-1(固體成分:65%,酸價:89mgKOH/g) Carboxyl group-containing resin solution A-1: Varnish A-1 (solid content: 65%, acid value: 89mgKOH/g)
含羧基樹脂溶液A-2:清漆A-2(固體成分:71%,酸價:88mgKOH/g) Carboxyl group-containing resin solution A-2: Varnish A-2 (solid content: 71%, acid value: 88mgKOH/g)
含羧基樹脂溶液A-3:清漆A-3(Daicel公司製 CYCLOMER(ACA)Z320(固體成分:39%,酸價:135mgKOH/g)) Carboxyl group-containing resin solution A-3: Varnish A-3 (manufactured by Daicel Corporation) CYCLOMER (ACA) Z320 (solid content: 39%, acid value: 135mgKOH/g))
光聚合起始劑B-1:BASF Japan公司製Irgacure 907(2-甲基-1-(4-甲硫基苯基)-2-嗎啉丙烷-1-酮) Photopolymerization initiator B-1: Irgacure 907 (2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one) manufactured by BASF Japan
光聚合起始劑B-2:具有咔唑構造之二聚體的肟酯系光聚合起始劑(上述化合物No.1) Photopolymerization initiator B-2: Dimer oxime ester photopolymerization initiator having a carbazole structure (the above compound No. 1)
光聚合起始劑B-3:肟酯系光聚合起始劑 Photopolymerization initiator B-3: Oxime ester photopolymerization initiator
稀釋劑C-1:二丙二醇單甲基醚(DPM) Thinner C-1: Dipropylene glycol monomethyl ether (DPM)
稀釋劑C-2:新中村化學公司製NK酯A-9550(多官能丙烯酸酯) Thinner C-2: NK Ester A-9550 (multifunctional acrylate) manufactured by Shin Nakamura Chemical Company
多官能環氧化合物D-1:DIC公司製N870-75EA(雙酚A型環氧樹脂) Multifunctional epoxy compound D-1: N870-75EA (bisphenol A type epoxy resin) manufactured by DIC Corporation
多官能環氧化合物D-2:TEPIC-HP Multifunctional epoxy compound D-2: TEPIC-HP
黑色著色劑E-1:RESINO COLOR公司製CKT-7198(碳黑) Black colorant E-1: CKT-7198 (carbon black) manufactured by Resino Color Company
藍色著色劑F-1:ε-酞花青藍 Blue colorant F-1: ε-phthalocyanine blue
紅色著色劑F-2:PY8025 Red colorant F-2: PY8025
紫色著色劑F-3:二紫Violet B Purple colorant F-3: 2 Violet B
黃色著色劑F-4:CROMOPHTAL黃AGR Yellow colorant F-4: CROMOPHTAL yellow AGR
橙色著色劑F-5:二酮吡咯并吡咯橙Orange TR Orange colorant F-5: Diketopyrrolopyrrole Orange TR
硬化觸媒G-1:三聚氰胺 Hardening catalyst G-1: Melamine
硬化觸媒G-2:三氰二胺 Hardening catalyst G-2: Tricyandiamide
添加劑H-1:Shin-Etsu Silicone公司製KS-66(矽酮系消泡劑) Additive H-1: KS-66 (silicone defoamer) manufactured by Shin-Etsu Silicone
填料I-1:堺化學公司製B-30(硫酸鋇) Filler I-1: B-30 (barium sulfate) manufactured by Sakai Chemical Company
填料I-2:SiO2 Filler I-2: SiO 2
(評估方法) (assessment method)
<a*值及b*值> <a* value and b* value>
將各實施例及各比較例之硬化性組成物分別以網版印刷全面塗布於洗淨後的銅平塗基板上,於熱風循環式乾燥爐中,以80℃進行乾燥10分鐘而形成乾燥塗膜,接著,藉由搭載有Oak製作所公司製金屬鹵素燈的曝光機,以成為感度7段的曝光量進行曝光。其後,藉由1wt%Na2CO3水溶液,以噴霧壓0.1MPa進行顯像1分鐘,接著,使用熱風循環式乾燥爐,以150℃進行熱硬化處理60分鐘,藉此而得到硬化塗膜。針對所得到的硬化塗膜,使用分光測色計(Konica Minolta公司製,CM-2600d),按照JIS Z 8729來測定塗膜上之L*a*b *表色系之值,將表示亮度的指數之L*a*b *值作為黑色度之指標來進行評估。a*b *值皆表示越接近0黑色度越優異。將所得到的結果顯示於下述表2。 The curable compositions of each example and each comparative example were applied to the washed copper flat-coated substrates by screen printing, and dried in a hot air circulation drying oven at 80°C for 10 minutes to form a dry coating. Then, the film was exposed at an exposure level with a sensitivity of 7 steps by an exposure machine equipped with a metal halide lamp manufactured by Oak Manufacturing Co., Ltd. Thereafter, development was carried out with a 1% by weight Na 2 CO 3 aqueous solution at a spray pressure of 0.1 MPa for 1 minute, and then, a hot-air circulation type drying furnace was used for thermal curing at 150° C. for 60 minutes to obtain a cured coating film. . For the obtained cured coating film, using a spectrophotometer (manufactured by Konica Minolta, CM-2600d), the value of the L*a*b* color system on the coating film was measured according to JIS Z 8729, and the brightness The L*a*b* value of the index is evaluated as an indicator of blackness. Both a*b* values indicate that the closer to 0, the better the blackness. The obtained results are shown in Table 2 below.
<吸光度> <absorbance>
於吸光度之測定中係使用紫外可見分光光度計(日本分光公司製Ubest-V-570DS),及積分球裝置(日本分光公司製ISN-470)。將前述各實施例及各比較例之硬化性組成物使用塗抹器來塗布於玻璃板之後,使用熱風循環式乾燥 爐,以80℃進行乾燥30分鐘,於玻璃板上製作硬化性組成物之乾燥塗膜。使用紫外可見分光光度計及積分球裝置,以與塗布有硬化性組成物的玻璃板同一的玻璃板,測定500~300nm之吸光度基準線。測定製作出之附乾燥塗膜的玻璃板之吸光度,由基準線算出乾燥塗膜之吸光度,而得到目的之光的波長355nm之吸光度。為了防止因塗布膜厚之偏差所致之吸光度的偏差,將以塗抹器所致之塗布厚作4階段變化來進行此作業,製成塗布厚與355nm之吸光度的圖表,由其之近似式算出膜厚25μm之乾燥塗膜的吸光度,而作為各自之吸光度。將所得到的結果顯示於下述表2。 In the measurement of absorbance, an ultraviolet-visible spectrophotometer (Ubest-V-570DS manufactured by Japan Spectroscopy Corporation) and an integrating sphere device (ISN-470 manufactured by Japan Spectroscopy Corporation) are used. After applying the hardenable composition of each of the foregoing examples and each comparative example to a glass plate using an applicator, it was dried using hot air circulation The furnace was dried at 80°C for 30 minutes to produce a dry coating film of the curable composition on the glass plate. Using an ultraviolet-visible spectrophotometer and an integrating sphere device, the absorbance reference line of 500 to 300 nm is measured on the same glass plate as the glass plate coated with the curable composition. The absorbance of the prepared glass plate with a dry coating film was measured, and the absorbance of the dry coating film was calculated from the reference line to obtain the absorbance at the wavelength of 355 nm of the target light. In order to prevent the deviation of the absorbance caused by the deviation of the coating film thickness, the coating thickness caused by the applicator is changed in four stages to perform this operation, and a graph of the coating thickness and the absorbance of 355nm is prepared and calculated from the approximate formula The absorbance of the dried coating film with a film thickness of 25 μm is taken as the respective absorbance. The obtained results are shown in Table 2 below.
<感度> <sensitivity>
將各實施例及比較例之硬化性組成物利用網版印刷以乾燥後成為10μm的方式全面塗布於洗淨後的銅平塗基板上,於熱風循環乾燥爐中,以80℃進行乾燥10分鐘。於此塗膜上放置Stouffer公司製之梯型板(41段),以搭載有Oak製作所公司製金屬鹵素燈的曝光機,以300mJ/cm2之曝光量進行曝光,調查藉由1wt%Na2CO3水溶液以噴霧壓0.1MPa進行顯像1分鐘後之殘留段數。殘留段數越多,感度越良好,而為佳。將所得到的結果顯示於下述表2。 The curable composition of each example and comparative example was applied to the washed copper flat-coated substrate by screen printing so as to become 10 μm after drying, and dried at 80° C. for 10 minutes in a hot air circulation drying furnace . Place a trapezoidal plate (41 steps) made by Stouffer on this coating film, and expose it with an exposure machine equipped with a metal halide lamp made by Oak Manufacturing Co., Ltd. at an exposure amount of 300mJ/cm 2 , and investigate by 1wt% Na 2 CO 3 aqueous solution was developed at a spray pressure of 0.1 MPa for 1 minute and the number of remaining segments. The greater the number of remaining segments, the better the sensitivity and the better. The obtained results are shown in Table 2 below.
<解析度> <resolution>
將各實施例及比較例之硬化性樹脂組成物以網版印刷 全面塗布於銅平塗基板上,以80℃進行乾燥30分鐘。使用L/S=50/500之底片以最適曝光量進行曝光,將30℃之1%Na2CO3水溶液以噴霧壓2kg/cm2的條件進行顯像60秒鐘,而得到圖型。顯像後,以光學顯微鏡觀察浮凸形狀,如下述方式進行評估。將所得到的結果顯示於下述表2。將實施例2、比較例2之浮凸形狀分別顯示於第1圖、第2圖。 The curable resin composition of each example and comparative example was applied to the copper flat-coated substrate by screen printing, and dried at 80° C. for 30 minutes. Exposure was performed using a negative film with L/S=50/500 at an optimal exposure amount, and a 1% Na 2 CO 3 aqueous solution at 30° C. was developed under a spray pressure of 2 kg/cm 2 for 60 seconds to obtain a pattern. After development, the relief shape was observed with an optical microscope and evaluated as follows. The obtained results are shown in Table 2 below. The relief shapes of Example 2 and Comparative Example 2 are shown in Figs. 1 and 2 respectively.
◎:圖型之扭曲、過寬、及基蝕(頂部與底部之尺寸差)之任一者皆無法確認。 ◎: Any of the pattern distortion, over-width, and base erosion (the difference between the top and bottom dimensions) cannot be confirmed.
○:確認到些許的圖型扭曲、過寬、及基蝕(頂部與底部之尺寸差)之任一者。 ○: Any one of slight pattern distortion, excessive width, and undercut (the difference between the size of the top and the bottom) was confirmed.
×:確認到明顯的圖型扭曲、過寬、及基蝕(頂部與底部之尺寸差)之任一者。 ×: Any one of obvious pattern distortion, excessive width, and undercut (the difference between the size of the top and the bottom) was confirmed.
<鍍金耐性(密著性)> <Gold plating resistance (adhesion)>
將各實施例及比較例之硬化性組成物,以使乾燥膜厚成為20μm的方式以網版印刷進行全面塗布於形成有圖型之銅箔基板上,以80℃進行乾燥30分鐘,放冷至室溫。於此基板使用搭載有高壓水銀燈之曝光裝置,以最適曝光量將圖型進行曝光,之後,藉由30℃之1wt%碳酸鈉水溶液,以噴霧壓0.2MPa的條件下,進行顯像60秒鐘,而得到圖型。將此基板以150℃/60分鐘進行後硬化,而得到形成有硬化物圖型之評估基板。 The curable composition of each example and comparative example was applied to the patterned copper foil substrate by screen printing in such a way that the dry film thickness was 20 μm, dried at 80° C. for 30 minutes, and allowed to cool To room temperature. On this substrate, an exposure device equipped with a high-pressure mercury lamp was used to expose the pattern at an optimal exposure amount, and then, a 30-degree 1wt% sodium carbonate aqueous solution was developed under a spray pressure of 0.2 MPa for 60 seconds. , And get the pattern. This substrate was post-cured at 150° C./60 minutes to obtain an evaluation substrate with a pattern of cured objects.
針對評估基板,使用市售品之無電解鍍鎳浴及無電解 鍍金浴,以80~90℃,在鎳5μm、金0.05μm的條件下進行鍍敷。於經鍍敷的評估基板,目視評估鍍敷滲入之有無後,藉由膠帶剝離評估阻劑層的剝離之有無。各自的判定基準係如以下所述。將所得到的結果顯示於下述表2。 For the evaluation substrate, use a commercially available electroless nickel plating bath and electroless The gold plating bath is plated under the conditions of nickel 5 μm and gold 0.05 μm at 80 to 90°C. After the plating evaluation board was visually evaluated for the presence or absence of plating infiltration, the peeling of the resist layer was evaluated by tape peeling. The criteria for each judgment are as follows. The obtained results are shown in Table 2 below.
◎:於鍍敷後皆無觀察到滲入,在膠帶剝離後並無剝離。 ◎: No penetration was observed after plating, and there was no peeling after the tape was peeled off.
○:於鍍敷後僅觀察到滲入,但在膠帶剝離後並無剝離。 ○: Only penetration was observed after plating, but there was no peeling after the tape was peeled off.
△:於鍍敷後觀察到些許滲入,在膠帶剝離後有些許剝離。 △: A little penetration was observed after plating, and a little peeling after the tape was peeled off.
×:於鍍敷後確認有滲入,在膠帶剝離後亦觀察到剝離。 ×: Penetration was confirmed after plating, and peeling was also observed after the tape was peeled off.
任一實施例之硬化性組成物皆可確認到解析度及硬化物之黑色度優異。相對於此,不滿足前述吸光度 的比較例1~3之硬化性組成物係確認到解析度差。又,不滿足前述吸光度的比較例4,若與組成類似的實施例2進行比較,則可確認到解析度差。 It was confirmed that the curable composition of any example was excellent in resolution and blackness of the cured product. In contrast, the aforementioned absorbance is not satisfied The hardenable compositions of Comparative Examples 1 to 3 were confirmed to have poor resolution. In addition, Comparative Example 4, which does not satisfy the aforementioned absorbance, can be confirmed to have poor resolution when compared with Example 2 having a similar composition.
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| WO2017217429A1 (en) * | 2016-06-14 | 2017-12-21 | 株式会社クラレ | Black film |
| JP7167429B2 (en) * | 2017-01-16 | 2022-11-09 | 東洋インキScホールディングス株式会社 | Photosensitive coloring composition, photosensitive coloring composition for color filter, and color filter |
| JP7312107B2 (en) * | 2017-06-20 | 2023-07-20 | 株式会社Adeka | Polymerizable composition, photosensitive composition for black matrix and photosensitive composition for black column spacer |
| JP6409106B1 (en) * | 2017-08-30 | 2018-10-17 | 太陽インキ製造株式会社 | Curable resin composition, dry film, cured product and printed wiring board |
| JP7029267B2 (en) * | 2017-10-06 | 2022-03-03 | 日鉄ケミカル&マテリアル株式会社 | Method for manufacturing a photosensitive resin composition and a substrate with a resin film |
| JP6766104B2 (en) * | 2018-08-03 | 2020-10-07 | 株式会社タムラ製作所 | Curable resin composition for inkjet and printed wiring board |
| JP6820982B2 (en) * | 2018-08-03 | 2021-01-27 | 株式会社タムラ製作所 | Black curable resin composition and printed wiring board |
| JP6843949B2 (en) * | 2018-12-27 | 2021-03-17 | 株式会社タムラ製作所 | Black photosensitive resin composition |
| JP7300619B2 (en) * | 2019-01-11 | 2023-06-30 | 太陽ホールディングス株式会社 | Laminated structures, dry films, cured products thereof, and electronic components |
| CN111752102A (en) * | 2019-03-29 | 2020-10-09 | 日铁化学材料株式会社 | The manufacturing method of the photosensitive resin composition, the cured film, the board|substrate with a cured film, and the board|substrate with a cured film |
| JP7536481B2 (en) * | 2019-03-29 | 2024-08-20 | 日鉄ケミカル&マテリアル株式会社 | Photosensitive resin composition, cured film obtained by curing the photosensitive resin composition, substrate with cured film, and method for producing substrate with cured film |
| JP7297499B2 (en) * | 2019-04-04 | 2023-06-26 | 東京応化工業株式会社 | Photosensitive resin composition, method for producing patterned cured film, and patterned cured film |
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| WO2012141153A1 (en) * | 2011-04-13 | 2012-10-18 | 太陽インキ製造株式会社 | Photocurable resin composition, dry film, cured product, and printed wiring board |
| JP2014156583A (en) * | 2013-01-15 | 2014-08-28 | Taiyo Ink Mfg Ltd | Curable resin composition, dry film and cured product thereof, and printed wiring board using the same |
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