TWI684017B - Bump testing apparatus and method - Google Patents

Abstract

A bump testing method is provided, including measuring the height of a plurality of conductive bumps disposed on a substrate structure, removing a portion of the conductive bumps, and conducting a thrust experiment, to allow all the conducive bumps to have the same height. The bump testing method conducts the thrust experiment on all of the conductive bumps at the same time, and the required to conduct the test is greatly reduced. The present invention also provides a bump testing apparatus.

Description

Bump test equipment and method

The invention relates to a testing device applied in a packaging process, in particular to a bump testing device and method.

The conventional Flip-Chip Ball Grid Array (FCBGA) bonding and packaging technology is shown in FIG. 1, mainly on the action surface 11a of a semiconductor chip 11 by a plurality of conductive bumps 13 electrically Connected to the package substrate 10 to reduce the volume of the overall semiconductor package 1.

Before the flip chip bonding process is performed, it is determined whether the structural strength of the conductive bumps 13 on the bonding pads 12 of the package substrate 10 is sufficient. The conventional operation to determine the structural strength of the conductive bump 13 is to confirm the structural strength of each conductive bump 13 by a shear test as shown in FIGS. 2A to 2D.

Specifically, as shown in FIG. 2A, a thrust mechanism 8 is used to conduct destructive testing of the conductive bump 13 bonded to the pad 12 by a thrust test.

Therefore, when the bonding between the conductive bump 13 and the pad 12 is good (that is, the conductive bump 13 can withstand a large stress), the failure mode of the conductive bump 13 when it is pushed down by force (failure mode) will occur at the body of the conductive bump 13, that is, part of the material of the conductive bump 13a will remain It remains on the pad 12 as shown in FIG. 2B. On the other hand, if the bonding between the conductive bump 13 and the pad 12 is poor (ie, the conductive bump 13 cannot bear a large stress), the failure mode of the conductive bump 13 when pushed down Occurs at the junction of the conductive bump 13 and the pad 12, that is, the conductive bump 13 will be completely detached from the pad 12 without leaving any material of the conductive bump 13 in the solder On the pad 12, as shown in FIG. 2C.

However, the conventional thrust mechanism 8 can only perform a thrust test on one conductive bump 13 at a time. Therefore, if a thrust test is performed on a plurality of conductive bumps 13 arranged in a group, it will be extremely time-consuming.

Furthermore, during the thrust test, the thrust mechanism 8 is likely to collide with the soder mask on the package substrate 10, causing the package substrate 10 to crack.

In addition, the package substrate 10 may have a warping phenomenon, as shown in FIG. 2D, so that each conductive bump 13 on the package substrate 10 is not at the same level, so it is not accurate during the thrust test For each conductive bump 13, ground thrust destruction is performed at the same location, resulting in inaccurate test results. For example, the thrust mechanism 8 pushes a portion of the conductive bump 13 only at the top 1/3 part A, and pushes another part of the conductive bump 13 at the top 2/3 part B. Wherein, since the thrust mechanism 8 only presses at the 1/3 part A of the conductive bump, even if the bonding between the conductive bump 13 and the pad 12 is poor, it will not occur as shown in FIG. 2C As shown, it is not possible to effectively detect the situation of poor binding.

Therefore, how to overcome the various problems in the above-mentioned conventional technologies has become an urgent problem to be solved at present.

In view of the above-mentioned defects of the prior art, the present invention provides a bump testing device, which includes: a carrying device for carrying a substrate structure incorporating a plurality of conductive bumps; a measuring device for measuring each The height of the conductive bump; and the removal device, which is used to remove at least a part of the material of the conductive bump.

The invention also provides a bump testing method, which includes: providing a substrate structure combined with a plurality of conductive bumps; measuring the height of each conductive bump; and removing at least a part of the material of the conductive bump.

In the aforementioned bump test method and device, the substrate structure is a package substrate, a silicon interposer, or a semiconductor chip.

In the aforementioned bump testing method and device, the conductive bump is a solder ball or a metal pillar.

In the aforementioned bump test method and equipment, the substrate structure is positioned by vacuum adsorption. For example, the carrier device positions the substrate structure by vacuum suction.

In the aforementioned bump testing method and device, the height of each conductive bump is measured by light sensing. For example, the measuring device measures the height of each conductive bump in a light-sensitive manner.

In the aforementioned bump test method and equipment, part of the material of the conductive bump is removed by cutting. For example, the removing device removes at least one part of the material of the conductive bump by cutting.

In the aforementioned bump test method and device, the height of the conductive bump is compensated according to the measurement result, and then at least a part of the material of the conductive bump is removed. For example, after the removal device removes at least one part of the material of the conductive bump, the height of each conductive bump is the same.

In the aforementioned bump test method and device, a thrust test is performed simultaneously during the process of removing at least one material of the conductive bump. For example, the removal device simultaneously performs a thrust test while removing at least one material of the conductive bump.

It can be seen from the above that in the bump testing method and apparatus of the present invention, the material of these conductive bumps is mainly removed, and the thrust test is also performed at the same time, so compared to the conventional technology, only one conductive A method for performing a thrust test on a bump. The bump test method of the present invention can perform a thrust test operation on all conductive bumps at one time, thereby greatly reducing the time course.

Furthermore, the present invention can compensate the height of the conductive bump according to the measurement result of the measurement device, so that the removal device can move along the warped surface of the substrate structure, so compared with the conventional technology, the present According to the invention, when the thrust test is performed, the removal device does not collide with the substrate structure, so that the substrate structure can be prevented from cracking.

In addition, the removal device of the present invention moves along the warped surface of the substrate structure, so compared with the conventional technology, the removal device can accurately perform the same part for each conductive bump during the thrust test The thrust is destroyed, thus greatly improving the accuracy of the test results.

1‧‧‧Semiconductor package

10‧‧‧Package substrate

11‧‧‧Semiconductor chip

11a‧‧‧action surface

12,90‧‧‧solder pad

13,13a,3,4‧‧‧ conductive bump

2‧‧‧Bump testing equipment

20‧‧‧Bearing device

20a‧‧‧Vacuum platform

21‧‧‧Measuring device

22‧‧‧Remove device

8‧‧‧Thrust mechanism

9‧‧‧Substrate structure

A, B‧‧‧ parts

F‧‧‧Adsorption force direction

H, h‧‧‧ height

L‧‧‧Datum plane

P‧‧‧Light

S‧‧‧Moving path

X,Z‧‧‧Movement direction

Figure 1 is a schematic cross-sectional view of a conventional flip chip semiconductor package; Figure 2A is a schematic side view of a conventional thrust test; Figures 2B and 2C are schematic side views of various results of a conventional thrust test; Figure 2D is a cross-sectional view of a conventional package substrate warping and performing a thrust test Schematic diagrams; Figures 3A to 3C are side schematic diagrams of the flow of the bump testing method of the present invention; and Figure 3D is a partially enlarged schematic diagram of Figure 3C.

The following describes the implementation of the present invention by specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structure, proportion, size, etc. shown in the drawings in this specification are only used to match the contents disclosed in the specification, for those who are familiar with this skill to understand and read, not to limit the implementation of the present invention The limited conditions do not have technical significance. Any modification of structure, change of proportional relationship or adjustment of size should still fall within the scope of the invention without affecting the efficacy and the purpose of the invention. The technical content disclosed by the invention can be covered. At the same time, the terms such as "上" and "一" cited in this specification are only for the convenience of description, and are not used to limit the scope of the invention. The relative relationship is changed or adjusted. Substantially changing the technical content should also be regarded as the scope of the invention.

Please refer to FIGS. 3A to 3C, which are schematic side views of the bump testing method of the present invention.

As shown in FIG. 3A, a substrate structure 9 incorporating a plurality of conductive bumps 3 is provided, and the substrate structure 9 is placed on a carrier device 20. Next, the height h of each conductive bump 3 is measured by a measuring device 21.

In this embodiment, the substrate structure 9 is a flip chip package substrate, a silicon interposer or a flip chip semiconductor chip, and the conductive bump 3 is a solder ball or a metal pillar such as a copper pillar.

Furthermore, the carrying device 20 includes a vacuum platform 20a carrying the substrate structure 9, and the substrate structure 9 is positioned by a positioning pusher (not shown), and is vacuum adsorbed (as shown in FIG. 3A). The force direction F) fixes the substrate structure 9.

In addition, the measuring device 21 measures the height h of each conductive bump 3 by a light-sensing method (light P as shown in FIG. 3A) in the moving direction X shown in FIG. 3A. Specifically, the measuring device 21 measures the height of each conductive bump 3 relative to the same plane (such as the reference plane L or the vacuum platform 20a) according to the degree of warpage of each part of the substrate structure 9 using laser light h.

As shown in FIGS. 3B to 3C, part of the material of the conductive bumps 3 is removed by a removing device 22 (as shown in the moving direction Z in FIG. 3B).

In this embodiment, the removing device 22 removes at least one part of the material of the conductive bump 3 by cutting (such as milling by a milling cutter).

Furthermore, the removal device 22 compensates for the height of the conductive bump 3 according to the measurement result of the measurement device 21, so that the removal device 22 moves along the warped surface of the substrate structure 9 (e.g. 3B The moving path S) shown in the figure, after the removal operation, the height H of each conductive bump 4 is the same, as Leveling results shown in Figure 3D.

In addition, in the process of removing part of the materials of the conductive bumps 3, the removal device 22 will contact the conductive bumps 3, so a thrust test can be performed together to confirm the structure of each conductive bump 3 strength.

Therefore, the bump testing method of the present invention removes part of the materials of the conductive bumps 3 and simultaneously performs the thrust test, so compared to the conventional technology, only one conductive bump 13 can be thrust at a time. The test method, the bump test method of the present invention can perform thrust test operation on all conductive bumps 3 arranged in a group of arrays at a time, thereby greatly reducing the time course.

Furthermore, the bump testing method of the present invention performs height compensation of the conductive bump 3 according to the measurement result of the measuring device 21, so that the removing device 22 can move along the warped surface of the substrate structure 9, so Compared with the conventional technology, when the bump test method of the present invention performs a thrust test, the removal device 22 does not collide with the substrate structure 9, so the substrate structure 9 can be prevented from cracking.

In addition, the removal device 22 used in the bump testing method of the present invention moves along the warped surface of the substrate structure 9, so compared to the conventional technology, the removal device 22 can be accurately performed during the thrust test For each conductive bump 3, the thrust of the same part is destroyed, thereby greatly improving the accuracy of the test result. For example, the removal device 22 pushes each conductive bump 3 at the top 2/3 of its top surface, so when the bonding between the conductive bump 3 and the pad 90 of the substrate structure 9 is poor As a result, the conductive bump 3 will be completely detached from the solder pad 90 (as shown in FIG. 2C), so that the poor adhesion can be effectively detected.

The invention also provides a bump testing device 2 which includes: a carrying device 20, a measuring device 21 and a removing device 22.

The carrying device 20 is used to carry a substrate structure 9 combined with a plurality of conductive bumps 3 and 4.

The measuring device 21 is used to measure the height h of each conductive bump 3.

The removal device 22 is used to remove at least one part of the material of the conductive bump 3.

In one embodiment, the substrate structure 9 is a package substrate, silicon interposer or semiconductor chip, and the conductive bumps 3 and 4 are solder balls or metal pillars.

In one embodiment, the carrier device 20 positions the substrate structure 9 by vacuum suction.

In one embodiment, the measuring device 21 measures the height h of each conductive bump 3 in a light-sensitive manner.

In one embodiment, the removal device 22 removes at least one part of the material of the conductive bump 3 by cutting, and after the removal device 22 removes at least one part of the material of the conductive bump 3, each The height H of the conductive bump 4 is the same.

In an embodiment, the removal device 22 performs a thrust test together during the process of removing at least one part of the material of the conductive bump 3.

In summary, in the bump testing method and apparatus of the present invention, by removing part of the materials of the conductive bumps and simultaneously performing the thrust test, the thrust test operation can be performed on all conductive bumps at once, Therefore, the time course can be greatly reduced.

Furthermore, the present invention can compensate for the height of the conductive bump according to the measurement result of the measurement device, so that during the thrust test, the bump test equipment not only does not collide with the substrate structure but can avoid the substrate structure from cracking, And it can accurately destroy the thrust of the same part of all conductive bumps to make the test result correct.

The above embodiments are used to exemplify the principles and effects of the present invention, rather than to limit the present invention. Anyone who is familiar with this skill can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be as listed in the scope of patent application mentioned later.

2‧‧‧Bump testing equipment

20‧‧‧Bearing device

20a‧‧‧Vacuum platform

21‧‧‧Measuring device

22‧‧‧Remove device

4‧‧‧ conductive bump

9‧‧‧Substrate structure

F‧‧‧Adsorption force direction

Claims (15)

A bump testing device includes: a carrying device for carrying a substrate structure combined with a plurality of conductive bumps; a measuring device for measuring each conductive bump according to the degree of warpage of each part of the substrate structure The height relative to the same plane; and the removal device, which compensates for the height of the conductive bump according to the height measurement result of the conductive bump, and determines a moving path according to the result of the height compensation, and the removal device moves along the The moving path removes at least a part of the material of the conductive bump. The bump test equipment as described in item 1 of the patent application scope, wherein the substrate structure is a package substrate, a silicon interposer, or a semiconductor chip. The bump testing device as described in item 1 of the patent application scope, wherein the conductive bump is a solder ball or a metal pillar. The bump test equipment as described in item 1 of the patent application scope, wherein the carrier device positions the substrate structure by vacuum suction. The bump testing device as described in item 1 of the patent application scope, wherein the measuring device measures the height of each conductive bump in a light-sensitive manner. The bump testing equipment as described in item 1 of the patent application scope, wherein the removing device removes at least a part of the material of the conductive bump by cutting. The bump testing equipment as described in item 1 of the patent application range, wherein after the removal device removes at least one part of the material of the conductive bump, the height of each conductive bump is the same. The bump testing equipment as described in item 1 of the patent application scope, wherein the removing device simultaneously performs a thrust test during the process of removing at least one part of the material of the conductive bump. A bump test method includes: providing a substrate structure combined with a plurality of conductive bumps; measuring the height of each conductive bump relative to the same plane according to the warpage of each part of the substrate structure; based on the conductive bump The height measurement result performs height compensation of the conductive bump; determines a moving path according to the result of the height compensation; and removes at least a part of the material of the conductive bump along the moving path. The bump test method as described in item 9 of the patent application scope, wherein the substrate structure is a package substrate, a silicon interposer, or a semiconductor chip. The bump test method as described in item 9 of the patent application scope, wherein the conductive bump is a solder ball or a metal pillar. The bump test method as described in item 9 of the patent application scope, wherein the substrate structure is positioned by vacuum suction. The bump testing method as described in item 9 of the patent application scope, wherein the height of the conductive bump is measured by light sensing. The bump test method as described in item 9 of the patent application scope, wherein part of the material of the conductive bump is removed by cutting. The bump testing method as described in item 9 of the patent application scope, wherein the thrust test is performed simultaneously during the process of removing at least a part of the material of the conductive bump.

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