TWI676988B - Readout circuit applied to a memory - Google Patents
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Abstract
一種應用於一記憶體的讀出電路,其中當通過記憶體中的一記憶體單元的一電流不大於一第一邊界電流時,記憶體單元具有一第一輸出值,當通過記憶體中的記憶體單元的單元電流不小於第二邊界電流時,記憶體單元具有一第二輸出值,讀出電路包含:一接收電路以及一控制電路,其中接收電路係用以接收通過記憶體單元的單元電流,而控制電路係耦接至接收電路並用以根據通過記憶體單元的單元電流以及一參考電流來產生一控制電流,並另外根據控制電流產生第一輸出值或第二輸出值的其中之一,其中該參考電流位於該第一邊界電流以及該第二邊界電流之間。 A readout circuit applied to a memory. When a current passing through a memory cell in the memory is not greater than a first boundary current, the memory cell has a first output value. When the unit current of the memory unit is not less than the second boundary current, the memory unit has a second output value. The readout circuit includes a receiving circuit and a control circuit. The receiving circuit is used to receive the unit passing through the memory unit. Current, and the control circuit is coupled to the receiving circuit and used for generating a control current according to the unit current passing through the memory unit and a reference current, and further generating one of the first output value or the second output value according to the control current. , Wherein the reference current is located between the first boundary current and the second boundary current.
Description
本發明係有關於一記憶體系統,尤指一種應用於一記憶體的讀出電路。 The invention relates to a memory system, and more particularly to a readout circuit applied to a memory.
傳統上,在一個以偵測電流判斷資料狀態的記憶體中,尤指磁阻式隨機存取記憶體(Magnetoresistive Random Access Memory,MRAM),用以判斷資料狀態為”0”或為”1”的兩界限電流太過接近,使得些微的製程偏差即會造成記憶體判斷資料狀態錯誤。因此需要一種新的記憶體系統來解決上述問題。 Traditionally, in a memory that judges the state of data by detecting the current, especially a magnetoresistive random access memory (MRAM), which is used to determine whether the state of the data is "0" or "1" The two limit currents are too close to each other, so that a slight process deviation will cause the memory to judge the data status error. Therefore, a new memory system is needed to solve the above problems.
本發明的目的之一在於提供一種記憶體的讀出電路來解決上述問題。 An object of the present invention is to provide a memory readout circuit to solve the above problems.
根據本發明的一實施例,揭露一種應用於一記憶體的讀出電路,其中當通過該記憶體中的一記憶體單元的一單元電流不大於一第一邊界電流時,該記憶體單元具有一第一輸出值,當通過該記憶體中的該記憶體單元的該單元電流不小於該第二邊界電流時,該記憶體單元具有一第二輸出值,該讀出電路包含:一接收電路以及一控制電路,其中該接收電路係用以接收通過該記憶體單 元的該單元電流,而控制電路係耦接至該接收電路並用以根據通過該記憶體單元的該單元電流以及一參考電流來產生一控制電流,並另外根據該控制電流產生該第一輸出值或該第二輸出值的其中之一,其中該參考電流位於該第一邊界電流以及該第二邊界電流之間。 According to an embodiment of the present invention, a readout circuit applied to a memory is disclosed. When a cell current passing through a memory cell in the memory is not greater than a first boundary current, the memory cell has A first output value, when the cell current passing through the memory cell in the memory is not less than the second boundary current, the memory cell has a second output value, the readout circuit includes: a receiving circuit And a control circuit, wherein the receiving circuit is used for receiving And the control circuit is coupled to the receiving circuit and used for generating a control current according to the unit current and a reference current passing through the memory unit, and generating the first output value according to the control current. Or one of the second output values, wherein the reference current is between the first boundary current and the second boundary current.
Icell‧‧‧單元電流 Icell‧‧‧cell current
I1、I2、I3、I4‧‧‧邊界電流 I1, I2, I3, I4‧‧‧ boundary current
Iref1、Iref2‧‧‧參考電流 Iref1, Iref2‧‧‧ reference current
10‧‧‧記憶體 10‧‧‧Memory
100‧‧‧讀出電路 100‧‧‧readout circuit
110‧‧‧接收電路 110‧‧‧Receiving circuit
120‧‧‧控制電路 120‧‧‧Control circuit
Do‧‧‧資料狀態 Do‧‧‧Data Status
Ictrl‧‧‧控制電流 Ictrl‧‧‧Control current
Ipro1-Ipro2‧‧‧處理電流 Ipro1-Ipro2‧‧‧ Handle current
M1-M4‧‧‧電晶體 M1-M4‧‧‧Transistors
第1圖係為一磁阻式隨機存取記憶體的操作示意圖。 FIG. 1 is a schematic diagram of the operation of a magnetoresistive random access memory.
第2圖係根據本發明一實施例之一記憶體的一讀出電路的示意圖。 FIG. 2 is a schematic diagram of a readout circuit of a memory according to an embodiment of the invention.
第3圖係根據本發明一實施例之一控制電路的示意圖。 FIG. 3 is a schematic diagram of a control circuit according to an embodiment of the present invention.
第4圖係根據本發明一實施例之一電流產生電路的示意圖。 FIG. 4 is a schematic diagram of a current generating circuit according to an embodiment of the present invention.
第5圖係根據本發明另一實施例之一控制電路的示意圖。 FIG. 5 is a schematic diagram of a control circuit according to another embodiment of the present invention.
在說明書及後續的申請專利範圍當中使用了某些詞彙來指稱特定的元件。所屬領域中具有通常知識者應可理解,硬體製造商可能會用不同的名詞來稱呼同一個元件。本說明書及後續的申請專利範圍並不以名稱的差異來作為區分元件的方式,而是以元件在功能上的差異來作為區分的準則。在通篇說明書及後續的請求項當中所提及的「包含」係為一開放式的用語,故應解釋成「包含但不限定於」。此外,「耦接」一詞在此係包含任何直接及間接的電氣連接手段,因此,若文中描述一第一裝置耦接於一第二裝置,則代表該第一裝置可直接電氣連接於該第二裝置,或者透過其他裝置或連接手段間接地電氣連接至該第二裝置。 Certain terms are used in the description and the scope of subsequent patent applications to refer to specific elements. It should be understood by those with ordinary knowledge in the art that hardware manufacturers may use different names to refer to the same component. The scope of this specification and subsequent patent applications does not take the difference in names as a way to distinguish components, but rather uses the difference in functions of components as a criterion for distinguishing components. "Inclusion" mentioned throughout the specification and subsequent claims is an open-ended term and should be interpreted as "including but not limited to." In addition, the term "coupled" includes any direct and indirect electrical connection means. Therefore, if the text describes a first device coupled to a second device, it means that the first device can be directly and electrically connected to the second device. The second device is indirectly electrically connected to the second device through other devices or connection means.
第1圖係一磁阻式隨機存取記憶體的單元電流(cell current)分布及操作示意圖,在第1圖中,電流I1與I2分別為資料狀態為“0”時的單元電流(cell current)分布的邊界電流,而電流I3與I4分別為資料狀態為“1”時的單元電流(cell current)分布的邊界電流,亦即流過記憶體單元的單元電流Icell位於參考電流I1與參考電流I2之間時,記憶體可被判斷資料狀態為”0”,而流過記憶體單元的單元電流Icell位於邊界電流I3與邊界電流I4之間時,記憶體可被判斷資料狀態為”1”,其中為了確保製程偏差的容錯率,通常會定義一參考電流Iref,使得參考電流Iref與邊界電流I2之間和參考電流Iref與邊界電流I3之間可具有相同的間隔,傳統上,記憶體的讀出電路會比較參考電流Iref與單元電流Icell,當記憶體單元的單元電流Icell小於參考電流Iref時,記憶體即被判斷資料狀態為”0”,然而,單元電流分布狀況下,單元電流Icell最大值為邊界電流I2,其與參考電流Iref之間的間隔僅僅為(I3-I2)/2;同樣地,當通過記憶體單元的單元電流Icell大於參考電流Iref時,記憶體即被判斷資料狀態為”1”,此狀況下,單元電流Icell最小值為邊界電流I3,其與參考電流Iref之間的間隔同樣僅僅為(I3-I2)/2。因此對於磁阻式隨機存取記憶體來說,如此小的間隔使得些微的製程偏差即會造成記憶體判斷資料狀態錯誤,因此本發明提出一種新的記憶體系統來解決此問題。 Figure 1 shows the cell current distribution and operation of a magnetoresistive random access memory. In Figure 1, the currents I1 and I2 are the cell currents when the data state is "0". ) Distributed boundary current, and the currents I3 and I4 are the boundary currents of the cell current distribution when the data state is "1", that is, the cell current Icell flowing through the memory cell is located at the reference current I1 and the reference current Between I2, the memory can be judged that the data state is "0", and when the cell current Icell flowing through the memory cell is between the boundary current I3 and the boundary current I4, the memory can be judged that the data state is "1" In order to ensure the tolerance rate of process deviation, a reference current Iref is usually defined so that the reference current Iref and the boundary current I2 and the reference current Iref and the boundary current I3 can have the same interval. Traditionally, the memory The readout circuit compares the reference current Iref with the cell current Icell. When the cell current Icell of the memory cell is less than the reference current Iref, the memory is judged to have a data state of "0". However, Under the condition of cell current distribution, the maximum value of the cell current Icell is the boundary current I2, and the interval between the cell current and the reference current Iref is only (I3-I2) / 2; Similarly, when the cell current Icell passing the memory cell is larger than the reference current When Iref, the memory is judged to have a data state of "1". Under this condition, the minimum value of the cell current Icell is the boundary current I3, and the interval between the reference current Iref is also only (I3-I2) / 2. Therefore, for a magnetoresistive random access memory, such a small interval causes a slight process deviation to cause the memory to judge the data status error. Therefore, the present invention proposes a new memory system to solve this problem.
第2圖係根據本發明一實施例之應用於一記憶體10的一讀出電路100的示意圖,在本實施例中,記憶體10可為一但不限定於,一磁阻式隨機存取記憶體(Magnetoresistive Random Access Memory,MRAM),其他任何透過偵測電流來判斷資料狀態的記憶體皆可隸屬於本發明的範圍。如第2圖所示,讀出電路100包含一接收電路110以及一控制電路120,其中接收電路110係用以接收流過記憶體10中所包含的記憶體單元的一單元電流Icell,並將單元電流Icell傳送至控制電路120,而控制電路120根據單元電流Icell以及第1圖中所示的兩個參考電流 Iref1及Iref2來產生一控制電流Ictrl,並根據控制電流Ictrl產生該記憶體單元的資料狀態Do,如輸出邏輯值”0”或”1”。在本實施例中,為了方便後續的說明,參考電流Iref1係等於邊界電流I2,而參考電流Iref2係等於邊界電流I3,但本發明並不以此為限。在其他的實施例中,參考電流Iref1、Iref2可以是位於邊界電流I2、I3之間的任何適當的電流值。 FIG. 2 is a schematic diagram of a readout circuit 100 applied to a memory 10 according to an embodiment of the present invention. In this embodiment, the memory 10 may be one but not limited to a magnetoresistive random access A memory (Magnetoresistive Random Access Memory, MRAM), any other memory that judges the state of data by detecting a current, can belong to the scope of the present invention. As shown in FIG. 2, the readout circuit 100 includes a receiving circuit 110 and a control circuit 120. The receiving circuit 110 is configured to receive a cell current Icell flowing through a memory cell included in the memory 10, and The unit current Icell is transmitted to the control circuit 120, and the control circuit 120 is based on the unit current Icell and the two reference currents shown in FIG. Iref1 and Iref2 generate a control current Ictrl, and generate a data state Do of the memory unit according to the control current Ictrl, such as outputting a logic value "0" or "1". In this embodiment, for convenience of subsequent description, the reference current Iref1 is equal to the boundary current I2, and the reference current Iref2 is equal to the boundary current I3, but the present invention is not limited thereto. In other embodiments, the reference currents Iref1 and Iref2 may be any appropriate current values between the boundary currents I2 and I3.
第3圖係根據本發明一實施例之控制電路120的示意圖,如第3圖所示,控制電路120包含電流產生電路210與220以及一比較電路230。電流產生電路210係用以接收單元電流Icell與邊界電流I2,並產生一處理電流Ipro1,在本實施例中,處理電流Ipro1可以為單元電流Icell與邊界電流I2的一差值的整數倍,即Ipro1=A(Icell-I2),其中A為一正整數。另外,電流產生電路220係用以接收單元電流Icell與邊界電流I3,並產生一處理電流Ipro2,在本實施例中,處理電流Ipro2可以為邊界電流I3與單元電流Icell的一差值的整數倍,即Ipro2=A(I3-Icell)。比較電路230係用以比較處理電流Ipro1與Ipro2以產生控制電流Ictrl,其中當控制電流Ictrl指示處理電流Ipro1大於處理電流Ipro2時,即Ipro1-Ipro2>0時,比較電路230輸出的資料狀態Do為邏輯值”1”,而當控制電流Ictrl指示處理電流Ipro1小於處理電流Ipro2時,即Ipro1-Ipro2<0時,比較電路230輸出的資料狀態Do為邏輯值”0”。 FIG. 3 is a schematic diagram of a control circuit 120 according to an embodiment of the present invention. As shown in FIG. 3, the control circuit 120 includes current generating circuits 210 and 220 and a comparison circuit 230. The current generating circuit 210 is configured to receive the cell current Icell and the boundary current I2 and generate a processing current Ipro1. In this embodiment, the processing current Ipro1 may be an integer multiple of a difference between the cell current Icell and the boundary current I2, that is, Ipro 1 = A ( Icell - I 2), where A is a positive integer. In addition, the current generating circuit 220 is configured to receive the cell current Icell and the boundary current I3 and generate a processing current Ipro2. In this embodiment, the processing current Ipro2 may be an integer multiple of a difference between the boundary current I3 and the cell current Icell. , That is, Ipro 2 = A ( I 3- Icell ). The comparison circuit 230 is used to compare the processing currents Ipro1 and Ipro2 to generate a control current Ictrl. When the control current Ictrl indicates that the processing current Ipro1 is greater than the processing current Ipro2, that is, when Ipro1-Ipro2> 0, the data state Do output by the comparison circuit 230 is The logic value "1", and when the control current Ictrl indicates that the processing current Ipro1 is smaller than the processing current Ipro2, that is, when Ipro1-Ipro2 <0, the data state Do output by the comparison circuit 230 is a logic value "0".
根據第3圖的實施例可知,比較電路230比較處理電流Ipro1與Ipro2來產生資料狀態Do,其中控制電流Ictrl可歸納為數學式如下:Ictrl=Ipro1-Ipro2,Ictrl=(Icell-I2)-(I3-Icell),假設A=1 According to the embodiment of FIG. 3, it can be known that the comparison circuit 230 compares the processing currents Ipro1 and Ipro2 to generate a data state Do, where the control current Ictrl can be summarized as a mathematical formula as follows: Ictrl = Ipro 1- Ipro 2, Ictrl = ( Icell-I 2 )-( I 3- Icell ), assuming A = 1
Ictrl=2Icell-(I2+I3) I ctrl = 2 Icell- ( I 2+ I 3)
而比較電路230透過比較控制電流Ictrrl是否大於0或小於0來輸出資 料狀態Do,然而,從上述數學式以及第1圖實施例中可知,若要得到輸出資料狀態Do為邏輯值”0”的情況下,單元電流Icell最大可為邊界電流I2,此時的控制電流Ictrl將為I2-I3;而若要得到輸出資料狀態Do為邏輯值”1”的情況下,單元電流Icell最小為邊界電流I3,此時的控制電流Ictrl將為I3-I2,明顯地,與第1圖的實施例相比,本發明所提出的架構可以使得電流間隔增加為兩倍,如此一來將可以大幅降低記憶體對於資料狀態判讀的錯誤率。需注意的是,本實施例中假設A為正整數1,在其他實施例中,A可以為大於1的正整數,大於1的任何數,如此一來,將可得到更加大的電流間隔以降低記憶體對於資料狀態判讀的錯誤率。 The comparison circuit 230 outputs data by comparing whether the control current Ictrrl is greater than 0 or less than 0. The material state Do, however, it can be known from the above mathematical formula and the embodiment in FIG. 1 that if the output data state Do is a logical value “0”, the maximum cell current Icell can be the boundary current I2. The current Ictrl will be I2-I3; if the output data state Do is a logic value "1", the minimum unit current Icell is the boundary current I3, and the control current Ictrl at this time will be I3-I2. Obviously, Compared with the embodiment shown in FIG. 1, the structure proposed by the present invention can increase the current interval by a factor of two, so that the error rate of the data state interpretation by the memory can be greatly reduced. It should be noted that in this embodiment, it is assumed that A is a positive integer 1. In other embodiments, A may be a positive integer greater than 1 and any number greater than 1. In this way, a larger current interval will be obtained. Reduce the error rate of memory for data state interpretation.
第4圖係根據本發明一實施例之電流產生電路210的示意圖,如第4圖所示,電流產生電路210包含金屬氧化物半導體場效電晶體(Metal-Oxide-Semiconductor Field-Effect Transistor,MOSFET)M1-M4(以下簡稱電晶體M1-M4),其中電晶體M1與M2形成一電流鏡架構且電晶體M3與M4形成另一電流鏡架構。電晶體M1的一源極端用以接收邊界電流I2,而電晶體M2的一源極端用以接收單元電流I2,如此一來流經電晶體M3的一源極端的電流將為(Icell-I2),而透過調整電晶體M4與M3的面積比例,可於電晶體M4的一源極端得到處理電流Ipro1=A(Icell-I2)。電流產生電路220同樣可以根據第4圖中的電流產生電路210來實施,僅需要將電晶體M1與M2的源極端所接收的電流分別替換為單元電流Icell與邊界電流I3,本領域具通常知識者應可輕易理解電流鏡的其他實施方式,詳細說明在此省略以省篇幅。 FIG. 4 is a schematic diagram of a current generating circuit 210 according to an embodiment of the present invention. As shown in FIG. 4, the current generating circuit 210 includes a metal oxide semiconductor field effect transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). ) M1-M4 (hereinafter referred to as transistors M1-M4), in which transistors M1 and M2 form a current mirror structure and transistors M3 and M4 form another current mirror structure. A source terminal of the transistor M1 is used to receive the boundary current I2, and a source terminal of the transistor M2 is used to receive the unit current I2, so that the current flowing through a source terminal of the transistor M3 will be (Icell-I2) By adjusting the area ratio of the transistors M4 and M3, the processing current Ipro1 = A (Icell-I2) can be obtained at one source terminal of the transistor M4. The current generating circuit 220 can also be implemented according to the current generating circuit 210 in FIG. 4. It is only necessary to replace the currents received by the source terminals of the transistors M1 and M2 with the cell current Icell and the boundary current I3, respectively. One should be able to easily understand other embodiments of the current mirror, and detailed descriptions are omitted here to save space.
第5圖係根據本發明另一實施例之一控制電路120的示意圖,在此實施例中,假設因記憶體元件電流分布易於小於邊界電流I2,如此一來,控制電路 120將參考電流定義與邊界電流I2相同(即,使用參考電流Iref1),因此控制電路120可透過比較電路510比較流經記憶體單元的單元電流Icell以及邊界電流I2來產生控制電流Ictrl,當控制電流Ictrl指示單元電流Icell大於邊界電流I2時,則輸出資料狀態Do為邏輯值”1”,當控制電流Ictrl指示單元電流Icell小於邊界電流I2時,則輸出資料狀態Do為邏輯值”0”。在此狀態下,若輸出資料狀態Do為邏輯值”1”,單元電流的最小值為I3,因此可知,與參考電流Iref1=I2時之間的間隔為(I3-I2),與第1圖實施例比較,同樣可以將電流間隔增加兩倍,以減少記憶體判斷資料狀態錯誤的機率。同樣地,若記憶體元件電流分布易於大於邊界電流I3,將參考電流定義與邊界電流I3相同(即,使用參考電流Iref2),控制電路120可替換為透過比較電路510比較流經記憶體單元的單元電流Icell以及邊界電流I3來產生控制電流Ictrl,當控制電流Ictrl指示單元電流Icell大於邊界電流I3時,則輸出資料狀態Do為邏輯值”1”,當控制電流Ictrl指示單元電流Icell小於邊界電流I3時,則輸出資料狀態Do為邏輯值”0”。在此狀態下,若輸出資料狀態Do為邏輯值”0”,單元電流的最大值為I2,因此可知,與參考電流Iref2=I3時之間的間隔同樣為(I3-I2),與第1圖實施例比較,同樣可以將電流間隔增加兩倍,以減少記憶體判斷資料狀態錯誤的機率。 FIG. 5 is a schematic diagram of the control circuit 120 according to another embodiment of the present invention. In this embodiment, it is assumed that the current distribution of the memory element is easily smaller than the boundary current I2. As a result, the control circuit 120 defines the reference current as the boundary current I2 (that is, uses the reference current Iref1), so the control circuit 120 can compare the cell current Icell flowing through the memory cell and the boundary current I2 through the comparison circuit 510 to generate the control current Ictrl. When the current Ictrl indicates that the cell current Icell is greater than the boundary current I2, the data state Do is output as a logical value “1”, and when the control current Ictrl indicates that the cell current Icell is less than the boundary current I2, the data state Do is output as a logic value “0”. In this state, if the output data state Do is a logical value "1", the minimum value of the unit current is I3, so it can be known that the interval from the reference current Iref1 = I2 is (I3-I2), which is the same as in Figure 1. Comparing the embodiments, the current interval can also be doubled to reduce the probability that the memory judges the data status error. Similarly, if the current distribution of the memory element is easily larger than the boundary current I3, the reference current is defined the same as the boundary current I3 (that is, the reference current Iref2 is used), and the control circuit 120 may be replaced by comparing the current flowing through the memory unit through the comparison circuit 510. The cell current Icell and the boundary current I3 are used to generate the control current Ictrl. When the control current Ictrl indicates that the cell current Icell is greater than the boundary current I3, the data status Do is a logical value "1". When the control current Ictrl indicates that the cell current Icell is less than the boundary current When I3, the output data state Do is logic value "0". In this state, if the output data state Do is a logic value "0", the maximum value of the unit current is I2, so it can be seen that the interval between the reference current Iref2 = I3 is also (I3-I2), which is the same as the first Comparing the embodiment of the figure, the current interval can also be doubled to reduce the probability that the memory judges the data status error.
簡單歸納本發明,本發明提出一種應用於一記憶體的讀出電路,使得判斷資料狀態為”0”或”1”的電流之間的間隔增加數倍,因此大幅降低記憶體判斷資料狀態錯誤的機率。以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 To briefly summarize the present invention, the present invention proposes a readout circuit applied to a memory, which increases the interval between currents for judging the data state as "0" or "1", thereby greatly reducing the error of the memory judging data state Chance. The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the scope of the present invention.
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| US7173852B2 (en) * | 2003-10-03 | 2007-02-06 | Sandisk Corporation | Corrected data storage and handling methods |
| US7836374B2 (en) * | 2004-05-06 | 2010-11-16 | Micron Technology, Inc. | Memory controller method and system compensating for memory cell data losses |
| TW201642276A (en) * | 2015-05-29 | 2016-12-01 | 華邦電子股份有限公司 | Memory system and error correction methods therefor |
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| US7173852B2 (en) * | 2003-10-03 | 2007-02-06 | Sandisk Corporation | Corrected data storage and handling methods |
| US7836374B2 (en) * | 2004-05-06 | 2010-11-16 | Micron Technology, Inc. | Memory controller method and system compensating for memory cell data losses |
| TW201642276A (en) * | 2015-05-29 | 2016-12-01 | 華邦電子股份有限公司 | Memory system and error correction methods therefor |
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