TWI673550B - Transflective display panel and pixel structure thereof - Google Patents

Abstract

A pixel structure includes a switching circuit, a pixel electrode, an insulating layer, a transparent protective layer, and at least one transparent bump. The pixel electrode is electrically connected to the switch circuit, and has a light reflecting portion and a light transmitting portion, wherein the light reflecting portion is adjacent to the light transmitting portion. The insulating layer covers the switching circuit and is located between the pixel electrode and the switching circuit. The transparent protective layer is located between the insulating layer and the pixel electrode, and has a first block and a second block. The light reflecting portion covers the first block, and the light transmitting portion covers the second block. The distance between the light reflecting portion and the insulating layer is greater than the distance between the light transmitting portion and the insulating layer. The transparent bump is formed on the insulating layer and is covered by a transparent protective layer, wherein the light reflecting portion overlaps the transparent bump. In addition, a transflective display panel including the above pixel structure is proposed here.

Description

Semi-transparent display panel and its pixel structure

The invention relates to a display, and more particularly to a transflective display panel and a pixel structure thereof.

Many mobile devices today, such as smart phones and tablet computers, use transflective display panels as display screens, while most current transflective display panels have multiple light transmitting sections and multiple reflective sections. When the internal light source of the display, such as a backlight module, emits light, the light can penetrate the transflective display panel from these light-transmitting portions to display an image. When external light, such as sunlight, shines on the display area of the transflective display panel, the external light will be reflected by these reflective parts and can also display images. Therefore, the transflective display panel can use an internal light source (such as a backlight module) and external light (such as sunlight) to display an image.

However, the reflective part has an opaque reflective layer, and the reflective layer can not only reflect external light, but also reflect light from the internal light source, so these reflective parts will block part of the light emitted by the internal light source, resulting in internal The light utilization rate of the light source is reduced. Therefore, when the transflective display panel is used in a dim environment (such as suburbs at night and indoor environments with insufficient light), the internal light source may need to provide strong light to the transflective display panel to display a sufficiently bright image for use. Watch.

At least one embodiment of the present invention provides a pixel structure, which includes at least one transparent bump overlapping the reflective portion, wherein the transparent bump can help increase the light utilization efficiency of the internal light source.

At least one embodiment of the present invention provides a transflective display panel including the above-mentioned transparent bumps.

The pixel structure provided by at least one embodiment of the present invention includes a switching circuit, a pixel electrode, an insulating layer, a transparent passivation layer, and at least one transparent bump. The pixel electrode is electrically connected to the switch circuit, and has a light reflecting portion and a light transmitting portion, wherein the light reflecting portion is adjacent to the light transmitting portion. The insulating layer covers the switching circuit and is located between the pixel electrode and the switching circuit. The transparent protective layer is located between the insulating layer and the pixel electrode, and has a first block and a second block connected to each other, wherein the light reflecting portion covers the first block and the light transmitting portion covers the second block. The distance between the light reflecting portion and the insulating layer is greater than the distance between the light transmitting portion and the insulating layer. The transparent bump is formed on the insulating layer and is covered by a transparent protective layer, wherein the light reflecting portion overlaps the transparent bump.

In at least one embodiment of the present invention, the transparent bump is located at a boundary between the light reflecting portion and the light transmitting portion.

In at least one embodiment of the present invention, the number of the transparent bumps is plural, and the plurality of transparent bumps are arranged along the edge of the reflective portion.

In at least one embodiment of the present invention, the plurality of transparent bumps are arranged along a boundary between the light reflecting portion and the light transmitting portion.

In at least one embodiment of the present invention, the number of the transparent bumps is multiple, and the transparent bumps are located between the light reflecting portion and the insulating layer.

In at least one embodiment of the present invention, the transparent bumps are arranged regularly.

In at least one embodiment of the present invention, the transparent bumps are arranged irregularly.

In at least one embodiment of the present invention, a top end of the transparent bump has a parabolic convex surface.

In at least one embodiment of the present invention, the width of the transparent bump at the parabolic convex surface is between 1.1 micrometers (μm) and 2 micrometers.

In at least one embodiment of the present invention, the height of the transparent bump is between 0.5 μm and 3 μm.

In at least one embodiment of the present invention, the number of the transparent bumps is multiple, and the transparent bumps are connected to each other.

In at least one embodiment of the present invention, the number of the transparent bumps is plural, and the transparent bumps are separated from each other.

In at least one embodiment of the present invention, a refractive index of the transparent bump is smaller than a refractive index of the transparent protective layer.

In at least one embodiment of the present invention, the switch circuit includes a scan line, a data line, and a switching element. The data lines are interlaced with the scan lines. The switching element is electrically connected to the scanning line, the data line, and the pixel electrode.

In at least one embodiment of the present invention, the pixel electrode includes a metal layer and a transparent conductive layer. The metal layer is electrically connected to the switching element and is located in the light reflecting portion, but not in the light transmitting portion. The transparent conductive layer is electrically connected to the metal layer and covers the metal layer, the first block, and the second block. The transparent conductive layer protrudes from the edge of the metal layer.

In at least one embodiment of the present invention, the reflective portion has a reflective surface, and a ratio between an area of the transparent bump overlapping the reflective surface and an area of the reflective surface is between 0.9% and 1.7%.

The transflective display panel provided by at least one embodiment of the present invention includes an element array substrate, an opposite substrate, and a liquid imaging layer. The element array substrate includes a transparent substrate, a switch array, a plurality of pixel electrodes, an insulating layer, a transparent protective layer, and a plurality of transparent bumps. The switch array is formed on a transparent substrate. These pixel electrodes are electrically connected to the switch array, wherein each pixel electrode has a light reflecting portion and a light transmitting portion, and the light reflecting portion is adjacent to the light transmitting portion. The insulating layer covers the switch array and is located between the pixel electrodes and the switch array. The transparent protective layer is located between the insulating layer and the pixel electrodes, and has a plurality of first and second blocks connected to each other. The reflective portions respectively cover the first blocks, and the transparent portions respectively cover These second blocks. The distance between each light reflecting portion and the insulating layer is greater than the distance between each light transmitting portion and the insulating layer. The transparent bumps are formed on the insulating layer and are covered by a transparent protective layer, wherein the light reflecting portions overlap the transparent bumps. The opposite substrate is opposite to the element array substrate, and the liquid developing layer is disposed between the element array substrate and the opposite substrate.

In at least one embodiment of the present invention, the switch array includes a plurality of parallel scan lines, a plurality of parallel data lines, and a plurality of switching elements. These data lines are interleaved with these scan lines. The switching elements are electrically connected to the scan lines, the data lines, and the pixel electrodes.

In at least one embodiment of the present invention, each pixel electrode includes a metal layer and a transparent conductive layer. The metal layer is electrically connected to one of the switching elements and is located in the reflective portion, but not in the transparent portion. The transparent conductive layer is electrically connected to the metal layer and covers the metal layer, the first block, and the second block. The transparent conductive layer protrudes from the edge of the metal layer.

Based on the above, when the internal light source emits light, the transparent bumps disclosed in at least one embodiment of the present invention can deflect a part of the light originally blocked by the reflective portion, so that the light of this portion can penetrate the transflective display panel. Therefore, the transparent bump can help part of the light emitted by the internal light source not be blocked by the reflective portion, and improve the light utilization efficiency of the internal light source.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are described below in detail with reference to the accompanying drawings, as follows.

FIG. 1A is a schematic cross-sectional view of a transflective display according to at least one embodiment of the present invention. 1A, a transflective display 10 includes an internal light source 11 and a transflective display panel 100. The internal light source 11 may be a backlight module, and the light source of the internal light source 11 may be a cold cathode fluorescent lamp (Cold Cathode). Fluorescent Lamp (CCFL) or Light Emitting Diode (LED). The internal light source 11 can emit a plurality of light rays L1 toward the transflective display panel 100, and a part of the light rays L1 can penetrate the transflective display panel 100 and exit from the display surface 101 of the transflective display panel 100.

The transflective display panel 100 includes an element array substrate 200, an opposite substrate 120, and a liquid imaging layer 140. The opposite substrate 120 is opposite to the element array substrate 200, and the liquid imaging layer 140 is disposed between the element array substrate 200 and the opposite. Between the substrates 120. The opposite substrate 120 is, for example, a color filters substrate, and the liquid-state imaging layer 140 is, for example, a liquid crystal layer, which includes a plurality of liquid crystal molecules 141. The element array substrate 200 can generate an electric field to drive the liquid crystal molecules 141 to deflect, thereby controlling the gray level of each pixel of the display surface 101, so that the transflective display panel 100 can display an image on the display surface 101.

FIG. 1B is a schematic wiring diagram of the element array substrate in FIG. 1A, and the element array substrate 200 shown in FIG. 1A is drawn along a line 1A-1A section in FIG. 1B. Referring to FIGS. 1A and 1B, the element array substrate 200 includes a plurality of pixel electrodes 220 and a switch array 230. The pixel electrodes 220 are electrically connected to the switch array 230. The switch array 230 includes a plurality of switching elements 232, a plurality of parallel scanning lines 233s, and a plurality of parallel data lines 233d. The data lines 233d are interleaved with the scanning lines 233s. The switching elements 232 are electrically connected to the scanning lines 233s, The data lines 233d and the pixel electrodes 220. The scanning lines 233s can turn on and off the switching elements 232, so that the pixel voltage transmitted by the data lines 233d can be input to the pixel electrodes 220 through the switching elements 232. In this way, the pixel electrodes 220 can generate an electric field to drive the liquid crystal molecules 141 to deflect.

In the embodiment shown in FIGS. 1A and 1B, each switching element 232 may be a thin-film transistor (TFT), and includes a gate electrode 23g, a source electrode 23s, a drain electrode 23d, and a channel layer 23c. The channel layer 23c is a semiconductor layer, and connects the source electrode 23s and the drain electrode 23d. The gate electrode 23g is connected to the scanning line 233s, and the source electrode 23s is connected to the data line 233d. The drain electrode 23d is connected to the pixel electrode 220, and the drain electrode 23d can be connected to the pixel electrode 220 by using a contact window W1, so that the drain electrode 23d and the pixel electrode 220 can be electrically connected to each other. The element array substrate 200 further includes a gate-insulating layer 260 covering the gate electrode 23g. The gate-insulating layer 260 may be made of silicon oxide or silicon nitride. The gate insulating layer 260 is located between the gate 23g and the channel layer 23c, so that the gate 23g and the channel layer 23c are electrically insulated from each other, thereby forming a capacitor structure.

When a voltage is input from the scanning line 233s to the gate electrode 23g, a field effect is generated between the gate electrode 23g and the channel layer 23c, so that the source electrode 23s and the drain electrode 23d can be electrically connected to each other through the channel layer 23c. Continuity. In this way, the pixel voltage transmitted by the data line 233d can be sequentially input to the pixel electrode 220 through the source electrode 23s, the channel layer 23c, and the drain electrode 23d to generate an electric field that drives the liquid crystal molecules 141 to deflect. In addition, the element array substrate 200 may further include a plurality of parallel common lines 280, wherein the common lines 280 can input a common voltage, and the common lines 280 may have the same orientation as the scan lines 233s. Each common line 280 has at least two sections with different widths. Among them, the wider section is an extension 281, and a plurality of extensions 281 overlap with the pixel electrodes 220, as shown in FIG. 1B.

It should be noted that although in the embodiments shown in FIG. 1A and FIG. 1B, each switching element 232 is a thin film transistor, that is, the switching element 232 is an active component, but in other embodiments, the switching element 232 It can also be a passive component, such as a diode. Therefore, it is emphasized here that these switching elements 232 can also be passive elements (such as diodes), and are not limited to being only active elements (such as thin film transistors). In addition, when the switching element 232 is a passive element, the opposite substrate 120 may be a colorless transparent substrate, such as a transparent glass plate without a color filter.

The element array substrate 200 further includes a transparent substrate 210, a transparent protective layer 240, and an insulating layer 250. The transparent substrate 210 is, for example, a glass plate. The transparent protective layer 240 may be made of photoresist, and the insulating layer 250 may be made of silicon oxide or silicon nitride. The switch array 230, the transparent protective layer 240, and the insulating layer 250 are all formed on the transparent substrate 210, and the insulating layer 250 covers the switch array 230 and is located between these pixel electrodes 220 and the switch array 230. Therefore, the switching element 232, the scanning lines 233s, and the data lines 233d are all covered by the insulating layer 250. The transparent protective layer 240 is located between the insulating layer 250 and the pixel electrode 220 and has a first block 241 and a second block 242 connected to each other. The thickness of the first block 241 is greater than the thickness of the second block 242. And the first block 241 protrudes from the upper surface of the second block 242, as shown in FIG. 1A. Since the transparent protective layer 240 may be a photoresist, the first blocks 241 and the second blocks 242 having different thicknesses may be formed by photolithography.

Each pixel electrode 220 may be divided into two parts. Specifically, each pixel electrode 220 has a light reflecting portion 220f and a light transmitting portion 220t, and the light reflecting portion 220f is adjacent to the light transmitting portion 220t. The light reflecting portion 220f covers the first block 241, and the light transmitting portion 220t covers the second block 242. Since the thickness of the first block 241 is greater than the thickness of the second block 242, the distance between the light reflecting portion 220f and the insulating layer 250 is greater than the distance between the light transmitting portion 220t and the insulating layer 250, as shown in FIG. 1A. Each pixel electrode 220 includes a transparent conductive layer 221 and a metal layer 222. The transparent conductive layer 221 may be made of transparent conductive oxide (Transparent Conducting. Oxides, TCO), and the transparent conductive oxide is, for example, indium tin oxide (Indium Tin Oxide). , ITO) or Indium Zinc Oxide (IZO).

The metal layer 222 can reflect light due to its high reflectivity. The metal layer 222 is, for example, an aluminum metal layer or a silver metal layer. Therefore, each light reflecting portion 220f has a reflective surface 222a, which may be the upper surface of the metal layer 222 shown in FIG. 1A. The transparent conductive layer 221 is electrically connected to the metal layer 222, and the metal layer 222 is electrically connected to the drain electrode 23d of one of the switching elements 232. Therefore, the switching element 232 can be electrically connected to the transparent conductive layer 221 through the metal layer 222. In addition, in the same pixel electrode 220, the transparent conductive layer 221 covers the first and second blocks 241 and 242 of the metal layer 222 and the transparent protective layer 240, and the metal layer 222 only covers the first block 241, but The second block 242 is not covered. That is, the metal layer 222 is located on the light reflecting portion 220f, but not on the light transmitting portion 220t, so the transparent conductive layer 221 will protrude from the edge of the metal layer 222. Therefore, in the embodiment shown in FIG. 1A, the light transmitting portion 220 t is formed by a part of the transparent protective layer 240, and the light reflecting portion 220 f is formed by other portions of the transparent protective layer 240 and the metal layer 222.

The element array substrate 200 further includes a plurality of transparent bumps 270. These transparent bumps 270 are formed on the insulating layer 250 and are covered with a transparent protective layer 240. In the embodiment shown in FIG. 1A and FIG. 1B, a plurality of transparent bumps 270 in the same pixel electrode 220 are located at the boundary between the reflective portion 220f and the transparent portion 220t. The transparent bumps 270 may be along the Arranged at the boundary between the reflective portion 220f and the transparent portion 220t. The light reflecting portion 220f overlaps the transparent bump 270. Taking FIG. 1A and FIG. 1B as an example, in the same pixel electrode 220, the light reflecting portion 220f partially overlaps each transparent bump 270, that is, the metal layer 222 of a single light reflecting portion 220f covers a part of each transparent bump 270. In addition, a ratio between an area of the transparent bumps 270 overlapping the reflective surfaces 222 a and an area of the reflective surfaces 222 a is between 0.9% and 1.7%.

FIG. 1C is a schematic cross-sectional view taken along a line 1C-1C in FIG. 1B. Please refer to FIG. 1A and FIG. 1C. Like the transparent protective layer 240, the transparent bump 270 can also be made of photoresist, so the transparent bump 270 can also be formed by photolithography. However, the refractive index of each transparent bump 270 is different from the refractive index of the transparent protective layer 240, so the components of the transparent bump 270 and the transparent protective layer 240 are not completely the same. In addition, the top of each transparent bump 270 has a parabolic convex surface 272, and the transparent protective layer 240 covers and contacts the parabolic convex surface 272. When the light ray L1 in the transparent bump 270 exits from the parabolic convex surface 272, the light ray L1 originally entering the metal layer 222 is deflected due to refraction, and the deflected light ray L1 does not enter the metal layer 222, and The liquid imaging layer 140 and the opposite substrate 120 are sequentially penetrated and emitted from the display surface 101, as in FIG. 1A, the second light ray L1 is counted from the left side.

It can be seen that the transparent bump 270 can deflect a part of the light L1 that was originally blocked by the reflective portion 220f, and let this part of the light L1 sequentially penetrate the liquid imaging layer 140 and the opposite substrate 120, and exit from the display surface 101. In this way, the transparent bump 270 can reduce the light L1 blocked by the reflective portion 220f, and increase the light L1 penetrating through the transflective display panel 100, thereby improving the light utilization rate of the internal light source 11. In this way, when the transflective display 10 is used in a dim environment (such as a suburb at night and an indoor environment with insufficient light), compared with the existing transflective display panel, the internal light source 11 can provide lower intensity light. That is, an image with sufficient brightness can be displayed for the user to watch, thereby helping to reduce the power consumption of the internal light source 11.

Please refer to FIG. 1C. In this embodiment, the width W27 of each transparent bump 270 at the parabolic convex surface 272 may be between 1.1 microns and 2 microns, and the height H27 of each transparent bump 270 may be between 0.5 microns and The distance P27 between the two adjacent transparent bumps 270 center line 271 may be between 3 microns, and the interval P27 may be between 1.1 microns and 2 microns. However, the foregoing ranges of the width W27, the height H27, and the pitch P27 are only one embodiment, and do not limit the present invention. In addition, the refractive index of each transparent bump 270 may be smaller than the refractive index of the transparent protective layer 240, and the transparent bumps 270 in the same pixel electrode 220 may be connected to each other.

The following (Table 1) is a program simulation to measure the transmittance of the transflective display panel 100 when different transparent bumps 270 are used. The simulation conditions of (Table 1) include the curvature radius of the parabolic convex surface 272. 0.3 μm; the refractive index of the transparent protective layer 240 is 1.7; and the width W27 in the same pixel electrode 220 is 2 μm. As a control group, the transflective display panel (ie, the transflective display panel 100 without the transparent bumps 270) has a transmittance of 42% after analog measurement. In addition, the above program is simulated based on Maxwell's equations. (Table I) Refractive index of transparent bump 270 Height H27 (micron) 1.2 1.65 2.1 2.55 3 0.5 44.53 44.17 42.60 42.84 42.46 1.125 44.63 44.16 40.74 41.20 40.96 1.75 43.66 43.87 39.87 40.00 39.68 2.375 42.76 43.37 39.45 38.90 38.50 3 42.57 43.46 39.20 38.81 38.27

It can be seen from (Table 1) that when the refractive index of the transparent bump 270 is smaller than the refractive index (1.7) of the transparent protective layer 240, the transflective display panel 100 can obtain a transmittance greater than 42% (control group). Therefore, some of the transparent bumps 270 disclosed in (Table 1) do help to improve the transmittance of the transflective display panel 100. In addition, under the condition that the height H27 of the transparent bump 270 is 0.5 micrometers (that is, 500 nanometers), even if the refractive index of the transparent bump 270 is greater than the refractive index of the transparent protective layer 240, the transmissivity of the transflective display panel 100 is half. Can also be greater than 42%. Since 0.5 micron is already in the visible wavelength range (between about 390 nm and 700 nm), the transparent bump 270 with a height of H27 of 0.5 micron will cause diffraction, and the transparent bump 270 may be used. This diffraction effect increases the transmittance of the transflective display panel 100.

The following (Table 2) also uses a program simulation to measure the transmittance of the transflective display panel 100 when using other different transparent bumps 270. The program used in (Table 2) is the same as the program used in (Table 1). And, the same as the control group (Table 1), the penetration rate of the control group (Table 2) is also 42%. (Table 2) The simulation conditions include: the curvature radius of the parabolic convex surface 272 is 0.3 micrometers; the refractive index of the transparent protective layer 240 is 1.7; and the width W27 in the same pixel electrode 220 is 1.1 micrometers. Therefore, unlike the simulation conditions of (Table 1), the width W27 of (Table 2) is relatively small (1.1 micron). (Table II) Refractive index of transparent bump 270 Height H27 (micron) 1.2 1.65 2.1 2.55 3 0.50 43.44 42.73 39.39 39.28 38.97 1.13 41.08 43.10 38.30 38.72 38.50 1.75 40.60 43.05 38.37 38.78 38.28 2.38 40.78 42.71 38.19 38.33 38.56 3.00 40.30 42.69 37.92 38.21 38.49

It can be seen from (Table 2) that when the refractive index of the transparent bump 270 is smaller than the refractive index (1.7) of the transparent protective layer 240, the transflective display panel 100 can still obtain a transmittance greater than 42% (control group). . Therefore, some of the transparent bumps 270 disclosed in (Table 2) do help to improve the transmittance of the transflective display panel 100. In addition, different from the results of (Table 1), under the condition that the refractive index of the transparent bump 270 is greater than the refractive index (1.7) of the transparent protective layer 240, regardless of whether the height H27 is 0.5 μm, the penetration of the transflective display panel 100 is half. The transmittances were less than 42% of the control group.

Please refer to FIG. 1A and FIG. 1B. In the element array substrate 200, the pixel electrodes 220, the switch array 230, the transparent protective layer 240, the insulating layer 250, and the plurality of transparent bumps 270 can form multiple pixels arranged in an array. Structure PX1, as shown in Figure 1B. Each pixel structure PX1 is formed on a transparent substrate 210 and includes a pixel electrode 220, a transparent protective layer 240, an insulating layer 250, and a switching circuit 231. The switching circuit 231 is a part of the switch array 230 in a single pixel structure PX1. . The insulating layer 250 covers the switching circuit 231 and is located between the pixel electrode 220 and the switching circuit 231. A single switching circuit 231 includes a switching element 232, a scanning line 233s, and a data line 233d. The foregoing scanning lines 233s and The data lines 233d are staggered.

Each pixel structure PX1 further includes at least one transparent bump 270. In the embodiment of FIG. 1B, a single pixel structure PX1 includes a plurality of transparent bumps 270 connected to each other, but in other embodiments, a single pixel structure PX1 may also include only one transparent bump 270, so The transparent bumps 270 shown in FIG. 1B are for illustration only, and the number of the transparent bumps 270 included in one pixel structure PX1 is not limited.

FIG. 2A is a schematic wiring diagram of an element array substrate drawn according to at least one embodiment of the present invention, and FIG. 2B is a schematic cross-sectional diagram drawn along a line 2B-2B cross-section in FIG. 2A. Please refer to FIG. 2A and FIG. 2B. The device array substrate 300 shown in FIG. 2A is similar to the device array substrate 200 shown in FIG. 1B. For example, the element array substrates 300 and 200 also include the same elements, such as the transparent substrate 210, the transparent protective layer 240, the scan lines 233s, the data lines 233d, the pixel electrodes 220, and the common lines 280. In addition, the element array substrate 300 can also be applied to the transflective display 10 in FIG. 1A, that is, the element array substrate 200 in FIG. 1A can be replaced with the element array substrate 300. Only the features of the element array substrate 300 that are different from the foregoing embodiments will be described below. As for the same features of the element array substrates 300 and 200, the description will not be repeated, and FIG. 2A will also omit drawing some of the same elements.

The element array substrate 300 includes a plurality of transparent bumps 370. The transparent bumps 370 and 270 can be made of the same material and manufacturing method, and the top of the transparent bumps 370 also has a parabolic convex surface (not labeled). However, unlike the transparent bumps 270 in the foregoing embodiment, in the same pixel electrode 220 shown in FIG. 2A and FIG. 2B, these transparent bumps 370 are separated from each other, and any two of the adjacent transparent bumps 370 are adjacent to each other. The spacing between them can be equal to each other. The transparent bumps 370 may be arranged along the edge of the reflective portion 220f. The edge of the reflective portion 220f includes an interface between the reflective portion 220f and the light transmitting portion 220t. At least one transparent bump 370 may be located between the reflective portion 220f and the reflective portion 220f. The junction between the light transmitting portions 220t.

In this embodiment, the transparent bumps 370 in the same pixel electrode 220 are arranged in an inverted U shape along the three edges of the reflective portion 220f, but in other embodiments, the transparent bumps 370 are separated from each other. It may also be arranged linearly along one edge of the reflective portion 220f, or may be arranged along only any two edges of the reflective portion 220f. Therefore, the arrangement of the transparent bumps 370 shown in FIG. 2A does not limit the present invention. In addition, in other embodiments, at least two transparent bumps 370 may be connected to each other. For example, the transparent bumps 370 at the boundary between the light reflecting portion 220f and the light transmitting portion 220t in FIG. 2A may be connected to each other to form a plurality of transparent bumps 270 connected to each other as shown in FIG. 1B.

3 and 4 are schematic diagrams of wirings of two different element array substrates according to at least one embodiment of the present invention. The element array substrates 400 and 500 shown in FIGS. 3 and 4 are similar to the elements of the foregoing embodiment. Array substrates 200 and 300, and the element array substrate 200 in FIG. 1A may be replaced with an element array substrate 400 or 500. Please refer to FIG. 3. Unlike the foregoing embodiment, in the element array substrate 400, the transparent bumps 370 in the same pixel electrode 220 are regularly arranged. Taking FIG. 3 as an example, in each pixel electrode 220, the transparent bumps 370 may be arranged in an array.

See Figure 4. In the element array substrate 500 shown in the embodiment of FIG. 4, the transparent bumps 370 in the same pixel electrode 220 are irregularly arranged, so the transparent bumps 370 are not limited to be regularly arranged. In addition, the height range of the transparent bump 370 may be the same as the height H27 range of the transparent bump 270, so the height of the transparent bump 370 may be 0.5 micrometers. Since 0.5 micron is already in the wavelength range of visible light, the transparent bump 370 having a height of 0.5 micron will generate diffraction and affect the generated image. The irregularly arranged transparent bumps 370 (as shown in FIG. 4) can reduce optical interference to reduce the influence of diffraction on the image.

In summary, when the internal light source emits light, the transparent bumps disclosed in at least one embodiment of the present invention can deflect part of the light originally blocked by the reflective portion, so that the light in this part can penetrate the transflective display panel. . Therefore, the transparent bump can help part of the light emitted by the internal light source not be blocked by the reflective portion, thereby improving the light utilization efficiency of the internal light source. Compared with the existing transflective display panel, the transflective display panel provided by at least one embodiment of the present invention can use a lower intensity light in a dim environment (such as a suburb at night and an indoor environment with insufficient light). That is, it can display an image with sufficient brightness for users to watch, thereby helping to reduce the power consumption of the internal light source.

Although the present invention has been disclosed as above by way of examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains may make some modifications and retouching without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application.

10‧‧‧ Semi-transparent display

11‧‧‧Internal light source

23d‧‧‧Drain

23c‧‧‧Channel layer

23g‧‧‧Gate

23s‧‧‧Source

100‧‧‧ Semi-transparent display panel

101‧‧‧display surface

120‧‧‧ Opposite substrate

140‧‧‧ liquid imaging layer

141‧‧‧LCD molecules

200, 300, 400, 500‧‧‧‧ element array substrate

210‧‧‧ transparent substrate

220‧‧‧pixel electrode

220f‧‧‧Reflector

220t‧‧‧light transmission

221‧‧‧ transparent conductive layer

222‧‧‧metal layer

222a‧‧‧Reflective surface

230‧‧‧Switch Array

231‧‧‧Switch circuit

232‧‧‧Switch element

233d‧‧‧data line

233s‧‧‧scan line

240‧‧‧ transparent protective layer

241‧‧‧ Block 1

242‧‧‧Second Block

250‧‧‧ Insulation

260‧‧‧Gate insulation

270, 370‧‧‧ transparent bump

271‧‧‧center line

272‧‧‧ Parabolic Convex

280‧‧‧shared line

281‧‧‧ extension

L1‧‧‧light

H27‧‧‧height

P27‧‧‧Pitch

PX1‧‧‧Pixel Structure

W1‧‧‧Contact window

W27‧‧‧Width

FIG. 1A is a schematic cross-sectional view of a transflective display according to at least one embodiment of the present invention. FIG. 1B is a schematic diagram of a layout of the element array substrate in FIG. 1A. FIG. 1C is a schematic cross-sectional view taken along a line 1C-1C in FIG. 1B. FIG. 2A is a schematic wiring diagram of a device array substrate according to at least one embodiment of the present invention. FIG. 2B is a schematic cross-sectional view taken along line 2B-2B in FIG. 2A. FIG. 3 is a schematic wiring diagram of a device array substrate according to at least one embodiment of the present invention. FIG. 4 is a schematic wiring diagram of a device array substrate according to at least one embodiment of the present invention.

Claims (14)

A pixel structure includes: a switch circuit; a pixel electrode, electrically connected to the switch circuit, and having a light reflecting portion and a light transmitting portion, wherein the light reflecting portion is adjacent to the light transmitting portion; an insulating layer covers the A switching circuit, located between the pixel electrode and the switching circuit; a transparent protective layer, located between the insulating layer and the pixel electrode, and having a first block and a second block connected to each other, Wherein the light reflecting part covers the first block, and the light transmitting part covers the second block, the distance between the light reflecting part and the insulating layer is greater than the distance between the light transmitting part and the insulating layer; and at least A transparent bump formed on the insulating layer and covered by the transparent protective layer, wherein the reflective portion overlaps the at least one transparent bump, and the at least one transparent bump is located in the reflective portion and the transparent portion The junction between. The pixel structure of claim 1, wherein the number of the at least one transparent bump is plural, and the plurality of transparent bumps are arranged along the edge of the reflective portion. The pixel structure according to claim 1, wherein a plurality of the transparent bumps are arranged along the boundary between the light reflecting part and the light transmitting part. The pixel structure as recited in claim 1, wherein the number of the at least one transparent bump is plural, and the transparent bumps are located between the reflective portion and the insulating layer. The pixel structure as described in claim 4, wherein the transparent bumps are arranged regularly. The pixel structure as described in claim 4, wherein the transparent bumps are arranged irregularly. The pixel structure as described in claim 1, wherein the top of the transparent bump has a parabolic convex surface. The pixel structure as recited in claim 7, wherein the width of the transparent bump at the parabolic convex surface is between 1.1 microns and 2 microns. The pixel structure according to claim 1 or 7, wherein the height of the transparent bump is between 0.5 microns and 3 microns. The pixel structure according to claim 1, wherein the number of the at least one transparent bump is plural, and the transparent bumps are connected to each other. The pixel structure according to claim 1, wherein the number of the at least one transparent bump is plural, and the transparent bumps are separated from each other. The pixel structure of claim 1, wherein the refractive index of the transparent bump is smaller than the refractive index of the transparent protective layer. The pixel structure according to claim 1, wherein the reflective portion has a reflective surface, and the ratio between the area of the at least one transparent bump overlapping the reflective surface and the reflective surface is between 0.9% and Between 1.7%. A transflective display panel includes an element array substrate, including: a transparent substrate; a switch array formed on the transparent substrate; a plurality of pixel electrodes electrically connected to the switch array, wherein each of the pixel electrodes has a A light reflecting part and a light transmitting part, and the light reflecting part is adjacent to the light transmitting part; an insulating layer covering the switch array is located between the pixel electrodes and the switch array; a transparent protective layer is located on the insulating Between the layer and the pixel electrodes, there are a plurality of first blocks and a plurality of second blocks, the first blocks and the second blocks are connected to each other, wherein the reflective portions cover the A plurality of first blocks, and the light-transmitting parts cover the second blocks, the distance between each light-reflecting part and the insulating layer is greater than the distance between each light-transmitting part and the insulating layer; A transparent bump formed on the insulating layer and covered by the transparent protective layer, wherein the reflective portions overlap with the transparent bumps, and the at least one transparent bump is located between the reflective portion and the transparent portion The boundary between the element array substrate and the counter substrate; and a liquid imaging layer disposed between the element array substrate and the counter substrate.