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TWI672176B - Photocatalytic material structure with heterointerface formed on substrate - Google Patents

Photocatalytic material structure with heterointerface formed on substrate Download PDF

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TWI672176B
TWI672176B TW107143187A TW107143187A TWI672176B TW I672176 B TWI672176 B TW I672176B TW 107143187 A TW107143187 A TW 107143187A TW 107143187 A TW107143187 A TW 107143187A TW I672176 B TWI672176 B TW I672176B
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oxide
doping
substrate
photocatalytic
interface
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TW202019557A (en
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陳志典
張國仁
藍文厚
陳正龍
林家慶
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國家中山科學研究院
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Abstract

本發明係為一種以介面摻雜方式提升異質結構光催化能力的結構,主要在製備異質結構薄膜的過程中,藉由介面區域的摻雜:於電子親合力低之材料進行區域p型摻雜,或以及於電子親合力高之材料進行區域n型摻雜,製成具有適當摻雜之異質結構薄膜,與傳統無摻雜之異質結構相比,此具有適當介面摻雜之結構薄膜具有較高之光催化能力。 The invention relates to a structure for improving the photocatalytic ability of a heterostructure by means of interface doping, mainly in the process of preparing a heterostructure film, by doping in the interface region: performing p-doping in a region with a material having low electron affinity Or, in the region with high electron affinity, the n-type doping is performed to form a heterostructure film with proper doping. Compared with the conventional undoped heterostructure, the structural film with appropriate interface doping has High light catalytic ability.

Description

一種於基板上製成之具異質介面的光催化材料結構 Photocatalytic material structure with heterointerface formed on substrate

本發明係有關於一種在異質結構中,利用區域摻雜方式來提升此異質結構光催化能力的材料結構。 The present invention relates to a material structure that utilizes a region doping method to enhance the photocatalytic ability of the heterostructure in a heterostructure.

光催化法,為在光源照射下,將分子分解的技術。在應用於清除水中的有機汙染物上,常將光催化材料置於受有機物汙染的水中,在光源照射下,在光催化材料表面進行氧化與還原反應,而將有機汙染物分解,達到潔淨水源的目的。 The photocatalytic method is a technique for decomposing molecules under irradiation of a light source. In the application of organic pollutants in the removal of water, the photocatalytic material is often placed in water contaminated by organic matter, and under the illumination of the light source, oxidation and reduction reactions are carried out on the surface of the photocatalytic material, and the organic pollutants are decomposed to reach a clean water source. the goal of.

在催化材料上,常使用氧化物如氧化鈦TiO2,氧化鋅ZnO,氧化錫SnO2等。這些材料在吸收光子之後,轉換成電子-電洞。當這些電子-電洞移動至材料表面時,電洞端進行氧化反應與電子端進行還原反應,而將水中的有機物分解,達成清除有機物的目的。 On the catalytic material, an oxide such as titanium oxide TiO 2 , zinc oxide ZnO, tin oxide SnO 2 or the like is often used. These materials are converted into electron-holes after absorbing photons. When these electron-holes move to the surface of the material, the end of the hole undergoes an oxidation reaction and a reduction reaction at the electron end, and the organic matter in the water is decomposed to achieve the purpose of removing organic matter.

參照美國專利公告號第US20120097522A1號,其揭示了一種於水或乙醇溶液中,利用硝酸鋅與環己胺反應,以形成多面體顆粒狀ZnO的製作方式。以及於光照射下,應用此顆粒狀ZnO,將水溶液中氰化物反應分解,達成淨化水質的目的。 U.S. Patent Publication No. US20120097522A1, which discloses the use of zinc nitrate to react with cyclohexylamine to form polyhedral particulate ZnO in water or ethanol solution. And under the irradiation of light, the granular ZnO is used to decompose the cyanide in the aqueous solution to achieve the purpose of purifying the water.

除了使用單一材料,也可結合二種(或二種以上 的)材料,來增進其催化能力。參照美國專利公告號第US20050008549A1號,其揭示了一種含有TiO2,ZnO,SnO2,SrTiO3,WO3,Bi2O3與Fe2O3為基底材料,以及這些基底材料的混合,來增進光催化能力。 In addition to the use of a single material, two (or more) materials can be combined to enhance their catalytic capabilities. U.S. Patent Publication No. US20050008549A1, which discloses the use of TiO 2 , ZnO, SnO 2 , SrTiO 3 , WO 3 , Bi 2 O 3 and Fe 2 O 3 as a base material, and the mixing of these base materials to enhance Photocatalytic ability.

參照美國專利公告號第US6274049號,其揭示了一種光催化裝置,除催化材料與光源外,還包含過濾結構。以避免顆粒狀之催化材料於反應過程中被排放。 Reference is made to U.S. Patent No. 6,274,049, which discloses a photocatalytic device comprising a filter structure in addition to a catalytic material and a light source. To prevent the particulate catalytic material from being discharged during the reaction.

職是之故,申請人乃進行試驗與研究,提出一種能增進光催化反應的結構,特別係有關於結合二種材料的異質結構,於介面處進行適當之摻雜,而達到提升此異質結構光催化能力之功效。 For the sake of his position, the applicant conducted experiments and research to propose a structure that enhances the photocatalytic reaction, especially for the heterostructure combining the two materials, and appropriately doping at the interface to enhance the heterostructure. The efficacy of photocatalytic ability.

緣是,發明人有鑑於此,秉持多年該相關行業之豐富設計開發及實際製作經驗,針對現有之技術及缺失予以研究改良,提供一種於基板上製成之具異質介面的光催化材料結構,以期達到更佳實用價值性之目的者。 In view of this, the inventors have, in view of the rich experience in design and development and actual production of the relevant industries for many years, researched and improved the existing technologies and defects, and provided a photocatalytic material structure with a heterogeneous interface made on a substrate. In order to achieve better practical value.

鑒於上述習知技術,本發明之主要目的在於提出一種於基板上製成之具異質介面的光催化材料結構,於介面處進行適當之摻雜,而達到提升此異質結構光催化能力之功效。 In view of the above-mentioned prior art, the main object of the present invention is to provide a photocatalytic material structure having a hetero interface formed on a substrate, and performing appropriate doping at the interface to achieve the effect of improving the photocatalytic ability of the heterostructure.

為達到上述目的,本發明提出一種於基板上製成之具異質介面的光催化材料結構,其包含:一基板材料;一第 一材料,為電子親合力低之材料;以及一第二材料,為電子親合力高之材料,並與該第一材料結合形成於該基板材料上;其中該第一材料於接近該第二材料之材料端,進行一介面區域p型摻雜;或該第二材料於接近該第一材料之材料端,進行一介面區域n型摻雜;或同時兼具該介面區域p型摻雜及該介面區域n型摻雜之結構材料。 In order to achieve the above object, the present invention provides a photocatalytic material structure having a hetero interface formed on a substrate, comprising: a substrate material; a material which is a material having low electron affinity; and a second material which is a material having high electron affinity and is formed on the substrate material in combination with the first material; wherein the first material is adjacent to the second material a material region, performing p-doping in an interface region; or the second material is n-doped in an interface region near the material end of the first material; or simultaneously having p-doping in the interface region An n-type doped structural material in the interface region.

較佳地,該第一材料及該第二材料係可選自半導體材料、高分子材料、有機材料或上述之組合。 Preferably, the first material and the second material may be selected from a semiconductor material, a polymer material, an organic material, or a combination thereof.

較佳地,該基板材料係可選自矽、鋁、鐵、鎳、氧化鋅、氧化鉬、氧化錫、氧化鋁、氧化鎳、氧化銅或上述之組合。 Preferably, the substrate material may be selected from the group consisting of ruthenium, aluminum, iron, nickel, zinc oxide, molybdenum oxide, tin oxide, aluminum oxide, nickel oxide, copper oxide, or a combination thereof.

較佳地,該第一材料及該第二材料係可選自氧化鋅、氧化鉬、氧化錫、氧化鋁、氧化鎳、氧化銅或上述之組合。 Preferably, the first material and the second material may be selected from the group consisting of zinc oxide, molybdenum oxide, tin oxide, aluminum oxide, nickel oxide, copper oxide or a combination thereof.

較佳地,該介面區域p型摻雜及該介面區域n型摻雜之材料係可選自氮、砷、鉍、鐵、氯、溴、釕或上述之組合。 Preferably, the p-doping of the interface region and the n-doped material of the interface region may be selected from the group consisting of nitrogen, arsenic, antimony, iron, chlorine, bromine, antimony or a combination thereof.

較佳地,該第一材料、該第二材料與摻雜製作方式係可選自噴霧塗佈、熱蒸鍍、電子束蒸鍍、濺鍍、氣相沉積、液相沉積或上述之組合。 Preferably, the first material, the second material and the doping method may be selected from the group consisting of spray coating, thermal evaporation, electron beam evaporation, sputtering, vapor deposition, liquid deposition, or a combination thereof.

根據本發明之另一特徵,其可於金屬,半導體,高分子等基板上合成,以形成該結構。 According to another feature of the invention, it can be synthesized on a substrate such as a metal, a semiconductor, or a polymer to form the structure.

本發明藉由接合之二個材料,其各自材料的電子親和力不同所組成異質結構。而於電子親和力小的一方,於靠 近接面區域進行p型摻雜,或於電子親和力大的一方,於靠近接面區域進行n型摻雜,或二者之組成,而達到提升此異質結構光催化能力之功效。 The present invention constitutes a heterostructure by bonding two materials whose electron affinities differ from each other. On the side of small electron affinity, rely on The near junction region is p-doped, or the electron affinity is large, the n-type doping is performed close to the junction region, or the composition of the two, thereby improving the photocatalytic ability of the heterostructure.

以上之概述與接下來的詳細說明及附圖,皆是為了能進一步說明本創作達到預定目的所採取的方式、手段及功效。而有關本創作的其他目的及優點,將在後續的說明及圖式中加以闡述。 The above summary and the following detailed description and drawings are intended to further illustrate the manner, means and effects of the present invention in achieving its intended purpose. Other purposes and advantages of this creation will be explained in the following description and drawings.

100‧‧‧基板材料 100‧‧‧Substrate material

110‧‧‧第一材料 110‧‧‧First material

111、121‧‧‧結構層 111, 121‧‧‧ structural layer

120‧‧‧第二材料 120‧‧‧Second material

E‧‧‧電子親合力 E‧‧‧Electronic affinity

h(a)、h(b)‧‧‧電洞 h(a), h(b)‧‧‧ holes

e(a)、e(b)‧‧‧電子 e(a), e(b)‧‧‧Electronics

C‧‧‧濃度 C‧‧‧ concentration

t‧‧‧時間 t‧‧‧Time

a‧‧‧改良前 A‧‧‧ before improvement

b‧‧‧改良後 b‧‧‧After improvement

第1圖係為於基板上之雙層結構示意圖;第2圖係為氧化鋅-氧化鉬能帶示意圖;第3圖係為在光催化反應下,殘存剛果紅溶液之濃度對反應時間的關係圖。包含(a)改良前與(b)改良後的結果;第4圖係為於電子親合力小的一方改良後之雙層結構示意圖;第5圖係為於電子親合力大的一方改良後之雙層結構示意圖。 1 is a schematic diagram of a two-layer structure on a substrate; FIG. 2 is a schematic diagram of a zinc oxide-molybdenum oxide band; and FIG. 3 is a relationship between a concentration of a remaining Congo red solution and a reaction time under a photocatalytic reaction. Figure. It includes (a) the results before the improvement and (b) the improvement; the fourth figure is a schematic diagram of the two-layer structure after the improvement of the electron affinity, and the fifth figure is the improvement of the one with the greater electron affinity. Schematic diagram of the double layer structure.

第6圖係為同時於電子親合力大及電子親合力小的一方改良後之雙層結構示意圖。 Fig. 6 is a schematic diagram of a two-layer structure which is improved simultaneously with a large electron affinity and a small electron affinity.

以下係藉由特定的具體實例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容瞭解本發明之其他優點與功效。 The embodiments of the present invention are described below by way of specific examples, and those skilled in the art can understand the other advantages and advantages of the present invention from the disclosure.

請參考第1圖,為於基板上之雙層式光催化材料示意圖。如圖所示,其結構係包括基板材料100,其中基板材料100係可選自矽、鋁、鐵、鎳、氧化鋅、氧化鉬、氧化錫、氧化鋁、氧化鎳、氧化銅或上述之組合,其後於該基板材料100之上利用蒸鍍,濺鍍,化學氣相,噴霧,浸泡等製程,或是其組合方式完成之第一材料110與第二材料120,其中第一材料110及第二材料120係可選自半導體材料、高分子材料或上述之組合,例如氧化鋅、氧化鉬、氧化錫、氧化鋁、氧化鎳、氧化銅或上述之組合。在本實施例中,基板材料100為n型矽基板。第一材料110為氧化鋅(ZnO),第二材料120為氧化鉬(MoO3)。第一材料110與第二材料120的製作方式為使用噴霧熱解法:各自以醋酸鋅以及氯化鉬水溶液為前驅物,在450℃下依序噴塗而成。其厚度依序為450nm與120nm。 Please refer to FIG. 1 , which is a schematic diagram of a two-layer photocatalytic material on a substrate. As shown, the structure includes a substrate material 100, wherein the substrate material 100 can be selected from the group consisting of ruthenium, aluminum, iron, nickel, zinc oxide, molybdenum oxide, tin oxide, aluminum oxide, nickel oxide, copper oxide, or a combination thereof. And then using the first material 110 and the second material 120 on the substrate material 100 by evaporation, sputtering, chemical vapor, spraying, immersion, or the like, wherein the first material 110 and the first material 110 The second material 120 can be selected from a semiconductor material, a polymeric material, or a combination thereof, such as zinc oxide, molybdenum oxide, tin oxide, aluminum oxide, nickel oxide, copper oxide, or a combination thereof. In the present embodiment, the substrate material 100 is an n-type germanium substrate. The first material 110 is zinc oxide (ZnO) and the second material 120 is molybdenum oxide (MoO 3 ). The first material 110 and the second material 120 are formed by a spray pyrolysis method in which zinc acetate and an aqueous solution of molybdenum chloride are used as precursors, and are sequentially sprayed at 450 ° C. The thickness is in the order of 450 nm and 120 nm.

第2圖為第一材料110與第二材料120的能帶圖。由於氧化鋅與氧化鉬各自的能隙(約)為3.3eV與3.0eV;而氧化鉬的電子親合力E(約)為6.4eV,高於氧化鋅的電子親合力E(約)4.3eV。因此造成了介面能帶之不連續。照光時,二區域均 產生電子-電洞,而能帶差異促使電子與電洞分別移動。最後第二材料120(氧化鉬)區域之電洞h(b)參與溶液中的氧化反應,而第一材料110(氧化鋅)區域中的電子e(a)參與溶液中的還原反應。在本實施例中,選定在紡織、印刷與製藥等工業上常使用的剛果紅染料為待清除之物質。使用前述之氧化鋅/氧化鉬結構薄膜為光催化材料,照射光源為20W的低壓汞燈,進行對濃度為50ppm的剛果紅水溶液光催化分解。反應過程中剛果紅的殘存濃度C與時間t關係如第3圖的改良前a所示:在經過80分鐘的反應後,溶液中的剛果紅濃度降至15ppm,顯示本材料對於水溶液中之剛果紅有相當之分解能力。 2 is an energy band diagram of the first material 110 and the second material 120. Since the energy gap (about) of zinc oxide and molybdenum oxide is 3.3 eV and 3.0 eV, respectively, the electron affinity E (about) of molybdenum oxide is 6.4 eV, which is higher than the electron affinity E (about) of 4.3 eV of zinc oxide. Therefore, the interface energy band is discontinuous. When lighting, both areas are An electron-hole is generated, and the difference in the band causes the electron and the hole to move separately. Finally, the hole h(b) of the second material 120 (molybdenum oxide) region participates in the oxidation reaction in the solution, and the electron e(a) in the first material 110 (zinc oxide) region participates in the reduction reaction in the solution. In the present embodiment, a Congo red dye which is commonly used in the textile, printing, and pharmaceutical industries is selected as the substance to be removed. The zinc oxide/molybdenum oxide structural film was used as a photocatalytic material, and a low-pressure mercury lamp having a light source of 20 W was irradiated to carry out photocatalytic decomposition of a Congo red aqueous solution having a concentration of 50 ppm. The relationship between the residual concentration C of Congo red and the time t during the reaction is shown in Figure 3, before the improvement a: after 80 minutes of reaction, the concentration of Congo red in the solution drops to 15 ppm, indicating that the material is in the Congo in aqueous solution. Red has considerable decomposing power.

在第1圖結構中,能否順利反應的因素相當多。在第2圖的示意圖上,在考量電子與電洞的移動時,除了電子e(a)與電洞h(b)能順利移動至表面外,若是二材料介面之電子e(b)與電洞h(a)無法順利複合,則電子e(b)的存在影響電洞h(b)移至右方表面的能力;而電洞h(a)的存在則影響電子e(a)移至左方表面的能力。因此,電子e(b)與電洞h(a)能否順利複合是影響此結構光催化能力的重要因子。 In the structure of Figure 1, there are quite a few factors for a smooth response. In the diagram of Fig. 2, in consideration of the movement of electrons and holes, in addition to the electrons e(a) and holes h(b) can smoothly move to the surface, if the two materials interface electronic e(b) and electricity If the hole h(a) cannot be recombined smoothly, the existence of the electron e(b) affects the ability of the hole h(b) to move to the right surface; and the presence of the hole h(a) affects the movement of the electron e(a) to The ability of the left surface. Therefore, whether the electron e(b) and the hole h(a) can be smoothly combined is an important factor affecting the photocatalytic ability of the structure.

為改善上述缺點,增進電子e(b)與電洞h(a)的順利複合,請配合參考第4圖,我們在第一材料110結構上方,再製作一層與第一材料110結構相同的材料,但為介面區域p型摻雜的結構層111,其中介面區域p型摻雜之材料係選自氮、砷、鉍、鐵、氯、溴、釕或上述之組合,如此可促使第2圖中 第一材料110端之價電帶進一步向上彎曲,而增進了電洞h(a)移動至介面的能力。在改善之實施例上,使用未摻雜之第一材料110氧化鋅層之厚度為360nm,氮摻雜氧化鋅(ZnO:N)為介面區域p型摻雜的結構層111,其厚度為90nm,p型濃度為2x1017cm-3。其餘結構與參數不變。 In order to improve the above disadvantages and improve the smooth recombination of the electrons e(b) and the holes h(a), please refer to FIG. 4, and above the first material 110 structure, a layer of the same material as the first material 110 is fabricated. , but is a p-doped structural layer 111 of the interface region, wherein the p-doped material of the interface region is selected from the group consisting of nitrogen, arsenic, antimony, iron, chlorine, bromine, antimony or a combination thereof, so that the second diagram can be promoted. The valence band at the end of the first material 110 is further bent upwards, which enhances the ability of the hole h(a) to move to the interface. In an improved embodiment, the undoped first material 110 has a zinc oxide layer having a thickness of 360 nm, and the nitrogen-doped zinc oxide (ZnO: N) is a p-doped structural layer 111 having an interfacial region having a thickness of 90 nm. The p-type concentration is 2x10 17 cm -3 . The rest of the structure and parameters are unchanged.

以此材料進行與前述相同之光催化步驟,剛果紅的正規化濃度C-時間t關係如第3圖的改良後b所示:在經過80分鐘的反應後,溶液中的剛果紅濃度降至11ppm,提升了對於水溶液中剛果紅的分解能力。 The same photocatalytic step as described above was carried out with this material, and the normalized concentration C-time t relationship of Congo red was as shown in the modified b of Fig. 3: after 80 minutes of reaction, the Congo red concentration in the solution was lowered. 11 ppm, which enhances the ability to decompose Congo red in aqueous solution.

上述之實施例僅為例示性說明本發明之特點及其功效,而非用於限制本發明之實質技術內容的範圍。據本發明之精神,亦可於電子親合力大的一方,施以n型摻雜為之:如第5圖所示。其介面區域n型摻雜的結構層121為與第二材料120相同之高電子親合力材料,於結構層121施以n型摻雜,其中介面區域n摻雜之材料係選自氮、砷、鉍、鐵、氯、溴、釕或上述之組合,則可增加第2圖之電子e(b)移動至介面能力,促成與電洞h(a)之反應,而造成與第4圖相同之效果。 The above-described embodiments are merely illustrative of the features and functions of the present invention, and are not intended to limit the scope of the technical scope of the present invention. According to the spirit of the present invention, n-type doping can also be applied to the side having a large electron affinity: as shown in Fig. 5. The n-doped structural layer 121 of the interface region is the same high electron affinity material as the second material 120, and the n-type doping is applied to the structural layer 121, wherein the n-doped material in the interface region is selected from nitrogen and arsenic. , ruthenium, iron, chlorine, bromine, ruthenium or a combination of the above, can increase the electron e(b) movement of Figure 2 to the interface capacity, and contribute to the reaction with the hole h(a), resulting in the same as Figure 4. The effect.

此外,請參閱第6圖,本發明可同時兼具介面區域p型摻雜結構層111及介面區域n型摻雜結構層121之結構材料。任何熟習此技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修飾與變化。因此,本發明之權利保護範圍,應如後述之申請專利範圍所列。 In addition, referring to FIG. 6, the present invention can simultaneously have the structural material of the interface region p-type doped structure layer 111 and the interface region n-type doped structure layer 121. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.

上述實施例之第一材料110、第二材料120與摻雜製作方式係可選自噴霧塗佈、熱蒸鍍、電子束蒸鍍、濺鍍、氣相沉積、液相沉積或上述之組合。 The first material 110, the second material 120 and the doping method of the above embodiment may be selected from the group consisting of spray coating, thermal evaporation, electron beam evaporation, sputtering, vapor deposition, liquid deposition, or a combination thereof.

綜上所述,本發明主要在製備異質結構薄膜的過程中,藉由介面區域的摻雜:於電子親合力低之材料進行區域p型摻雜,或/以及於電子親合力高之材料進行區域n型摻雜,製成具有適當摻雜之異質結構薄膜,與傳統無摻雜之異質結構相比,此具有適當介面摻雜之結構薄膜具有較高之光催化能力 In summary, the present invention is mainly used in the process of preparing a heterostructure film by doping the interface region: a region p-type doping with a material having a low electron affinity, or/and a material having a high electron affinity The region is n-doped to form a properly doped heterostructure film, which has a higher photocatalytic ability than a conventional undoped heterostructure.

上述之實施例僅為例示性說明本發明之特點及其功效,而非用於限制本發明之實質技術內容的範圍。任何熟習此技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修飾與變化。因此,本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above-described embodiments are merely illustrative of the features and functions of the present invention, and are not intended to limit the scope of the technical scope of the present invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.

Claims (4)

一種於基板上製成之具異質介面的光催化材料結構,係包括:一基板材料;一第一材料,為氧化鋅材料,並形成於該基板材料上;以及一第二材料,為氧化鉬材料,並形成於該第一材料上;其中該第一材料於接近該第二材料之材料端,進行一介面區域p型摻雜;或該第二材料於接近該第一材料之材料端,進行一介面區域n型摻雜。 A photocatalytic material structure having a hetero interface formed on a substrate, comprising: a substrate material; a first material being a zinc oxide material and formed on the substrate material; and a second material being molybdenum oxide a material formed on the first material; wherein the first material is p-doped in an interface region near a material end of the second material; or the second material is near a material end of the first material, An n-type doping of the interface region is performed. 如申請專利範圍第1項所述之光催化材料結構,其中該基板材料係選自矽、鋁、鐵、鎳、氧化鋅、氧化鉬、氧化錫、氧化鋁、氧化鎳、氧化銅或上述之組合。 The photocatalytic material structure according to claim 1, wherein the substrate material is selected from the group consisting of ruthenium, aluminum, iron, nickel, zinc oxide, molybdenum oxide, tin oxide, aluminum oxide, nickel oxide, copper oxide or the like. combination. 如申請專利範圍第1項所述之光催化材料結構,其中該介面區域p型摻雜及該介面區域n型摻雜之材料係選自氮、砷、鉍、鐵、氯、溴、釕或上述之組合。 The photocatalytic material structure according to claim 1, wherein the p-doping of the interface region and the n-doping of the interface region are selected from the group consisting of nitrogen, arsenic, antimony, iron, chlorine, bromine, antimony or Combination of the above. 如申請專利範圍第1項所述之光催化材料結構,其中該第一材料、該第二材料與摻雜製作方式係選自噴霧塗佈、熱蒸鍍、電子束蒸鍍、濺鍍、氣相沉積、液相沉積或上述之組合。 The photocatalytic material structure according to claim 1, wherein the first material, the second material and the doping method are selected from the group consisting of spray coating, thermal evaporation, electron beam evaporation, sputtering, and gas. Phase deposition, liquid deposition or a combination of the above.
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