TWI669221B - Transfer film and device having the same, and manufacturing method of decorated moding article - Google Patents
Transfer film and device having the same, and manufacturing method of decorated moding article Download PDFInfo
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- TWI669221B TWI669221B TW107142101A TW107142101A TWI669221B TW I669221 B TWI669221 B TW I669221B TW 107142101 A TW107142101 A TW 107142101A TW 107142101 A TW107142101 A TW 107142101A TW I669221 B TWI669221 B TW I669221B
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- Prior art keywords
- transfer film
- ink composition
- layer
- mica
- workpiece
- Prior art date
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- 238000012546 transfer Methods 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000010410 layer Substances 0.000 claims abstract description 62
- 239000011241 protective layer Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 230000000295 complement effect Effects 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 239000000203 mixture Substances 0.000 claims description 39
- 239000010445 mica Substances 0.000 claims description 33
- 229910052618 mica group Inorganic materials 0.000 claims description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 239000002042 Silver nanowire Substances 0.000 claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004918 carbon fiber reinforced polymer Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 238000001721 transfer moulding Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007666 vacuum forming Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 21
- 230000000694 effects Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 239000002932 luster Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 4
- 230000035597 cooling sensation Effects 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 229910000733 Li alloy Inorganic materials 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 239000001989 lithium alloy Substances 0.000 description 3
- GCICAPWZNUIIDV-UHFFFAOYSA-N lithium magnesium Chemical compound [Li].[Mg] GCICAPWZNUIIDV-UHFFFAOYSA-N 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000011257 shell material Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 239000004034 viscosity adjusting agent Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 235000010292 orthophenyl phenol Nutrition 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920000193 polymethacrylate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000005510 radiation hardening Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 description 1
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 1
- HYLLZXPMJRMUHH-UHFFFAOYSA-N 1-[2-(2-methoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOC HYLLZXPMJRMUHH-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- BNXZHVUCNYMNOS-UHFFFAOYSA-N 1-butylpyrrolidin-2-one Chemical compound CCCCN1CCCC1=O BNXZHVUCNYMNOS-UHFFFAOYSA-N 0.000 description 1
- FPSURBCYSCOZSE-UHFFFAOYSA-N 1-ethenoxybutan-1-ol Chemical compound CCCC(O)OC=C FPSURBCYSCOZSE-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- RJBIZCOYFBKBIM-UHFFFAOYSA-N 2-[2-(2-methoxyethoxy)ethoxy]propane Chemical compound COCCOCCOC(C)C RJBIZCOYFBKBIM-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- QSNQXZYQEIKDPU-UHFFFAOYSA-N [Li].[Fe] Chemical compound [Li].[Fe] QSNQXZYQEIKDPU-UHFFFAOYSA-N 0.000 description 1
- KVXNKFYSHAUJIA-UHFFFAOYSA-N acetic acid;ethoxyethane Chemical compound CC(O)=O.CCOCC KVXNKFYSHAUJIA-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229910052626 biotite Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000005025 cast polypropylene Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- YGANSGVIUGARFR-UHFFFAOYSA-N dipotassium dioxosilane oxo(oxoalumanyloxy)alumane oxygen(2-) Chemical compound [O--].[K+].[K+].O=[Si]=O.O=[Al]O[Al]=O YGANSGVIUGARFR-UHFFFAOYSA-N 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 229910052627 muscovite Inorganic materials 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- MBHINSULENHCMF-UHFFFAOYSA-N n,n-dimethylpropanamide Chemical compound CCC(=O)N(C)C MBHINSULENHCMF-UHFFFAOYSA-N 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 229910052628 phlogopite Inorganic materials 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005678 polyethylene based resin Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Decoration By Transfer Pictures (AREA)
Abstract
一種轉印膜片,其包括基材、保護層、非導電性的仿金屬油墨層以及接著層。基材具有第一表面與第二表面,且第一表面具有第一紋理。保護層設置於基材的第一表面上,保護層具有第三表面與第四表面,其中第三表面與第一表面接觸,且第三表面具有與第一紋理互補的第二紋理。非導電性的仿金屬油墨層設置於保護層的第四表面上,其中非導電性的仿金屬油墨層具有第五表面與第六表面,且第五表面與第四表面接觸。接著層設置於非導電性的仿金屬油墨層的第六表面上。A transfer film comprising a substrate, a protective layer, a non-conductive, metallic ink layer, and an adhesive layer. The substrate has a first surface and a second surface, and the first surface has a first texture. The protective layer is disposed on the first surface of the substrate, the protective layer has a third surface and a fourth surface, wherein the third surface is in contact with the first surface, and the third surface has a second texture complementary to the first texture. A non-conductive, metallic ink layer is disposed on the fourth surface of the protective layer, wherein the non-conductive metallic ink layer has a fifth surface and a sixth surface, and the fifth surface is in contact with the fourth surface. The layer is then disposed on the sixth surface of the non-conductive, metallic ink layer.
Description
本發明是有關於一種轉印膜片及具有轉印膜片的裝置、加飾成型品的製造方法,且特別是有關於一種具有金屬質感的轉印膜片及具有轉印膜片的裝置、加飾成型品的製造方法。 The present invention relates to a transfer film, a device having a transfer film, and a method of manufacturing a decorative molded article, and more particularly to a transfer film having a metallic texture and a device having a transfer film. A method of manufacturing a molded article.
現今,為了增進電子裝置的美觀,通常會在電子裝置上設置具有金屬質感的外殼。一般而言,若欲在商品的外殼外觀上表現出金屬質感,通常是以蒸鍍及濺鍍方式將金屬鍍到薄膜上包覆。但是,這樣的薄膜因金屬層會產生屏蔽效應,故應用於行動電話上時,則會限制天線的設計。又,這樣的薄膜也有金屬輝度過高而視覺效果不佳以及金屬層產生靜電吸附碎片導致良率不佳的疑慮。另一方面,若是以利用印刷、噴漆、噴墨或是熱轉印的方式將仿金屬的原料噴塗或印刷到局部的外殼上,則又因為材料本質的限制,而無法表現出真實的金屬光澤及金屬冰涼感。 Nowadays, in order to enhance the aesthetic appearance of an electronic device, a metal-coated outer casing is usually provided on the electronic device. In general, if a metal texture is to be exhibited on the outer appearance of the outer casing of the product, the metal is usually coated on the film by vapor deposition and sputtering. However, such a film has a shielding effect due to the metal layer, so when applied to a mobile phone, the design of the antenna is limited. Moreover, such a film also has a problem that the metal luminance is too high, the visual effect is poor, and the metal layer generates electrostatic adsorption debris, resulting in poor yield. On the other hand, if the metal-like raw materials are sprayed or printed onto a partial outer casing by means of printing, painting, inkjet or thermal transfer, the true metallic luster cannot be expressed due to the limitation of the nature of the material. And the metal is cold.
本發明提供一種轉印膜片及具有轉印膜片的裝置、加飾成型品的製造方法,其中轉印膜片可表現出視覺效果良好的金屬光澤及金屬冰涼感,並且同時改善了金屬的輝度過高、產生屏蔽效應的問題以及金屬質感不足的問題。另外,藉由本發明的轉印膜片可以有效降低成本並且表現出優異的良率。 The present invention provides a transfer film sheet, a device having a transfer film sheet, and a method for producing a decorative molded article, wherein the transfer film sheet can exhibit a metallic gloss and a metal cooling feeling with good visual effects, and at the same time, improve the metal The problem of excessive brightness, shielding effect, and insufficient metal texture. In addition, the transfer film of the present invention can effectively reduce the cost and exhibit excellent yield.
本發明提供一種轉印膜片,其包括基材、保護層、非導電性的仿金屬油墨層以及接著層。基材具有彼此相對的第一表面與第二表面,且第一表面具有第一紋理。保護層設置於基材的第一表面上,保護層具有彼此相對的第三表面與第四表面,其中第三表面與第一表面接觸,且第三表面具有一與第一紋理互補的第二紋理。非導電性的仿金屬油墨層設置於保護層的第四表面上,其中非導電性的仿金屬油墨層具有彼此相對的第五表面與第六表面,且第五表面與第四表面接觸。接著層設置於非導電性的仿金屬油墨層的第六表面上。 The present invention provides a transfer film comprising a substrate, a protective layer, a non-conductive, metallic ink layer, and an adhesive layer. The substrate has a first surface and a second surface opposite each other, and the first surface has a first texture. The protective layer is disposed on the first surface of the substrate, the protective layer has a third surface and a fourth surface opposite to each other, wherein the third surface is in contact with the first surface, and the third surface has a second surface complementary to the first texture Texture. The non-conductive metal-like ink layer is disposed on the fourth surface of the protective layer, wherein the non-conductive metal-like ink layer has fifth and sixth surfaces opposite to each other, and the fifth surface is in contact with the fourth surface. The layer is then disposed on the sixth surface of the non-conductive, metallic ink layer.
在本發明的一實施例中,上述的非導電性的仿金屬油墨層是由油墨組成物形成。油墨組成物包括雲母、色漿(mill base)及溶劑。 In an embodiment of the invention, the non-conductive, metal-like ink layer is formed of an ink composition. The ink composition includes mica, a mill base, and a solvent.
在本發明的一實施例中,上述的油墨組成物中,以油墨組成物為100wt%計,雲母的含量為介於約3wt%至約15wt%之間。 In an embodiment of the invention, the ink composition has a mica content of from about 3 wt% to about 15 wt%, based on 100 wt% of the ink composition.
在本發明的一實施例中,上述的油墨組成物更包括銀奈 米線。 In an embodiment of the invention, the ink composition further comprises Yinnai Rice noodles.
在本發明的一實施例中,上述的油墨組成物中,以油墨組成物為100wt%計,銀奈米線與雲母的總含量為3wt%至18wt%。 In an embodiment of the invention, the ink composition has a total content of silver nanowires and mica of from 3 wt% to 18 wt%, based on 100 wt% of the ink composition.
在本發明的一實施例中,上述的油墨組成物更包括導電度不大於鎳的金屬。 In an embodiment of the invention, the ink composition further includes a metal having a conductivity of not more than nickel.
在本發明的一實施例中,上述的油墨組成物中,以油墨組成物為100wt%計,銀奈米線、雲母以及導電度不大於鎳的金屬的總含量為3wt%至18wt%。 In an embodiment of the invention, in the ink composition, the total content of the silver nanowire, mica, and the metal having a conductivity of not more than nickel is from 3 wt% to 18 wt%, based on 100 wt% of the ink composition.
在本發明的一實施例中,上述的油墨組成物中,以油墨組成物為100wt%計,銀奈米線、雲母、色漿以及導電度不大於的金屬的總含量為10wt%至30wt%。 In an embodiment of the present invention, in the ink composition, the total content of the silver nanowire, the mica, the color paste, and the metal having a conductivity of not more than 10% by weight to 30% by weight based on 100% by weight of the ink composition. .
在本發明的一實施例中,上述的雲母為無機系雲母。 In an embodiment of the invention, the mica is inorganic mica.
本發明另提供一種加飾成型品的製造方法,其包括:將工件及上述轉印膜片放置於一治具中;進行高壓轉印成型製程,以使轉印膜片經由接著層而黏著於工件的表面上;去除轉印膜片的基材;以及對保護層進行固化處理,以形成硬化層。 The present invention further provides a method for manufacturing a decorative molded article, comprising: placing a workpiece and the transfer film in a jig; performing a high-pressure transfer molding process to adhere the transfer film to the adhesive layer via the adhesive layer On the surface of the workpiece; removing the substrate of the transfer film; and curing the protective layer to form a hardened layer.
在本發明的一實施例中,上述的高壓轉印成型製程包括:使轉印膜片與工件接觸,並進行加熱軟化步驟;對轉印膜片及工件進行加壓步驟;以及對轉印膜片及工件進行高壓真空成型步驟,使轉印膜片轉印至工件上。 In an embodiment of the invention, the high-pressure transfer molding process includes: contacting the transfer film with the workpiece, and performing a heating and softening step; performing a pressing step on the transfer film and the workpiece; and transferring the film The sheet and the workpiece are subjected to a high pressure vacuum forming step to transfer the transfer film to the workpiece.
在本發明的一實施例中,上述的工件為塑膠、玻璃、鋁、鎂合金或碳纖維增強塑料。 In an embodiment of the invention, the workpiece is plastic, glass, aluminum, magnesium alloy or carbon fiber reinforced plastic.
本發明還提供一種具有轉印膜片的裝置,其包括本體、具有內表面及外表面的外殼、以及上述轉印膜片,其中外殼經由內表面包覆本體,並且轉印膜片的接著層貼合於外殼的外表面。 The present invention also provides an apparatus having a transfer film comprising a body, an outer casing having an inner surface and an outer surface, and the transfer film, wherein the outer casing covers the body via the inner surface, and the adhesive layer is attached to the adhesive layer Fits to the outer surface of the outer casing.
在本發明的一實施例中,上述的外殼為塑膠、玻璃、鋁、鎂合金或碳纖維增強塑料。 In an embodiment of the invention, the outer casing is plastic, glass, aluminum, magnesium alloy or carbon fiber reinforced plastic.
在本發明的一實施例中,上述的具有轉印膜片的裝置為行動電話、筆記型電腦或平板電腦。 In an embodiment of the invention, the device having the transfer film described above is a mobile phone, a notebook computer or a tablet computer.
基於上述,本發明的轉印膜片藉由包含一層非導電性的仿金屬油墨層,該非導電性的仿金屬油墨層含有雲母及低導電性或不具導電性的金屬中的至少一者,因此可表現出視覺效果良好的金屬光澤及金屬冰涼感,卻又不會有屏蔽效應或是金屬質感不足的問題。另外,本發明的轉印膜片中,形成有非導電性的仿金屬油墨層,該非導電性的仿金屬油墨層由於金屬含量低,不會產生靜電而吸附碎片,因此轉印膜片的製程可表現出優異的良率。又,本發明的轉印膜片形成有單一層非導電性的仿金屬油墨層,即可表現出金屬光澤及金屬冰涼感,而無需以濺鍍方式形成金屬層,藉此可以有效降低成本並且降低材料的質量達到輕量化的效果。 Based on the above, the transfer film of the present invention comprises a non-conductive metal-like ink layer containing at least one of mica and a low-conductivity or non-conductive metal. It can show a good metallic luster and a cool metal sensation without the shielding effect or the lack of metal texture. Further, in the transfer film of the present invention, a non-conductive metal-like ink layer is formed, and the non-conductive metal-like ink layer has a low metal content and does not generate static electricity to adsorb debris, so that the transfer film is processed. Can show excellent yield. Moreover, the transfer film of the present invention is formed with a single layer of non-conductive metal-like ink layer, which can exhibit metallic luster and metal cooling sensation without forming a metal layer by sputtering, thereby effectively reducing cost and Reduce the quality of the material to achieve a lightweight effect.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.
10、130‧‧‧轉印膜片 10,130‧‧‧Transfer film
10a‧‧‧膜片 10a‧‧‧ diaphragm
11‧‧‧基材 11‧‧‧Substrate
11a‧‧‧第一表面 11a‧‧‧ first surface
11b‧‧‧第二表面 11b‧‧‧ second surface
11c‧‧‧第一紋理 11c‧‧‧ first texture
12‧‧‧保護層 12‧‧‧Protective layer
12a‧‧‧第三表面 12a‧‧‧ third surface
12b‧‧‧第四表面 12b‧‧‧ fourth surface
12c‧‧‧第二紋理 12c‧‧‧second texture
13‧‧‧仿金屬油墨層 13‧‧‧Metal metal ink layer
13a‧‧‧第五表面 13a‧‧‧ fifth surface
13b‧‧‧第六表面 13b‧‧‧ sixth surface
14‧‧‧接著層 14‧‧‧Next layer
20‧‧‧工件 20‧‧‧Workpiece
20a‧‧‧表面 20a‧‧‧ surface
22‧‧‧硬化層 22‧‧‧ hardened layer
30‧‧‧加飾成型品 30‧‧‧Adding molded products
100‧‧‧具有轉印膜片的裝置 100‧‧‧Device with transfer film
110‧‧‧本體 110‧‧‧ body
120‧‧‧外殼 120‧‧‧Shell
120a‧‧‧內表面 120a‧‧‧ inner surface
120b‧‧‧外表面 120b‧‧‧ outer surface
圖1至圖3是本發明一實施例的轉印膜片的製造流程的剖面意圖。 1 to 3 are cross-sectional views showing a manufacturing flow of a transfer film according to an embodiment of the present invention.
圖4是本發明一實施例的加飾成型品的剖面意圖。 Fig. 4 is a cross-sectional view of a decorative molded article according to an embodiment of the present invention.
圖5是本發明一實施例的具有轉印膜片的裝置的剖面意圖。 Figure 5 is a cross-sectional view of an apparatus having a transfer film according to an embodiment of the present invention.
圖1至圖3是本發明一實施例的轉印膜片的製造流程的剖面意圖。特別說明的是,為求清楚表示與便於說明,對圖1至圖3中的各分層的厚度或比例被適度地放大或縮小,並不代表各分層的實際厚度或比例。 1 to 3 are cross-sectional views showing a manufacturing flow of a transfer film according to an embodiment of the present invention. In particular, the thickness or proportion of each layer in Figures 1 to 3 is moderately enlarged or reduced for clarity and ease of illustration, and does not represent the actual thickness or proportion of each layer.
請先參照圖3,圖3表示一實施例的轉印膜片的剖面意圖。 Referring first to Fig. 3, Fig. 3 shows a cross-sectional view of a transfer film of an embodiment.
轉印膜片10包括基材11、保護層12、仿金屬油墨層13(以下將「非導電性的仿金屬油墨層」簡稱為「仿金屬油墨層」)以及接著層14。基材11具有彼此相對的第一表面11a與第二表面11b,且第一表面11a具有第一紋理11c。更進一步來說,保護層12設置於基材11的第一表面11a上。保護層12具有彼此相對的第三表面12a與第四表面12b,其中第三表面12a與第一表面11a接觸,且第三表面12a具有與第一紋理11c互補的第二紋理12c。仿金屬油墨層13設置於保護層12的第四表面12b上。仿金屬油 墨層13具有彼此相對的第五表面13a與第六表面13b。第五表面13a與第四表面12b接觸。接著層14設置於仿金屬油墨層13的第六表面13b上。 The transfer film 10 includes a substrate 11, a protective layer 12, a metal-like ink layer 13 (hereinafter, a "non-conductive metal-like ink layer" is simply referred to as a "mim-like metal ink layer"), and an adhesive layer 14. The substrate 11 has a first surface 11a and a second surface 11b opposed to each other, and the first surface 11a has a first texture 11c. Further, the protective layer 12 is disposed on the first surface 11a of the substrate 11. The protective layer 12 has third and fourth surfaces 12a, 12b opposite to each other, wherein the third surface 12a is in contact with the first surface 11a, and the third surface 12a has a second texture 12c that is complementary to the first texture 11c. The imitation metal ink layer 13 is disposed on the fourth surface 12b of the protective layer 12. Imitation metal oil The ink layer 13 has fifth and third surfaces 13a and 13b opposed to each other. The fifth surface 13a is in contact with the fourth surface 12b. Next, the layer 14 is disposed on the sixth surface 13b of the imitation metal ink layer 13.
以下將說明上述實施例的轉印膜片10的製造流程。請參照圖1,首先,基材11具有彼此相對的第一表面11a與第二表面11b,且第一表面11a具有第一紋理11c。詳言之,基材11作為離型層。基材11例如是聚丙烯酸樹脂(acrylic resin)、聚酯樹脂(polyester)、聚苯乙烯樹脂(polystyrene,PS)、聚氯乙烯樹脂(polyvinyl chloride,PVC)、聚乙烯樹脂(polyethylene,PE)、聚丙烯樹脂(polypropylene,PP)、聚烯烴樹脂(polyolefin,PO)、聚碳酸酯樹脂(polycarbonate,PC)、聚氨酯樹脂(polyurethane,PU)、聚鄰苯基苯酚(O-phenylphenol,OPP)、聚乙烯醇(Polyvinyl Alcohol,PVA)、流延聚丙烯(Cast Polypropylene,CPP)等樹脂膜片;或紙類等纖維素膜片。透過印刷、壓印、刻劃或刷磨等方式於基材11的其中一平坦面上形成凹凸紋路結構。具體來說,例如是透過具有紋理的滾輪或模具對基材11進行壓制,以在基材11上形成具有第一紋理11c的第一表面11a。基材11的厚度可為40μm~60μm。 The manufacturing flow of the transfer film 10 of the above embodiment will be described below. Referring to FIG. 1, first, the substrate 11 has a first surface 11a and a second surface 11b opposed to each other, and the first surface 11a has a first texture 11c. In detail, the substrate 11 acts as a release layer. The substrate 11 is, for example, an acrylic resin, a polyester, a polystyrene (PS), a polyvinyl chloride (PVC), a polyethylene (PE), or a polyethylene resin (PE). Polypropylene (PP), Polyolefin (PO), Polycarbonate (PC), Polyurethane (PU), O-phenylphenol (OPP), Poly A resin film such as polyvinyl alcohol (PVA) or cast polypropylene (CPP); or a cellulose film such as paper. A concave-convex texture structure is formed on one of the flat surfaces of the substrate 11 by printing, imprinting, scribing or brushing. Specifically, for example, the substrate 11 is pressed through a textured roller or die to form a first surface 11a having a first texture 11c on the substrate 11. The substrate 11 may have a thickness of 40 μm to 60 μm .
接著,於第一表面11a上形成保護層12。保護層12的材質沒有特別的限制,其可包括熱硬化型樹脂、輻射硬化型樹脂以及電子束硬化型樹脂。熱硬化型樹脂可以是丙烯酸類樹脂(acrylic-based resin)、丙烯酸醇類樹脂(acrylic polyol based resin)、 乙烯基類樹脂(vinyl-based resin)、聚酯類樹脂(polyester-based resin)、環氧類樹脂(epoxy-based resin)或聚氨酯類樹脂(polyurethane-based resin)。輻射硬化型樹脂與電子束硬化型樹脂可由單體與寡聚體所形成,其中單體可以是具有單官能基、雙官能基或多官能基的甲基丙烯酸酯類(methacrylate-based)、丙烯酸酯類(acrylate-based)、乙烯基類(vinyl-based)、乙烯基醚類(vinyl-ether based)或環氧類(epoxy-based)。寡聚體可以是不飽和聚酯類(unsaturated polyester-based)、環氧丙烯酸酯類(epoxy acrylate-based),聚氨酯丙烯酸酯類(polyurethane acrylate-based)、聚酯丙烯酸酯類(polyester acrylate-based)、聚醚丙烯酸酯類(polyether acrylate-based)、丙烯酸酯化聚丙烯酸樹脂類(acrylated acrylic oligomer)或環氧樹脂類(epoxy-based resin)。舉例來說,可採用上述材質的至少任一種所製成的膠體塗佈於第一表面11a上,並使前述膠體經加熱或照光固化以製作得到保護層12。保護層12的厚度可為16μm~22μm。 Next, a protective layer 12 is formed on the first surface 11a. The material of the protective layer 12 is not particularly limited, and may include a thermosetting resin, a radiation hardening resin, and an electron beam curing resin. The thermosetting resin may be an acrylic-based resin, an acrylic polyol based resin, a vinyl-based resin, a polyester-based resin, or a ring. An epoxy-based resin or a polyurethane-based resin. The radiation hardening type resin and the electron beam hardening type resin may be formed of a monomer and an oligomer, wherein the monomer may be a methacrylate-based, acrylic acid having a monofunctional, difunctional or polyfunctional group. Acrylate-based, vinyl-based, vinyl-ether based or epoxy-based. The oligomer may be an unsaturated polyester-based, an epoxy acrylate-based, a polyurethane acrylate-based, or a polyester acrylate-based. ), polyether acrylate-based, acrylated acrylic oligomer or epoxy-based resin. For example, a colloid made of at least one of the above materials may be applied to the first surface 11a, and the colloid may be heated or cured to form the protective layer 12. The protective layer 12 may have a thickness of 16 μm to 22 μm .
保護層12具有彼此相對的第三表面12a與第四表面12b,其中第三表面12a與第一表面11a接觸以形成與第一紋理11c互補的第二紋理12c。如圖1所示,保護層12的第三表面12a覆蓋於基材11的第一表面11a上。在第二紋理12c直接形成於保護層12的情況下,能夠減少製程的工時。詳言之,未進行立體紋路加工的第四表面12b為一平坦面(如圖1所示)。 The protective layer 12 has third and fourth surfaces 12a, 12b opposite to each other, wherein the third surface 12a is in contact with the first surface 11a to form a second texture 12c that is complementary to the first texture 11c. As shown in FIG. 1, the third surface 12a of the protective layer 12 covers the first surface 11a of the substrate 11. In the case where the second texture 12c is directly formed on the protective layer 12, the man-hour of the process can be reduced. In detail, the fourth surface 12b which is not subjected to the three-dimensional grain processing is a flat surface (as shown in FIG. 1).
接著,請參考圖2,於保護層12的第四表面12b上形成 仿金屬油墨層13。仿金屬油墨層13具有彼此相對的第五表面13a與第六表面13b。仿金屬油墨層13的第五表面13a與保護層12的第四表面12b接觸。如圖2所示,仿金屬油墨層13的第五表面13a覆蓋於保護層12的第四表面12b上。仿金屬油墨層13是透過噴墨或印刷等方式將油墨組成物形成於保護層12的第四表面12b上來形成。仿金屬油墨層13的厚度可為7μm~12μm。 Next, referring to FIG. 2, a metal-like ink layer 13 is formed on the fourth surface 12b of the protective layer 12. The imitation metal ink layer 13 has fifth and third surfaces 13a, 13b opposed to each other. The fifth surface 13a of the imitation metal ink layer 13 is in contact with the fourth surface 12b of the protective layer 12. As shown in FIG. 2, the fifth surface 13a of the metallic ink layer 13 is overlaid on the fourth surface 12b of the protective layer 12. The imitation metal ink layer 13 is formed by forming an ink composition on the fourth surface 12b of the protective layer 12 by inkjet or printing. The metal-like ink layer 13 may have a thickness of 7 μm to 12 μm .
油墨組成物可包括雲母、色漿及溶劑。 The ink composition may include mica, color paste, and a solvent.
雲母可增加輝度卻又不具有導電性,因此不會有屏蔽效應以及吸附碎片導致良率降低的問題。雲母可為有機系雲母、無機系雲母、或其組合。就輝度及透明感來說,較佳為無機系雲母。無機系雲母例如是黑雲母、金雲母、白雲母、鋰雲母、鐵鋰雲母、或其組合。在油墨組成物中,以油墨組成物為100wt%計,雲母的含量介於約3wt%至約15wt%之間。 Mica can increase the brightness but not the conductivity, so there is no shielding effect and the problem of the yield reduction caused by the adsorption of debris. The mica may be organic mica, inorganic mica, or a combination thereof. In terms of luminance and transparency, inorganic mica is preferred. The inorganic mica is, for example, biotite, phlogopite, muscovite, lithium mica, iron lithium mica, or a combination thereof. In the ink composition, the mica content is between about 3 wt% and about 15 wt%, based on 100 wt% of the ink composition.
色漿沒有特別的限制,可依照需求的顏色適當地選擇。在油墨組成物中,以油墨組成物為100wt%計,色漿的含量介於約5wt%至約25wt%之間。 The color paste is not particularly limited and may be appropriately selected in accordance with the desired color. In the ink composition, the content of the paste is between about 5 wt% and about 25 wt%, based on 100 wt% of the ink composition.
溶劑沒有特別的限制,只要可作為分散介質將雲母、後述銀奈米線以及後述金屬分散均勻,且不使雲母、後述銀奈米線以及後述金屬發生聚集即可。另外,溶劑較佳為在形成仿金屬油墨層13時表現出揮發性即可。溶劑例如是乳酸乙酯、乙醇、乙二醇、丙二醇、甘油、乙二醇單甲醚、乙二醇單丁醚、乙二醇單苯醚、乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、乙二醇二甲醚、 丙二醇單甲醚、丙二醇單乙醚、丙二醇單丁醚、丙二醇單甲醚乙酸酯、丙二醇二甲醚、二乙二醇單甲醚、二乙二醇單丁醚、二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇異丙基甲醚、二乙二醇丁基甲醚、二乙二醇二丁醚、二乙二醇甲基乙基醚、二乙二醇單乙醚乙酸酯、二丙二醇二甲醚、二丙二醇單甲醚、三乙二醇二甲醚、三乙二醇單甲醚、三乙二醇二乙烯基醚、三丙二醇單甲醚、三丙二醇二甲醚、伸丁二醇單乙烯基醚、3-甲氧基丙酸甲酯、3-乙氧基丙酸乙酯、環己酮、1,3-二氧雜環戊烷、1,4-二噁烷、大茴香醚、苯甲酸甲酯、苯甲酸乙酯、1-乙烯基-2-吡咯啶酮、1-丁基-2-吡咯啶酮、1-乙基-2-吡咯啶酮、1-(2-羥乙基)-2-吡咯啶酮、2-吡咯啶酮、N-甲基-2-吡咯啶酮、1-乙醯基-2-吡咯啶酮、N,N-二乙基乙醯胺、N,N-二甲基丙醯胺、N-甲基-ε-己內醯胺、1,3-二甲基-2-咪唑啶酮、γ-丁內酯、或其組合。以油墨組成物為100wt%計,溶劑的含量可為45wt%至60wt%。 The solvent is not particularly limited as long as the mica, the silver nanowire described later, and the metal described below are uniformly dispersed as a dispersion medium, and mica, a silver nanowire to be described later, and a metal to be described later are not aggregated. Further, the solvent preferably exhibits volatility when the metal-like ink layer 13 is formed. The solvent is, for example, ethyl lactate, ethanol, ethylene glycol, propylene glycol, glycerin, ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, ethylene glycol monophenyl ether, ethylene glycol monomethyl ether acetate, ethylene Alcohol monoethyl ether acetate, ethylene glycol dimethyl ether, Propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, propylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether , diethylene glycol diethyl ether, diethylene glycol isopropyl methyl ether, diethylene glycol butyl methyl ether, diethylene glycol dibutyl ether, diethylene glycol methyl ethyl ether, diethylene glycol monoethyl ether Acid ester, dipropylene glycol dimethyl ether, dipropylene glycol monomethyl ether, triethylene glycol dimethyl ether, triethylene glycol monomethyl ether, triethylene glycol divinyl ether, tripropylene glycol monomethyl ether, tripropylene glycol Ether, butanediol monovinyl ether, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, cyclohexanone, 1,3-dioxolane, 1,4- Dioxane, anisole, methyl benzoate, ethyl benzoate, 1-vinyl-2-pyrrolidone, 1-butyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone , 1-(2-hydroxyethyl)-2-pyrrolidone, 2-pyrrolidone, N-methyl-2-pyrrolidone, 1-ethenyl-2-pyrrolidone, N,N- Diethylacetamide, N,N-dimethylpropanamide, N-methyl-ε-caprolactam, 1,3-dimethyl-2-imidazole Ketones, [gamma] -butyrolactone, or a combination thereof. The solvent may be included in an amount of from 45 to 60% by weight based on 100% by weight of the ink composition.
油墨組成物較佳為更包括銀奈米線。銀奈米線及雲母都具有適當的輝度,可以使轉印膜片表現出視覺效果良好的金屬光澤及金屬冰涼感。 Preferably, the ink composition further comprises a silver nanowire. Both the silver nanowire and the mica have an appropriate brightness, which allows the transfer film to exhibit a metallic luster and a metallic cooling sensation with good visual effects.
銀奈米線例如是平均短軸長度為1nm~150nm、平均長軸長度為1μm~100μm的銀奈米線。以油墨組成物為100wt%計,銀奈米線及雲母的總含量可為3wt%至18wt%。更進一步來說,以油墨組成物為100wt%計,銀奈米線的含量可為0.05wt%至3wt%,並且雲母的含量可為3wt%至15wt%。當銀奈米線的濃度較低時, 可以增加轉印膜片適當的輝度,且不會使轉印膜片產生屏蔽效應;當銀奈米線濃度過高時,會產生屏蔽效應,不利產品通過天線測試,並且產生靜電而吸附碎片導致良率降低。 The silver nanowire is, for example, a silver nanowire having an average minor axis length of 1 nm to 150 nm and an average major axis length of 1 μm to 100 μm. The total content of the silver nanowires and mica may be from 3 wt% to 18 wt%, based on 100 wt% of the ink composition. Further, the content of the silver nanowire may be 0.05% by weight to 3% by weight based on 100% by weight of the ink composition, and the content of mica may be 3% by weight to 15% by weight. When the concentration of the silver nanowire is low, The transfer film can be increased in proper brightness without causing a shielding effect on the transfer film; when the silver nanowire concentration is too high, a shielding effect is generated, which is unfavorable for the product to pass the antenna test, and static electricity is generated to adsorb the debris. Yield is reduced.
油墨組成物可更包括低導電性或不具導電性的金屬。所謂的「低導電性或不具導電性的金屬」為導電度不大於鎳的金屬。該金屬例如是鎳、錫、或其組合。以油墨組成物為100wt%計,銀奈米線、雲母、色漿以及導電度不大於鎳的金屬的總含量可為10wt%至30wt%。另外,以油墨組成物為100wt%計,銀奈米線、雲母以及導電度不大於鎳的金屬的總含量可為3wt%至18wt%。當銀奈米線、雲母以及導電度不大於鎳的金屬的總含量過少時,會有金屬質感不佳的問題。當銀奈米線及金屬的含量過多時,會有屏蔽效應的問題。 The ink composition may further include a metal that is low in conductivity or non-conductive. The so-called "low conductivity or non-conductive metal" is a metal having a conductivity of not more than nickel. The metal is, for example, nickel, tin, or a combination thereof. The total content of the silver nanowire, mica, color paste, and metal having a conductivity of not more than nickel may be 10% by weight to 30% by weight based on 100% by weight of the ink composition. Further, the total content of the silver nanowire, mica, and the metal having a conductivity of not more than nickel may be from 3 wt% to 18 wt%, based on 100% by weight of the ink composition. When the silver nanowire, mica, and the total content of the metal having a conductivity of not more than nickel are too small, there is a problem that the metal texture is not good. When the content of silver nanowires and metals is too large, there is a problem of shielding effect.
油墨組成物可更包括添加劑及樹脂中的至少其中一者。 The ink composition may further include at least one of an additive and a resin.
樹脂沒有特別的限制,只要可便於如噴墨或印刷等後續製程的操作即可。以油墨組成物為100wt%計,樹脂的含量可為25wt%至40wt%。 The resin is not particularly limited as long as the operation of a subsequent process such as inkjet or printing can be facilitated. The content of the resin may be from 25% by weight to 40% by weight based on 100% by weight of the ink composition.
添加劑例如是黏度調整劑、黏合劑、或其組合。以油墨組成物為100wt%計,添加劑的含量可為3wt%至9wt%。 The additive is, for example, a viscosity modifier, a binder, or a combination thereof. The content of the additive may be from 3% by weight to 9% by weight based on 100% by weight of the ink composition.
黏度調整劑沒有特別的限制,只要可便於如噴墨或印刷等後續製程的操作即可。黏度調整劑例如可列舉:羧基甲基纖維素、甲基纖維素、羥基丙基纖維素等纖維素系聚合物以及它們的銨鹽;聚(甲基)丙烯酸鈉等聚(甲基)丙烯酸鹽;聚乙烯醇、聚環氧 乙烷、聚乙烯吡咯啶酮、丙烯酸或者丙烯酸鹽與乙烯醇的共聚物、順丁烯二酸酐、順丁烯二酸或者反丁烯二酸與乙烯醇的共聚物、改質聚乙烯醇、改質聚丙烯酸、聚乙二醇、聚羧酸。 The viscosity modifier is not particularly limited as long as it can be easily handled by a subsequent process such as inkjet or printing. Examples of the viscosity modifier include cellulose polymers such as carboxymethylcellulose, methylcellulose, and hydroxypropylcellulose, and ammonium salts thereof; and poly(meth)acrylates such as sodium poly(meth)acrylate. ; polyvinyl alcohol, polyepoxy Ethane, polyvinylpyrrolidone, acrylic acid or a copolymer of acrylate and vinyl alcohol, maleic anhydride, maleic acid or a copolymer of fumaric acid and vinyl alcohol, modified polyvinyl alcohol, Modified polyacrylic acid, polyethylene glycol, polycarboxylic acid.
黏合劑沒有特別的限制,只要可混合於油墨組成物中,並表現出適度的接著性者即可。 The binder is not particularly limited as long as it can be mixed in the ink composition and exhibits a moderate adhesion.
最後,請再次參照請參照圖3,於仿金屬油墨層13的第六表面13b上形成接著層14,以形成轉印膜片10。接著層14的材料例如為丙烯酸類樹脂(acrylic-based resin)、氨酯類樹脂(urethane-based resin)、乙烯基類樹脂(vinyl-based resin)、聚酯類樹脂(polyester-based resin)、聚苯乙烯類樹脂(polystyrene-based resin)、聚丙烯類樹脂(polypropylene-based resin)、聚乙烯類樹脂(polyethylene-based resin)或聚碳酸酯類樹脂(polycarbonate-based resin),配置用以強化轉印膜片10的黏著性。接著層14的厚度可為16μm~22μm。整體來說,轉印膜片10的厚度可為79μm~116μm。另外,在一較佳實施例中,保護層12、仿金屬油墨層13以及接著層14的總厚度可為40μm~50μm,並且這三者的厚度比為2:1:2。 Finally, referring again to FIG. 3, an adhesive layer 14 is formed on the sixth surface 13b of the imitation metal ink layer 13 to form the transfer film 10. The material of the layer 14 is, for example, an acrylic-based resin, a urethane-based resin, a vinyl-based resin, a polyester-based resin, Polystyrene-based resin, polypropylene-based resin, polyethylene-based resin or polycarbonate-based resin The adhesiveness of the transfer film 10 is obtained. Layer 14 can then have a thickness of from 16 μm to 22 μm . Overall, the transfer film 10 may have a thickness of 79 μm to 116 μm . In addition, in a preferred embodiment, the total thickness of the protective layer 12, the metal-like ink layer 13, and the subsequent layer 14 may be 40 μm to 50 μm , and the thickness ratio of the three is 2:1:2.
圖4是本發明一實施例的加飾成型品30的剖面意圖。特別說明的是,為求清楚表示與便於說明,圖4中的各分層的厚度或比例被適度地放大或縮小,並不代表各分層的實際厚度或比例。請參考圖4,加飾成型品30包括具有表面20a的工件20及膜片10a。膜片10a配置於工件20的表面20a上,並且膜片10a的接著 層14與工件20的表面20a接觸。膜片10a為自轉印膜片10中去除基材11且保護層12經固化處理形成硬化層22所形成的片材。 Fig. 4 is a cross-sectional view of a decorative molded article 30 according to an embodiment of the present invention. In particular, the thickness or proportion of each layer in Figure 4 is moderately enlarged or reduced for clarity and ease of illustration and does not represent the actual thickness or proportion of each layer. Referring to FIG. 4, the decorative molded article 30 includes a workpiece 20 having a surface 20a and a diaphragm 10a. The diaphragm 10a is disposed on the surface 20a of the workpiece 20, and the film 10a is continued Layer 14 is in contact with surface 20a of workpiece 20. The diaphragm 10a is a sheet formed by removing the substrate 11 from the transfer film 10 and curing the protective layer 12 to form the hardened layer 22.
工件20可為電子裝置的外殼。電子裝置可為行動電話、筆記型電腦或平板電腦。電子裝置的種類並不以上述為限制。外殼的材質可為塑膠、玻璃、鋁、鎂合金或碳纖維增強塑料。鎂合金例如是鎂鋁合金或鎂鋰合金。塑膠例如是丙烯睛-丁二烯-苯乙烯(ABS)或聚碳酸酯(PC)。這些外殼材質在應用於作為外殼的材質時,由於鎂鋁合金或鎂鋰合金表面有許多孔洞,因此需要噴漆、補土,導致電子裝置的整體重量增加。藉由本發明的轉印膜片,可使這些外殼材質表現出金屬光澤及金屬冰涼感,同時降低材料的質量達到輕量化的效果。 The workpiece 20 can be an outer casing of an electronic device. The electronic device can be a mobile phone, a notebook or a tablet. The type of electronic device is not limited to the above. The material of the outer casing can be plastic, glass, aluminum, magnesium alloy or carbon fiber reinforced plastic. The magnesium alloy is, for example, a magnesium aluminum alloy or a magnesium lithium alloy. The plastic is, for example, acrylonitrile butadiene styrene (ABS) or polycarbonate (PC). When these shell materials are used as the material of the outer casing, since there are many holes on the surface of the magnesium alloy or the magnesium-lithium alloy, painting and soil filling are required, resulting in an increase in the overall weight of the electronic device. According to the transfer film of the present invention, these outer shell materials can exhibit metallic luster and metallic cooling sensation while reducing the quality of the material to achieve a lightweight effect.
加飾成型品30較佳為以模外裝飾(Out-Mold Decoration,OMD)技術中的模外成型轉寫(Out-Mold Release,OMR)來製造。 The decorative molded article 30 is preferably manufactured by Out-Mold Release (OMR) in Out-Mold Decoration (OMD) technology.
以下以模外成型轉寫為例進一步說明上述實施例的加飾成型品30的製造流程。 Hereinafter, the manufacturing process of the decorative molded article 30 of the above embodiment will be further described by taking an overmolding transfer as an example.
首先,以轉印膜片10的接著層14與工件20的表面20a接觸的方式,將工件20及轉印膜片10放置於治具中。接著,對轉印膜片10進行高壓轉印成型製程,以使轉印膜片10經由接著層14而黏著於工件20的表面20a上。更具體來說,高壓轉印成型製程是先藉由控制溫度使轉印膜片10進行加熱軟化步驟,接著對轉印膜片10進行加壓步驟,使轉印膜片10貼附於工件20的表 面20a上,然後,對轉印膜片10及工件20進行高壓真空成型步驟,使轉印膜片10轉印至工件20上。最後,將基材11移除,再以照射紫外線或加熱的方式使保護層12固化,以形成硬化層22;或者,先以照射紫外線或加熱的方式使保護層12固化,以形成硬化層22,再將基材11移除。 First, the workpiece 20 and the transfer film 10 are placed in the jig so that the adhesive layer 10 of the transfer film 10 comes into contact with the surface 20a of the workpiece 20. Next, the transfer film 10 is subjected to a high-pressure transfer molding process so that the transfer film 10 is adhered to the surface 20a of the workpiece 20 via the adhesive layer 14. More specifically, the high-pressure transfer molding process first performs a heating softening step by controlling the temperature of the transfer film 10, and then pressurizing the transfer film 10 to attach the transfer film 10 to the workpiece 20. Table On the surface 20a, the transfer film 10 and the workpiece 20 are then subjected to a high pressure vacuum forming step to transfer the transfer film 10 onto the workpiece 20. Finally, the substrate 11 is removed, and the protective layer 12 is cured by irradiation of ultraviolet rays or heating to form the hardened layer 22; or, the protective layer 12 is first cured by irradiation of ultraviolet rays or heating to form the hardened layer 22 Then, the substrate 11 is removed.
圖5是本發明一實施例的具有轉印膜片的裝置的剖面意圖。特別說明的是,為求清楚表示與便於說明,圖5中的各分層的厚度或比例被適度地放大或縮小,並不代表各分層的實際厚度或比例。請參考圖5,具有轉印膜片的裝置100包括本體110、外殼120以及轉印膜片130。外殼120具有內表面120a及外表面120b。外殼120經由內表面120a包覆本體110。轉印膜片130的接著層(未示於圖5)貼合於外殼120的外表面120b。另外,具有轉印膜片的裝置100可為行動電話、筆記型電腦或平板電腦等電子裝置。外殼120可為塑膠、玻璃、鋁、鎂合金或碳纖維增強塑料。轉印膜片130與上述的轉印膜片10相同,在此不另行贅述。承上述,由於鎂鋁合金或鎂鋰合金表面有許多孔洞,因此需要噴漆、補土,導致裝置的整體重量增加。藉由本發明的轉印膜片,可使這些外殼表現出金屬光澤及金屬冰涼感,同時降低材料的質量達到輕量化的效果。 Figure 5 is a cross-sectional view of an apparatus having a transfer film according to an embodiment of the present invention. In particular, the thickness or proportion of each layer in Figure 5 is moderately enlarged or reduced for clarity and ease of illustration, and does not represent the actual thickness or proportion of each layer. Referring to FIG. 5, the apparatus 100 having a transfer film includes a body 110, a housing 120, and a transfer film 130. The outer casing 120 has an inner surface 120a and an outer surface 120b. The outer casing 120 encases the body 110 via an inner surface 120a. An adhesive layer (not shown in FIG. 5) of the transfer film 130 is attached to the outer surface 120b of the outer casing 120. In addition, the device 100 having a transfer film may be an electronic device such as a mobile phone, a notebook computer, or a tablet computer. The outer casing 120 can be plastic, glass, aluminum, magnesium alloy or carbon fiber reinforced plastic. The transfer film 130 is the same as the above-described transfer film 10, and will not be further described herein. In view of the above, since there are many holes in the surface of the magnesium-aluminum alloy or the magnesium-lithium alloy, it is necessary to paint and replenish the soil, resulting in an increase in the overall weight of the device. By the transfer film of the present invention, these outer casings can exhibit a metallic luster and a metallic cooling sensation while reducing the quality of the material to achieve a lightweight effect.
綜上所述,本發明的轉印膜片藉由包含一層非導電性的仿金屬油墨層,該非導電性的仿金屬油墨層含有雲母及低導電性或不具導電性的金屬中的至少一者,因此將此轉印膜片應用於裝 飾電子裝置的外殼時,可表現出視覺效果良好的金屬光澤及金屬冰涼感,卻又不會有屏蔽效應或是金屬質感不足的問題。另外,本發明的轉印膜片的製造方法,藉由形成非導電性的仿金屬油墨層,該非導電性的仿金屬油墨層由於金屬含量低,不會產生靜電而吸附碎片,因此表現出優異的良率。又,本發明的轉印膜片的製造方法中形成單一層非導電性的仿金屬油墨層,即可表現出金屬光澤及金屬冰涼感,而無需以濺鍍方式形成金屬層,藉此可以有效降低成本並且降低材料的質量達到輕量化的效果。 In summary, the transfer film of the present invention comprises at least one of a non-conductive metal-like ink layer containing mica and a low-conductivity or non-conductive metal. Therefore, the transfer film is applied to the loading When the outer casing of the electronic device is decorated, it can exhibit a good metallic luster and a metallic cold feeling without the shielding effect or the lack of metal texture. Further, in the method for producing a transfer film of the present invention, by forming a non-conductive metal-like ink layer, the non-conductive metal-like ink layer exhibits excellent properties because it has a low metal content and does not generate static electricity and adsorbs debris. Yield. Further, in the method for producing a transfer film of the present invention, a single layer of a non-conductive metal-like ink layer is formed, and a metallic luster and a metallic cooling feeling can be exhibited without forming a metal layer by sputtering, thereby being effective. Reduce costs and reduce the quality of materials to achieve a lightweight effect.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
Claims (12)
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| Application Number | Priority Date | Filing Date | Title |
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| TW107142101A TWI669221B (en) | 2018-11-26 | 2018-11-26 | Transfer film and device having the same, and manufacturing method of decorated moding article |
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| Application Number | Priority Date | Filing Date | Title |
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| TW107142101A TWI669221B (en) | 2018-11-26 | 2018-11-26 | Transfer film and device having the same, and manufacturing method of decorated moding article |
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| Publication Number | Publication Date |
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| TWI669221B true TWI669221B (en) | 2019-08-21 |
| TW202019722A TW202019722A (en) | 2020-06-01 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW353762B (en) * | 1996-10-21 | 1999-03-01 | Dainippon Printing Co Ltd | Transfer sheet, and pattern-forming method |
| TW201016482A (en) * | 2008-10-23 | 2010-05-01 | Compal Electronics Inc | Transfer film, method of manufacturing the same, transfer method and object surface structure |
| TW201024390A (en) * | 2008-12-25 | 2010-07-01 | Compal Electronics Inc | Heat bonding film |
| CN104448752A (en) * | 2013-09-17 | 2015-03-25 | 比亚迪股份有限公司 | Polymer article and ink composition and surface selective metallization method |
| TW201708435A (en) * | 2015-07-01 | 2017-03-01 | 西克帕控股有限公司 | Environmentally friendly inks and fountain solutions for wet lithography processes and wet lithography processes |
-
2018
- 2018-11-26 TW TW107142101A patent/TWI669221B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW353762B (en) * | 1996-10-21 | 1999-03-01 | Dainippon Printing Co Ltd | Transfer sheet, and pattern-forming method |
| TW201016482A (en) * | 2008-10-23 | 2010-05-01 | Compal Electronics Inc | Transfer film, method of manufacturing the same, transfer method and object surface structure |
| TW201024390A (en) * | 2008-12-25 | 2010-07-01 | Compal Electronics Inc | Heat bonding film |
| CN104448752A (en) * | 2013-09-17 | 2015-03-25 | 比亚迪股份有限公司 | Polymer article and ink composition and surface selective metallization method |
| TW201708435A (en) * | 2015-07-01 | 2017-03-01 | 西克帕控股有限公司 | Environmentally friendly inks and fountain solutions for wet lithography processes and wet lithography processes |
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| TW202019722A (en) | 2020-06-01 |
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