TWI669035B - Printed circuit board and method for manufacturing the same - Google Patents

Abstract

A circuit board comprising a first circuit substrate, a second circuit substrate and at least one resistive component; the first circuit substrate comprises at least one first conductive circuit layer, the first conductive circuit layer comprising at least one first a conductive circuit, the second circuit substrate includes at least one second conductive circuit layer, the second conductive circuit layer includes at least one second conductive line, and the resistive element is formed on the first conductive circuit layer and the second conductive circuit layer One end of the resistive element is bonded to the first conductive line and electrically connected, and the other end is in contact with and electrically connected to the second conductive line. The invention also provides a method of fabricating the circuit board.

Description

Circuit board and circuit board manufacturing method

The present invention relates to the field of circuit board manufacturing, and in particular, to a circuit board including a resistor element and a method of manufacturing the circuit board.

With the development of resistive components to miniaturization, embedded technology has emerged. It has the following advantages: reduced package area and low power consumption, improved signal quality, and reduced electromagnetic interference noise and high frequency power supply stabilization.

Buried passive components commonly used in embedded technology mainly include: inductor components, capacitor components, and resistor components.

For example, the common method of embedding a resistive element is to first embed the resistive element in the same conductive circuit layer and then add layers, and the process is complicated; and the material of the resistive element is mostly an alloy layer such as NiCr or NiP, but these materials are usually Controlled by the material supplier, the circuit board in which the resistive element is embedded is expensive to manufacture.

In view of this, the present invention provides a low cost circuit board and a method of fabricating the same.

a circuit board comprising a first circuit substrate, a second circuit substrate and at least one resistive element; the first circuit substrate comprising at least one first conductive circuit layer, the first conductive line The circuit layer includes at least one first conductive circuit, the second circuit substrate includes at least one second conductive circuit layer, the second conductive circuit layer includes at least one second conductive circuit, and the resistive element is formed on the first conductive circuit layer and Between the second conductive circuit layers, one end of the resistive element is in contact with and electrically connected to the first conductive line, and the other end is in contact with and electrically connected to the second conductive line.

Further, the first conductive line includes a first side perpendicular to the extending direction of the first circuit substrate, and the second conductive line includes a second side perpendicular to the extending direction of the second circuit substrate, and the resistive elements are respectively The first side surface and the second side surface are in close contact with each other and electrically connected.

Further, the first conductive line further includes a first surface vertically connected to the first side, the second conductive line further includes a second surface perpendicularly connected to the second side, the resistive element and the first At least one of the surface and the second surface is in conformity and electrically connected.

Further, a first gap is formed between at least one surface of the resistive element opposite to the first side surface and the first conductive line of the first conductive circuit layer, and at least one of the resistive elements is opposite to the second side surface Forming a second gap between the surface of the back and the second conductive line of the second conductive circuit layer; the first circuit substrate and the second circuit substrate are bonded together by a glue layer, and the glue layer is stacked on the Between the first conductive circuit layer and the second conductive circuit layer and filled in the first gap and the second gap.

Further, the resistive element is made of a resistive material, which is a thermosetting colloid, which is mainly composed of a resin, a hardener, a catalyst, and a conductive filler, in which the resin occupies The weight percentage is 19.5~35%, the hardener accounts for 10~17%, the catalyst accounts for 0~1%, and the conductive filler accounts for 46~69%. The resin is composed of one or more of an epoxy resin, a dimer acid-modified polyester, and a polypropylene glycol diglycidyl ether.

Further, the colloid further contains an additive, and the additive accounts for 0.2 to 2% by weight.

A method for manufacturing a circuit board, comprising the steps of: providing a first circuit substrate intermediate body and a second circuit substrate intermediate; the first circuit substrate intermediate body comprises a first conductive circuit layer, the first conductive circuit layer Including at least one first conductive line; the second circuit substrate intermediate body includes a second conductive circuit layer, the second conductive circuit layer includes at least one second conductive line; providing a glue layer, Laminating the glue on the second conductive circuit layer, the adhesive layer includes a first through groove; providing a resistive material and printing the resistive material in the first through groove, so that the resistive material and the The second conductive line is bonded and electrically connected; and the first circuit substrate intermediate is pressed onto the second circuit substrate intermediate body, and the resistive material is adhered to the first conductive line and electrically connection.

Further, the first conductive line includes a first side perpendicular to the extending direction of the first circuit substrate, and the second conductive line includes a second side perpendicular to the extending direction of the second circuit substrate, and the resistive elements are respectively The first side surface and the second side surface are in close contact with each other and electrically connected.

Further, the first conductive line further includes a first surface vertically connected to the first side, the second conductive line further includes a second surface perpendicularly connected to the second side, the resistive element and the first At least one of the surface and the second surface is in conformity and electrically connected.

Further, a first gap is formed between at least one surface of the resistive element opposite to the first side surface and the first conductive line of the first conductive circuit layer, and at least one of the resistive elements is opposite to the second side surface A second gap is formed between the surface of the back and the second conductive line of the second conductive circuit layer; the glue layer is filled in the first gap and the second gap.

Compared with the prior art, the resistor material for manufacturing a resistor element provided by the present invention has a low manufacturing cost. In addition, the circuit board and the manufacturing method of the present invention use the above-mentioned resistive material as a material for manufacturing the resistive element, and the resistive element can be formed into the middle of the two circuit substrate intermediates by printing, and solidified in the process of layering. Forming can simplify the process.

100,200‧‧‧ circuit board

10‧‧‧First copper-clad substrate

11‧‧‧First substrate layer

12‧‧‧First copper foil layer

13‧‧‧Second copper foil layer

14‧‧‧First conductive circuit layer

141‧‧‧First conductive line

1411‧‧‧ first surface

1412‧‧‧ first side

148‧‧‧First gap

20‧‧‧second copper-clad substrate

21‧‧‧Second substrate layer

22‧‧‧ Third copper foil layer

23‧‧‧fourth copper foil layer

24‧‧‧Second conductive circuit layer

241‧‧‧Second conductive line

2411‧‧‧ second surface

2412‧‧‧ second side

248‧‧‧Second gap

30‧‧‧Resistive materials

31‧‧‧Resistive components

40‧‧‧ Film

41‧‧‧ glue layer

414‧‧‧ first through slot

60‧‧‧ conductive through holes

16‧‧‧ Third conductive circuit layer

17‧‧‧First solder mask

26‧‧‧fourth conductive layer

27‧‧‧Second solder mask

70‧‧‧First circuit board

71‧‧‧First circuit substrate intermediate

80‧‧‧Second circuit substrate

81‧‧‧Second circuit substrate intermediate

1 is a cross-sectional view of a circuit board according to a first embodiment of the present invention.

2 is a cross-sectional view showing a first circuit substrate intermediate body, a glue layer, and a second circuit substrate intermediate body according to the first embodiment of the present invention.

3 is a cross-sectional view of a first copper clad substrate provided by the present invention.

4 is a cross-sectional view showing the formation of a first conductive wiring layer by forming one copper foil layer of the first copper-clad substrate shown in FIG. 3 to form the first circuit substrate intermediate body shown in FIG. 2.

Figure 5 is a cross-sectional view showing a second copper clad substrate according to a first embodiment of the present invention.

Fig. 6 is a cross-sectional view showing the second conductive substrate layer formed by forming one copper foil layer of the second copper-clad substrate shown in Fig. 5, and further obtaining the second circuit substrate intermediate body shown in Fig. 2;

Figure 7 is a cross-sectional view of a film according to a first embodiment of the present invention.

Figure 8 is a cross-sectional view showing the film shown in Figure 7 formed into the adhesive layer shown in Figure 2 .

9 is a laminate of the adhesive shown in FIG. 2 on the second conductive wiring layer shown in FIG. 6, and provides a colloid for forming a resistor, and the colloid is formed on the first circuit substrate intermediate body and the second circuit. A cross-sectional view between the substrate intermediates.

FIG. 10 is a cross-sectional view showing the first circuit substrate intermediate body of FIG. 2 formed on the second circuit substrate intermediate body and heated and pressurized.

11 is a cross-sectional view showing a conductive via hole formed on the first circuit substrate intermediate body and the second circuit substrate intermediate body shown in FIG.

Fig. 12 is a cross-sectional view showing the second copper wiring layer shown in Fig. 3 and the fourth copper foil layer shown in Fig. 5, respectively, forming a third conductive wiring layer and a fourth conductive wiring layer.

Figure 13 is a cross-sectional view showing a circuit board according to a second embodiment of the present invention.

The specific embodiments, structures, and features of the circuit board and the manufacturing method thereof provided by the present invention are described below in conjunction with FIGS. 1-13 and preferred embodiments in order to further explain the technical means and functions of the present invention. Its efficacy, as detailed below.

Referring to FIG. 1, a first embodiment of the present invention provides a circuit board 100 including a resistive element 31. The circuit board 100 includes a first circuit substrate 70, a second circuit substrate 80, a resistive element 31, and a glue layer 41. The first circuit substrate 70 and the second circuit substrate 80 are bonded together by the adhesive layer 41 , and the resistive element 31 is located between the first circuit substrate 70 and the second circuit substrate 80 .

The first circuit substrate 70 includes an insulating first substrate layer 11 , a first conductive wiring layer 14 and a third conductive wiring layer 16 formed on opposite surfaces of the first substrate layer 11 and formed thereon. The first solder resist layer 17 on the surface of the third conductive wiring layer 16 away from the first substrate layer 11.

The material of the first substrate layer 11 is usually selected from polyimide (PI), polyethylene terephthalate (PET) or polyethylene naphthalate (Polyethylene Naphthalate). PEN), polyethylene (PE), Teflon, One of flexible materials such as liquid crystal polymer (LCP), polyvinyl chloride polymer (PVC), and the like. It may also be one of a hard supporting material such as a resin plate or a ceramic plate.

The first conductive circuit layer 14 includes at least one first conductive line 141. Each of the first conductive lines 141 includes a first surface 1411 parallel to the extending direction of the first circuit substrate 70 and a first side surface 1412 perpendicularly connected to the first surface 1411. The first surface 1411 is away from the first substrate layer 11.

The second circuit substrate 80 includes an insulating second substrate layer 21, second conductive wiring layers 24 and fourth conductive wiring layers 26 formed on opposite surfaces of the second substrate layer 21, and formed thereon. The second solder resist layer 27 of the fourth conductive wiring layer 26 is away from the surface of the second substrate layer 21. The second conductive wiring layer 24 is opposite to the first conductive wiring layer 14.

The material of the second substrate layer 21 is generally selected from polyimide (PI), polyethylene terephthalate (PET) or polyethylene naphthalate (Polyethylene Naphthalate). One of flexible materials such as PEN), polyethylene (PE), Teflon, liquid crystal polymer (LCP), polyvinyl chloride polymer (PVC), and the like. . It may also be one of a hard supporting material such as a resin plate or a ceramic plate.

The second conductive circuit layer 24 includes at least one second conductive line 241. Each of the second conductive lines 241 includes a second surface 2411 parallel to the extending direction of the second circuit substrate 80 and a second side surface 2412 perpendicularly connected to the second surface 2411. The second surface 2411 is away from the second substrate layer 21.

The resistive element 31 is obtained by heat-pressurizing and molding the resistive material 30.

The resistive material 30 is a thermosetting colloid, and the resistive material 30 is mainly composed of a resin, a hardener, a catalyst, a conductive filler and an additive.

In the resistive material 30, the resin accounts for 19.5-35% by weight, the hardener accounts for 10-17% by weight, and the catalyst accounts for 0~1% by weight. The filler accounts for 46 to 69% by weight, and the additive accounts for 0.2 to 2% by weight.

The resin may be a single resin or a mixture of a plurality of resins.

In this embodiment, the resin includes an epoxy resin, a dimer acid-modified polyester, and a polypropylene glycol diglycidyl ether. Wherein, the structural formula of the epoxy resin is: The structural formula of the polypropylene glycol diglycidyl ether is: .

The hardener may be a conventional hardener such as a fatty amine curing agent, a polyamide curing agent, or an alicyclic amine curing agent. In this embodiment, the hardener is a polyamine curing agent.

The catalyst may be an imidazole. In this embodiment, the catalyst is preferably 2-undecylimidazole, and the chemical formula of the 2-undecylimidazole is .

The conductive filler may be one or more of copper particles whose surface is coated with silver powder, gold powder, nickel powder or the like.

In this embodiment, the conductive filler is preferably copper particles coated with silver powder on the surface, that is, silver-coated copper powder.

The additive may be a decane tackifier or an organic polymer type anti-settling agent.

In this embodiment, the additive is a decane tackifier having a chemical formula of:

The resistive element 31 is located between the first conductive trace layer 14 and the second conductive trace layer 24.

In this embodiment, the resistive element 31 is respectively associated with the first surface 1411 of the first conductive trace 141, the first side 1412, and the second surface 2411 of the second conductive trace 241 of the second conductive trace layer 24. The second side 2412 is attached and electrically connected. A first gap 148 is formed between at least one surface of the resistive element 31 opposite the first side surface 1412 and the first conductive line 141 of the first conductive circuit layer 14 , at least one of the resistive elements 31 and the first A second gap 248 is formed between the opposite surface of the two side faces 2412 and the second conductive line 241 of the second conductive wiring layer 24.

The resistive element 31 is in contact with and electrically connected to the first surface 1411 and the second surface 2411, so that the resistive element 31 partially covers the first conductive line 141 and the second conductive line. 241, the contact area between the resistive element 31 and the first circuit substrate 70 and the second circuit substrate 80 can be increased, thereby enhancing the resistive element 31 and the first conductive circuit layer 14 and the second conductive circuit layer 24. The bonding force prevents the resistive element 31 from being peeled off between the first conductive wiring layer 14 and the second conductive wiring layer 24.

The adhesive layer 41 is stacked between the first conductive circuit layer 14 and the second conductive circuit layer 24 and filled in the first gap 148 and the second gap 248.

The circuit board 100 further includes at least one conductive via 60 extending through the circuit board 100. The conductive via 60 electrically connects the third conductive circuit layer 16, the first conductive circuit layer 14, the second conductive circuit layer 24, and The fourth conductive circuit layer 26. The first solder resist layer 17 and the second solder resist layer 27 are also filled in the conductive vias 60.

Referring to FIG. 1-12, the present invention provides a method for fabricating a circuit board 100 including a resistive element 31. The steps are as follows: First, please refer to FIG. 2-8 to provide a first circuit substrate intermediate body 71 and a glue. The layer 41 and a second circuit substrate intermediate body 81.

Specifically, referring to FIG. 3 to FIG. 4, the method for fabricating the first circuit substrate intermediate body 71 includes the following steps. First, referring to FIG. 3, a first copper clad substrate 10 is provided. The first copper clad substrate 10 includes a first An insulating first substrate layer 11 and a first copper foil layer 12 and a second copper foil layer 13 formed on opposite surfaces of the first substrate layer 11.

Next, referring to FIG. 4, the first copper foil layer 12 is formed into a first conductive wiring layer 14, and the first circuit substrate intermediate body 71 is formed.

Specifically, the first conductive circuit layer 14 is fabricated through an image transfer process.

The first conductive circuit layer 14 includes at least one first conductive line 141. Each of the first conductive lines 141 includes a first surface 1411 parallel to the extending direction of the first circuit substrate intermediate body 71 and a first side surface 1412 perpendicularly connected to the first surface 1411. The first surface 1411 is away from the first substrate layer 11.

Referring to FIGS. 5-6, the manufacturing method of the second circuit substrate intermediate body 81 includes the following steps: First, referring to FIG. 5, a second copper clad substrate 20 is provided. The second copper clad substrate 20 includes an insulative second substrate layer 21 formed on opposite surfaces of the second substrate layer 21. The third copper foil layer 22 and the fourth copper foil layer 23.

Next, referring to FIG. 6, the third copper foil layer 22 is formed into a second conductive circuit layer 24, thereby forming the second circuit substrate intermediate body 81.

Specifically, the second conductive circuit layer 24 is fabricated through an image transfer process.

The second conductive circuit layer 24 includes at least one second conductive line 241. Each of the second conductive lines 241 includes a second surface 2411 parallel to the extending direction of the second circuit substrate 80 and a second side surface 2412 perpendicularly connected to the second surface 2411. The second surface 2411 is away from the second substrate layer 21.

Referring to FIGS. 7-8, the manufacturing method of the adhesive layer 41 includes the following steps: First, referring to FIG. 7, a film 40 is provided.

Next, referring to FIG. 8, a first through groove 414 is formed in the film 40 to penetrate the film 40, thereby forming the glue layer 41.

Specifically, the first through groove 414 can be formed by punching.

In the second step, referring to FIG. 9, the adhesive layer 41 is first pressed onto the second conductive circuit layer 24, and a resistive material 30 is provided. The conductive material 30 is printed on the conductive layer of the second conductive circuit layer 24. The wiring material 30 is inserted into the first through slot 414.

In the present embodiment, the resistive material 30 protrudes from the adhesive layer 41. In other embodiments, the resistive material 30 can also be flush with the glue layer 41.

Specifically, the resistive material 30 is a thermosetting colloid, and the resistive material 30 is in contact with and electrically connected to the second surface 2411 and the second side 2412 of the second conductive trace 241 of the second conductive trace layer 24. A second gap 248 is formed between at least one surface of the resistive material 30 opposite the second side surface 2412 and the second conductive line 241 of the second conductive circuit layer 24, in the process of pressing the adhesive layer 41 The glue layer 41 is filled in the second gap 248.

This resistive material 30 is used to fabricate the resistive element 31.

The resistive material 30 is a thermosetting colloid, and the resistive material 30 is mainly composed of a resin, a hardener, a catalyst, a conductive filler and an additive.

In the resistive material 30, the resin accounts for 19.5-35% by weight, the hardener accounts for 10-17% by weight, and the catalyst accounts for 0~1% by weight. The filler accounts for 46 to 69% by weight, and the additive accounts for 0.2 to 2% by weight.

The resin may be a single resin or a mixture of a plurality of resins.

In this embodiment, the resin includes an epoxy resin, a dimer acid-modified polyester, and a polypropylene glycol diglycidyl ether. Wherein, the structural formula of the epoxy resin is: The structural formula of the polypropylene glycol diglycidyl ether is: .

The hardener may be a conventional hardener such as a fatty amine curing agent, a polyamide curing agent, or an alicyclic amine curing agent.

The catalyst may be an imidazole.

In this embodiment, the catalyst is preferably 2-undecylimidazole, and the chemical formula of the 2-undecylimidazole is .

The conductive filler may be one or more of copper particles whose surface is coated with silver powder, gold powder, nickel powder or the like.

In this embodiment, the conductive filler is preferably copper particles coated with silver powder on the surface, that is, silver-coated copper powder.

The additive may be a decane tackifier or an organic polymer type anti-settling agent.

In this embodiment, the additive is a decane tackifier having a chemical formula of:

In the third step, referring to FIG. 10, the first circuit substrate intermediate body 71 is stacked on the second circuit substrate intermediate body 81, and heated and pressurized to make the second circuit substrate intermediate body 81 and the first circuit. The substrate intermediate body 71 is bonded together.

The resistive material 30 is in contact with and electrically connected to the first surface 1411 and the first side 1412 of the first conductive line 141. At least one surface of the resistive material 30 opposite to the first side 1412 is A first gap 148 is formed between the first conductive lines 141 of the first conductive circuit layer 14, and the glue layer 41 is filled into the first gap 148 during heating and pressurization.

In addition, the resistive material 30 is solidified during heating and pressurization, and the resistive material 30 after solidification molding is the resistive element 31.

Since the resistive element 31 is located between the first circuit substrate intermediate body 71 and the second circuit substrate intermediate body 81, the thickness of the adhesive layer 41 can be controlled to adjust the thickness of the resistive element 31, thereby controlling the resistive element. The magnitude of the cross-sectional area of the cross section in the thickness direction of 31 is such that the resistance value of the resistive element 31 is changed when the resistivity and the resistance length are not changed.

In the fourth step, referring to FIG. 11 , at least one conductive via 60 is formed on the first circuit substrate intermediate body 71 and the second circuit substrate intermediate body 81 after pressing.

The conductive vias 60 electrically connect the first conductive wiring layer 14 , the second conductive wiring layer 24 , the second copper foil layer 13 , and the fourth copper foil layer 23 .

Specifically, at least one through hole may be formed by laser etching or mechanical drilling, and a plating layer is formed on the wall of the through hole by electroplating to form the conductive via 60.

In the fifth step, referring to FIG. 12, the second copper foil layer 13 and the fourth copper foil layer 23 are respectively formed into a third conductive wiring layer 16 and a fourth conductive wiring layer 26.

The conductive vias 60 electrically connect the first conductive wiring layer 14 , the second conductive wiring layer 24 , the third conductive wiring layer 16 , and the fourth conductive wiring layer 26 .

In a sixth step, referring to FIG. 1 , a first solder resist layer 17 is formed on a surface of the third conductive circuit layer 16 away from the first substrate layer 11 , and the fourth conductive circuit layer 26 is away from the first A second solder resist layer 27 is formed on the surface of the second substrate layer 21, and the first solder resist layer 17 and the second solder resist layer 27 are filled in the conductive via hole 60 to form the circuit board 100.

Referring to FIG. 13, a second embodiment of the present invention provides a circuit board 200. The circuit board 200 has substantially the same structure as the circuit board 100. The difference is that the resistive element 31 does not cover the first conductive line 141 and The second conductive line 241. That is, the resistive element 31 is only in contact with and electrically connected to the first side surface 1412 and the second side surface 2412, and is not in contact with and electrically connected to the first surface 1411 and the second surface 2411.

Of course, the resistive element 31 may cover only one of the first conductive line 141 and the second conductive line 241.

Compared with the prior art, the resistor material for manufacturing a resistor element provided by the present invention has a low manufacturing cost.

In addition, the circuit board and the manufacturing method of the present invention use the above-mentioned resistive material as a material for manufacturing the resistive element, and the resistive element can be formed into the middle of the two circuit substrate intermediates by printing, and solidified in the process of layering. Forming can simplify the process.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, although the present invention has been described above, and is not intended to limit the present invention, any person skilled in the art. The equivalents of the above-described technical contents may be modified or modified to equivalent changes without departing from the technical scope of the present invention, and the technical essence according to the present invention is not deviated from the technical scope of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the technical solutions of the present invention.

Claims (8)

A circuit board comprising a first circuit substrate, a second circuit substrate and at least one resistive component; the first circuit substrate comprises at least one first conductive circuit layer, the first conductive circuit layer comprising at least one first a conductive circuit, the second circuit substrate includes at least one second conductive circuit layer, the second conductive circuit layer includes at least one second conductive line, wherein the resistive element is formed on the first conductive circuit layer and the second conductive line Between the layers, one end of the resistive element is in contact with the first conductive line and electrically connected, and the other end is in contact with and electrically connected to the second conductive line; the first conductive line includes a vertical a first side of the circuit board extending direction, the second conductive line includes a second side perpendicular to the extending direction of the second circuit substrate, and the resistive element is respectively attached to the first side and the second side and electrically a first gap formed between at least one surface of the resistive element opposite the first side and the first conductive line of the first conductive circuit layer, the resistive element a second gap is formed between a surface opposite to the second side surface and the second conductive line of the second conductive circuit layer; the first circuit substrate and the second circuit substrate are bonded together by a glue layer, The glue is laminated between the first conductive circuit layer and the second conductive circuit layer and filled in the first gap and the second gap. The circuit board of claim 1, wherein the first conductive line further comprises a first surface vertically connected to the first side, the second conductive line further comprising a vertical connection to the second side The second surface, the resistive element is in contact with and electrically connected to at least one of the first surface and the second surface. The circuit board of claim 1, wherein the resistive element is made of a resistive material, the resistive material is a thermosetting colloid, and the resistive material is mainly composed of a resin, a hardener, a catalyst, and a conductive filler. In the resistive material, the resin accounts for 19.5-35% by weight, the hardener accounts for 10-17% by weight, and the catalyst accounts for 0-1% by weight. The percentage by weight is 46 to 69%, and the resin is composed of one or more of an epoxy resin, a dimer acid-modified polyester, and a polypropylene glycol diglycidyl ether. The circuit board of claim 3, wherein the resistor material further comprises an additive, and the additive accounts for 0.2 to 2% by weight. A method for manufacturing a circuit board, comprising the steps of: providing a first circuit substrate intermediate body and a second circuit substrate intermediate; the first circuit substrate intermediate body comprises a first conductive circuit layer, the first conductive circuit layer Including at least one first conductive line; the second circuit substrate intermediate body includes a second conductive circuit layer, the second conductive circuit layer includes at least one second conductive line; providing a glue layer and laminating the glue On the second conductive circuit layer, the adhesive layer includes a first through groove; a resistive material is provided and the resistive material is printed in the first through groove to form a resistive element, one end of the resistive element and the second The conductive circuit is bonded and electrically connected; and the first circuit substrate intermediate is pressed onto the second circuit substrate intermediate body, and the other end of the resistive element is bonded to the first conductive line and electrically Sexual connection. The method of manufacturing the circuit board of claim 5, wherein the first conductive line comprises a first side perpendicular to an extending direction of the first circuit substrate, and the second conductive line comprises a second perpendicular to the second The second side surface of the circuit board extending direction is electrically connected to the first side surface and the second side surface. The method of manufacturing the circuit board of claim 6, wherein the first conductive line further comprises a first surface vertically connected to the first side, the second conductive line further comprising a second side a second surface that is vertically connected, the resistive element is in contact with and electrically connected to at least one of the first surface and the second surface. The method of manufacturing the circuit board of claim 6, wherein the first surface of the resistive element opposite the first side and the first conductive line of the first conductive layer are first formed a second gap formed between the surface of the resistive element opposite to the second side and the second conductive line of the second conductive layer; the adhesive layer is filled in the first gap and the second Within the gap.