TWI653293B - 可室溫固化之聚矽氧橡膠組合物及其用途 - Google Patents
可室溫固化之聚矽氧橡膠組合物及其用途 Download PDFInfo
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- TWI653293B TWI653293B TW103145955A TW103145955A TWI653293B TW I653293 B TWI653293 B TW I653293B TW 103145955 A TW103145955 A TW 103145955A TW 103145955 A TW103145955 A TW 103145955A TW I653293 B TWI653293 B TW I653293B
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- rubber composition
- silicone rubber
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- 239000011667 zinc carbonate Substances 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
本發明提供可室溫固化之聚矽氧橡膠組合物，其展現對固化期間所接觸基板之良好黏著且能抑制滲油之發生。問題係藉由含有以下組份之可室溫固化之聚矽氧橡膠組合物來解決：(A)以下之混合物：(A1)有機聚矽氧烷，其在分子中具有至少兩個指定的含有烷氧基矽基之基團，及(A2)有機聚矽氧烷，其在分子中具有一個指定的含有烷氧基矽基之基團；(B)有機聚矽氧烷，其沒有羥基及烷氧基；(C)烷氧基矽烷；及(D)縮合反應觸媒。
Description
本發明係關於藉由與空氣中之水分接觸在室溫下固化之可室溫固化之聚矽氧橡膠組合物、藉由固化可室溫固化之聚矽氧橡膠組合物獲得之聚矽氧橡膠固化產物及處理聚矽氧橡膠固化產物之電子裝置。本發明主張對於2013年12月27日提出申請之日本專利申請案第2013-272670號之優先權，其內容係以引用方式併入本文中。
由在每分子中具有至少兩個含有烷氧基矽基之基團之有機聚矽氧烷、烷氧基矽烷及有機鈦化合物組成之可室溫固化之聚矽氧橡膠組合物在室溫下藉由與空氣中之水分接觸固化(涉及專利文件1至4)。該等可室溫固化之聚矽氧橡膠組合物藉由與該等電路或電極接觸固化用於諸如電路或電極中之密封劑、黏著劑及防潮塗佈劑等應用。
然而，專利文件1至4中闡述之可室溫固化之聚矽氧橡膠組合物具有與基板黏著不足之問題。
專利文件1：日本未審查專利申請公開案第2006-22277A號
專利文件2：日本未審查專利申請公開案第2006-22278A號
專利文件3：日本未審查專利申請公開案第2007-231172A號
專利文件4：日本未審查專利申請公開案第2012-219113A號
本發明之目標係提供可室溫固化之聚矽氧橡膠組合物，其藉由與空氣中之水分接觸在室溫下固化而形成聚矽氧橡膠固化產物，該產物展現對固化期間所接觸基板之良好黏著且能抑制滲油之發生。
作為努力研究以解決上述問題之結果，本發明者發現，可藉由含有以下組份之可室溫固化之聚矽氧橡膠組合物來解決上述問題：(A)以下之混合物：(A1)有機聚矽氧烷，其在每分子中在分子鏈中之矽原子上具有至少兩個指定的含有烷氧基矽基之基團，及(A2)有機聚矽氧烷，其在每分子中在分子鏈中之矽原子上具有一個指定的含有烷氧基矽基之基團；(B)有機聚矽氧烷，其在分子鏈中之矽原子上沒有羥基及烷氧基；(C)烷氧基矽烷或其部分水解縮合物；及(D)縮合反應觸媒，且其由此實現本發明。
具體而言，本發明之可室溫固化之聚矽氧橡膠組合物包含：(A)含有以下組份(A1)及(A2)之混合物：(A1)有機聚矽氧烷，其在每分子中在分子鏈中之矽原子上具有至少兩個表示為以下通式之含有烷氧基矽基之基團：
(其中R1係相同或不同的沒有脂肪族不飽和鍵之單價烴基，R2係烷基，R3係相同或不同伸烷基，a係0至2之整數，且p係1至50之整數)；(A2)有機聚矽氧烷，其在每分子中具有一個上述含有烷氧基矽基之基團；
(B)有機聚矽氧烷，其在分子鏈中之矽原子上沒有羥基及烷氧基；(C)表示為以下通式之烷氧基矽烷：R4 bSi(OR5)(4-b)(其中R4係單價烴基，R5係烷基，且b係0至2)或其部分水解縮合物；及(D)縮合反應觸媒。
更有利地，組份(A)中組份(A1)及組份(A2)之質量比係1：9至9：1。
更有利地，組份(A)作為整體在25℃下之黏度在100至1,000,000mPas範圍內。
組份(A1)較佳係在兩個分子末端之矽原子上具有含有烷氧基矽基之基團之直鏈有機聚矽氧烷，且組份(A2)較佳係在一個分子末端之矽原子上具有含有烷氧基矽基之基團之直鏈有機聚矽氧烷。
組份(A)中含有烷氧基矽基之基團較佳係表示為下式之基團：
較佳地，組份(B)在25℃下之黏度係在10至1,000,000mPas範圍內。
較佳地，組份(C)係甲基三甲氧基矽烷。
本發明之可室溫固化之聚矽氧橡膠組合物相對於100質量份數之組份(A)較佳含有1至100質量份數之組份(B)，含有0.5至30質量份數之組份(C)，且含有0.1至10質量份數之組份(D)。
本發明之可室溫固化之聚矽氧橡膠組合物較佳進一步包含(E)黏著促進劑。
較佳地，組份(E)係選自由以下組成之群：含有環氧基之烷氧基矽烷、含有丙烯酸基團之烷氧基矽烷、含有胺基之烷氧基矽烷及含有
環氧基之烷氧基矽烷與含有胺基之烷氧基矽烷之反應混合物。
本發明之可室溫固化之聚矽氧橡膠組合物較佳進一步包含(F)強化填充劑。
較佳地，組份(F)係選自由以下組成之群：發煙二氧化矽細粉、沈澱二氧化矽細粉、烘乾二氧化矽細粉及發煙氧化鈦細粉。
本發明進一步係關於藉由固化本發明之上述可室溫固化之聚矽氧橡膠組合物獲得之聚矽氧橡膠固化產物。
本發明亦係關於提供有上述聚矽氧橡膠固化產物之電子裝置。
藉由與空氣中之水分接觸在室溫下固化，本發明之可室溫固化之聚矽氧橡膠組合物可形成聚矽氧橡膠固化產物，其展現對固化期間所接觸基板之良好黏著，且能抑制滲油之發生(油組份之滲流)。
本發明之聚矽氧橡膠固化產物亦展現對基板之良好黏著且能抑制滲油之發生。此外，本發明電子裝置具有良好可靠性由於上述聚矽氧橡膠固化產物展現對基板之良好黏著且抑制滲油之發生。
本發明之可室溫固化之聚矽氧橡膠組合物包含上述組份(A)至(D)。藉由與空氣中之水分接觸在室溫下固化，此一可室溫固化之聚矽氧橡膠組合物可形成聚矽氧橡膠固化產物，其展現對固化期間所接觸基板之良好黏著且能抑制滲油之發生。下文將詳細闡述每一組份。注意，在本說明書中，黏度係使用B型黏度計根據JIS K 7117-1在25℃下量測之值。
組份(A)係本發明組合物之基礎化合物，且係以下之混合物：
(A1)有機聚矽氧烷，其在每分子中在分子鏈中之矽原子上具有至少兩個表示為下式之含有烷氧基矽基之基團，及(A2)有機聚矽氧烷，其在每分子中在分子鏈中之矽原子上具有一個表示為下式之含有烷氧基矽基之基團。
在該式中，R1係相同或不同的沒有脂肪族不飽和鍵之單價烴基，其實例包括烷基，例如甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基、癸基及十八烷基；環烷基，例如環戊基及環己基；芳基，例如苯基、甲苯基、二甲苯基及萘基；芳烷基，例如苄基、苯乙基及苯丙基；及鹵代烷基，例如3-氯丙基及3,3,3-三氟丙基。烷基、環烷基或芳基較佳，且甲基或苯基更佳。在該式中，R2係烷基，其實例包括甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基、癸基及十八烷基。甲基或乙基較佳。在該式中，R3係相同或不同伸烷基，其實例包括甲基亞甲基、伸乙基、甲基伸乙基、伸丙基、伸丁基、伸戊基、伸己基、伸庚基及伸辛基。甲基亞甲基、伸乙基、甲基伸乙基或伸丙基較佳。在該式中，a係0至2之整數，且較佳係0或1。在該式中，p係1至50之整數，較佳係1至20之整數，更佳係1至10之整數，且尤佳係1至5之整數。
該等含有烷氧基矽基之基團之實例包括表示為下式之基團：
，表示為下式之基團：
，表示為下式之基團：
，表示為下式之基團：
，表示為下式之基團：
，表示為下式之基團：
，表示為下式之基團：
鍵結至組份(A1)及組份(A2)之分子鏈中之矽原子之並非含有烷氧基矽基之基團之基團的實例包括烷基，例如甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基、癸基及十八烷基；環烷基，例如環戊基及環己基；烯基，例如乙烯基、烯丙基、丁烯基、戊烯基、己烯基及庚烯基；芳基，例如苯基、甲苯基、二甲苯基及萘基；芳烷基，例如苄基、苯乙基及苯丙基；及鹵代烷基，例如3-氯丙基及3,3,3-三氟丙基。烷基、環烷基、烯基或芳基較佳，且甲基、乙烯基或苯基更佳。
組份(A1)及組份(A2)之分子結構不受限制且(例如)可具有直鏈、部分具支鏈直鏈、具支鏈或環狀分子結構，其中直鏈、部分具支鏈直鏈或具支鏈分子結構較佳。含有烷氧基矽基之基團可鍵結至分子鏈末
端之矽原子，或鍵結至沿分子鏈之矽原子。作為組份(A1)，具有直鏈分子結構且在兩個分子鏈末端之矽原子上具有上文所提及之含有烷氧基矽基之基團之有機聚矽氧烷較佳。作為組份(A2)，具有直鏈分子結構且在一個分子鏈末端之矽原子上具有上文所提及之含有烷氧基矽基之基團之有機聚矽氧烷較佳。
組份(A)作為整體在25℃下之黏度不受限制，但較佳在100至1,000,000mPas範圍內，且更佳在100至100,000mPas範圍內。在組份(A)之黏度不小於上文所給出範圍之最小值時，所得聚矽氧橡膠固化產物之機械強度經改良，且在該黏度不大於上文所給出範圍之最大值時，所得組合物之處置及加工性經改良。
組份(A)中組份(A1)及組份(A2)之質量比較佳係1：10至10：1，更佳1：9至9：1，甚至更佳1：7至7：1，且尤佳1：5至5：1。組份(A1)及組份(A2)之質量比在此範圍中時，自本發明組合物獲得之聚矽氧橡膠固化產物可具有適宜柔軟度，且因此可改良此聚矽氧橡膠固化產物之黏著且可抑制滲油之發生。
產生組份(A1)或組份(A2)之方法之實例包括日本未審查專利申請公開案第S62-207383A號及第S62-212488A號中所述之方法。
組份(B)係用於使自本發明組合物獲得之聚矽氧橡膠固化產物適宜地柔軟，且用於改良黏著之組份。其係在分子鏈中之矽原子上沒有羥基及烷氧基之有機聚矽氧烷。鍵結至組份(B)中之矽原子之並非羥基及烷氧基之基團之實例包括烷基，例如甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基、癸基及十八烷基；環烷基，例如環戊基及環己基；烯基，例如乙烯基、烯丙基、丁烯基、戊烯基、己烯基及庚烯基；芳基，例如苯基、甲苯基、二甲苯基及萘基；芳烷基，例如苄基、苯乙基及苯丙基；及鹵代烷基，例如3-氯丙基及3,3,3-三氟丙基。烷基、環烷基、烯基或芳基較佳，且甲基、乙烯基或苯基更
佳。組份(B)之實例包括在兩個分子末端經二甲基乙烯基矽氧基封端之二甲基聚矽氧烷及在兩個末端經三甲基矽氧基封端之二甲基聚矽氧烷及諸如此類。組份(B)之分子結構不受限制且(例如)可具有直鏈、部分具支鏈直鏈、具支鏈或環狀分子結構，其中直鏈、部分具支鏈直鏈或具支鏈分子結構較佳。組份(B)在25℃下之黏度不受限制，但較佳在10至1,000,000mPas範圍內，且更佳在50至100,000mPas範圍內。在組份(B)之黏度不小於上文所給出範圍之最小值時，可控制組份(B)自所得聚矽氧橡膠固化產物之滲出，且在該黏度不大於上文所給出範圍之最大值時，所得組合物之處置及加工性經改良。
對組份(B)之含量無限制，但(例如)其相對於100質量份數之組份(A)在1至100質量份數範圍內，較佳在1至80質量份數範圍內，更佳在1至70質量份數範圍內，且尤佳在1至60質量份數範圍內。在組份(B)之含量大於或等於上文所給出範圍之最小值時，所得組合物具有良好黏著，且在該含量小於或等於上文所給出範圍之最大值時，可控制組份(B)自所得聚矽氧橡膠固化產物之滲出。具體而言，組份(B)之含量相對於100質量份數之組份(A)較佳在15至60質量份數範圍內，此乃因對有機樹脂具有良好黏著。
組份(C)係用作本發明組合物之交聯劑之組份，且係表示為以下通式之烷氧基矽烷：R4 bSi(OR5)(4-b)
(其中R4係單價烴基，R5係烷基，且b係0至2)
或其部分水解縮合物。
在該式中，R4係相同或不同單價烴基，其實例包括烷基，例如甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基、癸基及十八烷基；環烷基，例如環戊基及環己基；烯基，例如乙烯基、烯丙基、丁烯基、戊烯基、己烯基及庚烯基；芳基，例如苯基、甲苯基、
二甲苯基及萘基；芳烷基，例如苄基、苯乙基及苯丙基；及鹵代烷基，例如3-氯丙基及3,3,3-三氟丙基。烷基、環烷基、烯基或芳基較佳，且甲基更佳。此外，在該式中，R5係相同或不同烷基，其實例包括甲基、乙基、丙基、丁基、戊基及己基。甲基較佳。
組份(C)之實例包括二官能烷氧基矽烷，例如二甲基二甲氧基矽烷、甲基苯基二甲氧基矽烷及二苯基二甲氧基矽烷；三官能烷氧基矽烷，例如甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷、乙烯基三甲氧基矽烷及苯基三甲氧基矽烷；四官能烷氧基矽烷，例如四甲氧基矽烷及四乙氧基矽烷；及其部分水解縮合物。組份(C)可係單獨使用或用作混合物之兩種或更多種之組合之該等烷氧基矽烷或其部分水解縮合物中之一者。
對組份(C)之含量無限制，但(例如)其相對於100質量份數之組份(A)在0.5至30質量份數範圍內，較佳在0.5至20質量份數範圍內，更佳在0.5至15質量份數範圍內，且尤佳在0.5至10質量份數範圍內。在組份(C)之含量不小於上文所給出範圍之最小值時，所得組合物具有足夠固化性且所得組合物在水分封阻下之儲放壽命經改良，且在該含量不大於上文所給出範圍之最大值時，所得組合物藉由空氣中之水分快速固化。
組份(D)係促進本發明組合物交聯之縮合反應觸媒。此組份(D)之實例包括錫化合物，例如二新癸酸二甲基錫及辛酸亞錫；鈦化合物，例如四(異丙氧基)鈦、四(正丁氧基)鈦、四(第三丁氧基)鈦、二(異丙氧基)雙(乙基乙醯乙酸)鈦、二(異丙氧基)雙(甲基乙醯乙酸)鈦及二(異丙氧基)雙(乙醯基丙酮酸)鈦及諸如此類。
對組份(D)之含量無限制，但(例如)其相對於100質量份數之組份(A)在0.1至10質量份數範圍內，且較佳在0.1至6質量份數範圍內。在組份(D)之含量不小於上文所給出範圍之最小值時，所得組合物藉由
空氣中之水分快速固化，且在該含量不大於上文所給出範圍之最大值時，所得組合物之儲放壽命經改良。
本發明之可室溫固化之聚矽氧橡膠組合物亦可含有除組份(A)至(D)外之組份；例如，其可進一步含有下文之組份(E)至(F)。
組份(E)係黏著促進劑，其用於改良對本發明組合物在固化期間所接觸有機樹脂之黏著。組份(E)之黏著促進劑之實例包括含有環氧基之烷氧基矽烷，例如3-縮水甘油氧基三甲氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷、3-縮水甘油氧基丙基甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷及4-氧基矽烷基丁基三甲氧基矽烷；含有丙烯酸基團之烷氧基矽烷，例如3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷及3-丙烯醯氧基丙基三甲氧基矽烷；含有胺基之烷氧基矽烷，例如3-胺基丙基三甲氧基矽烷、3-胺基丙基三乙氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷及N-苯基-3-胺基丙基三甲氧基矽烷；及上述含有環氧基之烷氧基矽烷及上述含有胺基之烷氧基矽烷之反應混合物(例如卡巴氮雜矽三環(carbasilatrane))。上述含有環氧基之烷氧基矽烷及上述含有胺基之烷氧基矽烷之反應混合物較佳。製備上述含有環氧基之烷氧基矽烷及上述含有胺基之烷氧基矽烷之該等反應混合物之方法的實例包括日本審查專利申請公開案第S55-41702A號及第H07-113083A號中闡述之方法。
組份(E)之含量不受限制，前提係其係可賦予對本發明組合物在固化期間所接觸有機樹脂之足夠黏著之量，但其相對於100質量份數之組份(A)較佳在0.01至10質量份數範圍內，且更佳在0.01至5質量份數範圍內。在組份(E)之含量不小於上文所給出範圍之最小值時，對有機樹脂具有足夠黏著，且在該含量不大於上文所給出範圍之最大值時，所得組合物藉由空氣中之水分快速固化。
組份(F)係強化填充劑，其用於賦予藉由固化本發明組合物獲得之聚矽氧橡膠固化產物以機械強度，且改良自基板之脫模性。組份(F)之實例包括發煙二氧化矽細粉、沈澱二氧化矽細粉、熔融二氧化矽細粉、烘乾二氧化矽細粉、發煙二氧化鈦細粉、玻璃纖維及藉由用有機矽烷、矽氮烷及矽氧烷寡聚物對該等細粉進行表面處理獲得之疏水化細粉。儘管對組份(F)細粉之顆粒直徑無具體限制，但根據使用雷射繞射/散射型粒徑分佈之量測，依照中值直徑，其可(例如)在0.01微米至1000微米範圍內。
組份(F)之含量不受限制，但相對於100質量份數之組份(A)較佳係0.1至50質量份數。
另外，本發明組合物亦可含有其他可選組份，前提係不妨礙本發明之目標，其實例包括非強化填充劑，例如石英細粉、碳酸鈣細粉、矽藻土細粉、氫氧化鋁細粉、氧化鋁細粉、氫氧化鎂細粉、氧化鎂細粉、氧化鋅細粉、碳酸鋅細粉及藉由用有機矽烷、矽氮烷及矽氧烷寡聚物對該等細粉進行表面處理獲得之疏水化細粉；有機溶劑；抗真菌劑；阻燃劑；抗熱劑；塑化劑；搖變性賦予劑；固化促進劑；佈線或電極之腐蝕/遷移抑制劑及/或諸如碳黑等顏料。
本發明可藉由將組份(A)至(D)及視需要組份(E)及(F)及其他可選組份在水分封阻下均勻混合來產生。混合聚矽氧組合物各組份之方法可為習用已知方法且並無具體限制，但通常藉由簡單攪拌來均勻混合。此外，在含有諸如無機填充劑或諸如此類等固體組份作為可選組份時，更佳使用混合裝置來混合。此一混合裝置並無具體限制，但例示為單螺桿或雙螺桿連續混合器、雙滾筒、Ross混合器、Hobart混合器、牙科混合器、行星式混合器、捏合機混合器、Henschel混合器及諸如此類。以此方式製備之本發明混合物可藉由在水分封阻下密封於氣密性容器中長時間儲存。
本發明之聚矽氧橡膠固化產物係藉由固化上述可室溫固化之聚矽氧橡膠組合物來獲得。固化可室溫固化之聚矽氧橡膠組合物之方法並無具體限制，但通常組合物可藉由與空氣中之水分接觸而快速固化，以形成聚矽氧橡膠固化產物。此一聚矽氧橡膠固化產物展現對固化期間所接觸基板之良好黏著且抑制滲油之發生。
聚矽氧橡膠固化產物可展現對多種基板之良好黏著。該等基板之實例包括諸如以下之多種基板：玻璃、陶瓷、灰泥、混凝土、木材、塑膠及金屬。塑膠基板之實例包括熱固性樹脂，例如環氧樹脂、酚樹脂、尿素樹脂、三聚氰胺樹脂及矽樹脂；及熱塑性樹脂，例如聚碳酸酯樹脂、聚酯樹脂、ABS樹脂、耐綸(nylon)樹脂、聚氯乙烯樹脂、丙烯腈樹脂、聚對苯二甲酸丁二酯樹脂、聚苯硫醚樹脂、聚伸苯基樹脂及聚對苯二甲酸乙二酯樹脂。金屬基板之實例包括諸如以下等金屬：銅、不銹鋼、鐵、鋅板、錫板、黃銅、鋅及鎳。
本發明電子裝置提供有上述聚矽氧橡膠固化產物。電子裝置並無具體限制，但例示為含有以下之電子裝置：其中形成金屬氧化物膜電極(例如氧化銦錫(ITO))之電路或電極，及基板(例如玻璃、環氧樹脂、聚醯亞胺樹脂、酚樹脂、陶瓷或諸如此類)上之銀、銅、鋁、金或諸如此類之金屬電極。該等電極之實例包括以下之電極：液晶顯示器(LCD)、平板顯示器(FPD)及平板顯示裝置。本發明組合物可用於塗佈該等電極。本發明電子裝置可用於附加零件，此乃因聚矽氧橡膠固化產物展現對基板之高黏著，且因其可抑制滲油之發生而具有良好可靠性。
現將使用實踐實例闡述本發明之可室溫固化之聚矽氧橡膠組合
物。注意，在實踐實例中，黏度係使用B型黏度計根據JIS K 7117-1在25℃下量測之值。另外，如下評估藉由固化可室溫固化之聚矽氧橡膠組合物獲得之聚矽氧橡膠固化產物對基板之黏著及滲油之發生。
以1mm厚度在多種基板上形成由可室溫固化之聚矽氧橡膠組合物組成之黏著層，且將其在25℃、50% RH下靜置7天以固化組合物，由此產生樣品。將樣品切割成條(長度4.0cm×寬度1.0cm×厚度0.5mm)，且在180度方向上以50mm/分鐘之速度實施剝離測試。肉眼觀察黏著劑斷裂面之狀況，且測定引起內聚破壞之聚矽氧橡膠固化產物之比例作為內聚破壞(CF)率。高CF率表明，聚矽氧橡膠固化產物具有對基板之良好黏著。使用自玻璃(GL)及耐綸66(NY66)製得之基板作為基板。
將0.2g可室溫固化之聚矽氧橡膠組合物滴至磨砂玻璃板上，且將其在25℃、50% RH下靜置7天，且用肉眼檢查在可室溫固化之聚矽氧橡膠組合物固化後，滲出(滲流)油組份之存在或不存在。
使用以下原材料來製備實踐實例及比較實例之可室溫固化之聚矽氧橡膠組合物。
組份(A1)：直鏈二甲基聚矽氧烷，其黏度為500mPas，且在兩個分子末端之矽原子上具有表示為下式之含有三甲氧基矽基乙基之基團：
組份(A2)：直鏈二甲基聚矽氧烷，其黏度為500mPas，且在一個分子末端之矽原子上具有表示為下式之含有三甲氧基矽基乙基之基
團：
組份(B-1)：直鏈二甲基聚矽氧烷，其在兩個分子末端之矽原子上具有二甲基乙烯基矽氧基，且黏度為400mPas
組份(B-2)：直鏈二甲基聚矽氧烷，其在兩個分子末端之矽原子上具有三甲基矽氧基，且黏度為500mPas
組份(C)：甲基三甲氧基矽烷
組份(D)：二(異丙氧基)雙(乙基乙醯乙酸)鈦
組份(E)：卡巴氮雜矽三環(環氧矽烷與胺基矽烷之反應混合物)
組份(F)：經六甲基二矽氮烷表面處理之發煙二氧化矽粉末，其比表面積依據BET為130m2/g
注意，上文組份(A1)及組份(A2)係根據日本未審查專利申請公開案第S62-207383A號中所述之方法來製備。
可室溫固化之聚矽氧橡膠組合物係藉由在水分封阻下以表1中所示之摻和量均勻混合組份(A1)、組份(A2)、組份(B-1)、組份(B-2)、組份(C)、組份(D)、組份(E)及組份(F)來製備。評估藉由固化該等可室溫固化之聚矽氧橡膠組合物獲得之聚矽氧橡膠固化產物之黏著及滲油之發生。彼等結果顯示於表1中。
工業適用性
本發明之可室溫固化之聚矽氧橡膠組合物藉由與空氣中之水分接觸在室溫下固化，且形成聚矽氧橡膠固化產物，其展現對固化期間所接觸基板之良好黏著且能抑制滲油之發生。因此，其有利於附加電氣及電子零件，且有利地作為引入高可靠性之密封劑、黏著劑或防潮塗佈劑。
Claims (14)
- 一種可室溫固化之聚矽氧橡膠組合物，其包含：(A)含有以下組份(A1)及(A2)之混合物：(A1)有機聚矽氧烷，其在每分子中在分子鏈中之矽原子上具有至少兩個表示為以下通式之含有烷氧基矽基之基團：(其中R1係相同或不同的沒有脂肪族不飽和鍵之單價烴基，R2係烷基，R3係相同或不同伸烷基，a係0至2之整數，且p係1至50之整數)；(A2)有機聚矽氧烷，其在每分子中具有一個上述含有烷氧基矽基之基團，其中該組份(A)中該組份(A1)對該組份(A2)之質量比係1：10至10：1；(B)直鏈有機聚矽氧烷，其在兩個分子末端具有鍵結至矽原子之二甲基乙烯基矽氧基，其在分子鏈中之矽原子上沒有羥基及烷氧基；(C)表示為以下通式之烷氧基矽烷：R4 bSi(OR5)(4-b)(其中R4係單價烴基，R5係烷基，且b係0至2)或其部分水解縮合物；及(D)縮合反應觸媒。
- 如請求項1之可室溫固化之聚矽氧橡膠組合物，其中該組份(A)作為整體在25℃下之黏度係在100至1,000,000mPas範圍內。
- 如請求項1之可室溫固化之聚矽氧橡膠組合物，其中該組份(A1)係在兩個分子末端之矽原子上具有含有烷氧基矽基之基團之直鏈有機聚矽氧烷，且該組份(A2)係在一個分子末端之矽原子上具有含有烷氧基矽基之基團之直鏈有機聚矽氧烷。
- 如請求項1之可室溫固化之聚矽氧橡膠組合物，其中該組份(A)中之該含有烷氧基矽基之基團係表示為下式之基團：
- 如請求項1之可室溫固化之聚矽氧橡膠組合物，其中該組份(B)在25℃下之黏度係在10至1,000,000mPas範圍內。
- 如請求項1之可室溫固化之聚矽氧橡膠組合物，其中該組份(C)係甲基三甲氧基矽烷。
- 如請求項1之可室溫固化之聚矽氧橡膠組合物，其相對於100質量份數之該組份(A)含有1至100質量份數之該組份(B)，含有0.5至30質量份數之該組份(C)，且含有0.1至10質量份數之該組份(D)。
- 如請求項1之可室溫固化之聚矽氧橡膠組合物，其進一步包含(E)黏著促進劑。
- 如請求項8之可室溫固化之聚矽氧橡膠組合物，其中該組份(E)係選自由以下組成之群之至少一種類型之黏著促進劑：含有環氧基之烷氧基矽烷、含有丙烯酸基團之烷氧基矽烷、含有胺基之烷氧基矽烷及含有環氧基之烷氧基矽烷與含有胺基之烷氧基矽烷之反應混合物。
- 如請求項1之可室溫固化之聚矽氧橡膠組合物，其進一步包含(F)強化填充劑。
- 如請求項10之可室溫固化之聚矽氧橡膠組合物，其中該組份(F)係選自由以下組成之群之至少一種類型之強化填充劑：發煙二氧化矽細粉、沈澱二氧化矽細粉、烘乾二氧化矽細粉及發煙氧化鈦細粉。
- 一種聚矽氧橡膠固化產物，其係藉由固化如請求項1之可室溫固化之聚矽氧橡膠組合物來獲得。
- 一種電子裝置，其提供有如請求項12之聚矽氧橡膠固化產物。
- 一種使用請求項12之聚矽氧橡膠固化產物修復電子裝置的方法。
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| CN109777342A (zh) * | 2018-12-29 | 2019-05-21 | 江苏创景科技有限公司 | 一种用于双组分有机硅灌封胶的固化促进剂及其应用 |
| US11254838B2 (en) | 2019-03-29 | 2022-02-22 | Ppg Industries Ohio, Inc. | Single component hydrophobic coating |
| EP3986968B1 (en) | 2019-06-21 | 2025-09-03 | Dow Silicones Corporation | Thermal conductive silicone composition |
| CN113950511B (zh) * | 2019-06-21 | 2024-01-16 | 美国陶氏有机硅公司 | 用于制备触变可固化有机硅组合物的方法 |
| CN112011309A (zh) * | 2020-09-04 | 2020-12-01 | 忍嘉有机硅新材料(东莞)有限公司 | 一种粘接pc、pa的自粘型液态硅橡胶及其制备方法 |
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