TWI651991B - Conductive circuit manufacturing method - Google Patents

Abstract

A method for manufacturing a conductive circuit includes opening a plurality of recesses in a predetermined path on a surface of a dielectric substrate, wherein a depth direction of each recess is not parallel to a surface normal direction; and a conductive adhesive is applied along the predetermined path to the dielectric. The surface of the substrate; in a vacuumed environment, the conductive adhesive is penetrated into the cavity by brushing and pressing; and the conductive adhesive is cured to form a conductive circuit.

Description

Manufacturing method of conductive line

A method for manufacturing a conductive circuit, in particular, a method for manufacturing a conductive circuit after surface treatment on a substrate.

The fabrication of conductive lines is common in printed circuit boards, solar cells or semiconductor processes. There are also many requirements for making conductive lines other than the above fields, such as automobile, electric vehicle manufacturing, 3C product manufacturing, etc. It can be seen that the application fields of designing conductive lines are quite wide.

Traditional conductive lines are made by wet etching and etching thin films to make conductive layers or dielectric layers. The process is simple and the etching speed is fast. However, it uses a chemical reaction between the liquid phase and the solid phase, which requires a large number of corrosive chemicals to be etched, and a relatively large amount of waste liquid is also generated after washing, which causes pollution to the environment and also easily causes harm to the human body.

In addition, the traditional conductive circuit does not last long after it is manufactured. The reason is that the adhesion between the conductive layer and the substrate is poor, and the conductive layer and the substrate are easily detached. Once the detachment occurs, the It may cause the whole circuit to be disconnected, and the applied product or commodity will lose its function.

In view of this, the present invention provides a method for manufacturing a conductive circuit, which includes opening a plurality of recesses in a predetermined path on a surface of a dielectric substrate, wherein the depth direction of each recess is not parallel to the surface normal direction Apply a conductive adhesive to the surface of the dielectric substrate along a predetermined path; in a vacuumed environment, make the conductive adhesive deep into the cavity by means of brush printing pressure; and cure the conductive adhesive to form a conductive circuit.

The present invention also provides a method for manufacturing a conductive circuit according to an embodiment, including opening a plurality of recesses in a predetermined path on a surface of a dielectric substrate, wherein a depth direction of each recess is not parallel to a surface normal direction; coating Conductive adhesive is on the surface of the dielectric substrate; in a vacuumed environment, the conductive adhesive is penetrated into the cavity by brushing and pressing; curing the conductive adhesive; and removing the conductive adhesive outside the predetermined path to form a conductive line.

As in the above-mentioned method for manufacturing a conductive circuit, in one embodiment, the cavity penetrates the dielectric substrate from the surface.

As in the above-mentioned method for manufacturing a conductive circuit, in one embodiment, the cavity does not penetrate the dielectric substrate.

As described above for the manufacturing method of the conductive circuit, in one embodiment, the cavity is opened by laser.

As described above for the manufacturing method of the conductive circuit, in one embodiment, the cavity is opened by plasma etching.

As described above for the manufacturing method of the conductive circuit, in one embodiment, the conductive adhesive is coated on the surface by means of dispensing.

As described above, in one embodiment, the method for manufacturing a conductive circuit is a method of heating a plurality of metal powders into a molten state, forming a conductive paste, and coating the conductive adhesive on the surface.

As described in the above-mentioned method for manufacturing a conductive circuit, in one embodiment, a conductive paste is formed by laser metal deposition (LMD), and then coated on the surface.

As described above for the manufacturing method of the conductive circuit, in one embodiment, the conductive adhesive is cured by laser light irradiation.

As described above for the manufacturing method of the conductive circuit, in one embodiment, the surface has a three-dimensional space.

Please refer to FIGS. 1 and 2A to 2E. FIG. 1 is a flowchart of steps in an embodiment of a method for manufacturing a conductive circuit according to the present invention. 2A to 2E are schematic diagrams of states of steps in the manufacturing method shown in FIG. 1, respectively.

The manufacturing method includes a hole-opening step, a coating step, a pressing step, and a curing step, which are described as follows:

Step of hole-opening (step S1): as shown in FIG. 2A, a plurality of cavities 12 are opened in a predetermined path M on the surface 11 of the dielectric substrate 1, and the depth direction L of each of the cavities 12 and the direction N of the surface 11 are normal. Not parallel. The dielectric substrate 1 is, for example, a plastic product. In one embodiment, the dielectric substrate 1 is made of epoxy resin. The direction in which the cavity 12 extends inwardly from the surface 11 of the dielectric substrate 1 after being opened is not parallel to the normal direction N perpendicular to the surface 11.

In other words, the cavity 12 is opened at a predetermined position on the surface 11, and the normal direction N is perpendicular to the location of the predetermined opening on the surface 11. Therefore, the depth direction L of the cavity 12 is relative to the location of the predetermined opening on the surface 11. In other words, it extends obliquely toward the interior of the surface. The depth direction L of the cavity 12 is at an angle to the normal direction N of the surface 11 (the planned opening position). The range is 90 degrees to approximately 0 degrees. The requirements can control the angle of the processing platform on which the cavity 12 is opened, or the angle of the processing platform on which the dielectric substrate 1 is placed so that the cavity 12 conforms to the structure described above. The larger the included angle is, the more obvious the manner in which the depth direction L of the cavity 12 is inclined, and the smaller the included angle is, the closer the depth direction L of the cavity 12 is to the normal direction N.

Coating step (step S2): As shown in FIG. 2B, a conductive paste 2 is coated on the surface 11 of the dielectric substrate 1 along a predetermined path M. The predetermined path M is a path preset by a user or a related operator to form a conductive line.

Pressing step (step S3): in a vacuumed environment, the conductive adhesive 2 is penetrated into the cavity 12 by brush printing and pressing (as shown in FIG. 2C).

In one embodiment, during or after the coating step (step S2), that is, by using an environmental vacuum method, the conductive adhesive 2 can be deeply filled in the cavity 12 below it. In another embodiment, during or after the coating step (step S2), in addition to using the environment to evacuate, and pressurizing with brushing, that is, controlling the pressure of the brushing plate to control the conductive adhesive 2 from overflowing, The pressing speed of the printing plate is further controlled to control the conductive adhesive 2 to flow into the cavity 12.

Curing step (step S4): Please refer to FIG. 2D to FIG. 2E to cure the conductive adhesive 2 to form a conductive circuit 3. The conductive paste 2 is applied on the surface 11 of the dielectric substrate 1 in a fluid state or a molten state. In one embodiment, the conductive adhesive 2 is cured by heating and drying at a high temperature. For example, the conductive adhesive 2 is heated by laser irradiation to cure it. In another embodiment, the conductive adhesive 2 is cured in a natural drying manner. The cured conductive adhesive 2 realizes the conductive circuit 3 (as shown in FIG. 2E). In another embodiment, the conductive adhesive 2 can be cured by photo-curing, such as irradiating ultraviolet light.

By opening the inclined cavity 12, after the conductive adhesive 2 is cured, the portion of the conductive adhesive 2 deeply filled in the cavity 12 provides more gripping force components different from the normal direction N of the surface 11, so that the conductive adhesive 2 2 is not easily separated from the surface 11.

Please refer to FIG. 3, which is a partial schematic view of a surface 11 of a dielectric substrate 1 according to an embodiment of a method for manufacturing a conductive circuit according to the present invention. In this embodiment, the plurality of cavities 12 are not necessarily consistent with the shape of the predetermined path M, and may be opened only at a local position of the predetermined path M. For example, the cavities 12 are enclosed in a circle, arranged in a diagonal line, etc. After the conductive adhesive 2 is cured into the conductive circuit 3, it provides the gripping force of the other oblique components of the conductive circuit 3, so that the conductive circuit 3 is not easily separated from the surface 11.

The pore diameter of the cavity 12 is in micrometers (µm). Therefore, the opening on the surface 12 of the dielectric substrate 1 does not affect the appearance of the dielectric substrate 1. In the above embodiment, the conductive adhesive 2 covers the cavity 12 along the predetermined path M, and the structure 11 does not have the cavity 12 stored on the surface 11 after being cured.

Please refer to FIGS. 4 and 5A to 5F. FIG. 4 is a flowchart of steps in another embodiment of a method for manufacturing a conductive circuit 3 according to the present invention. 5A to 5F are schematic diagrams of states of steps in the manufacturing method shown in FIG. 4 respectively.

The manufacturing method includes a hole-opening step, a coating step, a pressing step, a curing step, and a removing step, which are explained as follows:

The hole-opening step (step P1): a plurality of recesses 12 are opened in a predetermined path M on the surface 11 of the dielectric substrate 1, wherein the depth direction of each recess 12 is not parallel to the normal direction of the surface 11. Please refer to the relevant descriptions above, and will not repeat them here.

Coating step (step P2): coating the conductive adhesive 2 on the surface 11 of the dielectric substrate 1. The difference from the above-mentioned embodiment is that the applied range is an area or the entire surface on the surface 11 including the predetermined path M, and the surface 11 is not only applied along the predetermined path M. The coating method is, for example, printing the conductive adhesive 2 on the surface 11 of the dielectric substrate 1. Alternatively, the conductive adhesive 2 is coated on the surface 11 of the dielectric substrate 1 by a spin coating method using centrifugal force.

Pressing step (step P3): in a vacuumed environment, the conductive adhesive 2 is penetrated into the recess 12 by means of brush printing and pressing. Please refer to the above description of using the environment to evacuate the conductive adhesive 2 into the recess 12, which is not repeated here.

Curing step (step P4): curing the conductive adhesive 2. The conductive adhesive 2 is cured by heating, light, or natural drying. At this time, the cured conductive adhesive 2 forms a thick film-like conductive layer.

Removal step (step P5): The conductive adhesive 2 (ie, area E) other than the predetermined path M is removed to form a conductive line 3. In other words, after planning a predetermined route (that is, the required pattern of the conductive circuit 3) on the cured conductive adhesive 2 (conductive layer), the area E is removed, and the portion left on the surface 11 is the conductive circuit in question. 3.

In one embodiment, laser etching is used to remove unnecessary portions in the conductive layer. In one embodiment, a scraper or a engraving method is used to scrape off unnecessary parts. The invention does not limit the manner of removal.

In another embodiment, a laser can be used to thin the conductive adhesive 2 outside the predetermined path M, and then the entire surface 11 is etched with a large area of the plasma until the conductive adhesive 2 in the original thinned area E disappears or becomes ineffective. Conductive with the conductive paste 2 of the predetermined path M.

In the above step of etching the entire surface 11 with a plasma, the plasma etching of the conductive adhesive 2 (such as the depth of the etching, the amount of etching, etc.) can be controlled by presetting the etching time. In another embodiment, an electrical measurement method may be used to determine whether the required conductive circuit 3 is reached to determine whether to continue etching or stop etching.

In some embodiments, the opened cavity 12 is a through-hole structure, that is, penetrates the body of the dielectric substrate 1. In some embodiments, the cavity 12 is a blind hole structure that does not penetrate the body of the dielectric substrate 1. The cavity 12 is a through-hole structure or a blind-hole structure, and according to the design and requirements of the operator or user, and the properties of the dielectric substrate 1 (such as thickness, surface strength), the present invention does not have this limitation.

In addition, in some embodiments, the depth direction L of some of the recesses 12 may be the same direction or different directions. It depends on the design of the conductive line 3 of the operator and the user and the degree to which the conductive adhesive 2 is required to be attached to the surface 11, and the present invention is not limited.

In one embodiment, the above-mentioned opening cavity 12 is opened by laser drilling, and the surface of the dielectric substrate 1 (such as glass, acrylic, or semiconductor) is sintered at a high temperature by using a laser beam to achieve the opening. The purpose of the pocket 12. In one embodiment, the cavities 12 in the same depth direction L on the surface 11 of the dielectric substrate 1 are opened first, and then the cavities 12 in different depth directions L are opened. In one embodiment, the cavity 12 is opened at a predetermined position on the surface 11 of the dielectric substrate 1 in a random manner using a laser beam.

In another embodiment, the cavity 12 is opened by plasma etching, and the surface of the dielectric substrate 1 is etched by ion collision and bombardment. Compared with wet etching, the method of opening the cavity 12 is quite environmentally friendly, unlike wet etching which requires a large amount of chemicals (such as hydrofluoric acid, nitric acid or phosphoric acid) to etch the dielectric substrate 1. A large amount of waste liquid is generated, which is easy to pollute the environment and difficult to recycle after discharge. Moreover, plasma etching is anisotropic etching, which is more helpful for the formation of the cavity 12 than the isotropic etching of the wet etching.

In the foregoing embodiment, the conductive adhesive 2 is applied to the surface 11. In one embodiment, the conductive adhesive 2 is applied to the surface 11 in a dispensing manner. It means that the conductive adhesive 2 in a liquid or glued state is coated on the surface 11 of the dielectric substrate 1 by a dispensing method. In one embodiment, the conductive adhesive 2 is a copper adhesive. In some embodiments, silver glue is used.

In another embodiment, the method of applying the conductive paste 2 to the surface 11 is to heat a plurality of metal powders into a molten state, and the conductive paste 2 is formed and then coated on the surface 11 of the dielectric substrate 1.

In one embodiment, a laser metal deposition (LMD) method is used. The metal powder material sprayed at the same time is melted and coated on the surface 11 of the dielectric substrate 1 by using the energy of the laser. After the conductive line 3 is formed. In one embodiment, the metal powder material used is copper powder. Laser metal deposition has the advantages of short processing time, easy processing, and relatively low manufacturing cost.

Please refer to FIG. 6, which is a schematic diagram of a state of a surface 11 of a dielectric substrate 1 according to an embodiment of a method for manufacturing a conductive circuit 3 according to the present invention. The manufacturing method of the conductive circuit 3 can be applied to a variety of three-dimensional dielectric substrates 1. As shown in FIG. 3, the surface 11 of the dielectric substrate 1 bridges from a two-dimensional space to occupy a three-dimensional space. In other words, the manufacturing method of the conductive circuit 3 in the embodiment of the present invention is not limited to the two-dimensional flat surface 11. In some embodiments, the surface 11 has a three-dimensional space, such as a concave curved surface, a convex curved surface, or even a surface with a turning angle. 11. In this way, the manufacturing method of the conductive circuit 3 can be applied to a dielectric substrate 1 including various surface 11 shapes, such as a remote control for electric vehicles, a steering wheel circuit, a car shell circuit, a substrate for a robot, or a substrate for an electronic product.

An embodiment of the present invention provides a method for manufacturing a conductive circuit, wherein the depth direction of the cavity is not parallel to the normal line on the surface of the dielectric substrate, and is opened in an oblique manner. And the conductive glue is used to make deep filling of the cavity in a pressurized manner. In this way, the conductive adhesive can be closely fitted to the surface when the conductive adhesive is cured, and the conductive circuit can be used for a long time without being detached from the surface. Even if an external force is applied, the structure of the cavity can disperse the external force because the cavity is fixedly connected to the conductive adhesive (conducting circuit), so the conductive circuit is not easily separated from the surface.

In addition, in an embodiment of the present invention, the surface of the dielectric substrate is not limited to a plane, and the surface has a three-dimensional space. For example, the surface of the dielectric substrate occupies three-dimensional space. Therefore, the same applies to a dielectric substrate with a complicated surface structure. , To expand the scope of application of the production of conductive lines.

1‧‧‧ Dielectric substrate

11‧‧‧ surface

12‧‧‧Dent

2‧‧‧ conductive adhesive

3‧‧‧ conductive line

N‧‧‧normal direction

L‧‧‧ Depth

M‧‧‧ scheduled route

F‧‧‧Printing pressure

E‧‧‧Area

S1‧‧‧ Open a plurality of recesses in a predetermined path on the surface of the dielectric substrate, and the depth direction of each recess is not parallel to the surface normal direction

S2‧‧‧ Apply conductive adhesive to the surface of the dielectric substrate along a predetermined path

S3‧‧‧ In a vacuum environment, the conductive glue is deepened in the cavity by brushing and pressing.

S4‧‧‧ Curing conductive adhesive to form conductive circuits

P1‧‧‧ Open a plurality of recesses in a predetermined path on the surface of the dielectric substrate, wherein the depth direction of each recess is not parallel to the surface normal direction

P2‧‧‧ Coated conductive adhesive on the surface of dielectric substrate

P3‧‧‧ In a vacuum environment, the conductive glue is deep into the cavity by brushing and pressing.

P4‧‧‧cured conductive adhesive

P5‧‧‧Remove the conductive paste outside the predetermined path to form a conductive line

[FIG. 1] It is a flowchart of steps of an embodiment of a method for manufacturing a conductive circuit of the present invention. [Fig. 2A] It is a state diagram of step S1 in the manufacturing method shown in Fig. 1. [Fig. [Fig. 2B] It is a state diagram of step S2 in the manufacturing method shown in Fig. 1. [Fig. [FIG. 2C] It is a state diagram of step S3 in the manufacturing method shown in FIG. 1. [FIG. [Fig. 2D] It is a state diagram of step S4 in the manufacturing method shown in Fig. 1. [Fig. [FIG. 2E] It is a schematic diagram of the state after the step S4 in the manufacturing method shown in FIG. 1 is completed. [FIG. 3] It is a partial schematic diagram of the surface of a dielectric substrate, which is an embodiment of a method for manufacturing a conductive circuit according to the present invention. [Fig. 4] It is a flowchart of the steps of another embodiment of the method for manufacturing a conductive circuit of the present invention. [Fig. 5A] It is a schematic state diagram of step P1 in the manufacturing method shown in Fig. 4. [Fig. [Fig. 5B] It is a state diagram of step P2 in the manufacturing method shown in Fig. 4. [Fig. [FIG. 5C] It is a state diagram of step P3 in the manufacturing method shown in FIG. 4. [FIG. [Fig. 5D] It is a state diagram of step P4 in the manufacturing method shown in Fig. 4. [Fig. [FIG. 5E] It is a schematic diagram of a state after the step P5 in the manufacturing method shown in FIG. 4 is completed. [FIG. 5F] It is a schematic diagram of the state after the step P5 in the manufacturing method shown in FIG. 4 is completed. [Fig. 6] It is a schematic diagram of a surface state of a dielectric substrate according to an embodiment of a method for manufacturing a conductive circuit according to the present invention.

Claims (10)

A method for manufacturing a conductive circuit includes: opening a plurality of recesses in a predetermined path on a surface of a dielectric substrate, wherein a depth direction of each of the recesses is not parallel to a normal direction of the surface; along the predetermined path Apply a conductive adhesive to the surface of the dielectric substrate; in a vacuum environment, make the conductive adhesive penetrate into the cavities in a brushing and pressing manner; and cure the conductive adhesive to form the Conductive line. The method for manufacturing a conductive circuit according to claim 1, wherein the conductive adhesive is coated on the surface by a little glue. The method for manufacturing a conductive circuit according to claim 1, wherein a plurality of metal powders are heated to a molten state, and the conductive paste is formed and then coated on the surface. A method for manufacturing a conductive circuit includes: opening a plurality of recesses in a predetermined path on a surface of a dielectric substrate, wherein a depth direction of each recess is not parallel to a normal direction of the surface; Glue on the surface of the dielectric substrate; in a vacuum environment, make the conductive glue penetrate into the recesses by a method of brushing and pressing; solidify the conductive glue; and remove the outside of the predetermined path The conductive adhesive is used to form the conductive circuit. The method for manufacturing a conductive circuit according to claim 1 or 4, wherein the recesses penetrate the dielectric substrate from the surface. The method for manufacturing a conductive circuit according to claim 1 or 4, wherein the recesses do not penetrate the dielectric substrate. The manufacturing method of the conductive line according to claim 1 or 4, wherein the recesses are opened by a laser. The method for manufacturing a conductive circuit according to claim 1 or 4, wherein the recesses are opened by a plasma etching method. The method for manufacturing a conductive circuit according to claim 1 or 4, wherein the conductive adhesive is cured by a laser light irradiation method. The method for manufacturing a conductive circuit according to claim 1 or 4, wherein the surface has a three-dimensional space.