TWI645158B - Three dimensional measuring device - Google Patents

Abstract

A three-dimensional measuring device comprises: a light source, a beam splitter, a reflector, a sensor, and an imaging system. The three-dimensional measuring device corresponds to an interference measuring surface. The beam splitter is tilted by a first angle, the reflector is tilted by a second angle, the sensor is tilted by a third angle, and the interference measuring surface is tilted by a fourth angle.

Description

Three-dimensional measuring device

[0001] The present invention relates to a three-dimensional measuring device, and more particularly to a device for optically measuring a three-dimensional contour of a surface of a test object.

[0002] Regardless of the manufacturing or manufacturing of high-tech semiconductors in the traditional industry, the demand for the measurement and measurement of the three-dimensional contour of the surface is increasing. In addition to accuracy, speed detection is the focus of consideration by various equipment manufacturers, because the equipment with high precision and fast measurement represents quality assurance and productivity. [0003] There are many types of surface three-dimensional contour measurement techniques, each having different principles, such as stereo sensor, laser light cutting method, dispersion confocal sensor, white light interferometer, etc., and its height measurement range and resolution Degrees vary. Compared with other technologies, the white light interferometer does not limit the surface material and undulation in measurement, and its height resolution depends on the height displacement accuracy of the white light interferometer or the stage on which the object to be tested is loaded, but it cannot be ignored. Disadvantages, such as measuring the field of view is too small and the measurement speed is too slow, so this is the main reason why the general white light interferometer is difficult to use on the in-line inspection machine. 1 is an optical path diagram of a structure of a conventional white light interferometer 1001 in which an optical path 1000 is indicated by a thick line. Referring to FIG. 1, the conventional white light interferometer 1001 includes a light source 1002, a beam splitter 1003, a mirror 1004, a sensor 1005, and an imaging system 1006. The conventional white light interferometer 1001 has a corresponding interference measuring surface 1012 (the interference measuring surface 1012 is a virtual surface, indicated by a broken line), and the light emitted by the light source 1002 is transmitted and reflected by the beam splitter 1003 to the mirror 1004, respectively. The object to be tested 1007 measures the maximum interference intensity of the reflected light generated at the height of the surface of the object to be tested 1007 coincident with the interference measurement surface 1012 and the reflected light from the mirror 1004 at the pixel of the corresponding sensor 1005. In order to adjust the interference measurement surface 1012 to confirm different heights of the surface of the object to be tested 1007, the conventional white light interferometer 1001 or the stage on which the object to be tested 1007 is loaded must be moved vertically (z direction). The interference measurement surface 1012 is vertically moved and scanned to obtain the height distribution of the surface of the object 1007 (the xy direction, the y direction is parallel to the paper entrance direction in FIG. 1), and then moves to the next level. position. [0005] For example, for a 12-inch (about 300 mm diameter) wafer, if the conventional white light interferometer 1001 with a objective lens is used for the whole area measurement, the field of view of the measurement is assumed to be 25 mm, which needs to be performed at a plurality of different horizontal positions. Vertical movement scan measurements allow for complete wafer surface height distribution measurements. Moreover, the high resolution of the conventional white light interferometer 1001 is determined by the high displacement accuracy of the conventional white light interferometer 1001 or the stage, and the cost required to achieve high altitude resolution is high. Moreover, the conventional white light interferometer 1001 needs to be used in conjunction with a microscope system, and thus is costly.

An example of an embodiment of the present invention may be a three-dimensional measuring device, comprising: a light source; a beam splitter, the beam splitter is inclined at a first angle with respect to a horizontal direction; and the reflector, the surface of the reflector corresponds to a reference surface, reference The surface is inclined by a second angle with respect to the vertical direction; the sensor, the surface of the sensor corresponds to the imaging surface, the imaging surface is inclined by a third angle or parallel to the horizontal direction; the imaging system, the imaging system is located in the beam splitter and the sensor The three-dimensional measuring device has an interference measuring surface, and the interference measuring surface is inclined by a fourth angle with respect to the horizontal direction, wherein the horizontal splitter is between the light source and the reference surface, and the vertical splitter is on the imaging surface And between the interferometric measuring surfaces, wherein the distance from the arbitrary point on the spectroscope to the reference plane in the horizontal direction is equal to the distance in the vertical direction from the point on the spectroscope to the interferometric measuring surface, wherein when measuring At the time, the light irradiated by the three-dimensional measuring device toward the object to be tested is parallel to the vertical direction. An example of an embodiment of the present invention may be a three-dimensional measuring device, wherein an imaging surface of a third angle that is inclined or parallel with respect to a horizontal direction passes through the imaging system and has a corresponding tilt or parallel with respect to the horizontal direction. The object surface, the imaging surface and the object surface conform to the Scheimpflug Principle, and adjust the third angle of the imaging surface to make the object surface coincide with the oblique interference measurement surface. An example of an embodiment of the present invention may be a three-dimensional measuring device, wherein a surface of the reflector is such that light emitted from the light source and penetrating the beam splitter can partially reflect light parallel to the light when the reflector is illuminated. Light emitted by the light source and penetrating the beam splitter. An example of an embodiment of the present invention may be a three-dimensional measuring device, wherein when measuring, if the height of the surface of the object to be tested coincides with the interference measuring surface, the sensor measures the maximum interference. strength. [0010] An example of an embodiment of the present invention may be a three-dimensional measuring device, wherein the sensor is a surface sensor, the surface sensor includes a pixel array, wherein the interference measuring surface includes a corresponding pixel array For the plurality of measurement lines of the corresponding column, the inclined interference measurement surface can be regarded as a combination of the measurement lines for determining different heights, wherein when the measurement is performed, if the height of the surface of the object to be tested is consistent with the measurement line, the sense The corresponding pixel in the pixel array of the detector measures the maximum interference intensity. [0011] An example of an embodiment of the present invention may be a three-dimensional measuring device, wherein the reflector and the sensor are rotatable such that the second angle and the third angle are adjustable according to the requirements of the fourth angle. [0012] An example of an embodiment of the present invention may be a three-dimensional measuring device, wherein when the measurement is performed, the three-dimensional measuring device or the stage loaded with the object to be tested is horizontally moved to obtain different horizontal positions. The height of the surface of the object to be tested. [0013] An example of an embodiment of the present invention may be a three-dimensional measuring device, wherein when measuring, the three-dimensional measuring device or the stage equipped with the object to be tested can be continuously moved and measured once. The entire surface of the object. [0014] An example of an embodiment of the present invention may be a three-dimensional measuring device, wherein the imaging system includes at least one of: a mirror group, a transmission mirror group, or a mirror composed of a mirror and a transmission mirror. group. [0015] An example of an embodiment of the present invention may be a three-dimensional measuring device in which the surface of the reflector is stepped. [0016] As such, the present invention has at least one or more of the following advantageous effects. Since the three-dimensional measuring device of the present invention has a tilting interference measuring surface, unlike the conventional white light interferometer, the three-dimensional measuring device or the stage must be vertically moved and can only be measured in stages, and the present invention only needs to move the three-dimensionally horizontally. The measuring device or the stage can be measured and thus a continuous measurement can be carried out without the need to measure the additional precise positioning system in a fractional manner. Further, even if the interference measuring surface of the three-dimensional measuring device of the present invention is inclined, the light irradiated to the object to be tested by the three-dimensional measuring device of the present invention is still parallel to the vertical direction, so that there is no problem of shadow or vignetting. Furthermore, the height resolution of the three-dimensional measuring device of the present invention can be determined by the number of pixels and the tilt angle of the interference measuring surface, and it is easy and low in cost to achieve high altitude resolution. Moreover, the three-dimensional measuring device of the present invention does not have to use a microscope system, and can also use a large-sized sensor used in a camera system, or a lens with a wider field of view, different types and magnifications, and even an imaging system can use a telecentric system. The cost of construction can be lower and the construction method is more diverse. Since the unrestricted imaging system of the present invention may be a mirror group, a transmission mirror group, or a mirror system consisting of a mirror and a transmission mirror, a transmission mirror group such as a common type of lens is usually designed for visible light, and a mirror is used. The light source of the group is more widely applicable, and therefore the light source for the three-dimensional measuring device of the present invention can use visible light or invisible light.

[0018] Hereinafter, embodiments, examples, and examples of the present invention will be described with reference to the drawings. It is to be noted that the details of the embodiments, examples, and examples of the present invention can be changed to different forms without departing from the scope of the invention as a whole. The embodiment and the examples are intended to include a reasonable change without departing from the scope of the invention, and the embodiments, examples and examples of the invention may be arbitrarily combined as appropriate. [0019] Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 2A, 2B, 2C, 3A, 3B, 3C, 4A, 4B, 4C, 4D, and 4E. 2A is an optical path diagram showing a configuration of a three-dimensional measuring device 2001 according to an embodiment of the present invention, in which the optical path 2000 is indicated by a thick line. Referring to FIG. 2A, an example of an embodiment of the present invention may be a three-dimensional measuring device 2001, including: a light source 2002, a beam splitter 2003, a reflector 2004, a sensor 2005, and an imaging system 2006. The spectroscope 2003 is inclined at a first angle θ1 with respect to the horizontal direction (the x-y direction, the y direction is parallel to the paper-input direction in FIG. 2A, and the example of tilting with respect to the x direction is schematically shown in FIG. 2A). The surface of the reflector 2004 corresponds to the reference plane 2010 (this reference plane 2010 is a virtual plane, indicated by a broken line), and the reference plane 2010 is inclined by a second angle θ2 with respect to the vertical direction (z direction). The surface of the sensor 2005 corresponds to the imaging surface 2011 (this imaging surface 2011 is a virtual surface, indicated by a broken line), and the imaging surface 2011 is inclined by a third angle θ3 with respect to the horizontal direction or parallel to the horizontal direction. The imaging system 2006 is located between the beam splitter 2003 and the sensor 2005, wherein the three-dimensional measuring device 2001 has an interference measuring surface 2012 (this interference measuring surface 2012 is a virtual surface, indicated by a broken line, which refers to when the object to be tested is At the interference measurement surface 2012, the sensor 2005 obtains a corresponding maximum interference intensity), and the interference measurement surface 2012 is inclined by a fourth angle θ4 with respect to the horizontal direction. The horizontal direction beam splitter 2003 is between the light source 2002 and the reference plane 2010, and the vertical direction beam splitter 2003 is between the imaging plane 2011 and the interference measurement plane 2012. The distance d1 in the horizontal direction from any point on the spectroscope 2003 to the reference plane 2010 is equal to the distance d2 from the point on the beam splitter 2003 to the interference measurement plane 2012 in the vertical direction. When the measurement is performed, the light irradiated by the three-dimensional measuring device 2001 toward the object to be tested is parallel to the vertical direction. [0021] Note that this FIG. 2A is only a schematic optical path diagram, and the optical path diagram includes optical paths of imaging, illumination, and interference systems, and the actual optical path diagram may be adjusted according to different types of the three systems. Or, when other optical components are additionally placed between the optical paths, the optical path will be different. It is within the scope of the invention to provide an optical path arrangement that conforms to the spirit of the present invention. In one example of the present invention, even the position of imaging system 2006 and beam splitter 2003 for interference may be placed at other locations between the optical paths as needed. [0022] An example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein the reflector 2004 and the sensor 2005 are rotatable such that the second angle θ2 and the third angle θ3 are according to the fourth angle θ4 Adjusted for the needs. In this way, the measurement range and resolution of the height can be adjusted, and at the same time, clear surface imaging and interference intensity can be obtained. An example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein when the measurement is performed, if the height of the surface of the object to be tested coincides with the interference measuring surface 2012, the sensor 2005 measures The maximum interference intensity is obtained. That is, if "the light transmitted from the light source 2002 passes through the beam splitter 2003 to the reflector 2004, then reaches the beam splitter 2003 after being reflected by the reflector 2004, and is reflected by the beam splitter 2003 and reaches the optical path of the sensor 2005" equals "The light emitted from the light source 2002 is reflected by the beam splitter 2003 and reaches the interference measuring surface 2012, where the interference measuring surface 2012 coincides with the surface of the object to be tested, and then reaches from the surface of the object to be tested. When the beam splitter 2003, and the re-transmission beam splitter 2003 reaches the optical path of the sensor 2005, the sensor 2005 measures the maximum interference intensity. 2B is an optical path diagram further illustrating an example of the three-dimensional measuring device 2001 of FIG. 2A, the component numbers of which are the same as those of FIG. 2A, and partially repeated components are not labeled to avoid confusion due to excessive complexity. In the three-dimensional measuring device 2001 of an example of an embodiment of the present invention, the imaging surface 2011 corresponds to an object surface 2013 by the imaging system 2006 (this object surface 2013 is a virtual surface, indicated by a broken line, and the object surface 2013 is shown in FIG. 2B). An example consistent with the interference measurement surface 2012, that is, when the object to be tested is on the object surface 2013, the most clear imaging is obtained on the imaging surface 2011. An example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein the third angle θ3 and the fourth angle θ4 are set such that the imaging surface 2011 and the object surface 2013 conform to the Scheimpflug Principle and the object surface 2013 coincides with the interferometric measuring surface 2012. Thus, the maximum interference intensity is consistent with the most obvious imaging, so that the maximum interference intensity can be obtained while obtaining the most clear measurement surface imaging. 2C is a light path diagram further illustrating an example of the three-dimensional measuring device 2001 of FIG. 2A, the component numbers of which are the same as those of FIG. 2A, and partially repeated components are not labeled to avoid confusion due to excessive complexity. An example of an embodiment of the present invention may be a three-dimensional measuring device 2001. When the imaging system 2006 and the sensor 2005 provide sufficient depth of field, the tilt of the imaging surface 2011 may be different from the ideal, or may not be tilted. Imaging is available, but some of the imaging quality is sacrificed. That is, at this time, the object surface 2013 does not coincide with the interference measurement surface 2012, so the maximum interference intensity is inconsistent with the most obvious image. When the imaging system 2006 and the sensor 2005 provide sufficient depth of field, the sacrifice portion is required. The imaging quality, sensor 2005 can still see the imaging of maximum interference. 2C is an example when the imaging plane 2011 is not tilted, that is, when the imaging plane 2011 is parallel to the horizontal direction. At this time, the object surface 2013 does not coincide with the interference measurement surface 2012, so it is necessary to provide sufficient depth of field by the imaging system 2006 and the sensor 2005 to achieve height measurement. Referring to FIG. 2A, an example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein the imaging system 2006 may include, for example, at least one of the following: a mirror group, a transmission lens group, or A mirror consisting of a mirror and a mirror. In an example of an embodiment of the present invention, the spectral width of the light source 2002 affects the range in which interference occurs. When the interference range is narrow, the three-dimensional measuring device 2001 can more accurately determine the height position of the surface of the object. 3A is a further explanatory diagram of an example of the three-dimensional measuring device 2001 of FIG. 2A, wherein the component numbers are the same as those of FIG. 2A, and partially repeated components are not labeled to avoid confusion due to excessive complexity. FIG. 3B is a further explanatory diagram of an example of the sensor 2005 of the three-dimensional measuring device 2001 of FIG. 3A. FIG. 3C is a further explanatory diagram of an example of the reflector 2004 of the three-dimensional measuring device 2001 of FIG. 3A. [0028] Referring to FIG. 3A and FIG. 3B, an example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein the sensor 2005 is a surface sensor 3005, and the surface sensor 3005 includes a pixel array. The interference measurement surface 2012 includes a plurality of measurement lines 3012 for measuring different heights corresponding to corresponding columns of the pixel array (this measurement line 3012 is a virtual line parallel to the paper-feeding direction, and the cross section in FIG. 3A Only one point is represented by a circle and a dot), wherein when the measurement is performed, if the height of the surface of the object to be tested coincides with the measurement line 3012, the corresponding pixel Px in the pixel array 2025 of the sensor 2005 is measured. The maximum interference intensity is obtained. The surface sensor 3005 can be, for example, a rectangular or square two-dimensional array of pixels. Referring to FIG. 3A, the height resolution h1 of the present invention is affected by the number of pixels, wherein the number of pixels=the sensor size s1/the pixel size s2, and the larger the number of pixels, the smaller the height resolution h1, that is, the height resolution. The higher the degree. Further, the height measurement range h2 of the present invention is affected by the fourth angle θ4 (please refer to FIG. 2A), and the height measurement range h2 is larger as the fourth angle θ4 is larger. The height resolution h1 of the present invention is also affected by the fourth angle θ4. When the fourth angle θ4 is smaller, the height resolution h1 is smaller, that is, the height resolution is higher. Thus, the desired height resolution h1 and height measurement range h2 can be obtained by adjusting the number of pixels and the tilt angle. 3A and 3C, an example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein the surface of the reflector 2004 causes light emitted from the light source 2002 and penetrating the beam splitter 2003 to be illuminated. The reflector 2004 can have partially reflected light parallel to the light emitted from the source 2002 and penetrating the beam splitter 2003. Referring to FIG. 3C, an example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein the surface of the reflector 2004 is stepped such that incident light to the surface of the reflector 2004 is parallel to the reflected light. . In an embodiment of an embodiment of the invention, the surface of the reflector 2004 has a Blazed grating structure. [0032] An example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein the reflector 2004 is replaceable, and a surface having a different structure may be used depending on a range of the second angle θ2. Get better reflection. In one example, the reflector 2004 may use surfaces having different configurations depending on the requirements of the range of the fourth angle θ4, such that the interference measurement surface 2012 is consistent with the object plane 2013. 4A, 4B, and 4C are schematic explanatory views of an example of the three-dimensional measuring device 2001 of FIG. 2A when the measurement is performed. FIG. 4D is a schematic diagram showing an example of measurement results of the height distribution of the surface of the test object 4007. 4E is a view showing an example of the interference intensity I versus the optical path difference D. The component numbers are the same as those of FIG. 2A and FIG. 3A. In order to avoid confusion due to excessive complexity, partially repeated components are no longer labeled. 4A, 4B, 4C, and 4D, an example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein when measuring, the three-dimensional measuring device 2001 or The stage of the object to be tested 4007 is horizontally moved to obtain the height of the surface of the object to be tested 4007 at different horizontal positions. Referring to FIG. 4A, the pixels P1 to P6 are horizontally moved to measure, and when the horizontal position of the three-dimensional measuring device 2001 and the object to be tested 4007 is moved to the case of FIG. 4A, the height is consistent with the measuring line 3012 of the interference measuring surface 2012. At the surface of the object to be tested 4007, only the maximum interference intensity is measured at the corresponding pixel P1, and the interference intensity measured at the surface of the pixels P2, P3, P4, P5 and P6 is not the largest, so it can be obtained The height of the surface of the object 4007 here is the height H1 corresponding to the pixel P1. Note that the manner in which the pixels Px correspond will vary depending on the imaging system 2006, and the example shown here is an example in which the imaging system 2006 reverses the light path up and down. Referring to FIG. 4B, when the horizontal position of the three-dimensional measuring device 2001 and the object to be tested 4007 is moved to the case of FIG. 4B, the height is only at the surface of the object to be tested 4007 at which the measuring line 3012 of the interference measuring surface 2012 coincides. The maximum interference intensity is measured at the corresponding pixel P3, and the interference intensity measured at the surface of the pixels P1, P2, P4, P5, and P6 is not the largest, so that the height of the surface of the object to be tested 4007 is determined by the pixel. The height H3 corresponding to P3. Referring to FIG. 4C, when the horizontal position of the three-dimensional measuring device 2001 and the object to be tested is moved to the case of FIG. 4C, the height of the surface of the object to be tested 4007 is coincident with the measuring line 3012 of the interference measuring surface 2012, which The three surface positions respectively measure the maximum interference intensity at the corresponding pixels P1, P2, and P3, so that the heights of the three surfaces of the object to be tested 4007 are the heights H1 and H2 corresponding to the pixels P1, P2, and P3. H3. Referring to FIG. 4D, the heights H1, H2, H3, and H4 corresponding to the pixels corresponding to the maximum interference intensity measured at each position are analyzed, and the height distribution of each position is established, and the three-dimensional shape of the surface of the object to be tested 4007 is obtained. [0035] In FIG. 4E, the horizontal axis represents the optical path difference D and the vertical axis represents the interference intensity I. Here, the optical path difference D is defined to be equal to "the light transmitted from the light source 2002 passes through the beam splitter 2003 to the reflector 2004, then reaches the beam splitter 2003 after being reflected by the reflector 2004, and is reflected by the beam splitter 2003 to reach the sensor 2005. Subtracting "the light emitted from the light source 2002 reaches the specific surface of the surface of the object to be tested 4007 after being reflected by the spectroscope 2003, and then reflects from the surface of the object to be tested 4007 to the spectroscope 2003, and transmits the spectroscopic light again. The device 2003 reaches the optical path of the sensor 2005, that is, the optical path difference D is equal to "the distance from the spectroscope 2003 to the interference measuring surface 2012" minus the "specificity from the spectroscope 2003 to the surface of the object to be tested 4007". The distance." The change in the intensity of the interference pattern varies depending on the optical path difference D. When the optical path difference D is 0, the interference intensity I has the largest interference intensity. An example of an embodiment of the present invention may be a three-dimensional measuring device 2001, wherein when the measurement is performed, the three-dimensional measuring device 2001 or the stage containing the object to be tested 4007 can be continuously moved while being measured. The entire surface of the test object 4007 is measured. For example, the surface of a complete wafer can be measured in one continuous motion. [0037] As such, one or more of the examples of the above embodiments of the present invention have at least one or more of the following advantageous effects. Since the three-dimensional measuring device 2001 of the present invention has a tilted interference measuring surface 2012, unlike the conventional white light interferometer, which has to vertically move the three-dimensional measuring device or the stage and can only measure in fractions, the present invention only needs to be horizontal. The mobile three-dimensional measuring device 2001 or the stage can be measured, and thus continuous measurement can be performed without the need to measure the additional required precise positioning system in stages. Moreover, even if the interference measuring surface 2012 of the three-dimensional measuring device 2001 of the present invention is inclined, the light irradiated by the three-dimensional measuring device 2001 of the present invention toward the object to be tested is still parallel to the vertical direction, so that there is no shadow or a vignetting angle. The problem. Furthermore, the height resolution h1 of the three-dimensional measuring device 2001 of the present invention can be determined by the number of pixels and the tilt angle of the interference measuring surface 2012, and it is easy and low in cost to achieve a small height resolution h1. Moreover, the three-dimensional measuring device 2001 of the present invention does not have to use a microscope system, and can also use a large-sized sensor used in a camera system, or a lens with a wider field of view, different types and magnifications, or even an imaging system can use telecentricity. The system can be built at a lower cost and more diverse. Since the three-dimensional measuring device 2001 of the present invention is not limited to the imaging system 2006, which may be a mirror group, a transmission mirror group, or a mirror system composed of a mirror and a transmission mirror, a transmission lens group such as a common type of lens is usually designed for Visible light, while the light source using the mirror group has a wider range of applications, so the light source 2002 for the three-dimensional measuring device 2001 of the present invention can use visible light or invisible light.

[0038]

1000‧‧‧Light path

1001‧‧‧Traditional white light interferometer

1002‧‧‧Light source

1003‧‧‧ spectroscopy

1004‧‧‧Mirror

1005‧‧‧ sensor

1006‧‧‧ imaging system

1007‧‧‧Test object

1012‧‧‧Interference measuring surface

2000‧‧‧Light path

2001‧‧‧3D measuring device

2002‧‧‧Light source

2003‧‧‧ spectroscopy

2004‧‧‧ reflector

2005‧‧‧Sensor

2006‧‧‧ imaging system

2010‧‧‧ reference surface

2011‧‧‧ imaging surface

2012‧‧‧Interference measurement surface

2013‧‧‧ ‧

3005‧‧‧ face sensor

3012‧‧‧Measurement line

4007‧‧‧Test object

Θ1‧‧‧ first angle

Θ2‧‧‧second angle

Θ3‧‧‧ third angle

Θ4‧‧‧fourth angle

D1‧‧‧ distance

D2‧‧‧ distance

H1‧‧‧High resolution

H2‧‧‧ Height measurement range

S1‧‧‧Sensor size

S2‧‧‧ pixel size

Px‧‧ pixels

P1‧‧ pixels

P2‧‧ pixels

P3‧‧ ‧ pixels

P4‧‧ pixels

P5‧‧ pixels

P6‧‧ pixels

H1‧‧‧ Height

H2‧‧‧ Height

H3‧‧‧ Height

H4‧‧‧ Height

D‧‧‧ optical path difference

I‧‧‧ interference intensity

1 is a light path diagram of a structure of a conventional white light interferometer 1001. 2A is an optical path diagram showing a configuration of a three-dimensional measuring device 2001 according to an example of an embodiment of the present invention. FIG. 2B is an optical path diagram further illustrating an example of the three-dimensional measuring device 2001 of FIG. 2A. FIG. 2C is an optical path diagram further illustrating an example of the three-dimensional measuring device 2001 of FIG. 2A. FIG. 3A is a further explanatory diagram of an example of the three-dimensional measuring device 2001 of FIG. 2A. FIG. 3B is a further explanatory diagram of the sensor 2005 of an example of the three-dimensional measuring device 2001 of FIG. 3A. FIG. 3C is a further explanatory diagram of an example of the reflector 2004 of the three-dimensional measuring device 2001 of FIG. 3A. 4A, 4B, and 4C are schematic explanatory views of an example of the three-dimensional measuring device 2001 of Fig. 2A when the measurement is performed. FIG. 4D is a schematic diagram showing an example of measurement results of the height distribution of the surface of the test object 4007. 4E is a view showing an example of the interference intensity I versus the optical path difference D.

Claims (10)

A three-dimensional measuring device comprising: a light source; a beam splitter, the beam splitter is inclined at a first angle with respect to a horizontal direction; and a reflector having a surface corresponding to a reference surface, the reference surface being inclined by a second angle with respect to a vertical direction; sensing The surface of the sensor corresponds to an imaging surface that is inclined at a third angle or parallel to the horizontal direction with respect to the horizontal direction; an imaging system, the imaging system being located between the beam splitter and the sensor; wherein the three-dimensional The measuring device has an interference measuring surface which is inclined at a fourth angle with respect to the horizontal direction, wherein the beam splitter is horizontal between the light source and the reference surface, and in the vertical direction, the beam splitter is in the imaging Between the surface and the interference measuring surface, wherein a distance from any point on the beam splitter to the reference surface in the horizontal direction is equal to a distance in the vertical direction from the point on the beam splitter to the interference measuring surface, Wherein, when the measurement is performed, the light irradiated by the three-dimensional measuring device toward the object to be tested is parallel to the vertical direction. A three-dimensional measuring device comprising: a light source; a beam splitter, the beam splitter is inclined at a first angle with respect to a horizontal direction; and a reflector having a surface corresponding to a reference surface, the reference surface being inclined by a second angle with respect to a vertical direction; sensing The surface of the sensor corresponds to an imaging surface that is inclined by a third angle with respect to a horizontal direction; an imaging system is disposed between the beam splitter and the sensor, wherein the three-dimensional measuring device has interference a measuring surface, the interference measuring surface is inclined by a fourth angle with respect to a horizontal direction, wherein the beam splitter is between the light source and the reference surface in a horizontal direction, and the optical splitter is in the imaging plane and the interference amount in a vertical direction Between the measuring surfaces, wherein the distance from any point on the beam splitter to the reference plane in the horizontal direction is equal to the distance in the vertical direction from the point on the beam splitter to the interference measuring surface, wherein When measuring, the light irradiated by the three-dimensional measuring device toward the object to be tested is parallel to the vertical direction, wherein the third The angle and the fourth angle are set such that the imaging surface and the object plane conform to the Scheimpflug Principle and the object plane coincides with the interference measurement surface. A three-dimensional measuring device comprising: a light source; a beam splitter, the beam splitter is inclined at a first angle with respect to a horizontal direction; and a reflector having a surface corresponding to a reference surface, the reference surface being inclined by a second angle with respect to a vertical direction; sensing The surface of the sensor corresponds to an imaging surface that is inclined by a third angle with respect to a horizontal direction; an imaging system is disposed between the beam splitter and the sensor, wherein the three-dimensional measuring device has interference a measuring surface, the interference measuring surface is inclined by a fourth angle with respect to a horizontal direction, wherein the beam splitter is between the light source and the reference surface in a horizontal direction, and the optical splitter is in the imaging plane and the interference amount in a vertical direction Between the measuring surfaces, wherein the distance from any point on the beam splitter to the reference plane in the horizontal direction is equal to the distance in the vertical direction from the point on the beam splitter to the interference measuring surface, wherein When measuring, the light irradiated by the three-dimensional measuring device toward the object to be tested is parallel to the vertical direction, wherein the reflection The surface of the device is such that light emitted from the source and penetrating the beam splitter can partially reflect light as it illuminates the reflector parallel to the light emitted from the source and penetrating the beam splitter. The three-dimensional measuring device according to any one of claims 1 to 3, wherein, when measuring, if the height of the surface of the object to be tested coincides with the interference measuring surface, the sensor measures the maximum interference strength. The three-dimensional measuring device of any one of claims 1 to 3, wherein the sensor is a surface sensor, the surface sensor comprises a pixel array, wherein the interference measuring surface comprises a corresponding pixel array Corresponding columns of the plurality of measurement lines, wherein when the measurement is performed, if the height of the surface of the object to be tested is consistent with the measurement line, the corresponding pixel in the pixel array of the sensor is measured to be the largest Interference intensity. The three-dimensional measuring device of any one of claims 1 to 3, wherein the reflector and the sensor are rotatable such that the second angle and the third angle are adjustable according to the demand of the fourth angle . The three-dimensional measuring device according to any one of claims 1 to 3, wherein, when the measuring is performed, the three-dimensional measuring device or the stage on which the object to be tested is horizontally moved to obtain different horizontal positions The height of the surface of the object to be tested. The three-dimensional measuring device according to any one of claims 1 to 3, wherein, when the measuring is performed, the three-dimensional measuring device or the stage on which the object to be tested is loaded can be continuously moved to measure the measured time at a time. The entire surface of the object. A three-dimensional measuring device according to any one of claims 1 to 3, wherein the imaging system comprises at least one of: a mirror group, a transmission mirror group, or a mirror group consisting of a mirror and a transmission mirror. The three-dimensional measuring device of claim 3, wherein the surface of the reflector is stepped or has a Blazed grating structure.