TWI536100B - 用於模具片材之組成物及使用該組成物製備模具片材的方法 - Google Patents
用於模具片材之組成物及使用該組成物製備模具片材的方法 Download PDFInfo
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- TWI536100B TWI536100B TW097145153A TW97145153A TWI536100B TW I536100 B TWI536100 B TW I536100B TW 097145153 A TW097145153 A TW 097145153A TW 97145153 A TW97145153 A TW 97145153A TW I536100 B TWI536100 B TW I536100B
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- Prior art keywords
- mold sheet
- mold
- weight
- energy ray
- resin
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- 238000000034 method Methods 0.000 title claims description 31
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- 229920005989 resin Polymers 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 20
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 10
- 229910052731 fluorine Inorganic materials 0.000 claims description 10
- 239000011737 fluorine Substances 0.000 claims description 10
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- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 8
- -1 acryloxy Chemical group 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 229920002554 vinyl polymer Polymers 0.000 claims description 6
- 238000007646 gravure printing Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 2
- 229910052684 Cerium Inorganic materials 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 230000001680 brushing effect Effects 0.000 claims 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims 1
- 238000002360 preparation method Methods 0.000 description 21
- 239000000758 substrate Substances 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 10
- 229910052707 ruthenium Inorganic materials 0.000 description 10
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- 239000004205 dimethyl polysiloxane Substances 0.000 description 9
- 238000000059 patterning Methods 0.000 description 9
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- 238000012360 testing method Methods 0.000 description 6
- 238000001406 capillary force lithography Methods 0.000 description 5
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- 238000001053 micromoulding Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 2
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
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- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
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- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
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- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- NIAXWFTYAJQENP-UHFFFAOYSA-N 3-ethenyl-2h-1,3-oxazole Chemical compound C=CN1COC=C1 NIAXWFTYAJQENP-UHFFFAOYSA-N 0.000 description 1
- FYRWKWGEFZTOQI-UHFFFAOYSA-N 3-prop-2-enoxy-2,2-bis(prop-2-enoxymethyl)propan-1-ol Chemical compound C=CCOCC(CO)(COCC=C)COCC=C FYRWKWGEFZTOQI-UHFFFAOYSA-N 0.000 description 1
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
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- 239000004593 Epoxy Substances 0.000 description 1
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- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 description 1
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- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
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- JQRRFDWXQOQICD-UHFFFAOYSA-N biphenylen-1-ylboronic acid Chemical compound C12=CC=CC=C2C2=C1C=CC=C2B(O)O JQRRFDWXQOQICD-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
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- 239000012954 diazonium Substances 0.000 description 1
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- KHAYCTOSKLIHEP-UHFFFAOYSA-N docosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C=C KHAYCTOSKLIHEP-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- XJELOQYISYPGDX-UHFFFAOYSA-N ethenyl 2-chloroacetate Chemical compound ClCC(=O)OC=C XJELOQYISYPGDX-UHFFFAOYSA-N 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical class [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
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- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
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- 229920006254 polymer film Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
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- 229960000834 vinyl ether Drugs 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
- G03F7/0295—Photolytic halogen compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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Description
本發明關於一種用於製備使用於在基板上形成超精細圖案的模具片材之組成物,以及關於用於自該組成物製備模具片材之方法。
包括半導體、電子、光電、磁性、顯示器及微機電裝置及光學鏡片(例如稜鏡片及透鏡片)之各種不同裝置,包含具有微米圖案之組件,以及其等傳統上已藉由光微影術形成。然而,在光微影術方法中,電路線寬或圖案線寬係依曝光製程中使用之光的帶寬而定。因此,在基板上形成具有低於100nm之線寬的超精細圖案是非常困難的。再者,此一傳統光微影法需要各種不同的步驟(例如基板清洗、基板表面處理、在低溫下之光敏性聚合物塗布處理、曝光、顯影、清洗、高溫熱處理及其他),使得光微影法複雜且花費高。
為了克服傳統光微影法的限制,最近已發展出奈米壓模微影法(nano-imprint lithographic method),用於藉由具有所欲圖案之由矽(Si)製成的硬模具,將硬質模的圖案轉移至聚合物薄膜基板,該方法包含利用熱塑性聚合物薄膜塗布硬模具的表面、在高溫-高壓的條件下利用板式壓機壓縮經塗布之硬模具,以及使壓縮模具與基板分離。此奈米壓模微影法(nano-imprint lithographic method)具有可容易形成超精細圖案的優點。圖案的線寬解析度已測得如約7nm一般小(參見S. Y. Chou等人,J. Vac. Sci. Technol. B15
,2897(1997))。
此奈米壓模微影術仍具有壓縮後模具難以與基板分離,及高壓壓縮步驟傾向損害模具與基板的缺點。再者,因為執行圖案化係利用加熱至高溫之聚合物的流動性,所以需要相當可觀的時間來進行此圖案化。
非傳統的微影術的其他實施例包括微接觸印刷術(μCP)、毛細微模塑法(MIMIC)、轉移微模塑法(μTM)、軟模塑及毛細力微影術(CFL)。使用於此等方法中作為模具的是聚合物彈性體,例如聚二甲基矽氧烷(PDMS)。使用於奈米壓模微影術的PDMS模具有較低的表面能,對其他材料之表面的低黏著力,使得圖案化後PDMS模具容易與基板之表面分離。然而,此類彈性PDMS模具具有低低機械強度,且在特定條件下易於變形,以及因此PDMS模具無法使用於形成具有圖案解像線小於約500μm(依欲形成之圖案的縱橫比而定)的微圖案。此外,PDMS模具當與例如甲苯之有機溶劑接觸時產生潤脹及變形,其限制可使用於圖案化步驟之溶劑的選擇。
因此,本發明之一目的為提供一種模具片材,其可容易地與基板分離,維持其彈性及機械強度,且當與有機溶劑接觸時不潤脹。
根據本發明之一方面,提供一種用於形成圖案的模具片材之組成物,其包含:
(A)一活化能射線可固化之化合物,其具有一或多個不飽和雙鍵;以及
(B)以100重量份之該組分(A)為基礎,0.1至20重量份之一光引發劑。
根據本發明之另一方面,提供一種用於形成所欲圖案之模具片材,該片材包含組成物的固化產物,該固化產物上形成有所欲圖案之凹版印刷圖案。
根據本發明之又另一方面,提供一種用於製備供形成所欲圖案的模具片材之方法,其包含下述步驟:
(A)在具有所欲圖案之一主模上塗覆或鑄造組成物;
(B)藉由在該組成物上照射一活化能射線以固化該組成物;以及
(C)自該主模剝離該固化產物以獲得具有該所欲圖案之一凹版印刷圖案的該模具片材。
本發明之上述及其他目的及特徵將由下述本發明之說明,連同下述附帶的圖式而得以明白,此圖式分別顯示:
第1a圖:藉由使用製備例1製備的模具片材,於300m圖案化製程之後模具圖案的截面照片;
第1b圖:藉由使用製備例3製備的模具片材,於300m圖案化製程之後模具圖案的截面照片;
第2a圖:顯示製備例2製備之模具片材的剝離試驗結果之照片;以及
第2b圖:顯示製備例4製備之模具片材的剝離試驗結果之照片。
本發明的模具片材之組成物包含(A)100重量份之活化能射線可固化之化合物,其具有一或多個不飽和雙鍵;以及(B)以100重量份之組分(A)為基礎,0.1至20重量份之光引發劑。
具有一或多個不飽和雙鍵之活化能射線可固化之化合物(組分(A))可為至少一具有一官能基之單體,該官能基係選自於乙烯基、(甲基)丙烯醯氧基及烯丙基所組成之組群,其當曝露於例如紫外線、紅外射線及電子束之活化能射線時可被固化。
具有乙烯基之單體可為環己基乙烯基醚、2-乙基己基乙烯基醚、十二烷基乙烯基醚、1,4-丁二醇二乙烯基醚、1,6-己二醇基二乙烯基醚、二甘醇二乙烯基醚、乙二醇丁基乙烯基醚、乙二醇二乙烯基醚、三甘醇甲基乙烯基醚、三甘醇二乙烯基醚、三羥甲基丙烷三乙烯基醚、1,4-環己烷化二甲醇二乙烯基醚、乙酸乙烯酯、氯乙酸乙烯酯、N-乙烯基吡咯烷酮、N-乙烯基咔唑、N-乙烯基己內醯胺、乙烯基甲苯、苯乙烯、阿爾法甲基苯乙烯或其等之混合物。
具有丙烯醯氧基之單體可為丙烯酸異冰片酯(isobornyl acrylate)、1,6-己二醇二丙烯酸酯、三甘醇二(甲基)丙烯酸酯、三羥甲基丙烷三丙烯酸酯、四甘醇二(甲基)丙烯酸酯、1,3-丁二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、二甘醇二丙烯酸酯、新戊二醇二丙烯酸酯、新戊基二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、季戊四醇三丙烯酸酯、二季戊四醇(羥基)五丙烯酸酯、烷氧化四丙烯酸酯、丙烯酸辛癸酯、丙烯酸異癸酯、丙烯酸十二酯、丙烯酸十八酯、丙烯酸二十二酯,或其等之混合物。
再者,具有烯丙基之單體可為烯丙基丙基醚、烯丙基丁基醚、烯丙基醚、季戊四醇三烯丙基醚、二烯丙基聯苯甲酸、三羥甲基丙烷二烯丙基醚、三羥甲基丙烷三烯丙基醚、鄰苯二甲酸二烯丙酯,間苯二甲酸二烯丙酯、苯三甲酸三烯丙酯(triallyl trimellitate),或其等之混合物。
使用於本發明之較佳光引發劑為當利用活化能射線處理時產生自由基或陽離子之化合物。自由基起始劑之代表性例子包括苯甲基酮縮醇、安息香醚、苯乙酮衍生物、酮肟醚、二苯基酮、苯并及噻吨酮化合物、及其等之混合物,可使用於本發明之該陽離子起始劑的例子為鎓鹽、二茂鐵鹽、重氮鹽、或其等之混合物。
在一較佳的具體例中,本發明的模具片材之組成物可進一步包含具有一或多個官能基之化合物,該官能基含有矽、氟或二者,該化合物之含量,以100重量份之組分(A)為基礎,為0.01至200重量份,較佳為0.1至100重量份,更佳為0.1至50重量份,以致能增進離形特性。
具有含有矽、氟或二者之官能基的化合物亦為活化能射線可固化之化合物,且其可衍生自乙烯基樹脂、(甲基)丙烯醯氧基或烯丙基樹脂、界面活性劑、油、及其等之混合物。其等之代表性例子包括含矽之乙烯基衍生物、含矽之(甲基)丙烯酸酯、含(甲基)丙烯醯氧基之有機矽氧烷、矽聚丙烯酸酯、含氟烷基之乙烯基衍生物、含氟烷基之(甲基)丙烯酸酯、氟化聚丙烯酸酯、聚二甲基矽氧烷、氟化聚合物、二甲基矽氧烷油、及其等之混合物。
在另一較佳具體例中,本發明的模具片材之組成物可進一步包含具有至少一選自於下述基團所組成之組群的官能基之活化能射線可固化之樹脂:乙烯基、(甲基)丙烯醯氧基、烯丙基及烯丙氧基,該樹脂含量以100重量份之組分(A)為基礎,為50重量份或以下。
活化能射線可固化之樹脂為寡聚物或聚合物,其分子量為400或以上,及其代表性例子包括以脂環族或芳族胺基甲酸酯為主之寡聚物,其具有至少一反應基、聚酯(甲基)丙烯酸酯、聚醚(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、或聚碳酸酯(甲基)丙烯酸酯寡聚物、及其等之混合物。
較佳地,活化能射線可固化之樹脂之應用量,以100重量份之組分(A)為基礎,可為50重量份或更少。當量超過此限度,固化膜的厚度變得更小,固化模具之玻璃轉換溫度(Tg)降低,且其傾向降低耐熱性。再者,對化學品及濕氣的抗性變低,且在重覆使用於圖案化製程的期間,耐用性亦變低。
在本發明中,用於形成圖案的模具片材可藉由使用本發明之組成物製備,該片材上具有所欲圖案之凹版印刷圖案。
用於製備用於形成所欲圖案的模具片材之方法包含下述步驟:
(A)在具有所欲圖案之一主模的表面上塗覆或鑄造本發明之組成物;
(B)藉由在該組成物上照射一活化能射線以固化該組成物;以及
(C)自該主模剝離該固化產物以獲得具有該所欲圖案之一凹版印刷圖案的該模具片材。使用該可固化之組成物以製備該模具片材的特定製程可參考韓國專利第568581號。
根據本發明之另一具體例,藉由使用本發明之組成物製備的本發明之模具片材具有一結構,其中本發明之組成物的固化材料係由一載體所支撐。用於製備具有該載體之該模具片材的方法進一步包含在進行步驟(B)之前,在已塗覆或已鑄造在一主模上的該組成物之上,層合一載體的步驟。
根據本發明之又另一具體例,本發明之方法進一步包含在進行步驟(B)之前或之後,塗覆或鑄造第二活化能射線可固化之樹脂的步驟。
再者,本發明之方法可進一步包含使自步驟(C)獲得的產物接受表面處理的步驟。
再者,本發明方法可進一步包含藉由使用至少一烷氧基化合物,使自步驟(C)獲得的產物接受化學表面處理的步驟,該烷氧基化合物具有一或多個選自於下述基團所組成之組群的官能基:氟、矽、烷基、苯甲基及氯化物。
根據本發明之又另一具體例,藉由自該主模分離之該產物可連接或壓縮至一軟質或硬質載體,以獲得一多層產物。
不同於使用於壓印法之已知無機模具,或使用於微接觸印刷或軟模塑法之彈性體熱可固化之聚合物,本發明的模具片材之組成物的特徵在於使用活化能射線可固化之化合物,且其可有利地使用於形成具有低於數十奈米之線寬的超微米或次微米圖案。
再者,本發明的模具片材之組成物可使用簡單的製程,在低生產成本之下,提供具有大尺寸的模具,以及因此,其可應用於有機模具的量產。
本發明之模具片材可應用於習知技術領域中已知的方法(例如,使用硬質模具之奈米壓模微影法,或使用例如PDMS之彈性體模具之微接觸印刷術(μCP)、毛細微模塑法(MIMIC)、轉移微模塑法(μTM)、軟模塑或毛細力微影術(CFL),且其亦可使用於取代使用活化能射線可固化之化合物及金屬模具之傳統圖案形成製程中的金屬模具。
所製得之模具可進一步藉由與具有所欲形狀(平坦或彎曲)之一軟質或硬質載體組合而設置有襯底材,以獲得多層模具。
本發明之聚合物模具可應用於微米圖案法,例如印刷術(μCP)、軟模塑及毛細力微影術等方法。再者,可使具有流動性之活化能可固化樹脂與該模具接觸,接著利用例如UV活化能射線處理該模具,以獲得所欲的聚合物微米圖案。
下述實施例係意欲在未限制本發明之範圍之下,進一步舉例說明本發明。
將具有列示於表1之實施例1中的組分之模具組成物,塗覆在具有稜鏡圖案之主模的圖案化表面上。接下來,將透明聚酯片材放置在塗覆的表面上,以及以150mJ/cm2
之劑量,利用UV光照射所得之層合物,以固化樹脂組成物,以及自主模剝離固化之模具以獲得厚度37μm之稜鏡圖案的模具片材。再者,使用高壓汞燈,以30,000mJ/cm2
之劑量,利用UV光進一步照射模具片材之稜鏡圖案表面,獲得用於形成稜鏡圖案之固化的模具片材。
除了使用具有列示於表1之實施例2中的組分之組成物以外,重覆製備例1之步驟,以獲得用於形成稜鏡圖案之模具片材
除了使用具有列示於表1之比較例1中的組分之組成物以外,重覆製備例1之步驟,以獲得用於形成稜鏡圖案之模具片材。
除了使用具有列示於表1之比較例2中的組分之組成物以外,重覆製備例1之步驟,以獲得用於形成稜鏡圖案之模具片材。
將用於形成圖案之UV可固化之樹脂塗覆在透明聚對苯二甲酸乙二酯膜上,將製備例1及3中製備的模具片材各自置於塗覆的表面上,以及以250mJ/cm2
之劑量,利用UV光照射所得之層合物,另一方面維持壓力接觸以獲得稜鏡片材。
第1a圖顯示使用製備例1中製備之模具片材所獲得的圖案化片材的截面,當在相同條件下重覆使用模具片材製造超過600m之最終稜鏡片時,該模具片材未改變,最終稜鏡片之亮度在1%之內維持相同(第1a圖)。然而,在製備例3中製備的模具片材之圖案構形,自生產約300m程度時開始改變,以及最終稜鏡片之亮度降低超過5%(第1b圖)。
將製備例2及4中製備之模具片材曝露於高溫蒸汽下10min,以及將模具片材之表面上形成的圖案十字切割成棋盤的形狀,貼附上膠帶,且剝除膠帶。
如第2a圖及第2b圖所示,僅有5%之圖案自製備例2中製備之以聚酯為主的模具片材剝離(第2a圖),另一方面,超過50%之圖案自製備例4中製備之模具片材剝離(第2b圖)。
雖然本發明已參照上述特定具體例來說明,應認知到可進行各種不同的改良及改變,且該等改良及改變亦落於下述申請專利範圍所界定之本發明的範圍內。
第1a圖:藉由使用製備例1製備的模具片材,於300m圖案化製程之後模具圖案的截面照片;
第1b圖:藉由使用製備例3製備的模具片材,於300m圖案化製程之後模具圖案的截面照片;
第2a圖:顯示製備例2製備之模具片材的剝離試驗結果之照片;以及
第2b圖:顯示製備例4製備之模具片材的剝離試驗結果之照片。
Claims (10)
- 一種用於將所欲圖案轉移至另一樹脂層之模具片材,其具有一所欲圖案之凹版印刷圖案,該模具片材包含一組成物之固化產物,該組成物包含:(A)一活化能射線可固化之化合物,其具有一或多個不飽和雙鍵,該活化能射線可固化之化合物為至少一具有一官能基之單體,該官能基係選自於乙烯基、(甲基)丙烯醯氧基及烯丙基所組成之組群;(B)以100重量份之該組分(A)為基礎,0.1至20重量份之一光引發劑;(C)以100重量份之該組分(A)為基礎,0.01至200重量份之含有矽、氟或兩者的一化合物;(D)以100重量份之該組分(A)為基礎,50或更少重量份之一活化能射線可固化之樹脂,其包含一或多個選自於乙烯基、(甲基)丙烯醯氧基、及烯丙基的官能基,其中在該固化產物於固化該組成物固化後,該固化產物接受藉由使用一活化能射線、紫外線、臭氧或一電漿來進行之表面處理。
- 如申請專利範圍第1項之模具片材,其中該光引發劑為當利用一活化能射線處理時,能夠產生一自由基或陽離子之化合物。
- 如申請專利範圍第1項之模具片材,其中該含有矽、氟或二者的化合物為一樹脂、一界面活性劑、或一油。
- 如申請專利範圍第1項之模具片材,其中該含有矽的化 合物為衍生自一乙烯基樹脂、一(甲基)丙烯醯氧基樹脂或一烯丙基樹脂的一樹脂。
- 如申請專利範圍第1項之模具片材,其中該活化能射線可固化之樹脂為具有400或更高之分子量的寡聚物或聚合物。
- 如申請專利範圍第1項之模具片材,其中該固化產物係與一載體層合或連接。
- 一種用於製備如申請專利範圍第1項之模具片材之方法,其包含下述步驟:(i)在具有一所欲圖案之一主模上塗覆或鑄造一組成物,該組成物包含(A)一活化能射線可固化之化合物,其具有一或多個不飽和雙鍵,該活化能射線能可固化之化合物為至少一具有一官能基之單體,該官能基係選自於乙烯基、(甲基)丙烯醯氧基及烯丙基所組成之組群,(B)以100重量份之該組分(A)為基礎,0.1至20重量份之一光引發劑,(C)以100重量份之該組分(A)為基礎,0.01至200重量份之含有矽、氟或兩者的一化合物,(D)以100重量份之該組分(A)為基礎,50或更少重量份之一活化能線能可固化之樹脂,其包含一或多個選自於乙烯基、(甲基)丙烯醯氧基、及烯丙基的官能基;(ii)藉由在該組成物上照射一活化能射線以固化該組成物;(iii)自該主模剝離該固化產物以獲得具有該所欲圖案之一凹版印刷圖案的該模具片材;以及 (iv)使步驟(iii)取得之產物接受藉由使用一活化能射線、紫外線、臭氧或一電漿來進行之表面處理。
- 如申請專利範圍第7項之方法,其進一步包含在固化步驟(ii)之前,在已塗覆或已鑄造在該主模上的該組成物上層合一載體的步驟。
- 如申請專利範圍第1項之模具片材,其中該具有氟之化合物為樹脂、界面活性劑或油。
- 如申請專利範圍第1項之模具片材,其中該具有氟之化合物為衍生自乙烯基樹脂、(甲基)丙烯醯氧基或烯丙基樹脂之一樹脂。
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| US8133534B2 (en) | 2004-11-22 | 2012-03-13 | Wisconsin Alumni Research Foundation | Methods and compositions for forming patterns with isolated or discrete features using block copolymer materials |
| JP5377857B2 (ja) * | 2004-11-22 | 2013-12-25 | ウィスコンシン・アラムナイ・リサーチ・ファウンデーション | 非周期的パターン共重合体フィルムのための方法及び組成 |
| US8168284B2 (en) | 2005-10-06 | 2012-05-01 | Wisconsin Alumni Research Foundation | Fabrication of complex three-dimensional structures based on directed assembly of self-assembling materials on activated two-dimensional templates |
| US8618221B2 (en) * | 2005-10-14 | 2013-12-31 | Wisconsin Alumni Research Foundation | Directed assembly of triblock copolymers |
| WO2009079241A2 (en) * | 2007-12-07 | 2009-06-25 | Wisconsin Alumni Research Foundation | Density multiplication and improved lithography by directed block copolymer assembly |
| US8133341B2 (en) * | 2008-04-01 | 2012-03-13 | Wisconsin Alumni Research Foundation | Molecular transfer printing using block copolymers |
| WO2011115383A2 (ko) * | 2010-03-18 | 2011-09-22 | 서울대학교산학협력단 | 필름형 유연 스탬퍼 및 그 제조방법, 이를 이용한 사출성형용 금형 및 사출성형방법 |
| KR101303514B1 (ko) * | 2010-03-18 | 2013-09-03 | 서울대학교산학협력단 | 필름형 유연 스탬퍼를 이용한 사출성형용 금형 및 사출성형방법 |
| US9299381B2 (en) | 2011-02-07 | 2016-03-29 | Wisconsin Alumni Research Foundation | Solvent annealing block copolymers on patterned substrates |
| KR101999870B1 (ko) | 2011-09-15 | 2019-10-02 | 위스콘신 얼럼나이 리서어치 화운데이션 | 화학적으로 패턴화된 표면과 제2 표면 사이의 블록 공중합체 막의 유도 조립 |
| US9372398B2 (en) | 2012-03-02 | 2016-06-21 | Wisconsin Alumni Research Foundation | Patterning in the directed assembly of block copolymers using triblock or multiblock copolymers |
| KR101465322B1 (ko) * | 2013-03-26 | 2014-12-10 | 성균관대학교산학협력단 | 반사방지필름 및 그 제조 방법 |
| US9840038B2 (en) * | 2013-04-11 | 2017-12-12 | Toyo Gosei Co., Ltd. | Resin mold |
| JP6352742B2 (ja) * | 2014-09-11 | 2018-07-04 | 東芝メモリ株式会社 | 感光性組成物、インプリント方法および層間層 |
| KR102452035B1 (ko) | 2017-04-14 | 2022-10-11 | 삼성디스플레이 주식회사 | 소프트 몰드용 조성물, 이를 이용하여 제조된 소프트 몰드 |
| CN109188860B (zh) * | 2018-09-21 | 2022-02-18 | 深圳市龙图光电有限公司 | 一种掩模板及其制作方法 |
| KR102663730B1 (ko) | 2022-09-28 | 2024-05-03 | 주식회사 기가레인 | 광경화성 조성물, 이를 포함하는 적층체 및 적층체의 제조방법 |
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| EP1803033A2 (en) * | 2004-09-13 | 2007-07-04 | Dow Corning Corporation | Lithography technique using silicone molds |
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| KR100929381B1 (ko) | 2009-12-02 |
| JP5106638B2 (ja) | 2012-12-26 |
| WO2009066895A3 (en) | 2009-07-30 |
| CN101918896B (zh) | 2014-04-16 |
| TW200933296A (en) | 2009-08-01 |
| WO2009066895A2 (en) | 2009-05-28 |
| CN101918896A (zh) | 2010-12-15 |
| US20100255268A1 (en) | 2010-10-07 |
| JP2011507725A (ja) | 2011-03-10 |
| KR20090053102A (ko) | 2009-05-27 |
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