TWI534596B - Wearable mobile device heat dissipation structure - Google Patents
Wearable mobile device heat dissipation structure Download PDFInfo
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- TWI534596B TWI534596B TW103138956A TW103138956A TWI534596B TW I534596 B TWI534596 B TW I534596B TW 103138956 A TW103138956 A TW 103138956A TW 103138956 A TW103138956 A TW 103138956A TW I534596 B TWI534596 B TW I534596B
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- 230000017525 heat dissipation Effects 0.000 title claims description 29
- 239000004020 conductor Substances 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
一種穿戴式行動裝置散熱結構,尤指一種應用於穿戴式行動裝置內部進行解熱的穿戴式行動裝置散熱結構。 A wearable mobile device heat dissipation structure, in particular, a wearable mobile device heat dissipation structure applied to the inside of a wearable mobile device for deheating.
按,隨著科技的日新月異,現行的可攜式行動裝置係除了手機、平板外亦擴及至穿戴式裝置,諸如:手錶、項鍊、戒子亦成為具有多功能之智慧型行動裝置,並隨著使用需求亦加入觸控螢幕及衛星定位及運動感測或醫療監測等電子元件,且該智慧型手錶除了可與其他行動裝置透過藍牙或網路進行連線使用外,亦可插入SIN卡進行3G或4G網路使用以及通話或照相及錄影等功能,因此當智慧型手錶於運作時會產生熱量,此外由於智慧型手錶為達到防塵或防水或保護之之條件下,其整體結構係被設計為封閉狀態,因此內部之電子元件所產生之熱量無法散溢至外界進行散熱,而積熱於該手錶或裝置內部,進而造成該智慧型手錶產生執行作業延遲或停頓或嚴重者甚而當機或等缺失,故如何對該智慧型手錶及各項穿戴式的型動裝置進行解熱為現行最優先解決之課題。 According to the rapid development of technology, the current portable mobile devices are expanded to wearable devices in addition to mobile phones and tablets. For example, watches, necklaces and rings have become multifunctional mobile devices with In addition to the demand, electronic components such as touch screen and satellite positioning and motion sensing or medical monitoring can be added. In addition to being connected to other mobile devices via Bluetooth or the Internet, the smart watch can also be inserted into the SIN card for 3G. Or 4G network use and call or camera and video functions, so when the smart watch is running, it will generate heat. In addition, because the smart watch is dust-proof or waterproof or protected, its overall structure is designed as In a closed state, the heat generated by the internal electronic components cannot be dissipated to the outside to dissipate heat, and the heat is accumulated inside the watch or the device, thereby causing the smart watch to perform execution delay or pause or severely even crash or wait. Missing, so how to solve the problem of the smart watch and various wearable devices is the current top priority .
爰此,為有效解決上述之問題,本發明之主要目的,係提供一種有效解決穿戴式行動裝置內部積熱問題的穿戴式行動裝置散熱結構。 Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a wearable mobile device heat dissipation structure that effectively solves the problem of heat accumulation inside a wearable mobile device.
為達上述目的本發明係提供一種穿戴式行動裝置散熱結構,係包含:一穿戴式行動裝置本體、一可撓式帶體;所述穿戴式行動裝置本體具有一容置空間並容設有複數電子元件,該等電子元件具有至少一發熱源;所述可撓式帶體係為橡膠或矽膠材質其中任一所構成,其構形有一具毛細結構及工作液體之腔室,該腔室壁面凸伸有一支撐部,該可撓式帶體定義一吸熱部及至少一散熱部,所述散熱部由該吸熱部兩端延伸所構形,所述吸熱部與該電子元件或發熱源其中任一接觸傳導熱量,本發明係提供一種於可撓式帶體中設置汽液循環腔室及結構直接提供穿戴式行動裝置之散熱效能,藉以提升整體散熱效率者。 The present invention provides a wearable mobile device heat dissipation structure, comprising: a wearable mobile device body and a flexible belt body; the wearable mobile device body has a receiving space and accommodates a plurality of An electronic component having at least one heat source; the flexible tape system being composed of any one of a rubber or a silicone material, the configuration having a capillary structure and a working liquid chamber, the chamber wall surface convex Extending a support portion, the flexible strip defines a heat absorbing portion and at least one heat dissipating portion, wherein the heat dissipating portion is configured to extend from both ends of the heat absorbing portion, and the heat absorbing portion and the electronic component or the heat source are any In contact with the conduction heat, the present invention provides a vapor-liquid circulation chamber in the flexible belt body and the structure directly provides the heat dissipation performance of the wearable mobile device, thereby improving the overall heat dissipation efficiency.
1‧‧‧穿戴式行動裝置散熱結構 1‧‧‧Wearing mobile device heat dissipation structure
11‧‧‧穿戴式行動裝置本體 11‧‧‧ Wearable mobile device body
111‧‧‧容置空間 111‧‧‧ accommodating space
112‧‧‧電子元件 112‧‧‧Electronic components
1121‧‧‧發熱源 1121‧‧‧heat source
12‧‧‧可撓式帶體 12‧‧‧Flexible belt
121‧‧‧腔室 121‧‧‧室
121a‧‧‧支撐部 121a‧‧‧Support
1211‧‧‧凸肋 1211‧‧‧ rib
1212‧‧‧通道 1212‧‧‧ channel
1213‧‧‧凸體 1213‧‧‧ convex
122‧‧‧吸熱部 122‧‧‧heat absorption department
123‧‧‧毛細結構 123‧‧‧Capillary structure
124‧‧‧散熱部 124‧‧‧ Department of heat dissipation
2‧‧‧工作液體 2‧‧‧Working liquid
3‧‧‧鍍層 3‧‧‧ plating
4‧‧‧熱傳單元 4‧‧‧heat transfer unit
第1圖係為本發明之穿戴式行動裝置散熱結構之第一實施例之立體分解圖;第2圖係為本發明之穿戴式行動裝置散熱結構之第一實施例之組合圖剖視圖;第3圖係為本發明之穿戴式行動裝置散熱結構之第一實施例之第二圖局部剖視放大圖;第4圖係為本發明之穿戴式行動裝置散熱結構之第二實施例之立體分解圖;第5圖係為本發明之穿戴式行動裝置散熱結構之第二實施例之組合剖視圖;第6圖係為本發明之穿戴式行動裝置散熱結構之第二實施例之局部剖視放大圖;第7圖係為本發明之穿戴式行動裝置散熱結構之第三實施例之組合剖視圖;第8圖係為本發明之穿戴式行動裝置散熱結構之第四實施例之組合剖視圖;第9圖係為本發明之穿戴式行動裝置散熱結構之第五實施例之立體分解局部剖視圖。 1 is a perspective exploded view of a first embodiment of a heat dissipation structure of a wearable mobile device according to the present invention; and FIG. 2 is a cross-sectional view of a first embodiment of a heat dissipation structure of a wearable mobile device according to the present invention; Figure 2 is a partial cross-sectional enlarged view of the second embodiment of the heat-dissipating structure of the wearable mobile device of the present invention; Figure 4 is a perspective exploded view of the second embodiment of the heat-dissipating structure of the wearable mobile device of the present invention Figure 5 is a cross-sectional view showing a second embodiment of the heat dissipation structure of the wearable mobile device of the present invention; and Figure 6 is a partial cross-sectional enlarged view showing the second embodiment of the heat dissipation structure of the wearable mobile device of the present invention; Figure 7 is a cross-sectional view showing a third embodiment of the heat-dissipating structure of the wearable mobile device of the present invention; and Figure 8 is a cross-sectional view showing a fourth embodiment of the heat-dissipating structure of the wearable mobile device of the present invention; A perspective exploded partial cross-sectional view of a fifth embodiment of the heat sink structure of the wearable mobile device of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1、2、3圖,係為本發明之穿戴式行動裝置散熱結構之第一實施例之立體分解及組合圖剖視圖及局部剖視放大圖,如圖所示,本發明穿戴式行動裝置散熱結構1,係包含:一穿戴式行動裝置本體11、一可撓式帶體12;所述穿戴式行動裝置本體11具有一容置空間111並容設有複數電子元件112,該等電子元件112具有至少一發熱源1121。 1 and 2 are a perspective exploded view and a partial cross-sectional enlarged view of a first embodiment of a heat dissipating structure of a wearable mobile device according to the present invention. As shown, the wearable action of the present invention is illustrated. The device heat dissipation structure 1 includes a wearable mobile device body 11 and a flexible belt body 12; the wearable mobile device body 11 has an accommodation space 111 and accommodates a plurality of electronic components 112. Element 112 has at least one heat source 1121.
該可撓式帶體12係為橡膠或矽膠材質其中任一所構成,其具有一腔室121,該腔室121壁面凸伸一支撐部121a,且該腔室121內設有至少一毛細結構123及一工作液體2。 The flexible belt body 12 is formed of any one of a rubber or a silicone material, and has a chamber 121. The wall surface of the chamber 121 protrudes from a support portion 121a, and at least one capillary structure 123 is disposed in the chamber 121. And a working liquid 2.
所述支撐部121a係具有複數凸肋(連續(如條狀)或非連續)1211,該等凸肋1211平行並列,且該等凸肋1211間具有至少一通道1212,該等通道1212係可作為工作液體2蒸發汽化之蒸汽通道使用。 The support portion 121a has a plurality of ribs (continuous (such as strips) or discontinuous) 1211. The ribs 1211 are juxtaposed in parallel, and the ribs 1211 have at least one channel 1212 therebetween. It is used as a steam passage for evaporative vaporization of working liquid 2.
所述可撓式帶體12定義一吸熱部122及至少一散熱部124,所述散熱部124係由該吸熱部122至少一端延伸所構形。 The flexible strip 12 defines a heat absorbing portion 122 and at least one heat dissipating portion 124. The heat dissipating portion 124 is configured by extending at least one end of the heat absorbing portion 122.
所述吸熱部122被設置於該穿戴式行動裝置本體11之容置空間111中與該電子元件112或發熱源1121接觸。 The heat absorbing portion 122 is disposed in the accommodating space 111 of the wearable mobile device body 11 to be in contact with the electronic component 112 or the heat source 1121.
本實施例中該等電子元件112係為電路機板或電晶體或CPU或MCU或顯示螢幕或觸控螢幕或電池其中任一,該電子元件112透過貼設或置放於該吸熱部122之處,並且該吸熱部122本實施例係設置於該可撓式帶體12靠近中央處,其上側及下側皆可直接與該等電子元件112(如第2圖所述)。 In this embodiment, the electronic components 112 are either a circuit board or a transistor or a CPU or an MCU or a display screen or a touch screen or a battery. The electronic component 112 is attached or placed in the heat absorbing portion 122. The heat absorbing portion 122 is disposed in the vicinity of the center of the flexible strip 12, and the upper side and the lower side thereof are directly connected to the electronic components 112 (as described in FIG. 2).
所述可撓式帶體12之吸熱部122係較該可撓式帶體12其他部位之厚度 為薄,透過該吸熱部122直接與該等電子元件112或發熱源1121直接接觸傳導熱量,令吸熱部122直接將熱量傳遞至可撓式帶體12,並對該可撓式帶體12之腔室121內部之工作液體2產生加熱蒸發擴散,並於該可撓式帶體12之散熱部124處之腔室121內產生冷凝,再透過毛細結構123回流至該吸熱部122周圍再次進行汽液循環藉以達到散熱之效果。 The heat absorbing portion 122 of the flexible strip 12 is thicker than other portions of the flexible strip 12 The heat is directly transmitted to the electronic component 112 or the heat source 1121 through the heat absorbing portion 122 to directly conduct heat, so that the heat absorbing portion 122 directly transfers heat to the flexible belt 12, and the flexible belt 12 is The working liquid 2 inside the chamber 121 is heated to evaporate and diffuse, and condenses in the chamber 121 at the heat radiating portion 124 of the flexible strip 12, and then flows back through the capillary structure 123 to the heat absorbing portion 122 to re-steam. The liquid circulation is used to achieve the effect of heat dissipation.
請參閱第4、5、6圖,係為本發明之穿戴式行動裝置散熱結構之第二實施例之立體分解及組合剖視與剖視放大圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於本實施例之所述吸熱部122係嵌設一熱傳良導體122a,並該熱傳良導體122a一側相對於該等電子元件112或發熱源1121並與其貼設,所述熱傳良導體122a另一側係相對前述可撓式帶體12之腔室121,並所述毛細結構123部分延伸設置於該熱傳良導體122a周圍。 Please refer to Figures 4, 5 and 6 for a perspective exploded view, a combined cross-sectional view and a cross-sectional enlarged view of a second embodiment of the heat-dissipating structure of the wearable mobile device of the present invention. As shown, some structural techniques of this embodiment are shown. The features are the same as those in the foregoing first embodiment, and therefore will not be further described herein. However, the difference between the embodiment and the first embodiment is that the heat absorbing portion 122 of the embodiment is embedded with a heat transfer conductor 122a. And the side of the heat transfer conductor 122a is opposite to the electronic component 112 or the heat source 1121, and the other side of the heat transfer conductor 122a is opposite to the chamber 121 of the flexible tape 12, and The capillary structure 123 is partially extended around the heat transfer conductor 122a.
並本實施例熱傳良導體122a係為一銅質板體或一鋁質板體或一金屬板體或熱管或均溫板或石墨其中任一,本實施例係以銅質板體作為說明實施例但並不引以為限。 In this embodiment, the heat transfer conductor 122a is a copper plate body or an aluminum plate body or a metal plate body or a heat pipe or a uniform temperature plate or graphite. In this embodiment, a copper plate body is used as a description. The examples are not limited.
本實施例主要係為該穿戴式行動裝置本體11內之各項電子元件112之發熱源1121所產生之熱量,進一步透過吸熱部122所設置之熱傳良導體122a將熱量吸附並傳遞至該腔室121內,而吸熱部122之腔室121內之工作流體2受熱後產生蒸發,於吸熱部122之腔室121內產生汽化擴散,並於散熱部124之腔室121中冷凝後轉化成液態,再由該毛細結構123吸附回流至該吸熱部122周圍附近再次進行汽液循環,藉此產生一汽液循環進而達到對該等電子元件112進行散熱之效果者。 In this embodiment, the heat generated by the heat source 1121 of each electronic component 112 in the body of the wearable mobile device 11 is further absorbed and transmitted to the cavity through the heat transfer conductor 122a disposed in the heat sink 122. In the chamber 121, the working fluid 2 in the chamber 121 of the heat absorbing portion 122 is heated to be evaporated, vaporized and diffused in the chamber 121 of the heat absorbing portion 122, and condensed in the chamber 121 of the heat radiating portion 124 to be converted into a liquid state. Then, the capillary structure 123 is adsorbed and returned to the vicinity of the heat absorbing portion 122 to perform vapor-liquid circulation again, thereby generating a vapor-liquid circulation to achieve the effect of dissipating heat to the electronic components 112.
請參閱第7圖,係為本發明之穿戴式行動裝置散熱結構之第三實施例 之組合圖剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第二實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於,本實施例所述可撓式帶體12之腔室121內更具有一鍍層3,所述鍍層3係設於該腔室121之壁面,所述鍍層3係可增加該工作流體2(參閱第5圖)冷凝之效率及匯集之效果。 Please refer to FIG. 7 , which is a third embodiment of the heat dissipation structure of the wearable mobile device of the present invention. The sectional view of the combination is as shown in the figure. The structural features of the embodiment are the same as those of the foregoing second embodiment, and therefore will not be described again here. However, the difference between the embodiment and the first embodiment is that the present embodiment For example, the chamber 121 of the flexible belt body 12 further has a plating layer 3, and the plating layer 3 is disposed on the wall surface of the chamber 121, and the plating layer 3 can increase the working fluid 2 (refer to FIG. 5). The efficiency of condensation and the effect of collection.
請參閱第8圖,係為本發明之穿戴式行動裝置散熱結構之第四實施例之組合剖視圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於本實施例中更具有至少一熱傳單元4,所述熱傳單元4係為熱管或均溫板或石墨片其中任一,並該熱傳單元4係設於前述電子元件112與該可撓式帶體12之間,並可透過該熱傳單元4進一步大面積吸收該等電子元件112之熱量後再傳遞給可撓式帶體12之吸熱部122進行熱傳導,所述吸熱部122再將所接受之熱量傳遞至遠端的散熱部124進行散熱(如第5圖所示)。 FIG. 8 is a cross-sectional view showing a fourth embodiment of the heat dissipation structure of the wearable mobile device of the present invention. As shown in the figure, the structural features of the embodiment are the same as those of the first embodiment. The difference between the present embodiment and the foregoing first embodiment is that the present embodiment further has at least one heat transfer unit 4, which is a heat pipe or a uniform temperature plate or a graphite sheet. And the heat transfer unit 4 is disposed between the electronic component 112 and the flexible strap 12, and can further absorb the heat of the electronic components 112 through the heat transfer unit 4, and then transmit to the flexible The heat absorbing portion 122 of the strip body 12 conducts heat conduction, and the heat absorbing portion 122 transfers the received heat to the heat radiating portion 124 at the distal end to dissipate heat (as shown in Fig. 5).
請參閱第9圖,係為本發明之穿戴式行動裝置散熱結構之第五實施例之立體分解圖,如圖所示,本實施例部分結構技術特徵係與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之差異在於本實施例中所述支撐部121a係具有複數凸體1213,該等凸體1213間隔排列,該等凸體1213間橫向及縱向間具有至少一通道1212,該通道1212係可提供該工作流體2(如第5圖所示)作為蒸發後之蒸汽通道使用。 FIG. 9 is a perspective exploded view of a fifth embodiment of the heat dissipation structure of the wearable mobile device of the present invention. As shown in the figure, some of the structural features of the embodiment are the same as those of the first embodiment. The difference between the present embodiment and the first embodiment is that the support portion 121a has a plurality of protrusions 1213 in the embodiment, and the protrusions 1213 are spaced apart, and the protrusions 1213 are laterally arranged. There is at least one passage 1212 between the longitudinal direction, and the passage 1212 can provide the working fluid 2 (as shown in FIG. 5) for use as an evaporated steam passage.
前述各實施例中所述毛細結構121係為網格體或纖維體或複數金屬線材編織體或燒結粉末體其中任一,本實施例係以網格體作為說明實施例,但並不引以為限。 In the foregoing embodiments, the capillary structure 121 is a mesh body or a fiber body or a plurality of metal wire braids or sintered powder bodies. This embodiment uses a mesh body as an illustrative embodiment, but does not Limited.
1‧‧‧穿戴式行動裝置散熱結構 1‧‧‧Wearing mobile device heat dissipation structure
11‧‧‧穿戴式行動裝置本體 11‧‧‧ Wearable mobile device body
111‧‧‧容置空間 111‧‧‧ accommodating space
112‧‧‧電子元件 112‧‧‧Electronic components
1121‧‧‧發熱源 1121‧‧‧heat source
12‧‧‧可撓式帶體 12‧‧‧Flexible belt
121‧‧‧腔室 121‧‧‧室
122‧‧‧吸熱部 122‧‧‧heat absorption department
123‧‧‧毛細結構 123‧‧‧Capillary structure
124‧‧‧散熱部 124‧‧‧ Department of heat dissipation
121a‧‧‧支撐部 121a‧‧‧Support
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103138956A TWI534596B (en) | 2014-11-10 | 2014-11-10 | Wearable mobile device heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103138956A TWI534596B (en) | 2014-11-10 | 2014-11-10 | Wearable mobile device heat dissipation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201617762A TW201617762A (en) | 2016-05-16 |
| TWI534596B true TWI534596B (en) | 2016-05-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103138956A TWI534596B (en) | 2014-11-10 | 2014-11-10 | Wearable mobile device heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI534596B (en) |
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2014
- 2014-11-10 TW TW103138956A patent/TWI534596B/en active
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| Publication number | Publication date |
|---|---|
| TW201617762A (en) | 2016-05-16 |
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