TWI510147B - Electronic device and printing circuit board forming method - Google Patents

Description

Method for forming electronic device and printed circuit board

This invention relates to a printed circuit board, and more particularly to a printed circuit board that reduces mechanical wave noise.

A printed circuit board is a support for electronic components. The traditional printed circuit board uses the method of printing etch resist to make the circuit and the surface of the circuit, so it is called a printed circuit board or a printed circuit board. The use of printed circuit boards is currently quite common and is applied to various types of electronic devices. The blood pressure device will be described as an example below.

In general, blood pressure monitors can be used to detect a user's blood pressure. The blood pressure device includes an inflatable pump, an inflatable arm band, and a blood pressure device body. The inflatable arm strap can be worn on the user's arm. An inflatable pump can be used to pump up the inflatable arm. The blood pressure device body includes a printed circuit board. The printed circuit board will be equipped with a pressure sensor. The pressure sensor is connected to the inflatable arm pocket through a gas pipe and can be used to detect the pressure of the inflatable arm pocket.

It is worth mentioning that when the printed circuit board is fixed to the housing of the blood pressure device through the copper column or the user uses the blood pressure device, the printed circuit board is often subjected to external force interference and the plate is bent and deformed, thereby causing the pressure sensor to occur. error.

The invention provides an electronic device for reducing noise of a resistive sensor.

The invention provides a method for forming a printed circuit board, which can reduce the interference of the plate bending of the printed circuit board on the resistive sensor.

The invention provides an electronic device comprising a printed circuit board, a positioning member and a resistive sensor. The printed circuit board includes a positioning portion, a component arrangement region and an isolation trench. The isolation trench is located between the positioning portion and the component arrangement region and adjacent to the periphery of the component arrangement region for isolating a mechanical wave conduction between the positioning portion and the component arrangement region. The positioning member fixes the printed circuit board through the positioning portion. The resistive sensor is disposed on the component arrangement area.

From another point of view, the present invention provides a method of forming a printed circuit board that includes defining a positioning portion of the printed circuit board, wherein the positioning portion is for connecting to a positioning member. In addition, a component arrangement area of the printed circuit board is defined, wherein the component arrangement area is for a resistive sensor to be disposed thereon. Furthermore, an isolation trench is formed between the positioning portion and the component arrangement region and adjacent to the periphery of the component arrangement region.

In an embodiment of the invention, the component placement region is connected to the printed circuit board by only one side by isolation of the isolation trench.

In an embodiment of the invention, the isolation trench is formed using die cutting techniques, die cutting techniques, compression molding techniques, or high speed drilling techniques.

From another perspective, the present invention provides an electronic device including a printed circuit board, a positioning member and a resistive sensor. The printed circuit board includes a positioning portion, a component arrangement region and an isolation trench. The isolation trench is located between the positioning portion and the component arrangement region and adjacent to the periphery of the component arrangement region. The positioning member can fix the printed circuit board through the positioning portion. The resistive sensor is disposed on the component placement area.

In an embodiment of the invention, the component placement area is formed by the isolation trench The slots are isolated and only one side is connected to the printed circuit board.

In an embodiment of the invention, the resistive sensor comprises a pressure sensor or a temperature sensor. In another embodiment, the resistive sensor has a resistance value. The above resistance value is changed by the deformation of the printed circuit board. In still another embodiment, the positioning member includes a housing, a copper post or a clip. In still another embodiment, the shape of the isolation trench is at least one of a linear shape, a curved shape, and a polygonal shape, or a combination thereof.

Based on the above, the present invention forms an isolation trench between the positioning portion on the printed circuit board and the component arrangement region, which can reduce interference of force noise.

The above described features and advantages of the invention will be apparent from the following description.

Conventional blood pressure monitors tend to affect the accuracy of the pressure sensor due to the bending of the printed circuit board.

In contrast, embodiments of the present invention form isolation trenches between the locating portions on the printed circuit board and the component placement regions. In general, most of the external interference of printed circuit boards is caused by the positioning portion. The isolation trench can block the conduction of the mechanical wave, and the resistive sensor on the component arrangement area is reduced by external force. As a result, even if the printed circuit board is bent, the resistive sensor is not affected much. The embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which FIG.

1 is a schematic diagram of a printed circuit board of an electronic device in accordance with a first embodiment of the present invention. Please refer to FIG. 1, in this embodiment, an electronic device The blood pressure device (not shown) is taken as an example, but the invention is not limited thereto. In other embodiments, the electronic device may also be other electronic devices, such as a temperature sensing device, an all-in-one home care device, a pressure control device, an automatic control pump device, a gas pressure monitoring device, a communication device, a high-precision instrument, Sensing devices, medical instrument devices, or consumer electronics...etc.

In view of the above, the electronic device provided by the present invention includes a printed circuit board 10, a positioning member (not shown) and a resistive sensor 50. The printed circuit board 10 includes a positioning portion 20, a component arrangement region 30 and an isolation trench 40. In this embodiment, the positioning member is, for example, a positioning post. The positioning member can fix the printed circuit board 10 in the electronic device through the positioning portion 20. The resistive sensor 50 can be, for example, a resistive pressure sensor disposed on the component placement region 30. It is worth mentioning that if the substrate under the resistive sensor 50 is disturbed by an external force, the resistive sensor 50 is prone to error. The dotted line F1 in Figure 1 illustrates possible external force interference.

In view of this, the isolation trench 40 may be formed between the positioning portion 20 and the component arrangement region 30 to isolate the mechanical wave conduction between the positioning portion 20 and the component placement region 30. In this way, when the positioning portion 20 and the positioning member are interfered by the external force, the mechanical wave is not easily transmitted to the component arrangement region 30, and the resistive sensor 50 is less susceptible to interference, and the accuracy of the electronic device can also be improved. The method for forming the printed circuit board and its isolation trenches will be further described below.

2 is a flow chart of a method of forming a printed circuit board in accordance with a first embodiment of the present invention. Referring to FIG. 1 and FIG. 2 together, first, a positioning portion 20 of the printed circuit board 10 may be defined by step S201, wherein the positioning portion 20 is used to connect to the positioning member. A component arrangement area 30 of the printed circuit board 10 can then be defined by step S202, wherein the component arrangement area 30 can be used for component placement thereon, such as a resistive sensor or other various components susceptible to external force from the substrate. For example, a pressure sensor or a temperature sensor or the like, but the invention is not limited thereto.

Then, an isolation trench 40 is formed between the positioning portion 20 and the component arrangement region 30 by step S203. More specifically, the isolation trench 40 can be formed, for example, using die cutting techniques, die cutting techniques, compression molding techniques, or high speed drilling techniques. As a result, when the positioning portion 20 and the positioning member are interfered by an external force, the mechanical wave is not easily transmitted to the component arrangement region 30.

Although a possible form of the electronic device and printed circuit board forming method has been drawn in the above embodiments, those skilled in the art should know the methods for forming electronic devices and printed circuit boards by various manufacturers. The design is different, so the application of the invention is not limited to this possible type. In other words, it is in keeping with the spirit of the present invention as long as the isolation trench is formed between the component arrangement region on the printed circuit board and the positioning portion. The following examples are presented to enable those of ordinary skill in the art to understand the invention and practice the invention.

In the above embodiment, the positioning member is described by taking a positioning post as an example, but it is only an alternative embodiment. In other embodiments, the positioning member may also be a copper post, a snap member, a limiting member formed by the housing, or a clip member or the like.

In the above embodiment, the resistive sensor is described by taking a resistive pressure sensor as an example, but it is only an alternative embodiment. In other implementations In an example, the resistive sensor 50 can also be a temperature sensor, a humidity sensor, an infrared sensor, or other sensor susceptible to mechanical wave interference.

In FIG. 1 of the first embodiment, the isolation trench 40 is described by taking a straight line as an example, but it is merely an alternative embodiment, and the present invention is not limited thereto. In other embodiments, those skilled in the art can also change the shape of the isolation trench according to the requirements thereof, for example, at least one of a linear shape, a curved shape, a polygonal shape, and an arc shape, and a combination thereof. For example, Figure 3 depicts a schematic of six isolation trenches. In Figure 3, isolation trenches 401-406 can be used to block the conduction of mechanical waves. However, as the shape of the isolation trench is different, the effect of obstructing the mechanical wave may be different, and those skilled in the art may select an appropriate isolation trench type according to their needs.

In Fig. 1 of the first embodiment, the component arrangement region 30 is disposed at a corner of the printed circuit board 10, but it is merely an alternative embodiment, and the present invention is not limited thereto. In other embodiments, component placement area 30 may also be located at the side, middle, or other location of printed circuit board 10. Further, although the positioning unit 20 is exemplified by two, it is merely an alternative embodiment. In other embodiments, the positioning portion 20 may also be one or three or more.

Although the element arrangement region 30 has been described as an example, it may be two or more in other embodiments. Further, although the isolation trench 40 is described as an example, it may be two or more in other embodiments. Moreover, although the isolation trench 40 is adjacent to the component placement region 30, it is merely an alternative embodiment. In other embodiments, the isolation trench 40 may also be located adjacent to the positioning portion 20 or at any position between the component arrangement region 30 and the positioning portion 20.

For example, FIGS. 4 to 16 are schematic views of a printed circuit board in accordance with second to fourteenth embodiments of the present invention. The isolation trenches 40 in FIGS. 4-16 can effectively prevent the transmission of mechanical waves and reduce the interference of the resistive sensor 50 by external forces. In this way, effects similar to those of the first embodiment can also be achieved.

Referring to FIG. 4 , the resistive sensor 50 is disposed at a middle end of the printed circuit board 10 , and the positioning portion 20 is disposed at one side of the resistive sensor 50 on the printed circuit board 10 . Two isolation trenches 40 are disposed on the two sides of the resistive sensor 50, which can effectively prevent external force interference in the F1 direction of FIG.

Referring to FIG. 5 , the resistive sensor 50 is disposed at a middle portion of the printed circuit board 10 , and the positioning portion 20 is disposed at two sides of the resistive sensor 50 , and the isolation trench 40 is formed on the The three sides of the resistive sensor 50 can effectively prevent external force interference in the F1 direction of FIG.

Referring to FIG. 6 , the resistive sensor 50 is disposed at a corner of the printed circuit board 10 , and the positioning portion 20 is disposed at an oblique angle of the resistive sensor 50 . 40 is disposed on one side of the resistive sensor 50, and can effectively prevent external force interference in the F1 direction of FIG.

Referring to FIG. 7 , the resistive sensor 50 is disposed at a middle end of the printed circuit board 10 , and the positioning portion 20 is disposed at an oblique angle on both sides of the resistive sensor 50 , and the isolation trench The slots 40 are disposed on both sides of the resistive sensor 50 to effectively prevent external force interference in the F1 direction of FIG.

Referring to FIG. 8 , the resistive sensor 50 is disposed at a middle portion of the printed circuit board 10 , and the positioning portion 20 is disposed on the resistive sensor 50 . The two sides are inclined, and the isolation trench 40 is disposed on three sides of the resistive sensor 50, which can effectively prevent external force interference in the F1 direction of FIG.

Referring to FIG. 9 , the resistive sensor 50 is disposed at a middle portion of the printed circuit board 10 , and the positioning portion 20 is disposed at two ends of the resistive sensor 50 , and the isolation trench 40 is disposed. On the three sides of the resistive sensor 50, external force interference in the F1 direction of FIG. 9 can be effectively prevented.

Referring to FIG. 10, the resistive sensor 50 is disposed at a middle portion of the printed circuit board 10, and the positioning portion 20 is disposed at one end of the resistive sensor 50, and the isolation trench 40 is disposed at The three sides of the resistive sensor 50 can effectively prevent external force interference.

Referring to FIG. 11 , the resistive sensor 50 is disposed at a middle portion of the printed circuit board 10 , and the positioning portion 20 is disposed at one end of the resistive sensor 50 , and the isolation trench 40 is disposed at The three sides of the positioning portion 20 can effectively prevent external force interference.

Referring to FIG. 12, the resistive sensor 50 is disposed at a middle portion of the printed circuit board 10, and the positioning portion 20 is disposed at one end of the resistive sensor 50, and the isolation trench 40 is disposed at The three sides of the positioning portion 20 and the three sides of the resistive sensor 50 may have different widths of the isolation trenches 40, and may also effectively prevent external force interference.

Referring to FIG. 13 , the resistive sensor 50 is disposed at a middle portion of the printed circuit board 10 , and the positioning portion 20 is disposed at two ends of the resistive sensor 50 , and the isolation trench 40 is disposed. On the three sides of the two positioning portions 20, external force interference can also be effectively prevented.

Referring to FIG. 14, the resistive sensor 50 is set in printed electricity. The positioning portion 20 is disposed at two sides of the resistive sensor 50, and the isolation trench 40 is disposed on three sides of the two positioning portions 20 as shown in FIG. Effectively prevent external interference.

Referring to FIG. 15, one end of the printed circuit board 10 is provided with two resistive sensors 50, and the positioning portion 20 is disposed at one end of the resistive sensor 50, and the isolation trench 40 is disposed at The three sides of the two resistive sensors 50 have the shape as shown in FIG. 15, and can also effectively prevent external force interference.

Referring to FIG. 16 , the printed circuit board 10 is provided with a resistive sensor 50 at a middle portion, and the positioning portion 20 is disposed at one end of the printed circuit board 10 , and the isolation trench 40 is disposed on the printed circuit board. The three sides of 10 are shaped as shown in Fig. 16, and can also effectively prevent external force interference.

In summary, the present invention utilizes an isolation trench formed between the component placement region on the printed circuit board and the positioning portion. In this way, it is possible to reduce the interference of the components on the component arrangement region by the mechanical waves from the positioning portion.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and those skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Printed circuit board

20‧‧‧ Positioning Department

30‧‧‧Component configuration area

40, 401~406‧‧‧Isolation trench

50‧‧‧Resistive Sensor

S201~S203‧‧‧How to form a printed circuit board

F1‧‧‧ dotted line

1 is a schematic diagram of a printed circuit board of an electronic device in accordance with a first embodiment of the present invention.

2 is a flow chart of a method of forming a printed circuit board in accordance with a first embodiment of the present invention.

Figure 3 depicts a schematic of six isolation trenches.

4 to 16 are schematic views of a printed circuit board in accordance with second to fourteenth embodiments of the present invention.

10‧‧‧Printed circuit board

20‧‧‧ Positioning Department

30‧‧‧Component configuration area

40‧‧‧Isolation trench

50‧‧‧Resistive Sensor

F1‧‧‧ dotted line

Claims (9)

An electronic device comprising: a printed circuit board comprising a positioning portion, a component arrangement region and an isolation trench, wherein the isolation trench is located between the positioning portion and the component arrangement region and adjacent to the component arrangement region a surrounding portion for isolating a mechanical wave conduction between the positioning portion and the component arrangement region; a positioning member fixing the printed circuit board through the positioning portion; and a resistive sensor disposed in the component arrangement region on. The electronic device of claim 1, wherein the component placement region is connected to the printed circuit board by only one side by isolation of the isolation trench. The electronic device of claim 1, wherein the resistive sensor comprises a pressure sensor or a temperature sensor. The electronic device of claim 1, wherein the resistive sensor has a resistance value that is varied by deformation of the printed circuit board. The electronic device of claim 1, wherein the positioning member comprises a housing, a copper post or a clip. The electronic device of claim 1, wherein the isolation trench has a shape of at least one of a linear shape, a curved shape, and a polygonal shape or a combination thereof. A method for forming a printed circuit board, comprising: defining a positioning portion of the printed circuit board, wherein the positioning portion is for connecting to a positioning member; Defining a component arrangement area of the printed circuit board, wherein the component arrangement area is for a resistive sensor disposed thereon; and forming an isolation trench between the positioning portion and the component arrangement area, and adjacent Around the component configuration area. The method of forming a printed circuit board according to claim 7, wherein the component arrangement region is connected to the printed circuit board by only one side by isolation of the isolation trench. The method of forming a printed circuit board according to claim 7 or 8, wherein the isolation trench is formed by die cutting technology, die cutting technique, compression molding technique or high speed drilling technology.