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TWI509484B - Touch-sensitive panel device and electrode structure therein - Google Patents

Touch-sensitive panel device and electrode structure therein Download PDF

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Publication number
TWI509484B
TWI509484B TW102146150A TW102146150A TWI509484B TW I509484 B TWI509484 B TW I509484B TW 102146150 A TW102146150 A TW 102146150A TW 102146150 A TW102146150 A TW 102146150A TW I509484 B TWI509484 B TW I509484B
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layer
electrode structure
substrate
blackening
shaved
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TW102146150A
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Chinese (zh)
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TW201523366A (en
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Yu Chou Yeh
Tsung Her Yeh
Szu Kai Liao
Chiu Cheng Tsui
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J Touch Corp
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Description

觸控面板裝置與其電極結構Touch panel device and electrode structure thereof

一種觸控面板裝置與其電極結構,特別是具有防反光功能的金屬電極結構,以及以此電極結構組成的觸控面板裝置。A touch panel device and an electrode structure thereof, in particular, a metal electrode structure having an anti-reflection function, and a touch panel device composed of the electrode structure.

在採用金屬電極導線(金屬網格)的面板習知技術中,需要額外添加一層防炫光處理(Anti-Glare)膜,藉此消除面板中金屬導線產生的金屬反光,這些反光可能造成顯示品質下降的問題。In the conventional art of panel using metal electrode wires (metal mesh), an additional anti-Glare film is required to eliminate the metal reflection caused by the metal wires in the panel, and these reflections may cause display quality. The problem of falling.

習知採用防炫光處理膜可能會增加觸控面板的厚度,並且影響到透光區的透光性;同時,光學級的塑膠基板本身也可能造成反光,反光容易使人眼視覺疲勞,若與前述金屬線的反光結合,反光干擾更甚,使得人眼更容易觀察到金屬導線的干涉現象。It is known that the anti-glare treatment film may increase the thickness of the touch panel and affect the light transmission of the light-transmitting region; at the same time, the optical-grade plastic substrate itself may also cause reflection, and the reflection is easy to cause visual fatigue of the human eye. In combination with the reflection of the aforementioned metal wires, the reflection interference is even worse, making it easier for the human eye to observe the interference phenomenon of the metal wires.

圖1顯示習知技術中基板與電極結構應用於觸控顯示裝置的剖面結構示意圖。FIG. 1 is a schematic cross-sectional view showing the structure of a substrate and an electrode structure applied to a touch display device in the prior art.

其中觸控面板部份包括基板10與其上下兩個表面的電極結構101、102,組成觸控顯示裝置時,上方設有光學膠(optically clear adhesive)11,光學膠11上黏著為了要消除面板中金屬材料的反光的防炫光處理膜12,接著再以光學膠13貼附上方基板14。在此結構下方,基板10則可透過光學膠15設於液晶顯示模組16上。The touch panel portion includes the electrode structure 101 and 102 of the substrate 10 and the upper and lower surfaces thereof. When the touch display device is formed, an optically clear adhesive 11 is disposed thereon, and the optical adhesive 11 is adhered in order to eliminate the panel. The reflective anti-glare treatment film 12 of the metal material is then attached to the upper substrate 14 with the optical glue 13. Under the structure, the substrate 10 is disposed on the liquid crystal display module 16 through the optical adhesive 15.

在習知技術中,也有為了降低如前述金屬反光的解決方式,比如在金屬(如銅)網格的結構上鍍製一黑化層,藉此調整螢幕 與網格結構色差,但此黑化層無論是使用何種金屬或氧化層,都會降低金屬層的導電率,且抗環境腐蝕的能力差。In the prior art, there is also a solution for reducing the reflection of metal as described above, such as plating a black layer on the structure of a metal (such as copper) grid, thereby adjusting the screen. The color difference is different from the grid structure, but the blackening layer reduces the conductivity of the metal layer regardless of the metal or oxide layer used, and has poor resistance to environmental corrosion.

習知技術之觸控面板中導電電極與基板的疊構可參閱圖2所示之剖面示意圖。For a stack of conductive electrodes and substrates in a touch panel of the prior art, reference may be made to the cross-sectional view shown in FIG.

其中顯示在面板中的塑膠基板21,上方形成第一電極23,此類電極結構為金屬材料,會產生金屬反光,因此可以在其表面上形成一第一黑化層25,作為降低金屬與螢幕產生的色差之用。如圖所示,入射光201射向第一電極23時,原本的反射光202會因第一黑化層25而感覺到金屬反光;接著如入射光203來看,射向塑膠基板21的光線也會被基板所反射,如反射光204。The plastic substrate 21 is displayed in the panel, and the first electrode 23 is formed above. The electrode structure is a metal material, which causes metal reflection, so that a first blackening layer 25 can be formed on the surface thereof to reduce the metal and the screen. The color difference produced. As shown in the figure, when the incident light 201 is incident on the first electrode 23, the original reflected light 202 will be reflected by the first blackening layer 25; then, as seen by the incident light 203, the light is directed toward the plastic substrate 21. It is also reflected by the substrate, such as reflected light 204.

在塑膠基板21之另一側表面也形成另一層電極層,如圖示有第二電極29,同樣在第二電極29對外的表面上形成有第二黑化層27。如圖所示,射向塑膠基板21的光線經穿透後射到第二電極29,而感覺到反射光205。Another electrode layer is also formed on the other side surface of the plastic substrate 21, as shown by the second electrode 29, and a second blackening layer 27 is also formed on the outer surface of the second electrode 29. As shown, the light that is incident on the plastic substrate 21 is penetrated and then hits the second electrode 29, and the reflected light 205 is perceived.

如上所述,習知技術中利用防炫光結構以降低金屬反射現象,或是於電極結構上形成黑化層以降低金屬與螢幕產生的色差,皆無法有效解決反射問題,卻會產生如增加面板厚度,降低所覆蓋的金屬導電率,並且抗蝕能力低等問題。As described above, in the prior art, the anti-glare structure is used to reduce the metal reflection phenomenon, or the blackening layer is formed on the electrode structure to reduce the color difference between the metal and the screen, and the reflection problem cannot be effectively solved, but an increase occurs. The thickness of the panel reduces the conductivity of the metal covered and has low corrosion resistance.

有鑑於習知技術採用金屬電極導線產生了金屬反光,電極上直接覆蓋防炫光處理膜將造成面板顯示品質下降,或是透過鍍製黑化層避免金屬與螢幕產生的色差問題,卻又造成導電率降低的問題,本發明揭露書提出一種觸控面板裝置、電極結構與製程,其中電極結構的設計除了可以有效消除金屬或基板產生的反光,更可有效降低觸控面板厚度,且不影響顯示品質,具高透光性與金屬導電率,同時具有極佳的耐候性,可在高溫鹽浴的環境下抗腐蝕。In view of the conventional technology, the metal electrode wire is used to produce metal reflection, and directly covering the anti-glare film on the electrode will cause the panel display quality to be degraded, or the blackening layer may be used to avoid the color difference between the metal and the screen, but cause The invention discloses a touch panel device, an electrode structure and a process, wherein the design of the electrode structure can effectively eliminate the reflection caused by the metal or the substrate, and can effectively reduce the thickness of the touch panel without affecting. Display quality, high light transmission and metal conductivity, and excellent weather resistance, corrosion resistance in high temperature salt bath environment.

根據實施例之一,電極結構主要結構有金屬導電層,形成於基板之表面上,為電極結構之導電結構;削光粗化結構,接續形成於金屬導電層之表面上,用以將金屬反光散射掉,或是用以降低金屬導電層與基板兩者合成的反光,削光粗化結構的形成可以在金屬導電層上蝕刻或加工形成,或是利用電解、濺鍍、沈積或塗佈方法形成;再有一黑化層,接續形成於削光粗化結構之表面上,使黑化層亦產生削光作用,用以吸收射向金屬導電層的光線,同時使得入射光線不會一致性地朝同一方向反射,以抗金屬反光。According to one embodiment, the electrode structure is mainly provided with a metal conductive layer formed on the surface of the substrate as a conductive structure of the electrode structure; the thinned and roughened structure is successively formed on the surface of the metal conductive layer for reflecting the metal Scattered or used to reduce the reflection of the metal conductive layer and the substrate. The formation of the thinned roughened structure can be formed by etching or processing on the metal conductive layer, or by electrolysis, sputtering, deposition or coating. Forming; a blackening layer is formed on the surface of the thinned roughened structure, so that the blackening layer also has a shaving effect for absorbing light incident on the metal conductive layer, and the incident light is not consistently Reflect in the same direction to resist metal reflection.

基於前述電極結構,電極結構更可包括一接著層,電極結構透過此接著層與基板結合,可用以提升電極結構與基板的接著性;同時,接著層可具有削光粗化的結構。Based on the foregoing electrode structure, the electrode structure may further include an adhesive layer through which the electrode structure is combined with the substrate to improve the adhesion between the electrode structure and the substrate. Meanwhile, the adhesive layer may have a structure of shading and roughening.

在另一電極結構的實施例中,主要結構包括有金屬導電層以及具有粗糙表面的黑化層,此例即直接於黑化層上以蝕刻或加工形成粗糙面,此具有粗糙表面的黑化層透過表面結構降低自金屬導電層反射形成的反光散射掉,並降低反光量。同樣地,在電極結構與基板之間可形成有一提昇接著性的接著層;同時,接著層可具有削光粗化的結構。In another embodiment of the electrode structure, the main structure comprises a metal conductive layer and a blackened layer having a rough surface, which is directly etched or processed on the blackened layer to form a rough surface, which has a blackened surface The layer reduces the light scattering from the reflection of the metal conductive layer through the surface structure and reduces the amount of light reflection. Similarly, an adhesion-promoting bonding layer may be formed between the electrode structure and the substrate; meanwhile, the bonding layer may have a structure of shading and roughening.

在前述實施例中,黑化層之表面上更可形成另一黑化層,可藉此增加抗蝕與黑化的能力;而接著層與金屬導電層之間可再形成一提升附著性的另一接著層;同時,另一接著層可具有削光粗化的結構。In the foregoing embodiment, another blackening layer may be formed on the surface of the blackening layer, thereby increasing the resistance of the blackening and blackening; and the adhesion between the bonding layer and the metal conductive layer may be further formed. Another subsequent layer; at the same time, another subsequent layer may have a structure that is shaved and roughened.

根據再一電極結構的實施例中,電極結構主要有接著層、金屬導電層與第一黑化層,此第一黑化層接續形成於金屬導電層之表面上,用以吸收射向該金屬導電層的光線,以抗金屬反光,接著於第一黑化層表面上再形成第二黑化層,再於第二黑化層之表面蝕刻或加工後形成粗糙表面結構,藉此加強抗反光的效果,減少與螢幕之色偏。本發明實施態樣之電極結構,可具有兩層以上之接著層、黑化層與削光粗化層,並非用以對本發明加以限制。According to the embodiment of the further electrode structure, the electrode structure mainly has an adhesive layer, a metal conductive layer and a first blackening layer. The first blackening layer is formed on the surface of the metal conductive layer to absorb the metal. The light of the conductive layer is reflective with metal, and then a second blackening layer is formed on the surface of the first blackening layer, and then etched or processed on the surface of the second blackening layer to form a rough surface structure, thereby enhancing anti-reflection The effect is reduced by the color cast of the screen. The electrode structure of the embodiment of the present invention may have two or more layers, a blackening layer and a shaved rough layer, and is not intended to limit the invention.

上述各實施例所載的電極結構,與一基材結合,組合形成一種觸控面板裝置。The electrode structures described in the above embodiments are combined with a substrate to form a touch panel device.

於再一實施例中,基材表面同樣可形成有削光粗化結構,主要目的就是為了能夠讓進入基材的光線可以被散射掉,有效避免造成視覺上不舒適的反光。In still another embodiment, the surface of the substrate may also be formed with a shaved and roughened structure, the main purpose of which is to enable the light entering the substrate to be scattered, thereby effectively avoiding visually uncomfortable reflection.

於前述基材與電極結構中形成削光粗化結構的實施例中,當與其他元件結合時,可以填入光學膠,光學膠會填補基材透光區表面削光粗化結構的隙縫,可降低因為削光粗化所提升的霧度,同時使具粗糙表面的黑化層顏色更黑,減少與螢幕之色偏。In the embodiment in which the thinned and roughened structure is formed in the substrate and the electrode structure, when combined with other components, the optical adhesive may be filled, and the optical adhesive fills the gap of the roughened structure on the surface of the transparent region of the substrate. It can reduce the haze which is enhanced by the shaving and roughening, and make the blackening layer with rough surface darker and reduce the color shift with the screen.

為了能更進一步瞭解本發明為達成既定目的所採取之技術、方法及功效,請參閱以下有關本發明之詳細說明、圖式,相信本發明之目的、特徵與特點,當可由此得以深入且具體之瞭解,然而所附圖式與附件僅提供參考與說明用,並非用來對本發明加以限制者。In order to further understand the technology, method and effect of the present invention in order to achieve the intended purpose, reference should be made to the detailed description and drawings of the present invention. The drawings and the annexed drawings are intended to be illustrative and not to limit the invention.

10‧‧‧基板10‧‧‧Substrate

101,102‧‧‧電極結構101,102‧‧‧Electrode structure

11,13,15‧‧‧光學膠11,13,15‧‧‧Optical adhesive

12‧‧‧防炫光處理膜12‧‧‧Anti-glare treatment film

14‧‧‧上方基板14‧‧‧Upper substrate

16‧‧‧液晶顯示模組16‧‧‧LCD module

21‧‧‧塑膠基板21‧‧‧Plastic substrate

23‧‧‧第一電極23‧‧‧First electrode

25‧‧‧第一黑化層25‧‧‧First blackening layer

29‧‧‧第二電極29‧‧‧second electrode

27‧‧‧第二黑化層27‧‧‧Second blackening layer

201,203‧‧‧入射光201, 203‧‧‧ incident light

202,204,205‧‧‧反射光202,204,205‧‧‧ Reflected light

30‧‧‧基板30‧‧‧Substrate

32‧‧‧電極結構32‧‧‧Electrode structure

301‧‧‧金屬導電層301‧‧‧Metal conductive layer

302‧‧‧削光粗化層302‧‧‧Doughening rough layer

303‧‧‧黑化層303‧‧‧Blackening layer

40‧‧‧基板40‧‧‧Substrate

401‧‧‧接著層401‧‧‧Next layer

42‧‧‧電極結構42‧‧‧Electrode structure

402‧‧‧金屬導電層402‧‧‧Metal conductive layer

403‧‧‧削光粗化層403‧‧‧Shaded roughened layer

404‧‧‧黑化層404‧‧‧Blackening layer

52‧‧‧電極結構52‧‧‧Electrode structure

50‧‧‧基板50‧‧‧Substrate

501‧‧‧第一接著層501‧‧‧ first layer

502‧‧‧第二接著層502‧‧‧Secondary layer

503‧‧‧金屬導電層503‧‧‧Metal conductive layer

504‧‧‧削光粗化層504‧‧ ‧ shaved rough layer

505‧‧‧第一黑化層505‧‧‧First blackening layer

506‧‧‧第二黑化層506‧‧‧Second blackening layer

60,60’‧‧‧基板60,60'‧‧‧substrate

601’‧‧‧第一削光粗化層601'‧‧‧The first shaved rough layer

602’‧‧‧第二削光粗化層602'‧‧‧Second shaved roughening layer

601,602‧‧‧削光粗化結構601,602‧‧‧Diffuse roughening structure

70,70’‧‧‧基板70,70’‧‧‧substrate

72,72’‧‧‧電極結構72,72'‧‧‧electrode structure

701,724‧‧‧削光粗化層701, 724‧‧ ‧ shaved rough layer

721‧‧‧第一接著層721‧‧‧ first layer

722‧‧‧第二接著層722‧‧‧second second layer

723‧‧‧金屬導電層723‧‧‧Metal conductive layer

725,725’‧‧‧第一黑化層725, 725' ‧ ‧ the first blackening layer

726,726’‧‧‧第二黑化層726, 726'‧‧‧ second blackening layer

727‧‧‧削光粗化結構727‧‧ ‧ shaved roughening structure

80‧‧‧基板80‧‧‧Substrate

801‧‧‧第一削光粗化層801‧‧‧First shaved roughening layer

802‧‧‧第二削光粗化層802‧‧‧Second shaved roughening layer

82‧‧‧第一電極結構82‧‧‧First electrode structure

84‧‧‧第二電極結構84‧‧‧Second electrode structure

811,812‧‧‧光學膠811,812‧‧‧Optical adhesive

803‧‧‧透明基板803‧‧‧Transparent substrate

804‧‧‧液晶顯示模組804‧‧‧LCD module

90‧‧‧基板90‧‧‧Substrate

901‧‧‧削光粗化層901‧‧‧Doughening rough layer

923,923’,923”‧‧‧金屬導電層923,923’, 923”‧‧‧Metal conductive layer

924,924’,924”‧‧‧第一黑化層924,924’, 924”‧‧‧ first blackening layer

925,925’,925”‧‧‧第二黑化層925, 925', 925" ‧ ‧ second blackening layer

步驟S121~S129‧‧‧電極結構製程Step S121~S129‧‧‧Electrode structure process

圖1顯示習知技術觸控顯示裝置的剖面結構示意圖;圖2顯示習知技術之觸控面板中導電電極與基板的疊構剖面示意圖;圖3顯示本發明基本電極結構實施例示意圖之一;圖4顯示本發明基本電極結構實施例示意圖之二;圖5顯示本發明電極結構之另一實施例示意圖;圖6A顯示本發明基板表面結構的實施例示意圖之一;圖6B顯示本發明基板表面結構的實施例示意圖之二;圖7A顯示本發明電極結構與基板結合的實施例示意圖之一;圖7B顯示本發明電極結構與基板結合的實施例示意圖之二;圖8顯示本發明觸控面板的實施例示意圖;圖9至圖11示意顯示本發明電極結構的實施例; 圖12顯示之流程描述製作電極結構的步驟。1 is a schematic cross-sectional view showing a conventional touch display device; FIG. 2 is a schematic cross-sectional view showing a conductive electrode and a substrate in a touch panel of the prior art; FIG. 3 is a schematic view showing an embodiment of a basic electrode structure of the present invention; 4 is a schematic view showing a second embodiment of the electrode structure of the present invention; FIG. 5 is a schematic view showing another embodiment of the electrode structure of the present invention; FIG. 6A is a view showing an embodiment of the surface structure of the substrate of the present invention; FIG. 7A is a schematic view showing an embodiment of an electrode structure of the present invention combined with a substrate; FIG. 7B is a second schematic view showing an embodiment of the electrode structure of the present invention and a substrate; FIG. 8 is a view showing the touch panel of the present invention; Schematic diagram of an embodiment; FIGS. 9 to 11 schematically show an embodiment of an electrode structure of the present invention; The flow shown in Figure 12 describes the steps in making the electrode structure.

本發明揭露書提出一種觸控面板裝置、電極結構與製程,其中觸控面板上採用了金屬製或金屬基的電極結構或是導線,電極結構中為了消除金屬反光,其中金屬材料上透過表面處理,形成一抗蝕黑化層,同時可以避免習知技術中為了防反光的結構增厚的問題,也可以避免一般黑化處理導致導電率降低的問題,藉此提出不影響透光性與金屬導電率的具有防反光金屬電極導線的觸控面板結構。The invention discloses a touch panel device, an electrode structure and a process. The touch panel adopts a metal or metal-based electrode structure or a wire, and in the electrode structure, in order to eliminate metal reflection, the metal material is permeated through the surface. Forming a resist blackening layer, and avoiding the problem of thickening of the structure for preventing reflection in the prior art, and avoiding the problem of lowering the conductivity due to the general blackening treatment, thereby proposing that the light transmittance and the metal are not affected. Conductive touch panel structure with anti-reflective metal electrode wires.

應用於本發明所揭示的觸控面板裝置中,實施例主要結構包括有透明基板與基板上的金屬電極或導線,可應用於一般觸控面板或是可撓式的觸控面板上。其中導電金屬表面形成有削光粗化結構,或以蝕刻等加工方式形成,或以其他材料電解、濺鍍或沈積方式形成。另可再形成有黑化層,除了藉此降低反射光能量外,更有光學匹配與結構強化的功能。In the touch panel device disclosed in the present invention, the main structure of the embodiment includes a transparent substrate and a metal electrode or a wire on the substrate, which can be applied to a general touch panel or a flexible touch panel. The conductive metal surface is formed with a shaved and roughened structure, or formed by etching or the like, or formed by electrolysis, sputtering or deposition of other materials. In addition, a blackening layer can be formed, in addition to reducing the reflected light energy, and having the functions of optical matching and structural strengthening.

根據揭露書所載裝置之實施例,導電金屬或是基板表面形成的削光粗化結構為一薄層,該層厚度可介於1nm~10μm,更佳為介於50nm~2μm。而形成於導電金屬表面上的黑化層為達降低反射光能量的目的,黑化層的特性在以L(亮度)、a(紅綠)與b(黃藍)組成的色度座標值中範圍分別為L<50;a<-0.1;以及b<-0.1。According to an embodiment of the device disclosed in the disclosure, the conductive metal or the surface of the substrate is a thin layer, and the thickness of the layer may be between 1 nm and 10 μm, more preferably between 50 nm and 2 μm. The blackening layer formed on the surface of the conductive metal serves the purpose of reducing the energy of the reflected light, and the characteristics of the blackening layer are in the chromaticity coordinate values composed of L (brightness), a (red green) and b (yellow blue). The ranges are L<50; a<-0.1; and b<-0.1.

第一實施例:First embodiment:

圖3顯示本發明基本電極結構實施例示意圖。圖中顯示在基板30上形成有一電極結構32,此電極結構32的基本結構包括有作為導電介質的金屬導電層301、削光粗化層302與黑化層303。其中結構特徵與製作可再參閱圖4的描述。Fig. 3 is a view showing an embodiment of a basic electrode structure of the present invention. The figure shows that an electrode structure 32 is formed on the substrate 30. The basic structure of the electrode structure 32 includes a metal conductive layer 301 as a conductive medium, a thinned roughened layer 302 and a blackened layer 303. The structural features and fabrication can be referred to the description of FIG. 4 again.

此例中,電極結構32可直接形成於基板30上,包括上表面或是下表面,其中主要結構有金屬導電層301,金屬導電層301 為電極結構32中的主要導電結構,可以電解(electrolysis)、濺鍍(sputtering)或印刷(printing)等方式形成於特定結構之上。In this example, the electrode structure 32 can be directly formed on the substrate 30, including an upper surface or a lower surface, wherein the main structure is a metal conductive layer 301, and the metal conductive layer 301 The main conductive structure in the electrode structure 32 can be formed on a specific structure by electrolysis, sputtering, or printing.

以金屬作為導電結構的方式,因為金屬容易反射外部光線,若應用於顯示裝置中,可能視覺上會被影響,於是本發明在此電極結構中加入一個粗化的手段,粗化的方式有多種,其一如此實施例所載,金屬導電層301表面上形成一削光粗化層302,產生的方式有多種,比如可在金屬導電層301上經過表面處理產生,或可直接於金屬導電層301另外形成一個具有表面結構的粗糙結構層。這些表面結構可以將自金屬導電層301反射形成的反光散射掉。The way metal is used as the conductive structure, because the metal easily reflects external light, if it is applied to a display device, it may be visually affected, so the present invention adds a roughening means to the electrode structure, and there are various ways of roughening. As shown in this embodiment, a thinned roughened layer 302 is formed on the surface of the metal conductive layer 301, and can be produced in various manners, for example, by surface treatment on the metal conductive layer 301, or directly on the metal conductive layer. 301 additionally forms a rough structural layer having a surface structure. These surface structures can scatter the light reflected from the metal conductive layer 301.

此實施例中,接著於金屬導電層301與削光粗化層302上形成黑化層303,黑化層303設於電極結構32中,比如在金屬導電層301的上方,其用途在於吸收外部射向此電極結構32的光線,特別是可以減少與螢幕之色偏,亦可作為加強結構、防蝕等保護結構。In this embodiment, a blackening layer 303 is formed on the metal conductive layer 301 and the shaved roughening layer 302. The blackening layer 303 is disposed in the electrode structure 32, such as above the metal conductive layer 301, and its purpose is to absorb the external portion. The light that is incident on the electrode structure 32 can, in particular, reduce the color shift from the screen, and can also serve as a protective structure such as a reinforcing structure or an anti-corrosion.

第二實施例:Second embodiment:

本揭露書提出的觸控面板的基本電極結構示意圖可參閱圖4,製程步驟可以同時參考圖12所示的流程。The basic electrode structure diagram of the touch panel proposed in the present disclosure can be referred to FIG. 4, and the process steps can refer to the flow shown in FIG. 12 at the same time.

先備置有基板40(圖12,S121),在基板40上以金屬為主要材料形成電極結構42,此例以一個電極結構為例,實際實施上可以根據需求設計為多個陣列形式排列的電極結構。基板40包括玻璃基板或是適用於可撓式觸控面板的塑膠基板,其中塑膠基板的材料可為PET(Polyethylene terephthalatem,聚對苯二甲酸乙二酯)、PEI(Polyetherimide,聚醚亞醯胺)、PPSU(Polyphenylensulfon,聚苯碸)、PI(Polyimide,聚酰亞胺)或其組合。The substrate 40 (FIG. 12, S121) is placed first, and the electrode structure 42 is formed on the substrate 40 by using metal as a main material. In this example, an electrode structure is taken as an example, and the electrode array can be designed as a plurality of arrays according to requirements. structure. The substrate 40 includes a glass substrate or a plastic substrate suitable for a flexible touch panel. The material of the plastic substrate may be PET (Polyethylene terephthalatem, polyethylene terephthalate), PEI (Polyetherimide, polyetherimide). ), PPSU (Polyphenylensulfon, polyphenylene), PI (Polyimide, polyimide) or a combination thereof.

電極結構42中包括有鄰近接觸基板40的接著層401,接著層401先形成於基板40的表面上(圖12,S123),電極結構42即透 過接著層401與基板40結合。此接著層401功能係用以提升接續的電極結構與基板40的接著性,有實施例可以透過額外的接著層來加強附著性;之後再於接著層401上形成金屬導電層402(圖12,S125),金屬導電層402為電極結構42中的主要導電結構,可以電解、濺鍍或印刷等方式形成於特定結構之上。金屬導電層402材料可為如銀、銅等導電金屬材料。The electrode structure 42 includes an adhesive layer 401 adjacent to the contact substrate 40, and then the layer 401 is first formed on the surface of the substrate 40 (FIG. 12, S123), and the electrode structure 42 is transparent. The via layer 401 is bonded to the substrate 40. The function of the adhesive layer 401 is to improve the adhesion of the succeeding electrode structure to the substrate 40. In some embodiments, the adhesion may be enhanced by an additional adhesive layer; then the metal conductive layer 402 is formed on the adhesive layer 401 (FIG. 12, S125), the metal conductive layer 402 is the main conductive structure in the electrode structure 42, and can be formed on a specific structure by electrolysis, sputtering or printing. The material of the metal conductive layer 402 may be a conductive metal material such as silver or copper.

在一實施例中,為了能夠降低與螢幕之色偏或者避免由金屬導電層402產生的反光現象,可以直接於金屬導電層402上以電解、濺鍍、沈積或塗佈方式形成黑化層404(圖12,S129),黑化層404除了減少與螢幕之色偏與防反光外,更可作為加強結構、防蝕等保護結構。In an embodiment, the blackening layer 404 may be formed directly on the metal conductive layer 402 by electrolysis, sputtering, deposition or coating in order to reduce the color shift from the screen or to avoid the phenomenon of reflection by the metal conductive layer 402. (Fig. 12, S129), the blackening layer 404 can be used as a protective structure such as a reinforcing structure or an anti-corrosion, in addition to reducing the color shift and anti-reflection with the screen.

在此實施例中,在金屬導電層402上形成黑化層404之前,可先在金屬導電層402表面上可形成一削光粗化層403(圖12,S127),此削光粗化層403為一種削光粗化結構,可為在金屬導電層402上經過表面處理(粗糙化)所形成的表面結構,比如用蝕刻、表面加工處理等;或可直接於金屬導電層402上再形成一個具有表面結構的粗糙結構層,比如透過電解、濺鍍或沈積等的方式。這些表面結構可以將自金屬導電層402反射形成的反光散射掉,或是能同時降低金屬導電層402與基板40兩者合成的反光。In this embodiment, before the blackening layer 404 is formed on the metal conductive layer 402, a thinned rough layer 403 may be formed on the surface of the metal conductive layer 402 (FIG. 12, S127). 403 is a thinned roughened structure, which may be a surface structure formed by surface treatment (roughening) on the metal conductive layer 402, such as etching, surface processing, etc.; or may be formed directly on the metal conductive layer 402. A layer of rough structure with a surface structure, such as by electrolysis, sputtering or deposition. These surface structures can scatter the light reflected from the metal conductive layer 402, or can simultaneously reduce the reflection of the metal conductive layer 402 and the substrate 40.

在削光粗化層403上可再形成一黑化層404,黑化層404接續形成於削光粗化層403之表面上,可以電解、濺鍍、沈積或塗佈形成於削光粗化層403之上,形成一粗糙的黑化層結構,因此非平面的連續結構形成於金屬導電層402上方而可用以漫射和吸收射向金屬導電層402的光線,可以抗金屬反光,同時又能增加電子穿隧的機率而不使導電率下降,更因為其鍵結強度硬度比金屬導體更好,具有抗蝕的保護層作用。由於黑化層404設於整個電極結構42外層,因此可以輔助定義金屬電極的外觀。A blackening layer 404 may be further formed on the shaved roughening layer 403. The blackening layer 404 is formed on the surface of the shaved roughening layer 403, and may be formed by electrolysis, sputtering, deposition or coating on the shaving and roughening. Above the layer 403, a rough blackening layer structure is formed, so that a non-planar continuous structure is formed over the metal conductive layer 402 to diffuse and absorb light incident on the metal conductive layer 402, which is resistant to metal reflection, and at the same time It can increase the probability of electron tunneling without lowering the conductivity, and because the bonding strength is better than that of the metal conductor, it has the protective layer of resist. Since the blackening layer 404 is provided on the entire outer layer of the electrode structure 42, it is possible to assist in defining the appearance of the metal electrode.

更者,在一實施例中,電極結構42接觸上方的其他結構,比 如透過光學膠(optically clear adhesive,OCA)結合其他結構形成觸控顯示裝置,包括上方的膜體、基板,下方的膜體、顯示模組等,當光學膠與此例的電極結構42最上層的黑化層404結合時,黑化層的特性可以因光學膠而加強其黑化和對比的程度,降低粗糙表面的白霧干擾,使得使用者在觀看此觸控顯示裝置時較為舒適。Moreover, in an embodiment, the electrode structure 42 contacts other structures above, For example, the touch display device is formed by an optically clear adhesive (OCA) combined with other structures, including the upper film body, the substrate, the lower film body, the display module, etc., when the optical glue and the electrode structure 42 of this example are the uppermost layer. When the blackening layer 404 is combined, the characteristics of the blackening layer can be enhanced by the optical glue to reduce the degree of blackening and contrast, and the white fog interference of the rough surface is reduced, so that the user is more comfortable when viewing the touch display device.

第三實施例:Third embodiment:

另一實施例可參閱圖5所示之電極結構示意圖,其中電極結構52形成於基板50之上,基板50如塑膠、玻璃等透明材料所備置,電極結構52主要結構包括銜接基板50與電極結構52之間的第一接著層501,第一接著層501可提升電極結構52與基板50的接合性;接著再於第一接著層501之表面形成另一接著層,如第二接著層502,此第二接著層502可更提升接續的金屬導電層結構與基板50、第一接著層501的附著性。For another embodiment, reference may be made to the schematic diagram of the electrode structure shown in FIG. 5, wherein the electrode structure 52 is formed on the substrate 50. The substrate 50 is provided with a transparent material such as plastic or glass. The main structure of the electrode structure 52 includes the connection substrate 50 and the electrode structure. a first adhesive layer 501 between 52, the first adhesive layer 501 can enhance the adhesion of the electrode structure 52 to the substrate 50; then another surface layer, such as the second adhesive layer 502, is formed on the surface of the first adhesive layer 501. The second adhesive layer 502 can further improve the adhesion of the continuous metal conductive layer structure to the substrate 50 and the first adhesive layer 501.

在第二接著層502上繼續形成金屬導電層503,此為電極結構中的導電層,材料可為銀、銅等,但實際實施不限於特定材料。此例中,金屬導電層503表面可以加工的方式直接將金屬表面進行蝕刻,形成具有表面結構的削光粗化層504;或以電解、濺鍍或沈積方式額外形成一個具有表面結構的削光粗化層504。削光粗化層504可因表面結構讓進入的光線散射出去,不至於產生一致的反光現象。The metal conductive layer 503 is further formed on the second adhesive layer 502, which is a conductive layer in the electrode structure, and the material may be silver, copper, or the like, but the actual implementation is not limited to a specific material. In this example, the surface of the metal conductive layer 503 can be directly etched to form a thinned roughened layer 504 having a surface structure; or an additional surface shading is formed by electrolysis, sputtering or deposition. The layer 504 is roughened. The thinned roughened layer 504 can scatter the incoming light due to the surface structure without causing a consistent reflection.

由於前述金屬導電層503本身的金屬材料容易將入射的光線反射出去,也容易被氧化而造成導電率下降的問題。因此,接著削光粗化層504上可形成具有抗蝕能力的第一黑化層505,此第一黑化層505主體為黑色或深色,可以有效降低金屬反光與減少和螢幕的色偏,又因第一黑化層為金屬基材料,可保持電極結構52的導電性,又因有比金屬導電層503或其他結構更好的抗蝕性,因此可以成為包覆結構,作為一個電極結構外型定義輔助層。Since the metal material of the metal conductive layer 503 itself easily reflects the incident light, it is also easily oxidized to cause a problem of a decrease in electrical conductivity. Therefore, the first blackening layer 505 having the resisting ability can be formed on the thinned roughening layer 504. The first blackening layer 505 is black or dark, which can effectively reduce metal reflection and reduction and color shift of the screen. Moreover, since the first blackening layer is a metal-based material, the conductivity of the electrode structure 52 can be maintained, and since it has better corrosion resistance than the metal conductive layer 503 or other structures, it can be used as a cladding structure as an electrode. The structural shape defines the auxiliary layer.

除上述各層結構外,第一黑化層505上又可以疊構形式形成另一黑化層,如圖中顯示的第二黑化層506,同樣具有抗蝕能力、維持導電率等好處,更可提升黑色色度,因粗糙結構亦可加強降低反射率(抗反光)。In addition to the above-mentioned layers, the first blackening layer 505 can form another blackening layer in a stacked form. The second blackening layer 506 shown in the figure also has the advantages of resisting ability, maintaining conductivity, and the like. It can improve the black chromaticity, and the roughness can also be enhanced to reduce the reflectance (anti-reflective).

上述結構中,透過接著層、削光粗化結構、黑化層等結構的光學匹配,可以形成低反光或無反光的電極結構,使得人眼可以不受環境背光的影響,舒適地觀看相關顯示裝置的顯示內容。In the above structure, the optical structure of the structure such as the adhesion layer, the shaved roughening structure, and the blackening layer can be formed to form a low-reflective or non-reflective electrode structure, so that the human eye can be comfortably viewed without being affected by the environmental backlight. The display content of the device.

前述形成於電極結構上的黑化層可防止金屬反光與減少和螢幕的色偏,削光粗化結構則可以降低內部與外部反光,而基板的上下表面上亦可如圖6所示之實施例形成有表面的削光粗化結構,增加整體結構的反光問題,應用在觸控面板上,可以增加視覺上舒適度。The blackening layer formed on the electrode structure can prevent metal reflection and reduction and color shift of the screen, and the thinned structure can reduce internal and external reflection, and the upper and lower surfaces of the substrate can also be implemented as shown in FIG. For example, a surface roughening structure is formed, which increases the reflection problem of the overall structure, and is applied to the touch panel to increase visual comfort.

第四實施例:Fourth embodiment:

削光粗化結構亦可形成於基板之上,如圖6A所示,此例係直接在基板60上利用表面處理形成削光粗化結構601,602,製程如蝕刻或是表面加工。更細節來說,削光粗化結構601,602可利用化學蝕刻(硫酸、高錳酸等)、機械物理或電漿清潔(如滾軋、離子束、電暈、大氣電漿)等方式形成,此例的削光粗化結構601,602材質與基板材質相同。The thinned and roughened structure may also be formed on the substrate, as shown in FIG. 6A. In this example, the thinned roughened structure 601, 602 is formed directly on the substrate 60 by surface treatment, such as etching or surface processing. In more detail, the thinned roughened structure 601, 602 can be formed by chemical etching (sulfuric acid, permanganic acid, etc.), mechanical physics or plasma cleaning (such as rolling, ion beam, corona, atmospheric plasma). For example, the shaved and roughened structure 601, 602 has the same material as the substrate.

當此基板60表面上形成電極結構,此處形成的削光粗化結構使得入射光線不會一致地朝向一個方向反射,將輔助降低反光的效果,更是降低直接由基板60表面反射的光。When an electrode structure is formed on the surface of the substrate 60, the thinned roughened structure formed here causes the incident light to not be uniformly reflected in one direction, which will help reduce the effect of reflection, and further reduce the light directly reflected by the surface of the substrate 60.

如圖6B顯示為在基板60’上形成降低反光的表面結構示意圖,此例示意顯示在基板60’的上表面形成有第一削光粗化層601’,削光粗化結構的目的為降低整體基板60’表面可能形成的反光,此例之削光粗化層601’,602’可為增加材料形成,比如電解、濺鍍、塗佈、壓印或沈積等的方式形成削光粗化結構。6B is a schematic view showing a surface structure for reducing reflection on the substrate 60'. This example schematically shows that a first thinned roughened layer 601' is formed on the upper surface of the substrate 60'. The purpose of the thinned roughened structure is to reduce The reflective surface may be formed on the surface of the integral substrate 60'. The thinned roughened layer 601', 602' of this example may be formed by adding material such as electrolysis, sputtering, coating, stamping or deposition. structure.

此例於基板60’的下表面也可以形成有第二削光粗化層 602’,形成的方式如上述第一削光粗化層601’的形成方式。形成於基板60’上下表面的第一削光粗化層601’與第二削光粗化層602’的配合下,可以有效降低自外部光線射入結構的反光,以及由內部(如背光模組)射出產生影響視覺的光線。由螢幕背光通過彩色濾光片(color filter)的黑色陣列(black matrix)與金屬電極排列容易產生的疊紋(morie)干涉現象,也可以因為第二削光粗化層的作用,破壞因黑色陣列所產生的規律性背光,而減少疊紋問題。在基板設立削光粗化結構可具有有效降低元件厚度、減少金屬反光與疊紋干涉現象等新穎與進步性。In this example, a second thinned rough layer may be formed on the lower surface of the substrate 60'. 602' is formed in such a manner as to form the first thinned roughened layer 601'. The first thinned roughened layer 601' formed on the upper and lower surfaces of the substrate 60' and the second thinned roughened layer 602' can effectively reduce the reflection from the external light incident structure and the interior (such as the backlight mode). Group) Shooting produces light that affects the vision. The black matrix that passes through the color filter of the screen backlight and the morie interference phenomenon easily generated by the arrangement of the metal electrodes can also be destroyed by the action of the second thinned rough layer. The regular backlight produced by the array reduces the problem of moiré. The establishment of the shaved and roughened structure on the substrate can have novel and progressive effects such as effectively reducing the thickness of the element and reducing the phenomenon of metal reflection and rubbing interference.

光線射入的態樣可參考習知技術圖2,根據入射光線被基板表面反射的方式來看,本例的基板60’的第二削光粗化層602’因為可能銜接了另一設於下表面上的電極結構(並未顯示於圖6A,6B),當光線射向下表面的電極結構時,基板表面的削光粗化結構可以有效降低電極結構的金屬反光,因此下表面上的第二粗化層602’的設置更可有效降低反光。For the light incident, reference may be made to the prior art FIG. 2. According to the manner in which the incident light is reflected by the surface of the substrate, the second thinned rough layer 602' of the substrate 60' of this example may be connected to another The electrode structure on the lower surface (not shown in Figs. 6A, 6B), when the light is directed to the electrode structure on the lower surface, the shaved roughened structure on the surface of the substrate can effectively reduce the metal reflection of the electrode structure, thus the lower surface The setting of the second roughening layer 602' is more effective in reducing reflection.

形成此例的第一削光粗化層601’與第二削光粗化層602’的方式如利用額外塗佈紫外光膠或是有機-無機矽樹酯硬化層等材料實現,此方式產生的削光粗化層材質與基板材質不同。The manner of forming the first thinned roughened layer 601' and the second thinned roughened layer 602' of this example is achieved by using an additional coating of ultraviolet glue or an organic-inorganic eucalyptus hardened layer. The material of the shaved rough layer is different from the material of the substrate.

圖6A顯示的實施例中的削光粗化結構601,602以及本例的第一削光粗化層601’與第二削光粗化層602’的粗糙度(Ra,中心線平均粗糙度)範圍為0.001-0.2um為佳,最佳的粗糙度範圍為Ra=0.02-0.1um。The roughness (Ra, center line average roughness) range of the thinned roughened structure 601, 602 and the first thinned roughened layer 601' and the second thinned roughened layer 602' of the embodiment shown in FIG. 6A are shown in FIG. 6A. It is preferably from 0.001 to 0.2 um, and the optimum roughness range is Ra = 0.02 - 0.1 um.

第五實施例:Fifth embodiment:

圖7A接著顯示在具有表面削光粗化結構的基板70上形成電極結構72的實施例示意圖。FIG. 7A then shows a schematic diagram of an embodiment of forming an electrode structure 72 on a substrate 70 having a surface shaved roughened structure.

電極結構72係以一疊構形式形成於基板70表面上,電極結構72的主要結構包括有與基板70銜接的第一接著層721,與基板70接觸的表面可以形成如圖6顯示的削光粗化結構,即此例的削 光粗化層701。The electrode structure 72 is formed on the surface of the substrate 70 in a stack. The main structure of the electrode structure 72 includes a first adhesive layer 721 that is coupled to the substrate 70. The surface in contact with the substrate 70 can be formed as a shading as shown in FIG. Roughening structure, ie the cutting of this example Light roughening layer 701.

第一接著層721上可再形成另一接著層,如圖示的第二接著層722,補強接著形成的金屬導電層723,金屬導電層723形成的方式可以參考以上各實施例,為了降低或是避免金屬導電層723產生的反光,實施例更在金屬導電層723上形成另一在電極結構72內的削光粗化層724,以及接著形成可具有抗蝕能力與黑化效果的第一黑化層725,為了減少與螢幕產生色偏的效果,亦可在第一黑化層725上形成另一黑化層,如圖示的第二黑化層726,具有加強抗蝕與黑化效果的功能。A further adhesive layer may be further formed on the first adhesive layer 721, such as the second adhesive layer 722 as illustrated, and the metal conductive layer 723 formed by the reinforcement is formed. The manner in which the metal conductive layer 723 is formed may be referred to the above embodiments, in order to reduce or In order to avoid the reflection of the metal conductive layer 723, the embodiment further forms another thinned roughening layer 724 in the electrode structure 72 on the metal conductive layer 723, and then forms a first one capable of resisting and blackening. The blackening layer 725 may also form another blackening layer on the first blackening layer 725, such as the illustrated second blackening layer 726, to enhance the resist and blackening in order to reduce the effect of color shift with the screen. The function of the effect.

在此實施例的疊構結構中,因為對外表面形成有削光粗化或是黑化的結構,因此具有降低或是避免基板70或是金屬導電層723反光的效果,同時減少和螢幕的色偏。In the stacked structure of this embodiment, since the outer surface is formed with a structure of shading or blackening, the effect of reducing or avoiding the reflection of the substrate 70 or the metal conductive layer 723 is reduced, and the color of the screen is reduced. Partial.

第六實施例:Sixth embodiment:

圖7B顯示在製程中可將削光粗化結構(如圖7A,724)直接在最後一道加工,可以同時實現於基板與電極上。當執行最後一道加工時,實施例可利用額外塗佈紫外光膠或是有機-無機矽樹酯硬化層等材料實現此削光粗化結構,此方式產生的削光粗化層材質將與電極和基板材質不同。加工方式可以為比如電解、濺鍍、塗佈、壓印或沈積等的方式形成此削光粗化結構。Fig. 7B shows that the shaved roughened structure (Fig. 7A, 724) can be directly processed in the last process in the process, and can be realized on the substrate and the electrode at the same time. When performing the final processing, the embodiment may realize the thinning and roughening structure by using an additional coating of ultraviolet glue or an organic-inorganic eucalyptus hardened layer. The method of producing the roughened rough layer material and the electrode Different from the substrate material. The processing method may form the thinned roughened structure in a manner such as electrolysis, sputtering, coating, stamping or deposition.

如圖7B所示,在基板70’上形成的電極結構72’中並未如圖7A所示在金屬導電層723上形成的削光粗化層724,而原本基板70’上也可不用先形成削光粗化層(如圖7A,701),而是直接在金屬導電層723上直接形成第一黑化層725’或可再加上第二黑化層726’,之後再於最後一道加工製程中,同時一次性地在基板70’與電極結構72’上形成削光粗化結構727。As shown in FIG. 7B, the thinned layer 724 formed on the metal conductive layer 723 is not formed in the electrode structure 72' formed on the substrate 70', but the original substrate 70' may not be used first. Forming a thinned roughened layer (as shown in FIG. 7A, 701), but directly forming a first blackening layer 725' or a second blackening layer 726' directly on the metal conductive layer 723, and then finally In the processing process, the thinned roughened structure 727 is formed on the substrate 70' and the electrode structure 72' at the same time.

上述各實施例中,以圖7A或圖7B為例,第一接著層721與/或第二接著層722可以是高分子、氧化物或金屬材料,或是其中材料的組合。詳細地說,第一接著層721中內含的高分子材料有 助於提升第一接著層721與基板70的附著性。第一接著層721與/或第二接著層722中內含的氧化物材料具有使接著層擁有抗反射、抗干涉、抗彩虹紋、抗磨耗、耐刮的特性。若第一接著層721中內含的金屬材料,則可以提升第一接著層721與第二接著層722之附著性之功效。In the above embodiments, taking FIG. 7A or FIG. 7B as an example, the first adhesive layer 721 and/or the second adhesive layer 722 may be a polymer, an oxide or a metal material, or a combination thereof. In detail, the polymer material contained in the first adhesive layer 721 is It helps to improve the adhesion of the first adhesive layer 721 to the substrate 70. The oxide material contained in the first adhesive layer 721 and/or the second adhesive layer 722 has such characteristics that the adhesive layer has anti-reflection, anti-interference, anti-rainbow, anti-wear, and scratch resistance. If the metal material contained in the first adhesive layer 721 is used, the adhesion between the first adhesive layer 721 and the second adhesive layer 722 can be improved.

疊構中各層的製作材料中,高分子材料包含acrylic、PET、PEI、PPSU、PI、PEDOT、Polyaniline、Polypyrrole或是其中的複合材料組合。氧化物可為非晶或多晶的氧化物薄膜或是粉末結構。其中,氧化物的組成可為氧化鈦(titanium oxide)、氧化鉭(tantalum oxide)、氧化矽(silicon oxide)、氧化鋁(aluminum oxide)或是其中的複合材料組合。金屬可包含銅、銀、鋁、鉬、鎳、鉻、鎢、鈦、矽、鋅、錫、鐵和其他合金或是其中的複合材料組合。亦可以得到是高分子、金屬與氧化物兩種或是三種組合,如:金屬與氧化物的結合、高分子與金屬的結合、高分子與氧化物的組合或是金屬與氧化物與高分子的組合的複合材料。如果使用複合材料,高分子所佔的比例為10-90%,氧化物所佔的比例為10-90%,金屬所佔的比例為10-90%。氧化物也可以是多層的結構。Among the materials of the layers in the stack, the polymer material comprises acrylic, PET, PEI, PPSU, PI, PEDOT, Polyaniline, Polypyrrole or a combination thereof. The oxide may be an amorphous or polycrystalline oxide film or a powder structure. The composition of the oxide may be titanium oxide, tantalum oxide, silicon oxide, aluminum oxide or a combination thereof. The metal may comprise copper, silver, aluminum, molybdenum, nickel, chromium, tungsten, titanium, niobium, zinc, tin, iron, and other alloys or combinations thereof. It can also be obtained by polymer or metal or oxide combination, such as metal-oxide combination, polymer-metal combination, polymer-oxide combination or metal and oxide and polymer. The combination of composite materials. If a composite material is used, the proportion of the polymer is 10-90%, the proportion of the oxide is 10-90%, and the proportion of the metal is 10-90%. The oxide may also be a multilayer structure.

根據一實施例,前述氧化鈦的厚度可為900nm左右,而氧化矽的厚度可為100nm左右。第一接著層721與/或第二接著層722的厚度以0.001um與1um之間的範圍為佳;第一接著層與/或第二接著層722的721反射率需介於1%到50%的範圍,較佳為低於30%。此外,第一接著層721與/或第二接著層722亦可藉由加工方式,形成粗化,達到反射光消除的效果。形成第一接著層721與/或第二接著層722的方式如:(1)增加第一接著層濺鍍的能量,使接著層的材料轟入基材;(2)添加有色高分子如聚苯胺於接著層;或(3)將接著層材料蝕刻成多孔結構等。According to an embodiment, the titanium oxide may have a thickness of about 900 nm, and the cerium oxide may have a thickness of about 100 nm. The thickness of the first adhesive layer 721 and/or the second adhesive layer 722 is preferably in a range between 0.001 um and 1 um; the 721 reflectance of the first adhesive layer and/or the second adhesive layer 722 is required to be between 1% and 50. The range of % is preferably less than 30%. In addition, the first adhesive layer 721 and/or the second adhesive layer 722 can also be roughened by processing to achieve the effect of eliminating reflected light. The manner of forming the first adhesive layer 721 and/or the second adhesive layer 722 is as follows: (1) increasing the energy of the first bonding layer sputtering, causing the material of the bonding layer to blast into the substrate; (2) adding a colored polymer such as poly The aniline is in the adhesive layer; or (3) the adhesive layer material is etched into a porous structure or the like.

金屬導電層723材料可為銅、金、銀、鋁、鎢、鐵、鎳、鉻、鈦、鉬、銦、錫或是其中的複合材料組合,而厚度則以0.001um 至5um之範圍為佳。The metal conductive layer 723 material may be copper, gold, silver, aluminum, tungsten, iron, nickel, chromium, titanium, molybdenum, indium, tin or a composite material thereof, and the thickness is 0.001 um. The range to 5um is preferred.

為了增加電極結構72的接著性與導電性,如果金屬導電層723是純金屬,與其相鄰的第二接著層722則可包含此純金屬超過50%的含量,而第一接著層721則可包含純金屬低於50%之含量的漸層結構。舉例說明,導電層723如果是純銅,第一接著層721則可為鎳銅鉻鐵合金,其組成為鎳:銅:鉻:鐵=60:30:10:0或鎳:銅:鉻:鐵=80:10:5:5。第一接著層721則亦可為鎳鎢合金,其組成為鎳:鎢=50:50。該第一接著層721可額外添加矽與磷等。第二接著層722則可為銅鎳鉻合金,其組成為銅:鎳:鉻=60:30:10。或銅鎳鎢合金,其組成為銅:鎳:鎢=60:20:20;第二接著層722亦可額外添加矽與磷等。In order to increase the adhesion and conductivity of the electrode structure 72, if the metal conductive layer 723 is a pure metal, the second subsequent layer 722 adjacent thereto may contain more than 50% of the pure metal, and the first adhesive layer 721 may A gradation structure containing less than 50% pure metal. For example, if the conductive layer 723 is pure copper, the first adhesive layer 721 may be a nickel copper ferrochrome alloy, the composition of which is nickel: copper: chromium: iron = 60:30:10:0 or nickel: copper: chromium: iron = 80:10:5:5. The first adhesive layer 721 may also be a nickel-tungsten alloy having a composition of nickel: tungsten = 50:50. The first subsequent layer 721 may additionally be doped with phosphorus or the like. The second adhesive layer 722 can be a copper-nickel-chromium alloy having a composition of copper:nickel:chromium=60:30:10. Or copper-nickel-tungsten alloy, the composition of which is copper: nickel: tungsten = 60: 20: 20; the second subsequent layer 722 may additionally add bismuth and phosphorus.

設於電極結構72內的削光粗化層724為一種削光粗化結構,可利用物理機械式粗化(滾軋、電漿蝕刻)或化學蝕刻的方式,以破壞性的方式提高其表面粗糙度,因此其中材質與金屬導電層723為相同材質。The shaved roughening layer 724 disposed in the electrode structure 72 is a shaved and roughened structure, and the surface thereof can be improved in a destructive manner by means of physical mechanical roughening (rolling, plasma etching) or chemical etching. Roughness, so the material is the same material as the metal conductive layer 723.

根據削光粗化層(如圖7A,724)的結構設計,可額外延伸其結構,增加削光粗化層724而涵蓋於金屬導電層723上方,削光粗化層724的材料可以與金屬導電層723不同。如:(1)改變鍍膜條件,包含乾式鍍膜:濺鍍、蒸鍍等;或濕式鍍膜:電鍍、化鍍等,將削光粗化層724鍍製成不連續的島狀分佈而形成粗糙表面或是多孔結構;或是(2)先將削光粗化層724材料鍍製成平整的連續結構,利用物理機械式粗化(滾軋、電漿蝕刻)或化學蝕刻的方式,以破壞性的方式提高其表面粗糙度。利用增長的方式製作的削光粗化層724材料可以是為高分子、氧化物與金屬,可以與金屬導電層723相同;或是與第一黑化層725相同。According to the structural design of the thinned roughened layer (as shown in FIG. 7A, 724), the structure may be additionally extended, and the thinned roughened layer 724 may be added to cover the metal conductive layer 723. The material of the thinned roughened layer 724 may be combined with the metal. The conductive layer 723 is different. Such as: (1) changing the coating conditions, including dry coating: sputtering, evaporation, etc.; or wet coating: electroplating, plating, etc., the thinned rough layer 724 is plated into a discontinuous island-like distribution to form a rough Surface or porous structure; or (2) firstly plate the thinned rough layer 724 material into a flat continuous structure, using physical mechanical roughening (rolling, plasma etching) or chemical etching to destroy The way to improve its surface roughness. The material of the thinned roughened layer 724 produced by the growth method may be a polymer, an oxide and a metal, may be the same as the metal conductive layer 723, or may be the same as the first blackening layer 725.

削光粗化層724可影響電極結構72表面粗糙度,具有抗光反射與增加光致或熱致抗蝕劑附著於電極結構72表面的能力,無需額外在觸控面板上增設防炫光處理膜,因此可以降低成本,同時 不影響到細線路的蝕刻。削光粗化層724較佳的表面粗糙度範圍為Ra=0.001um~0.2um,最佳的粗糙度為Ra=0.02um~0.1um。反映出的光學霧度應小於2。The thinned roughened layer 724 can affect the surface roughness of the electrode structure 72, has anti-light reflection and increases the ability of the photoresist or the thermal resist to adhere to the surface of the electrode structure 72, and does not require additional anti-glare treatment on the touch panel. Membrane, so it can reduce costs while Does not affect the etching of fine lines. The surface roughness of the roughened layer 724 is preferably Ra = 0.001 um to 0.2 um, and the optimum roughness is Ra = 0.02 um to 0.1 um. The reflected optical haze should be less than 2.

前述第一與/或第二黑化層725/726材料可為銅、銀、鋁、鉬、鎳、鉻、鎢、鈦、矽、鋅、錫或鐵,或是其中的材料的組合。第一黑化層725與/或第二黑化層726的厚度以0.001um至1um之範圍為佳;第一黑化層725與/或第二黑化層726的反射率可介於1%到50%的範圍,較佳為低於30%。The first and/or second blackening layer 725/726 material may be copper, silver, aluminum, molybdenum, nickel, chromium, tungsten, titanium, tantalum, zinc, tin or iron, or a combination thereof. The thickness of the first blackening layer 725 and/or the second blackening layer 726 is preferably in the range of 0.001 um to 1 um; the reflectance of the first blackening layer 725 and/or the second blackening layer 726 may be 1%. Up to 50%, preferably less than 30%.

上述所提的第二黑化層726為形成的另一黑化層,可披覆於第一黑化層725,可以提升抗蝕與黑化的能力,使增加整體結構的環境適應性,並且協助第一黑化層725調整整體電極的顏色色度與光反射能力。第二黑化層726材料可為氧化物、高分子、碳與其之混合物。氧化物則可為氧化矽、氧化鈦、氧化鋁與其之混合物。其中高分子可為acrylic(丙烯酸)、alkylbenzimidazole(烷基苯)混合物、烷基苯化合物、PET或有色有機物:PEDOT、聚苯胺或其混合物。The second blackening layer 726 mentioned above is another blackening layer formed, which can be coated on the first blackening layer 725, can enhance the ability of resisting and blackening, and increase the environmental adaptability of the overall structure, and The first blackening layer 725 is assisted in adjusting the color chromaticity and light reflection ability of the overall electrode. The second blackening layer 726 material can be an oxide, a polymer, carbon, and a mixture thereof. The oxide may be cerium oxide, titanium oxide, aluminum oxide or a mixture thereof. The polymer may be acrylic (acrylic acid), alkylbenzimidazole (alkyl benzene) mixture, alkyl benzene compound, PET or colored organic matter: PEDOT, polyaniline or a mixture thereof.

其中,第二黑化層726的混合物中,高分子的比例可為10-90%,氧化物的比例可為10-90%。第二黑化層726厚度以0.001um至1um之範圍為佳;第二黑化層的726反射率需介於1%到50%的範圍,較佳為低於30%。此外,第一黑化層725與第二黑化層726所產生的總體反射率應低於30%較佳。例如:當此裝置應用於顯示器,當螢幕關閉背光時,其反射率低於30%,色度座標紅綠軸(a/-a axis)低於-2,黃藍軸(b/-b axis)低於-4。尤其是有搭載偏光片的螢幕,其色度更偏向藍綠色,該搭載偏光片的螢幕其b值約-7。Wherein, in the mixture of the second blackening layer 726, the proportion of the polymer may be 10-90%, and the ratio of the oxide may be 10-90%. The second blackening layer 726 preferably has a thickness in the range of 0.001 um to 1 um; the second blackening layer has a 726 reflectance in the range of 1% to 50%, preferably less than 30%. In addition, the overall reflectance produced by the first blackening layer 725 and the second blackening layer 726 should be less than 30%. For example, when the device is applied to a display, when the screen is turned off, the reflectance is lower than 30%, the chromaticity coordinate red-green axis (a/-a axis) is lower than -2, and the yellow-blue axis (b/-b axis) ) below -4. In particular, a screen equipped with a polarizer has a chromaticity that is more blue-green, and the screen on which the polarizer is mounted has a b value of about -7.

因此,第一黑化層725可同時調整金屬細線本身金屬色,使與其搭配之金屬細線路本身顏色(如純銅金屬母材反射率>50%,L>90%,a<0.1,b>2)接近螢幕黑色矩陣(Black matrix:BM)之 顏色,減少對比色差。因為b值若大於1或反射率大於50%,則人眼很容易觀察到偏黃色的金屬反光。第一與第二黑化層725/726材料本身的色度可因為材料厚度改變。第二黑化層726可調整所覆蓋的第一黑化層725的色度,使其更接近於螢幕的黑色矩陣的顏色,同時擁有抗色偏、抗反射、抗疊紋干涉、抗彩虹紋、抗磨耗、耐刮的特性。Therefore, the first blackening layer 725 can simultaneously adjust the metallic color of the metal thin wire to match the color of the metal thin wire itself (for example, the reflectivity of the pure copper metal base material is >50%, L>90%, a<0.1, b>2). ) close to the black matrix (Black matrix: BM) Color, reducing contrast chromatic aberration. If the b value is greater than 1 or the reflectance is greater than 50%, it is easy for the human eye to observe a yellowish metal reflection. The chromaticity of the first and second blackening layers 725/726 material itself may vary due to material thickness. The second blackening layer 726 can adjust the chromaticity of the covered first blackening layer 725 to be closer to the color of the black matrix of the screen, and has anti-color shift, anti-reflection, anti-aliasing interference, anti-rainbow pattern , anti-wear, scratch resistance.

然而,揭露書所載內容係在電極結構中提供一種形成粗化降低反射光的一特定實施例,本發明並未受限於揭露書所載的各種實施例中。However, the disclosure of the present invention provides a specific embodiment for forming a roughened, reduced reflected light in an electrode structure, and the present invention is not limited to the various embodiments set forth in the disclosure.

第七實施例:Seventh embodiment:

再一實施例如圖8所示,此例顯示本發明基板與電極結構應用在一個觸控面板內的實施例示意圖。Still another embodiment is shown in FIG. 8. This example shows a schematic diagram of an embodiment of the substrate and electrode structure of the present invention applied to a touch panel.

除於基板之一表面形成削光粗化結構的實施例之外,此例更顯示基板80的上下表面皆形成有削光粗化結構,如第一削光粗化層801與第二削光粗化層802,可以利用化學蝕刻(硫酸、高錳酸等)、機械物理或電漿清潔(如滾軋、離子束、電暈、大氣電漿)等方式形成。In addition to the embodiment in which the shaved roughened structure is formed on one surface of the substrate, this example further shows that the upper and lower surfaces of the substrate 80 are formed with a shaved roughened structure, such as the first shaved roughening layer 801 and the second shaved light. The roughened layer 802 can be formed by chemical etching (sulfuric acid, permanganic acid, etc.), mechanical physics or plasma cleaning (such as rolling, ion beam, corona, atmospheric plasma).

形成於基板80上表面第一削光粗化層801上方的第一電極結構82與形成於下方的第二電極結構84可為相同的結構,結構描述可參考圖7A或圖7B。第一電極結構82與第二電極結構84內具有可以抗色偏、抗反射、抗疊紋干涉、抗彩虹紋、抗磨耗、耐刮的結構,如接著層、黑化層、削光粗化結構等,實施例可參閱圖7A或圖7B的描述。基板80向外的表面上形成有抗基板80反光的第一削光粗化層801,第二削光粗化層802則是可以降低或避免由第二電極結構84所形成的金屬反光,因此在外部(如圖示之上方)觀看時,可以因為金屬反光大幅降低而改善視覺效果,增加人眼的舒適度,具有有效降低元件厚度與減少疊紋干涉現象的功用。The first electrode structure 82 formed on the upper surface of the substrate 80 on the first thinned roughening layer 801 and the second electrode structure 84 formed on the lower surface may have the same structure, and the structure description can be referred to FIG. 7A or FIG. 7B. The first electrode structure 82 and the second electrode structure 84 have structures capable of resisting color shift, anti-reflection, anti-aliasing interference, anti-rainbow, anti-wear, and scratch resistance, such as an adhesive layer, a blackening layer, and a shaving roughening. For the structure and the like, the embodiment can refer to the description of FIG. 7A or FIG. 7B. A first thinned roughened layer 801 that is reflective of the substrate 80 is formed on the outward surface of the substrate 80, and the second thinned roughened layer 802 is capable of reducing or avoiding metal reflection formed by the second electrode structure 84. When viewed from the outside (above the figure), the visual effect can be improved due to the greatly reduced metal reflection, which increases the comfort of the human eye, and has the function of effectively reducing the thickness of the component and reducing the phenomenon of the crease interference.

由基板80、電極結構82/84形成觸控面板裝置,此裝置與其他元件結合組合觸控顯示面板裝置時,如圖所示,可以光學膠811,812作為接著劑。舉例來說,基板80、電極結構82/84形成的觸控面板裝置以光學膠811與上方光學組件組合,如圖示的透明基板803與相關光學元件,再可以光學膠812與液晶顯示模組804(此例為下方)結合。若前述基材80與電極結構82/84之組合的表面上形成有削光粗化結構,當與其他組件結合時,填入光學膠811,812時,光學膠811,812可填補表面粗化結構的隙縫,可降低因為粗化所提升透光區的霧度,增加透光區的透光率。The touch panel device is formed by the substrate 80 and the electrode structures 82/84. When the device is combined with other components to form the touch display panel device, as shown in the figure, the optical adhesives 811, 812 can be used as an adhesive. For example, the touch panel device formed by the substrate 80 and the electrode structures 82/84 is combined with the upper optical component by the optical adhesive 811, such as the transparent substrate 803 and related optical components, and the optical adhesive 812 and the liquid crystal display module. 804 (this example is below) combined. If the surface of the combination of the substrate 80 and the electrode structure 82/84 is formed with a shaved roughened structure, when combined with other components, the optical adhesive 811, 812 can fill the gap of the surface roughening structure when the optical adhesive 811, 812 is filled. The haze of the light-transmitting region can be reduced due to the roughening, and the light transmittance of the light-transmitting region can be increased.

然而,貼上光學膠811,812後,形成於基板80表面的第一削光粗化層801與第二削光粗化層802的粗糙度可能因為光學膠811,812的關係而降低人眼於透光區的霧度(Haze)感。此外,因為光學膠811,812材質可與基板80接近,且折射率差異較小,當填補於觸控面板裝置上的粗糙面時,不僅可增加基板80透光區的透光度,亦可額外使抗蝕黑化層的顏色更偏於純黑或是與螢幕的黑色矩陣更類似的色度,降低因霧化產生的白霧效果,且不影響電極上削光粗化層效果,以有效遮蔽金屬網格,提升人眼舒適度。However, after the optical adhesives 811 and 812 are attached, the roughness of the first thinned roughening layer 801 and the second thinned roughened layer 802 formed on the surface of the substrate 80 may be lowered by the human eye in the light transmitting region due to the relationship of the optical adhesives 811 and 812. Haze feeling. In addition, since the optical adhesive 811, 812 material is close to the substrate 80 and the refractive index difference is small, when filling the rough surface on the touch panel device, not only the transmittance of the transparent region of the substrate 80 can be increased, but also the additional The color of the resist blackening layer is more pure black or a color similar to the black matrix of the screen, reducing the white mist effect caused by fogging, and does not affect the effect of the shaved layer on the electrode to effectively shield Metal mesh for improved eye comfort.

值得一提的是,本發明不同於一般在基板上鍍上折射率比較低的薄膜材料,也就是抗反射膜,可以提升基板穿透率的方式,根據本發明所採用的光學膠的應用中,當粗化了基板(如PET)表面時,覆蓋光學膠可以填補表面的粗化結構外,更可降低因為粗化提升霧度。舉例來說,光學膠與面板裝置之玻璃的折射率都可能低於PET,因此可提昇穿透率。上述各結構數據如,表面玻璃折射率:1.53;光學膠折射率:1.46-1.47,光學級PET折射率:1.62。It is worth mentioning that the present invention is different from the general application of a thin film material having a relatively low refractive index on a substrate, that is, an anti-reflection film, which can improve the transmittance of the substrate, and the application of the optical adhesive used in accordance with the present invention When the surface of the substrate (such as PET) is roughened, the covering optical glue can fill the roughened structure of the surface, and the haze can be reduced due to roughening. For example, the refractive index of the glass of the optical glue and the panel device may be lower than that of PET, thereby increasing the transmittance. The above structural data such as: surface glass refractive index: 1.53; optical adhesive refractive index: 1.46-1.47, optical grade PET refractive index: 1.62.

電極結構的實施態樣可以不受限於上述圖式中,以下各圖顯示不同的電極結構實施例,其中所載的接著層、金屬導電層、削光粗化層與黑化層的材料、製作方法與疊構關係如上述各實施例 所載,在此並不贅述。Embodiments of the electrode structure may not be limited to the above figures, and the following figures show different electrode structure embodiments in which the adhesive layer, the metal conductive layer, the thinned roughened layer and the blackened layer are contained, Manufacturing method and stacking relationship as in the above embodiments The contents are not described here.

在圖9所示之一實施例中,基板90表面上有降低反光的削光粗化結構,如所示的削光粗化層901,上方形成電極結構,實施例顯示電極結構主要元件可參見上述圖7A、圖7B與圖8,而實際實施也不限於上述結構,其中的金屬導電層923直接被侵蝕或加工形成削光粗化結構,形成削光粗化層,使得接續的結構也形成粗糙面,比如第一黑化層924與第二黑化層925都隨著金屬導電層923的削光粗化結構形成粗糙面。In one embodiment shown in FIG. 9, the surface of the substrate 90 has a shading-reducing roughening structure, as shown by the shaved roughening layer 901, and an electrode structure is formed thereon. The embodiment shows that the main components of the electrode structure can be seen. 7A, 7B and 8 above, the actual implementation is not limited to the above structure, in which the metal conductive layer 923 is directly eroded or processed to form a shaved roughened structure, forming a thinned roughened layer, so that the succeeding structure is also formed. The rough surface, such as the first blackening layer 924 and the second blackening layer 925, both form a rough surface with the thinned roughened structure of the metal conductive layer 923.

或如圖10所示的電極結構實施例,在基板90表面的削光粗化層901上形成的電極結構中,金屬導電層923’上形成的第一黑化層924’直接以蝕刻或加工而被粗化,形成具有粗糙表面的黑化層,也就是前述的削光粗化結構由黑化層經加工直接形成。其中,此第一黑化層924’係以電解、濺鍍、沈積或塗佈方法形成於金屬導電層923’上。此粗糙表面係於一黑化層924’之表面蝕刻或加工後形成,此具有粗糙表面的第一黑化層924’透過表面結構將自金屬導電層923’可將自金屬導電層923’反射形成的反光散射掉,更可進一步降低反光量。Or in the electrode structure embodiment shown in FIG. 10, in the electrode structure formed on the shaved roughening layer 901 on the surface of the substrate 90, the first blackening layer 924' formed on the metal conductive layer 923' is directly etched or processed. The roughened layer is formed to form a blackened layer having a rough surface, that is, the aforementioned shaved roughened structure is directly formed by processing the blackened layer. Here, the first blackening layer 924' is formed on the metal conductive layer 923' by electrolysis, sputtering, deposition or coating. The rough surface is formed after the surface of a blackening layer 924' is etched or processed. The first blackening layer 924' having a rough surface can be reflected from the metal conductive layer 923' through the surface structure. The formed reflection is scattered, which further reduces the amount of reflection.

接著,更可於具有粗糙表面的第一黑化層924’上形成另一黑化層,如所示的第二黑化層925’,同樣隨著第一黑化層924’的表面結構形成粗糙面。Next, another blackening layer, such as the second blackening layer 925' as shown, may be formed on the first blackening layer 924' having a rough surface, also formed along with the surface structure of the first blackening layer 924'. Rough surface.

再如圖11所示的實施例,電極結構中的金屬導電層923”上第一黑化層924”不變,而直接蝕刻或加工第二黑化層925”,使得其表面粗化形成粗糙面。此具有粗糙表面的第二黑化層925”接續形成於第一黑化層924”之表面上,透過表面結構將自金屬導電層923”反射形成的反光散射掉,並降低反光量。Further, as shown in the embodiment shown in FIG. 11, the first blackening layer 924" on the metal conductive layer 923" in the electrode structure is unchanged, and the second blackening layer 925" is directly etched or processed to roughen the surface. The second blackening layer 925 having a rough surface is successively formed on the surface of the first blackening layer 924", and reflects the reflection formed by the reflection of the metal conductive layer 923" through the surface structure, and reduces the amount of reflection.

在製造兩層黑化層的步驟中,第一黑化層924”係以電解、濺鍍、沈積或塗佈方法形成於金屬導電層923”之上;第二黑化層925”係以電解、濺鍍、沈積或塗佈方法形成於第一黑化層924” 之上,兩者有類似的製作方式。In the step of fabricating the two blackening layers, the first blackening layer 924" is formed on the metal conductive layer 923" by electrolysis, sputtering, deposition or coating; the second blackening layer 925" is electrolyzed. , sputtering, deposition or coating methods are formed on the first blackening layer 924" Above, the two have similar production methods.

在圖11所示的實施例中,電極結構中各元件材料與其組成可參閱以上各實施例所載,此例之第一或第二黑化層的材料組合、厚度、反射率要求亦可參閱以上各實施例所描述的內容。In the embodiment shown in FIG. 11, the material of each component in the electrode structure and its composition can be referred to the above embodiments. The material combination, thickness, and reflectance requirements of the first or second blackening layer in this example can also be referred to. What has been described in the above embodiments.

是以,本發明提出的觸控面板裝置,其中電極結構不同於習知的金屬網格觸控面板在銅層上方鍍製一層黑化層的降低金屬反光的處理,結構中利用疊構與材料設計,除了可以消除金屬與塑膠基板的反光問題,更可有效降低觸控面板的厚度,且不影響透光區的霧度;同時,不影響銅導電層的導電率,兼具有極佳的耐候性,可在高溫鹽浴的環境下展現極佳的壽命。Therefore, the touch panel device of the present invention has a structure different from that of the conventional metal grid touch panel in which a blackening layer is coated on the copper layer to reduce metal reflection, and the structure utilizes the structure and material. Design, in addition to eliminating the problem of reflective metal and plastic substrates, can effectively reduce the thickness of the touch panel, and does not affect the haze of the transparent region; at the same time, does not affect the conductivity of the copper conductive layer, and has excellent Weather resistance, excellent life in a high temperature salt bath environment.

以上所述僅為本創作之較佳可行實施例,凡依本創作申請專利範圍所做之均等變化與修飾,皆應屬本創作之涵蓋範圍。The above descriptions are only preferred embodiments of the present invention, and all changes and modifications made in accordance with the scope of the patent application of this creation should be covered by this creation.

30‧‧‧基板30‧‧‧Substrate

32‧‧‧電極結構32‧‧‧Electrode structure

301‧‧‧金屬導電層301‧‧‧Metal conductive layer

302‧‧‧削光粗化層302‧‧‧Doughening rough layer

303‧‧‧黑化層303‧‧‧Blackening layer

Claims (22)

一種電極結構,包括:一金屬導電層,為該電極結構之導電結構;一黑化層,用以吸收射向該電極結構的光線,以消除由該金屬導電層產生的反光,並減少與螢幕色偏;一削光粗化結構,形成於該電極結構中,包括形成於該金屬導電層之表面上或該黑化層的表面上,該削光粗化結構透過表面結構將進入該電極結構的光線,或自該金屬導電層反射形成的反光散射掉,且同時抗疊紋干擾。 An electrode structure comprising: a metal conductive layer as a conductive structure of the electrode structure; a blackening layer for absorbing light incident on the electrode structure to eliminate reflection caused by the metal conductive layer and reducing the screen a color-shearing structure formed in the electrode structure, comprising being formed on a surface of the metal conductive layer or on a surface of the blackening layer, the thinned roughened structure entering the electrode structure through the surface structure The light, or the reflection formed by the reflection of the metal conductive layer, scatters and at the same time resists the interference of the crease. 如請求項1所述的電極結構,其中當該削光粗化結構接續形成於該金屬導電層之表面上時,該削光粗化結構係於該金屬導電層之表面蝕刻或加工後形成,該削光粗化結構材質與該金屬導電層相同。 The electrode structure according to claim 1, wherein when the thinned roughening structure is successively formed on the surface of the metal conductive layer, the thinned roughened structure is formed after etching or processing the surface of the metal conductive layer. The material of the shaved roughened structure is the same as the metal conductive layer. 如請求項1所述的電極結構,其中當該削光粗化結構接續形成於該金屬導電層之表面上時,該削光粗化結構係為於該金屬導電層上形成一個具有表面結構的削光粗化層,該削光粗化結構材質與該金屬導電層不同。 The electrode structure according to claim 1, wherein when the shaved roughening structure is successively formed on a surface of the metal conductive layer, the shaved roughening structure forms a surface structure on the metal conductive layer. The thinned layer is cut, and the material of the roughened structure is different from the metal conductive layer. 如請求項1所述的電極結構,其中當該削光粗化結構形成於該黑化層的表面上時,該削光粗化結構係於該黑化層之表面蝕刻或加工後形成,該削光粗化結構材質與該黑化層相同。 The electrode structure according to claim 1, wherein when the shaved roughening structure is formed on a surface of the blackening layer, the shaved roughening structure is formed after etching or processing the surface of the blackening layer, The shaved roughened structure material is the same as the blackened layer. 如請求項1所述的電極結構,其中當該削光粗化結構形成於該黑化層的表面上時,該削光粗化結構係為於該黑化層上形成一個具有表面結構的削光粗化層,該削光粗化結構材質與該黑化層不同。 The electrode structure according to claim 1, wherein when the shaved roughening structure is formed on a surface of the blackening layer, the shaved roughening structure forms a surface having a surface structure on the blackening layer. The light roughening layer is different from the blackening layer. 如請求項5所述的電極結構,其中該黑化層之表面上更形成另一黑化層,以增加抗蝕、降低螢幕的色偏與提升黑化的能力。 The electrode structure of claim 5, wherein another blackening layer is formed on the surface of the blackening layer to increase the resist, reduce the color shift of the screen, and enhance the blackening ability. 如請求項1至6其中之一所述的電極結構,其中該黑化層係以電解、濺鍍、沈積或塗佈方法形成。 The electrode structure according to any one of claims 1 to 6, wherein the blackening layer is formed by electrolysis, sputtering, deposition or coating. 如請求項7所述的電極結構,其中該黑化層或該另一黑化層的隨著該削光粗化結構亦形成粗糙面。 The electrode structure according to claim 7, wherein the blackening layer or the other blackening layer also forms a rough surface along with the shaved roughening structure. 如請求項8所述的電極結構,其中該黑化層或該另一黑化層的材料為銅、銀、鋁、鉬、鎳、鉻、鎢、鈦、矽、鋅、錫或鐵,或是其中材料的組合;該黑化層或該另一黑化層的厚度範圍為0.001um至1um;該黑化層或該另一黑化層的反射率範圍介於1%到50%。 The electrode structure of claim 8, wherein the blackening layer or the material of the other blackening layer is copper, silver, aluminum, molybdenum, nickel, chromium, tungsten, titanium, tantalum, zinc, tin or iron, or It is a combination of materials therein; the blackening layer or the other blackening layer has a thickness ranging from 0.001 um to 1 um; and the blackening layer or the other blackening layer has a reflectance ranging from 1% to 50%. 如請求項1至6其中之一所述的電極結構,其中該電極結構係形成於一基板上。 The electrode structure of any one of claims 1 to 6, wherein the electrode structure is formed on a substrate. 如請求項10所述的電極結構,其中該基板之表面形成有削光粗化結構,該削光粗化結構係於該基板之表面蝕刻或加工後形成,該削光粗化結構材質與該基板相同。 The electrode structure of claim 10, wherein the surface of the substrate is formed with a shaved roughening structure formed by etching or processing the surface of the substrate, the shaved roughening structure material and the The substrates are the same. 如請求項10所述的電極結構,其中該削光粗化結構係為於該基板上形成一個具有表面結構的削光粗化層,該削光粗化結構材質與該基板不同。 The electrode structure according to claim 10, wherein the shaved roughening structure is formed on the substrate by a shaved roughening layer having a surface structure, the material of the shaved roughening structure being different from the substrate. 如請求項10所述的電極結構,更包括一接著層,該接著層形成於該金屬導電層與該基板之間,該電極結構透過該接著層與該基板結合,用以提升該電極結構與基板的接著性。 The electrode structure of claim 10, further comprising an adhesive layer formed between the metal conductive layer and the substrate, wherein the electrode structure is bonded to the substrate through the adhesive layer to enhance the electrode structure and The adhesion of the substrate. 如請求項13所述的電極結構,其中該接著層與該金屬導電層之間再形成一提升附著性的另一接著層。 The electrode structure of claim 13, wherein another adhesive layer is formed between the adhesive layer and the metal conductive layer. 如請求項14所述的電極結構,其中該接著層或該另一接著層為高分子、氧化物或金屬材料,或是其中材料的組合;該接著層或該另一接著層的厚度範圍為0.001um至1um;該接著層或該另一接著層的反射率範圍為1%到50%。 The electrode structure of claim 14, wherein the adhesive layer or the further adhesive layer is a polymer, an oxide or a metal material, or a combination thereof; the thickness of the adhesive layer or the further adhesive layer is 0.001 um to 1 um; the reflectivity of the adhesive layer or the further adhesive layer ranges from 1% to 50%. 一種面板裝置,包括:一基板,至少具有一表面;以及一或多個電極結構,形成於該表面上,其中該電極結構包括:一金屬導電層,為該電極結構之導電結構; 一黑化層,用以吸收射向該電極結構的光線,以消除由該金屬導電層產生的反光,並減少與螢幕色偏;一削光粗化結構,形成於該電極結構中,包括形成於該金屬導電層之表面上或該黑化層的表面上,該削光粗化結構透過表面結構將進入該電極結構的光線,或自該金屬導電層反射形成的反光散射掉。A panel device comprising: a substrate having at least one surface; and one or more electrode structures formed on the surface, wherein the electrode structure comprises: a metal conductive layer, the conductive structure of the electrode structure; a blackening layer for absorbing light incident on the electrode structure to eliminate reflection caused by the metal conductive layer and reducing color shift from the screen; a thinned roughened structure formed in the electrode structure, including formation On the surface of the metal conductive layer or on the surface of the blackening layer, the thinned roughened structure transmits light that enters the electrode structure through the surface structure or is reflected by reflection from the metal conductive layer. 如請求項16所述的面板裝置,其中該基板之表面形成有削光粗化結構。The panel device of claim 16, wherein the surface of the substrate is formed with a shaved roughened structure. 如請求項16所述的面板裝置,其中該基板與該一或多個電極結構之組合與該面板裝置內其他組件結合時,填入光學膠。The panel device of claim 16, wherein the optical glue is filled in combination with the one or more electrode structures in combination with other components in the panel device. 如請求項18所述的面板裝置,其中該光學膠用以填補該基板與該一或多個電極結構的表面的削光粗化結構的隙縫,以降低因為粗化所提升透光區的霧度,增加透光區的透光率。The panel device of claim 18, wherein the optical glue is used to fill a gap between the substrate and the thinned roughened structure of the surface of the one or more electrode structures to reduce fogging of the light-transmitting region due to roughening Degree, increase the light transmittance of the light transmission area. 一種面板裝置,包括:一基板,至少具有一表面;以及一或多個電極結構,形成於該表面上,其中該電極結構包括:一金屬導電層,為該電極結構之導電結構;一黑化層,用以吸收射向該電極結構的光線,以消除由該金屬導電層產生的反光,並減少與螢幕色偏;一削光粗化結構,同時形成於該一或多個電極結構與該基板之表面上,該削光粗化結構透過表面結構將進入該電極結構與該基板的光線反射形成的反光散射掉。A panel device comprising: a substrate having at least one surface; and one or more electrode structures formed on the surface, wherein the electrode structure comprises: a metal conductive layer, which is a conductive structure of the electrode structure; a layer for absorbing light incident on the electrode structure to eliminate reflection caused by the metal conductive layer and reducing color shift from the screen; a thinned roughened structure formed simultaneously on the one or more electrode structures On the surface of the substrate, the shaved roughened structure scatters the light reflected by the reflection of the light entering the electrode structure and the substrate through the surface structure. 如請求項20所述的面板裝置,其中該電極結構與該基板表面上的削光粗化結構係以塗佈紫外光膠或是有機-無機矽樹酯硬化層形成。The panel device of claim 20, wherein the electrode structure and the shaved roughening structure on the surface of the substrate are formed by coating an ultraviolet glue or an organic-inorganic eucalyptus hardened layer. 如請求項20所述的面板裝置,其中該電極結構與該基板表面上的削光粗化結構係以電解、濺鍍、塗佈、壓印或沈積的方式形成。The panel device of claim 20, wherein the electrode structure and the shaved roughening structure on the surface of the substrate are formed by electrolysis, sputtering, coating, stamping or deposition.
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