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TWI504681B - A hardening composition, a hardened product, and a hardening composition - Google Patents

A hardening composition, a hardened product, and a hardening composition Download PDF

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Publication number
TWI504681B
TWI504681B TW100107284A TW100107284A TWI504681B TW I504681 B TWI504681 B TW I504681B TW 100107284 A TW100107284 A TW 100107284A TW 100107284 A TW100107284 A TW 100107284A TW I504681 B TWI504681 B TW I504681B
Authority
TW
Taiwan
Prior art keywords
group
decane
curable composition
decane compound
formula
Prior art date
Application number
TW100107284A
Other languages
English (en)
Chinese (zh)
Other versions
TW201141952A (en
Inventor
樫尾幹廣
Original Assignee
琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 琳得科股份有限公司 filed Critical 琳得科股份有限公司
Publication of TW201141952A publication Critical patent/TW201141952A/zh
Application granted granted Critical
Publication of TWI504681B publication Critical patent/TWI504681B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/06—Triglycidylisocyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
TW100107284A 2010-03-08 2011-03-04 A hardening composition, a hardened product, and a hardening composition TWI504681B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010050621 2010-03-08

Publications (2)

Publication Number Publication Date
TW201141952A TW201141952A (en) 2011-12-01
TWI504681B true TWI504681B (zh) 2015-10-21

Family

ID=44563468

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100107284A TWI504681B (zh) 2010-03-08 2011-03-04 A hardening composition, a hardened product, and a hardening composition

Country Status (5)

Country Link
JP (1) JP5725479B2 (ja)
KR (1) KR101768246B1 (ja)
CN (1) CN102906198B (ja)
TW (1) TWI504681B (ja)
WO (1) WO2011111667A1 (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012073988A1 (ja) * 2010-11-30 2012-06-07 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
EP2796510A4 (en) * 2011-12-22 2015-08-05 Daicel Corp HARDENABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
WO2013141360A1 (ja) * 2012-03-23 2013-09-26 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
CN104781309B (zh) * 2012-10-30 2018-01-19 琳得科株式会社 固化性聚倍半硅氧烷化合物、其制造方法、固化性组合物、固化物、以及固化性组合物等的使用方法
JP6327472B2 (ja) * 2012-12-28 2018-05-23 三菱瓦斯化学株式会社 プリプレグ及びフィルム
EP2944675B1 (en) * 2013-01-09 2017-04-12 Daicel Corporation Curable resin composition, and cured product of same
WO2014125964A1 (ja) 2013-02-14 2014-08-21 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
CN104583326B (zh) * 2013-08-01 2016-03-02 株式会社大赛璐 固化性树脂组合物及使用其的半导体装置
CN104583325B (zh) * 2013-08-02 2016-11-09 株式会社大赛璐 固化性树脂组合物及使用其的半导体装置
JP5830201B2 (ja) * 2013-08-06 2015-12-09 株式会社ダイセル 硬化性樹脂組成物及びそれを用いた半導体装置
JP6247059B2 (ja) * 2013-09-05 2017-12-13 デクセリアルズ株式会社 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法
US9670326B2 (en) * 2013-09-20 2017-06-06 Lintec Corporation Curable composition, curing product, and method for using curable composition
US9540490B2 (en) * 2013-09-20 2017-01-10 Lintec Corporation Curable composition, curing product, and method for using curable composition
WO2015041344A1 (ja) * 2013-09-20 2015-03-26 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
WO2015041339A1 (ja) * 2013-09-20 2015-03-26 リンテック株式会社 硬化性組成物、硬化物および硬化性組成物の使用方法
EP3173445A4 (en) * 2014-07-23 2018-03-14 LINTEC Corporation Curable composition, method for manufacturing curable composition, cured product, method for using curable composition, and optical device
TWI660009B (zh) * 2014-08-26 2019-05-21 Lintec Corporation 硬化性組合物、硬化物、硬化性組合物之使用方法以及光裝置
TWI678387B (zh) * 2014-08-26 2019-12-01 日商琳得科股份有限公司 硬化性組合物、硬化性組合物之製造方法、硬化物、硬化性組合物之使用方法以及光裝置
TWI660008B (zh) 2014-08-26 2019-05-21 日商琳得科股份有限公司 硬化性組合物、硬化性組合物之製造方法、硬化物、硬化性組合物之使用方法以及光裝置
TWI696662B (zh) * 2014-08-26 2020-06-21 日商琳得科股份有限公司 硬化性組合物、硬化物、硬化性組合物之使用方法以及光裝置
TWI660010B (zh) * 2014-08-26 2019-05-21 Lintec Corporation 硬化性組合物、硬化物、硬化性組合物之使用方法以及光裝置
TWI690564B (zh) 2014-08-26 2020-04-11 日商琳得科股份有限公司 硬化性組合物、硬化性組合物之製造方法、硬化物、硬化性組合物之使用方法以及光裝置
CN109153690A (zh) 2016-05-03 2019-01-04 美国陶氏有机硅公司 倍半硅氧烷树脂和甲硅烷基酐组合物
TWI817317B (zh) * 2017-04-28 2023-10-01 南韓商Ｌｇ化學股份有限公司 封裝組成物
WO2019044817A1 (ja) * 2017-08-28 2019-03-07 住友ベークライト株式会社 ネガ型感光性樹脂組成物、半導体装置および電子機器
TWI739989B (zh) * 2018-01-19 2021-09-21 南韓商東友精細化工有限公司 感光性樹脂組成物、包括使用感光性樹脂組成物製造之黑色矩陣、柱間隔物或黑色柱間隔物的彩色濾光片、以及包括彩色濾光片的顯示裝置
WO2021060561A1 (ja) * 2019-09-27 2021-04-01 リンテック株式会社 硬化性組成物、硬化物、及び、硬化性組成物の使用方法

Citations (4)

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TW200920767A (en) * 2007-06-29 2009-05-16 Lintec Corp Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element
TW200946627A (en) * 2008-02-19 2009-11-16 Lintec Corp Adhesive mainly composed of polyorganosiloxane compound
TW200946566A (en) * 2008-02-14 2009-11-16 Lintec Corp Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device
TW201000523A (en) * 2008-03-26 2010-01-01 Lintec Corp Fixing material comprising silane compound polymer and photonic device sealed body

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JP5115099B2 (ja) * 2006-09-04 2013-01-09 東レ・ファインケミカル株式会社 アシロキシ基を有するシリコーン共重合体及びその製造方法
JP5050684B2 (ja) * 2006-10-13 2012-10-17 日立化成工業株式会社 感光性樹脂組成物、シリカ系被膜の形成方法、及びシリカ系被膜を備える装置及び部材
US7736837B2 (en) * 2007-02-20 2010-06-15 Az Electronic Materials Usa Corp. Antireflective coating composition based on silicon polymer
JP5075680B2 (ja) * 2007-03-28 2012-11-21 リンテック株式会社 光素子用封止材および光素子封止体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200920767A (en) * 2007-06-29 2009-05-16 Lintec Corp Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element
TW200946566A (en) * 2008-02-14 2009-11-16 Lintec Corp Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device
TW200946627A (en) * 2008-02-19 2009-11-16 Lintec Corp Adhesive mainly composed of polyorganosiloxane compound
TW201000523A (en) * 2008-03-26 2010-01-01 Lintec Corp Fixing material comprising silane compound polymer and photonic device sealed body

Also Published As

Publication number Publication date
CN102906198A (zh) 2013-01-30
WO2011111667A1 (ja) 2011-09-15
JPWO2011111667A1 (ja) 2013-06-27
KR20130034005A (ko) 2013-04-04
CN102906198B (zh) 2014-10-29
TW201141952A (en) 2011-12-01
KR101768246B1 (ko) 2017-08-14
JP5725479B2 (ja) 2015-05-27

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