TWI503589B - Image capturing module for increasing assembly flatness and decreasing focusing time and method of assembling the same - Google Patents

Description

Image capturing module and group thereof for increasing assembly flatness and reducing focusing time Loading method

The invention relates to an image capturing module and an assembling method thereof, in particular to an image capturing module for increasing assembly flatness and reducing focusing time and an assembling method thereof.

In recent years, the trend of handheld devices such as mobile phones and PDAs has become increasingly popular, and with the market demand for better handheld devices and smaller size, The group has faced the dual requirements of higher image quality and miniaturization. In view of the improvement of the image quality of the image capture module, on the one hand, the pixel is improved. The market trend is from the original VGA level of 30 pixels, which has progressed to the current two million pixels and three million pixels commonly used in the market. Even worse, it has introduced a higher level of more than eight million pixels. In addition to the improvement of pixels, on the other hand, the resolution of the image is taken care of. Therefore, the image capturing module of the handheld device is also developed by the fixed focus image capturing function toward the camera-like optical autofocus function or even the optical zoom function.

The optical autofocus function is operated according to different distances and close distances of the target object to appropriately move the lens in the image capturing module, so that the optical image of the image capturing object can be accurately focused on the image sensor. To produce a clear image. At present, it is common to activate the lens movement in the image capturing module, which includes stepping motor actuation, piezoelectric actuation, and voice coil motor (VCM) actuation. However, when the image sensor and the support in the conventional image capture module When the board is stacked on the board as the stacking reference plane, the mounting angle of the bracket relative to the image sensor is too large, so that the image quality captured by the conventional image capturing module cannot be effectively obtained. improve. In addition, the manual focusing of the conventional image capturing module relative to the image sensor takes a lot of time.

An embodiment of the present invention provides an image capturing module for assembling flatness and reducing focusing time, and an assembling method thereof, which can effectively solve the problem that the image sensor and the bracket in the conventional image capturing module are When the boards are stacked on the stacking reference planes in sequence, the mounting angle of the brackets relative to the image sensor is too large, and the image quality captured by the conventional image capturing module cannot be effectively improved." And the lack of "a lot of time that the conventional image capture module uses manual focus adjustment with respect to the image sensor".

An image capturing module for increasing assembly flatness and reducing focusing time according to an embodiment of the present invention includes: an image sensing unit, a frame housing, an actuator structure, and a reflective substance . The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, wherein a top end of the image sensing wafer has a laser light source The level of the first level is obtained after the horizontal correction. The frame housing is disposed on the carrier substrate and surrounds the image sensing wafer. The actuator structure is disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a lens carrier disposed on the frame housing and a lens holder a movable lens assembly in the lens carrier and above the image sensing wafer, the lens carrier has a surrounding movable member, and the movable lens assembly is fixed by at least two fixing colloids In the surrounding movable member, and the movable lens assembly is movably disposed in the lens holder by the surrounding movable member. The reflective material is temporarily placed on a top end of the movable lens assembly, wherein a top end of the reflective material has a second horizontal upper surface obtained by horizontal correction of the laser light source. Wherein said The first horizontal upper surface of the image sensing wafer and the second horizontal upper surface of the reflective material are parallel to each other to increase assembly flatness of the movable lens assembly relative to the image sensing wafer. Wherein the distance of the laser light source from the first horizontal upper surface of the image sensing wafer is defined as a first vertical distance, and the laser light source is spaced apart from the second horizontal upper surface of the reflective material The distance is defined as a second vertical distance, and the first vertical distance minus the second vertical distance results in the second horizontal upper surface of the reflective material being separated from the image sensing wafer. The distance of the first horizontal upper surface is a predetermined fixed focus distance to reduce the focusing time of the movable lens assembly relative to the image sensing wafer.

Another embodiment of the present invention provides an image capturing module assembly method for increasing the flatness of the assembly and reducing the focusing time. The method includes the following steps: providing an image sensing unit and a frame housing, wherein The image sensing unit includes a carrier substrate and an image sensing wafer disposed on the carrier substrate and electrically connected to the carrier substrate, and the frame housing is disposed on the carrier substrate and surrounds the image sensing substrate An image sensing wafer; the image sensing wafer is horizontally corrected by a laser light source to obtain a first horizontal upper surface on a top end of the image sensing wafer, wherein the laser light source is spaced apart from the image A distance of the first horizontal upper surface of the sensing wafer is defined as a first vertical distance; an actuator structure is provided, wherein the actuator structure is disposed on the frame housing and located on the image sensing wafer Above, wherein the actuator structure comprises a lens carrier disposed on the frame housing and a lens holder disposed in the lens carrier and located on the image sensing chip a movable lens assembly, and the inside of the lens carrier has a surrounding movable member; a reflective substance is temporarily placed on a top end of the movable lens assembly; the reflective substance passes through the level of the laser light source Correcting to obtain a second horizontal upper surface on the top end of the reflective material, wherein the first horizontal upper surface of the image sensing wafer and the second horizontal upper surface of the reflective material are parallel to each other To increase the movable lens assembly relative to the image sensing wafer Assembly flatness; adjusting a focal length of the movable lens assembly relative to the first horizontal upper surface of the image sensing wafer to drive the reflective material to move up and down until the laser light source is apart from the The distance from the second horizontal upper surface of the reflective material is equal to a second vertical distance, wherein the first vertical distance minus the second vertical distance results in the second horizontal upper surface of the reflective material The distance from the first horizontal upper surface of the image sensing wafer is a predetermined fixed focusing distance to reduce the focusing time of the movable lens assembly relative to the image sensing wafer; Two fixing colloids for fixing the movable lens assembly in the surrounding movable member, wherein the movable lens assembly is movably disposed on the lens bearing by the surrounding movable member And receiving the reflective material from the movable lens assembly.

The image capturing module and the assembling method thereof can be provided by the embodiment of the present invention, which can be obtained by “the top end of the image sensing chip has a horizontal correction through a laser light source. a first horizontal upper surface, a top end of the reflective material having a second horizontal upper surface obtained by horizontal correction of the laser light source, and the first horizontal upper surface of the image sensing wafer The second horizontal upper surface of the reflective material is parallel to each other" to effectively reduce the assembly tilt angle of the movable lens assembly relative to the image sensing wafer, thereby ensuring that the movable lens assembly is opposite The image is sensed for the flatness of the wafer. In addition, the image capturing module and the assembling method thereof are provided by the embodiment of the present invention, wherein the distance between the laser light source and the first horizontal upper surface of the image sensing wafer is defined as a first a vertical distance, the distance of the laser light source from the second horizontal upper surface of the reflective material is defined as a second vertical distance, and the first vertical distance minus the second vertical distance is obtained Determining that the distance of the second horizontal upper surface of the reflective material from the first horizontal upper surface of the image sensing wafer is a predetermined fixed focus distance" to reduce the relative displacement of the movable lens assembly The focusing time of the wafer is sensed by the image.

In order to further understand the features and technical contents of the present invention, please refer to the following The detailed description of the present invention and the accompanying drawings are intended to

M‧‧‧Image Capture Module

1‧‧‧Image sensing unit

10‧‧‧Loading substrate

11‧‧‧Image sensing wafer

110‧‧‧First level upper surface

2‧‧‧Frame housing

200‧‧‧ top opening

3‧‧‧Activity structure

30‧‧‧Lens carrier

31‧‧‧Removable lens assembly

310‧‧‧ first plane

311‧‧‧ bottom

30M‧‧‧around movable parts

4‧‧‧Reflecting substances

400‧‧‧Second level upper surface

401‧‧‧ second plane

5‧‧‧ Filter elements

H‧‧‧Fixed colloid

S‧‧‧Laser light source

P‧‧‧Predetermined location

L1‧‧‧first laser beam

R1‧‧‧first reflected beam

L2‧‧‧second laser beam

R2‧‧‧second reflected beam

D1‧‧‧first vertical distance

D2‧‧‧second vertical distance

D3‧‧‧ third vertical distance

D4‧‧‧ fourth vertical distance

F‧‧‧Fixed focusing distance

H1‧‧‧first predetermined thickness

H2‧‧‧second predetermined thickness

1 is a flow chart of a method for assembling an image capturing module for increasing assembly flatness and reducing focusing time according to the present invention.

2 is a side cross-sectional view of steps S100 and S102 of the present invention.

Figure 3 is a side cross-sectional view showing the step S104 of the present invention.

4 is a side cross-sectional view showing steps S106 and S108 of the present invention.

Figure 5 is a side cross-sectional view showing the step S110 of the present invention.

Figure 6 is a side cross-sectional view showing the step S112 of the present invention.

Figure 7 is a side cross-sectional view showing the step S114 of the present invention.

The embodiments of the present invention disclose an image capturing module for increasing the flatness of the assembly and reducing the focusing time, and an assembly method thereof, which are disclosed by the present disclosure. The contents are readily understood to provide additional advantages and benefits of the present invention. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. Further, the drawings of the present invention are merely illustrative, and are not depicted in actual dimensions, that is, the actual dimensions of the related structures are not reflected, which will be described first. The following embodiments are intended to further explain the related art of the present invention, but are not intended to limit the technical scope of the present invention.

Referring to FIG. 1 to FIG. 7 , the present invention provides an assembly method of an image capturing module M for increasing the flatness of the assembly and reducing the focusing time. The method may generally include the following steps: First, step S100 As shown in FIG. 1 and FIG. 2 , an image sensing unit 1 and a frame housing 2 are provided. The image sensing unit 1 includes a carrier substrate 10 and is disposed on the carrier substrate 10 and electrically connected to the carrier. The image of the substrate 10 senses the wafer 11 , and the frame housing 2 is disposed on the carrier substrate 10 and surrounds the image sensing crystal Slice 11. For example, as shown in FIG. 2, the image sensing wafer 11 can be a CMOS image sensing wafer, and the image sensing wafer 11 can be adhered by an adhesive (not labeled, such as UV adhesive, thermosetting adhesive, or in-furnace hardening). Glue or the like) is provided on the carrier substrate 10. In addition, the frame housing 2 may be disposed on the carrier substrate 10 by an adhesive body such as a UV adhesive, a heat hardening adhesive, or an in-furnace hardening adhesive or the like. In addition, the carrier substrate 10 can be a circuit substrate having a plurality of conductive pads (not labeled) on the upper surface thereof. The upper surface of the image sensing wafer 11 has a plurality of conductive pads (not labeled), and the image sensing wafer 11 is Each of the conductive pads can be electrically connected to the conductive pads of the carrier substrate 10 through a conductive line (not labeled), thereby achieving electrical conduction between the image sensing wafer 11 and the carrier substrate 10.

Next, in step S102, as shown in FIG. 1, FIG. 2 and FIG. 5, the image sensing wafer 11 is horizontally corrected by a laser light source S to obtain a first level on the top end of the image sensing wafer 11. The surface 110, wherein the distance of the laser source S from the first horizontal upper surface 110 of the image sensing wafer 11, is defined as a first vertical distance D1. Further, the laser light source S is disposed at a predetermined position P (for example, a fixed position) above the image sensing wafer 11 for generating a direct vertical projection on the first level of the image sensing wafer 11. The first laser beam L1 on the surface 110. The first laser beam L1 generated by the laser source S passes through the reflection of the first horizontal upper surface 110 of the image sensing wafer 11 to form a first direct vertical projection at a predetermined position P or very close to the predetermined position P. Reflecting the beam R1. In other words, when the top end of the image sensing wafer 11 is adjusted to the horizontal state, the first reflected light beam R1 generated by the reflection of the first laser beam L1 through the top end of the image sensing wafer 11 is directly returned to the predetermined position P vertically. Or, the first reflected beam R1 produces a skew within an allowable error range that is very close to the predetermined position P. At this time, the top end of the image sensing wafer 11 is the first horizontal upper surface 110 which can serve as a horizontal reference surface.

Then, in step S104, as shown in FIG. 1 and FIG. 3, an actuator structure 3 is provided, wherein the actuator structure 3 is disposed on the frame housing 2 and located above the image sensing wafer 11, wherein the actuator structure 3 includes a lens disposed on the frame housing 2 A lens holder 30 and a movable lens assembly 31 disposed in the lens holder 30 and located above the image sensing wafer 11 and having a surrounding movable member 30M inside the lens holder 30. For example, the lens carrier 30 can also be disposed on the frame housing 2 by an adhesive (for example, a UV adhesive, a thermosetting adhesive, or an in-furnace hardening glue, etc.), and the movable lens assembly 31 can be composed of a plurality of Optical lens (not labeled). Additionally, it is worth mentioning that, as shown in FIG. 3, the actuator structure 3 can be a voice coil actuator. However, the invention is not limited thereto, and for example, the actuator structure 3 of the present invention may be replaced by an optical auxiliary structure having a fixed lens assembly.

Next, in step S106, a reflective substance 4 is temporarily placed on the top end of the movable lens unit 31 as shown in Figs. 1, 3 and 4. Furthermore, the top end of the movable lens assembly 31 has a first plane 310, and the bottom end of the reflective substance 4 has a second plane 401 corresponding to the first plane 310 and parallel to the second horizontal upper surface 400, and The reflective substance 4 is movably disposed on the first plane 310 of the movable lens assembly 31. For example, the reflective material 4 may be a total reflection material such as a mirror, or may be a semi-reflective material such as glass, but the invention is not limited thereto.

Next, step S108 is: as shown in FIG. 1 and FIG. 4, the reflective material 4 is corrected by the horizontal of the laser light source S to obtain a second horizontal upper surface 400 on the top end of the reflective material 4, wherein the image sensing is performed. The first horizontal upper surface 110 of the wafer 11 and the second horizontal upper surface 400 of the reflective material 4 are parallel to each other to increase the assembly flatness of the movable lens assembly 31 relative to the image sensing wafer 11. Therefore, since the first horizontal upper surface 110 of the image sensing wafer 11 and the second horizontal upper surface 400 of the reflective material 4 are parallel to each other, the present invention can effectively reduce the assembly of the movable lens assembly 31 with respect to the image sensing wafer 11. The inclination angle is thereby used to ensure the flatness of the movable lens unit 31 with respect to the image sensing wafer 11.

Further, a laser light source S (for example, a laser level) is disposed at a predetermined position P above the reflective material 4 for generating a direct vertical projection on the reflective material. The second laser beam L2 on the second horizontal upper surface 400 of 4. The second laser beam L2 generated by the laser source S passes through the second horizontal upper surface 400 of the reflective material 4 to form a second reflected beam that is directly perpendicularly projected at a predetermined position P or very close to the predetermined position P. R2. In other words, when the tip end of the reflective substance 4 is adjusted to the horizontal state, the second reflected light beam R2 generated by the reflection of the second laser beam L2 through the tip end of the reflective substance 4 directly returns to the predetermined position P vertically, or is The two reflected beam R2 produces a skew within the allowable error range very close to the predetermined position P. At this time, the top end of the reflective material 4 forms a second horizontal upper surface 400 parallel to the first horizontal upper surface 110.

It is worth mentioning that the first laser beam L1 generated by the laser source S may also be obliquely projected on the first horizontal upper surface 110 of the image sensing wafer 11, and the second light generated by the laser source S The light beam L2 may also be obliquely projected on the second horizontal upper surface 400 of the reflective material 4 as long as it is a first reflected light beam R1 that enables the "first laser beam L1 to pass through the reflection of the tip end of the image sensing wafer 11". And "the second reflected light beam R2" generated by the reflection of the second laser beam L2 through the tip end of the reflective material 4 is reflected to the same point, and can also reach "the top end of the image sensing wafer 11 and the reflective material 4" The top ends will be parallel to each other to increase the assembly flatness of the movable lens assembly 31 with respect to the image sensing wafer 11.

Then, in step S110, the focal length of the movable lens assembly 31 relative to the first horizontal upper surface 110 of the image sensing wafer 11 is adjusted to drive the reflective material 4 to move up and down, as shown in FIG. 1 , FIG. 4 and FIG. 5 . Until the distance of the laser source S from the second horizontal upper surface 400 of the reflective material 4 is substantially or completely equal to a second vertical distance D2 (as shown in FIG. 5), wherein the first vertical distance D1 is subtracted from the second vertical distance D2, the second horizontal upper surface 400 of the reflective material 4 is obtained from the first horizontal upper surface 110 of the image sensing wafer 11 by a predetermined fixed focusing distance F to reduce the movable lens assembly 31 relative to the image. The focusing time of the wafer 11 is sensed. Therefore, after the preset fixed focus distance F has been previously set by the user, and the first vertical distance D1 is determined by the measurement of the laser light source S, the use is performed. It is only necessary to directly adjust the distance of the laser light source S from the second horizontal upper surface 400 of the reflective material 4 to be substantially equal to or completely equal to the second vertical distance D2, thereby ensuring that the movable lens assembly 31 is opposed to the image sensing wafer 11 The distance of the first horizontal upper surface 110 has been adjusted to an optimum focusing distance, thereby reducing the focusing time of the movable lens assembly 31 relative to the image sensing wafer 11.

Furthermore, as shown in FIGS. 4 and 5, the movable lens assembly 31 has a first predetermined thickness H1, and the reflective material 4 has a second predetermined thickness H2. The distance of the first plane 310 of the movable lens assembly 31 from the first horizontal upper surface 110 of the image sensing wafer 11 is defined as a third vertical distance D3, and the bottom end 311 of the movable lens assembly 31 is spaced apart from the image sensing wafer 11 The distance of the first horizontal upper surface 110 is defined as a fourth vertical distance D4. Thereby, the third vertical distance D3 and the first predetermined thickness H1 are added to be equal to the preset fixed focus distance F, or the fourth vertical distance D4, the first predetermined thickness H1 and the second predetermined thickness H2. The addition will be equal to the preset fixed focus distance F.

Next, step S112 is: "the first horizontal upper surface 110 of the image sensing wafer 11 and the second horizontal upper surface 400 of the reflective material 4 are parallel to each other" and "the laser light source S are spaced apart" as shown in FIG. 1 and FIG. In the case where the distance of the second horizontal upper surface 400 of the reflective substance 4 has been adjusted to be substantially equal to or completely equal to the second vertical distance D2", at least two fixing colloids H may be passed to fix the movable lens assembly 31 in the surrounding shape. In the movable member 30M, wherein the movable lens assembly 31 can be movably disposed in the lens holder 30 by being driven by the surrounding movable member 30M.

Therefore, the present invention can provide an image capturing module M for increasing the flatness of the assembly and reducing the focusing time, which includes: an image sensing unit 1, by the assembly method disclosed in the above steps S100 to S112. a frame housing 2, an actuator structure 3 and a reflective material 4, wherein the top end of the image sensing wafer 11 has a first horizontal upper surface 110 obtained by horizontal correction of the laser light source S, and the reflective substance 4 The top end has a second horizontal upper surface 400 obtained by horizontal correction of the laser source S. Thereby, the first horizontal upper surface 110 of the image sensing wafer 11 The second horizontal upper surface 400 with the reflective material 4 will be parallel to each other to increase the assembly flatness of the movable lens assembly 31 relative to the image sensing wafer 11. In addition, when the distance between the laser light source S and the first horizontal upper surface 110 of the image sensing wafer 11 is defined as a first vertical distance D1, and the distance between the laser light source S and the second horizontal upper surface 400 of the reflective material 4 is defined In the case of a second vertical distance D2, after the first vertical distance D1 is subtracted from the second vertical distance D2, the second horizontal upper surface 400 of the reflective material 4 is obtained from the first horizontal upper surface of the image sensing wafer 11. The distance of 110 is a predetermined fixed focus distance F, thereby reducing the focusing time of the movable lens assembly 31 with respect to the image sensing wafer 11.

In addition, as shown in FIG. 6, the image capturing module M disclosed in the present invention for increasing the flatness of the assembly and reducing the focusing time further includes: a filter element 5, wherein the filter element 5 is disposed on the frame shell. The body 2 is located between the image sensing wafer 11 and the movable lens assembly 31. Furthermore, the top end of the frame housing 2 has a top opening 200 between the image sensing wafer 11 and the movable lens assembly 31, and the top opening 200 of the frame housing 2 is closed by the filter element 5.

Finally, step S114 is to remove the reflective material 4 from the movable lens assembly 31 as shown in FIGS. 1, 6, and 7.

[Possible effects of the examples]

In summary, the image capturing module M and the assembling method thereof can be provided by the embodiment of the present invention. The image sensing chip 11 has a top end having a laser light source S. The first horizontal upper surface 110 obtained after horizontal correction, the top end of the reflective material 4 has a second horizontal upper surface 400 obtained by horizontal correction of the laser light source S, and the first level of the image sensing wafer 11 is The design of the surface 110 and the second horizontal upper surface 400 of the reflective material 4 are parallel to each other to effectively reduce the assembly tilt angle of the movable lens assembly 31 relative to the image sensing wafer 11, thereby ensuring that the movable lens assembly 31 is relative to the image The flatness of the wafer 11 is sensed. In addition, the present invention also has the advantage of reducing the focusing time of the movable lens assembly 31 relative to the image sensing wafer 11.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .

M‧‧‧Image Capture Module

1‧‧‧Image sensing unit

10‧‧‧Loading substrate

11‧‧‧Image sensing wafer

110‧‧‧First level upper surface

2‧‧‧Frame housing

200‧‧‧ top opening

3‧‧‧Activity structure

30‧‧‧Lens carrier

31‧‧‧Removable lens assembly

30M‧‧‧around movable parts

4‧‧‧Reflecting substances

400‧‧‧Second level upper surface

5‧‧‧ Filter elements

H‧‧‧Fixed colloid

Claims (10)

An image capturing module for increasing the flatness of the assembly and reducing the focusing time, comprising: an image sensing unit, the image sensing unit comprising a carrier substrate and an electrical device disposed on the carrier substrate An image sensing wafer coupled to the carrier substrate, wherein a top end of the image sensing wafer has a first horizontal upper surface obtained by horizontal correction of a laser light source; a frame housing, the frame shell a body disposed on the carrier substrate and surrounding the image sensing wafer; an actuator structure disposed on the frame housing and above the image sensing wafer, wherein the The actuator structure includes a lens carrier disposed on the frame housing and a movable lens assembly disposed in the lens carrier and above the image sensing wafer, the lens carrier The inner portion has a surrounding movable member, the movable lens assembly is fixed in the surrounding movable member by at least two fixing colloids, and the movable lens assembly passes through the surrounding shape a movable member is movably disposed in the lens holder; and a reflective substance temporarily placed on a top end of the movable lens assembly, wherein a top end of the reflective substance has a passage a second horizontal upper surface obtained by horizontally correcting the laser light source; wherein the first horizontal upper surface of the image sensing wafer and the second horizontal upper surface of the reflective material are parallel to each other Adding an assembly flatness of the movable lens assembly relative to the image sensing wafer; wherein a distance of the laser light source from the first horizontal upper surface of the image sensing wafer is defined as a first vertical a distance, the distance of the laser light source from the second horizontal upper surface of the reflective material is defined as a second vertical distance, and the first vertical distance minus the second vertical distance is obtained The second horizontal upper surface of the reflective material is at a predetermined fixed focus distance from the first horizontal upper surface of the image sensing wafer to reduce the movable lens assembly relative to the The image sensing time of the wafer is adjusted. The image capturing module of claim 1 for increasing the flatness of the assembly and reducing the focusing time, wherein the top end of the movable lens assembly has a first plane and the bottom end of the reflective material Having a second plane corresponding to the first plane and parallel to the second horizontal upper surface, wherein the reflective substance is movably disposed on the first plane of the movable lens assembly, and The reflective material is a totally reflective or semi-reflective material. The image capturing module of claim 2, wherein the movable lens assembly has a first predetermined thickness, and the reflective material has a second predetermined thickness. a distance of the first plane of the movable lens assembly from the first horizontal upper surface of the image sensing wafer is defined as a third vertical distance, and a bottom end of the movable lens assembly is spaced apart from the image The distance of the first horizontal upper surface of the sensing wafer is defined as a fourth vertical distance, and the third vertical distance is added to the first predetermined thickness or the fourth vertical distance, the first Adding a predetermined thickness to the second predetermined thickness will be equal to the predetermined focus distance. The image capturing module of claim 1 for increasing the flatness of the assembly and reducing the focusing time, wherein the laser light source is disposed at a predetermined position above the image sensing wafer for use in Generating a first laser beam directly projected onto the first horizontal upper surface of the image sensing wafer, the first laser beam generated by the laser source passing through the image sensing wafer The first horizontal upper surface is reflected to form a first reflected beam that is directly projected at or in close proximity to the predetermined position. An image capturing module for increasing assembly flatness and reducing focusing time according to claim 1, wherein the laser light source is disposed above the reflective material a predetermined position for generating a second laser beam directly projected onto the second horizontal upper surface of the reflective material, the second laser beam generated by the laser light source passing through A reflection of the second horizontal upper surface of the reflective material to form a second reflected light beam that is directly projected at or in close proximity to the predetermined position. An image capturing module for increasing the flatness of the assembly and reducing the focusing time, comprising: an image sensing unit, the image sensing unit comprising a carrier substrate and an electrical device disposed on the carrier substrate An image sensing wafer coupled to the carrier substrate, wherein a top end of the image sensing wafer has a first horizontal upper surface; a frame housing disposed on the carrier substrate and surrounding the An image sensing wafer; an actuator structure disposed on the frame housing and above the image sensing wafer, wherein the actuator structure includes a frame disposed on the frame a lens mount on the body and a movable lens assembly movably disposed in the lens carrier and above the image sensing wafer, and the top end of the movable lens assembly has a first plane; And a reflective substance movably temporarily placed on the first plane of the movable lens assembly, wherein a top end of the reflective material has a second horizontal upper surface And the bottom end of the reflective material has a second plane corresponding to the first plane and parallel to the second horizontal upper surface; wherein the first horizontal upper surface of the image sensing wafer is The second horizontal upper surfaces of the reflective material are parallel to each other to increase assembly flatness of the movable lens assembly relative to the image sensing wafer; wherein a laser light source is spaced from the image sensing wafer The distance of the first horizontal upper surface is defined as a first vertical distance, and the laser light source is separated from the opposite The distance of the second horizontal upper surface of the incident material is defined as a second vertical distance, and the first vertical distance minus the second vertical distance obtains the second horizontal upper surface of the reflective substance The distance from the first horizontal upper surface of the image sensing wafer is a predetermined fixed focusing distance to reduce the focusing time of the movable lens assembly relative to the image sensing wafer. The image capturing module for increasing the flatness of the assembly and reducing the focusing time, as described in claim 6, wherein the movable lens assembly has a first predetermined thickness, and the reflective material has a second predetermined thickness. a distance of the first plane of the movable lens assembly from the first horizontal upper surface of the image sensing wafer is defined as a third vertical distance, and a bottom end of the movable lens assembly is spaced apart from the image The distance of the first horizontal upper surface of the sensing wafer is defined as a fourth vertical distance, and the third vertical distance is added to the first predetermined thickness or the fourth vertical distance, the first Adding a predetermined thickness to the second predetermined thickness will be equal to the predetermined focus distance. An assembly method of an image capturing module for increasing the flatness of the assembly and reducing the focusing time, comprising the steps of: providing an image sensing unit and a frame housing, wherein the image sensing unit comprises a carrier substrate And an image sensing wafer disposed on the carrier substrate and electrically connected to the carrier substrate, and the frame housing is disposed on the carrier substrate and surrounding the image sensing wafer; The wafer is horizontally corrected by a laser source to obtain a first horizontal upper surface on the top end of the image sensing wafer, wherein the laser source is at a distance from the first level of the image sensing wafer The distance of the upper surface is defined as a first vertical distance; an actuator structure is provided, wherein the actuator structure is disposed on the frame housing and above the image sensing wafer, wherein the actuator The structure includes a lens carrier disposed on the frame housing and a speaker disposed on the frame a movable lens assembly in the lens holder and above the image sensing wafer, and the inside of the lens carrier has a surrounding movable member; a reflective substance is temporarily placed on the top of the movable lens assembly The reflective material is corrected by the level of the laser light source to obtain a second horizontal upper surface on the top end of the reflective material, wherein the first horizontal upper surface of the image sensing wafer is The second horizontal upper surfaces of the reflective material are parallel to each other to increase the assembly flatness of the movable lens assembly relative to the image sensing wafer; and the movable lens assembly is adjusted relative to the image sensing a focal length of the first horizontal upper surface of the wafer to drive the reflective material to move up and down until the distance of the laser light source from the second horizontal upper surface of the reflective material is equal to a second vertical distance The first vertical distance minus the second vertical distance, the second horizontal upper surface of the reflective material is obtained from the image sensing The distance of the first horizontal upper surface of the sheet is a predetermined fixed focus distance to reduce the focusing time of the movable lens assembly relative to the image sensing wafer; by at least two fixing colloids, Fixing the movable lens assembly in the surrounding movable member, wherein the movable lens assembly is movably disposed in the lens carrier by the surrounding movable member; The reflective material is removed from the movable lens assembly. The method for assembling an image capturing module for increasing the flatness of the assembly and reducing the focusing time, wherein the laser light source is disposed at a predetermined position above the image sensing wafer, For generating a first laser beam directly projected on the first horizontal upper surface of the image sensing wafer, the first laser beam generated by the laser light source passes through the image sense The reflection of the first horizontal upper surface of the wafer is measured to form a first reflected beam that is directly projected at or in close proximity to the predetermined position. An image for increasing the flatness of the assembly and reducing the focusing time as described in claim 8 a method of assembling a capture module, wherein the laser light source is disposed at a predetermined position above the reflective material for generating a direct projection on the second horizontal upper surface of the reflective material a second laser beam, the second laser beam generated by the laser source being reflected by the second horizontal upper surface of the reflective material to form a direct projection at the predetermined position or very A second reflected beam approaching the predetermined location.