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TWI588552B - Optical transceiver subassembly and manufacturing method thereof - Google Patents

Optical transceiver subassembly and manufacturing method thereof Download PDF

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Publication number
TWI588552B
TWI588552B TW104111342A TW104111342A TWI588552B TW I588552 B TWI588552 B TW I588552B TW 104111342 A TW104111342 A TW 104111342A TW 104111342 A TW104111342 A TW 104111342A TW I588552 B TWI588552 B TW I588552B
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light
optical
module
substrate
optical transceiver
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TW104111342A
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Chinese (zh)
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TW201636666A (en
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中庸 王
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祥茂光電科技股份有限公司
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Description

光收發次組件及其製造方法 Optical transceiver sub-assembly and manufacturing method thereof

本發明係關於一種光通訊元件及其製造方法,特別關於一種光收發次組件及其製造方法。 The present invention relates to an optical communication component and a method of fabricating the same, and more particularly to an optical transceiver subassembly and a method of fabricating the same.

現今全球許多國家已普遍採用光纖作為網路系統主要的傳輸工具。因為光纖是以光的全反射來進行傳輸,因此光纖具有高速傳輸以及低傳輸損失的特性。當光纖被用來作為網路系統的傳遞媒介時,光纖具有寬頻、高容量與高速的特性。在目前資訊傳輸量越來越大且使用者對網路要求更為快速的情形下,光纖的傳輸數據量已逐漸不敷使用。為了因應傳輸數據量不敷使用的問題,除了改善光纖傳遞速度以外,光纖兩端的接收與發射亦顯得相當重要。其中,重要的元件包括了光接收器、光發射器以及光收發器。 Fiber optics is now widely used as the primary transmission tool for network systems in many countries around the world. Since the optical fiber is transmitted by total reflection of light, the optical fiber has characteristics of high speed transmission and low transmission loss. When an optical fiber is used as a transmission medium for a network system, the optical fiber has characteristics of wide frequency, high capacity, and high speed. In the current situation of increasing information transmission and users requiring faster network requirements, the amount of data transmitted by optical fibers has gradually become insufficient. In order to cope with the problem of insufficient data transmission, in addition to improving the fiber transmission speed, the reception and transmission at both ends of the fiber are also very important. Among them, important components include optical receivers, optical transmitters, and optical transceivers.

然而,在實務上,由於光收發器的技術日新月異,傳統的架構已無法滿足設計上與製造上的需求。因此,如何簡化光收發次組件的結構,並提升光收發次組件的組裝效率,則為研發人員應解決的問題之一。 However, in practice, due to the rapid advancement of optical transceiver technology, the traditional architecture has been unable to meet the design and manufacturing needs. Therefore, how to simplify the structure of the optical transceiver sub-assembly and improve the assembly efficiency of the optical transceiver sub-assembly is one of the problems that the researcher should solve.

本發明在於提供一種光收發次組件,以簡化光收發次組件的結構,並提升光收發次組件的組裝效率。 The present invention provides an optical transceiver sub-assembly to simplify the structure of the optical transceiver sub-assembly and improve the assembly efficiency of the optical transceiver sub-assembly.

本發明所揭露的光收發次組件,包括光連接模組、光偵測模組、光源模組以及光波導模組。光連接模組係用以連接外部裝置,包括第一連接埠及第二連接埠,第一連接埠傳遞外部裝置的第一光訊號。再者,光波導模 組包括第一導光區域及第二導光區域,且光波導模組具有入光部、出光部與傳輸部。其中,第一導光區域經由傳輸部光耦接第一連接埠,第二導光區域經由傳輸部光耦接第二連接埠。光偵測模組則經由出光部光耦接第一導光區域,用以偵測經第一導光區域的第一光訊號。此外,光源模組經由入光部光耦接第二導光區域,用以發射一第二光訊號經第二導光區域至第二連接埠,第二連接埠則將第二光訊號傳遞至外部裝置。 The optical transceiver sub-assembly disclosed in the present invention comprises an optical connection module, a light detection module, a light source module and an optical waveguide module. The optical connection module is configured to connect to the external device, and includes a first connection port and a second connection port, and the first connection port transmits the first optical signal of the external device. Furthermore, the optical waveguide mode The group includes a first light guiding area and a second light guiding area, and the optical waveguide module has a light entering part, a light emitting part and a transmitting part. The first light guiding region is optically coupled to the first connecting port via the transmitting portion, and the second light guiding region is optically coupled to the second connecting port via the transmitting portion. The light detecting module is optically coupled to the first light guiding region via the light emitting portion for detecting the first light signal passing through the first light guiding region. In addition, the light source module is optically coupled to the second light guiding region via the light incident portion for transmitting a second light signal to the second port through the second light guiding region, and the second port transmits the second light signal to the second port. External device.

根據上述本發明所揭露的光收發次組件,利用光波導元件取代多條光纖,以做為光收發次組件中的光通道,不僅能讓光通道的輸入端間距與輸出端間距轉換更容易,亦簡化了光收發次組件的結構與光收發次組件的組裝流程。 According to the optical transceiver module disclosed in the above invention, the optical waveguide component is used to replace the plurality of optical fibers as the optical channel in the optical transceiver sub-assembly, which not only makes the input end spacing and the output end spacing of the optical channel easier to convert. The structure of the optical transceiver sub-assembly and the assembly process of the optical transceiver sub-assembly are also simplified.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

1、3、4、6、7‧‧‧光收發次組件 1, 3, 4, 6, 7‧‧‧ optical transceiver sub-components

10、30、40、50、60‧‧‧基板 10, 30, 40, 50, 60‧‧‧ substrates

12、42、62、72‧‧‧光連接模組 12, 42, 62, 72‧‧‧ optical connection modules

14、34、44、64‧‧‧光偵測模組 14,34,44,64‧‧‧Light detection module

16、46、66‧‧‧光源模組 16, 46, 66‧‧‧ Light source module

18、28、38、48、68‧‧‧光波導模組 18, 28, 38, 48, 68‧‧‧ optical waveguide modules

120、620‧‧‧第一連接埠 120, 620‧‧‧ First connection埠

122、622‧‧‧第二連接埠 122, 622‧‧‧Second connection埠

180、280‧‧‧第一導光區域 180, 280‧‧‧ first light guiding area

182、282‧‧‧第二導光區域 182, 282‧‧‧second light guiding area

184、284、484‧‧‧入光部 184, 284, 484‧‧‧ into the Department of Light

186、286、386‧‧‧出光部 186, 286, 386‧‧‧Lighting Department

188、288、688‧‧‧傳輸部 188, 288, 688‧‧‧Transportation Department

2800、2820‧‧‧光通道 2800, 2820‧‧‧ light channel

28000、28002、28200、28202‧‧‧輸入/輸出端 28000, 28002, 28200, 28202‧‧‧ input/output

340‧‧‧光偵測元件 340‧‧‧Light detection components

342‧‧‧透鏡單元 342‧‧‧ lens unit

3420‧‧‧入射端 3420‧‧‧Injection end

3422‧‧‧反射面 3422‧‧‧reflecting surface

3424‧‧‧出射端 3424‧‧‧Outlet

3426‧‧‧定位部 3426‧‧‧ Positioning Department

381、383‧‧‧表面 381, 383‧‧‧ surface

41‧‧‧光隔離器 41‧‧‧Optical isolator

43‧‧‧電流電壓轉換器 43‧‧‧ Current and voltage converter

460‧‧‧發光元件 460‧‧‧Lighting elements

462‧‧‧控制單元 462‧‧‧Control unit

510、512‧‧‧磁性體 510, 512‧‧‧ magnetic body

514‧‧‧法拉第轉子 514‧‧‧Faraday rotor

6200、6220‧‧‧光纖 6200, 6220‧‧‧ fiber

622‧‧‧玻璃片 622‧‧‧Stainless glass

75‧‧‧殼體 75‧‧‧shell

第1圖為本發明一實施例之光收發次組件的結構示意圖。 FIG. 1 is a schematic structural view of an optical transceiver sub-assembly according to an embodiment of the present invention.

第2圖為本發明一實施例之光波導模組的結構示意圖。 FIG. 2 is a schematic structural view of an optical waveguide module according to an embodiment of the present invention.

第3圖為本發明一實施例之光收發次組件的側視圖。 Fig. 3 is a side view of an optical transceiver sub-assembly according to an embodiment of the present invention.

第4圖為本發明另一實施例之光收發次組件的結構示意圖。 FIG. 4 is a schematic structural diagram of an optical transceiver sub-assembly according to another embodiment of the present invention.

第5圖為本發明一實施例之光隔離器的結構圖。 Fig. 5 is a structural view showing an optical isolator according to an embodiment of the present invention.

第6圖為本發明又一實施例之光收發次組件的結構示意圖。 FIG. 6 is a schematic structural diagram of an optical transceiver sub-assembly according to still another embodiment of the present invention.

第7圖為本發明再一實施例之光收發次組件的結構示意圖。 FIG. 7 is a schematic structural diagram of an optical transceiver sub-assembly according to still another embodiment of the present invention.

第8圖為本發明一實施例之光收發次組件製造方法的流程圖。 Figure 8 is a flow chart showing a method of manufacturing an optical transceiver sub-assembly according to an embodiment of the present invention.

請參照第1圖,係為本發明一實施例之光收發次組件的結構示意圖。如第1圖所示,光收發次組件1包括光連接模組12、光偵測模組14、光源模組16以及光波導模組18。光連接模組12係用以連接外部裝置,包括第一 連接埠120及第二連接埠122,第一連接埠120傳遞外部裝置的第一光訊號。光波導模組18具有一光波導元件,係以氧化矽或矽晶圓製成。於實務上,可對氧化矽或矽晶圓基板進行半導體製程,以產生包括第一導光區域180及第二導光區域182。且光波導模組18具有入光部184、出光部186與傳輸部188。第一導光區域180經由傳輸部188光耦接第一連接埠120,第二導光區域182經由傳輸部188光耦接第二連接埠122。再者,光偵測模組14係經由出光部186光耦接第一導光區域180,用以偵測經第一導光區域180的第一光訊號。此外,光源模組16係經由入光部184光耦接第二導光區域182。光源模組16發射第二光訊號經第二導光區域182至第二連接埠122,第二連接埠122則將第二光訊號傳遞至外部裝置。 Please refer to FIG. 1 , which is a schematic structural diagram of an optical transceiver sub-assembly according to an embodiment of the present invention. As shown in FIG. 1 , the optical transceiver sub-assembly 1 includes an optical connection module 12 , a photo detection module 14 , a light source module 16 , and an optical waveguide module 18 . The optical connection module 12 is used to connect an external device, including the first The port 120 and the second port 122 transmit the first optical signal of the external device. The optical waveguide module 18 has an optical waveguide component made of a tantalum oxide or tantalum wafer. In practice, a semiconductor process can be performed on the yttrium oxide or tantalum wafer substrate to produce a first light guiding region 180 and a second light guiding region 182. The optical waveguide module 18 has a light incident portion 184, a light exit portion 186, and a transfer portion 188. The first light guiding region 180 is optically coupled to the first connecting port 120 via the transmitting portion 188 , and the second light guiding region 182 is optically coupled to the second connecting port 122 via the transmitting portion 188 . In addition, the light detecting module 14 is optically coupled to the first light guiding region 180 via the light emitting portion 186 for detecting the first light signal passing through the first light guiding region 180. In addition, the light source module 16 is optically coupled to the second light guiding region 182 via the light incident portion 184 . The light source module 16 transmits the second optical signal to the second port 122 via the second light guiding region 182, and the second port 122 transmits the second optical signal to the external device.

於一實施例中,光收發次組件1更可包括基板10。其中,基板10的材料可以是有絕緣及/或散熱效果的材料,例如氮化鋁、矽或是其他陶瓷材料。因此,光波導模組18、光偵測模組14以及光源模組16可分別設置於基板10。惟本實施例並不以此為限,該所屬技術領域之通常知識者亦可依實際需求利用其他適合的固接設計以設置光波導模組18、光偵測模組14以及光源模組16。 In an embodiment, the optical transceiver sub-assembly 1 further includes a substrate 10. The material of the substrate 10 may be a material having an insulating and/or heat dissipating effect, such as aluminum nitride, tantalum or other ceramic materials. Therefore, the optical waveguide module 18, the light detecting module 14 and the light source module 16 can be respectively disposed on the substrate 10. However, the present embodiment is not limited thereto, and those skilled in the art can also use other suitable fixed designs to set the optical waveguide module 18, the light detecting module 14 and the light source module 16 according to actual needs. .

請參照第2圖,係為本發明一實施例之光波導模組的結構示意圖。光波導模組28中的第一導光區域280包括至少一第一光通道2800,每一個第一光通道2800包括第一輸入端28000及第一輸出端28002。第一輸入端28000光耦接於傳輸部288,以接收第一光訊號。第一輸出端28002光耦接於出光部286,以便將透過第一光通道2800傳送的第一光訊號傳送至光偵測模組。再者,第二導光區域282包括至少一第二光通道2820,每一個第二光通道2820包括第二輸入端28200及第二輸出端28202。第二輸入端28200光耦接於入光部284,以接收第二光訊號。第二輸出端28202光耦接於傳輸部288,以便將透過第二光通道2820傳送的第二光訊號傳送至光連接模組。 Please refer to FIG. 2, which is a schematic structural view of an optical waveguide module according to an embodiment of the present invention. The first light guiding region 280 in the optical waveguide module 28 includes at least one first optical channel 2800. Each of the first optical channels 2800 includes a first input end 28000 and a first output end 28002. The first input end 28000 is optically coupled to the transmission unit 288 to receive the first optical signal. The first output end 28002 is optically coupled to the light exiting portion 286 to transmit the first optical signal transmitted through the first optical channel 2800 to the light detecting module. Furthermore, the second light guiding region 282 includes at least one second optical channel 2820, and each of the second optical channels 2820 includes a second input end 28200 and a second output end 28202. The second input end 28200 is optically coupled to the light incident portion 284 to receive the second optical signal. The second output end 28202 is optically coupled to the transmission portion 288 for transmitting the second optical signal transmitted through the second optical channel 2820 to the optical connection module.

其中,相鄰的第二輸入端28200之間係間隔第一距離,相鄰的 第二輸出端28202之間則間隔第二距離。於實務上,第一距離可不等於第二距離。舉例來說,通常由於光源模組尺寸的限制,第一距離為1mm。第二距離則需配合光連接模組而設定為250μm。於此例中,第一距離為1mm係遠大於第二距離。但透過光波導元件的光通道設計,可輕易將兩端差異極大的間距做轉換。此外,相鄰的第一輸入端28000之間係間隔第三距離,相鄰的第一輸出端28002之間則間隔第四距離。於實務上,第三距離亦可不等於第四距離。如是,利用光波導元件易於調適光通道輸入端間距與輸出端間距的特性,讓輸入端間距與輸出端間距的轉換更容易,以使光連接模組、光偵測模組及光源模組之間的組配更有彈性。此外,更可避免以光纖作為光通道時為達到適當間距配置而遭遇光纖間距的限制或是光纖扭曲問題。 Wherein the adjacent second input ends 28200 are spaced apart by a first distance, adjacent The second output 2828 is spaced apart by a second distance. In practice, the first distance may not be equal to the second distance. For example, the first distance is usually 1 mm due to the size of the light source module. The second distance is set to 250 μm in conjunction with the optical connection module. In this example, the first distance is 1 mm and is much larger than the second distance. However, through the optical channel design of the optical waveguide component, the extremely different spacing between the two ends can be easily converted. In addition, the adjacent first input ends 28000 are separated by a third distance, and the adjacent first output ends 28002 are separated by a fourth distance. In practice, the third distance may not be equal to the fourth distance. For example, the optical waveguide component can easily adjust the characteristics of the spacing between the input end of the optical channel and the spacing of the output end, so that the conversion between the input end spacing and the output end spacing is easier, so that the optical connection module, the light detecting module, and the light source module are The composition between the two is more flexible. In addition, it is more difficult to avoid the limitation of the fiber spacing or the fiber distortion problem when the optical fiber is used as the optical channel to achieve the proper spacing configuration.

請參照第3圖,係為本發明一實施例之光收發次組件的側視 圖。光收發次組件3包括光連接模組(圖未示)、光偵測模組34、光源模組(圖未示)以及光波導模組38。其中,光偵測模組34包括光偵測元件340及一透鏡單元342。透鏡單元342設置於光偵測元件340的上方,並鄰近於出光部386。透鏡單元342包括入射端3420、反射面3422及出射端3424,入射端3420對準出光部386,出射端3424對準光偵測元件340。反射面3422用以使從入射端3420進入的第一光訊號轉朝向出射端3424。於實務上,由於光波導模組38於製造時出光部386與光波導模組38的下表面381的垂直距離通常較不易控制,但出光部386與光波導模組38的上表面383的垂直距離則可精確控制以配合透鏡單元342中入射端3420的位置。因此,可利用上表面383做為定位的參考平面,將透鏡單元342的定位部3426設置於上表面383上,以便將入射端3420對準出光部386。於實務上,光收發次組件3更可包括基板30,並將光偵測元件340設置於基板30上,惟本實施例不以此為限。 Please refer to FIG. 3, which is a side view of an optical transceiver sub-assembly according to an embodiment of the invention. Figure. The optical transceiver sub-assembly 3 includes an optical connection module (not shown), a light detection module 34, a light source module (not shown), and an optical waveguide module 38. The light detecting module 34 includes a light detecting component 340 and a lens unit 342. The lens unit 342 is disposed above the light detecting element 340 and adjacent to the light exiting portion 386 . The lens unit 342 includes an incident end 3420, a reflective surface 3422, and an exit end 3424. The incident end 3420 is aligned with the light exiting portion 386, and the exit end 3424 is aligned with the photodetecting element 340. The reflective surface 3422 is configured to rotate the first optical signal entering from the incident end 3420 toward the exit end 3424. In practice, since the vertical distance between the light exit portion 386 and the lower surface 381 of the optical waveguide module 38 during manufacturing is generally difficult to control, the light exit portion 386 is perpendicular to the upper surface 383 of the optical waveguide module 38. The distance can then be precisely controlled to match the position of the incident end 3420 in the lens unit 342. Therefore, the upper surface 383 can be used as a reference plane for positioning, and the positioning portion 3426 of the lens unit 342 is disposed on the upper surface 383 to align the incident end 3420 with the light exit portion 386. In an embodiment, the optical transceiver sub-assembly 3 may further include a substrate 30 and the photodetecting element 340 is disposed on the substrate 30. However, the embodiment is not limited thereto.

請參照第4圖,係用以說明本發明另一實施例之光收發次組件 的結構示意圖。如第4圖所示,光收發次組件4包括光連接模組42、光偵測模組44、光源模組46以及光波導模組48,其耦接關係及運作原理與第1圖所示 實施例相同,在此不再贅述。與第1圖不同的是,光收發次組件4更包括光隔離器41,設置於光源模組46與入光部484之間,且分別光耦接於光源模組46及入光部484。光隔離器41係用以控制第二光訊號,使其行進方向為單一方向(即由光源模組46射向光波導模組48),以避免第二光訊號反射回光源模組46而影響發光效能。於實務上,光收發次組件4更可包括基板40,並將光隔離器41、光偵測模組44、光源模組46以及光波導模組48設置於基板40上,惟本實施例不以此為限。請參照第5圖,係為本發明一實施例之光隔離器的結構圖。光隔離器包括第一磁性體510、第二磁性體512及法拉第轉子514,法拉第轉子514係設置於第一磁性體510與第二磁性體512之間。舉例來說,如第5圖所示,可將光隔離器的第二磁性體512端設置於基板50上,使第一磁性體510、第二磁性體512及法拉第轉子514成上下排列,以節省光隔離器所占的橫向空間。於另一個例子中,亦可將第一磁性體510、第二磁性體512及法拉第轉子514以橫向方式設置於基板50上。除此之外,於又一個例子中,亦可將法拉第轉子514設置於圓形磁性體中間,再將光隔離器設置於基板50上。 Please refer to FIG. 4 for explaining an optical transceiver sub-assembly according to another embodiment of the present invention. Schematic diagram of the structure. As shown in FIG. 4, the optical transceiver sub-assembly 4 includes an optical connection module 42, a light detection module 44, a light source module 46, and an optical waveguide module 48. The coupling relationship and operation principle are shown in FIG. The embodiments are the same and will not be described again here. Different from the first embodiment, the optical transceiver sub-assembly 4 further includes an optical isolator 41 disposed between the light source module 46 and the light incident portion 484 and optically coupled to the light source module 46 and the light incident portion 484, respectively. The optical isolator 41 is configured to control the second optical signal so that the traveling direction is a single direction (ie, the light source module 46 is directed to the optical waveguide module 48) to prevent the second optical signal from being reflected back to the light source module 46. Luminous performance. In an embodiment, the optical transceiver sub-assembly 4 further includes a substrate 40, and the optical isolator 41, the optical detection module 44, the light source module 46, and the optical waveguide module 48 are disposed on the substrate 40, but the embodiment does not This is limited to this. Please refer to FIG. 5, which is a structural diagram of an optical isolator according to an embodiment of the present invention. The optical isolator includes a first magnetic body 510, a second magnetic body 512, and a Faraday 514. The Faraday 514 is disposed between the first magnetic body 510 and the second magnetic body 512. For example, as shown in FIG. 5, the second magnetic body 512 end of the optical isolator may be disposed on the substrate 50, and the first magnetic body 510, the second magnetic body 512, and the Faraday rotator 514 may be arranged up and down to Save the lateral space occupied by optical isolators. In another example, the first magnetic body 510, the second magnetic body 512, and the Faraday rotator 514 may be disposed on the substrate 50 in a lateral direction. In addition, in another example, the Faraday rotator 514 may be disposed in the middle of the circular magnetic body, and the optical isolator may be disposed on the substrate 50.

請復參照第4圖,於又一實施例中,光收發次組件4更可包括 電流電壓轉換器43。電流電壓轉換器43係電性連接於光偵測模組44,用以將光偵測模組44產生的電流訊號轉換為電壓訊號。此外,可將電流電壓轉換器43設置於基板40上,惟本實施例不以此為限。於實務上,光源模組46可包括發光元件460及控制單元462。其中,控制單元462可包括光偵測器及控制電路。控制單元462透過控制電路電性連接於發光元件460,並透過光偵測器光耦接於發光元件460。由於發光元件460除了朝入光部484的方向發光外,亦會朝另一方向(即朝控制單元462的方向)發光,且兩方向的發光亮度具有一定的關係。因此,可利用控制單元462的光偵測器偵測發光元件460的發光亮度,以推知發光元件460朝入光部484的發光亮度。控制單元462並依據推知的發光亮度,決定是否利用控制電路對發光元件460的發射功率進行調整,藉以達到自動功率控制的目的。 Referring to FIG. 4, in another embodiment, the optical transceiver sub-assembly 4 may further include Current to voltage converter 43. The current-to-voltage converter 43 is electrically connected to the light detecting module 44 for converting the current signal generated by the light detecting module 44 into a voltage signal. In addition, the current-to-voltage converter 43 can be disposed on the substrate 40, but the embodiment is not limited thereto. In practice, the light source module 46 can include a light emitting element 460 and a control unit 462. The control unit 462 can include a photodetector and a control circuit. The control unit 462 is electrically connected to the light-emitting element 460 through a control circuit, and is optically coupled to the light-emitting element 460 through the light detector. Since the light-emitting element 460 emits light in the direction of entering the light-emitting portion 484, it also emits light in the other direction (i.e., in the direction toward the control unit 462), and the light-emitting luminances in both directions have a certain relationship. Therefore, the light-emitting luminance of the light-emitting element 460 can be detected by the light detector of the control unit 462 to infer the light-emitting luminance of the light-emitting element 460 toward the light-emitting portion 484. The control unit 462 determines whether to use the control circuit to adjust the transmit power of the light-emitting element 460 according to the inferred light-emitting brightness, thereby achieving the purpose of automatic power control.

請參照第6圖,係為本發明另一實施例之光收發次組件的結構 示意圖。如第6圖所示,光收發次組件6包括光連接模組62、光偵測模組64、光源模組66以及光波導模組68。於實務上,光收發次組件6更可包括基板60。其耦接關係及運作原理與第1圖所示實施例相同,在此不再贅述。除此之外,第一連接埠620包括至少一第一光纖6200,第二連接埠622包括至少一第二光纖6220,第一光纖6200及第二光纖6220光耦接傳輸部688,以做為光波導模組68與光連接模組62之間光訊號的傳輸媒介。再者,第一光纖6200及第二光纖6220係利用玻璃片622進行夾固。 Please refer to FIG. 6 , which is a structure of an optical transceiver sub-assembly according to another embodiment of the present invention. schematic diagram. As shown in FIG. 6, the optical transceiver sub-assembly 6 includes an optical connection module 62, a light detection module 64, a light source module 66, and an optical waveguide module 68. In practice, the optical transceiver subassembly 6 may further include a substrate 60. The coupling relationship and the operation principle are the same as those in the embodiment shown in FIG. 1, and details are not described herein again. In addition, the first port 620 includes at least one first fiber 6200, and the second port 622 includes at least one second fiber 6220. The first fiber 6200 and the second fiber 6220 are optically coupled to the transmission portion 688 to serve as The transmission medium of the optical signal between the optical waveguide module 68 and the optical connection module 62. Furthermore, the first optical fiber 6200 and the second optical fiber 6220 are sandwiched by a glass piece 622.

請參照第7圖,係為本發明再一實施例之光收發次組件的結構 示意圖。如第7圖所示,光收發次組件7包括光連接模組72、光偵測模組(圖未示)、光源模組(圖未示)以及光波導模組(圖未示),其耦接關係及運作原理與第1圖所示實施例相同,在此不再贅述。除此之外,光收發次組件7更包括殼體75。且光連接模組72與殼體75連接,並至少一部份露出殼體75,光偵測模組、光源模組及光波導模組則設置於殼體內75。 Please refer to FIG. 7 , which is a structure of an optical transceiver sub-assembly according to still another embodiment of the present invention. schematic diagram. As shown in FIG. 7, the optical transceiver sub-assembly 7 includes an optical connection module 72, a light detection module (not shown), a light source module (not shown), and an optical waveguide module (not shown). The coupling relationship and the operation principle are the same as those in the embodiment shown in FIG. 1, and details are not described herein again. In addition to this, the optical transceiver subassembly 7 further includes a housing 75. The optical connection module 72 is connected to the housing 75, and at least partially exposes the housing 75. The light detecting module, the light source module and the optical waveguide module are disposed in the housing 75.

為說明本發明一實施例之光收發次組件製造方法的流程,請一 併參照第1圖及第8圖,其中第8圖係為本實施例之流程圖。如第8圖所示,光收發次組件製造方法包括下步驟。首先,於步驟S80中,將光波導模組18固定於基板10上。其中,光波導模組18包括第一導光區域180及第二導光區域182。且光波導模組18具有入光部184、出光部186與傳輸部188,傳輸部188光耦接於光連接模組12。接著,於步驟S81中,將光偵測模組14對準出光部186。接著,於步驟S82中,將光偵測模組14固定。又於步驟S83中,將光源模組16對準入光部184。再來,於步驟S84中,並將光源模組16固定於基板10上。而上述固定相關步驟,其方式可先將膠體設於固定處或待固定元件,再以光照固化膠體,藉由膠體的固化使得元件固定。再者,使用於固化膠體的光線可以但不限制為紫外線光。 In order to explain the flow of the optical transceiver sub-assembly manufacturing method according to an embodiment of the present invention, please Referring to Figures 1 and 8, Figure 8 is a flow chart of the present embodiment. As shown in Fig. 8, the optical transceiver subassembly manufacturing method includes the following steps. First, in step S80, the optical waveguide module 18 is fixed to the substrate 10. The optical waveguide module 18 includes a first light guiding area 180 and a second light guiding area 182. The optical waveguide module 18 has a light incident portion 184 , a light exit portion 186 , and a transmission portion 188 . The transmission portion 188 is optically coupled to the optical connection module 12 . Next, in step S81, the light detecting module 14 is aligned with the light exiting portion 186. Next, in step S82, the light detecting module 14 is fixed. In step S83, the light source module 16 is aligned into the light portion 184. Then, in step S84, the light source module 16 is fixed to the substrate 10. In the above-mentioned fixed-related step, the colloid may be first set at a fixed position or a component to be fixed, and then the colloid is cured by light, and the component is fixed by curing of the colloid. Furthermore, the light used to cure the colloid can be, but is not limited to, ultraviolet light.

於一實施例中,請一併參照第3圖及第8圖。光偵測模組34包 括光偵測元件340及透鏡單元342,透鏡單元342包括入射端3420、出射端3424及定位部3426,步驟S81包括下列步驟。首先,將光偵測元件340固定於基板30上。其次,將透鏡單元342的定位部3426設置於光波導模組38的上表面383。接著,將入射端3420對準出光部386。再來,將出射端3424對準光偵測元件340。此外,步驟S82包括將透鏡單元342的定位部3426固定於光波導模組38的上表面383的步驟。於另一實施例中,請一併參照第4圖及第8圖,光收發次組件製造方法更包括將電流電壓轉換器43固定於基板40上,並電性連接於光偵測模組44的步驟。於又一實施例中,光收發次組件製造方法更包括將光隔離器41固定於光源模組46與入光部484之間的基板40上,且光耦接於光源模組46及入光部484的步驟。於再一實施例中,請一併參照第7圖及第8圖,光收發次組件製造方法更包括將光連接模組72及基板與殼體75結合的步驟。其中,基板固定於殼體75內,且光連接模組72至少一部份露出殼體75。 In an embodiment, please refer to FIG. 3 and FIG. 8 together. Light detection module 34 package The light detecting component 340 and the lens unit 342 include an incident end 3420, an exit end 3424, and a positioning portion 3426. Step S81 includes the following steps. First, the photodetecting element 340 is fixed to the substrate 30. Next, the positioning portion 3426 of the lens unit 342 is disposed on the upper surface 383 of the optical waveguide module 38. Next, the incident end 3420 is aligned with the light exiting portion 386. Then, the exit end 3424 is aligned with the light detecting element 340. Further, step S82 includes the step of fixing the positioning portion 3426 of the lens unit 342 to the upper surface 383 of the optical waveguide module 38. In another embodiment, the method for manufacturing the optical transceiver sub-assembly further includes fixing the current-voltage converter 43 to the substrate 40 and electrically connecting to the light detecting module 44. Referring to FIG. 4 and FIG. A step of. In another embodiment, the optical transceiver sub-assembly manufacturing method further includes the optical isolator 41 being fixed on the substrate 40 between the light source module 46 and the light incident portion 484, and optically coupled to the light source module 46 and the light entering the light. Step 484. In still another embodiment, referring to FIG. 7 and FIG. 8 together, the optical transceiver sub-assembly manufacturing method further includes the step of combining the optical connection module 72 and the substrate with the housing 75. The substrate is fixed in the housing 75, and at least a portion of the optical connection module 72 is exposed to the housing 75.

舉例來說,光收發次組件可應用於並行單模四路(Parallel Single Mode 4 lane,PSM4)的技術,惟並不以應用於並行單模四路的技術為限。請復參照第1圖及第2圖,以便說明並行單模四路光收發次組件的運作。首先,關於光訊號接收,光連接模組12可從外部裝置接收到並行單模四路的第一光訊號,其中第一光訊號為單模四路的光訊號。接著,光連接模組12將單模四路的第一光訊號透過第一導光區域280的四個第一光通道2800傳送至光偵測模組14。再來,光偵測模組14依據第一光訊號產生相應的電性訊號,以利後續處理。至於光訊號發射的部分,係由光源模組16將電性訊號轉換為相應的並行單模四路第二光訊號。再透過第二導光區域282的四個第二光通道2820將第二光訊號傳送至光連接模組12,以便將第二光訊號發送至外部裝置。 For example, optical transceiver sub-components can be applied to parallel single-mode four-way (Parallel Single Mode 4 lane, PSM4) technology, but not limited to the technology applied to parallel single-mode four-way. Please refer to Figure 1 and Figure 2 for the operation of the parallel single-mode four-channel optical transceiver sub-assembly. First, regarding the optical signal receiving, the optical connection module 12 can receive the first optical signal of the parallel single mode four channels from the external device, wherein the first optical signal is a single mode four-way optical signal. Then, the optical connection module 12 transmits the first optical signal of the single mode to the optical detection module 14 through the four first optical channels 2800 of the first light guiding area 280. Then, the light detecting module 14 generates a corresponding electrical signal according to the first optical signal for subsequent processing. As for the part of the optical signal transmission, the light source module 16 converts the electrical signal into a corresponding parallel single mode four-way second optical signal. The second optical signal is transmitted to the optical connection module 12 through the four second optical channels 2820 of the second light guiding area 282 to send the second optical signal to the external device.

綜上所述,利用光波導元件取代多條光纖,以做為光收發次組 件中的光通道,不僅能讓光通道的輸入端間距與輸出端間距轉換更容易,亦簡化了光收發次組件的結構與光收發次組件的組裝流程。此外,藉由特別設計的 透鏡單元,利用光波導模組的上表面做為定位的參考平面,更可提高定位的準確度,並提升光收發次組件的組裝效率。再者,將光隔離器的磁性體及法拉第轉子以上下方式排列,可節省光隔離器所占的橫向空間,進而提供縮小產品尺寸的可能性。 In summary, the optical waveguide component is used to replace a plurality of optical fibers as an optical transceiver group. The optical channel in the device not only makes the input channel spacing and the output terminal pitch conversion of the optical channel easier, but also simplifies the structure of the optical transceiver sub-assembly and the assembly process of the optical transceiver sub-assembly. In addition, by special design The lens unit uses the upper surface of the optical waveguide module as a reference plane for positioning, thereby improving the accuracy of positioning and improving the assembly efficiency of the optical transceiver sub-assembly. Furthermore, by arranging the magnetic body of the optical isolator and the Faraday rotator in the above manner, the lateral space occupied by the optical isolator can be saved, thereby providing the possibility of downsizing the product.

雖然本發明的實施例揭露如上所述,然並非用以限定本發明,任何熟習相關技藝者,在不脫離本發明的精神和範圍內,舉凡依本發明申請範圍所述的形狀、構造、特徵及數量當可做些許的變更,因此本發明的專利保護範圍須視本說明書所附的申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, configurations, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

1‧‧‧光收發次組件 1‧‧‧Light Transceiver Subassembly

10‧‧‧基板 10‧‧‧Substrate

12‧‧‧光連接模組 12‧‧‧ optical connection module

14‧‧‧光偵測模組 14‧‧‧Light detection module

16‧‧‧光源模組 16‧‧‧Light source module

18‧‧‧光波導模組 18‧‧‧ Optical waveguide module

120‧‧‧第一連接埠 120‧‧‧First connection埠

122‧‧‧第二連接埠 122‧‧‧Second connection

180‧‧‧第一導光區域 180‧‧‧First light guiding area

182‧‧‧第二導光區域 182‧‧‧Second light guiding area

184‧‧‧入光部 184‧‧‧Into the Department of Light

186‧‧‧出光部 186‧‧‧Lighting Department

188‧‧‧傳輸部 188‧‧‧Transportation Department

Claims (14)

一種光收發次組件,包括:一光連接模組,用以連接一外部裝置,包括一第一連接埠及一第二連接埠,該第一連接埠傳遞該外部裝置的一第一光訊號;一光波導模組,包括一第一導光區域及一第二導光區域,且該光波導模組具有一入光部、一出光部與一傳輸部,該第一導光區域經由該傳輸部光耦接該第一連接埠,該第二導光區域經由該傳輸部光耦接該第二連接埠;一光偵測模組,經由該出光部光耦接該第一導光區域,該光偵測模組偵測經該第一導光區域的該第一光訊號,該光偵測模組包括一光偵測元件及一透鏡單元,該透鏡單元設置於該光偵測元件的上方,並鄰接於該出光部,該透鏡單元包括一入射端、一反射面及一出射端,該入射端對準該出光部,該出射端對準該光偵測元件,該反射面用以使從該入射端進入的該第一光訊號轉朝向該出射端,該光偵測元件用以偵測從該出射端射出的該第一光訊號,該透鏡單元更包括一定位部,該定位部設置於該光波導模組的一上表面;以及一光源模組,經由該入光部光耦接該第二導光區域,該光源模組發射一第二光訊號經該第二導光區域至該第二連接埠,該第二連接埠將該第二光訊號傳遞至該外部裝置。 An optical transceiver sub-assembly includes: an optical connection module for connecting an external device, comprising a first connection port and a second connection port, the first connection port transmitting a first optical signal of the external device; An optical waveguide module includes a first light guiding region and a second light guiding region, and the optical waveguide module has a light entering portion, a light emitting portion and a transmitting portion, and the first light guiding region is transmitted through the light guiding portion The light is coupled to the first port, and the second light guiding region is optically coupled to the second port via the transmitting portion; a light detecting module is optically coupled to the first light guiding region via the light emitting portion, The light detecting module includes the first light signal passing through the first light guiding region, the light detecting module includes a light detecting component and a lens unit, and the lens unit is disposed on the light detecting component Upper and adjacent to the light exiting portion, the lens unit includes an incident end, a reflecting surface and an emitting end, the incident end is aligned with the light exiting portion, and the emitting end is aligned with the light detecting component, and the reflective surface is used for Rotating the first optical signal entering from the incident end toward the exit end, The detecting component is configured to detect the first optical signal emitted from the emitting end, the lens unit further includes a positioning portion disposed on an upper surface of the optical waveguide module; and a light source module The light incident portion is optically coupled to the second light guide region, and the light source module transmits a second light signal to the second port through the second light guide region, and the second port transmits the second light signal To the external device. 如請求項1所述之光收發次組件,更包括一基板,其中該光波導模組、該光偵測模組以及該光源模組分別設置於該基板。 The optical transceiver sub-assembly of claim 1, further comprising a substrate, wherein the optical waveguide module, the optical detection module, and the light source module are respectively disposed on the substrate. 如請求項1所述之光收發次組件,其中該第一導光區域包括至少一第一光通道,每一該第一光通道包括一第一輸入端及一第一輸出端,該第一輸入端光耦接於該傳輸部,該第一輸出端光耦接於該出光部,該第二導光區域包括至少一第二光通道,每一該第二光通道包括一第二輸入端及一第二輸出端,該第二輸入端光耦接於該入光部,該第二輸出端光耦接於該傳輸部。 The optical transceiver sub-assembly of claim 1, wherein the first light guiding area comprises at least one first optical channel, each of the first optical channels comprising a first input end and a first output end, the first The input end is optically coupled to the transmitting portion, the first output end is optically coupled to the light exiting portion, the second light guiding region includes at least one second optical channel, and each of the second optical channels includes a second input end And a second output end, the second input end is optically coupled to the light incident portion, and the second output end is optically coupled to the transfer portion. 如請求項3所述之光收發次組件,其中相鄰的該第二輸入端之間間隔一第一距離,相鄰的該第二輸出端之間間隔一第二距離,該第一距離不等於該第二距離。 The optical transceiver sub-assembly of claim 3, wherein the adjacent second input ends are separated by a first distance, and the adjacent second output ends are separated by a second distance, the first distance is not Equal to the second distance. 如請求項2所述之光收發次組件,更包括一光隔離器,設置於該光源模組與該入光部之間的該基板上,且光耦接於該光源模組及該入光部,其中該光隔離器包括一第一磁性體、一第二磁性體及一法拉第轉子,該法拉第轉子設置於該第一磁性體與該第二磁性體之間,且該第二磁性體位於該法拉第轉子與該基板之間。 The optical transceiver sub-assembly of claim 2, further comprising an optical isolator disposed on the substrate between the light source module and the light incident portion, and optically coupled to the light source module and the light incident The optical isolator includes a first magnetic body, a second magnetic body and a Faraday rotator. The Faraday rotator is disposed between the first magnetic body and the second magnetic body, and the second magnetic body is located The Faraday rotor is between the substrate and the substrate. 如請求項1所述之光收發次組件,更包括一電流電壓轉換器,電性連接於該光偵測模組,用以將該光偵測模組產生的一電流訊號轉換為一電壓訊號。 The optical transceiver sub-assembly of claim 1 further includes a current-voltage converter electrically coupled to the optical detection module for converting a current signal generated by the optical detection module into a voltage signal . 如請求項1所述之光收發次組件,其中該光源模組包括一發光元件及一控 制單元,該發光元件發射該第二光訊號該控制單元電性連接且光耦接於該發光元件,用以依據該發光元件的一發光亮度控制該發光元件的一發射功率。 The optical transceiver secondary component of claim 1, wherein the light source module comprises a light emitting component and a control The illuminating unit emits the second optical signal. The control unit is electrically connected and optically coupled to the illuminating element for controlling a transmitting power of the illuminating element according to a illuminating brightness of the illuminating element. 如請求項1所述之光收發次組件,其中該第一連接埠包括至少一第一光纖,該第二連接埠包括至少一第二光纖、該至少一第一光纖及該至少一第二光纖光耦接該傳輸部。 The optical transceiver sub-assembly of claim 1, wherein the first port includes at least one first fiber, and the second port comprises at least one second fiber, the at least one first fiber, and the at least one second fiber The optical coupling is coupled to the transmission portion. 如請求項1所述之光收發次組件,更包括一殼體,其中,該光連接模組與該殼體連接,並至少一部份露出該殼體,該光偵測模組、該光源模組及該光波導模組設置於該殼體內。 The optical transceiver module of claim 1, further comprising a housing, wherein the optical connection module is coupled to the housing, and at least partially exposes the housing, the light detecting module, the light source The module and the optical waveguide module are disposed in the housing. 一種光收發次組件製造方法,包括:固定一光波導模組於一基板上,該光波導模組包括一第一導光區域及一第二導光區域,且該光波導模組具有一入光部、一出光部與一傳輸部,該傳輸部光耦接於一光連接模組的一第一連接埠及一第二連接埠;將一光偵測模組對準該出光部,該光偵測模組包括一光偵測元件及一透鏡單元;固定該光偵測模組;將一光源模組對準該入光部,包含:固定該光偵測元件於該基板上;將該透鏡單元的一定位部設置於該光波導模組的一上表面;將該透鏡單元的一入射端對準該出光部;以及 將該透鏡單元的一出射端對準該光偵測元件;以及固定該光源模組於該基板上。 An optical transceiver subassembly manufacturing method includes: fixing an optical waveguide module on a substrate, the optical waveguide module includes a first light guiding region and a second light guiding region, and the optical waveguide module has an input a light emitting portion, a light emitting portion and a transmitting portion, the transmitting portion is optically coupled to a first connecting port and a second connecting port of an optical connecting module; and a light detecting module is aligned with the light emitting portion, The light detecting module includes a light detecting component and a lens unit; the light detecting module is fixed; and the light source module is aligned with the light incident portion, comprising: fixing the light detecting component on the substrate; a positioning portion of the lens unit is disposed on an upper surface of the optical waveguide module; an incident end of the lens unit is aligned with the light exit portion; Aligning an exit end of the lens unit with the light detecting element; and fixing the light source module on the substrate. 如請求項10所述之光收發次組件製造方法,其中該固定該光偵測模組的步驟包括:將該定位部固定於該光波導模組的該上表面。 The optical transceiver module manufacturing method of claim 10, wherein the step of fixing the light detecting module comprises: fixing the positioning portion to the upper surface of the optical waveguide module. 如請求項10所述之光收發次組件製造方法,更包括固定一電流電壓轉換器於該基板上,並電性連接於該光偵測模組。 The optical transceiver sub-assembly manufacturing method of claim 10, further comprising: fixing a current-voltage converter on the substrate, and electrically connecting to the light detecting module. 如請求項10所述之光收發次組件製造方法,更包括固定一光隔離器於該光源模組與該入光部之間的該基板上,且光耦接於該光源模組及該入光部。 The optical transceiver module manufacturing method of claim 10, further comprising: fixing an optical isolator on the substrate between the light source module and the light incident portion, and optically coupling the light source module to the light source module Light department. 如請求項10所述之光收發次組件製造方法,更包括將該光連接模組及該基板與一殼體結合,其中該基板固定於該殼體內,且該光連接模組至少一部份露出該殼體。 The optical transceiver module manufacturing method of claim 10, further comprising combining the optical connection module and the substrate with a casing, wherein the substrate is fixed in the casing, and the optical connection module is at least a part The housing is exposed.
TW104111342A 2015-04-08 2015-04-08 Optical transceiver subassembly and manufacturing method thereof TWI588552B (en)

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Citations (3)

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Publication number Priority date Publication date Assignee Title
TW200423570A (en) * 2002-12-06 2004-11-01 Sony Corp Optical transceiver
US20130223848A1 (en) * 2011-08-31 2013-08-29 Sumitomo Electric Industries, Ltd. Optical transceiver, optical network unit, and optical transceiver control method
TWM484713U (en) * 2014-03-10 2014-08-21 Luxnet Corp Replaceable type light-emitting module and optical transceiver equipped with replaceable type light-emitting module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200423570A (en) * 2002-12-06 2004-11-01 Sony Corp Optical transceiver
US20130223848A1 (en) * 2011-08-31 2013-08-29 Sumitomo Electric Industries, Ltd. Optical transceiver, optical network unit, and optical transceiver control method
TWM484713U (en) * 2014-03-10 2014-08-21 Luxnet Corp Replaceable type light-emitting module and optical transceiver equipped with replaceable type light-emitting module

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