TWI578869B - Substrate bonding apparatus and substrate bonding method - Google Patents

Description

Substrate bonding device and substrate bonding method

The present invention relates to a substrate bonding apparatus for bonding a pair of substrates.

In an electronic device such as a smart phone or a personal digital assistant (PDA), a touch panel having a gesture operation by a user touching a display with a finger or a pen is widely used.

In the above electronic device, a laminated substrate body in which a touch panel sheet and a cover are laminated is formed on a display disposed on a surface of a casing.

As an example of the method of manufacturing the laminated substrate body, an adhesive is applied to the surface of the touch panel sheet placed on the mounting surface of the substrate bonding apparatus, and the cover plate held above is pressed and joined.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-150331

In most cases, a machine is placed on the side of the frame of the electronic device. In recent years, a physical button for operation has been proposed in which a highly flexible organic electroluminescence (EL) display is used to extend the display not only on the surface of the casing but also on the side of the casing. Some can also perform gesture operations on the touch panel.

Therefore, the laminated substrate body must also be configured such that the both ends are bent or bent and raised to have a concave shape, and the display is covered from the surface to the side surface.

In order to manufacture a laminated substrate body having a concave shape, first, both ends of a glass or resin substrate which is a cover plate are bent or bent to be formed into a concave shape. Next, it is necessary to laminate the flexible touch panel sheet so as to be in close contact with the concave surface of the cover.

As a method of the lamination processing, for example, the mounting surface of the substrate bonding apparatus is a convex surface that is fitted to the concave surface of the cover, and the touch panel sheet coated with the adhesive is deflected along the convex surface. And keep it. Then, it is pressed into the concave surface of the cover to join the two.

However, in the case of such a manufacturing method, when the touch panel sheet is pressed into the concave surface of the cover, the touch panel sheet coated with the adhesive rubs the cover in a surface contact manner. A bent or bent standing portion at both ends is pressed into it.

By the surface contact, the adhesive is scraped off, so that there is a possibility that the cover and the touch panel sheet are not properly joined, or a part of the adhesive is spilled outward to cause a defective product.

Moreover, there are cases where the two ends of the cover are bent or bent Manufacturing errors occur in the degree of bending or the degree of bending of the rising portion. In this case, the mounting surface of the substrate bonding apparatus may not conform to the shape of the convex surface of the concave surface of the cover plate, and it may be difficult to make the two adhere to each other.

The present invention has been made in order to solve the problems as described above. That is, an object of the present invention is to provide a substrate bonding apparatus capable of bonding a concave substrate having a concave surface and a flexible thin substrate to each other with high precision through an adhesive.

The present invention relates to a substrate bonding apparatus which laminates a concave substrate having a concave surface and a flexible thin substrate via an adhesive, wherein the substrate bonding apparatus includes a pressing unit, and the pushing The pressing unit presses the thin substrate against the concave surface of the concave substrate, and the pressing unit includes a pressing portion that presses the thin substrate against a concave surface of the concave substrate, and a displacement portion that is located beside the pressing portion. Further, the thin substrate is placed in the concave surface of the concave substrate by pressing the thin substrate on the concave substrate by the pressing portion, and the thin substrate is pressed against the concave surface.

The pressing portion may be a central block, and the displacement portion is a separation block that is close to and away from the central block, and the pressing unit brings the separation block close to the central block until the central block And the separation block is smaller than the concave surface, and enters the concave space together with the thin substrate, and moves the separation block in the concave space toward the side of the concave substrate. The thin substrate is opened in the same manner as the concave surface.

The separation block may have a pressing curved surface on the side of the side portion, and the pushing The pressed curved surface has substantially the same shape as the concave portion of the side edge portion of the concave substrate.

At least a portion of the displacement portion may also include an elastic member.

The pressing unit may further include a guiding unit, wherein the guiding unit bends the thin substrate in a shape similar to an overall shape when the separation block is close to the central block, and the separation block is formed in the bending shape. Thereafter, it moves in the direction of the side portion of the concave substrate.

The guide unit may include a hook portion that is externally biased by being stuck to a side end portion of the thin substrate, thereby performing the above-described bending forming of the thin substrate.

The separation block may be moved from a position outside the position abutting on the side edge portion of the concave substrate via the thin substrate during the bending process by the hook portion. To the position close to the above central block.

The hook portion may also pass through the side end portion of the thin substrate which is not subjected to an external force, and move along the outer shape of the separation block.

The hook portion may also move on a straight line that passes through a side end of the thin substrate that is not subjected to an external force and that passes through the shape of the separation block along the central block. The side end of the thin substrate after the bending is formed.

The substrate bonding apparatus may further include a suction unit, and the suction unit may be bent and shaped according to the overall shape of the central block and the separation block. The thin substrate is adsorbed to the separation block.

The substrate bonding apparatus may include a curing treatment unit, and the curing treatment unit applies the adhesive to at least one of the concave substrate and the thin substrate, and the thin substrate is bonded to the thin substrate. The concave substrate is temporarily hardened at least one period before and after bonding.

The substrate bonding apparatus may further include a curing treatment portion, and the curing treatment portion applies the adhesive applied to at least one of the concave substrate and the thin substrate before bonding of the side portions and At least one period after the bonding of the side portions is temporarily cured.

The pressing unit may have a support portion that supports the displacement portion, and the displacement portion may be displaced toward the side portion of the concave substrate while the other end is in contact with the thin substrate, thereby patterning the thin substrate The concave portion is crimped, and the support portion supports the other end of the displacement portion as a fulcrum of displacement.

One end of the displacement portion may maintain the pressure contact between the thin substrate and the concave substrate, and the distance between the fulcrum and the fulcrum may be variable.

Further, the embodiment adopted as the method of the above embodiment is also an embodiment of the present invention.

According to the invention, when the thin substrate is pressed into the concave space of the concave substrate, the thin substrate and the side portions of the concave substrate are not in surface contact and friction occurs. Therefore, it is possible to suppress that the erroneous portions are adhered to each other, the thin substrate is wrinkled, and the unbonded portion is formed between the thin substrate and the concave substrate. Moreover, because the thin substrate does not have one side Since the side portion of the concave substrate is rubbed in the surface while being pressed, the adhesive can be prevented from flowing out to the outside, and the adhesion can be prevented from being lowered, the design property can be lowered, and the short-circuiting via the adhesive can be prevented.

1‧‧‧Substrate bonding device

3‧‧‧ Keeping Department

4‧‧‧Pushing mechanism

5‧‧‧Hooks

5a‧‧‧Flange

9‧‧‧vacuum chamber

15‧‧‧Guiding agency

15a‧‧‧Guide members

20‧‧‧ concave substrate

20a‧‧‧ concave

20b‧‧‧Sideside

20c‧‧‧ concave space

21‧‧‧Thin substrate

21b‧‧‧ Side

41‧‧‧Central block

42‧‧‧Separate blocks

42a‧‧‧Pushing surface

42b, 50‧‧‧ Hardening Department

42c‧‧‧Sucking Department

44‧‧‧ platform

45‧‧‧ Track

46‧‧‧Slide table

47a‧‧‧Rotary machine

47b‧‧‧Rolling screw

48‧‧‧Rotary axis

49‧‧‧Rotary machine

141‧‧‧ Pressing Department

142‧‧‧ Displacement Department

142a‧‧‧roll

142b‧‧‧Axis support

142c‧‧‧ brush

142x, 142y, 142z‧‧‧ edge

143‧‧‧Support Department

143a‧‧‧Axis

143b‧‧‧Base Department

A‧‧‧1st position

B‧‧‧2nd position

C‧‧‧3rd position

R‧‧‧Adhesive

1(a) to 1(c) are schematic views showing various substrates after bonding.

FIG. 2 is a configuration diagram of a substrate bonding apparatus according to the first embodiment.

3(a) to 3(c) are configuration diagrams of a pressing mechanism provided in the substrate bonding apparatus of the first embodiment.

4 is an enlarged view showing a side portion of the concave substrate of the second embodiment.

(a) and (b) of FIG. 5 are views showing a pressing form of a separation block of the substrate bonding apparatus of the second embodiment.

Fig. 6 is a perspective view of a pressing mechanism according to a third embodiment.

7(a) to 7(h) are state transition diagrams showing the movement in the vicinity of the pressing curved surface of the third embodiment.

8(a) and 8(b) are state transition diagrams showing the operation of the hook portion of the fourth embodiment.

Fig. 9 is an enlarged view of a separation block of the substrate bonding apparatus of the fifth embodiment.

Fig. 10 is an enlarged view of a separation block of the substrate bonding apparatus of the sixth embodiment.

FIG. 11 is a configuration diagram of a pressing mechanism provided in the substrate bonding apparatus of the seventh embodiment.

12(A) to 12(D) show the substrate bonding apparatus of the seventh embodiment. A diagram of the fit step.

FIG. 13 is a configuration diagram of a pressing mechanism provided in the substrate bonding apparatus of the eighth embodiment.

14(A) to 14(D) are views showing a bonding step of the substrate bonding apparatus of the eighth embodiment.

Fig. 15 is a configuration diagram of a pressing mechanism provided in the substrate bonding apparatus of the ninth embodiment.

16(A) to 16(D) are views showing a bonding step of the substrate bonding apparatus of the ninth embodiment.

17(A) to 17(F) are views showing a bonding step of the substrate bonding apparatus of the tenth embodiment.

18(A) to 18(E) are views showing a bonding step of the substrate bonding apparatus of the eleventh embodiment.

19(A) and 19(B) are views showing the configuration of a pressing mechanism provided in the substrate bonding apparatus of the twelfth embodiment.

20(A) and 20(B) are configuration diagrams of a pressing mechanism provided in the substrate bonding apparatus of the twelfth embodiment.

21(A) to 21(D) are views showing a bonding step of a substrate bonding apparatus according to another embodiment.

Hereinafter, embodiments of the substrate bonding apparatus of the present invention will be described in detail with reference to the drawings.

(substrate)

A substrate to be bonded in advance by the substrate bonding apparatus of the present invention will be described. 1(a) to 1(c) are schematic views showing cross sections of various substrates after bonding. In the substrate bonding apparatus 1 of the present invention, the thin substrate 21 is bonded to the concave surface 20a of the concave substrate 20 by using the adhesive R.

The thin substrate 21 is a variety of films such as a touch panel, a decorative film, or an organic electroluminescence (EL) display or a liquid crystal display. On the other hand, the concave substrate 20 is a protective panel for protecting the thin substrate 21 from glass or acryl. For example, for the purpose of protecting the thin substrate 21, the entire surface of the thin substrate 21 is adhered to the concave substrate 20 by the adhesive R so that the entire surface of the thin substrate 21 is covered by the concave substrate 20.

The thin substrate 21 is a thin substrate having flexibility. In order to attach the thin substrate 21 to the concave surface 20a of the concave substrate 20, it is sufficient that the thin substrate 21 has flexibility to the extent that the concave surface 20a is bent and deformed.

The concave substrate 20 is a substrate having a concave surface 20a. The concave surface 20a is formed by at least the side portion 20b of the concave substrate 20 rising from the curved portion or the bent portion. That is, the substrate on which the concave surface 20a is formed on the surface of the substrate by bending or bending is the concave substrate 20.

The central region other than the side portion 20b of the concave substrate 20 may be flat or may be curved in connection with the side portion 20b. Further, the concave substrate 20 may be entirely lifted up, or the back surface opposite to the concave surface 20a may have a shape that is not related to the concave surface 20a, and is, for example, a flat surface. Moreover, the pair of side portions 20b facing each other may stand up, or Either the side portions 20b stand up, and the three side portions 20b can also stand up. It is also possible to stand upright for each of the two sets of side portions 20b that face each other so as to surround the center from the four sides.

Specifically, the concave substrate 20 includes a substantially tile shape as shown in FIG. 1( a ) or a substantially circular arc shape, and the side portion 20 b as shown in FIG. 1( b ) has a bent portion rising at a right angle. Approximate The font shape and the side portion 20b shown in Fig. 1(c) are substantially U-shaped by the curved portion.

Hereinafter, the term "side portion 20b" refers to the side portion 20b that rises to form the concave surface 20a. Further, a space surrounded by a plane including both ends of the side portion 20b and the concave surface 20a is referred to as a concave space 20c formed by the concave surface 20a.

The adhesive R is not particularly limited as long as it is cured by external energy, and is, for example, a thermosetting resin, a photocurable resin, a radiation curable resin, or other resins which are cured by receiving electromagnetic waves, or hardened by drying. Resin.

(First embodiment)

The substrate bonding apparatus 1 of the first embodiment will be described with reference to the drawings. FIG. 2 is a configuration diagram of the substrate bonding apparatus 1 of the first embodiment. (a) to (c) of FIG. 3 are configuration diagrams of the pressing mechanism 4 (pressing means) provided in the substrate bonding apparatus 1 of the first embodiment.

(constitution)

As shown in FIG. 2, in the substrate bonding apparatus 1, the holding portion 3 and the pressing mechanism 4 (pressing unit) are opposed to each other in a vacuum chamber 9 connected to a vacuum source (not shown). The holding portion 3 and the pressing mechanism 4 are relatively close to each other. For example, including an actuator, the actuator Both or one of the holding portion 3 and the pressing mechanism 4 is moved to approach or deviate toward the other side.

The holding portion 3 holds the concave substrate 20 by an electrostatic chuck, a mechanical chuck, a vacuum chuck, an adhesive chuck, or other various chuck mechanisms. The pressing mechanism 4 presses the thin substrate 21 into the concave space 20c while holding the thin substrate 21 by any one of the same various suction mechanism, and the thin substrate 21 is patterned along the concave substrate 20. The concave surface 20a is bent and deformed while being opened on the concave surface 20a.

As shown in FIGS. 3(a) to 3(c), the pressing mechanism 4 can be continuously deformed into two types. As shown in FIG. 3(a), the first embodiment of the pressing mechanism 4 is a reduced body that is contracted to be smaller than the concave space 20c formed by the concave surface 20a. As shown in FIG. 3(c), the second embodiment of the pressing mechanism 4 is an expanded body that is enlarged in accordance with the concave surface 20a.

By the pressing mechanism 4, the pressing mechanism 4 is not in contact with the concave surface 20a, is wound into the thin substrate 21, and enters the concave space 20c, and is thinned during the transition to the shape of the expanded body. The substrate 21 is opened and bent while being curved outward from the center of the substrate toward the outside, and the entire surface of the thin substrate 21 is adhered to the concave substrate 20 via the adhesive R.

The pressing mechanism 4 includes a central block 41 and a separation block 42. The separation block 42 is arranged beside the center block 41 so as to face the side edge portion 20b of the concave substrate 20. In the case of the side portion 20b rising from one of the four sides of the concave substrate 20, one separation block 42 is disposed so as to face the side portion 20b, and is erected on the opposite sides of the four sides. In the case of the side portion 20b, the separation block is disposed on both sides of the center block 41 so as to face the side portions 20b. 42. In the case of the side portions 20b that are all raised on all four sides, a total of four separation blocks 42 are arranged on the four sides of the center block 41.

The center block 41 presses the central region of the thin substrate 21 to the central region of the concave substrate 20. That is, the central block 41 is a substantially rectangular parallelepiped having an upper surface that follows the surface shape of the central region of the concave surface 20a. The substantially rectangular parallelepiped means that if the central portion of the concave surface 20a is curved, the upper surface is embossed in accordance with this, and if the central portion of the concave surface 20a is flat, the upper surface is flattened as it is.

The separation block 42 opens the thin substrate 21 in accordance with the concave surface 20a of the concave substrate 20. Further, the separation block 42 closes the thin substrate 21 to the side portion 20b of the concave substrate 20 without a gap. Therefore, the separation block 42 as a whole has a substantially rectangular parallelepiped shape, but the pressing curved surface 42a facing the side edge portion 20b of the concave substrate 20 is substantially corresponding to the curved or bent surface shape of the side edge portion 20b. The same shape. For example, when the side portion 20b is raised by the curved portion, the pressing curved surface 42a has a curvature in consideration of the curvature of the curved portion, the thickness of the thin substrate 21, and the thickness of the applied adhesive R. Round object.

Further, the center block 41 does not move in the direction of the side portion 20b of the concave substrate 20, but can move only in the direction of the concave substrate 20. On the other hand, the separation block 42 can move not only in the direction toward the concave substrate 20 but also outwardly away from the central block 41. Specifically, the first position A near the center block 41 and the thin substrate 21 as shown in FIG. 3( c ) are abutted as shown in FIGS. 3( a ) and 3 ( b ). The second position B of the side portion 20b of the concave substrate 20 is horizontally moved.

When the separation block 42 is located at the first position A, the entire opposing area of the central block 41 and the separation block 42 is contracted smaller than the concave space 20c of the concave substrate 20, and becomes a reduced body. The entire opposing area refers to the area of the central block 41 that faces the concave surface 20a and the area of the separation block 42 that faces the concave surface 20a. That is, the total width of the separation blocks 42 on both sides and the width of the central block 41 are smaller than the concave width of the concave substrate 20.

Further, when the separation block 42 is located at the second position B, the entire opposing region formed by the central block 41 and the separation block 42 is expanded to the concave surface 20a of the concave substrate 20 to be in the form of an expanded body. That is, the separation block 42 is subtracted from the concave width of the concave substrate 20 by the total amount of the width of the separation block 42 on both sides and the width of the central block 41, from the first position A to the second position B. mobile.

(effect)

The substrate bonding apparatus 1 first serves as a first step. As shown in FIG. 3(a), the separation block 42 moves closer to the center block 41 by moving to the first position A. That is, in the first step, the separation block 42 and the center block 41 are deformed into the shape of the reduced body.

Further, the concave portion 20 is provided in the holding portion 3, and the thin substrate 21 is placed on the upper surface of the central block 41 and the separation blocks 42 on both sides. At this time, the concave substrate 20 and the thin substrate 21 face each other in the vacuum chamber 9. The concave substrate 20 is provided so that the concave surface 20a faces the thin substrate 21. The adhesive R is applied to the concave substrate 20, the thin substrate 21, or the opposing faces of the both.

Next, as a second step, as shown in FIG. 3(b), the holding portion 3 is relatively close to the reduced body. When the reduced body enters into the concave space 20c, the thin base The plate 21 is also pressed into the concave space 20c. At this time, the reduced body is smaller than the concave space 20c. Therefore, the thin substrate 21 and the side portion 20b of the concave substrate 20 are still in point contact, but no surface contact is made. Since the surface contact is not performed, the thin substrate 21 is not pressed into the side portion 20b of the concave substrate 20 while rubbing the surface.

The relative approach of the holding portion 3 to the reduced body continues until the central region of the thin substrate 21 is pressed to the central region of the concave substrate 20. For example, the pressing can be sensed by providing a torque sensor or the like on the actuator.

As a third step, as shown in FIG. 3(c), the separation block 42 is moved to the second position B so as to face away from the center block 41. Then, the entire opposing region formed by the central block 41 and the separation block 42 is enlarged to follow the concave surface 20a of the concave substrate 20, thereby conforming to the concave shape and size of the concave substrate 20. Further, it is slightly smaller in size, which is actually equivalent to the amount between the thin substrate 21 and the adhesive R.

At this time, the thin substrate 21 is moved along with the concave surface 20a of the concave substrate 20 from the central portion toward the end portion with the horizontal movement of the separation block 42. The separation block 42 has an outer shape in which the pressing curved surface 42a conforms to the surface shape of the side portion 20b. Therefore, the thin substrate 21 and the concave substrate 20 are in close contact with each other over the entire area. Further, since the centers are closely contacted from the center toward the end portions, no space is formed between the concave substrate 20 and the thin substrate 21.

(effect)

As described above, the pressing mechanism 4 included in the substrate bonding apparatus 1 of the present embodiment includes the center block 41 and the separation block 42. The separation block 42 is located at the central block 41 Next to it, it can be close to and deviate from the central block 41. Further, the separation block 42 is brought close to the central block 41 until the shape of the central block 41 and the separation block 42 is contracted smaller than the concave space 20c of the concave substrate 20, and enters the concave surface together with the thin substrate 21. Within the space 20c. Next, the thin substrate 21 is opened in the concave surface 20a by moving the separation block 42 in the concave space 20c in the direction of the rising side portion 20b of the concave substrate 20.

According to the pressing mechanism 4, when the thin substrate 21 is press-fitted into the concave space 20c of the concave substrate 20, the thin substrate 21 and the side portion 20b of the concave substrate 20 are rubbed without coming into surface contact. Therefore, it is possible to prevent the erroneous portions from sticking to each other, the wrinkles of the thin substrate 21, and the non-adhered portions between the thin substrate 21 and the concave substrate 20. Further, since the thin substrate 21 is not pressed into the side portion 20b of the concave substrate 20 while rubbing the surface thereof, the adhesive R can be prevented from flowing out to the outside, and the adhesion can be prevented from being lowered and designed. Reduction in properties, short circuit through the adhesive R, and the like.

Further, the thin substrate 21 is pressed to the concave surface 20a of the concave substrate 20 from the central portion toward the end portion in accordance with the horizontal movement of the separation block 42. Therefore, wrinkles can be further suppressed from occurring in the thin substrate 21, and an unadhered portion between the thin substrate 21 and the concave substrate 20 can be prevented.

Further, the separation block 42 has a pressing curved surface 42a on the side of the rising side portion 20b of the concave substrate 20, and the pressing curved surface 42a has substantially the same shape as the concave surface 20a of the side portion 20b. Therefore, even in the case of the concave substrate 20, the thin substrate 21 can be adhered to the entire region. Therefore, even when the thin substrate 21 is bonded to the concave substrate 20, a high-quality laminate can be produced.

(Second embodiment)

(constitution)

FIG. 4 is an enlarged view showing a side portion 20b of the concave substrate 20. As shown in FIG. 4, the side portion 20b of the concave substrate 20 sometimes causes manufacturing errors in the degree of bending or the degree of bending. In this case, the shape of the pressing curved surface 42a of the separation block 42 does not match the shape of the side portion 20b of the concave substrate 20, and it may be difficult to closely contact the thin substrate 21 with the concave surface 2 of the concave substrate 2 (0).

Therefore, the substrate bonding apparatus 1 of the second embodiment includes the separation block 42 including the elastic member as shown in FIGS. 5(a) and 5(b). The portion of the elastic member as the material may be only the pressing curved surface 42a that is in close contact with the side edge portion 20b of the concave substrate 20, or may be entirely used as the elastic member for the simple manufacture of the separation block 42.

The elastic member is a member that is elastically deformed at the time of pressing and has substantially the same shape as the side portion 20b, and is restored to the original shape by pressing, and a sheet or a block of natural rubber having an elastic force is exemplified. A sheet or a block of a synthetic rubber such as a diene, a nitrile or a chloroprene, and a sheet or a block of fibers such as a polyurethane, and a brush obtained by bundling the fibers. The elastic members to be described later are also the same.

(Effect)

FIGS. 5(a) and 5(b) are views showing a pressing form of the separation block 42 when at least the pressing curved surface 42a is composed of an elastic member. As shown in Fig. 5 (a) and Fig. 5 (b), even if an error occurs in the shape of the side portion 20b of the concave substrate 20, the pressing curved surface 42a can absorb the error to follow the shape of the side portion 20b. And deformation. Therefore, the entire area of the thin substrate 21 can be pressed to the concave substrate 20, which is thin The substrate 21 is bent and deformed with high precision in accordance with the concave surface 20a, thereby achieving adhesion between the thin substrate 21 and the concave substrate 20.

Therefore, even if there is a manufacturing error in the concave substrate 20, a high-quality laminate can be produced.

(Third embodiment)

FIG. 6 is a perspective view showing the pressing mechanism 4 in the substrate bonding apparatus 1 of the third embodiment. The same components and the same functions as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

(constitution)

In the substrate bonding apparatus 1 of the third embodiment, the thin substrate 21 is bent and formed before the thin substrate 21 is pressed into the concave space 20c of the concave substrate 20, whereby the separation block 42 is wound so that the separation block 42 is close to the central block. 41 is a reduced body. In the substrate bonding apparatus 1, as shown in FIG. 6, the center block 41 and the separation block 42 are provided so as to extend the long sides in the same direction on the same stage 44. The central block 41 is fixed to the platform 44.

Moreover, a rail 45 is placed on the platform 44. The separation block 42 is fixed to a slide table 46 that slides on the rail 45. The track 45 extends in a direction transverse to the long side of the separation block 42. That is, the center block 41 and the separation block 42 obtain the form of the reduced body and the expanded body by sliding or sliding on the rail 45 with respect to the center block 41.

The drive unit that moves the separation block 42 is a rotating machine 47a such as a servo motor or a stepping motor, and a ball screw 47b connected to the rotating machine 47a. The ball screw 47b is extended in parallel with the rail 45, and each separation block 42 is placed. Each of the slide tables 46 is fitted to the ball screw 47b. The thread grooves corresponding to the respective slide tables 46 are bored in opposite directions from each other.

According to the ball screw 47b, when the screw shaft is rotated in one direction, the slide tables 46 move in opposite directions. That is, the separation blocks 42 on both sides move toward and away from the center block 41, respectively.

The detailed configuration of the pressing mechanism 4 up to this point is also the same as that of the substrate bonding apparatus 1 of the first embodiment. In the third embodiment, the hook portion 5 is further provided on the outer side of each of the separation blocks 42. The hook portion 5 is a guiding unit that shapes the thin substrate 21 in advance in a shape in which the center block 41 and the separation block 42 when the separation block 42 is located at the first position A.

The hook portion 5 has a plate shape of substantially the same length as the separation block 42, and is mounted along the separation block 42. The hook portion 5 has a flange 5a bent toward the center of both ends of the separation block 42 at both ends, and is axially supported at the flange 5a by a rotation shaft 48 that penetrates the shaft of the separation block 42. The rotary shaft 48 is connected to a rotary machine 49 such as a servo motor or a stepping motor. Each of the rotating shafts 48 and each of the rotating machines 49 is fixed to each of the sliding tables 46, and the hook portions 5 are movable along the pressing curved surface 42a of the separating block 42.

(effect)

The operation of the substrate bonding apparatus 1 will be described with reference to FIGS. 7(a) to 7(h). (a) to (h) of FIG. 7 are state transitions showing the movement in the vicinity of the pressing curved surface 42a in the substrate bonding apparatus 1 of the third embodiment.

First, as shown in FIG. 7(a), the separation block 42 is moved to the third position C. The third position C is more external than the second position B, and is not subjected to external force. When the flat thin substrate 21 is placed on the upper surface of the pressing mechanism 4, it is slightly suspended at a position to the pressing curved surface 42a of the separation block 42.

Further, in a state where the separation block 42 is moved to the third position C, the thin substrate 21 not subjected to the external force is placed on the upper surface of the pressing mechanism 4, and as shown in FIG. 7(b), the hook shape is made. The portion 5 is moved above the separation block 42 so as to be caught at the side end portion of the thin substrate 21. In other words, the extent to which the end portion of the thin substrate 21 slightly protrudes toward the pressing curved surface 42a means that the hook portion 5 is caught at the side end portion of the thin substrate 21 to obtain an external force. At this time, the adhesive R is preferably applied to the inner side from the outer edge of the thin substrate 21 a little, and the hook portion 5 is not in contact with each other.

When the hook portion 5 is caught, as shown in FIG. 7(c), the separation block 42 is pulled back (retracted) toward the first position A, and the hook portion 5 is pressed along the curved surface 42a. Rotate down. The hook portion 5 and the separation block 42 have a fixed relationship with the same slide table 46, so that the distance between the hook portion 5 and the pressing curved surface 42a does not change. At this time, slack deflection occurs on the thin substrate 21 each time the separation block 42 retreats. Further, the thin substrate 21 is wound around the pressing curved surface 42a of the separation block 42 in such a manner that the slack is corrected every time the hook portion 5 is rotated.

The retreat of the separation block 42 and the rotation of the hook portion 5 are continued. If the separation block 42 reaches the first position A, as shown in Fig. 7(d), the thin substrate 21 is wrapped around the upper surface of the reduced body. . In a state in which the thin substrate 21 is wound around the upper surface of the reduced body, the shape and size of the thin substrate 21 are smaller than the concave surface 20a of the concave substrate 20.

Therefore, as shown in FIG. 7(e), even if the thin substrate 21 is pressed into the concave In the surface space 20c, the side portion 20b of the concave substrate 20 is not in contact with the thin substrate 21. The press-fitting of the thin substrate 21 into the concave space 20c continues until the central region of the thin substrate 21 is pressed to the central region of the concave substrate 20.

When the press-fitting of the thin substrate 21 into the concave space 20c is completed, as shown in FIG. 7(f), the hook portion 5 is maintained at the rotation end position, and the separation block 42 is moved to the second position B, as shown in FIG. As shown in 7 (g), the entire thin substrate 21 is adhered to the concave substrate 20. In this manner, the thin substrate 21 and the side portion 20b of the concave substrate 20 are first contacted when the separation block 42 is moved to the second position B.

Further, it is preferable that the hook portion 5 continues to be engaged with the thin substrate 21 until the thin substrate 21 is in close contact with the side portion 20b of the concave substrate 20, or as shown in FIG. 7(h) until thin. Before the substrate 21 and the side portion 20b of the concave substrate 20 are in close contact with each other.

(effect)

As described above, the pressing mechanism 4 further includes a guiding unit that preliminarily bends the thin substrate 21 in accordance with the shape of the central block 41 and the separation block 42 when the separation block 42 is located at the first position A. After the bending of the drive unit, the separation block 42 is moved to the second position B.

Thereby, since the thin substrate 21 is smaller than the concave space 20c of the concave substrate 20, when the thin substrate 21 is pressed into the concave space 20c of the concave substrate 20, the thin substrate 21 and the concave substrate 20 are The side portion 20b does not make contact. Therefore, compared with the first embodiment, it is possible to further suppress wrinkles of the thin substrate 21 caused by the adhesion of the adhesive portion R due to the erroneous portion, and between the thin substrate 21 and the concave substrate 20 Produce unbonded parts.

Further, since the thin substrate 21 is not pressed into the side portion 20b of the concave substrate 20 while rubbing the surface thereof, the flow of the adhesive R to the outside can be further prevented, and the adhesion can be further prevented. Reduction, design degradation, short circuit via adhesive R, and the like.

Further, the guide unit is a hook portion 5 that is externally biased by being stuck to the side end portion of the thin substrate 21 to bend the thin substrate 21 in advance. Therefore, even when the adhesive R is applied onto the thin substrate 21, the contact of the adhesive R for bending forming on the coated surface can be minimized, and the bonding can be suppressed. The previous adhesive force is lowered or the unevenness of the adhesive R is generated.

Further, during the bending process by the hook portion 5, the drive unit moves the separation block 42 from the third position C outside the second position B to the first position A through the second position B. Thereby, the thin substrate 21 is wound around the pressing curved surface 42a of the separation block 42 so as to be flexibly bent by the hook portion 5 while being flexed while being flexed.

Therefore, even in the case where only the side end portions of the thin substrate 21 are grasped by the hook portion 5, the thin substrate 21 is not greatly bent in the wrong direction during bending, or is loosely wrapped around The block 42 is separated so that it can be easily bent and formed. Therefore, the thin substrate 21 can be made smaller than the concave space 20c with high precision, and the thin substrate 21 can be closely adhered to the concave surface 20a of the concave substrate 20 with high precision at the time of opening by the separation block 42, thereby Quality is improved.

(Fourth embodiment)

(a) and (b) of FIG. 8 are state transition diagrams showing the operation of the hook portion 5 in the substrate bonding apparatus 1 of the fourth embodiment. As shown in FIGS. 8(a) and 8(b), the hook portion 5 can be engaged with the side end of the thin substrate 21 in addition to the rotational movement along the outer shape of the separation block 42. Move in a straight line.

In other words, as shown in Figs. 8(a) and 8(b), the hook portion 5 of the fourth embodiment moves on a straight line which passes through the side end of the thin substrate 21 which is not subjected to an external force. The portion and the side end portion of the thin substrate 21 which is bent and formed along the outer shape of the separation block 42 located at the first position A.

According to the movement form of the hook portion 5, since only the side end portion of the thin substrate 21 is grasped, even when the adhesive R is applied to the thin substrate 21, it can be bent. The contact of the formed adhesive to the coated surface is minimized, so that the decrease in the adhesive force before the bonding or the unevenness of the adhesive R can be suppressed.

(Fifth Embodiment)

(constitution)

Fig. 9 is an enlarged view of a separation block 42 of the substrate bonding apparatus 1 of the fifth embodiment. The separation block 42 includes a hardening treatment portion 42b that radiates energy for hardening the adhesive R.

The hardening treatment portion 42b is for preventing the sagging of the adhesive R, preventing the unevenness of the adhesive R caused by the contact between the thin substrate 21 and the concave substrate 20, or maintaining the curved shape. The shape of the thin substrate 21 is combined to temporarily cure the adhesive R applied to the thin substrate 21. Temporary hardening refers to a state in which the state of complete hardening is not reached.

In order to maintain the shape of the curved thinned substrate 21, the hardened portion 42b is housed inside the separation block 42 and radiates energy to the pressing curved surface 42a. The hardening treatment unit 42b is an infrared lamp when the adhesive R is a thermosetting resin, and an ultraviolet (UV) lamp when the adhesive R is an ultraviolet curable resin.

In order to make the adhesive R temporarily hardened, it is sufficient that the adhesive R emits energy in an amount that is not completely cured. Further, in the case of the ultraviolet curable resin, even if strict radiation energy management in an oxygen-containing atmosphere such as the atmosphere is not performed, it is possible to be in a temporarily hardened state by the oxygen suppression effect of the curing. In this case, only the inside of the adhesive R is hardened, and the viscosity of the surface is maintained, so that undesired flow of the adhesive R can be suppressed, and adhesion can be ensured.

(effect)

As shown in FIG. 9, the adhesive R is applied to the thin substrate 21 in advance, and the thin substrate 21 is bent and formed so as to be wrapped around the central block 41 and the separation block 42. Then, before the thin substrate 21 is pressed against the concave substrate 20, the adhesive R is temporarily cured by the hardening treatment portion 42b. In particular, the adhesive R applied to the region adjacent to the pressing curved surface 42a, that is, the portion where the adhesive R having a large curved surface and the coating is likely to flow and concentrated on the edge of the thin substrate 21 is used. The adhesive R is temporarily hardened.

Further, by temporarily hardening and maintaining the shape of the center block 41 and the separation block 42 in a curved shape, the thin substrate 21 is pressed into the concave space 20c of the concave substrate 20, and the separation block 42 is oriented. The second position B moves, thereby making The thin substrate 21 is gradually elongated in accordance with the concave surface 20a.

(effect)

As described above, the substrate bonding apparatus 1 of the fifth embodiment further includes a curing treatment portion 42b that temporarily cures the adhesive R applied to the side portion of the thin substrate 21, thereby illuminating the center block 41. The thin substrate 21 bent and formed in the shape of the separation block 42 is temporarily hardened.

Thereby, the flow of the adhesive R can be suppressed before the entire region of the thin substrate 21 is adhered to the concave substrate 20 by using the separation block 42. Therefore, it is possible to prevent the erroneous portions from sticking to each other, the wrinkles of the thin substrate 21, and the non-adhered portions between the thin substrate 21 and the concave substrate 20.

Further, since the adhesive R does not move to the edge of the thin substrate 21 before the adhesion, it is possible to prevent overflow after adhesion or uneven thickness of adhesion, reduction in adhesion, design, and adhesion via the adhesive R. Short circuit, etc. Furthermore, after bonding by the substrate bonding apparatus 1, it is possible to maintain a thin shape that is bonded in a curved shape until the next step of curing the adhesive R from the substrate bonding apparatus 1 is completed. The shape of the substrate 21 does not peel off.

(Sixth embodiment)

Fig. 10 is an enlarged view of a separation block 42 of the substrate bonding apparatus 1 of the sixth embodiment. In the sixth embodiment, the suction portion 42c is included in order to maintain the shape of the curved thin substrate 21 until it is bonded. The suction portion 42c is a suction pipe connected to the negative pressure generating device, and is opened at the pressing curved surface 42a of the separation block 42. Further, in the sixth embodiment, the curing treatment portion 50 is included. The hardening treatment portion 50 radiates to make the adhesion The energy of the bonding agent R hardening is substantially the same as that of the above-described hardening treatment portion 42b. However, the hardening treatment portion 50 is disposed on the side (outer side) of the concave substrate 20 that is expanded by the bending of the side portion 20b.

The suction portion 42c sucks the thin substrate 21 wound around the separation block 42, and adheres the thin substrate 21 to the separation block 42. The entire area of the thin substrate 21 may be sucked in close contact with the separation block 42 or the central block 41, and it is effective to suction at least the region adjacent to the pressing curved surface 42a, that is, having a large curved surface and being easily bent. The part of the reaction force of the stress. Then, the suction of the suction portion 42c is maintained, and the separation block 42 is moved to the second position B, whereby the thin substrate 21 is gradually extended from the state of being bent and shaped to the concave surface 20a. The curing treatment portion 50 emits an adhesive for any period or both of the bending before molding (before the bonding of the side portions 20b) and after the bending (after bonding the side portions 20b). R temporarily hardens the energy.

In the substrate bonding apparatus 1 of the sixth embodiment, the suction unit 42c further includes a suction unit 42c that adsorbs the thin substrate 21 that is bent and shaped in accordance with the shape of the center block 41 and the separation block 42. Block 42. Further, when the adhesive R is temporarily cured by the hardening treatment portion 50 before the bending, the flow of the adhesive R can be suppressed. Further, when the adhesive R is temporarily cured by the curing treatment portion 50 after the bending, the shape of the bonded thin substrate 21 can be maintained without peeling off. Therefore, with this configuration, the same effects as those of the fifth embodiment can be achieved.

(Seventh embodiment)

The substrate of the present embodiment is attached with reference to Fig. 11 and Figs. 12(A) to 12(D). The device will be described. Figs. 11 and 12(A) to 12(D) are views showing the configuration and operation of the pressing mechanism of the embodiment.

(constitution)

As shown in FIG. 11, the pressing mechanism 4 of the present embodiment includes a pressing portion 141, a displacement portion 142, and a support portion 143. Further, in the present embodiment, the curing treatment unit 50 is provided in the same manner as in Fig. 10 . The pressing portion 141 is a member that moves the thin substrate 21 in a direction in which it is in contact with or separated from the concave substrate 20. The pressing portion 141 is close to the concave substrate 20, and the thin substrate 21 is pressed against the central portion of the concave substrate 20.

The pressing portion 141 is a block having a substantially rectangular parallelepiped shape, and its upper surface has a shape that follows the surface shape of the central portion of the concave surface 20a. That is, when the central portion of the concave surface 20a is a curved surface, the upper surface of the pressing portion 141 is shaped to follow the curved surface. In the case where the central portion of the concave surface 20a is flat, the upper surface of the pressing portion 141 is flat. Further, the above-described chuck mechanism is provided on the upper surface, and is provided to hold the thin substrate 21.

The displacement portion 142 is a pair of members that are provided on both sides of the pressing portion 141 in correspondence with the side edges 20b of the concave substrate 20. The displacement portion 142 is provided at a position of the space inside the side portion 20b of the concave substrate 20 together with the pressing portion 141 when the pressing portion 141 presses the thin substrate 21.

The displacement portion 142 is displaced toward the outer edge of the thin substrate 21 while bringing the one end into contact with the thin substrate 21 together with the pressing portion 141 with respect to the concave substrate 20. By this displacement, the displacement portion 142 presses the thin substrate 21 against the concave surface 20a of the concave substrate 20.

When the concave substrate 20 has a curved portion on one, three, or four sides of the side portion 20b, the displacement portion 142 may be provided on one side, three sides, or four sides of the pressing portion 141 corresponding thereto.

The displacement portion 142 of the present embodiment is a plate shape that is parallel to both side edges 20b of the concave substrate 20 and has at least the length of the entire length of the side portion 20b. One end of the displacement portion 142 that is in contact with or separated from the thin substrate 21 is a plate-shaped edge portion 142x. The displacement portion 142 includes an elastic member that is deflected when the edge portion 142x of the displacement portion 142 comes into contact with the thin substrate 21 and is pressed against the concave substrate 20. As the material of the elastic member, various materials can be used as described above. For example, the displacement portion 142 may be composed of rubber or other resin. Moreover, even if it is a plate shape, it is not necessary to have a flat surface as a whole, and it can have a fixed angle or curvature.

Further, it is preferable that the displacement portion 142 does not scratch the concave substrate 20 and the thin substrate 21. For example, it may be made of rubber or other resin or coated with a resin. Further, by making the edge portion 142x have a circular shape, scratching can be prevented.

The support portion 143 is a member that supports a part of the displacement portion 142, that is, the other end. The support portion 143 has a shaft portion 143a that serves as a fulcrum of the displacement of the displacement portion 142. The shaft portion 143a is provided in parallel with the side portion 20b of the concave substrate 20, and is rotated by a drive source (not shown). Thereby, the support portion 143 rotates around the shaft portion 143a.

The radius of rotation from the center of rotation of the shaft portion 143a of the support portion 143 to one end of the displacement portion 142 is set to a length such that one end of the displacement portion 142 does not deviate from the thin substrate 21 during the rotation thereof, and is maintained. For the concave substrate 20 Crimp.

For example, when the side portion 20b is raised by the curved portion, the distance from the rotation center of the shaft portion 143a to the inner surface of the curved portion may not be fixed depending on the position or shape of the inner surface. In this case, the radius of rotation is set such that the difference between the longest position and the shortest position is absorbed by the elastic deformation of the displacement portion 142, and the thin substrate 21 which is realized by one end of the displacement portion 142 is held concave. The pressure contact of the substrate 20 is performed.

Further, the pressing portion 141 is set so as to press the thin substrate 21 to the concave substrate 20 simultaneously with or before the displacement portion 142. In the case of simultaneous pressure bonding, the pressing surface of the pressing portion 141 is made equal to the height of one end of the displacement portion 142.

In order to press the pressing portion 141 first, an elastic member is provided to apply a force to the pressing portion 141 in a direction in which the thin substrate 21 is pressed against the concave substrate 20. In this case, when the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, the pressing portion 141 resists the pressing force of the elastic member, thereby relatively retreating with respect to the displacement portion 142, and thereafter, the displacement portion 142 The thin substrate 21 is crimped to the concave substrate 20 at one end.

Further, in order to press the pressing portion 141 first, the pressing portion 141 itself or the pressing surface thereof may be an elastic body. In this case, when the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, the pressing surface of the pressing portion 141 is elastically deformed, and relatively retreats with respect to one end of the displacement portion 142, and thereafter, the displacement portion 142 The thin substrate 21 is crimped to the concave substrate 20 at one end.

(effect)

The bonding step of the substrate of the present embodiment as described above will be described. First, in the initial state, as shown in FIG. 11, one end of the displacement portion 142 is close to the side of the pressing portion 141. Further, the concave portion 20 is provided in the holding portion 3, and the other surface of the thin substrate 21 to which the adhesive R is adhered is placed on the pressing portion 141 and the displacement portion 142. Thereby, the concave substrate 20 and the thin substrate 21 face each other in the chamber 9.

In this state, the inside of the vacuum chamber 9 is evacuated by a vacuum source. Further, before the thin substrate 21 and the concave substrate 20 are brought close to each other and bonded together, the self-hardening treatment portion 50 radiates energy for temporarily curing the adhesive R. Thereby, when the pressing portion 141 and the displacement portion 142 enter the space between the opposing side portions 20b of the concave substrate 20, the flow of the adhesive R applied to the thin substrate 21 can be suppressed.

When the pressing mechanism 4 approaches the holding portion 3, the pressing portion 141 and the displacement portion 142 enter the space between the opposing side portions 20b of the concave substrate 20, so that the thin substrate 21 also enters the space. Inside. At this time, as shown in FIG. 12(A), the displacement portion 142 enters a space inside the side portion 20b of the concave substrate 20.

As shown in FIGS. 12(A) and 12(B), the holding portion 3 and the pressing mechanism 4 are continued until the pressing portion 141 presses the central portion of the thin substrate 21 to the central portion of the concave substrate 20. For example, the pressing can be sensed by connecting a torque sensor or the like to a driving source of the driving mechanism.

As described above, when the pressing portion 141 presses the thin substrate 21 on the concave substrate 20, one end of the displacement portion 142 also presses the thin substrate 21 against the concave substrate 20. The pressing timing of the pressing portion 141 and the pressing timing of the displacement portion 142 are as described above. Further, by this pressing, the displacement portion 142 is elastically deformed, and is in contact with the pressing end of the pressing portion 141. The connected position is inserted into one end of the displacement portion 142.

In this state, as shown in FIGS. 12(C) and 12(D), the drive source is actuated and the support portion 143 is rotated. Then, one end of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20. One end of the displacement portion 142 is maintained in contact with the concave substrate 20 via the thin substrate 21 by elastic deformation of the displacement portion 142. Therefore, the thin substrate 21 is crimped to the side portion 20b of the concave substrate 20. Further, after the bonding, the energy for temporarily curing the adhesive R may be radiated by the curing treatment portion 50.

(effect)

According to the above-described embodiment, even if the shape of the curved portion of the side portion 20b is different, gaps or wrinkles are not generated, and the thin substrate 21 can be appropriately pressure-bonded.

Further, even when the shape of the curved portion of the side portion 20b is different depending on the product, it is not necessary to prepare a member having a convex shape having a fitting surface that matches each shape. Therefore, the labor for preparing or replacing the components is saved, and the productivity is improved.

Further, after the pressing portion 141 presses the thin substrate 21 to the central portion of the concave substrate 20, the thin substrate 21 is rotated toward the side portion 20b side of the concave substrate 20, and the thin substrate 21 is moved. It is pressed to the concave substrate 20. Therefore, the meshing of the vacuum bubble or the like is not caused, and the thin substrate 21 can be uniformly adhered to the entire surface of the concave substrate 20. Therefore, the quality of the bonded product is improved. Further, since the adhesive R is temporarily cured by the hardening treatment portion 50 before bonding, the flow of the adhesive R can be suppressed. Further, after the bonding, it is hardened. When the adhesive portion R is temporarily cured by the portion 50, the shape of the bonded thin substrate 21 can be maintained without peeling off. Therefore, with this configuration, the same effects as those of the fifth embodiment and the sixth embodiment can be achieved. Further, either or both of the temporary hardening before bonding and the temporary hardening after bonding may be performed.

(Eighth embodiment)

The substrate bonding apparatus of the present embodiment will be described with reference to Figs. 13 and 14(A) to 14(D). Figs. 13 and 14(A) to 14(D) are views showing the configuration and operation of the pressing mechanism 4 of the present embodiment.

(constitution)

This embodiment is basically the same configuration as the seventh embodiment. Here, as shown in FIG. 13, the displacement portion 142 of the present embodiment has a roller 142a and a shaft support portion 142b. The roller 142a is a rotating member that is parallel to the side portion 20b of the concave substrate 20 and has at least the entire length of the side portion 20b. The outer peripheral surface of the roller 142a is one end of the displacement portion 142 that is in contact with or separated from the thin substrate 21.

The shaft support portion 142b is a member that rotatably supports the roller 142a at one end thereof. The shaft support portion 142b has at least the same length as the entire length of the roller 142a. The shaft support portion 142b supports both ends of the shaft of the roller 142a by the arm portions at both ends. The arm portion is provided to be displaceable (expandable) by, for example, a floating device of an elastic body, an air cylinder, or an electromagnet, and to maintain the pressure contact of the roller 142a in accordance with the shape of the curved portion. As the elastomer, rubber or other resin, a spring, or an elastic supporter for the support can be used. In the case of using an electromagnet, it is easy to adjust the crimping force, the amount of expansion and the like, etc. by controlling the energization by the control device.

The support portion 143 is a member that supports the other end of the shaft support portion 142b. The support portion 143 has a shaft portion 143a that serves as a fulcrum of the displacement of the displacement portion 142, that is, a shaft on which the shaft support portion 142b rotates. The configuration of the shaft portion 143a is the same as that of the first embodiment described above.

In the same manner as in the above-described first embodiment, the pressing portion 141 is set so as to press the thin substrate 21 to the concave substrate 20 simultaneously with or before the roller 142a of the displacement portion 142.

(effect)

The bonding procedure of the substrate of the present embodiment as described above will be described. In addition, the description of the same steps as those of the above embodiment will be simplified or omitted. First, in the initial state, the roller 142a approaches the side of the pressing portion 141. Further, the pressing mechanism 4 is brought close to the holding portion 3 holding the concave substrate 20, so that the thin substrate 21 enters the space between the opposing side portions 20b of the concave substrate 20.

At this time, as shown in FIG. 14(A), the outer peripheral surface of the roller 142a which is one end of the displacement portion 142 enters a space inside the side portion 20b of the concave substrate 20.

When the pressing portion 141 presses the thin substrate 21 on the concave substrate 20, the outer peripheral surface of the roller 142a which is one end of the displacement portion 142 also presses the thin substrate 21 against the concave substrate 20, as shown in Fig. 14(B). .

In this state, the drive source is actuated and the shaft portion 143a is rotated. Then, as shown in FIGS. 14(C) and 14(D), the roller 142a of the displacement portion 142 moves toward the outer edge of the thin substrate 21 while rotating along the curved portion of the side portion 20b of the concave substrate 20. . Therefore, the thin substrate 21 is crimped to the side portion 20b of the concave substrate 20. at this time, The arm portion expands and contracts according to the shape of the curved portion, thereby maintaining the pressure contact between the thin substrate 21 by the roller 142a and the concave substrate 20.

(effect)

According to the present embodiment as described above, the same effects as those of the seventh embodiment can be obtained, and the following effects can be obtained. That is, the member that is in direct contact with the thin substrate 21 is a rotating roller 142a. Therefore, scratches caused by rubbing the surface of the thin substrate 21 are less likely to occur. Further, even if it moves at a high speed, it is difficult to scratch the thin substrate 21, and the speed of the bonding process can be increased. Further, by the expansion and contraction of the arm portion, even if the shape of the curved portion of the concave substrate 20 or the flexibility of the thin substrate 21 is different, the pressure contact can be maintained in the same manner as the curved surface.

(Ninth Embodiment)

A substrate bonding apparatus according to the present embodiment will be described with reference to Figs. 15 and 16(A) to 16(D). Figs. 15 and 16(A) to 16(D) are views showing the configuration and operation of the pressing mechanism 4 of the present embodiment.

(constitution)

This embodiment is basically the same configuration as the seventh embodiment. Here, the displacement portion 142 of the present embodiment has a brush 142c as shown in FIG. Further, the support portion 143 has a base portion 143b that fixes the brush 142c.

The brush 142c is, for example, an aggregate of a plurality of resins, natural or synthetic fibers or hairs, and one end thereof faces a curved portion of the side portion 20b of the concave substrate 20. The other end, which is a part of the brush 142c, is planted on the base portion 143b.

The base portion 143b is parallel to the side portion 20b of the concave substrate 20 and at least A member having a length of the entire length of the side portion 20b and having a curved surface that faces the curved portion of the side portion 20b. The brush 142c is implanted throughout the entire surface of the curved surface.

The tip end of the brush 142c is in contact with the thin substrate 21 and is pressed to one end of the concave substrate 20. The base portion of the base portion 143b of the root portion of the brush 142c serves as one of the fulcrums of the displacement of the brush 142c. Further, since the brush 142c has flexibility, the thin substrate 21 is bent when pressed against the concave substrate 20.

Further, although not shown, a drive mechanism is provided in which the pressing portion 141 presses the thin substrate 21 on the concave substrate 20, and further, the base portion 143b of the displacement portion 142 pushes the thin substrate 21 toward the tip end of the brush 142c. It moves in the direction in which the concave substrate 20 is pressed.

Further, similarly to the above-described first embodiment, the pressing portion 141 is set so as to press the thin substrate 21 to the concave substrate 20 simultaneously with or before the brush 142c of the displacement portion 142. Further, the tip end of the brush 142c which is one end of the displacement portion 142 is housed in a space inside the side portion 20b of the concave substrate 20, and is set to press the thin substrate 21 to the concave substrate 20 in order from the inside to the outside. the height of.

(effect)

The bonding step of the substrate of the present embodiment as described above will be described. In addition, the same steps as those in the above embodiment will be simplified or omitted. First, the pressing mechanism 4 is brought close to the holding portion 3 holding the concave substrate 20, so that the thin substrate 21 enters the space between the opposing side portions 20b of the concave substrate 20.

At this time, as shown in FIG. 16(A), the tip end of the brush 142c which is one end of the displacement portion 142 enters a space inside the side portion 20b of the concave substrate 20.

As shown in FIG. 16(B), when the pressing portion 141 presses the thin substrate 21 on the concave substrate 20, the tip end of the brush 142c which is one end of the displacement portion 142 also presses the thin substrate 21 on the concave substrate 20.

In this state, the drive mechanism is actuated to move the base portion 143b toward the concave substrate 20. Then, as shown in FIG. 16(C) and FIG. 16(D), the brush 142c is bent while pressing the thin substrate 21 to the concave substrate 20 from the inner brush 142c to the outer brush 142c. Thereby, the brush 142c presses the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20.

(effect)

According to the present embodiment as described above, the same effects as those of the seventh embodiment are obtained, and the following effects are obtained. That is, the member that is in direct contact with the thin substrate 21 is a soft brush 142c. Therefore, regarding the curved shape, even if there is a greater difference or difference, the difference or the difference can be absorbed to perform high-precision bonding. Moreover, it is not easy to cause scratches by rubbing the surface of the thin substrate 21.

Further, even if it moves at a high speed, it is difficult to scratch the thin substrate 21, and the speed of the bonding process can be increased. Further, since the displacement portion 142 is configured as a brush 142c that is embossed on the base portion 143b, the device configuration is simplified and can be manufactured at low cost.

(Tenth embodiment)

The substrate bonding apparatus of the present embodiment will be described with reference to Figs. 17(A) to 17(F). 17(A) to 17(F) are views showing the configuration and operation of the pressing mechanism 4 of the present embodiment.

(constitution)

This embodiment is basically the same configuration as the ninth embodiment. In the present embodiment, as shown in Fig. 17(A), the pressing portion 141 is integrally formed with the base portion 143b (support portion 143), and not only the base portion 143b but also the upper surface of the pressing portion 141 is also brushed with a brush 142c (displacement). Part 142). The tip end of the brush 142c is pressed against the thin substrate 21 from the central portion of the concave substrate 20, and is pressed toward the side edge portion 20b side of the concave substrate 20, and is sequentially pressed by the other brush 142c, thereby setting the center portion in this manner. Got high.

(effect)

The bonding step of the substrate of the present embodiment as described above will be described. In addition, the description of the same steps as those of the above embodiment will be simplified or omitted. First, the pressing mechanism 4 is brought close to the holding portion 3 holding the concave substrate 20, so that the thin substrate 21 enters the space between the opposing side portions 20b of the concave substrate 20.

At this time, as shown in FIG. 17(B), the tip end of the brush 142c which is one end of the displacement portion 142 is located inside the side portion 20b of the concave substrate 20.

Further, as shown in FIG. 17(C), the brush 142c of the pressing portion 141 presses the thin substrate 21 against the concave substrate 20. At this time, the tip end of the brush 142c is pressed against the thin substrate 21 in this order from the central portion of the concave substrate 20 toward the side portion 20b.

Further, as shown in Fig. 17 (D), Fig. 17 (E), and Fig. 17 (F), the curved portion of the side portion 20b of the concave substrate 20 is also sequentially from the inner brush 142c to the outer brush 142c. The thin substrate 21 is pressure-bonded to the concave substrate 20, and the brush 142c is bent. Thereby, the brush 142c presses the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20.

(effect)

According to the present embodiment as described above, the same effects as those of the fourth embodiment are obtained, and the following effects are obtained. In other words, since the entire member that presses the thin substrate 21 to the concave substrate 20 is the brush 142c, the central portion of the concave substrate 20 can be sequentially pressed toward the outside. Therefore, the meshing of the vacuum bubbles or the like can be further prevented, and the thin substrate 21 can be uniformly adhered to the entire surface of the concave substrate 20. Therefore, the quality of the bonded product is further improved. Further, a drive mechanism that drives only the base portion 143b of the displacement portion 142 is not required.

(Eleventh embodiment)

The substrate bonding apparatus of the present embodiment will be described with reference to Figs. 18(A) to 18(E). 18(A) to 18(E) are views showing the configuration and operation of the pressing mechanism 4 of the present embodiment.

(constitution)

This embodiment is basically the same configuration as the seventh embodiment. In the present embodiment, as shown in FIG. 18(A), the guide mechanism 15 is provided.

The guiding mechanism 15 is a mechanism that guides the surface of the side surface portion 21b of the thin substrate 21 that is pressed by the pressing mechanism 4 to the both side edges of the concave substrate 20. The inside of 20b. The guiding mechanism 15 has a pair of guiding members 15a that are in contact with or separated from the side edge portions 21b of the thin substrate 21 placed on the pressing mechanism 4. The guide member 15a has a plate shape having at least the same length as the entire length of the side portion 21b of the thin substrate 21.

Moreover, the pair of guiding members 15a are provided by a moving machine not shown It is possible to move between a guiding position that is in contact with the side edge portion 21b of the thin substrate 21 and a retracted position that is separated from the side edge portion 21b of the thin substrate 21 and retracted. Further, the moving mechanism may be configured such that a pair of frames and the like each having the guide member 15a are provided so as to be rotatable about an axis connected to the drive source, and are rotated in opposite directions to each other. The lead members 15a move in a direction of being in contact or separated from each other. Further, the pair of guiding members 15a are provided so as to be in contact with the side edge portion 21b of the thin substrate 21, and can be lifted and lowered together with the pressing mechanism 4 by a lifting mechanism (not shown). Further, the lifting mechanism can also serve as a driving mechanism of the pressing mechanism 4. Further, the lifting movement of the guiding member 15a may be performed with respect to the concave substrate 20 held by the holding portion 3.

The pair of guiding members 15a press the thin substrate 21 by the pressing portion 141, and the portion other than the portion crimped by the displacement portion 142 is set at the guiding position so as to be held at a position apart from the concave substrate 20. The interval between each other and the tracking distance to the pressing mechanism 4.

(effect)

The bonding step of the present embodiment as described above will be described. The basic bonding step is the same as that of the first embodiment described above. In the present embodiment, as shown in FIG. 18(B), the guide member 15a that has moved to the guide position is in contact with both side edges 21b of the thin substrate 21 placed on the pressing mechanism 4, whereby Deflection occurs.

Due to this deflection, the side edge portions 21b of the thin substrate 21 come to a position of the space inside the both side edges 20b of the concave substrate 20. Thus, in a state where the positions of the side edges 21b of the thin substrate 21 are restricted, the pressing mechanism 4 approaches The concave substrate 20, and following this, the guiding member 15a also approaches the concave substrate 20.

Further, the pressing portion 141 and the displacement portion 142 enter the space between the opposing side portions 20b of the concave substrate 20, and thus the thin substrate 21 also enters the space. At this time, the side edge portions 21b of the thin substrate 21 enter the inner side of the side edge portion 20b of the concave substrate 20 by the guide member 15a.

Further, as shown in FIGS. 18(C) and 18(D), the pressing portion 141 presses the thin substrate 21 against the concave substrate 20, and the displacement portion 142 performs the thin substrate 21 along the concave shape. The crimping of the curved portion of the side portion 20b of the substrate 20 is performed. This detail is the same as that of the first embodiment described above.

In the present embodiment, as shown in FIG. 18(D), the thin substrate 21 is in contact with the guide member 15a and held until the entire surface of the thin substrate 21 is bonded to the concave substrate 20, and thereafter, as shown in FIG. (E), the guiding member 15a is separated from the thin substrate 21. Therefore, the sway of the plate surface of the thin substrate 21 in the bonding is prevented.

(effect)

According to the present embodiment as described above, the same effects as those of the seventh embodiment are obtained, and finally, the sway of the thin substrate 21 before the entire surface of the thin substrate 21 is pressed against the concave substrate 20 is not generated. Therefore, a more uniform and highly precise bonding can be achieved, and the quality of the bonded substrate can be improved.

(Twelfth embodiment)

The substrate bonding apparatus of the present embodiment will be described with reference to FIGS. 19(A), 19(B), 20(A), and 20(B). 19(A), 19(B), 20(A), and 20(B) show the configuration and operation of the pressing mechanism 4 of the present embodiment. Figure.

(constitution)

This embodiment is basically the same configuration as the seventh embodiment. As shown in FIGS. 19(A) and 19(B), the displacement portion 142 of the present embodiment has a substantially elliptical cross section, for example, and has a plurality of ends that are in contact with or separated from the thin substrate 21. Further, the displacement portion 142 is a rotating member that is parallel to the side portion 20b of the concave substrate 20 and has at least the entire length of the side portion 20b. Further, as the displacement portion 142, a relatively rigid member may be used, or an elastic member may be used.

The support portion 143 is an axis that supports a part of the displacement portion 142 and serves as a fulcrum of the rotation of the displacement portion 142. The configuration of this shaft is the same as that of the shaft portion 143a of the above-described first embodiment. The support portion 143 is provided at an eccentric position of the displacement portion 142, and serves as an edge portion 142y of the outer peripheral surface of the displacement portion 142 and an edge portion 142z as the other outer peripheral surface facing the displacement portion 142, and a distance from the support portion 143, that is, the rotation center of the shaft. different. For example, the edge portion 142y is longer than the edge portion 142z by a distance from the center of rotation. The edge portion 142y and the edge portion 142z are one end of the displacement portion 142 that is in contact with or separated from the thin substrate 21. In addition, three or more ends having different rotation radii are provided, and it is also possible to correspond to more curved surfaces.

In the vicinity of the displacement portion 142 of the pressing portion 141, a hole, a recess or a cavity that allows the rotation of the displacement portion 142 is provided. Further, similarly to the first embodiment, the pressing portion 141 is configured to press the thin substrate 21 to the concave substrate 20 simultaneously with or before the displacement portion 142. In addition, the support portion 143 may be configured to be displaceable by the elastic member and to maintain the position according to the shape of the curved portion. The crimping of the moving portion 142.

(effect)

The bonding step of the substrate of the present embodiment as described above will be described. In addition, the description of the same steps as those of the above embodiment will be simplified or omitted. First, in the initial state, in accordance with the curved shape of the side portion 20b of the concave substrate 20, either one of the edge portion 142y and the edge portion 142z faces the direction in which the thin substrate 21 is in contact with each other.

19(A) shows a case where the curvature radius is large, and in this case, the edge portion 142y faces the thin substrate 21. Further, the pressing mechanism 4 is brought close to the holding portion 3 holding the concave substrate 20, so that the thin substrate 21 enters the space between the opposing side portions 20b of the concave substrate 20. Then, as shown in FIG. 19(A), together with the pressing portion 141, the edge portion 142y of the displacement portion 142 also presses the thin substrate 21 against the concave substrate 20.

In this state, the drive source is actuated and the support portion 143 is rotated. Then, as shown in FIG. 19(B), the edge portion 142y of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20. Therefore, the thin substrate 21 is crimped to the side portion 20b of the concave substrate 20.

On the other hand, in the case of a curved shape having a small radius of curvature, as shown in FIG. 20(A), the edge portion 142z faces the thin substrate 21. In the same manner as described above, the support portion 143 is rotated in a state in which the thin substrate 21 is pressed against the concave substrate 20 together with the pressing portion 141. Then, as shown in FIG. 20(B), the edge portion 142z of the displacement portion 142 moves toward the outer edge of the thin substrate 21 along the curved portion of the side portion 20b of the concave substrate 20. Therefore, the thin substrate 21 is crimped to the concave base The side portion 20b of the board 20.

(effect)

According to the present embodiment as described above, the same effects as those of the seventh embodiment are obtained, and the following effects are obtained. In other words, since the displacement portion 142 has the edge portion 142y and the edge portion 142z having different rotation radii, even if the member is not prepared or replaced, uniform bonding can be achieved in accordance with different curved shapes. Therefore, productivity can be improved. Further, a slight difference in the shape of the curved portion is absorbed by the elastic deformation of the concave substrate 20, and the pressure contact between the displacement portion 142 and the thin substrate 21 can be maintained. Further, since the support portion 143 is provided to be displaceable by the elastic member, even if the shape of the curved portion of the concave substrate 20 or the flexibility of the thin substrate 21 is different, the pressure contact can be maintained in accordance with the curved surface.

(Other embodiments)

The present invention is not limited to the above embodiment. For example, the following aspects are also included in the present invention.

(1) The positional relationship of the pair of substrates to be bonded is not limited to the contents exemplified in the above embodiment. For example, as shown in FIG. 21(A), the concave substrate 20 may be supported below, and the thin substrate 21 may be held above by the pressing portion 141. In this case, as shown in FIGS. 21(B) to 21(D), the pressing portion 141 and the displacement portion 142 holding the thin substrate 21 are lowered, and the pressing portion 141 presses the central portion of the thin substrate 21 to the concave portion. In the substrate 20, the displacement portion 142 presses the thin substrate 21 to the side portion 20b of the concave substrate 20. Further, the thin substrate 21 may be placed on the upper surface of the concave substrate 20, and the pressing portion 141 and the displacement portion may be used from above. 142 is pressed to perform bonding.

(2) In the embodiment according to any of the above embodiments, the adhesive before bonding and the adhesive after bonding may be temporarily cured by irradiation of energy in the curing treatment portion. Inhibit the flow of the adhesive. This temporary hardening can be achieved, for example, by weakening the energy imparted to the adhesive. Moreover, it can be realized by irradiation in the atmosphere. For example, in the case where the adhesive is an ultraviolet curable resin, the adhesive can be temporarily hardened by irradiating UV light in the atmosphere. In the case of irradiation in the atmosphere, oxygen in the atmosphere interferes with hardening, and it is easy to maintain a state in which the surface is viscous. In addition, it is considered that various methods such as irradiation of electromagnetic waves, temperature change (heating, cooling), and air blowing are used depending on the type of the resin. Further, in the above-described embodiment, the hardening treatment portion 42b and the hardening treatment portion 50 are provided outside the holding portion 3. However, the curing portion 42b and the curing portion 50 may be provided inside the holding portion 3, and may be radiated from the entire holding portion 3 for the adhesive R. The overall hardening energy. Further, by using the hardening treatment portions separately, the following hardening treatment can be achieved.

(a) Temporary hardening of the adhesive R applied to the concave substrate 20 or the thin substrate 21 before bonding.

(b) The temporary hardening of the thin substrate 21 at the side portion 20b of the concave substrate 20 before or after bonding is performed.

(c) Temporary hardening or main hardening of the entire adhesive 7 of the concave substrate 20 or the thin substrate 21 after bonding (hardening to a completely hardened state).

Further, in the above embodiment, the adhesive is temporarily cured by the energy of the curing treatment portion before and after the bonding. However, at one end of the displacement portion is concave In the embodiment in which the substrate is pressed against the thin substrate, the movement of one end of the displacement portion may be performed, and the hardened portion may emit energy toward the portion where the concave substrate and the thin substrate are pressed. For example, the light of the UV lamp is guided by the optical fiber, and the end faces of the optical fibers are arranged linearly or in a dot shape over the entire length of the concave substrate, and the movement of one end of the displacement portion is performed to press the concave substrate and the thin substrate. The part is irradiated with UV. In this manner, since the portion where the concave substrate and the thin substrate are bonded together is gradually hardened, the adhesive is temporarily hardened by the energy of the hardened portion after the bonding, thereby shortening the temporary portion. The hardening time can also suppress the offset of the thin substrate relative to the concave substrate.

(3) The bonding of the substrate can be carried out in a vacuum or in the atmosphere. Even when it is carried out in the air, the thin substrate can be pressed against the side portion from the central portion of the concave substrate to prevent the meshing of bubbles or the like. For example, when the brush of the tenth embodiment is used, the flat surface is not pressed in a relatively wide range, but the inner surface of the concave substrate can be pressed in order from the central portion of the concave substrate, thereby preventing the bubbles. effective.

(4) A cover plate, a touch panel, a liquid crystal module, a display panel constituting the liquid crystal module, a backlight, and the like are typical examples of the substrate to be bonded. However, any one of the size, the shape, the material, and the like may be used as long as it can be a pair of attached objects. For example, it can also be applied to various members and the like constituting the display device. The adhesive can be freely attached to any of the substrates, and is not only applicable to the case where one of the adhesives is attached to the substrate, but also applied to both of them. It can also be applied to a case where a substrate is crimped to another substrate without using an adhesive.

(5) Any of the above embodiments may be combined. For example, the eleventh embodiment can be combined with all of the above embodiments. That is, the above embodiments are not intended to limit the scope of the invention. It is to be understood that the scope of the invention is not limited by the scope of the invention and the scope of the invention.

20‧‧‧ concave substrate

20a‧‧‧ concave

20b‧‧‧Sideside

20c‧‧‧ concave space

21‧‧‧Thin substrate

R‧‧‧Adhesive

Claims (15)

A substrate bonding apparatus for bonding a concave substrate having a concave surface and a flexible thin substrate via an adhesive, wherein the substrate bonding apparatus includes a pressing unit, and the pressing unit is The concave surface of the concave substrate presses the thin substrate, and the pressing unit includes a pressing portion that presses the thin substrate against a concave surface of the concave substrate, and a displacement portion that is located beside the pressing portion and is as follows The displacement is such that the thin substrate is pressed against the concave substrate by the pressing portion, and is accommodated in the concave surface of the concave substrate, whereby the thin substrate is pressed against the concave surface. The substrate bonding apparatus according to claim 1, wherein the pressing portion is a central block, and the displacement portion is a separation block that is close to and away from the central block, and the pressing unit makes the separation region The block is adjacent to the central block until the central block and the separation block are contracted smaller than the concave surface, and enters into the concave space together with the thin substrate, wherein the separation block is in the concave surface The space is moved in the direction of the side portion of the concave substrate, and the thin substrate is opened in the same manner as the concave surface. The substrate bonding apparatus according to claim 2, wherein the separation block has a pressing curved surface on the side of the side portion, and the pressing curved surface is The concave portion of the side portion of the concave substrate has substantially the same shape. The substrate bonding apparatus according to claim 1, wherein at least a part of the displacement portion includes an elastic member. The substrate bonding apparatus according to claim 2, wherein the pressing unit further comprises a guiding unit, wherein the guiding unit causes the thin substrate to follow an overall shape when the separation block is close to the central block. Further, in the case where the bending is performed in advance, the separation block moves toward the side portion of the concave substrate after the bending. The substrate bonding apparatus according to claim 5, wherein the guiding unit includes a hook portion, and the hook portion is externally biased by being stuck at a side end portion of the thin substrate, thereby preliminarily The thin substrate is subjected to the above bending forming. The substrate bonding apparatus according to claim 6, wherein the separation block is subjected to the above-described bending forming by the hook portion, and the above-described concave substrate is formed from the concave substrate. The position where the side portion abuts starts from the outer position and moves to a position close to the center block. The substrate bonding apparatus according to claim 7, wherein the hook portion passes through a side end portion of the thin substrate which is not subjected to an external force, and moves along an outer shape of the separation block. The substrate bonding apparatus according to claim 8, wherein The hook portion moves on a straight line that passes through a side end portion of the thin substrate that is not subjected to an external force and that is bent through an outer shape of the separation block near the center block The side end portion of the above-mentioned thin substrate after molding. The substrate bonding apparatus according to claim 5, further comprising a suction unit, wherein the suction unit adsorbs the thin substrate which is bent and shaped in accordance with an overall shape of the central block and the separation block Separate blocks. The substrate bonding apparatus according to claim 1, comprising a curing treatment unit, wherein the curing treatment unit applies the adhesive to at least one of the concave substrate and the thin substrate. The thin substrate is temporarily cured before being bonded to the concave substrate and at least one period after bonding. The substrate bonding apparatus according to claim 1, comprising a curing treatment unit, wherein the curing treatment unit applies the adhesive to at least one of the concave substrate and the thin substrate. The side edge portion of the concave substrate is temporarily cured before bonding and at least one of the bonding of the side portions. The substrate bonding apparatus according to claim 1, wherein the pressing unit has a support portion that supports the displacement portion, and the displacement portion faces the concave substrate while contacting one end with the thin substrate. The side portion is displaced so that the thin substrate is pressed against the concave surface, and the support portion supports the other end of the displacement portion as a fulcrum of displacement. The substrate bonding apparatus according to claim 13, wherein one end of the displacement portion is provided so as to maintain a distance from the fulcrum so as to maintain pressure contact between the thin substrate and the concave substrate. A substrate bonding method in which a concave substrate having a concave surface and a flexible thin substrate are bonded together via an adhesive, wherein the substrate bonding method is characterized in that the pressing portion presses the thin substrate to the above The concave surface of the concave substrate is displaced by the displacement portion located beside the pressing portion, that is, the concave substrate is pressed against the concave substrate by the pressing portion, and is accommodated in the concave surface of the concave substrate Therefore, the thin substrate is pressed against the concave surface.