TWI574161B - Data transceiving system - Google Patents

Description

Data collection system

The present invention relates to a data collection system, and more particularly to a data collection system for a polycrystalline wafer.

With the continuous evolution of electronic technology, more humanized and more complex electronic products are constantly being introduced, and people's requirements for data processing capabilities of electronic products are becoming higher and higher. In the current electronic technology, a plurality of processing chips are usually disposed in an electronic product, and the processed data is distributed through the processing wafers to enhance the data processing capability of the electronic products.

When a single access device needs to transmit information for multiple processors, it often reduces the transmission efficiency of information due to the bandwidth limitation that the hardware can provide. In this case, when a large amount of data transmission operations are required, the access device cannot perform the data access operation in an instant, resulting in a decrease in system efficiency.

The present invention provides a data collection system that improves the efficiency of data transmission between cells in a multi-cell wafer.

The data collection system of the present invention includes a polycrystalline wafer and an access device. The multi-cell wafer of the present invention can be used after it is connected to a desired power source and signal, wherein the multi-cell wafer can include a semiconductor substrate, a plurality of unit cells, and a plurality of sets of signal transmission lines. Such unit cells can be disposed on a semiconductor substrate. Any two of the unit cells may have a space between them. The signal transmission lines may be respectively disposed on at least a portion of the spaced spaces and used to perform signal transmission between at least some of the adjacent cells. The polycrystalline cell wafer can be cut through a portion of the spaced spaces to cut off some of the signal transmission lines, so that the polycrystalline silicon wafer can be divided into a plurality of sub-wafers, wherein the cut portions of the sub-wafers are connected It can still be used after the required power and signal. The access device is coupled to the plurality of interface cells in the unit cell, wherein the access device performs a data transfer operation with the set cell through one or more of the interface cell and the signal transmission line group.

In an embodiment of the invention, the interface cell has a plurality of pads on the cell. The access device is coupled to a pad on the interface cell.

In an embodiment of the invention, each of the signal transmission line groups has a plurality of metal wires, and the metal wires are disposed on the semiconductor substrate.

In an embodiment of the invention, when the access device is to transmit the first data to the set cell, the access device distinguishes the first data into a plurality of second data, and respectively transmits the second data to the interface cell. And interfacing the cell and transmitting the second data to the set cell through one or more of the signal transmission line groups.

In an embodiment of the invention, the interface cells respectively set a plurality of transmission paths according to the positional relationship with the set cells, and the interface cells respectively transmit the second data to the set cells according to the transmission paths.

In an embodiment of the present invention, when the access device is configured to receive the first data transmitted by the setting unit cell, the unit cell is configured to distinguish the first data into the plurality of second data, and transmit the signal in the signal transmission line group. One or more to respectively transmit the second data to the interface unit cell, and the access device obtains the second data from the interface unit cell and obtains the first data.

In an embodiment of the invention, the setting unit cell sets a plurality of transmission paths to respectively transmit the second data to the interface unit cells, and each of the transmission paths is set according to a positional relationship between the set unit cell and the interface unit cell.

In an embodiment of the invention, each of the signal transmission line groups provides a transmission data width greater than a transmission data width between the access device and each interface cell.

In an embodiment of the invention, the set unit cell is one of the interface unit cells.

In an embodiment of the invention, the spaced spaces between the adjacent unit cells are provided as a cutting space.

Based on the above, the present invention couples a plurality of interface cells to an access device, and cooperates with a signal transmission line group between adjacent cells in a multi-cell wafer to complete the access device and the set cell. Data transfer action. Thereby, the data can be divided into multiple blocks to be transmitted in parallel through different paths. As a result, the efficiency of data transmission between the access device and the data transfer operation between the cells can be effectively improved.

The above described features and advantages of the invention will be apparent from the following description.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a data collection system according to an embodiment of the present invention. The data collection system 100 includes a poly unit wafer 110 and an access device 120. The poly unit wafer 110 has a semiconductor substrate SUB and includes a plurality of unit cells 111 to 116 and a plurality of signal transmission line groups OCI1 to OCI7. The unit cells 111 to 116 are disposed and arranged on the semiconductor substrate SUB, and have at least one space between adjacent cells. In addition, each of the signal transmission line groups OCI1 to OCI7 is disposed in a space between adjacent cells, and serves as a medium for data transmission operations between adjacent cells. For example, the signal transmission line group OCI1 is disposed on a space between the unit cell 111 and the unit cell 112 adjacent thereto. The signal transmission line group OCI1 is coupled to the cells 111, 112 and serves as a medium for data transmission between the cells 111, 112. In addition, the space between adjacent cells can provide a space for cutting as a scribe line. In other words, when the required number of unit cells can be small, the polycrystalline wafer 110 can be changed into a plurality of sub-wafers (including a plurality of single cells or a plurality of cells) by a cutting action, and after cutting Some of the sub-chips can still operate normally independently after receiving the voltage of the original.

Each of the signal transmission line groups OCI1 to OCI7 may include a plurality of wires which may be formed using one or more layers of patterned metal layers covering the semiconductor substrate SUB.

In addition, in an embodiment of the invention, each of the unit cells 111-116 may have a plurality of pads PAD, and the pads may be disposed on the surface layers of the cells 111-116.

In the unit cells 111-116, there are a plurality of interface cells (for example, the cells 111-114), and the access device 120 is coupled to the interface cells (cells 111-114) and through the interface cell to the cell. At least one of 111 to 116 performs information transmission.

In this embodiment, the access device 120 can be electrically connected to the pad PAD on the interface cell through the package wire. Alternatively, the access device 120 can also pass through, for example, a metal bump and a flexible circuit board and an interface cell. The pad PAD on the top produces an electrical connection with no fixed limits.

For details about the transmission details of the data, please refer to FIG. 2, which is a schematic diagram of the transmission mode of the data collection system 100 according to the embodiment of the present invention. When the access device 120 is to transmit data to the unit cell 115, the unit cell 115 is a set unit cell, and the access device 120 can divide the first data to be transmitted into four second data, and the four seconds to be distinguished. The data is placed in the data fields DA1~DA4, wherein the number of bits of the second data may be one quarter of the number of bits of the first data. Then, in the next first time interval, the access device 120 transmits the data fields DA1, DA4 through the electrical connection paths PA1, PA3, PA4, and PA2 with the pads of the unit cells 111, 112, 115, and 116. The second data in DA3 and DA2 are transmitted to the unit cells 111, 112, 115, and 116, respectively.

Moreover, in the second time interval, the unit cell 111 can transmit the second data in the received data field DA1 to the unit cell 112 through the signal transmission line group OCI1, and at the same time, the unit cells 112 and 116 can respectively transmit through the signal transmission line. The groups OCI4 and OCI5 respectively transmit the second data of the data fields DA4 and DA2 to the unit cell 115, and at the same time, the unit cell 115 can obtain the second data of the data fields DA2, DA3 and DA4.

In the third time interval after the second time interval, the unit cell 112 can transmit the second data in the data field DA1 to which the unit cell 111 is transmitted to the unit cell 115 through the signal transmission line group OCI4, so that the crystal The cell 115 can obtain the second data of all the data fields DA1~DA4, and complete the data transmission action by combining all the second data to obtain the first data.

It can be known from the above description that a data having a larger data width can be divided into a plurality of data having a smaller data width, so that the access device 120 can transmit all the data at most through a one-time transmission action. The unit cells 111, 112, 116, and 115, which are interface cells, are then collected by the signal transmission line groups OCI1, OCI4, OCI5, and OCI6 between the unit cells 111, 112, 116, and 115 to be used as the set cell. The cell 115 is used to complete the data transfer operation. It is to be noted that the signal transmission line groups OCI1, OCI4, OCI5, OCI6 are utilized with the unit cell 111 with respect to the connection form between the access device 120 and the pads of the unit cells 111, 112, 115, 116 as the interface cells. The metal wires formed by the patterned metal layers in the same integrated circuit of 112, 115, and 116 are constructed. Therefore, the signal transmission line groups OCI1, OCI4, OCI5, and OCI6 can have small parasitic capacitance and resistance values, and can Provides a relatively high ability to transfer data. In this embodiment, the number of times of data transmission between the access device 120 and the cell with slow data transmission speed is reduced, and the effective transmission of multiple second data can effectively improve the efficiency of data transmission.

Incidentally, the transmission path of the interface cell to the set cell can be determined according to the relative positional relationship between the interface cell and the set cell. For example, in the present embodiment, when the unit cell 111 as the interface unit cell determines the transmission path, the unit cell 111 can reach the unit cell 115 through the unit cell 112 or 116. Therefore, the unit cell 111 can determine its The transmission path of the two data is unit cell 111 à unit cell 112 à unit cell 115, or may be set to unit cell 111 à unit cell 116 à unit cell 115.

On the other hand, when the cell 115 is to transmit data to the access device 120, the cell 115 is a set cell. And, the unit cell 115 divides all the transmitted first data into four second data D1~D4, wherein the number of bits of the first data may be one quarter of the number of bits of the second data.

Then, in the first time interval, the cell 115 can transmit two of the second data D1, D2 to the unit cell 112 through the signal transmission line group OCI4, and transmit the second data D3 to the unit cell through the signal transmission line group OCI6. 116. Then, in the second time interval, the unit cell 112 can transmit the data D2 it receives to the unit cell 111 through the signal transmission line group OCI1.

In the next second time interval, based on the unit cells 111, 112, 115, and 116 are interface cells, the cells 111, 112, 115, and 116 respectively obtain the obtained second data D2, D1, D4, D3 is transmitted to the access device 120 through its pads through the electrical connection paths PA1, PA3, PA4 and PA2. In this way, by merging the received second data D2, D1, D4, and D3, the access device 120 can smoothly receive the first data to be transmitted by the unit cell 115.

It can be seen from the above description that the embodiment of the present invention reduces the data transmission operation between the access device 120 and the cell with lower speed, and effectively increases the speed of data transmission by synchronously transmitting multiple second data. .

Incidentally, setting the transmission path of the cell to transmit the second data to the interface cell can be determined according to the relative positional relationship between the cell and the interface cell. For example, in the present embodiment, when the cell 115 as the set cell is determined to transmit the second data to the transmission path of the unit cell 111, the unit cell 115 can reach the unit cell 111 through the unit cell 112 or 116. Therefore, the unit cell 115 can determine that the transmission path of the second data is the unit cell 115 à unit cell 112 à unit cell 111, or can also be set as the unit cell 115 à unit cell 116 à unit cell 111.

In the present embodiment, each of the signal transmission line groups OCI1, OCI4, OCI5, and OCI6 provides a transmission data width greater than a transmission data width between the access device 120 and each of the unit cells 111, 112, 115, and 116 as interface cells. The transmission data width provided by each of the signal transmission line groups OCI1, OCI4, OCI5, and OCI6 may be N times the width of the transmission data provided by the access device, and N is an integer greater than 1.

Further, in the above description, the unit cell 115 serves as both the set unit cell and the interface unit cell. In the embodiment of the present invention, it is not necessary to set the unit cell to be one of the unit cells. In addition, there is no certain limitation on the number of interface cells. Those skilled in the art can set the number of interface cells according to actual needs. The four setting cells of the foregoing embodiment are only an illustrative example, and are not limited. this invention.

Please refer to FIG. 2 and FIG. 3 simultaneously. FIG. 3 is a flow chart showing the operation of data transmission according to an embodiment of the present invention. In step S310, the interface cell is set and the transmission path setting between the cells is set. Taking FIG. 2 as an example, the unit cell 115 is used as the unit cell, and the unit cells 111, 112, 115, and 116 are all interface cells. The unit cell 115 and the unit cells 111, 112, 115, and 116 can be respectively set as: unit cell. 115à signal transmission line group OCI4à unit cell 112à signal transmission line group OCI1à unit cell 111, unit cell 115à signal transmission line group OCI4à unit cell 112, unit cell 115à unit cell 115, unit cell 115à signal transmission line group OCI6à unit cell 116.

Next, in step S320, the communication request is set, that is, the access requirement for setting the information transmission is proposed by the access device 120 or the unit cell 115, and the communication requirement is to extract data or deposit data. In step S330, it may be determined according to the setting of step S320 that the information transmission is transmitted from the cell 115 to the access device 120 or transmitted by the access device 120 to the unit cell 115. When it is determined in step S330 that the information transmission is transmitted from the cell 115 to the access device 120, steps S341 to S343 are performed. In contrast, when it is determined in step S330 that the information transmission is transmitted from the access device 120 to the unit cell 115, execution is performed. Steps S351 to S354.

In step S341, the unit cell 115 can divide the 32-bit data into four 8-bit data E, A, D, and B, and the data E and A thereof are {E, X, A, X}. The format is transmitted to the cells 112, 116 through the signal transmission line groups OCI4, OCI6 in the form of 24-bits, where X indicates that the data in the field is don't care. Thereby, the cells 112, 116 can obtain the data A, E respectively according to the order of the data fields of {E, X, A, X}. Next, in step S342, the unit cell 115 transmits the data D to the unit cell 112 through the signal transmission line group OCI4 in the form of {X, X, D, X} in the form of 24-bit, respectively, and then the unit cell 112 transmits The signal transmission line group OCI1 transmits the material D to the unit cell 111 in the format of {X, X, D, X}, so that the unit cell 111 can obtain the data D.

In step S343, the cells 112, 115, 116, 111 transfer the data E, B, A, D to the bonding pad to which they belong, and further, through the connection path of the bonding pad and the access device 120, the data E, B, A, and D are transmitted to the access device 120 to complete a data transfer operation (step S360), and return to step S330 to prepare for the next data transfer operation.

Incidentally, in step S343, the time at which the unit cells 112, 115, 116, 111 transmit data to the access device 120 may not necessarily be uniform. The data B corresponding to the cell 115 is obtained first, and can be transmitted to the access device 120 first, and the data E and A of the cells 116 and 112 can be transmitted later. The data D corresponding to the unit cell 111 can be transmitted at the latest. Of course, the time for each unit cell 112, 115, 116, 111 to transmit data to the access device 120 can be adjusted according to the actual operation state of the access device 120, without particular limitation.

On the other hand, in step S351, the access device 120 divides the data to be transmitted into data E, B, D, and A, and transmits the data E, B, and the electrical connection formed by the pads on the unit cell. D and A are transmitted to the unit cells 116, 115, 111, and 112, respectively. Next, in step S352, the cell 112 transmits the data A to the cell 115 through the signal transmission line group OCI4, the cell 116 transmits the data E to the cell 115 through the signal transmission line group OCI6, and the cell 111 transmits the data through the signal transmission line group OCI1. D to unit cell 115.

In step S353, the unit cell 112 further transmits the material D to the unit cell 115 through the signal transmission line group OCI4, and, in step S354, the unit cell 115 can receive the data E, B, D, A, and through the combined data E, B, D, and A obtain the complete data, and complete the transmission operation of a data (step S360). Then, the process returns to step S330 to prepare for the next data transfer operation.

In summary, the present invention performs a data transmission operation through an electrical connection path formed by the interface cell and the access device, and a signal transmission line group between the unit cell and the interface cell. Among them, the number of data transmission between the access device and the interface cell can be minimized, and the information transmission between the relatively high-speed signal transmission line group between the cells can effectively improve the efficiency of data transmission.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧ data collection system
110‧‧‧Multicell wafer
120‧‧‧Access device
SUB‧‧‧Semiconductor substrate
111~116‧‧‧ unit cell
OCI1~OCI7‧‧‧Signal transmission line group
PAD‧‧‧ pads
DA1~DA4‧‧‧ data field
PA1, PA3, PA4, PA2‧‧‧ electrical connection path
S310~S360‧‧‧ Data transmission steps

FIG. 1 is a schematic diagram of a data collection system according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a transmission mode of the data collection system 100 according to an embodiment of the present invention. FIG. 3 is a flow chart showing the operation of data transmission according to an embodiment of the present invention.

100‧‧‧ data collection system

110‧‧‧Multicell wafer

120‧‧‧Access device

SUB‧‧‧Semiconductor substrate

111~116‧‧‧ unit cell

OCI1~OCI7‧‧‧Signal transmission line group

PAD‧‧‧ pads

Claims (10)

A data collection system comprising: a multi-cell wafer, comprising: a semiconductor substrate; a plurality of unit cells disposed on the semiconductor substrate, wherein each of the two unit cells has a space between adjacent cells; And a plurality of signal transmission line groups respectively disposed on at least a portion of the spaced spaces for performing signal transmission between at least a portion of adjacent cells, wherein the poly unit wafer is usable And the multi-cell wafer is cut through a portion of the spaced spaces to cut a portion of the signal transmission line groups, so that the multi-cell wafer is divided into a plurality of sub-wafers, wherein the cut portions are The chip is still usable; and an access device is coupled to the plurality of interface cells in the unit cells, wherein the access device transmits the interface cells and one or more of the group of signal transmission lines Come and set up a unit cell for data transmission. The data collection system of claim 1, wherein the interface cells have a plurality of pads, and the access device is coupled to the pads on the interface cells. The data transmission system of claim 1, wherein each of the signal transmission line groups has a plurality of metal wires, and the metal wires are disposed on the semiconductor substrate. The data collection system of claim 1, wherein the access device distinguishes the first data into a plurality of second data when the access device is to transmit a first data to the set unit cell. And transmitting the second data to the interface cells, and the interface cells transmit the second data to the set cell through one or more of the group of signal transmission lines. The data collection system of claim 4, wherein the interface cells respectively set a plurality of transmission paths according to a positional relationship with the set unit cell, and the interface cells are respectively determined according to the The transmission path respectively transmits the second data to the set unit cell. The data collection system of claim 1, wherein when the access device is to receive a first data transmitted by the setting unit cell, the setting unit cell distinguishes the first data into a plurality of And transmitting, by the one or more of the group of signal transmission lines, the second data to the interface cells, and the access device obtains the second data by the interface cells And borrow to get the first information. The data collection system of claim 6, wherein the setting unit sets a plurality of transmission paths to respectively transmit the second data to the interface cells, and each of the transmission paths is respectively configured according to the set unit cell And the positional relationship of the interface cells is set. The data transmission system of claim 1, wherein each of the group of signal transmission lines provides a transmission data width greater than a transmission data width between the access device and each of the interface cells. The data collection system of claim 1, wherein the setting unit cell is one of the interface unit cells. The data collection system of claim 1, wherein the space between adjacent cells is provided as a cutting space.