TWI568054B - Organic light - emitting diodes and their packaging methods - Google Patents

Description

Organic light emitting diode and packaging method thereof

The invention relates to an organic light emitting diode and a packaging method thereof, in particular to an organic light emitting diode which contributes to improving the service life of the product and the package yield, and a packaging method of the organic light emitting diode.

Compared with liquid crystal display (LCD) technology, the use of Organic Light-Emitting Diode (OLED) display technology has many advantages, such as: light and thin (less than 1mm thickness), Wide viewing angle (up to 170 degrees), no need for backlight, high application temperature range (-40°C~70°C), microsecond response time (Response Time) and advantages in flexible and transmissive fields. However, the organic light-emitting layer material in the organic light-emitting diode or the high-activity cathode metal has a high sensitivity reaction to moisture and oxygen, so that the organic light-emitting diode must be packaged before it becomes a product. In order to improve the stability of the product and extend its service life.

The existing packaging methods are roughly as follows:

1. Hermetic packaging for hard substrates, such as (a) Glue & Getter packaging process, mainly using a glass or metal cover, on its inner surface And a getter is combined with a substrate on which an organic light-emitting unit is formed and coated with a photoresist (Glue), and then irradiated with ultraviolet light to cure the photoresist to complete a packaging operation, wherein the organic The light emitting unit includes an anode, an organic light emitting layer and a cathode; and (b) a Frit glass packaging process for melting the glass to be sintered (Frit glass) onto the glass and the substrate by using a laser beam In this packaging technology, it should be noted that the coefficient of thermal expansion (CTE) of the glass to be sintered needs to be close to the substrate and the cover plate, so as to avoid excessive deviation of the thermal expansion coefficient and cause alignment deviation during packaging.

Second, it can be applied to the hermetic packaging of flexible substrates, such as (a) thin film packaging process, mainly on the flexible substrate on which the organic light-emitting unit has been formed, and continue to deposit multiple layers of inorganic film and organic film to block the outside water Gas and oxygen are a kind of packaging process developed in response to the trend of thinning products, but the disadvantage is that the film deposition process is not only time consuming, but also the film forming equipment required is expensive; and (b) pressure sensitive adhesive packaging process The cover plate can be bonded to the substrate by directly attaching a layer of pressure sensitive adhesive tape (PSA tape) to the flexible substrate on which the organic light-emitting unit has been formed. It is a packaging technology that is especially suitable for large-scale flat-panel displays. It not only has a fast packaging speed, but also facilitates mass production, and can also effectively reduce packaging costs.

However, the pressure-sensitive adhesive tape packaging process technology directly attaches the pressure-sensitive adhesive tape to the top surface of the organic light-emitting unit, and therefore, the adhesive substrate in the pressure-sensitive adhesive tape is substantially The organic light-emitting unit is directly damaged, resulting in a decrease in carrier mobility (Mobility). In addition, since the adhesion between the organic light-emitting unit and the substrate is poor, when the pressure-sensitive adhesive tape is in direct contact with the organic light-emitting unit, The organic light-emitting unit will produce a non-defective defect due to the action of the pressure-sensitive adhesive tape itself, and the organic light-emitting unit will be desorbed from the substrate to cause peeling under the action of strong adhesive force. Therefore, there are shortcomings that are not conducive to improving product yield.

In addition, the pressure-sensitive adhesive tape not only cannot absorb the gas from the outside, but may also be defined by the substrate and the cover plate due to the presence of an material having an out-gassing component in the adhesive substrate. Excessive moisture and oxygen in the package space further affect the stability of the organic light-emitting unit and lead to a shortened service life.

Therefore, the object of the present invention is to provide an organic product which can improve product yield, contribute to mass production, and maintain good gas barrier effect and absorb moisture and oxygen in the package space, thereby improving product service life. Light-emitting diode.

Another object of the present invention is to provide a method of packaging an organic light emitting diode.

Another object of the present invention is to provide a packaging method for another organic light emitting diode.

Therefore, the organic light emitting diode of the present invention comprises a substrate and a cover plate corresponding to the substrate, an organic light emitting unit, a pressure sensitive adhesive, and a spacer moisture absorbing unit.

The substrate and the cover plate cooperate with each other to define a package space, and the substrate includes an upper surface, and the cover plate includes a lower surface.

The organic light emitting unit is disposed on an upper surface of the substrate.

The pressure sensitive adhesive is disposed on a lower surface of the cover plate for firmly adhering the cover to the substrate.

The interval moisture absorbing unit is disposed between the pressure sensitive adhesive and the organic light emitting unit to separate the organic light emitting unit from the pressure sensitive adhesive, and maintain the drying of the packaging space, when the pressure sensitive adhesive itself adheres When the pulling force desorbs the interval absorbing unit to the organic light emitting unit, the organic light emitting unit cannot be decoupled from the upper surface of the substrate.

The effect of the organic light-emitting diode of the present invention is that the spacer moisture absorbing unit is used to prevent the adhesive force of the pressure sensitive adhesive from directly acting on the organic light-emitting unit, thereby improving the product yield, and the interval moisture absorbing unit is also The organic light-emitting unit has a function of drying the package space, so that the water-vapor and the oxygen-sensitive reaction can increase the service life due to the dry package space.

The encapsulation method of the organic light-emitting diode of the present invention is used to manufacture the organic light-emitting diode as described above, and comprises the following steps: (A) preparation operation: preparing a substrate having an organic light-emitting unit, including a lower surface a cover plate, a spacer moisture absorbing unit, and a pressure sensitive adhesive disposed on a lower surface of the cover plate, the pressure sensitive adhesive comprising a bottom surface. (B) Pre-operation: The interval moisture absorbing unit is placed on the bottom surface of the pressure-sensitive adhesive. (C) Pressure bonding industry: the cover plate is firmly bonded to the substrate by the adhesiveness of the pressure sensitive adhesive, When the adhesive tension of the pressure sensitive adhesive itself causes the interval moisture absorbing unit to be desorbed to the organic light emitting unit, the organic light emitting unit cannot be decoupled from the upper surface of the substrate.

The method of the method for encapsulating the organic light-emitting diode of the present invention is that the invention not only has a small number of process steps, is simple and time-saving, but also facilitates mass production. The present invention utilizes the interval moisture absorbing unit to press the organic light-emitting unit with the pressure. The design of the sensitive gels separated from each other can also help to improve the package yield.

Another method for packaging an organic light-emitting diode according to the present invention is for manufacturing the organic light-emitting diode as described above, and comprises the following steps: (A) preparing a material: preparing a substrate having an organic light-emitting unit, including a surface cover, a spacer moisture absorbing unit, and a pressure sensitive adhesive disposed on the lower surface of the cover, the organic light emitting unit including a top surface. (B) Pre-operation: The interval moisture absorbing unit is placed on the top surface of the organic light-emitting unit. (C) pressure bonding industry: the cover plate is firmly bonded to the substrate by the adhesiveness of the pressure sensitive adhesive, wherein the adhesive absorption force of the pressure sensitive adhesive itself causes the interval moisture absorbing unit to be desorbed to the organic light emitting unit At this time, the organic light emitting unit cannot be decoupled from the upper surface of the substrate.

The efficacy of the encapsulation method of another organic light-emitting diode of the present invention can also achieve the purpose of improving the package yield and facilitating mass production because of the simple process steps.

1‧‧‧Substrate

10‧‧‧Package space

11‧‧‧ upper surface

2‧‧‧ Cover

21‧‧‧ Lower surface

3‧‧‧Organic lighting unit

3'‧‧‧Organic lighting unit

31‧‧‧ top surface

32‧‧‧Anode

33‧‧‧Organic light-emitting layer

34‧‧‧ cathode

4‧‧‧ Pressure sensitive adhesive

41‧‧‧ bottom

5‧‧‧Interval moisture absorption unit

100‧‧‧Stocking operations

100’‧‧‧Stocking operations

200‧‧‧Pre-installation

200’‧‧‧Pre-installation

300‧‧‧Compression cooperation

300’‧‧‧Compound cooperation

Other features and effects of the present invention will be directed to the implementation of the drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view showing an embodiment of an organic light emitting diode of the present invention; FIG. 2 is a schematic cross-sectional view showing the direction along the line II-II of FIG. 1; It is a top view showing a flat display using a plurality of organic light emitting diodes of the present invention to display images; FIG. 4 is a schematic cross-sectional view showing the direction of the IV-IV cut line in FIG. 3; FIG. 5 is a schematic view illustrating An interval moisture absorbing unit of the embodiment of the present invention is in the form of a sheet; FIG. 6 is a schematic view showing a variation of the interval absorbing unit of the embodiment of the present invention, in which the interval absorbing unit is Fig. 7 is a schematic view showing another variation of the interval absorbing unit of the embodiment of the present invention, in which the interval absorbing unit is in the form of powder and granules; A flow chart of a first embodiment of a method for packaging an organic light-emitting diode; FIG. 9 is a schematic view showing a preparation operation of the first embodiment of the method for packaging an organic light-emitting diode of the present invention; FIG. Diode packaging method A schematic view of one embodiment of the pre-job first embodiment; FIG. 11 is a schematic view of one embodiment of a first embodiment of the pressure sector cooperation encapsulation method OLED of the present invention; 12 is a flow chart of a second embodiment of a method for packaging an organic light-emitting diode according to the present invention; FIG. 13 is a schematic view showing a preparation operation of the second embodiment of the method for packaging an organic light-emitting diode according to the present invention; A front view of the second embodiment of the method for packaging an organic light emitting diode of the present invention; and FIG. 15 is a schematic view of the second embodiment of the method for packaging the organic light emitting diode of the present invention. .

Hereinafter, the present invention will be described with reference to the drawings, and it should be noted that dimensions such as thickness and length shown in the respective drawings are different from actual articles.

Referring to FIG. 1 and FIG. 2, an embodiment of the organic light emitting diode of the present invention comprises a substrate 1 and a cover plate 2 corresponding to the substrate 1, an organic light emitting unit 3, a pressure sensitive adhesive 4, and a spacer. Wet unit 5. It can be understood that a plurality of organic light-emitting units 3, 3' are deposited on the substrate 1 and deployed in an array to obtain a flat display for displaying images, as shown in FIGS. 3 and 4.

The substrate 1 and the cover 2 are both used to protect and package the organic light emitting unit 3, and cooperate with each other to define a package space 10. The substrate 1 includes an upper surface 11. The material of the substrate 1 can be one of glass, ceramic, metal and plastic materials. In the embodiment, the substrate 1 is made of a plastic material having a gas barrier function. In addition, the plastic material can use polyethylene terephthalate (PET), polyimides (PI) or polyethylene naphthalate (Polyethylene Naphthalate). PEN). Further, the substrate 1 may be transparent or opaque.

The cover plate 2 includes a lower surface 21, and the cover plate 2 can be made of one of glass, ceramic, metal and plastic materials. In the embodiment, the cover plate 2 is made of a plastic material having a gas barrier function. The selection of the respective materials of the substrate 1 and the cover plate 2 is well known to those skilled in the art and is not the technical focus of the present invention, and will not be described in detail herein.

The organic light emitting unit 3 is disposed on the upper surface 11 of the substrate 1. The organic light emitting unit 3 includes a top surface 31, an anode 32 formed on the substrate 1, an organic light emitting layer 33 formed on the anode 32, and a light emitting layer formed on the anode 32. Cathode 34 on layer 33. Preferably, the organic light emitting unit 3 further includes a hole transport layer (not shown) interposed between the anode 32 and the organic light emitting layer 33, and an electron between the organic light emitting layer 33 and the cathode 34. A transport layer (not shown) is used, thereby increasing the luminous efficiency of the organic light-emitting unit 3.

The material of the anode 32 is not particularly limited, and is usually a metal oxide of a high work function such as Indium Tin Oxide, Znic Tin Oxide, and Indium Znic Oxide. Transparent guide Transparent Conductive Oxides (TCOs). The material of the cathode 34 is not particularly limited, and is usually a material having a low work function of magnesium (Mg), magnesium silver alloy (Mg-Ag), lithium (Li), and calcium (Ca). Since the composition and structure of the organic light-emitting unit 3 are not the technical focus of the present invention, they will not be described herein.

The pressure sensitive adhesive 4 is disposed on the lower surface 21 of the cover 2, and includes a bottom surface 41 for firmly adhering the cover 2 to the substrate 1. It should be noted that, in addition to being adhered to the upper surface 11 of the substrate 1, the pressure sensitive adhesive 4 substantially adheres to the patterned anode 32 trace, as shown in FIG.

The interval absorbing unit 5 is disposed between the pressure sensitive adhesive 4 and the organic light emitting unit 3, and more specifically, the spaced absorbing unit 5 is disposed on the bottom surface 41 of the pressure sensitive adhesive 4 for The light emitting unit 3 is spaced apart from the pressure sensitive adhesive 4 and maintains the drying of the package space 10. In detail, since the interval absorbing unit 5 is disposed between the illuminating unit 3 and the pressure sensitive adhesive 4, the adhesive tension of the pressure sensitive adhesive 4 itself can only affect the interval absorbing unit 5 substantially. Desorbed from the organic light-emitting unit 3, and the organic light-emitting unit 3 cannot be further decoupled from the upper surface 11 of the substrate 1, that is, because the adhesive force of the pressure-sensitive adhesive 4 itself cannot directly affect the organic light-emitting The unit 3 can reduce the occurrence of defects in the organic light-emitting unit 3 due to the adhesive force of the pressure-sensitive adhesive 4 itself, and avoid peeling between the organic light-emitting unit 3 and the substrate 1.

In the present embodiment, the spacer unit 5 includes a main substrate 51 having a function of absorbing moisture, and a sub-substrate 52 for mixing with the main substrate 51 to form a sheet, as shown in FIG. Show. The main substrate 51 having the function of absorbing moisture contained in the interval absorbing unit 5 can be selected from the group consisting of zirconium (Zr), titanium (Ti), hafnium (Hf), niobium (Nb), tantalum (Ta), and chromium. a group consisting of (Cr), molybdenum (Mo), iron (Fe), ruthenium (Ru), nickel (Ni), and cobalt (Co), preferably, also selected from calcium oxide (CaO), oxidation a group consisting of BaO, CaCO ₃ , P ₂ O ₅ , Zeolite, Silica Gel, and Alumina, in this embodiment The main substrate 51 is made of calcium carbonate. The sub-substrate 52 of the inter-hygroscopic unit 5 is made of polyethylene (PE), polyethylene terephthalate, polycarbonate (Polycarbonate, PC for short), and polypropylene (PP). In one embodiment, in the embodiment, the sub-substrate 52 is made of polyethylene. In addition, the sub-substrate 52 can also adopt other materials suitable for low-temperature processing, so that it is not required to be described. Plastic is limited.

In the present embodiment, the interval absorbing unit 5 is in the form of a sheet, and is prepared by mixing the main substrate 51 in the form of powder and the sub-substrate 52 in the form of a pellet, and heating and melting, and then using the machine. It is rolled to a thickness of between about 20 micrometers (μm) and 100 micrometers. It should be noted that the thickness of the interval absorbing unit 5 is generally between about 10 micrometers and 1 millimeter (mm), but not limited thereto. In addition, in a plan view, the peripheral edge of the interval moisture absorbing unit 5 is adjacent to the periphery of the organic light emitting unit 3, and the peripheral edge of the interval moisture absorbing unit 5 can be located in the periphery of the organic light emitting unit 3, and between the two The distance is not more than 1 mm, as shown in FIG. 1; the periphery of the interval moisture absorbing unit 5 can also surround the periphery of the organic light emitting unit 3, and the distance between the two is not more than 2 mm; it can also be understood that the interval moisture absorbing unit 5 The periphery can also substantially overlap the periphery of the organic light-emitting unit 3.

Referring to Figure 6, a variation of the intervening moisture absorbing unit 5 is shown. In this variation, the spacer unit 5 includes the main substrate 51 having a function of absorbing moisture, and a sub-substrate 53 for mixing with the main substrate 51 to form a slurry. The sub-substrate 53 is an anhydrous solvent (Anhydrous Solvent), and thus, the intervening moisture absorbing unit 5 in a slurry form can be obtained.

Referring to Fig. 7, another variation of the interval moisture absorbing unit 5 is shown. In this variation, the interval of the moisture absorbing unit 5 is in the form of powder and granules, and is prepared by uniformly mixing the main substrate 51 having a smaller particle diameter and the sub-substrate 52 having a larger particle diameter with each other. The spaced apart moisture absorbing unit 5 is obtained in a volume. It should be noted that when the particle diameter of the main substrate 51 is sized to effectively prevent the pressure sensitive adhesive 4 from directly contacting the organic light emitting unit 3, the spacer moisture absorbing unit 5 in the form of powder can also be used. It consists only of the main substrate 51 having a space-absorbing function.

8 is a flowchart of a first embodiment of a method for packaging an organic light emitting diode according to the present invention. The first embodiment of the method for packaging an organic light emitting diode according to the present invention includes the following steps:

Step 1, as shown in FIG. 9, the preparation operation 100: preparing a substrate 1 having an organic light-emitting unit 3, a cover plate 2 including a lower surface 21, and a spacer moisture absorption The unit 5, and a pressure sensitive adhesive 4 disposed on the lower surface 21 of the cover plate 2. The pressure sensitive adhesive 4 includes a bottom surface 41.

Step 2: As shown in FIG. 10, the pre-work 200: the interval moisture absorbing unit 5 is disposed on the bottom surface 41 of the pressure sensitive adhesive 4.

Step 3: As shown in FIG. 11, the press cooperative 300: firmly bonds the cover 2 to the substrate 1 by utilizing the adhesiveness of the pressure sensitive adhesive 4 in a low oxygen dry environment.

In detail, when the interval moisture absorbing unit 5 prepared in the first step is in the form of a sheet or a powder, the package person or the machine can first set the interval moisture absorbing unit 5 in the second step. The preset position on the bottom surface 41 of the pressure sensitive adhesive 4 is passed through the precise alignment, and then the press cooperation 300 of the third step is performed by roller (roller) pressing.

In addition, when the interval moisture absorbing unit 5 prepared in the first step is in a slurry form, the packager or the machine may apply the interval moisture absorbing unit 5 to the pressure sensitive adhesive in the second step. The predetermined position on the bottom surface 41 of the 4, the spacer-shaped moisture absorbing unit 4 can be solidified by ultraviolet curing or vacuum hardening, and finally the roller is pressed. Step 3 of the cooperative industry 300. It should be noted here that the curing operation is not a necessary step, and thus the same purpose can be achieved.

Thus, regardless of whether the intervening moisture absorbing unit 5 is in the form of a sheet, a slurry, or a powder, the packaging method of the present invention can provide a low cost and a useful amount. An organic light-emitting diode that produces a good gas barrier effect and absorbs moisture and oxygen in the package space.

12 is a flowchart of a second embodiment of a method for packaging an organic light-emitting diode according to the present invention. The second embodiment of the method for packaging an organic light-emitting diode according to the present invention includes the following steps:

Step 1, as shown in FIG. 13, the preparation operation 100': preparing a substrate 1 having an organic light-emitting unit 3, a cover plate 2 including a lower surface 21, a spacer moisture absorbing unit 5, and a cover plate The pressure sensitive adhesive 4 of the lower surface 21 of 2. The organic light emitting unit 3 includes a top surface 31.

Step 2, as shown in FIG. 14, the pre-operation 200': the interval moisture absorbing unit 5 is disposed on the top surface 31 of the organic light-emitting unit 3.

Step 3: As shown in FIG. 15, the press bonding industry 300': the cover plate 2 is firmly bonded to the substrate 1 by the adhesiveness of the pressure sensitive adhesive 4 in a low oxygen drying environment.

In detail, when the interval moisture absorbing unit 5 prepared in the first step is in the form of a sheet or a powder, the packager or the machine can directly use the interval moisture absorbing unit having a predetermined size in the second step. After being placed on the top surface of the organic light-emitting unit 3, the press-working industry 300' of the third step is performed by roller pressing.

In addition, when the interval moisture absorbing unit 5 prepared in the first step is in a slurry state, the package person or machine may apply the interval moisture absorbing unit 5 to the organic light emitting unit in the second step. The top surface 31 of the slurry, the interval moisture absorption sheet The element 5 can be solidified by ultraviolet light curing or vacuum curing, and finally the press bonding industry 300' of the third step is carried out by roller pressing. It is added that the curing operation is not a necessary step.

Thus, the second embodiment of the packaging method of the present invention can achieve the same objects and effects as the first embodiment of the above-described packaging method of the present invention.

Through the above description, the advantages of the organic light-emitting diode of the present invention and the packaging method thereof can be summarized as follows:

1. The present invention utilizes the spacer moisture absorbing unit 5 to prevent the organic light emitting unit 3 from being directly attached to the substrate 1 by the adhesive force of the pressure sensitive adhesive 4, so that the organic light emitting unit 3 and the substrate 1 can be avoided. The peeling occurs therebetween, and the organic light-emitting unit 3 can be prevented from being damaged by the adhesive force of the pressure-sensitive adhesive 4 itself, thereby improving the yield of the product packaging operation.

2. The spacer moisture absorbing unit 5 of the present invention can absorb the gas from the pressure sensitive adhesive 4 in addition to the gas generated by the aging (Aging) or phase change of the organic light-emitting unit 3. The gas of gas, that is, the present invention further increases the service life of the organic light-emitting unit 3 because it can effectively dry the package space 10.

3. The packaging method provided by the present invention can improve the competitive advantage of the product itself, in addition to being simple and time-consuming to facilitate mass production, and also because the packaging equipment is cheap and beneficial to reduce costs. More preferably, the existing roll-to-roll fit (Roll to The production methods such as Roll), Roll to Sheet, or Sheet to Sheet can be packaged by the packaging method provided by the present invention.

In summary, the organic light-emitting diode of the present invention and its packaging method can achieve the object of the present invention.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.

1‧‧‧Substrate

10‧‧‧Package space

11‧‧‧ upper surface

2‧‧‧ Cover

21‧‧‧ Lower surface

3‧‧‧Organic lighting unit

31‧‧‧ top surface

32‧‧‧Anode

33‧‧‧Organic light-emitting layer

34‧‧‧ cathode

4‧‧‧ Pressure sensitive adhesive

41‧‧‧ bottom

5‧‧‧Interval moisture absorption unit

Claims (10)

An organic light emitting diode comprising: a substrate and a cover plate corresponding to the substrate, the substrate and the cover plate cooperate with each other to define a package space, the substrate comprises an upper surface, and the cover plate comprises a lower surface; An organic light emitting unit is disposed on the upper surface of the substrate; a pressure sensitive adhesive is disposed on the lower surface of the cover for firmly adhering the cover to the substrate; and a spacer moisture absorbing unit is disposed at the pressure Between the sensitive adhesive and the organic light emitting unit, the organic light emitting unit is separated from the pressure sensitive adhesive, and the drying of the packaging space is maintained, and the adhesive tension of the pressure sensitive adhesive itself desorbs the spaced moisture absorbing unit In the organic light-emitting unit, the organic light-emitting unit cannot be decoupled from the upper surface of the substrate. The organic light-emitting diode according to claim 1, wherein the interval moisture absorbing unit is in the form of a sheet, and comprises a main substrate with a space-absorbing function and a mixture for mixing with the main substrate to form a sheet. Sub-substrate. The organic light-emitting diode according to claim 2, wherein the secondary substrate is polyethylene. The organic light-emitting diode according to claim 1, wherein the interval moisture absorbing unit is in a slurry form, and comprises a main substrate with a space-absorbing function and a mixture for mixing with the main substrate to form a slurry. Sub-substrate. The organic light-emitting diode according to claim 4, wherein the secondary substrate is an anhydrous solvent. The organic light emitting diode according to claim 1, wherein the pressure sensitive adhesive comprises a bottom surface, and the spaced moisture absorbing unit is disposed on the bottom surface. The organic light-emitting diode according to claim 1, wherein the interval moisture absorbing unit has a form of powder particles. A method for packaging an organic light emitting diode comprises the following steps: (A) preparing a substrate: preparing a substrate having an organic light emitting unit, a cover plate including a lower surface, a spacer moisture absorbing unit, and a cover disposed on the cover a pressure sensitive adhesive on the lower surface of the plate, the pressure sensitive adhesive comprises a bottom surface; (B) a front working operation: the spaced moisture absorbing unit is disposed on the bottom surface of the pressure sensitive adhesive; (C) press cooperation: using the pressure sensitive adhesive The adhesive layer firmly bonds the cover plate to the substrate, wherein when the adhesive tension of the pressure sensitive adhesive itself causes the interval moisture absorbing unit to be detached from the organic light emitting unit, the organic light emitting unit cannot be decoupled The upper surface of the substrate. A method for packaging an organic light emitting diode comprises the following steps: (A) preparing a substrate: preparing a substrate having an organic light emitting unit, a cover plate including a lower surface, a spacer moisture absorbing unit, and a cover disposed on the cover a pressure sensitive adhesive on the lower surface of the plate, the organic light emitting unit includes a top surface; (B) a front working operation: the spaced moisture absorbing unit is disposed on a top surface of the organic light emitting unit; (C) press cooperation: using the pressure The adhesive property of the adhesive is firmly bonded to the substrate, wherein when the adhesive force of the pressure sensitive adhesive itself causes the interval moisture absorbing unit to be detached from the organic light emitting unit, the organic light emitting unit cannot be removed Attached to the upper surface of the substrate. The method of encapsulating an organic light-emitting diode according to claim 8 or 9, wherein the interval moisture absorbing unit prepared in the step (A) is one of a sheet shape, a slurry shape, and a powder particle shape. .