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TWI561687B - An electroplating method - Google Patents

An electroplating method

Info

Publication number
TWI561687B
TWI561687B TW101133276A TW101133276A TWI561687B TW I561687 B TWI561687 B TW I561687B TW 101133276 A TW101133276 A TW 101133276A TW 101133276 A TW101133276 A TW 101133276A TW I561687 B TWI561687 B TW I561687B
Authority
TW
Taiwan
Prior art keywords
electroplating method
electroplating
Prior art date
Application number
TW101133276A
Other languages
Chinese (zh)
Other versions
TW201407005A (en
Inventor
Kwok Wai Wong
Paul Henington
Yu Him Chiu
Kwong Cho Cheng
jie ling Huang
shi feng Zhang
Original Assignee
Process Automation Int Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Process Automation Int Ltd filed Critical Process Automation Int Ltd
Publication of TW201407005A publication Critical patent/TW201407005A/en
Application granted granted Critical
Publication of TWI561687B publication Critical patent/TWI561687B/en

Links

TW101133276A 2012-08-14 2012-09-12 An electroplating method TWI561687B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210288848.XA CN103590079A (en) 2012-08-14 2012-08-14 Electroplating method

Publications (2)

Publication Number Publication Date
TW201407005A TW201407005A (en) 2014-02-16
TWI561687B true TWI561687B (en) 2016-12-11

Family

ID=50080386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101133276A TWI561687B (en) 2012-08-14 2012-09-12 An electroplating method

Country Status (2)

Country Link
CN (1) CN103590079A (en)
TW (1) TWI561687B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108360047B (en) * 2018-04-11 2020-03-17 中国科学院半导体研究所 Electroplating clamp and using method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200930845A (en) * 2007-11-01 2009-07-16 Almex Pe Inc Tinuous plating treatment device
TW201204877A (en) * 2010-07-02 2012-02-01 Novellus Systems Inc Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5937360B2 (en) * 1977-01-26 1984-09-08 凸版印刷株式会社 Metal surface treatment equipment
JP3411103B2 (en) * 1994-09-14 2003-05-26 イビデン株式会社 Electroplating method, electroplating equipment, rack for electroplating
JP4339980B2 (en) * 2000-03-14 2009-10-07 沖プリンテッドサーキット株式会社 Electrolytic plating equipment
US6818115B2 (en) * 2001-10-19 2004-11-16 Viasystems Group, Inc. System and method for electrolytic plating
DE10153171B4 (en) * 2001-10-27 2004-09-16 Atotech Deutschland Gmbh Method and device for the electrolytic treatment of parts in continuous systems
JP4177626B2 (en) * 2002-09-20 2008-11-05 有限会社 関西エンジニアリング Electroplating method of wire, electroplating apparatus, and electroplated wire
CN201169649Y (en) * 2008-02-02 2008-12-24 赵永先 Transmission mechanism for circuit board electroplating machine
JP5569713B2 (en) * 2009-05-29 2014-08-13 日立化成株式会社 Electroless copper plating apparatus for thickening, electroless copper plating method for thickening, and manufacturing method of multilayer printed wiring board
CN201447514U (en) * 2009-09-08 2010-05-05 陕西昕宇表面工程有限公司 Shifting device for electroplating workpieces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200930845A (en) * 2007-11-01 2009-07-16 Almex Pe Inc Tinuous plating treatment device
TW201204877A (en) * 2010-07-02 2012-02-01 Novellus Systems Inc Control of electrolyte hydrodynamics for efficient mass transfer during electroplating

Also Published As

Publication number Publication date
TW201407005A (en) 2014-02-16
CN103590079A (en) 2014-02-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees