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TWI561674B - Method for modifying surface of resin substrate, method for forming metal coating film and laminate - Google Patents

Method for modifying surface of resin substrate, method for forming metal coating film and laminate

Info

Publication number
TWI561674B
TWI561674B TW104111413A TW104111413A TWI561674B TW I561674 B TWI561674 B TW I561674B TW 104111413 A TW104111413 A TW 104111413A TW 104111413 A TW104111413 A TW 104111413A TW I561674 B TWI561674 B TW I561674B
Authority
TW
Taiwan
Prior art keywords
laminate
coating film
resin substrate
metal coating
forming metal
Prior art date
Application number
TW104111413A
Other languages
Chinese (zh)
Other versions
TW201544626A (en
Inventor
Christopher Cordonier
Hideo Honma
Original Assignee
Kanto Gakuin School Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Gakuin School Corp filed Critical Kanto Gakuin School Corp
Publication of TW201544626A publication Critical patent/TW201544626A/en
Application granted granted Critical
Publication of TWI561674B publication Critical patent/TWI561674B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW104111413A 2014-05-23 2015-04-09 Method for modifying surface of resin substrate, method for forming metal coating film and laminate TWI561674B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014106656A JP2015221925A (en) 2014-05-23 2014-05-23 Method for treating surface modification of resin base material, method for forming metal film, and laminate

Publications (2)

Publication Number Publication Date
TW201544626A TW201544626A (en) 2015-12-01
TWI561674B true TWI561674B (en) 2016-12-11

Family

ID=54553778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111413A TWI561674B (en) 2014-05-23 2015-04-09 Method for modifying surface of resin substrate, method for forming metal coating film and laminate

Country Status (3)

Country Link
JP (1) JP2015221925A (en)
TW (1) TWI561674B (en)
WO (1) WO2015178101A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017179530A (en) * 2016-03-31 2017-10-05 旭化成株式会社 Plated product and method for manufacturing the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08253869A (en) * 1995-03-14 1996-10-01 Sharp Corp Electroless plating method for resin
JP2000129449A (en) * 1998-10-20 2000-05-09 Murata Mfg Co Ltd Production of chip-like electronic parts
JP2003027250A (en) * 2001-07-18 2003-01-29 Toyota Motor Corp Method of forming electroless plating film on resin
JP2004186661A (en) * 2002-10-07 2004-07-02 Tokai Rubber Ind Ltd Method of producing flexible printed circuit board
JP2007231362A (en) * 2006-03-01 2007-09-13 Kanto Gakuin Univ Surface Engineering Research Institute Electroless plating method for resin products
JP2009084596A (en) * 2007-09-27 2009-04-23 Dainippon Printing Co Ltd Method for producing metal pattern forming body

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19835917A1 (en) * 1998-08-07 2000-02-10 Basf Ag With energetic radiation and / or thermally curable binder
JP4738308B2 (en) * 2006-10-11 2011-08-03 株式会社関東学院大学表面工学研究所 Method for producing cycloolefin polymer material with metal film and cycloolefin polymer material with metal film obtained by using the method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08253869A (en) * 1995-03-14 1996-10-01 Sharp Corp Electroless plating method for resin
JP2000129449A (en) * 1998-10-20 2000-05-09 Murata Mfg Co Ltd Production of chip-like electronic parts
JP2003027250A (en) * 2001-07-18 2003-01-29 Toyota Motor Corp Method of forming electroless plating film on resin
JP2004186661A (en) * 2002-10-07 2004-07-02 Tokai Rubber Ind Ltd Method of producing flexible printed circuit board
JP2007231362A (en) * 2006-03-01 2007-09-13 Kanto Gakuin Univ Surface Engineering Research Institute Electroless plating method for resin products
JP2009084596A (en) * 2007-09-27 2009-04-23 Dainippon Printing Co Ltd Method for producing metal pattern forming body

Also Published As

Publication number Publication date
JP2015221925A (en) 2015-12-10
WO2015178101A1 (en) 2015-11-26
TW201544626A (en) 2015-12-01

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