TWI550249B - Method of manufacturing vapor chamber - Google Patents
Method of manufacturing vapor chamber Download PDFInfo
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- TWI550249B TWI550249B TW102131853A TW102131853A TWI550249B TW I550249 B TWI550249 B TW I550249B TW 102131853 A TW102131853 A TW 102131853A TW 102131853 A TW102131853 A TW 102131853A TW I550249 B TWI550249 B TW I550249B
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- metal cover
- head
- hole
- width
- capillary structure
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- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 81
- 239000002184 metal Substances 0.000 claims description 81
- 238000000034 method Methods 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明關於一種均溫板及其製造方法，尤指一種以卡合方式於二金屬蓋板之間形成支撐結構之均溫板及其製造方法。 The invention relates to a temperature equalizing plate and a manufacturing method thereof, in particular to a temperature equalizing plate which forms a supporting structure between two metal cover plates in a snapping manner and a manufacturing method thereof.
均溫板之工作原理係以其封閉於板狀腔體中工作流體之蒸發凝結循環作動，使其具快速均溫的特性，從而具快速熱傳導及熱擴散的功能。一般而言，均溫板係由金屬殼體、毛細結構及工作流體經退火、抽真空及封焊等製程所製成。此外，為了避免均溫板產生凹陷或隆起等問題，習知技術會在金屬殼體中設置複數個支撐柱，並且將支撐柱之兩端焊接於上下兩金屬蓋板。焊接製程的成本較高，因此會增加均溫板的製造成本。 The working principle of the uniform temperature plate is operated by the evaporation condensation cycle of the working fluid enclosed in the plate-shaped cavity, so that it has the characteristics of rapid average temperature, thereby having the functions of rapid heat conduction and heat diffusion. In general, the uniform temperature plate is made of a metal casing, a capillary structure, and a working fluid through annealing, vacuuming, and sealing. In addition, in order to avoid problems such as depression or bulging of the uniform temperature plate, the prior art may provide a plurality of support columns in the metal casing, and weld both ends of the support column to the upper and lower metal cover plates. The cost of the welding process is higher, thus increasing the manufacturing cost of the temperature equalizing plate.
本發明提供一種均溫板及其製造方法，其以卡合方式於二金屬蓋板之間形成支撐結構，以解決上述之問題。 The invention provides a temperature equalizing plate and a manufacturing method thereof, which form a supporting structure between two metal cover plates in a snapping manner to solve the above problems.
根據一實施例，本發明之均溫板包含一第一金屬蓋板以及一第二金屬蓋板。第一金屬蓋板上設有複數個第一支撐部，每一個第一支撐部具有一頭部以及一頸部，頭部自頸部延伸出，且頭部之寬度大於頸部之寬度。第二金屬蓋板上設有複數個第二支撐部，每一個第二支撐部具有一通孔以及一卡槽，卡槽位於通孔中，卡槽之寬度大於頭部之寬度，通孔之寬度小於頭部之寬度，且通孔之寬度大於頸部之寬度。頭部設置於卡槽中，且頸部設置於通孔中，以使第一支撐部與第二支撐部相互卡合。 According to an embodiment, the temperature equalization plate of the present invention comprises a first metal cover and a second metal cover. The first metal cover is provided with a plurality of first support portions, each of the first support portions has a head portion and a neck portion, and the head portion extends from the neck portion, and the width of the head portion is greater than the width of the neck portion. The second metal cover is provided with a plurality of second support portions, each of the second support portions has a through hole and a card slot, wherein the card slot is located in the through hole, the width of the card slot is greater than the width of the head, and the width of the through hole It is smaller than the width of the head, and the width of the through hole is larger than the width of the neck. The head is disposed in the card slot, and the neck portion is disposed in the through hole to engage the first support portion and the second support portion with each other.
根據另一實施例，本發明之均溫板之製造方法包含：提供一第一金屬蓋板以及一第二金屬蓋板，其中第一金屬蓋板上設有複數個第一支撐 部，每一個第一支撐部具有一頭部以及一頸部，頭部自頸部延伸出，頭部之寬度大於頸部之寬度，第二金屬蓋板上設有複數個第二支撐部，每一個第二支撐部具有一通孔以及一卡槽，卡槽位於通孔中，卡槽之寬度大於頭部之寬度，通孔之寬度小於頭部之寬度，且通孔之寬度大於頸部之寬度；以及將第一金屬蓋板與第二金屬蓋板對組，使頭部設置於卡槽中，且使頸部設置於通孔中，以使第一支撐部與第二支撐部相互卡合。 According to another embodiment, a method for manufacturing a temperature equalizing plate according to the present invention includes: providing a first metal cover and a second metal cover, wherein the first metal cover is provided with a plurality of first supports Each of the first support portions has a head portion and a neck portion, the head portion extends from the neck portion, the width of the head portion is greater than the width of the neck portion, and the second metal cover plate is provided with a plurality of second support portions. Each of the second supporting portions has a through hole and a card slot, wherein the slot is located in the through hole, the width of the slot is larger than the width of the head, the width of the through hole is smaller than the width of the head, and the width of the through hole is larger than the neck Width; and the first metal cover and the second metal cover are paired, the head is disposed in the card slot, and the neck is disposed in the through hole, so that the first support portion and the second support portion are mutually engaged Hehe.
綜上所述，本發明係分別於第一金屬蓋板與第二金屬蓋板上形成第一支撐部與第二支撐部，並且使第一支撐部與第二支撐部相互卡合，以於第一金屬蓋板與第二金屬蓋板形成支撐結構。由於本發明係以卡合方式於二金屬蓋板之間形成支撐結構，不僅製程簡單，且可有效提高均溫板之製造效率，進而降低製造成本。 In summary, the present invention forms a first support portion and a second support portion on the first metal cover and the second metal cover, respectively, and the first support portion and the second support portion are engaged with each other. The first metal cover and the second metal cover form a support structure. Since the present invention forms a supporting structure between the two metal cover plates in a snapping manner, the manufacturing process is simple, and the manufacturing efficiency of the temperature equalizing plate can be effectively improved, thereby reducing the manufacturing cost.
關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.
1、1'‧‧‧均溫板 1, 1'‧‧‧ temperate plate
10‧‧‧第一金屬蓋板 10‧‧‧First metal cover
12‧‧‧第二金屬蓋板 12‧‧‧Second metal cover
14‧‧‧毛細結構 14‧‧‧Capillary structure
16‧‧‧工作流體 16‧‧‧Working fluid
100‧‧‧第一支撐部 100‧‧‧First support
102‧‧‧頭部 102‧‧‧ head
104‧‧‧頸部 104‧‧‧ neck
106‧‧‧第一傾斜邊緣 106‧‧‧First inclined edge
120‧‧‧第二支撐部 120‧‧‧second support
122‧‧‧通孔 122‧‧‧through hole
124‧‧‧卡槽 124‧‧‧ card slot
126‧‧‧第二傾斜邊緣 126‧‧‧Second inclined edge
140‧‧‧片狀毛細結構 140‧‧‧Flake capillary structure
142‧‧‧柱狀毛細結構 142‧‧‧column capillary structure
A1、A2‧‧‧箭頭 A1, A2‧‧‧ arrows
W1、W2、W3、W4‧‧‧寬度 W1, W2, W3, W4‧‧‧ width
S10-S18‧‧‧步驟 S10-S18‧‧‧Steps
第1圖為根據本發明第一實施例之均溫板之製造方法的流程圖。 Fig. 1 is a flow chart showing a method of manufacturing a temperature equalizing plate according to a first embodiment of the present invention.
第2圖為沖壓前的均溫板的剖面示意圖。 Figure 2 is a schematic cross-sectional view of the temperature equalization plate before stamping.
第3圖為沖壓後的均溫板的剖面示意圖。 Figure 3 is a schematic cross-sectional view of the uniform temperature plate after stamping.
第4圖為第一支撐部與第二支撐部呈圓形的立體示意圖。 Fig. 4 is a perspective view showing the first support portion and the second support portion in a circular shape.
第5圖為第一支撐部與第二支撐部呈方形的立體示意圖。 Fig. 5 is a schematic perspective view showing the first support portion and the second support portion in a square shape.
第6圖為第一支撐部與第二支撐部呈方形的另一立體示意圖。 Fig. 6 is another perspective view showing the first support portion and the second support portion being square.
第7圖為根據本發明第二實施例之沖壓前的均溫板的剖面示意圖。 Fig. 7 is a schematic cross-sectional view showing a temperature equalizing plate before punching according to a second embodiment of the present invention.
請參閱第1圖至第3圖，第1圖為根據本發明第一實施例之均溫板之製造方法的流程圖，第2圖為沖壓前的均溫板1的剖面示意圖，第3圖為沖壓後的均溫板1的剖面示意圖。 1 to 3, FIG. 1 is a flow chart of a method for manufacturing a temperature equalizing plate according to a first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of a temperature equalizing plate 1 before pressing, FIG. It is a schematic cross-sectional view of the uniform temperature plate 1 after stamping.
首先，執行步驟S10，提供一第一金屬蓋板10以及一第二金屬蓋板12。如第2圖所示，第一金屬蓋板10上設有複數個第一支撐部100，且第二金屬蓋板12上設有複數個第二支撐部120。於此實施例中，第一金屬蓋板10與第二金屬蓋板12可由銅或鋁等軟質金屬以擠製的方式製成，使得第一支撐部100與第一金屬蓋板10一體成型，且第二支撐部120與第二金屬蓋板12一體成型。每一個第一支撐部100具有一頭部102以及一頸部104，且頭部102自頸部104延伸出，其中頭部102之寬度W1大於頸部104之寬度W2。此外，每一個第二支撐部120具有一通孔122以及一卡槽124，且卡槽124位於通孔122中，其中卡槽124之寬度W4大於頭部102之寬度W1，通孔122之寬度W3小於頭部102之寬度W1，且通孔122之寬度W3大於頸部104之寬度W2。 First, step S10 is performed to provide a first metal cover 10 and a second metal cover 12. As shown in FIG. 2, the first metal cover 10 is provided with a plurality of first support portions 100, and the second metal cover 12 is provided with a plurality of second support portions 120. In this embodiment, the first metal cover 10 and the second metal cover 12 may be made of a soft metal such as copper or aluminum in an extruded manner, so that the first support portion 100 and the first metal cover 10 are integrally formed. The second support portion 120 is integrally formed with the second metal cover 12 . Each of the first support portions 100 has a head portion 102 and a neck portion 104, and the head portion 102 extends from the neck portion 104, wherein the width W1 of the head portion 102 is greater than the width W2 of the neck portion 104. In addition, each of the second supporting portions 120 has a through hole 122 and a slot 124, and the slot 124 is located in the through hole 122, wherein the width W4 of the slot 124 is greater than the width W1 of the head 102, and the width W3 of the through hole 122 It is smaller than the width W1 of the head 102, and the width W3 of the through hole 122 is larger than the width W2 of the neck 104.
接著，執行步驟S12，於第一金屬蓋板10與第二金屬蓋板12之間形成一毛細結構14，其中毛細結構14可為溝槽式毛細結構、多孔性毛細結構、網狀毛細結構、粉末燒結毛細結構或複合式毛細結構，視實際應用而定。需說明的是，上述之複合式毛細結構可由溝槽式毛細結構、多孔性毛細結構、網狀毛細結構與粉末燒結毛細結構中的至少兩種毛細結構組成。此外，毛細結構14可包含片狀毛細結構140以及柱狀毛細結構142。於此實施例中，片狀毛細結構140係形成於第一金屬蓋板10與第二金屬蓋板12內側壁上，且可將柱狀毛細結構142套設於第二金屬蓋板12之第二支撐部120上。 Next, step S12 is performed to form a capillary structure 14 between the first metal cover 10 and the second metal cover 12, wherein the capillary structure 14 may be a grooved capillary structure, a porous capillary structure, a mesh capillary structure, Powder sintered capillary structure or composite capillary structure, depending on the application. It should be noted that the composite capillary structure described above may be composed of at least two capillary structures of a grooved capillary structure, a porous capillary structure, a network capillary structure and a powder sintered capillary structure. Additionally, the capillary structure 14 can include a sheet-like capillary structure 140 and a cylindrical capillary structure 142. In this embodiment, the sheet-like capillary structure 140 is formed on the inner side wall of the first metal cover 10 and the second metal cover 12, and the columnar capillary structure 142 can be sleeved on the second metal cover 12 Two support portions 120.
接著，執行步驟S14，將第一金屬蓋板10與第二金屬蓋板12對組，使第一支撐部100之頭部102設置於第二支撐部120之卡槽124中，且使第一支撐部100之頸部104設置於第二支撐部120之通孔122中，以使第一支撐部100與第二支撐部120相互卡合。在將第一金屬蓋板10與第二金屬蓋板12對組時，可先使第一支撐部100之頭部102抵接於第二支撐部120之通孔122。接著，朝第2圖所示之箭頭A1與A2的方向沖壓第一金屬蓋板10與第二金屬蓋板12，以使第一支撐部100之頭部102通過第二支撐部120之 通孔122而卡合於第二支撐部120之卡槽124中。 Then, in step S14, the first metal cover 10 and the second metal cover 12 are paired, and the head 102 of the first support portion 100 is disposed in the card slot 124 of the second support portion 120, and the first The neck portion 104 of the support portion 100 is disposed in the through hole 122 of the second support portion 120 such that the first support portion 100 and the second support portion 120 are engaged with each other. When the first metal cover 10 and the second metal cover 12 are paired, the head 102 of the first support portion 100 may be abutted against the through hole 122 of the second support portion 120. Next, the first metal cover 10 and the second metal cover 12 are punched in the directions of the arrows A1 and A2 shown in FIG. 2 such that the head 102 of the first support portion 100 passes through the second support portion 120. The through hole 122 is engaged with the card slot 124 of the second support portion 120.
接著，執行步驟S16，將第一金屬蓋板10與第二金屬蓋板12周圍密封(例如，封焊)，且於第一金屬蓋板10與第二金屬蓋板12之間填充一工作流體(例如，水)16。接著，執行步驟S18，將第一金屬蓋板10與第二金屬蓋板12之間的腔體抽真空，以完成第3圖所示之均溫板1的製造。如第3圖所示，製造完成之均溫板1即包含上述之第一金屬蓋板10、第二金屬蓋板12、毛細結構14以及工作流體16。由於本發明係以卡合方式於第一金屬蓋板10與第二金屬蓋板12之間形成支撐結構，不僅製程簡單，且可有效提高均溫板1之製造效率，進而降低製造成本。 Then, step S16 is performed to seal (eg, seal) the first metal cover 10 and the second metal cover 12, and fill a working fluid between the first metal cover 10 and the second metal cover 12. (for example, water) 16. Next, in step S18, the cavity between the first metal cover 10 and the second metal cover 12 is evacuated to complete the manufacture of the temperature equalizing plate 1 shown in FIG. As shown in FIG. 3, the manufactured uniform temperature plate 1 includes the first metal cover 10, the second metal cover 12, the capillary structure 14, and the working fluid 16 described above. Since the present invention forms a supporting structure between the first metal cover 10 and the second metal cover 12 in a snapping manner, the manufacturing process is simple, and the manufacturing efficiency of the temperature equalizing plate 1 can be effectively improved, thereby reducing the manufacturing cost.
請參閱第4圖至第6圖，第4圖為第一支撐部100與第二支撐部120呈圓形的立體示意圖，第5圖為第一支撐部100與第二支撐部120呈方形的立體示意圖，第6圖為第一支撐部100與第二支撐部120呈方形的另一立體示意圖。如第4圖所示，第一支撐部100與第二支撐部120可呈相互配合的圓形。如第5圖所示，第一支撐部100與第二支撐部120可呈相互配合的方形，其中第一支撐部100與第二支撐部120可以擠製的方式形成長條狀。如第6圖所示，本發明可根據實際應用需求，將第5圖中長條狀的第一支撐部100與第二支撐部120銑削成複數個較短的第一支撐部100與第二支撐部120。 Please refer to FIG. 4 to FIG. 6 . FIG. 4 is a schematic perspective view of the first support portion 100 and the second support portion 120 in a circular shape. FIG. 5 is a first view of the first support portion 100 and the second support portion 120 . FIG. 6 is another perspective view showing the first support portion 100 and the second support portion 120 in a square shape. As shown in FIG. 4, the first support portion 100 and the second support portion 120 may have a circular shape that cooperates with each other. As shown in FIG. 5, the first support portion 100 and the second support portion 120 may have a square shape that cooperates with each other, and the first support portion 100 and the second support portion 120 may be formed into a strip shape in an extruded manner. As shown in FIG. 6, the first support portion 100 and the second support portion 120 of the long strip in FIG. 5 can be milled into a plurality of shorter first support portions 100 and second according to actual application requirements. Support portion 120.
當第一支撐部100與第二支撐部120呈第5圖或第6圖所示之方形時，除了上述之沖壓方式外，本發明亦可使第一金屬蓋板10與第二金屬蓋板12相對平行滑動，以使第一支撐部100之頸部104與頭部102分別嵌進第二支撐部120之通孔122與卡槽124中，進而使第一支撐部100與第二支撐部120相互卡合。 When the first supporting portion 100 and the second supporting portion 120 are square as shown in FIG. 5 or FIG. 6, the present invention can also make the first metal cover 10 and the second metal cover in addition to the above-mentioned pressing method. The first support portion 100 and the second support portion are respectively inserted into the through hole 122 and the card slot 124 of the second support portion 120, respectively. 120 are engaged with each other.
配合第2圖，請參閱第7圖，第7圖為根據本發明第二實施例之沖壓前的均溫板1'的剖面示意圖。均溫板1'與上述的均溫板1的主要不同之處在於，均溫板1'之第一支撐部100之頭部102具有一第一傾斜邊緣106，且 均溫板1'之第二支撐部120之通孔122具有一第二傾斜邊緣126，其中第一傾斜邊緣106之傾斜方向與第二傾斜邊緣126之傾斜方向相同。藉此，在沖壓的過程中，第一傾斜邊緣106會推擠第二傾斜邊緣126，使第二支撐部120產生彈性變形，以使第一支撐部100之頭部102通過第二支撐部120之通孔122而卡合於第二支撐部120之卡槽124中。換言之，藉由第一傾斜邊緣106與第二傾斜邊緣126的相互配合，可使沖壓過程更為順暢且提高組裝良率。於此實施例中，第一傾斜邊緣106與第二傾斜邊緣126係為弧面。然而，於另一實施例中，第一傾斜邊緣106與第二傾斜邊緣126亦可為平面。需說明的是，第7圖中與第2圖中所示相同標號的元件，其作用原理大致相同，在此不再贅述。 Referring to Fig. 2, please refer to Fig. 7. Fig. 7 is a schematic cross-sectional view of the temperature equalizing plate 1' before punching according to the second embodiment of the present invention. The main difference between the temperature equalizing plate 1' and the above-mentioned temperature equalizing plate 1 is that the head 102 of the first supporting portion 100 of the temperature equalizing plate 1' has a first inclined edge 106, and The through hole 122 of the second supporting portion 120 of the temperature equalizing plate 1' has a second inclined edge 126, wherein the inclined direction of the first inclined edge 106 is the same as the oblique direction of the second inclined edge 126. Thereby, during the pressing process, the first inclined edge 106 pushes the second inclined edge 126 to elastically deform the second supporting portion 120, so that the head 102 of the first supporting portion 100 passes through the second supporting portion 120. The through hole 122 is engaged with the card slot 124 of the second support portion 120. In other words, by the mutual cooperation of the first inclined edge 106 and the second inclined edge 126, the stamping process can be smoother and the assembly yield can be improved. In this embodiment, the first inclined edge 106 and the second inclined edge 126 are curved surfaces. However, in another embodiment, the first inclined edge 106 and the second inclined edge 126 may also be planar. It should be noted that the components of the same reference numerals as those shown in FIG. 2 have substantially the same operation principle, and are not described herein again.
綜上所述，本發明係分別於第一金屬蓋板與第二金屬蓋板上形成第一支撐部與第二支撐部，並且使第一支撐部與第二支撐部相互卡合，以於第一金屬蓋板與第二金屬蓋板形成支撐結構。由於本發明係以卡合方式於二金屬蓋板之間形成支撐結構，不僅製程簡單，且可有效提高均溫板之製造效率，進而降低製造成本。 In summary, the present invention forms a first support portion and a second support portion on the first metal cover and the second metal cover, respectively, and the first support portion and the second support portion are engaged with each other. The first metal cover and the second metal cover form a support structure. Since the present invention forms a supporting structure between the two metal cover plates in a snapping manner, the manufacturing process is simple, and the manufacturing efficiency of the temperature equalizing plate can be effectively improved, thereby reducing the manufacturing cost.
以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
1‧‧‧均溫板 1‧‧‧Wall plate
10‧‧‧第一金屬蓋板 10‧‧‧First metal cover
12‧‧‧第二金屬蓋板 12‧‧‧Second metal cover
14‧‧‧毛細結構 14‧‧‧Capillary structure
16‧‧‧工作流體 16‧‧‧Working fluid
100‧‧‧第一支撐部 100‧‧‧First support
102‧‧‧頭部 102‧‧‧ head
104‧‧‧頸部 104‧‧‧ neck
120‧‧‧第二支撐部 120‧‧‧second support
122‧‧‧通孔 122‧‧‧through hole
124‧‧‧卡槽 124‧‧‧ card slot
140‧‧‧片狀毛細結構 140‧‧‧Flake capillary structure
142‧‧‧柱狀毛細結構 142‧‧‧column capillary structure
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102131853A TWI550249B (en) | 2013-09-04 | 2013-09-04 | Method of manufacturing vapor chamber |
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| Application Number | Priority Date | Filing Date | Title |
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| TW102131853A TWI550249B (en) | 2013-09-04 | 2013-09-04 | Method of manufacturing vapor chamber |
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| Publication Number | Publication Date |
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| TW201510454A TW201510454A (en) | 2015-03-16 |
| TWI550249B true TWI550249B (en) | 2016-09-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI768335B (en) * | 2019-05-10 | 2022-06-21 | 訊凱國際股份有限公司 | Vapor chamber and manufacturing method of the same |
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|---|---|---|---|---|
| TWM381992U (en) * | 2009-11-26 | 2010-06-01 | Isystems Technology Inc | Uniform temperature heat sink with capillary structure |
| TW201032696A (en) * | 2009-02-20 | 2010-09-01 | Wen-Jin Chen | Superconducting element structure |
| WO2012068779A1 (en) * | 2010-11-24 | 2012-05-31 | Cai Yinglin | Heat exchange device for shower hot-water |
| WO2012113087A1 (en) * | 2011-02-22 | 2012-08-30 | Walter Schneider | Flat heat exchanger |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201032696A (en) * | 2009-02-20 | 2010-09-01 | Wen-Jin Chen | Superconducting element structure |
| TWM381992U (en) * | 2009-11-26 | 2010-06-01 | Isystems Technology Inc | Uniform temperature heat sink with capillary structure |
| WO2012068779A1 (en) * | 2010-11-24 | 2012-05-31 | Cai Yinglin | Heat exchange device for shower hot-water |
| WO2012113087A1 (en) * | 2011-02-22 | 2012-08-30 | Walter Schneider | Flat heat exchanger |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI768335B (en) * | 2019-05-10 | 2022-06-21 | 訊凱國際股份有限公司 | Vapor chamber and manufacturing method of the same |
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| TW201510454A (en) | 2015-03-16 |
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