TWI549921B - Paste and method for manufacturing panel of flat-panel display - Google Patents
Paste and method for manufacturing panel of flat-panel display Download PDFInfo
- Publication number
- TWI549921B TWI549921B TW101107394A TW101107394A TWI549921B TW I549921 B TWI549921 B TW I549921B TW 101107394 A TW101107394 A TW 101107394A TW 101107394 A TW101107394 A TW 101107394A TW I549921 B TWI549921 B TW I549921B
- Authority
- TW
- Taiwan
- Prior art keywords
- softening point
- paste
- mol
- low
- oxide
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000011521 glass Substances 0.000 claims description 143
- 239000000843 powder Substances 0.000 claims description 89
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 76
- 239000000758 substrate Substances 0.000 claims description 39
- 239000011787 zinc oxide Substances 0.000 claims description 38
- 229910000272 alkali metal oxide Inorganic materials 0.000 claims description 31
- 238000001354 calcination Methods 0.000 claims description 30
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 26
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 26
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 claims description 24
- 229910052810 boron oxide Inorganic materials 0.000 claims description 20
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 20
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 15
- 229910044991 metal oxide Inorganic materials 0.000 claims description 6
- 150000004706 metal oxides Chemical class 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- -1 silver ions Chemical class 0.000 description 45
- 150000001875 compounds Chemical class 0.000 description 37
- 235000014692 zinc oxide Nutrition 0.000 description 30
- 238000000576 coating method Methods 0.000 description 21
- 239000010410 layer Substances 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 18
- 238000011161 development Methods 0.000 description 17
- 239000000975 dye Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 14
- 239000000178 monomer Substances 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 14
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 13
- 239000002245 particle Substances 0.000 description 13
- 238000011156 evaluation Methods 0.000 description 12
- 239000007787 solid Substances 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
- 239000000470 constituent Substances 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 238000007650 screen-printing Methods 0.000 description 10
- 238000005979 thermal decomposition reaction Methods 0.000 description 10
- 239000003963 antioxidant agent Substances 0.000 description 9
- 230000003078 antioxidant effect Effects 0.000 description 9
- 235000006708 antioxidants Nutrition 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000010304 firing Methods 0.000 description 9
- 239000003999 initiator Substances 0.000 description 9
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 9
- 229910052753 mercury Inorganic materials 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 239000000395 magnesium oxide Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- 229920006243 acrylic copolymer Polymers 0.000 description 7
- 239000002003 electrode paste Substances 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 239000000292 calcium oxide Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000000921 elemental analysis Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 5
- 229910001947 lithium oxide Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- RMVRSNDYEFQCLF-UHFFFAOYSA-N phenyl mercaptan Natural products SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 5
- 229910001948 sodium oxide Inorganic materials 0.000 description 5
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 235000000126 Styrax benzoin Nutrition 0.000 description 4
- 244000028419 Styrax benzoin Species 0.000 description 4
- 235000008411 Sumatra benzointree Nutrition 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229960002130 benzoin Drugs 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000005562 fading Methods 0.000 description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 4
- 235000019382 gum benzoic Nutrition 0.000 description 4
- 238000010191 image analysis Methods 0.000 description 4
- 239000011572 manganese Substances 0.000 description 4
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 4
- 229910001950 potassium oxide Inorganic materials 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000007607 die coating method Methods 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 125000005641 methacryl group Chemical group 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000002411 thermogravimetry Methods 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- OVQQQQUJAGEBHH-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl prop-2-enoate Chemical compound FC(F)(F)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)OC(=O)C=C OVQQQQUJAGEBHH-UHFFFAOYSA-N 0.000 description 2
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 2
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 2
- GKMWWXGSJSEDLF-UHFFFAOYSA-N 1-methoxyethane-1,2-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)CO GKMWWXGSJSEDLF-UHFFFAOYSA-N 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- VBHXIMACZBQHPX-UHFFFAOYSA-N 2,2,2-trifluoroethyl prop-2-enoate Chemical compound FC(F)(F)COC(=O)C=C VBHXIMACZBQHPX-UHFFFAOYSA-N 0.000 description 2
- OWPUOLBODXJOKH-UHFFFAOYSA-N 2,3-dihydroxypropyl prop-2-enoate Chemical compound OCC(O)COC(=O)C=C OWPUOLBODXJOKH-UHFFFAOYSA-N 0.000 description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 2
- CMCLUJRFBZBVSW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCO CMCLUJRFBZBVSW-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- MHOFGBJTSNWTDT-UHFFFAOYSA-M 2-[n-ethyl-4-[(6-methoxy-3-methyl-1,3-benzothiazol-3-ium-2-yl)diazenyl]anilino]ethanol;methyl sulfate Chemical compound COS([O-])(=O)=O.C1=CC(N(CCO)CC)=CC=C1N=NC1=[N+](C)C2=CC=C(OC)C=C2S1 MHOFGBJTSNWTDT-UHFFFAOYSA-M 0.000 description 2
- UGIJCMNGQCUTPI-UHFFFAOYSA-N 2-aminoethyl prop-2-enoate Chemical compound NCCOC(=O)C=C UGIJCMNGQCUTPI-UHFFFAOYSA-N 0.000 description 2
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 2
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 2
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 2
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- 229930192627 Naphthoquinone Natural products 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 229960005164 acesulfame Drugs 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- OOCCDEMITAIZTP-UHFFFAOYSA-N cinnamyl alcohol Chemical compound OCC=CC1=CC=CC=C1 OOCCDEMITAIZTP-UHFFFAOYSA-N 0.000 description 2
- 229910000428 cobalt oxide Inorganic materials 0.000 description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- VEZUQRBDRNJBJY-UHFFFAOYSA-N cyclohexanone oxime Chemical compound ON=C1CCCCC1 VEZUQRBDRNJBJY-UHFFFAOYSA-N 0.000 description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 2
- 238000004993 emission spectroscopy Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- SOEDHYUFNWMILE-UHFFFAOYSA-N naphthalen-1-yl prop-2-enoate Chemical compound C1=CC=C2C(OC(=O)C=C)=CC=CC2=C1 SOEDHYUFNWMILE-UHFFFAOYSA-N 0.000 description 2
- 150000002791 naphthoquinones Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 2
- 238000006303 photolysis reaction Methods 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 2
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 2
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 2
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- DQFBYFPFKXHELB-VAWYXSNFSA-N trans-chalcone Chemical compound C=1C=CC=CC=1C(=O)\C=C\C1=CC=CC=C1 DQFBYFPFKXHELB-VAWYXSNFSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 2
- CNGTXGHYZBQUQS-UHFFFAOYSA-N ((1-(2-methoxyethoxy)ethoxy)methyl)benzene Chemical compound COCCOC(C)OCC1=CC=CC=C1 CNGTXGHYZBQUQS-UHFFFAOYSA-N 0.000 description 1
- CLZRLXAAJPNBTF-UHFFFAOYSA-N (1,4-dimethylcyclohexa-2,4-dien-1-yl)hydrazine Chemical compound CC1=CCC(C)(NN)C=C1 CLZRLXAAJPNBTF-UHFFFAOYSA-N 0.000 description 1
- POLSVAXEEHDBMJ-UHFFFAOYSA-N (2-hydroxy-4-octadecoxyphenyl)-phenylmethanone Chemical compound OC1=CC(OCCCCCCCCCCCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 POLSVAXEEHDBMJ-UHFFFAOYSA-N 0.000 description 1
- MLIWQXBKMZNZNF-PWDIZTEBSA-N (2e,6e)-2,6-bis[(4-azidophenyl)methylidene]-4-methylcyclohexan-1-one Chemical compound O=C1\C(=C\C=2C=CC(=CC=2)N=[N+]=[N-])CC(C)C\C1=C/C1=CC=C(N=[N+]=[N-])C=C1 MLIWQXBKMZNZNF-PWDIZTEBSA-N 0.000 description 1
- UZNOMHUYXSAUPB-UNZYHPAISA-N (2e,6e)-2,6-bis[(4-azidophenyl)methylidene]cyclohexan-1-one Chemical compound C1=CC(N=[N+]=[N-])=CC=C1\C=C(/CCC\1)C(=O)C/1=C/C1=CC=C(N=[N+]=[N-])C=C1 UZNOMHUYXSAUPB-UNZYHPAISA-N 0.000 description 1
- LGPAKRMZNPYPMG-UHFFFAOYSA-N (3-hydroxy-2-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OC(CO)COC(=O)C=C LGPAKRMZNPYPMG-UHFFFAOYSA-N 0.000 description 1
- ARVUDIQYNJVQIW-UHFFFAOYSA-N (4-dodecoxy-2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC(OCCCCCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 ARVUDIQYNJVQIW-UHFFFAOYSA-N 0.000 description 1
- XCUSJMKBYGXRKA-UHFFFAOYSA-N 1,1,2,2,3,5,5,5-octafluoropentyl prop-2-enoate Chemical compound FC(F)(F)CC(F)C(F)(F)C(F)(F)OC(=O)C=C XCUSJMKBYGXRKA-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- WQONPSCCEXUXTQ-UHFFFAOYSA-N 1,2-dibromobenzene Chemical compound BrC1=CC=CC=C1Br WQONPSCCEXUXTQ-UHFFFAOYSA-N 0.000 description 1
- KNKRKFALVUDBJE-UHFFFAOYSA-N 1,2-dichloropropane Chemical compound CC(Cl)CCl KNKRKFALVUDBJE-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- YFKBXYGUSOXJGS-UHFFFAOYSA-N 1,3-Diphenyl-2-propanone Chemical compound C=1C=CC=CC=1CC(=O)CC1=CC=CC=C1 YFKBXYGUSOXJGS-UHFFFAOYSA-N 0.000 description 1
- WDCYWAQPCXBPJA-UHFFFAOYSA-N 1,3-dinitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC([N+]([O-])=O)=C1 WDCYWAQPCXBPJA-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- JWTSVUUPJIIXTO-UHFFFAOYSA-N 1,5-bis[4-(dimethylamino)phenyl]penta-1,4-dien-3-one Chemical compound C1=CC(N(C)C)=CC=C1C=CC(=O)C=CC1=CC=C(N(C)C)C=C1 JWTSVUUPJIIXTO-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- VMCRQYHCDSXNLW-UHFFFAOYSA-N 1-(4-tert-butylphenyl)-2,2-dichloroethanone Chemical compound CC(C)(C)C1=CC=C(C(=O)C(Cl)Cl)C=C1 VMCRQYHCDSXNLW-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- TUSDEZXZIZRFGC-UHFFFAOYSA-N 1-O-galloyl-3,6-(R)-HHDP-beta-D-glucose Natural products OC1C(O2)COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC1C(O)C2OC(=O)C1=CC(O)=C(O)C(O)=C1 TUSDEZXZIZRFGC-UHFFFAOYSA-N 0.000 description 1
- KCKJMQMEWMHVCH-UHFFFAOYSA-N 1-butoxy-2-[2-(2-hydroxyethoxy)ethoxy]ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCOC(O)COCCOCCO KCKJMQMEWMHVCH-UHFFFAOYSA-N 0.000 description 1
- UVHXEHGUEKARKZ-UHFFFAOYSA-N 1-ethenylanthracene Chemical compound C1=CC=C2C=C3C(C=C)=CC=CC3=CC2=C1 UVHXEHGUEKARKZ-UHFFFAOYSA-N 0.000 description 1
- VETPHHXZEJAYOB-UHFFFAOYSA-N 1-n,4-n-dinaphthalen-2-ylbenzene-1,4-diamine Chemical compound C1=CC=CC2=CC(NC=3C=CC(NC=4C=C5C=CC=CC5=CC=4)=CC=3)=CC=C21 VETPHHXZEJAYOB-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- PLGAYGHFBSTWCA-UHFFFAOYSA-N 10-phenylsulfanylacridin-9-one Chemical compound C1(=CC=CC=C1)SN1C=2C=CC=CC2C(C2=CC=CC=C12)=O PLGAYGHFBSTWCA-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- LKWVKJXZKSOZIW-UHFFFAOYSA-N 2,5-dibutylbenzene-1,4-diol Chemical compound CCCCC1=CC(O)=C(CCCC)C=C1O LKWVKJXZKSOZIW-UHFFFAOYSA-N 0.000 description 1
- XMTVIMLHAWZAAB-UHFFFAOYSA-N 2,5-diethoxycyclohexa-2,5-diene-1,4-dione Chemical compound CCOC1=CC(=O)C(OCC)=CC1=O XMTVIMLHAWZAAB-UHFFFAOYSA-N 0.000 description 1
- YXQINXKZKRYRQM-UHFFFAOYSA-N 2,6-bis[[4-(dimethylamino)phenyl]methylidene]-4-methylcyclohexan-1-one Chemical compound O=C1C(=CC=2C=CC(=CC=2)N(C)C)CC(C)CC1=CC1=CC=C(N(C)C)C=C1 YXQINXKZKRYRQM-UHFFFAOYSA-N 0.000 description 1
- ASUQXIDYMVXFKU-UHFFFAOYSA-N 2,6-dibromo-9,9-dimethylfluorene Chemical compound C1=C(Br)C=C2C(C)(C)C3=CC=C(Br)C=C3C2=C1 ASUQXIDYMVXFKU-UHFFFAOYSA-N 0.000 description 1
- RMFWVOLULURGJI-UHFFFAOYSA-N 2,6-dichloro-7h-purine Chemical compound ClC1=NC(Cl)=C2NC=NC2=N1 RMFWVOLULURGJI-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- JLZIIHMTTRXXIN-UHFFFAOYSA-N 2-(2-hydroxy-4-methoxybenzoyl)benzoic acid Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1C(O)=O JLZIIHMTTRXXIN-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- ITLDHFORLZTRJI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-5-octoxyphenol Chemical compound OC1=CC(OCCCCCCCC)=CC=C1N1N=C2C=CC=CC2=N1 ITLDHFORLZTRJI-UHFFFAOYSA-N 0.000 description 1
- HYVGFUIWHXLVNV-UHFFFAOYSA-N 2-(n-ethylanilino)ethanol Chemical compound OCCN(CC)C1=CC=CC=C1 HYVGFUIWHXLVNV-UHFFFAOYSA-N 0.000 description 1
- BIVJXJNCTSUKAT-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)propoxy]propoxy]propoxy]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)OCC(C)OCC(C)OCC(C)OC(=O)C(C)=C BIVJXJNCTSUKAT-UHFFFAOYSA-N 0.000 description 1
- MWGATWIBSKHFMR-UHFFFAOYSA-N 2-anilinoethanol Chemical compound OCCNC1=CC=CC=C1 MWGATWIBSKHFMR-UHFFFAOYSA-N 0.000 description 1
- HQTNTADNCBNEGC-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(2-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=CC=C(N2CCOCC2)C=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 HQTNTADNCBNEGC-UHFFFAOYSA-N 0.000 description 1
- XRXMNWGCKISMOH-UHFFFAOYSA-N 2-bromobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1Br XRXMNWGCKISMOH-UHFFFAOYSA-N 0.000 description 1
- PAAVDLDRAZEFGW-UHFFFAOYSA-N 2-butoxyethyl 4-(dimethylamino)benzoate Chemical compound CCCCOCCOC(=O)C1=CC=C(N(C)C)C=C1 PAAVDLDRAZEFGW-UHFFFAOYSA-N 0.000 description 1
- IKCLCGXPQILATA-UHFFFAOYSA-N 2-chlorobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1Cl IKCLCGXPQILATA-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QSKGBYWLRDVOLD-UHFFFAOYSA-N 2-methylidene-9h-fluoren-1-one Chemical compound C1=CC=C2C(C=CC(C3=O)=C)=C3CC2=C1 QSKGBYWLRDVOLD-UHFFFAOYSA-N 0.000 description 1
- MUZDXNQOSGWMJJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O MUZDXNQOSGWMJJ-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- VFBREPODMPKTCC-UHFFFAOYSA-N 2-tert-butyl-9h-fluorene Chemical compound C1=CC=C2C3=CC=C(C(C)(C)C)C=C3CC2=C1 VFBREPODMPKTCC-UHFFFAOYSA-N 0.000 description 1
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 1
- HAHWYTLUKCIGPH-UHFFFAOYSA-N 3-methylbutyl 2-(diethylamino)benzoate Chemical compound CCN(CC)C1=CC=CC=C1C(=O)OCCC(C)C HAHWYTLUKCIGPH-UHFFFAOYSA-N 0.000 description 1
- ARXVXVOLXMVYIT-UHFFFAOYSA-N 3-methylbutyl 2-(dimethylamino)benzoate Chemical compound CC(C)CCOC(=O)C1=CC=CC=C1N(C)C ARXVXVOLXMVYIT-UHFFFAOYSA-N 0.000 description 1
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 description 1
- SRYYOKKLTBRLHT-UHFFFAOYSA-N 4-(benzylamino)phenol Chemical compound C1=CC(O)=CC=C1NCC1=CC=CC=C1 SRYYOKKLTBRLHT-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- VNGLVZLEUDIDQH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;2-methyloxirane Chemical compound CC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 VNGLVZLEUDIDQH-UHFFFAOYSA-N 0.000 description 1
- WPSWDCBWMRJJED-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;oxirane Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WPSWDCBWMRJJED-UHFFFAOYSA-N 0.000 description 1
- RPPHWBSWFASQRA-UHFFFAOYSA-N 4-hydroxy-5-(2-hydroxy-4-methoxybenzoyl)-2-methoxybenzenesulfonic acid Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC(S(O)(=O)=O)=C(OC)C=C1O RPPHWBSWFASQRA-UHFFFAOYSA-N 0.000 description 1
- PSCXFXNEYIHJST-UHFFFAOYSA-N 4-phenylbut-3-enoic acid Chemical compound OC(=O)CC=CC1=CC=CC=C1 PSCXFXNEYIHJST-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 description 1
- XWTGEDNUGUMEPF-UHFFFAOYSA-N 5,5-dichlorocyclohexa-1,3-diene Chemical compound ClC1(Cl)CC=CC=C1 XWTGEDNUGUMEPF-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- JIXWCMGGZUZYET-UHFFFAOYSA-N 5-benzoyl-4-hydroxy-2-methoxybenzenesulfonic acid;trihydrate Chemical compound O.O.O.C1=C(S(O)(=O)=O)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 JIXWCMGGZUZYET-UHFFFAOYSA-N 0.000 description 1
- ORJNLUXHBUSOKL-UHFFFAOYSA-N 6,7-dihydrodibenzo[2,1-b:1',2'-d][7]annulen-5-one Chemical compound O=C1CCC2=CC=CC=C2C2=CC=CC=C12 ORJNLUXHBUSOKL-UHFFFAOYSA-N 0.000 description 1
- GBJVVSCPOBPEIT-UHFFFAOYSA-N AZT-1152 Chemical compound N=1C=NC2=CC(OCCCN(CC)CCOP(O)(O)=O)=CC=C2C=1NC(=NN1)C=C1CC(=O)NC1=CC=CC(F)=C1 GBJVVSCPOBPEIT-UHFFFAOYSA-N 0.000 description 1
- 229910015999 BaAl Inorganic materials 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- SESFRYSPDFLNCH-UHFFFAOYSA-N Benzyl benzoate Natural products C=1C=CC=CC=1C(=O)OCC1=CC=CC=C1 SESFRYSPDFLNCH-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- OMRZRYPJXDJILP-UHFFFAOYSA-N C(=O)(C(=C)C)C(CN=C=O)C1OC1 Chemical compound C(=O)(C(=C)C)C(CN=C=O)C1OC1 OMRZRYPJXDJILP-UHFFFAOYSA-N 0.000 description 1
- DBJFSFSBHGPDPG-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC Chemical group C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC DBJFSFSBHGPDPG-UHFFFAOYSA-N 0.000 description 1
- KCUUPEAFEVMCFO-UHFFFAOYSA-N C(CCCCCCCCC)C(C)N=C=O.C=CC Chemical compound C(CCCCCCCCC)C(C)N=C=O.C=CC KCUUPEAFEVMCFO-UHFFFAOYSA-N 0.000 description 1
- DROMOSDBMGJHBP-UHFFFAOYSA-N C(CCCCCCCCC)N=C=O.C=CC Chemical compound C(CCCCCCCCC)N=C=O.C=CC DROMOSDBMGJHBP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DQFBYFPFKXHELB-UHFFFAOYSA-N Chalcone Natural products C=1C=CC=CC=1C(=O)C=CC1=CC=CC=C1 DQFBYFPFKXHELB-UHFFFAOYSA-N 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000001263 FEMA 3042 Substances 0.000 description 1
- 208000033962 Fontaine progeroid syndrome Diseases 0.000 description 1
- 241000629264 Halicreas minimum Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910017863 MgGd Inorganic materials 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- ZCTYHONEGJTYQV-UHFFFAOYSA-N N-methylphenylethanolamine Chemical compound CNCC(O)C1=CC=CC=C1 ZCTYHONEGJTYQV-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- WYWZRNAHINYAEF-UHFFFAOYSA-N Padimate O Chemical compound CCCCC(CC)COC(=O)C1=CC=C(N(C)C)C=C1 WYWZRNAHINYAEF-UHFFFAOYSA-N 0.000 description 1
- LRBQNJMCXXYXIU-PPKXGCFTSA-N Penta-digallate-beta-D-glucose Natural products OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-PPKXGCFTSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-N Salicylic acid Natural products OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 1
- FHNINJWBTRXEBC-UHFFFAOYSA-N Sudan III Chemical compound OC1=CC=C2C=CC=CC2=C1N=NC(C=C1)=CC=C1N=NC1=CC=CC=C1 FHNINJWBTRXEBC-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- UATJOMSPNYCXIX-UHFFFAOYSA-N Trinitrobenzene Chemical compound [O-][N+](=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1 UATJOMSPNYCXIX-UHFFFAOYSA-N 0.000 description 1
- BWLVSYUUKOQICP-FMQUCBEESA-N Yellow OB Chemical compound CC1=CC=CC=C1\N=N\C1=C(N)C=CC2=CC=CC=C12 BWLVSYUUKOQICP-FMQUCBEESA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- BRHJUILQKFBMTL-UHFFFAOYSA-N [4,4-bis(dimethylamino)cyclohexa-1,5-dien-1-yl]-phenylmethanone Chemical compound C1=CC(N(C)C)(N(C)C)CC=C1C(=O)C1=CC=CC=C1 BRHJUILQKFBMTL-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- ZZAGLMPBQOKGGT-UHFFFAOYSA-N [4-[4-(4-prop-2-enoyloxybutoxy)benzoyl]oxyphenyl] 4-(4-prop-2-enoyloxybutoxy)benzoate Chemical compound C1=CC(OCCCCOC(=O)C=C)=CC=C1C(=O)OC(C=C1)=CC=C1OC(=O)C1=CC=C(OCCCCOC(=O)C=C)C=C1 ZZAGLMPBQOKGGT-UHFFFAOYSA-N 0.000 description 1
- YZDCDMYOFGMVBG-UHFFFAOYSA-N [Cd].[Cs] Chemical compound [Cd].[Cs] YZDCDMYOFGMVBG-UHFFFAOYSA-N 0.000 description 1
- MHWCWOJCSXYJSG-UHFFFAOYSA-N [Cl-].[SH3+].N1=CC=CC2=CC=CC=C12 Chemical compound [Cl-].[SH3+].N1=CC=CC2=CC=CC=C12 MHWCWOJCSXYJSG-UHFFFAOYSA-N 0.000 description 1
- TWNWAFGPYRSJTR-UHFFFAOYSA-N [Cl].CC=Cc1ccccc1 Chemical compound [Cl].CC=Cc1ccccc1 TWNWAFGPYRSJTR-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000001000 anthraquinone dye Substances 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229960001716 benzalkonium Drugs 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- WVXMLBXFHITUIT-UHFFFAOYSA-N benzo[a]fluoren-1-one Chemical compound C1=CC=CC2=CC3=C4C(=O)C=CC=C4C=CC3=C21 WVXMLBXFHITUIT-UHFFFAOYSA-N 0.000 description 1
- CYDRXTMLKJDRQH-UHFFFAOYSA-N benzododecinium Chemical compound CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 CYDRXTMLKJDRQH-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 229960002903 benzyl benzoate Drugs 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- HCRQJOUBOFIKCF-UHFFFAOYSA-L benzyl(trimethyl)azanium;oxalate Chemical compound [O-]C(=O)C([O-])=O.C[N+](C)(C)CC1=CC=CC=C1.C[N+](C)(C)CC1=CC=CC=C1 HCRQJOUBOFIKCF-UHFFFAOYSA-L 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 235000005513 chalcones Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- BQFCCCIRTOLPEF-UHFFFAOYSA-N chembl1976978 Chemical compound CC1=CC=CC=C1N=NC1=C(O)C=CC2=CC=CC=C12 BQFCCCIRTOLPEF-UHFFFAOYSA-N 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 1
- 229940117389 dichlorobenzene Drugs 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- WOAZEKPXTXCPFZ-UHFFFAOYSA-N dimethyl(phenyl)azanium;chloride Chemical compound Cl.CN(C)C1=CC=CC=C1 WOAZEKPXTXCPFZ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 1
- YQGOJNYOYNNSMM-UHFFFAOYSA-N eosin Chemical compound [Na+].OC(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C(O)=C(Br)C=C21 YQGOJNYOYNNSMM-UHFFFAOYSA-N 0.000 description 1
- XSQNOFMFKVYSNL-UHFFFAOYSA-N ethene;toluene Chemical group C=C.CC1=CC=CC=C1 XSQNOFMFKVYSNL-UHFFFAOYSA-N 0.000 description 1
- YGTOVECNNXAGIC-UHFFFAOYSA-N ethyl (1-phenyltetrazol-5-yl)sulfanylformate Chemical compound CCOC(=O)SC1=NN=NN1C1=CC=CC=C1 YGTOVECNNXAGIC-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 230000002070 germicidal effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine Substances NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- COHYTHOBJLSHDF-BUHFOSPRSA-N indigo dye Chemical compound N\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-BUHFOSPRSA-N 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007603 infrared drying Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- 125000006178 methyl benzyl group Chemical group 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- CXKWCBBOMKCUKX-UHFFFAOYSA-M methylene blue Chemical compound [Cl-].C1=CC(N(C)C)=CC2=[S+]C3=CC(N(C)C)=CC=C3N=C21 CXKWCBBOMKCUKX-UHFFFAOYSA-M 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 229920003087 methylethyl cellulose Polymers 0.000 description 1
- 229960000907 methylthioninium chloride Drugs 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 235000012459 muffins Nutrition 0.000 description 1
- SQDFHQJTAWCFIB-UHFFFAOYSA-N n-methylidenehydroxylamine Chemical class ON=C SQDFHQJTAWCFIB-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- SLVJUZOHXPZVLR-UHFFFAOYSA-N naphthalen-2-yl prop-2-enoate Chemical compound C1=CC=CC2=CC(OC(=O)C=C)=CC=C21 SLVJUZOHXPZVLR-UHFFFAOYSA-N 0.000 description 1
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Substances CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 1
- 239000001005 nitro dye Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 1
- FMJSMJQBSVNSBF-UHFFFAOYSA-N octocrylene Chemical compound C=1C=CC=CC=1C(=C(C#N)C(=O)OCC(CC)CCCC)C1=CC=CC=C1 FMJSMJQBSVNSBF-UHFFFAOYSA-N 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- YVZACCLFRNQBNO-UHFFFAOYSA-N pentylhydrazine Chemical compound CCCCCNN YVZACCLFRNQBNO-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- RYSBYLUYRUYPNW-UHFFFAOYSA-N phenyl-(2-propoxyphenyl)methanone Chemical compound CCCOC1=CC=CC=C1C(=O)C1=CC=CC=C1 RYSBYLUYRUYPNW-UHFFFAOYSA-N 0.000 description 1
- OBFRFCIHSAOUGJ-UHFFFAOYSA-N phenylmethanethiol;prop-2-enoic acid Chemical compound OC(=O)C=C.SCC1=CC=CC=C1 OBFRFCIHSAOUGJ-UHFFFAOYSA-N 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- YUGFAXWXGVQNBN-UHFFFAOYSA-N prop-1-en-2-ylbenzene hydrobromide Chemical compound Br.CC(=C)C1=CC=CC=C1 YUGFAXWXGVQNBN-UHFFFAOYSA-N 0.000 description 1
- DHCQRYGGPSSQNL-UHFFFAOYSA-N prop-1-en-2-ylbenzene;hydrochloride Chemical compound Cl.CC(=C)C1=CC=CC=C1 DHCQRYGGPSSQNL-UHFFFAOYSA-N 0.000 description 1
- AYEFIAVHMUFQPZ-UHFFFAOYSA-N propane-1,2-diol;prop-2-enoic acid Chemical compound CC(O)CO.OC(=O)C=C AYEFIAVHMUFQPZ-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000001008 quinone-imine dye Substances 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229940099373 sudan iii Drugs 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000000375 suspending agent Substances 0.000 description 1
- LRBQNJMCXXYXIU-NRMVVENXSA-N tannic acid Chemical compound OC1=C(O)C(O)=CC(C(=O)OC=2C(=C(O)C=C(C=2)C(=O)OC[C@@H]2[C@H]([C@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)[C@@H](OC(=O)C=3C=C(OC(=O)C=4C=C(O)C(O)=C(O)C=4)C(O)=C(O)C=3)O2)OC(=O)C=2C=C(OC(=O)C=3C=C(O)C(O)=C(O)C=3)C(O)=C(O)C=2)O)=C1 LRBQNJMCXXYXIU-NRMVVENXSA-N 0.000 description 1
- 229940033123 tannic acid Drugs 0.000 description 1
- 235000015523 tannic acid Nutrition 0.000 description 1
- 229920002258 tannic acid Polymers 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- HRVLWYIKDSTXOT-UHFFFAOYSA-N tribromo(phenyl)phosphanium Chemical compound Br[P+](Br)(Br)C1=CC=CC=C1 HRVLWYIKDSTXOT-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
- C09D1/02—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances alkali metal silicates
- C09D1/04—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances alkali metal silicates with organic additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/36—Spacers, barriers, ribs, partitions or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/15—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen with ray or beam selectively directed to luminescent anode segments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
- H01J9/242—Spacers between faceplate and backplate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/36—Spacers, barriers, ribs, partitions or the like
- H01J2211/366—Spacers, barriers, ribs, partitions or the like characterized by the material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Glass Compositions (AREA)
- Gas-Filled Discharge Tubes (AREA)
Description
本發明是有關於一種形成絕緣性圖案時所使用之糊劑及使用該糊劑之平面顯示器用面板的製造方法。 The present invention relates to a paste used in forming an insulating pattern and a method of manufacturing a panel for a flat panel display using the paste.
近年來,電漿顯示面板、場發射顯示器、螢光顯示管、液晶顯示裝置、電致發光顯示器、發光二極體等平面顯示器之開發正得到急速地推進。該些平面顯示器中,電漿顯示器藉由如下方式而進行顯示:於前面玻璃基板與背面玻璃基板之間所設之放電空間內,於相對向之陽極電極與陰極電極之間產生電漿放電,將由上述放電空間內所封入之氣體而產生的紫外線照射至放電空間內所設之螢光體上。電漿顯示器或螢光顯示管等氣體放電類型之顯示器必需要有用以隔開放電空間之絕緣性隔板。而且,場發射顯示器等場發射型顯示器必需要有用以隔絕閘電極與陰極之絕緣性隔板。 In recent years, development of flat panel displays such as plasma display panels, field emission displays, fluorescent display tubes, liquid crystal display devices, electroluminescence displays, and light-emitting diodes has been rapidly advanced. In the flat display, the plasma display is displayed by generating a plasma discharge between the anode electrode and the cathode electrode in a discharge space provided between the front glass substrate and the back glass substrate. Ultraviolet rays generated by the gas enclosed in the discharge space are irradiated onto the phosphor provided in the discharge space. A gas discharge type display such as a plasma display or a fluorescent display tube must have an insulating spacer that is useful to separate the discharge space. Moreover, a field emission type display such as a field emission display necessarily requires an insulating spacer for isolating the gate electrode from the cathode.
形成該些隔板之方法已知有:藉由網版印刷版而反覆將隔板糊劑塗佈為圖案狀並加以乾燥後,進行煅燒之網版印刷法;以抗蝕劑遮蓋於經乾燥之隔板材料層上,藉由噴砂處理而削去後進行煅燒之噴砂法;對經乾燥之隔板材料進行煅燒後,藉由抗蝕劑而遮蓋於其層上,進行蝕刻之蝕刻法;於隔板糊劑之塗佈膜上抵壓具有圖案之模具而形成圖案後,進行煅燒之模具轉印法(壓印法);塗佈包含感光性糊劑材料之隔板材料而進行乾燥,其次進行曝光、顯影 處理後進行煅燒之感光性糊劑法(光微影法)等。該些圖案形成法均是使用包含低軟化點玻璃與有機成分之糊劑而設置經圖案化之糊劑塗佈膜,藉由進行煅燒除去有機成分而形成包含低軟化點玻璃之絕緣性圖案之隔板的方法。其中,感光性糊劑法是可高精細地應對大面積化之方法,而且是成本優勢高的手法。 A method of forming the separators is known in which a separator paste is applied in a pattern by a screen printing plate and dried, and then subjected to a screen printing method of calcination; a blasting method in which a layered material is removed by sandblasting and then calcined; after the dried separator material is calcined, the layer is covered by a resist and an etching method is performed; After the pattern of the mold is pressed against the coating film of the separator paste to form a pattern, the mold transfer method (imprint method) for baking is performed, and the separator material containing the photosensitive paste material is applied and dried. Secondly, exposure and development A photosensitive paste method (photolithography method) or the like which is subjected to calcination after the treatment. In the pattern forming method, a patterned paste coating film is provided by using a paste containing a low softening point glass and an organic component, and the organic component is removed by calcination to form an insulating pattern containing a low softening point glass. The method of the partition. Among them, the photosensitive paste method is a method capable of coping with a large area with high precision, and is a method with high cost advantage.
於先前之形成方法中,使用包含低軟化點玻璃與有機成分之糊劑而形成圖案,其後進行煅燒而形成隔板,因此於煅燒後殘存微量之有機成分。若存在之該殘存有機成分較多,則存在如下之問題:隔板著色,對面板之發光效率、色純度等顯示器之顯示特性造成影響。另外,於電漿顯示器中存在如下之問題:於將前面板與背面板貼合而面板化之熔封步驟中,殘存於隔板上之有機成分產生為氣體,對前面板保護層造成影響,引起放電電壓上升等特性劣化;或者由於面板內殘存雜質氣體而造成無法提高面板之可靠性。 In the prior formation method, a pattern is formed by using a paste containing a low-softening point glass and an organic component, and then calcined to form a separator, so that a trace amount of an organic component remains after calcination. If there are many remaining organic components, there is a problem in that the spacer is colored, which affects the display characteristics of the display such as the luminous efficiency and the color purity of the panel. In addition, in the plasma display, there is a problem that in the step of sealing the front panel and the back panel, the organic component remaining on the separator is generated as a gas, which affects the protective layer of the front panel. The characteristics such as the rise in the discharge voltage are deteriorated, or the reliability of the panel cannot be improved due to the residual impurity gas remaining in the panel.
因此,為了製造亮度或色純度等顯示特性優異、面板可靠性高之顯示器,提出了各種使煅燒後之殘存有機成分減少之手法(參照專利文獻1~專利文獻3)。專利文獻1之特徵在於:使用含有羥基及聚合性不飽和基之樹脂、例如高溫時之熱分解性優異之多元醇作為糊劑中之有機成分。專利文獻2之特徵在於:為了提高有機成分之熱分解性,使用具有氧原子含有率高的聚氧化烯鏈段之丙烯酸系共聚物作為有機成分。專利文獻3之特徵在於:為了使有 機成分分解物並不殘存於玻璃中,使用具有如下玻璃轉移點之低軟化點玻璃,所述玻璃轉移點比有機成分之減量率達到80%之溫度高10℃以上。然而,雖然藉由該些手法可減少殘存有機成分中之造成熱分解性不良之成分,由於無法抑制熱分解物吸附於玻璃上,因此會有隔板之殘存有機成分之減少尚不充分的問題。 Therefore, in order to produce a display having excellent display characteristics such as brightness and color purity and high panel reliability, various methods for reducing residual organic components after firing have been proposed (see Patent Document 1 to Patent Document 3). Patent Document 1 is characterized in that a resin containing a hydroxyl group and a polymerizable unsaturated group, for example, a polyol having excellent thermal decomposition property at a high temperature is used as an organic component in the paste. Patent Document 2 is characterized in that an acrylic copolymer having a polyoxyalkylene segment having a high oxygen atom content is used as an organic component in order to improve the thermal decomposition property of the organic component. Patent Document 3 is characterized in that, in order to The machine component decomposition product does not remain in the glass, and a low softening point glass having a glass transition point higher than the temperature at which the organic component reduction rate reaches 80% is used at 10 ° C or higher. However, these components can reduce the component which causes thermal decomposition defects in the residual organic component, and since the thermal decomposition product cannot be inhibited from adsorbing on the glass, there is a problem that the residual organic component of the separator is insufficient. .
先前技術文獻 Prior technical literature
專利文獻 Patent literature
專利文獻1:日本專利特開2001-305729號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2001-305729
專利文獻2:日本專利特開2008-50594號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2008-50594
專利文獻3:日本專利特開平11-52561號公報 Patent Document 3: Japanese Patent Laid-Open No. Hei 11-52561
因此,本發明著眼於上述先前技術之問題點,其目的在於提供一種糊劑,其於煅燒時有機成分之熱分解性良好,熱分解物於玻璃上之吸附得到抑制,且可形成殘存有機成分少之隔板。而且,提供一種平面顯示器用面板,其形成殘存有機成分少之隔板,亮度或色純度等顯示特性優異,可靠性高。 Accordingly, the present invention has been made in view of the above problems of the prior art, and an object thereof is to provide a paste which is excellent in thermal decomposition property of an organic component during calcination, which inhibits adsorption of a thermally decomposed substance on glass, and can form a residual organic component. Less partition. Further, a panel for a flat panel display is provided which has a separator having a small amount of residual organic components, and is excellent in display characteristics such as brightness and color purity, and has high reliability.
本發明為了解決上述課題而具有以下之構成。 The present invention has the following configuration in order to solve the above problems.
(1)一種糊劑,其特徵在於含有:軟化點為570℃~620℃之低軟化點玻璃粉末及有機成分,所述低軟化點玻璃粉末含有氧化矽、氧化硼、鹼金屬氧化物、鹼土金屬氧化物及氧化鋅,於將所述低軟化點玻璃粉末中之氧化矽含有率設為X(SiO2)(mol%)、將所述低軟化點玻璃粉末中之 氧化硼含有率設為X(B2O3)(mol%)、將所述低軟化點玻璃粉末中之鹼金屬氧化物含有率設為X(M2O)(mol%)、將所述低軟化點玻璃粉末中之鹼土金屬氧化物含有率設為X(MO)(mol%)、將所述低軟化點玻璃粉末中之氧化鋅含有率設為X(ZnO)(mol%)時,下述式(1)所表示之A之值為35~46之範圍內,且下述式(2)所表示之B之值為1.5~5.5之範圍內,且下述式(3)所表示之C之值為24~30之範圍內:A=X(SiO2)+X(B2O3)-X(M2O) (1) (1) A paste comprising: a low-softening point glass powder having a softening point of 570 ° C to 620 ° C and an organic component, the low-softening point glass powder containing cerium oxide, boron oxide, an alkali metal oxide, an alkaline earth The metal oxide and the zinc oxide have a cerium oxide content in the low-softening point glass powder as X (SiO 2 ) (mol%), and a boron oxide content in the low-softening point glass powder. X(B 2 O 3 ) (mol%), the alkali metal oxide content in the low-softening point glass powder is set to X (M 2 O) (mol%), and the low-softening point glass powder is used When the alkaline earth metal oxide content is X (MO) (mol%) and the zinc oxide content in the low softening point glass powder is X (ZnO) (mol%), the following formula (1) The value of A is in the range of 35 to 46, and the value of B represented by the following formula (2) is in the range of 1.5 to 5.5, and the value of C represented by the following formula (3) is 24 Within the range of ~30: A=X(SiO 2 )+X(B 2 O 3 )-X(M 2 O) (1)
B=X(ZnO) (2) B=X(ZnO) (2)
C=X(M2O)+X(MO)+X(ZnO) (3)。 C = X (M 2 O) + X (MO) + X (ZnO) (3).
(2)如上述(1)所述之糊劑,其中所述有機成分包含感光性有機成分。 (2) The paste according to the above (1), wherein the organic component contains a photosensitive organic component.
(3)一種平面顯示器用面板的製造方法,其特徵在於:於基板上塗佈如上述(1)或(2)所述之糊劑,進行煅燒而形成絕緣性圖案。 (3) A method of producing a panel for a flat panel display, characterized in that the paste according to the above (1) or (2) is applied onto a substrate and fired to form an insulating pattern.
(4)一種平面顯示器用面板的製造方法,其特徵在於:於基板上塗佈如上述(2)所述之糊劑,進行曝光、顯影、煅燒而形成絕緣性圖案。 (4) A method for producing a panel for a flat panel display, comprising applying the paste according to the above (2) to a substrate, exposing, developing, and firing to form an insulating pattern.
(5)一種平面顯示器用面板,其是具有以軟化點為570℃~620℃之低軟化點玻璃為主成分之隔板的平面顯示器用面板,其特徵在於:所述低軟化點玻璃粉末含有氧化 矽、氧化硼、鹼金屬氧化物、鹼土金屬氧化物及氧化鋅,於將所述低軟化點玻璃粉末中之氧化矽含有率設為X(SiO2)(mol%)、將所述低軟化點玻璃粉末中之氧化硼含有率設為X(B2O3)(mol%)、將所述低軟化點玻璃粉末中之鹼金屬氧化物含有率設為X(M2O)(mol%)、將所述低軟化點玻璃粉末中之鹼土金屬氧化物含有率設為X(MO)(mol%)、將所述低軟化點玻璃粉末中之氧化鋅含有率設為X(ZnO)(mol%)時,下述式(1)所表示之A之值為35~46之範圍內,且下述式(2)所表示之B之值為1.5~5.5之範圍內,且下述式(3)所表示之C之值為24~30之範圍內:A=X(SiO2)+X(B2O3)-X(M2O) (1) (5) A panel for a flat panel display, which is a panel for a flat panel display having a separator having a low softening point glass having a softening point of 570 ° C to 620 ° C as a main component, wherein the low softening point glass powder contains The cerium oxide, the boron oxide, the alkali metal oxide, the alkaline earth metal oxide, and the zinc oxide, wherein the cerium oxide content in the low-softening point glass powder is X (SiO 2 ) (mol%), which is low The content of boron oxide in the softening point glass powder is X (B 2 O 3 ) (mol%), and the alkali metal oxide content in the low softening point glass powder is X (M 2 O) (mol) %), the alkaline earth metal oxide content in the low-softening point glass powder is X (MO) (mol%), and the zinc oxide content in the low-softening point glass powder is X (ZnO) (mol%), the value of A represented by the following formula (1) is in the range of 35 to 46, and the value of B represented by the following formula (2) is in the range of 1.5 to 5.5, and the following The value of C represented by the formula (3) is in the range of 24 to 30: A = X (SiO 2 ) + X (B 2 O 3 ) - X (M 2 O) (1)
B=X(ZnO) (2) B=X(ZnO) (2)
C=X(M2O)+X(MO)+X(ZnO) (3)。 C = X (M 2 O) + X (MO) + X (ZnO) (3).
藉由本發明可提供能夠形成殘存有機成分少之絕緣性圖案的糊劑。而且,可穩定地提供顯示器用面板,所述顯示器用面板形成殘存有機成分少之絕緣性圖案,亮度或色純度等顯示特性優異,可靠性高。 According to the present invention, it is possible to provide a paste capable of forming an insulating pattern in which a small amount of organic components remain. Further, it is possible to stably provide a panel for a display which is formed with an insulating pattern having a small amount of residual organic components, and is excellent in display characteristics such as brightness and color purity, and has high reliability.
本發明中所謂之糊劑是可藉由網版印刷法、噴砂法、蝕刻法、模具轉印法(壓印法)、感光性糊劑法(光微影法) 等方法而進行圖案形成之無機成分與有機成分之混合物。 於用於形成電漿顯示器之隔板等高精細之絕緣性圖案時,較佳的是包含感光性有機成分作為有機成分之感光性糊劑。 The paste in the present invention is a screen printing method, a sandblasting method, an etching method, a mold transfer method (imprint method), a photosensitive paste method (photolithography method). A mixture of an inorganic component and an organic component which are patterned by a method. When a high-definition insulating pattern such as a separator for forming a plasma display is used, a photosensitive paste containing a photosensitive organic component as an organic component is preferable.
本發明之糊劑以作為無機成分之軟化點為570℃~620℃之低軟化點玻璃粉末為必需成分。軟化點為570℃~620℃之低軟化點玻璃粉末是隔板之主成分,於低軟化點玻璃粉末之軟化點附近之溫度下進行煅燒而除去後述之有機成分,藉此可獲得包括含有低軟化點玻璃之無機成分之圖案。 The paste of the present invention contains a low softening point glass powder having a softening point of 570 ° C to 620 ° C as an inorganic component as an essential component. The low softening point glass powder having a softening point of 570 ° C to 620 ° C is a main component of the separator, and is calcined at a temperature near the softening point of the glass powder of the low softening point to remove the organic component described later, thereby obtaining a low content including Softening the pattern of the inorganic components of the glass.
本發明中之低軟化點玻璃粉末是指軟化點為570℃~620℃之範圍之玻璃粉末。藉由使軟化點處於該範圍內,可使於燒結時並無圖案之變形,熔融性亦變適宜。而且,特別是於玻璃基板上形成絕緣性圖案之情形時,即使於為了並不產生基板之變形等問題而藉由比較低的溫度進行燒結之情形時,亦可進行充分之軟化,因此可獲得表面粗糙度小之絕緣性圖案。軟化點較佳的是575℃~597℃之範圍內,更佳的是580℃~595℃之範圍內。 The low softening point glass powder in the present invention means a glass powder having a softening point in the range of 570 ° C to 620 ° C. By setting the softening point within this range, there is no pattern deformation at the time of sintering, and the meltability is also suitable. Further, particularly in the case where an insulating pattern is formed on a glass substrate, even when sintering is performed at a relatively low temperature so as not to cause deformation of the substrate or the like, sufficient softening can be performed, and thus it is possible to obtain An insulating pattern with a small surface roughness. The softening point is preferably in the range of 575 ° C to 597 ° C, more preferably in the range of 580 ° C to 595 ° C.
本發明所謂之軟化點通常可使用示差熱分析裝置(DTA)而測定,例如可根據測定玻璃粉末而所得之DTA曲線,藉由切線法對吸熱峰中之吸熱結束溫度進行外推而求出。 The softening point in the present invention can be generally measured by using a differential thermal analyzer (DTA). For example, the DTA curve obtained by measuring the glass powder can be obtained by extrapolating the endothermic end temperature in the endothermic peak by a tangent method.
於將本發明之糊劑製成感光性糊劑之情形時,較佳的是低軟化點玻璃粉末之折射率為1.45~1.65。藉由使無機 成分與有機成分之折射率一致,抑制光散射而使高精度之圖案加工變容易。本發明中之折射率可藉由貝克線檢測法而測定,將25℃下之波長436nm(水銀燈之g線)下之折射率作為本發明之折射率。 In the case where the paste of the present invention is used as a photosensitive paste, it is preferred that the low softening point glass powder has a refractive index of 1.45 to 1.65. By making inorganic The composition has the same refractive index as the organic component, and suppresses light scattering to facilitate high-precision pattern processing. The refractive index in the present invention can be measured by the Becker line detection method, and the refractive index at a wavelength of 436 nm (g line of a mercury lamp) at 25 ° C is taken as the refractive index of the present invention.
本發明之糊劑中所使用之低軟化點玻璃粉末之粒徑可考慮所欲製作之圖案之形狀而選擇,較佳的是重量分布曲線中之50%粒徑(平均粒徑)d50為0.1μm~3.0μm,最大粒徑dmax為20μm以下。 The particle diameter of the low-softening point glass powder used in the paste of the present invention can be selected in consideration of the shape of the pattern to be produced, and it is preferred that the 50% particle diameter (average particle diameter) d 50 in the weight distribution curve is 0.1 μm to 3.0 μm, and the maximum particle diameter d max is 20 μm or less.
本發明之糊劑中所使用之低軟化點玻璃粉末必須含有以氧化物表示而言為氧化矽、氧化硼、鹼金屬氧化物作為構成成分。另外,於將低軟化點玻璃粉末中之氧化矽含有率設為X(SiO2)(mol%)、將低軟化點玻璃粉末中之氧化硼含有率設為X(B2O3)(mol%)、將低軟化點玻璃粉末中之鹼金屬氧化物含有率設為X(M2O)(mol%)時,必須使下述式(1)所表示之A之值為35~46之範圍內。 The low-softening point glass powder used in the paste of the present invention must contain, as an oxide, cerium oxide, boron oxide, or an alkali metal oxide as a constituent component. Further, the content of cerium oxide in the low-softening point glass powder is X (SiO 2 ) (mol%), and the boron oxide content in the low-softening point glass powder is X (B 2 O 3 ) (mol) When the alkali metal oxide content in the low-softening point glass powder is X (M 2 O) (mol%), the value of A represented by the following formula (1) must be 35 to 46. Within the scope.
A=X(SiO2)+X(B2O3)-X(M2O) (1) A=X(SiO 2 )+X(B 2 O 3 )-X(M 2 O) (1)
另外,一般情況下鹼金屬是指鋰、鈉、鉀、銣、銫,作為本發明之低軟化點玻璃粉末之構成成分而含有的鹼金屬氧化物是指氧化鋰、氧化鈉及氧化鉀,必須包含該些中之1個以上作為必需成分,將氧化鋰、氧化鈉及氧化鉀之合計含有率設為X(M2O)而滿足上述式(1)。 In addition, in general, an alkali metal means lithium, sodium, potassium, rubidium, or cesium, and the alkali metal oxide contained as a constituent component of the low-softening point glass powder of the present invention means lithium oxide, sodium oxide, and potassium oxide, and must be In addition, one or more of these are essential components, and the total content of lithium oxide, sodium oxide, and potassium oxide is X (M 2 O), and the above formula (1) is satisfied.
藉由使A為46以下,可減少殘存有機成分。另一方 面,若A變小,則鹼金屬氧化物之含有率上升,隔板於煅燒後黃化,因此必須為35以上。較佳的是36~45之範圍內,更佳的是38~44之範圍內。 By setting A to 46 or less, the residual organic component can be reduced. The other side When A is small, the content of the alkali metal oxide increases, and the separator is yellowed after calcination, so it is necessary to be 35 or more. Preferably, it is in the range of 36 to 45, and more preferably in the range of 38 to 44.
於本發明中,藉由使上述式(1)中之A為46以下而表現出可形成殘存有機成分少之隔板的顯著效果之理由並不明確,但認為是如下之機理。 In the present invention, the reason why the A of the above formula (1) is 46 or less and the remarkable effect of forming a separator having a small residual organic component is not clear, but it is considered to be the following mechanism.
氧化矽與氧化硼是酸性成分,且鹼金屬氧化物是鹼成分,上述式(1)中之A是表示玻璃粉末中之酸性成分與鹼性成分之平衡的指標。於鹼金屬氧化物之含有率小、且A大於46之情形時,玻璃之酸鹼平衡偏移,因此變得化學性不穩定,從而導致與糊劑中之有機成分反應,或吸附熱分解物,殘存有機成分變多。可推測:藉由使作為鹼性成分之鹼金屬氧化物增加,使A為46以下,可使玻璃之酸鹼平衡變佳,其結果變得化學性穩定,與糊劑中之有機成分之反應得到抑制,或熱分解物之吸附得到抑制,從而可減少殘存有機成分。 The cerium oxide and the boron oxide are acidic components, and the alkali metal oxide is an alkali component, and A in the above formula (1) is an index indicating the balance between the acidic component and the alkaline component in the glass powder. When the content of the alkali metal oxide is small and A is greater than 46, the acid-base balance of the glass shifts, and thus becomes chemically unstable, thereby causing reaction with the organic component in the paste, or adsorption of the thermal decomposition product. There are more organic components remaining. It is presumed that by increasing the alkali metal oxide as an alkaline component and making A 46 or less, the acid-base balance of the glass can be improved, and as a result, it becomes chemically stable and reacts with the organic component in the paste. The suppression is suppressed, or the adsorption of the thermal decomposition product is suppressed, so that the residual organic component can be reduced.
以下對構成低軟化點玻璃粉末之各成分加以說明。 Hereinafter, each component constituting the low-softening point glass powder will be described.
氧化矽是形成玻璃骨架之材料。可有效地提高玻璃之緻密性、強度或穩定性,且對於玻璃之低折射率化而言亦有效。而且,於使用玻璃基板作為基材之情形時,亦可控制熱膨脹係數而防止與玻璃基板之失配所造成之剝離等問題。氧化矽之調配率較佳的是10mol%~40mol%,更佳的是20mol%~40mol%。藉由使氧化矽之調配率為10mol%以上,可將熱膨脹係數抑制得小從而於燒印於玻璃基板上 時難以產生裂痕,可將折射率抑制得低。而且,藉由使氧化矽之調配率為40mol%以下,可將軟化點抑制得低,從而降低燒印於玻璃基板上之燒印溫度。 Cerium oxide is a material that forms a glass skeleton. It can effectively improve the compactness, strength or stability of the glass, and is also effective for the low refractive index of the glass. Further, when a glass substrate is used as the substrate, the thermal expansion coefficient can be controlled to prevent problems such as peeling due to mismatch with the glass substrate. The blending ratio of cerium oxide is preferably from 10 mol% to 40 mol%, more preferably from 20 mol% to 40 mol%. By setting the cerium oxide ratio to 10 mol% or more, the thermal expansion coefficient can be suppressed to be small and burned on a glass substrate. When it is difficult to generate cracks, the refractive index can be suppressed low. Further, by setting the cerium oxide ratio to 40 mol% or less, the softening point can be suppressed to be low, and the baking temperature on the glass substrate can be lowered.
氧化硼是形成玻璃骨架之材料。具有使軟化點降低之效果,而且對於低折射率化而言有效。氧化硼之調配率較佳的是20mol%~45mol%,更佳的是20mol%~40mol%。藉由使氧化硼之調配率為20mol%以上,可將軟化點抑制得低而使於玻璃基板上之燒印變容易,且將折射率抑制得低。而且,藉由使氧化硼之調配率為45mol%以下,可維持玻璃之化學穩定性。 Boron oxide is a material that forms a glass skeleton. It has an effect of lowering the softening point and is effective for lowering the refractive index. The blending ratio of boron oxide is preferably from 20 mol% to 45 mol%, more preferably from 20 mol% to 40 mol%. When the blending ratio of boron oxide is 20 mol% or more, the softening point can be suppressed to be low, and the printing on the glass substrate can be easily performed, and the refractive index can be suppressed low. Further, by setting the boron oxide compounding ratio to 45 mol% or less, the chemical stability of the glass can be maintained.
作為鹼金屬氧化物之氧化鋰、氧化鈉及氧化鉀不僅可使玻璃之熱膨脹係數之控制變容易,而且具有使軟化點降低之效果。鹼金屬氧化物之調配率之合計較佳的是10mol%~30mol%,更佳的是10mol%~20mol%。藉由使鹼金屬氧化物之調配率之合計為10mol%以上,可獲得使玻璃之軟化點變低之效果。而且,藉由使鹼金屬氧化物之調配率之合計為30mol%以下,可維持化學穩定性,將熱膨脹係數抑制得小,將折射率抑制得低。作為鹼金屬,自可減低銀離子之遷移所造成之黃化之方面考慮,較佳的是選擇鋰。 Lithium oxide, sodium oxide and potassium oxide which are alkali metal oxides not only facilitate the control of the thermal expansion coefficient of the glass, but also have an effect of lowering the softening point. The total blending ratio of the alkali metal oxide is preferably from 10 mol% to 30 mol%, more preferably from 10 mol% to 20 mol%. When the total blending ratio of the alkali metal oxide is 10 mol% or more, the effect of lowering the softening point of the glass can be obtained. In addition, when the total blending ratio of the alkali metal oxide is 30 mol% or less, chemical stability can be maintained, the thermal expansion coefficient can be kept small, and the refractive index can be suppressed low. As the alkali metal, lithium is preferably selected from the viewpoint of reducing the yellowing caused by the migration of silver ions.
本發明中之低軟化點玻璃粉末必須進一步含有1.5mol%~5.5mol%之以氧化物表示而言為氧化鋅者作為構成成分。自氧化鋅具有可並不使玻璃之熱膨脹係數大幅變化而降低軟化點之效果考慮,必須含有1.5mol%以上。而 且,若含有率變高則玻璃之穩定性降低,折射率變高,與糊劑中之有機成分之反應性增加,糊劑黏度變得容易隨時間經過而上升,因此必須於5.5mol%以下之範圍內進行調配。較佳的是2.5mol%~3.3mol%。 The low-softening point glass powder in the present invention must further contain 1.5 mol% to 5.5 mol% of a zinc oxide as a constituent component in terms of oxide. The self-oxidizing zinc has an effect of not lowering the thermal expansion coefficient of the glass and lowering the softening point, and it is necessary to contain 1.5 mol% or more. and In addition, when the content rate is high, the stability of the glass is lowered, the refractive index is increased, and the reactivity with the organic component in the paste is increased, and the viscosity of the paste is likely to rise with time, so it must be 5.5 mol% or less. Provisioning within the scope. It is preferably 2.5 mol% to 3.3 mol%.
作為本發明中之低軟化點玻璃粉末,必須進一步含有以氧化物表示而言為鹼土金屬氧化物者作為構成成分,且鹼金屬氧化物、鹼土金屬氧化物及氧化鋅之合計為24mol%~30mol%。 In the low-softening point glass powder of the present invention, it is necessary to further contain, as a constituent component, an alkaline earth metal oxide represented by an oxide, and the total of the alkali metal oxide, the alkaline earth metal oxide, and the zinc oxide is 24 mol% to 30 mol. %.
另外,一般情況下鹼土金屬氧化物是指氧化鈣、氧化鍶、氧化鋇及氧化鐳,本發明中之鹼土金屬氧化物是氧化鎂、氧化鈣、氧化鍶及氧化鋇,所謂包含鹼土金屬氧化物是指含有該些化合物中之1種以上,將該些含有率之合計用作鹼土金屬氧化物之含有率。 In addition, in general, an alkaline earth metal oxide refers to calcium oxide, cerium oxide, cerium oxide, and oxidized radium. The alkaline earth metal oxides in the present invention are magnesium oxide, calcium oxide, cerium oxide, and cerium oxide, and so-called alkaline earth metal oxides. It is one or more types of these compounds, and the total content rate is used as the content rate of an alkaline earth metal oxide.
鹼金屬氧化物、鹼土金屬氧化物及氧化鋅均具有使軟化點降低之效果,因此其合計含有量必須為24mol%以上。而且,若含有率變高,則折射率變高,因此必須於其合計為30mol%以下之範圍內進行調配。較佳的是25mol%~29mol%,更佳的是26mol%~28mol%。 Since the alkali metal oxide, the alkaline earth metal oxide, and the zinc oxide all have an effect of lowering the softening point, the total content thereof must be 24 mol% or more. In addition, when the content ratio is high, the refractive index is high, and therefore it is necessary to carry out the formulation in a range of 30 mol% or less in total. It is preferably 25 mol% to 29 mol%, more preferably 26 mol% to 28 mol%.
鹼土金屬氧化物可有效地調整熱膨脹係數,且具有使軟化點降低之效果。鹼土金屬氧化物之調配率較佳的是2mol%~20mol%,更佳的是3mol%~18mol%。藉由使鹼土金屬氧化物之調配率為2mol%以上,可獲得使玻璃之軟化點變低之效果。而且,藉由使鹼土金屬氧化物之調配率為20mol%以下,可維持玻璃之化學穩定性,且可將折射 率抑制得低。 The alkaline earth metal oxide can effectively adjust the coefficient of thermal expansion and has an effect of lowering the softening point. The blending ratio of the alkaline earth metal oxide is preferably from 2 mol% to 20 mol%, more preferably from 3 mol% to 18 mol%. When the blending ratio of the alkaline earth metal oxide is 2 mol% or more, the effect of lowering the softening point of the glass can be obtained. Moreover, by setting the alkaline earth metal oxide to a compounding ratio of 20 mol% or less, the chemical stability of the glass can be maintained, and the refraction can be performed. The rate is suppressed low.
作為其他成分,可含有具有使玻璃之化學穩定性提高之效果的氧化鋁或氧化鈦、氧化鋯等,亦可含有具有使軟化點降低之效果的氧化鉍、氧化鉛。 The other component may contain alumina, titanium oxide, zirconium oxide, or the like, which has an effect of improving the chemical stability of the glass, and may contain cerium oxide or lead oxide having an effect of lowering the softening point.
作為低軟化點玻璃粉末之製作方法,例如將作為構成成分之氧化鋰、氧化矽、氧化硼、氧化鋇、氧化鎂及氧化鋁等原料以成為所規定的調配組成之方式加以混合,於900℃~1200℃下熔融後,急冷而製成玻璃粉後進行粉碎、分級而製成20μm以下之微細粉末。原料可使用高純度之碳酸鹽、氧化物、氫氧化物等。而且,若使用如下之粉末則可獲得電阻高且緻密、並且氣孔少、純度高之煅燒膜而較佳,所述粉末是根據玻璃粉末之種類或組成而使用99.99%以上之超高純度之烷醇鹽或有機金屬之原料,藉由溶膠凝胺法而均質地製作之粉末。 As a method for producing a low-softening point glass powder, for example, a raw material such as lithium oxide, cerium oxide, boron oxide, cerium oxide, magnesium oxide, or aluminum oxide as a constituent component is mixed so as to have a predetermined blending composition, and is 900 ° C. After melting at ~1200 ° C, it is quenched to obtain a glass frit, and then pulverized and classified to obtain a fine powder of 20 μm or less. High-purity carbonates, oxides, hydroxides, and the like can be used as the raw materials. Further, it is preferable to use a powder having a high electric resistance and a high density, and having a small number of pores and a high purity, and the powder is used in an ultrahigh purity alkane of 99.99% or more depending on the kind or composition of the glass powder. A raw material of alkoxide or organometallic, which is homogeneously prepared by a sol-gel method.
於本發明中,低軟化點玻璃粉末之構成成分及其含有率可根據製作玻璃粉末時之原料及其調配率而算出,亦可根據玻璃粉末、糊劑或隔板而算出。於玻璃粉末之情形時,可藉由進行原子吸光分析、感應耦合電漿(ICP)發射光譜分析而定量地決定。於隔板之情形時,可藉由歐傑電子光譜分析而定量地決定。具體而言是根據隔板截面之SEM影像之濃淡差而區別低軟化點玻璃,藉由歐傑電子光譜而進行元素分析。而且亦可輔助地使用其他公知之分析手段,例如自隔板選擇性地削出低軟化點玻璃,進行原子吸光分析、感應耦合電漿(ICP)發射光譜分析。於糊劑之 情形時,可藉由過濾糊劑、加以清洗等操作而分離玻璃粉末,由此而藉由與玻璃粉末同樣之手法而進行分析。或者可藉由塗佈糊劑並進行煅燒而形成隔板,然後藉由與隔板同樣之手法而進行分析。 In the present invention, the constituent components of the low-softening point glass powder and the content thereof can be calculated from the raw materials and the blending ratio at the time of producing the glass powder, and can be calculated from the glass powder, the paste or the separator. In the case of glass powder, it can be quantitatively determined by performing atomic absorption analysis and inductively coupled plasma (ICP) emission spectrometry. In the case of a separator, it can be quantitatively determined by Auger electron spectroscopy. Specifically, the low-softening point glass is distinguished according to the difference in SEM image of the cross-section of the separator, and elemental analysis is performed by the Auger electron spectrum. It is also possible to use other well-known analytical means, such as selectively cutting low-softening point glass from the separator, performing atomic absorption analysis, and inductively coupled plasma (ICP) emission spectroscopy. In paste In this case, the glass powder can be separated by an operation of filtering the paste, washing, or the like, and thereby analyzing by the same method as the glass powder. Alternatively, the separator may be formed by applying a paste and calcining, and then analyzing by the same method as the separator.
根據元素分析結果而算出構成成分之含有率的方法如下所述。藉由元素分析而獲得玻璃粉末中所含之元素之質量比之信息,因此可基於原子量、氧化物之式量、氧化物之組成式中之陽離子數而算出氧化物換算之質量比、亦即構成成分之質量比。作為將所得之構成成分之質量比換算為莫耳比之換算,於將Ri設為構成成分i之質量%,將Fi設為構成成分i之式量,將Σ設為所有成分之和之情形時,可藉由下式而進行換算。 The method of calculating the content ratio of the constituent components based on the result of the elemental analysis is as follows. Since information on the mass ratio of the elements contained in the glass powder is obtained by elemental analysis, the mass ratio of the oxide conversion can be calculated based on the atomic weight, the amount of the oxide, and the number of cations in the composition formula of the oxide, that is, The mass ratio of the constituents. In the conversion of the mass ratio of the obtained constituent components into the molar ratio, Ri is assumed to be the mass % of the constituent component i, Fi is the formula of the component i, and Σ is the sum of all the components. In time, conversion can be performed by the following formula.
(Ri/Fi)/Σ(Ri/Fi)×100(mol%) (Ri/Fi)/Σ(Ri/Fi)×100 (mol%)
於本發明中,亦可添加填料作為無機成分。本發明中之填料是用以改良隔板之強度而添加者,是指即使於煅燒溫度下亦難以熔融流動之無機粉末。具體而言是指於650℃以下並不具有軟化點或熔點、分解溫度,於650℃下以固體之形式存在的無機粉末。填料可使用選自軟化點為650℃~1200℃之高軟化點玻璃粉末或堇青石、氧化鋁、二氧化矽、氧化鎂、氧化鋯等陶瓷粉末之至少1種。自重量分布曲線中之50%粒徑(平均粒徑)d50或平均折射率之調節之容易性之方面考慮,較佳的是使用高軟化點玻璃粉 末。填料可考慮於糊劑中之分散性或填充性、抑制曝光時之光散射而較佳地使用平均粒徑為0.1μm~3.0μm、最大粒徑為20μm以下者。 In the present invention, a filler may also be added as an inorganic component. The filler in the present invention is added to improve the strength of the separator, and is an inorganic powder which is difficult to melt even at a calcination temperature. Specifically, it means an inorganic powder which does not have a softening point or a melting point and a decomposition temperature below 650 ° C and is present as a solid at 650 ° C. As the filler, at least one selected from the group consisting of a high softening point glass powder having a softening point of 650 ° C to 1200 ° C or a ceramic powder such as cordierite, alumina, ceria, magnesia or zirconia may be used. From the viewpoint of the easiness of adjustment of the 50% particle diameter (average particle diameter) d 50 or the average refractive index in the weight distribution curve, it is preferred to use a high softening point glass powder. The filler can be preferably used in consideration of dispersibility or filling property in the paste and light scattering during exposure, and an average particle diameter of 0.1 μm to 3.0 μm and a maximum particle diameter of 20 μm or less are preferably used.
於添加低軟化點玻璃及填料作為無機成分之情形時,低軟化點玻璃粉末於無機成分中所佔之比例較佳的是50vol%~98vol%。若含有比例為50vol%以上,則煅燒時之燒結變容易,可維持煅燒後之圖案空隙比小而較佳。而且,若含有比例為98vol%以下,則具有如下優點而較佳:可控制煅燒時之無機成分整體之流動性,且可防止圖案形狀之變形,改善煅燒後圖案之機械強度,可形成難以由於衝擊而破裂之圖案等。 In the case where a low-softening point glass and a filler are added as an inorganic component, the proportion of the low-softening point glass powder in the inorganic component is preferably from 50 vol% to 98 vol%. When the content ratio is 50 vol% or more, sintering at the time of firing becomes easy, and it is preferable to maintain a small pattern void ratio after firing. Further, when the content ratio is 98 vol% or less, it is preferable to control the fluidity of the inorganic component as a whole during calcination, prevent deformation of the pattern shape, and improve mechanical strength of the pattern after calcination, which may be difficult to form due to A pattern that is broken by impact and the like.
無機成分中之低軟化點玻璃粉末及填料之比例可根據製成糊劑時之各成分之調配率而算出,亦可藉由掃描式電子顯微鏡對糊劑乾燥膜(塗佈感光性糊劑並加以乾燥而獲得)或糊劑煅燒膜(對乾燥膜進行煅燒而獲得)之截面進行觀察而求出。藉由掃描式電子顯微鏡而觀察垂直於糊劑乾燥膜或糊劑煅燒膜之膜面的截面,根據影像之濃淡而區別無機成分之種類,進行影像解析即可。影像之濃淡與無機成分之關係可藉由利用X射線之元素分析而確定。作為掃描式電子顯微鏡之評價區域,例如以20μm×100μm左右之面積為對象,藉由1000倍~3000倍左右進行觀察即可。 The ratio of the low-softening point glass powder and the filler in the inorganic component can be calculated according to the blending ratio of each component in the preparation of the paste, and the film can be dried by a scanning electron microscope (coating the photosensitive paste and The section obtained by drying or obtained by baking a paste-fired film (obtained by calcination of a dry film) was computed. The cross section perpendicular to the film surface of the paste-dried film or the paste-fired film is observed by a scanning electron microscope, and the type of the inorganic component is distinguished according to the shade of the image, and image analysis can be performed. The relationship between the shade of the image and the inorganic component can be determined by elemental analysis using X-rays. The evaluation area of the scanning electron microscope may be, for example, an area of about 20 μm × 100 μm, and may be observed by about 1000 to 3000 times.
可較佳地使用之高軟化點玻璃粉末例如以氧化物表示而言具有下述之組成。 The high softening point glass powder which can be preferably used has, for example, an oxide composition having the following composition.
於以本發明之糊劑為感光性糊劑之情形時,較佳的是填料之折射率為1.45~1.65。藉由使無機成分與有機成分之折射率一致,抑制光散射而使高精度之圖案加工變容易。 In the case where the paste of the present invention is used as a photosensitive paste, it is preferred that the filler has a refractive index of 1.45 to 1.65. By matching the refractive indices of the inorganic component and the organic component, light scattering is suppressed, and high-precision pattern processing is facilitated.
較佳的是於糊劑之固形物中以合計為35vol%~80vol%、更佳的是40vol%~70vol%之含有率包含上述無機成分。此處,所謂固形物是糊劑中所含之無機成分、及除溶劑以外之有機成分。若無機成分之含有率變得小於35vol%,則由於煅燒所造成之圖案收縮變大,形狀容易變不良而欠佳。而且,若變得大於80vol%,則變得難以均一地塗佈而欠佳。 It is preferable that the inorganic component is contained in the solid content of the paste in a total content of 35 vol% to 80 vol%, more preferably 40 vol% to 70 vol%. Here, the solid matter is an inorganic component contained in the paste and an organic component other than the solvent. When the content ratio of the inorganic component becomes less than 35 vol%, the pattern shrinkage due to firing becomes large, and the shape is liable to be deteriorated and is not preferable. Moreover, when it becomes more than 80 vol%, it becomes difficult to apply uniformly and it is unpreferable.
固形物中之無機成分之含有率(vol%)可於調製糊劑時考慮無機成分及有機成分之密度而藉由添加率(質量%)控制。而且,作為分析無機成分之含有率的方法可列舉:藉由熱重量測定(TGA)與無機成分之煅燒膜之密度測定而求出之方法,或者藉由糊劑乾燥膜(塗佈糊劑並進行乾燥而獲得)的穿透式電子顯微鏡觀察影像的影像解析而求出的方法。於藉由熱重量測定與無機成分之煅燒膜之密度 測定而求出之情形時,例如將10mg左右之糊劑作為樣品,藉由TGA(例如島津製作所股份有限公司製造之「TGA-50」)而評價室溫~600℃之重量變化。通常情況下,糊劑中之溶劑於100℃~150℃下蒸發,因此根據升溫至600℃之後的重量(有機成分被除去,因此相當於無機成分之重量)相對於溶劑蒸發後之重量之比例而求出無機成分與有機成分之重量比。另一方面,若基於煅燒膜之膜厚、面積與質量而評價無機成分之密度,則可評價含有率。 而且,於藉由穿透式電子顯微鏡觀察而求出含有率之情形時,藉由穿透式電子顯微鏡(例如日本電子股份有限公司製造之「JEM-4000EX」)而觀察垂直於糊劑乾燥膜之膜面的截面,根據影像之濃淡而區別無機成分與有機成分,進行影像解析即可。作為穿透式電子顯微鏡之評價區域,例如以20μm×100μm左右之面積為對象,於1000倍~3000倍左右進行觀察即可。 The content ratio (vol%) of the inorganic component in the solid matter can be controlled by the addition ratio (% by mass) in consideration of the density of the inorganic component and the organic component in the preparation of the paste. Further, as a method of analyzing the content ratio of the inorganic component, a method of determining the density of the calcined film of the inorganic component by thermogravimetry (TGA) or a method of drying the film by a paste (coating paste and A method of obtaining an image analysis of a video by a transmission electron microscope obtained by drying. Density of calcined film by thermal gravimetric determination with inorganic components In the case of the measurement, for example, a paste of about 10 mg is used as a sample, and a weight change of room temperature to 600 ° C is evaluated by TGA (for example, "TGA-50" manufactured by Shimadzu Corporation). Usually, the solvent in the paste evaporates at 100 ° C to 150 ° C, so the weight after the temperature is raised to 600 ° C (the organic component is removed, so the weight of the inorganic component is equivalent to the weight of the solvent after evaporation) The weight ratio of the inorganic component to the organic component is determined. On the other hand, when the density of the inorganic component is evaluated based on the film thickness, the area, and the mass of the calcined film, the content ratio can be evaluated. In addition, when the content is determined by a transmission electron microscope, a dry film perpendicular to the paste is observed by a transmission electron microscope (for example, "JEM-4000EX" manufactured by JEOL Ltd.). The cross section of the film surface can be distinguished from the inorganic component and the organic component according to the shade of the image, and the image analysis can be performed. The evaluation area of the transmission electron microscope may be observed at an area of about 20 μm × 100 μm, for example, at about 1000 to 3000 times.
本發明中之糊劑必須含有有機成分。此處,有機成分若為於塗佈糊劑時具有適度之黏度,塗佈糊劑而視需要進行乾燥時可保持圖案形狀者即可。本發明之糊劑中所使用之有機成分可根據隔板形成製程而選擇,並無特別限定。 例如,可使用以乙基纖維素為代表之纖維素化合物、以聚甲基丙烯酸異丁酯為代表之丙烯酸聚合物等。而且,可列舉聚乙烯醇、聚乙烯丁醛、甲基丙烯酸酯聚合物、丙烯酸酯聚合物、丙烯酸酯-甲基丙烯酸酯共聚物、α-甲基苯乙烯聚合物等樹脂。 The paste in the present invention must contain an organic component. Here, the organic component may have a moderate viscosity when the paste is applied, and the pattern may be maintained when the paste is applied and dried as needed. The organic component used in the paste of the present invention can be selected according to the separator forming process, and is not particularly limited. For example, a cellulose compound typified by ethyl cellulose, an acrylic polymer typified by polybutyl methacrylate, or the like can be used. Further, examples thereof include resins such as polyvinyl alcohol, polyvinyl butyral, methacrylate polymers, acrylate polymers, acrylate-methacrylate copolymers, and α-methylstyrene polymers.
於將本發明之糊劑製成感光性糊劑之情形時,其特徵在於含有感光性有機成分。感光性有機成分是選自感光性單體、感光性寡聚物、感光性聚合物中之至少1種。而且,可視需要而添加非感光性聚合物成分、抗氧化劑、有機染料、光聚合起始劑、增感劑、增感助劑、塑化劑、增稠劑、分散劑、有機溶劑、懸浮劑等有機成分。 In the case where the paste of the present invention is used as a photosensitive paste, it is characterized by containing a photosensitive organic component. The photosensitive organic component is at least one selected from the group consisting of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer. Further, a non-photosensitive polymer component, an antioxidant, an organic dye, a photopolymerization initiator, a sensitizer, a sensitizer, a plasticizer, a thickener, a dispersant, an organic solvent, a suspending agent may be added as needed. And other organic ingredients.
本發明中所謂之感光性糊劑是指藉由對進行了塗佈、乾燥之後的塗膜照射活性光線,照射部分通過光交聯、光聚合、光解聚合、光改質等反應而產生化學結構變化,從而變得可進行利用顯影液之顯影的糊劑。本發明特別是藉由可製成負型感光性糊劑而獲得良好之特性,所述負型感光性糊劑可藉由照射活性光線而使照射部分變得不溶於顯影液中,然後利用顯影液而僅僅除去未照射部分,藉此而進行圖案形成。此處所謂之活性光線是指產生此種化學反應之250nm~1100nm之波長區域的光線,具體而言可列舉超高壓水銀燈、金屬鹵素燈等之紫外光線,鹵素燈等之可見光線,氦-鎘雷射、氦-氖雷射、氬離子雷射、半導體雷射、YAG雷射、二氧化碳雷射等之特定波長的雷射光線等。 In the present invention, the photosensitive paste is obtained by irradiating active light rays to a coating film which has been applied and dried, and the irradiation portion is subjected to a reaction such as photocrosslinking, photopolymerization, photopolymerization, or photo-modification to generate a chemical. The structure is changed, so that it becomes possible to perform the development using the development of the developer. In particular, the present invention obtains good characteristics by making a negative photosensitive paste which can make the irradiated portion insoluble in the developing solution by irradiating the active light, and then utilizes development. The liquid is removed, and only the unirradiated portion is removed, whereby patterning is performed. The active light referred to herein is light having a wavelength range of 250 nm to 1100 nm which generates such a chemical reaction, and specific examples thereof include ultraviolet light such as an ultrahigh pressure mercury lamp or a metal halide lamp, visible light rays such as a halogen lamp, and cesium-cadmium. Laser light of a specific wavelength such as laser, 氦-氖 laser, argon ion laser, semiconductor laser, YAG laser, carbon dioxide laser, and the like.
感光性聚合物可較佳地使用鹼可溶性之聚合物。其原因在於:藉由使聚合物具有鹼可溶性,可並不使用對環境而言存在問題之有機溶劑而是使用鹼性水溶液作為顯影液。鹼可溶性之聚合物可較佳地使用丙烯酸系共聚物。丙烯酸系共聚物是於共聚成分中至少包含丙烯酸系單體之共 聚物,丙烯酸系單體之具體例可列舉:丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸異丙酯、丙烯酸正丁酯、丙烯酸第二丁酯、丙烯酸異丁酯、丙烯酸第三丁酯、丙烯酸正戊酯、丙烯酸烯丙酯、丙烯酸苄酯、丙烯酸丁氧基乙酯、丁氧基三乙二醇丙烯酸酯、丙烯酸環己基酯、丙烯酸二環戊基酯、丙烯酸二環戊烯基酯、丙烯酸-2-乙基己酯、丙三醇丙烯酸酯、丙烯酸縮水甘油酯、丙烯酸十七氟癸基酯、丙烯酸-2-羥基乙酯、丙烯酸異冰片基酯、丙烯酸-2-羥基丙酯、丙烯酸異癸基酯、丙烯酸異辛酯、丙烯酸月桂基酯、丙烯酸-2-甲氧基乙酯、甲氧基乙二醇丙烯酸酯、甲氧基二乙二醇丙烯酸酯、丙烯酸八氟戊基酯、丙烯酸苯氧基乙酯、丙烯酸硬脂基酯、丙烯酸三氟乙酯、丙烯醯胺、丙烯酸胺基乙酯、丙烯酸苯基酯、丙烯酸-1-萘基酯、丙烯酸-2-萘基酯、苯硫酚丙烯酸酯、苄硫醇丙烯酸酯等丙烯酸系單體及將該些丙烯酸酯替換為甲基丙烯酸酯而成者等。 丙烯酸系單體以外之共聚成分可使用具有碳-碳雙鍵之化合物,較佳地列舉苯乙烯、鄰甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、α-甲基苯乙烯、氯甲基苯乙烯、羥基甲基苯乙烯等苯乙烯類或1-乙烯基-2-吡咯啶酮等。 As the photosensitive polymer, an alkali-soluble polymer can be preferably used. The reason for this is that by making the polymer alkali-soluble, it is possible to use an alkaline aqueous solution as a developing solution without using an organic solvent which is problematic for the environment. As the alkali-soluble polymer, an acrylic copolymer can be preferably used. The acrylic copolymer is a copolymer comprising at least an acrylic monomer Specific examples of the polymer and the acrylic monomer include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, second butyl acrylate, isobutyl acrylate, and acrylic acid. Butyl ester, n-amyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxy triethylene glycol acrylate, cyclohexyl acrylate, dicyclopentyl acrylate, dicyclopentyl acrylate Alkenyl ester, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobornyl acrylate, acrylic acid-2- Hydroxypropyl ester, isodecyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxy ethylene glycol acrylate, methoxy diethylene glycol acrylate, acrylic acid Octafluoropentyl ester, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, acrylamide, aminoethyl acrylate, phenyl acrylate, 1-naphthyl acrylate, acrylic acid - 2-naphthyl ester, thiophenol Acrylic monomers acrylate, benzyl acrylate, thiol and replacing the more acrylate methacrylate and the like are formed. As the copolymerization component other than the acrylic monomer, a compound having a carbon-carbon double bond can be used, and preferably, styrene, o-methyl styrene, m-methyl styrene, p-methyl styrene, and α-methyl styrene are exemplified. And styrene such as chloromethylstyrene or hydroxymethylstyrene or 1-vinyl-2-pyrrolidone.
為了賦予丙烯酸系共聚物鹼可溶性,可藉由加入不飽和羧酸等不飽和酸作為單體而達成。不飽和酸之具體例可列舉丙烯酸、甲基丙烯酸、伊康酸、丁烯酸、馬來酸、富馬酸或該些之酸酐。加成該些單體後之聚合物之酸值較佳的是50~150之範圍。 In order to impart alkali solubility to the acrylic copolymer, it can be achieved by adding an unsaturated acid such as an unsaturated carboxylic acid as a monomer. Specific examples of the unsaturated acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid or anhydrides thereof. The acid value of the polymer after the addition of the monomers is preferably in the range of 50 to 150.
於使用丙烯酸系共聚物之情形時,為了使感光性糊劑之曝光所產生之硬化反應的反應速度變大,較佳的是製成於側鏈或分子末端具有碳-碳雙鍵之丙烯酸系共聚物。具有碳-碳雙鍵之基可列舉乙烯基、烯丙基、丙烯基、甲基丙烯基等。為了使此種官能基加成於丙烯酸系共聚物上具有如下之方法:使具有縮水甘油基或異氰酸酯基與碳-碳雙鍵之化合物、或丙烯醯氯、甲基丙烯醯氯或烯丙基氯對丙烯酸系共聚物中之巰基、胺基、羥基、羧基進行加成反應而製造。 In the case of using an acrylic copolymer, in order to increase the reaction rate of the hardening reaction by exposure of the photosensitive paste, it is preferred to prepare an acrylic resin having a carbon-carbon double bond at a side chain or a molecular end. Copolymer. Examples of the group having a carbon-carbon double bond include a vinyl group, an allyl group, a propenyl group, a methacryl group, and the like. In order to add such a functional group to an acrylic copolymer, there is a method of: a compound having a glycidyl group or an isocyanate group and a carbon-carbon double bond, or a propylene chloride, a methacrylium chloride or an allyl group. Chlorine is produced by addition reaction of a mercapto group, an amine group, a hydroxyl group, and a carboxyl group in an acrylic copolymer.
具有縮水甘油基與碳-碳雙鍵之化合物可列舉甲基丙烯酸縮水甘油酯、丙烯酸縮水甘油酯、烯丙基縮水甘油醚、丙烯酸縮水甘油基乙酯、丁烯醯基縮水甘油醚、丁烯酸縮水甘油酯、異丁烯酸縮水甘油酯等。具有異氰酸酯基與碳-碳雙鍵之化合物可列舉丙烯醯基異氰酸酯、甲基丙烯醯基異氰酸酯、丙烯醯基乙基異氰酸酯、甲基丙烯醯基乙基異氰酸酯等。 Examples of the compound having a glycidyl group and a carbon-carbon double bond include glycidyl methacrylate, glycidyl acrylate, allyl glycidyl ether, glycidyl acrylate, butenyl glycidyl ether, and butene. Glycidyl methacrylate, glycidyl methacrylate, and the like. Examples of the compound having an isocyanate group and a carbon-carbon double bond include propylene decyl isocyanate, methacryl oxime isocyanate, propylene decyl ethyl isocyanate, and methacryl oxiranyl ethyl isocyanate.
另外,本發明之感光性糊劑亦可含有非感光性聚合物成分作為有機成分,所述非感光性聚合物成分例如為甲基纖維素、乙基纖維素等纖維素化合物、高分子量聚醚等。 Further, the photosensitive paste of the present invention may contain a non-photosensitive polymer component as an organic component, for example, a cellulose compound such as methyl cellulose or ethyl cellulose, or a high molecular weight polyether. Wait.
而且,感光性單體是含有碳-碳不飽和鍵之化合物,其具體例可列舉:丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丙酯、丙烯酸異丙酯、丙烯酸正丁酯、丙烯酸第二丁酯、丙烯酸異丁酯、丙烯酸第三丁酯、丙烯酸正戊酯、丙烯酸烯丙酯、丙烯酸苄酯、丙烯酸丁氧基乙酯、丁氧基三乙二醇丙烯酸 酯、丙烯酸環己基酯、丙烯酸二環戊基酯、丙烯酸二環戊烯基酯、丙烯酸-2-乙基己酯、丙三醇丙烯酸酯、丙烯酸縮水甘油酯、丙烯酸十七氟癸基酯、丙烯酸-2-羥基乙酯、丙烯酸異冰片基酯、丙烯酸-2-羥基丙酯、丙烯酸異癸酯、丙烯酸異辛酯、丙烯酸月桂基酯、丙烯酸-2-甲氧基乙酯、甲氧基乙二醇丙烯酸酯、甲氧基二乙二醇丙烯酸酯、丙烯酸八氟戊基酯、丙烯酸苯氧基乙酯、丙烯酸硬脂基酯、丙烯酸三氟乙酯、烯丙基化環己基二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,3-丁二醇二丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、二季戊四醇六丙烯酸酯、二季戊四醇單羥基五丙烯酸酯、二-三羥甲基丙烷四丙烯酸酯、丙三醇二丙烯酸酯、甲氧基化環己基二丙烯酸酯、新戊二醇二丙烯酸酯、丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、三丙三醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、丙烯醯胺、丙烯酸胺基乙酯、丙烯酸苯基酯、丙烯酸苯氧基乙酯、丙烯酸苄酯、丙烯酸-1-萘基酯、丙烯酸-2-萘基酯、雙酚A二丙烯酸酯、雙酚A-環氧乙烷加成物之二丙烯酸酯、雙酚A-環氧丙烷加成物之二丙烯酸酯、苯硫酚丙烯酸酯、苄硫醇丙烯酸酯,以及該些化合物之芳香環的氫原子中的1個~5個被取代為氯或溴原子之單體,或者苯乙烯、對甲基苯乙烯、鄰甲基苯乙烯、間甲基苯乙烯、氯化苯乙烯、溴化苯乙烯、α-甲基苯乙烯、氯化α-甲基苯乙烯、溴化α-甲基苯乙烯、氯甲基苯乙烯、羥基甲基苯乙烯、羧基甲基苯乙烯、乙烯基 萘、乙烯基蒽、乙烯基咔唑、及上述化合物之分子內的丙烯酸酯之一部分或全部被取代為甲基丙烯酸酯而成者,γ-甲基丙烯醯氧基丙基三甲氧基矽烷、1-乙烯基-2-吡咯啶酮等。而且,於多官能單體中,具有不飽和鍵之基亦可為丙烯基、甲基丙烯基、乙烯基、烯丙基混合存在。於本發明中,可使用該些化合物之1種或2種以上。 Further, the photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, and acrylic acid second. Ester, isobutyl acrylate, tert-butyl acrylate, n-amyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxy triethylene glycol Ester, cyclohexyl acrylate, dicyclopentyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobornyl acrylate, 2-hydroxypropyl acrylate, isodecyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxy Ethylene glycol acrylate, methoxy diethylene glycol acrylate, octafluoropentyl acrylate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, allylated cyclohexyl diacrylic acid Ester, 1,4-butanediol diacrylate, 1,3-butanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene Alcohol diacrylate, dipentaerythritol hexaacrylate, dipentaerythritol monohydroxy pentaacrylate, di-trimethylolpropane tetraacrylate, glycerol diacrylate, methoxycyclohexyl diacrylate, neopentyl Alcohol diacrylate, propylene glycol diacrylate, Propylene glycol diacrylate, tripropylene triol diacrylate, trimethylolpropane triacrylate, acrylamide, aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, benzyl acrylate, acrylic acid - 1-naphthyl ester, 2-naphthyl acrylate, bisphenol A diacrylate, diacrylate of bisphenol A-ethylene oxide adduct, diacrylic acid of bisphenol A-propylene oxide adduct Ester, thiophenol acrylate, benzyl thiol acrylate, and one to five of the hydrogen atoms of the aromatic ring of the compounds are substituted with a monomer of a chlorine or bromine atom, or styrene or p-methylbenzene Ethylene, o-methyl styrene, m-methyl styrene, chlorinated styrene, brominated styrene, α-methyl styrene, α-methyl styrene chloride, α-methyl styrene bromide, chlorine Methylstyrene, hydroxymethylstyrene, carboxymethylstyrene, vinyl Naphthalene, vinyl anthracene, vinyl carbazole, and some or all of the acrylates in the molecule of the above compound are substituted with methacrylate, γ-methacryloxypropyltrimethoxydecane, 1-vinyl-2-pyrrolidone and the like. Further, in the polyfunctional monomer, the group having an unsaturated bond may be a mixture of a propenyl group, a methacryl group, a vinyl group, and an allyl group. In the present invention, one type or two or more types of these compounds can be used.
本發明中所使用之感光性糊劑較佳的是進一步含有胺基甲酸酯化合物。其原因在於:藉由含有胺基甲酸酯化合物,可提高糊劑乾燥膜之柔軟性,減小煅燒時之應力,可有效地抑制龜裂或斷線等缺陷。而且,藉由含有胺基甲酸酯化合物,可使熱分解性提高,於煅燒步驟中變得難以殘存有機成分。本發明中所較佳地使用的胺基甲酸酯化合物例如可列舉下述通式(1)所表示之化合物。 The photosensitive paste used in the present invention preferably further contains a urethane compound. The reason for this is that by containing a urethane compound, the flexibility of the dried film of the paste can be improved, the stress at the time of firing can be reduced, and defects such as cracks or breakage can be effectively suppressed. Further, by containing a urethane compound, thermal decomposition property can be improved, and it becomes difficult to retain an organic component in the calcination step. The urethane compound which is preferably used in the present invention is, for example, a compound represented by the following formula (1).
此處,R1及R2是選自由包含乙烯性不飽和基之取代基、氫、碳數為1~20之烷基、芳基、芳烷基及羥基芳烷基所構成之群組者,可分別相同亦可不同。R3是環氧烷基或環氧烷寡聚物,R4是包含胺基甲酸酯鍵之有機基。n是1~10之整數。 Here, R 1 and R 2 are a group selected from the group consisting of a substituent containing an ethylenically unsaturated group, hydrogen, an alkyl group having 1 to 20 carbon atoms, an aryl group, an aralkyl group, and a hydroxyaralkyl group. , can be the same or different. R 3 is an alkylene oxide or alkylene oxide oligomer, and R 4 is an organic group containing a urethane bond. n is an integer from 1 to 10.
此種胺基甲酸酯化合物較佳的是包含環氧乙烷單元之化合物。更佳的是於通式(1)中,R4為包含環氧乙烷單元(以下表示為EO)與環氧丙烷單元(以下表示為PO) 之寡聚物,且該寡聚物中之EO含有率為8質量%~70質量%之範圍內的化合物。藉由使EO含有率為70質量%以下,可使柔軟性進一步提高,且可使煅燒應力變小,因此可有效地抑制缺陷。另外,熱分解性提高,且於隨後之煅燒步驟中,有機成分變得難以殘存。而且,藉由使EO含有率為8%以上,可提高與其他有機成分之相溶性。 Such a urethane compound is preferably a compound containing an ethylene oxide unit. More preferably, in the formula (1), R 4 is an oligomer comprising an ethylene oxide unit (hereinafter referred to as EO) and a propylene oxide unit (hereinafter referred to as PO), and the oligomer The compound having an EO content of from 8% by mass to 70% by mass. When the EO content is 70% by mass or less, the flexibility can be further improved and the calcination stress can be reduced, so that defects can be effectively suppressed. Further, the thermal decomposition property is improved, and in the subsequent calcination step, the organic component becomes difficult to remain. Further, by making the EO content rate 8% or more, the compatibility with other organic components can be improved.
而且,亦較佳的是胺基甲酸酯化合物具有碳-碳雙鍵。胺基甲酸酯化合物之碳-碳雙鍵與其他交聯劑之碳-碳雙鍵反應而含有於交聯體中,由此可進一步抑制聚合收縮。 Moreover, it is also preferred that the urethane compound has a carbon-carbon double bond. The carbon-carbon double bond of the urethane compound is contained in the crosslinked body by reacting with the carbon-carbon double bond of the other crosslinking agent, whereby the polymerization shrinkage can be further suppressed.
本發明中較佳使用之胺基甲酸酯化合物之具體例可列舉UA-2235PE(分子量為18000、EO含有率為20%)、UA-3238PE(分子量為19000、EO含有率為10%)、UA-3348PE(分子量為22000、EO含有率為15%)、UA-5348PE(分子量為39000、EO含有率為23%)(以上由新中村化學股份有限公司製造)等,但並不限定於該些化合物。而且,該些化合物亦可混合使用。 Specific examples of the urethane compound preferably used in the present invention include UA-2235PE (molecular weight: 18,000, EO content: 20%), UA-3238PE (molecular weight: 19,000, EO content: 10%), UA-3348PE (molecular weight: 22,000, EO content: 15%), UA-5348PE (molecular weight: 39,000, EO content: 23%) (the above is manufactured by Shin-Nakamura Chemical Co., Ltd.), etc., but is not limited thereto. Some compounds. Moreover, these compounds may also be used in combination.
胺基甲酸酯化合物之含有率較佳的是除溶劑以外之有機成分之0.1質量%~20質量%。藉由使含有率為0.1質量%以上,可提高糊劑乾燥膜之柔性,且可緩和對糊劑乾燥膜進行煅燒時之煅燒收縮應力。若含有率超過20質量%,則有機成分與無機成分之分散性降低,且單體及光聚合起始劑之濃度相對性地降低,因此變得容易產生缺陷。 The content of the urethane compound is preferably from 0.1% by mass to 20% by mass based on the organic component other than the solvent. By setting the content to be 0.1% by mass or more, the flexibility of the paste-dried film can be improved, and the calcination shrinkage stress at the time of baking the paste-dried film can be alleviated. When the content is more than 20% by mass, the dispersibility of the organic component and the inorganic component is lowered, and the concentration of the monomer and the photopolymerization initiator is relatively lowered, so that defects are likely to occur.
光聚合起始劑可較佳地使用藉由照射活性光源而產生自由基之光自由基起始劑。其具體例可列舉:二苯甲酮、 鄰苯甲醯苯甲酸甲酯、4,4-雙(二甲基胺基)二苯甲酮、4,4-雙(二乙基胺基)二苯甲酮、4,4-二氯二苯甲酮、4-苯甲醯基-4-甲基二苯基酮、二苄基酮、茀酮、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基-2-苯乙酮、2-羥基-2-甲基苯丙酮、對第三丁基二氯苯乙酮、噻噸酮、2-甲基噻噸酮、2-氯噻噸酮、2-異丙基噻噸酮、二乙基噻噸酮、苯偶醯、鄰苯甲醯苯甲酸甲酯、苄基甲氧基乙基縮醛、安息香、安息香甲醚、安息香丁醚、蒽醌、2-第三丁基蒽醌、2-戊基蒽醌、β-氯蒽醌、蒽酮、苯并蒽酮、二苯并環庚酮、亞甲基蒽酮、4-疊氮基苯基苯乙烯基酮、2,6-雙(對疊氮基苯亞甲基)環己酮、2,6-雙(對疊氮基苯亞甲基)-4-甲基環己酮、2-苯基-1,2-丁二酮-2-(鄰甲氧基羰基)肟、1-苯基-丙二酮-2-(鄰乙氧基羰基)肟、1,3-二苯基-丙三酮-2-(鄰乙氧基羰基)肟、1-苯基-3-乙氧基-丙三酮-2-(鄰苯甲醯基)肟、米其勒酮、2-甲基-[4-(甲硫基)苯基]-2-N-嗎啉基-1-丙酮、萘磺醯氯、2-苄基-2-二甲基胺基-1-(4-N-嗎啉基苯基)-1-丁酮、喹啉磺醯氯、N-苯硫基吖啶酮、4,4-偶氮雙異丁腈、二苯二硫醚、苯并噻唑二硫醚、三苯基膦、樟腦醌、四溴化碳、三溴苯基碸、過氧化安息香及曙紅、亞甲基藍等光還原性色素與抗壞血酸、三乙醇胺等還原劑之組合等。於本發明中可使用該些化合物之1種或2種以上。以相對於感光性單體與感光性聚合物之合計量而言為0.05質量%~20質量%、更佳的是0.1質量%~18質量%之範圍而添加光聚合起始劑。若聚合起始劑之量過少,則存在光敏度變不良之虞;若光聚 合起始劑之量過多,則存在曝光部之殘存率變得過小之虞。 As the photopolymerization initiator, a photoradical initiator which generates a radical by irradiation with an active light source can be preferably used. Specific examples thereof include benzophenone, Methyl benzalkonium benzoate, 4,4-bis(dimethylamino)benzophenone, 4,4-bis(diethylamino)benzophenone, 4,4-dichloro Benzene, 4-benzylidene-4-methyldiphenyl ketone, dibenzyl ketone, fluorenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2 -Phenyl-2-acetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone , 2-isopropyl thioxanthone, diethyl thioxanthone, benzoin, methyl benzyl benzoate, benzyl methoxy ethyl acetal, benzoin, benzoin methyl ether, benzoin,蒽醌, 2-tert-butyl fluorene, 2-pentyl hydrazine, β-chloropurine, fluorenone, benzofluorenone, dibenzocycloheptanone, methylene fluorenone, 4-azide Phenylstyryl ketone, 2,6-bis(p-azidobenzylidene)cyclohexanone, 2,6-bis(p-azidobenzylidene)-4-methylcyclohexanone , 2-phenyl-1,2-butanedione-2-(o-methoxycarbonyl)anthracene, 1-phenyl-propanedione-2-(o-ethoxycarbonyl)anthracene, 1,3-two Phenyl-propanetrione-2-(o-ethoxycarbonyl)anthracene, 1-phenyl-3-ethoxy-propanetrione-2-(o-benzylidene) , Michlerone, 2-methyl-[4-(methylthio)phenyl]-2-N-morpholinyl-1-propanone, naphthalenesulfonium chloride, 2-benzyl-2-dimethyl Amino-1-(4-N-morpholinylphenyl)-1-butanone, quinoline sulfonium chloride, N-phenylthioacridone, 4,4-azobisisobutyronitrile, diphenyl Disulfide, benzothiazole disulfide, triphenylphosphine, camphorquinone, carbon tetrabromide, tribromophenylphosphonium, peroxidized benzoin and eosin, methylene blue and other photoreducible pigments and reduction of ascorbic acid, triethanolamine, etc. Combination of agents, etc. One or two or more kinds of these compounds can be used in the present invention. The photopolymerization initiator is added in an amount of 0.05% by mass to 20% by mass, and more preferably 0.1% by mass to 18% by mass based on the total amount of the photosensitive monomer and the photosensitive polymer. If the amount of the polymerization initiator is too small, there is a problem that the photosensitivity becomes poor; When the amount of the starting agent is too large, the residual ratio of the exposed portion becomes too small.
而且,與光聚合起始劑一同使用增感劑,可提高感光度,且擴大對於反應而言有效的波長範圍。增感劑之具體例可列舉:2,4-二甲基噻噸酮、2,4-二乙基噻噸酮、2-異丙基噻噸酮、2,3-雙(4-二乙基胺基亞苄基)環戊酮、2,6-雙(4-二甲胺基亞苄基)-4-甲基環己酮、米其勒酮、4,4-雙(二乙基胺基)查耳酮、對二甲基胺基亞桂皮基二氫茚酮、對二甲基胺基苯亞甲基二氫茚酮、2-(對二甲基胺基苯基伸乙烯基)異萘并噻唑、1,3-雙(4-二甲基胺基亞苄基)丙酮、1,3-羰基雙(4-二乙基胺基亞苄基)丙酮、3,3-羰基雙-(7-二乙基胺基香豆素)、三乙醇胺、甲基二乙醇胺、三異丙醇胺、N-苯基-N-乙基乙醇胺、N-苯基乙醇胺、N-甲苯基二乙醇胺、4-二甲胺基苯甲酸甲酯、4-二甲基胺基苯甲酸乙酯、二甲基胺基苯甲酸異戊酯、二乙基胺基苯甲酸異戊酯、苯甲酸(2-二甲基胺基)乙酯、4-二甲基胺基苯甲酸(正丁氧基)乙酯、4-二甲基胺基苯甲酸-2-乙基己酯、3-苯基-5-苯甲醯基硫基四唑、1-苯基-5-乙氧基羰基硫基四唑等。於本發明中,可使用該些化合物之1種或2種以上。另外,於增感劑中亦存在可用作光聚合起始劑者。於將增感劑添加於本發明之感光性糊劑中之情形時,其添加量相對於除溶劑以外之有機成分而言較佳的是0.05質量%~10質量%,更佳的是0.1質量%~10質量%。藉由使增感劑之添加量為該範圍內,可保持曝光部之殘存率且獲得良好之光敏度。 Further, the use of a sensitizer together with a photopolymerization initiator improves the sensitivity and expands the wavelength range effective for the reaction. Specific examples of the sensitizer include 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, and 2,3-bis(4-diethyl). Aminobenzylidene)cyclopentanone, 2,6-bis(4-dimethylaminobenzylidene)-4-methylcyclohexanone, mischrone, 4,4-bis(diethyl Amino) chalcone, p-dimethylamino cinnamicin, p-dimethylaminobenzylidene ketone, 2-(p-dimethylaminophenyl vinyl) Iso-naphthylthiazole, 1,3-bis(4-dimethylaminobenzylidene)acetone, 1,3-carbonylbis(4-diethylaminobenzylidene)acetone, 3,3-carbonyl double -(7-diethylaminocoumarin), triethanolamine, methyldiethanolamine, triisopropanolamine, N-phenyl-N-ethylethanolamine, N-phenylethanolamine, N-methylphenyl Ethanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, benzoic acid 2-dimethylamino)ethyl ester, 4-dimethylaminobenzoic acid (n-butoxy)ethyl ester, 4-dimethylaminobenzoic acid 2-ethylhexyl ester, 3-phenyl -5-benzimidylthiotetrazole, 1-phenyl-5-ethoxy Carbonylthiotetrazole and the like. In the present invention, one type or two or more types of these compounds can be used. In addition, there are also those which can be used as a photopolymerization initiator in the sensitizer. When a sensitizer is added to the photosensitive paste of the present invention, the amount thereof is preferably 0.05% by mass to 10% by mass, more preferably 0.1% by mass based on the organic component other than the solvent. %~10% by mass. By setting the amount of the sensitizer to be within this range, the residual ratio of the exposed portion can be maintained and a good photosensitivity can be obtained.
亦較佳的是於本發明中使用抗氧化劑。所謂抗氧化劑 是具有自由基鏈抑制作用、三重態之消去作用、氫過氧化物之分解作用者。若於感光性糊劑中添加抗氧化劑,則抗氧化劑捕獲自由基,或使被激發之光聚合起始劑或增感劑之能量狀態恢復至基態,藉此而抑制散射光所造成之多餘之光反應,以無法藉由抗氧化劑而抑制之曝光量產生急劇之光反應,由此可提高於顯影液中之溶解、不溶之對比度。 具體而言可列舉:對苯醌、萘醌、對二甲基苯醌、對甲基苯醌、2,6-二氯醌、2,5-二乙醯氧基-對苯醌、2,5-二甲酸(dicaproxy)-對苯醌、對苯二酚、對第三丁基兒茶酚、2,5-二丁基對苯二酚、單第三丁基對苯二酚、2,5-二-第三戊基對苯二酚、二-第三丁基-對甲酚、對苯二酚單甲醚、α-萘酚、肼鹽酸鹽、三甲基苄基氯化銨、三甲基苄基草酸銨、苯基-β-萘基胺、對苄基胺基苯酚、二-β-萘基對苯二胺、二硝基苯、三硝基苯、苦味酸、醌二肟、環己酮肟、鄰苯三酚、丹寧酸、三乙基胺鹽酸鹽、二甲基苯胺鹽酸鹽、銅鐵靈、2,2'-硫代雙(4-第三辛基酚化物)-2-乙基己基胺基鎳(II)、4,4'-硫代雙-(3-甲基-6-第三丁基苯酚)、2,2'-亞甲基雙-(4-甲基-6-第三丁基苯酚)、三乙二醇-雙[3-(第三丁基-5-甲基-4-羥基苯基)丙酸]酯、1,6-己二醇-雙[(3,5-二第三丁基-4-羥基苯基)丙酸]酯、1,2,3-三羥基苯等,但並不限定於該些化合物。於本發明中可使用該些化合物之1種以上。抗氧化劑之添加量於感光性糊劑中較佳的是0.01質量%~30質量%,更佳的是0.05質量%~20質量%之範圍。藉由使抗氧化劑之添加量為該範圍內,可維持感光性糊劑之光 敏度,且保持聚合度而維持圖案形狀,可較大地獲得曝光部與未曝光部的之對比度。 It is also preferred to use an antioxidant in the present invention. Antioxidant It is a one that has a free radical chain inhibition effect, a triplet elimination effect, and a decomposition of a hydroperoxide. When an antioxidant is added to the photosensitive paste, the antioxidant traps the radical, or restores the energy state of the excited photopolymerization initiator or sensitizer to the ground state, thereby suppressing the excess caused by the scattered light. The photoreaction produces an abrupt photoreaction with an amount of exposure that cannot be suppressed by the antioxidant, thereby improving the contrast of dissolution and insolubility in the developer. Specific examples thereof include p-benzoquinone, naphthoquinone, p-dimethylphenylhydrazine, p-methylbenzoquinone, 2,6-dichloropurine, 2,5-diethyloxy-p-benzoquinone, 2, 5-dicarboxylic acid (dicaproxy)-p-benzoquinone, hydroquinone, p-tert-butylcatechol, 2,5-dibutyl hydroquinone, mono-tert-butyl hydroquinone, 2, 5-di-p-pentyl hydroquinone, di-tert-butyl-p-cresol, hydroquinone monomethyl ether, α-naphthol, hydrazine hydrochloride, trimethylbenzylammonium chloride , trimethylbenzyl ammonium oxalate, phenyl-β-naphthylamine, p-benzylaminophenol, bis-β-naphthyl p-phenylenediamine, dinitrobenzene, trinitrobenzene, picric acid, hydrazine Diterpenoid, cyclohexanone oxime, pyrogallol, tannic acid, triethylamine hydrochloride, dimethylaniline hydrochloride, copper iron, 2,2'-thiobis (4-third Octyl phenolate)-2-ethylhexylamino nickel (II), 4,4'-thiobis-(3-methyl-6-tert-butylphenol), 2,2'-methylene Bis-(4-methyl-6-tert-butylphenol), triethylene glycol-bis[3-(t-butyl-5-methyl-4-hydroxyphenyl)propionic acid], 1, 6-hexanediol-bis[(3,5-di-t-butyl-4-hydroxyphenyl)propionic acid], 1,2,3-trihydroxybenzene, etc. However, it is not limited to these compounds. One or more of these compounds can be used in the present invention. The amount of the antioxidant added is preferably from 0.01% by mass to 30% by mass, more preferably from 0.05% by mass to 20% by mass, based on the photosensitive paste. By making the amount of the antioxidant added within this range, the light of the photosensitive paste can be maintained The sensitivity is maintained, and the degree of polymerization is maintained to maintain the pattern shape, so that the contrast between the exposed portion and the unexposed portion can be largely obtained.
亦較佳的是於本發明之感光性糊劑中使用紫外線吸收劑。藉由添加紫外線吸收劑,可吸收曝光光線所造成之糊劑內部之散射光,使散射光變弱。紫外線吸收劑若於g線、h線及i線附近之波長的吸光性優異則特別有效,具體例可列舉:二苯甲酮系化合物、氰基丙烯酸酯化合物、水楊酸系化合物、苯并三唑系化合物、吲哚系化合物、無機系之微粒子氧化金屬等。該些化合物中特別有效的是二苯甲酮系化合物、氰基丙烯酸酯化合物、苯并三唑系化合物、吲哚系化合物。該些化合物之具體例可列舉2,4-二羥基二苯甲酮、2-羥基-4-甲氧基二苯甲酮、2,2'-二羥基-4,4'-二甲氧基二苯甲酮、2,2'-二羥基-4,4'-二甲氧基-5-磺基二苯甲酮、2-羥基-4-甲氧基-2'-羧基二苯甲酮、2-羥基-4-甲氧基-5-磺基二苯甲酮三水合物、2-羥基-4-正辛氧基二苯甲酮、2-羥基-4-十八烷氧基二苯甲酮、2,2',4,4'-四羥基二苯甲酮、4-十二烷氧基-2-羥基二苯甲酮、2-羥基-4-(2-羥基-3-甲基丙烯醯氧基)丙氧基二苯甲酮、2-(2'-羥基-3',5'-二第三丁基苯基)苯并三唑、2-(2'-羥基-3'-第三丁基-5'-甲基苯基)-5-氯苯并三唑、2-(2'-羥基-3',5'-二-第三丁基苯基)-5-氯苯并三唑、2-(2'-羥基-4'-正辛氧基苯基)苯并三唑、2-乙基己基-2-氰基-3,3-二苯基丙烯酸酯、2-乙基-2-氰基-3,3-二苯基丙烯酸酯、作為吲哚系紫外線吸收劑之BONASORB UA-3901、BONASORB UA-3902、BONASORB UA-3911、 SOM-2-0008(以上由Orient Chemical Industries Co.,Ltd.製造)、鹼性藍、蘇丹藍、蘇丹R、蘇丹I、蘇丹II、蘇丹III、蘇丹IV、油溶橙SS、油溶紫、油溶黃OB(以上由Aldrich公司製造)等,但並不限定於該些化合物。另外,亦可於該些紫外線吸收劑之骨架導入甲基丙烯基等而作為反應型使用。於本發明中,可使用該些化合物之1種或2種以上。 It is also preferred to use an ultraviolet absorber in the photosensitive paste of the present invention. By adding an ultraviolet absorber, the scattered light inside the paste caused by the exposure light can be absorbed, and the scattered light is weakened. The ultraviolet absorber is particularly effective when it absorbs light at a wavelength near the g line, the h line, and the i line, and specific examples thereof include a benzophenone compound, a cyanoacrylate compound, a salicylic acid compound, and benzo. A triazole compound, an anthraquinone compound, an inorganic fine particle metal oxide or the like. Among these compounds, a benzophenone-based compound, a cyanoacrylate compound, a benzotriazole-based compound, and an anthraquinone-based compound are particularly effective. Specific examples of such compounds include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, and 2,2'-dihydroxy-4,4'-dimethoxy group. Benzophenone, 2,2'-dihydroxy-4,4'-dimethoxy-5-sulfobenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone , 2-hydroxy-4-methoxy-5-sulfobenzophenone trihydrate, 2-hydroxy-4-n-octyloxybenzophenone, 2-hydroxy-4-octadecyloxy Benzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 2-hydroxy-4-(2-hydroxy-3- Methyl propylene oxime) propoxy benzophenone, 2-(2'-hydroxy-3',5'-di-t-butylphenyl)benzotriazole, 2-(2'-hydroxy- 3'-Tertibutyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-t-butylphenyl)-5 -Chlorobenzotriazole, 2-(2'-hydroxy-4'-n-octyloxyphenyl)benzotriazole, 2-ethylhexyl-2-cyano-3,3-diphenylacrylate , 2-ethyl-2-cyano-3,3-diphenyl acrylate, BONASORB UA-3901, BONASORB UA-3902, BONASORB UA-3911 as a lanthanide UV absorber SOM-2-0008 (manufactured by Orient Chemical Industries Co., Ltd.), Basic Blue, Sudan Blue, Sudan R, Sudan I, Sudan II, Sudan III, Sudan IV, oil-soluble orange SS, oil-soluble purple, Oil-soluble yellow OB (manufactured by Aldrich Co., Ltd.) or the like, but is not limited to these compounds. Further, a methacryl group or the like may be introduced into the skeleton of the ultraviolet absorber to be used as a reaction type. In the present invention, one type or two or more types of these compounds can be used.
於本發明中,紫外線吸收劑亦可使用光褪色性化合物。所謂光褪色性化合物是指具有如下性質之化合物:於照射活性光線之波長區域之光時,吸收活性光線之波長區域之光,通過光分解或光改質等化學結構之變化,使於活性光源之波長區域之吸光度變得比照射前更小。通常情況下,於感光性糊劑法中,利用超高壓水銀燈之g線(436nm)、h線(405nm)、i線(365nm)而進行曝光,因此較佳的是本發明中所使用之光褪色性化合物亦於g線、h線、i線區域具有吸收性。藉由於感光性糊劑中添加光褪色性化合物,於圖案設計上而言,可防止曝光光線侵入至作為不受到曝光光線照射之部分的未曝光部,可抑制圖案之底部粗大。而且,於曝光部中,光褪色性化合物吸收曝光光線之能量,經過光分解或光改質而逐漸變得不吸光,因此變得容易使充分之曝光光線到達至下層。因此,未曝光部與曝光部之光硬化之對比度變明確,可確實地提高曝光量裕度。具體而言可列舉光褪色性染料、光酸產生劑、光鹼產生劑、硝酮化合物等光分解性化合物或偶氮系染 料、光色化合物等光改質化合物。光酸產生劑之具體例可列舉鎓鹽、含有鹵素之化合物、重氮甲烷化合物、碸化合物、磺酸酯化合物、磺醯亞胺化合物、重氮甲酮化合物等作為例子。 In the present invention, a photo-fading compound can also be used as the ultraviolet absorber. The photofading compound refers to a compound having a property of absorbing a light in a wavelength region of the active light, and absorbing a light in a wavelength region of the active light, and changing the chemical structure such as photolysis or photo-modification to the active light source. The absorbance in the wavelength region becomes smaller than before the irradiation. In general, in the photosensitive paste method, the light is used in the g-line (436 nm), the h-line (405 nm), and the i-line (365 nm) of the ultrahigh pressure mercury lamp, and therefore the light used in the present invention is preferred. The fading compound is also absorptive in the g-line, h-line, and i-line regions. By adding a photo-fading compound to the photosensitive paste, it is possible to prevent the exposure light from entering the unexposed portion which is a portion which is not exposed to the exposure light, and to suppress the coarseness of the bottom portion of the pattern. Further, in the exposed portion, the photofadable compound absorbs the energy of the exposure light, and gradually becomes non-absorbed by photodecomposition or photo-modification, so that it is easy to allow sufficient exposure light to reach the lower layer. Therefore, the contrast of the light hardening of the unexposed portion and the exposed portion becomes clear, and the exposure amount margin can be surely improved. Specific examples thereof include photodegradable dyes such as photofading dyes, photoacid generators, photobase generators, and nitrone compounds, or azo dyes. Photo-modified compounds such as materials and photochromic compounds. Specific examples of the photoacid generator include an onium salt, a halogen-containing compound, a diazomethane compound, an anthraquinone compound, a sulfonate compound, a sulfonimide compound, a diazomethanone compound, and the like.
紫外線吸收劑之含有率於感光性糊劑中較佳的是0.001質量%~1質量%,更佳的是0.001質量%~0.5質量%。藉由使紫外線吸收劑之添加量為該範圍,可吸收散射光,抑制圖案之底部粗大,並且保持對於曝光光線之感光度。 The content of the ultraviolet absorber is preferably 0.001% by mass to 1% by mass, and more preferably 0.001% by mass to 0.5% by mass, based on the photosensitive paste. By setting the amount of the ultraviolet absorber to be in this range, the scattered light can be absorbed, the bottom of the pattern can be suppressed from being coarse, and the sensitivity to the exposure light can be maintained.
而且,於本發明中,亦較佳的是使用有機染料作為曝光、顯影之記號。藉由添加染料進行著色而使視認性變良好,變得容易區別顯影時殘留糊劑之部分與除去糊劑之部分。有機染料並無特別限定,較佳的是並不殘存於煅燒後之絕緣膜中者。具體而言可使用蒽醌系染料、靛藍系染料、酞菁系染料、碳鎓離子系染料、醌亞胺系染料、次甲基系染料、喹啉系染料、硝基系染料、亞硝基系染料、苯醌系染料、萘醌系染料、鄰苯二甲醯亞胺系染料、紫環酮系染料等。特佳的是選擇吸收h線與i線附近之波長之光的染料,例如鹼性藍等碳鎓離子系染料。有機染料之添加量較佳的是相對於除溶劑以外之有機成分而言為0.001質量%~1質量%。 Further, in the present invention, it is also preferred to use an organic dye as a mark for exposure and development. By adding a dye to colorize, the visibility is improved, and it becomes easy to distinguish the part of the residual paste at the time of development and the part which removes the paste. The organic dye is not particularly limited, and it is preferred that it does not remain in the insulating film after firing. Specifically, an anthraquinone dye, an indigo dye, a phthalocyanine dye, a carbonium ion dye, a quinone imine dye, a methine dye, a quinoline dye, a nitro dye, a nitroso can be used. A dye, a benzoquinone dye, a naphthoquinone dye, a phthalimide dye, a purple ketone dye, or the like. Particularly preferred is a dye which absorbs light of a wavelength near the h-line and the i-line, such as a carbon ray ion dye such as basic blue. The amount of the organic dye added is preferably 0.001% by mass to 1% by mass based on the organic component other than the solvent.
為了根據塗佈方法而調整將糊劑塗佈於基板上時之黏度,亦較佳的是使用有機溶劑。此時,所使用之有機溶劑可使用甲基賽珞蘇、乙基賽珞蘇、丁基賽路蘇、丁基卡必 醇、乙基卡必醇、丁基卡必醇乙酸酯、乙基卡必醇乙酸酯、丁酮、二噁烷、丙酮、環己酮、環戊酮、異丁醇、異丙醇、四氫呋喃、二甲基亞碸、γ-丁內酯、溴苯、氯苯、二溴苯、二氯苯、溴苯甲酸、氯苯甲酸等或含有該些溶劑中之1種以上的有機溶劑混合物。 In order to adjust the viscosity when the paste is applied onto the substrate according to the coating method, it is also preferred to use an organic solvent. At this time, the organic solvent used may be methyl acesulfame, ethyl acesulfame, butyl siroli, butyl carbene. Alcohol, ethyl carbitol, butyl carbitol acetate, ethyl carbitol acetate, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutanol, isopropanol , tetrahydrofuran, dimethyl hydrazine, γ-butyrolactone, bromobenzene, chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, etc. or one or more organic solvents containing these solvents mixture.
本發明之糊劑於將無機成分之各成分及有機成分之各成分調合成為預定之組成後,使用三輥研磨機等混練機器而進行正式混練,製作糊劑。而且,亦可預先適宜地對正式混練結束後之糊劑進行過濾、脫泡。 In the paste of the present invention, each component of the inorganic component and each component of the organic component are adjusted to a predetermined composition, and then kneaded by a kneading machine such as a three-roll mill to form a paste. Further, the paste after the completion of the final kneading may be appropriately filtered and defoamed in advance.
本發明之平面顯示器用面板的製造方法之特徵在於:於基板上塗佈上述糊劑,進行煅燒而形成絕緣性圖案。藉此可形成煅燒後之殘存有機成分少且無著色之絕緣性圖案,因此可獲得亮度或色純度等顯示特性優異、可靠性高的平面顯示器用面板。 The method for producing a panel for a flat panel display according to the present invention is characterized in that the paste is applied onto a substrate and fired to form an insulating pattern. As a result, an insulating pattern having little residual organic component after firing and having no coloration can be formed. Therefore, a flat panel display panel having excellent display characteristics such as brightness and color purity and high reliability can be obtained.
而且,本發明之平面顯示器用面板的製造方法之特徵在於:於基板上塗佈上述感光性糊劑,進行曝光、顯影、煅燒而形成絕緣性圖案。藉此不僅可形成煅燒後之殘存有機成分少、且無著色之絕緣性圖案,而且可高精度地形成高精細之絕緣性圖案,因此可穩定、低成本地獲得亮度或色純度等顯示特性優異、可靠性高的平面顯示器用面板。 Further, the method for producing a panel for a flat panel display according to the present invention is characterized in that the photosensitive paste is applied onto a substrate, exposed, developed, and fired to form an insulating pattern. In this way, not only an insulating pattern having less residual organic components after firing but also a coloring-free insulating pattern can be formed, and a high-definition insulating pattern can be formed with high precision, so that excellent display properties such as brightness and color purity can be obtained stably and at low cost. Highly reliable panel for flat panel displays.
本發明之平面顯示器用面板是具有以軟化點為570℃~620℃之低軟化點玻璃為主成分之隔板的平面顯示器用面板,其特徵在於:所述低軟化點玻璃含有氧化矽、氧化硼及鹼金屬氧化物,於將所述低軟化點玻璃中之氧化矽含 有率設為X(SiO2)(mol%)、將所述低軟化點玻璃中之氧化硼含有率設為X(B2O3)(mol%)、將所述低軟化點玻璃中之鹼金屬氧化物含有率設為X(M2O)(mol%)時,下述式(1)所表示之A之值在35~46之範圍內。 The panel for a flat panel display of the present invention is a panel for a flat panel display having a separator having a low softening point glass having a softening point of 570 ° C to 620 ° C as a main component, wherein the low softening point glass contains cerium oxide and oxidizes. Boron and an alkali metal oxide, wherein the cerium oxide content in the low softening point glass is X (SiO 2 ) (mol%), and the boron oxide content in the low softening point glass is X ( B 2 O 3 ) (mol%), when the alkali metal oxide content in the low-softening point glass is X (M 2 O) (mol%), A of the following formula (1) The value is in the range of 35~46.
A=X(SiO2)+X(B2O3)-X(M2O) (1) A=X(SiO 2 )+X(B 2 O 3 )-X(M 2 O) (1)
藉由將A之值設為35~46之範圍內,可製成亮度或色純度等顯示特性優異、可靠性高的平面顯示器用面板。 A之值較佳的是36~45之範圍內,更佳的是38~44之範圍內。此處所謂之主成分是表示固體成分全體中體積分率最大之成分。低軟化點玻璃之含有比例可利用電子顯微鏡觀察隔板之截面,藉由對於固體成分之總截面積中低軟化點玻璃所佔之截面積進行影像解析而求出。低軟化點玻璃與其他固體成分可藉由影像之濃淡差而區別。而且,亦可利用具有能量分散型X射線光譜分析裝置之掃描型分析顯微鏡(SEM-EDX)等機構對原子進行測繪,藉此而亦可對成分進行嚴密地區別。 By setting the value of A to the range of 35 to 46, it is possible to produce a panel for a flat panel display having excellent display characteristics such as brightness or color purity and high reliability. The value of A is preferably in the range of 36 to 45, and more preferably in the range of 38 to 44. Here, the main component is a component which indicates the largest volume fraction of the solid component. The ratio of the content of the low-softening point glass can be obtained by observing the cross section of the separator by an electron microscope, and performing image analysis on the cross-sectional area occupied by the low-softening point glass in the total cross-sectional area of the solid component. Low softening point glass and other solid components can be distinguished by the contrast of the image. Further, the atom can be mapped by a mechanism such as a scanning analysis microscope (SEM-EDX) having an energy dispersive X-ray spectrum analyzer, and the components can be closely distinguished.
作為隔板之主成分的低軟化點玻璃之構成成分及其含有率可藉由歐傑電子光譜分析而定量地決定。具體而言,是指藉由隔板截面之SEM影像之濃淡差而區別低軟化點玻璃,藉由歐傑電子光譜而進行元素分析。而且,亦可輔助地使用其他公知之分析手段,例如自隔板選擇性地削出低軟化點玻璃,進行原子吸光分析、感應耦合電漿(ICP) 發射光譜分析。 The constituent components of the low-softening point glass which is a main component of the separator and the content thereof can be quantitatively determined by Auger electron spectroscopy. Specifically, it means that the low-softening point glass is distinguished by the difference in SEM image of the cross-section of the separator, and elemental analysis is performed by the Auger electron spectrum. Moreover, other well-known analytical means may be additionally used, such as selective cutting of low-softening point glass from the separator, atomic absorption analysis, inductively coupled plasma (ICP) Emission spectrum analysis.
作為隔板之主成分的低軟化點玻璃之軟化點可自隔板選擇性地削出低軟化點玻璃,使用示差熱分析裝置(DTA)而測定。可根據測定玻璃粉末而所得之DTA曲線,藉由切線法對吸熱峰中之吸熱結束溫度進行外推而求出。 The softening point of the low-softening point glass which is a main component of the separator can be selectively cut from the separator to a low-softening point glass, and is measured using a differential thermal analyzer (DTA). The DTA curve obtained by measuring the glass powder can be obtained by extrapolating the endothermic end temperature in the endothermic peak by a tangent method.
於本發明之平面顯示器用面板中,其特徵在於:作為隔板之主成分的低軟化點玻璃粉末含有氧化鋅,其含有率為1.5mol%~5.5mol%之範圍內。自氧化鋅具有並不使玻璃之熱膨脹係數大幅變化地使軟化點降低之效果而言,其特徵在於含有1.5mol%以上。而且,若含有率變高,則玻璃之穩定性降低,折射率變高,與糊劑中之有機成分之反應性增加,糊劑黏度變得容易隨時間經過而上升,因此其特徵在於:於5.5mol%以下之範圍內進行調配。較佳的是2.5mol%~3.3mol%。 In the panel for a flat panel display of the present invention, the low-softening point glass powder which is a main component of the separator contains zinc oxide, and the content thereof is in the range of 1.5 mol% to 5.5 mol%. Zinc oxide has an effect of lowering the softening point without significantly changing the thermal expansion coefficient of the glass, and is characterized by containing 1.5 mol% or more. Further, when the content ratio is high, the stability of the glass is lowered, the refractive index is increased, the reactivity with the organic component in the paste is increased, and the viscosity of the paste is easily increased with the passage of time. The formulation is carried out within a range of 5.5 mol% or less. It is preferably 2.5 mol% to 3.3 mol%.
於本發明之平面顯示器用面板中,其特徵在於:作為隔板之主成分的低軟化點玻璃粉末含有鹼金屬氧化物、鹼土金屬氧化物及氧化鋅,其含有率之合計為24mol%~30mol%之範圍內。自鹼金屬氧化物、鹼土金屬氧化物及氧化鋅均具有使軟化點降低之效果而言,其特徵在於其合計含有量為24mol%以上;若含有率變高則折射率變高,因此其特徵在於以其合計為30mol%以下之範圍而進行調配。 較佳的是25mol%~29mol%,更佳的是26mol%~28mol%。 In the panel for a flat panel display of the present invention, the low-softening point glass powder which is a main component of the separator contains an alkali metal oxide, an alkaline earth metal oxide and zinc oxide, and the total content thereof is 24 mol% to 30 mol. Within the range of %. Each of the alkali metal oxide, the alkaline earth metal oxide, and the zinc oxide has an effect of lowering the softening point, and is characterized in that the total content thereof is 24 mol% or more, and if the content ratio is high, the refractive index is high, and thus the characteristics thereof are The compounding is carried out in a range of 30 mol% or less in total. It is preferably 25 mol% to 29 mol%, more preferably 26 mol% to 28 mol%.
以下,敍述使用感光性糊劑法之電漿顯示器部件及電 漿顯示面板之製作順序作為平面顯示器用面板之製作順序,但未必限定於此。而且,此處,以最一般的交流(AC)型電漿顯示器為例而對電漿顯示器的基本結構等加以說明。 Hereinafter, a plasma display device and a battery using a photosensitive paste method will be described. The order in which the pulp display panels are produced is used as the order of the panels for the flat panel display, but is not necessarily limited thereto. Further, here, the basic structure and the like of the plasma display will be described by taking the most general alternating current (AC) type plasma display as an example.
電漿顯示面板是於以前面板及/或背面板上所形成之螢光體層面向內部空間內之方式將該前面板與該背面板熔封而成的部件中,於所述內部空間內封入放電氣體而成者。亦即,於前面板中,於顯示面側之基板上形成有用以顯示用放電之透明電極(維持電極、掃描電極)。為了形成更低電阻之電極,亦可於透明電極之背面側形成匯流電極。其中,匯流電極包含材質Ag、Cr/Cu/Cr等,多數情況下不透明。因此,與所述透明電極不同,對單元之顯示造成干擾,因此較佳的是設於顯示面之外邊緣部。於AC型電漿顯示器之情形時,多數情況下於電極之上層形成透明介電質層及作為其保護膜之MgO薄膜。於背面板形成有用以對進行顯示之單元進行位址選擇的電極(定址電極)。 用以隔開單元之隔板或螢光體層可形成於前面板、背面板之任意者或雙方上,但多數情況下僅僅形成於背面板上。 電漿顯示面板是所述前面板與所述背面板熔封而成,於兩者間之內部空間封入有Xe-Ne、Xe-Ne-He等放電氣體者。 The plasma display panel is formed by sealing the front panel and the back panel in such a manner that the phosphor layer formed on the front panel and/or the back panel faces the inner space, and the discharge is sealed in the inner space. The gas is the one. That is, in the front panel, a transparent electrode (sustaining electrode, scanning electrode) for performing discharge for display is formed on the substrate on the display surface side. In order to form an electrode having a lower resistance, a bus electrode may be formed on the back side of the transparent electrode. Among them, the bus electrode includes a material of Ag, Cr/Cu/Cr, etc., and is opaque in many cases. Therefore, unlike the transparent electrode, it interferes with the display of the cell, and therefore it is preferably provided at the outer edge portion of the display surface. In the case of an AC type plasma display, in many cases, a transparent dielectric layer and a MgO film as a protective film are formed on the upper layer of the electrode. An electrode (addressing electrode) for performing address selection on the unit for display is formed on the back panel. A separator or a phosphor layer for separating the cells may be formed on either or both of the front panel and the back panel, but in most cases, it is formed only on the back panel. The plasma display panel is formed by sealing the front panel and the back panel, and a discharge gas such as Xe-Ne or Xe-Ne-He is sealed in the internal space between the two.
首先,關於面板製造步驟而對前面板之製作方法加以敍述。基板可使用鈉玻璃或作為電漿顯示面板用之耐熱玻璃之“PP8”(日本電氣硝子股份有限公司製造)、“PD200”(旭硝子股份有限公司製造)。玻璃基板之尺寸並無特別限 定,可使用厚度為1mm~5mm者。 First, the method of manufacturing the front panel will be described with respect to the panel manufacturing steps. As the substrate, soda glass or "PP8" (manufactured by Nippon Electric Glass Co., Ltd.) and "PD200" (manufactured by Asahi Glass Co., Ltd.) for heat-resistant glass for a plasma display panel can be used. The size of the glass substrate is not limited For the thickness, the thickness can be 1mm~5mm.
首先,於玻璃基板上濺鍍銦錫氧化物(ITO),藉由光蝕刻法而形成圖案。其次,印刷黑色電極用之黑色電極糊劑。黑色電極糊劑之主成分是有機黏合劑、黑色顏料、導電性粉末以及於光微影法中使用之情形時之感光性成分。 黑色顏料可較佳地使用金屬氧化物。金屬氧化物存在有鈦黑或銅、鐵、錳之氧化物或該些之複合氧化物、氧化鈷等,自與玻璃混合而進行煅燒時褪色少之方面考慮,較佳的是氧化物鈷。導電性粉末可列舉金屬粉末或金屬氧化物粉末。金屬粉末可無特別限制地使用作為電極材料而通常使用之金、銀、銅、鎳等。該黑色電極之電阻率大,因此為了製作電阻率小之電極而形成匯流電極,將導電性高的電極用糊劑(例如以銀為主成分者)印刷於黑色電極糊劑之印刷面上。該導電性糊劑亦可適宜地使用定址電極中所使用之電極糊劑。繼而,進行總括曝光/顯影而製作匯流電極圖案。為了確實地確保導電性,亦可於顯影前再次印刷導電性高的電極糊劑,再次曝光後進行總括顯影。於形成匯流電極圖案後進行煅燒。其後,為了提高對比度,較佳的是形成黑色條紋或黑色矩陣。較佳的是煅燒後之黑色電極糊劑及煅燒後之導電性糊劑之膜厚分別為1μm~5μm之範圍。而且,較佳的是煅燒後之線寬為20μm~100μm。 First, indium tin oxide (ITO) was sputtered on a glass substrate, and a pattern was formed by photolithography. Next, a black electrode paste for black electrodes was printed. The main component of the black electrode paste is an organic binder, a black pigment, a conductive powder, and a photosensitive component in the case of use in a photolithography method. A metal oxide can be preferably used as the black pigment. The metal oxide is titanium oxide or an oxide of copper, iron or manganese, or a composite oxide thereof, cobalt oxide or the like, and is preferably cobalt oxide since it is mixed with glass and has little fading when calcined. The conductive powder may be a metal powder or a metal oxide powder. As the metal powder, gold, silver, copper, nickel, or the like which is generally used as an electrode material can be used without particular limitation. Since the black electrode has a large specific resistance, a bus electrode is formed to form an electrode having a small specific resistance, and a highly conductive electrode paste (for example, a component containing silver as a main component) is printed on the printing surface of the black electrode paste. As the conductive paste, an electrode paste used in the address electrode can also be suitably used. Then, collective light exposure/development is performed to produce a bus electrode pattern. In order to surely ensure conductivity, it is also possible to reprint an electrode paste having high conductivity before development, and perform total development after exposure again. Calcination is performed after forming the bus electrode pattern. Thereafter, in order to increase the contrast, it is preferred to form a black stripe or a black matrix. It is preferable that the film thickness of the black electrode paste after calcination and the conductive paste after calcination is in the range of 1 μm to 5 μm, respectively. Further, it is preferred that the line width after calcination is from 20 μm to 100 μm.
其次,使用透明介電質糊劑而形成透明介電質層。透明介電質糊劑之主成分為有機黏合劑、有機溶劑、玻璃,亦可添加適宜之塑化劑等添加物。透明介電質層之形成方 法並無特別限定,例如可藉由網版印刷、棒塗、輥塗、模塗、刮刀塗佈、旋塗等,將透明介電質糊劑整個面地塗佈或部分性地塗佈於電極形成基板上,然後使用通風烘箱、加熱板、紅外線乾燥爐、真空乾燥等任意者而進行乾燥,形成厚膜。而且,亦可將透明介電質糊劑生片化,將其層壓於電極形成基板上。厚度較佳的是0.01mm~0.03mm。 Next, a transparent dielectric paste is formed using a transparent dielectric paste. The main component of the transparent dielectric paste is an organic binder, an organic solvent, or a glass, and an additive such as a suitable plasticizer may be added. The formation of a transparent dielectric layer The method is not particularly limited. For example, the transparent dielectric paste may be coated or partially coated on the entire surface by screen printing, bar coating, roll coating, die coating, knife coating, spin coating or the like. The electrode is formed on a substrate, and then dried using a ventilating oven, a hot plate, an infrared drying oven, vacuum drying, or the like to form a thick film. Further, the transparent dielectric paste may be formed into a sheet and laminated on the electrode-formed substrate. The thickness is preferably from 0.01 mm to 0.03 mm.
其次,於煅燒爐中進行煅燒。煅燒環境或溫度因糊劑或基板之種類而異,可於空氣中或氮氣、氫氣等環境下進行煅燒。煅燒爐可使用分批式之煅燒爐或輥搬送式之連續型煅燒爐。作為煅燒溫度,藉由於所使用之樹脂充分地進行脫黏合劑之溫度下即可。通常情況下,於使用丙烯酸系樹脂之情形時,於430℃~650℃下進行煅燒。若煅燒溫度過低,則樹脂成分變得容易殘存;若過高,則存在於玻璃基板上產生變形而破碎之現象。 Next, calcination is carried out in a calciner. The calcination environment or temperature varies depending on the type of the paste or the substrate, and can be calcined in the air or in an environment such as nitrogen or hydrogen. The calciner may use a batch type calciner or a roll transfer type continuous calciner. As the calcination temperature, the resin to be used can be sufficiently subjected to the temperature of the debonding agent. Usually, in the case of using an acrylic resin, calcination is carried out at 430 ° C to 650 ° C. When the baking temperature is too low, the resin component tends to remain; if it is too high, it is deformed by the glass substrate and is broken.
進一步形成保護膜。保護膜可使用選自MgO、MgGd2O4、BaGd2O4、Sr0.6Ca0.4Gd2O4、Ba0.6Sr0.4Gd2O4、SiO2、TiO2、Al2O3、前述之低軟化點玻璃之群組之至少1種,特佳的是MgO。保護膜之製作方法可使用電子束蒸鍍或離子電鍍法等公知之技術。 A protective film is further formed. The protective film may be selected from the group consisting of MgO, MgGd 2 O 4 , BaGd 2 O 4 , Sr 0.6 Ca 0.4 Gd 2 O 4 , Ba 0.6 Sr 0.4 Gd 2 O 4 , SiO 2 , TiO 2 , Al 2 O 3 , the aforementioned low At least one of the groups of softening point glass, particularly preferably MgO. A known technique such as electron beam evaporation or ion plating can be used as the method for producing the protective film.
繼而,對背面板之製作方法加以說明。玻璃基板可與前面板之情形同樣地使用鈉玻璃、“PD200”、“PP8”等。於玻璃基板上,藉由銀或鋁、鉻、鎳等金屬而形成定址用條紋狀電極圖案。形成方法可使用如下之方法:藉由網版印刷而對以該些金屬之粉末與有機黏合劑為主成分的金屬糊 劑進行圖案印刷之方法;或者感光性糊劑法,於塗佈使用感光性有機成分作為有機黏合劑之感光性金屬糊劑後,使用光罩而進行圖案曝光,藉由顯影步驟將不需要之部分溶解除去,進一步通常加熱至350℃~600℃進行煅燒而形成電極圖案。而且可使用蝕刻法,於玻璃基板上蒸鍍鉻或鋁之後,塗佈抗蝕劑,對抗蝕劑進行圖案曝光、顯影後,藉由蝕刻而除掉不需要之部分。另外,較佳的是於定址電極上設置介電質層。藉由設置介電質層,可提高放電穩定性或者抑制介電質層之層上所形成的隔板之坍塌或剝落。形成介電質層之方法存在有如下方法等:藉由網版印刷、縫隙模塗佈等而對以玻璃粉末或高軟化點玻璃粉末等無機成分與有機黏合劑為主成分之介電質糊劑進行整個面印刷或塗佈。 Next, a method of manufacturing the back panel will be described. As for the glass substrate, soda glass, "PD200", "PP8", or the like can be used similarly to the case of the front panel. A stripe electrode pattern for addressing is formed on the glass substrate by silver or a metal such as aluminum, chromium or nickel. The formation method may be a method of using a metal paste containing a powder of the metal and an organic binder as a main component by screen printing. a method of pattern printing; or a photosensitive paste method, after applying a photosensitive metal paste using a photosensitive organic component as an organic binder, pattern exposure using a photomask, which is unnecessary by a development step Partially dissolved and removed, and further heated to 350 ° C to 600 ° C to be calcined to form an electrode pattern. Further, after etching or depositing chromium or aluminum on the glass substrate by an etching method, a resist is applied, and the resist is subjected to pattern exposure and development, and then unnecessary portions are removed by etching. Additionally, it is preferred to provide a dielectric layer on the addressed electrode. By providing a dielectric layer, it is possible to improve discharge stability or to suppress collapse or peeling of the spacer formed on the layer of the dielectric layer. The method of forming a dielectric layer includes a method of using a dielectric paste containing an inorganic component such as a glass powder or a high-softening point glass powder and an organic binder as a main component by screen printing, slit die coating, or the like. The agent is printed or coated on the entire surface.
其次,對利用感光性糊劑法之隔板之形成方法加以說明。隔板之圖案並無特別限定,較佳的是格子狀、松餅狀等。首先,於形成有介電質之基板上塗佈本發明之感光性糊劑。塗佈方法可使用棒塗、輥塗、縫隙模塗佈、刮刀塗佈、網版印刷等方法。塗佈厚度可考慮所期望之隔板之高度與糊劑之煅燒所產生之收縮率而決定。塗佈厚度可藉由塗佈次數、網版之網目及糊劑之黏度而進行調整。於本發明中,較佳的是以乾燥後之塗佈厚度成為100μm以上之方式進行塗佈。藉由使塗佈厚度為100μm以上,可獲得充分之放電空間,擴大螢光體之塗佈範圍而提高電漿顯示面板之亮度。 Next, a method of forming a separator using a photosensitive paste method will be described. The pattern of the separator is not particularly limited, and is preferably a lattice shape, a muffin shape or the like. First, the photosensitive paste of the present invention is applied onto a substrate on which a dielectric is formed. The coating method may be a method such as bar coating, roll coating, slit die coating, blade coating, screen printing or the like. The coating thickness can be determined in consideration of the height of the desired separator and the shrinkage rate produced by the calcination of the paste. The coating thickness can be adjusted by the number of coatings, the mesh of the screen, and the viscosity of the paste. In the present invention, it is preferred to apply the coating thickness after drying to 100 μm or more. By making the coating thickness 100 μm or more, a sufficient discharge space can be obtained, and the coating range of the phosphor can be enlarged to increase the brightness of the plasma display panel.
所塗佈之隔板糊劑於乾燥後進行曝光。曝光一般情況下是如通常之光微影中所進行那樣介隔光罩而進行曝光之方法。而且,亦可使用如下之方法:不使用光罩而藉由雷射光等進行直接繪圖之方法。曝光裝置可使用步進式曝光機、近接式曝光機等。此時所使用之活性光源例如可列舉近紫外線、紫外線、電子束、X射線、雷射光等。該些中最佳的是紫外線,其光源例如可使用低壓水銀燈、高壓水銀燈、超高壓水銀燈、鹵素燈、殺菌燈等。該些中適宜的是超高壓水銀燈。曝光條件因塗佈厚度而異,通常使用1mW/cm2~100mW/cm2之輸出功率的超高壓水銀燈而進行0.01分鐘~30分鐘之曝光。 The applied separator paste was exposed after drying. Exposure is generally a method of exposing through a mask as is conventional in photolithography. Further, a method of directly drawing by laser light or the like without using a photomask may be used. The exposure apparatus can use a stepper, a proximity exposure machine, or the like. Examples of the active light source used at this time include near ultraviolet rays, ultraviolet rays, electron beams, X rays, and laser light. The most preferable ones are ultraviolet rays, and for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a halogen lamp, a germicidal lamp, or the like can be used. Suitable for these are ultra high pressure mercury lamps. The exposure conditions vary depending on the thickness of the coating, and an ultrahigh pressure mercury lamp having an output of 1 mW/cm 2 to 100 mW/cm 2 is usually used for exposure for 0.01 minutes to 30 minutes.
於曝光後,利用曝光部分與未曝光部分對於顯影液之溶解度差而進行顯影,通常藉由浸漬法或噴射法、毛刷法等而進行。作為顯影液,可使用能夠溶解感光性糊劑中之有機成分之有機溶劑,但於感光性糊劑中存在具有羧基等酸性基之化合物時,可藉由鹼性水溶液而進行顯影。鹼性水溶液可使用氫氧化鈉或碳酸鈉、氫氧化鉀水溶液等,使用有機鹼性水溶液時容易於煅燒時除去鹼性成分因而較佳。 After the exposure, development is performed by the difference in solubility between the exposed portion and the unexposed portion with respect to the developer, and is usually carried out by a dipping method, a jet method, a brush method, or the like. As the developer, an organic solvent capable of dissolving the organic component in the photosensitive paste can be used. However, when a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, development can be carried out by an aqueous alkaline solution. As the alkaline aqueous solution, sodium hydroxide, sodium carbonate, potassium hydroxide aqueous solution or the like can be used, and when an organic alkaline aqueous solution is used, it is easy to remove an alkaline component during calcination, which is preferable.
有機鹼可使用一般的胺化合物。具體而言可列舉四甲基氫氧化銨、三甲基苄基氫氧化銨、單乙醇胺、二乙醇胺等。 As the organic base, a general amine compound can be used. Specific examples thereof include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, and diethanolamine.
鹼性水溶液之濃度通常為0.05質量%~5質量%,更佳的是0.1質量%~1質量%。若鹼濃度過低,則難以除 去可溶部;若鹼濃度過高,則存在使圖案剝離、或產生腐蝕之虞而欠佳。而且,於步驟管理上而言,較佳的是於顯影時之顯影溫度為20℃~50℃下進行。 The concentration of the alkaline aqueous solution is usually 0.05% by mass to 5% by mass, and more preferably 0.1% by mass to 1% by mass. If the alkali concentration is too low, it is difficult to remove When the concentration of the alkali is too high, there is a problem that the pattern is peeled off or corrosion is generated, which is unsatisfactory. Further, in terms of step management, it is preferred to carry out the development at a developing temperature of 20 ° C to 50 ° C.
而且,隔板亦可包含2層以上。藉由使其為2層以上之結構物,可三維地擴大隔板形狀之構成範圍。例如,於2層結構之情形時,塗佈第1層而曝光為條紋狀之後,塗佈第2層而曝光為與第1層垂直之方向的條紋狀,進行顯影而可形成具有錯落有致的井字形結構的隔板。其次,於煅燒爐中以520℃~620℃之溫度下保持10分鐘~60分鐘而進行煅燒,從而形成隔板。 Further, the separator may also contain two or more layers. By making it a structure of two or more layers, the structural range of a separator shape can be expanded three-dimensionally. For example, in the case of a two-layer structure, after applying the first layer and exposing it to a stripe shape, the second layer is applied and exposed to a stripe shape perpendicular to the first layer, and development is carried out to form a patch having a pattern. A partition of a well-shaped structure. Next, calcination is carried out in a calciner at a temperature of 520 ° C to 620 ° C for 10 minutes to 60 minutes to form a separator.
本發明之感光性糊劑適於上述隔板之形成,可藉由本發明之感光性糊劑而形成殘存有機成分少之隔板,可製造亮度或色純度等顯示特性優異、面板可靠性高的平面顯示器。 The photosensitive paste of the present invention is suitable for the formation of the above-mentioned separator, and the photosensitive paste of the present invention can form a separator having a small amount of residual organic components, and can have excellent display characteristics such as brightness and color purity, and high panel reliability. Flat panel display.
其次,使用螢光體糊劑而形成螢光體。可藉由使用螢光體糊劑之光微影法、分注法、網版印刷法等而形成。螢光體之厚度並無特別限定,較佳為10μm~30μm,更佳的是15μm~25μm。螢光體粉末並無特別限定,自發光強度、色度、色平衡、壽命等之觀點考慮,適宜的是以下之螢光體。藍色的是對2價銪進行活化而成之鋁酸鹽螢光體(例如、BaMgAl10O17:Eu)或CaMgSi2O6。於綠色中,自面板亮度之方面考慮,適宜的是Zn2SiO4:Mn、YBO3:Tb、BaMg2Al14O24:Eu,Mn、BaAl12O19:Mn、BaMgAl14O23:Mn。更佳的是Zn2SiO4:Mn。於紅色中,同樣地較佳的是 (Y、Gd)BO3:Eu、Y2O3:Eu、YPVO:Eu、YVO4:Eu。 更佳的是(Y、Gd)BO3:Eu。於經過煅燒之步驟而形成螢光體之情形時,亦可同時地進行上述介電質層或隔板之煅燒。 Next, a phosphor is formed using a phosphor paste. It can be formed by a photolithography method using a phosphor paste, a dispensing method, a screen printing method, or the like. The thickness of the phosphor is not particularly limited, but is preferably 10 μm to 30 μm, more preferably 15 μm to 25 μm. The phosphor powder is not particularly limited, and the following phosphors are suitable from the viewpoints of self-luminous intensity, chromaticity, color balance, and lifetime. Blue is an aluminate phosphor (for example, BaMgAl 10 O 17 :Eu) or CaMgSi 2 O 6 which is activated by the activation of divalent europium. In green, from the viewpoint of panel brightness, Zn 2 SiO 4 : Mn, YBO 3 : Tb, BaMg 2 Al 14 O 24 : Eu, Mn, BaAl 12 O 19 : Mn, BaMgAl 14 O 23 : Mn are suitable. . More preferably, it is Zn 2 SiO 4 : Mn. Also preferable in red is (Y, Gd) BO 3 :Eu, Y 2 O 3 :Eu, YPVO:Eu, YVO 4 :Eu. More preferably (Y, Gd) BO 3 :Eu. In the case where a phosphor is formed by the calcination step, the calcination of the dielectric layer or the separator may be simultaneously performed.
其次,對電漿顯示面板的製造方法加以說明。將背面板與前面板熔封後,一面對2枚基板之間所形成之空間進行加熱一面進行真空排氣,其後封入包含He、Ne、Xe等之放電氣體而進行密封。自放電電壓與亮度之兩方面考慮,較佳的是Xe為5vol%~15vol%之Xe-Ne混合氣體。 為了使紫外線之產生效率變大,亦可使Xe進一步提高至30vol%左右。 Next, a method of manufacturing the plasma display panel will be described. After the back panel and the front panel are melted, the space formed between the two substrates is heated and evacuated, and then a discharge gas containing He, Ne, Xe or the like is sealed and sealed. From the standpoint of self-discharge voltage and brightness, it is preferred that Xe is a mixed gas of Xe-Ne of 5 vol% to 15 vol%. In order to increase the efficiency of ultraviolet light generation, Xe can be further increased to about 30 vol%.
最後,安裝驅動電路而進行老化,藉此可製作電漿顯示面板。 Finally, the drive circuit is mounted and aged, whereby a plasma display panel can be fabricated.
實例 Instance
以下,藉由實例對本發明加以更具體地說明。但本發明並不限定於此。 Hereinafter, the present invention will be more specifically described by way of examples. However, the invention is not limited thereto.
(實例1~實例16、比較例1~比較例10) (Example 1 to Example 16, Comparative Example 1 to Comparative Example 10)
A.玻璃粉末之粒徑分布評價 A. Evaluation of particle size distribution of glass powder
使用粒度分布測定裝置(日機裝股份有限公司製造之「MT3300」)而評價玻璃粉末之平均粒徑d50與最大粒徑dmax。於充滿水之試樣室中投入玻璃粉末,進行300秒之超音波處理後進行測定。 The average particle diameter d 50 and the maximum particle diameter d max of the glass powder were evaluated using a particle size distribution measuring apparatus ("MT3300" manufactured by Nikkiso Co., Ltd.). The glass powder was placed in a sample chamber filled with water, and subjected to ultrasonic treatment for 300 seconds, and then measured.
B.玻璃粉末之軟化點評價 B. Softening evaluation price of glass powder
使用示差熱分析裝置(RIGAKU股份有限公司製造之 「差動型示差熱天平TG8120」),以氧化鋁粉末為標準試樣,自室溫起以20℃/min進行升溫,根據所得之DTA曲線,藉由切線法對吸熱峰中之吸熱結束溫度進行外推而求出軟化點Ts。 Using a differential thermal analysis device (manufactured by RIGAKU Co., Ltd.) "Differential type differential thermostat TG8120"), using alumina powder as a standard sample, and raising the temperature at room temperature from 20 ° C / min. According to the obtained DTA curve, the endothermic end temperature in the endothermic peak is performed by a tangent method. Extrapolation to determine the softening point Ts.
C.糊劑之製作 C. Making of paste
藉由以下之順序而製作糊劑。 The paste was prepared by the following procedure.
a.有機成分 a. organic ingredients
藉由表1中所示之重量比而稱量包含以下原料之有機固形物並加以混合,相對於有機固形物40.1重量份而加入有機溶劑(γ-丁內酯)42重量份,進行混合、攪拌而製作有機媒劑。 The organic solid matter containing the following raw materials was weighed and mixed by the weight ratio shown in Table 1, and 42 parts by weight of an organic solvent (γ-butyrolactone) was added to 40.1 parts by weight of the organic solid matter, and mixed. The organic vehicle was prepared by stirring.
有機固形物之組成 Composition of organic solids
感光性單體M-1(三羥甲基丙烷三丙烯酸酯):6重量份 Photosensitive monomer M-1 (trimethylolpropane triacrylate): 6 parts by weight
感光性單體M-2(四丙二醇二甲基丙烯酸脂):6重量份 Photosensitive monomer M-2 (tetrapropylene glycol dimethacrylate): 6 parts by weight
感光性聚合物(對於包含甲基丙烯酸/甲基丙烯酸甲酯/苯乙烯=40/40/30之共聚物的羧基而加成反應0.4當量之甲基丙烯酸縮水甘油酯所形成的聚合物、重量平均分子量為43000、酸值為100):18重量份 Photosensitive polymer (polymer and weight formed by adding 0.4 equivalent of glycidyl methacrylate to a carboxyl group containing a copolymer of methacrylic acid/methyl methacrylate/styrene=40/40/30) The average molecular weight is 43,000 and the acid value is 100): 18 parts by weight
光聚合起始劑(2-苄基-2-二甲基胺基-1-(4-N-嗎啉基苯基)-1-丁酮、BASF公司製造之IC369(商品名)):5重量份 Photopolymerization initiator (2-benzyl-2-dimethylamino-1-(4-N-morpholinylphenyl)-1-butanone, IC369 (trade name) manufactured by BASF Corporation): 5 Parts by weight
增感劑(2,4-二乙基噻噸酮):1重量份 Sensitizer (2,4-diethylthioxanthone): 1 part by weight
抗氧化劑(1,6-己二醇-雙[(3,5-二-第三丁基-4-羥基苯基)丙酸]酯):4重量份 Antioxidant (1,6-hexanediol-bis[(3,5-di-t-butyl-4-hydroxyphenyl)propionic acid] ester): 4 parts by weight
紫外線吸收劑(Sudan IV(東京應化工業股份有限公司製造、吸收波長為350nm及520nm):0.1重量份 UV absorber (Sudan IV (manufactured by Tokyo Ohka Kogyo Co., Ltd., absorption wavelengths of 350 nm and 520 nm): 0.1 parts by weight
b.無機成分 b. Inorganic components
將以下組成之低軟化點玻璃粉末80vol%與高軟化點玻璃粉末20vol%加以混合而用作無機成分。 80 vol% of the low-softening point glass powder of the following composition and 20 vol% of the high-softening point glass powder were mixed and used as an inorganic component.
低軟化點玻璃粉末:表2、表3中所記載之組成、軟化點、粒度分布之玻璃粉末(另外,表中之記號具有以下之含義。SiO2:氧化矽、B2O3:氧化硼、ZnO:氧化鋅、Li2O:氧化鋰、Na2O:氧化鈉、K2O:氧化鉀、MgO:氧化鎂、CaO:氧化鈣、BaO:氧化鋇、Al2O3:氧化鋁) Low-softening point glass powder: glass powder of the composition, softening point, and particle size distribution described in Table 2 and Table 3 (in addition, the symbols in the table have the following meanings. SiO 2 : yttrium oxide, B 2 O 3 : boron oxide ZnO: zinc oxide, Li 2 O: lithium oxide, Na 2 O: sodium oxide, K 2 O: potassium oxide, MgO: magnesium oxide, CaO: calcium oxide, BaO: yttrium oxide, Al 2 O 3 : alumina)
高軟化點玻璃粉末(氧化鈉:1質量%、氧化矽:40質量%、氧化硼:10質量%、氧化鋁:33質量%、氧化鋅:4質量%、氧化鈣:9質量%、氧化鈦:3質量%、軟化點Ts:740℃、d50:2μm、dmax:10μm) High softening point glass powder (sodium oxide: 1% by mass, cerium oxide: 40% by mass, boron oxide: 10% by mass, alumina: 33% by mass, zinc oxide: 4% by mass, calcium oxide: 9% by mass, titanium oxide) : 3 mass%, softening point Ts: 740 ° C, d 50 : 2 μm, d max : 10 μm)
c.糊劑之調製 c. Modulation of paste
將如上所得之有機媒劑與無機粉末加以混合,進行調製、添加以使除有機溶劑外之所有固體成分中之有機固形物之比例為42vol%、無機成分之比例為58vol%之後,藉由三輥混練機進行混練,製成感光性糊劑。 The organic vehicle obtained above and the inorganic powder are mixed, prepared and added so that the ratio of the organic solids in all the solid components except the organic solvent is 42 vol%, and the ratio of the inorganic components is 58 vol%, The roller kneading machine was kneaded to prepare a photosensitive paste.
D.殘存有機成分量之評價 D. Evaluation of the amount of residual organic components
將0.75g表2、表3中所記載之玻璃粉末20g與乙基纖維素溶液(乙基纖維素:25質量%、γ-BL:75質量%)40g混合而成者放入至250mL之鋁容器中,蓋上鋁蓋而加以密閉,進行煅燒。煅燒條件是於空氣中以10℃/min而升溫至500℃,於500℃下保持15分鐘。使用熱分解氣相層析質譜分析計(島津製作所製造之GCMS-QP2010 Plus)而於550℃、He環境下對煅燒後之粉末15mg進行測定,藉由源自有機成分之所有峰面積之合計值而評價殘存有機成分。於峰面積之合計值為5×106以上之情形時,殘存有機成分多而欠佳。 60 g of the glass powder described in Table 2 and Table 3 and 40 g of ethyl cellulose solution (ethylcellulose: 25 mass%, γ-BL: 75 mass%) were mixed and placed in 250 mL of aluminum. The container was covered with an aluminum lid and sealed to be calcined. The calcination conditions were such that the temperature was raised to 500 ° C at 10 ° C / min in air and held at 500 ° C for 15 minutes. The calcined powder 15 mg was measured at 550 ° C in a He environment using a thermal decomposition gas chromatography mass spectrometer (GCMS-QP2010 Plus manufactured by Shimadzu Corporation), and the total value of all peak areas derived from the organic component was measured. The residual organic components were evaluated. When the total value of the peak area is 5 × 10 6 or more, there are many organic components remaining and it is not preferable.
E.評價用基板之製作 E. Production of evaluation substrate
評價用基板可藉由以下之順序而製作。於旭硝子股份有限公司製造之“PD-200”玻璃基板(42吋)上,藉由使用感光性銀糊劑之光微影法而形成定址電極圖案。其次,藉由網版印刷法而於形成有定址電極之玻璃基板上以20μm之厚度形成介電質層。其後,藉由網版印刷法將感光性糊劑均一地塗佈於形成有定址電極圖案及介電質層之背面板玻璃基板上直到成為所期望之厚度。為了避免於塗佈膜上產生針孔等,反覆進行數次以上之塗佈、乾燥,使乾燥後 之厚度成為150μm。途中之乾燥於100℃下進行10分鐘。 其次,介隔曝光遮罩而進行曝光。曝光遮罩是設計為可形成縱間距150μm、縱線寬25μm、橫間距450μm、橫線寬25μm之電漿顯示器中之格子狀絕緣性圖案的鉻遮罩。曝光可藉由使用50mW/cm2之輸出功率的超高壓水銀燈變更曝光時間而於250mJ/cm2~375mJ/cm2之範圍內以25mJ/cm2之間隔進行8點曝光。其後,藉由噴淋單乙醇胺之0.3質量%水溶液150秒而進行顯影,加以水清洗而除去未光硬化之空間部分。另外,藉由於590℃下保持30分鐘後進行煅燒而形成隔板,獲得評價用基板。 The evaluation substrate can be produced by the following procedure. The address electrode pattern was formed by a photolithography method using a photosensitive silver paste on a "PD-200" glass substrate (42 inch) manufactured by Asahi Glass Co., Ltd. Next, a dielectric layer was formed on the glass substrate on which the address electrodes were formed by a screen printing method to a thickness of 20 μm. Thereafter, the photosensitive paste is uniformly applied to the back glass substrate on which the address electrode pattern and the dielectric layer are formed by a screen printing method until the desired thickness is obtained. In order to avoid occurrence of pinholes or the like on the coating film, coating and drying were repeated several times or more, and the thickness after drying was 150 μm. Drying on the way was carried out at 100 ° C for 10 minutes. Next, exposure is performed by exposure of the mask. The exposure mask is a chrome mask designed to form a lattice-like insulating pattern in a plasma display having a vertical pitch of 150 μm, a vertical line width of 25 μm, a lateral pitch of 450 μm, and a horizontal line width of 25 μm. Exposure may be by using 50mW / cm 2 power output of the superhigh pressure mercury lamp in the exposure time is changed within a range of 250mJ / cm 2 ~ 375mJ / cm 2 at an interval of 25mJ / cm 2 for 8-point of exposure. Thereafter, development was carried out by spraying a 0.3% by mass aqueous solution of monoethanolamine for 150 seconds, and washing with water to remove the uncured space portion. Moreover, the separator was formed by baking at 590 ° C for 30 minutes, and the substrate for evaluation was obtained.
F.黃化評價 F. Yellowing evaluation
藉由分光光譜儀(柯尼卡美能達股份有限公司(Konica Minolta Co.,Ltd.)製造之「CM-2002」)SCE模式而測定E中所製作之基板中的隔板底部寬度成為55μm之位置,評價b*值。於b*值為10以上之情形時,隔板之黃化顯著而欠佳。 The position of the bottom of the separator in the substrate prepared in E was 55 μm by the SCE mode of a spectroscopic spectrometer ("CM-2002" manufactured by Konica Minolta Co., Ltd.). , evaluate the b* value. When the b* value is 10 or more, the yellowing of the separator is remarkable and unsatisfactory.
G.黏度穩定性 G. Viscosity stability
使用附有數位演算功能之B型黏度計(美國布魯克菲爾德製造、DV-II)而測定C中所製作之糊劑於溫度25℃、轉速3rpm下之黏度。測定製作第1天與於23℃下保管7天後之糊劑之黏度共計2次,以製作第1天之黏度為標準而計算保管7天後之黏度之上升率,評價黏度穩定性。於7天後之黏度上升率為10%以上之情形時,黏度穩定性差而欠佳。 The viscosity of the paste prepared in C at a temperature of 25 ° C and a rotation speed of 3 rpm was measured using a B-type viscometer (manufactured by Brookfield, USA, DV-II) equipped with a digital calculation function. The viscosity of the paste after storage on the first day and the storage at 23 ° C for 7 days was measured twice, and the viscosity of the first day was calculated as the standard for the viscosity of the first day, and the viscosity was evaluated. When the viscosity increase rate after 7 days is 10% or more, the viscosity stability is poor and is not good.
H.最小底部隔板寬度 H. Minimum bottom partition width
觀察E中所製作之基板之隔板,測定並不產生剝落之隔板底部寬度,將其最小值作為最小隔板底部寬度。於E之製作條件下,隔板頂部寬度成為約38μm,因此最小隔板底部寬度於38μm以上之範圍內越小則越變得可形成矩形之隔板,因此較佳。於最小隔板底部寬度為50μm以上之情形時,無法形成細隔板圖案而欠佳。 The separator of the substrate prepared in E was observed, and the width of the bottom of the separator which did not peel off was measured, and the minimum value was taken as the minimum width of the bottom of the separator. In the production condition of E, the width of the top of the separator is about 38 μm, so that the smaller the width of the bottom of the separator is smaller than 38 μm or more, the more the separator becomes a rectangular separator, which is preferable. When the width of the bottom of the minimum separator is 50 μm or more, the fine separator pattern cannot be formed and is not preferable.
I.表面粗糙度評價 I. Surface roughness evaluation
藉由刮刀塗佈將C中所製作之糊劑以50μm之膜厚塗佈於玻璃基板(旭硝子股份有限公司製造之PD-200、5吋)上之後,於100℃下進行30分鐘之乾燥。其後,於590℃下保持30分鐘而進行煅燒,製作表面粗糙度評價用樣品。 表面粗糙度是藉由Surfcom(東京精密公司製造之「1400D」)而測定輪廓算術平均偏差(Ra)。測定條件是於ISO-‘97測格「表面粗糙度測定」中將測定長設為1mm,將測定速度設為0.30mm/s。作為表面粗糙度Ra成為2.0μm以上之糊劑,由於使用該糊劑所製造的面板之顯示特性惡化因而欠佳。 The paste prepared in C was applied onto a glass substrate (PD-200, 5: manufactured by Asahi Glass Co., Ltd.) at a film thickness of 50 μm by doctor blade coating, and then dried at 100 ° C for 30 minutes. Thereafter, the mixture was fired at 590 ° C for 30 minutes to prepare a sample for surface roughness evaluation. The surface roughness was measured by the arithmetic mean deviation (Ra) of the contour by Surfcom ("1400D" manufactured by Tokyo Precision Co., Ltd.). The measurement conditions were such that the measurement length was 1 mm in the ISO-'97 measurement "surface roughness measurement", and the measurement speed was set to 0.30 mm/s. As the paste having a surface roughness Ra of 2.0 μm or more, the display characteristics of the panel produced by using the paste are deteriorated, which is not preferable.
將實例1~實例16及比較例1~比較例10中所得之糊劑之評價結果示於表2、表3中。 The evaluation results of the pastes obtained in Examples 1 to 16 and Comparative Examples 1 to 10 are shown in Table 2 and Table 3.
表3中,A=X(SiO2)+X(B2O3)-X(M2O) In Table 3, A = X (SiO 2 ) + X (B 2 O 3 ) - X (M 2 O)
於實例1~實例16中,A處於35~46之範圍內,且B(氧化鋅含量)處於1.5~5.5之範圍內,且C(鹼金屬氧化物、鹼土金屬氧化物、氧化鋅之含量之合計)處於24~30之範圍內,於任意情形時均是殘存有機成分少而良好。 In Examples 1 to 16, A is in the range of 35 to 46, and B (zinc oxide content) is in the range of 1.5 to 5.5, and C (alkali metal oxide, alkaline earth metal oxide, zinc oxide content) In total, it is in the range of 24 to 30, and in any case, the residual organic component is small and good.
於A小於35之比較例1中,玻璃中之鹼金屬氧化物 含有率多,b*值變大,隔板黃化,因此欠佳。 In Comparative Example 1 in which A is less than 35, the alkali metal oxide in the glass The content rate is large, the b* value becomes large, and the separator is yellowed, so it is not good.
於A大於46之比較例2~比較例4中,玻璃中之氧化矽、氧化硼含有率多,玻璃之酸鹼平衡差,因此殘存有機成分多而欠佳。 In Comparative Example 2 to Comparative Example 4 in which A is larger than 46, the content of cerium oxide and boron oxide in the glass is large, and the acid-base balance of the glass is poor, so that there are many organic components remaining and it is not preferable.
於B(氧化鋅含量)小於1.5之比較例5中,氧化鋅少,因此表面粗糙度Ra大而欠佳。 In Comparative Example 5 in which B (zinc oxide content) was less than 1.5, since zinc oxide was small, the surface roughness Ra was large and unsatisfactory.
於B(氧化鋅含量)大於5.5之比較例6中,氧化鋅多,因此糊劑之黏度上升率大而欠佳。 In Comparative Example 6 in which B (zinc oxide content) was more than 5.5, since there was a large amount of zinc oxide, the viscosity increase rate of the paste was large and unsatisfactory.
於C(鹼金屬氧化物、鹼土金屬氧化物、氧化鋅之含量之合計)小於24之比較例7中,氧化鋅、鹼金屬氧化物、鹼土金屬氧化物之合計量少,因此表面粗糙度Ra大而欠佳。 In Comparative Example 7 in which C (the total content of alkali metal oxides, alkaline earth metal oxides, and zinc oxides) was less than 24, the total amount of zinc oxide, alkali metal oxide, and alkaline earth metal oxide was small, and thus the surface roughness Ra was Big and poor.
於C(鹼金屬氧化物、鹼土金屬氧化物、氧化鋅之含量之合計)大於30之比較例8~比較例10中,氧化鋅、鹼金屬氧化物、鹼土金屬氧化物之合計量多,因此低軟化點玻璃粉末之折射率高且與有機成分之折射率差變大。其結果是最小隔板底部寬度變大,變得無法形成較細之圖案而欠佳。 In Comparative Examples 8 to 10 in which C (the total content of alkali metal oxides, alkaline earth metal oxides, and zinc oxides) is more than 30, the total amount of zinc oxide, alkali metal oxide, and alkaline earth metal oxide is large. The low softening point glass powder has a high refractive index and a large difference in refractive index from the organic component. As a result, the width of the bottom of the smallest separator becomes large, and it becomes impossible to form a fine pattern and is not preferable.
(產業上之可利用性) (industrial availability)
本發明可作為糊劑而有用地利用,所述糊劑用以形成殘存有機成分少之隔板。而且,可作為平面顯示器而有用地利用,所述平面顯示器形成殘存有機成分少之隔板,亮度或色純度等顯示特性優異,面板可靠性高。 The present invention can be used usefully as a paste for forming a separator having a small residual organic component. Further, it can be used as a flat panel display which forms a separator having a small amount of residual organic components, and is excellent in display characteristics such as brightness and color purity, and has high panel reliability.
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011069551 | 2011-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201245090A TW201245090A (en) | 2012-11-16 |
| TWI549921B true TWI549921B (en) | 2016-09-21 |
Family
ID=46930414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101107394A TWI549921B (en) | 2011-03-28 | 2012-03-06 | Paste and method for manufacturing panel of flat-panel display |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5158289B2 (en) |
| KR (1) | KR101883192B1 (en) |
| CN (1) | CN103415480A (en) |
| TW (1) | TWI549921B (en) |
| WO (1) | WO2012132652A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013176022A1 (en) | 2012-05-25 | 2013-11-28 | 東レ株式会社 | Partition paste, method for manufacturing member having partitions, and members having partition |
| CN108886847B (en) | 2016-03-28 | 2021-02-12 | 东洋制罐集团控股株式会社 | Substrate for flexible device and method for producing the same |
| CN107117819B (en) * | 2017-06-06 | 2020-06-09 | 长春理工大学 | Lead-free high volume resistivity low temperature sealing glass |
| CN108766664A (en) * | 2018-05-15 | 2018-11-06 | 王召惠 | A kind of preparation method of Modified Activated Carbon element base electrode paste |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000016835A (en) * | 1998-06-30 | 2000-01-18 | Toray Ind Inc | Insulation paste for display |
| JP2008195572A (en) * | 2007-02-14 | 2008-08-28 | Sumitomo Chemical Co Ltd | Glass paste for plasma display partition walls |
| TW201106410A (en) * | 2009-03-31 | 2011-02-16 | Toray Industries | Member for plate panel display, and paste for topmost layer of partition wall of member for plate panel display |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1152561A (en) | 1997-08-08 | 1999-02-26 | Toray Ind Inc | Photosensitive paste |
| JP2001305729A (en) | 2000-04-18 | 2001-11-02 | Daicel Chem Ind Ltd | Water or diluted alkali developing type photocurable resin composition |
| JP2006117440A (en) * | 2004-10-19 | 2006-05-11 | Central Glass Co Ltd | Lead-free glass having low melting point |
| KR100772653B1 (en) * | 2005-10-14 | 2007-11-02 | 주식회사 휘닉스피디이 | A plasma display panel comprising a photosensitive lead-free partition glass composition for a plasma display panel and a partition including the same |
| JP2008050594A (en) | 2006-07-26 | 2008-03-06 | Sekisui Chem Co Ltd | Binder resin composition |
| JP2011225439A (en) * | 2010-03-31 | 2011-11-10 | Nihon Yamamura Glass Co Ltd | Lead-free glass composition |
-
2012
- 2012-02-22 JP JP2012513107A patent/JP5158289B2/en not_active Expired - Fee Related
- 2012-02-22 CN CN2012800118144A patent/CN103415480A/en active Pending
- 2012-02-22 WO PCT/JP2012/054225 patent/WO2012132652A1/en not_active Ceased
- 2012-02-22 KR KR1020137017642A patent/KR101883192B1/en not_active Expired - Fee Related
- 2012-03-06 TW TW101107394A patent/TWI549921B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000016835A (en) * | 1998-06-30 | 2000-01-18 | Toray Ind Inc | Insulation paste for display |
| JP2008195572A (en) * | 2007-02-14 | 2008-08-28 | Sumitomo Chemical Co Ltd | Glass paste for plasma display partition walls |
| TW201106410A (en) * | 2009-03-31 | 2011-02-16 | Toray Industries | Member for plate panel display, and paste for topmost layer of partition wall of member for plate panel display |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103415480A (en) | 2013-11-27 |
| WO2012132652A1 (en) | 2012-10-04 |
| JPWO2012132652A1 (en) | 2014-07-24 |
| TW201245090A (en) | 2012-11-16 |
| KR20140043046A (en) | 2014-04-08 |
| KR101883192B1 (en) | 2018-07-30 |
| JP5158289B2 (en) | 2013-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102918459B (en) | The formation method of light sensitive paste, pattern and the manufacture method of plane member for display panel | |
| JP6244910B2 (en) | Partition wall paste, method for manufacturing member having partition wall, and member having partition wall | |
| TWI549921B (en) | Paste and method for manufacturing panel of flat-panel display | |
| JP5593662B2 (en) | Photosensitive paste, insulating pattern forming method, and flat panel display manufacturing method | |
| TWI478197B (en) | Member for plate panel display, and paste for topmost layer of partition wall of member for plate panel display | |
| JP5440742B1 (en) | Member having partition wall, inorganic pattern forming paste, and pattern forming method | |
| JP2008224940A (en) | Photosensitive paste and plasma display member | |
| JP2007183595A (en) | Photosensitive paste, pattern forming method, and method for producing flat display panel | |
| JP2012093742A (en) | Photosensitive paste, formation method of pattern and manufacturing method of member for flat display panel | |
| JP4797683B2 (en) | Negative photosensitive paste and its manufacturing method, pattern forming method, and flat panel display manufacturing method. | |
| JP2010086719A (en) | Method of forming photosensitive paste and pattern, and method of manufacturing member for planar display panel | |
| JP2006145750A (en) | Photosensitive paste, method for manufacturing panel for use in plasma display using the same and panel for use in plasma display | |
| JP5417747B2 (en) | Negative photosensitive paste, pattern forming method and flat display panel member manufacturing method. | |
| JP2009176740A (en) | Flat panel display barrier rib forming method, and flat panel display manufacturing method | |
| JP2007230804A (en) | Inorganic material paste, method of manufacturing member for flat display and flat display | |
| JP2006261005A (en) | Method for forming barrier rib for flat display and method for manufacturing flat display | |
| JP2012051961A (en) | Polymer and photosensitive paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |