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TWI433967B - Vertical system for the plating treatment of a work piece and method for conveying the work piece - Google Patents

Vertical system for the plating treatment of a work piece and method for conveying the work piece Download PDF

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Publication number
TWI433967B
TWI433967B TW097120910A TW97120910A TWI433967B TW I433967 B TWI433967 B TW I433967B TW 097120910 A TW097120910 A TW 097120910A TW 97120910 A TW97120910 A TW 97120910A TW I433967 B TWI433967 B TW I433967B
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Taiwan
Prior art keywords
clamping
workpiece
clamping device
processing module
processing
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TW097120910A
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Chinese (zh)
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TW200914648A (en
Inventor
Reinhard Schneider
Uwe Hauf
Britta Scheller
Henry Kunze
Ferdinand Wiener
Heinz Klingl
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Atotech Deutschland Gmbh
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • C25D17/04External supporting frames or structures
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • C25D7/123Semiconductors first coated with a seed layer or a conductive layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Manipulator (AREA)

Description

用於工作件之鍍敷處理的直立式系統以及運送該工作件的方法Vertical system for plating treatment of work pieces and method for transporting the same 發明領域Field of invention

本發明係有關於一種用於工作件之鍍敷處理之直立式系統及一種用以將多數被一抓握裝置扣持成垂直方位之工作件運送至一處理模組的方法。The present invention relates to an upright system for the plating of workpieces and a method for transporting a plurality of workpieces held in a vertical orientation by a gripping device to a processing module.

鍍敷系統特別被用於印刷電路板與印刷電路箔及半導體晶圓之處理,以及用於如光電太陽電池等光電池、及監視器板之製造。在這些系統中之處理通常包含化學與電化學處理方法。Plating systems are used in particular for the processing of printed circuit boards and printed circuit foils and semiconductor wafers, as well as for the fabrication of photovoltaic cells such as photovoltaic solar cells, and monitor panels. Processing in these systems typically involves chemical and electrochemical processing methods.

背景技術Background technique

目前,在半導體工業中之晶片製造者正努力引入所謂65奈米結構(Computertechnik (10), 2007),而更小之45nm的結構亦正在發展的過程中。但是,這些尺寸亦只是在到達甚至更小結構之路上的中間步驟而已。依據半導體組件之不斷小型化,具有晶片載子之印刷電路板的製造者欲使他們的產品配合新的條件亦會產生新的挑戰。這表示,例如,如果他們要在市場中存在,則必須實現結構尺寸為大約0.25μm之目前需要。在此同時,已經很清楚的是在不久的將來,尺寸會變得更小。利用現今在印刷電路板製造中之習知方法與裝置,將不再可能實現這種具有必要品質之精確結構。在結構小型化時,會看到具有不規則輪廓之結構,甚至橋接(短路)或斷路。此外,已確立的是所沈積之金屬層 的均一性不足。這是無法接受的,因為依此方式製造之電路的電特性將會以一不可預測之方式被破壞,而這表示該等電路將必須被廢棄。Currently, wafer manufacturers in the semiconductor industry are working hard to introduce the so-called 65 nanostructure (Computertechnik (10), 2007), and the smaller 45nm structure is also in the process of development. However, these dimensions are only intermediate steps on the way to even smaller structures. Depending on the continued miniaturization of semiconductor components, manufacturers of printed circuit boards with wafer carriers have new challenges in adapting their products to new conditions. This means, for example, that if they are to be present in the market, a current need to achieve a structural size of about 0.25 [mu]m must be achieved. At the same time, it is already clear that the size will become smaller in the near future. With the conventional methods and apparatus nowadays in the manufacture of printed circuit boards, it is no longer possible to achieve such precise structures with the necessary qualities. When the structure is miniaturized, you will see structures with irregular contours, even bridging (short circuiting) or breaking. In addition, the deposited metal layer has been established. Insufficient uniformity. This is unacceptable because the electrical characteristics of the circuits fabricated in this manner will be destroyed in an unpredictable manner, which means that the circuits will have to be discarded.

對於高精確地製造印刷電路板的前述要求與可一再以非常大之量且以儘可能符合經濟效益之方式製造這些印刷電路板的需求一起出現。The foregoing requirements for high precision manufacturing of printed circuit boards have arisen with the need to repeatedly manufacture these printed circuit boards in very large quantities and in a manner that is as cost effective as possible.

過去,已有達成前述目的之各種提案:例如,WO 2006/002969 A2揭露一種化學或電解處理欲處理材料之裝置,且該裝置包含用以處理欲處理材料之處理容器及一用以輸送欲處理材料之輸送系統。該裝置具有一連接該等處理容器之清潔室區域,且該欲處理材料可被該輸送系統輸送通過該清潔室區域。詳而言之,該清潔室區域被一清潔室殼體空間性地界定,且該清潔室殼體包括多數穿孔且透過淨化氣體之供應而呈過壓狀態。一包含一扣持元件之輸送系統被用來扣持該欲處理材料,且該扣持元件較佳地實質設置在該清潔室區域內。In the past, various proposals have been made to achieve the aforementioned objectives: for example, WO 2006/002969 A2 discloses a device for chemically or electrolytically treating a material to be treated, and the device comprises a processing container for processing the material to be treated and a device for transporting Material delivery system. The apparatus has a clean room area that connects the processing vessels, and the material to be treated can be transported by the delivery system through the clean room area. In detail, the clean room area is spatially defined by a clean room housing, and the clean room housing includes a plurality of perforations and is overpressured by the supply of purge gas. A delivery system comprising a fastening element is used to hold the material to be treated, and the fastening element is preferably disposed substantially within the clean room area.

WO 2004/022814 A2亦揭露一種電解處理至少在其表面上是導電之欲處理材料的裝置,且該裝包含用於該欲處理材料之電源裝置。該裝置之電源裝置各包含在實質上互相相對之側緣處之欲處理材料電接觸的接觸片,且該等接觸片可以固定在支持框架上,且該等支持框架可以被支持元件支持在一可收納該處理流體之容器中。該等支持元件可以移動,這表示該等支持框架相對在該容器中之支持點的位置是可改變的。WO 2004/022814 A2 also discloses a device for electrolytically treating a material to be treated which is at least electrically conductive on its surface, and which contains a power supply unit for the material to be treated. The power supply devices of the device each include contact pads that are in electrical contact with the material to be treated at substantially opposite side edges, and the contact pads can be secured to the support frame, and the support frames can be supported by the support member It can be stored in the container of the treatment fluid. The support elements can be moved, which means that the positions of the support frames relative to the support points in the container are changeable.

WO 2006/015871 A1亦揭露一種用於工作件之處理之直立式鍍敷處理系統的容器,且該容器具有一由容器壁及一容器底部所界定並且由至少兩容器模組形成之容器內部。在各情形下,該容器之壁與底部以相同高度與寬度界定模組內部空間。在該等容器中設有如接觸框架、接觸夾具、電源裝置、移動裝置、欲處理材料之引導元件、噴嘴、導入空氣之裝置、泵、加熱元件、冷卻元件、過濾器、感測器、配料裝置及化學處理用裝置的多數安裝件,詳而言之,該等噴嘴為噴射噴嘴、噴灑噴嘴、沖擊噴嘴。該等安裝件可以被支持框架支持且可以與該等支持框架一起被升高而進出該容器,並且可以一似矩陣之方式多排且多列地設置多數容器。WO 2006/015871 A1 also discloses a container for a vertical plating treatment system for the treatment of workpieces, and the container has a container interior defined by the container wall and a container bottom and formed by at least two container modules. In each case, the wall and bottom of the container define the interior of the module at the same height and width. Provided in such containers as contact frames, contact clamps, power supply devices, moving devices, guiding elements for materials to be processed, nozzles, devices for introducing air, pumps, heating elements, cooling elements, filters, sensors, dosing devices And a plurality of mounting members of the chemical processing apparatus, in detail, the nozzles are spray nozzles, spray nozzles, and impact nozzles. The mounts can be supported by the support frame and can be raised into and out of the container together with the support frames, and a plurality of containers can be arranged in a plurality of rows and columns in a matrix-like manner.

此外,WO 2006/000439 A1揭露一包含至少一排處理站及至少一平移操作器之處理系統,且這操作器包含至少一可沿一排至少兩處理站驅動之驅動元件、及用於欲處理材料之至少一升降元件與至少一安裝在該升降元件上之抓握元件。該等升降元件與該等抓握元件可以模組方式擴充,使得該等升降元件在該擴充情形下相對至少兩排處理站橫向地延伸。各排處理站與至少一抓握元件相連接,且該升降元件係由至少一被至少一橫向橫樑扣持之升降單元形成,或由至少一被至少一升降單元扣持之橫向橫樑形成。該橫向橫樑延伸橫越多排處理站,且該等抓握元件係由兩夾具形成,而該等夾具抓握欲處理材料、藉由各個樞接點可樞轉地安裝且可藉由該夾具之各部份的軸向移動而被致 動。Furthermore, WO 2006/000439 A1 discloses a processing system comprising at least one row of processing stations and at least one translation operator, and the operator comprises at least one driving element that can be driven along at least two processing stations in a row, and for processing At least one lifting element of the material and at least one gripping element mounted on the lifting element. The lifting elements and the gripping elements can be modularly expanded such that the lifting elements extend laterally relative to at least two rows of processing stations in the expanded condition. Each row of processing stations is coupled to at least one gripping element and is formed by at least one lifting unit that is held by at least one transverse beam or by at least one transverse beam that is held by at least one lifting unit. The transverse beam extends across the plurality of rows of processing stations, and the gripping elements are formed by two clamps that grip the material to be treated, are pivotally mounted by respective pivot points, and can be pivoted by the fixture The axial movement of each part is caused move.

此外,DE 195 39 868 C1揭露一用以運送直立板狀物體以進行其化學或電解表面處理之輸送裝置。該裝置包含一夾具狀下拾取區域,且藉此這些物體可以被收納且可藉由一可在兩端部間實質垂直移動之元件而被致動。該裝置包含多數夾持部,且該等夾持部以一鉗子方式被固持且在其下端具有作為拾取區域之接觸部份。該等接觸部份係透過一樞接部而被致動,以利用一被扣持在一夾持吊架中之滑動體來檢測與釋放該物體。該樞接部包含兩致動臂,且其中一致動臂可樞轉地安裝在該滑動體底端處之一側上且在該接觸部份頂端處之另一側上。該滑動體之移動產生該接觸份之兩連續移動,亦即,當由該扣持位置傳送至該釋放位置或由該釋放位置傳送至該扣持位置時,產生一實質水平延伸之伸展或夾持移動及一實質垂直延伸上升或下降移動。In addition, DE 195 39 868 C1 discloses a conveying device for transporting upright plate-like objects for their chemical or electrolytic surface treatment. The device includes a grip-like lower pick-up area whereby the objects can be received and actuated by an element that is substantially vertically movable between the ends. The device includes a plurality of gripping portions, and the gripping portions are held in a pliers manner and have a contact portion as a picking region at a lower end thereof. The contact portions are actuated by a pivoting portion to detect and release the object using a sliding body that is held in a clamping cradle. The pivoting portion includes two actuating arms, and wherein the intermeshing arm is pivotally mounted on one side of the bottom end of the sliding body and on the other side of the top end of the contact portion. The movement of the sliding body produces two consecutive movements of the contact portion, that is, when transferred from the holding position to the release position or from the release position to the holding position, a substantially horizontally extending stretch or clip is produced. Moves and moves in a substantially vertical extension.

一用以在一電解系統中輸送一欲處理材料之裝置揭露在WO 2006/125629 A1中,且這裝置係設計成使欲處理材料沿著一在一預定輸送平面中之輸送路徑被輸送。該裝置包括多數沿著該輸送路徑間隔地設置並可移動之夾具,且該裝置具有一使該等夾具沿著該輸送路徑移動之驅動器。該等夾具包含一設置在該輸送平面一側上之第一夾持面及一設置在該輸送平面另一相對側上之第二夾持面,且該等夾持面係設計成使該第一夾持面與該第二夾持面兩者均可相對該輸送平面移動,以閉合該等夾具而抓握該欲處理材 料,或分別地移動以打開該等夾具而釋放該欲處理材料。與該輸送平面鄰接之底夾持面的位置可以藉由,一擋止構件來確定。A device for transporting a material to be treated in an electrolysis system is disclosed in WO 2006/125629 A1, and is designed to transport the material to be treated along a transport path in a predetermined transport plane. The apparatus includes a plurality of clamps spaced and movable along the transport path, and the apparatus has a drive for moving the clamps along the transport path. The clamps include a first clamping surface disposed on one side of the conveying plane and a second clamping surface disposed on the opposite side of the conveying plane, and the clamping surfaces are designed to enable the first clamping surface Both a clamping surface and the second clamping surface are movable relative to the conveying plane to close the clamps and grasp the material to be treated Material, or separately moved to open the clamps to release the material to be treated. The position of the bottom gripping surface adjacent to the conveying plane can be determined by a stop member.

此外,DE 91 02 321 U1係有關一種用以電鍍印刷電路板之自動裝載裝置。這裝置包含,即,多數固定在一支持框架上之夾持裝置。該等夾持裝置包含多數夾具,且各夾具包含一前臂與一後臂,並且該等前臂與後臂可於一中心位置樞轉。該後臂之頂端與一拉桿固定連接,此外,該等夾具設置在該支持框架中,且多數氣壓缸位於該支持框架上,並且可用該等氣壓缸對該等前與後臂施壓。當這些氣壓缸被致動時,它們會壓抵各夾具之後或前壁的各個頂部,且該等夾具因此被打開以抓握或釋放該印刷電路板。Furthermore, DE 91 02 321 U1 relates to an automatic loading device for electroplating printed circuit boards. This device comprises, i.e., a plurality of clamping devices that are fixed to a support frame. The clamping devices include a plurality of clamps, and each clamp includes a forearm and a rear arm, and the forearms and the rear arms are pivotable in a central position. The top end of the rear arm is fixedly coupled to a pull rod. Further, the clamps are disposed in the support frame, and a plurality of pneumatic cylinders are located on the support frame, and the front and rear arms can be pressed by the pneumatic cylinders. When these pneumatic cylinders are actuated, they press against the various tops of the clamps or front walls, and the clamps are thus opened to grasp or release the printed circuit board.

EP 0 517 349 A1揭露一種用於化學處理印刷電路板之系統的結構,其中該等電路板被供應至一裝載站且由此被多數以輸送車移動之掛架(flight bar)帶到在該系統中之多數處理站,然後返回一卸載站。該等電路板被夾具可分離地懸吊在各個掛架上,且在此情形下被抓住一邊緣區域。該等夾具各包括利用一彈簧利動至一夾持位置之夾持臂,且其中一夾持臂安裝在一掛架上,而另一夾持臂則可對抗彈簧壓力以一樞接點樞轉並可利用一推力件由一關閉位置移動至一開啟位置。EP 0 517 349 A1 discloses a structure for a system for chemically processing printed circuit boards, wherein the circuit boards are supplied to a loading station and thereby carried by a majority of flight bars that are moved by the transport vehicle. Most of the processing stations in the system then return to an unloading station. The boards are detachably suspended by the clamps on the respective pylons and in this case are caught in an edge region. The clamps each include a clamping arm that is biased to a clamping position by a spring, and one of the clamping arms is mounted on a hanger, and the other clamping arm is pivotally pivoted against the spring pressure. The swivel can be moved from a closed position to an open position by a thrust member.

此外,DE 42 43 252 A1接露一用以利用一支持框架扣持印刷電路板之裝置,且該支持框架包括一具有受彈簧偏壓之夾具的實質水平延伸支持部,並且該等夾具係用以在 該等印刷電路板側緣處扣持且電接觸該等印刷電路板。該等夾具被扣持在一上支柱處,且該等夾具包含一固定於該支柱之部份,其中該部份包括一軸,且一移動部可以該軸為中心樞轉並預先受到一彈簧之偏壓而遠離該夾具之關閉位置。Furthermore, DE 42 43 252 A1 discloses a device for holding a printed circuit board by means of a support frame, and the support frame comprises a substantially horizontally extending support with a spring-biased clamp, and the clamps are used In The printed circuit boards are latched at the side edges and electrically contact the printed circuit boards. The clamps are held at an upper strut, and the clamps include a portion fixed to the support, wherein the portion includes a shaft, and a moving portion can pivot about the shaft and is pre-stressed by a spring Bias away from the closed position of the clamp.

最後,EP 0666 343揭露一種用以電解沈積金屬於一可塗覆基板上之裝置。該裝置包含,即,一夾持裝置。該基板之上緣處可被安裝至一公用桿。一旦該桿與該基板被浸入一容器中,該夾持裝置便夾持該基板之底緣。該夾具包含至少兩以一樞接點可轉動地互相連接之槓桿臂,且該夾具在由於其浮力浮在一液體表面上時係位於一開啟位置,且在被浸入液體中時係位置一關閉位置。Finally, EP 0 666 343 discloses a device for electrolytically depositing metal onto a coatable substrate. The device comprises, ie a clamping device. The upper edge of the substrate can be mounted to a common pole. Once the rod and the substrate are immersed in a container, the clamping device grips the bottom edge of the substrate. The clamp comprises at least two lever arms rotatably connected to each other by a pivot point, and the clamp is in an open position when floating on a liquid surface due to its buoyancy, and is closed when immersed in the liquid. position.

這些習知裝置的缺點是該等工作件無法充份地被處理至可一再以前述結構尺寸產生金屬結構,且這情形在該等工作件呈薄與箔狀時特別明顯。A disadvantage of these conventional devices is that the workpieces are not sufficiently processed to produce metal structures in the aforementioned structural dimensions, and this is particularly evident when the workpieces are thin and foil-like.

發明目的Purpose of the invention

本發明之一目的是改良習知裝置以避免該等裝置之缺點且特別達成該等工作件之可重現處理,以在該等工作件上以前述結構尺寸形成金屬結構。本發明之另一目的係亦可處理箔狀工作件以符合前述目的。此外,本發明之一目的係可透過較少因輸送條件而產生之浴夾帶(bath entrainment)而使處理浴具有高清潔度與長使用壽命。另外,本發明之另一目的是可儘可能符合經濟效益地製造該 等工作件。又,本發明之再一目的是以一最適當方式處理該等工作件。本發明之又一目的是在各處理位置處及在各處理步驟中產生該等工作件之最適當處理條件。本發明之另一目的是改進該等處理條件,使得在尺寸與時間方面儘可能少出現變化。本發明之再一目的是產生儘可能可重現之處理條件。本發明之又一目的是保持相同處理物體在不同處理位置間之處理條件的變化儘可能地小。本發明之另一目的是在處理步驟之順序、處理參數之可調整性及系統尺寸之適應性方面獲得高度彈性。本發明之一目的是在對各處理之工作件個別地記錄處理條件。It is an object of the present invention to improve conventional devices to avoid the disadvantages of such devices and to specifically achieve reproducible processing of the workpieces to form metal structures on the workpieces in the aforementioned structural dimensions. Another object of the invention is also to treat foil-like workpieces to meet the aforementioned objectives. Furthermore, it is an object of the present invention to provide a process bath with high cleanliness and long service life through less bath entrainment due to delivery conditions. In addition, another object of the present invention is to manufacture the product as economically as possible. Wait for work pieces. Still another object of the invention is to process the workpieces in the most appropriate manner. A further object of the invention is to produce the most appropriate processing conditions for the workpieces at each processing location and in each processing step. Another object of the invention is to improve the processing conditions such that as little as possible in terms of size and time. A further object of the invention is to produce processing conditions that are as reproducible as possible. A further object of the invention is to keep the variation of the processing conditions of the same processing object between different processing locations as small as possible. Another object of the present invention is to achieve a high degree of flexibility in terms of the sequence of processing steps, the adjustability of processing parameters, and the adaptability of system dimensions. It is an object of the present invention to separately record processing conditions for the workpieces of the respective processes.

發明之說明Description of the invention

這些目的係透過申請專利範圍第1項之用於工作件之鍍敷處理的系統及透過申請專利範圍第27項之運送一被扣持在一直立方位之工作件的方法來達成。本發明之較佳特定實施例係揭露在申請專利範圍之依附項中。These objects are achieved by the system for the plating treatment of work pieces in the first application of the patent scope and the method of transporting the work pieces held in the cubic position through the application of the scope of the patent application. Preferred specific embodiments of the invention are disclosed in the dependent claims.

在以下說明與在申請專利範圍中所使用之用語“直立式系統”係表示一其中工作件可被處理之處理系統,且該等工作件係在處理時與由一處理模組輸送至另一處理模組時均實質上位於直立方位上(即,位在其中該等工作件各相對於垂直線最多傾斜20∘之方位上)。The term "upright system" as used in the following description and in the scope of the claims refers to a processing system in which the workpieces can be processed, and the workpieces are transported from one processing module to another during processing. The processing modules are each located substantially in a straight cubic position (i.e., in a position in which the workpieces are inclined at most 20 angstroms relative to the vertical line).

在以下說明與在申請專利範圍中所使用之用語“鍍敷處理”係表示工作件藉由液體或氣體處理劑處理之一種處理,且更特別的是在數次鍍敷處理步驟之製程循環中的工作件係在,例如沈積或溶解一金屬層之至少一方法步驟中 改變。該鍍敷處理可以是一化學或電化學處理。The term "plating treatment" as used in the following description and in the scope of the patent application means a treatment of a workpiece by a liquid or gas treatment agent, and more particularly in a process cycle of several plating treatment steps. Work piece is in, for example, at least one method step of depositing or dissolving a metal layer change. The plating treatment can be a chemical or electrochemical treatment.

在以下說明與在申請專利範圍中所使用之用語“工作件”係特別表示板狀工作件,尤其是印刷電路板與印刷電路箔。但是,它亦可表示半導體晶圓、如光電太陽電池等光電池、及監視器板與玻璃板。就該等工作件為板狀而言,它們具有一平行於該等板表面延伸之工作件平面。就以單數或以複數來使用之用語“工作件/多數工作件”而言,應了解的是它亦可分別以複數或單數來使用。The term "workpiece" as used in the following description and in the context of the patent application, particularly denotes a plate-like workpiece, in particular a printed circuit board and a printed circuit foil. However, it can also mean a semiconductor wafer, a photovoltaic cell such as a photovoltaic solar cell, and a monitor board and a glass plate. Insofar as the workpieces are in the form of a plate, they have a plane of the workpiece extending parallel to the surface of the plates. In the singular or plural term "work piece / majority work piece", it should be understood that it can also be used in plural or singular, respectively.

本發明之處理系統最好設計成使得該等工作件可在該等處理模組中處理時被扣持於直立方位,且當由一處理模組輸送至另一處理模組時,該等工作件亦被扣持於直立方位。又,可提供自動裝置以在裝載與卸載程序時垂直地定向該等工作件。Preferably, the processing system of the present invention is designed such that the workpieces can be held in a straight cubic position when processed in the processing modules, and when transported from one processing module to another, the operations The pieces were also held in straight cubes. Also, an automated device can be provided to orient the workpieces vertically during loading and unloading procedures.

扣持裝置係設置在該等工作件之處理模組中,且一工作件在該處理時被這種扣持裝置扣持。這扣持裝置以一固定方式固定在該處理模組中,且該輸送裝置在將該工作件傳送至一處理模組後,將該工作件傳送至在該處理模組中之該等扣持裝置。The fastening device is disposed in the processing module of the workpieces, and a workpiece is held by the fastening device during the processing. The fastening device is fixed in the processing module in a fixed manner, and after the workpiece is transferred to a processing module, the workpiece is transferred to the fastening module in the processing module. Device.

本發明之系統之特徵在於該等電路板最好直接被該等輸送裝置抓握,即,它們在輸送時以不需任何框架或支持框架或掛架。The system of the present invention is characterized in that the boards are preferably directly grasped by the transport means, i.e. they are transported without any frame or support frame or pylon.

該輸送裝置包含至少一扣持該工作件且在各情形中至少具有一固結裝置,且各固結裝置包括第一與第二夾持裝置,而第一與第二夾持裝置各與該工作件之一側連接。該 第一夾持裝置與該第二夾持裝置兩者一起形成一對夾持裝置,且可移動以抓握與釋放該等工作件。因此,該等工作件在該等夾持裝置打開時被該抓握裝置抓握且亦可依此方式由一處理模組輸送至另一處理模組。通常,使用一抓握裝置來扣持與輸送一工作件或多數工作件。The conveying device comprises at least one holding the working piece and in each case at least one fixing device, and each fixing device comprises first and second clamping devices, and the first and second clamping devices respectively One side of the work piece is connected. The The first clamping device and the second clamping device together form a pair of clamping devices and are movable to grasp and release the workpieces. Therefore, the workpieces are grasped by the gripping device when the gripping devices are opened and can also be transported from one processing module to another in this manner. Typically, a gripping device is used to hold and transport a work piece or a plurality of work pieces.

由於不僅是一夾持裝置而是一抓握裝置之各固結裝置的兩夾持裝置均可移動,可以毫無問題地抓握一易受損的工作件,不必擔心該工作件會在抓握過程中與其中一夾持裝置碰撞。在一夾持裝置為固定且該工作件必須被置入兩位於開啟位置之夾持部份時,特別會發生這種碰撞。在此情形下,會有一危險,即,該固結裝置之固定部,例如,被固定之該等夾持裝置,沿著該工作件刮擦該工作件並使它損壞。Since not only one clamping device but two clamping devices of each fixing device of the grasping device can be moved, a vulnerable working piece can be grasped without any problem, and there is no need to worry that the working piece will be caught. Colliding with one of the clamping devices during the gripping process. This type of collision occurs particularly when a clamping device is fixed and the workpiece must be placed in two clamping portions in the open position. In this case, there is a danger that the fixing portion of the consolidation device, for example, the holding device to be fixed, scrapes the work piece along the work piece and damages it.

由於一扣持裝置設置在一處理模組中,藉由:a)該工作件被運送至該處理模組;b)該工作件被該扣持裝置抓握;且c)該工作件被該抓握裝置釋放可以利用該抓握裝置將被固持於直立方位之工作件運送至該處理模組。Since a fastening device is disposed in a processing module, by: a) the workpiece is transported to the processing module; b) the workpiece is grasped by the fastening device; and c) the workpiece is The gripping device release can utilize the gripping device to transport the workpiece held in the straight cubic position to the processing module.

這表示在由一處理模組輸送至另一處理模組時,可以在一位於欲處理之區域(“有效區域”)外側之多數點處於該工作件表面上抓握該工作件。此外,該抓握裝置僅與該處理流體短暫地接觸且不會在該電解程序時暴露於一電流中。This means that when transported from one processing module to another, the workpiece can be grasped on the surface of the workpiece at a plurality of points outside the area to be treated ("active area"). Furthermore, the gripping device is only in transient contact with the treatment fluid and is not exposed to a current during the electrolysis procedure.

至少一與該工作件之第一側連接之第一夾持裝置最好被設計與設置成使得該工作件之第一側的位置係由該第一夾持裝置來界定,且該工作件之第一側可以是一接觸平面。相對於此,至少一與該工作件之第二側連接之第二夾持裝置最好被設計與設置成使得一夾持力可以利用該第二夾持裝置施加在該工作件上。At least one first clamping device coupled to the first side of the workpiece is preferably designed and arranged such that the position of the first side of the workpiece is defined by the first clamping device and the workpiece The first side can be a contact plane. In contrast, at least one second clamping device coupled to the second side of the workpiece is preferably designed and arranged such that a clamping force can be applied to the workpiece by the second clamping device.

在一較佳實施例中,該等抓握裝置之傳送該力量的部份係呈一管中管結構的型態,即,兩夾持裝置係安裝成可以互相轉動。因此,不會有浴流體穿透至該等夾持裝置中,且可以在該等管之底部提供密封來防止這種情形發生。這表示該抓握裝置具有較小表面之優點,使得它僅以最低限度產生浴夾帶。In a preferred embodiment, the portion of the gripping device that transmits the force is in the form of a tube-in-tube structure, i.e., the two gripping devices are mounted to be rotatable relative to one another. Therefore, no bath fluid will penetrate into the clamping devices and a seal can be provided at the bottom of the tubes to prevent this from happening. This means that the gripping device has the advantage of having a smaller surface such that it only produces a bath entrainment with minimal.

該第一夾持裝置最好設計成使該工作件之第一側的位置係由該第一夾持裝置來界定,且這表示一工作件(之第一側)之接觸側的位置被該抓握裝置準確地輸送至該扣持裝置或被它接管。相對於此,該第二夾持裝置最好被設計與設置成使一夾持(關閉)力可以由該第二夾持裝置施加在該工作件上。透過不同設計與設置並因此使兩夾持裝置特殊化,可以確保被扣持之工作件的準確定位。Preferably, the first clamping device is designed such that the position of the first side of the workpiece is defined by the first clamping device, and this indicates that the position of the contact side of the first member of the workpiece is The gripping device is accurately delivered to or taken over by the holding device. In contrast, the second clamping device is preferably designed and arranged such that a clamping force can be applied to the workpiece by the second clamping device. Through the different designs and settings and thus the specialization of the two clamping devices, the precise positioning of the held workpiece can be ensured.

為了可完成前述工作,該抓握裝置如下般被致動以抓握該工作件:i)移動該第一夾持裝置,使得該第一夾持裝置到達一接觸位置且因此界定該工作件之第一側的位置;及ii)移動該第二夾持裝置,使得該第二夾持裝置到達一 夾持位置,且在如此做時,與該(至少一)第一夾持裝置一起夾持定位該工作件。In order to be able to perform the aforementioned work, the gripping device is actuated as follows to grasp the working piece: i) moving the first clamping device such that the first clamping device reaches a contact position and thus defines the workpiece Positioning the first side; and ii) moving the second clamping device such that the second clamping device reaches a The clamping position, and in doing so, grips the workpiece with the (at least one) first clamping device.

該第一夾持裝置最好在該第二夾持裝置到達該夾持位置之前便到達該接觸位置,因此,該第一夾持裝置先移動至終端位置且接著該第二夾持裝置移動至其終端位置。但是,這並不排除兩夾持裝置亦至少有時同時地移動。事實上,兩夾持裝置亦可一個接一個地移動,即,首先是該第一夾持裝置,接著是該第二夾持裝置。以相反之方式,當該固結裝置被開啟時,該第二夾持裝置可以先移動至一開啟位置且該第一夾持裝置相對其延遲到達該開啟位置。利用這操作以抓握一工作件之方法,一方面可以一重現方式非常準確地定位該工作件,且另一方面可以在沒有工作件與該等夾持裝置碰撞之危險的情形下,毫無問題地利用該固結裝置抓握該工作件。在該等處理模組中之扣持裝置可以構形成,如同該等抓握裝置一般,具有扣持該工作件之成對夾持裝置(該等扣持裝置之第一與第二夾持裝置)。這種在該等扣持裝置處之夾持裝置,如同該等抓握裝置之夾持裝置一般,可以為第一與第二夾持裝置之形態,且如同在該等抓握裝置上之夾持裝置的情形一般,係用以界定該工作件之第一側的位置或分別在該工作件上施加一夾持力並可移動以達成此目的。該等扣持裝置之夾持裝置可以較佳地具有與該等抓握裝置之夾持裝置相同之結構,因此例如,係可轉動且可以如同該等抓握裝置之夾持裝置一般地包括對應夾持面的方式來使用。又,該等扣持裝置可以藉 由例如氣動驅動器來致動。Preferably, the first clamping device reaches the contact position before the second clamping device reaches the clamping position, so that the first clamping device first moves to the end position and then the second clamping device moves to Its terminal location. However, this does not preclude the two gripping devices from moving at least sometimes simultaneously. In fact, the two clamping devices can also be moved one after the other, ie first the first clamping device, followed by the second clamping device. In the opposite manner, when the consolidation device is opened, the second clamping device can be moved to an open position and the first clamping device is delayed relative to the open position. By using this operation to grasp a work piece, on the one hand, the work piece can be positioned very accurately in a reproducible manner, and on the other hand, in the case where there is no danger of the work piece colliding with the holding devices, The work piece is grasped by the consolidation device without problems. The holding device in the processing module can be configured to have a pair of clamping devices for holding the working member (the first and second clamping devices of the fastening devices, as in the grasping device) ). Such gripping means at the retaining means, as in the gripping means of the gripping means, may be in the form of first and second gripping means and as in the gripping of the gripping means The holding device is generally used to define the position of the first side of the work piece or to apply a clamping force on the work piece and to move for this purpose. The gripping means of the retaining means may preferably have the same construction as the gripping means of the gripping means, and thus, for example, are rotatable and may generally include corresponding gripping means of the gripping means Use the way of clamping the surface. Moreover, the holding devices can borrow Actuated by, for example, a pneumatic actuator.

在本發明之另一較佳特定實施例中,該抓握裝置包括至少兩分開之固結裝置,且該等固結裝置分別在相對邊緣處固持一工作件,且該等固結裝置之各個第一與第二夾持裝置是可移動的,使得該工作件在平行於其第一側進行夾持時受到拉伸(在該等固結裝置之間),以避免該電路板之彎曲或拱起。例如,在一被扣持於一直立方位上之矩形工作件上,如果該等固結裝置被配置在該工作件之相對垂直邊緣處,則可以在一實質水平方向上進行這拉伸,或者如果該等固結裝置被配置在該工作件之相對水平邊緣處,則可以在一實質垂直方向上進行這拉伸。In another preferred embodiment of the present invention, the gripping device comprises at least two separate consolidation devices, and the consolidation devices respectively hold a workpiece at opposite edges, and each of the consolidation devices The first and second clamping devices are movable such that the workpiece is stretched (between the consolidation devices) when clamped parallel to the first side thereof to avoid bending of the circuit board or arch. For example, on a rectangular workpiece that is held in a constant cubic position, if the consolidation devices are disposed at opposite vertical edges of the workpiece, the stretching can be performed in a substantially horizontal direction, or If the consolidation means are disposed at opposite horizontal edges of the workpiece, the stretching can be performed in a substantially vertical direction.

在本發明之再一較佳特定實施例,前述至少兩固結裝置被設計且設置成使它們在例如在邊緣區域且最好是在底與頂緣或在側緣處之有效區域外側的區域中抓握該工作件,並且在夾持時分別在電路板平面中互相朝相反方向施加拉伸力在該工作件上。該工作件W具有一在第1A圖中之接觸側(第一側)WE。In a further preferred embodiment of the invention, the at least two consolidation means are designed and arranged such that they are in the region outside the effective area, for example at the edge region and preferably at the bottom and top edges or at the side edges. The workpiece is grasped and a tensile force is applied to the workpiece in opposite directions in the plane of the board during clamping. The work piece W has a contact side (first side) WE in Fig. 1A.

板狀工作件可以依此方式被抓握,特別是在位於相對位置之邊緣處,且至少兩固結裝置是分開的。該等夾持裝置之移動最好使在夾持該工作件時,除了施加該夾持力(垂直作用在該工作件表面上)以外,更施加一平行於該工作件表面向外之拉伸力。為了施加這拉伸力,可以進行另一方法步驟,即:(iii)使該等第一與第二夾持裝置之至少一者移動,特別 是使該第二夾持裝置移動而不移動該第一夾持裝置,使得一拉伸力平行於該工作件之第一側施加在該工作件上。The plate-like workpiece can be gripped in this manner, in particular at the edge of the relative position, and at least the two consolidation devices are separate. Preferably, the movement of the clamping device is such that when the workpiece is clamped, in addition to applying the clamping force (perpendicularly acting on the surface of the workpiece), an outward stretching is applied parallel to the surface of the workpiece. force. In order to apply this tensile force, another method step can be performed, namely: (iii) moving at least one of the first and second clamping devices, in particular The second clamping device is moved without moving the first clamping device such that a tensile force is applied to the workpiece along a first side of the workpiece.

此外該拉伸步驟亦可在與該夾持步驟同時進行,且一非常容易實施之移動順序包括這在後來實施之第三方法步驟,且該步驟係在藉由移動該第二夾持裝置在該工作件上施加該夾持力之後,該等夾持裝置繼續移動,使得另一平行於該工作件表面之力施加在該工作件上來達成。Furthermore, the stretching step can also be carried out simultaneously with the clamping step, and a very easy to implement movement sequence comprises the third method step which is carried out later, and the step is by moving the second clamping device After the clamping force is applied to the workpiece, the clamping devices continue to move such that another force parallel to the surface of the workpiece is exerted on the workpiece.

例如,為了在夾持後拉伸箔,該第二夾持裝置可以再轉動,使得一對應力透過摩擦施加在該箔上。該轉動應作用在該力量將該等箔拉開之方向上,且用以拉伸之力量與移動可以在該電路板兩側上具有相同大小,或該箔僅在一側上被拉伸。For example, to stretch the foil after clamping, the second clamping device can be rotated again such that a pair of stresses are applied to the foil by friction. This rotation should be applied in the direction in which the force pulls the foil apart, and the force and movement for stretching can be the same size on both sides of the board, or the foil can be stretched only on one side.

如果欲在該系統中輸送具有相當不同厚度之工作件,則在各情形中該抓握裝置可設有用於該第二夾持裝置之彈性元件。在此情形下,彈力行程係位在朝該工作件或分別遠離該工作件之方向上。前述特定實施例最好用以將箔狀工作件以一可重現方式扣持且將它們連結在板平面中,以便可均勻地處理該產品之各區域。藉由在夾持時拉伸該等工作件,它們的位置係以一準確方式固定,且它們可以一準確位置被輸送與傳送至一在一處理站中之扣持裝置。另一成果是如該流出裝置之在電路板與安裝件間的間隔,在整個表面上是相等的,如此可以均勻地處理各表面元件。即使當該產品移動時,該產品之各區域移動通過相同之路徑。If a workpiece having a considerably different thickness is to be conveyed in the system, the gripping device can in each case be provided with a resilient element for the second clamping device. In this case, the spring travel is in the direction of the work piece or away from the work piece. The foregoing specific embodiments are preferably used to hold the foil-like workpieces in a reproducible manner and join them in the plane of the panel so that the regions of the product can be processed uniformly. By stretching the workpieces during clamping, their position is fixed in an accurate manner and they can be conveyed and conveyed to a holding device in a processing station at an accurate location. Another result is that the spacing between the circuit board and the mounting member, such as the spacing of the outflow device, is equal across the surface so that each surface element can be processed uniformly. Even when the product moves, the regions of the product move through the same path.

該工作件亦可被一第一(較大)力扣持且僅以小於該第一力之第二力將其另一側向外拉。The work piece can also be held by a first (larger) force and pull the other side outward only with a second force that is less than the first force.

當該等第一與第二夾持裝置之移動為轉動時,特別有利。例如,在本發明一特殊較佳特定實施例之固結裝置中之一對夾持裝置的第一夾持裝置可以一第一轉軸為中心轉動,且在該固結裝置中之該對夾持裝置的第二夾持裝置則以一平行於該第一轉軸之第二轉軸為中心轉動,這使得該裝置可以非常緊緻之方式設計。此外,作用在該工作件上之關閉力可以利用該轉動位置以一輕柔與準確之方式來調整。最後,這設計亦使該等箔狀工作件可以被抓握與拉伸。It is particularly advantageous when the movement of the first and second clamping devices is rotational. For example, in a consolidation device of a particularly preferred embodiment of the invention, the first clamping device of the clamping device can be rotated about a first axis of rotation and the pair of clamping members in the consolidation device The second clamping device of the device is pivoted about a second axis of rotation parallel to the first axis of rotation, which allows the device to be designed in a very tight manner. In addition, the closing force acting on the workpiece can be adjusted in a gentle and accurate manner using the rotational position. Finally, this design also allows the foil-like workpieces to be grasped and stretched.

該工作件之第一側的位置可以利用該第一夾持裝置之轉動位置特別準確地界定,在本發明一特別較佳特定實施例中,為了藉由轉動該第一夾持裝置來界定該工作件之位置,相對該第一轉軸呈直角地產生之第一夾持裝置一區段之外部邊界的第一部份可以外凸地彎曲,且該區段之外部邊界的第二部份可以由一筆直之邊界線形成,且該邊界線以正切之方式連接該外部邊界之第一部份。因此,該第一部份可以形成為一種凸輪盤。由於該第二部份適合放置成與該工作件齊平,該工作件之位置可以一準確之方式界定。該第一部份用以在該第二部份接近時輕柔地引導該工作件,且在這特定實施例中,該第一夾持裝置之轉軸可以較佳地被放置成使該外部邊界在轉動時接近該工作件表面,直到該筆直第二部份以一齊平方式抵靠該工作件表面為止。The position of the first side of the workpiece can be defined particularly precisely by the rotational position of the first clamping device, in a particularly preferred embodiment of the invention, the body is defined by rotating the first clamping device The first portion of the outer boundary of a section of the first clamping device that is generated at a right angle to the first rotating shaft may be convexly curved, and the second portion of the outer boundary of the segment may be Formed by a straight boundary line, and the boundary line connects the first portion of the outer boundary in a tangential manner. Therefore, the first portion can be formed as a cam disc. Since the second portion is adapted to be placed flush with the workpiece, the position of the workpiece can be defined in an accurate manner. The first portion is for gently guiding the workpiece when the second portion is approached, and in this particular embodiment, the axis of rotation of the first clamping device can preferably be placed such that the outer boundary is Approaching the surface of the workpiece as it rotates until the straight second portion abuts the surface of the workpiece in a flush manner.

在本發明一特別較佳特定實施例中,該第一部份係由一平行於該第一轉軸之外凸表面段形成,且該第二部份係由一構形成抵靠該工作件之第一側之較佳平坦接觸面形成。這表示該第一夾持裝置在該關閉位置平順地抵靠該工作件表面;藉此避免該工作件在該夾持點處之傾斜移動。當抓握該工作件時,在此情形下於方法步驟i)中,可以轉動該第一夾持裝置直到該平坦表面部份到達該抵靠位置為止。In a particularly preferred embodiment of the present invention, the first portion is formed by a convex surface section parallel to the first rotating shaft, and the second portion is formed by a structure against the working member. A preferred flat contact surface on the first side is formed. This means that the first clamping device abuts smoothly against the surface of the workpiece in the closed position; thereby avoiding tilting movement of the workpiece at the nip point. When the workpiece is gripped, in this case in method step i), the first clamping device can be rotated until the flat surface portion reaches the abutment position.

該第二夾持裝置最好具有一構形成用以將一夾持力傳送至該工作件之第二側上的外凸夾持面,且該第二夾持裝置最好包含一設計成可將一夾持力傳送至該工作件之第二側的外凸夾持面。為了讓這發生,該第二夾持面係設置在距離該第二轉軸一距離處,且該距離等於或大於在該第二轉軸與這夾持應抵靠之工作件表面間的距離。這第二夾持面最好被設計成與該第二轉軸平行。Preferably, the second clamping device has a convex clamping surface configured to transmit a clamping force to the second side of the working member, and the second clamping device preferably includes a design A clamping force is transmitted to the convex clamping surface of the second side of the workpiece. In order for this to occur, the second clamping surface is disposed at a distance from the second rotating shaft, and the distance is equal to or greater than the distance between the second rotating shaft and the surface of the workpiece against which the clamping should abut. This second clamping surface is preferably designed to be parallel to the second axis of rotation.

對一緊緻實施例而言,該固結裝置包括一扣持至少一第一夾持裝置且與該第一轉軸同軸之第一扭力桿,及一扣持至少一第二夾持裝置且與該第二轉軸同軸之第二扭力桿。該等扭力桿可以由實心材料或由管形成。For a compact embodiment, the consolidation device includes a first torsion bar that holds at least one first clamping device and is coaxial with the first rotating shaft, and a second holding device that holds at least one second clamping device and The second torsion bar of the second rotating shaft is coaxial. The torsion bars can be formed from a solid material or from a tube.

因此,可以一牢固之方式扣持一板狀工作件,且各由第一與第二夾持裝置構成之至少兩對夾持裝置可以被扣持在一對包含該等第一與第二扭力桿之扭力桿處,並且該等第一與第二扭力桿形成一固結裝置。這些夾持裝置對可以較佳地分開設置在各個固結裝置處以便,例如,可以扣持Therefore, a plate-shaped work piece can be fastened in a secure manner, and at least two pairs of clamping devices each composed of the first and second clamping devices can be held in a pair to include the first and second torsion forces The torsion bar of the rod, and the first and second torsion bars form a consolidation device. These pairs of clamping devices can preferably be arranged separately at the respective consolidation device so that, for example, they can be held

一工作件,或在儘可能互相遠離之其他點處,使得該工作件在不可能傾倒之情形下被扣持。如此,當該工作件下降到一在該處理模組中之浴中時,該電路板不可能彎曲。如果一夾具具有數對夾持裝置,則必須小心地設計以確使所有的夾持裝置均可以被充分之夾持力抓握。在一固結裝置上之一對上夾持裝置與一對下夾持裝置之間,可以設置在側邊抓握該電路板邊緣之多數對另外的夾持裝置。A work piece, or at other points as far apart as possible from each other, causes the work piece to be held in a situation where it is impossible to dump. Thus, when the workpiece is lowered into a bath in the processing module, the board is unlikely to bend. If a fixture has several pairs of clamping devices, care must be taken to ensure that all of the clamping devices are gripped by sufficient clamping force. Between a pair of upper clamping devices and a pair of lower clamping devices on a consolidation device, a plurality of pairs of additional clamping devices that grip the edges of the circuit board at the side may be provided.

在本發明之另一特定實施例中,該等工作件亦可完全在其上緣處被該抓握裝置扣持。在此例中,僅以數個夾持裝置,即透過少數接觸點,且最好是僅透過兩個接觸點抓握該工作件,而該等夾持裝置係透過前述接觸點接觸該工作件。由於該固結裝置在此例中僅稍微浸於該浴中,流體幾乎不會被夾帶出該處理模組。In another particular embodiment of the invention, the workpieces can also be fully held by the gripping device at their upper edges. In this case, the workpiece is grasped by only a plurality of clamping devices, that is, through a small number of contact points, and preferably only through two contact points, and the clamping devices contact the workpiece through the aforementioned contact points. . Since the consolidation device is only slightly immersed in the bath in this example, the fluid is hardly entrained out of the processing module.

在一較佳特定實施例中,該等抓握裝置係由如不鏽鋼或鈦等耐腐蝕材料製成。In a preferred embodiment, the gripping devices are made of a corrosion resistant material such as stainless steel or titanium.

該等抓握裝置直接抓握該產品,即,在輸送或在處理時,不必使用另外的框架或架來扣持該產品。如此可得到該等處理浴之高度清潔性與長使用壽命,且依此方式亦可避免該等電路板因流體黏著於該框架所產生之污染。The gripping devices grip the product directly, i.e., without the use of additional frames or shelves to hold the product while transporting or processing. In this way, the high cleanliness and long service life of the treatment baths can be obtained, and in this way, contamination of the circuit boards due to fluid adhesion to the frame can also be avoided.

該扣持力係利用一彈簧機構產生,如此,可確使該產品即使在停電時亦繼續保持被扣持之狀態。相對於此,在該等固結裝置處之開啟力係透過一如氣壓缸或馬達等致動驅動器來產生。The holding force is generated by a spring mechanism, so that the product can be kept in a state of being held even when the power is cut off. In contrast, the opening force at the consolidation devices is generated by actuating the actuator, such as a pneumatic cylinder or motor.

在本發明之系統中所使用之抓握裝置係用以將一工作 件輸送至一用於該處理之處理模組中,依據本發明,該工作件係在該處理模組中被傳送至一設置在該模組中之扣持裝置。為達此目的,該抓握裝置可以在該工作件已被傳送至抓握該工作件之扣持裝置後立即釋放該工作件。然後,它可以再次移出該模組。在該抓握裝置已將一第一工作件放置在該模組中後,它便可以用於輸送另一工作件。因此,在該處理過程中,在此情形下,該抓握裝置不是位在該處理模組中。因此,扣持一工作件之抓握裝置可以移入一處理模組中以放置與釋放該工作件於該處,且該工作件被設置在該模組中之扣持裝置接管。接著,該抓握裝置移出該處理模組。The gripping device used in the system of the present invention is used to work The workpiece is transported to a processing module for the processing. According to the present invention, the working member is transferred to the holding device disposed in the module. To this end, the gripping device can release the work piece immediately after the work piece has been transferred to the holding device that grips the work piece. It can then move the module out again. After the gripping device has placed a first work piece in the module, it can be used to transport another work piece. Therefore, during this process, in this case, the gripping device is not located in the processing module. Therefore, the gripping device holding the working piece can be moved into a processing module to place and release the working piece there, and the working piece is taken over by the holding device disposed in the module. The gripping device is then removed from the processing module.

以一對應之方式,該抓握裝置可以在方法步驟i)之前移入一處理模組,以接管一已在一處理模組中處理過之工作件,以便在該處抓握該工作件。為達此目的,設置於該處之扣持裝置釋放該工作件。一旦該工作件已被抓握,該抓握裝置便與該工作件一起移出該處理模組。In a corresponding manner, the gripping device can be moved into a processing module prior to method step i) to take over a workpiece that has been processed in a processing module for gripping the workpiece there. To this end, the holding device provided there releases the work piece. Once the workpiece has been grasped, the gripping device is removed from the processing module along with the workpiece.

為了在移入與移出該抓握裝置時不損壞一位於一處理模組中之工作件,該等第一與第二夾持裝置可同時地或有一時間差地由其抓握位置開啟。In order to prevent damage to a work piece located in a processing module when moving in and out of the gripping device, the first and second holding devices can be opened simultaneously by their gripping position or with a time difference.

為了將該工作件由該抓握裝置傳送至在該浴容器中之扣持裝置或反向進行前述動作,該等工作件之位置一定不能改變,因為若不如此就必須在該浴容器中使該等工作件再對齊。特別是若為非常薄且輕之印刷電路箔,則每一工作件就要提供最少兩個固結裝置。在此例中,該等工作件 由該等輸送裝置傳送至該扣持裝置係在該浴容器中發生,且最好包括兩步驟:在一第一步驟中,該抓握裝置之第一夾持裝置是開啟的,而在該浴中之相關扣持裝置的夾持裝置亦是開啟的。該抓握裝置之第二夾持裝置仍停留在初始位置,使得該工作件仍僅抵靠該等第二夾持裝置。接著,在該浴中之該扣持裝置的第一夾持裝置關閉。在一第二步驟中,該抓握裝置之第二夾持裝置是開啟的,而在該浴中之扣持裝置的第二夾持裝置則是關閉的。In order to transfer the workpiece from the gripping device to the holding device in the bath container or to perform the aforementioned actions in reverse, the position of the workpieces must not be changed, since otherwise it must be made in the bath container. The work pieces are then aligned. In particular, if it is a very thin and light printed circuit foil, a minimum of two consolidation devices are provided for each workpiece. In this case, the work pieces The transfer from the delivery device to the fastening device occurs in the bath container and preferably includes two steps: in a first step, the first clamping device of the grasping device is open, and The holding device of the relevant holding device in the bath is also open. The second gripping device of the gripping device remains in the initial position such that the workpiece still only abuts the second gripping device. Next, the first holding device of the holding device in the bath is closed. In a second step, the second gripping means of the gripping device is open and the second gripping means of the gripping means in the bath is closed.

該操作之方法防止該等導電箔因傳送程序而受損,且該等工作件之位置沒有改變。當在該輸送系統處之可移動夾持裝置相對在浴中之扣持裝置處的固定夾持裝置偏移時,如果該抓握裝置之兩夾持裝置與該扣持裝置之夾持裝置在該電路板之一側上同時關閉,則該等工作件將會在被該扣持裝置抓握時因該等材料之過度膨脹而受損。The method of operation prevents the conductive foils from being damaged by the transfer procedure and the position of the workpieces is unchanged. When the movable gripping device at the transport system is offset relative to the fixed gripping device at the holding device in the bath, if the gripping device of the gripping device and the gripping device of the retaining device are When one side of the circuit board is simultaneously closed, the work pieces will be damaged by excessive expansion of the materials when grasped by the fastening device.

此外,該抓握裝置亦可被設置成可利用該抓握裝置產生一與一被扣持工作件電接觸,這表示一極化電流被傳送至移入一處理模組或移出一處理模組之產品。In addition, the gripping device can also be configured to generate electrical contact with a held workpiece by the gripping device, which means that a polarized current is transmitted to the processing module or to a processing module. product.

本發明之系統最好包括多數沖洗裝置(最好是噴水裝置),且可以在由該處理模組取出時,利用該等沖洗裝置沖洗至少一抓握裝置及/或該等工作件(例如,用水管沖洗)。該等沖洗裝置係設置在該浴之液位上方,且在有或沒有工作件之抓握裝置被升起且移動通過一例如一噴射管之沖洗裝置時進行操作。因此,可以在該抓握裝置移動通過該等沖洗裝置時,清潔該等夾持裝置。緣是,可特別沖洗多數 在該等夾持裝置上之區域,而該等夾持裝置係透過該等區域接觸該等工作件。亦可在位於該位置處之抓握裝置未扣持任何工作件時操作一沖洗裝置,即,特別在該抓握裝置於已放好該工作件後移出該處理模組時,操作一沖洗裝置。或者,亦可以利用設置在該輸送裝置上之沖洗裝置,例如利用安裝在該位置處之噴射管,在例如由一處理模組移動至另一處理模組時,沖洗該等抓握裝置。該輸送系統可以具有一自動化滴盤,以避免沖洗液帶出(drag-out)。Preferably, the system of the present invention includes a plurality of irrigation devices, preferably water spray devices, and can be used to flush at least one of the grasping devices and/or the work members (e.g., when removed from the processing module). Rinse with a water pipe). The flushing devices are disposed above the level of the bath and operate when the gripping device with or without the workpiece is raised and moved through a flushing device such as a spray tube. Thus, the gripping devices can be cleaned as the gripping device moves through the flushing devices. The edge is that the majority can be washed In the area of the clamping device, the clamping devices contact the workpieces through the regions. It is also possible to operate a flushing device when the gripping device at the position does not hold any working piece, that is, to operate the flushing device particularly when the gripping device removes the processing module after the working member has been placed. . Alternatively, it is also possible to use flushing devices provided on the transport device, for example by means of spray tubes mounted at the location, for flushing the gripping devices, for example, when moving from one processing module to another. The delivery system can have an automated drip tray to avoid rinsing fluid dr-out.

一在一處理模組中之扣持裝置可以被設計成使一因此被扣持之工作件的位置可以於平行於該工作件平面之一或多個方向或亦與其相對呈直角地調整,特別是使其居中。定位裝置設置在該處理模組中以達成此目的,藉此確保在處理時該產品之最適當位置。該等定位裝置最好位於該浴區域中且可以使該電路板平行於該電路板表面對齊,例如該垂直對齊可以透過一擋止構件設定且該橫向對齊可透過偏心安裝之圓盤或一槓桿機構設定。The holding device in a processing module can be designed such that the position of a workpiece thus held can be adjusted in one or more directions parallel to the plane of the workpiece or at a right angle thereto, in particular It is to make it centered. A positioning device is provided in the processing module for this purpose, thereby ensuring the most appropriate position of the product at the time of processing. Preferably, the positioning means are located in the bath area and the board is aligned parallel to the surface of the board, for example the vertical alignment can be set by a stop member and the lateral alignment can be transmitted through an eccentrically mounted disc or a lever Institutional settings.

為了適時知道電路板是否相對該抓握裝置被傾斜地吊掛,該輸送系統可以設置一感測器系統。這至少在兩個點處監測該電路板,且例如光感應感測器是適當的。In order to know in a timely manner whether the circuit board is suspended obliquely relative to the gripping device, the transport system can be provided with a sensor system. This monitors the board at least at two points, and for example a light sensing sensor is suitable.

各個處理模組最好具有可自足自給操作的設備,即,各處理模組具有所有處理該產品所需之裝置,例如,其自已的容器;自已的流出構件;用以移動該產品之裝置;泵;用以過濾、冷卻、加熱與配料之裝置。因此,各處理模組可以互相獨立地操作。如此可藉由流體交換、排出空氣混 合、不同電源等,避免在處理模組與在這些處理模組中之工作件間的互相干擾,例如經由透過共同容器壁之熱傳送。這表示該等處理參數是可以一非常準確之方式控制與測量的,且可產生相當好與特別均勻的處理結果。Preferably, each processing module has a self-contained self-contained device, that is, each processing module has all the devices required to process the product, for example, its own container; its own outflow member; means for moving the product; Pump; means for filtering, cooling, heating and dosing. Therefore, each processing module can operate independently of each other. So by fluid exchange, exhaust air mixing Coupling, different power sources, etc., avoid mutual interference between the processing modules and the work pieces in the processing modules, such as via heat transfer through the walls of the common container. This means that the processing parameters can be controlled and measured in a very accurate manner and can produce fairly good and particularly uniform processing results.

原則上,該系統可設置成使用數種處理模組。各種模組對於數目與設計(浴循環、加熱、冷卻、輸入流裝置等)具有安裝與附加零件的選擇性,且該等安裝與附加零件接著依據在該處理模組中之程序要求來安裝。因此,有多數零件由其選出之最多設備可供裝設該處理模組。這表示在一種模組中之不同處理模組安裝與附加零件被同等地設計與設置在相同位置處,而這減少花費在設計與生產上之成本與努力。該等安裝與附加零件之程序上且與處理相關之效能在它們安裝於其中之各處理模組中亦是相同的,這表示在具有相同配備之處理模組之效能資料中且因此在該等處理模組中處理之工作件之處理結果中的偏差會減至最小。如此,效能且因此來自具有不同配備之處理模組之處理結果相差不大。In principle, the system can be configured to use several processing modules. The various modules have selectivity to the number and design (bath cycle, heating, cooling, input flow devices, etc.) for mounting and additional parts, and the mounting and additional parts are then installed in accordance with the program requirements in the processing module. Therefore, the most equipment selected by most of the parts can be equipped with the processing module. This means that different process module installations and additional components in a module are equally designed and placed at the same location, which reduces the cost and effort involved in design and production. The procedural and processing-related performance of such installations and additional parts is also the same in each of the processing modules in which they are installed, which is indicated in the performance data of the processing modules having the same equipment and therefore in such Deviations in the processing results of the workpieces processed in the processing module are minimized. As such, the performance and therefore the processing results from processing modules with different configurations are comparable.

本發明之系統可被設計成使至少一處理模組包含以下結構特徵:a.一容器,用以收容處理流體;b.一基本框架,具有扣持該容器之收納框架;c.多數安裝零件,係位在該容器內內部且向上直到該蓋處之零件,例如,進行加熱、冷卻;d.一支持框架,用以安裝可相對該工作件平面呈直角 地移動之零件;e.一擺動框架,用以安裝可平行於該工作件平面移動之零件;f.附加零件,係位於該容器內部區域外側之零件,例如,泵、過濾器;及g.多數蓋,係用於該容器者。The system of the present invention can be designed such that at least one processing module comprises the following structural features: a. a container for containing a processing fluid; b. a basic frame having a receiving frame for holding the container; c. a plurality of mounting parts a part that is inside the container and up to the cover, for example, heating and cooling; d. a support frame for mounting at right angles to the plane of the workpiece a moving part; e. a swinging frame for mounting a part movable parallel to the plane of the workpiece; f. an additional part, a part located outside the inner area of the container, for example, a pump, a filter; and g. Most covers are used for the container.

由於該容器係被一收納框架支持且同時固定地或可分離地連接於該框架,所以它本身不需要承擔任何靜止之工作。它被安裝成具有相當大的游隙,例如,懸吊在該收納框架中,使得其熱膨脹係不會傳遞至該收納框架或該格架上。例如,具有一凸緣之容器可以懸吊在被一基本框架扣持之收納框架中。各處理模組可以因此被連結在地板上、在天花板上或在另一連結面上。各模組可具有它自己的基本框架或者可以是一具有具有其他模組之共用基本框架,這種基本框架亦可是可擴大的。該基本框架最好是由金屬製成以大幅避免溫度之影響,且該基本框架可以站立在地板上或可以連結在牆壁上或天花板上。一處理模組之組件的附加與安裝零件未連結在該容器本身上,這使該容器在操作時可充份熱膨脹且不會改變該等組件之位置。因此,相對於該容器本身必須具有一支持功能,在該等處理模組中之各個組件之間的相對空間配置更為準確且更容易重現。由於該容器之熱膨脹因前述原因不會對在該處理模組中之各個組件的定位產生影響,其設計可以是簡單的且該容器不需要補強,這表示相較於習知結構,該容器之製造 成本可以大幅降低。Since the container is supported by a receiving frame and is fixedly or detachably attached to the frame at the same time, it does not itself have to undertake any static work. It is mounted to have a relatively large play, for example, suspended in the receiving frame such that its thermal expansion is not transmitted to the receiving frame or the frame. For example, a container having a flange can be suspended in a receiving frame that is held by a basic frame. The processing modules can thus be attached to the floor, to the ceiling or to another joining surface. Each module may have its own basic frame or may have a shared basic frame with other modules, which may also be expandable. The basic frame is preferably made of metal to substantially avoid the effects of temperature, and the basic frame can stand on the floor or can be attached to a wall or ceiling. The additional and mounting components of the components of a processing module are not attached to the container itself, which allows the container to be fully thermally expanded during operation without changing the position of the components. Therefore, there must be a support function with respect to the container itself, and the relative spatial arrangement between the various components in the processing modules is more accurate and easier to reproduce. Since the thermal expansion of the container does not affect the positioning of the various components in the processing module for the foregoing reasons, the design can be simple and the container does not need to be reinforced, which means that compared to conventional structures, the container Manufacturing The cost can be greatly reduced.

此外,該等容器最好是構形成為相對浴流沒有死角區域,即,它們具有圓形角隅。該容器橫截面可以在頂部大於在底部,使更換安裝零件更為容易。該等容器最好由塑膠材料製成,且為了達成一符合經濟效益的生產,該等最好可利用大量生產之符合經濟效益方法來生產,例如,離心模製法、旋轉模製法或容器吹塑法。該等容器可以由金屬塑膠材料製成。Moreover, the containers are preferably configured to have no dead zone relative to the bath flow, i.e., they have a rounded corner. The cross section of the container can be larger at the top than at the bottom, making it easier to replace the mounting parts. Preferably, the containers are made of a plastic material and, in order to achieve a cost-effective production, such products are preferably produced in a cost-effective manner in mass production, for example, centrifugal molding, rotary molding or container blow molding. law. The containers may be made of a metal plastic material.

該支持框架最好連結在該收納框架上,且在另一特定實施例中,該支持框架被該收納框架扣持,以便可移動。這表示該支持框架可以扣持例如扣持裝置、流出構件與電極等容器安裝零件,且該等容器安裝零件相對該容器移動且與該產品呈直角。該支持框架最好利用一氣動驅動器來移動,且透過一氣動驅動器之預定終止位置,該支持框架可到達在該處理模組中之預定位置。如果在一處理模組中之其他裝置必須到達預定位置,則這些種類之氣動驅動器亦可供前述裝置使用。The support frame is preferably attached to the receiving frame, and in another particular embodiment, the support frame is retained by the receiving frame for movement. This means that the support frame can hold container mounting parts such as fastening means, outflow members and electrodes, and the container mounting parts move relative to the container and are at right angles to the product. Preferably, the support frame is moved using a pneumatic actuator and the predetermined end position of the pneumatic drive is reached, the support frame reaching a predetermined position in the processing module. If other devices in a processing module have to reach a predetermined location, these types of pneumatic actuators are also available for use with the aforementioned devices.

不論該支持框架之移動性為何,其在該處理模組中之準確定位與安裝於其上之安裝零件一樣重要,且該產品必須相對該抓握裝置準確地定位。因此,在本發明之一特定實施例中,該支持框架或其引導構件至少在一點處於至少一方向上是可調整的,且最好是可垂直地或橫向地調整。Regardless of the mobility of the support frame, its accurate positioning in the processing module is as important as the mounting components mounted thereon, and the product must be accurately positioned relative to the gripping device. Thus, in a particular embodiment of the invention, the support frame or its guiding member is adjustable at least in one direction in at least one direction, and preferably is vertically or laterally adjustable.

該支持框架最好由金屬製成,以大幅減少溫度之影響。The support frame is preferably made of metal to greatly reduce the effects of temperature.

該擺動框架可以連結在該支持框架上,以便可移動, 且例如流出構件或陽極等多數可以平行於該電路板表面移動之組件被連結在該擺動框架上。在一較佳實施例中,該擺動框架可包含一可用以在該支持框架上引導該擺動框架並且亦作為噴灑管之管的吊桿。這結構之效果是多數欲平行於該產品移動之組件,特別是流出構件與陽極,將與該產品一直保持一固定間距,即使該產品在同時相對其表面呈直角地移動時亦然。如此可最適當地均勻處理該產品。The swing frame can be coupled to the support frame so as to be movable. And a plurality of components, such as an outflow member or an anode, which are movable parallel to the surface of the board, are attached to the swing frame. In a preferred embodiment, the swing frame can include a boom that can be used to guide the swing frame on the support frame and also serve as a tube for the spray tube. The effect of this construction is that most components that are intended to move parallel to the product, particularly the outflow member and the anode, will remain at a fixed distance from the product, even if the product is moving at right angles to its surface. This makes it possible to treat the product evenly and uniformly.

流出裝置最好設置在各處理模組中。Preferably, the outflow device is disposed in each processing module.

為了保持在該處理模組中之溶液體積與該模組之所需空間儘可能地小,該等處理模組最好被設計為儘可能緊緻。例如,可以達到一在以化學與無電極方式操作之模組中液體體積與該板胚料之間的比例小於8 l/dm2 ,且在通電模組中小於15 l/dm2 ,且該容器之對應尺寸幾乎不大於該工作件之尺寸。In order to keep the volume of the solution in the processing module as small as possible of the module, the processing modules are preferably designed to be as compact as possible. For example, it is possible to achieve a ratio between the liquid volume and the billet in a module that is operated in a chemical and electrodeless manner of less than 8 l/dm 2 and less than 15 l/dm 2 in the energization module, and The corresponding size of the container is hardly greater than the size of the workpiece.

為了達到使各個處理模組之維修程序儘可能符合經濟效益,其上扣持有移動安裝零件之支持框架可以被設計成可與該模組分離。這亦讓處理站容易配合不同之處理工作。In order to achieve the economical benefit of the maintenance procedures of the various processing modules, the support frame with the removable mounting parts attached thereto can be designed to be separated from the module. This also makes the processing station easy to work with different processing.

由於該處理模組之相當輕重量與緊緻度且由於利用相同之連接構件來對該等模組供應第二電力與用以中止供應並且由於在各情形中之相同空間需求,所以可以一簡單之方式交換完整之處理模組,且升級該系統亦相當簡單。又,預製處理模組被放置、對齊與連接在該等處理站之對應位置處並且調整該輸送裝置。Due to the relatively light weight and compactness of the processing module and the use of the same connecting member to supply the second power to the modules and to suspend the supply and due to the same space requirements in each case, it can be simple The way to exchange the complete processing module, and upgrading the system is also quite simple. Again, the prefabricated processing modules are placed, aligned and attached at corresponding locations of the processing stations and the conveyor is adjusted.

例如,用於加壓空氣與水之供應裝置可以較佳地連結 在該基本框架上。它們位在同一種之各處理模組中的相同位置處,因此,準備該處理模組之位置是簡單的。For example, a supply device for pressurized air and water can be preferably connected On this basic framework. They are located at the same position in the same processing module, so the location of the processing module is simple.

在本發明一特殊較佳特定實施例中,在該系統中之至少一處理模組被設計成可僅收納與處理一個工作件,即,在該處理模組中之任何時間,只有一個工作件。一模組亦可被設計成可收納數個設置成在該模組中互相相鄰之工作件,在此情形下,該等工作件可較佳地位在該處理模組中互相分開之室中。但是,在一模組中處理一獨立工作件是較佳的且該等工作件可達到高可重現、可完成性之處理。各工作件之處理條件可以與其他工作件之處理條件無關地且非常準確地調整。In a particularly preferred embodiment of the invention, at least one processing module in the system is designed to accommodate and process only one workpiece, ie, at any time in the processing module, only one workpiece . A module can also be designed to accommodate a plurality of workpieces disposed adjacent to each other in the module, in which case the workpieces can preferably be positioned in separate chambers of the processing module . However, it is preferred to process a separate work piece in a module and the work pieces are highly reproducible and simplifiable. The processing conditions of each work piece can be adjusted very accurately regardless of the processing conditions of other work pieces.

對於工作件之處理而言,該等處理模組可以設置在模組序列中,使得該等工作件可以藉由將該等工作件一個接著一個地移入各個模組中,在該模組序列中一個接著一個地被處理。多數這些種類之序列的處理模組可以一個接著一個地設置,以產生一多列與多排處理模組的矩陣。因此,其中進行相同處理步驟之多數處理模組可以一個接著一個地排列,以在同時處理多數工作件。該矩陣亦包括多數可進行替代在一處理排中之處理之操作模式的模組,例如,具有不同程序參數之模組。這種系統可以一最適當方式配合可用空間。如果使用多數獨立之容器,且相鄰容器最好是分開的,則例如透過熱傳遞之相鄰容器的相互影響將不會發生。但是,分開之容器可以藉由最好可關閉之管線(旁通管線)互相連接。這可達成的效果是相互連接之容器在濃 度與溫度方面具有相同之浴流體。For the processing of the workpieces, the processing modules can be arranged in the module sequence, so that the workpieces can be moved into the modules one by one by the workpieces in the module sequence. Processed one after another. Most of these types of processing modules can be arranged one after the other to produce a matrix of multiple columns and multiple rows of processing modules. Therefore, most of the processing modules in which the same processing steps are performed can be arranged one after another to process most of the workpieces at the same time. The matrix also includes a number of modules that can be substituted for the mode of operation of processing in a processing bank, for example, modules having different program parameters. This system can fit the available space in the most appropriate way. If a plurality of separate containers are used and the adjacent containers are preferably separate, then the interaction of adjacent containers, such as through heat transfer, will not occur. However, separate containers may be interconnected by a preferably closable line (bypass line). The achievable effect is that the interconnected containers are thicker The same bath fluid as temperature.

控制該輸送裝置可以被特別設計成使容量利用性儘可能地最適當化。Controlling the delivery device can be specifically designed to maximize capacity utilization as much as possible.

在矩陣狀結構中之模組亦可設置成使對多數獨立處理站而言,一以一預定處理列處理之工作件不會移入在一排或列之模組矩形的處理模組內之處理模組中,但會移入一與其不同之序列中。因此,在該等模組被排列成矩形狀時,該輸送裝置可以特別地設計成使一抓握裝置由一處理模組被運送至任一其他模組(利用所謂座標輸送小車),即,該輸送裝置可以延伸至所有處理模組排,使得該抓握裝置將工作件供應至在不同排中之處理站或一個接一個地將多數工作件運送至在一排內的不同模組。這亦可使該抓握裝置達到最大可能彈性與容量利用性,及該系統對空間與生產需求之最大適用性。The modules in the matrix structure may also be arranged such that for most independent processing stations, the processing components processed by a predetermined processing column are not moved into the processing modules of the module rectangles of one row or column. In the module, but it will move into a different sequence. Therefore, when the modules are arranged in a rectangular shape, the conveying device can be specially designed such that a gripping device is transported from one processing module to any other module (using a so-called coordinate conveying trolley), ie The conveyor can be extended to all of the processing module rows such that the handling device supplies the workpiece to processing stations in different rows or transports the plurality of workpieces one after the other to different modules in a row. This also allows the grip device to achieve maximum possible flexibility and capacity utilization, and the system's maximum suitability for space and production needs.

該等電路板最好朝該方法方向輸送,這表示該材料係以一最適當方式輸送。但是,亦可為自由構成之處理序列,例如,重覆一加工步驟。這在處理該等電路板時可得到最大自由度。Preferably, the boards are transported in the direction of the method, which means that the material is delivered in the most appropriate manner. However, it can also be a freely constructed processing sequence, for example, repeating a processing step. This gives the greatest degree of freedom in processing these boards.

一直立系統之特徵在於一由該運輸小車移移之路徑所產生主輸送方向,以下稱為x軸,且y軸與其呈直角地延伸且位於水平方向上。與這兩軸呈直角地,各個處理模組之高度係由z軸表示。The upright system is characterized by a main conveying direction produced by the path of the transport trolley, hereinafter referred to as the x-axis, and the y-axis extends at right angles thereto and is located in the horizontal direction. At right angles to the two axes, the height of each processing module is represented by the z-axis.

一處理模組,除了對應於在該模組中之電路板延伸部之垂直延伸部以外,更包括在各情形下相對之縱向側與端 面,且該等端面比縱向側窄。a processing module, in addition to a vertical extension corresponding to the extension of the circuit board in the module, further including opposite longitudinal sides and ends in each case Faces, and the end faces are narrower than the longitudinal sides.

在本發明之一較佳特定實施例中,該等處理模組設置成使各個縱向側朝輸送方向延伸。這表示許多處理模組可以互相相鄰放置且因此可以在這些處理模組之各個處理模組中同時處理許多工作件,且該輸送裝置不必具有一足以跨越在一排中之所有處理模組。因此,在這特定實施例中之處理模組係放置成使它們的縱向側平行於x軸,基本上,有兩種不同的處理序列:處理序列1:不同處理用之模組係沿著y方向與x方向設置,因此處理之產品可以利用該抓握裝置朝y方向與x方向輸送通過該系統。這可以是,例如,一蜿蜒曲折狀之處理位置序列,且這序列對於具有小處理量之系統是有利的。In a preferred embodiment of the invention, the processing modules are arranged such that the respective longitudinal sides extend in the conveying direction. This means that many of the processing modules can be placed adjacent to each other and thus many of the work pieces can be processed simultaneously in each of the processing modules of the processing modules, and the transport device need not have a processing module that is sufficient to span across a row. Thus, the processing modules in this particular embodiment are placed such that their longitudinal sides are parallel to the x-axis. Basically, there are two different processing sequences: Processing Sequence 1: Modules for different processing are along y The direction is set in the x direction so that the processed product can be transported through the system in the y and x directions using the gripping device. This can be, for example, a meandering sequence of processing locations, and this sequence is advantageous for systems with small throughput.

處理序列2:具有相同處理工作之模組係設置於y方向上且具有不同處理工作設置在x方向上。該處理序列將只會在x方向上發生,且這設計係用以在具有一預定數目之電路板時使該輸送小車之x尺寸儘可能地短。Processing sequence 2: The modules with the same processing work are placed in the y direction and have different processing operations set in the x direction. This sequence of processing will only occur in the x direction, and this design is used to make the x dimension of the transport carriage as short as possible when having a predetermined number of boards.

當然,也可以在兩處理序列中使該等縱向側在y方向上對齊。Of course, it is also possible to align the longitudinal sides in the y-direction in both processing sequences.

此外,較佳地的是使每兩個處理模組透過該等端面互相相鄰設置(直接互相相鄰)。因此,可以收納與各處理模組相關之組件,使得它們可接近以進行維修,因為可以在各對處理模組之間設置一維修通道。該等組件最好設置在該模組之各端面處,這一方面可節省空間,而另一方面具有良好之通達性。In addition, it is preferred that each of the two processing modules are disposed adjacent to each other (directly adjacent to each other) through the end faces. Thus, the components associated with each processing module can be housed such that they are accessible for maintenance because a service channel can be provided between each pair of processing modules. Preferably, the components are disposed at each end face of the module, which saves space in this respect and has good accessibility on the other hand.

由於各件所使用之設備(安裝零件、附加零件)僅與一個處理模組與一個工作件相關(在該模組中處理時),可以在任何時間,藉由評估該工作件之真正供應電流、在該容器中之流動條件、溫度、浴組成等,制訂某一工作件之生產條件及其處理資料的資訊。這表示可以不需要以其他方式制訂該處理資料所必須之以感測器間接測量。Since the equipment (installation parts, additional parts) used for each piece is only related to one processing module and one workpiece (when processed in the module), the actual supply current of the workpiece can be evaluated at any time. , the flow conditions in the container, temperature, bath composition, etc., to develop information on the production conditions of a work piece and its processing data. This means that it is not necessary to otherwise formulate the indirect measurement of the sensor necessary to process the data.

此外,該處理模組可包括如空氣噴射之多數供應動力用連接構件、供水與排氣用之連接部,且它們各具有可偵測各個輸出之自己的感測器。另外,可依據該處理模組之特定目的,提供用於溫度、流體液面及流動條件之感測器系統與控制系統。這表示各處理過程之處理參數可以被記錄下來,作成文書且與被處理之工作件產生關聯。Further, the processing module may include a plurality of power supply connection members such as air injection, a connection portion for water supply and exhaust, and each of which has its own sensor capable of detecting each output. Additionally, sensor systems and control systems for temperature, fluid level, and flow conditions can be provided for the particular purpose of the processing module. This means that the processing parameters of each process can be recorded, documented and associated with the work piece being processed.

在另一較佳結構中,本發明直立系統之處理模組可具有多數蓋,最好是具有自動致動之蓋。這種蓋可以是一種可被下降至一處理模組中之工作件用滑動門。In another preferred construction, the processing module of the upright system of the present invention can have a plurality of covers, preferably with an automatically actuated cover. The cover can be a sliding door for a work piece that can be lowered into a processing module.

該等處理模組亦可以具有排氣裝置。此外,在本發明之一較佳特定實施例中,有一在該輸送裝置上之排氣裝置,特別是當該輸送裝置亦朝其中以一明顯在室溫以上之溫度進行一處理之處理模組移動時。在此例中,該輸送裝置最好裝設有一環繞該裝置之殼體。該排氣裝置之對應出口空氣管線可具有多數對應排氣連接器,使得被分離出來的空氣被吸出該輸送裝置,且該等連接器可以具有適當的閥。The processing modules may also have an exhaust device. Furthermore, in a preferred embodiment of the invention, there is an exhaust device on the transport device, particularly when the transport device is also subjected to a treatment module at a temperature above room temperature. When moving. In this case, the delivery device is preferably provided with a housing surrounding the device. The corresponding outlet air line of the venting device may have a plurality of corresponding exhaust connectors such that the separated air is drawn out of the conveying device and the connectors may have suitable valves.

該系統可以使用清潔室技術來設計。一所謂進料箱 (flow box)可設置在此,即,一其中有經淨化(過濾)空氣以一層流方式流經之箱。這進料箱可以設置成固定在該等處理模組上方使得該輸送裝置朝這進料箱移動,或者該進料箱僅環繞該輸送裝置且與該輸送裝置一起移動。為了在該進料箱中產生一清潔室條件,可以設置,例如,一由該輸送裝置承載於所輸送之工作件上方且向下輸出清潔室空氣使之環繞該工作件流動的裝置。只有在將一工作件移入一處理模組時使一安裝在容器上之蓋可開啟,以避免污染物進入該處理液體中。一旦工作件已移入或移出,該蓋將再次關閉。The system can be designed using clean room technology. a so-called feed box A flow box may be provided here, that is, a tank through which purified (filtered) air flows in a layerwise manner. The feed bin may be arranged to be secured above the processing modules such that the conveyor moves towards the feed bin, or the feed bin only surrounds and moves with the conveyor. In order to create a clean room condition in the feed bin, it may be provided, for example, a device carried by the transport device above the transported work piece and outputting the clean room air downwardly to flow around the work piece. Only when a workpiece is moved into a processing module, a lid mounted on the container can be opened to prevent contaminants from entering the processing liquid. Once the work piece has been moved in or out, the cover will close again.

因此來自該等進料箱之層流仍儘可能沿著該產品保持為層流,且該輸送系統之形狀與它一致。該抓握裝置被設計成使得干擾儘可能少發生,且因此,例如,以一對於流動之有利方式,如一水滴形方式被包圍起來。連結該抓握裝置之橫樑是圓的,例如,具有一圓形橫截面。Thus the laminar flow from the feed bins remains as laminar as possible along the product as much as possible, and the shape of the delivery system is consistent with it. The gripping device is designed such that interference occurs as little as possible and, therefore, for example, is enclosed in a droplet-like manner in an advantageous manner for flow. The beam joining the gripping device is round, for example, having a circular cross section.

該輸送裝置可包括一絕對測量系統,且該絕對測量系統使該輸送裝置可以被正確地定位在該裝置之三個移動方向上。為達此目的,例如,各處理模組使用一電機居中系統。在系統啟動時接近各個位置直到它們準確地到達為止,且在此時得到之位置值則被儲存在該系統控制部中,使得它們將來以一準確之方式自動地接近。又,在某些時段後,進行一自動控制再調整。The delivery device can include an absolute measurement system that allows the delivery device to be properly positioned in the three directions of movement of the device. To this end, for example, each processing module uses a motor centering system. The various locations are approached at system startup until they arrive accurately, and the position values obtained at this time are stored in the system control so that they will automatically approach in an accurate manner in the future. Also, after some time periods, an automatic control is performed to adjust.

各處理模組可具有其自己監測該處理液體之參數的自動系統,即,一自動測量系統,且最好是在線上測量流體 中之物質濃度,此外,亦具有這些物質之自動配料裝置。又,亦可設置與該等處理模組相關之記錄裝置,藉此各工作件之記錄裝置產品相關資料可個別地加以收集,且與對應工作件產生關聯並接著記錄在一報告中。Each processing module may have its own automated system for monitoring the parameters of the processing liquid, ie, an automated measurement system, and preferably measuring the fluid on-line The concentration of the substance in the medium, in addition, also has an automatic dosing device for these substances. Further, recording means associated with the processing modules may be provided whereby the recording device product related data of the respective workpieces may be individually collected and associated with the corresponding workpiece and then recorded in a report.

在本發明之系統中,各電路板可以利用一個別的處理程式來處理,由於必須可以處理多數電路板,該處理程式需要非常寬光譜之不同處理參數,以便,例如,可以一特別適當之方式來處理盲孔、具有高長度與直徑比之內孔、層厚度分布偏差特別小之表面、具有不良導電塗層之基底材料等。在各情形中欲最適當化之變數可以是,例如:浴組成、處理時間、進料流、電流參數、溫度、方法順序等。In the system of the present invention, each board can be processed by a different processing program. Since it is necessary to be able to handle most boards, the processing program requires very wide spectrally different processing parameters, for example, in a particularly suitable manner. The blind hole, the inner hole having a high length to diameter ratio, the surface having a particularly small deviation in layer thickness distribution, the base material having a poor conductive coating, and the like. The variables to be most suitably optimized in each case may be, for example, bath composition, processing time, feed stream, current parameters, temperature, method sequence, and the like.

為了達到最適當處理結果,該等工作件可以在數個處理模組中於x方向上,即,在一主要輸送方向上對齊,及/或於y方向上,即,相對該輸送方向橫交地對齊,及/或於z方向上,即,在一升/降方向上對齊。這可在該系統本身中發生,例如,在一處理模組中發生。或者它必須確使在該電路板一個未對齊後,在被移入該系統前,在該輸送裝置上且在該處理模組內之板引導裝置準確地作用,以便不超過一可容許公差。In order to achieve the most appropriate processing results, the workpieces may be aligned in the x direction, ie, in a main transport direction, and/or in the y direction, ie, transverse to the transport direction, in a plurality of processing modules. Aligned, and/or aligned in the z-direction, i.e., in a liter/lower direction. This can occur in the system itself, for example, in a processing module. Or it must be such that after a misalignment of the board, the board guiding means on the conveyor and within the processing module act accurately so that no tolerance is exceeded beyond that before being moved into the system.

圖式之說明Description of the schema

以下圖式將更詳細地說明本發明:第1圖是一抓握裝置之較佳特定實施例;第1A圖是通過一板狀工作件之示意截面圖;第2圖是沿第1圖之B-B的截面圖; 第3圖是沿第2圖之C-C的截面圖;第4圖是沿C-C通過第2圖所示之抓握裝置且於不同抓握階段中之截面圖;第5圖是本發明直立式系統之處理模組的示意俯視圖;第6圖是第5圖中之處理模組之截面的示意側視圖;第7圖是該抓握裝置之輸送裝置一部份在放置或拾取一工作件W時的示意側視圖;第8圖是具有一空氣動力殼體之第7圖中之輸送裝置的示意側視圖;第9圖是在一第一特定實施例中之處理模組結構的示意圖;第10圖是在一第二特定實施例中之處理模組結構的示意圖;第11圖是在一第三特定實施例中之處理模組結構的示意圖。The invention will be described in more detail in the following figures: Figure 1 is a preferred embodiment of a gripping device; Figure 1A is a schematic cross-sectional view through a plate-like workpiece; Figure 2 is a view along Figure 1. a cross-sectional view of BB; Figure 3 is a cross-sectional view taken along line CC of Figure 2; Figure 4 is a cross-sectional view of the gripping device shown in Figure 2 taken along CC and in different gripping stages; Figure 5 is a vertical system of the present invention; A schematic plan view of a processing module; FIG. 6 is a schematic side view of a cross section of the processing module of FIG. 5; and FIG. 7 is a portion of the conveying device of the gripping device when a working member W is placed or picked up Figure 8 is a schematic side view of the conveying device of Figure 7 with an aerodynamic housing; Figure 9 is a schematic view of the processing module structure of a first particular embodiment; The Figure is a schematic illustration of the structure of a processing module in a second particular embodiment; Figure 11 is a schematic illustration of the structure of a processing module in a third particular embodiment.

在所有圖式中,相同之符號表示相同之元件。In all the figures, the same symbols denote the same elements.

第1圖顯示本發明一抓握裝置10之較佳特定實施例,且一工作件W被該抓握裝置10抓握。這是一板狀工作件,例如一印刷電路箔。依據第1A圖,該工作件W具有一接觸側(第一側)WE,且它包括一內有效區域WN ,而該內有效區域WN 則藉虛線與一外邊緣區域WR 分開。該抓握裝置10包括一第一固結裝置20及一第二固結裝置30,且這些固結裝置20、30各包含第一扭力桿21、31及第二扭力桿22(第2圖)。 該等第二扭力桿在第1圖中看不到,因為它們被工作件W遮住。該等第一扭力桿21、31及該等第二扭力桿22更向上延伸且被扣持在一未顯示之安裝件中,並且形成該抓握裝置10之一部份。1 shows a preferred embodiment of a gripping device 10 of the present invention, and a workpiece W is grasped by the gripping device 10. This is a plate-like workpiece, such as a printed circuit foil. According to Fig. 1A, the work piece W has a contact side (first side) WE, and it includes an inner effective area W N , and the inner effective area W N is separated from an outer edge area W R by a broken line. The grasping device 10 includes a first consolidation device 20 and a second consolidation device 30, and each of the consolidation devices 20, 30 includes a first torsion bar 21, 31 and a second torsion bar 22 (Fig. 2) . These second torsion bars are not visible in Figure 1 because they are covered by the work piece W. The first torsion bars 21, 31 and the second torsion bars 22 extend further upwardly and are retained in a mounting member not shown and form part of the gripping device 10.

與第二夾持裝置(圖未示)一起夾持該工作件W之第一夾持裝置25、35被支持在該等第一扭力桿21、31上。The first holding devices 25, 35 that hold the work piece W together with the second holding device (not shown) are supported on the first torsion bars 21, 31.

該抓握裝置10之第一扭力桿21、31及第二扭力桿22與該第一夾持裝置25、35及第二夾持裝置26(第2圖)最好由不鏽鋼製成。The first torsion bars 21, 31 and the second torsion bar 22 of the gripping device 10 and the first clamping devices 25, 35 and the second clamping device 26 (Fig. 2) are preferably made of stainless steel.

第2圖顯示沿第1圖中之B-B的截面圖。一第一扭力桿21(以第一轉軸201為中心)及一第二扭力桿22(以第二轉軸202為中心)支持各個第一夾持裝置25與第二夾持裝置26,且所示之工作件W被夾持在這些夾持裝置25、26之間。Fig. 2 shows a cross-sectional view taken along line B-B in Fig. 1. A first torsion bar 21 (centered on the first shaft 201) and a second torsion bar 22 (centered on the second shaft 202) support the respective first clamping device 25 and the second clamping device 26, and are shown The work piece W is clamped between these holding devices 25, 26.

第3圖顯示沿第2圖中之C-C的截面圖。該第一夾持裝置25放置於該第一扭力桿21(以第一轉軸201為中心)上且該第二夾持裝置26放置在該第二扭力桿22(以第二轉軸202為中心)上。例如一導電箔之工作件W被夾持在兩夾持裝置之間,在第3圖中(如同在第1圖與第2圖中一般),所示之工作件W已完全被夾持。利用轉動該第一扭力桿21(以第一轉軸201為中心)或分別轉動該第二扭力桿22(以第二轉軸202為中心),該第一夾持裝置25與該第二夾持裝置26被移入關閉位置。在這關閉位置時,在所示例子中為平面之接觸面27平坦地抵靠在該工作件W之表面上。這表面係由在該工作件上之接觸平面WE形成,且該第二夾持裝置26之夾持面29 亦抵靠在該工作件上並在該工作件W上施加一夾持力。該第一夾持裝置25之外凸表面段係以符號28表示。Fig. 3 shows a cross-sectional view taken along line C-C in Fig. 2. The first clamping device 25 is placed on the first torsion bar 21 (centered on the first rotating shaft 201) and the second clamping device 26 is placed on the second torsion bar 22 (centered on the second rotating shaft 202) on. For example, a working piece W of a conductive foil is sandwiched between the two holding means, and in Fig. 3 (as in Figs. 1 and 2), the working piece W shown is completely clamped. The first clamping device 25 and the second clamping device are rotated by rotating the first torsion bar 21 (centered on the first rotating shaft 201) or respectively rotating the second torsion bar 22 (centered on the second rotating shaft 202) 26 is moved into the closed position. In this closed position, the planar contact surface 27 abuts flat against the surface of the workpiece W in the illustrated example. This surface is formed by the contact plane WE on the workpiece and the clamping surface 29 of the second clamping device 26 It also abuts against the work piece and exerts a clamping force on the work piece W. The convex surface section of the first clamping device 25 is indicated by reference numeral 28.

該抓握步驟之時序係以五個不同階段顯示於第4圖中,且該視圖對應於在第3圖中者。在該工作件W尚未被抓握之第一位置,兩夾持裝置25、26之任一者均未抵靠該工作件W之表面。藉由逆時針轉動該第一夾持裝置25,該外凸表面段28接近該工作件W之第一表面。在此同時,在所示之例子中,該第二夾持裝置26順時針轉動。在一第三轉動位置(C)時,由於該第一夾持裝置25已再逆時針轉動,該第一夾持裝置25之接觸面27抵靠該工作件W之第一表面。雖然該第二夾持裝置26亦已再順時針轉動,但是該第二夾持裝置26之夾持面29尚未抵靠該工作件W之第二表面。在該轉動位置(D)時,該夾持面29此時亦抵靠該工作件W之第二表面並在該工作件W上施加一夾持力。如果藉由施加一更大之轉動力(順時針;請參見箭號)使該第二夾持裝置26再轉動而離開該轉動位置,則該工作件W將會被拉伸(轉動位置E)。The timing of the gripping step is shown in Figure 4 in five different stages, and this view corresponds to in Figure 3. In the first position in which the work piece W has not been grasped, neither of the two holding devices 25, 26 abuts against the surface of the work piece W. The outer convex surface section 28 is adjacent to the first surface of the workpiece W by rotating the first clamping device 25 counterclockwise. At the same time, in the illustrated example, the second clamping device 26 rotates clockwise. In a third rotational position (C), since the first clamping device 25 has been rotated counterclockwise, the contact surface 27 of the first clamping device 25 abuts against the first surface of the workpiece W. Although the second clamping device 26 has also rotated clockwise, the clamping surface 29 of the second clamping device 26 has not yet abutted against the second surface of the workpiece W. In this rotational position (D), the clamping surface 29 also abuts against the second surface of the workpiece W and exerts a clamping force on the workpiece W. If the second clamping device 26 is rotated further away from the rotational position by applying a greater rotational force (clockwise; see arrow), the workpiece W will be stretched (rotation position E) .

為了更詳細地說明本發明之直立式系統,請參閱以下圖式,這些圖式以一示意方式重現該系統之個別組件。For a more detailed description of the upright system of the present invention, reference is made to the following figures which reproduce the individual components of the system in a schematic manner.

第5圖顯示一直立式系統之處理模組100之示意俯視圖。Figure 5 shows a schematic top view of the processing module 100 of the upright system.

該處理模組100包括一收納框架110,且該收納框架110是一基本框架105之組件,而該基本框架105係更詳細地顯示在第6圖中。該收納框架110係用以扣持該容器(未在第5 圖中更詳細地顯示),且在該容器中收納處理液體並且在該容器中發生一鍍敷處理。例如,它是由例如堅固之型材製成,且最好是由金屬製成,並且它可以固定地或可分離地連接於該基本框架之其餘部份。第5圖讓人可看到該處理模組100之內部,且亦可看到一支持框架120,並且支持框架120部份地位於一位在該容器中之工作件W上方並延伸環繞該容器之邊緣區域。該支持框架120係用以固持多數扣持裝置130(130.1、130.2)及一用以固持不同安裝零件之擺動框架140,而該等扣持裝置130(130.1、130.2)則扣持該工作件W。該支持框架來回地平行於該箭號P1 移動,因此,所有的模組組件及該工作件W亦隨著這移動而同步地移動,而這移動係利用一被支持在該收納框架110上之如氣壓缸等驅動器125來達成。該支持框架係透過軌道127移動,且該等軌道127係藉由調整裝置128準確地定位在一預定路徑上。該驅動器125之氣壓缸很小且相較於馬達驅動器,對通常大量存在一鍍敷容器於該浴表面與該蓋之間的蒸氣且對流體是不敏感的。此外,它們符合經濟效益。另外,它們使該被驅動支持框架120可到達預定終止位置。The processing module 100 includes a receiving frame 110, and the receiving frame 110 is a component of a basic frame 105, and the basic frame 105 is shown in more detail in FIG. The storage frame 110 is for holding the container (not shown in more detail in Fig. 5), and the processing liquid is accommodated in the container and a plating process is performed in the container. For example, it is made of, for example, a sturdy profile, and is preferably made of metal, and it may be fixedly or detachably attached to the remainder of the basic frame. FIG. 5 shows the inside of the processing module 100, and a support frame 120 is also visible, and the support frame 120 is partially located above a work piece W in the container and extends around the container. The edge area. The support frame 120 is configured to hold a plurality of holding devices 130 (130.1, 130.2) and a swing frame 140 for holding different mounting parts, and the holding devices 130 (130.1, 130.2) hold the working pieces W . The support frame moves back and forth parallel to the arrow P 1 , so that all the module components and the work piece W also move synchronously with the movement, and the mobile system is supported by the storage frame 110 This is achieved by a driver 125 such as a pneumatic cylinder. The support frame is moved through the track 127 and the tracks 127 are accurately positioned by a adjustment device 128 on a predetermined path. The pneumatic cylinder of the actuator 125 is small and compared to the motor drive, there is typically a large amount of vapor present between the bath surface and the lid of the plating vessel and is insensitive to fluids. In addition, they are economical. In addition, they enable the driven support frame 120 to reach a predetermined end position.

由於該支持框架120亦固持該擺動框架140,該擺動框架140亦會如同該支持框架120一般地平行於該箭號P1 來回移動。此外,該擺動框架140透過另一驅動器145朝一方向來回地移動,而該方向與該支持框架120之移動方向P1 呈直角地延伸。這移動方向係以另一箭號P2 表示。Since the support frame 120 also holds the pivot frame 140, the frame 140 will pivot the support frame 120 as generally parallel to the arrow P 1 moves back and forth. In addition, the pivot frame is moved back and forth 140,145 in one direction through the other driver, which a moving direction of the support frame 120 extending at right angles P 1. This direction of movement is indicated by another arrow P 2 .

該支持框架或該擺動框架140之驅動器125與145係氣 動地或電動地操作。The support frame or the drivers 125 and 145 of the swing frame 140 are gas Operate either electrically or electrically.

在該容器之內部,有一例如一印刷電路板之工作件W。該工作件W在該容器中利用扣持裝置130(130.1、130.2)被扣持於垂直方位上,且該等扣持裝置130抓握該工作件W之各個端部區域。第5圖顯示兩扣持裝置130,即,一抓握該工作件W之左緣的第一扣持裝置130.1,及一抓握該工作件W之右緣的第二扣持裝置130.2。該等扣持裝置130在該容器中亦如同該工作件W一般地被扣持於垂直方位上,且該等扣持裝置130各包含兩夾持指群135,且各夾持指群135在該工作件W被夾持時靠置於一邊緣側。該等夾持指群135各可以一樞接點為中心樞轉,因此,它們可以樞轉至一釋放位置及一夾持位置。為達此目的,有用以各致動一夾持指群135之驅動器137。這些驅動器137亦是以氣動操作,且在氣動力之作用下開啟或關閉,或者在氣動力之作用下開啟而在此情形下利用一預偏壓彈簧施加一關閉力。這表示即使動力失效,仍可保持該關閉力。Inside the container, there is a work piece W such as a printed circuit board. The workpiece W is held in the container by the fastening device 130 (130.1, 130.2) in a vertical orientation, and the fastening devices 130 grip the respective end regions of the workpiece W. Figure 5 shows two holding devices 130, i.e., a first holding device 130.1 that grips the left edge of the working member W, and a second holding device 130.2 that grips the right edge of the working member W. The holding device 130 is also held in the container in a vertical orientation as the working member W, and the holding devices 130 each include two clamping finger groups 135, and each clamping finger group 135 is The workpiece W is placed against an edge side when clamped. The gripping fingers 135 can each pivot about a pivot point so that they can be pivoted to a release position and a gripping position. To this end, it is useful to actuate a driver 137 that holds a finger group 135. These actuators 137 are also pneumatically operated and are opened or closed by aerodynamic forces or are actuated by aerodynamic forces, in which case a closing force is applied by a pre-biased spring. This means that the closing force can be maintained even if the power fails.

該等扣持裝置130係被該支持框架120扣持,這表示該等扣持裝置130且因此該等夾持指群135及該工作件W可透過該支持框架之來回移動來保持平行於該箭號方向P1 之持續移動。The fastening devices 130 are held by the support frame 120, which means that the fastening devices 130 and thus the clamping finger groups 135 and the working member W can be moved back and forth through the support frame to keep parallel to the The arrow direction P 1 continues to move.

此外,在該容器中之工作件W兩側上,有多數被該擺動框架140扣持之流出裝置150。由於該擺動框架140在箭號方向P1 且亦在箭號方向P2 上持續移動,故這些流出裝置150亦不斷這些方向上移動。由於箭號方向P1 上之移動的偏移 對應於該支持框架120及該工作件W之偏移,故在該工作件W與該等流出裝置150之間一直保持不變。此外,在該等流出裝置150與該工作件W之間發生一平行於其表面之相對移動,因此可獲得兩工作件表面之均勻衝擊。Further, on both sides of the workpiece W in the container, there are a plurality of outflow devices 150 that are held by the swing frame 140. Since the oscillating frame 140 continues to move in the arrow direction P 1 and also in the arrow direction P 2 , the outflow devices 150 also move in these directions. Since the offset of the movement in the direction of the arrow P 1 corresponds to the offset of the support frame 120 and the workpiece W, it remains unchanged between the workpiece W and the outflow devices 150. In addition, a relative movement parallel to the surface thereof occurs between the outflow device 150 and the workpiece W, so that a uniform impact of the surfaces of the two workpieces can be obtained.

在該容器外的是附加零件,即,如過濾器600之單元、如泵700之其他單元及用於如壓縮空氣、水等輔助介質500之連接構件。這些在一共同之位置處連接在該基本框架上,且它們最好位在該基本框架上該模組鄰接一維修通道之位置處。這些連接構件具有讓使用該介質之單元可輕易分離之連接部。Outside the container are additional components, i.e., units such as filter 600, other units such as pump 700, and connection members for auxiliary medium 500 such as compressed air, water, and the like. These are attached to the basic frame at a common location, and they are preferably located on the basic frame at a location where the module abuts a service access. These connecting members have a joint that allows the unit using the medium to be easily separated.

另亦可有多數未顯示之蓋,該等蓋在處理時覆蓋該處理模組或亦在它們未包含一工作件時覆蓋它們。為了覆蓋該處理模組,有一在該收納框架上自動開啟之蓋,且該蓋最好為一滑蓋並且最好是以氣動之方式被驅動。依此方,掉落之粒子將被排除在浴外,且欲被吸出之空氣體積減少。There may also be a plurality of unshown covers which cover the process module during processing or which also cover them when they do not contain a work piece. In order to cover the processing module, there is a cover that automatically opens on the receiving frame, and the cover is preferably a sliding cover and is preferably pneumatically driven. On this basis, the dropped particles will be excluded from the bath and the volume of air to be aspirated will decrease.

第6圖是以截面方式示意顯示一處理模組100之側視圖。該處理模組100包括一基本框架105,且該基本框架105之一部份是該收納框架110,並且該收納框架110位在該處理模組100之上方區域中,以固持,例如,該容器200。為達此目的,一收納型材115設置在該收納框架110上,且該收納型材115結合在容器200之具凸緣的邊緣中。因此,該容器200被懸吊在該收納框架110中。Figure 6 is a side view schematically showing a processing module 100 in cross section. The processing module 100 includes a basic frame 105, and a part of the basic frame 105 is the receiving frame 110, and the receiving frame 110 is located in an upper area of the processing module 100 for holding, for example, the container. 200. To this end, a receiving profile 115 is disposed on the receiving frame 110 and the receiving profile 115 is incorporated into the flanged edge of the container 200. Therefore, the container 200 is suspended in the storage frame 110.

此外,該支持框架120透過該等軌道127之引導而連接在該收納框架110上。因此,該容器200之熱膨脹不會影響 該支持框架120之定位或因此影響該模組100之其他組件。扣持裝置係連結在於此例中以夾持指群135代表之支持框架。另外,在此亦顯示平行於圖面來回移動之擺動框架140。一工作件W,例如,一印刷電路板,被該等夾持指群135抓握在其側邊之邊緣處。Further, the support frame 120 is coupled to the storage frame 110 by the guidance of the rails 127. Therefore, the thermal expansion of the container 200 does not affect The positioning of the support frame 120 or thus affects other components of the module 100. The fastening device is coupled to the support frame represented by the gripping finger group 135 in this example. In addition, a swing frame 140 that moves back and forth parallel to the plane of the drawing is also shown here. A work piece W, for example, a printed circuit board, is grasped by the pair of grip fingers 135 at the edges of its sides.

第7圖是一更詳細之示意圖,顯示在將一工作件W放置在該處理模組中或分別由該處理模組拾取時之輸送裝置,且未顯示該處理模組。Figure 7 is a more detailed schematic diagram showing the delivery device when a work piece W is placed in the process module or picked up by the process module, respectively, and the process module is not shown.

在第7圖之下方區域中顯示該工作件W,且其外邊界由實線表示且以一與一周邊外緣分開並以虛線顯示之內工作區域。該工作件W暫時同時地被該等夾持指群135與該等抓握裝置之夾持裝置25、35扣持,而該等夾持指群135僅以一夾持方式在側緣區域抓握該工作件W,以避免破壞一處理,且該等抓握裝置之夾持裝置25、35亦可在該頂與底緣接觸該工作件W以運輸它。The work piece W is shown in the lower area of Fig. 7, and its outer boundary is indicated by a solid line and is separated from the inner working edge by a peripheral edge and shown by a broken line. The workpiece W is temporarily held by the gripping fingers 135 and the gripping devices 25, 35 of the gripping devices at the same time, and the gripping fingers 135 are gripped in the side edge region only by a clamping manner. The work piece W is gripped to avoid breaking a process, and the gripping devices 25, 35 of the gripping devices can also contact the work piece W at the top and bottom edges to transport it.

該等夾持裝置25、35被可在該等處理模組上方移動之輸送頭300扣持,且該輸送頭300支持該抓握裝置之固結裝置20、30及其用以操作(轉動)該抓握裝置之驅動器。例如,該等固結裝置20、30之扭力桿21、31可以各種方式驅動,即,利用齒輪系統、槓桿系統、彈簧機構、馬達或氣動式驅動器。該驅動機構係可構成為當該等固結裝置20、30在關閉狀態時,使得該工作件W可藉助於一彈簧系統被扣持。為了釋放該工作件W,可致動與該彈簧力相反地作用的開啟驅動器。The clamping devices 25, 35 are held by a delivery head 300 that is movable over the processing modules, and the delivery head 300 supports the consolidation devices 20, 30 of the grasping device and their operation (rotation) The driver of the gripping device. For example, the torsion bars 21, 31 of the consolidation devices 20, 30 can be driven in a variety of ways, i.e., using a gear system, a lever system, a spring mechanism, a motor, or a pneumatic actuator. The drive mechanism can be configured such that when the consolidation devices 20, 30 are in the closed state, the workpiece W can be held by means of a spring system. In order to release the work piece W, an open drive acting opposite to the spring force can be actuated.

該輸送頭300包括一在其上方中央部之鳩尾引導構件310,且該鳩尾引導構件310被一橫樑350扣持。該橫樑350橫交地延伸在一排相鄰設置之處理模組上方,使得該輸送頭300可以在這整排處理模組上方移動。這表示該輸送頭300可以使該等固結裝置20、30下降至在這一排中之各處理模組中。如果這種多排處理模組以一矩陣方式一排在一排後方地設置,則該輸送頭300亦可以另外地朝垂直於該橫樑350方向之方向移動。該輸送裝置包括一用以達成此目的之運送小車(圖未示)。The delivery head 300 includes a dovetail guiding member 310 at a central portion thereof, and the dovetail guiding member 310 is held by a beam 350. The beam 350 extends transversely over a row of adjacent processing modules such that the head 300 can be moved over the entire row of processing modules. This means that the delivery head 300 can lower the consolidation devices 20, 30 into the various processing modules in this row. If the multi-row processing modules are arranged in a matrix in a row behind a row, the delivery head 300 can also be moved in a direction perpendicular to the direction of the beam 350. The delivery device includes a transport trolley (not shown) for this purpose.

第8圖顯示具有多數固結裝置20與其連結之輸送頭300,且多數扭力桿21、22利用夾持裝置25、26與該等固結裝置20連結,並且一空氣動力殼體360包圍該輸送頭300。該殼體完全包圍該輸送頭300且使已過濾之空氣由上方以一均勻之方式環繞該產品W流動,這表示不會有形成空氣渦流而導致污染之風險。一層流氣流不會被該殼體360破壞。Figure 8 shows a delivery head 300 having a plurality of consolidation devices 20 coupled thereto, and a plurality of torsion bars 21, 22 are coupled to the consolidation devices 20 by clamping devices 25, 26, and an aerodynamic housing 360 surrounds the delivery Head 300. The housing completely encloses the delivery head 300 and allows the filtered air to flow around the product W from above in a uniform manner, which means that there is no risk of contamination due to the formation of air turbulence. A layer of flowing air is not destroyed by the housing 360.

第9圖是在一第一特定實施例中之處理模組之配置的示意圖。這配置係有關於處理印刷電路板以清潔內孔,且該處理序列係:裝載、膨脹、沖洗、高錳酸鹽處理、沖洗、還原、沖洗、乾燥及卸載。Figure 9 is a schematic illustration of the configuration of a processing module in a first particular embodiment. This configuration relates to the processing of printed circuit boards to clean the inner bores, and the processing sequence is: loading, expansion, rinsing, permanganate treatment, rinsing, reduction, rinsing, drying, and unloading.

由俯視來看,各個處理模組係以獨立箱之形態顯示。一單一印刷電路板可以被收納在各處理模組中,且該等模組係配置成使它們互相相鄰設置且它們的窄端互相相對。因此,該等印刷電路板係平行於一主輸送方向(在圖頂部之 箭號P)被導入該模組中。這表示可以在同時處理許多電路板,且用以達成此目的且延伸在一排100R這些種類之模組(圖未示)上方之輸送裝置可以相當窄。From a top view, each processing module is displayed in the form of a separate box. A single printed circuit board can be housed in each processing module, and the modules are configured such that they are disposed adjacent to each other and their narrow ends are opposite each other. Therefore, the printed circuit boards are parallel to a main transport direction (at the top of the figure) The arrow P) is imported into the module. This means that many boards can be processed at the same time, and the transport means for achieving this purpose and extending over a row of 100R modules of this type (not shown) can be quite narrow.

此外,各排模組100R、100R'設置成使每兩模組排互相緊臨設置,且在兩排相鄰模組100R、100R'之間的是維修通道800。另外,在該等模組面向該維修通道800之側處,可設置多數附加零件(圖未示),且這些附加零件可輕易通達以進行維修。In addition, each row of modules 100R, 100R' is disposed such that each two module rows are disposed next to each other, and between the two rows of adjacent modules 100R, 100R' is a service channel 800. Additionally, at the side of the modules facing the service access 800, a number of additional components (not shown) may be provided and these additional components may be easily accessed for servicing.

在這特定實施例中,在一排模組中,有多數用以進行相同處理步驟之模組。因此,該等電路板被平行地降入各模組100R內,在此被處理且接著各被下降至一排位於相鄰模組100R'中之模組內。In this particular embodiment, there are a plurality of modules in a row of modules for performing the same processing steps. Thus, the boards are lowered into each module 100R in parallel, processed therein and then each dropped into a row of modules located in adjacent modules 100R'.

該等印刷電路板先被一在此未顯示之裝置移入該裝載站之各個模組中,接著,該等電路板由此藉由該輸送裝置由一排處理模組100R傳送至下一排處理模組100R'。在該等電路板已被傳送至該卸載站之模組內後,該等完成之電路板利用一未在此顯示之裝置由該系統中取出。The printed circuit boards are first moved into the various modules of the loading station by a device not shown here, and then the circuit boards are transferred from the processing module 100R to the next processing unit by the conveying device. Module 100R'. After the boards have been transferred to the module of the unloading station, the completed boards are removed from the system using a device not shown therein.

第10圖是該等處理模組之配置之第二特定實施例的示意圖。這配置係有關於處理印刷電路板以清潔內孔:裝載、膨脹、沖洗、高錳酸鹽處理、沖洗、還原、沖洗、無電解鍍銅、沖洗、乾燥、卸載。Figure 10 is a schematic illustration of a second particular embodiment of the configuration of the processing modules. This configuration relates to the processing of printed circuit boards to clean the inner bore: loading, expansion, rinsing, permanganate treatment, rinsing, reduction, rinsing, electroless copper plating, rinsing, drying, unloading.

如第9圖中之情形,只有一電路板被下降至各處理模組內。但是,在這第二特定實施例中之模組未被重覆地配置在與一主輸送方向P呈直角之多排模組100R、100R'中。該 等模組只有一個樣品供進行一個特定處理步驟,這表示一個電路板接著一個電路板被運送通過該直立式系統。由各個處理模組之配置可以看出該等電路板各以一蜿蜒曲折狀方式被運送通過該系統。As in the case of Figure 9, only one board is dropped into each processing module. However, the modules in this second particular embodiment are not repeatedly arranged in a plurality of rows of modules 100R, 100R' that are at right angles to a main transport direction P. The The module has only one sample for a specific processing step, which means that one board and then one board are transported through the upright system. It can be seen from the configuration of the various processing modules that the boards are each transported through the system in a meandering manner.

在這配置中,每兩排模組100R、100R'亦互相緊臨,使這兩排之間產生維修通道800。In this configuration, each of the two rows of modules 100R, 100R' are also in close proximity to one another such that a service channel 800 is created between the two rows.

第11圖顯示第9圖之一變化例,其中該等處理模組係相對於該主輸送方向P橫交地設置於多排模組100R、100R'且形成在處理模組之各種系列100F、100F'中的各排中。Figure 11 shows a variation of the ninth embodiment, wherein the processing modules are disposed transversely to the main transport direction P in the plurality of rows of modules 100R, 100R' and formed in various series 100F of the processing module, In each row in 100F'.

在此應了解的是在此所述之例子與實施例係僅用以說明且發明所屬技術領域中具有通常知識者可了解依此之各種修改與變化及在這申請案中所述之特徵的組合,並且可被包括在所述發明之精神與範圍內且在以申請專利範圍之範疇內。在此所述之所有刊物、專利與專利申請案在此加入作為參考。It is to be understood that the examples and embodiments described herein are merely illustrative and that those of ordinary skill in the art will recognize the various modifications and changes and the features described in the application. Combinations are included within the spirit and scope of the invention and are intended to be within the scope of the invention. All publications, patents and patent applications mentioned herein are hereby incorporated by reference.

10‧‧‧抓握裝置10‧‧‧grip device

20‧‧‧第一固結裝置20‧‧‧First consolidation device

21,31‧‧‧第一扭力桿21,31‧‧‧First torsion bar

22‧‧‧第二扭力桿22‧‧‧Second torsion bar

25,35‧‧‧第一夾持裝置25,35‧‧‧First clamping device

26‧‧‧第二夾持裝置26‧‧‧Second clamping device

27‧‧‧接觸面27‧‧‧Contact surface

28‧‧‧外凸表面段28‧‧‧Outer convex surface section

29‧‧‧夾持面29‧‧‧ clamping surface

30‧‧‧第二固結裝置30‧‧‧Second consolidation device

100‧‧‧處理模組100‧‧‧Processing module

105‧‧‧基本框架105‧‧‧Basic framework

110‧‧‧收納框架110‧‧‧ 收纳 frame

115‧‧‧收納型材115‧‧‧Storage profiles

120‧‧‧支持框架120‧‧‧Support framework

125‧‧‧驅動器125‧‧‧ drive

127‧‧‧軌道127‧‧‧ Track

128‧‧‧調整裝置128‧‧‧Adjustment device

130,130.1,130.2‧‧‧扣持裝置130, 130.1, 130.2‧‧‧ holding device

135‧‧‧夾持指群135‧‧‧ gripping group

137‧‧‧驅動器137‧‧‧ drive

140‧‧‧擺動框架140‧‧‧ swing frame

145‧‧‧驅動器145‧‧‧ drive

150‧‧‧流出裝置150‧‧‧ outflow device

200‧‧‧容器200‧‧‧ container

201‧‧‧第一轉軸201‧‧‧First shaft

202‧‧‧第二轉軸202‧‧‧second shaft

300‧‧‧輸送頭300‧‧‧ delivery head

310‧‧‧鳩尾引導構件310‧‧‧鸠尾导部件

350‧‧‧橫樑350‧‧‧ beams

360‧‧‧氣動殼體360‧‧‧Pneumatic housing

500‧‧‧輔助介質500‧‧‧Auxiliary media

600‧‧‧過濾器600‧‧‧Filter

700‧‧‧泵700‧‧‧ pump

800‧‧‧維修通道800‧‧‧Maintenance access

P‧‧‧主輸送方向P‧‧‧Main conveying direction

P1 ,P2 ‧‧‧移動方向P 1 , P 2 ‧‧‧ moving direction

W‧‧‧工作件;產品W‧‧‧Workpieces; products

WE‧‧‧接觸側(第一側)WE‧‧‧Contact side (first side)

WN ‧‧‧內有效區域WN W N ‧‧‧Active area W N

WR ‧‧‧外邊緣區域WR W R ‧‧‧Outer edge area W R

100R,100R'‧‧‧模組100R, 100R'‧‧‧ modules

100F,100F‧‧‧系列100F, 100F‧‧‧ series

第1圖是一抓握裝置之較佳特定實施例;第1A圖是通過一板狀工作件之示意截面圖;第2圖是沿第1圖之B-B的截面圖;第3圖是沿第2圖之C-C的截面圖;第4圖是沿C-C通過第2圖所示之抓握裝置且於不同抓握階段中之截面圖;第5圖是本發明直立式系統之處理模組的示意俯視圖;第6圖是第5圖中之處理模組之截面的示意側視圖; 第7圖是該抓握裝置之輸送裝置一部份在放置或拾取一工作件W時的示意側視圖;第8圖是具有一空氣動力殼體之第7圖中之輸送裝置的示意側視圖;第9圖是在一第一特定實施例中之處理模組結構的示意圖;第10圖是在一第二特定實施例中之處理模組結構的示意圖;第11圖是在一第三特定實施例中之處理模組結構的示意圖。Figure 1 is a preferred embodiment of a gripping device; Figure 1A is a schematic cross-sectional view through a plate-like workpiece; Figure 2 is a cross-sectional view taken along line BB of Figure 1; 2 is a cross-sectional view of CC; FIG. 4 is a cross-sectional view of CC according to the gripping device shown in FIG. 2 and in different gripping stages; FIG. 5 is a schematic view of a processing module of the vertical system of the present invention; a top view; Fig. 6 is a schematic side view of a cross section of the processing module in Fig. 5; Figure 7 is a schematic side view of a portion of the conveying device of the gripping device when a working member W is placed or picked up; and Figure 8 is a schematic side view of the conveying device of Figure 7 having an aerodynamic housing Figure 9 is a schematic diagram showing the structure of a processing module in a first specific embodiment; Figure 10 is a schematic diagram showing the structure of a processing module in a second specific embodiment; and Figure 11 is a third specific Schematic diagram of the structure of the processing module in the embodiment.

25‧‧‧第一夾持裝置25‧‧‧First clamping device

26‧‧‧第二夾持裝置26‧‧‧Second clamping device

27‧‧‧接觸面27‧‧‧Contact surface

28‧‧‧外凸表面段28‧‧‧Outer convex surface section

29‧‧‧夾持面29‧‧‧ clamping surface

W‧‧‧工作件W‧‧‧Workpieces

Claims (34)

一種用於工作件之鍍敷處理的直立式系統,該系統包含至少兩處理模組及至少一輸送裝置,其中用於該等工作件之扣持裝置係設置在該等處理模組中,且該至少一輸送裝置係用以運送至少一工作件至一處理模組且用以將該工作件傳送至在該處理模組中之該等扣持裝置,其中該輸送裝置包含至少一抓握裝置,該至少一抓握裝置扣持該工作件並具有至少一個別的固結裝置,並且每一固結裝置包含各與該工作件之一側連接之第一夾持裝置及第二夾持裝置,其中該等第一夾持裝置與該等第二夾持裝置兩者均可移動以抓握與釋放該等工作件,其中該至少一抓握裝置包含互相分開之至少二固結裝置,該等第一夾持裝置及第二夾持裝置中之每一者係可移動,因此於平行於其第一側夾持之期間,該工作件係拉伸於該等固結裝置之間。 An upright system for a plating process of a workpiece, the system comprising at least two processing modules and at least one conveying device, wherein a fastening device for the workpieces is disposed in the processing modules, and The at least one transport device is configured to transport at least one work piece to a process module and to transfer the work piece to the hold device in the process module, wherein the transport device includes at least one grip device The at least one gripping device holds the workpiece and has at least one other consolidation device, and each consolidation device includes a first clamping device and a second clamping device each connected to one side of the workpiece The first clamping device and the second clamping device are both movable to grasp and release the working members, wherein the at least one grasping device comprises at least two consolidation devices separated from each other, Each of the first clamping device and the second clamping device is movable such that the workpiece is stretched between the consolidation devices during clamping parallel to the first side thereof. 如申請專利範圍第1項之直立式系統,其中至少一與該工作件之一第一側連接之第一夾持裝置係設計與設置成使得該工作件之該第一側的位置係由該第一夾持裝置來界定,且其中至少一與該工作件之一第二側連接之第二夾持裝置係設計與設置成使得一夾持力可以由該第二夾持裝置施加在該工作件上。 The upright system of claim 1, wherein the at least one first clamping device connected to the first side of the working member is designed and arranged such that the position of the first side of the working member is a first clamping device is defined, and wherein at least one of the second clamping devices coupled to the second side of the workpiece is designed and arranged such that a clamping force can be applied by the second clamping device On the piece. 如申請專利範圍第2項之直立式系統,其中該等至少兩固結裝置係設計且設置成使它們在相對邊緣處抓握該工作件,並且在夾持期間施加朝向互相相反方向之拉伸 力在該工作件上。 The upright system of claim 2, wherein the at least two consolidation devices are designed and arranged such that they grip the workpiece at opposite edges and apply stretching in opposite directions during clamping The force is on the work piece. 如申請專利範圍第1、2或3項之直立式系統,其中一固結裝置之第一夾持裝置係可圍繞一第一轉軸轉動,且該固結裝置之第二夾持裝置係可圍繞一平行於該第一轉軸之第二轉軸轉動。 The upright system of claim 1, wherein the first clamping device of one of the consolidation devices is rotatable about a first axis of rotation and the second clamping device of the consolidation device is A second rotating shaft parallel to the first rotating shaft rotates. 如申請專利範圍第4項之直立式系統,其中該工作件之該第一側的位置係由該第一夾持裝置之一轉動位置來界定。 The upright system of claim 4, wherein the position of the first side of the workpiece is defined by a rotational position of the first clamping device. 如申請專利範圍第4項之直立式系統,其中相對該第一轉軸呈直角地產生之該第一夾持裝置的一區段之外部邊界的第一部份係外凸地彎曲,且該區段之外部邊界的第二部份係由一筆直之邊界線形成,且該邊界線係以正切之方式連接該外部邊界之第一部份。 The upright system of claim 4, wherein the first portion of the outer boundary of a section of the first clamping device that is produced at a right angle to the first rotating shaft is convexly curved, and the region The second portion of the outer boundary of the segment is formed by a straight boundary line that connects the first portion of the outer boundary in a tangential manner. 如申請專利範圍第6項之直立式系統,其中該第一部份係由一平行於該第一轉軸之外凸表面段形成,且該第二部份係由一抵靠該工作件之第一側之接觸面形成。 The upright system of claim 6, wherein the first portion is formed by a convex surface section parallel to the first rotating shaft, and the second portion is abutted against the working piece A contact surface on one side is formed. 如申請專利範圍第1、2或3項之直立式系統,其中該第二夾持裝置包含一設計成可將一夾持力傳送至該工作件之第二側的外凸夾持面。 The upright system of claim 1, wherein the second clamping device comprises a convex clamping surface designed to transmit a clamping force to the second side of the workpiece. 如申請專利範圍第4項之直立式系統,其中至少一固結裝置包含一扣持該第一夾持裝置且相對該第一轉軸為同軸之第一扭力桿,及至少一扣持該第二夾持裝置且相對該第二轉軸為同軸之第二扭力桿。 The upright system of claim 4, wherein the at least one consolidation device comprises a first torsion bar that holds the first clamping device and is coaxial with the first rotating shaft, and at least one of the second torsion bar A clamping device and a second torsion bar coaxial with respect to the second rotating shaft. 如申請專利範圍第9項之直立式系統,其中各包含一第 一夾持裝置與一第二夾持裝置之至少兩對夾持裝置係扣持在一固結裝置之一扭力桿對上,該扭力桿對包含該第一扭力桿與該第二扭力桿。 Such as the upright system of claim 9 of the patent scope, each of which contains a At least two pairs of clamping devices of a clamping device and a second clamping device are fastened to a pair of torsion bars of the consolidation device, the pair of torsion bars comprising the first torsion bar and the second torsion bar. 如申請專利範圍第1或2項之直立式系統,其中該抓握裝置係以對已過濾之空氣之流入有利之方式來設計。 The upright system of claim 1 or 2, wherein the gripping device is designed in a manner that is advantageous for the inflow of filtered air. 如申請專利範圍第1或2項之直立式系統,其中該扣持裝置係設計成使得由該扣持裝置扣持之該工作件的位置在該處理模組中是可調整的。 The upright system of claim 1 or 2, wherein the fastening device is designed such that the position of the workpiece held by the fastening device is adjustable in the processing module. 如申請專利範圍第1或2項之直立式系統,其中至少一處理模組具有以下結構特徵:a.一容器,用以收納處理流體;b.一基本框架,具有支持該容器之一收納框架;c.多數安裝零件;d.一支持框架,用以安裝可相對該工作件平面呈直角地移動之零件;e.一擺動框架,用以安裝可平行於該工作件平面移動之零件;f.附加零件;及g.用於該容器之多數蓋。 The upright system of claim 1 or 2, wherein at least one processing module has the following structural features: a. a container for receiving a processing fluid; b. a basic frame having a receiving frame for supporting the container ; c. a majority of the mounting parts; d. a support frame for mounting a component that is movable at right angles to the plane of the workpiece; e. a swinging frame for mounting a component that is movable parallel to the plane of the workpiece; Additional parts; and g. many covers for the container. 如申請專利範圍第13項之直立式系統,其中該支持框架係由該收納框架扣持而可移動。 The upright system of claim 13, wherein the support frame is movable by being held by the storage frame. 如申請專利範圍第14項之直立式系統,其中該容器未承擔任何靜止之工作。 For example, the upright system of claim 14 wherein the container does not assume any static work. 如申請專利範圍第13項之直立式系統,其中該支持框架 係可利用至少一氣動驅動器來移動。 Such as the upright system of claim 13 of the patent scope, wherein the support framework The system can be moved using at least one pneumatic actuator. 如申請專利範圍第13項之直立式系統,其中該支持框架在至少一方向上是可調整的。 The upright system of claim 13, wherein the support frame is adjustable in at least one direction. 如申請專利範圍第13項之直立式系統,其中該擺動框架係扣持在該支持框架上而可移動。 The upright system of claim 13, wherein the swing frame is movable on the support frame. 如申請專利範圍第13項之直立式系統,其中多數可平行於該工作件移動之安裝零件係由該擺動框架扣持。 The upright system of claim 13 wherein a plurality of mounting parts movable parallel to the workpiece are held by the swing frame. 如申請專利範圍第1或2項之直立式系統,其中至少一處理模組係設計成可僅在其中處理一單一工作件。 In the upright system of claim 1 or 2, at least one of the processing modules is designed to process only a single workpiece therein. 如申請專利範圍第1或2項之直立式系統,其中多數處理模組係以一類似矩陣之方式設置成多列與多排處理模組。 For example, in the vertical system of claim 1 or 2, most of the processing modules are arranged in a matrix-like manner in a multi-column and multi-row processing module. 如申請專利範圍第21項之直立式系統,其中該等處理模組具有一具相對縱向側之長形基本輪廓,且係設置成可使各個縱向側朝該等工作件之輸送方向延伸。 The upright system of claim 21, wherein the processing modules have an elongate basic profile on opposite longitudinal sides and are arranged such that each longitudinal side extends toward the conveying direction of the workpieces. 如申請專利範圍第21項之直立式系統,其中該等處理模組具有一具相對端面之長形基本輪廓,且每兩個處理模組係藉由該等端面互相相鄰設置。 The upright system of claim 21, wherein the processing modules have an elongated basic profile with opposite end faces, and each of the two processing modules is disposed adjacent to each other by the end faces. 如申請專利範圍第21項之直立式系統,其中至少一輸送裝置係設計成使該工作件可由一處理模組運送至任一其他處理模組。 The upright system of claim 21, wherein at least one of the transport devices is designed to be transportable by a processing module to any other processing module. 如申請專利範圍第1或2項之直立式系統,其中各處理模組係裝備成可進行自給自足之操作。 For example, the upright system of claim 1 or 2, wherein each processing module is equipped to be self-sufficient. 一種用於運送工作件至處理模組之方法,該工作件係由 一抓握裝置扣持在垂直方位上,其中各抓握裝置包含至少一固結裝置,且在該固結裝置上設有各與該工作件之一側連接之第一夾持裝置及第二夾持裝置,其中該等第一夾持裝置及該等第二夾持裝置係可移動以抓握與釋放該等工作件,且其中用以抓握該工作件之方法包含以下方法步驟:a.將該工作件運送至該處理模組;b.以一設置在該處理模組中之扣持裝置抓握該工作件;以及c.以該抓握裝置釋放該工作件;其中該抓握裝置包含互相分開之至少二固結裝置,個別的第一夾裝置及個別的第二夾持裝置將該工作件夾持於相對邊緣之適當位置且在夾持動作期間插入朝向互相相反方向之拉伸力於該工作件上,因此在平行於其第一側之夾持期間,一拉伸力係施加於該等固結裝置間之該工作件。 A method for transporting a work piece to a processing module, the work piece being a gripping device is fastened in a vertical orientation, wherein each gripping device comprises at least one consolidating device, and the first clamping device and the second connecting device are connected to one side of the working member a clamping device, wherein the first clamping device and the second clamping device are movable to grasp and release the working members, and wherein the method for grasping the working member comprises the following method steps: a Transporting the workpiece to the processing module; b. grasping the workpiece with a fastening device disposed in the processing module; and c. releasing the workpiece with the grip device; wherein the grip The device comprises at least two consolidation means separated from each other, the individual first clamping means and the individual second clamping means clamping the working piece at an appropriate position on the opposite edge and inserting in opposite directions during the clamping action An extension is applied to the workpiece such that during clamping parallel to the first side thereof, a tensile force is applied to the workpiece between the consolidation devices. 如申請專利範圍第26項之方法,其中該方法更包含用以致動該抓握裝置之以下方法步驟:i.移動該第一夾持裝置,使得該第一夾持裝置接管一接觸位置且因此界定該工作件之該第一側的位置;及ii.移動該第二夾持裝置,使得該第二夾持裝置接管一夾持位置,且因此與該至少一第一夾持裝置一起夾持該工作件於適當之位置;其中該第一夾持裝置係在該第二夾持裝置接管該 夾持位置前接管該接觸位置。 The method of claim 26, wherein the method further comprises the following method step of actuating the gripping device: i. moving the first clamping device such that the first clamping device takes over a contact position and thus Defining a position of the first side of the work piece; and ii. moving the second clamping device such that the second clamping device takes over a clamping position and thus is clamped with the at least one first clamping device The work piece is in a suitable position; wherein the first clamping device is in the second clamping device to take over the The contact position is taken before the clamping position. 如申請專利範圍第27項之方法,其中該抓握裝置包含至少兩分開之固結裝置,且該等至少兩固結裝置之個別的第一夾持裝置與個別的第二夾持裝置在相對邊緣之適當位置夾持該工作件,並且在夾持動作期間施加朝向互相相反方向之拉伸力在該工作件上。 The method of claim 27, wherein the gripping device comprises at least two separate consolidation devices, and wherein the respective first clamping devices of the at least two consolidation devices are opposite to the individual second clamping devices The workpiece is clamped at an appropriate position of the edge and a tensile force is applied to the workpiece in opposite directions during the clamping action. 如申請專利範圍第27或28項之方法,其中在進行方法步驟ii之後,該方法更包括以下方法步驟:iii.使該第一夾持裝置與該第二夾持裝置同步地移動,使得一拉伸力係平行於該工作件之該第一側施加在該工作件上。 The method of claim 27 or 28, wherein after performing the method step ii, the method further comprises the following method steps: iii. moving the first clamping device synchronously with the second clamping device such that A tensile force is applied to the workpiece parallel to the first side of the workpiece. 如申請專利範圍第26、27或28項之方法,其中該第一夾持裝置之移動與該第二夾持裝置之移動係轉動。 The method of claim 26, 27 or 28, wherein the movement of the first clamping device and the movement of the second clamping device rotate. 如申請專利範圍第30項之方法,其中該第一夾持裝置包含一平坦表面部份,且在方法步驟i中轉動直到該平坦表面部份到達該接觸位置為止。 The method of claim 30, wherein the first clamping device comprises a flat surface portion and is rotated in method step i until the flat surface portion reaches the contact position. 如申請專利範圍第26、27或28項之方法,其中在處理一工作件後,該抓握裝置移入該處理模組中以於此抓握該工作件,且一旦抓握該工作件,該抓握裝置便移出該處理模組。 The method of claim 26, 27 or 28, wherein after processing a workpiece, the gripping device is moved into the processing module to grip the workpiece, and once the workpiece is grasped, The gripping device moves out of the processing module. 申請專利範圍第26、27或28項之方法,其中該抓握裝置將該工作件放置在一處理模組中、將它釋放且接著移出該處理模組。 The method of claim 26, 27 or 28, wherein the gripping device places the workpiece in a processing module, releases it and then moves out of the processing module. 申請專利範圍第26、27或28項之方法,其中該工作件之 接觸側之位置係由該抓握裝置準確地傳送至該扣持裝置且由該扣持裝置接管。 The method of claim 26, 27 or 28, wherein the work piece The position of the contact side is accurately transmitted by the gripping device to the holding device and is taken over by the holding device.
TW097120910A 2007-06-06 2008-06-05 Vertical system for the plating treatment of a work piece and method for conveying the work piece TWI433967B (en)

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