TWI432735B - Probe unit structure and method of manufacturing the same - Google Patents

Description

Probe unit structure and manufacturing method thereof

The present invention relates to a probe structure for detection, and more particularly to a probe unit structure and a method of fabricating the same.

When manufacturing a semiconductor integrated circuit such as an IC chip, in order to detect a defective product, electrical characteristics are checked. Specifically, when a semiconductor integrated circuit or a liquid crystal panel is detected, the semiconductor product of the inspection target can be known. Whether there is electrical short circuit or disconnection in the wiring pattern of the body circuit; at the same time, in order to achieve electrical connection between the inspection target and the signal processing device for outputting the inspection signal, a probe for accommodating a plurality of conductive contact probes is used. The unit is electrically connected to the inspection object and the signal processing device, respectively.

The conventional probe unit, as shown in the first to second figures, mainly includes a corresponding upper positioning substrate 10 and a lower positioning substrate 20, and a fixing member 30 for spacing the upper positioning substrate 10 and the lower positioning substrate 20 by a distance. And a contact probe 40 disposed on the positioning substrate 10 and the lower positioning substrate 20, wherein the upper positioning substrate 10 is provided with an upper hole 101, and the lower positioning substrate 20 is provided with a lower hole 201 corresponding to the upper hole 101, the contact The probe 40 is first inserted into the upper hole 101 and positioned on the upper positioning substrate 10, and then the lower positioning substrate 20 is mounted, so that the contact probe 40 is inserted into the set position corresponding to the upper and lower holes 201. Thereby, the position of the contact probe 40 is restricted.

However, in recent years, there has been a remarkable progress in high-integration and miniaturization of semiconductor integrated circuits, and in order to cope with the progress of this technology, the diameter of each contact probe is also reduced in diameter. At the same time, the distance between the contact probes is narrowed; however, the smaller the diameter of the contact probe 40 is, the smaller the upper and lower holes 101 and 201 are, and the upper and lower slots 101 and 101 are smaller. The alignment between the 201 causes a slight error, which causes the contact probe 40 to be positioned on the upper positioning substrate 10, but cannot be placed on the lower positioning substrate 20, and the forced assembly will damage the contact probe 40; therefore, the contact When the diameter of the probe 40 is reduced, the conventional probe unit has great difficulty in fabrication and combination and cannot be broken.

In view of the above, the inventors of the present invention have made great efforts to solve the above problems by focusing on the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of development by the present inventors.

It is an object of the present invention to provide a probe unit structure and a method of fabricating the same, which are simple and convenient to fabricate a probe unit by reducing the diameter of the contact probe.

In order to achieve the above object, the present invention provides a probe unit structure, including: a probe unit structure, comprising: a first positioning substrate, a plurality of first pinholes; and a second positioning substrate, corresponding to a positioning substrate, the second positioning substrate is provided with a plurality of second pinholes corresponding to the first pinholes; a plurality of contact probes, each of the two ends of the contact probes being respectively connected to each of the first Needle a hole and each of the second pinholes; and a spacer member connected between the first positioning substrate and the second positioning substrate, the spacer is provided with a chamber for receiving the contact probes; The first positioning substrate is slidably moved relative to the second positioning substrate, so that the first pinholes and the second pinholes are offset, so that the two ends of each of the contact probes are respectively The first positioning substrate and the second positioning substrate are positioned.

In order to achieve the above object, the present invention provides a method for fabricating a probe unit, the method comprising: a) disposing the second positioning substrate above the first positioning substrate, and inserting each of the contact probes into each The first pinhole and the second pinhole; b) providing a raised fixture, the elevation fixture is raised from the second positioning substrate, and the first positioning substrate and the second positioning substrate are Forming a gap therebetween; c) placing the spacer between the first positioning substrate and the second positioning substrate, and forming the gap between the first positioning substrate and the second positioning substrate a chamber, and two ends of each of the contact probes are respectively respectively connected to the first pinholes and the second pinholes; d) providing a plurality of screwing elements, wherein the second positioning substrate transmits the respective a screwing member to lock the spacer; e) providing a plurality of locking members, the first positioning substrate being fixed to the spacer through each of the locking members; and f) temporarily releasing the locking members Moving from the first positioning substrate to the second positioning substrate, thereby making the first Such pinholes and pinholes through the second polarizer The positional relationship is such that the two ends of each of the contact probes are respectively positioned by the first positioning substrate and the second positioning substrate.

The invention also has the following effects: the invention is more likely to be bent under the force of the diameter-diameter contact probe, so that the first positioning substrate slides relative to the second positioning substrate, thereby making the first pinhole and the first pinhole The two pinholes have a misalignment relationship, so that the two ends of each contact probe are respectively deformed by the first positioning substrate and the second positioning substrate, so that each contact probe is fixed by the first positioning substrate. And between the second positioning substrate, and further, the diameter of the contact probe is reduced, and the probe unit is still simple and convenient, and has low cost.

In addition, the two ends of each contact probe are respectively deformed by the first positioning substrate and the second positioning substrate to locate the contact probe and avoid contact or falling contact of the contact probe during detection, thereby improving the structure of the probe unit of the present invention. Stability of use.

Moreover, the first positioning substrate and the second positioning substrate are stacked on each other at the time of fabrication, and a distance between the first positioning substrate and the second positioning substrate is formed by the elevation fixture, and the spacer is placed in the spacing and clamped. The first positioning substrate and the second positioning substrate are disposed to form a chamber for accommodating the contact probes. Compared with the prior art, the probe unit structure of the present invention has simple steps and easy assembly in fabrication and combination. The characteristics.

<知知〉

10‧‧‧Upper positioning substrate

101‧‧‧Upper slot

20‧‧‧ positioning substrate

201‧‧‧ lower hole slot

30‧‧‧Fixed components

40‧‧‧Contact probe

<this invention>

1‧‧‧First positioning substrate

11‧‧‧First inner insulation board

111‧‧‧Keyhole

12‧‧‧First outer insulation board

121‧‧‧buried holes

13‧‧‧First pinhole

2‧‧‧Second positioning substrate

21‧‧‧Second inner insulation board

211‧‧‧Keyhole

22‧‧‧Second outer insulation board

221‧‧‧ Burying holes

23‧‧‧Second pinhole

3‧‧‧Contact probe

31‧‧‧Detection Department

32‧‧‧Protruding

4‧‧‧ spacers

41‧‧ ‧ room

42‧‧‧ half-spaced board

421‧‧‧U-shaped slot

5‧‧‧ screw components

51‧‧‧ head

6‧‧‧Locking components

61‧‧‧ head

100‧‧‧First placement fixture

200‧‧‧Elevation fixture

300‧‧‧Second placement fixture

400‧‧‧Signal processing unit

S‧‧‧ spacing

The first figure is a schematic diagram of the combination of the conventional probe units.

The second figure is a partial enlarged view of the conventional probe unit.

The third figure is an exploded perspective view of the structure of the probe unit of the present invention.

The fourth figure is a schematic perspective view of the contact probe of the present invention.

The fifth figure is a schematic diagram of the combination of the probe unit structures of the present invention.

Figure 6 is a schematic cross-sectional view showing the structure of the probe unit of the present invention.

The seventh drawing is a flow chart of the steps of the method for fabricating the probe unit of the present invention.

The eighth figure A is a schematic view of the first positioning substrate, the second positioning substrate and the contact probe of the present invention to be placed on the first placement jig.

Figure 8B is a side cross-sectional view showing the first placement fixture and the first positioning substrate of the elevated fixture of the present invention.

Figure 8C is a side cross-sectional view of the second positioning substrate of the elevated fixture of the present invention.

The eighth figure D is a schematic view of the semi-spacer plate of the present invention to be inserted into the first positioning substrate and the second positioning substrate.

The eighth figure E is a schematic view of the second positioning fixture of the present invention to be fixed on the second positioning substrate and the spacer.

Figure 8 is a side cross-sectional view showing the second positioning fixture of the present invention fixed to the second positioning substrate and the spacer.

Figure 8 is a side cross-sectional view showing the first positioning substrate of the present invention flipped over the second positioning substrate.

Figure 8 is a side cross-sectional view of the first placement jig and the second placement jig of the present invention.

Figure 8 is a side cross-sectional view of the first positioning substrate of the present invention to be slid relative to the second positioning substrate.

Figure 8 is a side cross-sectional view showing the first pinhole and the second pinhole of the present invention in an offset configuration.

Figure 8 is a side cross-sectional view showing the first pinhole and the second pinhole of the present invention in an offset configuration.

Figure 8 is a side cross-sectional view showing the first positioning substrate of the present invention fixed to the spacer and the second positioning substrate.

The ninth drawing is a schematic view showing the state of use of the probe unit structure of the present invention.

The detailed description and technical content of the present invention will be described with reference to the accompanying drawings.

Referring to the third to sixth embodiments, the present invention provides a probe unit structure and a manufacturing method thereof. The probe unit structure mainly includes a first positioning substrate 1, a second positioning substrate 2, and a plurality of contact probes 3. And a spacer 4.

The first positioning substrate 1 includes a first inner insulating plate 11 and a first outer insulating plate 12 bonded to the first inner insulating plate 11. The first inner insulating plate 11 and the first outer insulating plate 12 are provided with a plurality of The first inner insulating plate 11 is provided with a plurality of locking holes 111, and the first outer insulating plate 12 is provided with a plurality of embedded holes 121 corresponding to the locking holes 111.

The second positioning substrate 2 is disposed corresponding to the first positioning substrate 1 , and the second positioning substrate 2 includes a second inner insulating plate 21 and a second outer insulating plate 22 adhered to the second inner insulating plate 21 , and a second inner insulating plate 21 and the second outer insulating plate 22 are provided with a plurality of second pinholes 23 corresponding to the first pinholes 13; further, the second inner insulating plate 21 is provided with a plurality of locking holes 211, and the second outer insulating plate 22 A plurality of buried holes 221 corresponding to the keyholes 211 are provided.

Each of the two ends of the contact probe 3 is respectively connected to each of the first pinholes 13 and the second pinholes 23, and each of the contact probes 3 has a detecting portion 31 at one end and a protruding portion 32 at the other end. The portion 31 is exposed to the first positioning substrate 1 via the first pinholes 13 , and the protruding portion 32 is locked to the second positioning substrate 2 via the second pin holes 23 .

The spacer 4 is connected between the first positioning substrate 1 and the second positioning substrate 2. As described in detail below, the first inner insulating plate 11 is interposed between the spacer 4 and the first outer insulating plate 12, and the second inner insulating plate 21 is sandwiched between the spacer 4 and the second outer insulating plate 22; the spacer 4 includes two semi-spaced plates 42 symmetrically combined, and the two half spacers 42 are sandwiched between the first positioning substrate 1 and the second positioning substrate 2. Each of the half spacers 42 is provided with a U-shaped recess 421. The two U-shaped recesses 421 are formed with a chamber 41 for receiving the contact probes 3.

The first positioning substrate 1 is slidably moved relative to the second positioning substrate 2, so that the first pinholes 13 and the second pinholes 23 are in a misaligned relationship, so that each contact probe 3 is The two ends are respectively positioned by the first positioning substrate 1 and the second positioning substrate 2, and the two ends of each contact probe 3 are respectively pressed and deformed by the first positioning substrate 1 and the second positioning substrate 2, thereby Each contact probe 3 is fixed between the first positioning substrate 1 and the second positioning substrate 2 by a cassette.

The present invention further includes a plurality of screwing elements 5, each of which has a head 51, the outer circumference of each head 51 being smaller than the aperture size of each of the embedded holes 221, and each of the screw elements 5 via each of the keyholes The second inner insulating plate 21 is locked to the spacer 4 , and each of the heads 51 is embedded in each of the embedded holes 221 .

The invention further comprises a plurality of locking elements 6, each locking element 6 having a head 61, the outer circumference of each head 61 being smaller than the aperture size of each of the embedded holes 121, and each locking element 6 via each keyhole 111 locks the first inner insulating plate 11 corresponding to the spacer 4, each head The portion 61 is embedded in each of the buried holes 121.

A combination of the probe unit structures of the present invention is provided with first first pinholes 13 by using the first positioning substrate 1; the second positioning substrate 2 is disposed corresponding to the first positioning substrate 1, and the second positioning substrate 2 is provided with corresponding first a second pinhole 23 of the pinhole 13; two ends of each of the contact probes 3 are respectively connected to the first pinholes 13 and the second pinholes 23; the spacers 4 are placed Between the positioning substrate 1 and the second positioning substrate 2; wherein the first positioning substrate 1 is slidably moved relative to the second positioning substrate 2, so that the first pinning holes 13 and the second pin holes 23 are generated. The eccentricity is such that the two ends of each contact probe 3 are respectively positioned by the first positioning substrate 1 and the second positioning substrate 2, and the two ends of each contact probe 3 are respectively positioned by the first positioning. The substrate 1 and the second positioning substrate 2 are pressed and deformed such that each contact probe 3 is fixed between the first positioning substrate 1 and the second positioning substrate 2 by the latch.

In this way, the diameter of each contact probe is reduced by the progress of the probe unit in order to increase the integration and miniaturization of the semiconductor integrated circuit. However, when the diameter of the contact probe is reduced, the probe unit is caused. In the production and combination, there is great difficulty and cannot be broken. In contrast, the contact probe 3 having a diameter of a small diameter is more likely to be bent under the force, so that the first positioning substrate 1 is opposite to the second positioning substrate 2 The sliding position is moved, so that the first pinholes 13 and the second pinholes 23 are disposed in a biased position, so that the two ends of each contact probe 3 are respectively positioned by the first positioning substrate 1 and the second positioning The substrate 2 is deformed by pressing, so that each contact probe 3 is fixed between the first positioning substrate 1 and the second positioning substrate 2 by the cassette, and then the diameter of the contact probe 3 is reduced to form a probe. The unit still has the advantages of simplicity, convenience and low cost.

Please refer to the seventh figure and the eighth diagrams A to L, which are the steps of the method for fabricating the above probe unit structure.

As shown in the steps a and 8A of the seventh embodiment, first, a first placement jig 100, a first positioning substrate 1, a second positioning substrate 2, and a plurality of contact probes 3 are provided. The fixture 100 sequentially positions the first positioning substrate 1, the second positioning substrate 2, and the plurality of contact probes 3. The first positioning substrate 1 is provided with a plurality of first pinholes 13, and the second positioning substrate 2 is provided with a corresponding one. a plurality of second pinholes 23 of the first pinholes 13 , the second positioning substrate 2 is disposed above the first positioning substrate 1 , and each of the contact probes 3 penetrates into each of the first pinholes 13 and each of the second pins a pinhole 23; wherein each of the contact probes 3 has a detecting portion 31 at one end and a protruding portion 32 at the other end, and the detecting portion 31 is exposed to the first positioning substrate 1 via each of the first pinning holes 13, and the protruding portion 32 is passed through each The second pinhole 23 is latched on the second positioning substrate 2; as described in detail below, the first positioning jig 100 positions the second positioning substrate 2 above the first positioning substrate 1; further, each contact probe 3, when penetrating into each of the first pinholes 13 and the second pinholes 23, the first placement jig 100 provides a space for each contact probe 3 to be The first pinholes 13 and the second pinholes 23 are received in the first placement jig 100, so that the protrusions 32 are locked to the second positioning substrate via the second pinholes 23 . 2, thereby locating the position of each contact probe 3.

As shown in the step b of the seventh figure and the eighth to eighth embodiments, in addition, an elevation fixture 200 is provided, and the elevation fixture 200 is raised from the lower side of the first placement fixture 100 to the second positioning substrate 2, A spacing S is formed between the first positioning substrate 1 and the second positioning substrate 2.

As shown in the steps c and VIII of the seventh figure, a spacer 4 is provided. The spacer 4 is divided into two symmetric spacers 42. Each of the spacers 42 is provided with a U-shaped slot 421, two U. The shaped grooves 421 together form a chamber 41; the two half spacers 42 are placed in the spacing S, and the two half spacers 42 are combined into a spacer 4 to sandwich the spacer 4 on the first positioning substrate 1 and Between the second positioning substrates 2, and the first positioning substrate 1 and A cavity 41 for accommodating the contact probes 3 is formed between the two positioning substrates 2, and two ends of each of the contact probes 3 are respectively connected to the first pinholes 13 and the second pinholes 23 respectively. .

As shown in the step d and the eighth D of the seventh figure, in addition, a plurality of screwing elements are provided, and the second positioning substrate 2 is locked to the spacer 4 via each of the screwing elements 5; The substrate 2 includes a second inner insulating plate 21 and a second outer insulating plate 22 bonded to the second inner insulating plate 21, and the second inner insulating plate 21 is sandwiched between the spacer 4 and the second outer insulating plate 22. The second inner insulating plate 21 and the second outer insulating plate 22 are provided with the second pinholes 23; each of the screw elements 5 has a head 51, and the second inner insulating plate 21 is provided with a plurality of pinholes 211. The second outer insulating plate 22 is provided with a plurality of embedded holes 221 corresponding to the respective locking holes 211. The diameter of each of the embedded holes 221 is larger than the outer peripheral edge of each of the heads 51, and each of the screwing elements 5 passes through the respective locking holes 211. The second inner insulating plate 21 is locked corresponding to the spacer 4 so that the head portions 51 are embedded in the respective buried holes 221.

As shown in step e and eighth E to G of the seventh figure, the present invention further includes a step e' before the e step, wherein a second placement jig 300 is provided in the e' step, and the second The first positioning substrate 2 is mounted and abuts against the contact probes 3, and the first placement jig 100 and the second placement jig 300 sandwich the first positioning substrate 1 and the second positioning. The substrate 2, the contact probes 3 and the spacers 4; the second positioning fixture 300 is configured to invert the first positioning substrate 1 via the second placement fixture 300 to be disposed above the second positioning substrate 2, and second The jig 300 is placed and the contact probes 3 are prevented from falling off the first pinholes 13 and the second pinholes 23; therefore, the second placement jig 300 is mounted on the second positioning substrate 2, and then By flipping the first positioning substrate 1 above the second positioning substrate 2, the elevation jig 200 can be disengaged to perform the following steps.

Furthermore, a plurality of locking elements 6 are provided. The first placement jig 100 is provided with a plurality of through holes, and each of the locking elements 6 uses the first through hole of the jig 100 to lock the first positioning substrate 1. The first positioning substrate 1 includes a first inner insulating plate 11 and a first outer insulating plate 12 adhered to the first inner insulating plate 11, and the first inner insulating plate 11 is clamped. Between the spacer 4 and the first outer insulating plate 12, the first inner insulating plate 11 and the first outer insulating plate 12 are jointly provided with the first pinholes 13; each of the locking elements 6 has a head 61. The first inner insulating plate 11 is provided with a plurality of locking holes 111. The first outer insulating plate 12 is provided with a plurality of embedded holes 121 corresponding to the respective locking holes 111. The diameter of each of the buried holes 121 is larger than that of each of the heads 61. The outer peripheral member has the first inner insulating plate 11 locked to the spacer 4 via the respective locking holes 111, and each of the head portions 61 is embedded in each of the embedded holes 121.

As shown in the step f and the eighth G to L of the seventh figure, the first placement jig 100 is removed by the elevation jig 200, and the first positioning substrate 1 and the second positioning substrate 2 are respectively locked via the locking component. 6 and the screwing element 5 are locked corresponding to the spacer 4; finally, the locking elements 6 are temporarily loosened, and the first positioning substrate 1 is slidably moved relative to the second positioning substrate 2, thereby making the first needles The hole 13 and the second pinholes 23 are in a misaligned relationship, so that the two ends of each contact probe 3 are respectively positioned by the first positioning substrate 1 and the second positioning substrate 2, as described in detail below. The two ends of the contact probe 3 are respectively deformed by the first positioning substrate 1 and the second positioning substrate 2, so that each contact probe 3 is fixed between the first positioning substrate 1 and the second positioning substrate 2 by the latching. Then, the second placement jig 300 is removed, that is, the probe unit structure is completed.

Therefore, the probe unit structure of the present invention and the method of fabricating the same can be obtained by the above-described structural composition. Therefore, the first positioning substrate 1 and the second positioning substrate 2 are stacked on each other at the time of fabrication, and the distance between the first positioning substrate 1 and the second positioning substrate 2 is formed by the elevation jig 200, and the interval is formed. The workpiece 4 is placed between the first positioning substrate 1 and the second positioning substrate 2 to form a chamber 41 for accommodating the contact probes 3; Compared with the prior art, the probe unit structure of the present invention has the characteristics of simple steps and easy assembly in fabrication and combination.

As shown in the ninth figure, the use state of the probe unit structure of the present invention, wherein the detecting portion 31 at one end of the contact probe 3 corresponds to the inspection object contact, and the other end of the touch probe 3 having the protruding portion 32 corresponds to the signal processing device. The electrical connection of the probe unit is electrically connected to the inspection object and the signal processing device 400 to achieve an electrical connection between the inspection target and the signal processing device 400 for outputting the inspection signal. In addition, the two ends of each contact probe 3 are respectively pressed and deformed by the first positioning substrate 1 and the second positioning substrate 2; thereby, the contact probe 3 is positioned to avoid contact or falling contact of the contact probe 3 during detection. Further, the stability of use of the probe unit structure of the present invention is improved.

In summary, the probe unit structure and the manufacturing method thereof of the present invention have not been seen in similar products and are openly used, and have industrial utilization, novelty and progress, and fully comply with the requirements for invention patent applications, and are proposed according to the patent law. To apply, please check and grant the patent in this case to protect the rights of the inventor.

1‧‧‧First positioning substrate

11‧‧‧First inner insulation board

12‧‧‧First outer insulation board

13‧‧‧First pinhole

2‧‧‧Second positioning substrate

21‧‧‧Second inner insulation board

22‧‧‧Second outer insulation board

23‧‧‧Second pinhole

3‧‧‧Contact probe

31‧‧‧Detection Department

32‧‧‧Protruding

4‧‧‧ spacers

41‧‧ ‧ room

42‧‧‧ half-spaced board

421‧‧‧U-shaped slot

Claims (19)

A probe unit structure includes: a first positioning substrate, and a plurality of first pinholes; a second positioning substrate corresponding to the first positioning substrate, the second positioning substrate is provided with a corresponding first wearing a plurality of second pinholes of the pinhole; a plurality of contact probes, each of the two ends of the contact probe being respectively connected to each of the first pinholes and the second pinholes; and a spacer connecting Between the first positioning substrate and the second positioning substrate, the spacer is provided with a chamber for accommodating the contact probes; wherein the first positioning substrate is slidably moved relative to the second positioning substrate, thereby The first pinholes and the second pinholes are offset, so that the two ends of each of the contact probes are respectively positioned by the first positioning substrate and the second positioning substrate. The probe unit structure of claim 1, wherein the two ends of each of the contact probes are respectively deformed by the first positioning substrate and the second positioning substrate, so that each of the contact probes is jammed. Fixed between the first positioning substrate and the second positioning substrate. The probe unit structure of claim 1, wherein each of the contact probes has a detecting portion at one end and a protruding portion, and the detecting portion is exposed to the first positioning substrate via each of the first pinning holes. The protruding portion is clamped to the second positioning substrate via each of the second pinholes. The probe unit structure of claim 1, wherein the spacer comprises a symmetrically combined two-half spacer, the two half spacers being sandwiched between the first positioning substrate and the second positioning Between the substrates, each of the half spacers is provided with a U-shaped recess, and the two U-shaped recesses form the chamber. The probe unit structure of claim 1, wherein the first positioning substrate comprises a first inner insulating plate and a first outer insulating plate adhered to the first inner insulating plate, the first inner insulating plate clamp The first inner insulating plate and the first outer insulating plate are disposed together with the first pinhole. The probe unit structure of claim 5, further comprising a plurality of locking elements, each of the locking elements having a head, the first inner insulating plate is provided with a plurality of locking holes, and the first outer insulating plate is provided a plurality of buried holes corresponding to the keyholes, each of the buried holes has an aperture size larger than an outer peripheral edge of each of the heads, and each of the locking elements corresponds to the first inner insulating plate via each of the locking holes The pieces are locked, and each of the heads is embedded in each of the buried holes. The probe unit structure of claim 1, wherein the second positioning substrate comprises a second inner insulating plate and a second outer insulating plate adhered to the second inner insulating plate, the second inner insulating plate clamp The second inner insulating plate and the second outer insulating plate are disposed together with the second pinhole. The probe unit structure of claim 7, further comprising a plurality of screw elements, each of the screw elements having a head, the second inner insulating plate being provided with a plurality of keyholes, the second outer insulating plate a plurality of buried holes corresponding to the keyholes, each of the buried holes having an aperture size larger than an outer peripheral edge of each of the heads, and each of the screwing elements respectively spacing the second inner insulating plate via the respective locking holes The pieces are locked, and each of the heads is embedded in each of the buried holes. A method for fabricating a probe unit according to claim 1, the method comprising: a) disposing the second positioning substrate above the first positioning substrate, and inserting each of the contact probes into the first a pinhole and each of the second pinholes; b) providing a raised fixture, the elevation fixture is raised above the second positioning substrate such that a spacing is formed between the first positioning substrate and the second positioning substrate; c) placing the spacer into the spacing Separating between the first positioning substrate and the second positioning substrate, the chamber is formed between the first positioning substrate and the second positioning substrate, and the two ends of each of the contact probes are respectively Providing a plurality of the first pinholes and each of the second pinholes; d) providing a plurality of screwing elements, the second positioning substrate is fixed to the spacer through each of the screwing elements; e) providing a plurality of a locking component, the first positioning substrate is fixed to the spacer through each of the locking components; and f) temporarily releasing the locking components, and sliding the first positioning substrate from the second positioning substrate Moving, so that the first pinholes and the second pinholes are in a misaligned relationship, so that the two ends of each of the contact probes are respectively sandwiched by the first positioning substrate and the second positioning substrate Positioning. The method of manufacturing the probe unit of claim 9, wherein a step of providing a first positioning fixture is provided in the step of positioning the second positioning substrate on the first positioning substrate. And the first placement jig is positioned to each of the contact probes to be disposed in each of the first pinholes and the second pinholes. The method of manufacturing the probe unit according to claim 10, wherein each of the contact probes has a detecting portion at one end and a protruding portion, and the detecting portion is exposed to the first positioning via each of the first pinholes. The substrate is clamped to the second positioning substrate via each of the second pinholes. The method of manufacturing the probe unit according to claim 9, wherein in the step c, the spacer is divided into two symmetric partition plates, and the two half spacers are placed in the spacing. The method for fabricating the probe unit according to claim 12, wherein each of the half spacers is provided There is a U-shaped pocket that forms the chamber. The method of manufacturing the probe unit of claim 9, wherein the second positioning substrate in the step d comprises a second inner insulating plate and a second outer insulating plate adhered to the second inner insulating plate, the first The second inner insulating plate is sandwiched between the spacer and the second outer insulating plate, and the second inner insulating plate and the second outer insulating plate are provided with the second pinhole. The method of manufacturing the probe unit of claim 14, wherein each of the screwing elements has a head, the second inner insulating plate is provided with a plurality of locking holes, and the second outer insulating plate is provided with a corresponding lock a plurality of holes, wherein each of the holes has a larger aperture size than each of the outer circumferences of the heads, and each of the screw elements locks the second inner insulating plate corresponding to the spacers through the respective locking holes, so that Each of the heads is embedded in each of the buried holes. The method of manufacturing the probe unit of claim 9, further comprising a step e' before the e step, wherein the e' step provides a second placement jig, the first positioning substrate via the second The placing fixture is turned over to be disposed above the second positioning substrate, and the second positioning fixture prevents the contact probes from falling off the first first pinholes and the second pinholes. The method of manufacturing the probe unit of claim 9, wherein the first positioning substrate comprises a first inner insulating plate and a first outer insulating plate adhered to the first inner insulating plate, wherein the first step An inner insulating plate is interposed between the spacer and the first outer insulating plate, and the first inner insulating plate and the first outer insulating plate are jointly provided with the first pinholes. The method of manufacturing the probe unit of claim 17, wherein each of the locking elements has a head, the first inner insulating plate is provided with a plurality of locking holes, and the first outer insulating plate is provided with a corresponding lock a plurality of holes, wherein each of the holes has an aperture size larger than an outer circumference of each of the heads, and each of the locking elements locks the first inner insulating plate to the spacer via the locking holes The second positioning substrate is embedded in each of the buried holes. The method of manufacturing the probe unit of claim 9, wherein each of the two ends of the contact probe in the step f is pressed and deformed by the first positioning substrate and the second positioning substrate, thereby making each contact The probe is fixed between the first positioning substrate and the second positioning substrate by a cassette.