TWI427757B - Light emitting diode package structure and related illuminate component and direct type emitting module and display device - Google Patents

Description

Light-emitting diode package structure, light-emitting component, direct-type light-emitting module and display device

The present invention relates to a light emitting diode package structure, and more particularly to a light emitting component, a direct type light emitting module and a display device which are improved in a package structure in which light is uniformly dispersed by a partition structure.

With the advancement of technology, the light-emitting diode is an indispensable light-emitting element in daily life, which has the advantages of power saving, long life, fast response and shock resistance. Whether it is daily indoor lighting, lights, street lights and traffic lights, it is a common application of light-emitting diodes.

Please refer to FIG. 1 , which is a partial structural diagram of a conventional light-emitting component. The light-emitting device 1 includes a light-emitting substrate 11 and a plurality of light-emitting diode packages 2 disposed on the light-emitting substrate 11. The light-emitting diode package 2 includes a light-emitting diode chip 21, a substrate 22, and a reflector. twenty four. The light-emitting diode chip 21 is disposed on the substrate 22, and the reflector 24 is surrounded by the periphery of the light-emitting diode wafer 21. The local light generated by the LED chip 21 (shown by the solid line in the figure) can be directly emitted from the LED chip 21, and the local light (shown by a broken line in the figure) is reflected by the reflector 24 indirectly. Shoot out.

However, still referring to FIG. 1, the effective illumination area provided by the light directly emitted from the LED chip 21 and indirectly reflected by the reflector 24 is relatively concentrated (as indicated by the elliptical dotted line in FIG. 1), so When sufficient light is supplied, it is necessary to increase the number of the light emitting diode package structures 2 to increase the area of the light exiting. However, in addition to the cost increase, such a design is densely arranged on the light emitting substrate 11 by the light emitting diode package. The structure 2, as a result, causes a problem that the light is excessively concentrated in the forward light-emitting direction of the light-emitting diode package structure 2, resulting in partial unevenness in brightness.

Therefore, how to provide a light-emitting diode package structure and a light-emitting component thereof, a direct-type light-emitting module, and a display device to improve illumination brightness, expand an illumination area, and uniform light have become one of important topics.

In view of the above problems, an object of the present invention is to provide a light emitting diode package structure and a light emitting component thereof, a direct type light emitting module, and a display device, which have the advantages of sufficient brightness, wide illumination area, and uniform light.

To achieve the above object, a light emitting diode package structure according to the present invention comprises at least two light emitting diode chips, a carrier, at least one partition structure and a reflector. The light-emitting diode chip is carried on the carrier; the partition structure is disposed on the carrier and located between the light-emitting diode wafers; and the reflector ring is disposed around the partition structure and the light-emitting diode wafer.

According to the present invention, a light emitting device includes a circuit substrate and a plurality of light emitting diode package structures, the light emitting diode package structure is electrically connected to the circuit substrate, and each of the light emitting diode package structures includes at least two light emitting devices. A diode chip, a carrier, at least one partition structure, and a reflector. The light-emitting diode chip is carried on the carrier; the partition structure is disposed on the carrier and located between the light-emitting diode wafers; the reflector ring is disposed around the partition structure and the light-emitting diode wafer.

Moreover, a direct-lit light-emitting module according to the present invention includes a bottom plate and at least one light-emitting component, and the light-emitting component is disposed on the bottom plate, wherein the light-emitting component has a circuit substrate and at least one light-emitting diode electrically connected to the circuit substrate Polar body package structure. The light emitting diode package structure comprises at least two light emitting diode chips, a carrier, at least one partition structure and a reflector; the light emitting diode chip is carried on the carrier, and the partition structure is disposed on the carrier and located Between the light-emitting diode wafers, and the reflector ring is disposed around the partition structure and the light-emitting diode wafer.

Moreover, a display device according to the present invention includes a display panel and at least one light emitting component disposed opposite to the display panel, wherein the light emitting component comprises a circuit substrate, a plurality of light emitting diode package structures, and a reflector, and the light emitting diode The body package structure is electrically connected to the circuit substrate, and each of the light emitting diode package structures comprises at least two light emitting diode chips, a carrier, at least one partition structure and a reflector. The light-emitting diode chip is carried on the carrier; the partition structure is disposed on the carrier and located between the light-emitting diode wafers; and the reflector ring is disposed around the partition structure and the light-emitting diode wafer.

In addition, a display device according to the present invention includes a display panel and a correspondingly disposed light-emitting module. The direct-lit light-emitting module has a bottom plate and at least one light-emitting component disposed on the bottom plate, and the light-emitting component has a circuit substrate and electricity. The plurality of LED packages are connected to the circuit substrate, wherein each of the LED packages comprises at least two LED chips, a carrier, at least one partition structure and a reflector, and the LEDs The wafer is carried on the carrier, and the partition structure is disposed on the carrier and located between the LED chips, and the reflector ring is disposed around the partition structure and the LED body.

According to the present invention, a light-emitting diode package structure and a light-emitting component thereof, a direct-type light-emitting module, and a display device according to the present invention are disposed between a reflector and a light-emitting diode by disposing a partition structure therebetween. Therefore, the light generated by the light-emitting diode can increase the angle of the emitted light through the reflection of the partition structure, so as to increase the illumination brightness, enlarge the illumination area and uniform light under the premise of using less light-emitting diodes. effect. Compared with the prior art, the light emitting diode package structure and the light emitting component thereof, the direct type light emitting module and the display device of the invention can evenly distribute the light and increase the illumination area, and at the same time save the light emitting diode. Use quantity to reduce costs.

Hereinafter, a light-emitting diode package structure and a light-emitting component thereof, a direct-type light-emitting module, and a display device according to a preferred embodiment of the present invention will be described with reference to the related drawings. The same elements will be described by the same symbols.

2A and FIG. 2B, FIG. 2A is a light emitting diode package structure of the present invention, and FIG. 2B is a top view of FIG. 2A. The LED package structure 3 disclosed in this embodiment includes at least two LED chips 31, a carrier 32, at least one partition structure 33, and a reflector 34. The light-emitting diode chip 31 is carried on the carrier 32; the partition structure 33 is disposed on the carrier 32 and located between the light-emitting diode chips 31, and the partition structure 33 is disposed near the light-emitting diode package structure. One end of the surface is wider and narrower at one end near the carrier 32; the reflector 34 is annularly disposed around the partition structure 33 and the LED wafer 31.

After the LED chip 31 is turned on, part of the light is directly emitted from the LED package structure 3, as shown by the solid line in FIG. 2A, and the local light is removed from the LED package by reflection. Structure 3, as shown by the dashed line in Figure 2A.

Carrier 32 can be a leadframe, substrate, or circuit board. For example, when the carrier 32 is a circuit board and receives a power source from the outside (not shown), since the carrier 32 and the LED chip 31 are electrically connected to each other, the carrier 32 can be controlled by the carrier 32. The switch of the light emitting diode chip 31.

The partition structure 33 and the reflector 34 may be made of a reflective material, wherein the reflective material may be selected from the group consisting of silver, aluminum, aluminum oxide, cerium oxide, and combinations thereof. Therefore, the partition structure 33 and the reflector 34 can be reflected by the reflective material so that the light generated by the LED chip 31 (shown by a broken line in FIG. 2A) can be sufficiently reflected to the outside, for example, the light emitting diode After the light generated by the body wafer 31 is generated, the light having a large angle of light emission can be reflected by the reflecting surface 341 of the reflector 34 to the outside, and the reflecting surface 331 of the partitioning structure 33 can be used to cause the light emitting diode chip 31 to be emitted. The angle can be greatly increased.

In addition, the partition structure 33 and the reflector 34 may be formed of a reflective material, and may be separately formed on the areas of the reflective surfaces 331, 341 by means of a reflection (not shown). The light of the polar body wafer 31 can be reflected after reaching such areas. Moreover, the size and shape of the reflecting surfaces 331 and 341 can be changed according to actual needs. Although the reflecting surfaces 331 and 341 are exemplified by a slope, the present invention is not limited. For example, the reflecting surfaces 331, 341 can be used. According to actual needs, at least one elliptical surface, at least one parabolic surface or a combination thereof.

In addition, the LED package structure 3 further includes an encapsulation material 35 covering the LED array 31 and the separation structure 33. The material of the encapsulating material 35 may be selected from the group consisting of epoxy, silicon, polymers, and combinations thereof. In order to enable the light generated by the LED chip 31 to be emitted to the outside, the encapsulating material 35 must have light transmissivity, and since the different LED chips 31 have different color lights, in order to adjust the color of the emitted light, the encapsulating material The phosphor 36a may be doped in the 35, and the diffuser 36b may be doped in the encapsulating material 35 to make the light exiting angle from the LED wafer 31 wider.

The LED package structure 3 can be as shown in FIGS. 3A and 3B, in addition to the above-described aspects, wherein the number of the LED chips 31 and the arrangement of the partition structures 33a, 33b shown in FIGS. 3A and 3B are also shown. Different from the above embodiments, for example, the number of the LED chips 31 in FIGS. 3A and 3B is three and four, respectively, and in fact, the number of the LED chips 31 can be practical. In addition, as for the arrangement of the light-emitting diode chips 31, the mutual alignment is referred to as an example, but in practical applications, the light-emitting diodes in the light-emitting diode package structures 3a and 3b are used. Wafer 31 is not limited to a symmetrical arrangement.

It is to be noted that the partition structures 33a, 33b shown in FIGS. 3A and 3B respectively divide the inner regions of the light emitting diode package structures 3a, 3b into three parts and four parts, and the partition structures 33a, 33b and the carriers Between 32, it can be assembled or spliced according to actual needs, and between the partition structures 33a, 33b and the reflector 34, the embodiment shown in FIGS. 3A and 3B is taken as an example, the partition structure 33a, 33b and its corresponding reflector 34 are integrally formed structures, but the spacers 33a, 33b may be bonded to the corresponding reflector 34 by adhesion or snapping as needed.

Of course, the LED package structures 3a, 3b in FIGS. 3A and 3B also include an encapsulation material 35, and are also doped with a phosphor 36a and a diffuser 36b.

Referring to FIG. 4 again, it is a schematic diagram of another LED package structure 3c according to a preferred embodiment of the present invention. The difference from the above-described light emitting diode package structure 3 is that the reflecting surface 331c of the partition structure 33c and the reflecting surface 341c of the reflector 34c of the present embodiment are curved surfaces. By the design of the curved surface, the light shape generated by the light-emitting diode package structure 3c is different from that of the light-emitting diode package structure 3 of the above embodiment, thereby achieving a multi-dimensional light-shaped design. . It should be noted that the reflective surfaces 331c and 341c of the curved surface may be concave or convex as needed, and are not limited herein.

In addition, the present invention further discloses a light-emitting component, wherein the light-emitting component can be a side-lighting light-emitting component or a direct-lighting light-emitting component. Hereinafter, FIG. 5 and FIG. 6 respectively illustrate different. The illuminating component aspect.

As shown in FIG. 5 , a light-emitting component 4 of the present invention includes a circuit substrate 41 and a plurality of LED packages 3 , and each of the LED packages 3 is electrically connected to the circuit substrate 41 . As shown in FIG. 2A, the LED package structure 3 includes at least two LED chips 31, a carrier 32, at least one partition structure 33, a reflector 34, and a package material 35. The package material 35 covers the light-emitting diodes. The polar body chip 31 and the partition structure 33. Since the LED package structure 3 has been described in detail above, it will not be described herein.

In this embodiment, the light-emitting component 4 can be, for example, a side-lighted light-emitting component, and the light-emitting shape generated by the light-emitting diode package structure 3 (shown by an elliptical dotted line in FIG. 5) is The distribution is distributed to both sides of the LED package structure 3, so that the light distribution generated by the entire illumination unit 4 is lighter than that of the conventional (Fig. 1) light distribution, and the light mixing distance can be effectively shortened.

In addition, the circuit substrate 41 is further provided with at least one wire (not shown) for controlling the switch of the LED chip 31.

FIG. 6 is another embodiment of the present invention. The embodiment of the present invention discloses a direct-type lighting module 5 including a bottom plate 51 and at least one light-emitting assembly 4. In the direct type light emitting module 5 shown in FIG. 6, the circuit substrate 41 of the light emitting unit 4 is disposed on the bottom plate 51. In other words, the light emitting diode package structure 3 on the circuit substrate 41 is connected to the bottom plate 51 by the circuit substrate 41. As shown in FIG. 2A, the LED package structure 3 includes at least two LED chips 31, a carrier 32, at least one partition structure 33, a reflector 34, and a packaging material 35. . The light-emitting diode package structure 3 and the light-emitting component 4 have been described in detail above, and details are not described herein again.

The material of the bottom plate 51 can be selected from the group consisting of metal, alloy, polymer, and combination thereof. In addition, the circuit substrate 41 corresponding to the light-emitting component 4 is integrated into a single circuit board, so that the direct-lit light can be simplified. Assembly process of module 5.

When the direct-lit light-emitting module 5 is turned on, since the light-emitting diode chip 31 generates heat energy at the same time, the generated heat energy can be dissipated by the bottom plate 51 having a better heat-dissipating effect, thereby ensuring the direct-lighting mode. Group 5 does not operate in a high temperature environment, and thus can help extend the life of the direct type lighting module 5 and ensure its reliability.

Referring to FIG. 7 , a display device 6 of the present invention includes a display panel 61 and a direct-lit LED module 5 . The direct-lit light-emitting module 5 is disposed opposite to the display panel 61. The direct-lit light-emitting module 5 has a bottom plate 51 and at least one light-emitting component 4 disposed on the bottom plate 51. The light-emitting component 4 has a circuit substrate 41 and The plurality of LED package structures 3, the circuit substrate 41 and the LED package structure 3 are electrically connected to each other. In more detail, the LED package structure 3 is as shown in FIG. 2A, and includes at least two illuminations. The diode chip 31, one or 32, at least one partition structure 33, a reflector 34, and an encapsulating material 35.

The display panel 61 shown in this embodiment can be a flat display panel. In other words, the display device 6 disclosed herein is a flat panel display. In addition, the display panel 61 can also be a liquid crystal display panel, in other words, The disclosed display device 6 is a liquid crystal display device (LCD). Therefore, please refer to FIG. 2A and FIG. 6 at the same time, because the light-emitting component 4 in the direct-lit lighting module 5 can use the partition structure 33 therein to make the light generated by the LED chip 31 (FIG. 2A). The light-emitting diode package structure 3 can have a wide light-emitting angle, so that the light-emitting diode package structure 3 can be emitted by the reflection surface 331 of the partition structure 33 and the reflection surface 341 of the reflector 34, respectively. In the case of the module 5, the light source provided to the display panel 61 can have characteristics of higher brightness and better uniformity, thereby improving the visual effect of the display device 6.

In summary, a light emitting diode package structure and a light emitting component thereof, a direct type light emitting module, and a display device according to the present invention are disposed in a reflector and interposed between the light emitting diodes, Therefore, the light generated by the light-emitting diode can increase the angle of the emitted light through the reflection of the partition structure, so as to increase the illumination brightness, enlarge the illumination area and uniform light under the premise of using less light-emitting diodes. The effect, at the same time, also saves the cost by saving the number of light-emitting diodes used.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1, 4. . . Illuminating component

11. . . Light-emitting substrate

2, 3, 3a, 3b, 3c. . . Light emitting diode package structure

21, 31. . . Light-emitting diode chip

twenty two. . . Substrate

24, 34, 34c. . . Reflector

32. . . vehicle

33, 33a, 33b, 33c. . . Separation structure

331, 331c, 341, 341c. . . Reflective surface

34, 34c. . . Reflector

35. . . Packaging material

36a. . . Phosphor

36b. . . Diffusion

41. . . Circuit substrate

5. . . Direct light module

51. . . Bottom plate

6. . . Display device

61. . . Display panel

1 is a schematic view showing a conventional light emitting diode package structure;

2A is a schematic diagram of a light emitting diode package structure according to a preferred embodiment of the present invention;

2B is a top plan view of a light emitting diode package structure according to FIG. 2A;

3A is a top plan view of a light emitting diode package structure in accordance with a preferred embodiment of the present invention;

3B is a top plan view of another LED package structure in accordance with a preferred embodiment of the present invention;

4 is a schematic view showing another LED package structure according to a preferred embodiment of the present invention;

5 is a schematic diagram of a side-emitting assembly according to a preferred embodiment of the present invention;

6 is a schematic diagram of a direct type light emitting module according to a preferred embodiment of the present invention;

FIG. 7 is a schematic diagram of a display device in accordance with a preferred embodiment of the present invention.

3. . . Light emitting diode package structure

31. . . Light-emitting diode chip

32. . . vehicle

33. . . Separation structure

331, 341. . . Reflective surface

34. . . Reflector

35. . . Packaging material

36a. . . Phosphor

36b. . . Diffusion

Claims (51)

A light emitting diode package structure comprising: at least two light emitting diode chips; a carrier, the light emitting diode chips are carried on the carrier; at least one partition structure disposed on the carrier and located at Between the light-emitting diode wafers; and a reflector disposed around the partition structure and the light-emitting diode wafers. The light emitting diode package structure of claim 1, wherein the partition structure is integrally formed with the reflector. The light emitting diode package structure according to claim 1, wherein the partition structure and the reflector are made of a reflective material. The light emitting diode package structure of claim 1, wherein the partition structure has at least one slope, at least one elliptical curved surface, at least one parabolic curved surface, or a combination thereof adjacent to the light emitting diode wafer. The light emitting diode package structure of claim 1, wherein the carrier is a lead frame, a substrate or a circuit board. The light emitting diode package structure of claim 1, further comprising: a packaging material covering the light emitting diode chips and the partition structure. The light-emitting diode package structure according to claim 6, wherein the package material is selected from the group consisting of epoxy resin, silicone rubber, polymer, and combinations thereof. The light emitting diode package structure of claim 6, wherein the package material is doped with a phosphor or a diffuser. A light-emitting component comprising: a circuit substrate; and a plurality of light-emitting diode package structures electrically connected to the circuit substrate, each of the light-emitting diode package structures comprising: at least two light-emitting diode chips; The light-emitting diode chip is disposed on the carrier; at least one partition structure is disposed on the carrier and located between the light-emitting diode wafers; and a reflector is disposed on the partition structure and The periphery of the light-emitting diode wafers. The illuminating assembly of claim 9, wherein the partition structure is integrally formed with the reflector. The illuminating assembly of claim 9, wherein the partition structure and the reflector are made of a reflective material. The light-emitting assembly of claim 9, wherein the partition structure has at least one slope, at least one elliptical curved surface, at least one parabolic curved surface, or a combination thereof adjacent to the light-emitting diode wafer. The illuminating assembly of claim 9, wherein the carrier is a lead frame, a substrate or a circuit board. The illuminating component of the ninth aspect of the invention, wherein the illuminating diode package further comprises: a packaging material covering the illuminating diode chip and the separating structure. The light-emitting component of claim 14, wherein the encapsulating material is selected from the group consisting of epoxy resins, silicones, polymers, and combinations thereof. The illuminating assembly of claim 14, wherein the encapsulating material is doped with a phosphor or a diffuser. A direct-lit light-emitting module includes: a bottom plate; and at least one light-emitting component disposed on the bottom plate, the light-emitting component having a circuit substrate and a plurality of light-emitting diode package structures electrically connected to the circuit substrate, The light emitting diode package structure includes: at least two light emitting diode chips; a carrier, the light emitting diode chips are carried on the carrier; at least one partition structure disposed on the carrier and located at the Between the light-emitting diode wafers; and a reflector disposed around the partition structure and the light-emitting diode wafers. The direct-type lighting module of claim 17, wherein the material of the bottom plate is selected from the group consisting of metals, alloys, polymers, and combinations thereof. The direct type light emitting module of claim 17, wherein the partition structure is integrally formed with the reflector. The direct type lighting module of claim 17, wherein the partition structure and the reflector are made of a reflective material. The direct-lit light-emitting module of claim 17, wherein the partition structure has at least one slope, at least one elliptical curved surface, at least one parabolic curved surface, or a combination thereof adjacent to the light-emitting diode wafer. The direct type lighting module of claim 17, wherein the carrier is a lead frame, a substrate or a circuit board. The direct-lit light-emitting module of claim 17, wherein each of the light-emitting diode packages further comprises: a packaging material covering the light-emitting diode chips and the partition structure. The direct-type lighting module of claim 23, wherein the encapsulating material is selected from the group consisting of epoxy resin, silicone rubber, polymer, and combinations thereof. The direct-lit light-emitting module of claim 23, wherein the encapsulating material is doped with a phosphor or a diffuser. The direct-type lighting module of claim 17, wherein the plurality of circuit boards corresponding to the plurality of light-emitting components are more integrated into a single circuit board. A display device includes: a display panel; and at least one light emitting component, opposite to the display panel, comprising: a circuit substrate; a plurality of light emitting diode package structures electrically connected to the circuit substrate, each of the light emitting The diode package structure includes: at least two light emitting diode chips; a carrier, the light emitting diode chips are carried on the carrier; at least one partition structure disposed on the carrier and located in the light emitting Between the diode wafers; and a reflector disposed around the spacer structure and the LED chips. The display device of claim 27, wherein the partition structure is integrally formed with the reflector. The display device of claim 27, wherein the partition structure and the reflector are made of a reflective material. The display device of claim 27, wherein the partition structure has at least one slope, at least one elliptical curved surface, at least one parabolic curved surface, or a combination thereof adjacent to the light emitting diode wafers. The display device of claim 27, wherein the carrier is a lead frame, a substrate or a circuit board. The display device of claim 27, wherein each of the light emitting diode package structures further comprises: a package material covering the light emitting diode chips and the partition structure. The display device of claim 32, wherein the encapsulating material is selected from the group consisting of epoxy resins, silicones, polymers, and combinations thereof. The display device of claim 32, wherein the encapsulating material is doped with a phosphor or a diffuser. The display device of claim 27, wherein the plurality of circuit boards corresponding to the plurality of light-emitting components are more integrated into a single circuit board. The display device of claim 27, wherein the light emitting module is further disposed on a bottom plate. The display device of claim 36, wherein the material of the bottom plate is selected from the group consisting of metals, alloys, polymers, and combinations thereof. The display device of claim 27, wherein the light emitting module is a direct type light emitting component or a side light emitting component. The display device according to claim 27, which is a liquid crystal display device. A display device includes: a display panel; and a direct-type light-emitting module, opposite to the display panel, the direct-lit light-emitting module has a bottom plate and at least one light-emitting component disposed on the bottom plate, the light-emitting component having A circuit substrate and a plurality of LED packages are electrically connected to the circuit substrate, and each of the LED packages comprises: at least two LED chips; and a carrier that carries the LEDs On the carrier; at least one partition structure disposed on the carrier and located between the LED chips; and a reflector disposed on the spacer structure and the LED chip around. The display device of claim 40, wherein the material of the bottom plate is selected from the group consisting of metals, alloys, polymers, and combinations thereof. The display device of claim 40, wherein the partition structure is integrally formed with the reflector. The display device of claim 40, wherein the partition structure and the reflector are made of a reflective material. The display device of claim 40, wherein the partition structure has at least one slope, at least one elliptical curved surface, at least one parabolic curved surface, or a combination thereof adjacent to the light emitting diode wafer. The display device of claim 40, wherein the carrier is a lead frame, a substrate or a circuit board. The display device of claim 40, wherein each of the light emitting diode package structures further comprises: a packaging material covering the light emitting diode chips and the partition structure. The display device of claim 46, wherein the encapsulating material is selected from the group consisting of epoxy resins, silicones, polymers, and combinations thereof. The display device of claim 46, wherein the encapsulating material is doped with a phosphor or a diffuser. The display device of claim 40, wherein the plurality of circuit boards corresponding to the plurality of light-emitting components are more integrated into a single circuit board. A display device according to claim 40, which is a liquid crystal display device. A display device according to claim 40, which is a flat display device.