TWI425031B - A compound containing silicon, a hardened composition and a hardened product - Google Patents
A compound containing silicon, a hardened composition and a hardened product Download PDFInfo
- Publication number
- TWI425031B TWI425031B TW097114901A TW97114901A TWI425031B TW I425031 B TWI425031 B TW I425031B TW 097114901 A TW097114901 A TW 097114901A TW 97114901 A TW97114901 A TW 97114901A TW I425031 B TWI425031 B TW I425031B
- Authority
- TW
- Taiwan
- Prior art keywords
- compound
- group
- carbon atoms
- parts
- decane
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title claims description 212
- 239000000203 mixture Substances 0.000 title claims description 84
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 93
- 229910052707 ruthenium Inorganic materials 0.000 claims description 81
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 57
- 125000004432 carbon atom Chemical group C* 0.000 claims description 44
- 239000003054 catalyst Substances 0.000 claims description 35
- 125000001931 aliphatic group Chemical group 0.000 claims description 22
- 238000005984 hydrogenation reaction Methods 0.000 claims description 16
- 125000000304 alkynyl group Chemical group 0.000 claims description 15
- 125000003342 alkenyl group Chemical group 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 8
- 125000002947 alkylene group Chemical group 0.000 claims description 7
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 7
- 235000021003 saturated fats Nutrition 0.000 claims description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- -1 2-hexyl Chemical group 0.000 description 143
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 78
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 48
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 40
- 239000002904 solvent Substances 0.000 description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 33
- 125000002015 acyclic group Chemical group 0.000 description 31
- 125000004122 cyclic group Chemical group 0.000 description 31
- 239000000243 solution Substances 0.000 description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 27
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 21
- 229910052697 platinum Inorganic materials 0.000 description 20
- 239000002994 raw material Substances 0.000 description 20
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 16
- 238000005227 gel permeation chromatography Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 13
- 229910052731 fluorine Inorganic materials 0.000 description 13
- 239000011737 fluorine Substances 0.000 description 13
- 125000003545 alkoxy group Chemical group 0.000 description 12
- 238000004458 analytical method Methods 0.000 description 12
- 125000005843 halogen group Chemical group 0.000 description 12
- 229920001296 polysiloxane Polymers 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 238000006482 condensation reaction Methods 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 8
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 8
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 8
- KEPBYTKEUAZWQU-UHFFFAOYSA-N ClC(C(C)(C)Cl)CCCCCCCC Chemical compound ClC(C(C)(C)Cl)CCCCCCCC KEPBYTKEUAZWQU-UHFFFAOYSA-N 0.000 description 8
- 229910052797 bismuth Inorganic materials 0.000 description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 8
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 8
- 229910052794 bromium Inorganic materials 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 8
- 229910052801 chlorine Inorganic materials 0.000 description 8
- 229910052740 iodine Inorganic materials 0.000 description 8
- 239000011630 iodine Substances 0.000 description 8
- AOJFQRQNPXYVLM-UHFFFAOYSA-N pyridin-1-ium;chloride Chemical compound [Cl-].C1=CC=[NH+]C=C1 AOJFQRQNPXYVLM-UHFFFAOYSA-N 0.000 description 8
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- 238000006460 hydrolysis reaction Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000002243 precursor Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- GCZWJRLXIPVNLU-UHFFFAOYSA-N 2,2-dimethoxy-3-methylundecane Chemical compound CC(C(OC)(OC)C)CCCCCCCC GCZWJRLXIPVNLU-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 229910003471 inorganic composite material Inorganic materials 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- ULYZAYCEDJDHCC-UHFFFAOYSA-N isopropyl chloride Chemical compound CC(C)Cl ULYZAYCEDJDHCC-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical class CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 5
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 5
- 230000007062 hydrolysis Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- ANBBCZAIOXDZPV-UHFFFAOYSA-N 1,1,1-trimethoxy-2-methyldecane Chemical compound CC(C(OC)(OC)OC)CCCCCCCC ANBBCZAIOXDZPV-UHFFFAOYSA-N 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- XIPZIJBBZXOVGJ-UHFFFAOYSA-N ClC(C(C1=CC=CC=C1)(C1=CC=CC=C1)Cl)CCCCCCCC Chemical compound ClC(C(C1=CC=CC=C1)(C1=CC=CC=C1)Cl)CCCCCCCC XIPZIJBBZXOVGJ-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 229910000420 cerium oxide Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 4
- 229920002098 polyfluorene Polymers 0.000 description 4
- 229910052703 rhodium Inorganic materials 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- JKXQKGNGJVZKFA-UHFFFAOYSA-N 1-chloro-3-methylbut-2-ene Chemical compound CC(C)=CCCl JKXQKGNGJVZKFA-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000003980 solgel method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- FQQZGTRQZYMHCK-UHFFFAOYSA-N 1,1,1-triethoxytetradecane Chemical compound C(C)OC(CCCCCCCCCCCCC)(OCC)OCC FQQZGTRQZYMHCK-UHFFFAOYSA-N 0.000 description 2
- XPEXLDNYKCZKEH-UHFFFAOYSA-N 1,1,1-triethoxyundecane Chemical compound C(CCCCCCCCC)C(OCC)(OCC)OCC XPEXLDNYKCZKEH-UHFFFAOYSA-N 0.000 description 2
- LDHDFQDAIRQGPL-UHFFFAOYSA-N 1,1,1-trimethoxydodecane Chemical compound CCCCCCCCCCCC(OC)(OC)OC LDHDFQDAIRQGPL-UHFFFAOYSA-N 0.000 description 2
- GDDPLWAEEWIQKZ-UHFFFAOYSA-N 1,1-diethoxydecane Chemical compound CCCCCCCCCC(OCC)OCC GDDPLWAEEWIQKZ-UHFFFAOYSA-N 0.000 description 2
- ZNRPUQQOHLCOMC-UHFFFAOYSA-N 10,10,10-triethoxydecylbenzene Chemical compound C(C)OC(CCCCCCCCCC1=CC=CC=C1)(OCC)OCC ZNRPUQQOHLCOMC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QNGUFVBAHBNZGW-UHFFFAOYSA-N C(C)C(C(OC)(OC)CC)CCCCCCCC Chemical compound C(C)C(C(OC)(OC)CC)CCCCCCCC QNGUFVBAHBNZGW-UHFFFAOYSA-N 0.000 description 2
- AEPHJJCJSZQPJB-UHFFFAOYSA-N C(C)C(CCCCCCCCCOC)(CC)CC Chemical compound C(C)C(CCCCCCCCCOC)(CC)CC AEPHJJCJSZQPJB-UHFFFAOYSA-N 0.000 description 2
- ZTQDAIKZKAWDNI-UHFFFAOYSA-N C(C)C(CCCCCCCCCOCC)(CC)CC Chemical compound C(C)C(CCCCCCCCCOCC)(CC)CC ZTQDAIKZKAWDNI-UHFFFAOYSA-N 0.000 description 2
- ZVNOCJFSWARJSC-UHFFFAOYSA-N C(C)OC(CCCCCCCCCCCCCCCCC)(OCC)OCC Chemical compound C(C)OC(CCCCCCCCCCCCCCCCC)(OCC)OCC ZVNOCJFSWARJSC-UHFFFAOYSA-N 0.000 description 2
- QDDRKJQCLSJQGR-UHFFFAOYSA-N C(CCC)C(CCCCCCCCCOC)(CCCC)CCCC Chemical compound C(CCC)C(CCCCCCCCCOC)(CCCC)CCCC QDDRKJQCLSJQGR-UHFFFAOYSA-N 0.000 description 2
- NJZNKLXLNZAMIL-UHFFFAOYSA-N C(CCC)C(CCCCCCCCCOCC)(CCCC)CCCC Chemical compound C(CCC)C(CCCCCCCCCOCC)(CCCC)CCCC NJZNKLXLNZAMIL-UHFFFAOYSA-N 0.000 description 2
- YTRFOEIONLYOGA-UHFFFAOYSA-N C(CCCCCCC)C(C(OC)(OC)CCCCCCCC)CCCCCCCC Chemical compound C(CCCCCCC)C(C(OC)(OC)CCCCCCCC)CCCCCCCC YTRFOEIONLYOGA-UHFFFAOYSA-N 0.000 description 2
- MKHOIPZKJVAHSE-UHFFFAOYSA-N C(CCCCCCC)C(CCCCCCCCCOCC)(CCCCCCCC)CCCCCCCC Chemical compound C(CCCCCCC)C(CCCCCCCCCOCC)(CCCCCCCC)CCCCCCCC MKHOIPZKJVAHSE-UHFFFAOYSA-N 0.000 description 2
- RFQJUXFODPAHQH-UHFFFAOYSA-N C1(=CC=CC=C1)C(CCCCCCCCCOC)(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C(CCCCCCCCCOC)(C1=CC=CC=C1)C1=CC=CC=C1 RFQJUXFODPAHQH-UHFFFAOYSA-N 0.000 description 2
- SOKCRYXJCGOICF-UHFFFAOYSA-N C1(=CC=CC=C1)C(CCCCCCCCCOCC)(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C(CCCCCCCCCOCC)(C1=CC=CC=C1)C1=CC=CC=C1 SOKCRYXJCGOICF-UHFFFAOYSA-N 0.000 description 2
- UFMSZRQLWSQSKZ-UHFFFAOYSA-N CC(C(OCC)(C1=CC=CC=C1)C1=CC=CC=C1)CCCCCCCC Chemical compound CC(C(OCC)(C1=CC=CC=C1)C1=CC=CC=C1)CCCCCCCC UFMSZRQLWSQSKZ-UHFFFAOYSA-N 0.000 description 2
- HKJPCMWQYWJUNR-UHFFFAOYSA-N CC(CCCCCCCCC)(OC)C1=CC=CC=C1 Chemical compound CC(CCCCCCCCC)(OC)C1=CC=CC=C1 HKJPCMWQYWJUNR-UHFFFAOYSA-N 0.000 description 2
- COQYUAJAXLUAHF-UHFFFAOYSA-N CC(CCCCCCCCCOC)(C)C Chemical compound CC(CCCCCCCCCOC)(C)C COQYUAJAXLUAHF-UHFFFAOYSA-N 0.000 description 2
- ICLWANDVDRTPBG-UHFFFAOYSA-N CC(CCCCCCCCCOCC)(C)C Chemical compound CC(CCCCCCCCCOCC)(C)C ICLWANDVDRTPBG-UHFFFAOYSA-N 0.000 description 2
- ZCRHCHOHWXDDGH-UHFFFAOYSA-N CCCCCCCCCCC(OC)(OC)OC Chemical compound CCCCCCCCCCC(OC)(OC)OC ZCRHCHOHWXDDGH-UHFFFAOYSA-N 0.000 description 2
- IBIXXFBZCUOZRT-UHFFFAOYSA-N CCCCCCCCCCCC(OCC)(OCC)OCC Chemical compound CCCCCCCCCCCC(OCC)(OCC)OCC IBIXXFBZCUOZRT-UHFFFAOYSA-N 0.000 description 2
- LHJDJCSZEZUXFR-UHFFFAOYSA-N COC(CCCCCCCCCC1=CC=CC=C1)(OC)OC Chemical compound COC(CCCCCCCCCC1=CC=CC=C1)(OC)OC LHJDJCSZEZUXFR-UHFFFAOYSA-N 0.000 description 2
- YWEKAQXJRFUJOY-UHFFFAOYSA-N COC(CCCCCCCCCCCCCCCCC)(OC)OC Chemical compound COC(CCCCCCCCCCCCCCCCC)(OC)OC YWEKAQXJRFUJOY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- DVYUOQXRGHUWKE-UHFFFAOYSA-N dimethyl(2-phenylethoxy)silane Chemical compound C[SiH](C)OCCC1=CC=CC=C1 DVYUOQXRGHUWKE-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- UJVSKHIESAQKJB-UHFFFAOYSA-N platinum prop-2-enoic acid Chemical group C(C=C)(=O)O.[Pt] UJVSKHIESAQKJB-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 125000002328 sterol group Chemical group 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 229910052902 vermiculite Inorganic materials 0.000 description 2
- 239000010455 vermiculite Substances 0.000 description 2
- 235000019354 vermiculite Nutrition 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- CWZQYRJRRHYJOI-UHFFFAOYSA-N 1,1,1-trimethoxydecane Chemical compound CCCCCCCCCC(OC)(OC)OC CWZQYRJRRHYJOI-UHFFFAOYSA-N 0.000 description 1
- GFBUBCGICDOUBE-UHFFFAOYSA-N 1,1,1-trimethoxytetradecane Chemical compound CCCCCCCCCCCCCC(OC)(OC)OC GFBUBCGICDOUBE-UHFFFAOYSA-N 0.000 description 1
- PMQKLFXPMYQZBX-UHFFFAOYSA-N 1,1-diphenyldecan-1-ol Chemical compound C=1C=CC=CC=1C(O)(CCCCCCCCC)C1=CC=CC=C1 PMQKLFXPMYQZBX-UHFFFAOYSA-N 0.000 description 1
- UYVWNPAMKCDKRB-UHFFFAOYSA-N 1,2,4,5-tetraoxane Chemical compound C1OOCOO1 UYVWNPAMKCDKRB-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- KQGABGXGOVCINQ-UHFFFAOYSA-N 1-ethoxydecylbenzene Chemical compound CCCCCCCCCC(OCC)C1=CC=CC=C1 KQGABGXGOVCINQ-UHFFFAOYSA-N 0.000 description 1
- HSTCJLDQVIIDKF-UHFFFAOYSA-N 1-phenyldecylbenzene Chemical compound C=1C=CC=CC=1C(CCCCCCCCC)C1=CC=CC=C1 HSTCJLDQVIIDKF-UHFFFAOYSA-N 0.000 description 1
- YNICHAOCDICNOT-UHFFFAOYSA-N 2,2-dimethoxyundecane Chemical compound CCCCCCCCCC(C)(OC)OC YNICHAOCDICNOT-UHFFFAOYSA-N 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- DDSSHLDPSCLVTJ-UHFFFAOYSA-N 2-(2-methylprop-1-enyl)oxane Chemical compound CC(C)=CC1CCCCO1 DDSSHLDPSCLVTJ-UHFFFAOYSA-N 0.000 description 1
- FJGQBLRYBUAASW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)phenol Chemical class OC1=CC=CC=C1N1N=C2C=CC=CC2=N1 FJGQBLRYBUAASW-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- NRBONBRUELQXMV-UHFFFAOYSA-N 2-ethoxyundecan-2-ylbenzene Chemical compound CCCCCCCCCC(C)(OCC)C1=CC=CC=C1 NRBONBRUELQXMV-UHFFFAOYSA-N 0.000 description 1
- CTHZQSCBKROLEN-UHFFFAOYSA-N 2-ethyl-3,4-dihydro-2h-chromene Chemical compound C1=CC=C2OC(CC)CCC2=C1 CTHZQSCBKROLEN-UHFFFAOYSA-N 0.000 description 1
- WQHMEGBWNFRWDH-UHFFFAOYSA-N 2-methoxy-2-methylundecane Chemical compound CCCCCCCCCC(C)(C)OC WQHMEGBWNFRWDH-UHFFFAOYSA-N 0.000 description 1
- XTDKZSUYCXHXJM-UHFFFAOYSA-N 2-methoxyoxane Chemical compound COC1CCCCO1 XTDKZSUYCXHXJM-UHFFFAOYSA-N 0.000 description 1
- IRTCJFCIQKNFPP-UHFFFAOYSA-N 2-methyl-1,4-dioxane Chemical compound CC1COCCO1 IRTCJFCIQKNFPP-UHFFFAOYSA-N 0.000 description 1
- 125000003229 2-methylhexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- WQUNVSNKFICLRQ-UHFFFAOYSA-N 2-methylundecan-2-ol Chemical compound CCCCCCCCCC(C)(C)O WQUNVSNKFICLRQ-UHFFFAOYSA-N 0.000 description 1
- WRXSIZPUSNRUGA-UHFFFAOYSA-N 2-phenylundecan-2-ol Chemical compound CCCCCCCCCC(C)(O)C1=CC=CC=C1 WRXSIZPUSNRUGA-UHFFFAOYSA-N 0.000 description 1
- GPBBNPPLBQIADY-UHFFFAOYSA-N 4,4-dimethyloxane Chemical compound CC1(C)CCOCC1 GPBBNPPLBQIADY-UHFFFAOYSA-N 0.000 description 1
- 125000004861 4-isopropyl phenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- JZHKIUBMQMDQRG-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)OC)CCCCCCCC JZHKIUBMQMDQRG-UHFFFAOYSA-N 0.000 description 1
- AYWXDPHRLSGVBS-UHFFFAOYSA-N C(=C)CC(CCCCCCCCC)(OC)OC Chemical compound C(=C)CC(CCCCCCCCC)(OC)OC AYWXDPHRLSGVBS-UHFFFAOYSA-N 0.000 description 1
- MJXUFBUYCLOLBZ-UHFFFAOYSA-N C(C)(=N)N.CC(=O)C Chemical compound C(C)(=N)N.CC(=O)C MJXUFBUYCLOLBZ-UHFFFAOYSA-N 0.000 description 1
- XEPAKJGFUVCJOW-UHFFFAOYSA-N C(C)C(C(OCC)(OCC)CC)CCCCCCCC Chemical compound C(C)C(C(OCC)(OCC)CC)CCCCCCCC XEPAKJGFUVCJOW-UHFFFAOYSA-N 0.000 description 1
- LLGHYVXTTIEZPZ-UHFFFAOYSA-N C(C)OC(CCCCCCCCC)(C)C Chemical compound C(C)OC(CCCCCCCCC)(C)C LLGHYVXTTIEZPZ-UHFFFAOYSA-N 0.000 description 1
- ZXEYRBLEYIDXMS-UHFFFAOYSA-N C(C)OC(CCCCCCCCC)C=C Chemical compound C(C)OC(CCCCCCCCC)C=C ZXEYRBLEYIDXMS-UHFFFAOYSA-N 0.000 description 1
- IQUCDIIVDQWENU-UHFFFAOYSA-N C(CCC)C(C(OC)(OC)CCCC)CCCCCCCC Chemical compound C(CCC)C(C(OC)(OC)CCCC)CCCCCCCC IQUCDIIVDQWENU-UHFFFAOYSA-N 0.000 description 1
- UVPBWKQOKOQWOL-UHFFFAOYSA-N C(CCC)C(C(OCC)(OCC)CCCC)CCCCCCCC Chemical compound C(CCC)C(C(OCC)(OCC)CCCC)CCCCCCCC UVPBWKQOKOQWOL-UHFFFAOYSA-N 0.000 description 1
- HWGXBXCHAWZLMP-UHFFFAOYSA-N C(CCCCCCC)C(C(OCC)(OCC)CCCCCCCC)CCCCCCCC Chemical compound C(CCCCCCC)C(C(OCC)(OCC)CCCCCCCC)CCCCCCCC HWGXBXCHAWZLMP-UHFFFAOYSA-N 0.000 description 1
- YOCGPLHBIRTNJP-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(Cl)(C=C)C1=CC=CC=C1)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(Cl)(C=C)C1=CC=CC=C1)CCCCCCCC YOCGPLHBIRTNJP-UHFFFAOYSA-N 0.000 description 1
- VKAKNMXEHXHCPG-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(OCC)(C=C)C1=CC=CC=C1)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(OCC)(C=C)C1=CC=CC=C1)CCCCCCCC VKAKNMXEHXHCPG-UHFFFAOYSA-N 0.000 description 1
- LETBMYQUFYPCDG-UHFFFAOYSA-N C1(=CC=CC=C1)C(CCCCCCCCC)(OC)C1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)C(CCCCCCCCC)(OC)C1=CC=CC=C1 LETBMYQUFYPCDG-UHFFFAOYSA-N 0.000 description 1
- RDNVJBKVRFPREH-UHFFFAOYSA-N C=CC1CCC2C=CC=C2O1 Chemical compound C=CC1CCC2C=CC=C2O1 RDNVJBKVRFPREH-UHFFFAOYSA-N 0.000 description 1
- DVTOOMYOGUTSHM-UHFFFAOYSA-N CC(C(C=C)(OC)C)CCCCCCCC Chemical compound CC(C(C=C)(OC)C)CCCCCCCC DVTOOMYOGUTSHM-UHFFFAOYSA-N 0.000 description 1
- FMQJPSUCUJGTSW-UHFFFAOYSA-N CC(C(Cl)(C=C)C)CCCCCCCC Chemical compound CC(C(Cl)(C=C)C)CCCCCCCC FMQJPSUCUJGTSW-UHFFFAOYSA-N 0.000 description 1
- QYCXRSBMSUJZJN-UHFFFAOYSA-N CC(C(Cl)(C=C)C1=CC=CC=C1)CCCCCCCC Chemical compound CC(C(Cl)(C=C)C1=CC=CC=C1)CCCCCCCC QYCXRSBMSUJZJN-UHFFFAOYSA-N 0.000 description 1
- LNEJJQMNHUGXDW-UHFFFAOYSA-N CC(C(OCC)(OCC)C)CCCCCCCC Chemical compound CC(C(OCC)(OCC)C)CCCCCCCC LNEJJQMNHUGXDW-UHFFFAOYSA-N 0.000 description 1
- URUAYHCVNHVHGX-UHFFFAOYSA-N CCCCCCCCC(C(C=C)(C1=CC=CC=C1)OC)C1=CC=CC=C1 Chemical compound CCCCCCCCC(C(C=C)(C1=CC=CC=C1)OC)C1=CC=CC=C1 URUAYHCVNHVHGX-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- TZHJDSITGUDXEY-UHFFFAOYSA-N ClC(CCCCCCCCC)(C1=CC=CC=C1)C Chemical compound ClC(CCCCCCCCC)(C1=CC=CC=C1)C TZHJDSITGUDXEY-UHFFFAOYSA-N 0.000 description 1
- PPGMMLGQLMKZOO-UHFFFAOYSA-N ClC(CCCCCCCCC)(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound ClC(CCCCCCCCC)(C1=CC=CC=C1)C1=CC=CC=C1 PPGMMLGQLMKZOO-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 101000823778 Homo sapiens Y-box-binding protein 2 Proteins 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002675 Polyoxyl Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- SRITWFDREMKSQQ-UHFFFAOYSA-N [Pt].C(=C)C1(C(OC(C(O1)C)C)(C)C=C)C Chemical compound [Pt].C(=C)C1(C(OC(C(O1)C)C)(C)C=C)C SRITWFDREMKSQQ-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229950005499 carbon tetrachloride Drugs 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- XSDCTSITJJJDPY-UHFFFAOYSA-N chloro-ethenyl-dimethylsilane Chemical compound C[Si](C)(Cl)C=C XSDCTSITJJJDPY-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical class C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- WCOATMADISNSBV-UHFFFAOYSA-K diacetyloxyalumanyl acetate Chemical compound [Al+3].CC([O-])=O.CC([O-])=O.CC([O-])=O WCOATMADISNSBV-UHFFFAOYSA-K 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- QPPQHRDVPBTVEV-UHFFFAOYSA-N isopropyl dihydrogen phosphate Chemical compound CC(C)OP(O)(O)=O QPPQHRDVPBTVEV-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012567 medical material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229960002455 methoxyflurane Drugs 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- IFYYERYAOQBKQI-UHFFFAOYSA-N octanal;platinum Chemical compound [Pt].CCCCCCCC=O IFYYERYAOQBKQI-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- QBERHIJABFXGRZ-UHFFFAOYSA-M rhodium;triphenylphosphane;chloride Chemical compound [Cl-].[Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QBERHIJABFXGRZ-UHFFFAOYSA-M 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000011995 wilkinson's catalyst Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
本發明係關於一種具有特定結構之新穎的含有矽之化合物、含有該化合物而形成之硬化性組合物、及使該組合物熱硬化而形成之硬化物,詳細而言,本發明係關於一種提供硬化性組合物的含有矽之化合物、含有此含有矽之化合物的硬化性組合物、以及透明性及可撓性優異之硬化物,上述硬化性組合物之操作性及硬化性優異,形成透明性及可撓性優異之硬化物。The present invention relates to a novel bismuth-containing compound having a specific structure, a curable composition formed by the same, and a cured product formed by thermally hardening the composition. In detail, the present invention relates to a provision. The curable composition containing the bismuth of the curable composition, the curable composition containing the quinone-containing compound, and the cured product excellent in transparency and flexibility, the curable composition is excellent in handleability and curability, and forms transparency. And a cured product excellent in flexibility.
對於將有機原材料及無機原材料組合而成之複合材料,業者一直在進行各種研究,在工業上,亦利用使無機填充劑與有機高分子複合之方法、或以有機高分子對金屬表面加以修飾之塗佈的方法等。對於該等有機/無機複合材料而言,由於構成該等複合材料之原材料具有微米級以上之大小,故雖然可將一部分物性提高至預想值以上,但其他多數性能或物性僅表現出根據有機原材料及無機原材料各自之性能或物性之加成規則所預料的值。For composite materials that combine organic raw materials and inorganic raw materials, the industry has been conducting various researches. In the industry, the method of compounding inorganic fillers with organic polymers or modifying the surface of metal with organic polymers is also used. Coating method, etc. For these organic/inorganic composite materials, since the raw materials constituting the composite materials have a size of a micron or more, although some physical properties can be increased to a predetermined value or more, most other properties or physical properties are only expressed according to organic raw materials. And the value expected by the addition rule of the performance or physical properties of each of the inorganic raw materials.
另一方面,近年來,對以下有機/無機複合材料之研究較為盛行:有機原材料及無機原材料各原材料範疇(domain)之大小為奈米級,進而以分子水平(molecular level)組合而成之有機/無機複合材料。業者期望此類材料成為如下材料:不僅兼具各原材料之特性,而且兼具各原材料之優點,進而具有加成規則無法預料的與各原材料自 身完全不同之新功能性。On the other hand, in recent years, research on the following organic/inorganic composite materials has become more prevalent: the size of each raw material domain of organic raw materials and inorganic raw materials is nanometer-scale, and then organically combined at a molecular level. /Inorganic composite materials. The manufacturer expects such materials to be the following materials: not only the characteristics of each raw material, but also the advantages of each raw material, and thus the raw materials are unpredictable with the raw materials. A completely different new functionality.
此種有機/無機複合材料中,存在一方之原材料及另一方之原材料以分子水平經由共價鍵而鍵結之化學鍵結型、以及以一方之原材料作為基質並使另一方之原材料細微地分散於此基質中並複合化的混合型。至於合成該等有機/無機複合材料中所使用之無機原材料的方法,係使用溶膠-凝膠法,所謂該溶膠-凝膠法,係指藉由前驅物分子之水解及其後所進行之聚縮合反應,而在低溫下獲得交聯之無機氧化物的反應。由該溶膠-凝膠法所獲得之無機原材料,有在短期間內膠化等保存穩定性差之問題。In such an organic/inorganic composite material, there is a chemical bonding type in which one of the raw materials and the other raw material are bonded at a molecular level via a covalent bond, and one of the raw materials is used as a substrate and the other raw material is finely dispersed. A hybrid type that is combined in this matrix. As a method of synthesizing the inorganic raw materials used in the organic/inorganic composite materials, a sol-gel method is used, which means that the hydrolysis by the precursor molecules and the subsequent polymerization are carried out. The condensation reaction, while obtaining a reaction of the crosslinked inorganic oxide at a low temperature. The inorganic raw material obtained by the sol-gel method has a problem of poor storage stability such as gelation in a short period of time.
非專利文獻1中,藉由下述方法來嘗試改良保存穩定性:著眼於烷基三烷氧基矽烷之由烷基鏈長所致的縮合速度之差異,在甲基三甲氧基矽烷之聚縮合後,添加聚縮合速度較慢之長鏈烷基三烷氧基矽烷,對聚矽氧烷中之矽醇基進行封端;進而,使用鋁觸媒進行甲基三甲氧基矽烷之聚縮合反應,在達到特定分子量時添加乙醯丙酮,在反應系中進行配位基交換。然而,該等方法對保存穩定性之改善並不充分。又,由溶膠-凝膠法所獲得之無機原材料存在可撓性之問題。In Non-Patent Document 1, attempts have been made to improve the storage stability by focusing on the difference in the condensation rate due to the alkyl chain length of the alkyltrialkoxydecane, and the polymerization in methyltrimethoxydecane. After condensation, a long-chain alkyltrialkoxydecane having a slow polycondensation rate is added to block the sterol group in the polyoxyalkylene; further, the polycondensation of methyltrimethoxydecane is carried out using an aluminum catalyst. In the reaction, acetamidine acetone is added at a specific molecular weight, and ligand exchange is carried out in the reaction system. However, these methods are not adequate for improving storage stability. Further, the inorganic raw material obtained by the sol-gel method has a problem of flexibility.
相對於此,作為化學鍵結型之有機/無機複合材料,提出有含有特定的含有矽之聚合物的硬化性組合物。例如,於專利文獻1中揭示有如下含有矽之硬化性組合物:含有具有交聯結構且具有烯基及炔基的含有矽之聚合物(A)、具有交聯結構且具有矽烷基的含有矽之聚合物(B)、及鉑 系觸媒(D),且操作性及硬化性優異,所獲得之硬化物之耐熱性亦優異。然而,該含有矽之硬化性組合物有如下問題:硬化特性未必充分,無法在低溫下、在短時間內獲得具有充分之性能的硬化物。On the other hand, as the chemical bonding type organic/inorganic composite material, a curable composition containing a specific polymer containing ruthenium has been proposed. For example, Patent Document 1 discloses a curable composition containing ruthenium containing a ruthenium-containing polymer (A) having a crosslinked structure and having an alkenyl group and an alkynyl group, and having a crosslinked structure and having a fluorenyl group. Bismuth polymer (B), and platinum It is a catalyst (D) and is excellent in workability and hardenability, and the obtained cured product is also excellent in heat resistance. However, the curable composition containing bismuth has a problem that the hardening property is not necessarily sufficient, and a cured product having sufficient performance cannot be obtained at a low temperature in a short time.
[非專利文獻1]日本化學會雜誌,No.9,571(1998)[Non-Patent Document 1] Journal of the Chemical Society of Japan, No. 9, 571 (1998)
[專利文獻1]日本專利特開2005-325174號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-325174
本發明之目的在於提供一種操作性及硬化性優異、所獲得之硬化物的透明性及可撓性優異之硬化性組合物。An object of the present invention is to provide a curable composition which is excellent in workability and curability, and which is excellent in transparency and flexibility of a cured product obtained.
本發明者等人為解決上述課題而進行研究,結果發現,具有特定結構的含有矽之化合物及含有該含有矽之化合物的硬化性組合物可解決上述課題,從而完成本發明。In order to solve the above problems, the present inventors have found that a compound containing ruthenium having a specific structure and a curable composition containing the ruthenium-containing compound can solve the above problems, and the present invention has been completed.
本發明提供一種以下述通式(1)表示之含有矽之化合物:
又,本發明提供一種硬化性組合物,其係含有(A1)上述通式(1)中之Z為氫原子的上述含有矽之化合物、(B1)上述通式(1)中之Z為碳原子數為2~4之烯基或炔基的上述含有矽之化合物、及(C)矽氫化反應觸媒而形成者。Furthermore, the present invention provides a curable composition comprising (A1) the above-mentioned compound containing ruthenium wherein Z in the above formula (1) is a hydrogen atom, and (B1) Z in the above formula (1) is carbon The above-mentioned oxime-containing compound having an alkenyl group of 2 to 4 or an alkynyl group and (C) a hydrogenation-reactive catalyst are formed.
又,本發明提供一種使上述硬化性組合物硬化而形成之含有矽之硬化物。Moreover, the present invention provides a cured product containing ruthenium formed by curing the curable composition.
根據本發明,可提供一種操作性及硬化性優異之硬化性組合物,耐熱性、透明性及柔軟性優異之硬化物,以及提供該等硬化性組合物及硬化物的含有矽之化合物。According to the present invention, it is possible to provide a curable composition excellent in workability and curability, a cured product excellent in heat resistance, transparency, and flexibility, and a bismuth-containing compound which provides the curable composition and the cured product.
首先,對以上述通式(1)表示之本發明的含有矽之化合物加以說明。First, the compound containing ruthenium of the present invention represented by the above formula (1) will be described.
上述通式(1)中,作為以Ra ~Re 表示之碳原子數為1~12之飽和脂肪族烴基,可列舉:甲基、乙基、丙基、異丙基、丁基、第二丁基、第三丁基、異丁基、戊基、異戊基、第三戊基、己基、2-己基、3-己基、環己基、1-甲基環己基、庚基、2-庚基、3-庚基、異庚基、第三庚基、正辛基、異辛基、第三辛基、2-乙基己基、壬基、異壬基、癸 基、十二烷基等。In the above formula (1), the saturated aliphatic hydrocarbon group having 1 to 12 carbon atoms represented by R a to R e may, for example, be a methyl group, an ethyl group, a propyl group, an isopropyl group or a butyl group. Dibutyl, tert-butyl, isobutyl, pentyl, isopentyl, tert-pentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 1-methylcyclohexyl, heptyl, 2- Heptyl, 3-heptyl, isoheptyl, third heptyl, n-octyl, isooctyl, trioctyl, 2-ethylhexyl, decyl, isodecyl, decyl, dodecyl Wait.
又,以Re 表示之可由飽和脂肪族烴基取代的碳原子數為6~12之芳香族烴基,係指亦包括取代基即飽和脂肪族烴基的整體之碳原子數為6~12者。作為取代基即飽和脂肪族烴基,例如,可採用以上所例示之飽和脂肪族烴基中可滿足上述碳原子數者。因此,作為以Re 表示之可由飽和脂肪族烴基取代的碳原子數為6~12之芳香族烴基,可列舉:苯基、萘基、2-甲基苯基、3-甲基苯基、4-甲基苯基、3-異丙基苯基、4-異丙基苯基、4-丁基苯基、4-異丁基苯基、4-第三丁基苯基、4-己基苯基、4-環己基苯基、2,3-二甲基苯基、2,4-二甲基苯基、2,5-二甲基苯基、2,6-二甲基苯基、3,4-二甲基苯基、3,5-二甲基苯基、環己基苯基、聯苯基、2,4,5-三甲基苯基等。Further, the aromatic hydrocarbon group having 6 to 12 carbon atoms which may be substituted by a saturated aliphatic hydrocarbon group represented by R e means that the total number of carbon atoms of the saturated aliphatic hydrocarbon group which is a substituent is 6 to 12. As the substituent, that is, the saturated aliphatic hydrocarbon group, for example, those having a carbon atom number satisfying the above-described saturated aliphatic hydrocarbon group can be used. Therefore, examples of the aromatic hydrocarbon group having 6 to 12 carbon atoms which may be substituted by a saturated aliphatic hydrocarbon group represented by R e include a phenyl group, a naphthyl group, a 2-methylphenyl group, and a 3-methylphenyl group. 4-methylphenyl, 3-isopropylphenyl, 4-isopropylphenyl, 4-butylphenyl, 4-isobutylphenyl, 4-tert-butylphenyl, 4-hexyl Phenyl, 4-cyclohexylphenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2,6-dimethylphenyl, 3,4-Dimethylphenyl, 3,5-dimethylphenyl, cyclohexylphenyl, biphenyl, 2,4,5-trimethylphenyl, and the like.
又,作為以Y表示之碳原子數為2~4之伸烷基,可列舉-CH2 CH2 -、-CH2 CH2 CH2 -、-CH2 CH2 CH2 CH2 -、-CH(CH3 )CH2 -、-CH2 CH(CH3 )-等。Further, examples of the alkylene group having 2 to 4 carbon atoms represented by Y include -CH 2 CH 2 -, -CH 2 CH 2 CH 2 -, -CH 2 CH 2 CH 2 CH 2 -, -CH. (CH 3 )CH 2 -, -CH 2 CH(CH 3 )-, and the like.
作為以Z表示之碳原子數為2~4之烯基,可列舉CH2 =CH-、CH2 =CH-CH2 -、CH2 =CH-CH2 -CH2 -、CH2 =C(CH3 )-、CH2 =C(CH3 )-CH2 -、CH2 =CH-CH(CH3 )-等,作為以Z表示之碳原子數為2~4之炔基,例如可列舉下述基。Examples of the alkenyl group having 2 to 4 carbon atoms represented by Z include CH 2 =CH-, CH 2 =CH-CH 2 -, CH 2 =CH-CH 2 -CH 2 -, and CH 2 =C ( CH 3 )-, CH 2 =C(CH 3 )-CH 2 -, CH 2 =CH-CH(CH 3 )-, etc., and an alkynyl group having 2 to 4 carbon atoms represented by Z, for example, The following basis.
以上述通式(1)表示之本發明的含有矽之化合物之較好 形態為以下述通式(2)表示之含有矽之化合物。以下述通式(2)表示之含有矽之化合物,係以上述通式(1)表示之含有矽之化合物中T=K者。利用通常之合成方法所獲得者,係以下述通式(2)表示之含有矽之化合物、或複數種以上述通式(1)表示之含有矽之化合物的混合物,其係將以下述通式(2)表示之含有矽之化合物作為主成分者。例如,即便在使用多官能之以(Ra SiHO)K 表示之環聚矽氧烷作為導入環聚矽氧烷環之化合物時,上述通式(1)之K-T為大於1之數的化合物的生成量亦極少。其原因在於,非環狀之聚矽氧烷經由Y而與環聚矽氧烷的2個以上之Si-H鍵結而成的化合物之生成在能量方面非常不利。A preferred form of the ruthenium-containing compound of the present invention represented by the above formula (1) is a compound containing ruthenium represented by the following formula (2). The compound containing ruthenium represented by the following formula (2) is T=K in the compound containing ruthenium represented by the above formula (1). The compound obtained by the usual synthesis method is a mixture of a compound containing ruthenium represented by the following formula (2) or a plurality of compounds containing ruthenium represented by the above formula (1), which will have the following formula (2) A compound containing ruthenium as a main component. For example, even when a polyfunctional ring polyoxyalkylene represented by (R a SiHO) K is used as a compound introduced into a cyclic polyoxyalkylene ring, the KT of the above formula (1) is a compound having a number greater than 1 The amount generated is also very small. The reason for this is that the formation of a compound in which an acyclic polyoxyalkylene is bonded to two or more Si-H groups of a cyclopolyoxyalkylene via Y is extremely disadvantageous in terms of energy.
上述通式(1)或通式(2)中之Ra ~Rd 較好的是甲基,其原因在於,所獲得之硬化物之耐熱性良好。In the above formula (1) or in the formula (2), R a to R d are preferably a methyl group because the obtained cured product has good heat resistance.
又,上述通式(1)或通式(2)中之Re 較好的是碳原子數為1~12之飽和脂肪族烴基,其原因在於所獲得之硬化物之耐光性良好,上述通式(1)或通式(2)中之Re 更好的是甲基,其原因在於所獲得之硬化物之耐熱性亦良好。Further, R e in the above formula (1) or formula (2) is preferably a saturated aliphatic hydrocarbon group having 1 to 12 carbon atoms, because the cured product obtained has good light resistance, and the above-mentioned pass The R e in the formula (1) or the formula (2) is more preferably a methyl group because the heat resistance of the obtained cured product is also good.
又,上述通式(2)中之k為2~7。若k大於7,則官能基數過多,無法獲得所得硬化物所需之可撓性。k為2~5者在工業上可容易地獲取原料、且官能基數適當,故較好,最好的是k為3。Further, k in the above formula (2) is 2 to 7. If k is more than 7, the number of functional groups is too large, and the flexibility required for the obtained cured product cannot be obtained. When k is 2 to 5, it is industrially easy to obtain a raw material, and the number of functional groups is appropriate. Therefore, it is preferable that k is 3.
本發明之含有矽之化合物的質量平均分子量為3000~100萬。若質量平均分子量小於3000,則所獲得之硬化物之耐熱性不充分,若質量平均分子量大於100萬則黏度會變大,而妨礙操作。質量平均分子量較好的是5000~50萬,更好的是1萬~10萬。The ruthenium-containing compound of the present invention has a mass average molecular weight of 3,000 to 1,000,000. If the mass average molecular weight is less than 3,000, the heat resistance of the obtained cured product is insufficient, and if the mass average molecular weight is more than 1,000,000, the viscosity becomes large and the operation is hindered. The average mass molecular weight is preferably 5,000 to 500,000, more preferably 10,000 to 100,000.
本發明之含有矽之化合物視其製造方法而不同,並無特別限制,可應用眾所周知之反應來製造。以下製造方法中,以本發明之含有矽之化合物的以上述通式(2)表示者作為代表,對上述通式(2)中之Z為氫原子者、Z為碳原子數為2~4之烯基或炔基者依序加以說明。The ruthenium-containing compound of the present invention is not particularly limited as long as it is produced by a known method, and can be produced by a known reaction. In the following production method, the compound represented by the above formula (2) of the ruthenium-containing compound of the present invention is represented, and in the above formula (2), Z is a hydrogen atom, and Z is a carbon atom number of 2 to 4. The alkenyl or alkynyl group will be described in order.
又,以下,將上述通式(1)或(2)中之Z為氫原子者分別表述為含有矽之化合物(A1)或(A2),將上述通式(1)或(2)中之Z為碳原子數為2~4之烯基或炔基者分別表述為含有矽之 化合物(B1)或(B2)。In the following, in the above formula (1) or (2), Z is a hydrogen atom, and is represented as a compound (A1) or (A2) containing ruthenium, and the above formula (1) or (2) Z is an alkenyl or alkynyl group having 2 to 4 carbon atoms, respectively Compound (B1) or (B2).
以下,對上述通式(2)中之Z為氫原子的含有矽之化合物(A2)之製造方法加以說明。Hereinafter, a method for producing the ruthenium-containing compound (A2) in which Z in the above formula (2) is a hydrogen atom will be described.
含有矽之化合物(A2),例如,可藉由將具有不飽和鍵之非環狀聚矽氧烷化合物(a1)作為前驅物並使之與環狀聚矽氧烷化合物(a2)反應而獲得。The ruthenium-containing compound (A2) can be obtained, for example, by reacting an acyclic polyoxy siloxane compound (a1) having an unsaturated bond as a precursor and reacting it with a cyclic polyoxy siloxane compound (a2). .
上述具有不飽和鍵之非環狀聚矽氧烷化合物(a1)可藉由如下方式獲得:使1種或2種以上之二官能矽烷化合物利用水解進行縮合反應後,當p為1時與單官能單矽烷化合物反應,當p為3時與三官能單矽烷化合物反應,當p為4時與四官能單矽烷化合物反應,進而與具有不飽和基之單官能矽烷化合物反應而獲得。當p為2時,可在縮合反應之後與具有不飽和基之單官能矽烷化合物反應而獲得。作為該等矽烷化合物之官能基,代表性者為烷氧基、鹵基或羥基。具有不飽和鍵之非環狀聚矽氧烷化合物(a1)與環狀聚矽氧烷化合物(a2)係藉由(a1)之不飽和鍵結碳與(a2)之Si-H基的反應而鍵結。The acyclic polysiloxane compound (a1) having an unsaturated bond can be obtained by subjecting one or two or more difunctional decane compounds to a condensation reaction by hydrolysis, and when p is 1, The functional monodecane compound is reacted, reacted with a trifunctional monodecane compound when p is 3, reacted with a tetrafunctional monodecane compound when p is 4, and further reacted with a monofunctional decane compound having an unsaturated group. When p is 2, it can be obtained by reacting with a monofunctional decane compound having an unsaturated group after the condensation reaction. The functional group of the decane compound is typically an alkoxy group, a halogen group or a hydroxyl group. The acyclic polyoxy siloxane compound (a1) having an unsaturated bond and the cyclic polyoxy siloxane compound (a2) are reacted with the unsaturated bonded carbon of (a1) and the Si-H group of (a2) And the key knot.
作為上述具有不飽和鍵之非環狀聚矽氧烷化合物(a1)之製造中所使用的上述二官能矽烷化合物之例,可列舉:二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、二乙基二甲氧基矽烷、二乙基二乙氧基矽烷、二丁基二甲氧基矽烷、二丁基二乙氧基矽烷、二辛基二甲氧基矽烷、二辛基二乙氧基矽烷等二烷氧基單矽烷化合物;將該等二烷氧基單矽烷化合物之1個或2個烷氧基取代為選自由氟、氯、溴及碘所 組成之群中的鹵素原子或羥基之單矽烷化合物;由2個以上之該等單矽烷化合物縮合而成的二矽氧烷化合物及低聚矽氧烷化合物。Examples of the above-mentioned difunctional decane compound used in the production of the above-mentioned acyclic polysiloxane compound (a1) having an unsaturated bond include dimethyldimethoxydecane and dimethyldiethoxylate. Base decane, diethyl dimethoxy decane, diethyl diethoxy decane, dibutyl dimethoxy decane, dibutyl diethoxy decane, dioctyl dimethoxy decane, dioctane a dialkoxy monodecane compound such as bis-ethoxy decane; or one or two alkoxy groups of the above dialkoxy monodecane compounds are selected from the group consisting of fluorine, chlorine, bromine and iodine a monooxane compound having a halogen atom or a hydroxyl group in a group; a dioxane compound and an oligomeric alkoxylate compound obtained by condensing two or more of the monodecane compounds.
作為上述單官能單矽烷化合物,例如可列舉:三甲基乙氧基矽烷、三甲基甲氧基矽烷、三乙基乙氧基矽烷、三乙基甲氧基矽烷、三丁基甲氧基矽烷、三丁基乙氧基矽烷、三辛基甲氧基矽烷、三辛基乙氧基矽烷、三苯基乙氧基矽烷、三苯基甲氧基矽烷、甲基二苯基乙氧基矽烷、二甲基苯基乙氧基矽烷等單烷氧基矽烷化合物;將該等單烷氧基矽烷化合物之烷氧基取代為選自由氟、氯、溴及碘所組成之群中的鹵素原子或羥基之單矽烷化合物。Examples of the monofunctional monodecane compound include trimethyl ethoxy decane, trimethyl methoxy decane, triethyl ethoxy decane, triethyl methoxy decane, and tributyl methoxy decane. Tributyl ethoxy decane, trioctyl methoxy decane, trioctyl ethoxy decane, triphenyl ethoxy decane, triphenyl methoxy decane, methyl diphenyl ethoxy decane, a monoalkoxydecane compound such as dimethylphenylethoxysilane; the alkoxy group of the monoalkoxydecane compound is substituted with a halogen atom selected from the group consisting of fluorine, chlorine, bromine and iodine or a monodecane compound of a hydroxyl group.
作為上述三官能單矽烷化合物,可列舉:三乙氧基甲基矽烷、三甲氧基甲基矽烷、三乙氧基乙基矽烷、三甲氧基乙基矽烷、三乙氧基丁基矽烷、三甲氧基丁基矽烷、三乙氧基辛基矽烷、三甲氧基辛基矽烷、三乙氧基苯基矽烷、三甲氧基苯基矽烷等三烷氧基矽烷化合物;將該等三烷氧基矽烷化合物之1~3個烷氧基取代為選自由氟、氯、溴及碘所組成之群中的鹵素原子或羥基之單矽烷化合物。The trifunctional monodecane compound may, for example, be triethoxymethyl decane, trimethoxymethyl decane, triethoxyethyl decane, trimethoxyethyl decane, triethoxy butyl decane or the like. a trialkoxy decane compound such as oxybutyl decane, triethoxyoctyl decane, trimethoxyoctyl decane, triethoxyphenyl decane or trimethoxyphenyl decane; The 1-3 alkoxy group of the decane compound is substituted with a monodecane compound selected from a halogen atom or a hydroxyl group in a group consisting of fluorine, chlorine, bromine and iodine.
作為上述四官能單矽烷化合物,可列舉:四乙氧基矽烷、四甲氧基矽烷等四烷氧基矽烷化合物;將該等四烷氧基矽烷化合物之1~4個烷氧基取代為選自由氟、氯、溴及碘所組成之群中的鹵素原子或羥基之單矽烷化合物。Examples of the tetrafunctional monodecane compound include a tetraalkoxydecane compound such as tetraethoxysilane or tetramethoxynonane; and 1 to 4 alkoxy groups of the above tetraalkoxydecane compounds are substituted. A halogen atom or a monodecane compound of a hydroxyl group in a group consisting of fluorine, chlorine, bromine and iodine.
作為上述具有不飽和基之單官能矽烷化合物,可列舉:二甲基乙烯基氯矽烷、二甲基乙烯基甲氧基矽烷、二甲基 乙烯基乙氧基矽烷、二苯基乙烯基氯矽烷、二苯基乙烯基乙氧基矽烷、二苯基乙烯基甲氧基矽烷、甲基苯基乙烯基氯矽烷、甲基苯基乙氧基矽烷、甲基苯基甲氧基矽烷等。Examples of the monofunctional decane compound having an unsaturated group include dimethyl vinyl chlorodecane, dimethyl vinyl methoxy decane, and dimethyl group. Vinyl ethoxy decane, diphenyl vinyl chlorodecane, diphenyl vinyl ethoxy decane, diphenyl vinyl methoxy decane, methyl phenyl vinyl chloro decane, methyl phenyl ethoxylate Base decane, methyl phenyl methoxy decane, and the like.
作為上述環狀聚矽氧烷化合物(a2),可列舉:1,3,5-三甲基環三矽氧烷、1,3,5,7-四甲基環四矽氧烷、1,3,5,7,9-五甲基環五矽氧烷、1,3,5,7,9,11-六甲基環六矽氧烷、1,3,5,7,9,11,13-七甲基環七矽氧烷、1,3,5,7,9,11,13,15-八甲基環八矽氧烷、1,3,5-三乙基環三矽氧烷、1,3,5,7-四乙基環四矽氧烷、1,3,5,7,9-五乙基環五矽氧烷、1,3,5,7,9,11-六乙基環六矽氧烷、1,3,5-三苯基環三矽氧烷、1,3,5,7-四苯基環四矽氧烷、1,3,5,7,9-五苯基環五矽氧烷、1,3,5,7,9,11-六苯基環六矽氧烷等。The cyclic polyaluminoxane compound (a2) may, for example, be 1,3,5-trimethylcyclotrioxane or 1,3,5,7-tetramethylcyclotetraoxane or 1, 3,5,7,9-pentamethylcyclopentaoxane, 1,3,5,7,9,11-hexamethylcyclohexaoxane, 1,3,5,7,9,11, 13-heptamethylcyclopentaoxane, 1,3,5,7,9,11,13,15-octamethylcyclooctadecane, 1,3,5-triethylcyclotrioxane 1,3,5,7-tetraethylcyclotetraoxane, 1,3,5,7,9-pentaethylcyclopentaoxane, 1,3,5,7,9,11-six Ethylcyclohexaoxane, 1,3,5-triphenylcyclotrioxane, 1,3,5,7-tetraphenylcyclotetraoxane, 1,3,5,7,9- Pentaphenylcyclopentaoxane, 1,3,5,7,9,11-hexaphenylcyclohexaoxane, and the like.
又,作為上述二官能矽烷化合物、單官能單矽烷化合物、三官能單矽烷化合物、四官能單矽烷化合物、具有不飽和基之單官能矽烷化合物、或環狀聚矽氧烷化合物(a2),若使用將各化合物所具有之一部分或全部氫原子取代為氘及/或氟者,則可獲得後述之將本發明之含有矽之化合物的一部分或全部氫原子取代為氘及/或氟者。Further, the difunctional decane compound, the monofunctional monodecane compound, the trifunctional monodecane compound, the tetrafunctional monodecane compound, the monofunctional decane compound having an unsaturated group, or the cyclic polyoxy siloxane compound (a2) When one or all of the hydrogen atoms of each compound are substituted with hydrazine and/or fluorine, one or all of the hydrogen atoms of the quinone-containing compound of the present invention may be substituted with hydrazine and/or fluorine.
用以獲得含有矽之化合物(A2)的前驅物即具有不飽和鍵之非環狀聚矽氧烷化合物(a1)之利用水解所進行之縮合反應,可藉由所謂之溶膠-凝膠反應而進行。二官能矽烷化合物之水解-縮合反應係藉由如下方式進行:烷氧基或鹵基藉由水進行水解而生成矽醇基(Si-OH基),該生成之矽醇基彼此、矽醇基與烷氧基、或矽醇基與鹵基縮合。為使 該水解反應迅速地進行,較好的是加入適量之水,亦可加入觸媒。又,該縮合反應亦藉由空氣中之水分、或水以外之溶劑中所含的微量水而進行。該反應中亦可使用溶劑,溶劑並無特別限定,具體而言,例如可列舉:水,或甲醇、乙醇、正丙醇、異丙醇、正丁醇、異丁醇、丙酮、甲基乙基酮、二噁烷、四氫呋喃等親水性有機溶劑,該等溶劑可使用1種或混合使用2種以上。A condensation reaction by hydrolysis to obtain a precursor of the compound (A2) containing ruthenium, that is, a non-cyclic polyoxy siloxane compound (a1) having an unsaturated bond, by a so-called sol-gel reaction get on. The hydrolysis-condensation reaction of the difunctional decane compound is carried out by hydrolyzing an alkoxy group or a halogen group to form a decyl group (Si-OH group), which forms a sterol group and a decyl group. Condensation with an alkoxy group, or a decyl group and a halogen group. To make The hydrolysis reaction proceeds rapidly, and it is preferred to add an appropriate amount of water or to add a catalyst. Further, the condensation reaction is also carried out by moisture in the air or a trace amount of water contained in a solvent other than water. A solvent may be used for the reaction, and the solvent is not particularly limited, and specific examples thereof include water, methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, acetone, and methyl ethyl b. A hydrophilic organic solvent such as a ketone, a dioxane or a tetrahydrofuran may be used alone or in combination of two or more.
又,作為上述觸媒,可使用酸或鹼,具體而言,例如可列舉:鹽酸、磷酸、硫酸等無機酸類;乙酸、對甲苯磺酸、磷酸單異丙酯等有機酸類;氫氧化鈉、氫氧化鉀、氫氧化鋰、氨等無機鹼類;三甲胺、三乙胺、單乙醇胺、二乙醇胺等胺化合物(有機鹼)類;鈦酸四異丙酯,鈦酸四丁酯等鈦化合物類;月桂酸二丁基錫、辛基錫酸等錫化合物類;三氟化硼等硼化合物類;三乙醯丙酮鋁等鋁化合物類;鐵、鈷、錳、鋅等金屬之氯化物,及該等金屬之環烷酸鹽及辛酸鹽等金屬羧酸鹽類等;該等觸媒可使用1種或併用2種以上。又,由2種以上之二官能矽烷化合物進行水解-縮合反應時,既可於分別單獨進行某種程度之水解後將兩者混合而進一步進行水解縮合反應,亦可將所有二官能矽烷化合物混合而一起進行水解-縮合反應。Further, as the catalyst, an acid or a base can be used, and specific examples thereof include inorganic acids such as hydrochloric acid, phosphoric acid, and sulfuric acid; organic acids such as acetic acid, p-toluenesulfonic acid, and monoisopropyl phosphate; and sodium hydroxide; An inorganic base such as potassium hydroxide, lithium hydroxide or ammonia; an amine compound (organic base) such as trimethylamine, triethylamine, monoethanolamine or diethanolamine; a titanium compound such as tetraisopropyl titanate or tetrabutyl titanate; a tin compound such as dibutyltin laurate or octylstannic acid; a boron compound such as boron trifluoride; an aluminum compound such as aluminum triacetate; a chloride of a metal such as iron, cobalt, manganese or zinc; A metal carboxylate such as a metal naphthenate or an octanoate; and the like may be used alone or in combination of two or more. Further, when the hydrolysis-condensation reaction is carried out by using two or more kinds of difunctional decane compounds, the hydrolysis may be further carried out by separately mixing the two to some extent, and further mixing all the difunctional decane compounds. The hydrolysis-condensation reaction is carried out together.
如上所述,前驅物即具有不飽和鍵之非環狀聚矽氧烷化合物(a1)可藉由如下方式而獲得:在上述水解-縮合反應之後,當p為1時進一步與單官能單矽烷化合物反應,當p為3時進一步與三官能單矽烷化合物反應,當p為4時進一步與 四官能單矽烷化合物反應,繼而與具有不飽和基之單官能矽烷化合物反應而獲得;當p為2時可與具有不飽和基之單官能矽烷化合物反應而獲得。As described above, the precursor, that is, the acyclic polyoxy siloxane compound (a1) having an unsaturated bond can be obtained by further converting monofunctional monodecane when p is 1 after the above hydrolysis-condensation reaction. The compound reacts, further reacts with the trifunctional monodecane compound when p is 3, and further with p when The tetrafunctional monodecane compound is reacted, and then obtained by reacting with a monofunctional decane compound having an unsaturated group; when p is 2, it can be obtained by reacting with a monofunctional decane compound having an unsaturated group.
前驅物即具有不飽和鍵之非環狀聚矽氧烷化合物(a1)與環狀聚矽氧烷化合物(a2)的反應,可使用利用矽氫化反應之方法。例如,含有矽之化合物(A2)可藉由如下方式而獲得:將非環狀聚矽氧烷化合物(a1)與環狀聚矽氧烷化合物(a2)混合,添加任意量之鉑觸媒之後進行加熱。The precursor, that is, the reaction of the acyclic polyoxy siloxane compound (a1) having an unsaturated bond with the cyclic polyoxy siloxane compound (a2), a method using a hydrazine hydrogenation reaction can be used. For example, the ruthenium-containing compound (A2) can be obtained by mixing the acyclic polyoxy siloxane compound (a1) with the cyclic polyoxy siloxane compound (a2), and adding any amount of the platinum catalyst. Heat up.
以下,對上述通式(2)中之Z為碳原子數為2~4之烯基或炔基的含有矽之化合物(B2)之製造方法加以說明。Hereinafter, a method for producing a ruthenium-containing compound (B2) in which Z in the above formula (2) is an alkenyl group or an alkynyl group having 2 to 4 carbon atoms will be described.
含有矽之化合物(B2),例如,可藉由將非環狀聚矽氧烷化合物(b1)作為前驅物,並使之與具有不飽和鍵的環狀聚矽氧烷化合物(b2)反應而獲得。非環狀聚矽氧烷化合物(b1)可藉由如下方式而獲得:使1種或2種以上之二官能矽烷化合物利用水解進行縮合反應後,當p為1時與單官能單矽烷化合物反應,當p為3時與三官能單矽烷化合物反應,當p為4時與四官能單矽烷化合物反應,進而與導入Si-H基之化合物反應。非環狀聚矽氧烷化合物(b1)與具有不飽和鍵之環狀聚矽氧烷化合物(b2)係藉由(b1)之Si-H基與(b2)之不飽和基的反應而鍵結。上述二官能矽烷化合物之代表性官能基為烷氧基、鹵基或羥基。The ruthenium-containing compound (B2) can be, for example, reacted with a cyclic polysiloxane compound (b2) having an unsaturated bond by using the acyclic polyoxy siloxane compound (b1) as a precursor. obtain. The acyclic polyoxy siloxane compound (b1) can be obtained by reacting one or two or more difunctional decane compounds with a hydrolysis reaction, and reacting with a monofunctional monodecane compound when p is 1. When p is 3, it reacts with a trifunctional monodecane compound, and when p is 4, it reacts with a tetrafunctional monodecane compound, and further with a compound which introduces a Si-H group. The acyclic polyaluminoxane compound (b1) and the cyclic polyoxyalkylene compound (b2) having an unsaturated bond are bonded by the reaction of the Si-H group of (b1) with the unsaturated group of (b2). Knot. Representative functional groups of the above difunctional decane compounds are alkoxy groups, halogen groups or hydroxyl groups.
作為上述非環狀聚矽氧烷化合物(b1)之製造中所使用的上述二官能矽烷化合物之例,可列舉:二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、二乙基二甲氧基矽烷、二乙基 二乙氧基矽烷、二丁基二甲氧基矽烷、二丁基二乙氧基矽烷、二辛基二甲氧基矽烷、二辛基二乙氧基矽烷等二烷氧基單矽烷化合物;將該等二烷氧基單矽烷化合物之1個或2個烷氧基取代為選自由氟、氯、溴及碘所組成之群中的鹵素原子或羥基的單矽烷化合物;2個以上之該等單矽烷化合物縮合而成的二矽氧烷化合物及低聚矽氧烷化合物。Examples of the above-mentioned difunctional decane compound used in the production of the acyclic polysiloxane compound (b1) include dimethyldimethoxydecane, dimethyldiethoxydecane, and diethyl Dimethoxydecane, diethyl a dialkoxy monodecane compound such as diethoxydecane, dibutyldimethoxydecane, dibutyldiethoxydecane, dioctyldimethoxydecane or dioctyldiethoxydecane; One or two alkoxy groups of the above dialkoxymonodecane compounds are substituted with a monodecane compound selected from a halogen atom or a hydroxyl group in a group consisting of fluorine, chlorine, bromine and iodine; A dioxane compound and an oligomeric alkoxylate compound obtained by condensing a monodecane compound.
作為上述單官能單矽烷化合物,例如可列舉:三甲基乙氧基矽烷、三甲基甲氧基矽烷、三乙基乙氧基矽烷、三乙基甲氧基矽烷、三丁基甲氧基矽烷、三丁基乙氧基矽烷、三辛基甲氧基矽烷、三辛基乙氧基矽烷、三苯基乙氧基矽烷、三苯基甲氧基矽烷、甲基二苯基乙氧基矽烷、二甲基苯基乙氧基矽烷等單烷氧基矽烷化合物;將該等單烷氧基矽烷化合物之烷氧基取代為選自由氟、氯、溴及碘所組成之群中的鹵素原子或羥基之單矽烷化合物。Examples of the monofunctional monodecane compound include trimethyl ethoxy decane, trimethyl methoxy decane, triethyl ethoxy decane, triethyl methoxy decane, and tributyl methoxy decane. Tributyl ethoxy decane, trioctyl methoxy decane, trioctyl ethoxy decane, triphenyl ethoxy decane, triphenyl methoxy decane, methyl diphenyl ethoxy decane, a monoalkoxydecane compound such as dimethylphenylethoxysilane; the alkoxy group of the monoalkoxydecane compound is substituted with a halogen atom selected from the group consisting of fluorine, chlorine, bromine and iodine or a monodecane compound of a hydroxyl group.
作為上述三官能單矽烷化合物,例如可列舉:三乙氧基甲基矽烷、三甲氧基甲基矽烷、三乙氧基乙基矽烷、三甲氧基乙基矽烷、三乙氧基丁基矽烷、三甲氧基丁基矽烷、三乙氧基辛基矽烷、三甲氧基辛基矽烷、三乙氧基苯基矽烷、三甲氧基苯基矽烷等三烷氧基矽烷化合物;將該等三烷氧基矽烷化合物之1~3個烷氧基取代為選自由氟、氯、溴及碘所組成之群中的鹵素原子或羥基之單矽烷化合物。Examples of the trifunctional monodecane compound include triethoxymethyl decane, trimethoxymethyl decane, triethoxyethyl decane, trimethoxyethyl decane, and triethoxy butyl decane. a trialkoxy decane compound such as trimethoxybutyl decane, triethoxyoctyl decane, trimethoxyoctyl decane, triethoxyphenyl decane or trimethoxyphenyl decane; The 1-3 alkoxy group of the decyl group compound is substituted with a halogen atom or a hydroxy group monodecane compound selected from the group consisting of fluorine, chlorine, bromine and iodine.
作為上述四官能單矽烷化合物,例如可列舉:四乙氧基矽烷、四甲氧基矽烷等四烷氧基矽烷化合物;將該等四烷氧基矽烷化合物之1~4個烷氧基取代為選自由氟、氯、溴 及碘所組成之群中的鹵素原子或羥基之單矽烷化合物。Examples of the tetrafunctional monodecane compound include a tetraalkoxydecane compound such as tetraethoxysilane or tetramethoxydecane; and 1 to 4 alkoxy groups of the above tetraalkoxydecane compound are substituted with Free choice of fluorine, chlorine and bromine And a halogen atom or a monodecane compound of a hydroxyl group in the group consisting of iodine.
作為上述具有不飽和鍵之環狀聚矽氧烷化合物(b2),可列舉:1,3,5-三甲基-1,3,5-三乙烯基環三矽氧烷、1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷、1,3,5,7,9-五甲基-1,3,5,7,9-五乙烯基環五矽氧烷、1,3,5,7,9,11-六甲基-1,3,5,7,9,11-六乙烯基環六矽氧烷、1,3,5,7,9,11,13-七甲基-1,3,5,7,9,11,13-七乙烯基環七矽氧烷、1,3,5,7,9,11,13,15-八甲基-1,3,5,7,9,11,13,15-八乙烯基環八矽氧烷、1,3,5-三苯基-1,3,5-三乙烯基環三矽氧烷、1,3,5,7-四苯基-1,3,5,7-四乙烯基環四矽氧烷、1,3,5,7,9-五苯基-1,3,5,7,9-五乙烯基環五矽氧烷等。The cyclic polysiloxane compound (b2) having an unsaturated bond may, for example, be 1,3,5-trimethyl-1,3,5-trivinylcyclotrioxane or 1,3. 5,7-tetramethyl-1,3,5,7-tetravinylcyclotetraoxane, 1,3,5,7,9-pentamethyl-1,3,5,7,9-five Vinylcyclopentaoxane, 1,3,5,7,9,11-hexamethyl-1,3,5,7,9,11-hexavinylcyclohexaoxane, 1,3,5 , 7,9,11,13-heptamethyl-1,3,5,7,9,11,13-heptavinylcyclopentaoxane, 1,3,5,7,9,11,13, 15-octamethyl-1,3,5,7,9,11,13,15-octavinylcyclooctadecane, 1,3,5-triphenyl-1,3,5-trivinyl Cyclotrioxane, 1,3,5,7-tetraphenyl-1,3,5,7-tetravinylcyclotetraoxane, 1,3,5,7,9-pentaphenyl-1 , 3,5,7,9-pentavinylcyclopentaoxane, and the like.
作為上述導入Si-H基之化合物,可列舉:二甲基氯矽烷、二甲基甲氧基矽烷、二甲基乙氧基矽烷、二苯基氯矽烷、二苯基甲氧基矽烷、二苯基乙氧基矽烷、苯基甲基氯矽烷、苯基甲基甲氧基矽烷、苯基甲基乙氧基矽烷、羥基二甲基矽烷、羥基二苯基矽烷、羥基苯基甲基矽烷等。Examples of the compound into which the Si-H group is introduced include dimethylchloromethane, dimethyl methoxy decane, dimethyl ethoxy decane, diphenyl chlorodecane, diphenyl methoxy decane, and Phenyl ethoxy decane, phenyl methyl chlorodecane, phenyl methyl methoxy decane, phenyl methyl ethoxy decane, hydroxy dimethyl decane, hydroxy diphenyl decane, hydroxy phenyl methyl decane Wait.
又,作為上述二官能矽烷化合物、單官能單矽烷化合物、三官能單矽烷化合物、四官能單矽烷化合物、導入Si-H基之化合物、或具有不飽和鍵之環狀聚矽氧烷化合物(b2),若使用將各化合物所具有的一部分或全部氫原子取代為氘及/或氟者,則可獲得後述之將本發明的含有矽之化合物的一部分或全部氫原子取代為氘及/或氟之化合物。Further, the difunctional decane compound, a monofunctional monodecane compound, a trifunctional monodecane compound, a tetrafunctional monodecane compound, a compound into which a Si-H group is introduced, or a cyclic polyoxy siloxane compound having an unsaturated bond (b2) When a part or all of hydrogen atoms of each compound are substituted with hydrazine and/or fluorine, a part or all of hydrogen atoms of the ruthenium-containing compound of the present invention may be substituted with hydrazine and/or fluorine as described later. Compound.
用以獲得含有矽之化合物(B2)之前驅物即非環狀聚矽氧 烷化合物(b1)的利用水解所進行之縮合反應,可藉由所謂之溶膠-凝膠反應來進行,其與上述具有不飽和鍵之非環狀聚矽氧烷化合物(a1)中所說明之溶膠-凝膠反應相同。Non-cyclic polyfluorene used to obtain a compound containing ruthenium (B2) The condensation reaction by the hydrolysis of the alkane compound (b1) can be carried out by a so-called sol-gel reaction, which is described in the above-mentioned acyclic polysiloxane compound (a1) having an unsaturated bond. The sol-gel reaction is the same.
前驅物即非環狀聚矽氧烷化合物(b1)與具有不飽和鍵之環狀聚矽氧烷化合物(b2)的反應,可使用利用矽氫化反應之方法。例如,將非環狀聚矽氧烷化合物(b1)與具有不飽和鍵之環狀聚矽氧烷化合物(b2)混合,添加任意量之鉑觸媒之後進行加熱,藉此可獲得含有矽之化合物(B2)。The precursor, that is, the reaction of the acyclic polyoxy siloxane compound (b1) with the cyclic polyoxy siloxane compound (b2) having an unsaturated bond, can be carried out by a hydrogenation reaction using hydrazine. For example, the acyclic polyoxy siloxane compound (b1) is mixed with a cyclic polyoxy siloxane compound (b2) having an unsaturated bond, and an arbitrary amount of a platinum catalyst is added and then heated, whereby a bismuth-containing product can be obtained. Compound (B2).
本發明之含有矽之化合物,除如下所述可用作硬化性組合物之主成分以外,亦可與其他高分子化合物或高分子組合物混合而用於樹脂、塑膠改質劑等用途。The ruthenium-containing compound of the present invention can be used as a main component of the curable composition as described below, and can be used in combination with other polymer compounds or polymer compositions for use in resins, plastic modifiers, and the like.
再者,雖然在本發明之含有矽之化合物的範圍之外,但上述通式(1)或(2)中之非環狀矽氧烷鏈中,可導入硼、鎂、鋁、磷、鈦、鋯、鉿、鐵、鋅、鈮、鉭、錫、碲等矽以外之元素。作為其方法,例如可列舉如下方法:併用供給該等其他元素之衍生物並進行水解-縮合反應,於矽氧烷鏈中組入矽以外之元素。又,亦可存在將上述含有矽之化合物的一部分或全部氫原子取代為氘及/或氟者。Further, in addition to the range of the ruthenium-containing compound of the present invention, boron, magnesium, aluminum, phosphorus, and titanium may be introduced into the acyclic siloxane chain in the above formula (1) or (2). Other than zirconium, hafnium, iron, zinc, antimony, bismuth, tin, antimony and the like. As the method, for example, a method in which a derivative other than the other element is supplied and a hydrolysis-condensation reaction is carried out, and an element other than ruthenium is incorporated in the siloxane chain. Further, some or all of the hydrogen atoms of the above-mentioned compound containing ruthenium may be substituted with ruthenium and/or fluorine.
其次,就本發明之硬化性組合物加以說明。Next, the curable composition of the present invention will be described.
本發明之硬化性組合物,係含有上述通式(1)中之Z為氫原子的含有矽之化合物(A1)、上述通式(1)中之Z為碳原子數為2~4之烯基或炔基的含有矽之化合物(B1)、及矽氫化反應觸媒(C)作為必需成分之組合物。本發明之硬化性組合物,係藉由熱及矽氫化反應觸媒(C)之作用而使含有矽 之化合物(A1)之Z基與含有矽之化合物(B1)之Z基反應而硬化。本發明之硬化性組合物所含有的含有矽之化合物(A1)及含有矽之化合物(B1)各自之較好形態為上述含有矽之化合物(A2)及含有矽之化合物(B2)。The curable composition of the present invention contains a ruthenium-containing compound (A1) in which Z in the above formula (1) is a hydrogen atom, and Z in the above formula (1) is an alkene having 2 to 4 carbon atoms. A composition containing a hydrazine compound (B1) or a hydrazine hydrogenation reaction catalyst (C) as an essential component. The curable composition of the present invention contains hydrazine by the action of heat and hydrazine hydrogenation catalyst (C) The Z group of the compound (A1) is hardened by reacting with the Z group of the ruthenium-containing compound (B1). The preferred form of each of the ruthenium-containing compound (A1) and the ruthenium-containing compound (B1) contained in the curable composition of the present invention is the above-mentioned ruthenium-containing compound (A2) and ruthenium-containing compound (B2).
本發明之硬化性組合物中,相對於100質量份的含有矽之化合物(A1),較好的是含有5~5000質量份的含有矽之化合物(B1),更好的是10~1000質量份。又,就硬化性及保存穩定性之觀點而言,在本發明之硬化性組合物中,矽氫化反應觸媒(C)之含量較好的是5質量%以下,更好的是0.0001~1.0質量%。若矽氫化反應觸媒(C)之含量多於5質量%,則有時會影響硬化性組合物之穩定性。In the curable composition of the present invention, it is preferred to contain 5 to 5000 parts by mass of the compound (B1) containing ruthenium, more preferably 10 to 1000 mass, per 100 parts by mass of the compound (A1) containing ruthenium. Share. In the curable composition of the present invention, the content of the rhodium hydrogenation catalyst (C) is preferably 5% by mass or less, more preferably 0.0001 to 1.0. quality%. When the content of the hydrogenation reaction catalyst (C) is more than 5% by mass, the stability of the curable composition may be affected.
本發明之矽氫化反應觸媒(C),係含有選自由促進矽氫化反應之鉑、鈀及銠所組成之群中的一種以上金屬之眾所周知之觸媒。例如,作為鉑系觸媒,可列舉:鉑-羧基乙烯基甲基錯合物、鉑-二乙烯基四甲基二矽氧烷錯合物、鉑-環乙烯基甲基矽氧烷錯合物、鉑-辛醛錯合物等。作為鈀系觸媒及銠系觸媒,例如可列舉:於該鉑系觸媒中代替鉑而含有同為鉑系金屬之鈀或銠等的化合物。該等矽氫化反應觸媒既可使用1種,亦可併用2種以上。尤其就硬化性之觀點而言,較好的是含有鉑者,具體而言,較好的是鉑-羧基乙烯基甲基錯合物。又,三(三苯基膦)氯化銠(I)等含有上述鉑系金屬的所謂之Wilkinson觸媒亦包含在矽氫化反應觸媒(C)中。The hydrogenation reaction catalyst (C) of the present invention is a well-known catalyst containing one or more metals selected from the group consisting of platinum, palladium and rhodium which promote the hydrogenation reaction of hydrazine. For example, as the platinum-based catalyst, a platinum-carboxyvinylmethyl complex, a platinum-divinyltetramethyldioxane complex, and a platinum-cyclovinylmethyloxane are exemplified. , platinum-octanal complex, and the like. Examples of the palladium-based catalyst and the ruthenium-based catalyst include a compound such as palladium or rhodium which is a platinum-based metal in place of platinum in the platinum-based catalyst. These hydrogenation catalysts may be used alone or in combination of two or more. Particularly, from the viewpoint of hardenability, it is preferred to contain platinum, and specifically, a platinum-carboxyvinylmethyl complex is preferred. Further, a so-called Wilkinson catalyst containing the above platinum-based metal such as tris(triphenylphosphine)iridium chloride (I) is also contained in the rhodium hydrogenation catalyst (C).
本發明之硬化性組合物中,視需要亦可含有可與含有矽 之化合物(A1)或含有矽之化合物(B1)反應之化合物(D)。The curable composition of the present invention may contain and contain bismuth as needed. The compound (A1) or the compound (D) which reacts with the ruthenium-containing compound (B1).
該化合物(D)例如可為了提高密著性而使用。該化合物(D)係與上述含有矽之化合物(A1)中之Si-H基反應之化合物、或與上述含有矽之化合物(B1)中之烯基或炔基反應之化合物,可使用1種或混合使用2種以上。化合物種類並無特別限定,就硬化物之耐熱性之觀點而言較好的是聚矽氧烷化合物。作為該聚矽氧烷化合物,例如可列舉:於具有直鏈或支鏈之聚二甲基矽氧烷的兩末端具有乙烯基、乙炔基、Si-H基等基的聚矽氧;於具有直鏈或支鏈之二甲基矽氧烷與二苯基矽氧烷的無規及/或嵌段物之兩末端,具有乙烯基、乙炔基、Si-H基等基的聚矽氧;將具有直鏈或支鏈之聚二甲基矽氧烷的一部分甲基取代為選自乙烯基、乙炔基及Si-H基中之基的聚矽氧;將具有直鏈或支鏈之二甲基矽氧烷與二苯基矽氧烷的無規及/或嵌段物的一部分甲基或苯基,取代為選自乙烯基、乙炔基及Si-H基中之基的聚矽氧;具有乙烯基、乙炔基、Si-H基等基之樹脂等。This compound (D) can be used, for example, in order to improve adhesion. The compound (D) is a compound which reacts with the Si-H group in the above-mentioned compound (A1) containing ruthenium or a compound which reacts with an alkenyl group or an alkynyl group in the above-mentioned compound (B1) containing ruthenium, and one type can be used. Or a mixture of two or more types. The type of the compound is not particularly limited, and a polyoxyalkylene compound is preferred from the viewpoint of heat resistance of the cured product. Examples of the polyoxyalkylene compound include polyfluorene having a group such as a vinyl group, an ethynyl group, or a Si-H group at both ends of a linear or branched polydimethylsiloxane. a linear or branched dimethyloxane and a diphenyl decane at both ends of a random and/or block, having a polyoxyxylene having a vinyl group, an ethynyl group, a Si-H group or the like; Substituting a part of a methyl group having a linear or branched polydimethyl methoxyalkane with a polyfluorene oxide selected from the group consisting of a vinyl group, an ethynyl group and a Si-H group; having a straight chain or a branched chain a part of a methyl or phenyl group of a random group and/or a block of a methyl oxoxane and a diphenyl siloxane, substituted with a polyoxyl group selected from the group consisting of a vinyl group, an ethynyl group, and a Si-H group. A resin having a base such as a vinyl group, an ethynyl group or a Si-H group.
相對於反應對象即含有矽之化合物(A1)及含有矽之化合物(B1)之總量,使用該化合物(D)時之使用量較好的是50質量%以下。若化合物(D)之使用量多於50質量%,則有時所獲得之硬化物之柔軟性及耐光性會下降。With respect to the total amount of the compound (A1) containing ruthenium and the compound (B1) containing ruthenium, the amount of the compound (D) to be used is preferably 50% by mass or less. When the amount of the compound (D) used is more than 50% by mass, the softness and light resistance of the cured product obtained may be lowered.
本發明之硬化性組合物中,亦可進一步調配無機填充料、耐候性賦予劑等成分作為任意成分。In the curable composition of the present invention, a component such as an inorganic filler or a weather resistance imparting agent may be further added as an optional component.
作為上述無機填充料,例如可列舉:所謂之填充劑、礦物等無機材料,或藉由有機改性處理等對該等加以改質而 成者。具體而言,例如可列舉:膠體二氧化矽、二氧化矽填充料、二氧化矽凝膠等二氧化矽類;氧化鋁、氧化鋅、氧化鈦等金屬氧化物;雲母、蒙脫土、矽石、矽藻土類、絹雲母、高嶺石、燧石、長石粉、蛭石、厄帖浦石、滑石、鐵滑石、葉臘石等礦物類;藉由有機改性處理等對該等加以改質而成者。The inorganic filler may, for example, be an inorganic material such as a filler or a mineral, or may be modified by an organic modification treatment or the like. Adult. Specific examples thereof include cerium oxide such as colloidal cerium oxide, cerium oxide filler, and cerium oxide gel; metal oxides such as alumina, zinc oxide, and titanium oxide; mica, montmorillonite, and cerium; Minerals such as stone, diatomaceous earth, sericite, kaolinite, vermiculite, feldspar powder, vermiculite, erbium, talc, iron talc, and pyrophyllite; these have been modified by organic modification treatment, etc. Quality is the one.
就耐熱性之觀點而言,上述無機填充料之粒徑較好的是100 μm以下,更好的是50 μm以下。又,當硬化物之用途重視透明性時,較好的是使用量較少而效果較高之1 μm以下之微粒子。本發明之硬化性組合物中之無機填充料之含量,當重視透明性時較好的是儘可能少地使用,故較好的是0~10質量%,當用於提高耐熱性、增黏、賦予觸變性時,較好的是10~90質量%。The inorganic filler has a particle diameter of preferably 100 μm or less, more preferably 50 μm or less, from the viewpoint of heat resistance. Further, when the use of the cured product emphasizes transparency, it is preferred to use fine particles having a small amount and a high effect of 1 μm or less. The content of the inorganic filler in the curable composition of the present invention is preferably used as little as possible when transparency is emphasized, so it is preferably from 0 to 10% by mass, which is used for improving heat resistance and viscosity-increasing. When thixotropy is imparted, it is preferably from 10 to 90% by mass.
作為上述耐候性賦予劑,可使用光穩定劑、紫外線吸收劑、酚系抗氧化劑、硫系抗氧化劑、磷系抗氧化劑等眾所周知之通常所使用者。例如,光穩定劑可列舉受阻胺類,紫外線吸收劑可列舉2-羥基二苯甲酮類、2-(2-羥基苯基)苯并三唑類、2-(2-羥基苯基)-4,6-二芳基-1,3,5-三嗪類、苯甲酸酯類、氰基丙烯酸酯類,酚系抗氧化劑可列舉三乙二醇-雙[3-(3-第三丁基-5-甲基-4-羥基苯基)丙酸酯]、二丁基羥基甲苯(BHT)、2,6-二第三丁基-對甲酚(DBPC)等,硫系抗氧化劑可列舉二烷硫基二丙酸酯類、β-烷基巰基丙酸酯類,磷系抗氧化劑可列舉有機亞磷酸酯類。As the weather resistance imparting agent, a well-known general user such as a light stabilizer, an ultraviolet absorber, a phenol antioxidant, a sulfur-based antioxidant, or a phosphorus-based antioxidant can be used. For example, examples of the light stabilizer include hindered amines, and examples of the ultraviolet absorber include 2-hydroxybenzophenones, 2-(2-hydroxyphenyl)benzotriazoles, and 2-(2-hydroxyphenyl)- 4,6-diaryl-1,3,5-triazines, benzoates, cyanoacrylates, phenolic antioxidants can be cited as triethylene glycol-bis[3-(3-third 5--5-methyl-4-hydroxyphenyl)propionate], dibutylhydroxytoluene (BHT), 2,6-di-t-butyl-p-cresol (DBPC), etc., sulfur-based antioxidants Dialkylthiodipropionates and β-alkylmercaptopropionates are exemplified, and examples of the phosphorus-based antioxidants include organic phosphites.
使用上述耐候性賦予劑時,就耐熱性、電氣特性、硬化 性、力學特性、保存穩定性、操作性之觀點而言,在本發明之硬化性組合物中其含量較好的是0.0001~50質量%,更好的是0.001~10質量%。When the weather resistance imparting agent is used, heat resistance, electrical properties, and hardening are used. The content of the curable composition of the present invention is preferably from 0.0001 to 50% by mass, more preferably from 0.001 to 10% by mass, from the viewpoints of properties, mechanical properties, storage stability, and workability.
本發明之硬化性組合物中,可於不損及本發明之目標性能的範圍內,調配其他眾所周知之各種樹脂、添加劑、填充劑等。作為可任意調配的各種樹脂之例,可列舉:聚醯亞胺樹脂、聚乙二醇或聚丙二醇等聚醚樹脂、聚胺基甲酸酯樹脂、環氧樹脂、酚樹脂、聚酯樹脂、三聚氰胺樹脂、聚醯胺樹脂、聚苯硫醚樹脂等,作為可任意調配的添加劑之例,可列舉抗靜電劑等。In the curable composition of the present invention, various other well-known various resins, additives, fillers and the like can be blended in a range that does not impair the intended properties of the present invention. Examples of various resins which can be optionally formulated include polyether resins such as polyimine resins, polyethylene glycols, and polypropylene glycols, polyurethane resins, epoxy resins, phenol resins, and polyester resins. Examples of the melamine resin, the polyamide resin, the polyphenylene sulfide resin, and the like can be arbitrarily formulated, and examples thereof include an antistatic agent.
為了不損及本發明之目標性能,含有矽之化合物(A1)、含有矽之化合物(B1)及矽氫化反應觸媒(C)以外之任意成分之使用量,相對於含有矽之化合物(A1)與含有矽之化合物(B1)的總量100質量份,較好的是合計量為10質量份以下。In order not to impair the target performance of the present invention, the amount of any component other than the compound containing ruthenium (A1), the compound containing ruthenium (B1), and the ruthenium hydrogenation catalyst (C) is relative to the compound containing ruthenium (A1) With respect to 100 parts by mass of the total amount of the compound (B1) containing ruthenium, it is preferred that the total amount is 10 parts by mass or less.
本發明之硬化性組合物在室溫(25℃)下具有良好之流動性,因而操作性優異。關於流動性,在不含無機填充料之狀態下、於室溫(25℃)下用E型黏度計測定之黏度較好的是50 Pa.S以下,更好的是10 Pa.S以下。The curable composition of the present invention has good fluidity at room temperature (25 ° C) and is therefore excellent in handleability. Regarding the fluidity, the viscosity measured by the E-type viscometer at room temperature (25 ° C) in the state without the inorganic filler is preferably 50 Pa. Below S, better is 10 Pa. S below.
又,本發明之硬化性組合物之硬化物,耐熱性、耐龜裂性、透明性、耐光性等優異。詳細而言,由本發明之硬化性組合物,可較好地獲得引起硬化物之5質量%之質量減少的溫度為300℃以上、更好的是400℃以上的硬化物。又,可較好地獲得龜裂之產生較少的硬化物。Moreover, the cured product of the curable composition of the present invention is excellent in heat resistance, crack resistance, transparency, light resistance and the like. In particular, the curable composition of the present invention can preferably obtain a cured product having a temperature at which the mass of the cured product is reduced by 5% by mass, and is preferably 300 ° C or higher, more preferably 400 ° C or higher. Further, it is possible to obtain a cured product having less occurrence of cracks.
本發明之硬化物係使本發明之硬化性組合物硬化而形成者。硬化時之加熱溫度較好的是0~300℃,更好的是100~200℃。硬化時間較好的是0.1~10小時,更好的是0.5~6小時。藉由在該等硬化反應條件下進行硬化反應,可由本發明之硬化性組合物獲得具有耐熱性、耐龜裂性等優異之性能的硬化物。The cured product of the present invention is formed by curing the curable composition of the present invention. The heating temperature at the time of hardening is preferably from 0 to 300 ° C, more preferably from 100 to 200 ° C. The hardening time is preferably 0.1 to 10 hours, more preferably 0.5 to 6 hours. By performing the curing reaction under the curing reaction conditions, a cured product having excellent properties such as heat resistance and crack resistance can be obtained from the curable composition of the present invention.
本發明之硬化物係具有優異之物性,尤其係透明性、耐熱性、耐龜裂性、耐光性、耐溶劑性、耐鹼性、耐候性、耐污染性、阻燃性、耐濕性、阻氣性、可撓性、伸長率或強度、電氣絕緣性、低介電常數性等力學特性、光學特性、電氣特性等優異之材料。The cured product of the present invention has excellent physical properties, in particular, transparency, heat resistance, crack resistance, light resistance, solvent resistance, alkali resistance, weather resistance, stain resistance, flame retardancy, moisture resistance, A material excellent in mechanical properties such as gas barrier properties, flexibility, elongation or strength, electrical insulation properties, low dielectric constant, optical properties, and electrical properties.
含有本發明之含有矽之化合物而形成的本發明之硬化性組合物,穩定性、硬化性等優異,進而其硬化物之耐龜裂性、耐熱性、耐溶劑性、耐鹼性、耐候性、光學特性、電氣特性等各物性優異。本發明之硬化性組合物可應用於電氣/電子材料領域之顯示材料/光材料/記錄材料/半導體等之密封材料、高電壓絕緣材料、以絕緣/抗振/防水/防濕為目的之灌注/密封材料、塑膠零件之試製母模、塗佈材料、層間絕緣膜、絕緣用封裝、熱收縮橡膠管、O環、顯示裝置用密封劑/保護材料、光波導管、光纖保護材料、光學透鏡、光學設備用接著劑、高耐熱性接著劑、高散熱性材料、高耐熱密封材料、太陽電池/燃料電池用構件、電池用固態電解質、絕緣包覆材料、影印機用感光鼓、氣體分離膜等。又,亦可應用於土木/建材領域之混凝土保 護材料、襯砌、土壤注入劑、密封劑、蓄冷蓄熱材料、玻璃鍍膜等,進而在醫療用材料領域中亦可應用於試管、密封材料、塗佈材料、滅菌處理裝置用密封材料、隱形眼鏡、富氧膜等。The curable composition of the present invention comprising the ruthenium-containing compound of the present invention is excellent in stability, curability, and the like, and further has crack resistance, heat resistance, solvent resistance, alkali resistance, and weather resistance of the cured product. Excellent physical properties such as optical characteristics and electrical characteristics. The curable composition of the present invention can be applied to a display material of an electric/electronic material field, a sealing material for a light material/recording material/semiconductor, a high voltage insulating material, a perfusion for the purpose of insulation/anti-vibration/waterproof/moisture resistance. / Sealing materials, prototypes of plastic parts, coating materials, interlayer insulating films, packaging for insulation, heat shrinkable rubber tubes, O-rings, sealants/protective materials for display devices, optical waveguides, optical fiber protective materials, optical lenses, Adhesive for optical equipment, high heat-resistant adhesive, high heat-dissipating material, high heat-resistant sealing material, solar cell/fuel cell member, solid electrolyte for battery, insulating coating material, photosensitive drum for photocopier, gas separation film, etc. . Also, it can be applied to concrete protection in the field of civil engineering/building materials. Protective materials, linings, soil injecting agents, sealants, cold storage materials, glass coatings, etc., and in medical materials, can also be applied to test tubes, sealing materials, coating materials, sealing materials for sterilization treatment devices, contact lenses, Oxygen-rich membranes, etc.
以下,藉由實施例等進一步說明本發明,但本發明並不因該等實施例等而受到限定。又,實施例中之「份」或「%」係以質量為基準。Hereinafter, the present invention will be further illustrated by the examples, but the present invention is not limited by the examples and the like. Further, the "parts" or "%" in the examples are based on mass.
將100份之二氯二甲基矽烷滴加至100份之離子交換水、50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中,使之於105℃下聚合5小時。用500份之離子交換水對所獲得之反應溶液進行水洗,然後使該甲苯溶液脫水,加入20份之吡啶,於其中進一步加入20份之二甲基乙烯基氧矽烷並在70℃下攪拌30分鐘。其後,用100份之離子交換水進行水洗之後,於150℃下減壓餾去溶劑。繼而以100份之乙腈進行清洗,然後於70℃下減壓餾去溶劑,獲得具有不飽和鍵之非環狀聚矽氧烷化合物(a1-1)。於下述條件下藉由GPC(gel permeation chromatography,凝膠滲透層析法)進行分析之結果為非環狀聚矽氧烷化合物(a1-1)之分子量為Mw=20,000。再者,以下之GPC均係在該條件下進行。100 parts of dichlorodimethyl decane was added dropwise to a mixture of 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution, and polymerized at 105 ° C for 5 hours. The obtained reaction solution was washed with 500 parts of ion-exchanged water, and then the toluene solution was dehydrated, 20 parts of pyridine was added thereto, and 20 parts of dimethylvinyl oxane was further added thereto and stirred at 70 ° C. minute. Thereafter, after washing with 100 parts of ion-exchanged water, the solvent was distilled off under reduced pressure at 150 °C. Then, it was washed with 100 parts of acetonitrile, and then the solvent was distilled off under reduced pressure at 70 ° C to obtain an acyclic polysiloxane compound (a1-1) having an unsaturated bond. As a result of analysis by GPC (gel permeation chromatography) under the following conditions, the molecular weight of the acyclic polysiloxane compound (a1-1) was Mw = 20,000. Furthermore, the following GPCs were carried out under these conditions.
(GPC之測定條件) 管柱:TOSOH股份有限公司製造之TSK-GEL MULTIPORE HXLM,7.8 mm×300 mm 展開溶劑:四氫呋喃(Measurement conditions for GPC) Pipe column: TSK-GEL MULTIPORE HXLM manufactured by TOSOH Co., Ltd., 7.8 mm × 300 mm Developing solvent: tetrahydrofuran
將100份之合成例1中獲得之非環狀聚矽氧烷化合物(a1-1)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為環狀聚矽氧烷化合物的1,3,5,7-四甲基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後,於70℃下減壓餾去溶劑,獲得含有矽之化合物(A-1)。GPC之分析結果為含有矽之化合物(A-1)之分子量為Mw=22,000。100 parts of the acyclic polyaluminoxane compound (a1-1) obtained in Synthesis Example 1 was dissolved in 200 parts of toluene, 0.003 part of platinum catalyst was added, and 10 parts of the cyclic polysiloxane was added. The compound of 1,3,5,7-tetramethylcyclotetraoxane was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Then, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound (A-1) containing hydrazine. As a result of analysis by GPC, the molecular weight of the compound (A-1) containing ruthenium was Mw = 22,000.
將100份之二氯二甲基矽烷滴加於100份之離子交換水、50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中,使之於105℃下聚合5小時。用500份之離子交換水對所獲得之反應溶液進行水洗,其後使該甲苯溶液脫水,加入20份之吡啶,於其中進一步加入20份之二甲基氯矽烷並於70℃下攪拌30分鐘。其後,以100份之離子交換水進行水洗之後,於150℃下減壓餾去溶劑。繼而以100份之乙腈進行清洗,其後於70℃下減壓餾去溶劑,獲得非環狀聚矽氧烷化合物(b1-1)。GPC之分析結果為非環狀聚矽氧烷化合物(b1-1)之分子量為Mw=20,000。100 parts of dichlorodimethyl decane was added dropwise to a mixture of 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution, and polymerized at 105 ° C for 5 hours. The obtained reaction solution was washed with 500 parts of ion-exchanged water, and then the toluene solution was dehydrated, 20 parts of pyridine was added thereto, 20 parts of dimethylchloromethane was further added thereto, and the mixture was stirred at 70 ° C for 30 minutes. . Thereafter, the mixture was washed with 100 parts of ion-exchanged water, and then the solvent was evaporated under reduced pressure at 150 °C. Then, it was washed with 100 parts of acetonitrile, and then the solvent was distilled off under reduced pressure at 70 ° C to obtain a non-cyclic polyoxane compound (b1-1). As a result of analysis by GPC, the molecular weight of the acyclic polysiloxane compound (b1-1) was Mw = 20,000.
將100份之合成例2中所獲得之非環狀聚矽氧烷化合物(b1-1)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為具有不飽和鍵之環狀聚矽氧烷化合物的 1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70℃下減壓餾去溶劑,獲得含有矽之化合物(B-1)。GPC之分析結果為含有矽之化合物(B-1)之分子量為Mw=22,000。100 parts of the acyclic polyaluminoxane compound (b1-1) obtained in Synthesis Example 2 was dissolved in 200 parts of toluene, 0.003 part of platinum catalyst was added, and 10 parts were used as an unsaturated bond. Cyclic polyoxyalkylene compound 1,3,5,7-Tetramethyl-1,3,5,7-tetravinylcyclotetraoxane was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Then, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound (B-1) containing hydrazine. As a result of analysis by GPC, the molecular weight of the compound (B-1) containing ruthenium was Mw = 22,000.
將100份之二氯二甲基矽烷滴加於100份之離子交換水、50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中,使之於105℃下聚合5小時。用500份之離子交換水對所獲得之反應溶液進行水洗,其後使該甲苯溶液脫水。加入20份之吡啶,進而加入0.5份之甲基三氯矽烷,於室溫下攪拌30分鐘,進而於70℃下攪拌30分鐘,然後將該溶液分為兩等份。100 parts of dichlorodimethyl decane was added dropwise to a mixture of 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution, and polymerized at 105 ° C for 5 hours. The obtained reaction solution was washed with water using 500 parts of ion-exchanged water, and thereafter the toluene solution was dehydrated. 20 parts of pyridine was added, and further 0.5 parts of methyltrichloromethane was added, and the mixture was stirred at room temperature for 30 minutes, and further stirred at 70 ° C for 30 minutes, and then the solution was divided into two equal portions.
於其中一份溶液中,添加2.5份之作為具有不飽和鍵之單官能矽烷化合物的二甲基乙烯基氯矽烷,於室溫下攪拌30分鐘,進而於70℃下攪拌30分鐘,然後以離子交換水進行水洗,由此去除吡啶鹽酸鹽,獲得具有不飽和鍵之非環狀聚矽氧烷化合物(a1-2)。To one of the solutions, 2.5 parts of dimethylvinylchloromethane as a monofunctional decane compound having an unsaturated bond was added, and the mixture was stirred at room temperature for 30 minutes, further stirred at 70 ° C for 30 minutes, and then ionized. The exchanged water was washed with water to thereby remove the pyridine hydrochloride to obtain an acyclic polysiloxane compound (a1-2) having an unsaturated bond.
於另一份溶液中,加入2.5份之作為導入Si-H基之化合物的二甲基氯矽烷,於室溫下攪拌30分鐘,進而於70℃下攪拌30分鐘,然後以離子交換水進行水洗,由此去除吡啶鹽酸鹽,獲得非環狀聚矽氧烷化合物(b1-2)。To another solution, 2.5 parts of dimethylchloromethane as a compound into which Si-H group was introduced was added, and the mixture was stirred at room temperature for 30 minutes, further stirred at 70 ° C for 30 minutes, and then washed with ion-exchanged water. Thus, the pyridine hydrochloride was removed to obtain a non-cyclic polyoxyalkylene compound (b1-2).
將100份之合成例3中所獲得之具有不飽和鍵之非環狀聚 矽氧烷化合物(a1-2)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為環狀聚矽氧烷化合物的1,3,5,7-四甲基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70℃下減壓餾去溶劑,獲得含有矽之化合物(A-2)。GPC之分析結果為含有矽之化合物(A-2)之分子量為Mw=42,000。100 parts of the non-cyclic poly group having an unsaturated bond obtained in Synthesis Example 3 The oxoxane compound (a1-2) is dissolved in 200 parts of toluene, 0.003 part of a platinum catalyst, and 10 parts of a 1,3,5,7-tetramethyl ring as a cyclic polyoxyalkylene compound are added. The tetraoxane was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Then, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound (A-2) containing hydrazine. As a result of analysis by GPC, the molecular weight of the compound (A-2) containing ruthenium was Mw = 42,000.
將100份之合成例3中所獲得之非環狀聚矽氧烷化合物(b1-2)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為具有不飽和鍵之環狀聚矽氧烷化合物的1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70C下減壓餾去溶劑,獲得含有矽之化合物(B-2)。GPC之分析結果為含有矽之化合物(B-2)之分子量為Mw=42,000。100 parts of the acyclic polyaluminoxane compound (b1-2) obtained in Synthesis Example 3 was dissolved in 200 parts of toluene, 0.003 part of platinum catalyst was added, and 10 parts were used as an unsaturated bond. The 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetraoxane of the cyclic polyoxyalkylene compound was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Thereafter, the solvent was evaporated under reduced pressure at 70 ° C to yield Compound (B-2) containing oxime. As a result of analysis by GPC, the molecular weight of the compound (B-2) containing ruthenium was Mw = 42,000.
將100份之二氯二甲基矽烷滴加於100份之離子交換水、50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中,使之於105℃下反應5小時。用500份之離子交換水對所獲得之反應溶液進行水洗,其後使該甲苯溶液脫水。加入20份之吡啶,進而加入0.5份之四氯矽烷,於室溫下攪拌30分鐘,進而於70℃下攪拌30分鐘,然後將該溶液分為兩等份。100 parts of dichlorodimethyl decane was added dropwise to a mixture of 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution, and allowed to react at 105 ° C for 5 hours. The obtained reaction solution was washed with water using 500 parts of ion-exchanged water, and thereafter the toluene solution was dehydrated. 20 parts of pyridine was added, and further 0.5 parts of tetrachloromethane was added, and the mixture was stirred at room temperature for 30 minutes, and further stirred at 70 ° C for 30 minutes, and then the solution was divided into two equal portions.
於其中一份溶液中,加入2.5份之作為具有不飽和鍵之 單官能矽烷化合物的二甲基乙烯基氯矽烷,於室溫下攪拌30分鐘,進而於70℃下攪拌30分鐘,然後以離子交換水進行水洗,由此去除吡啶鹽酸鹽,獲得具有不飽和鍵之非環狀聚矽氧烷化合物(a1-3)。In one of the solutions, 2.5 parts were added as having an unsaturated bond. Dimethyl vinyl chlorosilane of a monofunctional decane compound, stirred at room temperature for 30 minutes, further stirred at 70 ° C for 30 minutes, and then washed with ion-exchanged water, thereby removing pyridine hydrochloride to obtain an unsaturated state. Acyclic acyclic polyoxane compound (a1-3).
於另一份溶液中,加入2.5份之作為導入Si-H基之化合物的二甲基氯矽烷,於室溫下攪拌30分鐘,進而於70℃下攪拌30分鐘,然後以離子交換水進行水洗,由此去除吡啶鹽酸鹽,獲得非環狀聚矽氧烷化合物(b1-3)。To another solution, 2.5 parts of dimethylchloromethane as a compound into which Si-H group was introduced was added, and the mixture was stirred at room temperature for 30 minutes, further stirred at 70 ° C for 30 minutes, and then washed with ion-exchanged water. Thus, the pyridine hydrochloride is removed to obtain a non-cyclic polyoxyalkylene compound (b1-3).
將100份之合成例4中所獲得之具有不飽和鍵之非環狀聚矽氧烷化合物(a1-3)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為具有不飽和鍵之環狀聚矽氧烷化合物的1,3,5,7-四甲基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70℃下減壓餾去溶劑,獲得含有矽之化合物(A-3)。GPC之分析結果為含有矽之化合物(A-3)之分子量為Mw=52,000。100 parts of the acyclic polyoxy siloxane compound (a1-3) having an unsaturated bond obtained in Synthesis Example 4 was dissolved in 200 parts of toluene, 0.003 parts of platinum catalyst was added, and 10 parts were added. 1,3,5,7-tetramethylcyclotetraoxane having a cyclic polyoxyalkylene compound having an unsaturated bond was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Then, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound (A-3) containing hydrazine. As a result of analysis by GPC, the molecular weight of the compound (A-3) containing ruthenium was Mw = 52,000.
將100份之合成例4中所獲得之非環狀聚矽氧烷化合物(b1-3)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為具有不飽和鍵之環狀聚矽氧烷化合物的1,3,5,7-四甲基-1,3,5,7-乙烯基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70℃下減壓餾去溶劑,獲得含有矽之化 合物(B-3)。GPC之分析結果為含有矽之化合物(B-3)之分子量為Mw=52,000。100 parts of the acyclic polyaluminoxane compound (b1-3) obtained in Synthesis Example 4 was dissolved in 200 parts of toluene, 0.003 part of platinum catalyst was added, and 10 parts were used as an unsaturated bond. The 1,3,5,7-tetramethyl-1,3,5,7-vinylcyclotetraoxane of the cyclic polyoxyalkylene compound was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Thereafter, the solvent was distilled off under reduced pressure at 70 ° C to obtain a hydrazine-containing compound. Compound (B-3). As a result of analysis by GPC, the molecular weight of the compound containing ruthenium (B-3) was Mw = 52,000.
於將50份之實施例1中所獲得的含有矽之化合物(A-1)與50份之實施例2中所獲得的含有矽之化合物(B-1)混合而成者中,混合0.005份之作為矽氫化反應觸媒(C)的鉑-羧基乙烯基甲基錯合物,獲得硬化性組合物No.1。50 parts of the hydrazine-containing compound (A-1) obtained in Example 1 and 50 parts of the hydrazine-containing compound (B-1) obtained in Example 2 were mixed, and 0.005 parts were mixed. As the platinum-carboxyvinylmethyl complex of the hydrogenation reaction catalyst (C), the curable composition No. 1 was obtained.
於將50份之實施例3中所獲得的含有矽之化合物(A-2)與50份之實施例4中所獲得的含有矽之化合物(B-2)混合而成者中,混合0.005份之作為矽氫化反應觸媒(C)的鉑-羧基乙烯基甲基錯合物,獲得硬化性組合物No.2。50 parts of the hydrazine-containing compound (A-2) obtained in Example 3 and 50 parts of the hydrazine-containing compound (B-2) obtained in Example 4 were mixed, and 0.005 parts were mixed. As the platinum-carboxyvinylmethyl complex of the hydrogenation reaction catalyst (C), the curable composition No. 2 was obtained.
於將50份之實施例5中所獲得的含有矽之化合物(A-3)與50份之實施例6中所獲得的含有矽之化合物(B-3)混合而成者中,混合0.005份之作為矽氫化反應觸媒(C)的鉑-羧基乙烯基甲基錯合物,獲得硬化性組合物No.3。50 parts of the hydrazine-containing compound (A-3) obtained in Example 5 and 50 parts of the hydrazine-containing compound (B-3) obtained in Example 6 were mixed, and 0.005 parts were mixed. As the platinum-carboxyvinylmethyl complex of the hydrogenation reaction catalyst (C), the curable composition No. 3 was obtained.
於將50份之上述合成例1中所獲得的具有不飽和鍵之非環狀聚矽氧烷(a1-1)與50份之上述合成例2中所獲得的非環狀聚矽氧烷化合物(b1-1)混合而成者中,混合0.005份之作為硬化觸媒的鉑-羧基乙烯基甲基錯合物,獲得比較用之硬化性組合物(比-1)。50 parts of the acyclic polyfluorene oxide (a1-1) having an unsaturated bond obtained in the above Synthesis Example 1 and 50 parts of the acyclic polyoxyalkylene compound obtained in the above Synthesis Example 2 (b1-1) In the mixture, 0.005 parts of a platinum-carboxyvinylmethyl complex as a curing catalyst was mixed to obtain a curable composition for comparison (ratio-1).
於將50份之以二甲基二甲氧基矽烷及乙烯基甲基二甲氧基矽烷作為單體使之無規縮合而成之聚矽氧烷(Mw:30,000,乙烯基量:3.5 mmol/g)、與50份之以二甲基二甲氧基矽烷及甲基二甲氧基矽烷作為單體使之無規縮合而成之聚矽氧烷(Mw=30,000,Si-H基量:3.5 mmol/g)混合而成者中,混合0.005份之作為硬化觸媒的鉑-羧基乙烯基甲基錯合物,獲得比較用之硬化性組合物(比-2)。Polyoxyalkylene (Mw: 30,000, vinyl amount: 3.5 mmol) obtained by randomly condensing 50 parts of dimethyldimethoxydecane and vinylmethyldimethoxydecane as a monomer /g), polyoxyalkylene which is obtained by randomly condensing 50 parts of dimethyldimethoxydecane and methyldimethoxydecane as a monomer (Mw=30,000, Si-H basis amount) In a mixture of 3.5 mmol/g), 0.005 parts of a platinum-carboxyvinylmethyl complex as a curing catalyst was mixed to obtain a comparatively curable composition (ratio-2).
於將50份之以乙烯基三甲氧基矽烷、甲基三甲氧基矽烷及二甲基二甲氧基矽烷作為單體並以莫耳比為1:4:5之比例無規縮合而成之聚矽氧烷樹脂(Mw:30,000,乙烯基量:3.5 mmol/g)、與50份之以三甲氧基矽烷、甲基三甲氧基矽烷及二甲基二甲氧基矽烷作為單體並以莫耳比為1:4:5之比例無規縮合而成之聚矽氧烷樹脂(Mw:30,000,Si-H基量:3.5 mmol/g)混合而成者中,混合0.005份之作為硬化觸媒的鉑-羧基乙烯基甲基錯合物,獲得比較用之硬化性組合物(比-3)。50 parts of vinyl trimethoxy decane, methyl trimethoxy decane and dimethyl dimethoxy decane were randomly condensed in a molar ratio of 1:4:5. Polyoxyalkylene resin (Mw: 30,000, vinyl amount: 3.5 mmol/g), with 50 parts of trimethoxydecane, methyltrimethoxydecane and dimethyldimethoxydecane as monomers and A mixture of a polyoxane resin (Mw: 30,000, Si-H basis amount: 3.5 mmol/g) in which the ratio of molar ratio is 1:4:5 is mixed, and 0.005 parts is mixed as hardening. The platinum-carboxyvinylmethyl complex of the catalyst was used to obtain a comparatively curable composition (ratio-3).
於將50份之實施例1中所獲得的含有矽之化合物(A-1)與50份之兩末端為乙烯基的聚二甲基矽氧烷(Mw:20,000)混合而成者中,混合0.005份之作為硬化觸媒的鉑-羧基乙烯基甲基錯合物,獲得比較用之硬化性組合物(比-4)。50 parts of the compound (A-1) containing ruthenium obtained in Example 1 and 50 parts of polydimethyl methoxy oxane (Mw: 20,000) having a vinyl group at both ends, mixed 0.005 parts of a platinum-carboxyvinylmethyl complex as a curing catalyst was used to obtain a comparatively curable composition (ratio-4).
於將50份之實施例2中所獲得的含有矽之化合物(B-1)與 50份之兩末端為Si-H基的聚二甲基矽氧烷(MW:20,000)混合而成者中,混合0.005份之作為硬化觸媒的鉑-羧基乙烯基甲基錯合物,獲得比較用之硬化性組合物(比-5)。50 parts of the compound (B-1) containing ruthenium obtained in Example 2 and 50 parts of a mixture of Si-H-based polydimethyl siloxane (MW: 20,000), 0.005 parts of a platinum-carboxyvinylmethyl complex as a hardening catalyst was obtained. A comparatively hardening composition (ratio-5).
混合90份之二氯二甲基矽烷與9份之二氯二苯基矽烷,滴加於100份之離子交換水、50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中,使之於105℃下聚合5小時。用500份之離子交換水對所獲得之反應溶液進行水洗,其後使該甲苯溶液脫水,加入20份之吡啶,於其中進一步加入20份之二甲基乙烯基氯矽烷,於70℃下攪拌30分鐘。然後,以100份之離子交換水進行水洗之後,於150℃下減壓餾去溶劑。繼而以100份之乙腈進行清洗,其後於70℃下減壓餾去溶劑,獲得具有不飽和鍵之非環狀聚矽氧烷化合物(比a1-1)。Mixing 90 parts of dichlorodimethyl decane with 9 parts of dichlorodiphenyl decane, and adding dropwise to a mixture of 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution, Polymerization was carried out at 105 ° C for 5 hours. The obtained reaction solution was washed with 500 parts of ion-exchanged water, and then the toluene solution was dehydrated, 20 parts of pyridine was added thereto, and 20 parts of dimethylvinylchloromethane was further added thereto, and the mixture was stirred at 70 ° C. 30 minutes. Then, after washing with 100 parts of ion-exchanged water, the solvent was distilled off under reduced pressure at 150 °C. Then, it was washed with 100 parts of acetonitrile, and then the solvent was distilled off under reduced pressure at 70 ° C to obtain an acyclic polyoxane compound having an unsaturated bond (ratio a1-1).
將100份之所獲得的具有不飽和鍵之非環狀聚矽氧烷化合物(比a1-1)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為環狀聚矽氧烷化合物的1,3,5,7-四甲基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70℃下減壓餾去溶劑,獲得含有矽之化合物(比A-1)。GPC之分析結果為含有矽之化合物(比A-1)之分子量為Mw=22,000。100 parts of the obtained non-cyclic polyoxyalkylene compound having an unsaturated bond (ratio a1-1) was dissolved in 200 parts of toluene, 0.003 part of platinum catalyst was added, and 10 parts were used as a cyclic poly The 1,3,5,7-tetramethylcyclotetraoxane of the siloxane compound was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Thereafter, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound containing hydrazine (ratio A-1). As a result of analysis by GPC, the molecular weight of the compound containing ruthenium (compared with A-1) was Mw = 22,000.
另一方面,混合90份之二氯二甲基矽烷與10份之二氯二苯基矽烷,滴加於100份之離子交換水、50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中,使之於105℃下聚合 5小時。用500份之離子交換水對所獲得之反應溶液進行水洗,其後使該甲苯溶液脫水,加入20份之吡啶,於其中進一步加入20份之二甲基氯矽烷並於70℃下攪拌30分鐘。然後,以100份之離子交換水進行水洗之後,於150℃下減壓餾去溶劑。繼而以100份之乙腈進行清洗,其後於70℃下減壓餾去溶劑,獲得非環狀聚矽氧烷化合物(比b1-1)。On the other hand, 90 parts of dichlorodimethyl decane and 10 parts of dichlorodiphenyl decane were mixed and added dropwise to 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution. In the mixture, it is polymerized at 105 ° C 5 hours. The obtained reaction solution was washed with 500 parts of ion-exchanged water, and then the toluene solution was dehydrated, 20 parts of pyridine was added thereto, 20 parts of dimethylchloromethane was further added thereto, and the mixture was stirred at 70 ° C for 30 minutes. . Then, after washing with 100 parts of ion-exchanged water, the solvent was distilled off under reduced pressure at 150 °C. Then, it was washed with 100 parts of acetonitrile, and then the solvent was distilled off under reduced pressure at 70 ° C to obtain a non-cyclic polyoxane compound (ratio b1-1).
將100份之所獲得的非環狀聚矽氧烷化合物(比b1-1)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為具有不飽和鍵之環狀聚矽氧烷化合物的1,3,5,7-四甲基-1,3,5,7-四乙烯基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70℃下減壓餾去溶劑,獲得含有矽之化合物(比B-1)。GPC之分析結果為含有矽之化合物(比B-1)之分子量為Mw=22,000。100 parts of the obtained acyclic polyaluminoxane compound (than b1-1) was dissolved in 200 parts of toluene, 0.003 part of platinum catalyst was added, and 10 parts of the cyclic poly group having an unsaturated bond was added. The 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetraoxane of the siloxane compound was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Thereafter, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound containing hydrazine (ratio B-1). As a result of analysis by GPC, the molecular weight of the compound containing ruthenium (compared with B-1) was Mw = 22,000.
於將50份之上述含有矽之化合物(比A-1)與50份之上述含有矽之化合物(比B-1)混合而成者中,混合0.005份之作為硬化觸媒的鉑-羧基乙烯基甲基錯合物,獲得比較用之硬化性組合物(比-6)。50 parts of the above-mentioned compound containing ruthenium (compared with A-1) and 50 parts of the above-mentioned compound containing ruthenium (compared with B-1) are mixed, and 0.005 part of platinum-carboxyethylene as a hardening catalyst is mixed. A methyl group complex obtained a comparatively hardenable composition (ratio-6).
混合75份之二氯二甲基矽烷與24份之二氯二苯基矽烷,滴加於100份之離子交換水、50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中,使之於105℃下聚合5小時。用500份之離子交換水對所獲得之反應溶液進行水洗,其後使該甲苯溶液脫水,加入20份之吡啶,於其中進一步加入 20份之二甲基乙烯基氯矽烷,於70℃下攪拌30分鐘。然後,以100份之離子交換水進行水洗之後,於150℃下減壓餾去溶劑。繼而以100份之乙腈進行清洗,其後於70℃下減壓餾去溶劑,獲得具有不飽和鍵之非環狀聚矽氧烷化合物(比a1-2)。Mixing 75 parts of dichlorodimethyl decane with 24 parts of dichlorodiphenyl decane, and adding dropwise to a mixture of 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution, Polymerization was carried out at 105 ° C for 5 hours. The obtained reaction solution was washed with 500 parts of ion-exchanged water, and then the toluene solution was dehydrated, and 20 parts of pyridine was added thereto, and further added thereto. 20 parts of dimethylvinylchloromethane was stirred at 70 ° C for 30 minutes. Then, after washing with 100 parts of ion-exchanged water, the solvent was distilled off under reduced pressure at 150 °C. Then, it was washed with 100 parts of acetonitrile, and then the solvent was distilled off under reduced pressure at 70 ° C to obtain an acyclic polyoxane compound having an unsaturated bond (ratio a1-2).
將100份之所獲得的具有不飽和鍵之非環狀聚矽氧烷化合物(比a1-2)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為環狀聚矽氧烷化合物的1,3,5,7-四甲基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70℃下減壓餾去溶劑,獲得含有矽之化合物(比A-2)。GPC之分析結果為含有矽之化合物(比A-2)之分子量為Mw=22,000。100 parts of the obtained acyclic polysiloxane compound having an unsaturated bond (ratio a1-2) was dissolved in 200 parts of toluene, 0.003 part of platinum catalyst was added, and 10 parts were used as a cyclic polymerization. The 1,3,5,7-tetramethylcyclotetraoxane of the siloxane compound was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Thereafter, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound containing hydrazine (ratio A-2). As a result of analysis by GPC, the molecular weight of the compound containing ruthenium (compared with A-2) was Mw = 22,000.
另一方面,混合75份之二氯二甲基矽烷與24份之二氯二苯基矽烷,滴加於100份之離子交換水、50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中,使之於105℃下聚合5小時。用500份之離子交換水對所獲得之反應溶液進行水洗,其後使該甲苯溶液脫水,加入20份之吡啶,於其中進一步加入20份之二甲基氯矽烷,於70℃下攪拌30分鐘。然後,以100份之離子交換水進行水洗之後,於150℃下減壓餾去溶劑。繼而以100份之乙腈進行清洗,其後於70℃下減壓餾去溶劑,獲得非環狀聚矽氧烷化合物(比b1-2)。On the other hand, 75 parts of dichlorodimethyl decane and 24 parts of dichlorodiphenyl decane were mixed and added dropwise to 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution. The mixture was polymerized at 105 ° C for 5 hours. The obtained reaction solution was washed with 500 parts of ion-exchanged water, and then the toluene solution was dehydrated, 20 parts of pyridine was added thereto, 20 parts of dimethylchloromethane was further added thereto, and the mixture was stirred at 70 ° C for 30 minutes. . Then, after washing with 100 parts of ion-exchanged water, the solvent was distilled off under reduced pressure at 150 °C. Then, it was washed with 100 parts of acetonitrile, and then the solvent was distilled off under reduced pressure at 70 ° C to obtain a non-cyclic polyoxane compound (ratio b1-2).
將100份之所獲得的非環狀聚矽氧烷化合物(比b1-2)溶解於200份之甲苯中,加入0.003份之鉑觸媒、及10份之作為具有不飽和鍵之環狀聚矽氧烷化合物的1,3,5,7-四甲基- 1,3,5,7-四乙烯基環四矽氧烷,使之於105℃下反應2小時。於70℃下減壓餾去溶劑之後以100份之乙腈進行清洗。其後於70℃下減壓餾去溶劑,獲得含有矽之化合物(比B-2)。GPC之分析結果為含有矽之化合物(比B-2)之分子量為Mw=22,000。100 parts of the obtained acyclic polyaluminoxane compound (than b1-2) was dissolved in 200 parts of toluene, 0.003 part of platinum catalyst was added, and 10 parts of the cyclic poly group having an unsaturated bond was added. 1,3,5,7-tetramethyl-methoxane compound 1,3,5,7-Tetravinylcyclotetraoxane was allowed to react at 105 ° C for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C, and then washed with 100 parts of acetonitrile. Then, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound containing hydrazine (ratio B-2). As a result of analysis by GPC, the molecular weight of the compound containing ruthenium (compared to B-2) was Mw = 22,000.
於將50份之上述含有矽之化合物(比A-2)與50份之上述含有矽之化合物(比B-2)混合而成者中,混合0.005份之作為硬化觸媒的鉑-羧基乙烯基甲基錯合物,獲得比較用之硬化性組合物(比-7)。50 parts of the above-mentioned compound containing ruthenium (compared with A-2) and 50 parts of the above-mentioned compound containing ruthenium (compared to B-2) are mixed, and 0.005 part of platinum-carboxyethylene as a hardening catalyst is mixed. A methyl group complex obtained a comparatively hardenable composition (ratio-7).
於鋁板上將上述實施例7~9中所獲得之硬化性組合物No.1~3及比較例1~5中所獲得之比較用硬化性組合物(比-1)~(比-5)分別製成膜厚約為1 mm之膜,於150℃下加熱30分鐘使之硬化,獲得硬化物No.1~3及硬化物比1~5。又,所使用之硬化性組合物之編號與所獲得之硬化物之編號分別相對應。以如下方式對該等硬化物進行硬化狀態之評價及180度彎曲試驗。The curable composition for comparison (ratio -1) to (ratio -5) obtained in the curable compositions Nos. 1 to 3 and the comparative examples 1 to 5 obtained in the above Examples 7 to 9 on an aluminum plate. Films having a film thickness of about 1 mm were respectively formed and cured by heating at 150 ° C for 30 minutes to obtain cured products No. 1 to 3 and a cured product ratio of 1 to 5. Further, the number of the curable composition used corresponds to the number of the cured product obtained. The hardened materials were evaluated for the hardened state and the 180 degree bending test in the following manner.
硬化狀態係根據特定硬化時間後硬化膜有無黏著感來判斷,將具有流動性之狀態評價為×,並無流動性但有黏著感者視其程度而評價為△~,無黏著感時評價為◎。The hardened state is judged based on whether or not the cured film has a feeling of adhesion after a specific hardening time, and the state having fluidity is evaluated as ×, and there is no fluidity but the degree of adhesion is evaluated as Δ~ When the adhesiveness was not felt, it was evaluated as ◎.
180度彎曲試驗中,對在鋁板上製作膜厚約為1 mm之膜而獲得的硬化膜觀察彎曲180度時的膜之狀態。將彎折180度時膜並無龜裂及剝離之樣品評價為,將彎折180度時產生龜裂而彎折90度時未產生龜裂及剝離之樣品評價為△, 將彎折90度時產生龜裂之樣品評價為×。In the 180-degree bending test, the state of the film when the film was bent at 180 degrees was observed on a cured film obtained by forming a film having a film thickness of about 1 mm on an aluminum plate. The sample with no crack and peeling when the film was bent at 180 degrees was evaluated as The sample which was cracked when it was bent at 180 degrees and cracked and peeled at 90 degrees was evaluated as Δ, and the sample which was cracked at 90 degrees was evaluated as ×.
將結果示於表1中。The results are shown in Table 1.
如表1所明示,實施例10~12之硬化物No.1~3與比較例9~12之硬化物比2~5相比,硬化狀態為同等程度或有所提高,180度彎曲試驗之評價結果均有所提高。又,由硬化性組合物(比-1)無法獲得充分之固體硬化物。由此可確認,藉由採用本發明之構成,硬化狀態及柔軟性會提高。As shown in Table 1, the cured products Nos. 1 to 3 of Examples 10 to 12 and the cured products of Comparative Examples 9 to 12 were in the same state or improved as compared with 2 to 5, and the 180-degree bending test was performed. The evaluation results have been improved. Further, a sufficient solid cured product could not be obtained from the curable composition (ratio-1). From this, it was confirmed that the cured state and the flexibility were improved by adopting the constitution of the present invention.
將上述實施例7~9中所獲得之硬化性組合物No.1~3及上述比較例6、7中所獲得之硬化性組合物(比-6)、(比-7)分別注入至20 mm×20 mm×3 mm之模具中,於150℃下加熱1 hr,獲得厚度為3 mm之硬化物No.4~6及比6、比7。針對該等硬化物,使用高壓水銀燈進行光劣化試驗,該光劣化試驗係利用365 nm之輸出為9.96 W/cm之放射線照射2小時而實施。將光劣化試驗前後之400 nm之透射率示於表2中。The curable composition Nos. 1 to 3 obtained in the above Examples 7 to 9 and the curable compositions (ratio -6) and (ratio -7) obtained in the above Comparative Examples 6 and 7 were respectively injected into 20 In a mold of mm × 20 mm × 3 mm, it was heated at 150 ° C for 1 hr to obtain a cured product No. 4 to 6 having a thickness of 3 mm, a ratio of 6, and a ratio of 7. The photo-deterioration test was carried out using a high-pressure mercury lamp for the hardened material, and the photo-deterioration test was carried out by irradiating the radiation of 9.96 W/cm at 365 nm for 2 hours. The transmittance at 400 nm before and after the photodegradation test is shown in Table 2.
如表2所明示,實施例13~15之硬化物No.4~6與比較例11、12之硬化物比6、比7相比,耐光性均有所提高。由此可確認,使Ra ~Re 僅由脂肪族組成的硬化性組合物硬化而成之硬化物,耐光性良好。As shown in Table 2, the cured products Nos. 4 to 6 of Examples 13 to 15 and the cured products of Comparative Examples 11 and 12 had a light resistance higher than that of Comparative Examples 6 and 6. From this, it was confirmed that the cured product obtained by curing the curable composition composed of only the aliphatic group of R a to R e has good light resistance.
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007112735A JP5248032B2 (en) | 2007-04-23 | 2007-04-23 | Silicon-containing compound, curable composition, and cured product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200911887A TW200911887A (en) | 2009-03-16 |
| TWI425031B true TWI425031B (en) | 2014-02-01 |
Family
ID=39925678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097114901A TWI425031B (en) | 2007-04-23 | 2008-04-23 | A compound containing silicon, a hardened composition and a hardened product |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5248032B2 (en) |
| KR (1) | KR101478803B1 (en) |
| CN (1) | CN101616961B (en) |
| TW (1) | TWI425031B (en) |
| WO (1) | WO2008133227A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9593209B2 (en) | 2009-10-22 | 2017-03-14 | Dow Corning Corporation | Process for preparing clustered functional polyorganosiloxanes, and methods for their use |
| TWI502004B (en) * | 2009-11-09 | 2015-10-01 | Dow Corning | Process for preparing clustered functional polyorganosiloxanes, and methods for their use |
| JP5914351B2 (en) * | 2009-12-21 | 2016-05-11 | ダウ コーニング コーポレーションDow Corning Corporation | Method for producing flexible waveguide using alkyl-functional silsesquioxane resin |
| JP5857039B2 (en) * | 2011-03-30 | 2016-02-10 | 旭化成ケミカルズ株式会社 | Organopolysiloxane, process for producing the same, and curable resin composition containing organopolysiloxane |
| KR101546599B1 (en) * | 2011-03-30 | 2015-08-21 | 아사히 가세이 케미칼즈 가부시키가이샤 | Organopolysiloxane, method for producing same, and curable resin composition containing organopolysiloxane |
| CN105189685B (en) | 2013-02-11 | 2017-08-08 | 道康宁公司 | Method for forming thermally conductive thermal free radical curable silicone composition |
| US10370572B2 (en) | 2013-02-11 | 2019-08-06 | Dow Silicones Corporation | Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin |
| KR102170923B1 (en) | 2013-02-11 | 2020-10-29 | 다우 실리콘즈 코포레이션 | Curable silicone compositions comprising clustured functional polyorganosiloxanes and silicone reactive diluents |
| US9670392B2 (en) | 2013-02-11 | 2017-06-06 | Dow Corning Corporation | Stable thermal radical curable silicone adhesive compositions |
| JP6484172B2 (en) * | 2013-07-24 | 2019-03-13 | 株式会社Adeka | Curable resin composition |
| KR101630769B1 (en) * | 2014-06-24 | 2016-06-16 | 매그나칩 반도체 유한회사 | Heat releasing semiconductor package and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200513483A (en) * | 2003-10-10 | 2005-04-16 | Shinetsu Chemical Co | Curable composition |
| CN1656174A (en) * | 2002-05-01 | 2005-08-17 | 陶氏康宁公司 | Compositions for improved tank life |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07309950A (en) * | 1994-05-17 | 1995-11-28 | Toray Dow Corning Silicone Co Ltd | Organosilicon polymer and its production |
| JP3317092B2 (en) * | 1994-06-06 | 2002-08-19 | 信越化学工業株式会社 | Silicone adhesive composition and composite of cured silicone and organic resin |
| GB0127983D0 (en) * | 2001-11-22 | 2002-01-16 | Neutec Pharma Plc | Treatment of micro-organism infection |
| US7429636B2 (en) * | 2002-05-01 | 2008-09-30 | Dow Corning Corporation | Organohydrogensilicon compounds |
| ATE396220T1 (en) * | 2002-12-20 | 2008-06-15 | Dow Corning | BRANCHED POLYMERS FROM ORGANOHYDROGEN SILICONE COMPOSITIONS |
| KR101028347B1 (en) * | 2002-12-20 | 2011-04-11 | 다우 코닝 코포레이션 | Branched Polymers from Organic Hydrogenated Silicon Compounds |
| JP4520251B2 (en) * | 2003-10-10 | 2010-08-04 | 信越化学工業株式会社 | Curable composition |
| JP5137295B2 (en) * | 2005-02-24 | 2013-02-06 | 株式会社Adeka | Silicon-containing curable composition and cured product thereof |
-
2007
- 2007-04-23 JP JP2007112735A patent/JP5248032B2/en not_active Expired - Fee Related
-
2008
- 2008-04-21 KR KR1020097017296A patent/KR101478803B1/en not_active Expired - Fee Related
- 2008-04-21 CN CN2008800055878A patent/CN101616961B/en not_active Expired - Fee Related
- 2008-04-21 WO PCT/JP2008/057663 patent/WO2008133227A1/en not_active Ceased
- 2008-04-23 TW TW097114901A patent/TWI425031B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656174A (en) * | 2002-05-01 | 2005-08-17 | 陶氏康宁公司 | Compositions for improved tank life |
| TW200513483A (en) * | 2003-10-10 | 2005-04-16 | Shinetsu Chemical Co | Curable composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008266483A (en) | 2008-11-06 |
| WO2008133227A1 (en) | 2008-11-06 |
| JP5248032B2 (en) | 2013-07-31 |
| CN101616961A (en) | 2009-12-30 |
| CN101616961B (en) | 2012-01-04 |
| KR20090129989A (en) | 2009-12-17 |
| KR101478803B1 (en) | 2015-01-02 |
| TW200911887A (en) | 2009-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI424005B (en) | A compound containing silicon, a hardened composition and a hardened product | |
| TWI425031B (en) | A compound containing silicon, a hardened composition and a hardened product | |
| TWI425028B (en) | A compound containing silicon, a hardened composition and a hardened product | |
| TWI487746B (en) | A silicon-containing hardened composition and a hardened product thereof | |
| CN101111567B (en) | Silicon-containing curable composition and cured product thereof | |
| TWI530532B (en) | A silicon-containing hardened composition and a hardened product thereof | |
| TWI588513B (en) | Gradient polymer structure and method | |
| TWI582167B (en) | Containing silicon hardened composition and hardened material | |
| JP2005330324A (en) | Method for producing alkoxysilyl group-containing silane-modified phenylene ether resin, alkoxysilyl group-containing silane-modified phenylene ether resin, alkoxysilyl group-containing silane-modified phenylene ether resin composition, and phenylene ether resin-silica hybrid cured product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |