TWI422985B - Nano-lithography system and nano-lithography method - Google Patents

Description

Nano lithography system and nano lithography method

The present invention relates to a nano lithography system and a nano lithography method, and in particular, the present invention relates to a nano lithography system for melting a material with a focused beam to coat a material on a substrate, and a nano lithography method. .

In recent years, research on nanotechnology has spread all over the world, and its related research fields are all-encompassing and can be applied to many different industries. The nano lithography technology is one of the most attractive technologies in the nano manufacturing technology, which can form a micro device by making a very small structure and pattern on a substrate. The conventional nano lithography technique uses a dipping method or a heating wire heating method to place a material on a probe, and the probe contacts the substrate to apply the material to the substrate.

Please refer to FIG. 1A and FIG. 1B. FIG. 1A and FIG. 1B are schematic diagrams showing the prior art nano lithography technology. As shown in FIG. A, the lithography apparatus 1 is a pen-type nano lithography technique that includes a probe 10, and the probe 10 is coated with a liquid material 12. The probe 10 can contact the substrate, so that the liquid material 12 can be attached to the substrate to complete the nano-lithography. Since the material 12 is first attached to the probe 10 and then transferred to the substrate, the structure and pattern ultimately presented on the substrate will have a larger line width. In addition, if an error occurs in the coating, the pattern or structure coated on the substrate cannot be changed.

As shown in FIG. 1B, the lithography apparatus 2 belongs to a heated nano lithography technique. Unlike the prior art described above, the liquid material is not attached to the probe 20 of the lithography apparatus 2, but the probe 20 itself is constructed of a material to be applied to the substrate. The probe 20 is a solid coating material, and a heating wire 22 may be disposed in the probe 20 to heat the probe 20. When the probe 20 is heated to the molten state by the heating wire 22, the probe 20 may contact the substrate to apply a partially melted material to the substrate. The structure and pattern formed on the substrate by the lithography apparatus 2 can determine the line width according to the tip size of the probe 20. However, since a heating wire is required in each of the probes 20, and a circuit is required at the same time to supply current to the heating wire, the manufacturing cost thereof is high. Similarly, if an error occurs in the coating, the pattern or structure on which the substrate is applied cannot be changed.

Each of the above prior art techniques cannot directly observe the coating condition when the coating material is applied to the substrate, and thus coating errors easily occur. At the same time, after the coating error, it is impossible to correct the error and cause waste. In addition, the above prior art is required to provide a plurality of probes for large-area coating, and it is necessary to provide a heating wire and a circuit for each probe for the heated nano lithography technology, thereby increasing the complexity of the process. And manufacturing costs.

One aspect of the present invention is to provide a nanolithography system that melts a material with a focused beam to coat a material onto a substrate to solve the above problems.

According to a specific embodiment, the nanolithography system of the present invention comprises a coating structure and a beam focusing device. The coating structure is made of a solid material, and the coating structure has contact points for contacting the substrate. The beam focusing device emits a beam of light and further focuses the beam onto the contact point of the coating structure, thereby heating the material at the contact point to assume a molten state. When the material on the contact point is in a molten state and contacts the substrate, a partially melted material adheres to the substrate to achieve a lithographic effect.

In this embodiment, the coating structure is a probe and the point of contact is the tip of the probe. In another embodiment, the coating structure can be a planar structure and the point of contact can be a plurality of points of contact on the surface of the planar structure in contact with the substrate.

One aspect of the present invention is to provide a nanolithography method for easily coating a material onto a substrate by means of beam heating.

According to a specific embodiment, the nanolithography method of the present invention comprises the steps of focusing a beam of light onto a focus point of a coating structure made of a material to cause the focus point to assume a molten state; and, to exhibit a molten state. The focus point contacts the substrate to coat the material on the substrate. In another embodiment, the sequence of the above steps may also be interchanged, that is, the focus point is first contacted with the substrate, and then the beam is focused on the focus point to heat the material on the focus point.

Likewise, the coating structure described above can be a probe and the focus point can be the tip of the probe. Alternatively, the coating structure can be a planar structure, and the focus point can be a plurality of contact points on the surface of the planar structure in contact with the substrate.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

Referring to FIG. 2, FIG. 2 is a schematic diagram of a nano-lithography system 3 according to an embodiment of the present invention. As shown in FIG. 2, the nanolithography system 3 is used to coat a material on the substrate 4. The nanolithography system 3 includes a coating device 30 and a beam focusing device 32, wherein the coating device 30 further includes a carrier member 300 and a first probe 302 disposed on the carrier member 300. The carrier member 300 of the coating device 30 can be moved according to the pattern set by the user in practical applications, so that the contact point 3020 of the first probe 302 contacts the substrate 4 and moves on the substrate 4. In general, the probe has its tip as a contact point to contact the substrate.

In this embodiment, the first probe 302 is constructed of a material to be applied to a substrate. The beam focusing device 32 includes a first lighting unit 320 and a first lens 322, wherein the first lighting unit 320 can emit a light beam, and the light beam can be focused on the contact point 3020 of the first probe 302 via the first lens 322 to heat the contact. Point 3020 and the materials around it. The beam produced by the beam focusing device 32 in practice may be, but is not limited to, a laser beam.

When the beam focusing device 32 focuses the beam at the contact point 3020, the contact point 3020 and the material surrounding it will be heated, and when the contact point 3020 and the material surrounding it are heated to the melting point of the material, the contact point 3020 and its The surrounding material will be in a molten state. Next, when the contact point 3020 in a molten state contacts the substrate 4, the material can be applied onto the surface of the substrate 4.

In the present embodiment, the contact point 3020 of the probe 302 is first heated by the focus of the beam to a molten state and then contacted with the substrate 4, thereby coating the material on the substrate 4. However, in practice, the above process sequence may also vary according to the needs of the user or the designer. For example, the contact point (tip) of the probe may first contact the substrate, and the beam focusing device focuses the beam to the contact point. The material at the contact point and its surroundings is melted, and the material is coated on the substrate.

Since the tip of the first probe 302 is locally heated by focusing the beam, the heating wire and the circuit on the first probe 302 can be avoided (as disclosed in the prior art) to simplify the fabrication process and cost of the first probe 302. . In addition, since the first probe 302 itself maintains a solid state and only the tip end portion is in a molten state, the line width of the structure formed on the substrate 4 by the nano lithography system 3 of the present embodiment can be made by the first probe 302. The size of the tip and the size of the focused spot formed by the focus of the beam are determined.

Please note that in practice, the beam focusing device can emit multiple beams of light to focus on one contact point or multiple contact points. For example, please refer to FIG. 3 , which is a schematic diagram of a nano lithography system 3 according to another embodiment of the present invention. As shown in FIG. 3, the specific embodiment differs from the previous embodiment in that the beam focusing device 32 of the specific embodiment further includes a second lighting unit 324 and a second lens 326, wherein the second lighting unit 324 The emitted light beam can be focused by the second lens 326 to the contact point 3020 of the first probe 302.

In the present embodiment, the light beam emitted by the first light emitting unit 320 and the light beam emitted by the second light emitting unit 324 are focused on the contact point 3020 from different directions. In practice, the light beam emitted by the first light emitting unit 320 and the light beam emitted by the second light emitting unit 324 can also be focused at different positions. For example, in another specific embodiment, the coating device 30 may further include a second probe, and the light beam emitted by the first light emitting unit 320 may be focused on the tip end of the first probe 302 and the second light emitting unit 324 The emitted beam can be focused on the tip of the second probe to simultaneously heat the tip of the first probe 302 and the tip of the second probe.

According to another embodiment, the beam focusing device can also receive the beam emitted by the illumination unit and adjust its phase using a phase modulator. In addition, the phase modulator can also receive the light beam emitted by the light emitting unit and further form a plurality of focus points. Therefore, the present embodiment can generate a plurality of focus points using only one light emitting unit.

As described above, the method of focusing multiple beams onto the tips of a plurality of probes can be used for the fabrication of large-area components, which avoids the complicated process of fabricating the heating wires and circuits for each of the probes. Further, the coating device is not limited to coating the substrate by a probe method, but may be carried out in other structures, for example, by imprinting the substrate in a planar structure.

Referring to Figure 4, Figure 4 is a schematic diagram of a nanolithography system 5 in accordance with another embodiment of the present invention. As shown in FIG. 4, the nanolithography system 5 is used to coat a material on the substrate 6, and includes a coating device 50 and a beam focusing device 52. The coating device 50 further includes a carrier member 500 and a planar structure 502 disposed on the carrier member 500, wherein the planar structure 502 is constructed of a material to be applied to the substrate 6, and which includes a focus point 5020. Please note that in practice, the number and location of the focus points 5020 are based on the needs of the user or the designer and are not limited to this embodiment.

In the present embodiment, beam focusing device 52 further includes a lighting unit 520 and a lens 522. Light unit 520 can emit a beam of light that can be focused over focus point 5020 via lens 522. When a beam of light (e.g., a laser beam) is focused on focus point 5020, the material at focus point 5020 and its surroundings is heated, and the material will assume a molten state when focus point 5020 and its surrounding material are heated to a melting point. Next, the coating device 50 can imprint the planar structure 502 onto the substrate 6 such that the contact point 5020 contacts the substrate 6, and the coating material is coated on the substrate 6.

In practice, the probe or planar structure of each of the above embodiments may incorporate a fluorescent dye during the fabrication process. When the beam is focused on the focus of the probe or planar structure, the phosphor in the material can be simultaneously excited to cause the material to fluoresce. Therefore, if an error occurs in the process of coating the material, the user can find and handle the error early.

In addition, the material applied to the wrong location can also be used to remove the erroneous portion by the nanolithography system of the present invention. Referring to FIG. 5, FIG. 5 is a schematic diagram showing the nano-lithography system 7 according to another embodiment for removing the material 80 coated on the substrate 8.

As shown in FIG. 5, the nanolithography system 7 has a coating device 70 and a beam focusing device 72, and the coating device 70 has a carrier member 700 and a probe 702 disposed on the carrier member 700. In the present embodiment, the functions of the units of the nano-lithography system 7 are substantially the same as those of the above-described specific embodiments, and details are not described herein again.

However, in contrast to the above-described embodiments, the beam of light emitted by the beam focusing device 72 of the present embodiment is focused on the material 80 of the substrate 8 to melt the material 80 on the substrate 8. Probe 702 can contact material 80 in a molten state. Next, after the probe 702 contacts the material 80 in a molten state, the beam focusing device 72 stops the beam focusing to cool the material 80 that was originally in a molten state and re-solidifies on the probe 702. Thereafter, the probe 702 can be removed to carry away the material 80 in contact with the probe 702. Thereby, the wrong material 80 coated on the substrate 8 can be removed. Please note that in this embodiment, the substrate 8 can be a transparent substrate, so that the light beam can penetrate the substrate 8 from the back side of the substrate 8 to focus on the material 80. In practice, the beam emitted by the beam focusing device 72 can also be focused directly onto the material 80 without penetrating the substrate 8.

Referring to FIG. 2 and FIG. 6 together, FIG. 6 is a schematic diagram showing a nano lithography method according to an embodiment of the present invention. As shown in FIG. 6 in conjunction with FIG. 2, the nanolithography method of the present embodiment includes the following steps: in step S90, the beam is focused on a contact point 3020 (focus point) on the probe 302, causing the contact point 3020 and its surroundings. The material exhibits a molten state; in step S92, the contact point 3020 exhibiting a molten state contacts the substrate 4 to coat the material on the substrate 4. Please note that in this embodiment, the probe 302 is constructed of a material to be applied to the substrate 4.

The steps of the above specific embodiments may also be interchanged. For example, in another embodiment, the contact point 3020 of the probe 302 may first contact the substrate 4, and then focus the beam on the contact point 3020 to bring the contact point 3020 into a molten state to coat the material on the substrate 4. .

Further, in the method of the above specific embodiment, the structure for coating the substrate is not limited to the probe, but varies depending on the needs of the user or the designer. For example, the coating structure may also be a planar structure, and the beam is focused on a surface of the planar structure for contacting the substrate to form one or more focusing points, thereby melting the material of the focusing point and its surroundings. Then, the planar structure can be embossed so that the focus point contacts the substrate to coat the material on the substrate.

Compared with the prior art, the present invention provides a nano lithography system and a nano lithography method, which melts a material on a coated structure by focusing a light beam, and contacts a portion of the coated structure in a molten state to contact the substrate. The coating material is applied to the substrate. The nano lithography system and the nano lithography method of the present invention do not require the provision of a heating wire and a circuit on a coating structure such as a probe, thereby reducing the process complexity and manufacturing cost of the probe. In terms of large-area coating, the present invention can simultaneously produce a plurality of focused spots on a plurality of probes for large-area coating, or generate a plurality of focused spots on a planar coating structure to imprint Large area coating. In addition, the user can immediately observe the coating condition during the coating process, and the user can easily remove the wrong portion when a coating error occurs.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed. Therefore, the scope of the patented scope of the invention should be construed as broadly construed in the

1, 2. . . Lithography device

10, 20. . . Probe

12. . . material

twenty two. . . Heating wire

3, 5, 7. . . Nano lithography system

30, 50, 70. . . Coating device

32, 52, 72. . . Beam concentrating device

300, 500, 700. . . Bearing member

302. . . First probe

3020. . . Contact point

320. . . First lighting unit

322. . . First lens

324. . . Second lighting unit

326. . . Second lens

502. . . Planar structure

5020. . . Focus point

520. . . Light unit

522. . . lens

702. . . Probe

4, 6, 8. . . Substrate

80. . . material

S90, S92. . . Process step

Figure 1A and Figure 1B show schematic diagrams of prior art nanolithography techniques.

2 is a schematic diagram of a nanolithography system in accordance with an embodiment of the present invention.

Figure 3 is a schematic illustration of a nanolithography system in accordance with another embodiment of the present invention.

4 is a schematic diagram of a nanolithography system in accordance with another embodiment of the present invention.

Figure 5 is a schematic diagram showing the material of a nano lithography system for removing coating errors on a substrate according to another embodiment.

Figure 6 is a schematic diagram showing a nanolithography method in accordance with an embodiment of the present invention.

3. . . Nano lithography system

30. . . Coating device

32. . . Beam concentrating device

300. . . Bearing member

302. . . First probe

3020. . . Contact point

320. . . First lighting unit

322. . . First lens

4. . . Substrate

Claims (19)

A nano lithography system for coating a material on a substrate, the nano lithography system comprising: a coating structure, the material is made of a solid material, and the coating structure has a contact point for Contacting the substrate; and a beam focusing device for emitting a first beam and focusing the first beam on the contact point of the coating structure. The nano lithography system of claim 1, wherein the coating structure is disposed on a load bearing member. The nano lithography system of claim 2, wherein the load bearing member is movable. The nano lithography system of claim 1, wherein the coating structure comprises a first probe. The nanolithography system of claim 4, wherein the contact point is a first tip of the first probe. The nano lithography system of claim 5, wherein the first tip contacts the substrate to coat the material on the substrate when the first beam heats the first tip to a melting point of the material . The nano lithography system of claim 4, wherein the coating structure comprises a second probe, and the beam focusing device is capable of focusing the first beam on a second tip of the second probe . The nano lithography system of claim 1, wherein the coating structure is a planar structure. The nano lithography system of claim 8, wherein the contact point is a first focus point on the planar structure. The nano lithography system of claim 9, wherein the first focus point contacts the substrate to coat the material when the first light beam heats the first focus point to a melting point of the material On the substrate. The nano lithography system of claim 8, wherein the planar structure comprises a second focus point, and the beam focusing device is capable of focusing the first light beam at the second focus point. The nano lithography system of claim 1, wherein the first beam is a laser beam. The nano lithography system of claim 1, wherein the beam focusing device further comprises: a first lighting unit for emitting the first light beam; and a first lens for focusing the first beam. The nano-lithography system of claim 13, wherein the beam focusing device further comprises: a phase modulator disposed between the first lighting unit and the first lens, the phase modulator is used Receiving the first beam and adjusting the phase of the first beam. The nano lithography system of claim 13, wherein the beam focusing device further comprises: a second illuminating unit for emitting a second light beam; and a second lens for focusing the second A beam of light is applied to the coated structure. The nano lithography system of claim 1, wherein the coating structure further comprises a fluorescent dye dispersed in the material, the fluorescent dye being excited by the first light beam to emit a light . The nano lithography system of claim 1, wherein the beam focusing device is capable of focusing the first light beam on the substrate. A nanolithography method for coating a material on a substrate, the nanolithography method comprising the steps of: focusing a light beam on a focus point of a coating structure made of the material to the focus The dots exhibit a molten state; and the focal point exhibiting the molten state contacts the substrate to coat the substrate to the substrate. A nano lithography method for coating a material on a substrate, the nano lithography method comprising the steps of: focusing one of a coating structure made of the material to contact the substrate; and focusing one The focus of the beam on the substrate causes the focus to assume a molten state to coat the substrate to the substrate.