TWI419422B - Connector - Google Patents
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- TWI419422B TWI419422B TW99132440A TW99132440A TWI419422B TW I419422 B TWI419422 B TW I419422B TW 99132440 A TW99132440 A TW 99132440A TW 99132440 A TW99132440 A TW 99132440A TW I419422 B TWI419422 B TW I419422B
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- 238000003032 molecular docking Methods 0.000 claims description 28
- 230000013011 mating Effects 0.000 claims description 19
- 238000005476 soldering Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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Description
本發明涉及一種連接器,尤其是一種可插拔連接器的內置電路板結構。The present invention relates to a connector, and more particularly to a built-in circuit board structure of a pluggable connector.
與本發明相關之習知技術可參閱於2000年11月7日公告之美國第6142802號發明專利。該專利揭示了電連接器,其具有設有複數第一導電片及複數第二導電片子電路板。與該電連接器對接的對接連接器具有複數第一端子及第二端子。當對接連接器與該電連接器發生對接時,對接連接器的第一端子與子電路板的第一導電片電性連接以傳輸差分信號、電源信號及接地。第二端子與子電路板的第二導電片電性連接以傳輸電源信號及接地。The prior art relating to the present invention can be found in U.S. Patent No. 6,142,802, issued on Nov. 7, 2000. This patent discloses an electrical connector having a plurality of first conductive sheets and a plurality of second conductive sheet sub-boards. The docking connector that interfaces with the electrical connector has a plurality of first terminals and second terminals. When the docking connector is docked with the electrical connector, the first terminal of the docking connector is electrically connected to the first conductive strip of the sub-board to transmit the differential signal, the power signal, and the ground. The second terminal is electrically connected to the second conductive strip of the sub-board to transmit the power signal and the ground.
然,如此設置的電連接器中的端子數量較少,如此只能傳輸少量的信號。However, the number of terminals in the electrical connector thus arranged is small, so that only a small amount of signals can be transmitted.
所以,有必要對習知的連接器進行改良以克服上述缺陷。Therefore, it is necessary to modify the conventional connector to overcome the above drawbacks.
鑒於上述內容,本發明之目的在於提供一種可傳輸多個信號的連接器。In view of the above, it is an object of the present invention to provide a connector that can transmit a plurality of signals.
為達成前述目的,本發明提供一種連接器,其可與對接連接器對接,該連接器包括殼體、及收容於殼體內且具有第一、第二表面的內置電路板,所述內置電路板的第一表面設有第一排導電片,所述第一排導電片包括複數上接地片及複數對上差分信號片,所述內置電路板的第二表面設有第二排導電片,所述第二排導電片包括複數下接地片及複數對下差分信號片,其中,所述內置電路板的第二表面進一步設有與複數對下差分信號片沿著對接方向對齊的複數對下低頻信號片。In order to achieve the foregoing object, the present invention provides a connector that can be mated with a mating connector, the connector including a housing, and a built-in circuit board housed in the housing and having first and second surfaces, the built-in circuit board The first surface of the first conductive sheet includes a plurality of upper grounding strips and a plurality of upper differential signal sheets, and the second surface of the internal circuit board is provided with a second row of conductive sheets. The second row of conductive sheets includes a plurality of lower grounding strips and a plurality of pairs of lower differential signal sheets, wherein the second surface of the built-in circuit board is further provided with a plurality of pairs of lower and lower frequencies aligned with the plurality of pairs of differential signal sheets along the mating direction Signal chip.
與習知技術相比,本發明具有如下有益效果:本發明不增大內置電路板尺寸的情況下可以配置多對差分信號片及控制信號片,且令每對信號片之間設有接地片。如此可以傳輸多對差分信號及控制信號且令每對差分信號之間傳輸接地信號。Compared with the prior art, the present invention has the following beneficial effects: the present invention can configure a plurality of pairs of differential signal slices and control signal slices without increasing the size of the built-in circuit board, and a grounding strip is disposed between each pair of signal slices. . In this way, multiple pairs of differential signals and control signals can be transmitted and a ground signal can be transmitted between each pair of differential signals.
如第一圖至第五圖所示,符合本發明的連接器100可令線纜組合700焊接於其上。連接器100可與焊接於母電路板900上的對接連接器800對接。As shown in the first to fifth figures, the connector 100 in accordance with the present invention allows the cable assembly 700 to be soldered thereto. The connector 100 can interface with the mating connector 800 soldered to the mother board 900.
線纜組合700包括複數線纜71及固定複數線纜71的固定件72。對接連接器800包括第一遮蔽蓋體851、第二遮蔽蓋體852及對接連接器模組。第一遮蔽蓋體851底部設有開口8511。第一遮蔽蓋體851之遠離開口8511一端設有彈片8513。彈片8513上設有鎖固槽8512。焊接於母電路板900的對接連接器模組可自開口8511裝入第一遮蔽蓋體851內。第二遮蔽蓋體852套設於連接器100上用於加強抗電磁干擾的效果。The cable assembly 700 includes a plurality of cables 71 and a fixing member 72 that fixes the plurality of cables 71. The docking connector 800 includes a first shielding cover 851, a second shielding cover 852, and a docking connector module. An opening 8511 is provided at the bottom of the first shielding cover 851. A spring piece 8513 is disposed at one end of the first shielding cover 851 away from the opening 8511. The elastic piece 8513 is provided with a locking groove 8512. The mating connector module soldered to the mother board 900 can be loaded into the first shield cover 851 from the opening 8511. The second shielding cover 852 is sleeved on the connector 100 for enhancing the anti-electromagnetic interference effect.
參閱第二圖及第三圖,連接器100包括下殼體11、上殼體12、收容於下殼體11內的內置電路板2、安裝於下殼體11上的連動體31及拉帶32、與連動體31配合的扣持體6及一對螺栓4。Referring to the second and third figures, the connector 100 includes a lower casing 11, an upper casing 12, a built-in circuit board 2 housed in the lower casing 11, a linkage body 31 mounted on the lower casing 11, and a drawstring. 32. A fastening body 6 and a pair of bolts 4 that cooperate with the interlocking body 31.
下殼體11設有位於前端的矩形收容腔111、位於收容腔111之後的環形容置槽112、及位於容置槽112之後的環形開口113。所述開口113兩側設有上下延伸的一對下螺孔114。下殼體11後部的兩側設有向外突出的一對突出部115。The lower housing 11 is provided with a rectangular receiving cavity 111 at the front end, an annular receiving groove 112 behind the receiving cavity 111, and an annular opening 113 behind the receiving groove 112. A pair of lower screw holes 114 extending up and down are disposed on both sides of the opening 113. A pair of protrusions 115 projecting outward are provided on both sides of the rear portion of the lower casing 11.
上殼體12上設有一對上螺孔121。A pair of upper screw holes 121 are provided in the upper casing 12.
結合第六圖及第七圖,內置電路板2具有對接端20及設有複數導電片的第一、第二表面21、22。In conjunction with the sixth and seventh figures, the built-in circuit board 2 has a mating end 20 and first and second surfaces 21, 22 provided with a plurality of conductive sheets.
連動體31設有一對轉動臂311及連接一對轉動臂311的連接臂312。各轉動臂311包括設於端部的卡扣孔314、及位於轉動臂311中間部分的樞轉孔313。The interlocking body 31 is provided with a pair of rotating arms 311 and a connecting arm 312 that connects the pair of rotating arms 311. Each of the rotating arms 311 includes a snap hole 314 provided at the end portion and a pivot hole 313 at a middle portion of the rotating arm 311.
扣持體6包括板狀的扣持部62、安裝於扣持部62上的扣持栓61及彈簧63。扣持部62上設有配合槽64。The latch body 6 includes a plate-shaped latching portion 62, a latching bolt 61 attached to the latching portion 62, and a spring 63. The catching portion 62 is provided with a fitting groove 64.
參閱第一圖至第五圖,組裝該連接器100時,令線纜組合700的複數線纜71與內置電路板2的第一、第二表面21、22的複數導電片焊接。將內置電路板2收容於下殼體11的收容腔111內,令內置電路板2的對接端20靠近下殼體11的前端。將線纜組合700通過開口113裝入容置槽112內。將上殼體12扣持於下殼體11上。令螺栓4依次通過上螺孔121與下螺孔114從而使得上殼體12固持於下殼體11上。將拉帶32套設於連動體31的連接臂312上。令連動體31的樞轉孔313與下殼體11的突出部115配合。將扣持部62配置於下殼體11之下,且令扣持栓61穿越卡扣孔314且固定於扣持部62上。Referring to the first to fifth figures, when the connector 100 is assembled, the plurality of cables 71 of the cable assembly 700 are soldered to the plurality of conductive sheets of the first and second surfaces 21, 22 of the built-in circuit board 2. The built-in circuit board 2 is housed in the housing cavity 111 of the lower casing 11, so that the butted end 20 of the built-in circuit board 2 is close to the front end of the lower casing 11. The cable assembly 700 is inserted into the accommodating groove 112 through the opening 113. The upper casing 12 is fastened to the lower casing 11. The bolt 4 is sequentially passed through the upper screw hole 121 and the lower screw hole 114 so that the upper casing 12 is held on the lower casing 11. The draw tape 32 is sleeved on the connecting arm 312 of the linking body 31. The pivot hole 313 of the interlocking body 31 is engaged with the protruding portion 115 of the lower casing 11. The latching portion 62 is disposed under the lower casing 11 and the latching bolt 61 passes through the latching hole 314 and is fixed to the latching portion 62.
當連接器100與對接連接器800對接時,將第二遮蔽蓋體852套設於連接器100上,且令連接器100進入第一遮蔽蓋體851內與對接連接器模組對接。When the connector 100 is docked with the docking connector 800, the second shielding cover 852 is sleeved on the connector 100, and the connector 100 is inserted into the first shielding cover 851 to interface with the docking connector module.
連接器100與對接連接器800對接時可處於鎖固位置或鬆開位置。當連接器100處於鎖固位置時,下殼體11的鎖固部116與扣持體6的配合槽64接觸並嵌入第一遮蔽蓋體851的鎖固槽8512內。此時,彈簧63抵靠於鎖固部116上。當拉帶32向後拉動時,扣持部62向前運動。彈簧63被壓縮。扣持部62頂起彈片8513從而令鎖固部116脫離彈片8513的鎖固槽8512。連接器100處於鬆開位置,從而可自對接連接器800拔出。彈簧63令扣持體6復位。拉帶32、連動體31及扣持體6構成退出機構。The connector 100 can be in a locked or unlocked position when docked with the docking connector 800. When the connector 100 is in the locking position, the locking portion 116 of the lower housing 11 contacts the engaging groove 64 of the latching body 6 and is embedded in the locking groove 8512 of the first shielding cover 851. At this time, the spring 63 abuts against the lock portion 116. When the draw tape 32 is pulled back, the catching portion 62 moves forward. The spring 63 is compressed. The latching portion 62 lifts the elastic piece 8513 to disengage the locking portion 116 from the locking groove 8512 of the elastic piece 8513. The connector 100 is in the released position so that it can be pulled out from the docking connector 800. The spring 63 resets the latching body 6. The draw tape 32, the interlocking body 31, and the retaining body 6 constitute an exit mechanism.
第六圖至第八圖揭示本發明第一實施方式中的連接器100與對接連接器800的對接模組的電連接情況。參閱第六圖及第七圖,第一實施方式中的連接器100的內置電路板2的第一表面21設有靠近對接端20排列成一排的五個接地片211及四對差分信號片212、及遠離對接端20排列成一排的複數線纜焊接片213。線纜71焊接於線纜焊接片213上。每一對差分信號片212皆位於相鄰兩個接地片211之間。所述複數接地片211及複數對差分信號片212排列成一排。接地片211沿對接方向的長度長於差分信號片212的相應長度。接地片211較之差分信號片212更靠近對接端20。6 to 8 show the electrical connection of the connector 100 of the first embodiment of the present invention and the docking module of the docking connector 800. Referring to the sixth and seventh figures, the first surface 21 of the built-in circuit board 2 of the connector 100 in the first embodiment is provided with five grounding strips 211 and four pairs of differential signal sheets 212 arranged in a row near the mating end 20. And a plurality of cable soldering pieces 213 arranged in a row away from the butting end 20. The cable 71 is soldered to the cable lug 213. Each pair of differential signal chips 212 is located between two adjacent ground plates 211. The plurality of grounding strips 211 and the plurality of pairs of differential signal strips 212 are arranged in a row. The length of the grounding lug 211 in the mating direction is longer than the corresponding length of the differential signal sheet 212. The grounding piece 211 is closer to the butting end 20 than the differential signal piece 212.
內置電路板2的第二表面22設有靠近對接端20的五個接地片221、四對控制信號片223、四對差分信號片222及遠離對接端20排列成一排的複數線纜焊接片224。線纜71焊接於線纜焊接片224上。一對控制信號片223與一對差分信號片222沿著對接方向對齊且位於相鄰兩個接地片221之間。控制信號片223比差分信號片222更靠近對接端20。接地片221沿對接方向的長度長於控制信號片223或差分信號片222的相應長度。接地片221的前端較之控制信號片223的前端更靠近對接端20。控制信號片223亦可根據需要設置成其他低頻信號片。The second surface 22 of the built-in circuit board 2 is provided with five grounding strips 221 close to the mating end 20, four pairs of control signal sheets 223, four pairs of differential signal sheets 222, and a plurality of cable lugs 224 arranged in a row away from the butting end 20. . The cable 71 is soldered to the cable lug 224. A pair of control signal sheets 223 and a pair of differential signal sheets 222 are aligned in the mating direction and are located between adjacent two ground strips 221. The control signal piece 223 is closer to the butt end 20 than the differential signal piece 222. The length of the grounding piece 221 in the mating direction is longer than the corresponding length of the control signal piece 223 or the differential signal piece 222. The front end of the grounding piece 221 is closer to the butting end 20 than the front end of the control signal piece 223. The control signal slice 223 can also be set as other low frequency signal slices as needed.
第一表面21的接地片211與第二表面22的接地片221沿著上下方向部分重疊。第一表面21的差分信號片212與第二表面22的差分信號片222沿著上下方向部分重疊。The grounding piece 211 of the first surface 21 and the grounding piece 221 of the second surface 22 partially overlap in the up and down direction. The differential signal piece 212 of the first surface 21 and the differential signal piece 222 of the second surface 22 partially overlap in the up and down direction.
參閱第八圖,第一實施方式中的對接連接器800的對接連接器模組包括絕緣本體80及複數端子模組。複數端子模組包括複數第一端子模組81與複數對第二端子模組82。各第一端子模組81包括第一上端子811及第一下接觸端子812。Referring to the eighth embodiment, the docking connector module of the docking connector 800 in the first embodiment includes an insulative housing 80 and a plurality of terminal modules. The plurality of terminal modules include a plurality of first terminal modules 81 and a plurality of pairs of second terminal modules 82. Each of the first terminal modules 81 includes a first upper terminal 811 and a first lower contact terminal 812.
各第二端子模組82包括第二上端子821、第二下接觸端子822、及第二下導電端子823。Each of the second terminal modules 82 includes a second upper terminal 821, a second lower contact terminal 822, and a second lower conductive terminal 823.
當連接器100與對接連接器800對接時,第一端子模組81的第一上端子811與內置電路板2的第一表面21上的接地片211接觸以傳輸接地信號。第一下接觸端子812與內置電路板2的第二表面22上的接地片221接觸以傳遞接地信號。相鄰兩個第二端子模組82中的兩個第二上端子821與內置電路板2的第一表面21上的差分信號片212接觸以傳輸差分信號。兩個第二下接觸端子822與第二表面22的差分信號片222接觸以傳輸差分信號。兩個第二下導電端子823與兩個控制信號片223接觸以傳輸控制信號。控制信號片223亦可設置成其他的低頻信號片。When the connector 100 is docked with the mating connector 800, the first upper terminal 811 of the first terminal module 81 is in contact with the grounding strip 211 on the first surface 21 of the built-in circuit board 2 to transmit a ground signal. The first lower contact terminal 812 is in contact with the grounding strip 221 on the second surface 22 of the built-in circuit board 2 to transmit a ground signal. Two of the two adjacent second terminal modules 82 are in contact with the differential signal sheet 212 on the first surface 21 of the built-in circuit board 2 to transmit a differential signal. The two second lower contact terminals 822 are in contact with the differential signal sheet 222 of the second surface 22 to transmit a differential signal. The two second lower conductive terminals 823 are in contact with the two control signal sheets 223 to transmit control signals. The control signal slice 223 can also be set as other low frequency signal slices.
內置電路板2未增大尺寸便可配置多對差分信號片及控制信號片,且令每對信號片之間設有接地片。如此可以傳輸多對差分信號及控制信號且令每對差分信號之間傳輸接地信號。The built-in circuit board 2 can be configured with a plurality of pairs of differential signal chips and control signal chips without increasing the size, and a grounding strip is disposed between each pair of signal sheets. In this way, multiple pairs of differential signals and control signals can be transmitted and a ground signal can be transmitted between each pair of differential signals.
參閱第九圖及第十圖,第二實施方式中的內置電路板2’的第一表面21與第六圖所示無異,而第二表面22’設置成第九圖所示的結構。如第九圖所示,內置電路板2’的第二表面22’設有第二排導電片228’及第三排導電片227’。第三排導電片227’比第二排導電片228’更靠近對接端20’。第三排導電片227’包括複數控制信號片223’、複數電源片225’及接地片226’。該等控制信號片223’、電源片225’及接地片226’皆為低頻信號片。第二排導電片228’包括複數接地片221’及複數對差分信號片222’。各對差分信號片222’位於相鄰接地片221’之間。Referring to the ninth and tenth drawings, the first surface 21 of the built-in circuit board 2' in the second embodiment is the same as that shown in the sixth figure, and the second surface 22' is provided in the structure shown in the ninth figure. As shown in the ninth figure, the second surface 22' of the built-in circuit board 2' is provided with a second row of conductive sheets 228' and a third row of conductive sheets 227'. The third row of conductive sheets 227' is closer to the butt end 20' than the second row of conductive sheets 228'. The third row of conductive sheets 227' includes a plurality of control signal sheets 223', a plurality of power supply sheets 225', and a grounding strip 226'. The control signal piece 223', the power supply piece 225', and the grounding piece 226' are all low frequency signal pieces. The second row of conductive strips 228' includes a plurality of ground straps 221' and a plurality of pairs of differential signal patches 222'. Each pair of differential signal pieces 222' is located between adjacent ground plates 221'.
第十圖所示的第二實施方式中的對接連接器800’ 包括絕緣本體80’及第二端子模組82’。第二端子模組82’與第八圖所示的第一實施方式中的第二端子模組82的結構相同,包括第二上端子821’、第二下接觸端子822’、及第二下導電端子823’。參閱第十圖,第二實施方式中的第一端子模組81’包括第一上端子811’、第一下接觸端子812’、及第一下導電端子813’。The docking connector 800' in the second embodiment shown in the tenth embodiment includes an insulative housing 80' and a second terminal module 82'. The second terminal module 82' has the same structure as the second terminal module 82 in the first embodiment shown in the eighth embodiment, and includes a second upper terminal 821', a second lower contact terminal 822', and a second lower portion. Conductive terminal 823'. Referring to the tenth diagram, the first terminal module 81' in the second embodiment includes a first upper terminal 811', a first lower contact terminal 812', and a first lower conductive terminal 813'.
當內置電路板2’插入絕緣本體80’時,內置電路板2’的第一表面21上的導電片與第一上端子811’或第二上端子821’接觸並導通。內置電路板2’的第二表面22’上的第三排導電片227’與第一下導電端子813’或第二下導電端子823’接觸並導通。內置電路板2’的第二表面22’上的第二排導電片228’與第一下接觸端子812’或第二下接觸端子822’接觸並導通。When the built-in circuit board 2' is inserted into the insulative housing 80', the conductive sheets on the first surface 21 of the built-in circuit board 2' are in contact with and electrically connected to the first upper terminal 811' or the second upper terminal 821'. The third row of conductive sheets 227' on the second surface 22' of the built-in circuit board 2' is in contact with and electrically connected to the first lower conductive terminal 813' or the second lower conductive terminal 823'. The second row of conductive sheets 228' on the second surface 22' of the built-in circuit board 2' is in contact with and electrically connected to the first lower contact terminal 812' or the second lower contact terminal 822'.
第二實施方式中內置電路板2’的第二表面22’上的接地片221’設置成比第一實施方式中的接地片221更短,從而於接地片221’前增設控制信號片223’。同時,第二實施方式增設第一下導電端子813’與該控制信號片223’接觸並導通。如此使用同樣尺寸的內置電路板2’可以傳遞更多的差分信號及控制信號。In the second embodiment, the grounding strip 221' on the second surface 22' of the built-in circuit board 2' is disposed shorter than the grounding strip 221 in the first embodiment, so that the control signal sheet 223' is added in front of the grounding strip 221'. . Meanwhile, in the second embodiment, the first lower conductive terminal 813' is brought into contact with the control signal piece 223' and turned on. Thus, the same size of the built-in circuit board 2' can be used to transmit more differential signals and control signals.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent application.
100‧‧‧連接器100‧‧‧Connector
11‧‧‧下殼體11‧‧‧ Lower case
111‧‧‧收容腔111‧‧‧ containment chamber
112‧‧‧容置槽112‧‧‧ accommodating slots
113‧‧‧開口113‧‧‧ openings
114‧‧‧下螺孔114‧‧‧Under the screw hole
115‧‧‧突出部115‧‧‧Protruding
116‧‧‧鎖固部116‧‧‧Locking
12‧‧‧上殼體12‧‧‧Upper casing
121‧‧‧上螺孔121‧‧‧Upper hole
2‧‧‧內置電路板2‧‧‧ Built-in board
20‧‧‧對接端20‧‧‧ docking end
21‧‧‧第一表面21‧‧‧ first surface
211‧‧‧接地片211‧‧‧ Grounding piece
212‧‧‧差分信號片212‧‧‧Differential signal piece
213‧‧‧線纜焊接片213‧‧‧Cable soldering piece
22‧‧‧第二表面22‧‧‧ second surface
221‧‧‧接地片221‧‧‧ Grounding piece
222‧‧‧差分信號片222‧‧‧Differential signal piece
223‧‧‧控制信號片223‧‧‧Control signal piece
224‧‧‧線纜焊接片224‧‧‧Wire soldering piece
31‧‧‧連動體31‧‧‧Continuous body
311‧‧‧轉動臂311‧‧‧Rotating arm
312‧‧‧連接臂312‧‧‧Connecting arm
313‧‧‧樞轉孔313‧‧‧ pivot hole
314‧‧‧卡扣孔314‧‧‧Snap hole
32‧‧‧拉帶32‧‧‧ Pulling
4‧‧‧螺栓4‧‧‧ bolt
6‧‧‧扣持體6‧‧‧Detained body
61‧‧‧扣持栓61‧‧‧holding bolts
62‧‧‧扣持部62‧‧‧Detention Department
63‧‧‧彈簧63‧‧‧ Spring
64‧‧‧配合槽64‧‧‧With slot
700‧‧‧線纜組合700‧‧‧ cable combination
71‧‧‧線纜71‧‧‧ Cable
72‧‧‧固定件72‧‧‧Fixed parts
800‧‧‧對接連接器800‧‧‧Docking connector
80‧‧‧絕緣本體80‧‧‧Insulated body
81‧‧‧第一端子模組81‧‧‧First terminal module
811‧‧‧第一上端子811‧‧‧first upper terminal
812‧‧‧第一下接觸端子812‧‧‧First contact terminal
82‧‧‧第二端子模組82‧‧‧Second terminal module
821‧‧‧第二上端子821‧‧‧Second upper terminal
822‧‧‧第二下接觸端子822‧‧‧Second lower contact terminal
823‧‧‧第二下導電端子823‧‧‧Second lower conductive terminal
851‧‧‧第一遮蔽蓋體851‧‧‧First cover body
8511‧‧‧開口8511‧‧‧ openings
8512‧‧‧鎖固槽8512‧‧‧Locking slot
8513‧‧‧彈片8513‧‧‧Shrap
852‧‧‧第二遮蔽蓋體852‧‧‧Second shade cover
900‧‧‧母電路板900‧‧‧Female circuit board
2’‧‧‧內置電路板2'‧‧‧ Built-in board
20’‧‧‧對接端20’‧‧‧ docking end
22’‧‧‧第二表面22'‧‧‧ second surface
221’‧‧‧接地片221’‧‧‧ Grounding piece
222’‧‧‧差分信號片222’‧‧‧Differential signal piece
223’‧‧‧控制信號片223’‧‧‧Control signal
224’‧‧‧線纜焊接片224’‧‧‧Cable soldering piece
225’‧‧‧電源片225’‧‧‧Power film
226’‧‧‧接地片226’‧‧‧ Grounding piece
227’‧‧‧第三排導電片227’‧‧‧ Third row of conductive sheets
228’‧‧‧第二排導電片228’‧‧‧Second row of conductive sheets
800’‧‧‧對接連接器800'‧‧‧Docking Connector
80’‧‧‧絕緣本體80’‧‧‧Insulated body
81’‧‧‧第一端子模組81'‧‧‧First Terminal Module
811’‧‧‧第一上端子811’‧‧‧first upper terminal
812’‧‧‧第一下接觸端子812'‧‧‧First contact terminal
813’‧‧‧第一下導電端子813'‧‧‧First lower conductive terminal
82’‧‧‧第二端子模組82'‧‧‧Second terminal module
821’‧‧‧第二上端子821’‧‧‧Second upper terminal
822’‧‧‧第二下接觸端子822’‧‧‧Second lower contact terminal
823’‧‧‧第二下導電端子823’‧‧‧Second lower conductive terminal
第一圖係本發明第一實施方式的連接器與線纜組合、對接連接器及母電路板的組合圖。The first figure is a combination diagram of a connector and a cable combination, a mating connector, and a mother board of the first embodiment of the present invention.
第二圖係第一圖所示連接器與線纜組合、對接連接器及母電路板的另一組合圖。The second figure is another combination of the connector and cable combination, the docking connector and the mother board shown in the first figure.
第三圖係第一圖所示的連接器與線纜組合、對接連接器的分解圖。The third figure is an exploded view of the connector and cable combination and the docking connector shown in the first figure.
第四圖係第三圖所示的連接器與線纜組合、對接連接器的另一角度的分解圖。The fourth figure is an exploded view of the connector and cable combination and the other angle of the docking connector shown in the third figure.
第五圖係內置電路板及線纜組合安裝於下殼體內的部分組裝圖。The fifth figure is a partial assembly diagram of the built-in circuit board and the cable combination installed in the lower casing.
第六圖係內置電路板的第一表面的視圖。The sixth picture is a view of the first surface of the built-in circuit board.
第七圖係內置電路板的第二表面的視圖。The seventh picture is a view of the second surface of the built-in circuit board.
第八圖係第一實施方式的對接連接器的對接連接器模組的視圖。The eighth figure is a view of the docking connector module of the docking connector of the first embodiment.
第九圖係第二實施方式的內置電路板的第二表面的視圖。The ninth drawing is a view of the second surface of the built-in circuit board of the second embodiment.
第十圖係第二實施方式的對接連接器的對接連接器模組的視圖。The tenth view is a view of the docking connector module of the docking connector of the second embodiment.
2‧‧‧內置電路板 2‧‧‧ Built-in board
20‧‧‧對接端 20‧‧‧ docking end
22‧‧‧第二表面 22‧‧‧ second surface
221‧‧‧接地片 221‧‧‧ Grounding piece
222‧‧‧差分信號片 222‧‧‧Differential signal piece
223‧‧‧控制信號片 223‧‧‧Control signal piece
224‧‧‧線纜焊接片 224‧‧‧Wire soldering piece
Claims (10)
殼體;及
收容於殼體內且具有第一、第二表面的內置電路板,所述內置電路板的第一表面設有第一排導電片,所述第一排導電片包括複數上接地片及複數對上差分信號片,所述內置電路板的第二表面設有第二排導電片,所述第二排導電片包括複數下接地片及複數對下差分信號片,所述內置電路板的第二表面進一步設有與複數對下差分信號片沿著對接方向對齊的複數對下低頻信號片。A connector that interfaces with a docking connector, including:
a housing; and a built-in circuit board having a first surface and a second surface; the first surface of the built-in circuit board is provided with a first row of conductive sheets, and the first row of conductive sheets includes a plurality of grounding strips And a plurality of pairs of upper differential signal sheets, the second surface of the built-in circuit board is provided with a second row of conductive sheets, and the second row of conductive sheets includes a plurality of lower grounding strips and a plurality of pairs of lower differential signal sheets, the built-in circuit board The second surface is further provided with a plurality of pairs of lower low frequency signal slices aligned with the plurality of pairs of lower differential signal slices along the mating direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99132440A TWI419422B (en) | 2010-09-24 | 2010-09-24 | Connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99132440A TWI419422B (en) | 2010-09-24 | 2010-09-24 | Connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201214894A TW201214894A (en) | 2012-04-01 |
| TWI419422B true TWI419422B (en) | 2013-12-11 |
Family
ID=46786598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99132440A TWI419422B (en) | 2010-09-24 | 2010-09-24 | Connector |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI419422B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6846115B1 (en) * | 2001-01-29 | 2005-01-25 | Jds Uniphase Corporation | Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor |
| TWM360467U (en) * | 2008-12-02 | 2009-07-01 | P Two Ind Inc | Flat cable connection structure |
| US7614913B2 (en) * | 2007-06-28 | 2009-11-10 | Finisar Corporation | Connector receptacle with receptacle EMI shield |
-
2010
- 2010-09-24 TW TW99132440A patent/TWI419422B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6846115B1 (en) * | 2001-01-29 | 2005-01-25 | Jds Uniphase Corporation | Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor |
| US7614913B2 (en) * | 2007-06-28 | 2009-11-10 | Finisar Corporation | Connector receptacle with receptacle EMI shield |
| TWM360467U (en) * | 2008-12-02 | 2009-07-01 | P Two Ind Inc | Flat cable connection structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201214894A (en) | 2012-04-01 |
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