TWI418067B - A crystal oscillator with a layout structure for miniaturized dimensions - Google Patents

Description

Crystal oscillator with layout structure for miniaturized size

The present invention relates to a piezoelectric device, and more particularly to an oscillator piezoelectric device.

The use of quartz crystal piezoelectric elements as oscillators is currently the best oscillator for accuracy and stability. The International Electrotechnical Commission (IEC) classifies quartz crystal piezoelectric element oscillators into four categories: quartz clock crystal oscillators (Simple Package) Crystal Oscillator, SPXO), Voltage Controlled Crystal Oscillator (VCXO), Temperature Compensated Crystal Oscillator (TCXO), Oven Controlled Crystal Oscillator (OCXO) With the booming development of the electronics industry, electronic products have entered the direction of multi-functional, high-performance and lightweight research and development. In order to meet the high integration of semiconductor wafers and miniaturized packaging requirements, the past layout of the circuit is insufficient. For the conventional oscillator circuit layout, refer to FIG. 1A to FIG. 1D, FIG. 1A and FIG. 1B to illustrate a schematic diagram of a conventional oscillator patterned circuit and an electrical contact diagram, FIG. 1C and FIG. 1D diagram to illustrate the schematic diagram of the patterned circuit of the miniaturized oscillator and the schematic diagram of the electrical contacts. As shown in FIG. 1A and FIG. 1B, the circuit layout of the conventional crystal oscillator 10 is due to the fact that in the past, the crystal oscillation integrated circuit 12 and the platform 14 have a large area, and the wall thickness of the substrate 14 is allowed to be allowed. There may be a large groove space, so that the layout space of the larger use can be used. In the case where the process capability of the platform 14 does not cause the plurality of patterned lines 16 to be short-circuited with each other, the patterned circuit 16 can be electrically connected. Point 18 is around the crystal oscillation integrated circuit 12, and during the process of testing the piezoelectric element, the required patterned electrical unit 17 also has a sufficient contact area, so that the piezoelectric element can reach a certain level during the test process. Yield. As shown in FIG. 1C and FIG. 1D, when the size of the crystal oscillator 10 is further miniaturized, the electrical contacts 18 designed by the prior art are arranged around the crystal oscillation integrated circuit 12. Because of the limitation of the groove space and the limitation of the process capability of the platform 14, the contact area of the patterned patterned electrical unit 17 in the piezoelectric element process is made very narrow, and the contact area of the patterned electrical unit 17 is small. This in turn causes the piezoelectric component to have a difficult test in the test process and the lack of good yield on the test. Therefore, how to increase the wiring density of the package substrate in a limited space to achieve miniaturization, and to maximize the area of the patterned electrical unit is the direction of the research and improvement of the present invention.

In view of the above, the present invention is directed to the above problem, and proposes a crystal oscillator having a layout structure for miniaturization size to solve a quartz clock crystal oscillator, a programmable quartz crystal oscillator, and a voltage controlled quartz crystal oscillator. And the temperature-compensated crystal oscillator is difficult to miniaturize due to the conventional circuit line layout.

The main object of the present invention is to provide a crystal oscillator having a layout structure for a miniaturized size, using an electrical contact of each of the first patterned lines and an electrical conduction contact connected to the crystal oscillation integrated circuit. The center of the first groove is symmetrically concentrated, so that the flexibility of the layout of the circuit can be improved in a limited space of the platform, so as to solve the low yield of the conventional crystal oscillator caused by miniaturization. Missing.

Another object of the present invention is to provide a crystal oscillator having a layout structure for a miniaturized size, wherein the electrical contact and the electrical conduction contact are symmetrically concentrated from the center of the outward first groove, and the electrical connection is made. The point is located below the crystal oscillation integrated circuit, so that the first groove can allow sufficient layout space to maximize the pattern of at least two patterned electrical units, so the present invention is solved in the past. In the limited space of the size, because the necessary test pins must be reserved in the process of the piezoelectric component, it is impossible to provide the crystal oscillator with sufficient contact area during the test process, which results in a good test process. The rate is not good.

A further object of the present invention is to provide a crystal oscillator having a layout structure for a miniaturized size. The pin of the crystal oscillation integrated circuit is bonded to the patterned line on the platform through the flip chip package, thereby oscillating the integrated circuit through the crystal. The relative position between the bits is shortened, which enables higher mass production realization, and miniaturization will bring lower cost. This miniaturized layout structure will greatly increase the achievability of the process but still sustain crystal oscillation. The size of the integrated circuit is reduced to achieve cost advantages. Relatively reduce the parallelism requirement of the platform of the flip chip package, thereby reducing the specification requirements and cost of the platform.

In order to achieve the above object, the present invention provides a crystal oscillator having a layout structure for a miniaturized size, comprising at least: a platform having a first groove and a second groove, a plurality of internal leads, arranged inside the platform, and crystal oscillation The integrated circuit is disposed at a near central position of the first recess, the crystal oscillation integrated circuit is electrically connected to the inner lead, and the plurality of first patterned lines are disposed in the first recess, electrically connected to the inner lead, wherein each A patterned circuit has an electrical contact, and the electrical contacts are symmetrically concentrated from the center of the outwardly facing first recess, and the electrical contacts are located below the crystal oscillation integrated circuit.

The purpose, technical content, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments.

The invention relates to a crystal oscillator with a layout structure for miniaturization, which can be applied to a quartz clock crystal oscillator, a programmable quartz crystal oscillator, a voltage controlled quartz crystal oscillator and a temperature compensated quartz crystal oscillator. The layout structure, when the circuit layout is performed, the electrical contacts of the patterned circuit are symmetrically concentrated from the outside to the center of the first groove, and the electrical contacts are located below the crystal oscillation integrated circuit, so In the space of the platform, the flexibility of the layout of the circuit can be improved, so that the first groove can allow sufficient layout space, and the pattern of at least two patterned electrical units can be expanded to maximize the crystal oscillator. The area of the pattern required to test the piezoelectric element is increased, thereby improving the test yield of the crystal oscillator. By using the invention, the oscillator can no longer be trapped in the environment where the electrical contact arrangement used in the past is arranged around the crystal oscillation integrated circuit, resulting in insufficient wiring space, making the patterned circuit of the crystal oscillator difficult to miniaturize.

Embodiments of the present invention firstly refer to FIG. 2, FIG. 3A, and FIG. 3B to illustrate a perspective view of a crystal oscillator, a schematic circuit diagram, and an electrical contact diagram of the present invention, as shown in FIG. The present invention provides a crystal oscillator 20 having a layout structure, which comprises at least a platform 22 which can be made of a ceramic material, the platform 22 has a first recess 23, and the first recess 23 is provided with a plurality of first patterns. The circuit 24, the first patterned circuit embodiment can be applied by using a single layer and a plurality of metal structures of titanium, aluminum, gold, nickel, copper, silver, platinum, rhodium, lithium, chromium, lanthanum or tungsten. As shown in FIG. 3A and FIG. 3B , each of the first patterned lines 24 has an electrical contact 26 , and the electrical contacts 26 are symmetrically concentrated from the outside to the center of the first recess 23 , and The electrical contact 26 is disposed below the crystal oscillation integrated circuit 28, and at least two patterned electrical units 30 are disposed in the plurality of patterned circuits 24, and one end of the patterned electrical unit 30 is an electrical contact 26, and the electrical The patterning unit 30 is testable at the other end. The pattern, since the electrical contacts 26 are symmetrically concentrated from the outside to the center of the first groove 23, the first groove 23 can allow sufficient layout area to make the pattern area of the other end of the patterned electrical unit 30 Expanding to maximize, therefore, the test pattern of the crystal oscillator can be improved by this line layout, wherein the electrical contact 26 can be used as an electrical contact pad or a bump pad. Or a packaging method such as a wire bonding pad, wherein the bump pad may be a gold bump or a solder bump, and the pattern of the first patterned line 24 is The description of the embodiment and the drawings is explained by forming a convex shape, but the pattern shape of the first patterned line 24 is not a limitation, and may be other such as a plurality of polygons, or even at most a circle. In addition, the technical features of the electrical contacts 26 of the plurality of first patterned lines 24 disclosed in the present invention are in this embodiment with six first patterned lines 24 having six electrical contacts 26 . For example, if the embodiment is a crystal oscillator (not shown) having a layout structure with four electrical contacts or six or more electrical contacts, the technical features of the embodiments are the same. As described in the embodiment, the electrical contacts 26 of each of the first patterned lines 24 are symmetrically concentrated from the center of the first recess 23, and the electrical contacts 26 are located at the crystal oscillation integrated circuit 28. Below, the plurality of first patterned lines 24 have at least two patterned electrical units 30, one end of the patterned electrical unit 30 is an electrical contact 26, and the pattern at the other end can be expanded to maximize, as for other Part of the structure will not be described here.

4, 5A, and 5B, in order to explain the main components of the crystal oscillator of the present invention, a bottom perspective exploded view and a top perspective exploded view, as shown in FIG. 4, the present invention is provided. The platform 22 used in the crystal oscillator 20 of the layout structure is a double groove structure having a first groove 23 and a second groove 33. The plurality of inner leads 34 are arranged inside the platform 22, and the quartz clock crystal can be utilized. An oscillator control chip, a programmable quartz crystal oscillator control chip, a voltage controlled quartz crystal oscillator control chip, or a temperature compensated quartz crystal oscillator control chip, one of the types of crystal oscillation integrated circuits 28, disposed in the first groove 23 is close to the central position; as shown in FIG. 5A, the crystal oscillation integrated circuit 28 has a plurality of electrically conductive contacts 35 electrically connected to the electrical contacts 26 through the interconnecting elements 36, and the interconnecting elements 36 can be used therein. For mounting methods such as electrical contact pads, bump pads, or wire bonding pads, the bump pads can be gold bumps or tin bumps. Bump (Solder Bump); as shown in FIG. 5B, the present invention is provided with at least two second patterned lines 37 disposed in the second recess 33, wherein the second recess 33 can be made of conductive silver paste with high conductivity. As the first coupling element 38 and the second coupling element 40, the present invention can use a quartz wafer as the piezoelectric element 41, is disposed in the second groove 33, and can utilize physical vapor deposition or chemical vapor deposition or sputtering. The plating method is performed to deposit the first coating electrode 42 and the second coating electrode 44 on the piezoelectric element 41, and then, as shown in FIGS. 4, 5A and 5B, the second patterned line 37 is transmitted. The inner lead 34 is electrically connected to the patterned electrical unit 30, the first coupling element 38 and the first coating electrode 42, and the other second patterned line 37' is also electrically connected to another patterned electric through the inner lead 34. The piezoelectric element 41 is subjected to a piezoelectric effect and is tested by at least two patterned electrical units 30 to complete the process test of the piezoelectric element 41. Wherein the second patterned line, the first coated electrode And the second coating electrode can be used as a single layer and a plurality of metal structure materials of titanium, aluminum, gold, nickel, copper, silver, platinum, rhodium, lithium, chromium, lanthanum or tungsten; as shown in FIG. 4 and As shown in FIG. 5A, the primer 46 can be used to fix and strengthen the bonding strength of the crystal oscillation integrated circuit 28 on the first recess 23, and can protect the first recess 23, the crystal oscillation integrated circuit 28, and the electrical connection. Point 35 and the interconnecting component 36. As shown in FIG. 4 and FIG. 5A, the present invention is provided with a plurality of conductive electrodes 48 disposed on the surface 50 of the platform 22 to electrically connect the internal leads 34 and electrically connect an external portion. The circuit (not shown), therefore, the crystal oscillator integrated circuit 28 can obtain an external voltage source and a quartz clock crystal oscillator, a programmable quartz crystal oscillator, and a voltage controlled quartz crystal oscillation by an external circuit (not shown). Different types of crystal oscillators 20 of the temperature compensated quartz crystal oscillator form an oscillating circuit, and the piezoelectric element 41 is electrically connected through the inner lead 34 to drive and control the piezoelectric element 41 to generate a frequency signal or to make a temperature compensated quartz. Crystal oscillator The row compensates the temperature effect of the piezoelectric element 41, and the piezoelectric element 41 generates a piezoelectric effect to obtain a reference frequency and transmits a reference frequency to the external circuit (not shown) through the conduction electrode 48, and further, is turned on here. The embodiment of the electrode 48 can be applied by using a single layer and a multi-layer metal structure material of titanium, aluminum, gold, nickel, copper, silver, platinum, rhodium, lithium, chromium, lanthanum or tungsten; finally, as shown in FIG. 5B The present invention can be provided on the metal surface 56 of the platform 22 by using a metal-clad package board 52, which can seal the second recess 33 and shield electromagnetic interference (EMI).

6A and 6B are used to illustrate a perspective view of the metal ring of the present invention and a cross-sectional view of the additional metal ring. As shown, the shielding plate can be used on the metal surface 56 of the platform 22 to achieve shielding electromagnetic The effect of the interference, but the present invention can be disposed between the metal surface 56 and the package board 52 through the additional metal ring 58, and then the metal surface 56 is fixed by the package board 52 to increase the electromagnetic interference shielding effect and the high temperature sealing process. The high temperature thermal stress buffer.

The piezoelectric component used in the present invention is a quartz wafer, wherein the quartz wafer is an AT angle-cut wafer or a Tuning Fork; wherein the AT angle-cut wafer is one of various types of cutting angles. The AT angle-cut quartz wafer is suitable for the frequency range from several MHz to several 佰MHz. It is the most widely used and widely used cutting application method for quartz wafers. It is also a technically well-achieved operation method for mass production. .

The embodiments described above are only the preferred embodiments of the present invention, and the features of the present invention are described by the embodiments, which are intended to enable those skilled in the art to understand the present invention and The scope of the practice of the invention. Equivalent changes and modifications to the structures, shapes, features, and spirits of the present invention should be included in the scope of the present invention.

10. . . Crystal oscillator

12. . . Crystal oscillation integrated circuit

14. . . platform

16. . . Patterned line

17. . . Patterned electrical unit

18. . . Electrical contact

20. . . Crystal oscillator

twenty two. . . platform

twenty three. . . First groove

twenty four. . . First patterned line

26. . . Electrical contact

28. . . Crystal oscillation integrated circuit

30. . . Patterned electrical unit

33. . . Second groove

34. . . Internal lead

35. . . Electrically conductive contact

36. . . Interconnecting component

37. . . Second patterned circuit

37’. . . Second patterned circuit

38. . . First coupling element

40. . . Second coupling element

41. . . Piezoelectric element

42. . . First coating electrode

44. . . Second coated electrode

46. . . Primer

48. . . Conduction electrode

50. . . surface

52. . . Package board

56. . . Metal surface

58. . . metal ring

Figure 1A is a schematic diagram of a conventional crystal oscillator patterned circuit.

Figure 1B is a schematic diagram of a conventional crystal oscillator electrical contact.

Figure 1C is a schematic diagram of a patterned circuit of a crystal oscillator of a reduced size.

Figure 1D is a schematic diagram of an electrical contact of a crystal oscillator of a miniaturized size.

Fig. 2 is a perspective view of the crystal oscillator of the present invention.

3A is a schematic diagram of a patterned circuit of a crystal oscillator of the present invention.

FIG. 3B is a schematic diagram of an electrical contact of the crystal oscillator of the present invention.

Fig. 4 is a cross-sectional view showing the main components of the crystal oscillator of the present invention.

Fig. 5A is a bottom perspective exploded view of the crystal oscillator of the present invention.

Fig. 5B is a perspective exploded view of the crystal oscillator of the present invention.

Fig. 6A is an exploded perspective view showing the addition of a metal ring of the crystal oscillator of the present invention.

Fig. 6B is a cross-sectional view showing the addition of a metal ring of the crystal oscillator of the present invention.

20. . . Crystal oscillator

twenty two. . . platform

26. . . Electrical contact

28. . . Crystal oscillation integrated circuit

30. . . Patterned electrical unit

Claims (19)

A crystal oscillator having a layout structure for miniaturization size includes at least: a platform having a first recess and a second recess; a plurality of internal leads disposed inside the platform; and a crystal oscillation integrated circuit The crystal oscillation integrated circuit is electrically connected to the inner lead; and the plurality of first patterned lines are disposed in the first recess and electrically connected to the inner lead, wherein the inner lead is electrically connected Each of the first patterned lines has an electrical contact, the electrical contacts being symmetrically concentrated outwardly toward the center of the first recess, and the electrical contacts are located below the crystal oscillation integrated circuit, and the The first patterned circuit has at least two patterned electrical units, one end of each of the patterned electrical units is the electrical contact, and the pattern at the other end is expanded to maximize. A crystal oscillator having a layout structure for a miniaturized size according to claim 1, further comprising at least two second patterned lines disposed on the second recess, wherein a first coupling is disposed on the second recess An element and a second coupling element. A crystal oscillator having a layout structure for a miniaturized size according to claim 2, further comprising a piezoelectric element disposed in the second recess, the piezoelectric element having a first coated electrode and a first a first coating electrode electrically connected to the first coupling element and the inner lead, the second coating electrode electrically connecting the second coupling element and the inner lead, causing the piezoelectric element to generate pressure Electrical effect. A crystal oscillator having a layout structure for miniaturization size according to claim 2, wherein the first coupling element and the second coupling element are electrically conductive silver paste. A crystal oscillator having a layout structure for miniaturization size as described in claim 1 The crystal oscillator can be divided into a quartz crystal oscillator (SPXO) or a (Clock Crystal Oscillator, CXO), a programmable crystal oscillator (PCXO), and a voltage controlled quartz crystal. Voltage Controlled Crystal Oscillator (VCXO) and Temperature Compensated Crystal Oscillator (TCXO). A crystal oscillator having a layout structure for miniaturization according to claim 1, wherein the crystal oscillation integrated circuit type can be classified into a quartz clock crystal oscillator control chip, a programmable quartz crystal oscillator control chip, and a voltage. The quartz crystal oscillator control wafer or the temperature compensated quartz crystal oscillator is controlled, wherein the crystal oscillation integrated circuit has a plurality of electrical conduction contacts. A crystal oscillator having a layout structure for a miniaturized size according to claim 6, further comprising a plurality of interconnecting elements electrically connected to the electrical conductive contact and the electrical contact, wherein the interconnecting component is It is an electrical contact pad, a bump pad or a wire bonding pad, wherein the bump pad can be a gold bump or a solder bump (Solder Bump) ). The crystal oscillator provided with the layout structure for miniaturization size according to claim 7, further comprising a primer for fixing and strengthening the bonding strength of the crystal oscillation integrated circuit on the first groove, and protecting the first a recess, the crystal oscillation integrated circuit, the electrical conduction contact, and the interconnecting component. A crystal oscillator having a layout structure for a miniaturized size according to claim 3, further comprising a plurality of conductive electrodes disposed on a surface of the platform to electrically connect the inner leads and electrically connect an external circuit, wherein The embodiment of the conductive electrode can be applied using a single layer and a plurality of metal structural materials of titanium, aluminum, gold, nickel, copper, silver, platinum, rhodium, lithium, chromium, ruthenium or tungsten. A crystal oscillator having a layout structure for a miniaturized size according to claim 9, wherein the crystal oscillation integrated circuit can obtain an external voltage source by the external circuit, and can be combined with a quartz clock crystal oscillator and a programmable A quartz crystal oscillator, a voltage controlled quartz crystal oscillator or a temperature compensated quartz crystal oscillator forms an oscillation circuit to drive the piezoelectric element to generate a frequency signal, or a temperature compensated quartz crystal oscillator can compensate for the temperature effect of the piezoelectric element and A reference frequency can be output to the external circuit. A crystal oscillator having a layout structure for miniaturization size according to claim 1, wherein the electrical contact may be an electrical contact pad, a bump pad or a wire pad. Bonding pad), wherein the bump pad may be an Au bump or a solder bump. A crystal oscillator having a layout structure for miniaturization size according to claim 1, wherein the material of the platform is ceramic. A crystal oscillator having a layout structure for a miniaturized size according to claim 1, further comprising a package board disposed on a metal surface of the platform to seal the second recess and shield electromagnetic interference. A crystal oscillator having a layout structure for miniaturization, as described in claim 13, further comprising a metal ring disposed on the metal surface of the platform and fixed to the package board. A crystal oscillator having a layout structure for a miniaturized size as described in claim 13, wherein the package board is made of a metal material. A crystal oscillator having a layout structure for miniaturization size as described in claim 3, wherein the piezoelectric element material is a quartz wafer. A crystal oscillator having a layout structure for miniaturization size as described in claim 16 The quartz wafer can be an AT-CUT wafer or a Tuning Fork wafer. The crystal oscillator of claim 2, wherein the first patterned circuit and the second patterned circuit are made of titanium, aluminum, gold, nickel, copper, silver, platinum. Single, multi-layered metal structures of tantalum, niobium, lithium, chromium, niobium or tungsten. The crystal oscillator of claim 3, wherein the first coating electrode and the second coating electrode are made of titanium, aluminum, gold, nickel, copper, silver, Single and multi-layer metal structures of platinum, rhodium, lithium, chromium, ruthenium or tungsten.