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TWI416925B - Chip card holding device - Google Patents

Chip card holding device Download PDF

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Publication number
TWI416925B
TWI416925B TW97143086A TW97143086A TWI416925B TW I416925 B TWI416925 B TW I416925B TW 97143086 A TW97143086 A TW 97143086A TW 97143086 A TW97143086 A TW 97143086A TW I416925 B TWI416925 B TW I416925B
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Taiwan
Prior art keywords
cover
wafer card
wall
holding device
mounting
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TW97143086A
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Chinese (zh)
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TW201019686A (en
Inventor
zhi-yang Liu
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Fih Hong Kong Ltd
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Priority to TW97143086A priority Critical patent/TWI416925B/en
Publication of TW201019686A publication Critical patent/TW201019686A/en
Application granted granted Critical
Publication of TWI416925B publication Critical patent/TWI416925B/en

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Abstract

The invention discloses a chip card holding device including a main body, a hinge device, a cover and a releasing device. The cover is rotatablely hinged with the main body by the hinge device and latched by the releasing device. The cover defines an accommodating space for assembling a chip card. The releasing device is slidably mounted on the main body. The hinge includes a torsion spring. When release the releasing device, the cover can be opened automatically by the torsion spring. The chip card holding device has simple device and is easy to operate, it is easily fulfill the assemble and disassemble operation to the chip card.

Description

晶片卡固持裝置Wafer card holding device

本發明涉及一種用於容置並固持晶片卡之固持裝置,特別涉及一種用於攜帶型電子裝置上之晶片卡固持裝置。The present invention relates to a holding device for accommodating and holding a wafer card, and more particularly to a wafer card holding device for a portable electronic device.

隨著通訊事業之迅速發展,行動電話、個人數位助理(personal digital assistant, PDA)等各種攜帶型電子裝置之使用越來越普及。隨著該等攜帶型電子裝置產品之功能日益多元化,應用於該等攜帶型裝置上之用於存儲記憶之晶片卡亦越來越多,例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、晶片卡(Subscriber Identification Module Card,用戶識別卡)等。其中,晶片卡為一種裝有IC晶片之塑膠卡片,其具有記錄個人用戶號碼及通訊錄等功能,藉由更換晶片卡,其可供多個用戶使用。With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As the functions of these portable electronic device products become increasingly diversified, more and more wafer cards for storing memories are applied to such portable devices, such as an SD card (Secure Digital Memory Card) and a CF card ( Compact Flash Card), a Subscriber Identification Module Card, etc. The chip card is a plastic card equipped with an IC chip, which has the functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the chip card.

習知晶片卡一般容置於攜帶型電子裝置之一卡槽內。當該晶片卡容置於該卡槽內時,該晶片卡上之積體電路藉由一連接器與該攜帶型電子裝置之電路板連接。當需要更換該晶片卡時,使用者使用手指直接按住該晶片卡暴露之部分,並向該卡槽外拖動,藉由使用者手指與該晶片卡之間之摩擦力使該晶片卡隨使用者手指運動,直至晶片卡由該卡槽內滑出。Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot.

然,於實際使用中,由於晶片卡暴露於卡槽外之部分 一般較小,直接按壓外露部分操作較為困難;有些型號之晶片卡甚至全部容置於卡槽內。故,使用者難以藉由直接按壓該晶片卡之方式帶動該晶片卡由卡槽滑出。However, in actual use, the wafer card is exposed to the outside of the card slot. Generally, it is difficult to directly press the exposed part; some types of wafer cards are even placed in the card slot. Therefore, it is difficult for the user to drive the wafer card to slide out of the card slot by directly pressing the wafer card.

有鑒於以上缺陷,有必要提供一種易於更換晶片卡且可有效容置、固持晶片卡之晶片卡固持裝置。In view of the above drawbacks, it is necessary to provide a wafer card holding device that can easily replace a wafer card and can effectively accommodate and hold the wafer card.

一種晶片卡固持裝置,其包括一本體、一鉸接裝置及一蓋體,該蓋體藉由鉸接裝置可旋轉地鉸接於本體上,該蓋體上設有一用於裝設晶片卡之容納腔室,所述晶片卡固持裝置還包括一釋放裝置,其可滑動地裝設於本體上;所述鉸接裝置包括一扭簧,該蓋體可朝向本體轉動並由該釋放裝置固持,朝遠離該蓋體方向滑動釋放該釋放裝置,該蓋體由該扭簧驅動遠離本體自動轉動打開。A wafer card holding device includes a body, a hinge device and a cover body rotatably hinged to the body by a hinge device, wherein the cover body is provided with a receiving chamber for mounting a wafer card The wafer card holding device further includes a release device slidably mounted on the body; the hinge device includes a torsion spring, the cover body is rotatable toward the body and held by the release device, away from the cover The release of the release device is performed by the body direction sliding, and the cover body is automatically rotated and opened by the torsion spring drive away from the body.

相較於習知技術,所述晶片卡固持裝置結構簡單,晶片卡裝設於蓋體上,並隨蓋體可旋轉地裝設於本體上,藉由一釋放裝置對蓋體進行鎖緊及開啟,輕易地實現了晶片卡之安裝及拆卸,同時使得晶片卡之安裝及更換過程變得更加簡單,容易操作。Compared with the prior art, the wafer card holding device has a simple structure, the chip card is mounted on the cover body, and is rotatably mounted on the body with the cover body, and the cover body is locked by a release device. When it is turned on, the installation and removal of the wafer card can be easily realized, and the process of installing and replacing the wafer card is made simpler and easier to operate.

本發明公開一種晶片卡固持裝置,其適用於行動電話、個人數位助理(personal digital assistant, PDA)等攜帶型電子裝置。下面將以本發明晶片卡固持裝置之較佳實施例應用於一行動電話(圖未示)為例進行說明。The invention discloses a chip card holding device, which is suitable for portable electronic devices such as mobile phones and personal digital assistants (PDAs). A preferred embodiment of the wafer card holding device of the present invention will be described as an example of a mobile phone (not shown).

請參閱圖1及圖2,本發明較佳實施例之晶片卡固持 裝置100用於固持一晶片卡90。該晶片卡固持裝置100包括一本體10、一蓋體30、一鉸接裝置50及一釋放裝置70。Referring to FIG. 1 and FIG. 2, the wafer card holding in the preferred embodiment of the present invention Device 100 is used to hold a wafer card 90. The wafer card holding device 100 includes a body 10, a cover 30, a hinge device 50 and a release device 70.

所述本體10可為一行動電話之後殼,其具有一外表面11及一與該外表面11相對之內表面15,該本體10之外表面11上向下凹設有一大致矩形凹腔狀之電池裝設部13(圖中僅示出部分)及一與該電池裝設部13相鄰設置之安裝槽17。所述電池裝設部13包括一底壁131及一垂直於底壁131設置且臨近該安裝槽17一側之側壁137。所述底壁131上臨近側壁137之一側貫通開設有一大致矩形之第一開口133,以用於裝設所述蓋體30並容置裝設於蓋體30上之晶片卡90。所述底壁131上臨近該第一開口133且遠離側壁137一側之中部位置處開設有一與該第一開口133相互連通之第二開口135,其共同形成一大致“凸”形之蓋體裝設部(圖未標)。所述第二開口135之二相對側壁1351上分別相對開設有一鉸接孔1353,以用於鉸接所述蓋體30。所述側壁137之大致中部位置處開設一與所述安裝槽17相互連通之矩形通孔1372,該側壁137與外表面11相接位置處臨近該表面11一側朝向安裝槽17方向相鄰間隔地凹設有二凹槽狀之卡合部1373及一連接該二卡合部1373之條形槽狀之容置部1375。所述安裝槽17之底部171上貫通開設有一矩形通槽173。所述本體10之內表面15上對應於所述安裝槽17位置處向下凹設有一容置槽18,該容置槽18藉由所述矩形通槽173 與安裝槽17相互連通。The body 10 can be a mobile phone rear case having an outer surface 11 and an inner surface 15 opposite to the outer surface 11. The outer surface 11 of the body 10 is recessed downwardly with a substantially rectangular concave shape. The battery mounting portion 13 (only a portion shown in the drawing) and a mounting groove 17 provided adjacent to the battery mounting portion 13 are provided. The battery assembly portion 13 includes a bottom wall 131 and a side wall 137 disposed perpendicular to the bottom wall 131 and adjacent to the mounting groove 17 side. A substantially rectangular first opening 133 is defined in the bottom wall 131 adjacent to one side of the side wall 137 for mounting the cover 30 and accommodating the wafer card 90 mounted on the cover 30. A second opening 135 is formed in the bottom wall 131 adjacent to the first opening 133 and away from the sidewall 137. The second opening 135 is connected to the first opening 133 to form a substantially "convex" shaped cover. Installation department (not shown). Two hinge holes 1353 are respectively defined on the opposite side walls 1351 of the second opening 135 for articulating the cover body 30. A rectangular through hole 1372 communicating with the mounting groove 17 is defined at a substantially central portion of the side wall 137. The side wall 137 is adjacent to the outer surface 11 and adjacent to the surface 11 is adjacent to the mounting groove 17 The recess is provided with a groove-like engaging portion 1373 and a strip-shaped receiving portion 1375 connecting the two engaging portions 1373. A rectangular through groove 173 is defined in the bottom portion 171 of the mounting groove 17 . An accommodating groove 18 is defined in the inner surface 15 of the body 10 corresponding to the mounting groove 17 . The accommodating groove 18 is defined by the rectangular through groove 173 . It is in communication with the mounting groove 17.

所述蓋體30由金屬片材衝壓形成或由塑膠材質模內一體成型而成,其藉由該鉸接裝置50可旋轉地鉸接於本體10之電池裝設部13之底壁131上並罩設於第一開口133及第二開口135上。所述蓋體30為一橫截面大致呈"L"形之片狀體,其包括一頂蓋31及一由該頂蓋31之一側緣垂直延伸彎折形成之配合壁35。所述頂蓋31大致呈“凸”形片板狀,其外形尺寸大小與所述第一開口133及第二開口135形成之蓋體裝設部之尺寸相當。所述頂蓋31包括一蓋體部311、二夾持壁313、二抵持壁315及一鉸接部317。所述蓋體部311大致呈矩形板狀,其外形尺寸大小與所述本體10之底壁131上之第一開口133之尺寸大小相當。所述二夾持壁313大致呈"L"形片狀,其由該蓋體部311之二橫向側緣沿背向該配合壁35延伸方向相對延伸彎折形成。所述二抵持壁315分別由該蓋體部311之與配合壁35相對之另一縱向側緣之兩端延伸彎折形成,並與該蓋體部311及二夾持壁313共同圍成一大致矩形腔體狀之容納腔室310,以用於裝設所述晶片卡90。所述鉸接部317相對配合壁35設置於該蓋體部311上與配合壁35相對之另一側中部位置處,由該蓋體部311之縱向側緣中部位置處向外延伸形成,並位於該二抵持壁315之間。所述鉸接部317之外形尺寸大小與底壁131上之第二開口135相當,該鉸接部317之兩側分別相對延伸彎折形成一安裝壁3171,該二安裝壁3171上分別相對開 設有一軸孔3173。所述配合壁35之中部位置處對應於所述本體10之側壁137上之矩形通孔1372貫通開設有一矩形孔351。該配合壁35之末端之兩側及中部位置處對應於所述本體10之二卡合部1373及容置部1375分別沿平行於頂蓋31方向且背向鉸接部317方向延伸彎折形成二舌狀之卡合臂353及一彎折捲曲形成之條形開啟部355。The cover body 30 is formed by stamping a metal sheet or integrally molded from a plastic material. The hinge device 50 is rotatably hinged to the bottom wall 131 of the battery mounting portion 13 of the body 10 and covered. On the first opening 133 and the second opening 135. The cover body 30 is a sheet-like body having a substantially "L" shape in cross section, and includes a top cover 31 and a matching wall 35 formed by vertically extending a side edge of the top cover 31. The top cover 31 is substantially in the shape of a "convex" shape, and has an outer size corresponding to the size of the cover mounting portion formed by the first opening 133 and the second opening 135. The top cover 31 includes a cover portion 311 , two clamping walls 313 , two resisting walls 315 , and a hinge portion 317 . The cover portion 311 has a substantially rectangular plate shape and has an outer size corresponding to the size of the first opening 133 of the bottom wall 131 of the body 10. The two clamping walls 313 are substantially in the shape of an L-shaped sheet, and are formed by two lateral edges of the cover portion 311 extending in a direction extending away from the mating wall 35. The two resisting walls 315 are respectively formed by extending and bending the two opposite longitudinal side edges of the cover portion 311 opposite to the mating wall 35, and are enclosed by the cover portion 311 and the two clamping walls 313. A substantially rectangular cavity-like receiving chamber 310 for mounting the wafer card 90. The hinge portion 317 is disposed on the cover body portion 311 opposite to the mating wall 35 at a position opposite to the mating wall 35, and is formed by extending from a central portion of the longitudinal side edge of the cover portion 311. The two abuts between the walls 315. The outer portion of the hinge portion 317 is sized to be opposite to the second opening 135 of the bottom wall 131. The two sides of the hinge portion 317 are respectively bent to form a mounting wall 3171, and the two mounting walls 3171 are respectively opened. A shaft hole 3173 is provided. A rectangular through hole 351 is defined in the middle of the matching wall 35 at a position corresponding to the rectangular through hole 1372 of the side wall 137 of the body 10. The two sides of the end of the mating wall 35 and the middle portion of the mating wall 35 correspond to the two engaging portions 1373 and the receiving portion 1375 of the main body 10, respectively, and are bent in a direction parallel to the direction of the top cover 31 and away from the hinge portion 317. A tongue-shaped engaging arm 353 and a strip-shaped opening portion 355 formed by bending and bending.

所述鉸接裝置50包括一轉軸51及一扭簧55,用於將所述蓋體30可相對旋轉地鉸接於本體10上。The hinge device 50 includes a rotating shaft 51 and a torsion spring 55 for hingedly pivoting the cover 30 to the body 10.

所述釋放裝置70包括一釋放件71及一彈性件75,該釋放件71相對滑動地裝設於本體10之安裝槽17內,用以實現對蓋體30之鎖緊及開啟。所述釋放件71包括一主體711、二卡塊713、一釋放塊715及一凸柱717,該主體711大致呈矩形塊狀,其具有一操作面712及一與該操作面712相對之安裝面714。該操作面712設置成一階梯面,以便於對該釋放件71進行操作。所述二卡塊713呈"L"形勾狀,其對應於所述本體10之安裝槽17內之矩形通槽173相鄰間隔地背向凸設於該主體711之安裝面714上中部位置處。所述二卡塊713之間間隔之距離與該矩形通槽173之寬度相當,以使得該二卡塊713可對應滑動地卡合於該安裝槽17之矩形通槽173內。所述釋放塊715呈"L"形塊狀,其設於該主體711之安裝面714上臨近該二卡塊713一側之側緣中部位置處,並位於該二卡塊713之間。該釋放塊715先沿垂直於該主體711之安裝面714方向延伸,然後朝遠離該主體711之方向延伸並伸 出於該主體711外側。所述凸柱717朝向該二卡塊713方向凸設於該釋放塊715上,並容置於該二卡塊713之間。所述彈性件75可為一螺旋彈簧,其一端套設於該釋放件71之凸柱717上,另一端抵持於本體10之安裝槽14內壁上,使該釋放件71可滑動地裝設於該安裝槽14內。The release device 70 includes a release member 71 and an elastic member 75. The release member 71 is slidably mounted in the mounting groove 17 of the body 10 for locking and opening the cover 30. The release member 71 includes a main body 711, two latching blocks 713, a releasing block 715 and a protruding post 717. The main body 711 has a substantially rectangular block shape and has an operating surface 712 and a mounting surface opposite to the operating surface 712. Face 714. The operating surface 712 is disposed as a stepped surface to facilitate operation of the release member 71. The two-shaped block 713 has an L-shaped hook shape, and the rectangular through-groove 173 corresponding to the mounting groove 17 of the body 10 is adjacently spaced apart from the central portion of the mounting surface 714 of the main body 711. At the office. The distance between the two blocks 713 is equal to the width of the rectangular through groove 173, so that the two blocks 713 can be slidably engaged with the rectangular through grooves 173 of the mounting groove 17. The release block 715 is in the shape of an "L" block, and is disposed on the mounting surface 714 of the main body 711 adjacent to the middle of the side edge of the side of the two blocks 713 and located between the two blocks 713. The release block 715 first extends in a direction perpendicular to the mounting surface 714 of the body 711 and then extends and extends away from the body 711. Out of the outside of the body 711. The protruding post 717 protrudes from the release block 715 toward the two latching blocks 713 and is received between the two latching blocks 713. The elastic member 75 can be a coil spring, and one end of the elastic member 75 is sleeved on the protruding post 717 of the releasing member 71, and the other end is abutted against the inner wall of the mounting groove 14 of the body 10, so that the releasing member 71 is slidably mounted. It is disposed in the mounting groove 14.

請一併參閱圖3,組裝所述晶片卡固持裝置100時,首先,將所述釋放裝置70裝設於本體10之安裝槽14內。將所述彈性件75之一端套設於該釋放件71之凸柱717上,並將釋放件71之釋放塊715端穿過安裝槽17內之矩形通孔1372,其末端部分伸出於該矩形通孔1372,同時,將該釋放件71之二卡塊713對應卡合於該安裝槽17內之矩形通槽173內,該二卡塊713之末端對應容置於該本體10之內表面15上之容置槽18內。所述彈性件75之另一端對應抵持於安裝槽14內壁上,從而將該釋放件71可滑動地彈性裝設於該安裝槽14內。接下來,將所述蓋體30藉由所述鉸接裝置50可旋轉之裝設於本體10上,並蓋合於本體10之底壁131之蓋體裝設部上。所述轉軸51之一端穿過本體10之第二開口135之一側壁1351上之鉸接孔1353、蓋體30之鉸接部317之一安裝壁3171上之軟孔3173、扭簧55、另一安裝壁3171上之軸孔3173及該本體10之第二開口135之另一側壁1351上之鉸接孔1353,從而將該蓋體30可旋轉地裝設於本體10上。所述扭簧55之一端抵持於蓋體30上,另一端抵持於本體10上。所述蓋體30閉合時,其配合壁35對應抵持於該本體10 之側壁137上,該配合壁35之矩形孔351對應於該側壁137上之矩形通孔1372套於該釋放塊715上。所述配合壁35之末端之二卡合臂353分別卡合於該側壁137上之二卡合部1373上,該條形開啟部355對應容置於該容置部1375內,即完成所述晶片卡固持裝置100之組裝。Referring to FIG. 3 together, when assembling the wafer card holding device 100, first, the releasing device 70 is installed in the mounting groove 14 of the body 10. One end of the elastic member 75 is sleeved on the protrusion 717 of the release member 71, and the end of the release block 715 of the release member 71 passes through the rectangular through hole 1372 in the mounting groove 17, and the end portion thereof protrudes therefrom. The rectangular through hole 1372 is formed in the rectangular through groove 173 of the mounting groove 17. The end of the two clamping block 713 is correspondingly received on the inner surface of the body 10. 15 is accommodated in the slot 18. The other end of the elastic member 75 is correspondingly abutted against the inner wall of the mounting groove 14, so that the releasing member 71 is slidably elastically installed in the mounting groove 14. Next, the cover body 30 is rotatably mounted on the body 10 by the hinge device 50, and is covered on the cover device mounting portion of the bottom wall 131 of the body 10. One end of the rotating shaft 51 passes through the hinge hole 1353 on one side wall 1351 of the second opening 135 of the body 10, one of the hinge portions 317 of the cover body 30, the soft hole 3173 on the mounting wall 3171, the torsion spring 55, and another mounting The shaft hole 3173 on the wall 3171 and the hinge hole 1353 on the other side wall 1351 of the second opening 135 of the body 10 rotatably mount the cover body 30 on the body 10. One end of the torsion spring 55 abuts against the cover 30 and the other end abuts against the body 10. When the cover 30 is closed, the mating wall 35 correspondingly resists the body 10 The rectangular hole 351 of the mating wall 35 is sleeved on the release block 715 corresponding to the rectangular through hole 1372 on the side wall 137. The two engaging arms 353 of the end of the mating wall 35 are respectively engaged with the two engaging portions 1373 of the side wall 137. The strip opening portion 355 is correspondingly received in the receiving portion 1375, that is, the completion of the Assembly of the wafer card holding device 100.

請參閱圖5,安裝晶片卡90時,首先將所述晶片卡90容置於蓋體30之容納腔室310內,將所述蓋體30翻轉,使該蓋體30壓縮扭簧55並蓋合併容置於該本體10之底壁131之蓋體裝設部內。所述蓋體30之配合壁35對應抵持於側壁137上,該配合壁35之矩形孔351對應套於該釋放塊715上。所述配合壁35之末端之二卡合臂353分別卡合於該側壁137上之二卡合部1373上,該條形開啟部355對應容置於該容置部1375內,即完成所述晶片卡之安裝。當需要取下所述晶片卡90時,沿遠離該蓋體30方向滑動釋放件71,使該釋放塊715進入到側壁137之矩形通孔1372內並脫出矩形孔351,同時,扭簧55釋放扭力,自動翻轉該蓋體30,將該蓋體30相對本體10旋開,即可取出裝設於蓋體30上之晶片卡90。Referring to FIG. 5, when the wafer card 90 is mounted, the wafer card 90 is first received in the accommodating chamber 310 of the cover 30, and the cover 30 is turned over to compress the torsion spring 55 and cover the cover 30. The combination is accommodated in the cover mounting portion of the bottom wall 131 of the body 10. The matching wall 35 of the cover body 30 correspondingly bears against the side wall 137. The rectangular hole 351 of the mating wall 35 is correspondingly sleeved on the release block 715. The two engaging arms 353 of the end of the mating wall 35 are respectively engaged with the two engaging portions 1373 of the side wall 137. The strip opening portion 355 is correspondingly received in the receiving portion 1375, that is, the completion of the Installation of the wafer card. When the wafer card 90 needs to be removed, the release member 71 is slid away from the cover 30, and the release block 715 is inserted into the rectangular through hole 1372 of the side wall 137 and the rectangular hole 351 is taken out. At the same time, the torsion spring 55 is removed. The torque is released, the cover 30 is automatically flipped, and the cover 30 is unscrewed from the body 10 to take out the wafer card 90 mounted on the cover 30.

所述晶片卡固持裝置100結構簡單,晶片卡90裝設於蓋體30上,並隨蓋體30可旋轉地裝設於本體10上,並藉由一釋放件71實現對該蓋體30之鎖緊及開啟,輕易地實現了晶片卡90之安裝及拆卸,同時使得晶片卡90之安裝及更換過程變得更加簡單,容易操作。The wafer card holding device 100 has a simple structure, and the wafer card 90 is mounted on the cover body 30, and is rotatably mounted on the body 10 with the cover body 30, and the cover body 30 is realized by a release member 71. The locking and opening makes it easy to install and disassemble the wafer card 90, and at the same time, the process of installing and replacing the wafer card 90 is simpler and easier to operate.

綜上所述,本發明符合發明專利要件,爰依法提出專 利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent, and Application for interest. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.

晶片卡固持裝置‧‧‧100Chip card holder ‧‧100

本體‧‧‧10Ontology ‧‧10

外表面‧‧‧11Outer surface ‧‧11

電池裝設部‧‧‧13Battery Installation Department ‧‧13

底壁‧‧‧131Bottom wall ‧‧131

第一開口‧‧‧133First opening ‧‧‧133

第二開口‧‧‧135Second opening ‧‧‧135

側壁‧‧‧1351,137Side wall ‧‧‧1351,137

鉸接孔‧‧‧1353Hinged hole ‧‧1135

矩形通孔‧‧‧1372Rectangular through hole ‧‧1372

卡合部‧‧‧1373KLA ‧‧1373

容置部‧‧‧1375Housing Department ‧‧1 1375

內表面‧‧‧15Inner surface ‧‧15

安裝槽‧‧‧17Installation slot ‧‧17

底部‧‧‧171Bottom ‧‧‧171

矩形通槽‧‧‧173Rectangular trough ‧‧173

容置槽‧‧‧18容槽槽‧‧18

蓋體‧‧‧30Cover ‧ ‧ 30

頂蓋‧‧‧31Top cover ‧‧31

蓋體部‧‧‧311Cover body ‧ ‧ 311

夾持壁‧‧‧313Clamping wall ‧‧ 313

抵持壁‧‧‧315Resist the wall ‧ ‧ 315

鉸接部‧‧‧317Hinged section ‧‧317

安裝壁‧‧‧3171Installation wall ‧‧1317

軸孔‧‧‧3173Shaft hole ‧‧3173

配合壁‧‧‧35Cooperating with the wall ‧ ‧

矩形孔‧‧‧351Rectangular hole ‧‧ 351

卡合臂‧‧‧353Clamping arm ‧‧ 353

開啟部‧‧‧355Opening Department ‧‧ 355

鉸接裝置‧‧‧50Hinged device ‧ ‧ 50

轉軸‧‧‧51Rotary ‧ ‧ 51

扭簧‧‧‧55Torsion spring ‧‧55

釋放裝置‧‧‧70Release device ‧‧70

釋放件‧‧‧71Release ‧‧‧71

主體‧‧‧711Main body ‧‧711

卡塊‧‧‧713Block ‧‧ 713

釋放塊‧‧‧715Release block ‧ ‧ 715

凸柱‧‧‧717Tab ‧‧717

彈性件‧‧‧75Elastic parts ‧‧75

圖1為晶片卡固持裝置之立體分解示意圖;圖2為晶片卡固持裝置之另一視角之立體分解示意圖;圖3為晶片卡固持裝置之蓋體蓋合於本體上之立體示意圖;圖4為晶片卡固持裝置之蓋體蓋合於本體上之另一視角之立體示意圖;圖5為本發明晶片卡固持裝置之蓋體裝設於本體上且處於開啟時之立體示意圖;圖6為圖3沿VI-VI線之剖示圖。1 is a perspective exploded view of the wafer card holding device; FIG. 2 is a perspective exploded view of the wafer card holding device; FIG. 3 is a perspective view of the cover of the wafer card holding device; 3 is a perspective view of another view of the cover of the wafer card holding device; FIG. 5 is a perspective view of the cover of the wafer card holding device of the present invention when it is mounted on the body; A cross-sectional view along line VI-VI.

晶片卡固持裝置‧‧‧100Chip card holder ‧‧100

本體‧‧‧10Ontology ‧‧10

外表面‧‧‧11Outer surface ‧‧11

電池裝設部‧‧‧13Battery Installation Department ‧‧13

底壁‧‧‧131Bottom wall ‧‧131

第一開口‧‧‧133First opening ‧‧‧133

第二開口‧‧‧135Second opening ‧‧‧135

側壁‧‧‧1351,137Side wall ‧‧‧1351,137

鉸接孔‧‧‧1353Hinged hole ‧‧1135

矩形通孔‧‧‧1372Rectangular through hole ‧‧1372

卡合部‧‧‧1373KLA ‧‧1373

容置部‧‧‧1375Housing Department ‧‧1 1375

安裝槽‧‧‧17Installation slot ‧‧17

底部‧‧‧171Bottom ‧‧‧171

矩形通槽‧‧‧173Rectangular trough ‧‧173

蓋體‧‧‧30Cover ‧ ‧ 30

頂蓋‧‧‧31Top cover ‧‧31

蓋體部‧‧‧311Cover body ‧ ‧ 311

夾持壁‧‧‧313Clamping wall ‧‧ 313

抵持壁‧‧‧315Resist the wall ‧ ‧ 315

鉸接部‧‧‧317Hinged section ‧‧317

安裝壁‧‧‧3171Installation wall ‧‧1317

軸孔‧‧‧3173Shaft hole ‧‧3173

配合壁‧‧‧35Cooperating with the wall ‧ ‧

矩形孔‧‧‧351Rectangular hole ‧‧ 351

卡合臂‧‧‧353Clamping arm ‧‧ 353

開啟部‧‧‧355Opening Department ‧‧ 355

鉸接裝置‧‧‧50Hinged device ‧ ‧ 50

轉軸‧‧‧51Rotary ‧ ‧ 51

扭簧‧‧‧55Torsion spring ‧‧55

釋放裝置‧‧‧70Release device ‧‧70

釋放件‧‧‧71Release ‧‧‧71

主體‧‧‧711Main body ‧‧711

卡塊‧‧‧713Block ‧‧ 713

釋放塊‧‧‧715Release block ‧ ‧ 715

凸柱‧‧‧717Tab ‧‧717

彈性件‧‧‧75Elastic parts ‧‧75

Claims (10)

一種晶片卡固持裝置,其包括一本體、一鉸接裝置及一蓋體,該蓋體藉由鉸接裝置可旋轉地鉸接於本體上,該蓋體上設有一用於裝設晶片卡之容納腔室,其改良在於:所述晶片卡固持裝置還包括一釋放裝置,其可滑動地裝設於本體上;所述鉸接裝置包括一扭簧,該蓋體可朝向本體轉動並由該釋放裝置固持,朝遠離該蓋體方向滑動釋放該釋放裝置,該蓋體由該扭簧驅動遠離本體自動轉動打開。A wafer card holding device includes a body, a hinge device and a cover body rotatably hinged to the body by a hinge device, wherein the cover body is provided with a receiving chamber for mounting a wafer card The improvement is that the wafer card holding device further comprises a release device slidably mounted on the body; the hinge device comprises a torsion spring, the cover body is rotatable toward the body and held by the release device, The release device is slid away from the cover body, and the cover body is automatically rotated and opened by the torsion spring drive away from the body. 如申請專利範圍第1項所述之晶片卡固持裝置,其中所述本體上設有一電池裝設部,其底壁上設有一蓋體裝設部,該蓋體可旋轉地裝設於底壁上並容置於蓋體裝設部內;所述臨近該電池裝設部位置處設有一安裝槽,所述釋放裝置包括一主體及二相對凸設於該主體上之卡塊,該釋放裝置之二卡塊對應可滑動地卡合裝設於安裝槽內。The wafer card holding device of claim 1, wherein the body is provided with a battery mounting portion, and a bottom body wall is provided with a cover mounting portion, and the cover body is rotatably mounted on the bottom wall. The upper receiving portion is disposed in the cover mounting portion; the mounting device is disposed adjacent to the battery mounting portion, and the releasing device comprises a main body and two oppositely protruding blocks disposed on the main body, the releasing device The two blocks are slidably engaged and mounted in the mounting groove. 如申請專利範圍第2項所述之晶片卡固持裝置,其中所述安裝槽內開設有一與該電池裝設部相互連通之通孔,所述釋放裝置還包括一釋放塊,其對應於該通孔凸設於主體之一端部位置處,該釋放塊穿過該通孔卡抵於蓋體上。The wafer card holding device of claim 2, wherein the mounting slot defines a through hole communicating with the battery mounting portion, the release device further comprising a release block corresponding to the pass The hole is convexly disposed at one end of the main body, and the release block is inserted through the through hole to the cover. 如申請專利範圍第3項所述之晶片卡固持裝置,其中所述蓋體包括一頂蓋及一由該頂蓋之 一側緣垂直延伸彎折形成之配合壁,該配合壁上對應於所述通孔貫通開設有一矩形孔,所述釋放裝置之釋放塊卡合於蓋體之矩形孔內。The wafer card holding device of claim 3, wherein the cover body comprises a top cover and a top cover The one side edge extends vertically to form a matching wall, and the matching wall has a rectangular hole corresponding to the through hole, and the release block of the release device is engaged in the rectangular hole of the cover body. 如申請專利範圍第4項所述之晶片卡固持裝置,其中所述釋放塊上朝向該主體之另一端凸設形成一凸柱,該釋放裝置還包括一彈性件,其一端套設於該釋放件之凸柱上,另一端抵持於本體之安裝槽內壁上,將該釋放件可滑動地彈性裝設於該安裝槽內。The wafer card holding device of claim 4, wherein the release block protrudes toward the other end of the main body to form a protrusion, and the release device further comprises an elastic member, one end of which is sleeved on the release The other end of the protruding post is abutted against the inner wall of the mounting groove of the body, and the releasing member is slidably elastically mounted in the mounting groove. 如申請專利範圍第4項所述之晶片卡固持裝置,其中所述容納腔室臨近該安裝槽一側之側壁與該本體外表面相接位置處設有二卡合部及一連接該二卡合部之槽狀容置部;所述配合壁末端之兩側及中部位置處對應於所述二卡合部及容置部分別沿平行於頂蓋方向且背向鉸接部方向延伸彎折形成二舌狀之卡合臂及一彎折捲曲形成之條形開啟部,以使該蓋體對應卡合於本體上。The wafer card holding device of claim 4, wherein a side wall of the receiving chamber adjacent to the mounting groove is provided with a second engaging portion and a connecting card at a position adjacent to the outer surface of the outer surface a groove-shaped accommodating portion of the merging portion; the two sides of the engaging wall end and the central portion corresponding to the two engaging portions and the accommodating portion respectively extend in a direction parallel to the direction of the top cover and away from the hinge portion The two tongue-shaped engaging arms and a strip-shaped opening portion formed by bending and bending, so that the cover body is correspondingly engaged with the body. 如申請專利範圍第6項所述之晶片卡固持裝置,其中所述蓋體之頂蓋包括一蓋體部、二夾持壁及二抵持壁,該二夾持壁呈"L"形片狀,其由蓋體部之二橫向側緣沿背向該配合壁延伸方向相對延伸彎折形成;所述二抵持壁分別由該蓋體部之與配合壁相對之另一縱向側 緣之兩端延伸彎折形成,並與該蓋體部及二夾持壁共同圍成所述用於裝設晶片卡之容納腔室。The wafer card holding device of claim 6, wherein the cover of the cover comprises a cover portion, two clamping walls and two resisting walls, the two clamping walls being "L" shaped Forming, by two lateral side edges of the cover portion, extending oppositely extending away from the extending direction of the mating wall; the two resisting walls are respectively formed by the other longitudinal side of the cover portion opposite to the mating wall The two ends of the edge are formed by bending and extending together with the cover portion and the two clamping walls to form the receiving chamber for mounting the wafer card. 如申請專利範圍第7項所述之晶片卡固持裝置,其中所述鉸接部相對配合壁設置於該蓋體部上與配合壁相對之另一側,該鉸接部之兩側分別相對延伸彎折形成一安裝壁,該二安裝壁上分別相對開設有一軸孔;所述鉸接裝置還包括一轉軸,該轉軸穿過交接部上之周孔及扭簧將所述蓋體可相對旋轉地鉸接於本體上。The wafer card holding device of claim 7, wherein the hinge portion is disposed on the opposite side of the cover portion opposite to the mating wall, and the two sides of the hinge portion are respectively extended and bent. Forming a mounting wall, the two mounting walls respectively have a shaft hole; the hinge device further includes a rotating shaft, the rotating shaft is hinged to the cover body through the peripheral hole and the torsion spring on the connecting portion On the body. 如申請專利範圍第1項所述之晶片卡固持裝置,其中所述蓋體由金屬片材衝壓形成或由塑膠材質模內一體成型而成。The wafer card holding device according to claim 1, wherein the cover body is formed by stamping a metal sheet or integrally molded from a plastic material. 如申請專利範圍第1項所述之晶片卡固持裝置,其中所述本體可為一行動電話之後殼。The wafer card holding device of claim 1, wherein the body is a mobile phone rear case.
TW97143086A 2008-11-07 2008-11-07 Chip card holding device TWI416925B (en)

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Publication number Priority date Publication date Assignee Title
US6890203B2 (en) * 2002-04-09 2005-05-10 Japan Aviation Electronics Industry, Limited Card connector reduced in operating force
TW200706093A (en) * 2005-07-29 2007-02-01 Fih Co Ltd Chip card holding structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6890203B2 (en) * 2002-04-09 2005-05-10 Japan Aviation Electronics Industry, Limited Card connector reduced in operating force
TW200706093A (en) * 2005-07-29 2007-02-01 Fih Co Ltd Chip card holding structure

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