TWI412457B - Housing and surface treating method - Google Patents
Housing and surface treating method Download PDFInfo
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- TWI412457B TWI412457B TW96142439A TW96142439A TWI412457B TW I412457 B TWI412457 B TW I412457B TW 96142439 A TW96142439 A TW 96142439A TW 96142439 A TW96142439 A TW 96142439A TW I412457 B TWI412457 B TW I412457B
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- layer
- coating
- coating layer
- casing
- substrate
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000010410 layer Substances 0.000 claims abstract description 47
- 239000012790 adhesive layer Substances 0.000 claims abstract description 34
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 239000011247 coating layer Substances 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 28
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 14
- 229910052801 chlorine Inorganic materials 0.000 claims description 14
- 239000000460 chlorine Substances 0.000 claims description 14
- 229920000098 polyolefin Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000004381 surface treatment Methods 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 9
- 229920000178 Acrylic resin Polymers 0.000 claims description 9
- 238000001771 vacuum deposition Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 238000005240 physical vapour deposition Methods 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- LEHUDBPYSAPFFO-UHFFFAOYSA-N alumane;bismuth Chemical compound [AlH3].[Bi] LEHUDBPYSAPFFO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 229920001778 nylon Polymers 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 8
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002294 plasma sputter deposition Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
本發明涉及一種殼體及表面處理方法，尤其係一種帶有塗層之殼體及表面處理方法。 The invention relates to a casing and a surface treatment method, in particular to a coated casing and a surface treatment method.
隨著電子產品之快速發展，攜帶式電子裝置(如手機、MP3播放器、個人數位助理)之使用已非常普遍。並且為使攜帶式電子裝置具有較好之外觀以及手感，通常會於攜帶式電子裝置之殼體上形成各種各樣之塗層。 With the rapid development of electronic products, the use of portable electronic devices (such as mobile phones, MP3 players, personal digital assistants) has become very common. In order to make the portable electronic device have a good appearance and feel, a variety of coatings are usually formed on the casing of the portable electronic device.
為使攜帶式電子裝置具有金屬外觀，通常會於該攜帶式電子裝置殼體表面形成塗層。於生產過程中，一般係於攜帶式電子裝置殼體基材之表面先塗佈底漆形成一底層，然後再於該底層上採用真空鍍膜之方法鍍上一金屬膜層。 In order for the portable electronic device to have a metallic appearance, a coating is usually formed on the surface of the portable electronic device housing. In the production process, a primer is generally applied to the surface of the substrate of the portable electronic device to form a bottom layer, and then a metal film layer is coated on the bottom layer by vacuum coating.
然而，採用真空鍍膜之方法形成之鍍膜層一般具有化學活性，因此鍍膜層處於外表面暴露於空氣中時，容易被腐蝕、刮傷、磨損及氧化，從而影響手機之外觀。 However, the coating layer formed by the vacuum coating method is generally chemically active, so that when the outer surface is exposed to the air, the coating layer is easily corroded, scratched, worn, and oxidized, thereby affecting the appearance of the mobile phone.
為避免鍍膜層被腐蝕、刮傷、磨損及氧化，習知技術係採用於鍍膜層上塗佈面漆形成外覆層來保護鍍膜層。外覆層可對鍍膜層起到一定保護作用，但於使用一段時間後，外覆層本身卻容易發生脫落、腐蝕，致使鍍膜層得不到保護，而仍影響產品之外觀。 In order to avoid corrosion, scratching, abrasion and oxidation of the coating layer, conventional techniques employ a top coat on the coating layer to form an outer coating to protect the coating layer. The outer cover layer can protect the coating layer. However, after using for a period of time, the outer cover layer is liable to fall off and corrode, so that the coating layer is not protected, and the appearance of the product is still affected.
鑒於以上內容，有必要提供一種可避免塗層損壞而影響 外觀之殼體及表面處理方法。 In view of the above, it is necessary to provide a way to avoid coating damage Appearance shell and surface treatment method.
一種殼體，其包括基材及形成於該基材表面之塗層，該塗層包括靠近該基材之鍍膜層與處於外表面之外覆層，其中該塗層於該鍍膜層與該外覆層之間還包括一黏合層。該黏合層之材質包括含氯聚烯烴，該外覆層之材質包括丙烯酸樹脂。該鍍膜層之材質為錫、鋁、矽鋁合金、鈦、碳化鈦、氮化鈦、鎘、銦、二氧化矽及不銹鋼之一或其組合物。 A casing comprising a substrate and a coating formed on a surface of the substrate, the coating comprising a coating layer adjacent to the substrate and a coating on the outer surface, wherein the coating is on the coating layer and the outer layer An adhesive layer is also included between the coatings. The material of the adhesive layer comprises a chlorine-containing polyolefin, and the material of the outer cover layer comprises an acrylic resin. The material of the coating layer is one of tin, aluminum, bismuth aluminum alloy, titanium, titanium carbide, titanium nitride, cadmium, indium, cerium oxide and stainless steel or a combination thereof.
一種表面處理方法，其包括以下步驟：於一基材表面沈積一鍍膜層，該鍍膜層由物理氣相沈積或絕緣真空鍍膜方法形成；於該鍍膜層上塗佈黏合劑，形成黏合層，該黏合劑包括含氯聚烯烴；及於該黏合層上塗佈面漆，形成外覆層，該面漆包括丙烯酸樹脂。 A surface treatment method comprising the steps of: depositing a coating layer on a surface of a substrate, the coating layer being formed by a physical vapor deposition or an insulating vacuum coating method; applying a binder on the coating layer to form an adhesive layer, The adhesive includes a chlorine-containing polyolefin; and a top coat is applied to the adhesive layer to form an outer cover, the top coat comprising an acrylic resin.
另一種表面處理方法，其包括以下步驟：於一基材表面塗佈底漆，形成一底層；於該底層沈積一鍍膜層，該鍍膜層由物理氣相沈積或絕緣真空鍍膜方法形成；於該鍍膜層上塗佈黏合劑，形成一黏合層，該黏合劑包括含氯聚烯烴；及於該黏合層上塗佈面漆，形成外覆層，該面漆包括丙烯酸樹脂。 Another surface treatment method includes the steps of: applying a primer to a surface of a substrate to form a bottom layer; depositing a coating layer on the bottom layer, the coating layer being formed by a physical vapor deposition or an insulating vacuum coating method; The adhesive layer is coated on the coating layer to form an adhesive layer, and the adhesive comprises a chlorine-containing polyolefin; and a top coat is applied on the adhesive layer to form an outer cover layer, and the top coat comprises an acrylic resin.
上述殼體於鍍膜層與外覆層之間形成有黏合層，黏合層可增強鍍膜層與外覆層之間之結合力，因此可防止或減少外覆層於使用時脫落，從而避免該塗層損壞，確保產品具有較好之外觀。 The shell forms an adhesive layer between the coating layer and the outer coating layer, and the adhesive layer can enhance the bonding force between the coating layer and the outer coating layer, thereby preventing or reducing the peeling of the outer coating layer during use, thereby avoiding the coating. The layer is damaged to ensure that the product has a good appearance.
下面將結合附圖及實施例對殼體及表面處理方法做進一步詳細說明。 The housing and surface treatment methods will be further described in detail below with reference to the accompanying drawings and embodiments.
請參閱圖1，所示為本發明較佳實施方式一之殼體10，其可用於攜帶式電子裝置。殼體10包括基材12及形成於基材12表面之塗層14。塗層14包括與基材12表面相連接之鍍膜層142，形成於鍍膜層142上之黏合層144，及形成於黏合層144上且處於外表面之外覆層146。其中，鍍膜層142之厚度可為10奈米至10微米，黏合層144之厚度可為1微米至20微米，外覆層146之厚度可為10微米至80微米。 Referring to FIG. 1, a housing 10 according to a preferred embodiment of the present invention is shown, which can be used in a portable electronic device. The housing 10 includes a substrate 12 and a coating 14 formed on the surface of the substrate 12. The coating 14 includes a coating layer 142 attached to the surface of the substrate 12, an adhesive layer 144 formed on the coating layer 142, and a coating layer 146 formed on the bonding layer 144 and outside the outer surface. The coating layer 142 may have a thickness of 10 nm to 10 μm, the adhesive layer 144 may have a thickness of 1 μm to 20 μm, and the outer cover layer 146 may have a thickness of 10 μm to 80 μm.
基材12之材質可為玻璃、陶瓷、聚碳酸酯、聚丙烯腈-丁二烯-苯乙烯、聚甲基丙烯酸甲酯及玻璃纖維-尼龍複合材料之一或其組合物。此外，為確保殼體10具有較好之外觀，基材12與鍍膜層142相接之表面最好較為光滑。 The material of the substrate 12 may be one of glass, ceramic, polycarbonate, polyacrylonitrile-butadiene-styrene, polymethyl methacrylate, and glass fiber-nylon composite or a combination thereof. In addition, in order to ensure a good appearance of the casing 10, the surface of the substrate 12 that is in contact with the coating layer 142 is preferably smooth.
鍍膜層142可為導電層或電絕緣層，其材質可為錫、鋁、矽鋁合金、鈦、碳化鈦、氮化鈦、鎘、銦、二氧化矽及不銹鋼之一或其組合物。 The coating layer 142 may be a conductive layer or an electrically insulating layer, and may be made of one of tin, aluminum, tantalum aluminum alloy, titanium, titanium carbide, titanium nitride, cadmium, indium, cerium oxide, and stainless steel, or a combination thereof.
黏合層144之材質可由含氯聚烯烴(如聚氯乙烯，聚氯丙稀)構成，或由重量比為1%至99%之含氯聚烯烴及其他材質構成，該其他材質可為羥基聚合物、胺基聚合物、羧基聚合物及環氧基聚合物之一或其組合。 The material of the adhesive layer 144 may be composed of a chlorine-containing polyolefin (such as polyvinyl chloride, polyvinyl chloride), or a chlorine-containing polyolefin and other materials in a weight ratio of 1% to 99%, and the other material may be a hydroxyl polymerization. One or a combination of an amine, an amine polymer, a carboxyl polymer, and an epoxy polymer.
外覆層146之主要成分可為丙烯酸樹脂。 The main component of the outer cover 146 may be an acrylic resin.
一種可製備殼體10之表面處理方法包括以下步驟： A surface treatment method for preparing the housing 10 includes the following steps:
步驟一，於基材12之表面真空沈積一鍍膜層142。其中沈積之方式可為物理氣相沈積(Physical Vapor Deposition)、絕緣真空鍍膜(Non Conductive Vacuum Metallization)或化學氣相沈積(Chemical Vapor Deposition)。其中當採用物理氣相沈積或絕緣真空鍍膜形成鍍膜層142時，可用錫、鋁、矽鋁合金、鈦、碳化鈦、氮化鈦、鎘、銦、二氧化矽及不銹鋼之一或其組合物為靶材，用磁控濺射、等離子濺鍍或蒸鍍之方式把靶材沈積到基材12上形成鍍膜層142。需要重點說明：用絕緣真空鍍膜方法沈積之鍍膜層142可為電絕緣層。 In step one, a coating layer 142 is vacuum deposited on the surface of the substrate 12. The deposition method may be physical Vapor Deposition, Non Conductive Vacuum Metallization or Chemical Vapor Deposition. When the coating layer 142 is formed by physical vapor deposition or insulating vacuum coating, one of tin, aluminum, bismuth aluminum alloy, titanium, titanium carbide, titanium nitride, cadmium, indium, cerium oxide and stainless steel or a combination thereof may be used. As a target, a target layer is deposited on the substrate 12 by magnetron sputtering, plasma sputtering or evaporation to form a plating layer 142. It is important to note that the coating layer 142 deposited by the insulating vacuum coating method may be an electrically insulating layer.
步驟二，於鍍膜層142上塗佈黏合劑，形成一黏合層144。該步驟可於常溫下進行。該黏合劑可全部由含氯聚烯烴構成(如聚氯乙烯，聚氯丙稀)，或由重量比為1%至99%之含氯聚烯烴及其他物質構成，該其他物質可為羥基聚合物、胺基聚合物、羧基聚合物、環氧基聚合物之一或其組合。 In step two, an adhesive is applied on the coating layer 142 to form an adhesive layer 144. This step can be carried out at room temperature. The binder may be composed entirely of a chlorine-containing polyolefin (such as polyvinyl chloride, polyvinyl chloride), or a chlorine-containing polyolefin and other materials in a weight ratio of 1% to 99%, and the other substance may be a hydroxyl polymerization. One of a substance, an amine based polymer, a carboxy polymer, an epoxy polymer, or a combination thereof.
步驟三，於黏合層144上塗佈面漆，形成一外覆層146。其中塗佈方式可為噴塗或手塗。該面漆可以係透明漆或色漆，一般選用主要成分為丙烯酸樹脂之面漆。將面漆塗佈於黏合層144上後，可再依次經過流平、固化等步驟來形成外覆層146。固化方式可為熱固化或光固化，例如當該面漆為紫外線固化漆時，面漆之固化就採用紫外線固化。 In step three, a top coat is applied to the adhesive layer 144 to form an outer cover 146. The coating method can be spray coating or hand coating. The topcoat can be a clear lacquer or a lacquer, and a topcoat whose main component is an acrylic resin is generally selected. After the topcoat is applied to the adhesive layer 144, the outer cover layer 146 can be formed by successive steps of leveling, curing, and the like. The curing method may be heat curing or light curing. For example, when the top coating is an ultraviolet curing paint, the curing of the top coating is ultraviolet curing.
上述殼體10，由於在鍍膜層142與外覆層146之間形成有黏合層144，黏合層144可增強鍍膜層142與外覆層146之 間之結合力，因此可防止或減少外覆層146於使用時脫落，避免鍍膜層142被損壞，從而確保產品具有較好之外觀。 In the housing 10, since the adhesive layer 144 is formed between the coating layer 142 and the outer cover 146, the adhesive layer 144 can enhance the coating layer 142 and the outer coating layer 146. The bonding force between the two can prevent or reduce the peeling of the outer cover 146 during use, and the coating layer 142 is prevented from being damaged, thereby ensuring a good appearance of the product.
具體於本實施方式中，黏合層144包括含氯聚烯烴，含氯聚烯烴之氯可與鍍膜層142中之金屬原子相作用形成具有較強作用力之化學鍵，且含氯聚烯烴中之有機分子鏈可與外覆層146之有機分子鏈相互吸引形成較強之結合力，因此黏合層144可使外覆層146與鍍膜層142之結合力增強，從而防止外覆層146從基材12上脫落，避免或減少鍍膜層142被氧化或腐蝕。並且由於黏合層144係由聚合物材料組成，其還具有一定之彈性，因此會增加處於外表面之外覆層146之柔軟度，從而提升殼體10之手感。 Specifically, in the embodiment, the adhesive layer 144 includes a chlorine-containing polyolefin, and the chlorine of the chlorine-containing polyolefin can react with the metal atom in the coating layer 142 to form a chemical bond having a strong force, and the organic compound in the chlorine-containing polyolefin. The molecular chain can attract the organic molecular chain of the outer cover layer 146 to form a strong binding force, so the adhesive layer 144 can enhance the bonding force between the outer cover layer 146 and the coating layer 142, thereby preventing the outer cover layer 146 from the substrate 12 The upper layer is peeled off to avoid or reduce the oxidation or corrosion of the coating layer 142. And since the adhesive layer 144 is composed of a polymer material, it also has a certain elasticity, thereby increasing the softness of the coating 146 outside the outer surface, thereby enhancing the hand of the casing 10.
另外，於殼體10之表面處理過程中，通過使用不同之靶材來沈積鍍膜層142或改變面漆之顏色，還易於對殼體10之顏色進行變更，從而滿足不同之外觀需求。以及採用絕緣真空鍍膜法形成絕緣鍍膜層142時，絕緣鍍膜層142可讓電磁信號穿過，因此其不會影響攜帶式電子裝置之射頻(RF)性能與電磁相容(ESD)性能。 In addition, during the surface treatment of the casing 10, by depositing the coating layer 142 or changing the color of the topcoat by using different targets, it is also easy to change the color of the casing 10 to meet different appearance requirements. When the insulating coating layer 142 is formed by the insulating vacuum coating method, the insulating coating layer 142 allows the electromagnetic signal to pass through, so that it does not affect the radio frequency (RF) performance and electromagnetic compatibility (ESD) performance of the portable electronic device.
請參閱圖2，所示為本發明較佳實施方式二之殼體20。殼體20與殼體10相似，包括基材22與塗層24。塗層24包括鍍膜層242、黏合層244及外覆層246，其不同點在於：塗層24還包括一底層241。底層241形成於基材22之表面，處於基材22與鍍膜層242之間。底層241之厚度可為1微米至30微米。表面處理過程係先於基材22上塗佈底漆，並依次經過流平、固化等步驟形成底層241，然後再依 次於底層241沈積鍍膜層242，塗佈黏合劑形成黏合層244及塗佈面漆形成外覆層246。其中底漆之主要成分可為丙烯酸樹脂，固化方式可為熱固化或光固化。可以理解，於殼體20中，由於存在底層241，因此基材22與底層241之相接表面即使為粗糙面也可確保殼體20具有較好之外觀。 Referring to Figure 2, there is shown a housing 20 in accordance with a preferred embodiment of the present invention. The housing 20 is similar to the housing 10 and includes a substrate 22 and a coating 24. The coating 24 includes a coating layer 242, an adhesive layer 244, and an outer cover 246, the difference being that the coating 24 further includes a bottom layer 241. The bottom layer 241 is formed on the surface of the substrate 22 between the substrate 22 and the plating layer 242. The bottom layer 241 may have a thickness of from 1 micron to 30 microns. The surface treatment process is to apply a primer on the substrate 22, and then through the steps of leveling, solidification, etc. to form the bottom layer 241, and then The coating layer 242 is deposited next to the bottom layer 241, the adhesive is applied to form the adhesive layer 244, and the topcoat is applied to form the outer cover layer 246. The main component of the primer may be an acrylic resin, and the curing method may be heat curing or light curing. It can be understood that in the casing 20, since the bottom layer 241 is present, even if the abutting surface of the substrate 22 and the bottom layer 241 is a rough surface, the casing 20 can be ensured to have a good appearance.
可以理解，上述表面處理方法並不限於製備殼體，例如其還可用於處理部分表面處於設備外部之零件之表面。 It will be appreciated that the surface treatment methods described above are not limited to the preparation of a housing, for example, it may also be used to treat surfaces of parts having portions of the surface that are external to the device.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，本發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝之人士，於爰依本案發明精神所作之等效修飾或變化，皆應包含於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be equivalently modified or changed in accordance with the spirit of the invention. All should be included in the scope of the following patent application.
10、20‧‧‧殼體 10, 20‧‧‧ shell
12、22‧‧‧基材 12, 22‧‧‧ substrate
14、24‧‧‧塗層 14, 24‧ ‧ coating
142、242‧‧‧鍍膜層 142, 242‧‧ ‧ coating layer
144、244‧‧‧黏合層 144, 244‧‧ ‧ adhesive layer
146、246‧‧‧外覆層 146, 246‧‧‧ outer cladding
241‧‧‧底層 241‧‧‧ bottom layer
圖1係本發明較佳實施方式一之殼體。 1 is a housing of a preferred embodiment of the present invention.
圖2係本發明較佳實施方式二之殼體。 2 is a housing of a preferred embodiment 2 of the present invention.
10‧‧‧殼體 10‧‧‧shell
142‧‧‧鍍膜層 142‧‧‧ coating layer
12‧‧‧基材 12‧‧‧Substrate
144‧‧‧黏合層 144‧‧‧ adhesive layer
14‧‧‧塗層 14‧‧‧ Coating
146‧‧‧外覆層 146‧‧‧Overcoat
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96142439A TWI412457B (en) | 2007-11-09 | 2007-11-09 | Housing and surface treating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96142439A TWI412457B (en) | 2007-11-09 | 2007-11-09 | Housing and surface treating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200920600A TW200920600A (en) | 2009-05-16 |
| TWI412457B true TWI412457B (en) | 2013-10-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96142439A TWI412457B (en) | 2007-11-09 | 2007-11-09 | Housing and surface treating method |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI412457B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5265404A (en) * | 1989-03-13 | 1993-11-30 | Ransomes, Sims & Jefferies Limited | Reel-type grass cutting unit |
| TW505563B (en) * | 1997-03-10 | 2002-10-11 | Toyo Kohan Co Ltd | Metal sheet coated with polyester resin |
| TW200714464A (en) * | 2005-07-08 | 2007-04-16 | Arkema France | Multilayer composition |
-
2007
- 2007-11-09 TW TW96142439A patent/TWI412457B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5265404A (en) * | 1989-03-13 | 1993-11-30 | Ransomes, Sims & Jefferies Limited | Reel-type grass cutting unit |
| TW505563B (en) * | 1997-03-10 | 2002-10-11 | Toyo Kohan Co Ltd | Metal sheet coated with polyester resin |
| TW200714464A (en) * | 2005-07-08 | 2007-04-16 | Arkema France | Multilayer composition |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200920600A (en) | 2009-05-16 |
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