TWI407882B - Housing of electronic device - Google Patents

Abstract

The present invention relates to a housing of an electronic device. The housing includes a metal substrate. At least one part of a surface of the metal substrate forms a metal braided fabric thereon. The housing can be fabricated easily, and have stereo vision and relatively better tactility.

Description

Electronic device housing

The present invention relates to an electronic device housing.

With the advancement of technology, electronic devices such as notebook computers, personal digital assistants, mobile phones, and music players, in addition to greatly improved functions and performance, the housing is also thin, miniaturized and sturdy, and resistant to falling. Continuous innovation and improvement in the direction of compression and beauty.

The housing of the electronic device may be an ABS (acrylonitrile-butadiene-styrene) engineering plastic or a polycarbonate (PC). ABS engineering materials have good plasticity and are applied to products with complicated shapes, but their density is high and the thermal conductivity is poor. Polycarbonate also has good plasticity and has better heat dissipation, but its wear resistance is poor. In order to improve thermal conductivity and wear resistance, some electronic device housings have been prepared in the prior art by using a metal material having high thermal conductivity and high hardness, such as magnesium alloy, titanium alloy and stainless steel.

However, in the electronic device housing made of metal material, the housing having a specific shape is formed by die casting, stamping or injection molding, and then the metal shell is subjected to anodization to form a surface protective layer and form a metallic luster. Or the surface of the casing is shaped by a sand blasting process. However, the above process is generally difficult to form a pattern or pattern having a three-dimensional visual and tactile sensation on the surface, so that the appearance requirements of the electronic device are often not satisfied.

In view of the above, it is necessary to provide an electronic device housing that is easy to prepare and has a three-dimensional vision and a better touch.

An electronic device housing comprising a metal substrate, at least part of a surface of which is provided with a metal braid, the surface of the metal substrate comprising a fixing portion shaped as a groove and an edge portion connected to the fixing portion, the metal braid is fixed In the fixed area, the electronic device housing further includes an outer frame, the outer frame includes a surrounding portion and a sealing portion connected to the surrounding portion, the surrounding portion includes a first inner frame surface, and the sealing portion includes a second inner frame The first inner frame surface and the second inner frame surface cover the peripheral portion of the metal braid and the edge portion of the metal substrate surface.

The metal base of the electronic device casing is provided with a metal braid at least part of its surface. Since the surface of the metal braid has a three-dimensional pattern, the electronic device housing has a three-dimensional vision and a better touch. Furthermore, the metal braid is interwoven by metal strips or metal wires, which is simple to prepare and can be mass-produced, and is easily fixed to the surface of the electronic device casing by a laser welding method or a powder bonding method. Therefore, the electronic device housing described above is easy to prepare and has a good three-dimensional vision and a better touch.

100‧‧‧Electronic device housing

224‧‧‧ first outer frame

10‧‧‧Metal substrate

24‧‧‧Seal

12‧‧‧ surface

242‧‧‧Second inner frame

122‧‧‧fixed area

244‧‧‧Second outer frame

124‧‧‧Edge

30‧‧‧Metal braid

20‧‧‧Front frame

32‧‧‧The Peripheral Department

22‧‧‧ Surrounding

34‧‧‧metal strips

222‧‧‧ first inner frame

1 is a perspective view of a housing of an electronic device in accordance with a preferred embodiment of the present invention.

2 is an exploded perspective view of the electronic device housing shown in FIG. 1.

The electronic device housing of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1, an electronic device housing 100 according to a preferred embodiment of the present invention can be used as a mobile phone case. The electronic device housing 100 includes a metal base 10, an outer frame 20, and a metal braid 30. The metal braid 30 is fixed between the metal base 10 and the outer frame 20.

Referring to FIG. 2, the metal substrate 10 has a surface 12. The surface 12 includes a fixed area 122 and an edge portion 124 that is coupled to the fixed area 122. The shape of the fixed area 122 is a "U" shaped groove for securing the metal braid 30. The fixing region 122 can be formed by a chemical etching method or a press forming method. metal The material of the base 10 may be one of magnesium alloy, titanium alloy and stainless steel. Specifically, in the present embodiment, the material of the metal base 10 is preferably stainless steel.

The outer frame 20 includes a surrounding portion 22 and a sealing portion 24. The surrounding portion 22 is a "U"-shaped frame, and the sealing portion 24 is a substantially "one" type frame. The surrounding portion 22 is coupled to the closure portion 24 to form an approximately closed "D" shaped frame. The surrounding portion 22 has a first inner frame surface 222 and a first outer frame surface 224 opposite to the first inner frame surface 222. The sealing portion 24 has a second inner frame surface 242 and a second outer frame surface 244 opposite to the second inner frame surface 242. The material of the outer frame 20 may be one of magnesium alloy, titanium alloy and stainless steel. Specifically, in the embodiment, the material of the outer frame 20 is preferably stainless steel.

The metal braid 30 is approximately the same size as the fixed area 122 of the metal substrate 10 and includes a peripheral portion 32. The inner frame surface 222 of the surrounding portion 22 of the outer frame 20 and the inner frame surface 242 of the sealing portion 24 completely cover the peripheral edge portion 32 and the edge portion 124 of the surface 12 of the metal base 10. The metal braid 30 is one of a metal woven mesh and a metal woven sheet. The metal woven mesh is a woven fabric in which a metal flat strip or a metal wire is interlaced into a mesh structure; the metal woven sheet is a knitted fabric in which a metal flat strip or a metal wire is densely woven into a sheet-like structure. Specifically, in the present embodiment, the metal braid 30 is a metal woven mesh formed by interlacing a plurality of metal flat strips 34. Each strip of metal 34 has a width in the range of 1.0 mm to 1.2 mm and a thickness of 0.25 mm. The maximum spacing between the metal strips 34 is 0.7 mm. The material of the metal flat strip 34 is preferably stainless steel.

When the electronic device housing 100 is prepared, the metal braid 30 is first fixed in the fixing region 122 by a laser welding method or a powder bonding method; then, the outer frame 20 is completely covered on the peripheral portion 32 of the metal braid 30. And on the edge portion 124 of the surface 12 of the metal substrate 10.

The base surface 12 of the electronic device housing 100 provided by the present invention is provided with a metal braid 30. Since the surface of the metal braid 30 has a three-dimensional pattern, the housing 100 of the electronic device has a three-dimensional vision and a better touch. Furthermore, since the metal braid 30 is formed by interlacing a metal flat strip or a metal wire, the preparation thereof is simple and can be mass-produced, and the method of laser welding or powder bonding is easy. The electronic device housing 100 of the present invention is simple to manufacture, and is fixed to the surface 12 of the metal substrate 10 of the electronic device housing 100. In addition, since the surface area of the metal braid 30 is large, heat dissipation is facilitated, so that the heat dissipation characteristics of the electronic device housing 100 can be improved.

It can be understood that the metal braid 30 can be disposed on a portion of the surface of the metal substrate 10, that is, the fixing region 122 can be plural, and the fixing portion 122 can be disposed in an appropriate region of the surface 12 of the metal substrate 10 according to design requirements. The metal braid 30 can be designed into a variety of patterns with stereoscopic vision and better tactile sensation according to design requirements.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Electronic device housing

10‧‧‧Metal substrate

20‧‧‧Front frame

30‧‧‧Metal braid

Claims (8)

An electronic device housing comprising a metal substrate, wherein the metal substrate is at least partially provided with a metal braid, the metal substrate surface comprising a fixing portion shaped as a groove and an edge portion connected to the fixing portion, The metal braid is fixed in the fixing area, and the electronic device housing further includes an outer frame, the outer frame includes a surrounding portion and a sealing portion connected to the surrounding portion, the surrounding portion includes a first inner frame surface, and the sealing portion includes The second inner frame surface, the first inner frame surface and the second inner frame surface cover the peripheral portion of the metal braid and the edge portion of the metal substrate surface. The electronic device housing according to claim 1, wherein the metal substrate and the outer frame are made of one of a magnesium alloy, a titanium alloy and a stainless steel. The electronic device housing according to claim 1, wherein the fixing region is formed by a chemical etching method or a press forming method. The electronic device casing according to claim 1, wherein the metal braid is fixed in the fixing zone by a method of powder bonding or laser welding. The electronic device housing of claim 1, wherein the metal braid is one of a metal woven mesh and a metal woven sheet. The electronic device casing according to claim 5, wherein the metal braid is a metal woven mesh, and the metal woven mesh is interwoven by a plurality of metal flat strips, and the width of the metal flat strip ranges from 1.0. The mm to 1.2 mm and the thickness is 0.25 mm, and the gap between the metal strips is at most 0.7 mm. The electronic device housing of claim 6, wherein the metal woven mesh has the same size as the fixed area. The electronic device housing according to claim 6, wherein the material of the metal flat strip is not Stainless steel.