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TWI406119B - 用以在一區域內遠端控制壓力的系統及一化學機械研磨機系統 - Google Patents

用以在一區域內遠端控制壓力的系統及一化學機械研磨機系統 Download PDF

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TWI406119B
TWI406119B TW96101519A TW96101519A TWI406119B TW I406119 B TWI406119 B TW I406119B TW 96101519 A TW96101519 A TW 96101519A TW 96101519 A TW96101519 A TW 96101519A TW I406119 B TWI406119 B TW I406119B
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pressure
flow rate
measurement
chamber
zone
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TW200745804A (en
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Ali Shajii
Siddharth P Nagarkatti
Gordon Hill
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Mks Instr Inc
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2013—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
    • G05D16/2026—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means
    • G05D16/206—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means the plurality of throttling means being arranged for the control of a plurality of diverging pressures from a single pressure
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2013—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
    • G05D16/2026—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7837—Direct response valves [i.e., check valve type]
    • Y10T137/7838—Plural
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87169—Supply and exhaust
    • Y10T137/87193—Pilot-actuated
    • Y10T137/87209—Electric
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87265—Dividing into parallel flow paths with recombining
    • Y10T137/8733—Fluid pressure regulator in at least one branch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87265—Dividing into parallel flow paths with recombining
    • Y10T137/8741—With common operator
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87265—Dividing into parallel flow paths with recombining
    • Y10T137/87507—Electrical actuator
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages
    • Y10T137/87708—With common valve operator
    • Y10T137/87772—With electrical actuation

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Control Of Fluid Pressure (AREA)
  • Measuring Fluid Pressure (AREA)

Description

用以在一區域內遠端控制壓力的系統及一化學機械研磨機系統
本發明關於一種壓力控制系統與方法，特別是關於一種可遙控一或多個遠端區域內壓力的壓力控制系統與方法。
在一些應用當中，可能有必要調整位於遠處之區域內的壓力。舉例來說，一些機器和設備可能包含在設備作業期間經加壓或排空的腔室。此等機器的實例非侷限性來說可包含化學機械研磨(CMP)機。
一在一測量室內的壓力感測器可能僅測量該測量室內的壓力，不測量相對於該感測器位在遠處之一區域內的壓力。因此，一僅使用由位在該測量室內之一壓力感測器測得之壓力量測值的壓力控制系統可能必須假設該測量室內之壓力等於遠端區域內之壓力。但該測量室內之壓力常常不等於區域壓力。舉例來說，當該測量室內發生局域性壓力瞬變時，該測量室內之壓力不會等於區域壓力。這可導致該壓力控制系統的表現實質變差。
因此，需要能準確控制遠處區域內壓力的系統和方法。
一用於遙控一區域內之壓力的系統包含一壓力感測器、一閥系統、一區域壓力評估器、及一控制器。該壓力感測器經建構測量一可透過一導管連接到該區域且遠離該區域之圍蔽空間(譬如測量室)內的壓力。該閥系統經建構調整一流體流入和流出該圍蔽空間及透過該導管流入該區域內的流量。該閥系統包含至少一經建構調整該流體流入該圍蔽空間內之一輸入流率的進入比例閥，及一經建構調整該流體流出該圍蔽空間外之一輸出流率的排出比例閥。該區域壓力評估器經建構以該壓力感測器測得之壓力之一函數及該導管之已知特性之一函數估算一估計壓力。該控制器經建構藉由操作該進入比例閥和該排出比例閥以便將該輸入流率和該輸出流率控制成得自該區域壓力評估器之該估計壓力及該區域之一壓力設定值的一函數的方式調整該區域內之壓力。
本發明提出一種用以遙控i個區域每一者內之壓力的系統，該等區域分別可透過導管i連接到i個圍蔽空間，其中該系統藉由控制一流體流入和流出每一圍蔽空間i之流量及透過每一導管i流入每一區域i內之流量的方式進行遙控(i＝1,...,N)。該系統包含一壓力測量系統、一閥系統、一區域壓力評估器、及一控制器。該壓力測量系統經建構測量該等i個圍蔽空間每一者內之流體壓力。該閥系統針對每一圍蔽空間i包含至少一經建構調整該流體流入該圍蔽空間i內之一輸入流率的進入比例閥，及至少一經建構調整該流體流出該圍蔽空間i外之一輸出流率的排出比例閥。
該區域壓力評估器耦接於該壓力測量系統。該區域壓力評估器經建構針對每一區域i從該壓力感測器系統接收該圍蔽空間i內之一實測壓力，且以該圍蔽空間i內之實測壓力之一函數及該導管i和該區域i之已知特性之一函數估算該區域i內之一估計壓力。該控制器經建構藉由操作每一圍蔽空間i之進入比例閥和排出比例閥以便將該流體流入該圍蔽空間i內之輸入流率和該流體流出該圍蔽空間i外之輸出流率控制成該區域i之一壓力設定值及得自該區域壓力評估器之該區域i內估計壓力的一函數的方式控制每一區域i內之壓力。
本發明提出一種遙控i個區域每一者內之壓力的方法，該等區域分別可透過i個導管連接到i個圍蔽空間，其中藉由控制一流體流入和流出每一圍蔽空間i之流量及透過每一導管i流入每一區域i內之流量的方式進行遙控(i＝1,...,N)。該方法包含測量該等i個圍蔽空間內之流體壓力。該方法更包含以該圍蔽空間i內之實測壓力之一函數及該導管i和該區域i之已知特性之一函數估算每一區域i內之一估計壓力。該方法更包含針對每一區域i操作每一圍蔽空間i之一進入比例閥和一排出比例閥以便將該流體流入該圍蔽空間i內之輸入流率和該流體流出該圍蔽空間i外之輸出流率控制成該區域i之一壓力設定值及該區域i內該估計壓力的一函數，藉此依據該壓力設定值調整該區域i內之壓力。
在本說明書中，區域一辭應解釋為一封閉容積。本發明提出一種利用一以觀測者為本的方案控制遠端區域內之壓力的系統及方法，該方案準確地評估壓力欲受控制之每一遠端區域的壓力。藉由運用壓力控制系統中之遠端區域的估計壓力，閉迴圈控制表現可被大幅提昇。舉例來說，發生在測量室內但不發生在遠端區域本身內的局域性壓力瞬變可被克服。
圖1是一功能方塊圖，其例示一依據本發明一實施例調整一或多個遠端區域Zi (i＝1,...,N)內之壓力的壓力控制系統100。如圖1所示，所有區域Zi 被一單一加壓流體源40進給且排放到一單一真空排放口30內。概要地說，壓力控制系統100可包含一壓力測量和流體控制系統110(在圖2更詳細示出)、一區域壓力評估器120、及一控制器130。
壓力控制系統100可利用一區域壓力評估器120以透過一導管Fi (示於圖2)連接到區域Zi 之一圍蔽空間bi (示於圖2)內之實測壓力為基礎評估遠端區域Zi 內之壓力且藉由以得自該區域壓力評估器120之該估計壓力為基礎控制一流體流入和流出該圍蔽空間之流量而遙控每一遠端區域Zi 內之壓力。一般而言，該等圍蔽空間可為壓力測量室，然亦可使用任何其他類型能夠將該流體封閉於其內的封閉容積。
壓力測量和流體控制系統110可包含一壓力測量系統，及一流體控制系統。110中之壓力測量系統舉例來說可包含複數個壓力感測器，每一壓力感測器連接到一圍蔽空間，且經建構測量該圍蔽空間內之壓力。110中之流體控制系統可包含一控制流入和流出每一圍蔽空間之流體流率的閥系統。
區域壓力評估器120可從壓力測量系統接收壓力量測值，且亦可接收(譬如從一顧客、一操作者、或其他人接收)系統100之物理參數，此等參數舉例來說可包含導管和區域之已知特性。區域壓力評估器120更可經建構利用該等壓力量測值和物理參數運用下文詳述之計算方法計算並提供每一區域的壓力估計值。
控制器130亦可接收遠端區域Zi 每一者之壓力設定值，且可利用該等區域壓力估計值(得自區域壓力評估器120)及壓力設定值來控制該流體控制系統。特定言之，控制器130可控制該閥系統使得流入和流出每一圍蔽空間之流體流率導致每一區域內之壓力依據該等壓力設定值得到調整。
在例示實施例中，該閥系統可針對每一圍蔽空間包含至少一經建構調整流體流入圍蔽空間內之一輸入流率的進入比例閥，及一經建構調整流體流出圍蔽空間外之一輸出流率的排出比例閥。控制器130可經建構藉由操作該進入比例閥和該排出比例閥以便將該輸入流率和輸出流率控制成得自該區域壓力評估器之估計壓力的一函數和一壓力設定值的一函數而調整每一區域內之壓力。
如圖1簡要示出，控制器130可向方塊110內之閥系統(在下文參照圖2更詳細說明)發送一輸入流量命令訊號和一輸出流量命令訊號，以便分別依據該輸入流量命令訊號和輸出流量命令訊號控制輸入流率和輸出流率。在一範例實施例中，該控制器可經建構執行流入和流出每一圍蔽空間之輸入流率和輸出流率之PI(比例積分)控制(詳見下文)，但亦可採用其他控制方法。儘管控制系統和方法係以一比例加積分(PI)型控制系統和方法作說明，然亦有多種其他類型之控制系統和方法可用，其中非侷限性包含比例型、積分型、比例加微分(PD)型、及比例加積分加微分(PID)型回授控制系統和方法。
圖2更詳細地示出可分別透過i個導管Fi 連接到i個圍蔽空間bi 的i個區域(i＝1,...,N)，每一區域i內之壓力經由控制一流體流入和流出每一圍蔽空間i及透過每一導管i進入每一區域i內之流量的方式受調整。圖2亦示出用在本發明所述壓力控制系統一實施例中之一壓力測量和流體控制系統。
如圖2所示，示於圖1方塊10內之遠端區域Zi 可能可分別透過i個導管Fi 連接到i個圍蔽空間bi (i＝1,...,N)。壓力測量和流體控制系統110包含i個圍蔽空間或測量室〝bi 〞，其中i＝1至N且等於遠端區域Zi 之數量。每一測量室bi 包含一經建構調整流入bi 之流體輸入流率的進入閥112及一經建構調整流出bi 之流體輸出流率的排出閥116。每一測量室bi 沿一從加壓流體源40通過一進入歧管〝L〞到用於圍蔽空間bi 之進入閥112且離開用於圍蔽空間bi 之排出閥116經由一流量限制歧管(在圖2示為〝man〞)到真空排放口30的流體流動路線定位。一壓力感測器114(通常是一變換器)有作用地連接到每一測量室bi 以供測量bi 內之壓力。
如稍早所述，所有區域Zi 被一單一加壓流體源40進給且排放到一單一真空排放口30內。在一實施例中，該流量限制歧管可為一文氏歧管(venturi manifold)，然亦可使用其他類型的流量限制器。遠端區域Zi (示於圖2之方塊10內)可具有剛性或撓性壁，且可為耦合或不耦合的。具備撓性壁之遠端區域可具有能夠膨脹和收縮的容積。具備撓性壁之區域的容積可彼此交互作用，譬如相互推擠。
各區域Zi 間之耦合可以多種方式發生。一具有可撓曲之壁(且因此可膨脹和收縮)之區域處的容積耦合可能是因為容積膨脹/收縮及容積對容積交互作用而發生。交互作用舉例來說可因一區域膨脹並推擠另一區域從而加大該第二區域內之壓力而發生。
排放口處之排出耦合在真空壓力水準漂移時可能發生，導致排出流量改變，且在極端情況中造成在被阻塞與未被阻塞之間變遷的流動。這在一文氏泵有高流量排入文氏管線內的情況中可能特別具關鍵意義。在此情況中，區域壁可為剛性或撓性。
若一區域中之設定值被設定成夠高致使一顯著沖流流入其歧管內造成管線壓力之一下降(亦即瞬變行為)，則可能發生進入耦合。此管線壓力降可能影響到接受該源進給之所有其他區域。區域壁同樣可為剛性或撓性。
一僅具備一個區域以及剛性壁的系統可被視為一〝不耦合單區域系統〞。由獨立入口進給且排入獨立排放口之此一剛性區域的多重案例可為一〝不耦合單區域系統〞之一實例。一具備可膨脹或收縮之撓性壁的單一區域可被視為是一〝耦合單區域系統〞。圖1和2所示範例實施例可為一〝耦合多區域系統〞，其中耦合程度可以進入、排出和容積耦合為基礎予以量化。
區域壓力評估器120可藉由利用壓力感測器114之壓力量測值、每一圍蔽空間(譬如測量室)和每一區域之物理參數、及一以模型為本的演算法(詳見下文)準確地評估區域Zi 內之壓力來評估區域Zi 每一者內之壓力。其直接成果為一在一閉迴圈中運用區域壓力評估器120來控制區域Zi 內之壓力的壓力控制系統可克服不會發生在區域Zi 自身內的測量室內局域性壓力瞬變。依此方式，該壓力控制系統之閉迴圈控制表現可大幅提昇。
區域壓力評估器120輕易地整合到一先進控制系統中，且可補償呈現進入壓力/流量、排出壓力/流量之靜態及/或動態耦合以及區域容積交互作用的多個區域Zi 。區域壓力評估器120對於遠端區域Zi 之大小或容積並不設限。區域壓力感測器120對於不同範圍的壓力設定值有效，且在被併入一先進控制系統中時會確保一致瞬變和穩態行為。
控制演算法
控制器130經建構接收i個區域每一者之壓力設定值，從區域壓力評估器120接收i個區域每一者之區域壓力估計值，並且藉由控制流入和流出被連接到區域i之測量室之流體流量而操作進入和排出比例閥的方式依據壓力設定值調整每一區域中之壓力。
如稍早所述，控制器130可向圍蔽空間bi 之進入比例閥發送一輸入流量命令訊號及向圍蔽空間bi 之排出比例閥發送一輸出流量命令訊號以便分別依據該輸入流量命令訊號和輸出流量命令訊號控制流入圍蔽空間bi 之輸入流率及流出圍蔽空間bi 之輸出流率。
如稍早所述，就圍蔽空間bi 之一或多者來說，控制器可進行輸入流率和輸出流率之PI控制，但亦可採用其他類型的比例閥控制。在實施PI控制時，從控制器到一圍蔽空間i之進入比例閥的輸入流量命令訊號可由下式給出：Q in , i ＝k Pin (P t －P z , i )＋k Iin ∫(P t －P z , i )dt 且從控制器到圍蔽空間bi 之進入比例閥的輸入流量命令訊號可由下式給出：Q ont , i ＝k Pout (P t －P z , i )＋k Iout ∫(P t －P z , i )dt 在此二式中，Q in , i 代表流入圍蔽空間i之輸入流率，Q out , i 代表流出圍蔽空間bi 之輸出流率，k Pin 代表該輸入流率之一比例增益，k Iin 代表輸入流率之一積分增益，k Pont 代表輸出流率之一比例增益，k Iout 代表輸出流率之一積分增益，P z , i 代表區域Zi 內之估計壓力，P t 代表從一壓力設定值到另一壓力設定值之一期望壓力軌線，且P t －P z , i 代表一循跡誤差。壓力軌線P t 可利用多樣技術構成，其中非侷限性包含多項式，及一階或更高階微分方程式的解。
儘管在本發明之特定實施例中例示說明一種PI型控制系統和方法，應理解到熟習此技藝者會想出多樣變化和修改；舉例來說，可為以模型為本之前饋項的包含。據此，希望隨附申請專利範圍項涵蓋落入本發明之真實精神和範圍內的所有此等變化和修改。
以下提出一種用來操作區域壓力評估器120以評估每一區域中之壓力的以模型為本估算方法。此種以模型為本估算方法可為以測量室之動態狀況以及遠端區域Zi 之動態狀況和容積耦合為基礎，詳見下文。
測量室動態狀況
每一測量室bi 內之有效壓力被定義為：
其中P b , i 是測量室內之壓力變換器114對於第i個區域測得的壓力，P STP 是標準溫度壓力(STP)條件下的壓力，Q in , i 代表輸入流量且Q o , i 和Q z , i 代表輸出流量。特定言之，Q o , i 是從第i個測量室bi 到文氏歧管的流量，且Q z , i 是到第i個區域的流量。在式(1)中，V b , i 代表用於第i個區域之測量室bi 的容積。
往流量限制器或文氏歧管〝man〞的輸出流量可被表示為：
其中d orifice , l 代表測量室中向文氏歧管進給之固定噴口之直徑，且P man 代表連接到真空排放口30之文氏歧管中的壓力。通過噴口之流體流可視橫跨該固定噴口之壓力差而被阻塞或未被阻塞。
區域動態狀況和容積耦合
流往每一區域Zi 之流量可用以下動態方程式(導自Navier－Stokes方程式)敘述：
其中Q z , i 和P z , i 分別代表送往第i個區域之進入流量及該區域中之壓力，且C tube , i 和τ tube , i 是與將測量室bi 連接到區域Zi 之導管Fi 有關的常數。特定言之，C tube , i 代表導管Fi 之一傳導率、SI單位[(m3 /s)/(s－Pa)]，且τ tube , i 代表橫跨該導管之一流量平衡時間常數、亦採SI單位。
每一區域Zi 內之壓力動態狀況可如下所示：
其中每一區域Zi 之容積係由V z , i 表示，且因多個區域Zi 間之耦合而造成的動態容積交互作用可被以數學方式描述如下：
其中V zO , i 是每一區域在標準溫度壓力(STP)條件下的初始容積，τ v 是容積膨脹/收縮時間常數，γ ii 代表膨脹/收縮係數，且γ ij 代表區域i與區域j間之耦合係數。質量/慣性效應可被假設為可忽略的。
區域壓力評估器
如稍早所述，控制器130之控制目標是調整遠端區域Zi 內之壓力。但用於bi 之壓力變換器114係被裝在測量室bi 內而非區域Zi 內。如圖2所示，測量室bi 以導管Fi 相隔於遠端區域Zi 。
用於壓力控制演算法之以觀測者為本的模型可由多種方式產生。舉例來說，可利用一流量感測器(譬如一風速計、感熱型感測器、感壓型感測器、及類似物)判定上列方程式中之流量Q z , i 。另一方案可為將區域流量方程式依其離散型改寫而產生一中間流量觀測者：
其中代表第i個區域之流量評估的第n個樣本，且P b 是流線壓力變換器114測得的壓力。
然後可得到方程式(5)之一離散解：
其中代表第i個區域之容積評估的第n個樣本。基於上列方程式，壓力評估器120之演算法係建構如下：
其中代表第i個區域之壓力評估的第n個樣本，係從式(6)中定義之流量評估獲得或者在可得到直接流量量測值Q z 時由此直接量測值替換，且係從式(7)獲得。
總括而言，以上提出一種藉由準確評估壓力受控之遠端區域之壓力而控制該等遠端區域中之壓力的系統及方法。上述壓力控制系統及方法可被用在多樣應用，其中非侷限性包含一CMP機。
儘管已敘述用以控制遠端區域中之壓力的系統和方法的特定實施例，應理解到這些實施例所隱含的概念亦可被用在其他實施例。本申請案的保護範圍僅由申請專利範圍項設限。
在這些申請專利範圍項中，元件之單數形表述除非有明確指定否則不應視為〝一且唯一〞而應視為〝一或多個〞。全說明書中各實施例之元件之熟習此技藝者已知或稍後會知曉的所有結構和功能等效物以引用的方式併入本文中，且希望為申請專利範圍項所涵蓋。此外，本說明書所述內容不管是否明列於申請專利範圍項中均不希望將其獻諸公用。所有申請專利範圍項要件除非是以〝用於...的構件(means for)〞片語或是在方法申請專利範圍項中以〝用以...的步驟(step for)〞片語明確敘述否則不應依35 U.S.C.§112第六段的規定解釋。
10．．．遠端區域方塊
30．．．真空排放口
40．．．加壓流體源
100．．．壓力控制系統
110．．．壓力測量和流體控制系統
112．．．進入閥
114．．．壓力感測器
116．．．排出閥
120．．．區域壓力評估器
130．．．控制器
圖1是一依據本發明一實施例的總體功能方塊圖，其示出一調整一或多個遠端區域內之壓力的壓力控制系統。
圖2更詳細地示出可分別透過i個導管連接到i個圍蔽空間的i個區域(i＝1,...,N)以及用在本發明所述壓力控制系統一實施例中之一壓力測量和流體控制系統。
10．．．遠端區域方塊
30．．．真空排放口
40．．．加壓流體源
100．．．壓力控制系統
110．．．壓力測量和流體控制系統
120．．．區域壓力評估器
130．．．控制器

Claims (9)

  1. 一種用於遙控i個區域每一者內之壓力的系統，該等區域分別可透過導管i連接到i個測量室，該系統藉由控制一流體流入和流出每一測量室i之流量及透過每一導管i流入每一區域i內之流量的方式進行遙控，其中i=1,...,N，該系統包括：多個測量室，i，其中每個測量室藉由操作連接至該測量室的一進入比例閥及排出比例閥而可控制地關閉，其中每個排出比例閥係連接至一真空排放口，且其中該多個測量室，i，藉由一流量限制歧管在相應的排出比例閥連接至另一測量室；多個區域i，其中每個區域透過一相應的導管連接至一相應的測量室，其中每個區域係一相對於該相應測量室的遙控區域；一壓力測量系統，其經建構測量該等i個測量室內之流體壓力；一閥系統，其針對每一測量室i包含至少一經建構調整該流體流入該測量室i內之一輸入流率的進入比例閥，及至少一經建構調整該流體流出該測量室i外之一輸出流率的排出比例閥；一區域壓力評估器，其耦接於該壓力測量系統且經建構針對每一區域i從該壓力測量系統接收該測量室i內之一實測壓力，且以該測量室i內之實測壓力之一函數及該導管i和該區域i之已知特性之一函數估算 該區域i內之一估計壓力；及一控制器，其經建構藉由操作每一測量室i之進入比例閥和排出比例閥以便將該流體流入該測量室i內之輸入流率和該流體流出該測量室i外之輸出流率控制成該區域i之一壓力設定值及得自該區域壓力評估器之該區域i內估計壓力的一函數的方式控制每一區域i內之壓力；其中針對該多個測量室i，該控制器更經建構實行該每一測量室之輸入流率和輸出流率之PI控制；其中從該控制器到測量室i之進入比例閥的一輸入流量命令訊號由下式給出：Q in ,i =k Pin (P t -P z ,i )+k Iin ʃ(P t -P z ,i )dt ，其中從該控制器到測量室i之排出比例閥的一輸出流量命令訊號由下式給出：Q out ,i =k Pout (P t -P z ,i )+k Iout ʃ(P t -P z ,i )dt ；且其中：Q in ,i 代表流入測量室i之輸入流率，Q out ,i 代表流出測量室i之輸出流率，k Pin 代表該輸入流率之一比例增益，k Iin 代表該輸入流率之一積分增益，k pout 代表該輸出流率之一比例增益，k Iout 代表該輸出流率之一積分增益，P z ,i 代表區域i內之估計壓力，P t 代表從一壓力設定值到另一壓力設定值之一期望 壓力軌線，且P t -P z ,i 代表一循跡誤差。
  2. 如申請專利範圍第1項之系統，其中該壓力測量系統包括複數個壓力感測器，該等壓力感測器每一者分別經連接用以測量該等i個測量室內之壓力。
  3. 如申請專利範圍第1項之系統，其更包括一連接到該等i個測量室之進入比例閥的加壓流體源。
  4. 如申請專利範圍第3項之系統，其更在該加壓流體源與該等進入比例閥之間包括一壓力歧管。
  5. 如申請專利範圍第1項之系統，其中該流量限制歧管包括一文氏歧管。
  6. 如申請專利範圍第1項之系統，其中該等i個區域之至少一些區域具有剛性壁。
  7. 如申請專利範圍第1項之系統，其中該等i個區域之至少一些區域不耦合。
  8. 一種化學機械研磨機系統，包含：多個用以接收一加壓流體的測量室i，其中每個測量室藉由操作連接至該測量室的一進入比例閥及排出比例閥而可控制地關閉，其中每個排出比例閥連接至一真空排放口，且其中該多個測量室i藉由一流量限制歧管在相應排出比例閥連接至另一測量室；多個區域，遠離且連接到該多個測量室，該區域用以接收自該多個測量室來的加壓流體，其中每個區域 藉由一相應導管連接至該相應測量室；一閥系統，其經建構以調整該加壓流體流入和流出該每個測量室及透過該相應導管流入該相應區域內的流量；一區域壓力評估器，其經建構以該相應測量室內的一壓力的函數以及以該相應導管之已知特性之一函數而判定該每一區域內的一估計壓力；以及一控制器，其經建構藉由操作該該閥系統以便將該多個區域的輸入和輸出流率控制成得自該區域壓力評估器之該估計壓力及該多個區域之一壓力設定值的一函數的方式調整該多個區域內之壓力；其中針對該多個測量室i，該控制器更經建構實行該每一測量室之輸入流率和輸出流率之PI控制；其中從該控制器到測量室i之進入比例閥的一輸入流量命令訊號由下式給出：Q in ,i =k Pin (P t -P z ,i )+k Iin ʃ(P t -P z ,i )dt ，其中從該控制器到測量室i之排出比例閥的一輸出流量命令訊號由下式給出：Q out ,i =k Pout (P t -P z ,i )+k Iout ʃ(P t -P z ,i )dt ；且其中：Q in ,i 代表流入測量室i之輸入流率，Q out ,i 代表流出測量室i之輸出流率，k Pin 代表該輸入流率之一比例增益，k Iin 代表該輸入流率之一積分增益，k Pout 代表該輸出流率之一比例增益，k Iout 代表該輸出流率之一積分增益，P z ,i 代表區域i內之估計壓力，P t 代表從一壓力設定值到另一壓力設定值之一期望壓力軌線，且P t -P z ,i 代表一循跡誤差。
  9. 如申請專利範圍第8項之化學機械研磨機系統，更包含多個壓力感測器，其經建構以測量該多個測量室內的壓力，其中該區域壓力評估器係經建構以藉由該相應壓力感測器測量的一壓力之函數而判定每一個該多個區域內之一估計壓力。
TW96101519A 2006-01-17 2007-01-16 用以在一區域內遠端控制壓力的系統及一化學機械研磨機系統 TWI406119B (zh)

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US8037896B2 (en) 2011-10-18
CN101356481A (zh) 2009-01-28
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JP2009524147A (ja) 2009-06-25
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