TWI404949B - Maintenance method for inspection fixture and substrate inspection device - Google Patents

Abstract

PURPOSE: A method for maintenance of inspection fixture and an apparatus for inspection of a base board are provided to accurately detect maintaining/repairing timing for the inspection fixture. CONSTITUTION: A first calculation unit(51) outputs a first resistance value between inspection points from a current value of a power unit and a voltage value of a detection unit. The determining unit(61) determines goodness or badness by comparing the first resistance value with a reference resistance value. If determination result is badness, a moving unit(62) recontacts a pair of contactor contacted with the inspection points. A second calculation unit(52) produces a second resistance value between inspection points from the current value of the power unit and the voltage value of the detection unit.

Description

Inspection method for inspection jig and substrate inspection device

The present invention relates to a method for repairing a jig for inspection and a substrate inspecting device, and more particularly to a method for repairing a jig for inspection and a substrate inspecting device capable of efficiently detecting a contact between the jigs of the jig for inspection The short-circuit is abnormal, and the time for repairing the inspection jig used for the substrate inspection is accurately detected, and the inspection jig is repaired.

Further, the present invention is not limited to a printed circuit board, and can be applied to various substrates such as a flexible substrate, a multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, and a package substrate or a film carrier for a semiconductor package or Inspecting electrical wiring such as semiconductor wafers, and in the present specification, these various inspection substrates are collectively referred to as "substrates".

The wiring formed on the substrate is used to transmit and receive an electrical signal to an IC (integrated circuit), a semiconductor component, or other electronic component mounted on the substrate. Such wiring has been formed to be finer and more complicated with the miniaturization of electronic parts in recent years, and has formed lower resistance.

As the wiring of the substrate is kept fine, it is necessary to check the accuracy of the wiring and the accuracy of the defect (good or bad). Further, the finer the wiring, the smaller the resistance value of the wiring itself, and the slighter the error or the accuracy is not able to accurately check whether the resistance value of the wiring is good or not.

In particular, since the signal wiring formed on the substrate is finely formed and the resistance value is small, the two-terminal measurement method is greatly affected by the contact resistance value, and the correct resistance value cannot be calculated, which is a problem. To solve this problem, a four-terminal measurement method that is not affected by the contact resistance value is used.

In the four-terminal measurement method, since the contact resistance value is negligible, the power supply terminal (contact) and the detection/measurement terminal are brought into contact with each inspection point between the wirings to be inspected, and the inspection is performed. .

When the wiring thus formed on the substrate is made fine, it is necessary to make the distance between the plurality of contacts provided in the inspection jig for performing the four-terminal measurement method a small pitch. In particular, the contact between the power supply contact for performing the four-terminal measurement method and the contact for detecting the measurement contact (a pair of contacts) must be formed to be extremely narrow.

As described above, when a pair of contacts are formed at a narrow pitch, conductive foreign matter easily adheres between the pair of contacts, and a problem of occurrence of a short-circuit state between the pair of contacts occurs.

In order to solve such a problem, a method of detecting a short-circuit abnormal state between the contacts before inspecting the substrate has been carried out. The detection method of the short-circuit abnormal state is performed by repeating all the contacts before the inspection jig is in contact with the substrate (before inspection): the contact that is the object and the remaining contacts are not short-circuited with each other (with or without Turn-on state).

However, even if the short-circuit abnormality check between such contacts is performed, the short-circuit abnormality may not be checked. The reason for this is that the contact member of the inspection jig is crimped to the electrode portion electrically connected to the inspection device to ensure the conduction state of the contact member and the electrode portion; however, when the inspection jig is not crimped to the substrate In some cases, the contact between the contact and the electrode portion is not stably contacted. In this case, even if the short-circuit abnormality is checked as described above, the contact of the contact itself is not ensured, and as a result, the short-circuit abnormality between the contacts cannot be checked.

The present inventors do not know that there is any published patent document or published non-patent document for the inspection method of the short-circuit abnormality between the contacts of the inspection jig.

The present invention provides a maintenance method for an inspection jig and a substrate inspection device which can efficiently detect a short-circuit abnormality between contacts of the inspection jig and accurately grasp the counter substrate. The inspection jig is inspected for the time when the inspection jig used is inspected for maintenance.

The invention described in Patent Application No. 1 provides a maintenance method for an inspection jig that electrically checks a substrate to be inspected and a substrate inspection device that checks for good and bad inspection points set on the substrate to be inspected. Connecting, and comprising a pair of contacts contacting the checkpoint; characterized in that: a pair of contacts are respectively contacted to each checkpoint between the checkpoints, and the resistance value between the checkpoints is calculated, and The calculated resistance value is compared with the reference resistance value, and the good and bad between the check points are determined; and in the bad determination, the pair of contacts that were originally in contact with the check point are contacted to the check point again, and the calculation is performed again. The resistance value between the check points in the re-contact state is calculated, and the second resistance value calculated again is compared with the calculated resistance value; and then the maintenance of the inspection jig is performed according to the comparison result.

The invention of claim 2 is the method for repairing an inspection jig according to claim 1, wherein the second resistance value is compared with the calculated resistance value, and the second resistance value is calculated. The amount of difference from the calculated resistance value is used as the comparison result.

According to the invention of the invention of claim 3, in the maintenance method of the inspection jig according to the application of the second aspect, the comparison result of the difference amount is used to determine the short-circuit abnormality of the pair of contacts in accordance with the magnitude of the difference. .

The invention described in claim 4 is the method of repairing the jig for inspection according to claim 1, wherein at least one of the pair of contacts is contacted when the pair of contacts is brought into contact with the check point. The piece is in contact with the checkpoint.

The invention described in claim 5 provides a substrate inspecting apparatus for performing the inspection on a substrate to be inspected between a plurality of inspection points set to receive good inspection and failure, and for preparing maintenance information of the inspection fixture, the inspection The jig includes a pair of contacts respectively contacting the checkpoint between the checkpoints; the feature comprises: a power supply mechanism that supplies current to the checkpoint; and a detection mechanism that detects a voltage between the checkpoints; The calculation means calculates a first resistance value between the inspection points based on a current value of the power supply mechanism and a voltage value of the detection means; and a determination means compares the first resistance value with a reference resistance value to determine good and bad; The moving mechanism, when the result of the determination by the determining means is determined to be defective, causes the pair of contacts that were originally in contact with the checkpoint to be in contact with the checkpoint; the second calculating mechanism has passed the moving mechanism When in the re-contact state, the second resistance value between the check points is calculated based on the current value of the power supply mechanism and the voltage value of the detection mechanism; and management The mechanism compares the first resistance value with the second resistance value to prepare maintenance information of the inspection jig.

The invention according to claim 5, wherein the management unit calculates a difference between the first resistance value and the second resistance value, and transmits the difference according to the difference amount. A signal for cleaning the inspection jig or a notification signal for notifying the short-circuit abnormality of the contact member is displayed.

The invention according to claim 7 is the substrate inspection device according to claim 6, wherein the management unit detects a short-circuit abnormality of the pair of contacts in accordance with the magnitude of the difference.

The invention of claim 8 is the substrate inspection device according to claim 5, wherein the moving mechanism causes at least one of the pair of contacts when the pair of contacts is brought into contact with the inspection point. The contact moves into contact with the checkpoint.

The invention described in claim 9 provides a substrate inspecting apparatus for performing inspection on a substrate to be inspected between a plurality of inspection points in which a good inspection and a defect are set, and for preparing maintenance information of the inspection jig, the inspection The jig includes a pair of contacts respectively contacting the checkpoint between the checkpoints; the feature comprises: a power supply mechanism that supplies current to the checkpoint; and a detection mechanism that detects a voltage between the checkpoints; a calculation unit calculates a first resistance value between the inspection points based on a current value of the power supply mechanism and a voltage value of the detection mechanism; and an upstream power supply terminal corresponding to each of the inspection points, and the power supply mechanism The upstream side is electrically connected to the contact member; the downstream side power supply terminal corresponds to each of the check points, and the downstream side of the power supply mechanism is electrically connected to the contact; the upstream side voltage detecting terminal respectively corresponds to each of the checks Pointing, and electrically connecting the upstream side of the detecting mechanism to the contact; the downstream side voltage detecting terminals respectively corresponding to the check points, and detecting the The downstream side of the structure is electrically connected to the contact member; and the selecting means connects the upstream side power supply terminal and the upstream side voltage detecting terminal to the check point selected from the plurality of check points to be in contact with: Checking the pair of contacts of one check point between the check points of the object, and respectively connecting the downstream side power supply terminal and the downstream side voltage detecting terminal to: the pair of contacts contacting another check point; the determining mechanism, Comparing the first resistance value with the reference resistance value to determine good and bad; and the moving mechanism, when the result of the determination by the determination means determines that the defect is bad, reconnecting the pair of contacts that were originally in contact with the inspection point at that time Going to the checkpoint; the second calculating means calculates the second resistance value between the checkpoints based on the current value of the power source mechanism and the voltage value of the detecting means when the moving mechanism is in the re-contact state; And the management unit compares the first resistance value and the second resistance value to detect an abnormality of the pair of contacts.

According to the invention described in the patents 1 and 5, when a defect can be detected between the inspection points to be inspected, the pair of contacts that come into contact with the inspection point are re-contacted, and the second resistance between the inspection points is calculated again. The value is compared with the calculated resistance value when the defect is detected and the second resistance value calculated again, and the inspection jig is repaired according to the comparison result, so that the defective phase can be detected between the inspection points, and the detection is performed. When the short-circuit abnormality between the contacts of the inspection jig is detected, the defective substrate is not detected as a defective product, and the maintenance timing of the inspection jig can be efficiently grasped and the maintenance can be performed.

According to the invention described in Patent Application Nos. 2 and 6, since the comparison result is calculated based on the difference between the second resistance value and the calculated resistance value, the short-circuit abnormality between the contacts can be more clearly detected.

According to the invention described in Patent Application Nos. 3 and 7, since the short-circuit abnormality between the pair of contacts can be detected in accordance with the magnitude of the difference, the maintenance of the inspection jig can be easily performed.

According to the invention described in Patent Application Nos. 4 and 8, when a pair of contact members are re-contacted, even if both contact members are not in contact with the inspection point, the maintenance timing of the inspection jig can be grasped, so that it is not necessary to confirm the two contacts. The maintenance of the inspection jig can be efficiently performed by the contact condition of the piece.

According to the invention described in the ninth aspect of the invention, when a defect is detected between the inspection points to be inspected, the pair of contacts that come into contact with the inspection point are re-contacted, and the second resistance value between the inspection points is calculated again. By comparing the calculated resistance value at the time of the failure detection with the second resistance value calculated again, and detecting the abnormality between the pair of contacts in accordance with the comparison result, it is possible to accurately grasp the abnormality between the pair of contacts.

(Best form of implementing the invention)

The best mode for carrying out the invention will be described below.

Fig. 1 is a schematic configuration diagram of a substrate inspecting apparatus according to the present invention.

The substrate inspection apparatus 1 according to the present invention includes a power supply mechanism 2, a detection mechanism 3, a memory mechanism 4, a first calculation unit 51, a second calculation unit 52, a determination mechanism 61, a movement mechanism 62, a management mechanism 63, and a switching mechanism 7, The power supply terminal 8, the voltage detecting terminal 9, the selection mechanism 10, and the display mechanism 11.

Further, the substrate inspection apparatus 1 uses a contact probe (contact) CP for crimping a checkpoint set on a plurality of wirings (between inspection points) Rx formed on the substrate. With the contact CP, a predetermined potential or current can be given to a predetermined inspection point, or an electrical characteristic (electrical signal) can be detected from a predetermined inspection point.

In addition, in FIG. 1, although the board|substrate which the test object or the probe CP contact|connected was not shown, this probe CP contacted the inspection point of the wiring set on the board|substrate. Further, although four probes CP are displayed, the number or position of the inspection points set in the wiring is not limited, and is set according to the number or position of the wiring; and when conducting the conduction inspection of the wiring, at least one wiring is provided The two probes CP are in contact, and the resistance value between the probes is calculated to perform the determination of good and bad wiring. In the substrate inspection apparatus 1 shown in FIG. 1, in order to calculate the resistance value between the wirings using the four-terminal measurement method, the power supply terminal 8 and the voltage detection terminal 9 are provided. By switching these terminals, it is possible to measure the four terminals between the inspection points.

The power supply mechanism 2 supplies wiring for inspecting the current to be inspected (set between the inspection point set on the wiring and the inspection point set on the wiring (between the inspection points)). The power supply mechanism 2 can use, for example, a variable voltage source or a current controller, and conducts a conduction test to appropriately adjust a voltage applied to a predetermined potential to supply a current.

Further, the power supply mechanism 2 is set to be capable of applying a voltage of a magnitude of about 0 to 500 V to the checkpoint.

The detecting unit 3 detects a potential difference (voltage) between the check points of the current supplied from the power supply unit 2. The detecting means 3 can be, for example, a voltmeter, but is not particularly limited, and it is not necessary to detect the voltage between the check points.

Moreover, since the detection mechanism 3 can detect the voltage between the inspection points, it is also possible to manage the voltage between the inspection points applied by the power supply mechanism 2.

In the schematic configuration of the substrate inspection apparatus 1 of Fig. 1, a current detecting means 21 for detecting electrical characteristics between inspection points when a predetermined potential is supplied from the power supply mechanism 2 to the inspection point is disposed. The current detecting means 21 can detect the electrical characteristics (current value) between the check points. Further, the current detecting means 21 detects the magnitude of the current between the checkpoints when the power supply means 2 has applied the predetermined potential, and can also control the magnitude of the current supplied from the power supply means 2. For example, the current detecting means 21 can use an ammeter to detect the value of the current flowing between the check points.

The memory mechanism 4 stores information for performing substrate inspection, and stores information on current value (current information) applied to the inspection points, information on the voltage value of the detected voltage (voltage information), and coordinates of each checkpoint. Information or inspection order, etc. This voltage information is a voltage value between the inspection points when the measurement current is supplied to between the inspection points, and is measured by the detecting means 3.

For example, when the first inspection point and the second inspection point are set on the wiring of the substrate to be inspected, the memory mechanism 4 stores the coordinate information or wiring (the first inspection point) of the first inspection point and the second inspection point. Information such as the resistance value between the checkpoints of the second checkpoint).

The information stored in the memory unit 4 is appropriately set as information on the substrate wiring or the checkpoint if it is related to the preset.

In the memory mechanism 4, the calculation result or the determination result generated by each of the first calculation means 51, the second calculation means 52, or the determination means 61, which will be described later, is also stored together with the information between the inspection points.

The first calculating means 51 performs predetermined processing based on the information or numerical value stored in the memory means 4. The first calculating means 51 calculates resistance information which is a resistance value between the inspection points based on the current information supplied from the power supply means 2 to the current between the inspection points and the voltage information measured by the detection means 3 between the inspection points. At this time, the specific calculation method performed by the first calculating means 51 is to calculate the resistance information (=R) by dividing the voltage information (=V) by the current information (=I). Moreover, in order to facilitate the description of the specification, the resistance information calculated at this time is set to the first resistance value R1.

The first resistance information (first resistance value R1) calculated by the first calculating means 51 is stored in the memory means 4 together with the calculated information between the check points.

The determination unit 61 compares the first resistance value R1 with the reference resistance value, and determines the goodness and the defect between the inspection points. More specifically, for example, the reference resistance value is extracted from the resistance value between the inspection points of the good substrate in advance, and a value that can be determined as a predetermined width of the good product based on the resistance value is set. Then, the determination unit 61 can be set to determine that "the good resistance" is present when the first resistance value R1 is within the predetermined width, and "defective" if the first resistance value R1 is outside the predetermined range. The result of the determination by the determination means 61 is stored in the memory means 4 as the determination result information.

Moreover, when the determination means 61 determines "bad", a signal for prompting the operation is transmitted to the moving mechanism 62 which will be described later. The operation signal transmitted by the determination means 61 can transmit an operation signal to the moving mechanism 62, which will be described later, even if it is determined to be defective between the inspection points during the substrate inspection, and may be repeated several times after the inspection of the plurality of substrates is completed. If it is detected as "bad" between the same checkpoint, it can be re-sent, and the user can set it appropriately.

When the result of the determination by the determination means 61 is "defective", the movement mechanism 62 moves the inspection jig so that the pair of contacts that come into contact with the inspection point come into contact again. The movement of the inspection jig by the moving mechanism 62 may be such that the pair of contacts originally contacting the inspection point move in the planar direction with respect to the substrate when the determination is "defective" (in the x-axis direction and/or the y-axis) The movement of the combination of the direction and/or the θ rotation direction may be performed again after the detachment from the inspection point (movement in the z-axis direction), or may be a combination of the above-described movement modes.

The amount of movement of the inspection jig or the pair of contact members by the moving mechanism 62 is such that the user sets the amount of movement as described above, and after the movement mechanism 62 receives the operation signal from the determination unit 61, Move the inspection jig just like the amount of movement.

The re-contact of the jig for inspection by the moving mechanism 62 must contact at least one of the contact members at the check point, but neither of the contacts may contact the check point.

When the moving mechanism 62 causes the inspection jig to move by a predetermined amount, the signal indicating that the movement has been completed is transmitted to the second calculating means 52, which will be described later. When the second calculating means 52 receives the signal, the pair of contacts of the inspection jig are brought into a recontact state.

Further, in the actual inspection jig, two inspection jigs (not shown) are disposed so as to sandwich the substrate in order to correspond to the top and bottom surfaces of the substrate. In particular, it is necessary to carry out the signal wiring of the four-terminal measurement, and the signal wiring (between the inspection point A1 and the inspection point A2) of the inspection point A2 set on the bottom surface of the substrate is often connected from the inspection point A1 set on the top surface of the substrate. Therefore, the moving mechanism 62 moves the inspection jig disposed on either of the upper and lower sides. Further, in this case, the inspection points on the one side of the substrate are mostly formed by solder bumps, and the inspection points on the other side are formed by bonding pads.

The second calculating means 52 receives the movement completion signal of the moving mechanism 62, and calculates the second resistance value R2 which is the resistance value between the inspection points. When the second calculating means 52 receives the signal from the moving means 62, the second calculating means 52 calculates the second resistance value based on the current information stored in the power supply means 2 of the memory means 4 and the voltage information of the detecting means 3. R2.

The second resistance value R2 calculated by the second calculating means 52 is stored in the memory means 4 together with the information between the check points. When the second calculation unit 52 calculates the second resistance value R2, an operation signal for prompting the processing operation is transmitted to the management unit 63 to be described later.

The management unit 63 compares the first resistance value R1 with the second resistance value R2 to prepare maintenance information for the inspection jig. When the management unit 63 receives the operation signal from the second calculation unit 52, the management unit 63 extracts the first resistance value R1 and the second resistance value R2 stored in the memory unit 4, and compares the resistance values. For the comparison, for example, in order to detect that the first resistance value R1 and the second resistance value R2 are the same value or a different value, the difference amount of the equal resistance value is calculated.

Fig. 2 shows the relationship between the first resistance value and the second resistance value and the difference between the resistance values. In FIG. 2, four examples in which a pair of contacts are recontacted are shown, and the difference between the first resistance value R1 and the second resistance value R2 is shown as ΔR.

Example 1 and Example 2 of Fig. 2 show a case where a pair of contacts TCP is not short-circuited abnormally, and Examples 3 and 4 show a case where a pair of contacts TCP has a substance X causing a short-circuit abnormality. The first resistance value R1 is determined by the determining means 61 to The resistance value between the inspection points at the time of "bad", and the second resistance value R2 is the resistance value between the inspection points when the pair of contacts TCP is re-contacted after the first resistance value R1 is detected.

The case of the example 1 is that the pair of contacts TCP is in a normal state, and even in the re-contact state, the pair of contacts TCP are surely contacted to the check point A, respectively. At this time, since the measurement is performed between the inspection points by the normal four-terminal measurement method, the first resistance value R1 and the second resistance value R2 have the same resistance value, and the difference amount ΔR of the resistance values becomes "zero". .

In the case of the example 2, the pair of contacts TCP is in a normal state, and in the re-contact state, one of the pair of contacts does not contact the checkpoint A. At this time, since the measurement is performed on the contact that is not in contact with the inspection point A, the state in which the resistance value becomes infinite (out of the measurement range) is calculated. Then, the second resistance value R2 has a value which is extremely larger than the first resistance value R1, and the difference amount ΔR of the resistance values becomes "∞ (maximum)".

In the case of the example 3, the pair of contacts TCP are in a state of short-circuit abnormality (a state of being short-circuited due to the presence of the substance X), and even in the re-contact state, the pair of contacts TCP are surely brought into contact with the checkpoint A, respectively. At this time, although the pair of contacts TCP are in contact with the inspection point A, they are affected by the contact resistance value R01 and the contact resistance value R02 of the respective contact members contacting the inspection point A, and the first resistance value R1 and the second resistance value R2 are affected. The resistance values are different, and the difference amount ΔR of the resistance values is calculated as a specific value in the range of "hundreds to thousands of mΩ".

In the case of the example 4, the pair of contacts TCP is in a state of short-circuit abnormality (a state in which the material X is short-circuited due to the presence of the substance X), and in the re-contact state, one of the pair of contacts does not come into contact with the inspection point A. At this time, although the measurement is performed with the contact member that is not in contact with the inspection point A, the material X becomes a virtual state in which the pair of contact members TCP respectively contact the inspection point A, and is contacted with the inspection point A by a contact member. The contact resistance value R03 is generated, and the first resistance value R1 and the second resistance value R2 are different resistance values, and the difference amount ΔR of the resistance values is calculated as "hundreds to thousands of mΩ". Specific values in the range.

As described above with reference to Fig. 2, the difference ΔR between the first resistance value R1 and the second resistance value R2 is detected as a specific value in the range of several hundred to several thousand mΩ when there is a short-circuit abnormality in the pair of contacts TCP; When there is no short-circuit abnormality in the pair of contacts TCP, it will be detected as "zero" or "∞". In other words, when the difference ΔR between the first resistance value R1 and the second resistance value R2 is calculated to be a specific value within the above range, the short-circuit abnormality of the pair of contacts TCP can be detected.

Further, in the above-described examples 1 to 4, it is not necessary to check whether the pair of contacts TCP contact the checkpoints, and the short-circuit abnormality of the pair of contacts TCP can be detected, and it can be omitted whether or not the pair of contacts are respectively contacted. Time labor to checkpoint A or its steps.

The selection mechanism 10 sets an inspection target between the inspection points from the inspection points of the plurality of wirings of the substrate, and selects the inspection points set on the substrate to determine the inspection points. The selection mechanism 10 performs inspection between all the inspection points by sequentially selecting the inspection points between the inspection points. Further, the selection mechanism 10 selects two checkpoints as checkpoints and continuously selects checkpoints (between checkpoints) until the resistance values of all the wires are measured.

The method of selecting the wiring to be inspected by the selection mechanism 10 may be exemplified by setting the order between the inspection points to be inspected in advance in the memory unit 4, and selecting the inspection points in accordance with the order. The selection method is not particularly limited, and is not particularly limited as long as it is a method of selecting a checkpoint to be an object in an orderly manner.

The specific wiring selection performed by the selection mechanism 10 is implemented by using the switching mechanism 7 described later. For example, by performing ON/OFF control of each switching element SW of the switching mechanism 7, two checkpoints to be inspected are selected, and checkpoints are set.

In the substrate inspection device 1, in order to supply a constant current between the inspection points to be inspected, the upstream side power supply terminal 81 is electrically connected to one inspection point side, and the downstream side power supply is electrically connected to the other inspection point side. Terminal 82. Moreover, in order to measure the voltage between the inspection points, the upstream side voltage detection terminal 91 is electrically connected to one inspection point side, and the downstream side voltage detection terminal 92 is electrically connected to the other inspection point side.

For example, when the first inspection point A1 and the second inspection point A2 are set in the wiring of the substrate T, and the resistance value of Rx between the inspection points is the inspection target, the inspection is performed by the four-terminal measurement, and the following inspection is performed. .

The two contact pieces CP1/CP2 are abutted at the first inspection point A1, and the two contacts CP3/CP4 are also abutted at the second inspection point A2 (see FIG. 3). Moreover, in FIG. 3, the contact CP1 and the contact CP2, and the contact CP3 and the contact CP4 are respectively set as a pair of contacts.

In this case, when the resistance value of Rx between the inspection points is measured, for example, the switching element SW1 of one contact CP2 abutting on the first inspection point A1 is turned ON to be connected to the upstream side of the upstream side of the power supply mechanism 2 The power supply terminal 81 is electrically connected. Further, the switching element SW3 of the other contact CP1 is turned ON to be electrically connected to the upstream side voltage detecting terminal 91 connected to the upstream side of the detecting mechanism 3.

Moreover, the switching element SW4 of one contact CP3 that has come into contact with the second inspection point A2 is turned ON, and is electrically connected to the downstream side voltage detecting terminal 92 connected to the downstream side of the detecting mechanism 3. The switching element SW2 of the other contact CP4 is turned ON to be electrically connected to the downstream side power supply terminal 82 connected to the downstream side of the power supply mechanism 2.

By turning ON or OFF the switching element as described above, it is possible to supply a current to the check point Rx between the first inspection point A1 and the second inspection point A2, and detect the voltage of Rx between the inspection points, and the first calculation mechanism 51 or the second calculating means 52 calculates the resistance value of the Rx between the inspection points based on the current value (current information) and the voltage value (voltage information).

Further, the ON/OFF operation of the switch in the above description is not particularly limited, and the upstream side and the downstream side can be replaced.

The switching mechanism 7 is constituted by a plurality of switching elements SW that are in contact with each contact CP. The switching mechanism 7 controls the ON/OFF operation by an operation signal from the selection mechanism 10. Therefore, by the switching operation of the switching mechanism 7, the selection of the inspection points (wiring) to be inspected can be performed.

The power supply terminal 8 is a voltage supplied between the inspection targets, and is connected to a checkpoint on each wiring by the contact CP.

The power supply terminal 8 includes an upstream power supply terminal 81, an upstream side (positive side) of the power supply mechanism 2 and a wiring, and a downstream power supply terminal 82, and a downstream side (negative side) of the power supply mechanism 2 or detection. The mechanism 21 is connected to the checkpoint. As shown in FIG. 3, the upstream side power supply terminal 81 and the downstream side power supply terminal 82 of the power supply terminal 8 are connected to the check point Rx via the protective resistor R. The upstream power supply terminal 81 and the downstream power supply terminal 82 respectively have the switching element SW of the switching mechanism 7, and the ON/OFF operation of the switching element SW of the switching mechanism 7 sets the connection state/unconnected. status. The protective resistor R is a resistor for electrostatic-static discharge protection.

The voltage detecting terminal 9 is a voltage for detecting the electrical characteristics of the Rx between the inspection points, and is connected to the inspection point A of each wiring by the contact CP. The voltage detecting terminal 9 includes the following components: an upstream side voltage detecting terminal 91 that connects the upstream side (positive side) of the detecting mechanism 3 to the check point of the wiring; and a downstream side voltage detecting terminal 92 that is downstream of the detecting mechanism 3. The side (negative side) is connected to the checkpoint of the wiring. As shown in FIG. 3, the upstream side voltage detecting terminal 91 and the downstream side voltage detecting terminal 92 of the voltage detecting terminal 9 are connected to the inspection point A of the wiring via the protective resistor R. The upstream side voltage detecting terminal 91 and the downstream side voltage detecting terminal 92 have the switching element SW of the switching mechanism 7 and the ON/OFF operation of the switching element SW of the switching mechanism 7 in the same manner as the power supply terminal 8. Set the connection status/unconnected status.

As shown in FIG. 1, the power supply terminal 8 and the voltage detecting terminal 9 are arranged with four terminals for one contact CP that is in contact with the inspection point, and include four switching elements SW for performing ON/OFF control of each terminal. . In addition, in FIG. 1, the switching element which controls the operation of the upstream side power supply terminal 81 is shown by the symbol SW1, and the switching element which controls the operation of the upstream side voltage detection terminal 91 is shown by the symbol SW3, and the downstream side power supply terminal 82 is controlled. The switching element that operates is represented by the symbol SW2, and the switching element that controls the operation of the downstream side voltage detecting terminal 92 is represented by the symbol SW4.

The display mechanism 11 displays the inspection result between the substrate or the inspection point. Further, the display unit 11 is configured such that when the management unit 63 detects that one of the inspection jigs is short-circuited to the contact member, the main point is displayed, or when the abnormality is detected, the notification or the display is prompted to cause the inspection tool to be inspected. Cleaning and other maintenance. The display method or the notification method of the inspection displayed on the display unit 11 can be used to display, for example, a function of "good", "defective", "short-circuit abnormality" or "maintenance" on the substrate that has been inspected. Further, it is also possible to function to display "good" or "bad" one by one for the wiring to be inspected.

The structure of the substrate inspection apparatus 1 according to the present invention will be described above.

Next, the operation of the substrate inspection apparatus according to the present invention will be described. Fig. 4 is a flow chart showing the operation of the substrate inspecting apparatus according to the present invention.

First, in order to perform the inspection, information of the substrate to be inspected is input to the memory mechanism 4 of the substrate inspection apparatus 1 (S1). At this time, the position information of the inspection point to be inspected, the information between the inspection points to be the inspection order, the design information between the inspection points set on the substrate, and the like are input. The current information of the current applied to the Rx between the inspection points of the substrate T to be inspected, or information such as the type of the substrate is also stored in the memory mechanism 4. Further, the reference resistance value for determining the good and bad Rx between the inspection points is stored in the memory mechanism 4 in accordance with each inspection point.

When the information necessary for the inspection as described above is stored in the substrate inspection apparatus 1, the substrate T to be inspected is placed on the substrate inspection apparatus 1 (S2). When the substrate T is placed at a predetermined position, it is transported to a predetermined inspection position. The substrate T that has been transported to a predetermined inspection position is disposed, for example, in the following manner, and is prepared for inspection: a multi-needle substrate inspection jig (a jig for inspection including a plurality of inspection pieces) from the front and back sides of the substrate T The substrate T is held by a pair of contacts respectively abutting the inspection points.

In the case of the substrate T, when the contact CP of the jig for the substrate inspection is in contact with each of the inspection points A, the resistance value of the Rx between the inspection points of the inspection object is calculated, and the current is supplied to the inspection point Rx, and is detected. Output voltage (S3). Moreover, the current value and the voltage value are stored in the memory mechanism 4.

When a current is supplied between the inspection points and the voltage between the inspection points is detected, the first calculating means 51 calculates the resistance value of the Rx between the inspection points, that is, the first resistance value R1 (S4). Further, the first resistance value R1 is stored in the memory mechanism 4.

When the first calculating means 51 calculates the first resistance value R1, the determining means 61 determines the goodness and the badness between the check points based on the first resistance value R1 calculated based on the reference resistance value stored in the memory means 4 (S5). ).

At this time, when the determination unit 61 determines that the Rx between the inspection points is "good", it shifts to the inspection between the next inspection points. By performing the inspection sequence in reverse, all the inspections of the Rx between the inspection points formed on the substrate T are performed. When there is no more between the next checkpoints, the inspection between all the inspection points set on the substrate is completed, and it is determined that the substrate to be inspected is "good" and the inspection is ended (E1).

On the other hand, when the determination unit 61 determines that the check point Rx is "defective", the determination unit 61 transmits an operation signal to the moving mechanism 62. When the moving mechanism 62 receives the operation signal, the moving mechanism 62 moves the inspection jig to the re-contact state (S7). At this time, the pair of contacts TCP of the inspection jig will come into contact with the inspection point A again.

When the moving mechanism 62 moves the inspection jig by a predetermined amount, the pair of contacts (inspection jig) is brought into contact with the inspection point A again, and the calculation of the resistance value between the inspection points Rx is again performed (S8).

At this time, similarly to the case where the first resistance value R1 is calculated, a current is supplied to the inter-checkpoint Rx, and the voltage of Rx between the inspection points is detected, and the second resistance value R2 of the Rx between the inspection points is calculated.

When the second resistance value R2 is calculated, the first resistance value R1 and the second resistance value R2 are compared. More specifically, the difference amount ΔR between the first resistance value R1 and the second resistance value R2 is calculated (S9).

In this case, when the difference amount ΔR has a value of “0” or “∞”, there is no short-circuit abnormality between the pair of contacts TCP (corresponding to the case of the example 1 or the example 2 of FIG. 2), and the inspection is performed. There is no abnormality in the fixture, and the Rx between the inspection points is bad (E2).

In addition, when the difference amount ΔR is not a value of “0” or “∞”, or a specific value of several hundred to several thousand mΩ is calculated, it is necessary that a pair of contacts TCP has a short-circuit abnormality and must be implemented. To remove (clean) the maintenance of the substance X existing between the pair of contacts TCP (E3).

Further, as a result of the steps E1 to E3, by displaying on the display unit 11, it is possible to appropriately notify the user of the good and bad state of the substrate and the short-circuit abnormal state of the pair of contacts, or Check the repair notice of the fixture.

The basic operation of the substrate inspection apparatus will be described above.

1. . . Substrate inspection device

2. . . Power supply mechanism

3. . . testing facility

4. . . Memory mechanism

51. . . First computing institution

52. . . Second computing institution

61. . . Judging agency

62. . . Mobile agency

63. . . Management agency

7. . . Switching mechanism

8. . . Power supply terminal

81. . . Upstream side power supply terminal

82. . . Downstream power supply terminal

9. . . Voltage detection terminal

91. . . Upstream side voltage detection terminal

92. . . Downstream side voltage detection terminal

10. . . Selection agency

11. . . Display mechanism

twenty one. . . Current detecting mechanism (detection mechanism)

A, A1, A2. . . checking point

CP1-CP4. . . Contact

R. . . Protection resistor

R01-R03. . . Contact resistance value

R1. . . First resistance value

R2. . . Second resistance value

Rx. . . Checkpoint

△R. . . The difference between the first resistance value and the second resistance value

SW1-SW4. . . Switching element

S1-S9, E1-E3. . . step

T. . . Substrate

TCP. . . a pair of contacts

X. . . Substance causing short circuit abnormality

Fig. 1 is a schematic configuration diagram of the substrate inspecting apparatus.

Fig. 2 shows the relationship between the first resistance value and the second resistance value and the difference between the resistance values.

Fig. 3 is a schematic block diagram showing the operation of the substrate inspecting apparatus. The inspection point A1 and the inspection point A2 are set on the top and bottom surfaces of the substrate, respectively. Further, in the actual inspection, one inspection jig is provided with respect to the inspection point set on the top surface of the substrate, and one inspection jig is provided with respect to the inspection point set on the bottom surface of the substrate.

4 is a flow chart showing a substrate inspection method according to the present invention.

S1-S9, E1-E3. . . step

Claims (9)

A cleaning method for inspecting a fixture, wherein the substrate to be inspected is electrically connected to a substrate inspection device for inspecting a good or bad check point between the inspection points set on the substrate to be inspected, and includes contacting the substrate a pair of contact members of the inspection point; the maintenance method of the inspection jig is characterized in that a pair of contact members are respectively brought into contact with each inspection point between the inspection points, and a resistance value between the inspection points is calculated; The calculated resistance value is compared with the reference resistance value, and the good and bad between the check points are determined; in the bad determination, the pair of contacts that were originally in contact with the check point are re-contacted to the check point; The resistance value between the check points in the re-contact state; and comparing the recalculated second resistance value with the calculated resistance value; and then, according to the comparison result, the maintenance of the inspection jig is performed. The method for repairing a jig for inspection according to claim 1, wherein the comparison between the second resistance value and the calculated resistance value calculates a difference between the second resistance value and the calculated resistance value, The difference amount is used as the comparison result. For example, in the maintenance method of the jig for inspection of the second aspect of the patent application, the comparison result of the difference amount is based on the magnitude of the difference, and the short-circuit abnormality of the pair of contacts is judged. The maintenance method of the jig for inspection according to the first aspect of the invention, wherein at least one of the pair of contacts contacts the check point when the pair of contacts is brought into contact with the check point. A substrate inspection device for performing inspection on a substrate to be inspected between a plurality of inspection points set to be inspected and defective, and for preparing maintenance information of the inspection fixture, the inspection fixture comprising contacting the inspection point separately a pair of contacts of the checkpoint; characterized in that: a power supply mechanism supplies current to the checkpoint; a detection mechanism detects a voltage between the checkpoints; and a first calculation mechanism according to the current value of the power supply mechanism Calculating a first resistance value between the inspection points with a voltage value of the detection mechanism; and determining a comparison between the first resistance value and the reference resistance value to determine good and bad; and the moving mechanism determines the determination mechanism If the result is determined to be defective, the pair of contacts that were originally in contact with the inspection point are then brought into contact with the inspection point; and the second calculation mechanism is based on the power supply mechanism when the moving mechanism is in the re-contact state. a current value and a voltage value of the detecting means to calculate a second resistance value between the check points; and a management means to compare the first resistance value with the second resistance value, And the maintenance information of the inspection jig is produced. The substrate inspection device according to claim 5, wherein the management unit calculates a difference between the first resistance value and the second resistance value, and transmits and displays the inspection jig according to the difference amount. The signal, or a notification signal notifying the short circuit abnormality of the contact. The substrate inspection device of claim 6, wherein the management mechanism detects a short circuit abnormality of the pair of contacts according to the magnitude of the difference. The substrate inspection device of claim 5, wherein the moving mechanism moves at least one of the pair of contacts into contact with the check point when the pair of contacts is contacted to the check point . A substrate inspection device for performing the inspection on a substrate to be inspected between a plurality of inspection points set to receive good inspection and failure, and for preparing maintenance information of the inspection fixture, the inspection fixture comprising contacting the inspection separately a pair of contacts of the checkpoint between the points; the feature comprises: a power supply mechanism to supply current to the checkpoint; a detecting mechanism to detect a voltage between the checkpoints; and a first calculating mechanism according to the current of the power supply mechanism Calculating a first resistance value between the check points and a voltage value of the detection mechanism; and an upstream power supply terminal corresponding to each of the inspection points, and electrically connecting an upstream side of the power supply mechanism to the contact; The downstream side power supply terminals respectively correspond to the check points, and the downstream side of the power supply mechanism is electrically connected to the contact; the upstream side voltage detecting terminals respectively correspond to the check points, and the detecting mechanism is upstream The side is electrically connected to the contact; the downstream side voltage detecting terminals respectively correspond to the check points, and the downstream side of the detecting mechanism is electrically connected to the contact The selection means is configured to connect the upstream power supply terminal and the upstream voltage detection terminal to a checkpoint between the inspection points contacting the inspection object between the inspection points selected from the plurality of inspection points. The pair of contacts; and the downstream side power supply terminal and the downstream side voltage detecting terminal are respectively connected to the pair of contacts contacting the other check point; the determining means compares the first resistance value with the reference resistance value, and Determining good and bad; the moving mechanism, when the result of the determination by the determining means is determined to be defective, the pair of contacts that were originally in contact with the checkpoint at that time are again brought into contact with the checkpoint; the second calculating mechanism When the moving mechanism is in the re-contact state, the second resistance value between the inspection points is calculated based on the current value of the power supply mechanism and the voltage value of the detection mechanism; and the management mechanism compares the first resistance value with the The second resistance value detects an abnormality of the pair of contacts.