TWI499639B - A release agent composition, a release film, and a subsequent film using the same - Google Patents
A release agent composition, a release film, and a subsequent film using the same Download PDFInfo
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- TWI499639B TWI499639B TW099134279A TW99134279A TWI499639B TW I499639 B TWI499639 B TW I499639B TW 099134279 A TW099134279 A TW 099134279A TW 99134279 A TW99134279 A TW 99134279A TW I499639 B TWI499639 B TW I499639B
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- release
- film
- resin
- agent composition
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- 239000000203 mixture Substances 0.000 title claims description 34
- 239000002313 adhesive film Substances 0.000 claims description 49
- 239000010410 layer Substances 0.000 claims description 46
- 239000003795 chemical substances by application Substances 0.000 claims description 39
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 229920005749 polyurethane resin Polymers 0.000 claims description 31
- 125000003545 alkoxy group Chemical group 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 229920002635 polyurethane Polymers 0.000 claims description 13
- 239000004814 polyurethane Substances 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 229920002675 Polyoxyl Polymers 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 77
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- 239000001856 Ethyl cellulose Substances 0.000 description 9
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 9
- 229920001249 ethyl cellulose Polymers 0.000 description 9
- 235000019325 ethyl cellulose Nutrition 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 229920002098 polyfluorene Polymers 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000007259 addition reaction Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- -1 methoxy alkane Chemical class 0.000 description 6
- 239000003522 acrylic cement Substances 0.000 description 5
- 229910000420 cerium oxide Inorganic materials 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 5
- 229910052684 Cerium Inorganic materials 0.000 description 4
- 239000013039 cover film Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000004823 Reactive adhesive Substances 0.000 description 2
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 2
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000036461 convulsion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XTDKZSUYCXHXJM-UHFFFAOYSA-N 2-methoxyoxane Chemical compound COC1CCCCO1 XTDKZSUYCXHXJM-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
- C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本發明係關於一種離型劑組成物、離型膜及使用其之接著膜,尤其係關於一種適於對異向導電性接著膜等接著膜加以保護之離型膜及對於形成該離型膜之離型層而言有用之離型劑組成物。The present invention relates to a release agent composition, a release film, and an adhesive film therewith, and more particularly to a release film suitable for protecting an adhesive film such as an anisotropic conductive adhesive film and for forming the release film. A release agent composition useful as a release layer.
先前以來,於聚酯膜等離型基底基材之其中一面設有離型劑塗膜(離型層)之離型膜,被廣泛用作為各種接著膜之黏著劑被膜之保護膜。Conventionally, a release film having a release coating film (release layer) on one side of a polyester film isothermal base substrate has been widely used as a protective film for an adhesive film of various adhesive films.
通常,接著膜之黏著劑被膜,係藉由將含有反應性黏著劑與溶劑之塗液塗佈於基底膜之表面後,進行加熱將溶劑去除之方法被設置於基底膜上。Usually, the adhesive film of the film is applied to the base film by applying a coating liquid containing a reactive adhesive and a solvent onto the surface of the base film, and then heating and removing the solvent.
另一方面,積層於該接著膜之表面、被用作為保護膜之離型膜通常係藉由以下方式製造:將使用金屬氧化物等作為填料之白色雙軸拉伸聚酯膜作為離型基底基材,於其單面或兩面塗佈溶解於溶劑中之狀態之硬化型聚矽氧系剝離劑,並使其乾燥、硬化而形成離型層(專利文獻1)。On the other hand, a release film laminated on the surface of the adhesive film and used as a protective film is usually produced by using a white biaxially stretched polyester film using a metal oxide or the like as a filler as a release substrate. The base material is coated with a hardening type polyoxo-based release agent in a state of being dissolved in a solvent on one surface or both surfaces, and dried and cured to form a release layer (Patent Document 1).
上述硬化型聚矽氧系剝離劑所使用之聚矽氧通常要求防止與接著膜表面黏著,且儘量減少聚矽氧轉移至背面之離型基底基材。因此,聚矽氧主要使用以下型態者:使用有機錫觸媒使末端具有-OH基之聚二甲基矽氧烷與末端具有-H基之聚二甲基矽氧烷(羥基聚二甲基矽氧烷)進行縮合反應而形成三維交聯結構之類型者、或使用鉑觸媒使末端導入有乙烯基之聚二甲基矽氧烷與羥基聚二甲基矽氧烷進行加成反應之類型者。The polyfluorene oxide used in the above-mentioned hardened polyoxo-based release agent is generally required to prevent adhesion to the surface of the adhesive film and to minimize the transfer of polyfluorene to the release base substrate on the back side. Therefore, polyfluorene is mainly used in the following types: polydimethyl methoxy alkane having an -OH group at the end and polydimethyl methoxy oxane having a -H group at the end using an organotin catalyst (hydroxy polydimethylene) a type in which a condensation reaction is carried out to form a three-dimensional crosslinked structure, or a platinum catalyst is used to carry out an addition reaction of a polydimethylsiloxane having a vinyl group introduced into a terminal with a hydroxypolydimethyloxane. Type of person.
又,積層有離型膜之接著膜之使用方法,例如於該接著膜為具有異向性導電膜作為黏著劑被膜之異向性導電膜之情形時,於將液晶面板之ITO(Indium tin oxide,銦錫氧化物)電極與TAB連接時,通常首先將異向性導電膜之單面之離型膜加以剝離,將異向性導電膜加熱加壓(預壓接)於液晶面板之ITO電極上,接著再將異向性導電膜之另一面之離型基底膜加以剝離,將TAB進行加熱加壓(正式壓接)於經預壓接之接著膜上,將液晶面板與TAB確實地接合。此時,為了穩定地進行接著膜之移動、供給、剝離,離型膜發揮重要之作用。Further, when a laminate film is provided with a release film, for example, when the adhesive film is an anisotropic conductive film having an anisotropic conductive film as an adhesive film, ITO (Indium tin oxide) of the liquid crystal panel is used. When the electrode of the indium tin oxide is connected to the TAB, the release film of the one side of the anisotropic conductive film is first peeled off, and the anisotropic conductive film is heated and pressurized (pre-compression bonded) to the ITO electrode of the liquid crystal panel. Then, the release base film on the other side of the anisotropic conductive film is peeled off, and the TAB is heated and pressed (formally crimped) onto the pre-compression bonding film to surely bond the liquid crystal panel to the TAB. . At this time, in order to stably perform the movement, supply, and peeling of the adhesive film, the release film plays an important role.
於離型膜之離型層之形成中,通常為了降低其表面能量而使用聚矽氧系離型劑。然而,於使用通常之聚矽氧之情形時,離型層與塗設於其上之黏著劑被膜之親和性差,離型層與黏著劑被膜之接著力整體較弱,於兩者之剝離開始部分較強,而出現自剝離開始至剝離結束為止之期間中不穩定之所謂急拉(Jerky)現象。若出現急拉現象,則於需要較大剝離力之部分會產生黏著劑被膜之一部分會從剝離膜側往離型層側被剝離之問題。In the formation of the release layer of the release film, a polyfluorene-based release agent is usually used in order to reduce the surface energy thereof. However, in the case of using the usual polyfluorene oxide, the affinity between the release layer and the adhesive film coated thereon is poor, and the adhesion force of the release layer and the adhesive film is weak overall, and the peeling of the two starts. The part is strong, and there is a so-called Jerky phenomenon which is unstable during the period from the start of peeling to the end of peeling. If a sharp pull phenomenon occurs, a problem that a part of the adhesive film is peeled off from the peeling film side to the release layer side occurs in a portion where a large peeling force is required.
為了解決該問題,亦想到使用離型作用較小之特殊之離型膜,但此情形時,有時會產生剝離作用過小而黏附於成為覆蓋層之離型膜之所謂黏連(blocking)現象,由此存在不僅防礙接著膜之穩定移動、供給,而且導致剝離能力之不穩定,大幅度地損及作為接著膜之性能之問題。In order to solve this problem, it is also conceivable to use a special release film having a small release effect, but in this case, a so-called blocking phenomenon in which the release effect is too small to adhere to the release film which becomes a cover layer may occur. Therefore, there is a problem that not only the stable movement and supply of the adhesive film but also the peeling ability is unstable, and the performance as the adhesive film is greatly impaired.
專利文獻1:日本特開2002-220431號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-220431
本發明係為了解決上述先前技術之課題而成者,其目的在於提供一種剝離膜,當從接著膜將離型膜剝離時,該剝離膜可不產生急拉現象而順暢地剝離,且不產生離型膜之離型層黏附於接著膜之接著劑層之黏連現象,不會損及接著膜之性能。The present invention has been made in order to solve the problems of the prior art described above, and an object of the invention is to provide a release film which can be smoothly peeled off without causing a sharp pull phenomenon when peeling off the release film from the adhesive film, and does not cause separation. The release layer of the film adheres to the adhesion layer of the adhesive layer of the adhesive film without impairing the properties of the adhesive film.
本發明者為了解決該問題而反覆潛心研究,結果發現,若使形成剝離膜之離型層之剝離劑組成物中含有聚矽氧樹脂與含烷氧基之矽烷改質聚胺酯樹脂,則於將其成膜時,可獲得所謂海島結構,該海島結構係二氧化矽-聚胺酯混成複合體之多數的島分散於主劑即聚矽氧樹脂形成連續相之海中,藉此離型層與接著膜之親和性局部地提昇而可獲得所需之剝離強度,可改善急拉現象或黏連現象,從而完成了本發明。The present inventors have made intensive studies to solve this problem, and as a result, it has been found that when a release agent composition for forming a release layer of a release film contains a polyoxyxylene resin and an alkoxy-containing decane-modified polyurethane resin, When the film is formed, a so-called sea-island structure can be obtained, and a majority of the islands of the sea-island structure-cerium oxide-polyurethane hybrid composite are dispersed in a sea in which a main component, that is, a polyfluorene-oxygen resin, forms a continuous phase, whereby the release layer and the adhesive film are formed. The present invention has been completed by locally increasing the affinity to obtain the desired peel strength and improving the jerk phenomenon or the adhesion phenomenon.
基於該見解而成之本發明係一種離型劑組成物,其含有聚矽氧樹脂、含烷氧基之矽烷改質聚胺酯樹脂及溶劑。The present invention based on this finding is a release agent composition containing a polyoxyxylene resin, an alkoxy-containing decane-modified polyurethane resin, and a solvent.
該離型劑組成物中,上述含烷氧基之矽烷改質聚胺酯樹脂以固形物成分比率計較佳為0.5重量%以上、50重量%以下,更有效為1.25重量%以上、20重量%以下之情形。In the release agent composition, the alkoxy-containing decane-modified polyurethane resin preferably has a solid content ratio of 0.5% by weight or more and 50% by weight or less, more preferably 1.25% by weight or more and 20% by weight or less. situation.
又,本發明之離型膜具有離型基底基材、及設置於該離型基底基材之其中一面之離型層,離型層為上述離型劑組成物之硬化膜。Further, the release film of the present invention has a release base substrate and a release layer provided on one of the release base substrates, and the release layer is a cured film of the release agent composition.
本發明之接著膜具有離型基底基材、設置於該離型基底基材之另一面之離型層、及設置於該離型層之接著劑層,離型層為上述離型劑組成物之硬化膜。作為該接著膜之較佳態樣,可列舉接著劑層由導電粒子分散於黏合樹脂中之異向導電性接著劑構成之態樣。The adhesive film of the present invention has a release base substrate, a release layer disposed on the other side of the release base substrate, and an adhesive layer disposed on the release layer, wherein the release layer is the release agent composition Hardened film. As a preferable aspect of the adhesive film, an aspect in which the adhesive layer is formed of an anisotropic conductive adhesive in which conductive particles are dispersed in a binder resin can be used.
本發明之離型膜之製造方法係於離型基底基材上塗佈含有聚矽氧樹脂、含烷氧基之矽烷改質聚胺酯樹脂及溶劑之離型劑組成物,使其硬化而形成離型層之方法。The method for producing a release film of the present invention is characterized in that a release agent composition containing a polyoxyxylene resin, an alkoxy-containing decane-modified polyurethane resin, and a solvent is applied onto a release base substrate to form a release agent. The method of the layer.
若將本發明之離型劑組成物成膜於離型基底基材上形成離型層,則離型層會構成海島結構,該海島結構係於聚矽氧樹脂形成之連續相之海中存在有由二氧化矽-聚胺酯混成複合體形成之熱塑性樹脂之多數的島。其結果,離型層與接著膜之親和性局部地提昇。藉此,自接著膜將離型膜剝離時,可不產生急拉現象而順暢地剝離,且可不產生離型膜之離型層黏附於接著膜之接著劑層之黏連現象,可不損及作為接著膜之性能而將離型膜之離型層自接著膜之接著劑層剝離。If the release agent composition of the present invention is formed on a release base substrate to form a release layer, the release layer constitutes a sea-island structure which exists in the sea in which the continuous phase of the polyoxyl resin is formed. An island of a majority of thermoplastic resins formed from a mixture of cerium oxide and polyurethane. As a result, the affinity of the release layer and the adhesive film is locally increased. Thereby, when the release film is peeled off from the film, the film can be smoothly peeled off without causing a sharp pull phenomenon, and the release layer of the release film can be adhered to the adhesive layer of the adhesive film without causing damage. The release layer of the release film is then stripped from the adhesive layer of the adhesive film by the properties of the film.
又,根據本發明之離型劑組成物,可藉由調整含烷氧基之矽烷改質聚胺酯樹脂之添加量而獲得所需之剝離強度。Further, according to the release agent composition of the present invention, the desired peel strength can be obtained by adjusting the addition amount of the alkoxy-containing decane-modified polyurethane resin.
以下,參照圖式對本發明之較佳實施形態進行詳細說明。Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
本發明之離型劑組成物係含有聚矽氧樹脂、含烷氧基之矽烷改質聚胺酯樹脂及溶劑而成,且較佳為該等樹脂成分溶解於溶劑中。The release agent composition of the present invention comprises a polyoxyxylene resin, an alkoxy-containing decane-modified polyurethane resin, and a solvent, and preferably the resin component is dissolved in a solvent.
作為本發明所使用之聚矽氧樹脂,並無特別限定,就反應性及穩定性之觀點而言,可適當使用加成反應型聚矽氧樹脂。作為加成反應型聚矽氧樹脂,例如可列舉分子中含有烯基(例如乙烯基、己烯基等)之公知之聚二甲基矽氧烷等。作為加成反應型聚矽氧之具體例,可列舉信越化學工業股份有限公司之商品名X52-9201B、KS847、KS830等材料。The polyoxynoxy resin used in the present invention is not particularly limited, and an addition reaction type polyoxyxylene resin can be suitably used from the viewpoint of reactivity and stability. Examples of the addition reaction type polyoxynoxy resin include a known polydimethylsiloxane having an alkenyl group (for example, a vinyl group or a hexenyl group) in the molecule. Specific examples of the addition reaction type polyfluorene oxide include materials such as trade names X52-9201B, KS847, and KS830 of Shin-Etsu Chemical Co., Ltd.
又,本發明之離型劑組成物可含有先前以來一直使用之加成反應型聚矽氧之硬化觸媒,例如可較佳地列舉公知之鉑系硬化觸媒。作為鉑系硬化觸媒之例,可列舉氯鉑酸、氯鉑酸與烯烴類之錯鹽、氯鉑酸與醇類之化合物等。Further, the release agent composition of the present invention may contain an addition reaction type polyfluorene hardening catalyst which has been used in the past, and a platinum-based curing catalyst known in the art is preferably used. Examples of the platinum-based curing catalyst include chloroplatinic acid, a wrong salt of chloroplatinic acid and an olefin, a compound of chloroplatinic acid and an alcohol, and the like.
作為本發明所使用之含烷氧基之矽烷改質聚胺酯樹脂,可適當使用日本專利特願2002-220431號公報所記載者。其中,聚胺酯樹脂可使用聚醚系聚胺酯樹脂、聚碳酸酯系聚胺酯、聚酯系聚胺酯等。As the alkoxy-containing decane-modified polyurethane resin used in the present invention, those described in Japanese Patent Application No. 2002-220431 can be suitably used. Among them, a polyether-based polyurethane resin, a polycarbonate-based polyurethane, a polyester-based polyurethane, or the like can be used as the polyurethane resin.
該含烷氧基之矽烷改質聚胺酯樹脂係其硬化物具有膠化之微細之二氧化矽部位(矽氧烷鍵之高次網狀結構)者。The alkoxy-containing decane-modified polyurethane resin has a cured product having a gelatinized fine cerium oxide site (a high-order network structure of a decane bond).
本發明之離型劑組成物中之含烷氧基之矽烷改質聚胺酯樹脂之含量並無特別限定,就可確實地達成本發明之效果之觀點而言,含烷氧基之矽烷改質聚胺酯樹脂以固形物成分之比率計較佳為0.5重量%以上、50重量%以下,更佳為1.25重量%以上、20重量%以下,進而佳為2.5重量%以上、12.5重量%以下,特佳為2.5重量%以上、7.5重量%以下。The content of the alkoxy-containing decane-modified polyurethane resin in the release agent composition of the present invention is not particularly limited, and the alkoxy-containing decane-modified polyurethane can be obtained from the viewpoint of reliably achieving the effects of the present invention. The resin is preferably 0.5% by weight or more and 50% by weight or less, more preferably 1.25 % by weight or more and 20% by weight or less, further preferably 2.5% by weight or more and 12.5% by weight or less, and particularly preferably 2.5, based on the ratio of the solid content of the resin. Weight% or more and 7.5% by weight or less.
若含烷氧基之矽烷改質聚胺酯樹脂二氧化矽-聚胺酯混成複合體之含量過少,則與接著膜之親和性不充分而無法防止黏連現象,另一方面,若過多則有塗膜性及離型性劣化之虞,故欠佳。When the content of the alkoxy-modified decane-modified polyurethane resin cerium oxide-polyurethane mixed composite is too small, the affinity with the adhesive film is insufficient, and the adhesion phenomenon cannot be prevented. On the other hand, if it is too much, the coating property is too large. And the deterioration of the release property is not good.
又,於本發明之離型劑組成物中,除了形成二氧化矽-聚胺酯混成複合體之含烷氧基之矽烷改質聚胺酯樹脂以外,亦可使用其他形成二氧化矽混成有機聚合物之矽烷改質樹脂。例如,亦可使用由環氧系樹脂、酚系樹脂、聚乙烯醇系樹脂、丙烯酸系樹脂、聚苯乙烯系樹脂、聚乙酸乙烯酯系樹脂、聚醯亞胺系樹脂、聚醯胺醯亞胺系樹脂等構成者。Further, in the release agent composition of the present invention, in addition to the alkoxy-containing decane-modified polyurethane resin which forms the ceria-polyurethane mixed composite, other decane which forms a cerium oxide-mixed organic polymer may be used. Modified resin. For example, an epoxy resin, a phenol resin, a polyvinyl alcohol resin, an acrylic resin, a polystyrene resin, a polyvinyl acetate resin, a polyamidene resin, or a polyamide can also be used. A constituent of an amine resin or the like.
又,本發明之離型劑組成物中,可含有溶劑、剝離控制劑、填充劑等添加劑。溶劑並無特別限定,就確保良好之可溶性及成膜性之觀點而言,可適當組合使用甲苯、MEK(甲基乙基酮)、IPA(Isopropyl alcohol,異丙醇)、丁醇、丙酮、MIBK(Methyl isobutyl ketone,甲基異丁基酮)等。Further, the release agent composition of the present invention may contain an additive such as a solvent, a release controlling agent, or a filler. The solvent is not particularly limited, and toluene, MEK (methyl ethyl ketone), IPA (Isopropyl alcohol), butanol, acetone, and the like can be appropriately combined from the viewpoint of ensuring good solubility and film formability. MIBK (Methyl isobutyl ketone, methyl isobutyl ketone) and the like.
本發明之離型劑組成物可藉由利用常規方法將上述成分均勻混合而製備。The release agent composition of the present invention can be produced by uniformly mixing the above components by a conventional method.
本發明之離型膜係於離型基底基材之單面形成有上述本發明之離型劑組成物之硬化膜者,圖1係表示本發明之離型膜之一例之剖面圖。The release film of the present invention is a cured film in which the release agent composition of the present invention is formed on one surface of a release base substrate, and Fig. 1 is a cross-sectional view showing an example of the release film of the present invention.
如圖1所示,本例之離型膜1係由離型基底基材2、及設置於該離型基底基材2之其中一面上之離型層3而構成。As shown in Fig. 1, the release film 1 of the present embodiment is composed of a release base substrate 2 and a release layer 3 provided on one of the release base substrates 2.
此處,離型基底基材2,例如可適當使用PET(聚對苯二甲酸乙二酯)、PEN(聚萘二甲酸乙二酯)、OPP(雙軸拉伸聚丙烯)等。Here, as the release base substrate 2, for example, PET (polyethylene terephthalate), PEN (polyethylene naphthalate), OPP (biaxially oriented polypropylene), or the like can be suitably used.
離型層3可藉由以下方式而形成:於離型基底基材2上塗佈上述本發明之離型劑組成物,並對其適當進行乾燥、加熱使其硬化。The release layer 3 can be formed by applying the above-described release agent composition of the present invention to the release base substrate 2, and drying it, heating it, and hardening it.
本發明之離型劑組成物硬化而成之離型層3具有海島結構,該海島結構係於聚矽氧樹脂形成之連續相之海中,分散有由二氧化矽-聚胺酯混成複合體形成之熱塑性樹脂之多數的島。因此,該離型層3與未分散有二氧化矽-聚胺酯混成複合體之島的離型層相比較,與接著膜之親和性提昇。The release layer 3 obtained by hardening the release agent composition of the present invention has a sea-island structure which is in the sea of the continuous phase formed by the polyoxyn resin, and is dispersed with a thermoplastic formed by the ceria-polyurethane hybrid composite. The island of most of the resin. Therefore, the release layer 3 has an improved affinity with the adhesive film as compared with the release layer of the island in which the cerium oxide-polyurethane mixed composite is not dispersed.
本發明之情況下,離型層3之厚度並無特別限定,就兼顧離型性與經濟性之觀點而言,較佳為0.05 μm以上、0.5 μm以下。In the case of the present invention, the thickness of the release layer 3 is not particularly limited, and is preferably 0.05 μm or more and 0.5 μm or less from the viewpoint of both release property and economy.
本發明之接著膜係於本發明之離型膜之離型層上設有接著劑層者,圖2係表示本發明之接著膜之一例之剖面圖。The adhesive film of the present invention is provided with an adhesive layer on the release layer of the release film of the present invention, and Fig. 2 is a cross-sectional view showing an example of the adhesive film of the present invention.
如圖2所示,本例之接著膜10係於上述離型膜1之離型層3上設置有接著劑層4而構成。As shown in Fig. 2, the adhesive film 10 of this example is formed by providing the adhesive layer 4 on the release layer 3 of the release film 1.
接著劑層4可與公知之接著膜同樣地設置黏著性、熱塑性、熱硬化性、光硬化性之樹脂層,其樹脂成分可含有環氧樹脂、苯氧樹脂、丙烯酸系樹脂等。於用以形成接著劑層4之樹脂組成物中,可適當含有聚合起始劑、溶劑等。The adhesive layer 4 may be provided with a resin layer of adhesiveness, thermoplasticity, thermosetting property, and photocurability in the same manner as the known adhesive film, and the resin component may contain an epoxy resin, a phenoxy resin, an acrylic resin, or the like. The resin composition for forming the adhesive layer 4 may suitably contain a polymerization initiator, a solvent or the like.
又,亦可藉由使接著劑層4含有導電性粒子而使接著劑層4形成為異向性導電膜,使接著膜10為異向導電性接著膜(ACF)。Further, the adhesive layer 4 may be formed of an anisotropic conductive film by including the conductive particles in the adhesive layer 4, and the adhesive film 10 may be an anisotropic conductive adhesive film (ACF).
作為接著膜10之製造方法,於上述離型膜1之離型層3上塗佈接著劑層形成用樹脂組成物,並使其乾燥、硬化。As a method of producing the adhesive film 10, a resin composition for forming an adhesive layer is applied onto the release layer 3 of the release film 1, and dried and cured.
接著劑層4之厚度並無特別限定,就兼顧接著性與經濟性之觀點而言,較佳為0.005 mm以上、0.05 mm以下。The thickness of the adhesive layer 4 is not particularly limited, and is preferably 0.005 mm or more and 0.05 mm or less from the viewpoint of adhesiveness and economy.
實施例Example
以下,藉由實施例對本發明進行具體說明,本發明並不限定於該等實施例。Hereinafter, the invention will be specifically described by way of examples, but the invention is not limited to the examples.
實施例1Example 1
將含烷氧基之矽烷改質聚胺酯樹脂溶液(固形物成分為25%)(Iuliano U302,荒川化學工業公司製造)10重量份、30%加成反應型聚矽氧溶液(KS-847,信越化學工業公司製造)27重量份、鉑硬化觸媒(PL-50T,信越化學工業公司製造)0.8重量份、甲苯30重量份及MEK 33重量份均勻混合而製備離型劑組成物。Alkoxy-containing decane modified polyurethane resin solution (solid content: 25%) (Iuliano U302, manufactured by Arakawa Chemical Industry Co., Ltd.) 10 parts by weight, 30% addition reaction type polyoxyl solution (KS-847, Shin-Etsu 27 parts by weight, a platinum hardening catalyst (PL-50T, manufactured by Shin-Etsu Chemical Co., Ltd.), 0.8 parts by weight, 30 parts by weight of toluene, and 33 parts by weight of MEK were uniformly mixed to prepare a release agent composition.
再者,本實施例之情況下,離型劑組成物之固形物成分之比率(觸媒除外)係含烷氧基之矽烷改質聚胺酯樹脂為20重量%,聚矽氧樹脂為80%。Further, in the case of the present embodiment, the ratio of the solid content component of the release agent composition (excluding the catalyst) was 20% by weight of the alkoxy-containing decane-modified polyurethane resin, and 80% by weight of the polyoxyxylene resin.
利用線棒以乾燥厚度成為0.1 μm之方式,將所得之離型劑組成物塗佈於為膜基材之50 μm厚PET膜之其中一面,將其放入至烘箱內並於160℃之溫度下保持1分鐘後,自烘箱中取出。如此,獲得於離型基底基材之其中一面設置有離型層之離型膜。The obtained release agent composition was applied to one side of a 50 μm thick PET film which is a film substrate by using a wire bar to have a dry thickness of 0.1 μm, and placed in an oven at a temperature of 160 ° C. After holding for 1 minute, remove it from the oven. Thus, a release film having a release layer provided on one side of the release base substrate was obtained.
<a. 對黏著膜之初期剝離強度><a. Initial peel strength to the adhesive film>
於實施例1所得之離型膜之離型層上貼合測試用丙烯酸系黏著膜(T4090,索尼化學&信息部件股份有限公司製造),切成長200 mm、寬50 mm之長條狀,使所得之長條狀試樣承載2kg之荷重,保持該狀態於70℃老化20小時。老化結束後,於25℃下進行T模剝離試驗,使用剝離強度試驗機(Tensilon,Orientec公司製造)測定初期剝離強度(N/5 cm)。The acrylic adhesive film for test (T4090, manufactured by Sony Chemicals & Information Co., Ltd.) was bonded to the release layer of the release film obtained in Example 1, and cut into strips having a length of 200 mm and a width of 50 mm. The obtained long strip sample carried a load of 2 kg, and this state was maintained at 70 ° C for 20 hours. After the aging was completed, the T-die peeling test was performed at 25 ° C, and the initial peel strength (N/5 cm) was measured using a peel strength tester (Tensilon, manufactured by Orientec Co., Ltd.).
<b. 對接著膜ADH之初期剝離強度><b. Initial peel strength of the adhesive film ADH>
於實施例1所得之離型膜之其中一面塗佈接著膜ADH(含環氧系硬化劑之反應性黏著液),於80℃之烘箱內保持1分鐘,去除溶劑。其後,對離型膜上之接著膜ADH塗膜貼合丙烯酸系黏著膜(PP膠帶,日東電工公司製造),切成長200 mm、寬50 mm之長條狀,於25℃下進行T模剝離試驗,使用剝離強度試驗機(Tensilon,Orientec公司製造)測定初期剝離強度(N/5cm)。將其結果示於表1。On one of the release films obtained in Example 1, a film ADH (reactive adhesive containing an epoxy-based curing agent) was applied, and the film was kept in an oven at 80 ° C for 1 minute to remove the solvent. Thereafter, the ADH coating film on the release film was bonded to an acrylic adhesive film (PP tape, manufactured by Nitto Denko Corporation), and cut into strips having a length of 200 mm and a width of 50 mm, and a T-die was performed at 25 ° C. In the peeling test, the initial peel strength (N/5 cm) was measured using a peel strength tester (Tensilon, manufactured by Orientec Co., Ltd.). The results are shown in Table 1.
<c. 黏連><c. Adhesion>
於上述b.對接著膜ADH之初期剝離強度之試驗中,根據對覆蓋膜(接著膜ADH與丙烯酸系黏著膜之積層物)之黏附之發生率而研究黏連之產生狀況,按以下評價基準進行評價。In the above test for the initial peel strength of the adhesive film ADH, the occurrence of adhesion was investigated based on the incidence of adhesion to the cover film (the laminate of the film ADH and the acrylic adhesive film), and the following evaluation criteria were used. Conduct an evaluation.
[評價基準][evaluation benchmark]
A:對覆蓋膜之黏附之發生率為1%以下A: The incidence of adhesion to the cover film is 1% or less.
B:對覆蓋膜之黏附之發生率為1%以上、未達10%B: The incidence of adhesion to the cover film is 1% or more and less than 10%.
C:對覆蓋膜之黏附之發生率為10%以上C: The incidence of adhesion to the cover film is 10% or more.
將結果示於表1。The results are shown in Table 1.
<d. 急拉><d. 急拉>
於上述b.對接著膜ADH之初期剝離強度之試驗中,根據剝離力圖表中之最大值(Max)與最小值(Min)之差相對於平均剝離力(Ave)之比率R(R=100×(Max-Min)/Ave)研究急拉之產生狀況,按以下評價基準進行評價。In the above test b. For the initial peel strength of the film ADH, the ratio of the difference between the maximum value (Max) and the minimum value (Min) in the peel force chart to the average peel force (Ave) is R (R = 100). × (Max-Min)/Ave) The state of occurrence of the jerk was studied and evaluated according to the following evaluation criteria.
[評價基準][evaluation benchmark]
A:R之值為20%以下(實際應用上無問題之水平)A: The value of R is 20% or less (the level of no problem in practical application)
B:R之值為20%以上、未達50%B: The value of R is 20% or more and less than 50%.
C:R之值為50%以上C: R value is 50% or more
將結果示於表1。The results are shown in Table 1.
<e. 初期殘留接著率><e. Initial residual adhesion rate>
利用手動輥(hand roller),於平滑之不鏽鋼板上貼附上述a.對黏著膜之初期剝離強度試驗中經剝離之測試用丙烯酸系黏著膜,並藉由上述方法測定剝離強度(殘留剝離強度)。The acrylic adhesive film which was peeled off in the initial peel strength test of the adhesive film was attached to a smooth stainless steel plate by a hand roller, and the peel strength (residual peel strength) was measured by the above method. ).
利用手動輥,於平滑之不鏽鋼板上貼附與上述不同而未使用之測試用丙烯酸系黏著膜,並藉由上述方法測定剝離強度(基準剝離強度)。繼而,計算出初期殘留接著率(%)作為殘留剝離強度相對於基準剝離強度之比率。將其結果示於表1。The acrylic adhesive film for testing which was not used in the above-described manner was attached to a smooth stainless steel plate by a hand roll, and the peel strength (reference peel strength) was measured by the above method. Then, the initial residual adhesion ratio (%) was calculated as the ratio of the residual peel strength to the reference peel strength. The results are shown in Table 1.
<實施例2><Example 2>
除了代替實施例1之含烷氧基之矽烷改質聚胺酯樹脂溶液(Iuliano U302,荒川化學工業公司製造)10重量份而調配其他含烷氧基之矽烷改質聚胺酯樹脂溶液(Iuliano U301,荒川化學工業公司製造)10重量份以外,藉由與實施例1相同之方法製作試樣,進行相同之實驗。將其結果示於表1。In addition to 10 parts by weight of the alkoxy-containing decane-modified polyurethane resin solution (Iuliano U302, manufactured by Arakawa Chemical Industries Co., Ltd.) of Example 1, the other alkoxy-containing decane-modified polyurethane resin solution (Iuliano U301, Arakawa Chemical) was formulated. A sample was prepared in the same manner as in Example 1 except that 10 parts by weight of the product was produced by Industrial Co., and the same experiment was carried out. The results are shown in Table 1.
<比較例1><Comparative Example 1>
調配10%乙基纖維素溶液(N100,Hercules公司製造)20重量份,來取代上述含烷氧基之矽烷改質聚胺酯樹脂(Iuliano U302,荒川化學工業公司製造)10重量份,除此之外,藉由與實施例1相同之方法製作試樣,進行相同之實驗。將其結果示於表1。20 parts by weight of a 10% ethyl cellulose solution (N100, manufactured by Hercules Co., Ltd.) was added to replace 10 parts by weight of the above alkoxy-containing decane-modified polyurethane resin (Iuliano U302, manufactured by Arakawa Chemical Industries Co., Ltd.). A sample was prepared in the same manner as in Example 1 and the same experiment was carried out. The results are shown in Table 1.
再者,比較例1之情況下,纖維素之調配比相對於離型劑組成物之樹脂固形物成分整體為20重量%,離型劑組成物之樹脂固形物成分之比率係纖維素為20重量%,聚矽氧樹脂為約80%。Further, in the case of Comparative Example 1, the blending ratio of cellulose was 20% by weight based on the total of the resin solid content of the release agent composition, and the ratio of the resin solid content of the release agent composition was 20%. The wt% polyoxyl resin is about 80%.
<比較例2><Comparative Example 2>
除了不添加上述含烷氧基之矽烷改質聚胺酯樹脂(Iuliano U302,荒川化學工業公司製造)以外,藉由與實施例1相同之方法製作試樣,進行相同之實驗。將其結果示於表1。A sample was prepared in the same manner as in Example 1 except that the above alkoxy-containing decane-modified polyurethane resin (Iuliano U302, manufactured by Arakawa Chemical Industries Co., Ltd.) was not added, and the same experiment was carried out. The results are shown in Table 1.
<比較例3><Comparative Example 3>
調配聚酯樹脂(Elitel VE3200,Unitika公司製造)之10重量%(甲苯/MEK=1:1)溶液20重量份,取代上述含烷氧基之矽烷改質聚胺酯樹脂(Iuliano U302,荒川化學工業公司製造)10重量份,除此之外,藉由與實施例1相同之方法製作試樣,進行相同之實驗。再者,比較例3之情況下,離型劑組成物之固形物成分之比率(觸媒除外)係聚酯樹脂為20重量%,聚矽氧樹脂為80%。將其結果示於表1。20 parts by weight of a 10% by weight (toluene/MEK=1:1) solution of a polyester resin (Elitel VE3200, manufactured by Unitika Co., Ltd.) was added to replace the above alkoxy-containing decane-modified polyurethane resin (Iuliano U302, Arakawa Chemical Industry Co., Ltd. A sample was prepared in the same manner as in Example 1 except that 10 parts by weight of the product was produced, and the same experiment was carried out. Further, in the case of Comparative Example 3, the ratio of the solid content component of the release agent composition (excluding the catalyst) was 20% by weight of the polyester resin and 80% by weight of the polyoxyxylene resin. The results are shown in Table 1.
<比較例4><Comparative Example 4>
調配二氧化矽(DF-5VLD,龍森公司製造)之10重量%之溶膠(甲苯)20重量份,代替上述含烷氧基之矽烷改質聚胺酯樹脂(Iuliano U302,荒川化學工業公司製造)10重量份,除此之外,藉由與實施例1相同之方法製作試樣,進行相同之實驗。再者,比較例4之情況下,離型劑組成物之固形物成分之比率(觸媒除外)係聚酯樹脂為20重量%,聚矽氧樹脂為80%。將其結果示於表1。20 parts by weight of a 10% by weight sol (toluene) of cerium oxide (DF-5VLD, manufactured by Ronson Co., Ltd.) was prepared in place of the above alkoxy-containing decane-modified polyurethane resin (Iuliano U302, manufactured by Arakawa Chemical Industries Co., Ltd.) 10 A sample was prepared in the same manner as in Example 1 except for the parts by weight, and the same experiment was carried out. Further, in the case of Comparative Example 4, the ratio of the solid content component of the release agent composition (excluding the catalyst) was 20% by weight of the polyester resin and 80% by weight of the polyoxyxylene resin. The results are shown in Table 1.
<f. ACF剝離強度與含烷氧基之矽烷改質聚胺酯樹脂添加量之依存性><f. Dependence of ACF peel strength on the addition amount of alkoxy-containing decane modified polyurethane resin>
使用以下者作為ACF。Use the following as the ACF.
首先,將苯氧樹脂(YP50,東都化成公司製造)50重量份、環氧樹脂(828,油化殼牌公司製造)50重量份、咪唑系硬化劑(HX3941HP,旭化成公司製造)100重量份、矽烷偶合劑(A187,邁圖高新材料日本有限公司製造)3.2重量份、平均粒徑100 nm之聚丁二烯粒子0.5重量份溶解於甲苯溶劑中,製備絕緣性接著劑樹脂、即黏合劑溶液。First, 50 parts by weight of a phenoxy resin (YP50, manufactured by Tohto Kasei Co., Ltd.), 50 parts by weight of an epoxy resin (828, manufactured by Hosei Co., Ltd.), 100 parts by weight of an imidazole-based curing agent (HX3941HP, manufactured by Asahi Kasei Co., Ltd.), and decane. A coupling agent (A187, manufactured by Momentive Advanced Materials Japan Co., Ltd.), 3.2 parts by weight, and 0.5 parts by weight of polybutadiene particles having an average particle diameter of 100 nm were dissolved in a toluene solvent to prepare an insulating adhesive resin, that is, a binder solution.
繼而,於該黏合劑溶液100重量份中添加作為導電粒子之對平均粒徑5 μm之苯并胍胺粒子實施鎳-金鍍敷而成者3.5重量份,形成黏合劑。Then, 3.5 parts by weight of benzoguanamine particles having an average particle diameter of 5 μm as conductive particles were added to 100 parts by weight of the binder solution to form a binder.
進而,以乾燥後之厚度成為25 μm之方式將該黏合劑塗佈於剝離用之PET膜上而獲得異向導電性接著膜。將該異向導電性接著膜切成寬2 mm之條狀,作為ACF之試樣。Further, the adhesive was applied onto a PET film for peeling so that the thickness after drying became 25 μm to obtain an anisotropic conductive film. The anisotropic conductive adhesive film was cut into strips having a width of 2 mm to prepare a sample of ACF.
於上述實施例1之離型膜中,將含烷氧基之矽烷改質聚胺酯樹脂溶液(Iuliano U302,荒川化學工業公司製造)之調配量設為20重量%、40重量%、60重量%、80重量%,藉由上述「b.對接著膜ADH之初期剝離強度」之方法測定ACF剝離強度。將其結果示於圖3。In the release film of the above-mentioned Example 1, the amount of the alkoxy-containing decane-modified polyurethane resin solution (Iuliano U302, manufactured by Arakawa Chemical Industries Co., Ltd.) was set to 20% by weight, 40% by weight, 60% by weight, 80% by weight, the ACF peel strength was measured by the above method "b. Initial peel strength to the adhesive film ADH". The result is shown in Fig. 3.
<g. ACF剝離強度與纖維素添加量之依存性><g. Dependence of ACF peel strength and cellulose addition amount>
製作於上述比較例1之離型膜中10%乙基纖維素溶液(N100,Hercules公司製造)之調配量為20重量%、40重量%、60重量%、80重量%之離型膜之試樣,使用與上述f相同之ACF,藉由上述方法測定ACF之剝離強度。將其結果示於圖4。A test of a release film of 20% by weight, 40% by weight, 60% by weight, and 80% by weight of a 10% ethylcellulose solution (N100, manufactured by Hercules) in the release film of the above Comparative Example 1 Thus, the peel strength of ACF was measured by the above method using the same ACF as the above f. The result is shown in Fig. 4.
<h. 殘留接著率與含烷氧基之矽烷改質聚胺酯樹脂添加量之依存性><h. Dependence of residual adhesion rate on the addition amount of alkoxy-containing decane modified polyurethane resin>
於上述實施例1中,將含烷氧基之矽烷改質聚胺酯樹脂溶液(Iuliano U302,荒川化學工業公司製造)之調配量設為20重量%、40重量%、60重量%、80重量%,使用與上述f相同之ACF,與上述e之方法同樣地測定殘留接著率。將其結果示於圖5。In the above-mentioned Example 1, the amount of the alkoxy-containing decane-modified polyurethane resin solution (Iuliano U302, manufactured by Arakawa Chemical Industries Co., Ltd.) was set to 20% by weight, 40% by weight, 60% by weight, and 80% by weight. Using the same ACF as the above f, the residual adhesion ratio was measured in the same manner as in the above-described method. The result is shown in Fig. 5.
<i. ACF殘留接著率與纖維素添加量之依存性><i. Dependence of ACF residual adhesion rate and cellulose addition amount>
與10%乙基纖維素溶液(N100,Hercules公司製造)之調配量為20重量%之比較例1同樣地製作10%乙基纖維素溶液為40重量%、60重量%、80重量%之離型膜,使用與上述f相同之ACF,與上述e之方法同樣地測定殘留接著率。將其結果示於圖6。In the same manner as in Comparative Example 1 in which the amount of the 10% ethylcellulose solution (N100, manufactured by Hercules) was 20% by weight, the 10% ethylcellulose solution was prepared to be 40% by weight, 60% by weight, or 80% by weight. The residual film was measured in the same manner as in the above-described method using the same ACF as that of the above-mentioned f. The result is shown in Fig. 6.
<評價><evaluation>
由圖3表明,於使聚矽氧樹脂中含有含烷氧基之矽烷改質聚胺酯樹脂之實施例中,若增加含烷氧基之矽烷改質聚胺酯樹脂之含量,則可使對接著膜之剝離強度提昇而達到所需之值。It is shown in Fig. 3 that in the embodiment in which the alkoxy-containing decane-modified polyurethane resin is contained in the polyoxynoxy resin, if the content of the alkoxy-containing decane-modified polyurethane resin is increased, the film can be bonded to the film. The peel strength is increased to achieve the desired value.
又,本實施例中,由圖5表明,即便於使含烷氧基之矽烷改質聚胺酯樹脂之含量增加至60重量%之情形時,殘留接著率亦大於90%,未見其下降。Further, in the present embodiment, as shown in Fig. 5, even when the content of the alkoxy-containing decane-modified polyurethane resin was increased to 60% by weight, the residual adhesion ratio was more than 90%, and no decrease was observed.
另一方面,由圖4表明,於使聚矽氧樹脂中含有乙基纖維素之比較例1中,即便於使乙基纖維素之含量增加之情形時,對接著膜之剝離強度亦未上升,反而可見下降之傾向。On the other hand, as shown in Fig. 4, in Comparative Example 1 in which ethylcellulose was contained in the polyoxyxene resin, even when the content of ethylcellulose was increased, the peeling strength to the adhesive film did not rise. Instead, there is a tendency to decline.
進而,於該比較例1中,藉由含有乙基纖維素,如圖6所示般殘留接著率下降至80%左右。Further, in Comparative Example 1, by containing ethyl cellulose, as shown in Fig. 6, the residual adhesion ratio was lowered to about 80%.
另一方面,於如比較例3般使聚矽氧樹脂中含有聚酯之情形時,即便增加聚酯之含量,對接著膜之剝離強度亦未上升。On the other hand, in the case where the polyester is contained in the polyoxyxene resin as in Comparative Example 3, even if the content of the polyester is increased, the peeling strength against the adhesive film does not increase.
進而,於如比較例4般使聚矽氧樹脂中含有二氧化矽之情形時,對ACF之剝離強度遠小於實施例,即便增加二氧化矽之含量,對接著膜之剝離強度亦未上升。Further, when the cerium oxide was contained in the polyfluorene oxide as in Comparative Example 4, the peeling strength against ACF was much smaller than that in the examples, and even if the content of cerium oxide was increased, the peeling strength against the adhesive film did not increase.
由以上結果表明,根據本發明,可防止剝離強度不穩定之黏連現象,且可不大幅度地損及接著膜之性能而確保穩定之剝離強度。From the above results, according to the present invention, it is possible to prevent the peeling strength from being unstable and to prevent the peeling strength from being unstable, and to ensure the stable peeling strength without greatly impairing the performance of the adhesive film.
[產業上之可利用性][Industrial availability]
本發明之離型膜對於保護異向導電性接著膜等接著膜而言有用,且本發明之離型劑組成物對於形成離型膜之離型層而言有用。The release film of the present invention is useful for protecting an adhesive film such as an anisotropic conductive adhesive film, and the release agent composition of the present invention is useful for forming a release layer of a release film.
1...離型膜1. . . Release film
2...離型基底基材2. . . Release substrate
3...離型層3. . . Release layer
4...接著劑層4. . . Subsequent layer
10...接著膜10. . . Next film
圖1係表示本發明之離型膜之例之剖面圖。Fig. 1 is a cross-sectional view showing an example of a release film of the present invention.
圖2係表示本發明之接著膜之例之剖面圖。Fig. 2 is a cross-sectional view showing an example of a film of the present invention.
圖3係表示ACF剝離強度與二氧化矽-聚胺酯混成複合體添加量之依存性的圖表。Fig. 3 is a graph showing the dependence of the ACF peel strength on the amount of addition of the ceria-polyurethane hybrid composite.
圖4係表示ACF剝離強度與乙基纖維素溶液添加量之依存性的圖表。Fig. 4 is a graph showing the dependence of the ACF peel strength on the amount of ethylcellulose solution added.
圖5係表示ACF殘留接著率與含烷氧基之矽烷改質聚胺酯樹脂溶液添加量之依存性的圖表。Fig. 5 is a graph showing the dependence of the ACF residual adhesion ratio on the amount of the alkoxy-containing decane-modified polyurethane resin solution.
圖6係表示ACF殘留接著率與乙基纖維素溶液添加量之依存性的圖表。Fig. 6 is a graph showing the dependence of the ACF residual adhesion ratio on the amount of ethyl cellulose solution added.
Claims (8)
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| JP2009232215 | 2009-10-06 |
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| JP (1) | JP5671923B2 (en) |
| KR (1) | KR101725559B1 (en) |
| CN (1) | CN102272256B (en) |
| TW (1) | TWI499639B (en) |
| WO (1) | WO2011043386A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10280339B2 (en) | 2017-05-31 | 2019-05-07 | Hannstar Display (Nanjing) Corporation | Method for manufacturing flexible electrical device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107266696B (en) * | 2017-06-12 | 2020-10-27 | 浙江洁美电子科技股份有限公司 | Manufacturing method of release film for chip component manufacturing process and release film manufactured by manufacturing method |
| KR102518776B1 (en) * | 2017-12-27 | 2023-04-10 | 도요보 가부시키가이샤 | Release Film for Ceramic Green Sheet Manufacturing |
| CN112238664B (en) * | 2019-07-18 | 2024-05-03 | 东丽先端材料研究开发(中国)有限公司 | Film material for thermosetting resin molding and molded product thereof |
| KR102307617B1 (en) * | 2021-04-15 | 2021-10-05 | 주식회사 경국 | Double-sided tape for attaching cushion mat and cushion mat constructed using it |
| JP2024118532A (en) * | 2023-02-21 | 2024-09-02 | 第一工業製薬株式会社 | Release coating agent for polyester substrate, release sheet and laminate |
| JP7500810B1 (en) * | 2023-03-23 | 2024-06-17 | 第一工業製薬株式会社 | Release coating agent for polyester substrate, release sheet and laminate |
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| JPS577190B2 (en) * | 1976-07-26 | 1982-02-09 | ||
| JP2002220431A (en) * | 2001-01-25 | 2002-08-09 | Arakawa Chem Ind Co Ltd | Alkoxy group-containing silane-modified polyurethane resin, resin composition and polyurethane resin-silica hybrid |
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| CN87104240A (en) * | 1987-06-17 | 1988-12-28 | 中国原子能科学研究院 | Rubber release agent |
| JPH0796668B2 (en) * | 1987-12-08 | 1995-10-18 | 大日精化工業株式会社 | Method for producing releasable resin |
| JP2717190B2 (en) * | 1989-02-07 | 1998-02-18 | 日東電工株式会社 | Release agent and release film, adhesive member and separator |
| US5415935A (en) * | 1992-03-31 | 1995-05-16 | E. I. Du Pont De Nemours And Company | Polymeric release film |
| CN1053005C (en) * | 1993-11-22 | 2000-05-31 | 大金工业株式会社 | Mold-release agent, cured coating film prepared therefrom, and method of molding with said agent |
| US5587502A (en) * | 1995-06-02 | 1996-12-24 | Minnesota Mining & Manufacturing Company | Hydroxy functional alkoxysilane and alkoxysilane functional polyurethane made therefrom |
| JPH10279804A (en) * | 1997-03-31 | 1998-10-20 | Jsr Corp | Composition for coating |
| JP3477037B2 (en) * | 1997-07-31 | 2003-12-10 | 積水化成品工業株式会社 | An extruded thermoplastic polyester resin foam, a molded product thereof, and a method for producing an extruded thermoplastic polyester resin foam. |
| US20040235683A1 (en) * | 2003-05-23 | 2004-11-25 | Moffett Robert Harvey | Mold release composition and process therewith |
| US20070141362A1 (en) * | 2005-12-19 | 2007-06-21 | Elkins Casey L | Composition for coating substrate to prevent sticking |
| JP5214229B2 (en) * | 2007-12-04 | 2013-06-19 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Release agent composition |
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2010
- 2010-10-06 CN CN201080004246.6A patent/CN102272256B/en active Active
- 2010-10-06 TW TW099134279A patent/TWI499639B/en active
- 2010-10-06 KR KR1020117012561A patent/KR101725559B1/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577190B2 (en) * | 1976-07-26 | 1982-02-09 | ||
| JP2002220431A (en) * | 2001-01-25 | 2002-08-09 | Arakawa Chem Ind Co Ltd | Alkoxy group-containing silane-modified polyurethane resin, resin composition and polyurethane resin-silica hybrid |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10280339B2 (en) | 2017-05-31 | 2019-05-07 | Hannstar Display (Nanjing) Corporation | Method for manufacturing flexible electrical device |
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| Publication number | Publication date |
|---|---|
| CN102272256B (en) | 2015-07-29 |
| CN102272256A (en) | 2011-12-07 |
| TW201130915A (en) | 2011-09-16 |
| JP5671923B2 (en) | 2015-02-18 |
| KR101725559B1 (en) | 2017-04-10 |
| KR20120064646A (en) | 2012-06-19 |
| JP2011099095A (en) | 2011-05-19 |
| WO2011043386A1 (en) | 2011-04-14 |
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